DATA SH EET
Product specification
File under Integrated Circuits, IC01 May 1992
INTEGRATED CIRCUITS
TDA1519A
22 W BTL or 2 x 11 W stereo car
radio power amplifier
May 1992 2
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
GENERAL DESCRIPTION
The TDA1519A is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic power package.
The device is primarily developed for car radio applications.
Features
•Requires very few external components for Bridge Tied
Load (BTL)
•Stereo or BTL application
•High output power
•Low offset voltage at output (important for BTL)
•Fixed gain
•Good ripple rejection
•Mute/stand-by switch
•Load dump protection
•AC and DC short-circuit-safe to ground and VP
•Thermally protected
•Reverse polarity safe
•Capability to handle high energy on outputs (VP= 0 V)
•No switch-on/switch-off plop
•Protected against electrostatic discharge
•Low thermal resistance
•Identical inputs (inverting and non-inverting)
•Compatible with TDA1519B (except output power).
QUICK REFERENCE DATA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating VP6.0 14.4 17.5 V
non-operating VP−−30 V
load dump protected VP−−45 V
Repetitive peak output current IORM −−4A
Total quiescent current Itot −40 80 mA
Stand-by current Isb −0.1 100 µA
Switch-on current Isw −−40 µA
Input impedance
BTL |ZI|25−−kΩ
stereo |ZI|50−−kΩ
Stereo application
Output power THD = 10%; 4 ΩPo−6−W
THD = 10%; 2 ΩPo−11 −W
Channel separation α40 −−dB
Noise output voltage Vno(rms) −150 −µV
May 1992 3
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
PACKAGE OUTLINES
9 lead SIL; plastic power (SOT131); SOT131-2; 1996 July 22.
9-lead SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 July 22.
BTL application
Output power THD = 10%; 4 ΩPo−22 −W
Supply voltage ripple rejection RS = 0 Ω
f = 100 Hz RR 34 −−dB
f = 1 kHz to 10 kHz RR 48 −−dB
DC output offset voltage |∆V0|−−250 mV
Crystal temperature Tc−−150 °C
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
May 1992 4
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
Fig.1 Block diagram.
May 1992 5
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
PINNING
FUNCTIONAL DESCRIPTION
The TDA1519A contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
A special feature of this device is the mute/stand-by switch which has the following features:
•Low stand-by current (< 100 µA)
•Low mute/stand-by switching current (low cost supply switch)
•Mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1 NINV non-inverting input
2 GND1 ground (signal)
3 RR supply voltage ripple rejection
4 OUT1 output 1
5 GND2 ground (substrate)
6 OUT2 output 2
7V
Ppositive supply voltage
8 M/SS mute/stand-by switch
9 INV inverting input
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage
operating VP−17.5 V
non-operating VP−30 V
load dump protected during 50 ms;
tr≥2.5 ms VP−45 V
AC and DC short-circuit-safe voltage VPSC −18 V
Reverse polarity VPR −6V
Energy handling capability at outputs VP = 0 V −200 mJ
Non-repetitive peak output current IOSM −6A
Repetitive peak output current IORM −4A
Total power dissipation see Fig.2 Ptot −25 W
Crystal temperature Tc−150 °C
Storage temperature range Tstg −55 + 150 °C
May 1992 6
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
DC CHARACTERISTICS
VP= 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply
Supply voltage range note 1 VP6.0 14.4 17.5 V
Total quiescent current Itot −40 80 mA
DC output voltage note 2 VO−6.95 −V
DC output offset voltage |∆V4-6|−− 250 mV
Mute/stand-by switch
Switch-on voltage level VON 8.5 −−V
Mute condition Vmute 3.3 −6.4 V
Output signal in mute position VI = 1 V (max.);
f = 20 Hz to
15 kHz VO−− 20 mV
DC output offset voltage |∆V4-6|−− 250 mV
Fig.2 Power derating curve.
May 1992 7
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
AC CHARACTERISTICS
VP= 14.4 V; RL= 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
Stand-by condition Vsb 0−2V
DC current in stand-by condition Isb −− 100 µA
Switch-on current Isw −12 40 µA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Stereo application
Output power note 3
THD = 0.5% Po45 −W
THD = 10% Po5.5 6.0 −W
Output power at RL = 2 Ωnote 3
THD = 0.5% Po7.5 8.5 −W
THD = 10% Po10 11 −W
Total harmonic distortion Po = 1 W THD −0.1 −%
Low frequency roll-off note 4
−3 dB fL−45 −Hz
High frequency roll-off −1 dB fH20 −−kHz
Closed loop voltage gain Gv39 40 41 dB
Supply voltage ripple rejection
ON notes 5 and 6 RR 40 −−dB
ON notes 5 and 7 RR 45 −−dB
mute notes 5 and 8 RR 45 −−dB
stand-by notes 5 and 8 RR 80 −−dB
Input impedance |Zi|506075kΩ
Noise output voltage
(RMS value) note 9
ON RS = 0 Ω Vno(rms) −150 −µV
ON RS = 10 kΩVno(rms) −250 500 µV
mute note 10 Vno(rms) −120 −µV
Channel separation RS = 10 kΩα 40 −−dB
Channel unbalance |∆Gv|−0.1 1 dB
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
May 1992 8
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
AC CHARACTERISTICS
VP= 14.4 V; RL= 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.4; unless otherwise specified
Notes to the characteristics
1. The circuit is DC adjusted at VP = 6 V to 17.5 V and AC operating at VP = 8.5 V to 17.5 V.
2. At 17.5 V < VP< 30 V the DC output voltage ≤ VP/2.
3. Output power is measured directly at the output pins of the IC.
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Frequency between 100 Hz and 10 kHz.
9. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
10. Noise output voltage independent of RS (VI = 0 V).
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
BTL application
Output power note 3
THD = 0.5% Po15 17 −W
THD = 10% Po20 22 −W
Output power at VP = 13.2 V note 3
THD = 0.5% Po−13 −W
THD = 10% Po−17.5 - W
Total harmonic distortion Po = 1 W THD - 0.1 −%
Power bandwidth THD = 0.5%;
Po=−1 dB; 35 to
w.r.t. 15 W Bw−15 000 −Hz
Low frequency roll-off note 4
−1 dB fL−45 −Hz
High frequency roll-off −1 dB fH20 −−kHz
Closed loop voltage gain Gv45 46 47 dB
Supply voltage ripple rejection
ON notes 5 and 6 RR 34 −−dB
ON notes 5 and 7 RR 48 −−dB
mute notes 5 and 8 RR 48 −−dB
stand-by notes 5 and 8 RR 80 −-dB
Input impedance |Zi| 253038kΩ
Noise output voltage
(RMS value) note 9
ON RS = 0 Ω Vno(rms) −200 −µV
ON RS = 10 kΩVno(rms) −350 700 µV
mute note 10 Vno(rms) −180 −µV
May 1992 9
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
APPLICATION INFORMATION
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram.
May 1992 10
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
Fig.5 Total quiescent current (Itot) as a function of supply voltage (VP).
Fig.6 Output power (Po) as a function of supply voltage (VP) for BTL application at RL= 4 Ω; f = 1 kHz.
May 1992 11
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
Fig.7 Total harmonic distortion (THD) as a function of output power (Po) for BTL application at RL= 4 Ω;
f= 1 kHz.
Fig.8 Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at RL= 4 Ω;
Po= 1 W.
May 1992 12
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
PACKAGE OUTLINES
UNIT A b
max. bp2 cD
(1) E(1) Z(1)
deD
hLj
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 4.6
4.2 1.1 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 2.54
12.2
11.8 3.4
3.1
A
max.
1
2.0
Eh
62.00
1.45
2.1
1.8
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
17.2
16.5
SOT131-2 92-11-17
95-03-11
0 5 10 mm
scale
Q
0.25
w
0.03
x
D
L
A
E
c
A2
Q
wM
bp
d
D
Ze
xh
19
E
h
non-concave
seating plane
1
b
j
SIL9P: plastic single in-line power package; 9 leads SOT131-2
view B: mounting base side
B
May 1992 13
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
UNIT A A e12 bpcD
(1) E(1) Z(1)
deD
hLL
3m
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6
4.2 0.75
0.60 0.48
0.38 24.0
23.6 20.0
19.6 10 5.08
12.2
11.8 2.54
e2
5.08 2.4
1.6
Eh
62.00
1.45
0.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT157-2
0 5 10 mm
scale
v
2.1
1.8
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
L3
Q
wM
bp
1
d
D
Ze
e
xh
19
j
E
h
non-concave
92-10-12
95-03-11
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) SOT157-2
B
view B: mounting base side
m2
evM
May 1992 14
Philips Semiconductors Product specification
22 W BTL or 2 x 11 W stereo car radio
power amplifier TDA1519A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
