SFH 4230-Z - OSRAM Opto Semiconductors Inc

SFH 4230

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung

High Power Infrared Emitter (850 nm)

Lead (Pb) Free Product - RoHS Compliant

2007-03-29 1

Wesentliche Merkmale

• Punktlichtquelle mit hohem Wirkungsgrad bei

geringer Baugröße

• Chipgröße (emittierende Fläche) 1 x 1 mm2

• max. Gleichstrom 1 A

• niedriger Wärmewiderstand (15 K/W)

• Emissionswellenlänge 850 nm

•ESD-sicher bis 2 kV nach JESD22-A114-B

Anwendungen

• Infrarotbeleuchtung für CMOS Kameras

• Überwachungssysteme

• IR-Datenübertragung

• Fahrer-Assistenz Systeme

• Maschinensicherheit

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Normen 60825-1 und 62471

behandelt werden.

Typ

Type

Bestellnummer

Ordering Code

Gesamtstrahlungsfluss1) (IF = 1A, tp = 100 µs)

Total Radiant Flux1)

Φe (mW)

SFH 4230 Q65110A4023 typ. 440

1) gemessen mit Ulbrichtkugel / measured with integrating sphere

Features

• Point lightsource with high efficiency and small

package

• die-size (emitting area) 1 x 1 mm2

• max. DC-current 1 A

• Low thermal resistance (15 K/W)

• Maximum of spectral emission at 850 nm

• ESD save up to 2 kV acc. to JESD22-A114-B

Applications

• Infrared Illumination for CMOS cameras

• Surveillance systems

• IR Data Transmission

• Driver assistance systems

• Machine security

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 and IEC 62471.

2007-03-29 2

SFH 4230

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter

Symbol

Wert

Value

Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range

Top , Tstg – 40 … + 100 °C

Sperrschichttemperatur

Junction temperature

TJ+ 125 °C

Sperrspannung

Reverse voltage

VR1 V

Vorwärtsgleichstrom

Forward current

IF1 A

Stoßstrom, tp < 1 ms, D = 0.2

Surge current

IFSM 2 A

Leistungsaufnahme

Power consumption

Ptot 2.4 W

Wärmewiderstand Sperrschicht - Lötstelle bei

Montage auf Metall-Block

Thermal resistance junction - soldering point,

mounted on metal block

RthJS 15 K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter

Symbol

Wert

Value

Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 1 A, tp = 10 ms

λpeak 850 nm

Centroid-Wellenlänge der Strahlung

Centroid wavelength

IF = 1 A, tp = 10 ms

λcentroid 845 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 1 A, tp = 10 ms

∆λ 40 nm

Abstrahlwinkel

Half angle

ϕ± 60 Grad

deg.

Aktive Chipfläche

Active chip area

A1mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area

L × B

L × W

1 × 1 mm²

SFH 4230

2007-03-29 3

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, IF = 1 A, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 1 A, RL = 50 Ω

tr, tf10 ns

Durchlassspannung

Forward voltage

IF = 1 A, tp = 100 µs

VF1.8 (< 2.4) V

Strahlstärke

Radiant intensity

IF = 1 A, tp = 100 µs

Ie typ 170 mW/sr

Temperaturkoeffizient von Ie bzw. Φe

Temperature coefficient of Ie or Φe

IF = 1 A, tp = 10 ms

TCI– 0.5 %/K

Temperaturkoeffizient von VF

Temperature coefficient of VF

IF = 1 A, tp = 10 ms

TCV– 0.2 mV/K

Temperaturkoeffizient von λ

Temperature coefficient of λ

IF = 1 A, tp = 10 ms

TCλ,centroid + 0.2 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter

Symbol

Wert

Value

Einheit

Unit

SFH 4230

2007-03-29 4

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

Gesamtstrahlungsfluss1) Φe

Total Radiant Flux1) Φe

Bezeichnung

Parameter

Symbol Werte

Values

Einheit

Unit

SFH 4230-CW SFH 4230-DW

Gesamtstrahlungsfluss

Total Radiant Flux

IF = 1 A, tp = 100 µs

Φe min

Φe max

250

500

400

800

1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /

Only one group in one packing unit (variation lower 2:1)

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚

OHL01660

50˚

60˚

70˚

80˚

90˚

100˚

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

SFH 4230

2007-03-29 5

Relative spektrale Emission

Relative Spectral Emission

Irel = f (λ)

Max. zulässiger Durchlassstrom

Max. Permissible Forward Current

IF = f (TA), RthJS = 15 K/W

700

0nm

OHL01714

100

950750 800 850

rel

00˚C

OHF02801

200

400

600

800

1200

20 40 60 80 100

Durchlassstrom

Forward Current

IF = f (VF)

Single pulse, tp = 100 µs

Zulässige Impulsbelastbarkeit

Permissible Pulse Handling

Capability IF = f (tp), TA< 85 °C,

Duty cycle D = parameter

OHF02843

101

10-1

10-2

0 0.5 1 1.5 2 2.5 3V

1010

-2-3-4-5

1010 10

210-1

10 s 10

OHF02803

0.02

0.5

0.2

0.05

0.1

0.005

0.01

0.5

1.0

1.5

2.0

2.5

Relativer Gesamtstrahlungsfluss

Relative Total Radiant Flux

Φe/Φe(1000mA) = f (IF)

Single pulse, tp = 100 µs

OHL02830

-3

-1

-2

e (1000 mA)

10 10

1055

2007-03-29 6

SFH 4230

Maßzeichnung1)

Package Outlines

Kathodenkennung: Markierung

Cathode mark: mark

Gewicht / Approx. weight: 0.2 g

Gurtung / Polarität und Lage Verpackungseinheit 800/Rolle, ø180 mm

Method of Taping / Polarity and Orientation Packing unit 800/reel, ø180 mm

1) Maße in mm (inch) / Dimensions in mm (inch)

GPLY6192

6.2 (0.244)

5.8 (0.228)

1.9 (0.075)

1.7 (0.067)

Cathode

R1.5 (0.059)

11.2 (0.441)

10.8 (0.425)

1.2 (0.047)

0.8 (0.031)

0...0.1 (0.004)

0.29 (0.011)

0.24 (0.009)

6.8 (0.268)

7.2 (0.283)

1.0 (0.039)

0.8 (0.031)

1.6 (0.063)

2.0 (0.079)

(ø4.2 (0.165))

Protection

Heat sink

Diode

OHAY0508

1.55 (0.061) 2 (0.079)

4 (0.157)

6.35 (0.250)

8 (0.315)

1.75 (0.069)

11.5 (0.453)

12.4 (0.488)

24 (0.945)

0.3 (0.012)

1.9 (0.075)

7.35 (0.289)

Cathode/Collector Side

SFH 4230

2007-03-29 7

Empfohlenes Lötpaddesign

Recommended Solder Pad Design

Solder resist

Freies Kupfer

Bare Copper

Lötpasten Schablone

Solder paste stencil

Lötstopplack

OHAY0681

0.3 (0.012)

Kupfer

Copper

1.6 (0.063)

11.6 (0.457)

12.0 (0.472)

2.3 (0.091)

10 (0.394)

1.6 (0.063)

11.6 (0.457)

3 Lötstellen

3 solder points

Thermal enhanced PCB

Thermisch optimiertes PCB

ø4.0 (0.157)

Heatsink attach

ø4.0 (0.157)

ø2.5 (0.098)

Achtung:

Anode und Heatsink sind elektrisch verbunden

Attention:

Anode and Heatsink are electrically connected

Footprint

2007-03-29 8

SFH 4230

Lötbedingungen Vorbehandlung nach JEDEC Level 4

Soldering Conditions Preconditioning acc. to JEDEC Level 4

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min