Description
Agilent Power PLCC-4 is an
extension of our PLCC-2 SMT
LEDs. The package can be driven
at higher current due to its
superior package design. The
product is able to dissipate heat
more efficiently compared to the
conventional PLCC-2 SMT LEDs.
In proportion to the increase in
driving current, this family of
LEDs is able to produce higher
light output compared to the
conventional PLCC-2 SMT LEDs.
These SMT LEDs have higher
reliability and better performance
and are designed to work under a
wide range of environmental
conditions. This higher reliability
makes them suitable for use
under harsh environment and
conditions like automotive. In
addition, they are also suitable to
be used in electronic signs and
signals.
Agilent HSMx-A4xx-xxxxx SMT LED
Surface Mount LED Indicator
Data Sheet
CAUTION: HSMN-, HSMK-, HSMM-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate
precautions during handling and processing. Refer to Agilent Application Note AN-1142 for additional details.
To facilitate easy pick and place
assembly, the LEDs are packed in
EIA-compliant tape and reel.
Every reel will be shipped in
single intensity and color bin
(except for red color), to provide
close uniformity.
These LEDs are compatible with
IR solder reflow process. Due to
the high reliability feature of
these products, they also can be
mounted using through-the-wave
soldering process.
There are a variety of colors and
various viewing angles (30°, 60°
and 120°) available in these SMT
LEDs. Ideally, the 30° parts are
suitable for light piping where
focused intensities are required.
As for the 60° and 120°, they are
most suitable for automotive
interior and exterior lighting and
electronic signs applications.
Features
• Industry standard PLCC-4
• High reliability LED package
• High brightness using AlInGaP and
InGaN dice technologies
• High optical efficiency
• Higher ambient temperature at the
same current possible compared to
PLCC-2
• Available in full selection of colors
• Super wide viewing angle at 120˚
• Available in 8mm carrier tape on
7-inch reel
• Compatible with both IR and TTW
soldering process
Applications
• Interior automotive
– Instrument panel backlighting
– Central console backlighting
– Cabin backlighting
– Navigation and audio system
– Dome lighting
– Push button backlighting
• Exterior automotive
– Turn signals
– CHMSL
– Rear combination lamp
– Puddle light
• Electronic signs and signals
– Interior full color sign
– Variable message sign
• Office automation, home appli-
ances, industrial equipment
– Front panel backlighting
– Push button backlighting
– Display backlighting
2
Package Dimensions
0.8 ± 0.3
3.5 ± 0.2
2.8 ± 0.2
0.5 ± 0.1
3.2 ± 0.2
2.2 ± 0.2
1.9 ± 0.2
0.1 TYP. 0.8 ± 0.1
CATHODE MARKING
0.7 ± 0.1
CC
AC
NOTE: ALL DIMENSIONS IN mm.
Device Selection Guide
Color Part Number Min. Iv (mcd) Max. Iv (mcd) Test Current (mA) Dice Technology
Red HSMC-A400-S30M1 160.0 400.0 50 AlInGaP
HSMC-A401-T40M1 250.0 800.0 50 AlInGaP
HSMC-A401-T80M1 310.0 1000.0 50 AlInGaP
HSMZ-A400-U80M1 500.0 1600.0 50 AlInGaP
Red Orange HSMJ-A401-T40M1 250.0 800.0 50 AlInGaP
HSMJ-A401-U40M1 400.0 1260.0 50 AlInGaP
HSMV-A400-U80M1 500.0 1600.0 50 AlInGaP
Orange HSML-A401-U40M1 400.0 1260.0 50 AlInGaP
Amber HSMA-A400-T35M1 250.0 630.0 50 AlInGaP
HSMA-A401-U45M1 400.0 1260.0 50 AlInGaP
HSMU-A400-U85M1 500.0 1600.0 50 AlInGaP
Emerald Green HSME-A401-P4PM1 40.0 130.0 50 AlInGaP
Green HSMM-A401-R7YM2 120.0 320.0 30 InGaN
HSMM-A401-S4YM2 160.0 500.0 30 InGaN
HSMM-A401-S7YM2 200.0 500.0 30 InGaN
HSMM-A400-T8YM2 310.0 1000.0 30 InGaN
Cyan HSMK-A401-R40M2 100.0 320.0 30 InGaN
HSMK-A400-T80M2 310.0 1000.0 30 InGaN
Blue HSMN-A401-P4QM2 40.0 130.0 30 InGaN
HSMN-A401-P7QM2 50.0 130.0 30 InGaN
HSMN-A400-Q8QM2 80.0 250.0 30 InGaN
Note:
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned.
3
Absolute Maximum Ratings (TA = 25°C)
Parameters HSMC/J/L/A/E HSMZ/V/U HSMM/K/N
DC Forward Current[1] 70 mA[3,4] 70 mA[3,4] 30 mA
Peak Forward Current [2] 200 mA 200 mA 90 mA
Power Dissipation 180 mW 240 mW 114 mW
Reverse Voltage 5 V
Junction Temperature 110°C
Operating Temperature –40°C to +100°C
Storage Temperature –40°C to +100°C
Notes:
1. Derate linearly as shown in figure 5.
2. Duty factor = 10%, Frequency = 1 kHz.
3. Drive current between 10 mA and 70 mA is recommended for best long-term performance.
4. Operation at currents below 5 mA is not recommended.
Part Numbering System
HSM x1 – A x2 x3x4 – x5x6 x7 x8x9
Packaging Option
Color Bin Selection
Intensity Bin Select
Device Specific Configuration
Package Type
LED Chip Color
4
Optical Characteristics (TA = 25°C)
Peak Dominant Luminous Luminous Intensity/
Wavelength Wavelength Viewing Angle Efficacy ηv[3] Total Flux
Part λPEAK (nm) λD[1] (nm) 2θ1/2[2] (Degrees) (lm/W) Iv (mcd)/Φv (mlm)
Color Number Typ. Typ. Typ. Typ. Typ.
Red HSMC 635 626 120 150 0.45
HSMZ 639 630 120 155 0.45
Red Orange HSMJ 621 615 120 240 0.45
HSMV 623 617 120 263 0.45
Orange HSML 609 605 120 320 0.45
Amber HSMA 592 590 120 480 0.45
HSMU 594 592 120 500 0.45
Yellow Green HSME 576 575 120 560 0.45
Emerald Green HSME 568 567 120 610 0.45
Green HSMM 518 525 120 500 0.45
Cyan HSMK 502 505 120 300 0.45
Blue HSMN 468 470 120 75 0.45
Notes:
1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.
2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is
the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25°C)
Forward Voltage Reverse Voltage
VF (Volts) @ IF = 50 mA VR @ 100 µA
Part Number Typ. Max. Min.
HSMC/J/L/A/E 2.2 2.5 5
HSMZ/V/U 2.8 3.4 5
Forward Voltage Reverse Voltage
VF (Volts) @ IF = 30 mA VR @ 10 µA
Part Number Typ. Max. Min.
HSMM/K/N 3.8 4.6 5
Figure 1. Relative Intensity Vs. Wavelength.
WAVELENGTH – nm
EMERALD GREEN
RELATIVE INTENSITY
1.0
0.8
0380 480 580 680 730 780
630530430
BLUE
CYAN
0.6
0.4
0.2
GREEN
YELLOW GREEN
AMBER
ORANGE
RED ORANGE
RED
0.1
0.3
0.5
0.7
0.9
5
Figure 2. Forward Current Vs. Forward Voltage. Figure 3. Relative Intensity Vs. Forward
Current (AlInGaP).
Figure 4. Relative Intensity Vs. Forward
Current (InGaN).
Figure 5a. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (AlInGaP).
Figure 6. Dominant Wavelength Vs. Forward
Current – InGaN Devices.
Figure 7. Radiation Pattern.
040
FORWARD CURRENT – mA
0
0.4
RELATIVE INTENSITY
(NORMALIZED AT 50 mA)
80
0.8
0.2
1.0
20
0.6
1.2
6010 30 70
1.4
50
020
CURRENT – mA
460
480
540
DOMINANT WAVELENGTH – nm
35
500
470
510
10
490
520
25
InGaN GREEN
515 30
530
InGaN CYAN
InGaN BLUE
RELATIVE INTENSITY
1.0
0
ANGLE – DEGREES
0.8
0.6
0.2
0.4
-70 -50 -30 30 50 70 90-90 -10 10
0.1
0.3
0.5
0.7
0.9
0
80
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
40
40
60
30
300°C/W
20
70
100
10
350°C/W
470°C/W
50
0
020 60 80 120
MAXIMUM FORWARD CURRENT – mA
AMBIENT TEMPERATURE – °C
40
20
30
15
300°C/W
10
35
100
5
350°C/W
470°C/W
25
Figure 5b. Maximum Forward Current Vs.
Ambient Temperature, Derated Based On
TJmax = 110°C (InGaN).
03
FORWARD VOLTAGE – V
0
20
70
80
FORWARD CURRENT – mA
10
50
40
60
12 45
HSMM/K/N
HSMZ/V/U
HSMC/J/L/A/E
30
020
FORWARD CURRENT – mA
0
0.4
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 30 mA)
35
0.8
0.2
1.0
10
0.6
1.2
30515
25
6
Figure 9a. Recommended SnPb Reflow Soldering Profile.
Figure 10. Recommended Wave Soldering Profile.
Figure 8a. Recommended Soldering Pad Pattern.
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
–6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX.
Figure 8b. Recommended Soldering Pad Pattern (TTW).
Thermal Resistance Solder Pad Area (xy)
300°C/W >16 mm2
350°C/W >12 mm2
470°C/W >8 mm2
Figure 9b. Recommended Pb-free Reflow Soldering Profile.
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
125 °C ± 25 °C
255 °C
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
+5 °C
-0 °C
LAMINAR W A VE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT W A VE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
X X
0.5 (0.020)
Y
Y
1.0 (0.039)
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
2.8 (0.110)
6.1 (0.240)
DIMENSIONS IN mm (INCHES).
2.60
(0.103)
SOLDER RESIST
4.50 (0.178)
Y
X
0.40 (0.016)
X
0.50
(0.020)
Y
1.10
(0.043)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).
7
Figure 11. Tape Leader and Trailer Dimensions.
200 mm MIN. FOR ∅180 REEL.
200 mm MIN. FOR ∅330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR ∅180 REEL.
960 mm MIN. FOR ∅330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Reeling Orientation.
Figure 12. Tape Dimensions.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
Storage Condition: 5 to 30°C @
60% relative humidity max.
Baking is required under the
condition:
a) the humidity indicator card
color becoming pink
b) the pack has been opened for
more than 4 weeks
Baking recommended condition:
60 ± 5°C for 20 hours.
C
A
4 ± 0.1 2 ± 0.05
8 ± 0.1
5.5 ± 0.05
12+0.3
–0.1
1.75 ± 0.1
3.8 ± 0.1
3.6 ± 0.1
0.229 ± 0.01
∅1.5+0.1
–0
∅1+0.1
–0
C
C
3.45 ± 0.1
AA
VIEW A-A
VIEW B-B
B
B
ALL DIMENSIONS IN mm.
Intensity Bin Select (X5X6)
Individual reel will contain parts from
one half bin only.
X5Min. Iv Bin
X6
0 Full Distribution
3 3 half bins starting from X51
4 4 half bins starting from X51
5 5 half bins starting from X51
7 3 half bins starting from X52
8 4 half bins starting from X52
9 5 half bins starting from X52
Intensity Bin Limits
Bin ID Min. (mcd) Max. (mcd)
N1 28.50 35.50
N2 35.50 45.00
P1 45.00 56.00
P2 56.00 71.50
Q1 71.50 90.00
Q2 90.00 112.50
R1 112.50 140.00
R2 140.00 180.00
S1 180.00 224.00
S2 224.00 285.00
T1 285.00 355.00
T2 355.00 450.00
U1 450.00 560.00
U2 560.00 715.00
V1 715.00 900.00
V2 900.00 1125.00
W1 1125.00 1400.00
W2 1400.00 1800.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X7)
Individual reel will contain parts from
one full bin only.
X7
0 Full Distribution
Z A and B only
Y B and C only
W C and D only
V D and E only
U E and F only
T F and G only
S G and H only
Q A, B and C only
P B, C and D only
N C, D and E only
M D, E and F only
L E, F and G only
K F, G and H only
1 A, B, C and D only
2 E, F, G and H only
3 B, C, D and E only
4 C, D, E and F only
5 A, B, C, D and E only
6 B, C, D, E and F only
Color Bin Limits
Blue Min. (nm) Max. (nm)
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Cyan Min. (nm) Max. (nm)
A 490.0 495.0
B 495.0 500.0
C 500.0 505.0
D 505.0 510.0
Green Min. (nm) Max. (nm)
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Color Bin Limits
Emerald
Green Min. (nm) Max. (nm)
A 552.5 555.5
B 555.5 558.5
C 558.5 561.5
D 561.5 564.5
Yellow
Green Min. (nm) Max. (nm)
E 564.5 567.5
F 567.5 570.5
G 570.5 573.5
H 573.5 576.5
Amber/
Yellow Min. (nm) Max. (nm)
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Orange Min. (nm) Max. (nm)
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
Red
Orange Min. (nm) Max. (nm)
A 611.0 616.0
B 616.0 620.0
Red Min. (nm) Max. (nm)
Full Distribution
Tolerance of each bin limit = ± 1 nm
8
Packaging Option (X8X9)
Test Package Reel
Option Current Type Size
M1 50 mA Top Mount 7 inch
M2 30 mA Top Mount 7 inch
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0663EN
October 12, 2004
5989-1211EN
Forward Voltage Bin Table
For HSMZ/V/U – A4xx-xxxxx only
BIN MIN. MAX.
VA 1.9 2.2
VB 2.2 2.5
VC 2.5 2.8
VD 2.8 3.1
VE 3.1 3.4
Tolerance of each bin limit = ± 0.05
