2N6661CSM4
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DOC 3779, ISSUE 3
FEATURES
• Faster switching
• Low Ciss
• Integral Source-Drain Diode
• High Input Impedance and High Gain
DESCRIPTION
This enhancement-mode (normally-off) vertical DMOS FET is
ideally suited to a wide range of switching and amplifying
applications where high breakdown voltage, high input
impedance, low input capacitance, and fast switching speeds
are desired.
High Reliability Screening options are available.
N
CHANNEL
ENHANCEMENT MODE
MOSFET
VDSS 90V
ID 0.9A
RDS(on) 4.0Ω
CERAMIC LCC3 PACKAGE (MO-041BA)
(Underside View)
PAD 1 – DRAIN PAD 3 – SOURCE
PAD 2 – N/C PAD 4 – GATE
1
23
4
5.59 ± 0.13
(0.22 ± 0.005)
0.23
(0.009) rad.
1.02 ± 0.20
(0.04 ± 0.008)
2.03 ± 0.20
(0.08 ± 0.008)
1.40 ± 0.15
(0.055 ± 0.006)
0.25 ± 0.03
(0.01 ± 0.001)
0.23
(0.009) min.
1.27 ± 0.05
(0.05 ± 0.002)
3.81 ± 0.13
(0.15 ± 0.005)
0.64 ± 0.08
(0.025 ± 0.003)
MECHANICAL DATA
Dimensions in mm (inches)
ABSOLUTE MAXIMUM RATINGS TCASE = 25°C unless otherwise stated
VDS Drain - Source Voltage 90V
ID Drain Current - Continuous (TC = 25°C) 0.9A
- Continuous (TC = 100°C) 0.7A
IDM Drain Current - Pulsed (Note 1) 3A
VGS Gate - Source Voltage ±20V
Ptot(1) Total Power Dissipation at Tmb ≤ 25°C 6.25W
De-rate Linearly above 25°C 0.050W/°C
Ptot(2) Total Power Dissipation at Tamb ≤ 25°C 0.5W
Tj,Tstg Operating and Storage Junction Temperature Range -55 to +150°C
THERMAL DATA
Rthj-mb Thermal Resistance Junction – Mounting base Max 20 °C/W
Rthj-amb Thermal Resistance Junction - Ambient Max 250 °C/W
NOTES: 1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width ≤ 380µS, Duty Cycle , δ 2%