©1994 Burr-Brown Corporation PDS-1250B Printed in U.S.A. September, 1995
High-Voltage, High-Current
OPERATIONAL AMPLIFIER
DESCRIPTION
The OPA544 is a high-voltage/high-current opera-
tional amplifier suitable for driving a wide variety of
high power loads. High performance FET op amp
circuitry and high power output stage are combined on
a single monolithic chip.
The OPA544 is protected by internal current limit and
thermal shutdown circuits.
The OPA544 is available in industry-standard
5-lead TO-220 and 5-lead surface-mount power pack-
ages. Its copper tab allows easy mounting to a heat
sink for excellent thermal performance. It is specified
for operation over the extended industrial temperature
range, –40°C to +85°C.
®
OPA544
FEATURES
●HIGH OUTPUT CURRENT: 2A min
●WIDE POWER SUPPLY RANGE:
±10 to ±35V
●SLEW RATE: 8V/µs
●INTERNAL CURRENT LIMIT
●THERMAL SHUTDOWN PROTECTION
●FET INPUT: IB = 100pA max
●5-LEAD TO-220 PLASTIC PACKAGE
●5-LEAD SURFACE MOUNT PACKAGE
APPLICATIONS
●MOTOR DRIVER
●PROGRAMMABLE POWER SUPPLY
●SERVO AMPLIFIER
●VALVES, ACTUATOR DRIVER
●MAGNETIC DEFLECTION COIL DRIVER
●AUDIO AMPLIFIER
V–V
O
V+
V
IN
V
IN
12345
5-Lead TO-220
and
Stagger-Formed
TO-220
+
–
Tab is connected
to V– supply.
V–V
O
V+
V
IN
V
IN
12345
+
–
Tab is connected
to V– supply.
5-Lead
Surface Mount
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Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
SBOS038
®
2OPA544
SPECIFICATIONS
At TCASE = +25°C, VS = ±35V, unless otherwise noted.
OPA544T
OPA544T-1
OPA544F
PARAMETER CONDITION MIN TYP MAX UNITS
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
OFFSET VOLTAGE
Input Offset Voltage ±1±5mV
vs Temperature Specified Temperature Range ±10 µV/°C
vs Power Supply VS = ±10V to ±35V ±10 ±100 µV/V
INPUT BIAS CURRENT(1)
Input Bias Current VCM = 0V ±15 ±100 pA
vs Temperature See Typical Curve
Input Offset Current VCM = 0V ±10 ±100 pA
NOISE
Input Voltage Noise
Noise Density, f = 1kHz 36 nV/√Hz
Current Noise Density, f = 1kHz 3 fA/√Hz
INPUT VOLTAGE RANGE
Common-Mode Input Range, Positive Linear Operation (V+) –6 (V+) –4 V
Negative Linear Operation (V–) +6 (V–) +4 V
Common-Mode Rejection VCM = ±VS –6V 90 106 dB
INPUT IMPEDANCE
Differential 1012 || 8 Ω || pF
Common-Mode 1012 || 10 Ω || pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain VO = ±30V, RL = 1kΩ90 103 dB
FREQUENCY RESPONSE
Gain Bandwidth Product RL = 15Ω1.4 MHz
Slew Rate 60Vp-p, RL = 15Ω58 V/µs
Full-Power Bandwidth See Typical Curve
Settling Time 0.1% G = –10, 60V Step 25 µs
Total Harmonic Distortion See Typical Curve
OUTPUT
Voltage Output, Positive IO = 2A (V+) –5 (V+) –4.4 V
Negative IO = 2A (V–) +5 (V–) +3.8 V
Positive IO = 0.5A (V+) –4.2 (V+) –3.8 V
Negative IO = 0.5A (V–) +4 (V–) +3.1 V
Current Output See SOA Curves
Short-Circuit Current 4A
POWER SUPPLY
Specified Operating Voltage ±35 V
Operating Voltage Range ±10 ±35 V
Quiescent Current IO = 0 ±12 ±15 mA
TEMPERATURE RANGE
Operating –40 +85 °C
Storage –40 +125 °C
Thermal Resistance,
θ
JC f > 50Hz 2.7 °C/W
Thermal Resistance,
θ
JC DC 3 °C/W
Thermal Resistance,
θ
JA No Heat Sink 65 °C/W
NOTES: (1) High-speed test at TJ = 25°C.
®
3OPA544
Top View
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V– ................................................................... 70V
Output Current ................................................................. See SOA Curve
Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V
Operating Temperature ................................................. –40°C to +125°C
Storage Temperature ..................................................... –40°C to +125°C
Junction Temperature...................................................................... 150°C
Lead Temperature (soldering –10s)(1)............................................................... 300°C
CONNECTION DIAGRAMS
NOTE: (1) Vapor-phase or IR reflow techniques are recommended for solder-
ing the OPA544F surface mount package. Wave soldering is not recommended
due to excessive thermal shock and “shadowing” of nearby devices.
V–V
O
V+
V
IN
V
IN
12345
+
–
Tab is connected
to V– supply.
5-Lead
Surface Mount
V–V
O
V+
V
IN
V
IN
12345
5-Lead TO-220
and
Stagger-Formed
TO-220
+
–
Tab is connected
to V– supply.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE /ORDERING INFORMATION
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER(1)
OPA544T 5-Lead TO-220 315
OPA544T-1 5-Lead Stagger-Formed TO-220 323
OPA544F 5-Lead Surface-Mount 325
®
4OPA544
100 1k 10k 100k 1M
Common-Mode Rejection (dB)
Frequency (Hz)
COMMON-MODE REJECTION vs FREQUENCY
110
100
90
80
70
60
50
40
1 10 100 1k 10k 100k
10
Voltage Noise (nV/√Hz)
Frequency (Hz)
VOLTAGE NOISE DENSITY vs FREQUENCY
20
40
60
80
100
–75 –50 –25 0 25 50 75 100 125
Quiescent Current (mA)
Temperature (°C)
QUIESCENT CURRENT vs TEMPERATURE
13
12
11
10
9
V
S
= ±35V
V
S
= ±10V
–75 –50 –25 0 25 50 75 100 125
Limit Current (A)
Temperature (°C)
CURRENT LIMIT vs TEMPERATURE
5
4
3
2
1
0
–75 –50 –25 0 25 50 75 100 125
Input Bias Current (A)
Temperature (°C)
INPUT BIAS CURRENT vs TEMPERATURE
10n
1n
100p
10p
1p
IOS
IB
1 10 100 1k 10k 100k 1M 10M
Gain (dB)
Frequency (Hz)
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
120
100
80
60
40
20
0
–20
Phase (°)
0
–45
–90
–135
–180
R
L
= 15Ω
TYPICAL PERFORMANCE CURVES
At TCASE = +25°C, VS = ±35V, unless otherwise noted.
®
5OPA544
0123
|V
SUPPLY
| – |V
OUT
| (V)
Output Current (A)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
5
4
3
2
1
0
|(V–) –V
O
|
(V+) – V
O
35
30
25
20
15
10
5
0
Output Voltage (V)
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
Frequency (Hz)
20k 100k 200k
Clipping
Slew Rate
Limited
1 10 100 1k 10k 100k 1M
Power Supply Rejection (dB)
Frequency (Hz)
POWER SUPPLY REJECTION vs FREQUENCY
120
100
80
60
40
20
V+ Supply
V– Supply
TYPICAL PERFORMANCE CURVES (CONT)
At TCASE = +25°C, VS = ±35V, unless otherwise noted.
–75 –50 –25 0 25 50 75 100 125
|V
SUPPLY
| – |V
OUT
| (V)
Temperature (°C)
OUTPUT VOLTAGE SWING vs TEMPERATURE
6
5
4
3
2
1
0
I
O
= –2A
I
O
= +0.5A
I
O
= +2A
I
O
= –0.5A
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
10
1
0.1
0.01
0.001 20 100 1k 10k 20k
THD + N (%)
Frequency (Hz)
R
L
= 15Ω100mW
2W
30W
–75 –50 –25 0 25 50 75 100 125
Gain-Bandwidth Product (MHz)
Temperature (°C)
GAIN-BANDWIDTH PRODUCT AND SLEW RATE
vs TEMPERATURE
2.5
2.0
1.5
1.0
0.5
Slew Rate (V/µS)
9
8
7
6
SR–
SR+
GBW
®
6OPA544
TYPICAL PERFORMANCE CURVES (CONT)
APPLICATIONS INFORMATION
Figure 1 shows the OPA544 connected as a basic non-
inverting amplifier. The OPA544 can be used in virtually
any op amp configuration. Power supply terminals should be
bypassed with low series impedance capacitors. The tech-
nique shown, using a ceramic and tantalum type in parallel
is recommended. Power supply wiring should have low
series impedance and inductance.
The safe output current decreases as VS–VO increases. Output
short-circuits are a very demanding case for SOA. A short-circuit
to ground forces the full power supply voltage (V+ or V–) across
the conducting transistor. With VS = ±35V the safe output current
is 1.5A (at 25˚C). The short-circuit current is approximately 4A
which exceeds the SOA. This situation will activate the thermal
shutdown circuit in the OPA544. For further insight on SOA,
consult Application Bulletin AB-039.
SAFE OPERATING AREA
Stress on the output transistors is determined by the output
current and the voltage across the conducting output transis-
tor, VS–VO. The power dissipated by the output transistor is
equal to the product of the output current and the voltage
across the conducting transistor, VS–VO. The Safe Operating
Area (SOA curve, Figure 2) shows the permissible range of
voltage and current.
FIGURE 1. Basic Circuit Connections.
At TCASE = +25°C, VS = ±35V, unless otherwise noted.
5V/div
G = 1+ = 3
R
2
R
1
+
Z
L
V
O
R
2
10kΩ
R
1
5kΩ
0.1µF
10µF
OPA544
V–
–35V
+35V
V+
V
IN
+
10µF
0.1µF
200MV/div
SMALL SIGNAL RESPONSE
G = 3, C
L
= 1nF
2µs/div
FIGURE 2. Safe Operating Area.
12 510
|V
S
– V
O
| (V) 20 50 100
SAFE OPERATING AREA
10
4
1
Output Current (A)
0.4
0.1
Current-Limited
T
C
= 25°C
T
C
= 125°C
T
C
= 85°C
Output current may
be limited to less
than 4A—see text.
CURRENT LIMIT
The OPA544 has an internal current limit set for approxi-
mately 4A. This current limit decreases with increasing
junction temperature as shown in the typical curve, Current
Limit vs Temperature. This, in combination with the thermal
shutdown circuit, provides protection from many types of
overload. It may not, however, protect for short-circuit to
ground, depending on the power supply voltage, ambient
temperature, heat sink and signal conditions.
®
7OPA544
POWER DISSIPATION
Power dissipation depends on power supply, signal and load
conditions. For dc signals, power dissipation is equal to the
product of output current times the voltage across the con-
ducting output transistor. Power dissipation can be mini-
mized by using the lowest possible power supply voltage
necessary to assure the required output voltage swing.
For resistive loads, the maximum power dissipation occurs
at a dc output voltage of one-half the power supply voltage.
Dissipation with ac signals is lower. Application Bulletin
AB-039 explains how to calculate or measure power dissi-
pation with unusual signals and loads.
HEATSINKING
Most applications require a heat sink to assure that the
maximum junction temperature is not exceeded. The heat
sink required depends on the power dissipated and on
ambient conditions. Consult Application Bulletin AB-038
for information on determining heat sink requirements.
The mounting tab of the surface-mount package version
should be soldered to a circuit board copper area for good
heat dissipation. Figure 3 shows typical thermal resistance
from junction to ambient as a function of the copper area.
THERMAL PROTECTION
The OPA544 has thermal shutdown that protects the ampli-
fier from damage. Any tendency to activate the thermal
shutdown circuit during normal operation is indication of
excessive power dissipation or an inadequate heat sink.
The thermal protection activates at a junction temperature of
approximately 155˚C. For reliable operation, junction tem-
perature should be limited to 150˚C, maximum. To estimate
the margin of safety in a complete design (including heat
sink), increase the ambient temperature until the thermal
protection is activated. Use worst-case load and signal con-
ditions. For good reliability, the thermal protection should
trigger more than 25˚C above the maximum expected ambi-
ent condition of your application. This produces a junction
temperature of 125˚C at the maximum expected ambient
condition.
Depending on load and signal conditions, the thermal pro-
tection circuit may produce a duty-cycle modulated output
signal. This limits the dissipation in the amplifier, but the
rapidly varying output waveform may be damaging to some
loads. The thermal protection may behave differently de-
pending on whether internal dissipation is produced by
sourcing or sinking output current.
OUTPUT STAGE COMPENSATION
The complex load impedances common in power op amp
applications can cause output stage instability. Figure 3
shows an output series R/C compensation network (1Ω in
series with 0.01µF) which generally provides excellent sta-
bility. Some variation in circuit values may be required with
certain loads.
UNBALANCED POWER SUPPLIES
Some applications do not require equal positive and negative
output voltage swing. The power supply voltages of the
OPA544 do not need to be equal. For example, a –6V
negative power supply voltage assures that the inputs of the
OPA544 are operated within their linear common-mode
range, and that the output can swing to 0V. The V+ power
supply could range from 15V to 65V. The total voltage (V–
to V+) can range from 20V to 70V. With a 65V positive
supply voltage, the device may not be protected from dam-
age during short-circuits because of the larger VCE during
this condition.
OUTPUT PROTECTION
Reactive and EMF-generating loads can return load current
to the amplifier, causing the output voltage to exceed the
power supply voltage. This damaging condition can be
avoided with clamp diodes from the output terminal to the
power supplies as shown in Figure 4. Fast-recovery rectifier
diodes with a 4A or greater continuous rating are recom-
mended.
FIGURE 3. Thermal Resistance vs Circuit Board Copper Area.
THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA
50
40
30
20
10
0
Thermal Resistance, θ
JA
(°C/W)
012345
Copper Area (inches
2
)
OPA544F
Surface Mount Package
1oz copper
Circuit Board Copper Area
OPA544
Surface Mount Package
®
8OPA544
FIGURE 4. Motor Drive Circuit.
G = – = –4
R
2
R
1
1Ω
0.01µF
R
2
20kΩ
R
1
5kΩ
OPA544
V–
V+
V
IN
Motor
D
1
D
2
D
1
, D
2
: Motorola MUR420 Fast Recovery Rectifier.
OPA602
10kΩ
OPA544
40kΩ
0-1mA
DAC7801
12-bit
M-DAC
10V
REF102
+30V
+5V
20pF
20kΩ
1Ω
0.01µF
1µH
4.7kΩ
470pF
10kΩ10Ω
V
O
±20V
at 2A
Output series L/R
network helps assure
stability with very high
capacitance loads.
–30V
+30V
8-bit
data port
(8 + 4 bits)
FIGURE 5. Digitally Programmable Power Supply.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Aug-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA544F OBSOLETE DDPAK/
TO-263 KTT 5 TBD Call TI Call TI Replaced by OPA544FKTTT
OPA544F/500 ACTIVE DDPAK/
TO-263 KTT 5 500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples
OPA544F/500G3 ACTIVE DDPAK/
TO-263 KTT 5 500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR Purchase Samples
OPA544FKTTT ACTIVE DDPAK/
TO-263 KTT 5 50 TBD Call TI Call TI Contact TI Distributor
or Sales Office
OPA544FKTTTG3 ACTIVE DDPAK/
TO-263 KTT 5 50 TBD Call TI Call TI Contact TI Distributor
or Sales Office
OPA544T ACTIVE TO-220 KC 5 49 TBD Call TI Call TI Contact TI Distributor
or Sales Office
OPA544T-1 OBSOLETE TO-220 KC 5 TBD Call TI Call TI Replaced by OPA544T
OPA544TG3 ACTIVE TO-220 KC 5 49 TBD Call TI Call TI Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Aug-2010
Addendum-Page 2
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