935260937512 - NXP SEMICONDUCTORS

DATA SH EET

Product specification 1998 Feb 23

INTEGRATED CIRCUITS

TDA7056AT

3 W mono BTL audio amplifier with

DC volume control

1998 Feb 23 2

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

FEATURES

•DC volume control

•Few external components

•Mute mode

•Thermal protectio n

•Short-circuit proof

•No switch-on or switch-off clicks

•Good overall stab ility

•Low power cons umption

•Low HF radiation

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7056AT is a mono Bridge-Tied Load (BTL) output

amplifier with DC volume control. It is designed for use in

TVs and monitors, but is als o su itable for battery-fe d

portable recorders and radios. The device is contained in

a 20-lead small outlin e pa ckage.

A Missing Current Limiter (MCL) is built in. The MCL circuit

is activated when the difference in current between the

output terminal of each amplifier exceeds 100 mA

(300 mA typ.). This level of 100 mA allows for

Single-Ended (SE) headphone applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply vo ltage 4.5 −18 V

Pooutput power VP=12V; R

L=16Ω33.5−W

Gv(max) maximum total voltage gain VP=12V; R

L=16Ω34.5 35.5 36.5 dB

ΔGvvoltage gain control range 75 80 −dB

Iq(tot) total quiescent current VP=12V; R

L=∞− 816mA

THD tot al ha rmo n i c distortion Po=0.5W −0.3 1 %

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA7056AT SO20 plastic small outline package with 20 leads; body width 7.5 mm SOT163-1

1998 Feb 23 3

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

positive input

MGM576

TDA7056AT

I + i

17I − i

STABILIZER TEMPERATURE

PROTECTION

DC volume control

Vref

−

positive output

negative output

power

ground

signal

ground

1 to 3, 8 to 13,

16, 18 to 20

n.c.

1998 Feb 23 4

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected

n.c. 2 not connected

n.c. 3 not connected

VP4 positive supply voltage

VI5 p ositive input

GND1 6 signal ground

VC 7 DC volume control

n.c. 8 not connected

n.c. 9 not connected

n.c. 10 not connected

n.c. 11 not connected

n.c. 12 not connected

n.c. 13 not connected

OUT+ 14 positive output

GND2 15 power ground

n.c. 16 not connected

OUT−17 negative output

n.c. 18 not connected

n.c. 19 not connected

n.c. 20 not connected Fig.2 Pin configuration.

handbook, halfpage

n.c.

GND1

n.c.

OUT−

GND2

OUT+

n.c.

10 11

TDA7056AT

MGM577

1998 Feb 23 5

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

FUNCTIONAL DESCRIPTION

The TDA7056AT is a mono BTL output amplifier with DC

volume control. It is designed for use in TVs and monitors

but is also suitable for battery-fed portable recorders and

radios.

In conventional DC volume circuits the control or input

stage is AC-coupled to the output stage via external

capacitors to keep the offset voltage low. In the

TDA7056AT the DC volume control stage is integrated into

the input stage so that no coupling capacitors are required.

With this configuration, a low offset voltage is still

maintained and the minimum supply voltage remains low.

The BTL principle offer s the follo wing advantages:

•Lower peak value of the supply current

•The frequency of the ripple on the supply voltage is twice

the signal frequency.

Consequently, a re duced power supply with smaller

capacitors can be used which also results in cost

reductions. For po rtable applica tions there is a trend to

decrease the supply voltage, resulting in a reduction of

output power at conventional output stages. Using the BTL

principle increas es the output power.

The maximum gain of the amplifier is fixed at 35.5 dB.

The DC volume control stage has a logarithmic control

characteristic.

The total gain can be controlled from +35.5 to −44 dB.

If the DC volume control voltage is below 0.3 V, the device

switches to the mute mode.

The amplifier is short-circuit proof to ground, VP and

across the load. A thermal protection circuit is also

implemented. If the crystal temper ature rises above

+150 °C the gain will be reduced, thereby reducing the

output power. Special attention is give n to s witch -on and

switch-off clicks, low HF radiation and a good overall

stability.

Power dissipation

Assume VP=12V; R

L=16Ω.

The maximum sine wave dissipation is 1.8 W.

The Rth vj-a of the package is 60 K/W.

Therefore Tamb(max) =150−60 ×1.8 = 42 °C.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTE RISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage −18 V

V5, 7 input voltage pins 5 and 7 −5V

IORM repetitive peak output current −1.25 A

IOSM non-repetitive peak output current −1.5 A

Ptot total power dissipation Tcase <60 °C−1.5 W

Tamb operating ambient temperature −40 +85 °C

Tstg storage temperature −55 +150 °C

Tvj virtual junction temperature −150 °C

tsc short-circuit time −1h

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air 60 K/W

1998 Feb 23 6

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

CHARACTERISTICS

VP=12V; V

DC = 1 .4 V; f = 1 kHz; RL=16Ω; Tamb =25°C; unless otherwise spec ified (s ee Fig.14).

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset voltage divided by RL.

2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs=0Ω an d B = 5 kHz.

3. The ripple rejection is measured with Rs=0Ω and f = 100 Hz to 10 kHz. The ripple voltage (Vripple =200mVRMS)

is applied to the positive su pply rail.

4. The noise output voltage (Vn(o)(rms)) is measured with Rs=5kΩ unweighted.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VPsupply voltage 4.5 −18 V

Iq(tot) total quiescent current RL=∞; note 1 −816mA

Maximum gain (V7=1.4V)

Pooutput power THD = 10%; RL=16Ω33.5 −W

THD total harmonic distortion Po=0.5W −0.3 1 %

Gv(max) maximum total voltage gain 34.5 35.5 36.5 dB

Vi(rms) input signal handling (RMS va lue) VVC =0.8V; THD<1% 0.5 0.65 −V

Vn(o)(rms) noise output voltage (RMS value) f = 500 kHz; note 2 −210 −μV

B bandwidth at −1dB −0.02 to 300 −kHz

SVRR supply voltage ripple rejection note 3 38 46 −dB

⎪ΔVOS⎪DC output offset voltage ⎪V17 −v14⎪−0 150 mV

Ziinput impedance (pin 3) 15 20 25 kΩ

Minimum gain (V7=0.5V)

Gvvoltage gain −−44 −dB

Vo(n)(rms) noise output voltage (RMS value) note 4 −20 30 μV

Mute position

Vo(mute) output voltage in mute position VVC ≤0.3 V;

VI= 600 mV; note 4 −35 45 μV

DC volume control

ΔGvvoltage gain control range 75 80 −dB

IVC control current VVC =0V 60 70 80 μA

1998 Feb 23 7

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Fig.3 Quiescent curre nt as a function of the

supply voltage.

V5=1.4V; no load.

handbook, halfpage

MGM578

04 2081216

(mA)

VP (V)

Fig.4 THD as a functio n of ou tput power.

VDC =1.4V.

(1) VP=12V; R

L=16Ω.

handbook, halfpage

MGM579

Po (W)

THD

(%)

10−1110

(1)

Fig.5 THD as a function of frequency.

VP=12V, P

o= 0.5 W, VDC =1.4V.

(1) RL=16Ω.

handbook, halfpage

MGM580

10 10

f (Hz)

THD

(%)

(1)

Fig.6 Ripple rejec tio n as a function of frequency.

VP=12V; R

L=16Ω; Vr=200mV.

(1) V7=0.3V; R

s=5kΩ.

(2) V7=1.4V; R

s=0Ω.

(3) V7=1.4V; R

s=5kΩ.

handbook, halfpage

100

MGM581

10 10

f (Hz)

(dB)

(2)

(3)

(1)

1998 Feb 23 8

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Fig.7 Gain control as a function of DC volume

control.

handbook, halfpage

MGM582

−80

−20

−40

0 1.2 2.00.4 1.60.8 V7 (V)

gain

(dB)

−60

Fig.8 Noise output voltage as a function of DC

volume control.

Measured with Rs=5kΩ unweighted; f = 22 Hz to 22 kHz.

handbook, halfpage

1000

800

400

200

600

0 1.2 2.0

MGM583

0.4 1.60.8

(μV)

V7 (V)

Fig.9 Input signal handlin g as a function of the

supply voltage.

Tamb =25°C; THD = 1%; RL=16Ω; VDC =0.8V.

handbook, halfpage

1000

200

MGM584

400

600

800

04 2081216

(mV)

VP (V)

Fig.10 Output power as a function of the supply

voltage.

Measured at THD = 10%. The maximum output power is limited by

the maximum power dissipation an d the maximum available output

current.

(1) RL=8Ω.

(2) RL=16Ω.

(3) RL=25Ω.

handbook, halfpage

MGM585

04 2081216

(W)

VP (V)

(1) (2) (3)

1998 Feb 23 9

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Fig.11 Total worst case power dissipation as a

function of supply voltage.

(1) RL=8Ω.

(2) RL=16Ω.

(3) RL=25Ω.

handbook, halfpage

0420

MGM586

81216

(W)

VP (V)

(1) (3)(2)

Fig.12 Control current as a function of DC volume

control.

handbook, halfpage

0 1.2 2.0

100

−20

MGM587

−60

−100 0.4 1.60.8 V7 (V)

(μA)

1998 Feb 23 10

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Fig.13 Printed-circu it bo ard layout.

handbook, full pagewidth

MGM591

+VP

−OUT

volume

+OUT

TDA7056A/BT

5 kΩ

220 μF

0.47 μF

100 nF

100

GND

D&A AUDIO POWER

CIC NIJMEGEN

b. Top view of component s i de.

a. Top view of bottom copper.

1998 Feb 23 11

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

TEST AND APPLICATION INFO RMATION

Test conditions

Tamb =25°C if not specified: VP=12V; V

DC =1.4V;

f=1kHz; R

L=16Ω; audio bandpass: 22 Hz to 22 kHz.

In Figures 5 and 6 a low-pass filter of 80 kHz was applied.

It should be noted that capacitive loads (100 pF and 5 nF)

connected between the output pins to a co mmon ground

can cause oscillations. The BTL application circuit diagram

is shown in Fig.14. To avoid instabilities and too high

distortion, the input and power ground traces must be

separated as far as possible and connected together as

close as possible to the IC. The quiescent current has

been measured w i thout load impeda nce.

Voltage gain

The maximum closed-loop voltage gain has been

internally fixed at 35.5 dB. The input sensitivity at

maximum gain for Po=3W (R

L=16Ω) is 115 mV.

The gain bandwidth is 20 Hz to 300 kHz within 1 dB.

Output power

The output power as a function of supply voltage has been

measured at THD = 10%. The maximum output powe r is

limited by the maximum allowe d power dissipation at

Tamb =25°C app rox imately 2 W, and the maximum

available output current is 1.25 A repetitive peak current.

Switch-on/switch-off

The switch-on behaviour depends on the following:

•The rise time of the power su pply (if tr>40ms for

VP= 0 to 12 V then the switch-on behaviour will be

good)

•The input capacitor and source impedance (a hi gher

source impedance and/or lower input capacitor value

will have a positive influence on the switch-on/switch-off

behaviour)

•The DC volume control pin (a capacitor of >0.1 μF

avoids disturbances).

Thermal behaviour:

The measured thermal resistance of the IC package is

highly depende nt on the configuration and size of the

application board. Data may not be comparable between

different semiconductors manufacturers because the

application boards and tes t methods are not (yet)

standardized. The thermal performance of packages for a

specific application may also be differ ent than presented

here, because the configuration of the application boa rds

(copper area) may be different. NXP Semiconductors uses

FR-4 type application boards with 1 oz copper traces with

solder coating . The measur ements ha ve been carr ied out

with vertical placed bo ar ds.

Using a practical PCB layout with wider copper tracks and

some copper area to the IC pins and just under the IC, the

thermal resistance from junction to ambient can be

reduced. In the demonstration application PCB the

Rth(j-a) = 56 K/W for the SO20 plastic package. For a

maximum ambient temperature of Tamb =50°C the

following calculation can be made for the maximum power

dissipation:

For the application at VP= 12 V and RL=16Ω the worst

case sine wave di ssipation is 1.85 W. Because in pr actice

the ‘music-power’ causes about the half of the s ine wave

dissipation, this application (VP=12V; R

L=16Ω) has

been allowed.

Short-circuit protection:

The output pins (pins 14 and 17) can be short-circuited to

ground respec tive ly to +V P. The Missing Current Limiter

(MCL) protection circuit will shut-off the amplifier.

Removing the short-circuit will reset the amplifier

automatically. Short-circuit across the load

(pins 14 and 17) will activate the thermal protection circuit;

this will result in reducing the short-circuit current.

150 K/W 50 K/W–()

56 K/W

----------------------------------------------------- 1.79 W=

1998 Feb 23 12

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

For single-end application the output peak current may not exceed 100 mA; at highe r output currents the short circuit

protection (MLC) will be activated.

Fig.14 Test and applicatio n diagram.

To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as

possibl e to the IC.

(1) This capacitor can be omitted if the 220 μF elect r olytic capacitor is connected close to pin 2.

handbook, full pagewidth

positive input

MGM588

kΩ

0.47 μF

100 nF 220 μF

RL = 16 Ω

(1)

ground

volume

control

TDA7056AT

I + i

17I − i

STABILIZER TEMPERATURE

PROTECTION

Vref

−

1 to 3, 8 to 13,

16, 18 to 20

n.c.

1998 Feb 23 13

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Fig.15 Application with potentiometer as volume

control; maximum gain = 30 dB.

handbook, halfpage

MGM589

100 kΩ

1 μF

GND

volume

control TDA7056AT

Fig.16 Application with potentiometer as volume

control; maximum gain = 36 dB.

handbook, halfpage

MGM590

TDA7056AT

22 kΩ

82 kΩ

1 μF

GND

VP = 12 V

volume

control

1998 Feb 23 14

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 13.0

12.6 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT163-1

detail X

0.25

075E04 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.51

0.49 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

0 5 10 mm

scale

vMA

(A )

O20: plastic small outline package; 20 leads; body width 7.5 mm SOT163

-1

99-12-27

03-02-19

1998 Feb 23 15

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “IC Package Databook” (order cod e 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensing before packag e plac ement.

Several techniques ex is t for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending o n heating

method. Typical reflow temperatures range from

215to250°C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

Wave soldering

Wave soldering techniques can be used for all SO

packages if the following conditions are observ ed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

techniqu e sh ould be used.

•The longitudinal ax is of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temp erature is 260 °C, and

maximum duration of pack age immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first so ldering two diagonally-

opposite end leads. Use only a low voltage solder ing iron

(less than 24 V) applied to th e flat part of the lead. Con tact

time must be limit ed to 10 seconds at up t o 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operatio n wi th in 2 to 5 seconds bet we en

270 and 320 °C.

1998 Feb 23 16

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document b efore initiating or completing a design.

2. The product status of device (s) described in this document may have ch anged since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective s pe cification for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet P roduction This docume nt contains the product specification.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliable.

However, NXP Semiconduc tors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, busin es s interru ption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cu mulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditio ns of comme rcial

sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa tion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereo f.

Suitability for use ⎯ NXP Semiconduct ors pr oduc ts are

not designed, au thorized or warran ted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in pe rs onal injury, death or seve re

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductor s pr oducts in such equi pme nt or

application s and therefor e such inclusion and/or use is at

the customer’s own risk.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors pro du ct is su itable and fit for the

customer’s applications and products planned, as well as

for the planned a pplication and use of customer’s third

party customer(s). Customers should provide appropriate

design and opera t ing saf eg ua rd s to minimize the risks

associated with their applications and products.

NXP Semiconduc tors does n ot a ccept any liabil ity rela ted

to any default, damage, costs or problem which is based

on any weakne ss or default in t he customer’s applic ations

or products, or the application or use by customer’s third

party customer( s) . C us to m er is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applic ations and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

1998 Feb 23 17

NXP Semiconductors Product specification

3 W mono BTL audio amplifier with DC

volume control TDA7056AT

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions abo ve those given in th e Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the qua l ity and

reliability of the device.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subject to the general

terms and conditio ns of commercial sale, as published at

http://www.nxp.com/profile/terms, unless other wise

agreed in a valid written ind i vidual agreement. In case an

individual agreeme nt is co nc luded only the terms and

conditions of the resp ective agreement shall apply. NXP

Semiconductors hereby expressly objects to applying the

customer’s general terms and conditions with regard to the

purchase of NXP Semicon ductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)

described he re in may be subject to export control

regulations. Export might require a prior authorization from

national auth or itie s.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is au tomotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor te sted in accordanc e with automot ive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified prod ucts in automotive eq uip m en t or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such au t omo tive application s, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own ris k, and (c) customer fully inde m nifies

NXP Semiconductors for any liability, damages or failed

product clai ms r esult ing fr om custo mer desi gn an d us e o f

the product for automotive ap plic ations beyond NXP

Semiconductors ’ st andard warranty and NXP

Semiconductors’ product specifications.

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provides High Performance Mixed Signal and Standard Product

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Interface, Security and Digital Processing expertise

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual pr operty rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the tech nical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands 545102/25/01/pp18 Date of releas e : 1998 Feb 23 Document order number: 9397 750 03253