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BAS3005A...
Low VF Schottky Diode
Forward current: 0.5 A
Reverse voltage: 30 V
Very low forward voltage
(typ. 0.45 V @ IF = 0.5 A)
For low loss, fast-recovery protecting
and clamping applications
Pb-free (RoHS compliant) package1)
Qualified according AEC Q101
BAS3005A-02V
Type Package Configuration Marking
BAS3005A-02V* SC79 single 2
* Preliminary data
Maximum Ratings at T
A
= 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage2) VR30 V
Forward current2) IF500 mA
Average rectified forward current (50/60Hz, sinus) IFAV 500 mA
Repetitive peak forward current
(tp 1 ms, D 0.25) IFRM 3.5 A
Non-repetitive peak surge forward current
(t 10 ms) IFSM 5
Junction temperature T
j
150 °C
Operating temperature range To
p
-55 ... 125
Storage temperature Tst
g
-65 ... 150
1Pb-containing package may be available upon special request
2For TA > 25 °C the derating of VR and IF has to be considered.
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BAS3005A...
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1) RthJS tbd K/W
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current2)
VR = 5 V
VR = 10 V
VR = 30 V
IR
-
-
-
-
-
-
15
30
300
µA
Forward voltage2)
IF = 1 mA
IF = 10 mA
IF = 100 mA
IF = 500 mA
VF
-
-
-
-
200
260
340
450
260
310
390
500
mV
AC Characteristics
Diode capacitance
VR = 5 V, f = 1 MHz CT- 10 15 pF
1For calculation of RthJA please refer to Application Note Thermal Resistance
2Pulsed test: tp = 300 µs; D = 0.01
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BAS3005A...
Diode capacitance CT = ƒ (VR)
f = 1MHz
0 5 10 15 20 V30
VR
0
5
10
15
20
25
pF
35
CT
Reverse current IR = ƒ (TA)
VR = Parameter
0 25 50 75 100 °C 150
TA
-6
10
-5
10
-4
10
-3
10
-2
10
A
IR
30 V
20 V
10 V
5 V
Reverse current IR = ƒ(VR)
TA = Parameter
0 5 10 15 20 V30
VR
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
A
IR
25 °C
85 °C
125 °C
Forward Voltage VF = ƒ (TA)
IF = Parameter
-50 -25 0 25 50 75 100 °C 150
TA
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
V
0.5
VF
1 mA
10 mA
100 mA
500 mA
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BAS3005A...
Forward current IF = ƒ (VF)
TA = Parameter
0 0.1 0.2 0.3 0.4 V0.6
VF
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
A
IF
125 °C
85 °C
25 °C
- 40 °C
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BAS3005A...
Package SC79
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.6
0.3
1
2
marking
Cathode
0.8 ±0.1
10
˚
MAX.
±0.1
1.2
A
±0.05
10
˚
MAX.
0.13
A0.2
M
+0.05
-0.03
±0.04
0.55
±0.05
0.2
0.35
0.35
1.35
BAR63-02V
Type code
Cathode marking
Laser marking
2
0.66
0.93
0.4
1.33
1.96
8
0.2
Cathode
marking
4
Cathode
marking
Standard Reel with 2 mm Pitch
2005, June
Date code
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BAS3005A...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
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BAS3005A...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
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systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.