Allinformationprovidedissubjecttochangeatanytime,withoutnotice.Intelmaymakechangestomanufacturinglifecycle,specifications,andproductdescriptionsatanytime,withoutnotice.Theinformation
hereinisprovided"asis"andInteldoesnotmakeanyrepresentationsorwarrantieswhatsoeverregardingaccuracyoftheinformation,norontheproductfeatures,availability,functionality,orcompatibilityof
theproductslisted.Pleasecontactsystemvendorformoreinformationonspecificproductsorsystems.
"Intelclassifications"consistofExportControlClassificationNumbers﴾ECCN﴿andHarmonizedTariffSchedule﴾HTS﴿numbers.AnyusemadeofIntelclassificationsarewithoutrecoursetoIntelandshallnotbe
construedasarepresentationorwarrantyregardingtheproperECCNorHTS.Yourcompanymaybetheexporterofrecord,andassuch,yourcompanyisresponsiblefordeterminingthecorrectclassification
ofanyitematthetimeofexport.
RefertoDatasheetforformaldefinitionsofproductpropertiesandfeatures.
“Announced”SKUsarenotyetavailable.PleaserefertotheLaunchDateformarketavailability.
SomeproductscansupportAESNewInstructionswithaProcessorConfigurationupdate,inparticular,i72630QM/i72635QM,i72670QM/i72675QM,i52430M/i52435M,i52410M/i52415M.Please
contactOEMfortheBIOSthatincludesthelatestProcessorconfigurationupdate.
‡Thisfeaturemaynotbeavailableonallcomputingsystems.Pleasecheckwiththesystemvendortodetermineifyoursystemdeliversthisfeature,orreferencethesystemspecifications﴾motherboard,
processor,chipset,powersupply,HDD,graphicscontroller,memory,BIOS,drivers,virtualmachinemonitorVMM,platformsoftware,and/oroperatingsystem﴿forfeaturecompatibility.Functionality,
performance,andotherbenefitsofthisfeaturemayvarydependingonsystemconfiguration.
“Conflictfree”and“conflictfree”means“DRCconflictfree”, whichisdefinedbytheU.S.SecuritiesandExchangeCommissionrulestomeanproductsthatdonotcontainconflictminerals﴾tin,tantalum,tungsten
and/orgold﴿thatdirectlyorindirectlyfinanceorbenefitarmedgroupsintheDemocraticRepublicoftheCongo﴾DRC﴿oradjoiningcountries.Intelalsousestheterm"conflictfree"inabroadersensetoreferto
suppliers,supplychains,smeltersandrefinerswhosesourcesofconflictmineralsdonotfinanceconflictintheDRCoradjoiningcountries.IntelprocessorsmanufacturedbeforeJanuary1,2013arenot
confirmedconflictfree.Theconflictfreedesignationrefersonlytoproductmanufacturedafterthatdate.ForIntelBoxedProcessors,theconflictfreedesignationreferstotheprocessoronly,nottoany
additionalincludedaccessories,suchasheatsinks/coolers.
Seehttp://www.intel.com/content/www/us/en/architectureandtechnology/hyperthreading/hyperthreadingtechnology.html?wapkw=hyper+threadingformoreinformationincludingdetailsonwhich
processorssupportIntel® HTTechnology.
MaxTurboFrequencyreferstothemaximumsinglecoreprocessorfrequencythatcanbeachievedwithIntel® TurboBoostTechnology.Seewww.intel.com/technology/turboboost/formoreinformation.
UARTYes
PackageSpecifications
MaxCPUConfiguration 1
PackageSize37.5mmx37.5mm
SocketsSupportedFCBGA1667
LowHalogenOptionsAvailableSeeMDDS
AdvancedTechnologies
Intel® TurboBoostTechnology‡
2.0
Intel® HyperThreadingTechnology‡
Yes
Intel® VirtualizationTechnology﴾VTx﴿‡
Yes
Intel® VirtualizationTechnologyforDirectedI/O
﴾VTd﴿‡
Yes
Intel® VTxwithExtendedPageTables﴾EPT﴿‡
Yes
Intel® TSXNIYes
Intel® 64‡
Yes
IdleStatesYes
EnhancedIntelSpeedStep® TechnologyYes
ThermalMonitoringTechnologiesYes
Intel® DataProtectionTechnology
Intel® AESNewInstructionsYes
SecureKeyYes
Intel® PlatformProtectionTechnology
TrustedExecutionTechnology‡
Yes
ExecuteDisableBit‡
Yes
OSGuardYes
NetworkingSpecifications
SFIInterfaceYes
KRInterfaceYes
KR4InterfaceNo
KXInterfaceYes
KX4InterfaceYes
100BaseT No
1000BaseT Yes
10GBaseT Yes