dsPIC30F0012ATP-E/PT - Microchip Technology

 2003 Microchip Technology Inc. Advance Information DS70083C

dsPIC30F Data Sheet

General Purpose and Sensor Families

High Performance

Digital Signal Controllers

DS70083C-page ii Advance Information  2003 Microchip Technology Inc.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical

components in life support systems is not authorized except

with express written approval by Microchip. No licenses are

conveyed, implicitly or otherwise, under any intellectual

property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, microPort,

Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,

PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 1

dsPIC30F

High Performance Modified RISC CPU:

• Modified Harvard architecture

• C compiler optimized instruction set architecture

• 84 base instructions

• 24-bit wide instructions, 16-bit wide data path

• Linear program memory addressing up to 4M

instruction words

• Linear data memory addressing up to 64 Kbytes

• Up to 144 Kbytes on-chip Flash program space

• Up to 48K instruction words

• Up to 8 Kbytes of on-chip data RAM

• Up to 4 Kbytes of non-volatile data EEPROM

• 16 x 16-bit working register array

• Three Address Generation Units that enable:

- Dual data fetch

- Accumulator write back for DSP operations

• Flexible Addressing modes supporting:

- Indirect, Modulo and Bit-Reversed modes

• Two 40-bit wide accumulators with optional

saturation logic

• 17-bit x 17-bit single cycle hardware fractional/

integer multiplier

• Single cycle Multiply-Accumulate (MAC)

operation

• 40-stage Barrel Shifter

• Up to 30 MIPs operation:

- DC to 40 MHz external clock input

- 4 MHz-10 MHz oscillator input with

PLL active (4x, 8x, 16x)

• Up to 41 interrupt sources:

- 8 user selectable priority levels

• Vector table with up to 62 vectors:

- 54 interrupt vectors

- 8 processor exceptions and software traps

Peripheral Features:

• High current sink/source I/O pins: 25 mA/25 mA

• Up to 5 external interrupt sources

•Timer module with programmable prescaler:

- Up to five 16-bit timers/counters; optionally

pair up 16-bit timers into 32-bit timer modules

• 16-bit Capture input functions

• 16-bit Compare/PWM output functions:

- Dual Compare mode available

• Data Converter Interface (DCI) supports common

audio Codec protocols, including I2S and AC’97

• 3-wire SPI™ modules (supports 4 Frame modes)

•I

2C™ module supports Multi-Master/Slave mode

and 7-bit/10-bit addressing

• Addressable UART modules supporting:

- Interrupt on address bit

- Wake-up on Start bit

- 4 characters deep TX and RX FIFO buffers

• CAN bus modules

Analog Features:

• 12-bit Analog-to-Digital Converter (A/D) with:

- 100 Ksps conversion rate

- Up to 16 input channels

- Conversion available during Sleep and Idle

• Programmable Low Voltage Detection (PLVD)

• Programmable Brown-out Detection and Reset

generation

dsPIC30F Enhanced Flash 16-bit Digital Signal Controllers

General Purpose and Sensor Families

dsPIC30F

DS70083C-page 2 Advance Information  2003 Microchip Technology Inc.

Special Microcontroller Features:

• Enhanced Flash program memory:

- 10,000 erase/write cycle (min.) for

industrial temperature range, 100K (typical)

• Data EEPROM memory:

- 100,000 erase/write cycle (min.) for

industrial temperature range, 1M (typical)

• Self-reprogrammable under software control

• Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST)

• Flexible Watchdog Timer (WDT) with on-chip low

power RC oscillator for reliable operation

• Fail-Safe Clock Monitor operation:

- Detects clock failure and switches to on-chip

low power RC oscillator

• Programmable code protection

• In-Circuit Serial Programming™ (ICSP™) via

3 pins and power/ground

• Selectable Power Management modes:

- Sleep, Idle and Alternate Clock modes

CMOS Technology:

• Low power, high speed Flash technology

• Wide operating voltage range (2.5V to 5.5V)

• Industrial and Extended temperature ranges

• Low power consumption

 2003 Microchip Technology Inc. Advance Information DS70083C-page 3

dsPIC30F

dsPIC30F Sensor Processor Family

Pin Diagrams

Device Pins

Program Memory SRAM

Bytes

EEPROM

Bytes

Timer

16-bit

Input

Cap

Output Comp/

Std PWM

A/D 12-bit

100 Ksps

UART

SPI™

I2C™

Bytes Instructions

dsPIC30F2011 18 12K 4K 1024 0 3 2 2 8 ch 1 1 1

dsPIC30F3012 18 24K 8K 2048 1024 3 2 2 8 ch 1 1 1

dsPIC30F2012 28 12K 4K 1024 0 3 2 2 10 ch 1 1 1

dsPIC30F3013 28 24K 8K 2048 1024 3 2 2 10 ch 2 1 1

dsPIC30F2011

18-Pin SOIC and PDIP

dsPIC30F3012

MCLR

VSS

VDD

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AVDD

AVSS

AN2/SS1/LVDIN/CN4/RB2

IC2/INT2/RD9 EMUC2/IC1/INT1/RD8

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

VSS

OSC2/CLKO/RC15

OSC1/CLKI VDD

SCK1/INT0/RF6

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

AN5/CN7/RB5

AN4/CN6/RB4

AN3/CN5/RB3

AN6/OCFA/RB6

EMUD2/AN7/RB7

AN8/OC1/RB8

AN9/OC2/RB9

RF4

RF5

28-Pin SDIP and SOIC

dsPIC30F2012

Note: Pinout subject to change.

28-Pin SDIP and SOIC

dsPIC30F3013

AVDD

AVSS

EMUC2/IC1/INT1/RD8

VSS

VDD

SCK1/INT0/RF6

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

AN6/OCFA/RB6

EMUD2/AN7/RB7

AN8/OC1/RB8

AN9/OC2/RB9

RF4

RF5

MCLR

VSS

VDD

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

IC2/INT2/RD9

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSC2/CLKO/RC15

OSC1/CLKI

AN5/CN7/RB5

AN4/CN6/RB4

AN3/CN5/RB3

AVDD

AVSS

EMUC2/OC1/IC1/INT1/RD0

VSS

VDD

PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5

PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4

AN6/SCK1/INT0/OCFA/RB6

EMUD2/AN7/OC2/IC2/RB7

MCLR

AN0/VREF+/CN2/RB0

AN1/VREF-/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSCO/CLKO/RC15

OSCI/CLKI

AN3/CN5/RB3

dsPIC30F

DS70083C-page 4 Advance Information  2003 Microchip Technology Inc.

dsPIC30F General Purpose Controller Family

Pin Diagrams

Device Pins

Program Memory SRAM

Bytes

EEPROM

Bytes

Timer

16-bit

Input

Cap

Output

Comp/Std

PWM

Codec

Interface

A/D 12-bit

100 Ksps

UART

SPI™

I2C™

CAN

Bytes Instructions

dsPIC30F3014 40/44 24K 8K 2048 1024 3 2 2 — 13 ch 2 1 1 -

dsPIC30F4013 40/44 48K 16K 2048 1024 5 4 4 AC’97, I2S 13 ch 2 1 1 1

dsPIC30F5011 64 66K 22K 4096 1024 5 8 8 AC’97, I2S 16 ch 2 2 1 2

dsPIC30F6011 64 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2

dsPIC30F6012 64 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2

dsPIC30F5013 80 66K 22K 4096 1024 5 8 8 AC’97, I2S 16 ch 2 2 1 2

dsPIC30F6013 80 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2

dsPIC30F6014 80 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2

PGD/EMUD/AN7/RB7

PGC/EMUC/AN6/OCFA/RB6

C1RX/RF0

C1TX/RF1

IC1/INT1/RD8

OC3/RD2

AN8/RB8

dsPIC30F4013

MCLR

AN0/V

REF

+/CN2/RB0

AN1/V

REF

-/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

OC4/RD3

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSC2/CLKO/RC15

OSC1/CLKI

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

AN3/CN5/RB3

IC2/INT2/RD9

EMUC3/SCK1/RF6

U1RX/SDI1/SDA/RF2

EMUD3/U1TX/SDO1/SCL/RF3

U2RX/RF4

U2TX/RF5

AN12/COFS/RB12

AN10/CSDI/RB10

AN11/CSDO/RB11

AN9/CSCK/RB9

EMUC2/OC1/RD0

EMUD2/OC2/RD1

INT0/RA11

40-Pin PDIP

PGD/EMUD/AN7/RB7

PGC/EMUC/AN6/OCFA/RB6

RF0

RF1

IC1/INT1/RD8

RD2

AN8/RB8

dsPIC30F3014

MCLR

AN0/V

REF

+/CN2/RB0

AN1/V

REF

-/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

RD3

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSC2/CLKO/RC15

OSC1/CLKI

AN5/CN7/RB5

AN4/CN6/RB4

AN3/CN5/RB3

IC2/INT2/RD9

EMUC3/SCK1/RF6

U1RX/SDI1/SDA/RF2

EMUD3/U1TX/SDO1/SCL/RF3

U2RX/RF4

U2TX/RF5

AN12/RB12

AN10/RB10

AN 11 /RB11

AN9/RB9

EMUC2/OC1/RD0

EMUD2/OC2/RD1

INT0/RA11

40-Pin PDIP

Note: Pinout subject to change.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 5

dsPIC30F

Pin Diagrams (Continued)

EMUD3/U1TX/SDO1/SCL/RF3

EMUC3/SCK1/RF6

IC1/INT1/RD8

RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

VSS

RD3

IC2/INT2/RD9

INT0/RA11

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

MCLR

AVDD

AVSS

AN9/RB9

AN10/RB10

AN11/RB11

AN12/RB12

EMUC2/OC1/RD0

EMUD2/OC2/RD1

VDD

VSS

RF0

RF1

U2RX/RF4

U2TX/RF5

U1RX/SDI1/SDA/RF2

AN4/CN6/RB4

AN5/CN7/RB5

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

dsPIC30F3014

44-Pin TQFP

Note: Pinout subject to change.

dsPIC30F

DS70083C-page 6 Advance Information  2003 Microchip Technology Inc.

Pin Diagrams (Continued)

EMUD3/U1TX/SDO1/SCL/RF3

EMUC3/SCK1/RF6

IC1/INT1/RD8

OC3/RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

VSS

OC4/RD3

IC2/INT2/RD9

INT0/RA11

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

MCLR

AVDD

AVSS

AN9/CSCK/RB9

AN10/CSDI/RB10

AN11/CSDO/RB11

AN12/COFS/RB12

EMUC2/OC1/RD0

EMUD2/OC2/RD1

VDD

VSS

C1RX/RF0

C1TX/RF1

U2RX/RF4

U2TX/RF5

U1RX/SDI1/SDA/RF2

AN4/IC7/CN6/RB4

AN5/IC8/CN7/RB5

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

44-Pin TQFP

dsPIC30F4013

Note: Pinout subject to change.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 7

dsPIC30F

Pin Diagrams (Continued)

13 36

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/T4CK/CN1/RC13

EMUC2/OC1/RD0

IC4/INT4/RD11

IC2/INT2/RD9

IC1/INT1/RD8

VSS

OSC2/CLKO/RC15

OSC1/CLKI

VDD

SCL/RG2

EMUC3/SCK1/INT0/RF6

U1RX/SDI1/RF2

EMUD3/U1TX/SDO1/RF3

COFS/RG15

T2CK/RC1

T3CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

VSS

VDD

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

OC8/CN16/RD7

CSDO/RG13

CSDI/RG12

CSCK/RG14

VSS

C2TX/RG1

C1TX/RF1

C2RX/RG0

EMUD2/OC2/RD1

OC3/RD2

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VSS

VDD

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

U2TX/CN18/RF5

U2RX/CN17/RF4

SDA/RG3

SS2/CN11/RG9

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

IC3/INT3/RD10

VDD

C1RX/RF0

OC4/RD3

OC7/CN15/RD6

OC6/IC6/CN14/RD5

OC5/IC5/CN13/RD4

64-Pin TQFP

dsPIC30F5011

dsPIC30F6012

Note: Pinout subject to change.

dsPIC30F

DS70083C-page 8 Advance Information  2003 Microchip Technology Inc.

Pin Diagrams (Continued)

13 36

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/T4CK/CN1/RC13

EMUC2/OC1/RD0

IC4/INT4/RD11

IC2/INT2/RD9

IC1/INT1/RD8

VSS

OSC2/CLKO/RC15

OSC1/CLKI

VDD

SCL/RG2

EMUC3/SCK1/INT0/RF6

U1RX/SDI1/RF2

EMUD3/U1TX/SDO1/RF3

RG15

T2CK/RC1

T3CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

VSS

VDD

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

OC8/CN16/RD7

RG13

RG12

RG14

VSS

C2TX/RG1

C1TX/RF1

C2RX/RG0

EMUD2/OC2/RD1

OC3/RD2

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VSS

VDD

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

U2TX/CN18/RF5

U2RX/CN17/RF4

SDA/RG3

SS2/CN11/RG9

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

IC3/INT3/RD10

VDD

C1RX/RF0

OC4/RD3

OC7/CN15/RD6

OC6/IC6/CN14/RD5

OC5/IC5/CN13/RD4

64-Pin TQFP

dsPIC30F6011

Note: Pinout subject to change.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 9

dsPIC30F

Pin Diagrams (Continued)

dsPIC30F5013

22 80

IC5/RD12

OC4/RD3

OC3/RD2

EMUD2/OC2/RD1

CSCK/RG14

RA7/CN23

RA6/CN22

C2RX/RG0

C2TX/RG1

C1TX/RF1

C1RX/RF0

CSDO/RG13

CSDI/RG12

OC8/CN16/RD7

OC6/CN14/RD5

EMUC2/OC1/RD0

IC4/RD11

IC2/RD9

IC1/RD8

INT4/RA15

IC3/RD10

INT3/RA14

VSS

OSC1/CLKI

VDD

SCL/RG2

U1RX/RF2

U1TX/RF3

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

VREF+/RA10

VREF-/RA9

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VDD

U2RX/CN17/RF4

IC8/CN21/RD15

U2TX/CN18/RF5

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

T3CK/RC2

T4CK/RC3

T5CK/RC4

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/CN3/RB1

AN0/CN2/RB0

VSS

VDD

COFS/RG15

T2CK/RC1

INT2/RA13

INT1/RA12

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

VDD

VSS

OC5/CN13/RD4

IC6/CN19/RD13

SDA/RG3

SDI1/RF7

EMUD3/SDO1/RF8

AN5/CN7/RB5

VSS

OSC2/CLKO/RC15

OC7/CN15/RD6

EMUC3/SCK1/INT0/RF6

IC7/CN20/RD14

80-Pin TQFP

dsPIC30F6014

Note: Pinout subject to change.

dsPIC30F

DS70083C-page 10 Advance Information  2003 Microchip Technology Inc.

Pin Diagrams (Continued)

22 80

IC5/RD12

OC4/RD3

OC3/RD2

EMUD2/OC2/RD1

RG14

RA7/CN23

RA6/CN22

C2RX/RG0

C2TX/RG1

C1TX/RF1

C1RX/RF0

RG13

RG12

OC8/CN16/RD7

OC6/CN14/RD5

EMUC2/OC1/RD0

IC4/RD11

IC2/RD9

IC1/RD8

INT4/RA15

IC3/RD10

INT3/RA14

VSS

OSC1/CLKI

VDD

SCL/RG2

U1RX/RF2

U1TX/RF3

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

VREF+/RA10

VREF-/RA9

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VDD

U2RX/CN17/RF4

IC8/CN21/RD15

U2TX/CN18/RF5

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

T3CK/RC2

T4CK/RC3

T5CK/RC4

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/CN3/RB1

AN0/CN2/RB0

VSS

VDD

RG15

T2CK/RC1

INT2/RA13

INT1/RA12

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

VDD

VSS

OC5/CN13/RD4

IC6/CN19/RD13

SDA/RG3

SDI1/RF7

EMUD3/SDO1/RF8

AN5/CN7/RB5

VSS

OSC2/CLKO/RC15

OC7/CN15/RD6

EMUC3/SCK1/INT0/RF6

IC7/CN20/RD14

80-Pin TQFP

dsPIC30F6013

Note: Pinout subject to change.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 11

dsPIC30F

Table of Contents

1.0 Device Overview ........................................................................................................................................................................ 13

2.0 CPU Architecture Overview........................................................................................................................................................ 17

3.0 Memory Organization................................................................................................................................................................. 31

4.0 Address Generator Units............................................................................................................................................................ 43

5.0 Interrupts .................................................................................................................................................................................... 51

6.0 Flash Program Memory.............................................................................................................................................................. 59

7.0 Data EEPROM Memory ............................................................................................................................................................. 65

8.0 I/O Ports ..................................................................................................................................................................................... 71

9.0 Timer1 Module ........................................................................................................................................................................... 77

10.0 Timer2/3 Module ........................................................................................................................................................................ 81

11.0 Timer4/5 Module ........................................................................................................................................................................ 87

12.0 Input Capture Module................................................................................................................................................................. 91

13.0 Output Compare Module ............................................................................................................................................................ 95

14.0 SPI Module................................................................................................................................................................................. 99

15.0 I2C Module ............................................................................................................................................................................... 103

16.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 111

17.0 CAN Module ............................................................................................................................................................................. 119

18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 131

19.0 12-bit Analog-to-Digital Converter (A/D) Module...................................................................................................................... 141

20.0 System Integration ................................................................................................................................................................... 149

21.0 Instruction Set Summary .......................................................................................................................................................... 163

22.0 Development Support............................................................................................................................................................... 171

23.0 Electrical Characteristics .......................................................................................................................................................... 177

24.0 Packaging Information.............................................................................................................................................................. 227

Index .................................................................................................................................................................................................. 239

On-Line Support................................................................................................................................................................................. 245

Systems Information and Upgrade Hot Line ...................................................................................................................................... 245

Reader Response .............................................................................................................................................................................. 246

Product Identification System ............................................................................................................................................................ 247

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dsPIC30F

DS70083C-page 12 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 13

dsPIC30F

1.0 DEVICE OVERVIEW

This document contains device family specific

information for the dsPIC30F family of Digital Signal

Controller (DSC) devices. The dsPIC30F devices

contain extensive Digital Signal Processor (DSP)

functionality within a high performance 16-bit

microcontroller (MCU) architecture.

Figure 1-1 shows a sample device block diagram.

Note: The device(s) depicted in this block

diagram are representative of the

corresponding device family. Other

devices of the same family may vary in

terms of number of pins and multiplexing

of pin functions. Typically, smaller devices

in the family contain a subset of the

peripherals present in the device(s) shown

in this diagram.

dsPIC30F

DS70083C-page 14 Advance Information  2003 Microchip Technology Inc.

FIGURE 1-1: dsPIC30F5013/6013/6014 BLOCK DIAGRAM

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

Power-up

Timer

Oscillator

Start-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode &

Control

OSC1/CLKI

MCLR

, V

AN4/CN6/RB4

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

Low Voltage

Detect

UART1,

INT4/RA15

INT3/RA14

REF

+/RA10

REF

-/RA9

CAN2

Timing

Generation

CAN1,

AN5/CN7/RB5

PCH PCL

Program Counter

ALU<16>

X Data Bus

DCI

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

PCU

12-bit ADC

Timers

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

SS2/CN11/RG9

U2TX/CN18/RF5

EMUC3/SCK1/INT0/RF6

SDI1/RF7

EMUD3/SDO1/RF8

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

T4CK/RC3

T2CK/RC1

PORTB

C1RX/RF0

C1TX/RF1

U1RX/RF2

U1TX/RF3

C2RX/RG0

C2TX/RG1

SCL/RG2

SDA/RG3

PORTG

PORTD

16 16

16 x 16

W Reg Array

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bus

Effective Address

X RAGU

X WAGU

Y AGU

AN0/CN2/RB0

AN1/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

AN3/CN5/RB3

OSC2/CLKO/RC15

U2RX/CN17/RF4

, AV

UART2

SPI2

16 PORTA

PORTC

PORTF

Interrupt

Controller

PSV & Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data LatchData Latch

Y Data

(4 Kbytes)

RAM

X Data

(4 Kbytes)

RAM

Address

Latch

Address

Latch

Control Signals

to Various Blocks

EMUC2/OC1/RD0

EMUD2/OC2/RD1

OC3/RD2

OC4/RD3

OC5/CN13/RD4

OC6/CN14/RD5

OC7/CN15/RD6

OC8/CN16/RD7

IC1/RD8

IC2/RD9

IC3/RD10

IC4/RD11

IC5/RD12

IC6/CN19/RD13

IC7/CN20/RD14

IC8/CN21/RD15

CSDI/RG12

CSDO/RG13

CSCK/RG14

COFS/RG15

T3CK/RC2

SPI1,

INT1/RA12

INT2/RA13

RA7/CN23

RA6/CN22

T5CK/RC4

Address Latch

Program Memory

(144 Kbytes)

Data Latch

Data EEPROM

(4 Kbytes)

 2003 Microchip Technology Inc. Advance Information DS70083C-page 15

dsPIC30F

Table 1-1 provides a brief description of device I/O

pinouts and the functions that may be multiplexed to a

port pin. Multiple functions may exist on one port pin.

When multiplexing occurs, the peripheral module’s

functional requirements may force an override of the

data direction of the port pin.

TABLE 1-1: PINOUT I/O DESCRIPTIONS

Pin Name Pin

Type

Buffer

Type Description

AN0-AN15 I Analog Analog input channels.

AN0 and AN1 are also used for device programming data and

clock inputs, respectively.

AVDD P P Positive supply for analog module.

AVSS P P Ground reference for analog module.

CLKI

CLKO

ST/CMOS

—

External clock source input. Always associated with OSC1 pin

function.

Oscillator crystal output. Connects to crystal or resonator in

Crystal Oscillator mode. Optionally functions as CLKO in RC

and EC modes. Always associated with OSC2 pin

function.

CN0-CN23 I ST Input change notification inputs.

Can be software programmed for internal weak pull-ups on all

inputs.

COFS

CSCK

CSDI

CSDO

I/O

—

Data Converter Interface frame synchronization pin.

Data Converter Interface serial clock input/output pin.

Data Converter Interface serial data input pin.

Data Converter Interface serial data output pin.

C1RX

C1TX

C2RX

C2TX

—

CAN1 bus receive pin.

CAN1 bus transmit pin.

CAN2 bus receive pin.

CAN2 bus transmit pin

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Primary Communication Channel data input/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data

input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data

input/output pin.

ICD Quaternary Communication Channel clock input/output pin.

IC1-IC8 I ST Capture inputs 1 through 8.

INT0

INT1

INT2

INT3

INT4

External interrupt 0.

External interrupt 1.

External interrupt 2.

External interrupt 3.

External interrupt 4.

LVDIN I Analog Low Voltage Detect Reference Voltage input pin.

MCLR I/P ST Master Clear (Reset) input or programming voltage input. This

pin is an active low Reset to the device.

OCFA

OCFB

OC1-OC8

—

Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare Fault B input (for Compare channels 5, 6, 7 and 8).

Compare outputs 1 through 8.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F

DS70083C-page 16 Advance Information  2003 Microchip Technology Inc.

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator crystal input. ST buffer when configured in RC mode;

CMOS otherwise.

Oscillator crystal output. Connects to crystal or resonator in

Crystal Oscillator mode. Optionally functions as CLKO in RC

and EC modes.

PGD

PGC

I/O

In-Circuit Serial Programming data input/output pin.

In-Circuit Serial Programming clock input pin.

RA6-RA7

RA9-RA10

RA12-RA15

I/O

PORTA is a bidirectional I/O port.

RB0-RB15 I/O ST PORTB is a bidirectional I/O port.

RC1-RC4

RC13-RC15

I/O

PORTC is a bidirectional I/O port.

RD0-RD15 I/O ST PORTD is a bidirectional I/O port.

RF0-RF8 I/O ST PORTF is a bidirectional I/O port.

RG0-RG3

RG6-RG9

RG12-RG15

I/O

PORTG is a bidirectional I/O port.

SCK1

SDI1

SDO1

SS1

SCK2

SDI2

SDO2

SS2

I/O

—

Synchronous serial clock input/output for SPI1.

SPI1 Data In.

SPI1 Data Out.

SPI1 Slave Synchronization.

Synchronous serial clock input/output for SPI2.

SPI2 Data In.

SPI2 Data Out.

SPI2 Slave Synchronization.

SCL

SDA

I/O

Synchronous serial clock input/output for I2C.

Synchronous serial data input/output for I2C.

SOSCO

SOSCI

—

ST/CMOS

32 kHz low power oscillator crystal output.

32 kHz low power oscillator crystal input. ST buffer when config-

ured in RC mode; CMOS otherwise.

T1CK

T2CK

T3CK

T4CK

T5CK

Timer1 external clock input.

Timer2 external clock input.

Timer3 external clock input.

Timer4 external clock input.

Timer5 external clock input.

U1RX

U1TX

U1ARX

U1ATX

U2RX

U2TX

—

UART1 Receive.

UART1 Transmit.

UART1 Alternate Receive.

UART1 Alternate Transmit.

UART2 Receive.

UART2 Transmit.

VDD P — Positive supply for logic and I/O pins.

VSS P — Ground reference for logic and I/O pins.

VREF+ I Analog Analog Voltage Reference (High) input.

VREF- I Analog Analog Voltage Reference (Low) input.

TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type

Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

 2003 Microchip Technology Inc. Advance Information DS70083C-page 17

dsPIC30F

2.0 CPU ARCHITECTURE

OVERVIEW

2.1 Core Overview

The core has a 24-bit instruction word. The Program

Counter (PC) is 23-bits wide with the Least Significant

(LS) bit always clear (refer to Section 3.1), and the

Most Significant (MS) bit is ignored during normal pro-

gram execution, except for certain specialized instruc-

tions. Thus, the PC can address up to 4M instruction

words of user program space. An instruction pre-fetch

mechanism is used to help maintain throughput. Pro-

gram loop constructs, free from loop count manage-

ment overhead, are supported using the DO and

REPEAT instructions, both of which are interruptible at

any point.

The working register array consists of 16 x 16-bit regis-

ters, each of which can act as data, address or offset

registers. One working register (W15) operates as a

software stack pointer for interrupts and calls.

The data space is 64 Kbytes (32K words) and is split

into two blocks, referred to as X and Y data memory.

Each block has its own independent Address Genera-

tion Unit (AGU). Most instructions operate solely

through the X memory, AGU, which provides the

appearance of a single unified data space. The

Multiply-Accumulate (MAC) class of dual source DSP

instructions operate through both the X and Y AGUs,

splitting the data address space into two parts (see

Section 3.2). The X and Y data space boundary is

device specific and cannot be altered by the user. Each

data word consists of 2 bytes, and most instructions

can address data either as words or bytes.

There are two methods of accessing data stored in

program memory:

• The upper 32 Kbytes of data space memory can

be mapped into the lower half (user space) of pro-

gram space at any 16K program word boundary,

defined by the 8-bit Program Space Visibility Page

(PSVPAG) register. This lets any instruction

access program space as if it were data space,

with a limitation that the access requires an addi-

tional cycle. Moreover, only the lower 16 bits of

each instruction word can be accessed using this

method.

• Linear indirect access of 32K word pages within

program space is also possible using any working

Table read and write instructions can be used to

access all 24 bits of an instruction word.

Overhead-free circular buffers (modulo addressing) are

supported in both X and Y address spaces. This is pri-

marily intended to remove the loop overhead for DSP

algorithms.

The X AGU also supports bit-reversed addressing on

destination effective addresses to greatly simplify input

or output data reordering for radix-2 FFT algorithms.

Refer to Section 4.0 for details on modulo and

bit-reversed addressing.

The core supports Inherent (no operand), Relative,

Literal, Memory Direct, Register Direct, Register

Indirect, Register Offset and Literal Offset Addressing

modes. Instructions are associated with predefined

Addressing modes, depending upon their functional

requirements.

For most instructions, the core is capable of executing

a data (or program data) memory read, a working reg-

ister (data) read, a data memory write and a program

(instruction) memory read per instruction cycle. As a

result, 3-operand instructions are supported, allowing

C = A+B operations to be executed in a single cycle.

A DSP engine has been included to significantly

enhance the core arithmetic capability and throughput.

It features a high speed 17-bit by 17-bit multiplier, a

40-bit ALU, two 40-bit saturating accumulators and a

40-bit bidirectional barrel shifter. Data in the accumula-

tor or any working register can be shifted up to 15 bits

right, or 16 bits left in a single cycle. The DSP instruc-

tions operate seamlessly with all other instructions and

have been designed for optimal real-time performance.

The MAC class of instructions can concurrently fetch

two data operands from memory while multiplying two

W registers. To enable this concurrent fetching of data

operands, the data space has been split for these

instructions and linear for all others. This has been

achieved in a transparent and flexible manner, by ded-

icating certain working registers to each address space

for the MAC class of instructions.

The core does not support a multi-stage instruction

pipeline. However, a single stage instruction pre-fetch

mechanism is used, which accesses and partially

decodes instructions a cycle ahead of execution, in

order to maximize available execution time. Most

instructions execute in a single cycle with certain

exceptions, as outlined in Section 2.3.

The core features a vectored exception processing

structure for traps and interrupts, with 62 independent

vectors. The exceptions consist of up to 8 traps (of

which 4 are reserved) and 54 interrupts. Each interrupt

is prioritized based on a user assigned priority between

1 and 7 (1 being the lowest priority and 7 being the

highest), in conjunction with a predetermined ‘natural

order’. Traps have fixed priorities ranging from 8 to 15.

dsPIC30F

DS70083C-page 18 Advance Information  2003 Microchip Technology Inc.

2.2 Programmer’s Model

The programmer’s model is shown in Figure 2-1 and

consists of 16 x 16-bit working registers (W0 through

W15), 2 x 40-bit accumulators (AccA and AccB),

STATUS register (SR), Data Table Page register

(TBLPAG), Program Space Visibility Page register

(PSVPAG), DO and REPEAT registers (DOSTART,

DOEND, DCOUNT and RCOUNT) and Program

Counter (PC). The working registers can act as data,

address or offset registers. All registers are memory

mapped. W0 acts as the W register for file register

addressing.

Some of these registers have a shadow register asso-

ciated with each of them, as shown in Figure 2-1. The

shadow register is used as a temporary holding register

and can transfer its contents to or from its host register

upon the occurrence of an event. None of the shadow

registers are accessible directly. The following rules

apply for transfer of registers into and out of shadows.

•PUSH.S and POP.S

W0, W1, W2, W3, SR (DC, N, OV, Z and C bits

only) are transferred.

•DO instruction

DOSTART, DOEND, DCOUNT shadows are

pushed on loop start, and popped on loop end.

When a byte operation is performed on a working reg-

ister, only the Least Significant Byte of the target regis-

ter is affected. However, a benefit of memory mapped

working registers is that both the Least and Most Sig-

nificant Bytes can be manipulated through byte wide

data memory space accesses.

2.2.1 SOFTWARE STACK POINTER/

FRAME POINTER

The dsPIC® devices contain a software stack. W15 is

the dedicated software Stack Pointer (SP), and will be

automatically modified by exception processing and

subroutine calls and returns. However, W15 can be ref-

erenced by any instruction in the same manner as all

other W registers. This simplifies the reading, writing

and manipulation of the stack pointer (e.g., creating

stack frames).

W15 is initialized to 0x0800 during a Reset. The user

may reprogram the SP during initialization to any

location within data space.

W14 has been dedicated as a stack frame pointer as

defined by the LNK and ULNK instructions. However,

W14 can be referenced by any instruction in the same

manner as all other W registers.

2.2.2 STATUS REGISTER

The dsPIC core has a 16-bit STATUS register (SR), the

LS Byte of which is referred to as the SR Low byte

(SRL) and the MS Byte as the SR High byte (SRH).

See Figure 2-1 for SR layout.

SRL contains all the MCU ALU operation status flags

(including the Z bit), as well as the CPU Interrupt Prior-

ity Level status bits, IPL<2:0> and the Repeat Active

status bit, RA. During exception processing, SRL is

concatenated with the MS Byte of the PC to form a

complete word value which is then stacked.

The upper byte of the STATUS register contains the

DSP Adder/Subtracter status bits, the DO Loop Active

bit (DA) and the Digit Carry (DC) status bit.

Most SR bits are read/write. Exceptions are:

1. The DA bit: DA is read and clear only because

accidentally setting it could cause erroneous

operation.

2. The RA bit: RA is a read only bit because acci-

dentally setting it could cause erroneous opera-

tion. RA is only set on entry into a REPEAT loop,

and cannot be directly cleared by software.

3. The OV, OA, OB and OAB bits: These bits are

read only and can only be set by the DSP engine

overflow logic.

4. The SA, SB and SAB bits: These are read and

clear only and can only be set by the DSP

engine saturation logic. Once set, these flags

remain set until cleared by the user, irrespective

of the results from any subsequent DSP

operations.

2.2.2.1 Z Status Bit

Instructions that use a carry/borrow input (ADDC,

CPB, SUBB and SUBBR) will only be able to clear Z (for

a non-zero result) and can never set it. A multi-

precision sequence of instructions, starting with an

instruction with no carry/borrow input, will thus auto-

matically logically AND the successive results of the

zero test. All results must be zero for the Z flag to

remain set by the end of the sequence.

All other instructions can set as well as clear the Z bit.

2.2.3 PROGRAM COUNTER

The program counter is 23-bits wide; bit 0 is always

clear. Therefore, the PC can address up to 4M

instruction words.

Note: In order to protect against misaligned

stack accesses, W15<0> is always clear.

Note 1: Clearing the SAB bit will also clear both

the SA and SB bits.

2: When the memory mapped STATUS reg-

ister (SR) is the destination address for

an operation which affects any of the SR

bits, data writes are disabled to all bits.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 19

dsPIC30F

FIGURE 2-1: PROGRAMMER’S MODEL

TABPAG

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

Status Register

Working Registers

DSP Operand

Registers

W10

W11

W12/DSP Offset

W13/DSP Write Back

W14/Frame Pointer

W15/Stack Pointer

DSP Address

Registers

AD39 AD0AD31

DSP

Accumulators

AccA

AccB

PSVPAG

7 0

Program Space Visibility Page Address

OA OB SA SB

RCOUNT

15 0

REPEAT Loop Counter

DCOUNT

15 0

DO Loop Counter

DOSTART

22 0

DO Loop Start Address

IPL2 IPL1

SPLIM Stack Pointer Limit Register

AD15

SRL

PUSH.S Shadow

DO Shadow

OAB SAB

15 0

Core Configuration Register

Legend

CORCON

DA DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

DO Loop End Address

DOEND

dsPIC30F

DS70083C-page 20 Advance Information  2003 Microchip Technology Inc.

2.3 Instruction Flow

There are 8 types of instruction flows:

1. Normal one-word, one-cycle instructions: these

instructions take one effective cycle to execute

as shown in Figure 2-2.

FIGURE 2-2: INSTRUCTION PIPELINE FLOW: 1-WORD, 1-CYCLE

2. One-word, two-cycle (or three-cycle) instruc-

tions that are flow control instructions: these

instructions include the relative branches, rela-

tive call, skips and returns. When an instruction

changes the PC (other than to increment it), the

pipelined fetch is discarded. This causes the

instruction to take two effective cycles to exe-

cute as shown in Figure 2-3. Some instructions

that change program flow require 3 cycles, such

as the RETURN, RETFIE and RETLW instruc-

tions, and instructions that skip over 2-word

instructions.

FIGURE 2-3: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV.b #0x55,W0 Fetch 1 Execute 1

2. MOV.b #0x35,W1 Fetch 2 Execute 2

3. ADD.b W0,W1,W2 Fetch 3 Execute 3

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV #0x55,W0 Fetch 1 Execute 1

2. BTSC W1,#3 Fetch 2 Execute 2

Skip Taken

3. ADD W0,W1,W2 Fetch 3 Flush

4. BRA SUB_1 Fetch 4 Execute 4

5. SUB W0,W1,W3 Fetch 5 Flush

6. Instruction @ address SUB_1 Fetch SUB_1

 2003 Microchip Technology Inc. Advance Information DS70083C-page 21

dsPIC30F

3. One-word, two-cycle instructions that are not

flow control instructions: the only instructions of

this type are the MOV.D (load and store double-

word) instructions, as shown in Figure 2-4.

FIGURE 2-4: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE MOV.D OPERATIONS

4. Table read/write instructions: these instructions

will suspend the fetching to insert a read or write

cycle to the program memory. The instruction

fetched while executing the table operation is

saved for 1 cycle and executed in the cycle

immediately after the table operation as shown

in Figure 2-5.

FIGURE 2-5: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE TABLE OPERATIONS

5. Two-word instructions for CALL and GOTO: in

these instructions, the fetch after the instruction

provides the remainder of the jump or call desti-

nation address. These instructions require 2

cycles to execute, 1 cycle to fetch the 2 instruc-

tion words (enabled by a high speed path on the

second fetch), and 1 cycle to flush the pipeline

as shown in Figure 2-6.

FIGURE 2-6: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE GOTO, CALL

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV W0,0x1234 Fetch 1 Execute 1

2. MOV.D [W0++],W1 Fetch 2 Execute 2

R/W Cycle 1

3. MOV W1,0x00AA Fetch 3 Execute 2

R/W Cycle2

3a. Stall Stall Execute 3

4. MOV 0x0CC, W0 Fetch 4 Execute 4

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV #0x1234,W0 Fetch 1 Execute 1

2. TBLRDL [W0++],W1 Fetch 2 Execute 2

3. MOV #0x00AA,W1 Fetch 3 Execute 2

Read Cycle

3a. Table Operation Bus Read Execute 3

4. MOV #0x0CC,W0 Fetch 4 Execute 4

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV #0x1234,W0 Fetch 1 Execute 1

2. GOTO LABEL Fetch 2L Update PC

2a. Second Word Fetch 2H NOP

3. Instruction @ address LABEL Fetch

LABEL

Execute

LABEL

4. BSET W1, #BIT3 Fetch 4 Execute 4

dsPIC30F

DS70083C-page 22 Advance Information  2003 Microchip Technology Inc.

6. Two-word instructions for DO: in these instruc-

tions, the fetch after the instruction contains an

address offset. This address offset is added to

the first instruction address to generate the last

loop instruction address. Therefore, these

instructions require 2 cycles as shown in

Figure 2-7.

FIGURE 2-7: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE DO, DOW

7. Instructions that are subjected to a stall due to a

data dependency between the X RAGU and

X WAGU: an additional cycle is inserted to

resolve the resource conflict as shown in

Figure 2-7. Instruction stalls caused by data

dependencies are further discussed in

Section 4.0.

FIGURE 2-8: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE WITH INSTRUCTION STALL

8. Interrupt recognition execution: refer to

Section 6.0 for details on interrupts.

TCY0TCY1TCY2TCY3TCY4

1. PUSH DOEND Fetch 1 Execute 1

2. DO LABEL,#COUNT Fetch 2L NOP

2a. Second Word Fetch 2H Execute 2

3. 1st Instruction of Loop Fetch 3 Execute 3

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOV.b W0,[W1] Fetch 1 Execute 1

2. MOV.b [W1],PORTB Fetch 2 NOP

2a. Stall (NOP) Stall Execute 2

3. MOV.b W0,PORTB Fetch 3 Execute 3

 2003 Microchip Technology Inc. Advance Information DS70083C-page 23

dsPIC30F

2.4 Divide Support

The dsPIC devices feature a 16/16-bit signed fractional

divide operation, as well as 32/16-bit and 16/16-bit

signed and unsigned integer divide operations, in the

form of single instruction iterative divides. The following

instructions and data sizes are supported:

1. DIVF - 16/16 signed fractional divide

2. DIV.sd - 32/16 signed divide

3. DIV.ud - 32/16 unsigned divide

4. DIV.sw - 16/16 signed divide

5. DIV.uw - 16/16 unsigned divide

The 16/16 divides are similar to the 32/16 (same number

of iterations), but the dividend is either zero-extended or

sign-extended during the first iteration.

The quotient for all divide instructions is stored in W0,

and the remainder in W1. DIV and DIVF can specify

any W register for both the 16-bit dividend and divisor.

All other divides can specify any W register for the

16-bit divisor, but the 32-bit dividend must be in an

aligned W register pair, such as W1:W0, W3:W2, etc.

The non-restoring divide algorithm requires one cycle

for an initial dividend shift (for integer divides only), one

cycle per divisor bit, and a remainder/quotient correc-

tion cycle. The correction cycle is the last cycle of the

iteration loop but must be performed (even if the

remainder is not required) because it may also adjust

the quotient. A consequence of this is that DIVF will

also produce a valid remainder (though it is of little use

in fractional arithmetic).

The divide instructions must be executed within a

REPEAT loop. Any other form of execution (e.g., a

series of discrete divide instructions) will not function

correctly because the instruction flow depends on

RCOUNT. The divide instruction does not automatically

set up the RCOUNT value and it must, therefore, be

explicitly and correctly specified in the REPEAT instruc-

tion as shown in Table 2-1 (REPEAT will execute the tar-

get instruction {operand value+1} times). The REPEAT

loop count must be setup for 18 iterations of the DIV/

DIVF instruction. Thus, a complete divide operation

requires 19 cycles.

TABLE 2-1: DIVIDE INSTRUCTIONS

Note: The divide flow is interruptible. However,

the user needs to save the context as

appropriate.

Instruction Function

DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1

DIV.sd Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1

DIV.sw or

DIV.s

Signed divide: Wm/Wn → W0; Rem → W1

DIV.ud Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1

DIV.uw or

DIV.u

Unsigned divide: Wm/Wn → W0; Rem → W1

dsPIC30F

DS70083C-page 24 Advance Information  2003 Microchip Technology Inc.

2.5 DSP Engine

Concurrent operation of the DSP engine with MCU

instruction flow is not possible, though both the MCU

ALU and DSP engine resources may be used concur-

rently by the same instruction (e.g., ED and EDAC

instructions).

The DSP engine consists of a high speed 17-bit x

17-bit multiplier, a barrel shifter and a 40-bit adder/

subtracter (with two target accumulators, round and

saturation logic).

Data input to the DSP engine is derived from one of the

following:

1. Directly from the W array (registers W4, W5, W6

or W7) via the X and Y data buses for the MAC

class of instructions (MAC, MSC, MPY,

MPY.N, ED, EDAC, CLR and MOVSAC).

2. From the X bus for all other DSP instructions.

3. From the X bus for all MCU instructions which

use the barrel shifter.

Data output from the DSP engine is written to one of the

following:

1. The target accumulator, as defined by the DSP

instruction being executed.

2. The X bus for MAC, MSC, CLR and MOVSAC

accumulator writes, where the EA is derived

from W13 only. (MPY, MPY.N, ED and EDAC

do not offer an accumulator write option.)

3. The X bus for all MCU instructions which use the

barrel shifter.

The DSP engine also has the capability to perform

inherent accumulator-to-accumulator operations,

which require no additional data. These instructions are

ADD, SUB and NEG.

The DSP engine has various options selected through

various bits in the CPU Core Configuration register

(CORCON), as listed below:

1. Fractional or integer DSP multiply (IF).

2. Signed or unsigned DSP multiply (US).

3. Conventional or convergent rounding (RND).

4. Automatic saturation on/off for AccA (SATA).

5. Automatic saturation on/off for AccB (SATB).

6. Automatic saturation on/off for writes to data

memory (SATDW).

7. Accumulator Saturation mode selection

(ACCSAT).

A block diagram of the DSP engine is shown in

Figure 2-9.

Note: For CORCON layout, see Table 4-3.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 25

dsPIC30F

FIGURE 2-9: DSP ENGINE BLOCK DIAGRAM

Zero Backfill

Sign-Extend

Barrel

Shifter

40-bit Accumulator A

40-bit Accumulator B Round

Logic

X Data Bus

To/From W Array

Adder

Saturate

Negate

16 16

40 40

Y Data Bus

Carry/Borrow Out

Carry/Borrow In

Multiplier/Scaler

17-bit

dsPIC30F

DS70083C-page 26 Advance Information  2003 Microchip Technology Inc.

2.5.1 MULTIPLIER

The 17 x 17-bit multiplier is capable of signed or

unsigned operation and can multiplex its output using a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. The respective number representation

formats are shown in cáÖìêÉ OJNM. Unsigned operands

are zero-extended into the 17th bit of the multiplier

input value. Signed operands are sign-extended into

the 17th bit of the multiplier input value. The output of

the 17 x 17-bit multiplier/scaler is a 33-bit value which

is sign-extended to 40 bits. Integer data is inherently

represented as a signed two’s complement value,

where the MSB is defined as a sign bit. Generally

speaking, the range of an N-bit two’s complement inte-

ger is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data

range is -32768 (0x8000) to 32767 (0x7FFF) including

‘0’ (see Figure 2-10). For a 32-bit integer, the data

range is -2,147,483,648 (0x8000 0000) to

2,147,483,645 (0x7FFF FFFF).

When the multiplier is configured for fractional multipli-

cation, the data is represented as a two’s complement

fraction, where the MSB is defined as a sign bit and the

radix point is implied to lie just after the sign bit (QX for-

mat). The range of an N-bit two’s complement fraction

with this implied radix point is -1.0 to (1 – 21-N). For a

16-bit fraction, the Q15 data range is -1.0 (0x8000) to

0.999969482 (0x7FFF) including ‘0’ and has a preci-

sion of 3.01518x10-5. In Fractional mode, the 16x16

multiply operation generates a 1.31 product which has

a precision of 4.65661 x 10-10.

FIGURE 2-10: 16-BIT INTEGER AND FRACTIONAL MODES

Certain multiply operations always operate on signed

data. These include the MAC/MSC, MPY[.N] and

ED[AC] instructions. The 40-bit adder/subtracter may

also optionally negate one of its operand inputs to

change the result sign (without changing the oper-

ands). This is used to create a multiply and subtract

(MSC), or multiply and negate (MPY.N) operation.

In the special case when both input operands are 1.15

fractions and equal to 0x8000 (-110), the result of the

multiplication is corrected to 0x7FFFFFFF (as the

closest approximation to +1) by hardware before it is

used.

It should be noted that with the exception of DSP mul-

tiplies, the dsPIC30F ALU operates identically on inte-

ger and fractional data. Namely, an addition of two

integers will yield the same result (binary number) as

the addition of two fractional numbers. The only differ-

ence is how the result is interpreted by the user. How-

ever, multiplies performed by DSP operations are

different. In these instructions, data format selection is

made with the IF bit (CORCON<0>) and US bits

(CORCON<12>), and it must be set accordingly (‘0’ for

Fractional mode, ‘1’ for Integer mode in the case of the

IF bit, and ‘0’ for Signed mode, ‘1’ for Unsigned mode

in the case of the US bit). This is required because of

the implied radix point used by dsPIC30F fractions. In

Integer mode, multiplying two 16-bit integers produces

a 32-bit integer result. However, multiplying two 1.15

values generates a 2.30 result. Since the dsPIC30F

uses 1.31 format for the accumulators, a DSP multiply

in Fractional mode also includes a left shift by one bit to

keep the radix point properly aligned. This feature

reduces the resolution of the DSP multiplier to 2-30, but

has no other effect on the computation.

Different Representations of 0x4001

Integer:

214 213 212 211 .... 20

0x4001 = 214 + 20 = 16385

1.15 Fractional:

2-15

0x4001 = 2-1 + 2-15 = 0.500030518

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1

. 2-1 2-2 2-3 . . .

-20

0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1

 2003 Microchip Technology Inc. Advance Information DS70083C-page 27

dsPIC30F

The same multiplier is used to support the MCU multi-

ply instructions which include integer 16-bit signed,

unsigned and mixed sign multiplies. Additional data

paths are provided to allow these instructions to write

the result back into the W array and X data bus (via the

W array). These paths are placed prior to the data

scaler. The IF bit in the CORCON register, therefore,

only affects the result of the MAC class of DSP instruc-

tions. All other multiply operations are assumed to be

integer operations. If the user executes a MAC instruc-

tion on fractional data without clearing the IF bit, the

result must be explicitly shifted left by the user program

after multiplication in order to obtain the correct result.

The MUL instruction may be directed to use byte or

word sized operands. Byte operands will direct a 16-bit

result, and word operands will direct a 32-bit result to

the specified register(s) in the W array.

2.5.2 DATA ACCUMULATORS AND

ADDER/SUBTRACTER

The data accumulator consists of a 40-bit adder/

subtracter with automatic sign extension logic. It can

select one of two accumulators (A or B) as its pre-

accumulation source and post-accumulation destina-

tion. For the ADD and LAC instructions, the data to be

accumulated or loaded can be optionally scaled via the

barrel shifter, prior to accumulation.

2.5.2.1 Adder/Subtracter, Overflow and

Saturation

The adder/subtracter is a 40-bit adder with an optional

zero input into one side and either true, or complement

data into the other input. In the case of addition, the

carry/borrow input is active high and the other input is

true data (not complemented), whereas in the case of

subtraction, the carry/borrow input is active low and the

other input is complemented. The adder/subtracter

generates overflow status bits SA/SB and OA/OB,

which are latched and reflected in the STATUS register:

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits bits are not identical to each other.

The adder has an additional saturation block which

controls accumulator data saturation, if selected. It

uses the result of the adder, the overflow status bits

described above, and the SATA/B (CORCON<7:6>)

and ACCSAT (CORCON<4>) mode control bits to

determine when and to what value to saturate.

Six STATUS register bits have been provided to

support saturation and overflow; they are:

1. OA:

AccA overflowed into guard bits

2. OB:

AccB overflowed into guard bits

3. SA:

AccA saturated (bit 31 overflow and saturation)

AccA overflowed into guard bits and saturated

(bit 39 overflow and saturation)

4. SB:

AccB saturated (bit 31 overflow and saturation)

AccB overflowed into guard bits and saturated

(bit 39 overflow and saturation)

5. OAB:

Logical OR of OA and OB

6. SAB:

Logical OR of SA and SB

The OA and OB bits are modified each time data

passes through the adder/subtracter. When set, they

indicate that the most recent operation has overflowed

into the accumulator guard bits (bits 32 through 39).

The OA and OB bits can also optionally generate an

arithmetic warning trap when set and the correspond-

ing overflow trap flag enable bit (OVATEN, OVBTEN) in

the INTCON1 register (refer to Section 5.0) is set. This

allows the user to take immediate action, for example,

to correct system gain.

The SA and SB bits are modified each time data

passes through the adder/subtracter but can only be

cleared by the user. When set, they indicate that the

accumulator has overflowed its maximum range (bit 31

for 32-bit saturation, or bit 39 for 40-bit saturation) and

will be saturated (if saturation is enabled). When satu-

ration is not enabled, SA and SB default to bit 39 over-

flow and thus indicate that a catastrophic overflow has

occurred. If the COVTE bit in the INTCON1 register is

set, SA and SB bits will generate an arithmetic warning

trap when saturation is disabled.

The overflow and saturation status bits can optionally

be viewed in the STATUS register (SR) as the logical

OR of OA and OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). This allows programmers to check

one bit in the STATUS register to determine if either

accumulator has overflowed, or one bit to determine if

either accumulator has saturated. This would be useful

for complex number arithmetic which typically uses

both the accumulators.

dsPIC30F

DS70083C-page 28 Advance Information  2003 Microchip Technology Inc.

The device supports three saturation and overflow

modes:

1. Bit 39 Overflow and Saturation:

When bit 39 overflow and saturation occurs, the

saturation logic loads the maximally positive 9.31

(0x7FFFFFFFFF), or maximally negative 9.31

value (0x8000000000) into the target accumula-

tor. The SA or SB bit is set and remains set until

cleared by the user. This is referred to as ‘super

saturation’ and provides protection against erro-

neous data, or unexpected algorithm problems

(e.g., gain calculations).

2. Bit 31 Overflow and Saturation:

When bit 31 overflow and saturation occurs, the

saturation logic then loads the maximally posi-

tive 1.31 value (0x007FFFFFFF), or maximally

negative 1.31 value (0x0080000000) into the

target accumulator. The SA or SB bit is set and

remains set until cleared by the user. When this

Saturation mode is in effect, the guard bits are

not used (so the OA, OB or OAB bits are never

set).

3. Bit 39 Catastrophic Overflow:

The bit 39 overflow status bit from the adder is

used to set the SA or SB bit which remain set

until cleared by the user. No saturation operation

is performed and the accumulator is allowed to

overflow (destroying its sign). If the COVTE bit in

the INTCON1 register is set, a catastrophic

overflow can initiate a trap exception.

2.5.2.2 Accumulator ‘Write Back’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the accumulator that is not targeted by the instruction

into data space memory. The write is performed across

the X bus into combined X and Y address space. The

following Addressing modes are supported:

1. W13, Register Direct:

The rounded contents of the non-target

accumulator are written into W13 as a 1.15

fraction.

2. [W13]+=2, Register Indirect with Post-Increment:

The rounded contents of the non-target accumu-

lator are written into the address pointed to by

W13 as a 1.15 fraction. W13 is then

incremented by 2 (for a word write).

2.5.2.3 Round Logic

The round logic is a combinational block which per-

forms a conventional (biased) or convergent (unbi-

ased) round function during an accumulator write

(store). The Round mode is determined by the state of

the RND bit in the CORCON register. It generates a 16-

bit, 1.15 data value which is passed to the data space

write saturation logic. If rounding is not indicated by the

instruction, a truncated 1.15 data value is stored and

the LS Word is simply discarded.

The two Rounding modes are shown in Figure 2-10.

Conventional rounding takes bit 15 of the accumulator,

zero-extends it and adds it to the ACCxH word (bits 16

through 31 of the accumulator). If the ACCxL word

(bits 0 through 15 of the accumulator) is between

0x8000 and 0xFFFF (0x8000 included), ACCxH is

incremented. If ACCxL is between 0x0000 and

0x7FFF, ACCxH is left unchanged. A consequence of

this algorithm is that over a succession of random

rounding operations, the value will tend to be biased

slightly positive.

Convergent (or unbiased) rounding operates in the

same manner as conventional rounding, except when

ACCxL equals 0x8000. If this is the case, the LS bit

(bit 16 of the accumulator) of ACCxH is examined. If it

is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not

modified. Assuming that bit 16 is effectively random in

nature, this scheme will remove any rounding bias that

may accumulate.

The SAC and SAC.R instructions store either a trun-

cated (SAC) or rounded (SAC.R) version of the contents

of the target accumulator to data memory via the X bus

(subject to data saturation, see Section 2.5.2.4). Note

that for the MAC class of instructions, the accumulator

write back operation will function in the same manner,

addressing combined MCU (X and Y) data space

though the X bus. For this class of instructions, the data

is always subject to rounding.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 29

dsPIC30F

2.5.2.4 Data Space Write Saturation

In addition to adder/subtracter saturation, writes to data

space may also be saturated but without affecting the

contents of the source accumulator. The data space

write saturation logic block accepts a 16-bit, 1.15 frac-

tional value from the round logic block as its input,

together with overflow status from the original source

(accumulator) and the 16-bit round adder. These are

combined and used to select the appropriate 1.15

fractional value as output to write to data space

memory.

If the SATDW bit in the CORCON register is set, data

(after rounding or truncation) is tested for overflow and

adjusted accordingly, For input data greater than

0x007FFF, data written to memory is forced to the

maximum positive 1.15 value, 0x7FFF. For input data

less than 0xFF8000, data written to memory is forced

to the maximum negative 1.15 value, 0x8000. The MS

bit of the source (bit 39) is used to determine the sign

of the operand being tested.

If the SATDW bit in the CORCON register is not set, the

input data is always passed through unmodified under

all conditions.

2.5.3 BARREL SHIFTER

The barrel shifter is capable of performing up to 15-bit

arithmetic or logic right shifts, or up to 16-bit left shifts

in a single cycle. The source can be either of the two

DSP accumulators, or the X bus (to support multi-bit

shifts of register or memory data).

The shifter requires a signed binary value to determine

both the magnitude (number of bits) and direction of the

shift operation. A positive value will shift the operand

right. A negative value will shift the operand left. A

value of ‘0’ will not modify the operand.

The barrel shifter is 40-bits wide, thereby obtaining a

40-bit result for DSP shift operations and a 16-bit result

for MCU shift operations. Data from the X bus is pre-

sented to the barrel shifter between bit positions 16 to

31 for right shifts, and bit positions 0 to 15 for left shifts.

dsPIC30F

DS70083C-page 30 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 31

dsPIC30F

3.0 MEMORY ORGANIZATION

3.1 Program Address Space

The program address space is 4M instruction words. It

is addressable by a 24-bit value from either the 23-bit

PC, table instruction EA, or data space EA, when pro-

gram space is mapped into data space as defined by

Table 3-1. Note that the program space address is

incremented by two between successive program

words in order to provide compatibility with data space

addressing.

User program space access is restricted to the lower

4M instruction word address range (0x000000 to

0x7FFFFE) for all accesses other than TBLRD/TBLWT,

which use TBLPAG<7> to determine user or configura-

tion space access. In Table 3-1, Program Space

Address Construction, bit 23 allows access to the

Device ID, the User ID and the configuration bits.

Otherwise, bit 23 is always clear.

TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION

FIGURE 3-1: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

Note: The address map shown in Figure 3-5 is

conceptual, and the actual memory con-

figuration may vary across individual

devices depending on available memory.

Access Type Access

Space

Program Space Address

<23> <22:16> <15> <14:1> <0>

Instruction Access User 0PC<22:1> 0

TBLRD/TBLWT User

(TBLPAG<7> = 0)

TBLPAG<7:0> Data EA<15:0>

TBLRD/TBLWT Configuration

(TBLPAG<7> = 1)

TBLPAG<7:0> Data EA<15:0>

Program Space Visibility User 0PSVPAG<7:0> Data EA<14:0>

0Program Counter

23 bits

PSVPAG Reg

8 bits

15 bits

Program

Using

Select

TBLPAG Reg

8 bits

16 bits

Using

Byte

24-bit EA

1/0

Select

User/

Configuration

Table

Instruction

Program

Space

Counter

Using

Space

Select

Visibility

Note: Program space visibility cannot be used to access bits <23:16> of a word in program memory.

dsPIC30F

DS70083C-page 32 Advance Information  2003 Microchip Technology Inc.

3.1.1 PROGRAM SPACE ALIGNMENT

AND DATA ACCESS USING TABLE

INSTRUCTIONS

This architecture fetches 24-bit wide program memory.

Consequently, instructions are always aligned.

However, as the architecture is modified Harvard, data

can also be present in program space.

There are two methods by which program space can

be accessed: via special table instructions, or through

the remapping of a 16K word program space page into

the upper half of data space (see Section 3.1.2). The

TBLRDL and TBLWTL instructions offer a direct method

of reading or writing the LS Word of any address within

program space, without going through data space. The

TBLRDH and TBLWTH instructions are the only method

whereby the upper 8 bits of a program space word can

be accessed as data.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two 16-bit

word wide address spaces, residing side by side, each

with the same address range. TBLRDL and TBLWTL

access the space which contains the LS Data Word,

and TBLRDH and TBLWTH access the space which

contains the MS Data Byte.

Figure 3-1 shows how the EA is created for table oper-

ations and data space accesses (PSV = 1). Here,

P<23:0> refers to a program space word, whereas

D<15:0> refers to a data space word.

A set of table instructions are provided to move byte or

word sized data to and from program space.

1. TBLRDL: Table Read Low

Word: Read the LS Word of the program address;

P<15:0> maps to D<15:0>.

Byte: Read one of the LS Bytes of the program

address;

P<7:0> maps to the destination byte when byte

select = 0;

P<15:8> maps to the destination byte when byte

select = 1.

2. TBLWTL: Table Write Low (refer to Section 6.0

for details on Flash Programming)

3. TBLRDH: Table Read High

Word: Read the MS Word of the program address;

P<23:16> maps to D<7:0>; D<15:8> will always

be = 0.

Byte: Read one of the MS Bytes of the program

address;

P<23:16> maps to the destination byte when

byte select = 0;

The destination byte will always be = 0 when

byte select = 1.

4. TBLWTH: Table Write High (refer to Section 6.0

for details on Flash Programming)

FIGURE 3-2: PROGRAM DATA TABLE ACCESS (LS WORD)

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDL.W

TBLRDL.B (Wn<0> = 1)

TBLRDL.B (Wn<0> = 0)

 2003 Microchip Technology Inc. Advance Information DS70083C-page 33

dsPIC30F

FIGURE 3-3: PROGRAM DATA TABLE ACCESS (MS BYTE)

3.1.2 PROGRAM SPACE VISIBILITY

FROM DATA SPACE

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word program space page. This

provides transparent access of stored constant data

from X data space without the need to use special

instructions (i.e., TBLRDL/H, TBLWTL/H instructions).

Program space access through the data space occurs

if the MS bit of the data space EA is set and program

space visibility is enabled by setting the PSV bit in the

Core Control register (CORCON). The functions of

CORCON are discussed in Section 2.5, DSP Engine.

Data accesses to this area add an additional cycle to

the instruction being executed, since two program

memory fetches are required.

Note that the upper half of addressable data space is

always part of the X data space. Therefore, when a

DSP operation uses program space mapping to access

this memory region, Y data space should typically con-

tain state (variable) data for DSP operations, whereas

X data space should typically contain coefficient

(constant) data.

Although each data space address, 0x8000 and

higher, maps directly into a corresponding program

memory address (see Figure 3-4), only the lower

16 bits of the 24-bit program word are used to contain

the data. The upper 8 bits should be programmed to

force an illegal instruction to maintain machine robust-

ness. Refer to the Programmer’s Reference Manual

(DS70030) for details on instruction encoding.

Note that by incrementing the PC by 2 for each

program memory word, the LS 15 bits of data space

addresses directly map to the LS 15 bits in the corre-

sponding program space addresses. The remaining

bits are provided by the Program Space Visibility Page

For instructions that use PSV which are executed

outside a REPEAT loop:

• The following instructions will require one

instruction cycle in addition to the specified

execution time:

-MAC class of instructions with data operand

pre-fetch

-MOV instructions

-MOV.D instructions

• All other instructions will require two instruction

cycles in addition to the specified execution time

of the instruction.

For instructions that use PSV which are executed

inside a REPEAT loop:

• The following instances will require two instruction

cycles in addition to the specified execution time

of the instruction:

- Execution in the first iteration

- Execution in the last iteration

- Execution prior to exiting the loop due to an

interrupt

- Execution upon re-entering the loop after an

interrupt is serviced

• Any other iteration of the REPEAT loop will allow

the instruction accessing data, using PSV, to

execute in a single cycle.

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDH.W

TBLRDH.B (Wn<0> = 1)

TBLRDH.B (Wn<0> = 0)

Note: PSV access is temporarily disabled during

table reads/writes.

dsPIC30F

DS70083C-page 34 Advance Information  2003 Microchip Technology Inc.

FIGURE 3-4: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION

23 15 0

PSVPAG(1)

EA<15> =

EA<15> = 1

Data

Space

Data Space

Program Space

15 23

0x0000

0x8000

0xFFFF

0x21

0x108000

0x10FFFF

Data Read

Upper Half of Data

Space is Mapped

into Program Space

0x108200

Address

Concatenation

BSET CORCON,#2 ; PSV bit set

MOV #0x21, W0 ; Set PSVPAG register

MOV W0, PSVPAG

MOV 0x8200, W0 ; Access program memory location

; using a data space access

Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines

the page in program space to which the upper half of data space is being mapped).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 35

dsPIC30F

FIGURE 3-5: SAMPLE PROGRAM

SPACE MEMORY MAP

3.2 Data Address Space

The core has two data spaces. The data spaces can be

considered either separate (for some DSP instruc-

tions), or as one unified linear address range (for MCU

instructions). The data spaces are accessed using two

Address Generation Units (AGUs) and separate data

paths.

3.2.1 DATA SPACES

The X data space is used by all instructions and sup-

ports all Addressing modes. There are separate read

and write data buses. The X read data bus is the return

data path for all instructions that view data space as

combined X and Y address space. It is also the X

address space data path for the dual operand read

instructions (MAC class). The X write data bus is the

only write path to data space for all instructions.

The X data space also supports modulo addressing for

all instructions, subject to Addressing mode restric-

tions. Bit-reversed addressing is only supported for

writes to X data space.

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED,

EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to

provide two concurrent data read paths. No writes

occur across the Y bus. This class of instructions dedi-

cates two W register pointers, W10 and W11, to always

address Y data space, independent of X data space,

whereas W8 and W9 always address X data space.

Note that during accumulator write back, the data

address space is considered a combination of X and Y

data spaces, so the write occurs across the X bus.

Consequently, the write can be to any address in the

entire data space.

The Y data space can only be used for the data pre-

fetch operation associated with the MAC class of

instructions. It also supports modulo addressing for

automated circular buffers. Of course, all other instruc-

tions can access the Y data address space through the

X data path as part of the composite linear space.

The boundary between the X and Y data spaces is

defined as shown in Figure 3-8 and is not user pro-

grammable. Should an EA point to data outside its own

assigned address space, or to a location outside phys-

ical memory, an all zero word/byte will be returned. For

example, although Y address space is visible by all

non-MAC instructions using any Addressing mode, an

attempt by a MAC instruction to fetch data from that

space using W8 or W9 (X space pointers) will return

0x0000.

Reset - Target Address

User Memory

Space

000000

00007E

000002

000080

Device Configuration

User Flash

Program Memory

018000

017FFE

Configuration Memory

Space

Data EEPROM

(48K instructions)

(4 Kbytes)

800000

F80000

Registers F8000E

F80010

DEVID (2)

FEFFFE

FF0000

FFFFFE

Reserved

F7FFFE

Reserved

7FF000

7FEFFE

(Read ‘0’s)

8005FE

800600

UNITID (32 instr.)

Vector Tables

8005BE

8005C0

Reset - GOTO Instruction

000004

Reserved

7FFFFE

Reserved

000100

0000FE

000084

Alternate Vector Table

Reserved

Interrupt Vector Table

Note: These address boundaries may vary from one

device to another.

dsPIC30F

DS70083C-page 36 Advance Information  2003 Microchip Technology Inc.

TABLE 3-2: EFFECT OF INVALID

MEMORY ACCESSES

All effective addresses are 16 bits wide and point to

bytes within the data space. Therefore, the data space

address range is 64 Kbytes or 32K words.

3.2.2 DATA SPACE WIDTH

The core data width is 16 bits. All internal registers are

organized as 16-bit wide words. Data space memory is

organized in byte addressable, 16-bit wide blocks.

3.2.3 DATA ALIGNMENT

To help maintain backward compatibility with

PICmicro® devices and improve data space memory

usage efficiency, the dsPIC30F instruction set supports

both word and byte operations. Data is aligned in data

memory and registers as words, but all data space EAs

resolve to bytes. Data byte reads will read the complete

word which contains the byte, using the LS bit of any

EA to determine which byte to select. The selected byte

is placed onto the LS Byte of the X data path (no byte

accesses are possible from the Y data path as the MAC

class of instruction can only fetch words). That is, data

memory and registers are organized as two parallel

byte wide entities with shared (word) address decode

but separate write lines. Data byte writes only write to

the corresponding side of the array or register which

matches the byte address.

As a consequence of this byte accessibility, all effective

address calculations (including those generated by the

DSP operations which are restricted to word sized

data) are internally scaled to step through word aligned

memory. For example, the core would recognize that

Post-Modified Register Indirect Addressing mode

[Ws++] will result in a value of Ws+1 for byte operations

and Ws+2 for word operations.

All word accesses must be aligned to an even address.

Misaligned word data fetches are not supported so

care must be taken when mixing byte and word opera-

tions, or translating from 8-bit MCU code. Should a mis-

aligned read or write be attempted, an address error

trap will be generated. If the error occurred on a read,

the instruction underway is completed, whereas if it

occurred on a write, the instruction will be executed but

the write will not occur. In either case, a trap will then

be executed, allowing the system and/or user to exam-

ine the machine state prior to execution of the address

fault.

FIGURE 3-6: DATA ALIGNMENT

All byte loads into any W register are loaded into the LS

Byte. The MSB is not modified.

A sign-extend (SE) instruction is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the MSB of any W register by executing a

zero-extend (ZE) instruction on the appropriate

address.

Although most instructions are capable of operating on

word or byte data sizes, it should be noted that some

instructions, including the DSP instructions, operate

only on words.

3.2.4 DATA SPACE MEMORY MAP

The data space memory is split into two blocks, X and

Y data space. A key element of this architecture is that

Y space is a subset of X space, and is fully contained

within X space. In order to provide an apparent linear

addressing space, X and Y spaces have contiguous

addresses.

When executing any instruction other than one of the

MAC class of instructions, the X block consists of the 64-

Kbyte data address space (including all Y addresses).

When executing one of the MAC class of instructions,

the X block consists of the 64-Kbyte data address

space excluding the Y address block (for data reads

only). In other words, all other instructions regard the

entire data memory as one composite address space.

The MAC class instructions extract the Y address space

from data space and address it using EAs sourced from

W10 and W11. The remaining X data space is

addressed using W8 and W9. Both address spaces are

concurrently accessed only with the MAC class

instructions.

An example data space memory map is shown in

Figure 3-8.

Attempted Operation Data Returned

EA = an unimplemented address 0x0000

W8 or W9 used to access Y data

space in a MAC instruction

0x0000

W10 or W11 used to access X

data space in a MAC instruction

0x0000

15 8 7 0

0001

0003

0005

0000

0002

0004

Byte1 Byte 0

Byte3 Byte 2

Byte5 Byte 4

LS ByteMS Byte

 2003 Microchip Technology Inc. Advance Information DS70083C-page 37

dsPIC30F

3.2.5 NEAR DATA SPACE

An 8-Kbyte ‘near’ data space is reserved in X address

memory space between 0x0000 and 0x1FFF, which is

directly addressable via a 13-bit absolute address field

within all memory direct instructions. The remaining X

address space and all of the Y address space is

addressable indirectly. Additionally, the whole of X data

space is addressable using MOV instructions, which

support memory direct addressing with a 16-bit

address field.

The stack pointer always points to the first available

free word and grows from lower addresses towards

higher addresses. It pre-decrements for stack pops and

post-increments for stack pushes as shown in Figure 3-

7. Note that for a PC push during any CALL instruction,

the MSB of the PC is zero-extended before the push,

ensuring that the MSB is always clear.

3.2.6 SOFTWARE STACK

The dsPIC devices contain a software stack. W15 is

used as the stack pointer.

There is a Stack Pointer Limit register (SPLIM) associ-

ated with the stack pointer. SPLIM is uninitialized at

Reset. As is the case for the stack pointer, SPLIM<0>

is forced to ‘0’ because all stack operations must be

word aligned. Whenever an effective address (EA) is

generated using W15 as a source or destination

pointer, the address thus generated is compared with

the value in SPLIM. If the contents of the Stack Pointer

(W15) and the SPLIM register are equal and a push

operation is performed, a Stack Error Trap will not

occur. The Stack Error Trap will occur on a subsequent

push operation. Thus, for example, if it is desirable to

cause a Stack Error Trap when the stack grows beyond

address 0x2000 in RAM, initialize the SPLIM with the

value, 0x1FFE.

Similarly, a stack pointer underflow (stack error) trap is

generated when the stack pointer address is found to

be less than 0x0800, thus preventing the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM register should not be immediately

followed by an indirect read operation using W15.

FIGURE 3-7: CALL STACK FRAME

Note: A PC push during exception processing

will concatenate the SRL register to the

MSB of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

0x0000

PC<22:16>

POP : [--W15]

PUSH : [W15++]

dsPIC30F

DS70083C-page 38 Advance Information  2003 Microchip Technology Inc.

FIGURE 3-8: SAMPLE DATA SPACE MEMORY MAP

0x0000

0x07FE

SFR Space

0x17FE

0xFFFE

X Data RAM (X)

LS Byte

Address

16 bits

LSBMSB

MS Byte

Address

0x0001

0x07FF

0x17FF

0xFFFF

X Data

0x8001 0x8000

Optionally

Mapped

into Program

Memory

Unimplemented (X)

0x27FF 0x27FE

0x28000x2801

0x0801 0x0800

0x1801

0x1800

Near

Data

0x1FFE 0x1FFF

Y Data RAM (Y)

2-Kbyte

SFR Space

8-Kbyte

SRAM Space

8-Kbyte

Note: The address map shown in Figure 3-8 is conceptual, and may vary across individual devices

depending on available memory.

Space

 2003 Microchip Technology Inc. Advance Information DS70083C-page 39

dsPIC30F

FIGURE 3-9: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE

SFR SPACE

(Y SPACE)

X SPACE

SFR SPACE

UNUSED

X SPACE

Y SPACE

UNUSED

Non-MAC Class Ops (Read) MAC Class Ops (Read)

Indirect EA from any W Indirect EA from W8, W9 Indirect EA from W10, W11

dsPIC30F

DS70083C-page 40 Advance Information  2003 Microchip Technology Inc.

TABLE 3-3: CORE REGISTER MAP

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

W0 0000 W0 / WREG 0000 0000 0000 0000

W1 0002 W1 0000 0000 0000 0000

W2 0004 W2 0000 0000 0000 0000

W3 0006 W3 0000 0000 0000 0000

W4 0008 W4 0000 0000 0000 0000

W5 000A W5 0000 0000 0000 0000

W6 000C W6 0000 0000 0000 0000

W7 000E W7 0000 0000 0000 0000

W8 0010 W8 0000 0000 0000 0000

W9 0012 W9 0000 0000 0000 0000

W10 0014 W10 0000 0000 0000 0000

W11 0016 W11 0000 0000 0000 0000

W12 0018 W12 0000 0000 0000 0000

W13 001A W13 0000 0000 0000 0000

W14 001C W14 0000 0000 0000 0000

W15 001E W15 0000 1000 0000 0000

SPLIM 0020 SPLIM 0000 0000 0000 0000

ACCAL 0022 ACCAL 0000 0000 0000 0000

ACCAH 0024 ACCAH 0000 0000 0000 0000

ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000

ACCBL 0028 ACCBL 0000 0000 0000 0000

ACCBH 002A ACCBH 0000 0000 0000 0000

ACCBU 002C Sign-Extension (ACCB<39>) ACCBU 0000 0000 0000 0000

PCL 002E PCL 0000 0000 0000 0000

PCH 0030 — — — — — — — — —PCH0000 0000 0000 0000

TBLPAG 0032 — — — — — — — —TBLPAG0000 0000 0000 0000

PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000

RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu

DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu

DOSTARTL 003A DOSTARTL 0uuuu uuuu uuuu uuu0

DOSTARTH 003C — — — — — — — — — DOSTARTH 0000 0000 0uuu uuuu

DOENDL 003E DOENDL 0uuuu uuuu uuuu uuu0

DOENDH 0040 — — — — — — — — — DOENDH 0000 0000 0uuu uuuu

SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000

Legend: u = uninitialized bit

 2003 Microchip Technology Inc. Advance Information DS70083C-page 41

dsPIC30F

CORCON 0044 — — — US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000

MODCON 0046 XMODEN YMODEN —— BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000

XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0

XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1

YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0

YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1

XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu

DISICNT 0052 —— DISICNT<13:0> 0000 0000 0000 0000

TABLE 3-3: CORE REGISTER MAP (CONTINUED)

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 42 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 43

dsPIC30F

4.0 ADDRESS GENERATOR UNITS

The dsPIC core contains two independent address

generator units: the X AGU and Y AGU. Further, the X

AGU has two parts: X RAGU (Read AGU) and X

WAGU (Write AGU). The X RAGU and X WAGU sup-

port byte and word sized data space reads and writes

for both MCU and DSP instructions. The Y AGU sup-

ports word sized data reads for the DSP MAC class of

instructions only. They are each capable of supporting

two types of data addressing:

• Linear Addressing

• Modulo (Circular) Addressing

In addition, the X WAGU can support:

• Bit-Reversed Addressing

Linear and Modulo Data Addressing modes can be

applied to data space or program space. Bit-reversed

addressing is only applicable to data space addresses.

4.1 Data Space Organization

Although the data space memory is organized as 16-bit

words, all effective addresses (EAs) are byte

addresses. Instructions can thus access individual

bytes as well as properly aligned words. Word

addresses must be aligned at even boundaries. Mis-

aligned word accesses are not supported, and if

attempted, will initiate an address error trap.

When executing instructions which require just one

source operand to be fetched from data space, the X

RAGU and X WAGU are used to calculate the effective

address. The X RAGU and X WAGU can generate any

address in the 64-Kbyte data space. They support all

MCU Addressing modes and modulo addressing for

low overhead circular buffers. The X WAGU also sup-

ports bit-reversed addressing to facilitate FFT data

reorganization.

When executing instructions which require two source

operands to be concurrently fetched (i.e., the MAC class

of DSP instructions), both the X RAGU and Y AGU are

used simultaneously and the data space is split into two

independent address spaces, X and Y. The Y AGU sup-

ports register indirect post-modified and modulo

addressing only.

In the Split Data Space mode, some W register address

pointers are dedicated to X RAGU, and others to Y

AGU. The EAs of each operand must, therefore, be

restricted within different address spaces. If they are

not, one of the EAs will be outside the address space

of the corresponding data space (and will fetch the bus

default value, 0x0000).

4.2 Instruction Addressing Modes

The Addressing modes in Table 4-1 form the basis of

the Addressing modes optimized to support the specific

features of individual instructions. The Addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

Some Addressing mode combinations may lead to a

one-cycle stall during instruction execution, or are not

allowed, as discussed in Section 4.3.

TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED

Note: The data write phase of the MAC class of

instructions does not split X and Y address

space. The write EA is calculated using

the X WAGU and the data space is

configured for full 64-Kbyte access.

Addressing Mode Description

File Register Direct The address of the File register is specified explicitly.

decremented) by a constant value.

to form the EA.

dsPIC30F

DS70083C-page 44 Advance Information  2003 Microchip Technology Inc.

4.2.1 FILE REGISTER INSTRUCTIONS

Most File register instructions use a 13-bit address field

(f) to directly address data present in the first 8192

bytes of data memory. These memory locations are

known as File registers. Most File register instructions

employ a working register, W0, which is denoted as

WREG in these instructions. The destination is typically

either the same File register or WREG (with the excep-

tion of the MUL instruction), which writes the result to a

16-bit address field.

4.2.2 MCU INSTRUCTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where Operand 1 is always a working register (i.e., the

Addressing mode can only be register direct) which is

referred to as Wb. Operand 2 can be the W register

fetched from data memory or 5-bit literal. In two-

operand instructions, the result location is the same as

that of one of the operands. Certain MCU instructions

are one-operand operations. The following addressing

modes are supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-modified

• Register Indirect Pre-modified

• 5-bit or 10-bit Literal

4.2.3 MOVE AND ACCUMULATOR

INSTRUCTIONS

Move instructions and the DSP accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

Addressing modes supported by most MCU instruc-

tions, move and accumulator instructions also support

mode, also referred to as Register Indexed mode.

In summary, the following Addressing modes are

supported by move and accumulator instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-modified

• Register Indirect Pre-modified

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

4.2.4 MAC INSTRUCTIONS

The dual source operand DSP instructions (CLR, ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also

referred to as MAC instructions, utilize a simplified set of

Addressing modes to allow the user to effectively

manipulate the data pointers through register indirect

tables.

The 2 source operand pre-fetch registers must be a

member of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 will always be directed to the X

RAGU and W10 and W11 will always be directed to the

Y AGU. The effective addresses generated (before and

after modification) must, therefore, be valid addresses

within X data space for W8 and W9 and Y data space

for W10 and W11.

In summary, the following Addressing modes are

supported by the MAC class of instructions:

• Register Indirect

• Register Indirect Post-modified by 2

• Register Indirect Post-modified by 4

• Register Indirect Post-modified by 6

• Register Indirect with Register Offset (Indexed)

4.2.5 OTHER INSTRUCTIONS

Besides the various Addressing modes outlined above,

some instructions use literal constants of various sizes.

For example, BRA (branch) instructions use 16-bit

signed literals to specify the branch destination directly,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, such as ADD Acc, the

source of an operand or result is implied by the opcode

itself. Certain operations, such as NOP, do not have any

operands.

Note: Not all instructions support all the

Addressing modes given above. Individual

instructions may support different subsets

of these Addressing modes.

Note: For the MOV instructions, the Addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (register offset)

field is shared between both source and

destination (but typically only used by

one).

Note: Not all instructions support all the

Addressing modes given above. Individual

instructions may support different subsets

of these Addressing modes.

Note: Register indirect with register offset

addressing is only available for W9 (in X

space) and W11 (in Y space).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 45

dsPIC30F

4.3 Instruction Stalls

4.3.1 INTRODUCTION

In order to maximize data space, EA calculation and

operand fetch time, the X data space read and write

accesses are partially pipelined. The latter half of the

read phase overlaps the first half of the write phase of

an instruction, as shown in Section 2.0.

Address register data dependencies, also known as

‘Read After Write’ (RAW) dependencies may, there-

fore, arise between successive read and write opera-

tions using common registers. They occur across

instruction boundaries and are detected by the

hardware.

An example of a RAW dependency is a write operation

(in the current instruction) that modifies W5, followed

by a read operation (in the next instruction) that uses

W5 as a source address pointer. W5 will not be valid for

the read operation until the earlier write completes.

This problem is resolved by stalling the instruction exe-

cution for one instruction cycle, thereby allowing the

write to complete before the next read is started.

4.3.2 RAW DEPENDENCY DETECTION

During the instruction pre-decode, the core determines

if any address register dependency is imminent across

an instruction boundary. The stall detection logic com-

pares the W register (if any) used for the destination EA

of the instruction currently being executed, with the W

fetched instruction. As the W registers are also memory

mapped, the stall detection logic also derives an SFR

address from the W register being used by the destina-

tion EA, and determines whether this address is being

issued during the write phase of the instruction

currently being executed.

When it observes a match between the destination and

source registers, a set of rules is applied to decide

whether or not to stall the instruction by one cycle.

Table 4-2 lists out the various RAW conditions which

cause an instruction execution stall.

TABLE 4-2: RAW DEPENDENCY RULES (DETECTION BY HARDWARE)

Destination

Addressing Mode

Using Wn

Source Addressing

Mode Using Wn Status Examples

(Wn = W2)

Direct Direct No Stall ADD.w W0, W1, W2

MOV.w W2, W3

Direct Indirect Stall ADD.w W0, W1, W2

MOV.w [W2], W3

Direct Indirect with Pre- or

Post-Modification

Stall ADD.w W0, W1, W2

MOV.w [W2++], W3

Indirect Direct No Stall ADD.w W0, W1, [W2]

MOV.w W2, W3

Indirect Indirect No Stall ADD.w W0, W1, [W2]

MOV.w [W2], W3

Indirect Indirect Stall ADD.w W0, W1, [W2] ; W2=0x0004 (mapped W2)

MOV.w [W2], W3 ; (i.e. if W2 = addr. of

W2)

Indirect Indirect with Pre- or

Post-Modification

No Stall ADD.w W0, W1, [W2]

MOV.w [W2++], W3

Indirect Indirect with Pre- or

Post-Modification

Stall ADD.w W0, W1, [W2] ; W2=0x0004 (mapped W2)

MOV.w [W2++], W3 ; (i.e. if W2 = addr. of

W2)

Indirect with Pre- or

Post-Modification

Direct No Stall ADD.w W0, W1, [W2++]

MOV.w W2, W3

Indirect with Pre- or

Post-Modification

Indirect Stall ADD.w W0, W1, [W2++]

MOV.w [W2], W3

Indirect with Pre- or

Post-Modification

Indirect with Pre- or

Post-Modification

Stall ADD.w W0, W1, [W2++]

MOV.w [W2++], W3

dsPIC30F

DS70083C-page 46 Advance Information  2003 Microchip Technology Inc.

4.4 Modulo Addressing

Modulo addressing is a method of providing an auto-

mated means to support circular data buffers using

hardware. The objective is to remove the need for soft-

ware to perform data address boundary checks when

executing tightly looped code, as is typical in many

DSP algorithms.

Modulo addressing can operate in either data or pro-

gram space (since the data pointer mechanism is

essentially the same for both). One circular buffer can

be supported in each of the X (which also provides the

pointers into program space) and Y data spaces. Mod-

ulo addressing can operate on any W register pointer.

However, it is not advisable to use W14 or W15 for mod-

ulo addressing since these two registers are used as

the stack frame pointer and stack pointer, respectively.

In general, any particular circular buffer can only be

configured to operate in one direction, as there are cer-

tain restrictions on the buffer start address (for incre-

menting buffers), or end address (for decrementing

buffers) based upon the direction of the buffer.

The only exception to the usage restrictions is for buff-

ers which have a power-of-2 length. As these buffers

satisfy the start and end address criteria, they may

operate in a Bidirectional mode (i.e., address boundary

checks will be performed on both the lower and upper

address boundaries).

4.4.1 START AND END ADDRESS

The modulo addressing scheme requires that a starting

and an ending address be specified and loaded into the

16-bit Modulo Buffer Address registers: XMODSRT,

XMODEND, YMODSRT, YMODEND (see Table 3-3).

If the length of an incrementing buffer is greater than

M= 2

N-1, but not greater than M = 2N bytes, then the

last ‘N’ bits of the data buffer start address must be

zeros. There are no such restrictions on the end

address of an incrementing buffer. For example, if the

buffer size (modulus value) is chosen to be 100 bytes

(0x64), then the buffer start address for an increment-

ing buffer must contain 7 Least Significant zeros. Valid

start addresses may, therefore, be 0xXX00 and

0xXX80, where ‘X’ is any hexadecimal value. Adding

the buffer length to this value and subtracting ‘1’ will

give the end address to be written into X/YMODEND.

For example, if the start address was chosen to be

0x2000, then the X/YMODEND would be set to

(0x2000 + 0x0064 – 1) = 0x2063.

In the case of a decrementing buffer, the last ‘N’ bits of

the data buffer end address must be ones. There are

no such restrictions on the start address of a decre-

menting buffer. For example, if the buffer size (modulus

value) is chosen to be 100 bytes (0x64), then the buffer

end address for a decrementing buffer must contain

7 Least Significant ones. Valid end addresses may,

therefore, be 0xXXFF and 0xXX7F, where ‘X’ is any

hexadecimal value. Subtracting the buffer length from

this value and adding 1 will give the start address to be

written into X/YMODSRT. For example, if the end

address was chosen to be 0x207F, then the start

address would be (0x207F – 0x0064 + 1) = 0x201C,

which is the first physical address of the buffer.

The length of a circular buffer is not directly specified. It

is determined by the difference between the corre-

sponding start and end addresses. The maximum pos-

sible length of the circular buffer is 32K words

(64 Kbytes).

A write operation to the MODCON register should not

be immediately followed by an indirect read operation

using any W register.

Note: The start and end addresses are the first

and last byte addresses of the buffer (irre-

spective of whether it is a word or byte

buffer, or an increasing or decreasing

buffer). Moreover, the start address must

be even and the end address must be odd

(for both word and byte buffers).

Note: ‘Start address’ refers to the smallest

address boundary of the circular buffer.

The first access of the buffer may be at

any address within the modulus range

(see Section 4.4.4).

Note: Y space modulo addressing EA calcula-

tions assume word sized data (LS bit of

every EA is always clear).

Note 1: Using a POP instruction to pop the con-

tents of the top-of-stack (TOS) location

into MODCON also constitutes a write to

MODCON. Therefore, the instruction

immediately following such a POP cannot

be any instruction performing an indirect

read operation.

2: It should be noted that some instructions

perform an indirect read operation

implicitly. These are: POP, RETURN,

RETFIE, RETLW and ULNK.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 47

dsPIC30F

4.4.2 W ADDRESS REGISTER

SELECTION

The Modulo and Bit-Reversed Addressing Control reg-

ister MODCON<15:0> contains enable flags as well as

a W register field to specify the W address registers.

The XWM and YWM fields select which registers will

operate with modulo addressing. If XWM = 15, X

RAGU and X WAGU modulo addressing is disabled.

Similarly, if YWM = 15, Y AGU modulo addressing is

disabled.

The X Address Space Pointer W register (XWM), to

which modulo addressing is to be applied, is stored in

MODCON<3:0> (see Table 3-3). Modulo addressing is

enabled for X data space when XWM is set to any value

other than ‘15’ and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM), to

which modulo addressing is to be applied, is stored in

MODCON<7:4>. Modulo addressing is enabled for Y

data space when YWM is set to any value other than

‘15’ and the YMODEN bit is set at MODCON<14>.

FIGURE 4-1: INCREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE

Note: The XMODSRT and XMODEND registers

and the XWM register selection are

shared between X RAGU and X WAGU.

0x1100

0x1163

Start Addr = 0x1100

End Addr = 0x1163

Length = 0x0032 words

Byte

Address MOV #0x1100,W0

MOV W0,XMODSRT ;set modulo start address

MOV #0x1163,W0

MOV W0,MODEND ;set modulo end address

MOV #0x8001,W0

MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x0000,W0 ;W0 holds buffer fill value

MOV #0x1110,W1 ;point W1 to buffer

DO AGAIN,#0x31 ;fill the 50 buffer locations

MOV W0,[W1++] ;fill the next location

AGAIN: INC W0,W0 ;increment the fill value

dsPIC30F

DS70083C-page 48 Advance Information  2003 Microchip Technology Inc.

FIGURE 4-2: DECREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE

0x11D0

0x11FF

Start Addr = 0x11D0

End Addr = 0x11FF

Length = 0x0018 words

Byte

Address MOV #0x11D0,W0

MOV #0,XMODSRT ;set modulo start address

MOV 0x11FF,W0

MOV W0,XMODEND ;set modulo end address

MOV #0x8001,W0

MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x000F,W0 ;W0 holds buffer fill value

MOV #0x11E0,W1 ;point W1 to buffer

DO AGAIN,#0x17 ;fill the 24 buffer locations

MOV W0,[W1--] ;fill the next location

AGAIN: DEC W0,W0 ; decrement the fill value

 2003 Microchip Technology Inc. Advance Information DS70083C-page 49

dsPIC30F

4.4.3 MODULO ADDRESSING

APPLICABILITY

Modulo addressing can be applied to the effective

address (EA) calculation associated with any W regis-

ter. It is important to realize that the address bound-

aries check for addresses less than, or greater than the

upper (for incrementing buffers), and lower (for decre-

menting buffers) boundary addresses (not just equal

to). Address changes may, therefore, jump over bound-

aries and still be adjusted correctly (see Section 4.4.4

for restrictions).

4.4.4 MODULO ADDRESSING

RESTRICTIONS

For an incrementing buffer, the circular buffer start

address (lower boundary) is arbitrary but must be at a

‘zero’ power-of-two boundary (see Section 4.4.1). For

a decrementing buffer, the circular buffer end address

is arbitrary but must be at a ‘ones’ boundary.

There are no restrictions regarding how much an EA

calculation can exceed the address boundary being

checked and still be successfully corrected.

Once configured, the direction of successive

addresses into a buffer should not be changed.

Although all EAs will continue to be generated cor-

rectly, irrespective of offset sign, only one address

boundary is checked for each type of buffer. Thus, if a

buffer is set up to be an incrementing buffer by choos-

ing an appropriate starting address, then correction of

the effective address will be performed by the AGU at

the upper address boundary, but no address correction

will occur if the EA crosses the lower address bound-

ary. Similarly, for a decrementing boundary, address

correction will be performed by the AGU at the lower

address boundary, but no address correction will take

place if the EA crosses the upper address boundary.

The circular buffer pointer may be freely modified in

both directions without a possibility of out-of-range

address access only when the start address satisfies

the condition for an incrementing buffer (last ‘N’ bits are

zeroes) and the end address satisfies the condition for

a decrementing buffer (last ‘N’ bits are ones). Thus, the

modulo addressing capability is truly bidirectional only

for modulo-2 length buffers.

4.5 Bit-Reversed Addressing

Bit-reversed addressing is intended to simplify data re-

ordering for radix-2 FFT algorithms. It is supported by

the X WAGU only (i.e., for data writes only).

The modifier, which may be a constant value or register

contents, is regarded as having its bit order reversed. The

address source and destination are kept in normal order.

Thus, the only operand requiring reversal is the modifier.

4.5.1 BIT-REVERSED ADDRESSING

IMPLEMENTATION

Bit-reversed addressing is enabled when:

1. BWM (W register selection) in the MODCON

cannot be accessed using bit-reversed

addressing) and

2. the BREN bit is set in the XBREV register and

3. the Addressing mode used is Register Indirect

with Pre-Increment or Post-Increment.

If the length of a bit-reversed buffer is M = 2N bytes,

then the last ‘N’ bits of the data buffer start address

must be zeros.

XB<14:0> is the bit-reversed address modifier or ‘pivot

point’ which is typically a constant. In the case of an

FFT computation, its value is equal to half of the FFT

data buffer size.

When enabled, bit-reversed addressing will only be

executed for register indirect with pre-increment or

post-increment addressing and word sized data writes.

It will not function for any other Addressing mode or for

byte sized data, and normal addresses will be gener-

ated instead. When bit-reversed addressing is active,

the W address pointer will always be added to the

address modifier (XB) and the offset associated with

the Register Indirect Addressing mode will be ignored.

In addition, as word sized data is a requirement, the LS

bit of the EA is ignored (and always clear).

If bit-reversed addressing has already been enabled by

setting the BREN (XBREV<15>) bit, then a write to the

XBREV register should not be immediately followed by

an indirect read operation using the W register that has

been designated as the bit-reversed pointer.

Note: The modulo corrected effective address is

written back to the register only when Pre-

Modify or Post-Modify Addressing mode is

used to compute the effective address.

When an address offset (e.g., [W7+W2]) is

used, modulo address correction is per-

formed but the contents of the register

remain unchanged.

Note: All bit-reversed EA calculations assume

word sized data (LS bit of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note: Modulo addressing and bit-reversed

addressing should not be enabled together.

In the event that the user attempts to do

this, bit-reversed addressing will assume

priority when active for the X WAGU, and X

WAGU modulo addressing will be disabled.

However, modulo addressing will continue

to function in the X RAGU.

dsPIC30F

DS70083C-page 50 Advance Information  2003 Microchip Technology Inc.

FIGURE 4-3: BIT-REVERSED ADDRESS EXAMPLE

TABLE 4-3: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

TABLE 4-4: BIT-REVERSED ADDRESS MODIFIER VALUES

Normal Address Bit-Reversed Address

A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal

0000 00000 0

0001 11000 8

0010 20100 4

0011 31100 12

0100 40010 2

0101 51010 10

0110 60110 6

0111 71110 14

1000 80001 1

1001 91001 9

1010 10 0101 5

1011 11 1101 13

1100 12 0011 3

1101 13 1011 11

1110 14 0111 7

1111 15 1111 15

Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value

32768 0x4000

16384 0x2000

8192 0x1000

4096 0x0800

2048 0x0400

1024 0x0200

512 0x0100

256 0x0080

128 0x0040

64 0x0020

32 0x0010

16 0x0008

80x0004

40x0002

20x0001

b3 b2 b1 0

b2 b3 b4 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

Bit-Reversed Address

XB = 0x0008 for a 16-word Bit-Reversed Buffer

b7 b6 b5 b1

b7 b6 b5 b4

b11 b10 b9 b8

b15 b14 b13 b12

Sequential Address

Pivot Point

 2003 Microchip Technology Inc. Advance Information DS70083C-page 51

dsPIC30F

5.0 INTERRUPTS

The dsPIC30F Sensor and General Purpose Family

has up to 41 interrupt sources and 4 processor excep-

tions (traps) which must be arbitrated based on a

priority scheme.

The CPU is responsible for reading the Interrupt Vector

Table (IVT) and transferring the address contained in

the interrupt vector to the program counter. The inter-

rupt vector is transferred from the program data bus

into the program counter via a 24-bit wide multiplexer

on the input of the program counter.

The Interrupt Vector Table (IVT) and Alternate Interrupt

Vector Table (AIVT) are placed near the beginning of

program memory (0x000004). The IVT and AIVT are

shown in Table 5-2.

The interrupt controller is responsible for pre-

processing the interrupts and processor exceptions

prior to them being presented to the processor core.

The peripheral interrupts and traps are enabled, priori-

tized and controlled using centralized Special Function

Registers:

• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>

All interrupt request flags are maintained in these

three registers. The flags are set by their respec-

tive peripherals or external signals, and they are

cleared via software.

• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>

All interrupt enable control bits are maintained in

these three registers. These control bits are used

to individually enable interrupts from the

peripherals or external signals.

• IPC0<15:0>... IPC10<7:0>

The user assignable priority level associated with

each of these 41 interrupts is held centrally in

these twelve registers.

• IPL<3:0>

The current CPU priority level is explicitly stored

in the IPL bits. IPL<3> is present in the CORCON

STATUS register (SR) in the processor core.

• INTCON1<15:0>, INTCON2<15:0>

Global interrupt control functions are derived from

these two registers. INTCON1 contains the con-

trol and status flags for the processor exceptions.

The INTCON2 register controls the external

interrupt request signal behavior and the use of

the alternate vector table.

All interrupt sources can be user assigned to one of 7

priority levels, 1 through 7, via the IPCx registers. Each

interrupt source is associated with an interrupt vector,

as shown in Table 5-2. Levels 7 and 1 represent the

highest and lowest maskable priorities, respectively.

If the NSTDIS bit (INTCON1<15>) is set, nesting of

interrupts is prevented. Thus, if an interrupt is currently

being serviced, processing of a new interrupt is pre-

vented even if the new interrupt is of higher priority than

the one currently being serviced.

Certain interrupts have specialized control bits for fea-

tures like edge or level triggered interrupts, interrupt-

on-change, etc. Control of these features remains

within the peripheral module which generates the

interrupt.

The DISI instruction can be used to disable the pro-

cessing of interrupts of priorities 6 and lower for a cer-

tain number of instructions, during which the DISI bit

(INTCON2<14>) remains set.

When an interrupt is serviced, the PC is loaded with the

address stored in the vector location in program mem-

ory that corresponds to the interrupt. There are 63 dif-

ferent vectors within the IVT (refer to Table 5-2). These

vectors are contained in locations 0x000004 through

0x0000FE of program memory (refer to Table 5-2).

These locations contain 24-bit addresses and in order

to preserve robustness, an address error trap will take

place should the PC attempt to fetch any of these

words during normal execution. This prevents execu-

tion of random data as a result of accidentally decre-

menting a PC into vector space, accidentally mapping

a data space address into vector space, or the PC roll-

ing over to 0x000000 after reaching the end of imple-

mented program memory space. Execution of a GOTO

instruction to this vector space will also generate an

address error trap.

Note: Interrupt flag bits get set when an interrupt

condition occurs, regardless of the state of

its corresponding enable bit. User soft-

ware should ensure the appropriate inter-

rupt flag bits are clear prior to enabling an

interrupt.

Note: Assigning a priority level of ‘0’ to an inter-

rupt source is equivalent to disabling that

interrupt.

Note: The IPL bits become read only whenever

the NSTDIS bit has been set to ‘1’.

dsPIC30F

DS70083C-page 52 Advance Information  2003 Microchip Technology Inc.

5.1 Interrupt Priority

The user assignable interrupt priority (IP<2:0>) bits for

each individual interrupt source are located in the LS

3 bits of each nibble within the IPCx register(s). Bit 3 of

each nibble is not used and is read as a ‘0’. These bits

define the priority level assigned to a particular interrupt

by the user.

Since more than one interrupt request source may be

assigned to a specific user specified priority level, a

means is provided to assign priority within a given level.

This method is called “Natural Order Priority”.

Table 5-1 lists the interrupt numbers and interrupt

sources for the dsPIC device and their associated

vector numbers.

The ability for the user to assign every interrupt to one

of seven priority levels implies that the user can assign

a very high overall priority level to an interrupt with a

low natural order priority. For example, the PLVD (Low

Voltage Detect) can be given a priority of 7. The INT0

(External Interrupt 0) may be assigned to priority level

1, thus giving it a very low effective priority.

TABLE 5-1: NATURAL ORDER PRIORITY

Note: The user selectable priority levels start at

0 as the lowest priority and level 7 as the

highest priority.

Note 1: The natural order priority scheme has 0

as the highest priority and 53 as the

lowest priority.

2: The natural order priority number is the

same as the INT number.

INT

Number

Vector

Number Interrupt Source

Highest Natural Order Priority

0 8 INT0 - External Interrupt 0

1 9 IC1 - Input Capture 1

2 10 OC1 - Output Compare 1

3 11 T1 - Timer 1

4 12 IC2 - Input Capture 2

5 13 OC2 - Output Compare 2

6 14 T2 - Timer 2

7 15 T3 - Timer 3

8 16 SPI1

9 17 U1RX - UART1 Receiver

10 18 U1TX - UART1 Transmitter

11 19 ADC - ADC Convert Done

12 20 NVM - NVM Write Complete

13 21 SI2C - I2C Slave Interrupt

14 22 MI2C - I2C Master Interrupt

15 23 Input Change Interrupt

16 24 INT1 - External Interrupt 1

17 25 IC7 - Input Capture 7

18 26 IC8 - Input Capture 8

19 27 OC3 - Output Compare 3

20 28 OC4 - Output Compare 4

21 29 T4 - Timer 4

22 30 T5 - Timer 5

23 31 INT2 - External Interrupt 2

24 32 U2RX - UART2 Receiver

25 33 U2TX - UART2 Transmitter

26 34 SPI2

27 35 C1 - Combined IRQ for CAN1

28 36 IC3 - Input Capture 3

29 37 IC4 - Input Capture 4

30 38 IC5 - Input Capture 5

31 39 IC6 - Input Capture 6

32 40 OC5 - Output Compare 5

33 41 OC6 - Output Compare 6

34 42 OC7 - Output Compare 7

35 43 OC8 - Output Compare 8

36 44 INT3 - External Interrupt 3

37 45 INT4 - External Interrupt 4

38 46 C2 - Combined IRQ for CAN2

39-40 47-48 Reserved

41 49 DCI - Codec Transfer Done

42 50 LVD - Low Voltage Detect

43-53 51-61 Reserved

Lowest Natural Order Priority

 2003 Microchip Technology Inc. Advance Information DS70083C-page 53

dsPIC30F

5.2 Reset Sequence

A Reset is not a true exception, because the interrupt

controller is not involved in the Reset process. The pro-

cessor initializes its registers in response to a Reset

which forces the PC to zero. The processor then begins

program execution at location 0x000000. A GOTO

instruction is stored in the first program memory loca-

tion immediately followed by the address target for the

GOTO instruction. The processor executes the GOTO to

the specified address and then begins operation at the

specified target (start) address.

5.2.1 RESET SOURCES

In addition to external Reset and Power-on Reset

(POR), there are 6 sources of error conditions which

‘trap’ to the Reset vector.

• Watchdog Time-out:

The watchdog has timed out, indicating that the

processor is no longer executing the correct flow

of code.

• Uninitialized W Register Trap:

An attempt to use an uninitialized W register as

an address pointer will cause a Reset.

• Illegal Instruction Trap:

Attempted execution of any unused opcodes will

result in an illegal instruction trap. Note that a

fetch of an illegal instruction does not result in an

illegal instruction trap if that instruction is flushed

prior to execution due to a flow change.

• Brown-out Reset (BOR):

A momentary dip in the power supply to the

device has been detected which may result in

malfunction.

• Trap Lockout:

Occurrence of multiple trap conditions

simultaneously will cause a Reset.

5.3 Traps

Traps can be considered as non-maskable, non-stable

interrupts, which adhere to a predefined priority, as

shown in Table 5-2. They are intended to provide the

user a means to correct erroneous operation during

debug and when operating within the application.

Note that many of these trap conditions can only be

detected when they occur. Consequently, the question-

able instruction is allowed to complete prior to trap

exception processing. If the user chooses to recover

from the error, the result of the erroneous action that

caused the trap may have to be corrected.

There are 8 fixed priority levels for traps: level 8 through

level 15, which implies that the IPL3 is always set

during processing of a trap.

If the user is not currently executing a trap, and he sets

the IPL<3:0> bits to a value of ‘0111’ (level 7), then all

interrupts are disabled but traps can still be processed.

5.3.1 TRAP SOURCES

The following traps are provided with increasing prior-

ity. However, since all traps can be nested, priority has

little effect.

• Math Error Trap:

The math error trap executes under the following

four circumstances:

1. Should an attempt be made to divide by

zero, the divide operation will be aborted on

a cycle boundary and the trap taken.

2. If enabled, a math error trap will be taken

when an arithmetic operation on either

accumulator A or B causes an overflow

from bit 31 and the accumulator guard bits

are not utilized.

3. If enabled, a math error trap will be taken

when an arithmetic operation on either

accumulator A or B causes a catastrophic

overflow from bit 39 and all saturation is

disabled.

4. If the shift amount specified in a shift

instruction is greater than the maximum

allowed shift amount, a trap will occur.

Note: If the user does not intend to take correc-

tive action in the event of a trap error con-

dition, these vectors must be loaded with

the address of a default handler that sim-

ply contains the RESET instruction. If, on

the other hand, one of the vectors contain-

ing an invalid address is called, an

address error trap is generated.

dsPIC30F

DS70083C-page 54 Advance Information  2003 Microchip Technology Inc.

• Address Error Trap:

This trap is initiated when any of the following

circumstances occurs:

1. A misaligned data word access is

attempted.

2. A data fetch from and unimplemented data

memory location is attempted.

3. A data fetch from an unimplemented pro-

gram memory location is attempted.

4. An instruction fetch from vector space is

attempted.

5. Execution of a “BRA #literal” instruction or a

“GOTO #literal” instruction, where literal

is an unimplemented program memory address.

6. Executing instructions after modifying the PC to

point to unimplemented program memory

addresses. The PC may be modified by loading

a value into the stack and executing a RETURN

instruction.

• Stack Error Trap:

This trap is initiated under the following

conditions:

1. The stack pointer is loaded with a value

which is greater than the (user program-

mable) limit value written into the SPLIM

2. The stack pointer is loaded with a value

which is less than 0x0800 (simple stack

underflow).

• Oscillator Fail Trap:

This trap is initiated if the external oscillator fails

and operation becomes reliant on an internal RC

backup.

5.3.2 HARD AND SOFT TRAPS

It is possible that multiple traps can become active

within the same cycle (e.g., a misaligned word stack

write to an overflowed address). In such a case, the

fixed priority shown in Figure 5-2 is implemented,

which may require the user to check if other traps are

pending in order to completely correct the fault.

‘Soft’ traps include exceptions of priority level 8 through

level 11, inclusive. The arithmetic error trap (level 11)

falls into this category of traps. Soft traps can be treated

like non-maskable sources of interrupt that adhere to

the priority assigned by their position in the IVT. Soft

traps are processed like interrupts and require 2 cycles

to be sampled and Acknowledged prior to exception

processing. Therefore, additional instructions may be

executed before a soft trap is Acknowledged.

‘Hard’ traps include exceptions of priority level 12

through level 15, inclusive. The address error (level

12), stack error (level 13) and oscillator error (level 14)

traps fall into this category.

Like soft traps, hard traps can also be viewed as non-

maskable sources of interrupt. The difference between

hard traps and soft traps is that hard traps force the

CPU to stop code execution after the instruction caus-

ing the trap has completed. Normal program execution

flow will not resume until after the trap has been

Acknowledged and processed.

If a higher priority trap occurs while any lower priority

trap is in progress, processing of the lower priority trap

will be suspended and the higher priority trap will be

Acknowledged and processed. The lower priority trap

will remain pending until processing of the higher

priority trap completes.

Each hard trap that occurs must be Acknowledged

before code execution of any type may continue. If a

lower priority hard trap occurs while a higher priority

trap is pending, Acknowledged, or is being processed,

a hard trap conflict will occur. The conflict occurs

because the lower priority trap cannot be Acknowl-

edged until processing for the higher priority trap

completes.

The device is automatically reset in a hard trap conflict

condition. The TRAPR status bit (RCON<15>) is set

when the Reset occurs so that the condition may be

detected in software.

In the case of a math error trap or oscillator failure trap,

the condition that causes the trap to occur must be

removed before the respective trap flag bit in the

INTCON1 register may be cleared.

Note: In the MAC class of instructions, wherein

the data space is split into X and Y data

space, unimplemented X space includes

all of Y space, and unimplemented Y

space includes all of X space.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 55

dsPIC30F

5.4 Interrupt Sequence

All interrupt event flags are sampled in the beginning of

each instruction cycle by the IFSx registers. A pending

interrupt request (IRQ) is indicated by the flag bit being

equal to a ‘1’ in an IFSx register. The IRQ will cause an

interrupt to occur if the corresponding bit in the Interrupt

Enable (IECx) register is set. For the remainder of the

instruction cycle, the priorities of all pending interrupt

requests are evaluated.

If there is a pending IRQ with a priority level greater

than the current processor priority level in the IPL bits,

the processor will be interrupted.

The processor then stacks the current program counter

and the low byte of the processor STATUS register

(SRL), as shown in Figure 5-1. The low byte of the

STATUS register contains the processor priority level at

the time prior to the beginning of the interrupt cycle.

The processor then loads the priority level for this inter-

rupt into the STATUS register. This action will disable

all lower priority interrupts until the completion of the

Interrupt Service Routine.

FIGURE 5-1: INTERRUPT STACK

FRAME

The RETFIE (return from interrupt) instruction will

unstack the program counter and STATUS registers to

return the processor to its state prior to the interrupt

sequence.

FIGURE 5-2: EXCEPTION VECTORS

5.5 Alternate Vector Table

In program memory, the Interrupt Vector Table (IVT) is

followed by the Alternate Interrupt Vector Table (AIVT),

as shown in Table 5-2. Access to the alternate vector

table is provided by the ALTIVT bit in the INTCON2 reg-

ister. If the ALTIVT bit is set, all interrupt and exception

processes will use the alternate vectors instead of the

default vectors. The alternate vectors are organized in

the same manner as the default vectors. The AIVT sup-

ports emulation and debugging efforts by providing a

means to switch between an application and a support

environment without requiring the interrupt vectors to

be reprogrammed. This feature also enables switching

between applications for evaluation of different

software algorithms at run time.

If the AIVT is not required, the program memory allo-

cated to the AIVT may be used for other purposes.

AIVT is not a protected section and may be freely

programmed by the user.

Note 1: The user can always lower the priority

level by writing a new value into SR. The

Interrupt Service Routine must clear the

interrupt flag bits in the IFSx register

before lowering the processor interrupt

priority, in order to avoid recursive

interrupts.

2: The IPL3 bit (CORCON<3>) is always

clear when interrupts are being pro-

cessed. It is set only during execution of

traps.

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

0x0000

PC<15:0>

SRL IPL3 PC<22:16>

POP : [--W15]

PUSH: [W15++]

Address Error Trap Vector

Oscillator Fail Trap Vector

Stack Error Trap Vector

Reserved Vector

Math Error Trap Vector

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

Math Error Trap Vector

Decreasing

Priority

0x000000

0x000014

Reserved

Stack Error Trap Vector

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

IVT

AIVT

0x000080

0x00007E

0x0000FE

Reserved

0x000094

Reset - GOTO Instruction

Reset - GOTO Address 0x000002

Reserved

0x000082

0x000084

0x000004

Reserved Vector

dsPIC30F

DS70083C-page 56 Advance Information  2003 Microchip Technology Inc.

5.6 Fast Context Saving

A context saving option is available using shadow reg-

isters. Shadow registers are provided for the DC, N,

OV, Z and C bits in SR, and the registers W0 through

W3. The shadows are only one level deep. The shadow

registers are accessible using the PUSH.S and POP.S

instructions only.

When the processor vectors to an interrupt, the

PUSH.S instruction can be used to store the current

value of the aforementioned registers into their

respective shadow registers.

If an ISR of a certain priority uses the PUSH.S and

POP.S instructions for fast context saving, then a

higher priority ISR should not include the same instruc-

tions. Users must save the key registers in software

during a lower priority interrupt if the higher priority ISR

uses fast context saving.

5.7 External Interrupt Requests

The interrupt controller supports up to five external

interrupt request signals, INT0-INT4. These inputs are

edge sensitive; they require a low-to-high or a high-to-

low transition to generate an interrupt request. The

INTCON2 register has five bits, INT0EP-INT4EP, that

select the polarity of the edge detection circuitry.

5.8 Wake-up from Sleep and Idle

The interrupt controller may be used to wake-up the

processor from either Sleep or Idle modes, if Sleep or

Idle mode is active when the interrupt is generated.

If an enabled interrupt request of sufficient priority is

received by the interrupt controller, then the standard

interrupt request is presented to the processor. At the

same time, the processor will wake-up from Sleep or

Idle and begin execution of the Interrupt Service

Routine (ISR) needed to process the interrupt request.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 57

dsPIC30F

TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP

SFR

Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

INTCON1 0080 NSTDIS — — — — OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL —0000 0000 0000 0000

INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000

IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000

IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000

IFS2 0088 — — — — — LVDIF DCIIF —— C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000

IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000

IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000

IEC2 0090 — — — — — LVDIE DCIIE —— C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000

IPC0 0094 — T1IP<2:0> — OC1IP<2:0> — IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100

IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100

IPC2 0098 — ADIP<2:0> — U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100

IPC3 009A — CNIP<2:0> — MI2CIP<2:0> — SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100

IPC4 009C — OC3IP<2:0> — IC8IP<2:0> — IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100

IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100

IPC6 00A0 — C1IP<2:0> — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100

IPC7 00A2 — IC6IP<2:0> — IC5IP<2:0> — IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100

IPC8 00A4 — OC8IP<2:0> — OC7IP<2:0> — OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100

IPC9 00A6 — — — — — C2IP<2:0> — INT41IP<2:0> — INT3IP<2:0> 0000 0100 0100 0100

IPC10 00A8 — — — — — LVDIP<2:0> — DCIIP<2:0> — — — — 0000 0100 0100 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 58 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 59

dsPIC30F

6.0 FLASH PROGRAM MEMORY

The dsPIC30F family of devices contains internal pro-

gram Flash memory for executing user code. There are

two methods by which the user can program this

memory:

1. Run-Time Self-Programming (RTSP)

2. In-Circuit Serial Programming™ (ICSP™)

6.1 In-Circuit Serial Programming

(ICSP)

dsPIC30F devices can be serially programmed while in

the end application circuit. This is simply done with two

lines for Programming Clock and Programming Data

(which are named PGC and PGD respectively), and

three other lines for Power (VDD), Ground (VSS) and

Master Clear (MCLR). this allows customers to manu-

facture boards with unprogrammed devices, and then

program the microcontroller just before shipping the

product. This also allows the most recent firmware or a

custom firmware to be programmed.

6.2 Run-Time Self-Programming

(RTSP)

RTSP is accomplished using TBLRD (table read) and

TBLWT (table write) instructions, and the following

control registers:

• NVMCON: Non-Volatile Memory Control Register

• NVMKEY: Non-Volatile Memory Key Register

• NVMADR: Non-Volatile Memory Address Register

With RTSP, the user may erase program memory, 32

instructions (96 bytes) at a time and can write program

memory data, 4 instructions (12 bytes) at a time.

6.3 Table Instruction Operation

Summary

The TBLRDL and the TBLWTL instructions are used to

read or write to bits<15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

Word or Byte mode.

The TBLRDH and TBLWTH instructions are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTH can access program memory in Word or

Byte mode.

A 24-bit program memory address is formed using

bits<7:0> of the TBLPAG register and the effective

address (EA) from a W register specified in the table

instruction, as shown in Figure 6-1.

FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS

Program Counter

24 bits

NVMADRU Reg

8 bits 16 bits

Program

Using

TBLPAG Reg

8 bits

Working Reg EA

16 bits

Using

Byte

24-bit EA

1/0

Select

Table

Instruction

NVMADR

Addressing

Counter

Using

NVMADR Reg EA

User/Configuration

Space Select

dsPIC30F

DS70083C-page 60 Advance Information  2003 Microchip Technology Inc.

6.4 RTSP Operation

The dsPIC30F Flash program memory is organized

into rows and panels. Each row consists of 32 instruc-

tions or 96 bytes. Each panel consists of 128 rows or

4K x 24 instructions. RTSP allows the user to erase one

row (32 instructions) at a time and to program four

instructions at one time. RTSP may be used to program

multiple program memory panels, but the table pointer

must be changed at each panel boundary.

Each panel of program memory contains write latches

that hold four instructions of programming data. Prior to

the actual programming operation, the write data must

be loaded into the panel write latches. The data to be

programmed into the panel is loaded in sequential

order into the write latches: instruction 0, instruction 1,

etc. The instruction words loaded must always be from

a group of four boundary (e.g., loading of instructions 3,

4, 5 and 6 is not allowed).

The basic sequence for RTSP programming is to set up

a table pointer, then do a series of TBLWT instructions

to load the write latches. Programming is performed by

setting the special bits in the NVMCON register. Four

TBLWTL and four TBLWTH instructions are required to

load the four instructions. To fully program a row of

program memory, eight cycles of four TBLWTL and four

TBLWTH are required. If multiple panel programming

is required, the table pointer needs to be changed and

the next set of multiple write latches written.

All of the table write operations are single word writes

(2 instruction cycles) because only the table latches are

written. A total of 8 programming passes, each writing

4 instruction words, are required per row. A 128-row

panel requires 1024 programming cycles.

The Flash program memory is readable, writable, and

erasable during normal operation over the entire VDD

range.

6.5 Control Registers

The four SFRs used to read and write the program

Flash memory are:

•NVMCON

•NVMADR

• NVMADRU

•NVMKEY

6.5.1 NVMCON REGISTER

The NVMCON register controls which blocks are to be

erased, which memory type is to be programmed and

start of the programming cycle.

6.5.2 NVMADR REGISTER

The NVMADR register is used to hold the lower two

bytes of the effective address. The NVMADR register

captures the EA<15:0> of the last table instruction that

has been executed and selects the row to write.

6.5.3 NVMADRU REGISTER

The NVMADRU register is used to hold the upper byte

of the effective address. The NVMADRU register cap-

tures the EA<23:16> of the last table instruction that

has been executed.

6.5.4 NVMKEY REGISTER

NVMKEY is a write only register that is used for write

protection. To start a programming or an erase

sequence, the user must consecutively write 0x55 and

0xAA to the NVMKEY register. Refer to Section 6.6 for

further details.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 61

dsPIC30F

6.6 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. A programming operation is nominally 2 msec in

duration and the processor stalls (waits) until the oper-

ation is finished. Setting the WR bit (NVMCON<15>)

starts the operation, and the WR bit is automatically

cleared when the operation is finished.

6.6.1 PROGRAMMING ALGORITHM FOR

PROGRAM FLASH

The user can erase one row of program Flash memory

at a time. The user can program one block

(4 instruction words) of Flash memory at a time. The

general process is:

1. Read one row of program Flash (32 instruction

words) and store into data RAM as a data

“image”.

2. Update the data image with the desired new

data.

3. Erase program Flash row.

a) Setup NVMCON register for multi-word,

program Flash, erase, and set WREN bit.

b) Write address of row to be erased into

NVMADRU/NVMADR.

c) Write ‘55’ to NVMKEY.

d) Write ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin erase cycle.

f) CPU will stall for the duration of the erase

cycle.

g) The WR bit is cleared when erase cycle

ends.

4. Write four instruction words of data from data

RAM into the program Flash write latches.

5. Program 4 instruction words into program Flash.

a) Setup NVMCON register for multi-word,

program Flash, program, and set WREN

bit.

b) Write ‘55’ to NVMKEY.

c) Write ‘AA’ to NVMKEY.

d) Set the WR bit. This will begin program

cycle.

e) CPU will stall for duration of the program

cycle.

f) The WR bit is cleared by the hardware

when program cycle ends.

6. Repeat steps (4-5) seven more times to finish

programming Flash row.

7. Repeat steps 1 through 6 as needed to program

desired amount of program Flash memory.

6.6.2 ERASING A ROW OF PROGRAM

MEMORY

Example 6-1 shows a code sequence that can be used

to erase a row (32 instructions) of program memory.

EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write

; program memory selected, and writes enabled

MOV #0x4041,W0 ;

MOV W0,NVMCON ; Init NVMCON SFR

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR),W0 ;

MOV W0,NVMADRU ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer

MOV W0, NVMADR ; Initialize NVMADR SFR

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F

DS70083C-page 62 Advance Information  2003 Microchip Technology Inc.

6.6.3 LOADING WRITE LATCHES

Example 6-2 shows a sequence of instructions that can

be used to load the 96 bits of write latches. Four

TBLWTL and four TBLWTH instructions are needed to

load the write latches selected by the table pointer.

EXAMPLE 6-2: LOADING WRITE LATCHES

6.6.4 INITIATING THE PROGRAMMING

SEQUENCE

For protection, the write initiate sequence for NVMKEY

must be used to allow any erase or program operation

to proceed. After the programming command has been

executed, the user must wait for the programming time

until programming is complete. The two instructions fol-

lowing the start of the programming sequence should

be NOPs.

EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000,W0 ;

MOV W0,TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000,W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0,W2 ;

MOV #HIGH_BYTE_0,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1,W2 ;

MOV #HIGH_BYTE_1,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2,W2 ;

MOV #HIGH_BYTE_2,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

; 3rd_program_word

MOV #LOW_WORD_3,W2 ;

MOV #HIGH_BYTE_3,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

Note: In Example 6-2, the contents of the upper byte of W3 has no effect.

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

 2003 Microchip Technology Inc. Advance Information DS70083C-page 63

dsPIC30F

TABLE 6-1: NVM REGISTER MAP

File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All RESETS

NVMCON 0760 WR WREN WRERR — — — — TWRI — PROGOP<6:0> 0000 0000 0000 0000

NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu

NVMADRU 0764 — — — — — — — — NVMADR<23:16> 0000 0000 uuuu uuuu

NVMKEY 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 64 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 65

dsPIC30F

7.0 DATA EEPROM MEMORY

The Data EEPROM Memory is readable and writable

during normal operation over the entire VDD range. The

data EEPROM memory is directly mapped in the

program memory address space.

The four SFRs used to read and write the program

Flash memory are used to access data EEPROM

memory, as well. As described in Section 6.5, these

registers are:

•NVMCON

•NVMADR

• NVMADRU

•NVMKEY

The EEPROM data memory allows read and write of

single words and 16-word blocks. When interfacing to

data memory, NVMADR in conjunction with the

NVMADRU register are used to address the EEPROM

location being accessed. TBLRDL and TBLWTL

instructions are used to read and write data EEPROM.

The dsPIC30F devices have up to 8 Kbytes (4K

words) of data EEPROM with an address range from

0x7FF000 to 0x7FFFFE.

A word write operation should be preceded by an erase

of the corresponding memory location(s). The write typ-

ically requires 2 ms to complete but the write time will

vary with voltage and temperature.

A program or erase operation on the data EEPROM

does not stop the instruction flow. The user is respon-

sible for waiting for the appropriate duration of time

before initiating another data EEPROM write/erase

operation. Attempting to read the data EEPROM while

a programming or erase operation is in progress results

in unspecified data.

Control bit WR initiates write operations similar to pro-

gram Flash writes. This bit cannot be cleared, only set,

in software. They are cleared in hardware at the com-

pletion of the write operation. The inability to clear the

WR bit in software prevents the accidental or

premature termination of a write operation.

The WREN bit, when set, will allow a write operation.

On power-up, the WREN bit is clear. The WRERR bit is

set when a write operation is interrupted by a MCLR

Reset or a WDT Time-out Reset during normal opera-

tion. In these situations, following Reset, the user can

check the WRERR bit and rewrite the location. The

address register NVMADR remains unchanged.

7.1 Reading the Data EEPROM

A TBLRD instruction reads a word at the current pro-

gram word address. This example uses W0 as a

pointer to data EEPROM. The result is placed in

EXAMPLE 7-1: DATA EEPROM READ

Note: Interrupt flag bit NVMIF in the IFS0 regis-

ter is set when write is complete. It must be

cleared in software.

MOV #LOW_ADDR_WORD,W0 ; Init Pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

TBLRDL [ W0 ], W4 ; read data EEPROM

dsPIC30F

DS70083C-page 66 Advance Information  2003 Microchip Technology Inc.

7.2 Erasing Data EEPROM

7.2.1 ERASING A BLOCK OF DATA

EEPROM

In order to erase a block of data EEPROM, the

NVMADRU and NVMADR registers must initially point

to the block of memory to be erased. Configure

NVMCON for erasing a block of data EEPROM, and

set the ERASE and WREN bits in the NVMCON

shown in Example 7-2.

EXAMPLE 7-2: DATA EEPROM BLOCK ERASE

7.2.2 ERASING A WORD OF DATA

EEPROM

The TBLPAG and NVMADR registers must point to the

block. Select erase a block of data Flash, and set the

ERASE and WREN bits in the NVMCON register. Set-

ting the WR bit initiates the erase as shown in

Example 7-3.

EXAMPLE 7-3: DATA EEPROM WORD ERASE

; Select data EEPROM block, ERASE, WREN bits

MOV #4045,W0

MOV W0,NVMCON ; Initialize NVMCON SFR

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

; Select data EEPROM word, ERASE, WREN bits

MOV #4044,W0

MOV W0,NVMCON

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

 2003 Microchip Technology Inc. Advance Information DS70083C-page 67

dsPIC30F

7.3 Writing to the Data EEPROM

To write an EEPROM data location, the following

sequence must be followed:

1. Erase data EEPROM word.

a) Select word, data EEPROM erase, and set

WREN bit in NVMCON register.

b) Write address of word to be erased into

NVMADR.

c) Enable NVM interrupt (optional).

d) Write ‘55’ to NVMKEY.

e) Write ‘AA’ to NVMKEY.

f) Set the WR bit. This will begin erase cycle.

g) Either poll NVMIF bit or wait for NVMIF

interrupt.

h) The WR bit is cleared when the erase cycle

ends.

2. Write data word into data EEPROM write

latches.

3. Program 1 data word into data EEPROM.

a) Select word, data EEPROM program, and

set WREN bit in NVMCON register.

b) Enable NVM write done interrupt (optional).

c) Write ‘55’ to NVMKEY.

d) Write ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin program

cycle.

f) Either poll NVMIF bit or wait for NVM

interrupt.

g) The WR bit is cleared when the write cycle

ends.

The write will not initiate if the above sequence is not

exactly followed (write 0x55 to NVMKEY, write 0xAA to

NVMCON, then set WR bit) for each word. It is strongly

recommended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in NVMCON must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution. The WREN bit should be kept clear at all times

except when updating the EEPROM. The WREN bit is

not cleared by hardware.

After a write sequence has been initiated, clearing the

WREN bit will not affect the current write cycle. The WR

bit will be inhibited from being set unless the WREN bit

is set. The WREN bit must be set on a previous instruc-

tion. Both WR and WREN cannot be set with the same

instruction.

At the completion of the write cycle, the WR bit is

cleared in hardware and the Non-Volatile Memory

Write Complete Interrupt Flag bit (NVMIF) is set. The

user may either enable this interrupt or poll this bit.

NVMIF must be cleared by software.

7.3.1 WRITING A WORD OF DATA

EEPROM

Once the user has erased the word to be programmed,

then a table write instruction is used to write one write

latch, as shown in Example 7-4.

EXAMPLE 7-4: DATA EEPROM WORD WRITE

; Point to data memory

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #LOW(WORD),W2 ; Get data

TBLWTL W2,[ W0] ; Write data

; The NVMADR captures last table access address

; Select data EEPROM for 1 word op

MOV #0x4004,W0

MOV W0,NVMCON

; Operate key to allow write operation

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate program sequence

NOP

; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

dsPIC30F

DS70083C-page 68 Advance Information  2003 Microchip Technology Inc.

7.3.2 WRITING A BLOCK OF DATA

EEPROM

To write a block of data EEPROM, write to all sixteen

latches first, then set the NVMCON register and

program the block.

EXAMPLE 7-5: DATA EEPROM BLOCK WRITE

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #data1,W2 ; Get 1st data

TBLWTL W2,[ W0]++ ; write data

MOV #data2,W2 ; Get 2nd data

TBLWTL W2,[ W0]++ ; write data

MOV #data3,W2 ; Get 3rd data

TBLWTL W2,[ W0]++ ; write data

MOV #data4,W2 ; Get 4th data

TBLWTL W2,[ W0]++ ; write data

MOV #data5,W2 ; Get 5th data

TBLWTL W2,[ W0]++ ; write data

MOV #data6,W2 ; Get 6th data

TBLWTL W2,[ W0]++ ; write data

MOV #data7,W2 ; Get 7th data

TBLWTL W2,[ W0]++ ; write data

MOV #data8,W2 ; Get 8th data

TBLWTL W2,[ W0]++ ; write data

MOV #data9,W2 ; Get 9th data

TBLWTL W2,[ W0]++ ; write data

MOV #data10,W2 ; Get 10th data

TBLWTL W2,[ W0]++ ; write data

MOV #data11,W2 ; Get 11th data

TBLWTL W2,[ W0]++ ; write data

MOV #data12,W2 ; Get 12th data

TBLWTL W2,[ W0]++ ; write data

MOV #data13,W2 ; Get 13th data

TBLWTL W2,[ W0]++ ; write data

MOV #data14,W2 ; Get 14th data

TBLWTL W2,[ W0]++ ; write data

MOV #data15,W2 ; Get 15th data

TBLWTL W2,[ W0]++ ; write data

MOV #data16,W2 ; Get 16th data

TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.

MOV #0x400A,W0 ; Select data EEPROM for multi word op

MOV W0,NVMCON ; Operate Key to allow program operation

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start write cycle

NOP

 2003 Microchip Technology Inc. Advance Information DS70083C-page 69

dsPIC30F

7.4 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

7.5 Protection Against Spurious Write

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared;

also, the Power-up Timer prevents EEPROM write.

The write initiate sequence and the WREN bit together

help prevent an accidental write during brown-out,

power glitch, or software malfunction.

dsPIC30F

DS70083C-page 70 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 71

dsPIC30F

8.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR, and

OSC1/CLKI) are shared between the peripherals and

the parallel I/O ports.

All I/O input ports feature Schmitt Trigger inputs for

improved noise immunity.

8.1 Parallel I/O (PIO) Ports

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

may be read but the output driver for the parallel port bit

will be disabled. If a peripheral is enabled but the

peripheral is not actively driving a pin, that pin may be

driven by a port.

All port pins have three registers directly associated

with the operation of the port pin. The Data Direction

or an output. If the data direction bit is a ‘1’, then the pin

is an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx), read the latch.

Writes to the latch, write the latch (LATx). Reads from

the port (PORTx), read the port pins and writes to the

port pins, write the latch (LATx).

Any bit and its associated data and control registers

that are not valid for a particular device will be dis-

abled. That means the corresponding LATx and TRISx

registers and the port pin will read as zeros.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nevertheless

regarded as a dedicated port because there is no

other competing source of outputs. An example is the

INT4 pin.

The format of the registers for PORTA are shown in

Tab le 8 -1 .

The TRISA (Data Direction Control) register controls

the direction of the RA<7:0> pins, as well as the INTx

pins and the VREF pins. The LATA register supplies

data to the outputs and is readable/writable. Reading

the PORTA register yields the state of the input pins,

while writing the PORTA register modifies the contents

of the LATA register.

FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

WR LAT +

TRIS Latch

I/O Pad

WR Port

Data Bus

Data Latch

Read LAT

Read Port

Read TRIS

WR TRIS

I/O Cell

Dedicated Port Module

dsPIC30F

DS70083C-page 72 Advance Information  2003 Microchip Technology Inc.

TABLE 8-1: PORTA REGISTER MAP

SFR

Name

Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISA 02C0 TRISA15 TRISA14 TRISA13 TRISA12 — TRISA10 TRISA9 — TRISA7 TRISA6 — — — — — — 1111 0110 1100 0000

PORTA 02C2 RA15 RA14 RA13 RA12 — RA10 RA9 — RA7 RA6 — — — — — — 0000 0000 0000 0000

LATA 02C4 LATA15 LATA14 LATA13 LATA12 — LATA10 LATA9 — LATA7 LATA6 — — — — — — 0000 0000 0000 0000

Legend: u = uninitialized bit

 2003 Microchip Technology Inc. Advance Information DS70083C-page 73

dsPIC30F

A parallel I/O (PIO) port that shares a pin with a periph-

eral is, in general, subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has ownership of the output data and control signals of

the I/O pad cell. Figure 8-2 shows how ports are shared

with other peripherals and the associated I/O cell (pad)

to which they are connected. Table 8-2 through

Table 8-6 show the formats of the registers for the

shared ports, PORTB through PORTG.

FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

8.2 Configuring Analog Port Pins

The use of the ADPCFG and TRIS registers control the

operation of the A/D port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared (out-

put), the digital output level (VOH or VOL) will be

converted.

When reading the Port register, all pins configured as

analog input channels will read as cleared (a low level).

Pins configured as digital inputs will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins) may cause the

input buffer to consume current that exceeds the

device specifications.

Note: The actual bits in use vary between

devices.

WR LAT +

TRIS Latch

I/O Pad

WR Port

Data Bus

Data Latch

Read LAT

Read Port

Read TRIS

WR TRIS

Peripheral Output Data

Output Enable

Peripheral Input Data

I/O Cell

Peripheral Module

Peripheral Output Enable

PIO Module

Output Multiplexers

Output Data

Input Data

Peripheral Module Enable

dsPIC30F

DS70083C-page 74 Advance Information  2003 Microchip Technology Inc.

TABLE 8-2: PORTB REGISTER MAP

TABLE 8-3: PORTC REGISTER MAP

TABLE 8-4: PORTD REGISTER MAP

TABLE 8-5: PORTF REGISTER MAP

TABLE 8-6: PORTG REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111

PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISC 02CC TRISC15 TRISC14 TRISC13 ———————— TRISC4 TRISC3 TRISC2 TRISC1 —1110 0000 0001 1110

PORTC 02CE RC15 RC14 RC13 ———————— RC4 RC3 RC2 RC1 —0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 ———————— LATC4 LATC3 LATC2 LATC1 —0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111

PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000

LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISF 02DE — — — — — — — TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111

PORTF 02E0 — — — — — — — RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000

LATF 02E2 — — — — — — — LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISG 02E4 TRISG15 TRISG14 TRISG13 TRISG12 —— TRISG9 TRISG8 TRISG7 TRISG6 —— TRISG3 TRISG2 TRISG1 TRISG0 1111 0011 1100 1111

PORTG 02E6 RG15 RG14 RG13 RG12 —— RG9 RG8 RG7 RG6 —— RG3 RG2 RG1 RG0 0000 0000 0000 0000

LATG 02E8 LATG15 LATG14 LATG13 LATG12 —— LATG9 LATG8 LATG7 LATG6 —— LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000

Legend: u = uninitialized bit

 2003 Microchip Technology Inc. Advance Information DS70083C-page 75

dsPIC30F

8.3 Input Change Notification Module

The input change notification module provides the

dsPIC30F devices the ability to generate interrupt

requests to the processor, in response to a change of

state on selected input pins. This module is capable of

detecting input change of states even in Sleep mode,

when the clocks are disabled. There are up to 24 exter-

nal signals (CN0 through CN23) that may be selected

(enabled) for generating an interrupt request on a

change of state.

TABLE 8-7: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8)

TABLE 8-8: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State

CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000

CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000

CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000

CNPU2 00C6 — — — — — — — — 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000

CNEN2 00C2 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000

CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000

CNPU2 00C6 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 76 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 77

dsPIC30F

9.0 TIMER1 MODULE

This section describes the 16-bit General Purpose

(GP) Timer1 module and associated Operational

modes. Figure 9-1 depicts the simplified block diagram

of the 16-bit Timer1 module.

The following sections provide a detailed description

including setup and control registers, along with asso-

ciated block diagrams for the Operational modes of the

timers.

The Timer1 module is a 16-bit timer which can serve as

the time counter for the real-time clock, or operate as a

free-running interval timer/counter. The 16-bit timer has

the following modes:

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Further, the following operational characteristics are

supported:

• Timer gate operation

• Selectable prescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

These Operating modes are determined by setting the

appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1

presents a block diagram of the 16-bit timer module.

16-bit Timer Mode: In the 16-bit Timer mode, the timer

increments on every instruction cycle up to a match

value preloaded into the Period register PR1, then

resets to ‘0’ and continues to count.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the TSIDL (T1CON<13>)

bit = 0. If TSIDL = 1, the timer module logic will resume

the incrementing sequence upon termination of the

CPU Idle mode.

16-bit Synchronous Counter Mode: In the 16-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in PR1,

then resets to ‘0’ and continues.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the respective TSIDL bit = 0.

If TSIDL = 1, the timer module logic will resume the

incrementing sequence upon termination of the CPU

Idle mode.

16-bit Asynchronous Counter Mode: In the 16-bit

Asynchronous Counter mode, the timer increments on

every rising edge of the applied external clock signal.

The timer counts up to a match value preloaded in PR1,

then resets to ‘0’ and continues.

When the timer is configured for the Asynchronous

mode of operation and the CPU goes into the Idle

mode, the timer will stop incrementing if TSIDL = 1.

FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM

TON

Sync

SOSCI

SOSCO/

PR1

T1IF

Equal Comparator x 16

TMR1

Reset

LPOSCEN

Event Flag

TSYNC

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

T1CK

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

dsPIC30F

DS70083C-page 78 Advance Information  2003 Microchip Technology Inc.

9.1 Timer Gate Operation

The 16-bit timer can be placed in the Gated Time Accu-

mulation mode. This mode allows the internal TCY to

increment the respective timer when the gate input sig-

nal (T1CK pin) is asserted high. Control bit TGATE

(T1CON<6>) must be set to enable this mode. The

timer must be enabled (TON = 1) and the timer clock

source set to internal (TCS = 0).

When the CPU goes into the Idle mode, the timer will

stop incrementing unless TSIDL = 0. If TSIDL = 1, the

timer will resume the incrementing sequence upon

termination of the CPU Idle mode.

9.2 Timer Prescaler

The input clock (FOSC/4 or external clock) to the 16-bit

Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256,

selected by control bits TCKPS<1:0> (T1CON<5:4>).

The prescaler counter is cleared when any of the

following occurs:

• a write to the TMR1 register

• clearing of the TON bit (T1CON<15>)

• device Reset, such as POR and BOR

However, if the timer is disabled (TON = 0), then the

timer prescaler cannot be reset since the prescaler

clock is halted.

TMR1 is not cleared when T1CON is written. It is

cleared by writing to the TMR1 register.

9.3 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will operate if:

• The timer module is enabled (TON = 1) and

• The timer clock source is selected as external

(TCS = 1) and

• The TSYNC bit (T1CON<2>) is asserted to a logic

‘0’ which defines the external clock source as

asynchronous.

When all three conditions are true, the timer will con-

tinue to count up to the Period register and be reset to

0x0000.

When a match between the timer and the Period regis-

ter occurs, an interrupt can be generated if the

respective timer interrupt enable bit is asserted.

9.4 Timer Interrupt

The 16-bit timer has the ability to generate an interrupt on

period match. When the timer count matches the Period

generated if enabled. The T1IF bit must be cleared in

software. The timer interrupt flag, T1IF, is located in the

IFS0 Control register in the interrupt controller.

When the Gated Time Accumulation mode is enabled,

an interrupt will also be generated on the falling edge of

the gate signal (at the end of the accumulation cycle).

Enabling an interrupt is accomplished via the respec-

tive timer interrupt enable bit, T1IE. The timer interrupt

enable bit is located in the IEC0 Control register in the

interrupt controller.

9.5 Real-Time Clock

Timer1, when operating in Real-Time Clock (RTC)

mode, provides time of day and event time-stamping

capabilities. Key operational features of the RTC are:

• Operation from 32 kHz LP oscillator

• 8-bit prescaler

•Low power

• Real-Time Clock interrupts

These Operating modes are determined by setting the

appropriate bit(s) in the T1CON Control register.

9.5.1 RTC OSCILLATOR OPERATION

When the TON = 1, TCS = 1 and TGATE = 0, the timer

increments on the rising edge of the 32 kHz LP oscilla-

tor output signal, up to the value specified in the Period

The TSYNC bit must be asserted to a logic ‘0’

(Asynchronous mode) for correct operation.

Enabling LPOSCEN (OSCCON<1>) will disable the

normal Timer and Counter modes and enable a timer

carry-out wake-up event.

When the CPU enters Sleep mode, the RTC will con-

tinue to operate provided the 32 kHz external crystal

oscillator is active and the control bits have not been

changed. The TSIDL bit should be cleared to ‘0’ in

order for RTC to continue operation in Idle mode.

9.5.2 RTC INTERRUPTS

When an interrupt event occurs, the respective interrupt

flag, T1IF, is asserted and an interrupt will be generated

if enabled. The T1IF bit must be cleared in software. The

respective Timer interrupt flag, T1IF, is located in the

IFS0 Status register in the interrupt controller.

Enabling an interrupt is accomplished via the respec-

tive timer interrupt enable bit, T1IE. The timer interrupt

enable bit is located in the IEC0 Control register in the

interrupt controller.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 79

dsPIC30F

TABLE 9-1: TIMER1 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu

PR1 0102 Period Register 1 1111 1111 1111 1111

T1CON 0104 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS — 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 80 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 81

dsPIC30F

10.0 TIMER2/3 MODULE

This section describes the 32-bit General Purpose

(GP) Timer module (Timer2/3) and associated Opera-

tional modes. Figure 10-1 depicts the simplified block

diagram of the 32-bit Timer2/3 module. Figure 10-2

and Figure 10-3 show Timer2/3 configured as two

independent 16-bit timers, Timer2 and Timer3,

respectively.

The Timer2/3 module is a 32-bit timer (which can be

configured as two 16-bit timers) with selectable

Operating modes. These timers are utilized by other

peripheral modules, such as:

• Input Capture

• Output Compare/Simple PWM

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated block diagrams for the Operational modes of the

timers.

The 32-bit timer has the following modes:

• Two independent 16-bit timers (Timer2 and

Timer3) with all 16-bit Operating modes (except

Asynchronous Counter mode)

• Single 32-bit timer operation

• Single 32-bit synchronous counter

Further, the following operational characteristics are

supported:

• ADC event trigger

• Timer gate operation

• Selectable prescaler settings

• Timer operation during Idle and Sleep modes

• Interrupt on a 32-bit period register match

These Operating modes are determined by setting the

appropriate bit(s) in the 16-bit T2CON and T3CON

SFRs.

For 32-bit timer/counter operation, Timer2 is the LS

Word and Timer3 is the MS Word of the 32-bit timer.

16-bit Timer Mode: In the 16-bit mode, Timer2 and

Timer3 can be configured as two independent 16-bit

timers. Each timer can be set up in either 16-bit Timer

mode or 16-bit Synchronous Counter mode. See

Section 9.0, Timer1 Module for details on these two

Operating modes.

The only functional difference between Timer2 and

Timer3 is that Timer2 provides synchronization of the

clock prescaler output. This is useful for high frequency

external clock inputs.

32-bit Timer Mode: In the 32-bit Timer mode, the timer

increments on every instruction cycle, up to a match

value preloaded into the combined 32-bit Period

count.

For synchronous 32-bit reads of the Timer2/Timer3

pair, reading the LS Word (TMR2 register) will cause

the MS word to be read and latched into a 16-bit

holding register, termed TMR3HLD.

For synchronous 32-bit writes, the holding register

(TMR3HLD) must first be written to. When followed by

a write to the TMR2 register, the contents of TMR3HLD

will be transferred and latched into the MSB of the

32-bit timer (TMR3).

32-bit Synchronous Counter Mode: In the 32-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in the

combined 32-bit period register PR3/PR2, then resets

to ‘0’ and continues.

When the timer is configured for the Synchronous

Counter mode of operation and the CPU goes into the

Idle mode, the timer will stop incrementing unless the

TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer

module logic will resume the incrementing sequence

upon termination of the CPU Idle mode.

Note: For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits

are used for setup and control. Timer2

clock and gate inputs are utilized for the

32-bit timer module but an interrupt is gen-

erated with the Timer3 interrupt flag (T3IF)

and the interrupt is enabled with the

Timer3 interrupt enable bit (T3IE).

dsPIC30F

DS70083C-page 82 Advance Information  2003 Microchip Technology Inc.

FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM

TMR3 TMR2

T3IF

Equal Comparator x 32

PR3 PR2

Reset

LSB MSB

Event Flag

Note: Timer configuration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T2CON register.

Data Bus<15:0>

Read TMR2

Write TMR2 16

TGATE (T2CON<6>)

(T2CON<6>)

TGATE

TON

TCKPS<1:0>

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

ADC Event Trigger

Sync

TMR3HLD

Prescaler

1, 8, 64, 256

 2003 Microchip Technology Inc. Advance Information DS70083C-page 83

dsPIC30F

FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM

FIGURE 10-3: 16-BIT TIMER3 BLOCK DIAGRAM

TON

Sync

PR2

T2IF

Equal Comparator x 16

TMR2

Reset

Event Flag TGATE

TCKPS<1:0>

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

Prescaler

1, 8, 64, 256

TON

PR3

T3IF

Equal

Comparator x 16

TMR3

Reset

Event Flag TGATE

TCKPS<1:0>

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

T3CK

ADC Event Trigger

Sync

Prescaler

1, 8, 64, 256

dsPIC30F

DS70083C-page 84 Advance Information  2003 Microchip Technology Inc.

10.1 Timer Gate Operation

The 32-bit timer can be placed in the Gated Time Accu-

mulation mode. This mode allows the internal TCY to

increment the respective timer when the gate input sig-

nal (T2CK pin) is asserted high. Control bit TGATE

(T2CON<6>) must be set to enable this mode. When in

this mode, Timer2 is the originating clock source. The

TGATE setting is ignored for Timer3. The timer must be

enabled (TON = 1) and the timer clock source set to

internal (TCS = 0).

The falling edge of the external signal terminates the

count operation but does not reset the timer. The user

must reset the timer in order to start counting from zero.

10.2 ADC Event Trigger

When a match occurs between the 32-bit timer (TMR3/

TMR2) and the 32-bit combined period register (PR3/

PR2), a special ADC trigger event signal is generated

by Timer3.

10.3 Timer Prescaler

The input clock (FOSC/4 or external clock) to the timer

has a prescale option of 1:1, 1:8, 1:64, and 1:256,

selected by control bits TCKPS<1:0> (T2CON<5:4>

and T3CON<5:4>). For the 32-bit timer operation, the

originating clock source is Timer2. The prescaler oper-

ation for Timer3 is not applicable in this mode. The

prescaler counter is cleared when any of the following

occurs:

• a write to the TMR2/TMR3 register

• clearing either of the TON (T2CON<15> or

T3CON<15>) bits to ‘0’

• device Reset, such as POR and BOR

However, if the timer is disabled (TON = 0), then the

Timer 2 prescaler cannot be reset since the prescaler

clock is halted.

TMR2/TMR3 is not cleared when T2CON/T3CON is

written.

10.4 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

10.5 Timer Interrupt

The 32-bit timer module can generate an interrupt on

period match or on the falling edge of the external gate

signal. When the 32-bit timer count matches the

respective 32-bit period register, or the falling edge of

the external “gate” signal is detected, the T3IF bit

(IFS0<7>) is asserted and an interrupt will be gener-

ated if enabled. In this mode, the T3IF interrupt flag is

used as the source of the interrupt. The T3IF bit must

be cleared in software.

Enabling an interrupt is accomplished via the

respective timer interrupt enable bit, T3IE (IEC0<7>).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 85

dsPIC30F

TABLE 10-1: TIMER2/3 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu

TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu

TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu

PR2 010C Period Register 2 1111 1111 1111 1111

PR3 010E Period Register 3 1111 1111 1111 1111

T2CON 0110 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000 0000 0000 0000

T3CON 0112 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 86 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 87

dsPIC30F

11.0 TIMER4/5 MODULE

This section describes the second 32-bit General Pur-

pose (GP) Timer module (Timer4/5) and associated

Operational modes. Figure 11-1 depicts the simplified

block diagram of the 32-bit Timer4/5 module.

Figure 11-2 and Figure 11-3 show Timer4/5 configured

as two independent 16-bit timers, Timer4 and Timer5,

respectively.

The Timer4/5 module is similar in operation to the

Timer2/3 module. However, there are some differences

which are listed below:

• The Timer4/5 module does not support the ADC

event trigger feature

• Timer4/5 can not be utilized by other peripheral

modules, such as input capture and

output compare

The Operating modes of the Timer4/5 module are

determined by setting the appropriate bit(s) in the

16-bit T4CON and T5CON SFRs.

For 32-bit timer/counter operation, Timer4 is the LS

Word and Timer5 is the MS Word of the 32-bit timer.

FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM

Note: For 32-bit timer operation, T5CON control

bits are ignored. Only T4CON control bits

are used for setup and control. Timer4

clock and gate inputs are utilized for the

32-bit timer module but an interrupt is gen-

erated with the Timer5 interrupt flag (T5IF)

and the interrupt is enabled with the

Timer5 interrupt enable bit (T5IE).

TMR5 TMR4

T5IF

Equal Comparator x 32

PR5 PR4

Reset

LSB

MSB

Event Flag

Note: Timer configuration bit T32 (T4CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T4CON register.

Data Bus<15:0>

TMR5HLD

Read TMR4

Write TMR4 16

TGATE (T4CON<6>)

(T4CON<6>)

TGATE

TON

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T4CK

Sync

dsPIC30F

DS70083C-page 88 Advance Information  2003 Microchip Technology Inc.

FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM

FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM

TON

Sync

PR4

T4IF

Equal Comparator x 16

TMR4

Reset

Event Flag TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T4CK

Sync

TON

PR5

T5IF

Equal Comparator x 16

TMR5

Reset

Event Flag TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

T5CK

ADC Event Trigger

Sync

 2003 Microchip Technology Inc. Advance Information DS70083C-page 89

dsPIC30F

TABLE 11-1: TIMER4/5 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR4 0114 Timer 4 Register uuuu uuuu uuuu uuuu

TMR5HLD 0116 Timer 5 Holding Register (for 32-bit operations only) uuuu uuuu uuuu uuuu

TMR5 0118 Timer 5 Register uuuu uuuu uuuu uuuu

PR4 011A Period Register 4 1111 1111 1111 1111

PR5 011C Period Register 5 1111 1111 1111 1111

T4CON 011E TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T45 —TCS —0000 0000 0000 0000

T5CON 0120 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000 0000 0000 0000

Legend: u = uninitialized

dsPIC30F

DS70083C-page 90 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 91

dsPIC30F

12.0 INPUT CAPTURE MODULE

This section describes the input capture module and

associated Operational modes. The features provided

by this module are useful in applications requiring fre-

quency (period) and pulse measurement. Figure 12-1

depicts a block diagram of the input capture module.

Input capture is useful for such modes as:

• Frequency/Period/Pulse Measurements

• Additional Sources of External Interrupts

The key operational features of the input capture

module are:

• Simple Capture Event mode

• Timer2 and Timer3 mode selection

• Interrupt on input capture event

These Operating modes are determined by setting the

appropriate bits in the ICxCON register (where

x = 1,2,...,N). The dsPIC devices contain up to 8

capture channels (i.e., the maximum value of N is 8).

FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM

12.1 Simple Capture Event Mode

The simple capture events in the dsPIC30F product

family are:

• Capture every falling edge

• Capture every rising edge

• Capture every 4th rising edge

• Capture every 16th rising edge

• Capture every rising and falling edge

These simple Input Capture modes are configured by

setting the appropriate bits ICM<2:0> (ICxCON<2:0>).

12.1.1 CAPTURE PRESCALER

There are four input capture prescaler settings speci-

fied by bits ICM<2:0> (ICxCON<2:0>). Whenever the

capture channel is turned off, the prescaler counter will

be cleared. In addition, any Reset will clear the

prescaler counter.

ICxBUF

Prescaler

ICx pin

ICM<2:0>

Mode Select

Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture

channels 1 through N.

Set Flag

ICxIF

ICTMR

T2_CNT T3_CNT

Edge

Detection

Logic

Clock

Synchronizer

1, 4, 16

From GP Timer Module

16 16

FIFO

R/W

Logic

ICI<1:0>

ICBNE, ICOV

ICxCON Interrupt

Logic

Set Flag

ICxIF

Data Bus

dsPIC30F

DS70083C-page 92 Advance Information  2003 Microchip Technology Inc.

12.1.2 CAPTURE BUFFER OPERATION

Each capture channel has an associated FIFO buffer

which is four 16-bit words deep. There are two status

flags which provide status on the FIFO buffer:

• ICBFNE - Input Capture Buffer Not Empty

• ICOV - Input Capture Overflow

The ICBFNE will be set on the first input capture event

and remain set until all capture events have been read

from the FIFO. As each word is read from the FIFO, the

remaining words are advanced by one position within

the buffer.

In the event that the FIFO is full with four capture

events and a fifth capture event occurs prior to a read

of the FIFO, an overflow condition will occur and the

ICOV bit will be set to a logic ‘1’. The fifth capture event

is lost and is not stored in the FIFO. No additional

events will be captured until all four events have been

read from the buffer.

If a FIFO read is performed after the last read and no

new capture event has been received, the read will

yield indeterminate results.

12.1.3 TIMER2 AND TIMER3 SELECTION

MODE

The input capture module consists of up to 8 input cap-

ture channels. Each channel can select between one of

two timers for the time base, Timer2 or Timer3.

Selection of the timer resource is accomplished

through SFR bit, ICTMR (ICxCON<7>). Timer3 is the

default timer resource available for the input capture

module.

12.1.4 HALL SENSOR MODE

When the input capture module is set for capture on

every edge, rising and falling, ICM<2:0> = 001, the fol-

lowing operations are performed by the input capture

logic:

• The input capture interrupt flag is set on every

edge, rising and falling.

• The interrupt on Capture mode setting bits,

ICI<1:0>, is ignored since every capture

generates an interrupt.

• A capture overflow condition is not generated in

this mode.

12.2 Input Capture Operation During

Sleep and Idle Modes

An input capture event will generate a device wake-up

or interrupt, if enabled, if the device is in CPU Idle or

Sleep mode.

Independent of the timer being enabled, the input cap-

ture module will wake-up from the CPU Sleep or Idle

mode when a capture event occurs if ICM<2:0> = 111

and the interrupt enable bit is asserted. The same wake-

up can generate an interrupt if the conditions for pro-

cessing the interrupt have been satisfied. The wake-up

feature is useful as a method of adding extra external pin

interrupts.

12.2.1 INPUT CAPTURE IN CPU SLEEP

MODE

CPU Sleep mode allows input capture module opera-

tion with reduced functionality. In the CPU Sleep mode,

the ICI<1:0> bits are not applicable and the input cap-

ture module can only function as an external interrupt

source.

The capture module must be configured for interrupt

only on rising edge (ICM<2:0> = 111) in order for the

input capture module to be used while the device is in

Sleep mode. The prescale settings of 4:1 or 16:1 are

not applicable in this mode.

12.2.2 INPUT CAPTURE IN CPU IDLE

MODE

CPU Idle mode allows input capture module operation

with full functionality. In the CPU Idle mode, the Inter-

rupt mode selected by the ICI<1:0> bits is applicable,

as well as the 4:1 and 16:1 capture prescale settings

which are defined by control bits ICM<2:0>. This mode

requires the selected timer to be enabled. Moreover,

the ICSIDL bit must be asserted to a logic ‘0’.

If the input capture module is defined as

ICM<2:0> = 111 in CPU Idle mode, the input capture

pin will serve only as an external interrupt pin.

12.3 Input Capture Interrupts

The input capture channels have the ability to generate

an interrupt based upon the selected number of cap-

ture events. The selection number is set by control bits

ICI<1:0> (ICxCON<6:5>).

Each channel provides an interrupt flag (ICxIF) bit. The

respective capture channel interrupt flag is located in

the corresponding IFSx Status register.

Enabling an interrupt is accomplished via the respec-

tive capture channel interrupt enable (ICxIE) bit. The

capture interrupt enable bit is located in the

corresponding IEC Control register.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 93

dsPIC30F

TABLE 12-1: INPUT CAPTURE REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu

IC1CON 0142 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu

IC2CON 0146 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu

IC3CON 014A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu

IC4CON 014E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC5BUF 0150 Input 5 Capture Register uuuu uuuu uuuu uuuu

IC5CON 0152 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC6BUF 0154 Input 6 Capture Register uuuu uuuu uuuu uuuu

IC6CON 0156 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu

IC7CON 015A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu

IC8CON 015E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 94 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 95

dsPIC30F

13.0 OUTPUT COMPARE MODULE

This section describes the output compare module and

associated Operational modes. The features provided

by this module are useful in applications requiring

Operational modes, such as:

• Generation of Variable Width Output Pulses

• Power Factor Correction

Figure 13-1 depicts a block diagram of the output

compare module.

The key operational features of the output compare

module include:

• Timer2 and Timer3 Selection mode

• Simple Output Compare Match mode

• Dual Output Compare Match mode

• Simple PWM mode

• Output Compare During Sleep and Idle modes

• Interrupt on Output Compare/PWM Event

These Operating modes are determined by setting the

appropriate bits in the 16-bit OCxCON SFR (where

x = 1,2,3,...,N). The dsPIC devices contain up to 8

compare channels (i.e., the maximum value of N is 8).

OCxRS and OCxR in Figure 13-1 represent the Dual

Compare registers. In the Dual Compare mode, the

OCxR register is used for the first compare and OCxRS

is used for the second compare.

FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM

OCxR

Comparator

Output

Logic

OCM<2:0>

Output OCx

Set Flag bit

OCxIF

OCxRS

Mode Select

Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare

channels 1 through N.

OCFA

OCTSEL 01

T2P2_MATCHTMR2<15:0 TMR3<15:0> T3P3_MATCH

From GP

(for x = 1, 2, 3 or 4)

or OCFB

(for x = 5, 6, 7 or 8)

Timer Module

Enable

dsPIC30F

DS70083C-page 96 Advance Information  2003 Microchip Technology Inc.

13.1 Timer2 and Timer3 Selection Mode

Each output compare channel can select between one

of two 16-bit timers, Timer2 or Timer3.

The selection of the timers is controlled by the OCTSEL

bit (OCxCON<3>). Timer2 is the default timer resource

for the output compare module.

13.2 Simple Output Compare Match

Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 001,

010 or 011, the selected output compare channel is

configured for one of three simple Output Compare

Match modes:

• Compare forces I/O pin low

• Compare forces I/O pin high

• Compare toggles I/O pin

The OCxR register is used in these modes. The OCxR

selected incrementing timer count. When a compare

occurs, one of these Compare Match modes occurs. If

the counter resets to zero before reaching the value in

OCxR, the state of the OCx pin remains unchanged.

13.3 Dual Output Compare Match Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 100

or 101, the selected output compare channel is config-

ured for one of two Dual Output Compare modes,

which are:

• Single Output Pulse mode

• Continuous Output Pulse mode

13.3.1 SINGLE PULSE MODE

For the user to configure the module for the generation

of a single output pulse, the following steps are

required (assuming timer is off):

• Determine instruction cycle time TCY.

• Calculate desired pulse width value based on TCY.

• Calculate time to start pulse from timer start value

of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS Compare registers (x denotes

channel 1, 2, ...,N).

• Set Timer Period register to value equal to, or

greater than value in OCxRS Compare register.

• Set OCM<2:0> = 100.

• Enable timer, TON (TxCON<15>) = 1.

To initiate another single pulse, issue another write to

set OCM<2:0> = 100.

13.3.2 CONTINUOUS PULSE MODE

For the user to configure the module for the generation

of a continuous stream of output pulses, the following

steps are required:

• Determine instruction cycle time TCY.

• Calculate desired pulse value based on TCY.

• Calculate timer to start pulse width from timer start

value of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS (x denotes channel 1, 2, ...,N)

Compare registers, respectively.

• Set Timer Period register to value equal to, or

greater than value in OCxRS Compare register.

• Set OCM<2:0> = 101.

• Enable timer, TON (TxCON<15>) = 1.

13.4 Simple PWM Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 110

or 111, the selected output compare channel is config-

ured for the PWM mode of operation. When configured

for the PWM mode of operation, OCxR is the main latch

(read only) and OCxRS is the secondary latch. This

enables glitchless PWM transitions.

The user must perform the following steps in order to

configure the output compare module for PWM

operation:

1. Set the PWM period by writing to the appropriate

period register.

2. Set the PWM duty cycle by writing to the OCxRS

3. Configure the output compare module for PWM

operation.

4. Set the TMRx prescale value and enable the

Timer, TON (TxCON<15>) = 1.

13.4.1 INPUT PIN FAULT PROTECTION

FOR PWM

When control bits OCM<2:0> (OCxCON<2:0>) = 111,

the selected output compare channel is again config-

ured for the PWM mode of operation with the additional

feature of input FAULT protection. While in this mode,

if a logic ‘0’ is detected on the OCFA/B pin, the respec-

tive PWM output pin is placed in the high impedance

input state. The OCFLT bit (OCxCON<4>) indicates

whether a FAULT condition has occurred. This state will

be maintained until both of the following events have

occurred:

• The external FAULT condition has been removed.

• The PWM mode has been re-enabled by writing

to the appropriate control bits.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 97

dsPIC30F

13.4.2 PWM PERIOD

The PWM period is specified by writing to the PRx

Equation 13-1.

EQUATION 13-1:

PWM frequency is defined as 1 / [PWM period].

When the selected TMRx is equal to its respective

period register, PRx, the following four events occur on

the next increment cycle:

• TMRx is cleared.

• The OCx pin is set.

- Exception 1: If PWM duty cycle is 0x0000,

the OCx pin will remain low.

- Exception 2: If duty cycle is greater than PRx,

the pin will remain high.

• The PWM duty cycle is latched from OCxRS into

OCxR.

• The corresponding timer interrupt flag is set.

See Figure 13-2 for key PWM period comparisons.

Timer3 is referred to in Figure 13-2 for clarity.

FIGURE 13-2: PWM OUTPUT TIMING

13.5 Output Compare Operation During

CPU Sleep Mode

When the CPU enters Sleep mode, all internal clocks

are stopped. Therefore, when the CPU enters the

Sleep state, the output compare channel will drive the

pin to the active state that was observed prior to

entering the CPU Sleep state.

For example, if the pin was high when the CPU entered

the Sleep state, the pin will remain high. Likewise, if the

pin was low when the CPU entered the Sleep state, the

pin will remain low. In either case, the output compare

module will resume operation when the device wakes

up.

13.6 Output Compare Operation During

CPU Idle Mode

When the CPU enters the Idle mode, the output

compare module can operate with full functionality.

The output compare channel will operate during the

CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at

logic ‘0’ and the selected time base (Timer2 or Timer3)

is enabled and the TSIDL bit of the selected timer is set

to logic ‘0’.

13.7 Output Compare Interrupts

The output compare channels have the ability to gener-

ate an interrupt on a compare match, for whichever

Match mode has been selected.

For all modes except the PWM mode, when a compare

event occurs, the respective interrupt flag (OCxIF) is

asserted and an interrupt will be generated if enabled.

The OCxIF bit is located in the corresponding IFS

Status register and must be cleared in software. The

interrupt is enabled via the respective compare inter-

rupt enable (OCxIE) bit located in the corresponding

IEC Control register.

For the PWM mode, when an event occurs, the respec-

tive timer interrupt flag (T2IF or T3IF) is asserted and

an interrupt will be generated if enabled. The IF bit is

located in the IFS0 Status register and must be cleared

in software. The interrupt is enabled via the respective

timer interrupt enable bit (T2IE or T3IE) located in the

IEC0 Control register. The output compare interrupt

flag is never set during the PWM mode of operation.

PWM period = [(PRx) + 1] • 4 • TOSC •

(TMRx prescale value)

Period

Duty Cycle

TMR3 = Duty Cycle TMR3 = Duty Cycle

TMR3 = PR3

T3IF = 1

(Interrupt Flag)

OCxR = OCxRS

TMR3 = PR3

(Interrupt Flag)

OCxR = OCxRS

T3IF = 1

(OCxR) (OCxR)

dsPIC30F

DS70083C-page 98 Advance Information  2003 Microchip Technology Inc.

TABLE 13-1: OUTPUT COMPARE REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000

OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000

OC1CON 0184 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000

OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000

OC2CON 018A ——OCSIDL— — — — — — — — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000

OC3RS 018C Output Compare 3 Secondary Register 0000 0000 0000 0000

OC3R 018E Output Compare 3 Main Register 0000 0000 0000 0000

OC3CON 0190 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC4RS 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000

OC4R 0194 Output Compare 4 Main Register 0000 0000 0000 0000

OC4CON 0196 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC5RS 0198 Output Compare 5 Secondary Register 0000 0000 0000 0000

OC5R 019A Output Compare 5 Main Register 0000 0000 0000 0000

OC5CON 019C ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC6RS 019E Output Compare 6 Secondary Register 0000 0000 0000 0000

OC6R 01A0 Output Compare 6 Main Register 0000 0000 0000 0000

OC6CON 01A2 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC7RS 01A4 Output Compare 7 Secondary Register 0000 0000 0000 0000

OC7R 01A6 Output Compare 7 Main Register 0000 0000 0000 0000

OC7CON 01A8 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC8RS 01AA Output Compare 8 Secondary Register 0000 0000 0000 0000

OC8R 01AC Output Compare 8 Main Register 0000 0000 0000 0000

OC8CON 01AE ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

 2003 Microchip Technology Inc. Advance Information DS70083C-page 99

dsPIC30F

14.0 SPI MODULE

The Serial Peripheral Interface (SPI) module is a syn-

chronous serial interface. It is useful for communicating

with other peripheral devices, such as EEPROMs, shift

registers, display drivers and A/D converters, or other

microcontrollers. It is compatible with Motorola's SPI™

and SIOP interfaces.

14.1 Operating Function Description

Each SPI module consists of a 16-bit shift register,

SPIxSR (where x = 1 or 2), used for shifting data in and

out, and a buffer register, SPIxBUF. A control register,

SPIxCON, configures the module. Additionally, a status

The serial interface consists of 4 pins: SDIx (serial data

input), SDOx (serial data output), SCKx (shift clock

input or output), and SSx (active low slave select).

In Master mode operation, SCK is a clock output but in

Slave mode, it is a clock input.

A series of eight (8) or sixteen (16) clock pulses shift

out bits from the SPIxSR to SDOx pin and simulta-

neously shift in data from SDIx pin. An interrupt is gen-

erated when the transfer is complete and the

corresponding interrupt flag bit (SPI1IF or SPI2IF) is

set. This interrupt can be disabled through an interrupt

enable bit (SPI1IE or SPI2IE).

The receive operation is double-buffered. When a com-

plete byte is received, it is transferred from SPIxSR to

SPIxBUF.

If the receive buffer is full when new data is being trans-

ferred from SPIxSR to SPIxBUF, the module will set the

SPIROV bit indicating an overflow condition. The trans-

fer of the data from SPIxSR to SPIxBUF will not be

completed and the new data will be lost. The module

will not respond to SCL transitions while SPIROV is ‘1’,

effectively disabling the module until SPIxBUF is read

by user software.

Transmit writes are also double-buffered. The user

writes to SPIxBUF. When the master or slave transfer

is completed, the contents of the shift register (SPIxSR)

are moved to the receive buffer. If any transmit data has

been written to the buffer register, the contents of the

transmit buffer are moved to SPIxSR. The received

data is thus placed in SPIxBUF and the transmit data in

SPIxSR is ready for the next transfer.

In Master mode, the clock is generated by prescaling

the system clock. Data is transmitted as soon as a

value is written to SPIxBUF. The interrupt is generated

at the middle of the transfer of the last bit.

In Slave mode, data is transmitted and received as

external clock pulses appear on SCK. Again, the inter-

rupt is generated when the last bit is latched. If SSx

control is enabled, then transmission and reception are

enabled only when SSx = low. The SDOx output will be

disabled in SSx mode with SSx high.

The clock provided to the module is (FOSC/4). This

clock is then prescaled by the primary (PPRE<1:0>)

and the secondary (SPRE<2:0>) prescale factors. The

CKE bit determines whether transmit occurs on transi-

tion from active clock state to Idle clock state, or vice

versa. The CKP bit selects the Idle state (high or low)

for the clock.

14.1.1 WORD AND BYTE

COMMUNICATION

A control bit, MODE16 (SPIxCON<10>), allows the

module to communicate in either 16-bit or 8-bit mode.

16-bit operation is identical to 8-bit operation except

that the number of bits transmitted is 16 instead of 8.

The user software must disable the module prior to

changing the MODE16 bit. The SPI module is reset

when the MODE16 bit is changed by the user.

A basic difference between 8-bit and 16-bit operation is

that the data is transmitted out of bit 7 of the SPIxSR for

8-bit operation, and data is transmitted out of bit15 of

the SPIxSR for 16-bit operation. In both modes, data is

shifted into bit 0 of the SPIxSR.

14.1.2 SDOx DISABLE

A control bit, DISSDO, is provided to the SPIxCON reg-

ister to allow the SDOx output to be disabled. This will

allow the SPI module to be connected in an input only

configuration. SDO can also be used for general

purpose I/O.

14.2 Framed SPI Support

The module supports a basic framed SPI protocol in

Master or Slave mode. The control bit FRMEN enables

framed SPI support and causes the SSx pin to perform

the frame synchronization pulse (FSYNC) function.

The control bit SPIFSD determines whether the SSx

pin is an input or an output (i.e., whether the module

receives or generates the frame synchronization

pulse). The frame pulse is an active high pulse for a

single SPI clock cycle. When frame synchronization is

enabled, the data transmission starts only on the

subsequent transmit edge of the SPI clock.

Note: Both the transmit buffer (SPIxTXB) and

the receive buffer (SPIxRXB) are mapped

to the same register address, SPIxBUF.

dsPIC30F

DS70083C-page 100 Advance Information  2003 Microchip Technology Inc.

FIGURE 14-1: SPI BLOCK DIAGRAM

FIGURE 14-2: SPI MASTER/SLAVE CONNECTION

Note: x = 1 or 2.

Read Write

Internal

Data Bus

SDIx

SDOx

SSx

SCKx

SPIxSR

SPIxBUF

bit 0

Shift

Clock

Edge

Select

FOSC

Primary

1, 4, 16, 64

Enable Master Clock

Prescaler

Secondary

Prescaler

1,2,4,6,8

SS & FSYNC

Control

Clock

Control

Transmit

SPIxBUF

Receive

Serial Input Buffer

(SPIxBUF)

Shift Register

(SPIxSR)

MSb LSb

SDOx

SDIx

PROCESSOR 1

SCKx

SPI Master

Serial Input Buffer

(SPIyBUF)

Shift Register

(SPIySR)

LSb

MSb

SDIy

SDOy

PROCESSOR 2

SCKy

SPI Slave

Serial Clock

Note: x = 1 or 2, y = 1 or 2.

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14.3 Slave Select Synchronization

The SSx pin allows a Synchronous Slave mode. The

SPI must be configured in SPI Slave mode with SSx pin

control enabled (SSEN = 1). When the SSx pin is low,

transmission and reception are enabled and the SDOx

pin is driven. When SSx pin goes high, the SDOx pin is

no longer driven. Also, the SPI module is re-

synchronized, and all counters/control circuitry are

reset. Therefore, when the SSx pin is asserted low

again, transmission/reception will begin at the MS bit

even if SSx had been de-asserted in the middle of a

transmit/receive.

14.4 SPI Operation During CPU Sleep

Mode

During Sleep mode, the SPI module is shutdown. If the

CPU enters Sleep mode while an SPI transaction is in

progress, then the transmission and reception is

aborted.

The transmitter and receiver will stop in Sleep mode.

However, register contents are not affected by entering

or exiting Sleep mode.

14.5 SPI Operation During CPU Idle

Mode

When the device enters Idle mode, all clock sources

remain functional. The SPISIDL bit (SPIxSTAT<13>)

selects if the SPI module will stop or continue on Idle. If

SPISIDL = 0, the module will continue to operate when

the CPU enters Idle mode. If SPISIDL = 1, the module

will stop when the CPU enters Idle mode.

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DS70083C-page 102 Advance Information  2003 Microchip Technology Inc.

TABLE 14-1: SPI1 REGISTER MAP

TABLE 14-2: SPI2 REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

SPI1STAT 0220 SPIEN — SPISIDL — — — — — —SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000

SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

SPI2STAT 0226 SPIEN — SPISIDL — — — — — —SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000

SPI2CON 0228 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI2BUF 022A Transmit and Receive Buffer 0000 0000 0000 0000

Legend: u = uninitialized bit

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15.0 I2C MODULE

The Inter-Integrated Circuit (I2CTM) module provides

complete hardware support for both Slave and Multi-

Master modes of the I2C serial communication

standard, with a 16-bit interface.

This module offers the following key features:

•I

2C interface supporting both master and slave

operation.

•I

2C Slave mode supports 7 and 10-bit address.

•I

2C Master mode supports 7 and 10-bit address.

•I

2C port allows bidirectional transfers between

master and slaves.

• Serial clock synchronization for I2C port can be

used as a handshake mechanism to suspend and

resume serial transfer (SCLREL control).

•I

2C supports multi-master operation; detects bus

collision and will arbitrate accordingly.

15.1 Operating Function Description

The hardware fully implements all the master and slave

functions of the I2C Standard and Fast mode

specifications, as well as 7 and 10-bit addressing.

Thus, the I2C module can operate either as a slave or

a master on an I2C bus.

15.1.1 VARIOUS I2C MODES

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit address

•I

2C slave operation with 10-bit address

•I

2C master operation with 7 or 10-bit address

See the I2C programmer’s model in Figure 15-1.

FIGURE 15-1: PROGRAMMER’S MODEL

15.1.2 PIN CONFIGURATION IN I2C MODE

I2C has a 2-pin interface: the SCL pin is clock and the

SDA pin is data.

15.1.3 I2C REGISTERS

I2CCON and I2CSTAT are control and status registers,

respectively. The I2CCON register is readable and writ-

able. The lower 6 bits of I2CSTAT are read only. The

remaining bits of the I2CSTAT are read/write.

I2CRSR is the shift register used for shifting data,

whereas I2CRCV is the buffer register to which data

bytes are written, or from which data bytes are read.

I2CRCV is the receive buffer as shown in Figure 15-1.

I2CTRN is the transmit register to which bytes are

written during a transmit operation, as shown in

Figure 15-2.

The I2CADD register holds the slave address. A status

bit, ADD10, indicates 10-bit Address mode. The

I2CBRG acts as the baud rate generator reload value.

In receive operations, I2CRSR and I2CRCV together

form a double-buffered receiver. When I2CRSR

receives a complete byte, it is transferred to I2CRCV

and an interrupt pulse is generated. During

transmission, the I2CTRN is not double-buffered.

Bit 7 Bit 0

I2CRCV (8 bits)

Bit 7 Bit 0

I2CTRN (8 bits)

Bit 8 Bit 0

I2CBRG (9 bits)

Bit 15 Bit 0

I2CCON (16 bits)

Bit 15 Bit 0

I2CSTAT (16 bits)

Bit 9 Bit 0

I2CADD (10 bits)

Note: Following a RESTART condition in 10-bit

mode, the user only needs to match the

first 7-bit address.

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DS70083C-page 104 Advance Information  2003 Microchip Technology Inc.

FIGURE 15-2: I2C BLOCK DIAGRAM

I2CRSR

I2CRCV

Internal

Data Bus

SCL

SDA

Shift

Match Detect

I2CADD

Start and

Stop bit Detect

Clock

Addr_Match

Clock

Stretching

I2CTRN

LSB

Shift

Clock

Write

Read

BRG Down I2CBRG

Reload

Control

FOSC

Start, RESTART,

Stop bit Generate

Write

Read

Acknowledge

Generation

Collision

Detect

Write

Read

Write

Read

I2CCON

Write

Read

I2CSTAT

Control Logic

Read

LSB

Counter

 2003 Microchip Technology Inc. Advance Information DS70083C-page 105

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15.2 I2C Module Addresses

The I2CADD register contains the Slave mode

addresses. The register is a 10-bit register.

If the A10M bit (I2CCON<10>) is ‘0’, the address is

interpreted by the module as a 7-bit address. When an

address is received, it is compared to the 7 LS bits of

the I2CADD register.

If the A10M bit is ‘1’, the address is assumed to be a

10-bit address. When an address is received, it will be

compared with the binary value ‘11110 A9 A8’ (where

A9 and A8 are two Most Significant bits of I2CADD). If

that value matches, the next address will be compared

with the Least Significant 8 bits of I2CADD, as specified

in the 10-bit addressing protocol.

15.3 I2C 7-bit Slave Mode Operation

Once enabled (I2CEN = 1), the slave module will wait

for a Start bit to occur (i.e., the I2C module is ‘Idle’). Fol-

lowing the detection of a Start bit, 8 bits are shifted into

I2CRSR and the address is compared against

I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>

are compared against I2CRSR<7:1> and I2CRSR<0>

is the R_W bit. All incoming bits are sampled on the ris-

ing edge of SCL.

If an address match occurs, an Acknowledgement will

be sent, and the slave event interrupt flag (SI2CIF) is

set on the falling edge of the ninth (ACK) bit. The

address match does not affect the contents of the

I2CRCV buffer or the RBF bit.

15.3.1 SLAVE TRANSMISSION

If the R_W bit received is a ‘1’, then the serial port will

go into Transmit mode. It will send ACK on the ninth bit

and then hold SCL to ‘0’ until the CPU responds by writ-

ing to I2CTRN. SCL is released by setting the SCLREL

bit, and 8 bits of data are shifted out. Data bits are

shifted out on the falling edge of SCL, such that SDA is

valid during SCL high. The interrupt pulse is sent on the

falling edge of the ninth clock pulse, regardless of the

status of the ACK received from the master.

15.3.2 SLAVE RECEPTION

If the R_W bit received is a ‘0’ during an address

match, then Receive mode is initiated. Incoming bits

are sampled on the rising edge of SCL. After 8 bits are

received, if I2CRCV is not full or I2COV is not set,

I2CRSR is transferred to I2CRCV. ACK is sent on the

ninth clock.

If the RBF flag is set, indicating that I2CRCV is still

holding data from a previous operation (RBF = 1), then

ACK is not sent; however, the interrupt pulse is gener-

ated. In the case of an overflow, the contents of the

I2CRSR are not loaded into the I2CRCV.

15.4 I2C 10-bit Slave Mode Operation

In 10-bit mode, the basic receive and transmit opera-

tions are the same as in the 7-bit mode. However, the

criteria for address match is more complex.

The I2C specification dictates that a slave must be

addressed for a write operation with two address bytes

following a Start bit.

The A10M bit is a control bit that signifies that the

address in I2CADD is a 10-bit address rather than a 7-bit

address. The address detection protocol for the first byte

of a message address is identical for 7-bit and 10-bit

messages, but the bits being compared are different.

I2CADD holds the entire 10-bit address. Upon receiv-

ing an address following a Start bit, I2CRSR <7:3> is

compared against a literal ‘11110’ (the default 10-bit

address) and I2CRSR<2:1> are compared against

I2CADD<9:8>. If a match occurs and if R_W = 0, the

interrupt pulse is sent. The ADD10 bit will be cleared to

indicate a partial address match. If a match fails or

R_W = 1, the ADD10 bit is cleared and the module

returns to the Idle state.

The low byte of the address is then received and com-

pared with I2CADD<7:0>. If an address match occurs,

the interrupt pulse is generated and the ADD10 bit is

set, indicating a complete 10-bit address match. If an

address match did not occur, the ADD10 bit is cleared

and the module returns to the Idle state.

15.4.1 10-BIT MODE SLAVE

TRANSMISSION

Once a slave is addressed in this fashion with the full

10-bit address (we will refer to this state as

“PRIOR_ADDR_MATCH”), the master can begin

sending data bytes for a slave reception operation.

15.4.2 10-BIT MODE SLAVE RECEPTION

Once addressed, the master can generate a Repeated

Start, reset the high byte of the address and set the

R_W bit without generating a Stop bit, thus initiating a

slave transmit operation.

Note: The I2CRCV will be loaded if the I2COV

bit = 1 and the RBF flag = 0. In this case,

a read of the I2CRCV was performed but

the user did not clear the state of the

I2COV bit before the next receive

occurred. The Acknowledgement is not

sent (ACK = 1) and the I2CRCV is

updated.

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DS70083C-page 106 Advance Information  2003 Microchip Technology Inc.

15.5 Automatic Clock Stretch

In the Slave modes, the module can synchronize buffer

reads and write to the master device by clock stretching.

15.5.1 TRANSMIT CLOCK STRETCHING

Both 10-bit and 7-bit Transmit modes implement clock

stretching by asserting the SCLREL bit after the falling

edge of the ninth clock, if the TBF bit is cleared, indicat-

ing the buffer is empty.

In Slave Transmit modes, clock stretching is always

performed irrespective of the STREN bit.

Clock synchronization takes place following the ninth

clock of the transmit sequence. If the device samples

an ACK on the falling edge of the ninth clock and if the

TBF bit is still clear, then the SCLREL bit is automati-

cally cleared. The SCLREL being cleared to ‘0’ will

assert the SCL line low. The user’s ISR must set the

SCLREL bit before transmission is allowed to continue.

By holding the SCL line low, the user has time to ser-

vice the ISR and load the contents of the I2CTRN

before the master device can initiate another transmit

sequence.

15.5.2 RECEIVE CLOCK STRETCHING

The STREN bit in the I2CCON register can be used to

enable clock stretching in Slave Receive mode. When

the STREN bit is set, the SCL pin will be held low at the

end of each data receive sequence.

15.5.3 CLOCK STRETCHING DURING

7-BIT ADDRESSING (STREN = 1)

When the STREN bit is set in Slave Receive mode, the

SCL line is held low when the buffer register is full. The

method for stretching the SCL output is the same for

both 7 and 10-bit Addressing modes.

Clock stretching takes place following the ninth clock of

the receive sequence. On the falling edge of the ninth

clock at the end of the ACK sequence, if the RBF bit is

set, the SCLREL bit is automatically cleared, forcing

the SCL output to be held low. The user’s ISR must set

the SCLREL bit before reception is allowed to continue.

By holding the SCL line low, the user has time to ser-

vice the ISR and read the contents of the I2CRCV

before the master device can initiate another receive

sequence. This will prevent buffer overruns from

occurring.

15.5.4 CLOCK STRETCHING DURING

10-BIT ADDRESSING (STREN = 1)

Clock stretching takes place automatically during the

addressing sequence. Because this module has a

the protocol to wait for the address to be updated.

After the address phase is complete, clock stretching

will occur on each data receive or transmit sequence as

was described earlier.

15.6 Software Controlled Clock

Stretching (STREN = 1)

When the STREN bit is ‘1’, the SCLREL bit may be

cleared by software to allow software to control the

clock stretching. The logic will synchronize writes to the

SCLREL bit with the SCL clock. Clearing the SCLREL

bit will not assert the SCL output until the module

detects a falling edge on the SCL output and SCL is

sampled low. If the SCLREL bit is cleared by the user

while the SCL line has been sampled low, the SCL out-

put will be asserted (held low). The SCL output will

remain low until the SCLREL bit is set, and all other

devices on the I2C bus have de-asserted SCL. This

ensures that a write to the SCLREL bit will not violate

the minimum high time requirement for SCL.

If the STREN bit is ‘0’, a software write to the SCLREL

bit will be disregarded and have no effect on the

SCLREL bit.

15.7 Interrupts

The I2C module generates two interrupt flags, MI2CIF

(I2C Master Interrupt Flag) and SI2CIF (I2C Slave Inter-

rupt Flag). The MI2CIF interrupt flag is activated on

completion of a master message event. The SI2CIF

interrupt flag is activated on detection of a message

directed to the slave.

Note 1: If the user loads the contents of I2CTRN,

setting the TBF bit before the falling edge

of the ninth clock, the SCLREL bit will not

be cleared and clock stretching will not

occur.

2: The SCLREL bit can be set in software,

regardless of the state of the TBF bit.

Note 1: If the user reads the contents of the

I2CRCV, clearing the RBF bit before the

falling edge of the ninth clock, the

SCLREL bit will not be cleared and clock

stretching will not occur.

2: The SCLREL bit can be set in software

regardless of the state of the RBF bit. The

user should be careful to clear the RBF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 107

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15.8 Slope Control

The I2C standard requires slope control on the SDA

and SCL signals for Fast mode (400 kHz). The control

bit, DISSLW, enables the user to disable slew rate con-

trol if desired. It is necessary to disable the slew rate

control for 1 MHz mode.

15.9 IPMI Support

The control bit, IPMIEN, enables the module to support

Intelligent Peripheral Management Interface (IPMI).

When this bit is set, the module accepts and acts upon

all addresses.

15.10 General Call Address Support

The general call address can address all devices.

When this address is used, all devices should, in

theory, respond with an Acknowledgement.

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R_W = 0.

The general call address is recognized when the Gen-

eral Call Enable (GCEN) bit is set (I2CCON<15> = 1).

Following a Start bit detection, 8 bits are shifted into

I2CRSR and the address is compared with I2CADD,

and is also compared with the general call address

which is fixed in hardware.

If a general call address match occurs, the I2CRSR is

transferred to the I2CRCV after the eighth clock, the

RBF flag is set and on the falling edge of the ninth bit

(ACK bit), the master event interrupt flag (MI2CIF) is

set.

When the interrupt is serviced, the source for the inter-

rupt can be checked by reading the contents of the

I2CRCV to determine if the address was device

specific or a general call address.

15.11 I2C Master Support

As a master device, six operations are supported:

• Assert a Start condition on SDA and SCL.

• Assert a RESTART condition on SDA and SCL.

• Write to the I2CTRN register initiating

transmission of data/address.

• Generate a Stop condition on SDA and SCL.

• Configure the I2C port to receive data.

• Generate an ACK condition at the end of a

received byte of data.

15.12 I2C Master Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the beginning of the next serial transfer, the I2C bus will

not be released.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the data direction bit. In

this case, the data direction bit (R_W) is logic ‘0’. Serial

data is transmitted 8 bits at a time. After each byte is

transmitted, an ACK bit is received. Start and Stop con-

ditions are output to indicate the beginning and the end

of a serial transfer.

In Master Receive mode, the first byte transmitted con-

tains the slave address of the transmitting device

(7 bits) and the data direction bit. In this case, the data

direction bit (R_W) is logic ‘1’. Thus, the first byte trans-

mitted is a 7-bit slave address, followed by a ‘1’ to indi-

cate receive bit. Serial data is received via SDA while

SCL outputs the serial clock. Serial data is received

8 bits at a time. After each byte is received, an ACK bit

is transmitted. Start and Stop conditions indicate the

beginning and end of transmission.

15.12.1 I2C MASTER TRANSMISSION

Transmission of a data byte, a 7-bit address, or the sec-

ond half of a 10-bit address is accomplished by simply

writing a value to I2CTRN register. The user should

only write to I2CTRN when the module is in a WAIT

state. This action will set the Buffer Full Flag (TBF) and

allow the baud rate generator to begin counting and

start the next transmission. Each bit of address/data

will be shifted out onto the SDA pin after the falling

edge of SCL is asserted. The Transmit Status Flag,

TRSTAT (I2CSTAT<14>), indicates that a master

transmit is in progress.

15.12.2 I2C MASTER RECEPTION

Master mode reception is enabled by programming the

Receive Enable bit, RCEN (I2CCON<11>). The I2C

module must be Idle before the RCEN bit is set, other-

wise the RCEN bit will be disregarded. The baud rate

generator begins counting and on each rollover, the

state of the SCL pin ACK and data are shifted into the

I2CRSR on the rising edge of each clock.

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DS70083C-page 108 Advance Information  2003 Microchip Technology Inc.

15.12.3 BAUD RATE GENERATOR

In I2C Master mode, the reload value for the BRG is

located in the I2CBRG register. When the BRG is

loaded with this value, the BRG counts down to ‘0’ and

stops until another reload has taken place. If clock arbi-

tration is taking place, for instance, the BRG is reloaded

when the SCL pin is sampled high.

As per the I2C standard, FSCK may be 100 kHz or

400 kHz. However, the user can specify any baud rate

up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.

EQUATION 15-1: SERIAL CLOCK RATE

15.12.4 CLOCK ARBITRATION

Clock arbitration occurs when the master de-asserts

the SCL pin (SCL allowed to float high) during any

receive, transmit, or RESTART/Stop condition. When

the SCL pin is allowed to float high, the baud rate gen-

erator (BRG) is suspended from counting until the SCL

pin is actually sampled high. When the SCL pin is sam-

pled high, the baud rate generator is reloaded with the

contents of I2CBRG and begins counting. This ensures

that the SCL high time will always be at least one BRG

rollover count in the event that the clock is held low by

an external device.

15.12.5 MULTI-MASTER COMMUNICATION,

BUS COLLISION, AND BUS

ARBITRATION

Multi-master operation support is achieved by bus arbi-

tration. When the master outputs address/data bits

onto the SDA pin, arbitration takes place when the

master outputs a ‘1’ on SDA by letting SDA float high

while another master asserts a ‘0’. When the SCL pin

floats high, data should be stable. If the expected data

on SDA is a ‘1’ and the data sampled on the SDA

pin = 0, then a bus collision has taken place. The

master will set the MI2CIF pulse and reset the master

portion of the I2C port to its Idle state.

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the TBF flag is

cleared, the SDA and SCL lines are de-asserted and a

value can now be written to I2CTRN. When the user

services the I2C master event Interrupt Service Rou-

tine, if the I2C bus is free (i.e., the P bit is set), the user

can resume communication by asserting a Start

condition.

If a Start, RESTART, Stop or Acknowledge condition

was in progress when the bus collision occurred, the

condition is aborted, the SDA and SCL lines are de-

asserted, and the respective control bits in the I2CCON

bus collision Interrupt Service Routine, and if the I2C

bus is free, the user can resume communication by

asserting a Start condition.

The master will continue to monitor the SDA and SCL

pins, and if a Stop condition occurs, the MI2CIF bit will

be set.

A write to the I2CTRN will start the transmission of data

at the first data bit regardless of where the transmitter

left off when bus collision occurred.

In a multi-master environment, the interrupt generation

on the detection of Start and Stop conditions allows the

determination of when the bus is free. Control of the I2C

bus can be taken when the P bit is set in the I2CSTAT

cleared.

15.13 I2C Module Operation During CPU

Sleep and Idle Modes

15.13.1 I2C OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shutdown and stay at logic ‘0’. If

Sleep occurs in the middle of a transmission and the

state machine is partially into a transmission as the

clocks stop, then the transmission is aborted. Similarly,

if Sleep occurs in the middle of a reception, then the

reception is aborted.

15.13.2 I2C OPERATION DURING CPU IDLE

MODE

For the I2C, the I2CSIDL bit selects if the module will

stop on Idle or continue on Idle. If I2CSIDL = 0, the

module will continue operation on assertion of the Idle

mode. If I2CSIDL = 1, the module will stop on Idle.

FSCK = FCY / I2CBRG

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TABLE 15-1: I2C REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

I2CRCV 0200 — — — — — — — — Receive Register 0000 0000 0000 0000

I2CTRN 0202 — — — — — — — — Transmit Register 0000 0000 1111 1111

I2CBRG 0204 — — — — — — — Baud Rate Generator 0000 0000 0000 0000

I2CCON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000

I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000

I2CADD 020A — — — — — — Address Register 0000 0000 0000 0000

Legend: u = uninitialized bit

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NOTES:

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16.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART) MODULE

This section describes the Universal Asynchronous

Receiver/Transmitter Communications module.

16.1 UART Module Overview

The key features of the UART module are:

• Full-duplex, 8 or 9-bit data communication

• Even, odd or no parity options (for 8-bit data)

• One or two Stop bits

• Fully integrated baud rate generator with 16-bit

prescaler

• Baud rates range from 38 bps to 1.875 Mbps at a

30 MHz instruction rate

• 4-word deep transmit data buffer

• 4-word deep receive data buffer

• Parity, framing and buffer overrun error detection

• Support for interrupt only on address detect

(9th bit = 1)

• Separate transmit and receive interrupts

• Loopback mode for diagnostic support

FIGURE 16-1: UART TRANSMITTER BLOCK DIAGRAM

Write Write

UTX8 UxTXREG Low Byte

Load TSR

Transmit Control

– Control TSR

– Control Buffer

– Generate Flags

– Generate Interrupt

Control and Status bits

UxTXIF

Data

‘0’ (Start)

‘1’ (Stop)

Parity Parity

Generator

Transmit Shift Register (UxTSR)

16 Divider

Control

Signals

16x Baud Clock

from Baud Rate

Generator

Internal Data Bus

UTXBRK

UxTX

Note: x = 1 or 2.

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DS70083C-page 112 Advance Information  2003 Microchip Technology Inc.

FIGURE 16-2: UART RECEIVER BLOCK DIAGRAM

Read

URX8 UxRXREG Low Byte

Load RSR

UxMODE

Receive Buffer Control

– Generate Flags

– Generate Interrupt

UxRXIF

UxRX

· Start bit Detect

Receive Shift Register

16 Divider

Control

Signals

UxSTA

– Shift Data Characters

Read Read

Write Write

to Buffer

8-9

(UxRSR)

PERR

FERR

· Parity Check

· Stop bit Detect

· Shift Clock Generation

· Wake Logic

Internal Data Bus

LPBACK

From UxTX

16x Baud Clock from

Baud Rate Generator

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16.2 Enabling and Setting Up UART

16.2.1 ENABLING THE UART

The UART module is enabled by setting the UARTEN

bit in the UxMODE register (where x = 1 or 2). Once

enabled, the UxTX and UxRX pins are configured as an

output and an input respectively, overriding the TRIS

and LATCH register bit settings for the corresponding

I/O port pins. The UxTX pin is at logic ‘1’ when no

transmission is taking place.

16.2.2 DISABLING THE UART

The UART module is disabled by clearing the UARTEN

bit in the UxMODE register. This is the default state

after any Reset. If the UART is disabled, all I/O pins

operate as port pins under the control of the latch and

TRIS bits of the corresponding port pins.

Disabling the UART module resets the buffers to empty

states. Any data characters in the buffers are lost and

the baud rate counter is reset.

All error and status flags associated with the UART

module are reset when the module is disabled. The

URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and

UTXBF bits are cleared, whereas RIDLE and TRMT

are set. Other control bits, including ADDEN,

URXISEL<1:0>, UTXISEL, as well as the UxMODE

and UxBRG registers, are not affected.

Clearing the UARTEN bit while the UART is active will

abort all pending transmissions and receptions and

reset the module as defined above. Re-enabling the

UART will restart the UART in the same configuration.

16.2.3 ALTERNATE I/O

The alternate I/O function is enabled by setting the

ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX

and UxARX pins (alternate transmit and alternate

receive pins, respectively) are used by the UART mod-

ule instead of the UxTX and UxRX pins. If ALTIO = 0,

the UxTX and UxRX pins are used by the UART

module.

16.2.4 SETTING UP DATA, PARITY AND

STOP BIT SELECTIONS

Control bits PDSEL<1:0> in the UxMODE register are

used to select the data length and parity used in the

transmission. The data length may either be 8 bits with

even, odd or no parity, or 9 bits with no parity.

The STSEL bit determines whether one or two Stop bits

will be used during data transmission.

The default (power-on) setting of the UART is 8 bits, no

parity and 1 Stop bit (typically represented as 8, N, 1).

16.3 Transmitting Data

16.3.1 TRANSMITTING IN 8-BIT DATA

MODE

The following steps must be performed in order to

transmit 8-bit data:

1. Set up the UART:

First, the data length, parity and number of Stop

bits must be selected. Then, the transmit and

receive interrupt enable and priority bits are

setup in the UxMODE and UxSTA registers.

Also, the appropriate baud rate value must be

written to the UxBRG register.

2. Enable the UART by setting the UARTEN bit

(UxMODE<15>).

3. Set the UTXEN bit (UxSTA<10>), thereby

enabling a transmission.

4. Write the byte to be transmitted to the lower byte

of UxTXREG. The value will be transferred to the

Transmit Shift register (UxTSR) immediately

and the serial bit stream will start shifting out

during the next rising edge of the baud clock.

Alternatively, the data byte may be written while

UTXEN = 0, following which, the user may set

UTXEN. This will cause the serial bit stream to

begin immediately because the baud clock will

start from a cleared state.

5. A transmit interrupt will be generated, depend-

ing on the value of the interrupt control bit

UTXISEL (UxSTA<15>).

16.3.2 TRANSMITTING IN 9-BIT DATA

MODE

The sequence of steps involved in the transmission of

9-bit data is similar to 8-bit transmission, except that a

16-bit data word (of which the upper 7 bits are always

clear) must be written to the UxTXREG register.

16.3.3 TRANSMIT BUFFER (UXTXB)

The transmit buffer is 9 bits wide and 4 characters

deep. Including the Transmit Shift register (UxTSR),

the user effectively has a 5-deep FIFO (First-In, First-

Out) buffer. The UTXBF status bit (UxSTA<9>)

indicates whether the transmit buffer is full.

If a user attempts to write to a full buffer, the new data

will not be accepted into the FIFO, and no data shift will

occur within the buffer. This enables recovery from a

buffer overrun condition.

The FIFO is reset during any device Reset but is not

affected when the device enters or wakes up from a

Power Saving mode.

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DS70083C-page 114 Advance Information  2003 Microchip Technology Inc.

16.3.4 TRANSMIT INTERRUPT

The transmit interrupt flag (U1TXIF or U2TXIF) is

located in the corresponding interrupt flag register.

The transmitter generates an edge to set the UxTXIF

bit. The condition for generating the interrupt depends

on the UTXISEL control bit:

a) If UTXISEL = 0, an interrupt is generated when

a word is transferred from the transmit buffer to

the Transmit Shift register (UxTSR). This implies

that the transmit buffer has at least one empty

word.

b) If UTXISEL = 1, an interrupt is generated when

a word is transferred from the transmit buffer to

the Transmit Shift register (UxTSR) and the

transmit buffer is empty.

Switching between the two Interrupt modes during

operation is possible and sometimes offers more

flexibility.

16.3.5 TRANSMIT BREAK

Setting the UTXBRK bit (UxSTA<11>) will cause the

UxTX line to be driven to logic ‘0’. The UTXBRK bit

overrides all transmission activity. Therefore, the user

should generally wait for the transmitter to be Idle

before setting UTXBRK.

To send a break character, the UTXBRK bit must be set

by software and must remain set for a minimum of 13

baud clock cycles. The UTXBRK bit is then cleared by

software to generate Stop bits. The user must wait for

a duration of at least one or two baud clock cycles in

order to ensure a valid Stop bit(s) before reloading the

UxTXB, or starting other transmitter activity. Transmis-

sion of a break character does not generate a transmit

interrupt.

16.4 Receiving Data

16.4.1 RECEIVING IN 8-BIT OR 9-BIT

DATA MODE

The following steps must be performed while receiving

8-bit or 9-bit data:

1. Set up the UART (see Section 16.3.1).

2. Enable the UART (see Section 16.3.1).

3. A receive interrupt will be generated when one

or more data words have been received,

depending on the receive interrupt settings

specified by the URXISEL bits (UxSTA<7:6>).

4. Read the OERR bit to determine if an overrun

error has occurred. The OERR bit must be reset

in software.

5. Read the received data from UxRXREG. The act

of reading UxRXREG will move the next word to

the top of the receive FIFO, and the PERR and

FERR values will be updated.

16.4.2 RECEIVE BUFFER (UXRXB)

The receive buffer is 4 words deep. Including the

Receive Shift register (UxRSR), the user effectively

has a 5-word deep FIFO buffer.

URXDA (UxSTA<0>) = 1 indicates that the receive

buffer has data available. URXDA = 0 implies that the

buffer is empty. If a user attempts to read an empty

buffer, the old values in the buffer will be read and no

data shift will occur within the FIFO.

The FIFO is reset during any device Reset. It is not

affected when the device enters or wakes up from a

Power Saving mode.

16.4.3 RECEIVE INTERRUPT

The receive interrupt flag (U1RXIF or U2RXIF) can be

read from the corresponding interrupt flag register. The

interrupt flag is set by an edge generated by the

receiver. The condition for setting the receive interrupt

flag depends on the settings specified by the

URXISEL<1:0> (UxSTA<7:6>) control bits.

a) If URXISEL<1:0> = 00 or 01, an interrupt is gen-

erated every time a data word is transferred

from the Receive Shift register (UxRSR) to the

receive buffer. There may be one or more

characters in the receive buffer.

b) If URXISEL<1:0> = 10, an interrupt is generated

when a word is transferred from the Receive Shift

result of the transfer, contains 3 characters.

c) If URXISEL<1:0> = 11, an interrupt is set when

a word is transferred from the Receive Shift reg-

ister (UxRSR) to the receive buffer, which as a

result of the transfer, contains 4 characters (i.e.,

becomes full).

Switching between the Interrupt modes during opera-

tion is possible, though generally not advisable during

normal operation.

16.5 Reception Error Handling

16.5.1 RECEIVE BUFFER OVERRUN

ERROR (OERR BIT)

The OERR bit (UxSTA<1>) is set if all of the following

conditions occur:

a) The receive buffer is full.

b) The Receive Shift register is full, but unable to

transfer the character to the receive buffer.

c) The Stop bit of the character in the UxRSR is

detected, indicating that the UxRSR needs to

transfer the character to the buffer.

Once OERR is set, no further data is shifted in UxRSR

(until the OERR bit is cleared in software or a Reset

occurs). The data held in UxRSR and UxRXREG

remains valid.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 115

dsPIC30F

16.5.2 FRAMING ERROR (FERR)

The FERR bit (UxSTA<2>) is set if a ‘0’ is detected

instead of a Stop bit. If two Stop bits are selected, both

Stop bits must be ‘1’, otherwise FERR will be set. The

read only FERR bit is buffered along with the received

data. It is cleared on any Reset.

16.5.3 PARITY ERROR (PERR)

The PERR bit (UxSTA<3>) is set if the parity of the

received word is incorrect. This error bit is applicable

only if a Parity mode (odd or even) is selected. The

read only PERR bit is buffered along with the received

data bytes. It is cleared on any Reset.

16.5.4 IDLE STATUS

When the receiver is active (i.e., between the initial

detection of the Start bit and the completion of the Stop

bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the com-

pletion of the Stop bit and detection of the next Start bit,

the RIDLE bit is ‘1’, indicating that the UART is Idle.

16.5.5 RECEIVE BREAK

The receiver will count and expect a certain number of

bit times based on the values programmed in the

PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)

bits.

If the break is longer than 13 bit times, the reception is

considered complete after the number of bit times

specified by PDSEL and STSEL. The URXDA bit is set,

FERR is set, zeros are loaded into the receive FIFO,

interrupts are generated if appropriate and the RIDLE

bit is set.

When the module receives a long break signal and the

receiver has detected the Start bit, the data bits and the

invalid Stop bit (which sets the FERR), the receiver

must wait for a valid Stop bit before looking for the next

Start bit. It cannot assume that the break condition on

the line is the next Start bit.

Break is regarded as a character containing all ‘0’s with

the FERR bit set. The break character is loaded into the

buffer. No further reception can occur until a Stop bit is

received. Note that RIDLE goes high when the Stop bit

has not yet been received.

16.6 Address Detect Mode

Setting the ADDEN bit (UxSTA<5>) enables this spe-

cial mode in which a 9th bit (URX8) value of ‘1’ identi-

fies the received word as an address, rather than data.

This mode is only applicable for 9-bit data communica-

tion. The URXISEL control bit does not have any

impact on interrupt generation in this mode since an

interrupt (if enabled) will be generated every time the

received word has the 9th bit set.

16.7 Loopback Mode

Setting the LPBACK bit enables this special mode in

which the UxTX pin is internally connected to the UxRX

pin. When configured for the Loopback mode, the

UxRX pin is disconnected from the internal UART

receive logic. However, the UxTX pin still functions as

in a normal operation.

To select this mode:

a) Configure UART for desired mode of operation.

b) Set LPBACK = 1 to enable Loopback mode.

c) Enable transmission as defined in Section 16.3.

16.8 Baud Rate Generator

The UART has a 16-bit baud rate generator to allow

maximum flexibility in baud rate generation. The baud

rate generator register (UxBRG) is readable and

writable. The baud rate is computed as follows:

BRG = 16-bit value held in UxBRG register

(0 through 65535)

FCY = Instruction Clock Rate (1/TCY)

The Baud Rate is given by Equation 16-1.

EQUATION 16-1: BAUD RATE

Therefore, the maximum baud rate possible is

FCY /16 (if BRG = 0),

and the minimum baud rate possible is

FCY / (16* 65536).

With a full 16-bit baud rate generator at 30 MIPs

operation, the minimum baud rate achievable is

28.5 bps.

Baud Rate = FCY / (16*(BRG+1))

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DS70083C-page 116 Advance Information  2003 Microchip Technology Inc.

16.9 Auto Baud Support

To allow the system to determine baud rates of

received characters, the input can be optionally linked

to a selected capture input. To enable this mode, the

user must program the input capture module to detect

the falling and rising edges of the Start bit.

16.10 UART Operation During CPU

Sleep and Idle Modes

16.10.1 UART OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shutdown and stay at logic ‘0’. If entry

into Sleep mode occurs while a transmission is in

progress, then the transmission is aborted. The UxTX

pin is driven to logic ‘1’. Similarly, if entry into Sleep

mode occurs while a reception is in progress, then the

reception is aborted. The UxSTA, UxMODE, transmit

and receive registers and buffers, and the UxBRG

If the WAKE bit (UxSTA<7>) is set before the device

enters Sleep mode, then a falling edge on the UxRX pin

will generate a receive interrupt. The Receive Interrupt

Select mode bit (URXISEL) has no effect for this func-

tion. If the receive interrupt is enabled, then this will

wake-up the device from Sleep. The UARTEN bit must

be set in order to generate a wake-up interrupt.

16.10.2 UART OPERATION DURING CPU

IDLE MODE

For the UART, the USIDL bit selects if the module will

stop operation when the device enters Idle mode or

whether the module will continue on Idle. If USIDL = 0,

the module will continue operation during Idle mode. If

USIDL = 1, the module will stop on Idle.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 117

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TABLE 16-1: UART1 REGISTER MAP

TABLE 16-2: UART2 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U1MODE 020C UARTEN —USIDL——ALTIO—— WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U1STA 020E UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U1TXREG 0210 — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U1RXREG 0212 — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U2MODE 0216 UARTEN —USIDL— — — — — WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U2STA 0218 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U2TXREG 021A — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U2BRG 021E Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

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DS70083C-page 118 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 119

dsPIC30F

17.0 CAN MODULE

17.1 Overview

The Controller Area Network (CAN) module is a serial

interface, useful for communicating with other CAN

modules or microcontroller devices. This interface/

protocol was designed to allow communications within

noisy environments.

The CAN module is a communication controller imple-

menting the CAN 2.0 A/B protocol, as defined in the

BOSCH specification. The module will support

CAN 1.2, CAN 2.0A, CAN 2.0B Passive, and CAN 2.0B

Active versions of the protocol. The module implemen-

tation is a full CAN system. The CAN specification is

not covered within this data sheet. The reader may

refer to the BOSCH CAN specification for further

details.

The module features are as follows:

• Implementation of the CAN protocol CAN 1.2,

CAN 2.0A and CAN 2.0B

• Standard and extended data frames

• 0-8 bytes data length

• Programmable bit rate up to 1 Mbit/sec

• Support for remote frames

• Double-buffered receiver with two prioritized

received message storage buffers (each buffer

may contain up to 8 bytes of data)

• 6 full (standard/extended identifier) acceptance

filters, 2 associated with the high priority receive

buffer and 4 associated with the low priority

receive buffer

• 2 full acceptance filter masks, one each

associated with the high and low priority receive

buffers

• Three transmit buffers with application specified

prioritization and abort capability (each buffer may

contain up to 8 bytes of data)

• Programmable wake-up functionality with

integrated low-pass filter

• Programmable Loopback mode supports self-test

operation

• Signaling via interrupt capabilities for all CAN

receiver and transmitter error states

• Programmable clock source

• Programmable link to timer module for

time-stamping and network synchronization

• Low power Sleep and Idle mode

The CAN bus module consists of a protocol engine and

message buffering/control. The CAN protocol engine

handles all functions for receiving and transmitting

messages on the CAN bus. Messages are transmitted

by first loading the appropriate data registers. Status

and errors can be checked by reading the appropriate

registers. Any message detected on the CAN bus is

checked for errors and then matched against filters to

see if it should be received and stored in one of the

receive registers.

17.2 Frame Types

The CAN module transmits various types of frames

which include data messages or remote transmission

requests initiated by the user, as other frames that are

automatically generated for control purposes. The

following frame types are supported:

• Standard Data Frame:

A standard data frame is generated by a node

when the node wishes to transmit data. It includes

an 11-bit standard identifier (SID) but not an 18-bit

extended identifier (EID).

• Extended Data Frame:

An extended data frame is similar to a standard

data frame but includes an extended identifier as

well.

• Remote Frame:

It is possible for a destination node to request the

data from the source. For this purpose, the desti-

nation node sends a remote frame with an identi-

fier that matches the identifier of the required data

frame. The appropriate data source node will then

send a data frame as a response to this remote

request.

• Error Frame:

An error frame is generated by any node that

detects a bus error. An error frame consists of 2

fields: an error flag field and an error delimiter

field.

• Overload Frame:

An overload frame can be generated by a node as

a result of 2 conditions. First, the node detects a

dominant bit during interframe space which is an

illegal condition. Second, due to internal condi-

tions, the node is not yet able to start reception of

the next message. A node may generate a maxi-

mum of 2 sequential overload frames to delay the

start of the next message.

• Interframe Space:

Interframe space separates a proceeding frame

(of whatever type) from a following data or remote

frame.

dsPIC30F

DS70083C-page 120 Advance Information  2003 Microchip Technology Inc.

FIGURE 17-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM

Acceptance Filter

RXF2

Identifier

Data Field Data Field

Identifier

Acceptance Mask

RXM1

Acceptance Filter

RXF3

Acceptance Filter

RXF4

Acceptance Filter

RXF5

Acceptance Mask

RXM0

Acceptance Filter

RXF0

Acceptance Filter

RXF1

MSGREQ

TXB2

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

Message

Queue

Control Transmit Byte Sequencer

MSGREQ

TXB1

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

MSGREQ

TXB0

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

Receive ShiftTransmit Shift

Receive

Error

Transmit

Error

Protocol

RERRCNT

TERRCNT

Err Pas

Bus Off

Finite

State

Machine

Counter

Transmit

Logic

Bit

Timing

Logic

CiTX(1) CiRX(1)

Bit Timing

Generator

PROTOCOL

ENGINE

BUFFERS

CRC Check

CRC Generator

Note 1: i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 121

dsPIC30F

17.3 Modes of Operation

The CAN module can operate in one of several Operation

modes selected by the user. These modes include:

• Initialization Mode

• Disable Mode

• Normal Operation Mode

• Listen Only Mode

• Loopback Mode

• Error Recognition Mode

Modes are requested by setting the REQOP<2:0> bits

(CiCTRL<10:8>), except the Error Recognition mode

which is requested through the RXM<1:0> bits

(CiRXnCON<6:5>, where n = 0 or 1 represents a par-

ticular receive buffer). Entry into a mode is Acknowl-

edged by monitoring the OPMODE<2:0> bits

(CiCTRL<7:5>). The module will not change the mode

and the OPMODE bits until a change in mode is

acceptable, generally during bus Idle time which is

defined as at least 11 consecutive recessive bits.

17.3.1 INITIALIZATION MODE

In the Initialization mode, the module will not transmit or

receive. The error counters are cleared and the inter-

rupt flags remain unchanged. The programmer will

have access to configuration registers that are access

restricted in other modes. The module will protect the

user from accidentally violating the CAN protocol

through programming errors. All registers which control

the configuration of the module can not be modified

while the module is on-line. The CAN module will not

be allowed to enter the Configuration mode while a

transmission is taking place. The Configuration mode

serves as a lock to protect the following registers.

• All Module Control Registers

• Baud Rate and Interrupt Configuration Registers

• Bus Timing Registers

• Identifier Acceptance Filter Registers

• Identifier Acceptance Mask Registers

17.3.2 DISABLE MODE

In Disable mode, the module will not transmit or

receive. The module has the ability to set the WAKIF bit

due to bus activity, however, any pending interrupts will

remain and the error counters will retain their value.

If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the

module will enter the Module Disable mode. If the module

is active, the module will wait for 11 recessive bits on the

CAN bus, detect that condition as an Idle bus, then

accept the module disable command. When the

OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indi-

cates whether the module successfully went into Module

Disable mode. The I/O pins will revert to normal I/O

function when the module is in the Module Disable mode.

The module can be programmed to apply a low-pass

filter function to the CiRX input line while the module or

the CPU is in Sleep mode. The WAKFIL bit

(CiCFG2<14>) enables or disables the filter.

17.3.3 NORMAL OPERATION MODE

Normal Operating mode is selected when

REQOP<2:0> = 000. In this mode, the module is acti-

vated and the I/O pins will assume the CAN bus func-

tions. The module will transmit and receive CAN bus

messages via the CxTX and CxRX pins.

17.3.4 LISTEN ONLY MODE

If the Listen Only mode is activated, the module on the

CAN bus is passive. The transmitter buffers revert to

the port I/O function. The receive pins remain inputs.

For the receiver, no error flags or Acknowledge signals

are sent. The error counters are deactivated in this

state. The Listen Only mode can be used for detecting

the baud rate on the CAN bus. To use this, it is neces-

sary that there are at least two further nodes that

communicate with each other.

17.3.5 ERROR RECOGNITION MODE

The module can be set to ignore all errors and receive

any message. The Error Recognition mode is activated

by setting the RXM<1:0> bits (CiRXnCON<6:5>) regis-

ters to ‘11’. In this mode, the data which is in the mes-

sage assembly buffer until the time an error occurred,

is copied in the receive buffer and can be read via the

CPU interface.

17.3.6 LOOPBACK MODE

If the Loopback mode is activated, the module will con-

nect the internal transmit signal to the internal receive

signal at the module boundary. The transmit and

receive pins revert to their port I/O function.

Note: Typically, if the CAN module is allowed to

transmit in a particular mode of operation

and a transmission is requested immedi-

ately after the CAN module has been

placed in that mode of operation, the mod-

ule waits for 11 consecutive recessive bits

on the bus before starting transmission. If

the user switches to Disable Mode within

this 11-bit period, then this transmission is

aborted and the corresponding TXABT bit

is set and TXREQ bit is cleared.

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DS70083C-page 122 Advance Information  2003 Microchip Technology Inc.

17.4 Message Reception

17.4.1 RECEIVE BUFFERS

The CAN bus module has 3 receive buffers. However,

one of the receive buffers is always committed to mon-

itoring the bus for incoming messages. This buffer is

called the Message Assembly Buffer (MAB). So there

are 2 receive buffers visible, RXB0 and RXB1, that can

essentially instantaneously receive a complete

message from the protocol engine.

All messages are assembled by the MAB and are trans-

ferred to the RXBn buffers only if the acceptance filter

criterion are met. When a message is received, the

RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This

bit can only be set by the module when a message is

received. The bit is cleared by the CPU when it has com-

pleted processing the message in the buffer. If the

RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt

will be generated when a message is received.

RXF0 and RXF1 filters with RXM0 mask are associated

with RXB0. The filters RXF2, RXF3, RXF4, and RXF5

and the mask RXM1 are associated with RXB1.

17.4.2 MESSAGE ACCEPTANCE FILTERS

The message acceptance filters and masks are used to

determine if a message in the message assembly

buffer should be loaded into either of the receive buff-

ers. Once a valid message has been received into the

Message Assembly Buffer (MAB), the identifier fields of

the message are compared to the filter values. If there

is a match, that message will be loaded into the

appropriate receive buffer.

The acceptance filter looks at incoming messages for

the RXIDE bit (CiRXnSID<0>) to determine how to

compare the identifiers. If the RXIDE bit is clear, the

message is a standard frame and only filters with the

EXIDE bit (CiRXFnSID<0>) clear are compared. If the

RXIDE bit is set, the message is an extended frame,

and only filters with the EXIDE bit set are compared.

Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can

override the EXIDE bit.

17.4.3 MESSAGE ACCEPTANCE FILTER

MASKS

The mask bits essentially determine which bits to apply

the filter to. If any mask bit is set to a zero, then that bit

will automatically be accepted regardless of the filter

bit. There are 2 programmable acceptance filter masks

associated with the receive buffers, one for each buffer.

17.4.4 RECEIVE OVERRUN

An overrun condition occurs when the Message

Assembly Buffer (MAB) has assembled a valid

received message, the message is accepted through

the acceptance filters, and when the receive buffer

associated with the filter has not been designated as

clear of the previous message.

The overrun error flag, RXnOVR (CiINTF<15> or

CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be

set and the message in the MAB will be discarded.

If the DBEN bit is clear, RXB1 and RXB0 operate inde-

pendently. When this is the case, a message intended

for RXB0 will not be diverted into RXB1 if RXB0 con-

tains an unread message and the RX0OVR bit will be

set.

If the DBEN bit is set, the overrun for RXB0 is handled

differently. If a valid message is received for RXB0 and

RXFUL = 1 indicates that RXB0 is full and RXFUL = 0

indicates that RXB1 is empty, the message for RXB0

will be loaded into RXB1. An overrun error will not be

generated for RXB0. If a valid message is received for

RXB0 and RXFUL = 1, indicating that both RXB0 and

RXB1 are full, the message will be lost and an overrun

will be indicated for RXB1.

17.4.5 RECEIVE ERRORS

The CAN module will detect the following receive

errors:

• Cyclic Redundancy Check (CRC) Error

• Bit Stuffing Error

• Invalid Message Receive Error

These receive errors do not generate an interrupt.

However, the receive error counter is incremented by

one in case one of these errors occur. The RXWAR bit

(CiINTF<9>) indicates that the receive error counter

has reached the CPU warning limit of 96 and an

interrupt is generated.

17.4.6 RECEIVE INTERRUPTS

Receive interrupts can be divided into 3 major groups,

each including various conditions that generate

interrupts:

• Receive Interrupt:

A message has been successfully received and

loaded into one of the receive buffers. This inter-

rupt is activated immediately after receiving the

End of Frame (EOF) field. Reading the RXnIF flag

will indicate which receive buffer caused the

interrupt.

• Wake-up Interrupt:

The CAN module has woken up from Disable

mode or the device has woken up from Sleep

mode.

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• Receive Error Interrupts:

A receive error interrupt will be indicated by the

ERRIF bit. This bit shows that an error condition

occurred. The source of the error can be deter-

mined by checking the bits in the CAN Interrupt

Status register, CiINTF.

- Invalid Message Received:

If any type of error occurred during reception of

the last message, an error will be indicated by

the IVRIF bit.

- Receiver Overrun:

The RXnOVR bit indicates that an overrun

condition occurred.

- Receiver Warning:

The RXWAR bit indicates that the receive error

counter (RERRCNT<7:0>) has reached the

warning limit of 96.

- Receiver Error Passive:

The RXEP bit indicates that the receive error

counter has exceeded the error passive limit of

127 and the module has gone into error passive

state.

17.5 Message Transmission

17.5.1 TRANSMIT BUFFERS

The CAN module has three transmit buffers. Each of

the three buffers occupies 14 bytes of data. Eight of the

bytes are the maximum 8 bytes of the transmitted mes-

sage. Five bytes hold the standard and extended

identifiers and other message arbitration information.

17.5.2 TRANSMIT MESSAGE PRIORITY

Transmit priority is a prioritization within each node of

the pending transmittable messages. There are

4 levels of transmit priority. If TXPRI<1:0>

(CiTXnCON<1:0>, where n = 0, 1 or 2 represents a par-

ticular transmit buffer) for a particular message buffer is

set to ‘11’, that buffer has the highest priority. If

TXPRI<1:0> for a particular message buffer is set to

‘10’ or ‘01’, that buffer has an intermediate priority. If

TXPRI<1:0> for a particular message buffer is ‘00’, that

buffer has the lowest priority.

17.5.3 TRANSMISSION SEQUENCE

To initiate transmission of the message, the TXREQ bit

(CiTXnCON<3>) must be set. The CAN bus module

resolves any timing conflicts between setting of the

TXREQ bit and the Start of Frame (SOF), ensuring that if

the priority was changed, it is resolved correctly before the

SOF occurs. When TXREQ is set, the TXABT

(CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR

(CiTXnCON<4>) flag bits are automatically cleared.

Setting TXREQ bit simply flags a message buffer as

enqueued for transmission. When the module detects

an available bus, it begins transmitting the message

which has been determined to have the highest priority.

If the transmission completes successfully on the first

attempt, the TXREQ bit is cleared automatically, and an

interrupt is generated if TXIE was set.

If the message transmission fails, one of the error con-

dition flags will be set, and the TXREQ bit will remain

set indicating that the message is still pending for trans-

mission. If the message encountered an error condition

during the transmission attempt, the TXERR bit will be

set, and the error condition may cause an interrupt. If

the message loses arbitration during the transmission

attempt, the TXLARB bit is set. No interrupt is

generated to signal the loss of arbitration.

17.5.4 ABORTING MESSAGE

TRANSMISSION

The system can also abort a message by clearing the

TXREQ bit associated with each message buffer. Set-

ting the ABAT bit (CiCTRL<12>) will request an abort of

all pending messages. If the message has not yet

started transmission, or if the message started but is

interrupted by loss of arbitration or an error, the abort

will be processed. The abort is indicated when the

module sets the TXABT bit and the TXnIF flag is not

automatically set.

17.5.5 TRANSMISSION ERRORS

The CAN module will detect the following transmission

errors:

• Acknowledge Error

•Form Error

• Bit Error

These transmission errors will not necessarily generate

an interrupt but are indicated by the transmission error

counter. However, each of these errors will cause the

transmission error counter to be incremented by one.

Once the value of the error counter exceeds the value

of 96, the ERRIF (CiINTF<5>) and the TXWAR bit

(CiINTF<10>) are set. Once the value of the error

counter exceeds the value of 96, an interrupt is

generated and the TXWAR bit in the Error Flag register

is set.

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DS70083C-page 124 Advance Information  2003 Microchip Technology Inc.

17.5.6 TRANSMIT INTERRUPTS

Transmit interrupts can be divided into 2 major groups,

each including various conditions that generate

interrupts:

• Transmit Interrupt:

At least one of the three transmit buffers is empty

(not scheduled) and can be loaded to schedule a

message for transmission. Reading the TXnIF

flags will indicate which transmit buffer is available

and caused the interrupt.

• Transmit Error Interrupts:

A transmission error interrupt will be indicated by

the ERRIF flag. This flag shows that an error con-

dition occurred. The source of the error can be

determined by checking the error flags in the CAN

Interrupt Status register, CiINTF. The flags in this

- Transmitter Warning Interrupt:

The TXWAR bit indicates that the transmit error

counter has reached the CPU warning limit of

96.

- Transmitter Error Passive:

The TXEP bit (CiINTF<12>) indicates that the

transmit error counter has exceeded the error

passive limit of 127 and the module has gone to

error passive state.

- Bus Off:

The TXBO bit (CiINTF<13>) indicates that the

transmit error counter has exceeded 255 and

the module has gone to the bus off state.

17.6 Baud Rate Setting

All nodes on any particular CAN bus must have the

same nominal bit rate. In order to set the baud rate, the

following parameters have to be initialized:

• Synchronization Jump Width

• Baud Rate Prescaler

• Phase Segments

• Length determination of Phase Segment 2

• Sample Point

• Propagation Segment bits

17.6.1 BIT TIMING

All controllers on the CAN bus must have the same

baud rate and bit length. However, different controllers

are not required to have the same master oscillator

clock. At different clock frequencies of the individual

controllers, the baud rate has to be adjusted by

adjusting the number of time quanta in each segment.

The nominal bit time can be thought of as being divided

into separate non-overlapping time segments. These

segments are shown in Figure 17-2.

• Synchronization Segment (Sync Seg)

• Propagation Time Segment (Prop Seg)

• Phase Segment 1 (Phase1 Seg)

• Phase Segment 2 (Phase2 Seg)

The time segments and also the nominal bit time are

made up of integer units of time called time quanta or

TQ. By definition, the nominal bit time has a minimum

of 8 TQ and a maximum of 25 TQ. Also, by definition,

the minimum nominal bit time is 1 µsec corresponding

to a maximum bit rate of 1 MHz.

FIGURE 17-2: CAN BIT TIMING

Input Signal

Sync Prop

Segment

Phase

Segment 1

Phase

Segment 2 Sync

Sample Point

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17.6.2 PRESCALER SETTING

There is a programmable prescaler with integral values

ranging from 1 to 64, in addition to a fixed divide-by-2

for clock generation. The time quantum (TQ) is a fixed

unit of time derived from the oscillator period, and is

given by Equation 17-1.

EQUATION 17-1: TIME QUANTUM FOR

CLOCK GENERATION

17.6.3 PROPAGATION SEGMENT

This part of the bit time is used to compensate physical

delay times within the network. These delay times con-

sist of the signal propagation time on the bus line and

the internal delay time of the nodes. The Prop Seg can

be programmed from 1 TQ to 8 TQ by setting the

PRSEG<2:0> bits (CiCFG2<2:0>).

17.6.4 PHASE SEGMENTS

The phase segments are used to optimally locate the

sampling of the received bit within the transmitted bit

time. The sampling point is between Phase1 Seg and

Phase2 Seg. These segments are lengthened or short-

ened by resynchronization. The end of the Phase1 Seg

determines the sampling point within a bit period. The

segment is programmable from 1 TQ to 8 TQ. Phase2

Seg provides delay to the next transmitted data transi-

tion. The segment is programmable from 1 TQ to 8 TQ,

or it may be defined to be equal to the greater of

Phase1 Seg or the information processing time (2 TQ).

The Phase1 Seg is initialized by setting bits

SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is

initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).

The following requirement must be fulfilled while setting

the lengths of the phase segments:

Prop Seg + Phase1 Seg > = Phase2 Seg

17.6.5 SAMPLE POINT

The sample point is the point of time at which the bus

level is read and interpreted as the value of that respec-

tive bit. The location is at the end of Phase1 Seg. If the

bit timing is slow and contains many TQ, it is possible to

specify multiple sampling of the bus line at the sample

point. The level determined by the CAN bus then corre-

sponds to the result from the majority decision of three

values. The majority samples are taken at the sample

point and twice before with a distance of TQ/2. The

CAN module allows the user to choose between sam-

pling three times at the same point or once at the same

point, by setting or clearing the SAM bit (CiCFG2<6>).

Typically, the sampling of the bit should take place at

about 60 - 70% through the bit time, depending on the

system parameters.

17.6.6 SYNCHRONIZATION

To compensate for phase shifts between the oscillator

frequencies of the different bus stations, each CAN

controller must be able to synchronize to the relevant

signal edge of the incoming signal. When an edge in

the transmitted data is detected, the logic will compare

the location of the edge to the expected time (Synchro-

nous Segment). The circuit will then adjust the values

of Phase1 Seg and Phase2 Seg. There are 2

mechanisms used to synchronize.

17.6.6.1 Hard Synchronization

Hard synchronization is only done whenever there is a

‘recessive’ to ‘dominant’ edge during bus Idle indicating

the start of a message. After hard synchronization, the

bit time counters are restarted with the Sync Seg. Hard

synchronization forces the edge which has caused the

hard synchronization to lie within the synchronization

segment of the restarted bit time. If a hard synchroniza-

tion is done, there will not be a resynchronization within

that bit time.

17.6.6.2 Resynchronization

As a result of resynchronization, Phase1 Seg may be

lengthened or Phase2 Seg may be shortened. The

amount of lengthening or shortening of the phase

buffer segment has an upper bound known as the syn-

chronization jump width, and is specified by the

SJW<1:0> bits (CiCFG1<7:6>). The value of the syn-

chronization jump width will be added to Phase1 Seg or

subtracted from Phase2 Seg. The resynchronization

jump width is programmable between 1 TQ and 4 TQ.

The following requirement must be fulfilled while setting

the SJW<1:0> bits:

Phase2 Seg > Synchronization Jump Width

TQ = 2 (BRP<5:0> + 1) / FCAN

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DS70083C-page 126 Advance Information  2003 Microchip Technology Inc.

TABLE 17-1: CAN1 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C1RXF0SID 0300 — — — Receive Acceptance Filter 0 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF0EIDH 0302 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF1SID 0308 — — — Receive Acceptance Filter 1 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF1EIDH 030A — — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF2SID 0310 — — — Receive Acceptance Filter 2 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF2EIDH 0312 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF3SID 0318 — — — Receive Acceptance Filter 3 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF3EIDH 031A — — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF4SID 0320 — — — Receive Acceptance Filter 4 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF4EIDH 0322 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF5SID 0328 — — — Receive Acceptance Filter 5 Standard Identifier <10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF5EIDH 032A — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM0SID 0330 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C1RXM0EIDH 0332 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM1SID 0338 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C1RXM1EIDH 033A — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1TX2SID 0340 Transmit Buffer 2 Standard Identifier <10:6> — — — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX2EID 0342 Transmit Buffer 2 Extended Identifier

<17:14>

— — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu

C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu

C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C1TX2CON 034E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX1SID 0350 Transmit Buffer 1 Standard Identifier <10:6> — — — Transmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX1EID 0352 Transmit Buffer 1 Extended Identifier

<17:14>

— — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

Legend: u = uninitialized bit

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C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1TX1CON 035E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX0SID 0360 Transmit Buffer 0 Standard Identifier <10:6> — — — Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX0EID 0362 Transmit Buffer 0 Extended Identifier

<17:14>

— — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1TX0CON 036E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1RX1SID 0370 — — — Receive Buffer 1 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX1EID 0372 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RX1DLC 0374 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1RX1CON 037E — — — — — — — —RXFUL— — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000

C1RX0SID 0380 — — — Receive Buffer 0 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX0EID 0382 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RX0DLC 0384 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1RX0CON 038E — — — — — — — —RXFUL— — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000

C1CTRL 0390 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> —0000 0100 1000 0000

C1CFG1 0392 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C1CFG2 0394 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C1INTE 0398 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000

C1EC 039A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000

TABLE 17-1: CAN1 REGISTER MAP (CONTINUED)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

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DS70083C-page 128 Advance Information  2003 Microchip Technology Inc.

TABLE 17-2: CAN2 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C2RXF0SID 03C0 — — — Receive Acceptance Filter 0 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF0EIDH 03C2 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF0EIDL 03C4 Receive Acceptance Filter 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF1SID 03C8 — — — Receive Acceptance Filter 1 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF1EIDH 03CA — — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF1EIDL 03CC Receive Acceptance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF2SID 03D0 — — — Receive Acceptance Filter 2 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF2EIDH 03D2 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF2EIDL 03D4 Receive Acceptance Filter 2 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF3SID 03D8 — — — Receive Acceptance Filter 3 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF3EIDH 03DA — — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF3EIDL 03DC Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF4SID 03E0 — — — Receive Acceptance Filter 4 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF4EIDH 03E2 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF4EIDL 03E4 Receive Acceptance Filter 4 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF5SID 03E8 — — — Receive Acceptance Filter 5 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF5EIDH 03EA — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF5EIDL 03EC Receive Acceptance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXM0SID 03F0 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C2RXM0EIDH 03F2 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXM0EIDL 03F4 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXM1SID 03F8 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C2RXM1EIDH 03FA — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXM1EIDL 03FC Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2TX2SID 0400 Transmit Buffer 2 Standard Identifier <10:6> — — — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX2EID 0402 Transmit Buffer 2 Extended Identifier

<17:14>

— — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C2TX2DLC 0404 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C2TX2B1 0406 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu

C2TX2B2 0408 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu

C2TX2B3 040A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C2TX2B4 040C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C2TX2CON 040E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2TX1SID 0410 Transmit Buffer 1 Standard Identifier <10:6> — — — Transmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX1EID 0412 Transmit Buffer 1 Extended Identifier

<17:14>

— — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

Legend: u = uninitialized bit

 2003 Microchip Technology Inc. Advance Information DS70083C-page 129

dsPIC30F

C2TX1DLC 0414 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C2TX1B1 0416 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C2TX1B2 0418 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C2TX1B3 041A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C2TX1B4 041C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C2TX1CON 041E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2TX0SID 0420 Transmit Buffer 0 Standard Identifier <10:6> — — — Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX0EID 0422 Transmit Buffer 0 Extended Identifier

<17:14>

— — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C2TX0DLC 0424 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C2TX0B1 0426 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C2TX0B2 0428 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C2TX0B3 042A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C2TX0B4 042C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C2TX0CON 042E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2RX1SID 0430 — — — Receive Buffer 1 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C2RX1EID 0432 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RX1DLC 0434 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C2RX1B1 0436 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C2RX1B2 0438 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C2RX1B3 043A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C2RX1B4 043C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C2RX1CON 043E — — — — — — — —RXFUL— — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000

C2RX0SID 0440 — — — Receive Buffer 0 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C2RX0EID 0442 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RX0DLC 0444 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C2RX0B1 0446 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C2RX0B2 0448 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C2RX0B3 044A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C2RX0B4 044C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C2RX0CON 044E — — — — — — — —RXFUL— — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000

C2CTRL 0450 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> — 0000 0100 1000 0000

C2CFG1 0452 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C2CFG2 0454 — WAKFIL — — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C2INTF 0456 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C2INTE 0458 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000

C2EC 045A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000

TABLE 17-2: CAN2 REGISTER MAP (CONTINUED)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 130 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 131

dsPIC30F

18.0 DATA CONVERTER

INTERFACE (DCI) MODULE

18.1 Module Introduction

The dsPIC30F Data Converter Interface (DCI) module

allows simple interfacing of devices, such as audio

coder/decoders (Codecs), A/D converters and D/A

converters. The following interfaces are supported:

• Framed Synchronous Serial Transfer (Single or

Multi-Channel)

• Inter-IC Sound (I2S) Interface

• AC-Link Compliant mode

The DCI module provides the following general

features:

• Programmable word size up to 16 bits

• Support for up to 16 time slots, for a maximum

frame size of 256 bits

• Data buffering for up to 4 samples without CPU

overhead

18.2 Module I/O Pins

There are four I/O pins associated with the module.

When enabled, the module controls the data direction

of each of the four pins.

18.2.1 CSCK PIN

The CSCK pin provides the serial clock for the DCI

module. The CSCK pin may be configured as an input

or output using the CSCKD control bit in the DCICON2

SFR. When configured as an output, the serial clock is

provided by the dsPIC30F. When configured as an

input, the serial clock must be provided by an external

device.

18.2.2 CSDO PIN

The serial data output (CSDO) pin is configured as an

output only pin when the module is enabled. The

CSDO pin drives the serial bus whenever data is to be

transmitted. The CSDO pin is tri-stated or driven to ‘0’

during CSCK periods when data is not transmitted,

depending on the state of the CSDOM control bit. This

allows other devices to place data on the serial bus

during transmission periods not used by the DCI

module.

18.2.3 CSDI PIN

The serial data input (CSDI) pin is configured as an

input only pin when the module is enabled.

18.2.3.1 COFS PIN

The Codec frame synchronization (COFS) pin is used

to synchronize data transfers that occur on the CSDO

and CSDI pins. The COFS pin may be configured as an

input or an output. The data direction for the COFS pin

is determined by the COFSD control bit in the

DCICON1 register.

The DCI module accesses the shadow registers while

the CPU is in the process of accessing the memory

mapped buffer registers.

18.2.4 BUFFER DATA ALIGNMENT

Data values are always stored left justified in the buff-

ers since most Codec data is represented as a signed

2’s complement fractional number. If the received word

length is less than 16 bits, the unused LS bits in the

receive buffer registers are set to ‘0’ by the module. If

the transmitted word length is less than 16 bits, the

unused LS bits in the transmit buffer register are

ignored by the module. The word length setup is

described in subsequent sections of this document.

18.2.5 TRANSMIT/RECEIVE SHIFT

The DCI module has a 16-bit shift register for shifting

serial data in and out of the module. Data is shifted in/

out of the shift register MS bit first, since audio PCM

data is transmitted in signed 2’s complement format.

18.2.6 DCI BUFFER CONTROL

The DCI module contains a buffer control unit for trans-

ferring data between the shadow buffer memory and

the serial shift register. The buffer control unit is a sim-

ple 2-bit address counter that points to word locations

in the shadow buffer memory. For the receive memory

space (high address portion of DCI buffer memory), the

address counter is concatenated with a ‘0’ in the MSb

location to form a 3-bit address. For the transmit mem-

ory space (high portion of DCI buffer memory), the

address counter is concatenated with a ‘1’ in the MSb

location.

Note: The DCI buffer control unit always

accesses the same relative location in the

transmit and receive buffers, so only one

address counter is provided.

dsPIC30F

DS70083C-page 132 Advance Information  2003 Microchip Technology Inc.

FIGURE 18-1: DCI MODULE BLOCK DIAGRAM

BCG Control bits

16-bit Data Bus

Sample Rate

Generator

SCKD

FSD

DCI Buffer

Frame

Synchronization

Generator

Control Unit

DCI Shift Register

Receive Buffer

Registers w/Shadow

FOSC/4

Word Size Selection bits

Frame Length Selection bits

DCI Mode Selection bits

CSCK

COFS

CSDI

CSDO

15 0

Transmit Buffer

Registers w/Shadow

 2003 Microchip Technology Inc. Advance Information DS70083C-page 133

dsPIC30F

18.3 DCI Module Operation

18.3.1 MODULE ENABLE

The DCI module is enabled or disabled by setting/

clearing the DCIEN control bit in the DCICON1 SFR.

Clearing the DCIEN control bit has the effect of reset-

ting the module. In particular, all counters associated

with CSCK generation, frame sync, and the DCI buffer

control unit are reset.

The DCI clocks are shutdown when the DCIEN bit is

cleared.

When enabled, the DCI controls the data direction for

the four I/O pins associated with the module. The Port,

LAT and TRIS register values for these I/O pins are

overridden by the DCI module when the DCIEN bit is set.

It is also possible to override the CSCK pin separately

when the bit clock generator is enabled. This permits

the bit clock generator to operate without enabling the

rest of the DCI module.

18.3.2 WORD SIZE SELECTION BITS

The WS<3:0> word size selection bits in the DCICON2

SFR determine the number of bits in each DCI data

word. Essentially, the WS<3:0> bits determine the

counting period for a 4-bit counter clocked from the

CSCK signal.

Any data length, up to 16-bits, may be selected. The

value loaded into the WS<3:0> bits is one less the

desired word length. For example, a 16-bit data word

size is selected when WS<3:0> = 1111.

18.3.3 FRAME SYNC GENERATOR

The frame sync generator (COFSG) is a 4-bit counter

that sets the frame length in data words. The frame

sync generator is incremented each time the word size

counter is reset (refer to Section 18.3.2). The period for

the frame synchronization generator is set by writing

the COFSG<3:0> control bits in the DCICON2 SFR.

The COFSG period in clock cycles is determined by the

following formula:

EQUATION 18-1: COFSG PERIOD

Frame lengths, up to 16 data words, may be selected.

The frame length in CSCK periods can vary up to a

maximum of 256 depending on the word size that is

selected.

18.3.4 FRAME SYNC MODE

CONTROL BITS

The type of frame sync signal is selected using the

Frame Synchronization mode control bits

(COFSM<1:0>) in the DCICON1 SFR. The following

operating modes can be selected:

• Multi-Channel mode

•I

2S mode

• AC-Link mode (16-bit)

• AC-Link mode (20-bit)

The operation of the COFSM control bits depends on

whether the DCI module generates the frame sync

signal as a master device, or receives the frame sync

signal as a slave device.

The master device in a DSP/Codec pair is the device

that generates the frame sync signal. The frame sync

signal initiates data transfers on the CSDI and CSDO

pins and usually has the same frequency as the data

sample rate (COFS).

The DCI module is a frame sync master if the COFSD

control bit is cleared and is a frame sync slave if the

COFSD control bit is set.

18.3.5 MASTER FRAME SYNC

OPERATION

When the DCI module is operating as a frame sync

master device (COFSD = 0), the COFSM mode bits

determine the type of frame sync pulse that is

generated by the frame sync generator logic.

A new COFS signal is generated when the frame sync

generator resets to ‘0’.

In the Multi-Channel mode, the frame sync pulse is

driven high for the CSCK period to initiate a data trans-

fer. The number of CSCK cycles between successive

frame sync pulses will depend on the word size and

frame sync generator control bits. A timing diagram for

the frame sync signal in Multi-Channel mode is shown

in Figure 18-2.

In the AC-Link mode of operation, the frame sync sig-

nal has a fixed period and duty cycle. The AC-Link

frame sync signal is high for 16 CSCK cycles and is low

for 240 CSCK cycles. A timing diagram with the timing

details at the start of an AC-Link frame is shown in

Figure 18-3.

In the I2S mode, a frame sync signal having a 50% duty

cycle is generated. The period of the I2S frame sync

signal in CSCK cycles is determined by the word size

and frame sync generator control bits. A new I2S data

transfer boundary is marked by a high-to-low or a

low-to-high transition edge on the COFS pin.

Note: These WS<3:0> control bits are used only

in the Multi-Channel and I2S modes. These

bits have no effect in AC-Link mode since

the data slot sizes are fixed by the protocol.

Note: The COFSG control bits will have no effect

in AC-Link mode since the frame length is

set to 256 CSCK periods by the protocol.

Frame Length = Word Length • (FSG Value + 1)

dsPIC30F

DS70083C-page 134 Advance Information  2003 Microchip Technology Inc.

18.3.6 SLAVE FRAME SYNC OPERATION

When the DCI module is operating as a frame sync

slave (COFSD = 1), data transfers are controlled by the

Codec device attached to the DCI module. The

COFSM control bits control how the DCI module

responds to incoming COFS signals.

In the Multi-Channel mode, a new data frame transfer

will begin one CSCK cycle after the COFS pin is sam-

pled high (see Figure 18-2). The pulse on the COFS

pin resets the frame sync generator logic.

In the I2S mode, a new data word will be transferred

one CSCK cycle after a low-to-high or a high-to-low

transition is sampled on the COFS pin. A rising or fall-

ing edge on the COFS pin resets the frame sync

generator logic.

In the AC-Link mode, the tag slot and subsequent data

slots for the next frame will be transferred one CSCK

cycle after the COFS pin is sampled high.

The COFSG and WS bits must be configured to pro-

vide the proper frame length when the module is oper-

ating in the Slave mode. Once a valid frame sync pulse

has been sampled by the module on the COFS pin, an

entire data frame transfer will take place. The module

will not respond to further frame sync pulses until the

data frame transfer has completed.

FIGURE 18-2: FRAME SYNC TIMING, MULTI-CHANNEL MODE

FIGURE 18-3: FRAME SYNC TIMING, AC-LINK START OF FRAME

FIGURE 18-4: I2S INTERFACE FRAME SYNC TIMING

CSCK

CSDI/CSDO

COFS

MSB LSB

Tag

MSb

BIT_CLK

CSDO or CSDI

SYNC

Tag

bit 14

S12

LSb

S12

bit 1

S12

bit 2 Tag

bit 13

MSB LSB MSB LSB

CSCK

CSDI or CSDO

Note: A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length - this will

be system dependent.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 135

dsPIC30F

18.3.7 BIT CLOCK GENERATOR

The DCI module has a dedicated 12-bit time base that

produces the bit clock. The bit clock rate (period) is set

by writing a non-zero 12-bit value to the BCG<11:0>

control bits in the DCICON1 SFR.

When the BCG<11:0> bits are set to zero, the bit clock

will be disabled. If the BCG<11:0> bits are set to a non-

zero value, the bit clock generator is enabled. These

bits should be set to ‘0’ and the CSCKD bit set to ‘1’ if

the serial clock for the DCI is received from an external

device.

The formula for the bit clock frequency is given in

Equation 18-2.

EQUATION 18-2: BIT CLOCK FREQUENCY

The required bit clock frequency will be determined by

the system sampling rate and frame size. Typical bit

clock frequencies range from 16x to 512x the converter

sample rate depending on the data converter and the

communication protocol that is used.

To achieve bit clock frequencies associated with com-

mon audio sampling rates, the user will need to select

a crystal frequency that has an ‘even’ binary value.

Examples of such crystal frequencies are listed in

Table 18-1.

TABLE 18-1: DEVICE FREQUENCIES FOR

COMMON CODEC CSCK

FREQUENCIES

18.3.8 SAMPLE CLOCK EDGE

CONTROL BIT

The sample clock edge (CSCKE) control bit determines

the sampling edge for the CSCK signal. If the CSCK bit

is cleared (default), data will be sampled on the falling

edge of the CSCK signal. The AC-Link protocols and

most Multi-Channel formats require that data be sam-

pled on the falling edge of the CSCK signal. If the

CSCK bit is set, data will be sampled on the rising edge

of CSCK. The I2S protocol requires that data be

sampled on the rising edge of the CSCK signal.

18.3.9 DATA JUSTIFICATION

CONTROL BIT

In most applications, the data transfer begins one

CSCK cycle after the COFS signal is sampled active.

This is the default configuration of the DCI module. An

alternate data alignment can be selected by setting the

DJST control bit in the DCICON2 SFR. When DJST = 1,

data transfers will begin during the same CSCK cycle

when the COFS signal is sampled active.

18.3.10 TRANSMIT SLOT ENABLE BITS

The TSCON SFR has control bits that are used to

enable up to 16 time slots for transmission. These con-

trol bits are the TSE<15:0> bits. The size of each time

slot is determined by the WS<3:0> word size selection

bits and can vary up to 16 bits.

If a transmit time slot is enabled via one of the TSE bits

(TSEx = 1), the contents of the current transmit shadow

buffer location will be loaded into the CSDO Shift regis-

ter and the DCI buffer control unit is incremented to

point to the next location.

During an unused transmit time slot, the CSDO pin will

drive ‘0’s or will be tri-stated during all disabled time

slots depending on the state of the CSDOM bit in the

DCICON1 SFR.

The data frame size in bits is determined by the chosen

data word size and the number of data word elements

in the frame. If the chosen frame size has less than 16

elements, the additional slot enable bits will have no

effect.

Each transmit data word is written to the 16-bit transmit

buffer as left justified data. If the selected word size is

less than 16 bits, then the LS bits of the transmit buffer

memory will have no effect on the transmitted data. The

user should write ‘0’s to the unused LS bits of each

transmit buffer location.

FOSC PLL FCYC

2.048 MHz 16x 32.768 MIPs

4.096 MHz 8x 32.768 MIPs

4.800 MHz 8x 38.4 MIPs

9.600 MHz 4x 38.4 MIPs

Note 1: When the CSCK signal is applied exter-

nally (CSCKD = 1), the BCG<11:0> bits

have no effect on the operation of the DCI

module.

2: When the CSCK signal is applied exter-

nally (CSCKD = 1), the external clock

high and low times must meet the device

timing requirements.

FBCK = FCY

2 (BCG + 1)

•

dsPIC30F

DS70083C-page 136 Advance Information  2003 Microchip Technology Inc.

18.3.11 RECEIVE SLOT ENABLE BITS

The RSCON SFR contains control bits that are used to

enable up to 16 time slots for reception. These control

bits are the RSE<15:0> bits. The size of each receive

time slot is determined by the WS<3:0> word size

selection bits and can vary from 1 to 16 bits.

If a receive time slot is enabled via one of the RSE bits

(RSEx = 1), the shift register contents will be written to

the current DCI receive shadow buffer location and the

buffer control unit will be incremented to point to the

next buffer location.

Data is not packed in the receive memory buffer loca-

tions if the selected word size is less than 16 bits. Each

received slot data word is stored in a separate 16-bit

buffer location. Data is always stored in a left justified

format in the receive memory buffer.

18.3.12 SLOT ENABLE BITS OPERATION

WITH FRAME SYNC

The TSE and RSE control bits operate in concert with

the DCI frame sync generator. In the Master mode, a

COFS signal is generated whenever the frame sync

generator is reset. In the Slave mode, the frame sync

generator is reset whenever a COFS pulse is received.

The TSE and RSE control bits allow up to 16 consecu-

tive time slots to be enabled for transmit or receive.

After the last enabled time slot has been transmitted/

received, the DCI will stop buffering data until the next

occurring COFS pulse.

18.3.13 SYNCHRONOUS DATA

TRANSFERS

The DCI buffer control unit will be incremented by one

word location whenever a given time slot has been

enabled for transmission or reception. In most cases,

data input and output transfers will be synchronized,

which means that a data sample is received for a given

channel at the same time a data sample is transmitted.

Therefore, the transmit and receive buffers will be filled

with equal amounts of data when a DCI interrupt is

generated.

In some cases, the amount of data transmitted and

received during a data frame may not be equal. As an

example, assume a two-word data frame is used. Fur-

thermore, assume that data is only received during

slot #0 but is transmitted during slot #0 and slot #1. In

this case, the buffer control unit counter would be incre-

mented twice during a data frame but only one receive

18.3.14 BUFFER LENGTH CONTROL

The amount of data that is buffered between interrupts

is determined by the buffer length (BLEN<1:0>) control

bits in the DCISTAT SFR. The size of the transmit and

receive buffers may be varied from 1 to 4 data words

using the BLEN control bits. The BLEN control bits are

compared to the current value of the DCI buffer control

unit address counter. When the 2 LS bits of the DCI

address counter match the BLEN<1:0> value, the

buffer control unit will be reset to ‘0’. In addition, the

contents of the receive shadow registers are trans-

ferred to the receive buffer registers and the contents

of the transmit buffer registers are transferred to the

transmit shadow registers.

18.3.15 BUFFER ALIGNMENT WITH DATA

FRAMES

There is no direct coupling between the position of the

AGU address pointer and the data frame boundaries.

This means that there will be an implied assignment of

each transmit and receive buffer that is a function of the

BLEN control bits and the number of enabled data slots

via the TSE and RSE control bits.

As an example, assume that a 4-word data frame is

chosen and that we want to transmit on all four time

slots in the frame. This configuration would be estab-

lished by setting the TSE0, TSE1, TSE2, and TSE3

control bits in the TSCON SFR. With this module setup,

the TXBUF0 register would be naturally assigned to

slot #0, the TXBUF1 register would be naturally

assigned to slot #1, and so on.

Note: When more than four time slots are active

within a data frame, the user code must

keep track of which time slots are to be

read/written at each interrupt. In some

cases, the alignment between transmit/

receive buffers and their respective slot

assignments could be lost. Examples of

such cases include an emulation break-

point or a hardware trap. In these situa-

tions, the user should poll the SLOT status

bits to determine what data should be

loaded into the buffer registers to

resynchronize the software with the DCI

module.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 137

dsPIC30F

18.3.16 TRANSMIT STATUS BITS

There are two transmit status bits in the DCISTAT SFR.

The TMPTY bit is set when the contents of the transmit

buffer registers are transferred to the transmit shadow

registers. The TMPTY bit may be polled in software to

determine when the transmit buffer registers may be

written. The TMPTY bit is cleared automatically by the

hardware when a write to one of the four transmit

buffers occurs.

The TUNF bit is read only and indicates that a transmit

underflow has occurred for at least one of the transmit

buffer registers that is in use. The TUNF bit is set at the

time the transmit buffer registers are transferred to the

transmit shadow registers. The TUNF status bit is

cleared automatically when the buffer register that

underflowed is written by the CPU.

18.3.17 RECEIVE STATUS BITS

There are two receive status bits in the DCISTAT SFR.

The RFUL status bit is read only and indicates that new

data is available in the receive buffers. The RFUL bit is

cleared automatically when all receive buffers in use

have been read by the CPU.

The ROV status bit is read only and indicates that a

receive overflow has occurred for at least one of the

receive buffer locations. A receive overflow occurs

when the buffer location is not read by the CPU before

new data is transferred from the shadow registers. The

ROV status bit is cleared automatically when the buffer

When a receive overflow occurs for a specific buffer

location, the old contents of the buffer are overwritten.

18.3.18 SLOT STATUS BITS

The SLOT<3:0> status bits in the DCISTAT SFR indi-

cate the current active time slot. These bits will corre-

spond to the value of the frame sync generator counter.

The user may poll these status bits in software when a

DCI interrupt occurs to determine what time slot data

was last received and which time slot data should be

loaded into the TXBUF registers.

18.3.19 CSDO MODE BIT

The CSDOM control bit controls the behavior of the

CSDO pin during unused transmit slots. A given trans-

mit time slot is unused if it’s corresponding TSEx bit in

the TSCON SFR is cleared.

If the CSDOM bit is cleared (default), the CSDO pin will

be low during unused time slot periods. This mode will

be used when there are only two devices attached to

the serial bus.

If the CSDOM bit is set, the CSDO pin will be tri-stated

during unused time slot periods. This mode allows mul-

tiple devices to share the same CSDO line in a multi-

channel application. Each device on the CSDO line is

configured so that it will only transmit data during

specific time slots. No two devices will transmit data

during the same time slot.

18.3.20 DIGITAL LOOPBACK MODE

Digital Loopback mode is enabled by setting the

DLOOP control bit in the DCISTAT SFR. When the

DLOOP bit is set, the module internally connects the

CSDO signal to CSDI. The actual data input on the

CSDI I/O pin will be ignored in Digital Loopback mode.

18.3.21 UNDERFLOW MODE CONTROL BIT

When an underflow occurs, one of two actions may

occur depending on the state of the Underflow mode

(UNFM) control bit in the DCICON2 SFR. If the UNFM

bit is cleared (default), the module will transmit ‘0’s on

the CSDO pin during the active time slot for the buffer

location. In this Operating mode, the Codec device

attached to the DCI module will simply be fed digital

‘silence’. If the UNFM control bit is set, the module will

transmit the last data written to the buffer location. This

Operating mode permits the user to send continuous

data to the Codec device without consuming CPU

overhead.

18.4 DCI Module Interrupts

The frequency of DCI module interrupts is dependent

on the BLEN<1:0> control bits in the DCICON2 SFR.

An interrupt to the CPU is generated each time the set

buffer length has been reached and a shadow register

transfer takes place. A shadow register transfer is

defined as the time when the previously written TXBUF

values are transferred to the transmit shadow registers

and new received values in the receive shadow

registers are transferred into the RXBUF registers.

Note: The transmit status bits only indicate sta-

tus for buffer locations that are used by the

module. If the buffer length is set to less

than four words, for example, the unused

buffer locations will not affect the transmit

status bits.

Note: The receive status bits only indicate status

for buffer locations that are used by the

module. If the buffer length is set to less

than four words, for example, the unused

buffer locations will not affect the transmit

status bits.

dsPIC30F

DS70083C-page 138 Advance Information  2003 Microchip Technology Inc.

18.5 DCI Module Operation During CPU

Sleep and Idle Modes

18.5.1 DCI MODULE OPERATION DURING

CPU SLEEP MODE

The DCI module has the ability to operate while in

Sleep mode and wake the CPU when the CSCK signal

is supplied by an external device (CSCKD = 1). The

DCI module will generate an asynchronous interrupt

when a DCI buffer transfer has completed and the CPU

is in Sleep mode.

18.5.2 DCI MODULE OPERATION DURING

CPU IDLE MODE

If the DCISIDL control bit is cleared (default), the mod-

ule will continue to operate normally even in Idle mode.

If the DCISIDL bit is set, the module will halt when Idle

mode is asserted.

18.6 AC-Link Mode Operation

The AC-Link protocol is a 256-bit frame with one 16-bit

data slot, followed by twelve 20-bit data slots. The DCI

module has two Operating modes for the AC-Link pro-

tocol. These Operating modes are selected by the

COFSM<1:0> control bits in the DCICON1 SFR. The

first AC-Link mode is called ‘16-bit AC-Link mode’ and

is selected by setting COFSM<1:0> = 10. The second

AC-Link mode is called ‘20-bit AC-Link mode’ and is

selected by setting COFSM<1:0> = 11.

18.6.1 16-BIT AC-LINK MODE

In the 16-bit AC-Link mode, data word lengths are

restricted to 16 bits. Note that this restriction only

affects the 20-bit data time slots of the AC-Link proto-

col. For received time slots, the incoming data is simply

truncated to 16 bits. For outgoing time slots, the 4 LS

bits of the data word are set to ‘0’ by the module. This

truncation of the time slots limits the A/D and DAC data

to 16 bits but permits proper data alignment in the

TXBUF and RXBUF registers. Each RXBUF and

TXBUF register will contain one data time slot value.

18.6.2 20-BIT AC-LINK MODE

The 20-bit AC-Link mode allows all bits in the data time

slots to be transmitted and received but does not main-

tain data alignment in the TXBUF and RXBUF

registers.

The 20-bit AC-Link mode functions similar to the Multi-

Channel mode of the DCI module, except for the duty

cycle of the frame synchronization signal. The AC-Link

frame synchronization signal should remain high for 16

CSCK cycles and should be low for the following

240 cycles.

The 20-bit mode treats each 256-bit AC-Link frame as

sixteen, 16-bit time slots. In the 20-bit AC-Link mode,

the module operates as if COFSG<3:0> = 1111 and

WS<3:0> = 1111. The data alignment for 20-bit data

slots is ignored. For example, an entire AC-Link data

frame can be transmitted and received in a packed

fashion by setting all bits in the TSCON and RSCON

SFRs. Since the total available buffer length is 64 bits,

it would take 4 consecutive interrupts to transfer the

AC-Link frame. The application software must keep

track of the current AC-Link frame segment.

18.7 I2S Mode Operation

The DCI module is configured for I2S mode by writing

a value of ‘01’ to the COFSM<1:0> control bits in the

DCICON1 SFR. When operating in the I2S mode, the

DCI module will generate frame synchronization sig-

nals with a 50% duty cycle. Each edge of the frame

synchronization signal marks the boundary of a new

data word transfer.

The user must also select the frame length and data

word size using the COFSG and WS control bits in the

DCICON2 SFR.

18.7.1 I2S FRAME AND DATA WORD

LENGTH SELECTION

The WS and COFSG control bits are set to produce the

period for one half of an I2S data frame. That is, the

frame length is the total number of CSCK cycles

required for a left or a right data word transfer.

The BLEN bits must be set for the desired buffer length.

Setting BLEN<1:0> = 01 will produce a CPU interrupt,

once per I2S frame.

18.7.2 I2S DATA JUSTIFICATION

As per the I2S specification, a data word transfer will, by

default, begin one CSCK cycle after a transition of the

WS signal. A ‘MS bit left justified’ option can be

selected using the DJST control bit in the DCICON2

SFR.

If DJST = 1, the I2S data transfers will be MS bit left jus-

tified. The MS bit of the data word will be presented on

the CSDO pin during the same CSCK cycle as the ris-

ing or falling edge of the COFS signal. The CSDO pin

is tri-stated after the data word has been sent.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 139

dsPIC30F

TABLE 18-2: DCI REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

DCICON1 0240 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD UNFM CSDOM DJST — — — COFSM1 COFSM0 0000 0000 0000 0000

DCICON2 0242 — — — — BLEN1 BLEN0 — COFSG<3:0> — WS<3:0> 0000 0000 0000 0000

DCICON3 0244 — — — — BCG<11:0> 0000 0000 0000 0000

DCISTAT 0246 — — — — SLOT3 SLOT2 SLOT1 SLOT0 — — — — ROV RFUL TUNF TMPTY 0000 0000 0000 0000

TSCON 0248 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000

RSCON 024C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000

RXBUF0 0250 Receive Buffer #0 Data Register 0000 0000 0000 0000

RXBUF1 0252 Receive Buffer #1 Data Register 0000 0000 0000 0000

RXBUF2 0254 Receive Buffer #2 Data Register 0000 0000 0000 0000

RXBUF3 0256 Receive Buffer #3 Data Register 0000 0000 0000 0000

TXBUF0 0258 Transmit Buffer #0 Data Register 0000 0000 0000 0000

TXBUF1 025A Transmit Buffer #1 Data Register 0000 0000 0000 0000

TXBUF2 025C Transmit Buffer #2 Data Register 0000 0000 0000 0000

TXBUF3 025E Transmit Buffer #3 Data Register 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 140 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 141

dsPIC30F

19.0 12-BIT ANALOG-TO-DIGITAL

CONVERTER (A/D) MODULE

The 12-bit Analog-to-Digital converter (A/D) allows

conversion of an analog input signal to a 12-bit digital

number. This module is based on a Successive

Approximation Register (SAR) architecture and pro-

vides a maximum sampling rate of 100 ksps. The A/D

module has up to 16 analog inputs which are multi-

plexed into a sample and hold amplifier. The output of

the sample and hold is the input into the converter

which generates the result. The analog reference volt-

age is software selectable to either the device supply

voltage (AVDD/AVSS) or the voltage level on the

(VREF+/VREF-) pin. The A/D converter has a unique

feature of being able to operate while the device is in

Sleep mode with RC oscillator selection.

The A/D module has six 16-bit registers:

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

• A/D Control Register 3 (ADCON3)

• A/D Input Select Register (ADCHS)

• A/D Port Configuration Register (ADPCFG)

• A/D Input Scan Selection Register (ADCSSL)

The ADCON1, ADCON2 and ADCON3 registers con-

trol the operation of the A/D module. The ADCHS reg-

ister selects the input channels to be converted. The

ADPCFG register configures the port pins as analog

inputs or as digital I/O. The ADCSSL register selects

inputs for scanning.

The block diagram of the 12-bit A/D module is shown in

Figure 19-1.

FIGURE 19-1: 12-BIT A/D FUNCTIONAL BLOCK DIAGRAM

Note: The SSRC<2:0>, ASAM, SMPI<3:0>,

BUFM and ALTS bits, as well as the

ADCON3 and ADCSSL registers, must

not be written to while ADON = 1. This

would lead to indeterminate results.

Comparator

12-bit SAR Conversion Logic

VREF+

AVSSAVDD

DAC

Data Format

16-word, 12-bit

Dual Port

Buffer

Bus Interface

AN12

0000

0101

0111

1001

1101

1110

1111

1100

0001

0010

0011

0100

0110

1000

1010

1011

AN13

AN14

AN15

AN8

AN9

AN10

AN11

AN4

AN5

AN6

AN7

AN0

AN1

AN2

AN3

CH0

CH0R

CH0G

VREF-

Sample/Sequence

Control

Sample

Input Mux

Control

Input

Switches

S/H

dsPIC30F

DS70083C-page 142 Advance Information  2003 Microchip Technology Inc.

19.1 A/D Result Buffer

The module contains a 16-word dual port read only

buffer, called ADCBUF0...ADCBUFF, to buffer the A/D

results. The RAM is 12 bits wide but the data obtained

is represented in one of four different 16-bit data for-

mats. The contents of the sixteen A/D Conversion

Result Buffer registers, ADCBUF0 through ADCBUFF,

cannot be written by user software.

19.2 Conversion Operation

After the A/D module has been configured, the sample

acquisition is started by setting the SAMP bit. Various

sources, such as a programmable bit, timer time-outs

and external events, will terminate acquisition and start

a conversion. When the A/D conversion is complete,

the result is loaded into ADCBUF0...ADCBUFF, and

the DONE bit and the A/D interrupt flag ADIF are set after

the number of samples specified by the SMPI bit. The

ADC module can be configured for different interrupt

rates as described in Section 19.3.

The following steps should be followed for doing an

A/D conversion:

1. Configure the A/D module:

• Configure analog pins, voltage reference and

digital I/O

• Select A/D input channels

• Select A/D conversion clock

• Select A/D conversion trigger

• Turn on A/D module

2. Configure A/D interrupt (if required):

• Clear ADIF bit

• Select A/D interrupt priority

3. Start sampling.

4. Wait the required acquisition time.

5. Trigger acquisition end, start conversion:

6. Wait for A/D conversion to complete, by either:

• Waiting for the A/D interrupt

7. Read A/D result buffer, clear ADIF if required.

19.3 Selecting the Conversion

Sequence

Several groups of control bits select the sequence in

which the A/D connects inputs to the sample/hold

channel, converts a channel, writes the buffer memory

and generates interrupts.

The sequence is controlled by the sampling clocks.

The SMPI bits select the number of acquisition/

conversion sequences that would be performed before

an interrupt occurs. This can vary from 1 sample per

interrupt to 16 samples per interrupt.

The BUFM bit will split the 16-word results buffer into

two 8-word groups. Writing to the 8-word buffers will be

alternated on each interrupt event.

Use of the BUFM bit will depend on how much time is

available for the moving of the buffers after the

interrupt.

If the processor can quickly unload a full buffer within

the time it takes to acquire and convert one channel,

the BUFM bit can be ‘0’ and up to 16 conversions (cor-

responding to the 16 input channels) may be done per

interrupt. The processor will have one acquisition and

conversion time to move the sixteen conversions.

If the processor cannot unload the buffer within the

acquisition and conversion time, the BUFM bit should be

‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,

then eight conversions will be loaded into 1/2 of the

buffer, following which an interrupt occurs. The next

eight conversions will be loaded into the other 1/2 of the

buffer. The processor will have the entire time between

interrupts to move the eight conversions.

The ALTS bit can be used to alternate the inputs

selected during the sampling sequence. The input

multiplexer has two sets of sample inputs: MUX A and

MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are

selected for sampling. If the ALTS bit is ‘1’ and

SMPI<3:0> = 0000 on the first sample/convert

sequence, the MUX A inputs are selected and on the

next acquire/convert sequence, the MUX B inputs are

selected.

The CSCNA bit (ADCON2<10>) will allow the multi-

plexer input to be alternately scanned across a

selected number of analog inputs for the MUX A group.

The inputs are selected by the ADCSSL register. If a

particular bit in the ADCSSL register is ‘1’, the corre-

sponding input is selected. The inputs are always

scanned from lower to higher numbered inputs, starting

after each interrupt. If the number of inputs selected is

greater than the number of samples taken per interrupt,

the higher numbered inputs are unused.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 143

dsPIC30F

19.4 Programming the Start of

Conversion Trigger

The conversion trigger will terminate acquisition and

start the requested conversions.

The SSRC<2:0> bits select the source of the conver-

sion trigger. The SSRC bits provide for up to 4 alternate

sources of conversion trigger.

When SSRC<2:0> = 000, the conversion trigger is

under software control. Clearing the SAMP bit will

cause the conversion trigger.

When SSRC<2:0> = 111 (Auto-Start mode), the con-

version trigger is under A/D clock control. The SAMC

bits select the number of A/D clocks between the start

of acquisition and the start of conversion. This provides

the fastest conversion rates on multiple channels.

SAMC must always be at least 1 clock cycle.

Other trigger sources can come from timer modules or

external interrupts.

19.5 Aborting a Conversion

Clearing the ADON bit during a conversion will abort

the current conversion and stop the sampling sequenc-

ing until the next sampling trigger. The ADCBUF will not

be updated with the partially completed A/D conversion

sample. That is, the ADCBUF will continue to contain

the value of the last completed conversion (or the last

value written to the ADCBUF register).

If the clearing of the ADON bit coincides with an auto-

start, the clearing has a higher priority and a new

conversion will not start.

After the A/D conversion is aborted, a 2 TAD wait is

required before the next sampling may be started by

setting the SAMP bit.

19.6 Selecting the A/D Conversion

Clock

The A/D conversion requires 15 TAD. The source of the

A/D conversion clock is software selected, using a

six-bit counter. There are 64 possible options for TAD.

EQUATION 19-1: A/D CONVERSION CLOCK

The internal RC oscillator is selected by setting the

ADRC bit.

For correct A/D conversions, the A/D conversion clock

(TAD) must be selected to ensure a minimum TAD time

of 667 nsec. Table 19-1 shows the resultant TAD times

derived from the device operating frequencies and the

A/D clock source selected, (for VDD = 5V).

TABLE 19-1: TYPICAL TAD vs. DEVICE OPERATING FREQUENCIES

TAD = TCY * (0.5*(ADCS<5:0> + 1))

A/D Clock Period (TAD Values)

A/D Clock Source Select Device FCY

A/D

Clock ADRC ADCS<5:0> 30 MHz 25 MHz 12.5 MHz 6.25 MHz 1 MHz

TCY/2 0 000000 16.67 ns(2) 20 ns(2) 40 ns(2) 80 ns(2) 500 ns(2)

TCY 0 000001 33.33 ns(2) 40 ns(2) 80 ns(2) 160 ns(2) 1.0 µs

2 TCY 0 000011 66.66 ns(2 80 ns(2) 160 ns(2) 320 ns(2) 2.0 µs(3)

4 TCY 0 000111 133.32 ns(2) 160 ns(2) 320 ns(2) 640 ns(2) 4.0 µs(3)

8 TCY 0 001111 266.64 ns(2) 320 ns(2) 640 ns(2) 1.28 µs(3) 8.0 µs(3)

16 TCY 0 011111 533.28 ns(2) 640 ns(2) 1.28 µs(3) 2.56 µs(3) 16.0 µs(3)

RC 1 xxxxxx 200-400 ns(1,4) 200-400 ns(1,4) 200-400 ns(1,4) 200-400 ns(1,4) 200-400 ns(1)

Note 1: The RC source has a typical TAD time of 300 ns for VDD > 3.0V.

2: These values violate the minimum required TAD time of 667 ns.

3: For faster conversion times, the selection of another clock source is recommended.

4: A/D cannot meet full accuracy with RC clock source and FOSC > 20 MHz.

dsPIC30F

DS70083C-page 144 Advance Information  2003 Microchip Technology Inc.

19.7 A/D Acquisition Requirements

For the A/D converter to meet its specified accuracy,

the charge holding capacitor (CHOLD) must be allowed

to fully charge to the input channel voltage level. The

analog input model is shown in Figure 19-2. The

source impedance (RS) and the internal sampling

switch (RSS) impedance directly affect the time

required to charge the capacitor CHOLD. The sampling

switch (RSS) impedance varies over the device voltage

(VDD), see Figure 19-2. The impedance for analog

sources must be small enough to meet accuracy

requirements at the given speed. After the analog input

channel is selected (changed), this sampling must be

done before the conversion can be started.

To calculate the minimum acquisition time, Equation 19-

2 may be used. This equation assumes that the input is

stepped some multiple (n) of the LSB step size and the

output must be captured to within 1/2 LSb error

(8192 steps for 12-bit A/D).

EQUATION 19-2: A/D SAMPLING TIME

EQUATIONS

FIGURE 19-2: ANALOG INPUT MODEL

Note: The CHOLD is 18 pF for the A/D.

∆VO= ∆VI • (1 – e (-TC/CHOLD (RIC+RSS+RS)))

1 – (∆V

O / ∆VI)=e

(-TC/CHOLD (RIC+RSS+RS))

∆VI=VIN – VREF-

∆V

O= n • LSB – 1/2 LSB

∆V

O / ∆VI= (n • LSB – 1/2 LSB) / n • LSB

1 – (∆V

O / ∆VI) = 1 / 2n

1 / 2n = e (-TC/CHOLD (RIC+RSS+RS))

TC=CHOLD • (RIC+RSS+RS) • -In(1/2 • n)

TSMP = Amplifier Settling Time

+ Holding Capacitor Charging Time (TC)

+Temperature Coefficient †

† The temperature coefficient is only required for

temperatures > 25°C.

TSMP = 0.5 µs

+ CHOLD • (RIC+RSS+RS) • -In(1/2 • n)

+ [(Temp – 25°C)(0.05 µs/°C)]

CPIN

Rs ANx

5 pF

VDD (V)

VT = 0.6V

VT = 0.6V ILEAKAGE

RIC ≤ 1k

Sampling

Switch

SS RSS

CHOLD

= DAC Capacitance

VSS

3.5

2.5

2.0

1.5

1.0

234 5

(RSS kΩ)

VDD

= 18 pF

± 500 nA

Legend: CPIN

ILEAKAGE

RIC

CHOLD

= input capacitance

= threshold voltage

= leakage current at the pin due to

= interconnect resistance

= sampling switch

= sample/hold capacitance (from DAC)

various junctions

Sampling

3.0

0.5

Switch

Note: Values shown here are untested typical values for reference only. Exact electrical specifications are to be determined.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 145

dsPIC30F

19.8 Module Power-down Modes

The module has 3 internal Power modes.

When the ADON bit is ‘1’, the module is in Active mode;

it is fully powered and functional.

When ADON is ‘0’, the module is in Off mode. The dig-

ital and analog portions of the circuit are disabled for

maximum current savings.

In order to return to the Active mode from Off mode, the

user must wait for the ADC circuitry to stabilize.

19.9 A/D Operation During CPU Sleep

and Idle Modes

19.9.1 A/D OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shutdown and stay at logic ‘0’.

If Sleep occurs in the middle of a conversion, the con-

version is aborted. The converter will not continue with

a partially completed conversion on exit from Sleep

mode.

entering or leaving Sleep mode.

The A/D module can operate during Sleep mode if the

A/D clock source is set to RC (ADRC = 1). When the RC

clock source is selected, the A/D module waits one

instruction cycle before starting the conversion. This

allows the SLEEP instruction to be executed which elim-

inates all digital switching noise from the conversion.

When the conversion is complete, the CONV bit will be

cleared and the result loaded into the ADCBUF register.

If the A/D interrupt is enabled, the device will wake-up

from Sleep. If the A/D interrupt is not enabled, the A/

D module will then be turned off, although the ADON bit

will remain set.

19.9.2 A/D OPERATION DURING CPU IDLE

MODE

The ADSIDL bit selects if the module will stop on Idle or

continue on Idle. If ADSIDL = 0, the module will con-

tinue operation on assertion of Idle mode. If ADSIDL =

1, the module will stop on Idle.

19.10 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the A/D module to be turned off, and any

conversion and sampling sequence is aborted. The val-

ues that are in the ADCBUF registers are not modified.

The A/D Result register will contain unknown data after

a Power-on Reset.

19.11 Output Formats

The A/D result is 12 bits wide. The data buffer RAM is

also 12 bits wide. The 12-bit data can be read in one of

four different formats. The FORM<1:0> bits select the

format. Each of the output formats translates to a 16-bit

result on the data bus. Write data will always be in right

justified (integer) format.

FIGURE 19-3: A/D OUTPUT DATA FORMATS

RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional d11 d10d09d08d07d06d05d04d03d02d01d000000

Fractional d11d10d09d08d07d06d05d04d03d02d01d000000

Signed Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Integer 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

dsPIC30F

DS70083C-page 146 Advance Information  2003 Microchip Technology Inc.

19.12 Configuring Analog Port Pins

The use of the ADPCFG and TRIS registers control the

operation of the A/D port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared (out-

put), the digital output level (VOH or VOL) will be

converted.

The A/D operation is independent of the state of the

CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.

When reading the Port register, all pins configured as

analog input channels will read as cleared.

Pins configured as digital inputs will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins) may cause the

input buffer to consume current that exceeds the

device specifications.

19.13 Connection Considerations

The analog inputs have diodes to VDD and VSS as ESD

protection. This requires that the analog input be

between VDD and VSS. If the input voltage exceeds this

range by greater than 0.3V (either direction), one of the

diodes becomes forward biased and it may damage the

device if the input current specification is exceeded.

An external RC filter is sometimes added for anti-

aliasing of the input signal. The R component should be

selected to ensure that the sampling time requirements

are satisfied. Any external components connected (via

high impedance) to an analog input pin (capacitor,

zener diode, etc.) should have very little leakage

current at the pin.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 147

dsPIC30F

TABLE 19-2: A/D CONVERTER REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

ADCBUF0 0280 — — — — ADC Data Buffer 0 0000 uuuu uuuu uuuu

ADCBUF1 0282 — — — — ADC Data Buffer 1 0000 uuuu uuuu uuuu

ADCBUF2 0284 — — — — ADC Data Buffer 2 0000 uuuu uuuu uuuu

ADCBUF3 0286 — — — — ADC Data Buffer 3 0000 uuuu uuuu uuuu

ADCBUF4 0288 — — — — ADC Data Buffer 4 0000 uuuu uuuu uuuu

ADCBUF5 028A — — — — ADC Data Buffer 5 0000 uuuu uuuu uuuu

ADCBUF6 028C — — — — ADC Data Buffer 6 0000 uuuu uuuu uuuu

ADCBUF7 028E — — — — ADC Data Buffer 7 0000 uuuu uuuu uuuu

ADCBUF8 0290 — — — — ADC Data Buffer 8 0000 uuuu uuuu uuuu

ADCBUF9 0292 — — — — ADC Data Buffer 9 0000 uuuu uuuu uuuu

ADCBUFA 0294 — — — — ADC Data Buffer 10 0000 uuuu uuuu uuuu

ADCBUFB 0296 — — — — ADC Data Buffer 11 0000 uuuu uuuu uuuu

ADCBUFC 0298 — — — — ADC Data Buffer 12 0000 uuuu uuuu uuuu

ADCBUFD 029A — — — — ADC Data Buffer 13 0000 uuuu uuuu uuuu

ADCBUFE 029C — — — — ADC Data Buffer 14 0000 uuuu uuuu uuuu

ADCBUFF 029E — — — — ADC Data Buffer 15 0000 uuuu uuuu uuuu

ADCON1 02A0 ADON —ADSIDL — — — FORM<1:0> SSRC<2:0> —— ASAM SAMP DONE 0000 0000 0000 0000

ADCON2 02A2 VCFG<2:0> —— CSCNA ——BUFS — SMPI<3:0> BUFM ALTS 0000 0000 0000 0000

ADCON3 02A4 — — — SAMC<4:0> ADRC — ADCS<5:0> 0000 0000 0000 0000

ADCHS 02A6 — — — CH0NB CH0SB<3:0> — — — CH0NA CH0SA<3:0> 0000 0000 0000 0000

ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F

DS70083C-page 148 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 149

dsPIC30F

20.0 SYSTEM INTEGRATION

There are several features intended to maximize sys-

tem reliability, minimize cost through elimination of

external components, provide Power Saving Operating

modes and offer code protection:

• Oscillator Selection

• Reset

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Programmable Brown-out Reset (BOR)

• Watchdog Timer (WDT)

• Power Saving Modes (Sleep and Idle)

• Code Protection

• Unit ID Locations

• In-Circuit Serial Programming (ICSP)

dsPIC30F devices have a Watchdog Timer which is

permanently enabled via the configuration bits or can

be software controlled. It runs off its own RC oscillator

for added reliability. There are two timers that offer

necessary delays on power-up. One is the Oscillator

Start-up Timer (OST), intended to keep the chip in

Reset until the crystal oscillator is stable. The other is

the Power-up Timer (PWRT) which provides a delay on

power-up only, designed to keep the part in Reset while

the power supply stabilizes. With these two timers on-

chip, most applications need no external Reset cir-

cuitry.

Sleep mode is designed to offer a very low current

Power-down mode. The user can wake-up from Sleep

through external Reset, Watchdog Timer Wake-up, or

through an interrupt. Several oscillator options are also

made available to allow the part to fit a wide variety of

applications. In the Idle mode, the clock sources are

still active but the CPU is shut-off. The RC oscillator

option saves system cost while the LP crystal option

saves power.

20.1 Oscillator System Overview

The dsPIC30F oscillator system has the following

modules and features:

• Various external and internal oscillator options as

clock sources

• An on-chip PLL to boost internal operating

frequency

• A clock switching mechanism between various

clock sources

• Programmable clock postscaler for system power

savings

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

• Clock Control register (OSCCON)

• Configuration bits for main oscillator selection

Table 20-1 provides a summary of the dsPIC30F Oscil-

lator Operating modes. A simplified diagram of the

oscillator system is shown in Figure 20-1.

TABLE 20-1: OSCILLATOR OPERATING MODES

Oscillator Mode Description

XTL 200 kHz-4 MHz crystal on OSC1:OSC2.

XT 4 MHz-10 MHz crystal on OSC1:OSC2.

XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled.

XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled.

XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1).

LP 32 kHz crystal on SOSCO:SOSCI(2).

HS 10 MHz-25 MHz crystal.

EC External clock input (0-40 MHz).

ECIO External clock input (0-40 MHz), OSC2 pin is I/O.

EC w/ PLL 4x External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1).

EC w/ PLL 8x External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1).

EC w/ PLL 16x External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1).

ERC External RC oscillator, OSC2 pin is FOSC/4 output(3).

ERCIO External RC oscillator, OSC2 pin is I/O(3).

FRC 8 MHz internal RC oscillator.

LPRC 512 kHz internal RC oscillator.

Note 1: dsPIC30F maximum operating frequency of 120 MHz must be met.

2: LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1.

3: Requires external R and C. Frequency operation up to 4 MHz.

dsPIC30F

DS70083C-page 150 Advance Information  2003 Microchip Technology Inc.

Configuration bits determine the clock source upon

Power-on Reset (POR) and Brown-out Reset (BOR).

Thereafter, the clock source can be changed between

permissible clock sources. The OSCCON register con-

trols the clock switching and reflects system clock

related status bits.

FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM

Primary

OSC1

OSC2

SOSCO

SOSCI

Oscillator

32 kHz LP

Clock

and Control

Block

Switching

Oscillator

x4, x8, x16

PLL

Primary

Oscillator

Stability Detector

Secondary

Oscillator

Programmable

Clock Divider

Oscillator

Start-up

Timer

Fail-Safe Clock

Monitor (FSCM)

Internal Fast RC

Oscillator (FRC)

Internal Low

Power RC

Oscillator (LPRC)

PWRSAV Instruction

Wake-up Request

Oscillator Configuration bits

System

Clock

Oscillator Trap

To Timer1

LPRC

FRC

Secondary Osc

POR Done

Primary Osc

FPLL

POST<1:0>

FCKSM<1:0>

PLL

Lock COSC<1:0>

NOSC<1:0>

OSWEN

 2003 Microchip Technology Inc. Advance Information DS70083C-page 151

dsPIC30F

20.2 Oscillator Configurations

20.2.1 INITIAL CLOCK SOURCE

SELECTION

While coming out of Power-on Reset or Brown-out

Reset, the device selects its clock source based on:

a) FOS<1:0> configuration bits that select one of

four oscillator groups,

b) and FPR<3:0> configuration bits that select one

of 13 oscillator choices within the primary group.

The selection is as shown in Table 20-2.

TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator Mode Oscillator

Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2

Function

EC Primary 111011 CLKO

ECIO Primary 111100 I/O

EC w/ PLL 4x Primary 111101 I/O

EC w/ PLL 8x Primary 111110 I/O

EC w/ PLL 16x Primary 111111 I/O

ERC Primary 111001 CLKO

ERCIO Primary 111000 I/O

XT Primary 110100 OSC2

XT w/ PLL 4x Primary 110101 OSC2

XT w/ PLL 8x Primary 110110 OSC2

XT w/ PLL 16x Primary 110111 OSC2

XTL Primary 11000X OSC2

HS Primary 11001X OSC2

LP Secondary 0 0 ————(Notes 1, 2)

FRC Internal FRC 0 1 ————(Notes 1, 2)

LPRC Internal LPRC 1 0 ————(Notes 1, 2)

Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>).

2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is

selected at all times.

dsPIC30F

DS70083C-page 152 Advance Information  2003 Microchip Technology Inc.

20.2.2 OSCILLATOR START-UP TIMER

(OST)

In order to ensure that a crystal oscillator (or ceramic

resonator) has started and stabilized, an Oscillator

Start-up Timer is included. It is a simple 10-bit counter

that counts 1024 TOSC cycles before releasing the

oscillator clock to the rest of the system. The time-out

period is designated as TOST. The TOST time is involved

every time the oscillator has to restart (i.e., on POR,

BOR and wake-up from Sleep). The Oscillator Start-up

Timer is applied to the LP oscillator, XT, XTL, and HS

modes (upon wake-up from Sleep, POR and BOR) for

the primary oscillator.

20.2.3 LP OSCILLATOR CONTROL

Enabling the LP oscillator is controlled with two

elements:

1. The current oscillator group bits COSC<1:0>.

2. The LPOSCEN bit (OSCON register).

The LP oscillator is on (even during Sleep mode) if

LPOSCEN = 1. The LP oscillator is the device clock if:

•COSC<1:0> = 00 (LP selected as main oscillator)

and

• LPOSCEN = 1

Keeping the LP oscillator on at all times allows for a fast

switch to the 32 kHz system clock for lower power oper-

ation. Returning to the faster main oscillator will still

require a start-up time

20.2.4 PHASE LOCKED LOOP (PLL)

The PLL multiplies the clock which is generated by the

primary oscillator. The PLL is selectable to have either

gains of x4, x8, and x16. Input and output frequency

ranges are summarized in Table 20-3.

TABLE 20-3: PLL FREQUENCY RANGE

The PLL features a lock output which is asserted when

the PLL enters a phase locked state. Should the loop

fall out of lock (e.g., due to noise), the lock signal will be

rescinded. The state of this signal is reflected in the

read only LOCK bit in the OSCCON register.

20.2.5 FAST RC OSCILLATOR (FRC)

The FRC oscillator is a fast (8 MHz nominal) internal

RC oscillator. This oscillator is intended to provide rea-

sonable device operating speeds without the use of an

external crystal, ceramic resonator, or RC network.

The dsPIC30F operates from the FRC oscillator when-

ever the current oscillator selection control bits in the

OSCCON register (OSCCON<13:12>) are set to ‘01’.

20.2.6 LOW POWER RC OSCILLATOR

(LPRC)

The LPRC oscillator is a component of the Watchdog

Timer (WDT) and oscillates at a nominal frequency of

512 kHz. The LPRC oscillator is the clock source for

the Power-up Timer (PWRT) circuit, WDT, and clock

monitor circuits. It may also be used to provide a low

frequency clock source option for applications where

power consumption is critical and timing accuracy is

not required

The LPRC oscillator is always enabled at a Power-on

Reset because it is the clock source for the PWRT.

After the PWRT expires, the LPRC oscillator will

remain on if one of the following is TRUE:

• The Fail-Safe Clock Monitor is enabled

• The WDT is enabled

• The LPRC oscillator is selected as the system

clock via the COSC<1:0> control bits in the

OSCCON register

If one of the above conditions is not true, the LPRC will

shut-off after the PWRT expires.

FIN PLL

Multiplier FOUT

4 MHz-10 MHz x4 16 MHz-40 MHz

4 MHz-10 MHz x8 32 MHz-80 MHz

4 MHz-7.5 MHz x16 64 MHz-160 MHz

Note 1: OSC2 pin function is determined by the

Primary Oscillator mode selection

(FPR<3:0>).

2: OSC1 pin cannot be used as an I/O pin

even if the secondary oscillator or an

internal clock source is selected at all

times.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 153

dsPIC30F

20.2.7 FAIL-SAFE CLOCK MONITOR

The Fail-Safe Clock Monitor (FSCM) allows the device

to continue to operate even in the event of an oscillator

failure. The FSCM function is enabled by appropriately

programming the FCKSM configuration bits (clock

switch and monitor selection bits) in the FOSC Device

Configuration register. If the FSCM function is enabled,

the LPRC internal oscillator will run at all times (except

during Sleep mode) and will not be subject to control by

the SWDTEN bit.

In the event of an oscillator failure, the FSCM will gen-

erate a clock failure trap event and will switch the sys-

tem clock over to the FRC oscillator. The user will then

have the option to either attempt to restart the oscillator

or execute a controlled shutdown. The user may decide

to treat the trap as a warm Reset by simply loading the

Reset address into the oscillator fail trap vector. In this

event, the CF (Clock Fail) status bit (OSCCON<3>) is

also set whenever a clock failure is recognized.

In the event of a clock failure, the WDT is unaffected

and continues to run on the LPRC clock.

If the oscillator has a very slow start-up time coming out

of POR, BOR or Sleep, it is possible that the PWRT

timer will expire before the oscillator has started. In

such cases, the FSCM will be activated and the FSCM

will initiate a clock failure trap, and the COSC<1:0> bits

are loaded with FRC oscillator selection. This will effec-

tively shut-off the original oscillator that was trying to

start.

The user may detect this situation and restart the

oscillator in the clock fail trap ISR.

Upon a clock failure detection, the FSCM module will

initiate a clock switch to the FRC oscillator as follows:

1. The COSC bits (OSCCON<13:12>) are loaded

with the FRC oscillator selection value.

2. CF bit is set (OSCCON<3>).

3. OSWEN control bit (OSCCON<0>) is cleared.

For the purpose of clock switching, the clock sources

are sectioned into four groups:

1. Primary

2. Secondary

3. Internal FRC

4. Internal LPRC

The user can switch between these functional groups

but cannot switch between options within a group. If the

primary group is selected, then the choice within the

group is always determined by the FPR<3:0>

configuration bits.

The OSCCON register holds the control and status bits

related to clock switching.

• COSC<1:0>: Read only status bits always reflect

the current oscillator group in effect.

• NOSC<1:0>: Control bits which are written to

indicate the new oscillator group of choice.

- On POR and BOR, COSC<1:0> and

NOSC<1:0> are both loaded with the

configuration bit values FOS<1:0>.

• LOCK: The LOCK status bit indicates a PLL lock.

• CF: Read only status bit indicating if a clock fail

detect has occurred.

• OSWEN: Control bit changes from a ‘0’ to a ‘1’

when a clock transition sequence is initiated.

Clearing the OSWEN control bit will abort a clock

transition in progress (used for hang-up

situations).

If configuration bits FCKSM<1:0> = 1x, then the clock

switching and Fail-Safe Clock monitoring functions are

disabled. This is the default configuration bit setting.

If clock switching is disabled, then the FOS<1:0> and

FPR<3:0> bits directly control the oscillator selection

and the COSC<1:0> bits do not control the clock selec-

tion. However, these bits will reflect the clock source

selection.

20.2.8 PROTECTION AGAINST

ACCIDENTAL WRITES TO OSCCON

A write to the OSCCON register is intentionally made

difficult because it controls clock switching and clock

scaling.

To write to the OSCCON low byte, the following code

sequence must be executed without any other

instructions in between:

Byte write is allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

To write to the OSCCON high byte, the following

instructions must be executed without any other

instructions in between:

Byte write is allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

Note: The application should not attempt to

switch to a clock of frequency lower than

100 KHz when the fail-safe clock monitor is

enabled. If such clock switching is

performed, the device may generate an

oscillator fail trap and switch to the Fast RC

oscillator.

Byte Write “0x46” to OSCCON low

Byte Write “0x57” to OSCCON low

Byte Write “0x78” to OSCCON high

Byte Write “0x9A” to OSCCON high

dsPIC30F

DS70083C-page 154 Advance Information  2003 Microchip Technology Inc.

20.3 Reset

The dsPIC30F differentiates between various kinds of

Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during normal

operation)

e) Programmable Brown-out Reset (BOR)

f) RESET Instruction

g) Reset caused by trap lockup (TRAPR)

h) Reset caused by illegal opcode or by using an

uninitialized W register as an address pointer

(IOPUWR)

Different registers are affected in different ways by var-

ious Reset conditions. Most registers are not affected

by a WDT wake-up since this is viewed as the resump-

tion of normal operation. Status bits from the RCON

situations, as indicated in Table 20-4. These bits are

used in software to determine the nature of the Reset.

A block diagram of the On-Chip Reset Circuit is shown

in Figure 20-2.

A MCLR noise filter is provided in the MCLR Reset

path. The filter detects and ignores small pulses.

Internally generated Resets do not drive MCLR pin low.

FIGURE 20-2: RESET SYSTEM BLOCK DIAGRAM

20.3.1 POR: POWER-ON RESET

A power-on event will generate an internal POR pulse

when a VDD rise is detected. The Reset pulse will occur

at the POR circuit threshold voltage (VPOR) which is

nominally 1.85V. The device supply voltage character-

istics must meet specified starting voltage and rise rate

requirements. The POR pulse will reset a POR timer

and place the device in the Reset state. The POR also

selects the device clock source identified by the oscil-

lator configuration fuses.

The POR circuit inserts a small delay, TPOR, which is

nominally 10 µs and ensures that the device bias cir-

cuits are stable. Furthermore, a user selected power-

up time-out (TPWRT) is applied. The TPWRT parameter

is based on device configuration bits and can be 0 ms

(no delay), 4 ms, 16 ms, or 64 ms. The total delay is at

device power-up, TPOR + TPWRT. When these delays

have expired, SYSRST will be negated on the next

leading edge of the Q1 clock and the PC will jump to the

Reset vector.

The timing for the SYSRST signal is shown in

Figure 20-3 through Figure 20-5.

MCLR

VDD

VDD Rise

Detect

POR

SYSRST

Sleep or Idle

Brown-out

Reset BOREN

RESET

Instruction

WDT

Module

Digital

Glitch Filter

BOR

Trap Conflict

Illegal Opcode/

Uninitialized W Register

 2003 Microchip Technology Inc. Advance Information DS70083C-page 155

dsPIC30F

FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

TPWRT

TOST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL Reset

MCLR

TPWRT

TOST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL Reset

MCLR

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL Reset

TPWRT

TOST

dsPIC30F

DS70083C-page 156 Advance Information  2003 Microchip Technology Inc.

20.3.1.1 POR with Long Crystal Start-up Time

(with FSCM Enabled)

The oscillator start-up circuitry is not linked to the POR

circuitry. Some crystal circuits (especially low fre-

quency crystals) will have a relatively long start-up

time. Therefore, one or more of the following conditions

is possible after the POR timer and the PWRT have

expired:

• The oscillator circuit has not begun to oscillate.

• The Oscillator Start-up Timer has not expired (if a

crystal oscillator is used).

• The PLL has not achieved a LOCK (if PLL is

used).

If the FSCM is enabled and one of the above conditions

is true, then a clock failure trap will occur. The device

will automatically switch to the FRC oscillator and the

user can switch to the desired crystal oscillator in the

trap ISR.

20.3.1.2 Operating without FSCM and PWRT

If the FSCM is disabled and the Power-up Timer

(PWRT) is also disabled, then the device will exit rap-

idly from Reset on power-up. If the clock source is

FRC, LPRC, EXTRC or EC, it will be active

immediately.

If the FSCM is disabled and the system clock has not

started, the device will be in a frozen state at the Reset

vector until the system clock starts. From the user’s

perspective, the device will appear to be in Reset until

a system clock is available.

20.3.2 BOR: PROGRAMMABLE

BROWN-OUT RESET

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit. The main purpose of

the BOR module is to generate a device Reset when a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (i.e.,

missing portions of the AC cycle waveform due to bad

power transmission lines, or voltage sags due to exces-

sive current draw when a large inductive load is turned

on).

The BOR module allows selection of one of the

following voltage trip points:

•2.0V

•2.7V

•4.2V

•4.5V

A BOR will generate a Reset pulse which will reset the

device. The BOR will select the clock source based on

the device configuration bit values (FOS<1:0> and

FPR<3:0>). Furthermore, if an Oscillator mode is

selected, the BOR will activate the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, then the clock will be held

until the LOCK bit (OSCCON<5>) is ‘1’.

Concurrently, the POR time-out (TPOR) and the PWRT

time-out (TPWRT) will be applied before the internal Reset

is released. If TPWRT = 0 and a crystal oscillator is being

used, then a nominal delay of TFSCM = 100 µs is applied.

The total delay in this case is (TPOR + TFSCM).

The BOR status bit (RCON<1>) will be set to indicate

that a BOR has occurred. The BOR circuit, if enabled,

will continue to operate while in Sleep or Idle modes

and will reset the device should VDD fall below the BOR

threshold voltage.

FIGURE 20-6: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

Note: The BOR voltage trip points indicated here

are nominal values provided for design

guidance only. Refer to the Electrical

Specifications in the specific device data

sheet for BOR voltage limit specifications.

Note: Dedicated supervisory devices, such as

the MCP1XX and MCP8XX, may also be

used as an external Power-on Reset

circuit.

Note 1: External Power-on Reset circuit is required

only if the VDD power-up slope is too slow.

The diode D helps discharge the capacitor

quickly when VDD powers down.

2: R should be suitably chosen so as to make

sure that the voltage drop across R does not

violate the device’s electrical specifications.

3: R1 should be suitably chosen so as to limit

any current flowing into MCLR from external

capacitor C, in the event of MCLR/VPP pin

breakdown due to Electrostatic Discharge

(ESD), or Electrical Overstress (EOS).

VDD

dsPIC30F

MCLR

 2003 Microchip Technology Inc. Advance Information DS70083C-page 157

dsPIC30F

Table 20-4 shows the Reset conditions for the RCON

are R/W, the information in the table implies that all the

bits are negated prior to the action specified in the

condition column.

TABLE 20-4: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR

Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1

Brown-out Reset 0x000000 0 0 0 0 0 0 0 0 1

MCLR Reset during normal

operation

0x000000 0 0 1 0 0 0 0 0 0

Software Reset during

normal operation

0x000000 0 0 0 1 0 0 0 0 0

MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0

MCLR Reset during Idle 0x000000 0 0 1 0 0 1 0 0 0

WDT Time-out Reset 0x000000 0 0 0 0 1 0 0 0 0

WDT Wake-up PC + 2 0 0 0 0 1 0 1 0 0

Interrupt Wake-up from

Sleep

PC + 2(1) 000000100

Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0

Trap Reset 0x000000 1 0 0 0 0 0 0 0 0

Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

dsPIC30F

DS70083C-page 158 Advance Information  2003 Microchip Technology Inc.

Table 20-5 shows a second example of the bit

conditions for the RCON register. In this case, it is not

assumed the user has set/cleared specific bits prior to

action specified in the condition column.

TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR

Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1

Brown-out Reset 0x000000 u u u u u u u 0 1

MCLR Reset during normal

operation

0x000000 u u 1 0 0 0 0 u u

Software Reset during

normal operation

0x000000 u u 0 1 0 0 0 u u

MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u

MCLR Reset during Idle 0x000000 u u 1 u 0 1 0 u u

WDT Time-out Reset 0x000000 u u 0 0 1 0 0 u u

WDT Wake-up PC + 2 u u u u 1 u 1 u u

Interrupt Wake-up from

Sleep

PC + 2(1) uuuuuu1uu

Clock Failure Trap 0x000004 u u u u u u u u u

Trap Reset 0x000000 1 u u u u u u u u

Illegal Operation Reset 0x000000 u 1 u u u u u u u

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’

Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 159

dsPIC30F

20.4 Watchdog Timer (WDT)

20.4.1 WATCHDOG TIMER OPERATION

The primary function of the Watchdog Timer (WDT) is

to reset the processor in the event of a software mal-

function. The WDT is a free-running timer which runs

off an on-chip RC oscillator, requiring no external com-

ponent. Therefore, the WDT timer will continue to oper-

ate even if the main processor clock (e.g., the crystal

oscillator) fails.

20.4.2 ENABLING AND DISABLING

THE WDT

The Watchdog Timer can be “Enabled” or “Disabled”

only through a configuration bit (FWDTEN) in the

Configuration register, FWDT.

Setting FWDTEN = 1 enables the Watchdog Timer. The

enabling is done when programming the device. By

default, after chip erase, FWDTEN bit = 1. Any device

programmer capable of programming dsPIC30F

devices allows programming of this and other

configuration bits.

If enabled, the WDT will increment until it overflows or

“times out”. A WDT time-out will force a device Reset

(except during Sleep). To prevent a WDT time-out, the

user must clear the Watchdog Timer using a CLRWDT

instruction.

If a WDT times out during Sleep, the device will wake-

up. The WDTO bit in the RCON register will be cleared

to indicate a wake-up resulting from a WDT time-out.

Setting FWDTEN = 0 allows user software to enable/

disable the Watchdog Timer via the SWDTEN

(RCON<5>) control bit.

20.5 Low Voltage Detect

The Low Voltage Detect (LVD) module is used to detect

when the VDD of the device drops below a threshold

value, VLVD, which is determined by the LVDL<3:0>

bits (RCON<11:8>) and is thus user programmable.

The internal voltage reference circuitry requires a nom-

inal amount of time to stabilize, and the BGST bit

(RCON<13>) indicates when the voltage reference has

stabilized.

In some devices, the LVD threshold voltage may be

applied externally on the LVDIN pin.

The LVD module is enabled by setting the LVDEN bit

(RCON<12>).

20.6 Power Saving Modes

There are two power saving states that can be entered

through the execution of a special instruction, PWRSAV;

these are Sleep and Idle.

The format of the PWRSAV instruction is as follows:

PWRSAV <parameter>, where ‘parameter’ defines

Idle or Sleep mode.

20.6.1 SLEEP MODE

In Sleep mode, the clock to the CPU and peripherals is

shutdown. If an on-chip oscillator is being used, it is

shutdown.

The Fail-Safe Clock Monitor is not functional during

Sleep since there is no clock to monitor. However,

LPRC clock remains active if WDT is operational during

Sleep.

The brown-out protection circuit and the Low Voltage

Detect circuit, if enabled, will remain functional during

Sleep.

The processor wakes up from Sleep if at least one of

the following conditions has occurred:

• any interrupt that is individually enabled and

meets the required priority level

• any Reset (POR, BOR and MCLR)

• WDT time-out

On waking up from Sleep mode, the processor will

restart the same clock that was active prior to entry into

Sleep mode. When clock switching is enabled, bits

COSC<1:0> will determine the oscillator source that

will be used on wake-up. If clock switch is disabled,

then there is only one system clock.

If the clock source is an oscillator, the clock to the

device will be held off until OST times out (indicating a

stable oscillator). If PLL is used, the system clock is

held off until LOCK = 1 (indicating that the PLL is

stable). In either case, TPOR, TLOCK and TPWRT delays

are applied.

If EC, FRC, LPRC or EXTRC oscillators are used, then

a delay of TPOR (~ 10 µs) is applied. This is the smallest

delay possible on wake-up from Sleep.

Moreover, if LP oscillator was active during Sleep and

LP is the oscillator used on wake-up, then the start-up

delay will be equal to TPOR. PWRT delay and OST

timer delay are not applied. In order to have -the small-

est possible start-up delay when waking up from Sleep,

one of these faster wake-up options should be selected

before entering Sleep.

Note: If a POR or BOR occurred, the selection of

the oscillator is based on the FOS<1:0>

and FPR<3:0> configuration bits.

dsPIC30F

DS70083C-page 160 Advance Information  2003 Microchip Technology Inc.

Any interrupt that is individually enabled (using the cor-

responding IE bit) and meets the prevailing priority level

will be able to wake-up the processor. The processor will

process the interrupt and branch to the ISR. The Sleep

status bit in the RCON register is set upon wake-up.

All Resets will wake-up the processor from Sleep

mode. Any Reset, other than POR, will set the Sleep

status bit. In a POR, the Sleep bit is cleared.

If the Watchdog Timer is enabled, then the processor

will wake-up from Sleep mode upon WDT time-out. The

Sleep and WDTO status bits are both set.

20.6.2 IDLE MODE

In Idle mode, the clock to the CPU is shutdown while

peripherals keep running. Unlike Sleep mode, the clock

source remains active.

Several peripherals have a control bit in each module

that allows them to operate during Idle.

LPRC Fail-Safe Clock remains active if clock failure

detect is enabled.

The processor wakes up from Idle if at least one of the

following conditions has occurred:

• any interrupt that is individually enabled (IE bit is

‘1’) and meets the required priority level

• any Reset (POR, BOR, MCLR)

• WDT time-out

Upon wake-up from Idle mode, the clock is re-applied

to the CPU and instruction execution begins immedi-

ately, starting with the instruction following the PWRSAV

instruction.

Any interrupt that is individually enabled (using IE bit)

and meets the prevailing priority level will be able to

wake-up the processor. The processor will process the

interrupt and branch to the ISR. The Idle status bit in

the RCON register is set upon wake-up.

Any Reset other than POR will set the Idle status bit.

On a POR, the Idle bit is cleared.

If Watchdog Timer is enabled, then the processor will

wake-up from Idle mode upon WDT time-out. The Idle

and WDTO status bits are both set.

Unlike wake-up from Sleep, there are no time delays

involved in wake-up from Idle.

20.7 Device Configuration Registers

The configuration bits in each device configuration reg-

ister specify some of the Device modes and are

programmed by a device programmer, or by using the

In-Circuit Serial Programming™ (ICSP™) feature of

the device. Each device configuration register is a

24-bit register, but only the lower 16 bits of each regis-

ter are used to hold configuration data. There are four

device configuration registers available to the user:

1. FOSC (0xF80000): Oscillator Configuration

2. FWDT (0xF80002): Watchdog Timer

Configuration Register

3. FBORPOR (0xF80004): BOR and POR

Configuration Register

4. FGS (0xF8000A): General Code Segment

Configuration Register

The placement of the configuration bits is automatically

handled when you select the device in your device pro-

grammer. The desired state of the configuration bits

may be specified in the source code (dependent on the

language tool used), or through the programming inter-

face. After the device has been programmed, the appli-

cation software may read the configuration bit values

through the table read instructions. For additional infor-

mation, please refer to the Programming Specifications

of the device.

Note: In spite of various delays applied (TPOR,

TLOCK and TPWRT), the crystal oscillator

(and PLL) may not be active at the end of

the time-out (e.g., for low frequency crys-

tals). In such cases, if FSCM is enabled,

then the device will detect this as a clock

failure and process the clock failure trap, the

FRC oscillator will be enabled and the user

will have to re-enable the crystal oscillator. If

FSCM is not enabled, then the device will

simply suspend execution of code until the

clock is stable and will remain in Sleep until

the oscillator clock has started.

Note: If the code protection configuration fuse

bits (FGS<GCP> and FGS<GWRP>)

have been programmed, an erase of the

entire code-protected device is only

possible at voltages VDD ≥ 4.5V.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 161

dsPIC30F

20.8 Peripheral Module Disable (PMD)

Registers

The Peripheral Module Disable (PMD) registers pro-

vide a method to disable a peripheral module by stop-

ping all clock sources supplied to that module. When a

peripheral is disabled via the appropriate PMD control

bit, the peripheral is in a minimum power consumption

state. The control and status registers associated with

the peripheral will also be disabled so writes to those

registers will have no effect and read values will be

invalid.

A peripheral module will only be enabled if both the

associated bit in the the PMD register is cleared and

the peripheral is supported by the specific dsPIC vari-

ant. If the peripheral is present in the device, it is

enabled in the PMD register by default.

20.9 In-Circuit Debugger

When MPLAB ICD2 is selected as a Debugger, the In-

Circuit Debugging functionality is enabled. This func-

tion allows simple debugging functions when used with

MPLAB IDE. When the device has this feature enabled,

some of the resources are not available for general

use. These resources include the first 80 bytes of Data

RAM and two I/O pins.

One of four pairs of Debug I/O pins may be selected by

the user using configuration options in MPLAB IDE.

These pin pairs are named EMUD/EMUC, EMUD1/

EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.

In each case, the selected EMUD pin is the Emulation/

Debug Data line, and the EMUC pin is the Emulation/

Debug Clock line. These pins will interface to the

MPLAB ICD 2 module available from Microchip. The

selected pair of Debug I/O pins is used by MPLAB

ICD 2 to send commands and receive responses, as

well as to send and receive data. To use the In-Circuit

Debugger function of the device, the design must

implement ICSP connections to MCLR, VDD, VSS,

PGC, PGD, and the selected EMUDx/EMUCx pin pair.

This gives rise to two possibilities:

1. If EMUD/EMUC is selected as the Debug I/O pin

pair, then only a 5-pin interface is required, as

the EMUD and EMUC pin functions are multi-

plexed with the PGD and PGC pin functions in

all dsPIC30F devices.

2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/

EMUC3 is selected as the Debug I/O pin pair,

then a 7-pin interface is required, as the

EMUDx/EMUCx pin functions (x = 1, 2 or 3) are

not multiplexed with the PGD and PGC pin

functions.

Note: If a PMD bit is set, the corresponding mod-

ule is disabled after a delay of 1 instruction

cycle. Similarly, if a PMD bit is cleared, the

corresponding module is enabled after a

delay of 1 instruction cycle (assuming the

module control registers are already

configured to enable module operation).

dsPIC30F

DS70083C-page 162 Advance Information  2003 Microchip Technology Inc.

TABLE 20-6: SYSTEM INTEGRATION REGISTER MAP

TABLE 20-7: DEVICE CONFIGURATION REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

RCON 0740 TRAPR IOPUWR BGST LVDEN LVDL<3:0> EXTR SWR SWDTEN WDTO Sleep Idle BOR POR (Note 1)

OSCCON 0742 — — COSC<1:0> — — NOSC<1:0> POST<1:0> LOCK —CF— LPOSCEN OSWEN (Note 2)

PMD1 0770 T5MD T4MD T3MD T2MD T1MD —— DCIMD I2CMD U2MD U1MD SPI2MD SPI1MD C2MD C1MD ADCMD 0000 0000 0000 0000

PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 0000 0000 0000

Note 1: Reset state depends on type of Reset.

2: Reset state depends on configuration bits.

File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

FOSC F80000 — FSCKM<1:0> — — — — FOS<1:0> ———— FPR<3:0>

FWDT F80002 — FWDTEN — — — — — — — — — FWPSA<1:0> FWPSB<3:0>

FBORPOR F80004 — MCLREN — — — — — — —BOREN— BORV<1:0> — — FPWRT<1:0>

FGS F8000A — — — — — — — — — — — — — — — GCP GWRP

 2003 Microchip Technology Inc. Advance Information DS70083C-page 163

dsPIC30F

21.0 INSTRUCTION SET SUMMARY

The dsPIC30F instruction set adds many

enhancements to the previous PICmicro® instruction

sets, while maintaining an easy migration from

PICmicro instruction sets.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single word instruction is a 24-bit word divided

into an 8-bit opcode which specifies the instruction

type, and one or more operands which further specify

the operation of the instruction.

The instruction set is highly orthogonal and is grouped

into five basic categories:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• DSP operations

• Control operations

Table 21-1 shows the general symbols used in

describing the instructions.

The dsPIC30F instruction set summary in Table 21-2

lists all the instructions, along with the status flags

affected by each instruction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand which is typically a

• The second source operand which is typically a

• The destination of the result which is typically a

However, word or byte-oriented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could either be the file

‘WREG’

Most bit-oriented instructions (including simple rotate/

shift instructions) have two operands:

• The W register (with or without an address

modifier) or file register (specified by the value of

‘Ws’ or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The literal instructions that involve data movement may

use some of the following operands:

• A literal value to be loaded into a W register or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand which is a register ‘Wb’

without any address modifier

• The second source operand which is a literal

value

• The destination of the result (only if not the same

as the first source operand) which is typically a

The MAC class of DSP instructions may use some of the

following operands:

• The accumulator (A or B) to be used (required

operand)

• The W registers to be used as the two operands

• The X and Y address space pre-fetch operations

• The X and Y address space pre-fetch destinations

• The accumulator write back destination

The other DSP instructions do not involve any

multiplication, and may include:

• The accumulator to be used (required)

• The source or destination operand (designated as

Wso or Wdo, respectively) with or without an

address modifier

• The amount of shift specified by a W register ‘Wn’

or a literal value

The control instructions may use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

dsPIC30F

DS70083C-page 164 Advance Information  2003 Microchip Technology Inc.

All instructions are a single word, except for certain

double-word instructions, which were made double-

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8 MSbs are ‘0’s. If this second word is executed as an

instruction (by itself), it will execute as a NOP.

Most single word instructions are executed in a single

instruction cycle, unless a conditional test is true or the

program counter is changed as a result of the instruc-

tion. In these cases, the execution takes two instruction

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/computed branch), indirect CALL/GOTO, all table

reads and writes, and RETURN/RETFIE instructions,

which are single word instructions but take two or three

cycles. Certain instructions that involve skipping over

the subsequent instruction require either two or three

cycles if the skip is performed, depending on whether

the instruction being skipped is a single word or two-

word instruction. Moreover, double-word moves

require two cycles. The double-word instructions

execute in two instruction cycles.

Note: For more details on the instruction set,

refer to the Programmer’s Reference

Manual.

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Means literal defined by “text”

(text) Means “content of text”

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double-Word mode selection

.S Shadow register select

.w Word mode selection (default)

Acc One of two accumulators {A, B}

AWB Accumulator write back destination address register ∈ {W13, [W13]+=2}

bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero

Expr Absolute address, label or expression (resolved by the linker)

f File register address ∈ {0x0000...0x1FFF}

lit1 1-bit unsigned literal ∈ {0,1}

lit4 4-bit unsigned literal ∈ {0...15}

lit5 5-bit unsigned literal ∈ {0...31}

lit8 8-bit unsigned literal ∈ {0...255}

lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal ∈ {0...16384}

lit16 16-bit unsigned literal ∈ {0...65535}

lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0

None Field does not require an entry, may be blank

OA, OB, SA, SB DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate

PC Program Counter

Slit10 10-bit signed literal ∈ {-512...511}

Slit16 16-bit signed literal ∈ {-32768...32767}

Slit6 6-bit signed literal ∈ {-16...16}

 2003 Microchip Technology Inc. Advance Information DS70083C-page 165

dsPIC30F

Wb Base W register ∈ {W0..W15}

Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (direct addressing)

Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈

{W4*W4,W5*W5,W6*W6,W7*W7}

Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈

{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}

Wn One of 16 working registers ∈ {W0..W15}

Wnd One of 16 destination working registers ∈ {W0..W15}

Wns One of 16 source working registers ∈ {W0..W15}

WREG W0 (working register used in file register instructions)

Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx X data space pre-fetch address register for DSP instructions

∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,

[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,

[W9+W12],none}

Wxd X data space pre-fetch destination register for DSP instructions ∈ {W4..W7}

Wy Y data space pre-fetch address register for DSP instructions

∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,

[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,

[W11+W12], none}

Wyd Y data space pre-fetch destination register for DSP instructions ∈ {W4..W7}

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

dsPIC30F

DS70083C-page 166 Advance Information  2003 Microchip Technology Inc.

TABLE 21-2: INSTRUCTION SET OVERVIEW

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words

# of

Cycles

Status Flags

Affected

1 ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB

ADD f f = f + WREG 1 1 C,DC,N,OV,Z

ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z

ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB

2 ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z

3 AND AND f f = f .AND. WREG 1 1 N,Z

AND f,WREG WREG = f .AND. WREG 1 1 N,Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z

4 ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z

5 BCLR BCLR f,#bit4 Bit Clear f 1 1 None

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6 BRA BRA C,Expr Branch if Carry 1 1 (2) None

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None

BRA GT,Expr Branch if greater than 1 1 (2) None

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr Branch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NOV,Expr Branch if Not Overflow 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) None

BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None

BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None

BRA OV,Expr Branch if Overflow 1 1 (2) None

BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None

BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr Branch if Zero 1 1 (2) None

BRA Wn Computed Branch 1 2 None

7 BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 None

8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

 2003 Microchip Technology Inc. Advance Information DS70083C-page 167

dsPIC30F

9 BTG BTG f,#bit4 Bit Toggle f 1 1 None

BTG Ws,#bit4 Bit Toggle Ws 1 1 None

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3)

None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3)

None

11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1

(2 or 3)

None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3)

None

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB

16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep

17 COM COM f f = f 11 N,Z

COM f,WREG WREG = f 11 N,Z

COM Ws,Wd Wd = Ws 11 N,Z

18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z

CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z

19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z

CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z

20 CP1 CP1 f Compare f with 0xFFFF 1 1 C,DC,N,OV,Z

CP1 Ws Compare Ws with 0xFFFF 1 1 C,DC,N,OV,Z

21 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,Ws Compare Wb with Ws, with Borrow

(Wb - Ws - C)

1 1 C,DC,N,OV,Z

22 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3)

None

23 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1

(2 or 3)

None

24 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3)

None

25 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠11

(2 or 3)

None

26 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

27 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z

DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z

DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z

28 DEC2 DEC2 f f = f -2 1 1 C,DC,N,OV,Z

DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z

DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words

# of

Cycles

Status Flags

Affected

dsPIC30F

DS70083C-page 168 Advance Information  2003 Microchip Technology Inc.

29 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

30 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV

31 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV

32 DO DO #lit14,Expr Do code to PC+Expr, lit14+1 times 2 2 None

DO Wn,Expr Do code to PC+Expr, (Wn)+1 times 2 2 None

33 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,

SA,SB,SAB

34 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,

SA,SB,SAB

35 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

36 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C

37 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

38 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C

39 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to indirect 1 2 None

40 INC INC f f = f + 1 1 1 C,DC,N,OV,Z

INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

41 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z

INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z

42 IOR IOR f f = f .IOR. WREG 1 1 N,Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z

43 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

44 LNK LNK #lit14 Link frame pointer 1 1 None

45 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z

46 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,

AWB

Multiply and Accumulate 1 1 OA,OB,OAB,

SA,SB,SAB

MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,

SA,SB,SAB

47 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 N,Z

MOV f,WREG Move f to WREG 1 1 N,Z

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 N,Z

MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None

48 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Pre-fetch and store accumulator 1 1 None

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words

# of

Cycles

Status Flags

Affected

 2003 Microchip Technology Inc. Advance Information DS70083C-page 169

dsPIC30F

49 MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

50 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None

51 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,

AWB

Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

52 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) *

unsigned(Ws)

1 1 None

MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) *

unsigned(lit5)

1 1 None

MUL f W3:W2 = f * WREG 1 1 None

53 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

NEG f f = f + 1 1 1 C,DC,N,OV,Z

NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

54 NOP NOP No Operation 1 1 None

NOPR No Operation 1 1 None

55 POP POP f Pop f from top-of-stack (TOS) 1 1 None

POP Wdo Pop from top-of-stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from top-of-stack (TOS) to

W(nd):W(nd+1)

1 2 None

POP.S Pop Shadow Registers 1 1 All

56 PUSH PUSH f Push f to top-of-stack (TOS) 1 1 None

PUSH Wso Push Wso to top-of-stack (TOS) 1 1 None

PUSH.D Wns Push W(ns):W(ns+1) to top-of-stack (TOS) 1 2 None

PUSH.S Push Shadow Registers 1 1 None

57 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep

58 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

59 REPEAT REPEAT #lit14 Repeat Next Instruction lit14+1 times 1 2 None

REPEAT Wn Repeat Next Instruction (Wn)+1 times 1 2 None

60 RESET RESET Software device Reset 1 1 None

61 RETFIE RETFIE Return from interrupt 1 3 (2) None

62 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

63 RETURN RETURN Return from Subroutine 1 3 (2) None

64 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z

RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z

65 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z

RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z

66 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z

RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z

67 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words

# of

Cycles

Status Flags

Affected

dsPIC30F

DS70083C-page 170 Advance Information  2003 Microchip Technology Inc.

68 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None

SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None

69 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z

70 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xFFFF 1 1 None

71 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,

SA,SB,SAB

SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,

SA,SB,SAB

72 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z

73 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,

SA,SB,SAB

SUB f f = f - WREG 1 1 C,DC,N,OV,Z

SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z

SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z

SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z

SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z

74 SUBB SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z

75 SUBR SUBR f f = WREG - f 1 1 C,DC,N,OV,Z

SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z

SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z

SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z

76 SUBBR SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z

77 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

78 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

79 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None

80 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None

81 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None

82 ULNK ULNK Unlink frame pointer 1 1 None

83 XOR XOR f f = f .XOR. WREG 1 1 N,Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z

84 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic Assembly Syntax Description # of

Words

# of

Cycles

Status Flags

Affected

 2003 Microchip Technology Inc. Advance Information DS70083C-page 171

dsPIC30F

22.0 DEVELOPMENT SUPPORT

The PICmicro® microcontrollers are supported with a

full range of hardware and software development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Assemblers/Compilers/Linkers

- MPASM™ Assembler

- MPLAB C17 and MPLAB C18 C Compilers

- MPLINK™ Object Linker/

MPLIB™ Object Librarian

- MPLAB C30 C Compiler

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

- MPLAB dsPIC30 Software Simulator

• Emulators

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB ICE 4000 In-Circuit Emulator

• In-Circuit Debugger

- MPLAB ICD 2

• Device Programmers

-PRO MATE

® II Universal Device Programmer

- PICSTART® Plus Development Programmer

• Low Cost Demonstration Boards

- PICDEM™ 1 Demonstration Board

- PICDEM.net™ Demonstration Board

- PICDEM 2 Plus Demonstration Board

- PICDEM 3 Demonstration Board

- PICDEM 4 Demonstration Board

- PICDEM 17 Demonstration Board

- PICDEM 18R Demonstration Board

- PICDEM LIN Demonstration Board

- PICDEM USB Demonstration Board

• Evaluation Kits

-K

EELOQ®

- PICDEM MSC

- microID®

-CAN

- PowerSmart®

-Analog

22.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows®

based application that contains:

• An interface to debugging tools

- simulator

- programmer (sold separately)

- emulator (sold separately)

- in-circuit debugger (sold separately)

• A full-featured editor with color coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High level source code debugging

• Mouse over variable inspection

• Extensive on-line help

The MPLAB IDE allows you to:

• Edit your source files (either assembly or C)

• One touch assemble (or compile) and download

to PICmicro emulator and simulator tools

(automatically updates all project information)

• Debug using:

- source files (assembly or C)

- absolute listing file (mixed assembly and C)

- machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost effective

simulators, through low cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increasing flexibility

and power.

22.2 MPASM Assembler

The MPASM assembler is a full-featured, universal

macro assembler for all PICmicro MCUs.

The MPASM assembler generates relocatable object

files for the MPLINK object linker, Intel® standard HEX

files, MAP files to detail memory usage and symbol ref-

erence, absolute LST files that contain source lines and

generated machine code and COFF files for

debugging.

The MPASM assembler features include:

• Integration into MPLAB IDE projects

• User defined macros to streamline assembly code

• Conditional assembly for multi-purpose source

files

• Directives that allow complete control over the

assembly process

dsPIC30F

DS70083C-page 172 Advance Information  2003 Microchip Technology Inc.

22.3 MPLAB C17 and MPLAB C18

C Compilers

The MPLAB C17 and MPLAB C18 Code Development

Systems are complete ANSI C compilers for

Microchip’s PIC17CXXX and PIC18CXXX family of

microcontrollers. These compilers provide powerful

integration capabilities, superior code optimization and

ease of use not found with other compilers.

For easy source level debugging, the compilers provide

symbol information that is optimized to the MPLAB IDE

debugger.

22.4 MPLINK Object Linker/

MPLIB Object Librarian

The MPLINK object linker combines relocatable

objects created by the MPASM assembler and the

MPLAB C17 and MPLAB C18 C compilers. It can link

relocatable objects from pre-compiled libraries, using

directives from a linker script.

The MPLIB object librarian manages the creation and

modification of library files of pre-compiled code. When

a routine from a library is called from a source file, only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, deletion and extraction

22.5 MPLAB C30 C Compiler

The MPLAB C30 C compiler is a full-featured, ANSI

compliant, optimizing compiler that translates standard

ANSI C programs into dsPIC30F assembly language

source. The compiler also supports many command-

line options and language extensions to take full

advantage of the dsPIC30F device hardware capabili-

ties, and afford fine control of the compiler code

generator.

MPLAB C30 is distributed with a complete ANSI C

standard library. All library functions have been vali-

dated and conform to the ANSI C library standard. The

library includes functions for string manipulation,

dynamic memory allocation, data conversion, time-

keeping, and math functions (trigonometric, exponen-

tial and hyperbolic). The compiler provides symbolic

information for high level source debugging with the

MPLAB IDE.

22.6 MPLAB ASM30 Assembler, Linker,

and Librarian

MPLAB ASM30 assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 compiler uses the

assembler to produce it’s object file. The assembler

generates relocatable object files that can then be

archived or linked with other relocatable object files and

archives to create an executable file. Notable features

of the assembler include:

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich directive set

• Flexible macro language

• MPLAB IDE compatibility

22.7 MPLAB SIM Software Simulator

The MPLAB SIM software simulator allows code devel-

opment in a PC hosted environment by simulating the

PICmicro series microcontrollers on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a file, or user defined key press, to any pin. The execu-

tion can be performed in Single-Step, Execute Until

Break, or Trace mode.

The MPLAB SIM simulator fully supports symbolic

debugging using the MPLAB C17 and MPLAB C18

C Compilers, as well as the MPASM assembler. The

software simulator offers the flexibility to develop and

debug code outside of the laboratory environment,

making it an excellent, economical software

development tool.

22.8 MPLAB SIM30 Software Simulator

The MPLAB SIM30 software simulator allows code

development in a PC hosted environment by simulating

the dsPIC30F series microcontrollers on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a file, or user defined key press, to any of the pins.

The MPLAB SIM30 simulator fully supports symbolic

debugging using the MPLAB C30 C Compiler and

MPLAB ASM30 assembler. The simulator runs in either

a Command Line mode for automated tasks, or from

MPLAB IDE. This high speed simulator is designed to

debug, analyze and optimize time intensive DSP

routines.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 173

dsPIC30F

22.9 MPLAB ICE 2000

High Performance Universal

In-Circuit Emulator

The MPLAB ICE 2000 universal in-circuit emulator is

intended to provide the product development engineer

with a complete microcontroller design tool set for

PICmicro microcontrollers. Software control of the

MPLAB ICE 2000 in-circuit emulator is advanced by

the MPLAB Integrated Development Environment,

which allows editing, building, downloading and source

debugging from a single environment.

The MPLAB ICE 2000 is a full-featured emulator sys-

tem with enhanced trace, trigger and data monitoring

features. Interchangeable processor modules allow the

system to be easily reconfigured for emulation of differ-

ent processors. The universal architecture of the

MPLAB ICE in-circuit emulator allows expansion to

support new PICmicro microcontrollers.

The MPLAB ICE 2000 in-circuit emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft® Windows 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

22.10 MPLAB ICE 4000

High Performance Universal

In-Circuit Emulator

The MPLAB ICE 4000 universal in-circuit emulator is

intended to provide the product development engineer

with a complete microcontroller design tool set for high-

end PICmicro microcontrollers. Software control of the

MPLAB ICE in-circuit emulator is provided by the

MPLAB Integrated Development Environment, which

allows editing, building, downloading and source

debugging from a single environment.

The MPLAB ICD 4000 is a premium emulator system,

providing the features of MPLAB ICE 2000, but with

increased emulation memory and high speed perfor-

mance for dsPIC30F and PIC18XXXX devices. Its

advanced emulator features include complex triggering

and timing, up to 2 Mb of emulation memory, and the

ability to view variables in real-time.

The MPLAB ICE 4000 in-circuit emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft Windows 32-bit operating system were cho-

sen to best make these features available in a simple,

unified application.

22.11 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low cost, run-time development tool,

connecting to the host PC via an RS-232 or high speed

USB interface. This tool is based on the Flash

PICmicro MCUs and can be used to develop for these

and other PICmicro microcontrollers. The MPLAB

ICD 2 utilizes the in-circuit debugging capability built

into the Flash devices. This feature, along with

Microchip’s In-Circuit Serial Programming™ (ICSPTM)

protocol, offers cost effective in-circuit Flash debugging

from the graphical user interface of the MPLAB Inte-

grated Development Environment. This enables a

designer to develop and debug source code by setting

breakpoints, single-stepping and watching variables,

CPU status and peripheral registers. Running at full

speed enables testing hardware and applications in

real-time. MPLAB ICD 2 also serves as a development

programmer for selected PICmicro devices.

22.12 PRO MATE II Universal Device

Programmer

The PRO MATE II is a universal, CE compliant device

programmer with programmable voltage verification at

VDDMIN and VDDMAX for maximum reliability. It features

an LCD display for instructions and error messages

and a modular detachable socket assembly to support

various package types. In Stand-Alone mode, the

PRO MATE II device programmer can read, verify, and

program PICmicro devices without a PC connection. It

can also set code protection in this mode.

22.13 PICSTART Plus Development

Programmer

The PICSTART Plus development programmer is an

easy-to-use, low cost, prototype programmer. It con-

nects to the PC via a COM (RS-232) port. MPLAB

Integrated Development Environment software makes

using the programmer simple and efficient. The

PICSTART Plus development programmer supports

most PICmicro devices up to 40 pins. Larger pin count

devices, such as the PIC16C92X and PIC17C76X,

may be supported with an adapter socket. The

PICSTART Plus development programmer is CE

compliant.

dsPIC30F

DS70083C-page 174 Advance Information  2003 Microchip Technology Inc.

22.14 PICDEM 1 PICmicro

Demonstration Board

The PICDEM 1 demonstration board demonstrates the

capabilities of the PIC16C5X (PIC16C54 to

PIC16C58A), PIC16C61, PIC16C62X, PIC16C71,

PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All

necessary hardware and software is included to run

basic demo programs. The sample microcontrollers

provided with the PICDEM 1 demonstration board can

be programmed with a PRO MATE II device program-

mer, or a PICSTART Plus development programmer.

The PICDEM 1 demonstration board can be connected

to the MPLAB ICE in-circuit emulator for testing. A pro-

totype area extends the circuitry for additional applica-

tion components. Features include an RS-232

interface, a potentiometer for simulated analog input,

push button switches and eight LEDs.

22.15 PICDEM.net Internet/Ethernet

Demonstration Board

The PICDEM.net demonstration board is an Internet/

Ethernet demonstration board using the PIC18F452

microcontroller and TCP/IP firmware. The board

supports any 40-pin DIP device that conforms to the

standard pinout used by the PIC16F877 or

PIC18C452. This kit features a user friendly TCP/IP

stack, web server with HTML, a 24L256 Serial

EEPROM for Xmodem download to web pages into

Serial EEPROM, ICSP/MPLAB ICD 2 interface con-

nector, an Ethernet interface, RS-232 interface, and a

16 x 2 LCD display. Also included is the book and

CD-ROM “TCP/IP Lean, Web Servers for Embedded

Systems,” by Jeremy Bentham

22.16 PICDEM 2 Plus

Demonstration Board

The PICDEM 2 Plus demonstration board supports

many 18-, 28-, and 40-pin microcontrollers, including

PIC16F87X and PIC18FXX2 devices. All the neces-

sary hardware and software is included to run the dem-

onstration programs. The sample microcontrollers

provided with the PICDEM 2 demonstration board can

be programmed with a PRO MATE II device program-

mer, PICSTART Plus development programmer, or

MPLAB ICD 2 with a Universal Programmer Adapter.

The MPLAB ICD 2 and MPLAB ICE in-circuit emulators

may also be used with the PICDEM 2 demonstration

board to test firmware. A prototype area extends the

circuitry for additional application components. Some

of the features include an RS-232 interface, a 2 x 16

LCD display, a piezo speaker, an on-board temperature

sensor, four LEDs, and sample PIC18F452 and

PIC16F877 Flash microcontrollers.

22.17 PICDEM 3 PIC16C92X

Demonstration Board

The PICDEM 3 demonstration board supports the

PIC16C923 and PIC16C924 in the PLCC package. All

the necessary hardware and software is included to run

the demonstration programs.

22.18 PICDEM 4 8/14/18-Pin

Demonstration Board

The PICDEM 4 can be used to demonstrate the capa-

bilities of the 8-, 14-, and 18-pin PIC16XXXX and

PIC18XXXX MCUs, including the PIC16F818/819,

PIC16F87/88, PIC16F62XA and the PIC18F1320 fam-

ily of microcontrollers. PICDEM 4 is intended to show-

case the many features of these low pin count parts,

including LIN and Motor Control using ECCP. Special

provisions are made for low power operation with the

super capacitor circuit, and jumpers allow on-board

hardware to be disabled to eliminate current draw in

this mode. Included on the demo board are provisions

for Crystal, RC or Canned Oscillator modes, a five volt

regulator for use with a nine volt wall adapter or battery,

DB-9 RS-232 interface, ICD connector for program-

ming via ICSP and development with MPLAB ICD 2,

2x16 liquid crystal display, PCB footprints for H-Bridge

motor driver, LIN transceiver and EEPROM. Also

included are: header for expansion, eight LEDs, four

potentiometers, three push buttons and a prototyping

area. Included with the kit is a PIC16F627A and a

PIC18F1320. Tutorial firmware is included along with

the User’s Guide.

22.19 PICDEM 17 Demonstration Board

The PICDEM 17 demonstration board is an evaluation

board that demonstrates the capabilities of several

Microchip microcontrollers, including PIC17C752,

PIC17C756A, PIC17C762 and PIC17C766. A pro-

grammed sample is included. The PRO MATE II device

programmer, or the PICSTART Plus development pro-

grammer, can be used to reprogram the device for user

tailored application development. The PICDEM 17

demonstration board supports program download and

execution from external on-board Flash memory. A

generous prototype area is available for user hardware

expansion.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 175

dsPIC30F

22.20 PICDEM 18R PIC18C601/801

Demonstration Board

The PICDEM 18R demonstration board serves to assist

development of the PIC18C601/801 family of Microchip

microcontrollers. It provides hardware implementation

of both 8-bit Multiplexed/De-multiplexed and 16-bit

Memory modes. The board includes 2 Mb external

Flash memory and 128 Kb SRAM memory, as well as

serial EEPROM, allowing access to the wide range of

memory types supported by the PIC18C601/801.

22.21 PICDEM LIN PIC16C43X

Demonstration Board

The powerful LIN hardware and software kit includes a

series of boards and three PICmicro microcontrollers.

The small footprint PIC16C432 and PIC16C433 are

used as slaves in the LIN communication and feature

on-board LIN transceivers. A PIC16F874 Flash micro-

controller serves as the master. All three microcontrol-

lers are programmed with firmware to provide LIN bus

communication.

22.22 PICkit™ 1 Flash Starter Kit

A complete "development system in a box", the PICkit

Flash Starter Kit includes a convenient multi-section

board for programming, evaluation, and development

of 8/14-pin Flash PIC® microcontrollers. Powered via

USB, the board operates under a simple Windows GUI.

The PICkit 1 Starter Kit includes the user's guide (on

CD ROM), PICkit 1 tutorial software and code for vari-

ous applications. Also included are MPLAB® IDE (Inte-

grated Development Environment) software, software

and hardware "Tips 'n Tricks for 8-pin Flash PIC®

Microcontrollers" Handbook and a USB Interface

Cable. Supports all current 8/14-pin Flash PIC

microcontrollers, as well as many future planned

devices.

22.23 PICDEM USB PIC16C7X5

Demonstration Board

The PICDEM USB Demonstration Board shows off the

capabilities of the PIC16C745 and PIC16C765 USB

microcontrollers. This board provides the basis for

future USB products.

22.24 Evaluation and

Programming Tools

In addition to the PICDEM series of circuits, Microchip

has a line of evaluation kits and demonstration software

for these products.

•K

EELOQ evaluation and programming tools for

Microchip’s HCS Secure Data Products

• CAN developers kit for automotive network

applications

• Analog design boards and filter design software

• PowerSmart battery charging evaluation/

calibration kits

•IrDA

® development kit

• microID development and rfLab™ development

software

• SEEVAL® designer kit for memory evaluation and

endurance calculations

• PICDEM MSC demo boards for Switching mode

power supply, high power IR driver, delta sigma

ADC, and flow rate sensor

Check the Microchip web page and the latest Product

Line Card for the complete list of demonstration and

evaluation kits.

dsPIC30F

DS70083C-page 176 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 177

dsPIC30F

23.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future

revisions of this document as it becomes available.

For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual

(DS70046).

Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for

extended periods may affect device reliability. Functional operation of the device at these or any other conditions above

the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V)

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Voltage on MCLR with respect to VSS (Note 1) ......................................................................................... 0V to +13.25V

Total power dissipation (Note 2) ...............................................................................................................................1.0W

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin ..............................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD) ..........................................................................................................±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin ....................................................................................................25 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports ..................................................................................................................200 mA

Note 1: Power dissipation is calculated as follows:

Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)

2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup.

Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather

than pulling this pin directly to VSS.

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Note: All peripheral electrical characteristics are specified. For exact peripherals available on specific

devices, please refer the the Family Cross Reference Table.

dsPIC30F

DS70083C-page 178 Advance Information  2003 Microchip Technology Inc.

23.1 DC Characteristics

TABLE 23-1: OPERATING MIPS VS. VOLTAGE

VDD Range Temp Range

Max MIPS

dsPIC30FXXX-30I dsPIC30FXXX-20I dsPIC30FXXX-20E

4.5-5.5V -40°C to 85°C 30 20

4.5-5.5V -40°C to 125°C 20

3.0-3.6V -40°C to 85°C 20 15

3.0-3.6V -40°C to 125°C 15

2.5-3.0V -40°C to 85°C 10 7.5

2.5-3.0V -40°C to 125°C 7.5

TABLE 23-2: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage(2)

DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature

DC11 VDD Supply Voltage 2.5 — 5.5 V Extended temperature

DC12 VDR RAM Data Retention Voltage(3) —1.5—V

DC16 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

—V

SS —V

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 V/ms 0-5V in 0.1 sec

0-3V in 60 ms

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: This is the limit to which VDD can be lowered without losing RAM data.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 179

dsPIC30F

TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC20 — — mA -40°C

1 MIPS EC mode

DC20a 4 — mA 25°C

DC20b — — mA 85°C

DC20c — — mA 125°C

DC20d — — mA -40°C

DC20e 7 — mA 25°C

DC20f — — mA 85°C

DC20g — — mA 125°C

DC21 — — mA -40°C

2.5 MIPS EC mode

DC21a 8 — mA 25°C

DC21b — — mA 85°C

DC21c — — mA 125°C

DC21d — — mA -40°C

DC21e 15 — mA 25°C

DC21f — — mA 85°C

DC21g — — mA 125°C

DC22 — — mA -40°C

10 MIPS EC mode

DC22a — — mA 25°C

DC22b — — mA 85°C

DC22c — — mA 125°C

DC22d — — mA -40°C

DC22e — — mA 25°C

DC22f — — mA 85°C

DC22g — — mA 125°C

DC23 — — mA -40°C

3 V

4 MIPS EC mode, 4X PLL

DC23a 13 — mA 25°C

DC23b — — mA 85°C

DC23c — — mA 125°C

DC23d — — mA -40°C

DC23e 22 — mA 25°C

DC23f — — mA 85°C

DC23g — — mA 125°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data

Memory are operational. No peripheral modules are operating.

dsPIC30F

DS70083C-page 180 Advance Information  2003 Microchip Technology Inc.

DC24 — — mA -40°C

10 MIPS EC mode, 4X PLL

DC24a 29 — mA 25°C

DC24b — — mA 85°C

DC24c — — mA 125°C

DC24d — — mA -40°C

DC24e 50 — mA 25°C

DC24f — — mA 85°C

DC24g — — mA 125°C

DC25 — — mA -40°C

8 MIPS EC mode, 8X PLL

DC25a 23 — mA 25°C

DC25b — — mA 85°C

DC25c — — mA 125°C

DC25d — — mA -40°C

DC25e 41 — mA 25°C

DC25f — — mA 85°C

DC25g — — mA 125°C

DC26 — — mA -40°C

15 MIPS EC mode, 8X PLL

DC26a 39 — mA 25°C

DC26b — — mA 85°C

DC26c — — mA 125°C

DC26d — — mA -40°C

DC26e 70 — mA 25°C

DC26f — — mA 85°C

DC26g — — mA 125°C

DC27 — — mA -40°C

20 MIPS EC mode, 8X PLL

DC27a 50 — mA 25°C

DC27b — — mA 85°C

DC27c — — mA -40°C

DC27d 90 — mA 25°C

DC27e — — mA 85°C

DC27f — — mA 125°C

TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data

Memory are operational. No peripheral modules are operating.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 181

dsPIC30F

DC28 — — mA -40°C

16 MIPS EC mode, 16X PLL

DC28a 42 — mA 25°C

DC28b — — mA 85°C

DC28c — — mA -40°C

DC28d 76 — mA 25°C

DC28e — — mA 85°C

DC28f — — mA 125°C

DC29 — — mA -40°C

5V 30 MIPS EC mode, 16X PLL

DC29a 146 — mA 25°C

DC29b — — mA 85°C

DC29c — — mA 125°C

DC30 — — mA -40°C

FRC (~ 2 MIPS)

DC30a 7.0 — mA 25°C

DC30b — — mA 85°C

DC30c — — mA 125°C

DC30d — — mA -40°C

DC30e 12 — mA 25°C

DC30f — — mA 85°C

DC30g — — mA 125°C

DC31 — — mA -40°C

LPRC (~ 512 kHz)

DC31a 1.5 — mA 25°C

DC31b — — mA 85°C

DC31c — — mA 125°C

DC31d — — mA -40°C

5 V

DC31e 2.5 — mA 25°C

DC31f — — mA 85°C

DC31g — — mA 125°C

TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data

Memory are operational. No peripheral modules are operating.

dsPIC30F

DS70083C-page 182 Advance Information  2003 Microchip Technology Inc.

TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

DC40 — — mA -40°C

1 MIPS EC mode

DC40a 3 — mA 25°C

DC40b — — mA 85°C

DC40c — — mA 125°C

DC40d — — mA -40°C

DC40e 5 — mA 25°C

DC40f — — mA 85°C

DC40g — — mA 125°C

DC41 — — mA -40°C

2.5 MIPS EC mode

DC41a 4.8 — mA 25°C

DC41b — — mA 85°C

DC41c — — mA 125°C

DC41d — — mA -40°C

DC41e 8.6 — mA 25°C

DC41f — — mA 85°C

DC41g — — mA 125°C

DC42 — — mA -40°C

10 MIPS EC mode

DC42a — — mA 25°C

DC42b — — mA 85°C

DC42c — — mA 125°C

DC42d — — mA -40°C

DC42e — — mA 25°C

DC42f — — mA 85°C

DC42g — — mA 125°C

DC43 — — mA -40°C

4 MIPS EC mode, 4X PLL

DC43a 7.7 — mA 25°C

DC43b — — mA 85°C

DC43c — — mA 125°C

DC43d — — mA -40°C

DC43e 13 — mA 25°C

DC43f — — mA 85°C

DC43g — — mA 125°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 183

dsPIC30F

DC44 — — mA -40°C

10 MIPS EC mode, 4X PLL

DC44a 15 — mA 25°C

DC44b — — mA 85°C

DC44c — — mA 125°C

DC44d — — mA -40°C

DC44e 29 — mA 25°C

DC44f — — mA 85°C

DC44g — — mA 125°C

DC45 — — mA -40°C

8 MIPS EC mode, 8X PLL

DC45a 13 — mA 25°C

DC45b — — mA 85°C

DC45c — — mA 125°C

DC45d — — mA -40°C

DC45e 24 — mA 25°C

DC45f — — mA 85°C

DC45g — — mA 125°C

DC46 — — mA -40°C

15 MIPS EC mode, 8X PLL

DC46a 22 — mA 25°C

DC46b — — mA 85°C

DC46c — — mA 125°C

DC46d — — mA -40°C

DC46e 40 — mA 25°C

DC46f — — mA 85°C

DC46g — — mA 125°C

DC47 — — mA -40°C

20 MIPS EC mode, 8X PLL

DC47a 29 — mA 25°C

DC47b — — mA 85°C

DC47c — — mA -40°C

DC47d 52 — mA 25°C

DC47e — — mA 85°C

DC47f — — mA 125°C

TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.

dsPIC30F

DS70083C-page 184 Advance Information  2003 Microchip Technology Inc.

DC48 — — mA -40°C

16 MIPS EC mode, 16X PLL

DC48a 24 — mA 25°C

DC48b — — mA 85°C

DC48c — — mA -40°C

DC48d 43 — mA 25°C

DC48e — — mA 85°C

DC48f — — mA 125°C

DC49 — — mA -40°C

5V 30 MIPS EC mode, 16X PLL

DC49a 73 — mA 25°C

DC49b — — mA 85°C

DC49c — — mA 125°C

DC50 — — mA -40°C

FRC (~ 2 MIPS)

DC50a 4.0 — mA 25°C

DC50b — — mA 85°C

DC50c — — mA 125°C

DC50d — — mA -40°C

DC50e 7.0 — mA 25°C

DC50f — — mA 85°C

DC50g — — mA 125°C

DC51 — — mA -40°C

LPRC (~ 512 kHz)

DC51a 1.0 — mA 25°C

DC51b — — mA 85°C

DC51c — — mA 125°C

DC51d — — mA -40°C

5 V

DC51e 1.5 — mA 25°C

DC51f — — mA 85°C

DC51g — — mA 125°C

TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 185

dsPIC30F

TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power Down Current (IPD)(2)

DC60 — — µA -40°C

Base Power Down Current(3)

DC60a 50 — µA25°C

DC60b — — µA85°C

DC60c — — µA 125°C

DC60d — — µA -40°C

DC60e 100 — µA25°C

DC60f — — µA85°C

DC60g — — µA 125°C

DC61 — — µA -40°C

Watchdog Timer Current: ∆IWDT(3)

DC61a 10 — µA25°C

DC61b — — µA85°C

DC61c — — µA 125°C

DC61d — — µA -40°C

DC61e 20 — µA25°C

DC61f — — µA85°C

DC61g — — µA 125°C

DC62 — — µA -40°C

Timer 1 w/32 kHz Crystal: ∆ITI32(3)

DC62a — — µA25°C

DC62b — — µA85°C

DC62c — — µA 125°C

DC62d — — µA -40°C

DC62e — — µA25°C

DC62f — — µA85°C

DC62g — — µA 125°C

DC63 — — µA -40°C

3 V

BOR On: ∆IBOR(3)

DC63a 40 — µA25°C

DC63b — — µA85°C

DC63c — — µA 125°C

DC63d — — µA -40°C

DC63e 50 — µA25°C

DC63f — — µA85°C

DC63g — — µA 125°C

Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance

only and are not tested.

2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled high. LVD, BOR, WDT, etc. are all switched off.

3: The ∆ current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

dsPIC30F

DS70083C-page 186 Advance Information  2003 Microchip Technology Inc.

DC64 — — µA-40°C

10-bit ADC: ∆IADC10(3)

DC64a — — µA 25°C

DC64b — — µA 85°C

DC64c — — µA125°C

DC64d — — µA-40°C

DC64e — — µA 25°C

DC64f — — µA 85°C

DC64g — — µA125°C

DC65 — — µA-40°C

12-bit ADC: ∆IADC12(3)

DC65a — — µA 25°C

DC65b — — µA 85°C

DC65c — — µA125°C

DC65d — — µA-40°C

DC65e — — µA 25°C

DC65f — — µA 85°C

DC65g — — µA125°C

DC66 — — µA-40°C

Low Voltage Detect: ∆ILVD(3)

DC66a 25 — µA 25°C

DC66b — — µA 85°C

DC66c — — µA125°C

DC66d — — µA-40°C

DC66e 30 — µA 25°C

DC66f — — µA 85°C

DC66g — — µA125°C

TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power Down Current (IPD)(2)

Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance

only and are not tested.

2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled high. LVD, BOR, WDT, etc. are all switched off.

3: The ∆ current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 187

dsPIC30F

TABLE 23-6: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage(2)

DI10 I/O pins:

with Schmitt Trigger buffer VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 OSC1 (in XT, HS and LP modes) VSS —0.2VDD V

DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V

DI18 SDA, SCL TBD — TBD V SM bus disabled

DI19 SDA, SCL TBD — TBD V SM bus enabled

VIH Input High Voltage(2)

DI20 I/O pins:

with Schmitt Trigger buffer 0.8 VDD —VDD V

DI25 MCLR 0.8 VDD —VDD V

DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V

DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V

DI28 SDA, SCL TBD — TBD V SM bus disabled

DI29 SDA, SCL TBD — TBD V SM bus enabled

ICNPU CNXX Pull-up Current(2)

DI30 50 250 400 µAVDD = 5V, VPIN = VSS

DI31 TBD TBD TBD µAVDD = 3V, VPIN = VSS

IIL Input Leakage Current(2)(4)(5)

DI50 I/O ports — 0.01 ±1 µAVSS ≤ VPIN ≤ VDD,

Pin at hi-impedance

DI55 MCLR —0.05±5 µAVSS ≤ VPIN ≤ VDD

DI56 OSC1 — 0.05 ±5 µAVSS ≤ VPIN ≤ VDD, XT, HS

and LP Osc mode

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that

the dsPIC30F device be driven with an external clock while in RC mode.

4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

5: Negative current is defined as current sourced by the pin.

dsPIC30F

DS70083C-page 188 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-1: LOW-VOLTAGE DETECT CHARACTERISTICS

TABLE 23-7: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VOL Output Low Voltage(2)

DO10 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 5V

——TBDVI

OL = 2.0 mA, VDD = 3V

DO16 OSC2/CLKOUT — — 0.6 V IOL = 1.6 mA, VDD = 5V

(RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V

VOH Output High Voltage(2)

DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V

TBD — — V IOH = -2.0 mA, VDD = 3V

DO26 OSC2/CLKOUT VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V

(RC or EC Osc mode) TBD — — V IOH = -2.0 mA, VDD = 3V

Capacitive Loading Specs

on Output Pins(2)

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XTL, XT, HS and LP modes

when external clock is used to

drive OSC1.

DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode

DO58 CBSCL, SDA — — 400 pF In I2C mode

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

LV10

LVDIF

VDD

(LVDIF set by hardware)

 2003 Microchip Technology Inc. Advance Information DS70083C-page 189

dsPIC30F

TABLE 23-8: ELECTRICAL CHARACTERISTICS: LVDL

FIGURE 23-2: BROWN-OUT RESET CHARACTERISTICS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

LV10 VPLVD LVDL Voltage on VDD transition

high to low

LVDL = 0000(2) ———V

LVDL = 0001(2) ———V

LVDL = 0010(2) ———V

LVDL = 0011(2) ———V

LVDL = 0100 2.50 — 2.65 V

LVDL = 0101 2.70 — 2.86 V

LVDL = 0110 2.80 — 2.97 V

LVDL = 0111 3.00 — 3.18 V

LVDL = 1000 3.30 — 3.50 V

LVDL = 1001 3.50 — 3.71 V

LVDL = 1010 3.60 — 3.82 V

LVDL = 1011 3.80 — 4.03 V

LVDL = 1100 4.00 — 4.24 V

LVDL = 1101 4.20 — 4.45 V

LVDL = 1110 4.50 — 4.77 V

LV15 VLVDIN External LVD input pin

threshold voltage

LVDL = 1111 ———V

Note 1: These parameters are characterized but not tested in manufacturing.

2: These values not in usable operating range.

BO10

RESET (due to BOR)

VDD

(Device in Brown-out Reset)

(Device not in Brown-out Reset)

Power Up Time-out

BO15

dsPIC30F

DS70083C-page 190 Advance Information  2003 Microchip Technology Inc.

TABLE 23-9: ELECTRICAL CHARACTERISTICS: BOR

TABLE 23-10: DC CHARACTERISTICS: PROGRAM AND EEPROM

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

BO10 VBOR BOR Voltage(2) on

VDD transition high to

low

BORV = 00(3) — — — V Not in operating

range

BORV = 01 2.7 — 2.86 V

BORV = 10 4.2 — 4.46 V

BORV = 11 4.5 — 4.78 V

BO15 VBHYS —5—mV

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: 00 values not in usable operating range.

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Data EEPROM Memory(2)

D120 EDByte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write

VMIN = Minimum operating

voltage

D122 TDEW Erase/Write Cycle Time — 2 — ms

D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

Program FLASH Memory(2)

D130 EPCell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C

D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating

voltage

D132 VEB VDD for Block Erase 3.0 — 5.5 V

D133 VPEW VDD for Erase/Write 3.0 — 5.5 V

D134 TPEW Erase/Write Cycle Time — 2 — ms

D135 TRETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

D136 TEB ICSP Block Erase Time — 4 — ms

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 191

dsPIC30F

23.2 AC Characteristics and Timing Parameters

The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 23-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 23-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

FIGURE 23-4: EXTERNAL CLOCK TIMING

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Operating voltage VDD range as described in DC Spec Section 23.0.

VDD/2

VSS

RL=464Ω

CL= 50 pF for all pins except OSC2

5 pF for OSC2 output

Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2

OSC1

CLKOUT

Q4 Q1 Q2 Q3 Q4 Q1

OS20

OS25

OS30 OS30

OS40 OS41

OS31 OS31

dsPIC30F

DS70083C-page 192 Advance Information  2003 Microchip Technology Inc.

TABLE 23-12: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS10 FOSC External CLKIN Frequency(2)

(External clocks allowed only

in EC mode)

—

7.5

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

Oscillator Frequency(2) DC

0.4

—

512

7.5

—

MHz

kHz

MHz

kHz

XTL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

FRC internal

LPRC internal

OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS10 for

FOSC value

OS25 TCY Instruction Cycle Time(2)(3) 33 — DC ns See Table 23-14

OS30 TosL,

Tos H

External Clock(2) in (OSC1)

High or Low Time

TBD

——

—

µs

XTL osc

XT osc

LP osc

HS osc

OS31 TosR,

Tos F

External Clock(2) in (OSC1)

Rise or Fall Time

—

—TBD

TBD

XTL osc

XT osc

LP osc

HS osc

OS40 TckR CLKOUT Rise Time(2)(4) — 6 10 ns

OS41 TckF CLKOUT Fall Time(2)(4) — 6 10 ns

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“Max.” cycle time limit is “DC” (no clock) for all devices.

4: Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin.

CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 193

dsPIC30F

TABLE 23-14: INTERNAL CLOCK TIMING EXAMPLES

TABLE 23-13: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OS50 FPLLI PLL Input Frequency Range(2) 4 — 10 MHz EC, XT modes with PLL

OS51 FSYS On-chip PLL Output(2) 16 — 120 MHz EC, XT modes with PLL

OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 µs

OS53 DCLK CLKOUT Stability (Jitter) TBD 1 TBD % Measured over 100 ms

period

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

Clock

Oscillator

Mode

FOSC

(MHz)(1) TCY (µsec)(2) MIPS(3)

w/o PLL

MIPS(3)

w PLL x4

MIPS(3)

w PLL x8

MIPS(3)

w PLL x16

EC 0.200 20.0 0.05 — — —

4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

25 0.16 25.0 — — —

XT 4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

Note 1: Assumption: Oscillator Postscaler is divide by 1.

2: Instruction Execution Cycle Time: TCY = 1 / MIPS.

3: Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction

cycle].

TABLE 23-15: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

FRC @ Freq = 8 MHz(1)

F14 TBD +/-1 TBD % +25°C VDD =3V

F15 TBD — TBD % -10°C to +85°C VDD =3V

F16 TBD — TBD % -40°C to +85°C VDD =3V

F17 TBD +/-1 TBD % +25°C VDD =5V

F18 TBD — TBD % -10°C to +85°C VDD =5V

F19 TBD — TBD % -40°C to +85°C VDD =5V

LPRC @ Freq = 512 kHz(2)

F20 TBD — TBD % -40°C to +85°C VDD =3V

F21 TBD — TBD % -40°C to +85°C VDD =5V

Note 1: Frequency calibrated at 25°C. TUN bits can be used to compensate for temperature drift.

2: LPRC frequency after calibration.

3: Change of LPRC frequency as VDD changes.

dsPIC30F

DS70083C-page 194 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-5: CLKOUT AND I/O TIMING CHARACTERISTICS

TABLE 23-16: CLKOUT AND I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions

DO31 TIOR Port output rise time — 10 25 ns —

DO32 TIOF Port output fall time — 10 25 ns —

DI35 TINP INTx pin high or low time (output) 20 — — ns —

DI40 TRBP CNx high or low time (input) 2 TCY — — ns —

Note 1: These parameters are asynchronous events not related to any internal clock edges

2: Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC.

3: These parameters are characterized but not tested in manufacturing.

4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

Note: Refer to Figure 23-3 for load conditions.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Value New Value

DI40

DO31

DO32

 2003 Microchip Technology Inc. Advance Information DS70083C-page 195

dsPIC30F

FIGURE 23-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

RESET

Watchdog

Timer

RESET

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to Figure 23-3 for load conditions.

FSCM

Delay

SY35

SY30

SY12

dsPIC30F

DS70083C-page 196 Advance Information  2003 Microchip Technology Inc.

TABLE 23-17: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET TIMING REQUIREMENTS

FIGURE 23-7: BAND GAP START-UP TIME CHARACTERISTICS

TABLE 23-18: BAND GAP START-UP TIME REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY10 TmcL MCLR Pulse Width (low) 2 — — µs -40°C to +85°C

SY11 TPWRT Power-up Timer Period TBD

TBD

ms -40°C to +85°C

User programmable

SY12 TPOR Power On Reset Delay 3 10 30 µs -40°C to +85°C

SY13 TIOZ I/O Hi-impedance from MCLR

Low or Watchdog Timer Reset

——100ns

SY20 TWDT1 Watchdog Timer Time-out Period

(No Prescaler)

1.8 2.0 2.2 ms VDD = 5V, -40°C to +85°C

TWDT2 1.9 2.1 2.3 ms VDD = 3V, -40°C to +85°C

SY25 TBOR Brown-out Reset Pulse Width(3) 100 — — µsVDD ≤ VBOR (D034)

SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC ——TOSC = OSC1 period

SY35 TFSCM Fail-Safe Clock Monitor Delay — 100 — µs -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

3: Refer to Figure 23-2 and Table 23-9 for BOR.

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY40 TBGAP Band Gap Start-up Time — 20 50 µs Defined as the time between the

instant that the band gap is enabled

and the moment that the band gap

reference voltage is stable.

RCON<13>Status bit

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

VBGAP

Enable Band Gap

Band Gap

(see Note)

Stable

Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.

SY40

 2003 Microchip Technology Inc. Advance Information DS70083C-page 197

dsPIC30F

FIGURE 23-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS

TABLE 23-19: TYPE A TIMER EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TA11 TTXH TxCK High Time Synchronous,

no prescaler

0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler

10 — — ns

Asynchronous 10 — — ns

TA10 TTXL TxCK Low Time Synchronous,

no prescaler

0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler

10 — — ns

Asynchronous 10 — — ns

TA15 TTXP TxCK Input Period Synchronous,

no prescaler

TCY + 10 — — ns

Synchronous,

with prescaler

Greater of:

20 ns or

(TCY + 40)/N

— — — N = prescale

value

(1, 8, 64, 256)

Asynchronous 20 — — ns

OS60 Ft1 SOSC1/T1CK oscillator input

frequency range (oscillator enabled

by setting bit TCS (T1CON, bit 1))

DC — 50 kHz

TA20 TCKEXTMRL Delay from External TQCK Clock

Edge to Timer Increment

2 TOSC 6 TOSC —

Note: Timer1 is a Type A.

Note: Refer to Figure 23-3 for load conditions.

Tx1

Tx15

Tx1

Tx2

TMRX

OS60

TxCK

dsPIC30F

DS70083C-page 198 Advance Information  2003 Microchip Technology Inc.

TABLE 23-20: TYPE B TIMER EXTERNAL CLOCK TIMING REQUIREMENTS

TABLE 23-21: TYPE C TIMER EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TB11 TtxH TxCK High Time Synchronous,

no prescaler

0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler

10 — — ns

TB10 TtxL TxCK Low Time Synchronous,

no prescaler

0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler

10 — — ns

TB15 TtxP TxCK Input Period Synchronous,

no prescaler

TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler

Greater of:

20 ns or

(TCY + 40)/N

TB20 TCKEXTMRL Delay from External TQCK Clock

Edge to Timer Increment

2 TOSC —6 TOSC —

Note: Timer2 and Timer4 are Type B.

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TC11 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC10 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input Period Synchronous,

no prescaler

TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler

Greater of:

20 ns or

(TCY + 40)/N

TC20 TCKEXTMRL Delay from External TQCK Clock

Edge to Timer Increment

2 TOSC —6 TOSC —

Note: Timer3 and Timer5 are Type C.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 199

dsPIC30F

FIGURE 23-9: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS

TABLE 23-22: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TQ11 TtQH TQCK High Time Synchronous,

with prescaler

TCY + 20 — ns Must also meet

parameter TQ15

TQ10 TtQL TQCK Low Time Synchronous,

with prescaler

TCY + 20 — ns Must also meet

parameter TQ15

TQ15 TtQP TQCP Input Period Synchronous,

with prescaler

2 * TCY + 40 — ns —

TQ20 TCKEXTMRL Delay from External TQCK Clock

Edge to Timer Increment

Tosc 5 Tosc ns —

Note 1: These parameters are characterized but not tested in manufacturing.

TQ1

TQ15

TQ1

TQ2

QEB

POSCNT

dsPIC30F

DS70083C-page 200 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-10: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

TABLE 23-23: INPUT CAPTURE TIMING REQUIREMENTS

FIGURE 23-11: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

TABLE 23-24: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns

With Prescaler 10 — ns

IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 — ns

With Prescaler 10 — ns

IC15 TccP ICx Input Period (2 TCY + 40)/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC10 TccF OCx Output Fall Time — 10 25 ns —

OC11 TccR OCx Output Rise Time — 10 25 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

ICX

IC10 IC11

IC15

Note: Refer to Figure 23-3 for load conditions.

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 23-3 for load conditions.

or PWM Mode)

 2003 Microchip Technology Inc. Advance Information DS70083C-page 201

dsPIC30F

FIGURE 23-12: OC/PWM MODULE TIMING CHARACTERISTICS

TABLE 23-25: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC15 TFD Fault Input to PWM I/O

Change

— — 25 ns VDD = 3V -40°C to +85°C

TBD ns VDD = 5V

OC20 TFLT Fault Input Pulse Width — — 50 ns VDD = 3V -40°C to +85°C

TBD ns VDD = 5V

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

OCFA/OCFB

OCx

OC20

OC15

dsPIC30F

DS70083C-page 202 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-13: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS

FIGURE 23-14: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS

TABLE 23-26: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

MP10 TFPWM PWM Output Fall Time — 10 25 ns VDD = 5V -40°C to +85°C

MP11 TRPWM PWM Output Rise Time — 10 25 ns VDD = 5V -40°C to +85°C

MP12 TFPWM PWM Output Fall Time — TBD TBD ns VDD = 3V -40°C to +85°C

MP13 TRPWM PWM Output Rise Time — TBD TBD ns VDD = 3V -40°C to +85°C

MP20 TFD Fault Input to PWM

I/O Change

— — 25 ns VDD = 3V -40°C to +85°C

TBD ns VDD = 5V

MP30 TFH Fault Input Hold Time — — 50 ns VDD = 3V -40°C to +85°C

TBD ns VDD = 5V

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

FLTA/B

PWMx

MP30

MP20

PWMx

MP11 MP10

Note: Refer to Figure 23-3 for load conditions.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 203

dsPIC30F

FIGURE 23-15: QEA/QEB INPUT CHARACTERISTICS

TABLE 23-27: QUADRATURE DECODER TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Typ(2) Max Units Conditions

TQ30 TQUL Quadrature Input Low Time 6 TCY —ns —

TQ31 TQUH Quadrature Input High Time 6 TCY —ns —

TQ35 TQUIN Quadrature Input Period 12 TCY —ns —

TQ36 TQUP Quadrature Phase Period 3 TCY —ns —

TQ40 TQUFL Filter Time to Recognize Low,

with Digital Filter

3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ41 TQUFH Filter Time to Recognize High,

with Digital Filter

3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

Note 1: These parameters are characterized but not tested in manufacturing.

2: N = Index Channel Digital Filter Clock Divide Select Bits. Refer to Section 16. “Quadrature Encoder

Interface (QEI)” in the dsPIC30F Family Reference Manual.

TQ3

TQ35

TQ3

QEA

(input)

TQ3

QEB

(input)

TQ36

QEB

Internal

TQ4TQ4

dsPIC30F

DS70083C-page 204 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-16: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS

TABLE 23-28: QEI INDEX PULSE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

TQ50 TqIL Filter Time to Recognize Low,

with Digital Filter

3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ51 TqiH Filter Time to Recognize High,

with Digital Filter

3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ55 Tqidxr Index Pulse Recognized to Position

Counter Reset (Ungated Index)

3 TCY —ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Alignment of Index Pulses to QEA and QEB is shown for Position Counter reset timing only. Shown for

forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but

Index Pulse recognition occurs on falling edge.

QEA

(input)

Ungated

Index

QEB

(input)

TQ55

Index Internal

Position

TQ50

TQ51

 2003 Microchip Technology Inc. Advance Information DS70083C-page 205

dsPIC30F

FIGURE 23-17: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS

COFS

CSCK

(SCKE =

)

CSCK

(SCKE =

)

CSDO

CSDI

CS11 CS10

CS40 CS41

CS21

CS20

CS35

CS21

MSb LSb

MSb IN LSb IN

CS31

HIGH-Z HIGH-Z

CS30

CS51 CS50

CS55

Note: Refer to Figure 23-3 for load conditions.

CS20

CS56

dsPIC30F

DS70083C-page 206 Advance Information  2003 Microchip Technology Inc.

TABLE 23-29: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CS10 TcSCKL CSCK Input Low Time

(CSCK pin is an input)

TCY / 2 + 20 — — ns —

CSCK Output Low Time(3)

(CSCK pin is an output)

30 — — ns —

CS11 TcSCKH CSCK Input High Time

(CSCK pin is an input)

TCY / 2 + 20 — — ns —

CSCK Output High Time(3)

(CSCK pin is an output)

30 — — ns —

CS20 TcSCKF CSCK Output Fall Time(4)

(CSCK pin is an output)

—1025ns —

CS21 TcSCKR CSCK Output Rise Time(4)

(CSCK pin is an output)

—1025ns —

CS30 TcSDOF CSDO Data Output Fall Time(4) —1025ns —

CS31 TcSDOR CSDO Data Output Rise Time(4) —1025ns —

CS35 TDV Clock edge to CSDO data valid — — 10 ns —

CS36 TDIV Clock edge to CSDO tri-stated 10 — 20 ns —

CS40 TCSDI Setup time of CSDI data input to

CSCK edge (CSCK pin is input

or output)

20 — — ns —

CS41 THCSDI Hold time of CSDI data input to

CSCK edge (CSCK pin is input

or output)

20 — — ns —

CS50 TcoFSF COFS Fall Time

(COFS pin is output)

—1025nsNote 1

CS51 TcoFSR COFS Rise Time

(COFS pin is output)

—1025nsNote 1

CS55 TscoFS Setup time of COFS data input to

CSCK edge (COFS pin is input)

20 — — ns —

CS56 THCOFS Hold time of COFS data input to

CSCK edge (COFS pin is input)

20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all DCI pins.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 207

dsPIC30F

FIGURE 23-18: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS

TABLE 23-30: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions

CS60 TBCLKL BIT_CLK Low Time 36 40.7 45 ns —

CS61 TBCLKH BIT_CLK High Time 36 40.7 45 ns —

CS62 TBCLK BIT_CLK Period — 81.4 — ns Bit clock is input

CS65 TSACL Input Setup Time to

Falling Edge of BIT_CLK

— — 10 ns —

CS66 THACL Input Hold Time from

Falling Edge of BIT_CLK

— — 10 ns —

CS70 TSYNCLO SYNC Data Output Low Time — 19.5 — µsNote 1

CS71 TSYNCHI SYNC Data Output High Time — 1.3 — µsNote 1

CS72 TSYNC SYNC Data Output Period — 20.8 — µsNote 1

CS75 TRACL Rise Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V

CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V

CS77 TRACL Rise Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V

CS78 TFACL Fall Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V

CS80 T

OVDACL Output valid delay from rising

edge of BIT_CLK

— — 15 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: These values assume BIT_CLK frequency is 12.288 MHz.

3: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

SYNC

BIT_CLK

SDO

SDI

CS61 CS60

CS65 CS66

CS80

CS21

MSb IN

CS75

LSb

CS76

(COFS)

(CSCK)

LSb

MSb

CS72

CS71 CS70

CS76 CS75

(CSDO)

(CSDI)

CS62 CS20

dsPIC30F

DS70083C-page 208 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-19: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

TABLE 23-31: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns —

SP11 TscH SCKX Output High Time(3) TCY / 2 — — ns —

SP20 TscF SCKX Output Fall Time(4 —1025ns —

SP21 TscR SCKX Output Rise Time(4) —1025ns —

SP30 TdoF SDOX Data Output Fall Time(4) —1025ns —

SP31 TdoR SDOX Data Output Rise Time(4) —1025ns —

SP35 TscH2doV,

TscL2doV

SDOX Data Output Valid after

SCKX Edge

— — 30 ns —

SP40 TdiV2scH,

TdiV2scL

Setup Time of SDIX Data Input

to SCKX Edge

20 — — ns —

SP41 TscH2diL,

TscL2diL

Hold Time of SDIX Data Input

to SCKX Edge

20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDIx

SP11 SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

BIT14 - - - - - -1

MSb IN LSb IN

BIT14 - - - -1

SP30

SP31

Note: Refer to Figure 23-3 for load conditions.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 209

dsPIC30F

FIGURE 23-20: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

TABLE 23-32: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKX output low time(3) TCY / 2 — — ns —

SP11 TscH SCKX output high time(3) TCY / 2 — — ns —

SP20 TscF SCKX output fall time(4) —1025ns —

SP21 TscR SCKX output rise time(4) —1025ns —

SP30 TdoF SDOX data output fall time(4) —1025ns —

SP31 TdoR SDOX data output rise time(4) —1025ns —

SP35 TscH2doV,

TscL2doV

SDOX data output valid after

SCKX edge

— — 30 ns —

SP36 TdoV2sc,

TdoV2scL

SDOX data output setup to

first SCKX edge

30 — — ns —

SP40 TdiV2scH,

TdiV2scL

Setup time of SDIX data input

to SCKX edge

20 — — ns —

SP41 TscH2diL,

TscL2diL

Hold time of SDIX data input

to SCKX edge

20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SDIX

SP36

SP30,SP31

SP35

MSb

MSb IN

BIT14 - - - - - -1

LSb IN

BIT14 - - - -1

LSb

Note: Refer to Figure 23-3 for load conditions.

SP11 SP10 SP20

SP21

SP20

SP40

SP41

dsPIC30F

DS70083C-page 210 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-21: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

TABLE 23-33: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKX Input Low Time 30 — — ns —

SP11 TscH SCKX Input High Time 30 — — ns —

SP20 TscF SCKX Output Fall Time(3) —1025ns —

SP21 TscR SCKX Output Rise Time(3) —1025ns —

SP30 TdoF SDOX Data Output Fall Time(3) —1025ns —

SP31 TdoR SDOX Data Output Rise Time(3) —1025ns —

SP35 TscH2doV,

TscL2doV

SDOX Data Output Valid after

SCKX Edge

— — 30 ns —

SP40 TdiV2scH,

TdiV2scL

Setup Time of SDIX Data Input

to SCKX Edge

20 — — ns —

SP41 TscH2diL,

TscL2diL

Hold Time of SDIX Data Input

to SCKX Edge

20 — — ns —

SP50 TssL2scH,

TssL2scL

SSX↓ to SCKX↑ or SCKX↓ Input 120 — — ns —

SP51 TssH2doZ SSX↑ to SDOX Output

Hi-Impedance(3)

10 — 50 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Assumes 50 pF load on all SPI pins.

SCK

(CKP =

)

SCK

(CKP =

)

SDO

SDI

SP50

SP40

SP41

SP30,SP31 SP51

SP35

SDI

MSb LSb

BIT14 - - - - - -1

MSb IN BIT14 - - - -1 LSb IN

SP52

SP21

SP20

SP21

SP20

SP11 SP10

Note: Refer to Figure 23-3 for load conditions.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 211

dsPIC30F

FIGURE 23-22: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SP52 TscH2ssH

TscL2ssH

SSX after SCK Edge 1.5 TCY +40 — — ns —

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: Assumes 50 pF load on all SPI pins.

SSX

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SDI

SP50

SP60

SDIX

SP30,SP31

MSb BIT14 - - - - - -1 LSb

SP51

MSb IN BIT14 - - - -1 LSb IN

SP35

SP52

SP21

SP20

SP21

SP20

SP11 SP10

SP40

SP41

Note: Refer to Figure 23-3 for load conditions.

dsPIC30F

DS70083C-page 212 Advance Information  2003 Microchip Technology Inc.

TABLE 23-34: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 Tsc L SCKX Input Low Time 30 — — ns —

SP11 TscH SCKX Input High Time 30 — — ns —

SP20 TscF SCKX Output Fall Time(3) —1025ns —

SP21 TscR SCKX Output Rise Time(3) —1025ns —

SP30 TdoF SDOX Data Output Fall Time(3) —1025ns —

SP31 TdoR SDOX Data Output Rise Time(3) —1025ns —

SP35 TscH2doV,

TscL2doV

SDOX Data Output Valid after

SCKX Edge

— — 30 ns —

SP40 TdiV2scH,

TdiV2scL

Setup Time of SDIX Data Input

to SCKX Edge

20 — — ns —

SP41 TscH2diL,

TscL2diL

Hold Time of SDIX Data Input

to SCKX Edge

20 — — ns —

SP50 TssL2scH,

TssL2scL

SSX↓ to SCKX↓ or SCKX↑ input 120 — — ns —

SP51 TssH2doZ SS↑ to SDOX Output

Hi-Impedance(4)

10 — 50 ns —

SP52 TscH2ssH

TscL2ssH

SSX↑ after SCKX Edge 1.5 TCY + 40 — — ns —

SP60 TssL2doV SDOX Data Output Valid after

SCKX Edge

— — 50 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 213

dsPIC30F

FIGURE 23-23: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 23-24: I2C BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM31 IM34

SCL

SDA

Start

Condition

Stop

Condition

IM30 IM33

Note: Refer to Figure 23-3 for load conditions.

IM11 IM10 IM33

IM11

IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCL

SDA

Out

Note: Refer to Figure 23-3 for load conditions.

dsPIC30F

DS70083C-page 214 Advance Information  2003 Microchip Technology Inc.

TABLE 23-35: I2C BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min(1) Max Units Conditions

IM10 TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — ms —

400 kHz mode TCY / 2 (BRG + 1) — ms —

1 MHz mode(2) TCY / 2 (BRG + 1) — ms —

IM11 THI:SCL Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — ms —

400 kHz mode TCY / 2 (BRG + 1) — ms —

1 MHz mode(2) TCY / 2 (BRG + 1) — ms —

IM20 TF:SCL SDA and SCL

Fall Time

100 kHz mode — 300 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) —100ns

IM21 TR:SCL SDA and SCL

Rise Time

100 kHz mode — 1000 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) —300ns

IM25 TSU:DAT Data Input

Setup Time

100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(2) TBD — ns

IM26 THD:DAT Data Input

Hold Time

100 kHz mode 0 — ns —

400 kHz mode 0 0.9 ms

1 MHz mode(2) TBD — ns

IM30 TSU:STA Start Condition

Setup Time

100 kHz mode TCY / 2 (BRG + 1) — ms Only relevant for

repeated Start

condition

400 kHz mode TCY / 2 (BRG + 1) — ms

1 MHz mode(2) TCY / 2 (BRG + 1) — ms

IM31 THD:STA Start Condition

Hold Time

100 kHz mode TCY / 2 (BRG + 1) — ms After this period the

first clock pulse is

generated

400 kHz mode TCY / 2 (BRG + 1) — ms

1 MHz mode(2) TCY / 2 (BRG + 1) — ms

IM33 TSU:STO Stop Condition

Setup Time

100 kHz mode TCY / 2 (BRG + 1) — ms —

400 kHz mode TCY / 2 (BRG + 1) — ms

1 MHz mode(2) TCY / 2 (BRG + 1) — ms

IM34 THD:STO Stop Condition 100 kHz mode TCY / 2 (BRG + 1) — ns —

Hold Time 400 kHz mode TCY / 2 (BRG + 1) — ns

1 MHz mode(2) TCY / 2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock

100 kHz mode — 3500 ns —

400 kHz mode — 1000 ns —

1 MHz mode(2) — — ns —

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — ms

1 MHz mode(2) TBD — ms

IM50 CBBus Capacitive Loading — 400 pF

Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ (I2C)”

in the dsPIC30F Family Reference Manual.

2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 215

dsPIC30F

FIGURE 23-25: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 23-26: I2C BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IS31 IS34

SCL

SDA

Start

Condition

Stop

Condition

IS30 IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCL

SDA

Out

dsPIC30F

DS70083C-page 216 Advance Information  2003 Microchip Technology Inc.

TABLE 23-36: I2C BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Max Units Conditions

IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — µs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — µs Device must operate at a

minimum of 10 MHz.

1 MHz mode(1) 0.5 — µs—

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — µs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — µs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — µs—

IS20 TF:SCL SDA and SCL

Fall Time

100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 100 ns

IS21 TR:SCL SDA and SCL

Rise Time

100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

IS25 TSU:DAT Data Input

Setup Time

100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time

100 kHz mode 0 — ns —

400 kHz mode 0 0.9 µs

1 MHz mode(1) 00.3µs

IS30 TSU:STA Start Condition

Setup Time

100 kHz mode 4.7 — µs Only relevant for repeated

Start condition

400 kHz mode 0.6 — µs

1 MHz mode(1) 0.25 — µs

IS31 THD:STA Start Condition

Hold Time

100 kHz mode 4.0 — µs After this period the first

clock pulse is generated

400 kHz mode 0.6 — µs

1 MHz mode(1) 0.25 — µs

IS33 TSU:STO Stop Condition

Setup Time

100 kHz mode 4.7 — µs—

400 kHz mode 0.6 — µs

1 MHz mode(1) 0.6 — µs

IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns —

Hold Time 400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid From

Clock

100 kHz mode 0 3500 ns —

400 kHz mode 0 1000 ns

1 MHz mode(1) 0 350 ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — µs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — µs

1 MHz mode(1) 0.5 — µs

IS50 CBBus Capacitive

— 400pF —

Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

 2003 Microchip Technology Inc. Advance Information DS70083C-page 217

dsPIC30F

FIGURE 23-27: CAN MODULE I/O TIMING CHARACTERISTICS

TABLE 23-37: CAN MODULE I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CA10 TioF Port Output Fall Time — 10 25 ns —

CA11 TioR Port Output Rise Time — 10 25 ns —

CA20 Tcwf Pulse Width to Trigger

CAN Wakeup Filter

500 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

CXTX Pin

(output)

CA10 CA11

Old Value New Value

CA20

CXRX Pin

(input)

dsPIC30F

DS70083C-page 218 Advance Information  2003 Microchip Technology Inc.

TABLE 23-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply Greater of

VDD - 0.3

or 2.7

Lesser of

VDD + 0.3

or 5.5

V—

AD02 AVSS Module VSS Supply Vss - 0.3 VSS + 0.3 V —

Reference Inputs

AD05 VREFH Reference Voltage High AVss+2.7 AVDD V—

AD06 VREFL Reference Voltage Low AVss AVDD - 2.7 V —

AD07 VREF Absolute Reference Voltage AVss - 0.3 AVDD + 0.3 V —

AD08 IREF Current Drain — 200

.001

300

µA

A/D operating

A/D off

Analog Input

AD10 VINH-VINL Full-Scale Input Span VREFL VREFH V—

AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V —

AD12 — Leakage Current — ±0.001 ±0.244 µAV

INL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

Source Impedance =

10 kW

AD13 — Leakage Current — ±0.001 ±0.244 µAV

INL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

Source Impedance =

10 kW

AD15 RSS Switch Resistance — 5K — Ω—

AD16 CSAMPLE Sample Capacitor — 2.5 pF —

AD17 RIN Recommended Impedance

Of Analog Voltage Source

—10KΩ—

DC Accuracy

AD20 Nr Resolution 10 data bits bits —

AD21 INL Integral Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD21A INL Integral Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD22 DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD22A DNL Differential Nonlinearity — ±0.5 < ±1 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD23 GERR Gain Error — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD23A GERR Gain Error — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 219

dsPIC30F

AD24 EOFF Offset Error — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD24A EOFF Offset Error — ±0.75 TBD LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD25 — Monotonicity(2) — — — — Guaranteed

AD26 CMRR Common-Mode Rejection — TBD — dB —

AD27 PSRR Power Supply Rejection

Ratio

—TBD— dB —

AD28 CTLK Channel to Channel

Crosstalk

—TBD— dB —

Dynamic Performance

AD30 THD Total Harmonic Distortion — TBD — dB —

AD31 SINAD Signal to Noise and

Distortion

—TBD— dB —

AD32 SFDR Spurious Free Dynamic

Range

—TBD— dB —

AD33 FNYQ Input Signal Bandwidth — — 250 kHz —

AD34 ENOB Effective Number of Bits — TBD TBD bits —

TABLE 23-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

dsPIC30F

DS70083C-page 220 Advance Information  2003 Microchip Technology Inc.

FIGURE 23-28: HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)

AD55

TSAMP

BCF SAMPBSF SAMP

AD61

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

AD60

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 9 5 6 8

1- Software sets ADCON. SAMP to start sampling.

2- Sampling starts after discharge period.

3- Software clears ADCON. SAMP to start conversion.

4- Sampling ends, conversion sequence starts.

5- Convert bit 9.

9- One TAD for end of conversion.

AD50

ch0_samp

ch1_dischrg

eoc

AD55

6- Convert bit 8.

8- Convert bit 0.

Execution

TSAMP is described in the dsPIC30F MCU Family Reference Manual, Section 17.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 221

dsPIC30F

FIGURE 23-29: HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)

AD55

TSAMP

BSF ADON

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 4 5 6 8

1- Software sets ADCON. ADON to start AD operation.

2- Sampling starts after discharge period.

3- Convert bit 9.

4- Convert bit 8.

5- Convert bit 0.

AD50

ch0_samp

ch1_dischrg

eoc

7 3

AD55

6- One TAD for end of conversion.

7- Begin conversion of next channel

8- Sample for time specified by SAMC.

TSAMP

TCONV

3 4

Execution

TSAMP is described in the dsPIC30F

Family Reference Manual, Section 17.

TSAMP is described in the dsPIC30F

Family Reference Manual, Section 17.

dsPIC30F

DS70083C-page 222 Advance Information  2003 Microchip Technology Inc.

TABLE 23-39: HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD A/D Clock Period 154

833

ns VDD = 5V (Note 1)

VDD = 2.7V (Note 1)

AD51 tRC A/D Internal RC Oscillator Period 700 900 1100 ns —

Conversion Rate

AD55 tCONV Conversion Time 13 TAD ns —

AD56 FCNV Throughput Rate 500

100

ksps

VDD = VREF = 5V

VDD = VREF = 2.7V

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger

——TAD ns —

AD61 tPSS Sample Start from Setting

Sample (SAMP) Bit

0.5 TAD — 1.5 TAD ns —

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)

——TBDns —

AD63 tDPU Time to Stabilize Analog Stage

from A/D Off to A/D On

——TBDµs—

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 223

dsPIC30F

TABLE 23-40: 12-BIT LOW-SPEED A/D MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply Greater of

VDD - 0.3

or 2.7

— Lesser of

VDD + 0.3

or 5.5

V—

AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V —

Reference Inputs

AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V—

AD06 VREFL Reference Voltage Low AVSS —AVDD - 2.7 V —

AD07 VREF Absolute Reference

Voltage

AVSS - 0.3 — AVDD + 0.3 V —

AD08 IREF Current Drain — 200

.001

300

µA

A/D operating

A/D off

Analog Input

AD10 VINH-VINL Full-Scale Input Span VREFL VREFH VSee Note

AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V —

AD12 — Leakage Current — ±0.001 ±0.610 µAV

INL = AVSS = VREFL =

0V, AVDD = VREFH = 5V

Source Impedance =

1 kW

AD13 — Leakage Current — ±0.001 ±0.610 µAV

INL = AVSS = VREFL =

0V, AVDD = VREFH = 3V

Source Impedance =

1 kW

AD15 RSS Switch Resistance — 5K — Ω—

AD16 CSAMPLE Sample Capacitor — 18 pF —

AD17 RIN Recommended Impedance

of Analog Voltage Source

——1KW —

DC Accuracy

AD20 Nr Resolution 12 data bits bits

AD21 INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 5V

AD21A INL Integral Nonlinearity — ±0.75 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 3V

AD22 DNL Differential Nonlinearity — ±0.5 ±1 LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 5V

AD22A DNL Differential Nonlinearity — ±0.5 ±1 LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 3V

AD23 GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 5V

AD23A GERR Gain Error — ±1.25 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 3V

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

dsPIC30F

DS70083C-page 224 Advance Information  2003 Microchip Technology Inc.

AD24 EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 5V

AD24A EOFF Offset Error — ±1.25 TBD LSb VINL = AVSS = VREFL =

0V, AVDD = VREFH = 3V

AD25 — Monotonicity(1) — — — — Guaranteed

AD26 CMRR Common-Mode Rejection — TBD — dB —

AD27 PSRR Power Supply Rejection

Ratio

—TBD— dB —

AD28 CTLK Channel to Channel

Crosstalk

—TBD— dB —

Dynamic Performance

AD30 THD Total Harmonic Distortion — — — dB —

AD31 SINAD Signal to Noise and

Distortion

—TBD— dB —

AD32 SFDR Spurious Free Dynamic

Range

—TBD— dB —

AD33 FNYQ Input Signal Bandwidth — — 50 kHz —

AD34 ENOB Effective Number of Bits — TBD TBD bits —

TABLE 23-40: 12-BIT LOW-SPEED A/D MODULE SPECIFICATIONS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing

codes.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 225

dsPIC30F

FIGURE 23-30: LOW-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(ASAM = 0, SSRC = 000)

AD55

TSAMP

BCF SAMPBSF SAMP

AD61

ADCLK

Instruction

SAMP

ch0_dischrg

ch0_samp

AD60

DONE

ADIF

ADRES(0)

1 2 3 4 5 6 87

1- Software sets ADCON. SAMP to start sampling.

2- Sampling starts after discharge period.

3- Software clears ADCON. SAMP to start conversion.

4- Sampling ends, conversion sequence starts.

5- Convert bit 11.

9- One TAD for end of conversion.

AD50

eoc

6- Convert bit 10.

7- Convert bit 1.

8- Convert bit 0.

Execution

TSAMP is described in the dsPIC30F Family Reference Manual, Section 18.

dsPIC30F

DS70083C-page 226 Advance Information  2003 Microchip Technology Inc.

TABLE 23-41: LOW-SPEED A/D CONVERSION TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 T

AD A/D Clock Period 667

1.4

—— ns

µs

VDD = 5V (Note 1)

VDD = 2.7V (Note 1)

AD51 tRC A/D Internal RC Oscillator Period 1.2 1.5 1.8 µs—

Conversion Rate

AD55 tCONV Conversion Time — 15 TAD ns —

AD56 FCNV Throughput Rate — — 100

ksps

VDD = VREF = 5V

VDD = VREF = 2.7V

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger

——TAD ns —

AD61 tPSS Sample Start from Setting

Sample (SAMP) Bit

0.5 TAD —1.5 TAD ns —

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)

——TBDns —

AD63 tDPU Time to Stabilize Analog Stage

from A/D Off to A/D On

——TBDµs—

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

 2003 Microchip Technology Inc. Advance Information DS70083C-page 227

dsPIC30F

24.0 PACKAGING INFORMATION

24.1 Package Marking Information

XXXXXXXXXXXXXXXXX

YYWWNNN

28-Lead PDIP (Skinny DIP) Example

XXXXXXXXXXXXXXXXX

18-Lead PDIP Example

18-Lead SOIC Example

0348017

dsPIC30F2012-I/SP

XXXXXXXXXXXXXXXXX

YYWWNNN

dsPIC30F3012-I/P

0348017

YYWWNNN

XXXXXXXXXXXX

0348017

-I/SO

dsPIC30F2011

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*Standard device marking consists of Microchip part number, year code, week code, and traceability

code. For device marking beyond this, certain price adders apply. Please check with your Microchip

Sales Office. For QTP devices, any special marking adders are included in QTP price.

28-Lead SOIC (.300”)

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PICXXFXXXX/SO

0310017

dsPIC30F

DS70083C-page 228 Advance Information  2003 Microchip Technology Inc.

44-Lead TQFP Example

XXXXXXXXXX

YYWWNNN

dsPIC30F

3014-I/PT

0348017

64-Lead TQFP (10x10x1mm) Example

XXXXXXXXXX

YYWWNNN

dsPIC30F

5011-I/PT

0348017

80-Lead TQFP

XXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXX

Example

dsPIC30F5013

0348017

-I/PT

XXXXXXXXXXXX

YYWWNNN

64-Lead TQFP (14x14x1mm)

dsPIC30F6011

-I/PT

0348017

Example

XXXXXXXXXXXXXXXXXX

YYWWNNN

40-Lead PDIP Example

XXXXXXXXXXXXXXXXXX

dsPIC30F3014-I/P

0348017

 2003 Microchip Technology Inc. Advance Information DS70083C-page 229

dsPIC30F

18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

1510515105

Mold Draft Angle Bottom

1510515105

Mold Draft Angle Top

10.929.407.87.430.370.310

Overall Row Spacing §

0.560.460.36.022.018.014BLower Lead Width

1.781.461.14.070.058.045

Upper Lead Width

0.380.290.20.015.012.008

Lead Thickness

3.433.303.18.135.130.125LTip to Seating Plane

22.9922.8022.61.905.898.890DOverall Length

6.606.356.10.260.250.240

Molded Package Width

8.267.947.62.325.313.300EShoulder to Shoulder Width

0.38.015A1Base to Seating Plane

3.683.302.92.145.130.115

Molded Package Thickness

4.323.943.56.170.155.140ATop to Seating Plane

2.54.100

Pitch

1818

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-007

§ Significant Characteristic

dsPIC30F

DS70083C-page 230 Advance Information  2003 Microchip Technology Inc.

28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)

1510515105

Mold Draft Angle Bottom

1510515105

Mold Draft Angle Top

10.928.898.13.430.350.320

Overall Row Spacing §

0.560.480.41.022.019.016BLower Lead Width

1.651.331.02.065.053.040

Upper Lead Width

0.380.290.20.015.012.008

Lead Thickness

3.433.303.18.135.130.125LTip to Seating Plane

35.1834.6734.161.3851.3651.345DOverall Length

7.497.246.99.295.285.275

Molded Package Width

8.267.877.62.325.310.300EShoulder to Shoulder Width

0.38.015

Base to Seating Plane

3.433.303.18.135.130.125

Molded Package Thickness

4.063.813.56.160.150.140ATop to Seating Plane

2.54.100

Pitch

2828

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

Notes:

JEDEC Equivalent: MO-095

Drawing No. C04-070

* Controlling Parameter

Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

§ Significant Characteristic

 2003 Microchip Technology Inc. Advance Information DS70083C-page 231

dsPIC30F

18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

Foot Angle φ048048

1512015120

Mold Draft Angle Bottom

1512015120

Mold Draft Angle Top

0.510.420.36.020.017.014BLead Width

0.300.270.23.012.011.009

Lead Thickness

1.270.840.41.050.033.016LFoot Length

0.740.500.25.029.020.010hChamfer Distance

11.7311.5311.33.462.454.446DOverall Length

7.597.497.39.299.295.291E1Molded Package Width

10.6710.3410.01.420.407.394EOverall Width

0.300.200.10.012.008.004A1Standoff §

2.392.312.24.094.091.088

Molded Package Thickness

2.642.502.36.104.099.093AOverall Height

1.27.050

Pitch

1818

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-013

Drawing No. C04-051

§ Significant Characteristic

dsPIC30F

DS70083C-page 232 Advance Information  2003 Microchip Technology Inc.

28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)

Foot Angle Top φ048048

1512015120

Mold Draft Angle Bottom

1512015120

Mold Draft Angle Top

0.510.420.36.020.017.014BLead Width

0.330.280.23.013.011.009

Lead Thickness

1.270.840.41.050.033.016LFoot Length

0.740.500.25.029.020.010hChamfer Distance

18.0817.8717.65.712.704.695DOverall Length

7.597.497.32.299.295.288E1Molded Package Width

10.6710.3410.01.420.407.394EOverall Width

0.300.200.10.012.008.004A1Standoff §

2.392.312.24.094.091.088A2Molded Package Thickness

2.642.502.36.104.099.093AOverall Height

1.27.050

Pitch

2828

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-013

Drawing No. C04-052

§ Significant Characteristic

 2003 Microchip Technology Inc. Advance Information DS70083C-page 233

dsPIC30F

40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)

1510515105

Mold Draft Angle Bottom

1510515105

Mold Draft Angle Top

17.2716.5115.75.680.650.620

Overall Row Spacing §

0.560.460.36.022.018.014BLower Lead Width

1.781.270.76.070.050.030

Upper Lead Width

0.380.290.20.015.012.008

Lead Thickness

3.433.303.05.135.130.120LTip to Seating Plane

52.4552.2651.942.0652.0582.045DOverall Length

14.2213.8413.46.560.545.530E1Molded Package Width

15.8815.2415.11.625.600.595EShoulder to Shoulder Width

0.38.015A1Base to Seating Plane

4.063.813.56.160.150.140

Molded Package Thickness

4.834.454.06.190.175.160ATop to Seating Plane

2.54.100

Pitch

4040

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERSINCHES*Units

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MO-011

Drawing No. C04-016

§ Significant Characteristic

dsPIC30F

DS70083C-page 234 Advance Information  2003 Microchip Technology Inc.

44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-076

1.140.890.64.045.035.025CHPin 1 Corner Chamfer

1.00.039

(F)

Footprint (Reference)

(F)

A1 A2

#leads=n1

D1 D

βL

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n44 44

Pitch p.031 0.80

Overall Height A .039 .043 .047 1.00 1.10 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff § A1 .002 .004 .006 0.05 0.10 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle φ03.5 7 03.5 7

Overall Width E .463 .472 .482 11.75 12.00 12.25

Overall Length D .463 .472 .482 11.75 12.00 12.25

Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10

Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10

Pins per Side n1 11 11

Lead Thickness c.004 .006 .008 0.09 0.15 0.20

Lead Width B .012 .015 .017 0.30 0.38 0.44

Mold Draft Angle Top α5 10 15 5 10 15

Mold Draft Angle Bottom β5 10 15 5 10 15

CH x 45 °

§ Significant Characteristic

 2003 Microchip Technology Inc. Advance Information DS70083C-page 235

dsPIC30F

64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-085

1510515105

Mold Draft Angle Bottom

1510515105

Mold Draft Angle Top

0.270.220.17.011.009.007BLead Width

0.230.180.13.009.007.005

Lead Thickness

1616

Pins per Side

10.1010.009.90.398.394.390D1Molded Package Length

10.1010.009.90.398.394.390

Molded Package Width

12.2512.0011.75.482.472.463DOverall Length

12.2512.0011.75.482.472.463EOverall Width

73.5073.50

Foot Angle

0.750.600.45.030.024.018LFoot Length

0.250.150.05.010.006.002A1Standoff §

1.051.000.95.041.039.037

Molded Package Thickness

1.201.101.00.047.043.039AOverall Height

0.50.020

Pitch

6464

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERS*INCHESUnits

DD1

#leads=n1

CH x 45°

(F)

Footprint (Reference) (F) .039 1.00

Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14

§ Significant Characteristic

dsPIC30F

DS70083C-page 236 Advance Information  2003 Microchip Technology Inc.

64-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-085

13 11

Mold Draft Angle Bottom

1311 11

Mold Draft Angle Top

0.450.320.30.018.013.019BLead Width

0.20 0.09 .008 .004

Lead Thickness

1616n1Pins per Side

14.00 .551

Molded Package Length

14.00 .551 E1Molded Package Width

16.00 .630 DOverall Length

16.00 .630 EOverall Width

7 07 0

Foot Angle

0.750.600.45.030.024.018LFoot Length

0.15 0.05.006 .002

Standoff §

1.051.000.95.041.039.037A2Molded Package Thickness

1.20.047 AOverall Height

0.80.032

Pitch

6464

Number of Pins

MAXNOMMINMAXNOMMINDimension Limits

MILLIMETERS*INCHESUnits

DD1

#leads=n1

CH x 45°

(F)

Footprint (Reference) (F) .039 1.00

Pin 1 Corner Chamfer CH

§ Significant Characteristic

11 13

 2003 Microchip Technology Inc. Advance Information DS70083C-page 237

dsPIC30F

80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-092

1.101.00.043.039

1.140.890.64.045.035.025CHPin 1 Corner Chamfer

1.00.039

(F)

Footprint (Reference)

(F)

#leads=n1

D1 D

βL

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n80 80

Pitch p.020 0.50

Overall Height A .047 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff § A1 .002 .004 .006 0.05 0.10 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle φ03.5 7 03.5 7

Overall Width E .541 .551 .561 13.75 14.00 14.25

Overall Length D .541 .551 .561 13.75 14.00 14.25

Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25

Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25

Pins per Side n1 20 20

Lead Thickness c.004 .006 .008 0.09 0.15 0.20

Lead Width B .007 .009 .011 0.17 0.22 0.27

Mold Draft Angle Top α5 10 15 5 10 15

Mold Draft Angle Bottom β5 10 15 5 10 15

CH x 45°

§ Significant Characteristic

dsPIC30F

DS70083C-page 238 Advance Information  2003 Microchip Technology Inc.

80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-092

CHPin 1 Corner Chamfer

1.00.039

(F)

Footprint (Reference)

(F)

#leads=n1

D1 D

βL

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n80 80

Pitch p.026 0.65

Overall Height A .047 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff § A1 .002 .006 0.05 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle φ0 7 0 7

Overall Width E .630 16.00

Overall Length D .630 16.00

Molded Package Width E1 .551 14.00

Molded Package Length D1 . .551 14.00

Pins per Side n1 20 20

Lead Thickness c.004 .008 0.09 0.20

Lead Width B .009 .013 .015 0.22 0.32 0.38

Mold Draft Angle Top α11 13 11 13

Mold Draft Angle Bottom β11 13 11 13

CH x 45°

§ Significant Characteristic

 2003 Microchip Technology Inc. Advance Information DS70083C-page 239

dsPIC30F

INDEX

Numerics

12-bit Analog-to-Digital Converter (A/D) Module .............. 141

A/D .................................................................................... 141

Aborting a Conversion .............................................. 143

ADCHS Register ....................................................... 141

ADCON1 Register..................................................... 141

ADCON2 Register..................................................... 141

ADCON3 Register..................................................... 141

ADCSSL Register ..................................................... 141

ADPCFG Register..................................................... 141

Configuring Analog Port Pins.............................. 73, 146

Connection Considerations....................................... 146

Conversion Operation ............................................... 142

Effects of a Reset...................................................... 145

Operation During CPU Idle Mode ............................. 145

Operation During CPU Sleep Mode.......................... 145

Output Formats ......................................................... 145

Power-down Modes .................................................. 145

Programming the Sample Trigger............................. 143

Result Buffer ............................................................. 142

Sampling Requirements............................................ 144

Selecting the Conversion Clock ................................ 143

Selecting the Conversion Sequence......................... 142

TAD vs. Device Operating Frequencies..................... 143

AC Characteristics ............................................................ 191

Load Conditions ........................................................ 191

AC Temperature and Voltage Specifications .................... 191

AC-Link Mode Operation .................................................. 138

16-bit Mode ............................................................... 138

20-bit Mode ............................................................... 138

Address Generator Units .................................................... 43

Alternate Vector Table ........................................................ 55

Analog-to-Digital Converter. See A/D.

Assembler

MPASM Assembler................................................... 171

Automatic Clock Stretch.................................................... 106

During 10-bit Addressing (STREN = 1) .................... 106

During 7-bit Addressing (STREN = 1) ...................... 106

Receive Mode ........................................................... 106

Transmit Mode .......................................................... 106

Bandgap Start-up Time

Requirements............................................................ 196

Timing Characteristics .............................................. 196

Barrel Shifter ....................................................................... 29

Bit Reversed Addressing

Example ...................................................................... 50

Implementation ........................................................... 49

Bit-Reversed Addressing .................................................... 49

Modifier Values Table ................................................. 50

Sequence Table (16-Entry)......................................... 50

Block Diagrams

12-bit A/D Functional ................................................ 141

16-bit Timer1 Module .................................................. 77

16-bit Timer2............................................................... 83

16-bit Timer3............................................................... 83

16-bit Timer4............................................................... 88

16-bit Timer5............................................................... 88

32-bit Timer2/3............................................................ 82

32-bit Timer4/5 ........................................................... 87

Analog Input Model................................................... 144

CAN Buffers and Protocol Engine ............................ 120

DCI Module............................................................... 132

Dedicated Port Structure ............................................ 71

DSP Engine ................................................................ 25

dsPIC30F5013/6013/6014.......................................... 14

External Power-on Reset Circuit .............................. 156

I2C ............................................................................ 104

Input Capture Mode.................................................... 91

Oscillator System...................................................... 150

Output Compare Mode ............................................... 95

RESET System......................................................... 154

Shared Port Structure................................................. 73

SPI............................................................................ 100

SPI Master/Slave Connection................................... 100

UART Receiver......................................................... 112

UART Transmitter..................................................... 111

BOR Characteristics ......................................................... 190

BOR. See Brown-out Reset.

Brown-out Reset

Characteristics.......................................................... 189

Timing Requirements ............................................... 196

C Compilers

MPLAB C17.............................................................. 172

MPLAB C18.............................................................. 172

MPLAB C30.............................................................. 172

CAN Module ..................................................................... 119

Baud Rate Setting .................................................... 124

CAN1 Register Map.................................................. 126

CAN2 Register Map.................................................. 128

Frame Types ............................................................ 119

I/O Timing Characteristics ........................................ 217

I/O Timing Requirements.......................................... 217

Message Reception.................................................. 122

Message Transmission............................................. 123

Modes of Operation .................................................. 121

Overview................................................................... 119

CLKOUT and I/O Timing

Characteristics.......................................................... 194

Requirements ........................................................... 194

Code Examples

Data EEPROM Block Erase ....................................... 66

Data EEPROM Block Write ........................................ 68

Data EEPROM Read.................................................. 65

Data EEPROM Word Erase ....................................... 66

Data EEPROM Word Write ........................................ 67

Erasing a Row of Program Memory ........................... 61

Initiating a Programming Sequence ........................... 62

Loading Write Latches................................................ 62

Code Protection................................................................ 149

Core Architecture................................................................ 17

Overview..................................................................... 17

Data Accumulators and Adder/............................... 27, 28, 29

Data Address Space........................................................... 35

Alignment.................................................................... 36

Alignment (Figure) ...................................................... 36

Effect of Invalid Memory Accesses (Table) ................ 36

MCU and DSP (MAC Class) Instructions Example .... 39

Memory Map............................................................... 36

Near Data Space ........................................................ 37

Sample Memory Map ................................................. 38

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DS70083C-page 240 Advance Information  2003 Microchip Technology Inc.

Software Stack............................................................ 37

Spaces ........................................................................ 35

Width........................................................................... 36

Data Converter Interface (DCI) Module ............................ 131

Data EEPROM Memory ...................................................... 65

Erasing........................................................................ 66

Erasing, Block ............................................................. 66

Erasing, Word ............................................................. 66

Protection Against Spurious Write .............................. 69

Reading....................................................................... 65

Write Verify ................................................................. 69

Writing......................................................................... 67

Writing, Block .............................................................. 68

Writing, Word .............................................................. 67

Data Space Organization .................................................... 43

DC Characteristics ............................................................ 178

BOR .......................................................................... 190

Brown-out Reset ....................................................... 189

I/O Pin Input Specifications....................................... 187

I/O Pin Output Specifications .................................... 188

Idle Current (IIDLE) .................................................... 182

Low-Voltage Detect................................................... 188

LVDL ......................................................................... 189

Operating Current (IDD)............................................. 179

Power-Down Current (IPD) ........................................ 185

Program and EEPROM............................................. 190

Temperature and Voltage Specifications .................. 178

DCI Module

Bit Clock Generator................................................... 135

Buffer Alignment with Data Frames .......................... 136

Buffer Control............................................................ 131

Buffer Data Alignment............................................... 131

Buffer Length Control................................................ 136

COFS Pin.................................................................. 131

CSCK Pin.................................................................. 131

CSDI Pin ................................................................... 131

CSDO Mode Bit ........................................................ 137

CSDO Pin ................................................................. 131

Data Justification Control Bit..................................... 135

Device Frequencies for Common Codec

CSCK Frequencies (Table)............................... 135

Digital Loopback Mode ............................................. 137

Enable....................................................................... 133

Frame Sync Generator ............................................. 133

Frame Sync Mode Control Bits ................................. 133

I/O Pins ..................................................................... 131

Interrupts................................................................... 137

Introduction ............................................................... 131

Master Frame Sync Operation.................................. 133

Operation .................................................................. 133

Operation During CPU Idle Mode ............................. 138

Operation During CPU Sleep Mode.......................... 138

Receive Slot Enable Bits........................................... 136

Receive Status Bits................................................... 137

Sample Clock Edge Control Bit................................. 135

Slave Frame Sync Operation.................................... 134

Slot Enable Bits Operation with Frame Sync ............ 136

Slot Status Bits.......................................................... 137

Synchronous Data Transfers .................................... 136

Timing Characteristics

AC-Link Mode ................................................... 207

Multichannel, I2S Modes ................................... 205

Timing Requirements

AC-Link Mode................................................... 207

Multichannel, I2S Modes................................... 206

Transmit Slot Enable Bits ......................................... 135

Transmit Status Bits.................................................. 137

Transmit/Receive Shift Register ............................... 131

Underflow Mode Control Bit...................................... 137

Word Size Selection Bits .......................................... 133

Demonstration Boards

PICDEM 1................................................................. 174

PICDEM 17............................................................... 174

PICDEM 18R PIC18C601/801.................................. 175

PICDEM 2 Plus......................................................... 174

PICDEM 3 PIC16C92X............................................. 174

PICDEM 4................................................................. 174

PICDEM LIN PIC16C43X ......................................... 175

PICDEM USB PIC16C7X5 ....................................... 175

PICDEM.net Internet/Ethernet.................................. 174

Development Support ....................................................... 171

Device Configuration

Device Configuration Registers

FBORPOR................................................................ 160

FGS .......................................................................... 160

FOSC........................................................................ 160

FWDT ....................................................................... 160

Device Overview................................................................. 13

Disabling the UART .......................................................... 113

Divide Support .................................................................... 23

Instructions (Table)..................................................... 23

DSP Engine ........................................................................ 24

Multiplier ..................................................................... 26

Dual Output Compare Match Mode .................................... 96

Continuous Pulse Mode.............................................. 96

Single Pulse Mode...................................................... 96

Electrical Characteristics .................................................. 177

AC............................................................................. 191

DC ............................................................................ 178

Enabling and Setting Up UART

Alternate I/O ............................................................. 113

Setting Up Data, Parity and Stop Bit Selections....... 113

Enabling the UART ........................................................... 113

Equations

A/D Conversion Clock............................................... 143

A/D Sampling Time................................................... 144

Baud Rate................................................................. 115

Bit Clock Frequency.................................................. 135

COFSG Period.......................................................... 133

Serial Clock Rate...................................................... 108

Time Quantum for Clock Generation........................ 125

Errata .................................................................................. 11

Evaluation and Programming Tools.................................. 175

Exception Processing ......................................................... 51

External Clock Timing Characteristics

Type A, B and C Timer ............................................. 197

External Clock Timing Requirements ............................... 192

Type A Timer ............................................................ 197

Type B Timer ............................................................ 198

Type C Timer............................................................ 198

External Interrupt Requests ................................................ 56

 2003 Microchip Technology Inc. Advance Information DS70083C-page 241

dsPIC30F

Fast Context Saving............................................................ 56

Flash Program Memory ...................................................... 59

Control Registers ........................................................ 60

NVMADR ............................................................ 60

NVMADRU.......................................................... 60

NVMCON............................................................ 60

NVMKEY............................................................. 60

I/O Pin Specifications

Input .......................................................................... 187

Output ....................................................................... 188

I/O Ports.............................................................................. 71

Parallel (PIO) .............................................................. 71

I2C..................................................................................... 103

I2C 10-bit Slave Mode Operation ...................................... 105

Reception.................................................................. 105

Transmission............................................................. 105

I2C 7-bit Slave Mode Operation ........................................ 105

I2C 7-bit Slave Mode Operation

Reception.................................................................. 105

Transmission............................................................. 105

I2C Master Mode Operation .............................................. 107

Baud Rate Generator................................................ 108

Clock Arbitration........................................................ 108

Multi-Master Communication, Bus Collision

and Bus Arbitration ........................................... 108

Reception.................................................................. 107

Transmission............................................................. 107

I2C Master Mode Support ................................................. 107

I2C Module ........................................................................ 103

Addresses ................................................................. 105

Bus Data Timing Characteristics

Master Mode..................................................... 213

Slave Mode....................................................... 215

Bus Data Timing Requirements

Master Mode..................................................... 214

Slave Mode....................................................... 216

Bus Start/Stop Bits Timing Characteristics

Master Mode..................................................... 213

Slave Mode....................................................... 215

General Call Address Support .................................. 107

Interrupts................................................................... 106

IPMI Support ............................................................. 107

Operating Function Description ................................ 103

Operation During CPU Sleep and Idle Modes .......... 108

Pin Configuration ...................................................... 103

Registers................................................................... 103

Slope Control ............................................................ 107

Software Controlled Clock Stretching

(STREN = 1)..................................................... 106

Various Modes .......................................................... 103

I2C Module

Programmer’s Model................................................. 103

I2S Mode Operation .......................................................... 138

Data Justification....................................................... 138

Frame and Data Word Length Selection................... 138

Idle Current (IIDLE) ............................................................ 182

In-Circuit Serial Programming (ICSP) ......................... 59, 149

Input Capture (CAPX) Timing Characteristics .................. 200

Input Capture Module ......................................................... 91

Interrupts..................................................................... 92

Input Capture Operation During Sleep and Idle Modes...... 92

CPU Idle Mode ........................................................... 92

CPU Sleep Mode........................................................ 92

Input Capture Timing Requirements................................. 200

Input Change Notification Module....................................... 75

Input Characteristics

QEA/QEB ................................................................. 203

Instruction Addressing Modes ............................................ 43

File Register Instructions ............................................ 44

Fundamental Modes Supported ................................. 43

MAC Instructions ........................................................ 44

MCU Instructions ........................................................ 44

Move and Accumulator Instructions ........................... 44

Other Instructions ....................................................... 44

Instruction Flow................................................................... 20

Pipeline

1-Word, 1-Cycle (Figure).................................... 20

1-Word, 2-Cycle (Figure).................................... 20

1-Word, 2-Cycle MOV.D Operations (Figure)..... 21

1-Word, 2-Cycle Table Operations (Figure) ....... 21

1-Word, 2-Cycle with Instruction Stall (Figure) ... 22

2-Word, 2-Cycle DO, DOW (Figure)................... 22

2-Word, 2-Cycle GOTO, CALL (Figure) ............. 21

Instruction Set

Overview................................................................... 166

Summary .................................................................. 163

Instruction Stalls ................................................................. 45

Introduction................................................................. 45

Raw Dependency Detection ....................................... 45

Inter-Integrated Circuit. See I2C.

Internal Clock Timing Examples ....................................... 193

Interrupt Controller

Interrupt Priority .................................................................. 52

Interrupt Sequence ............................................................. 55

Interrupt Stack Frame................................................. 55

Load Conditions................................................................ 191

Low Voltage Detect (LVD) ................................................ 159

Low-Voltage Detect Characteristics.................................. 188

LVDL Characteristics........................................................ 189

Memory Organization ......................................................... 31

Core Register Map ..................................................... 40

Modes of Operation

Disable...................................................................... 121

Error Recognition...................................................... 121

Initialization............................................................... 121

Listen Only................................................................ 121

Loopback .................................................................. 121

Normal Operation ..................................................... 121

Modulo Addressing............................................................. 46

Applicability................................................................. 49

Decrementing Buffer Operation Example................... 48

Incrementing Buffer Operation Example .................... 47

Restrictions................................................................. 49

Start and End Address ............................................... 46

W Address Register Selection.................................... 47

Motor Control PWM Module

Fault Timing Characteristics ..................................... 202

Timing Characteristics .............................................. 202

Timing Requirements ............................................... 202

dsPIC30F

DS70083C-page 242 Advance Information  2003 Microchip Technology Inc.

MPLAB ASM30 Assembler, Linker, Librarian ................... 172

MPLAB ICD 2 In-Circuit Debugger.................................... 173

MPLAB ICE 2000 High Performance Universal

In-Circuit Emulator .................................................... 173

MPLAB ICE 4000 High Performance Universal

In-Circuit Emulator .................................................... 173

MPLAB Integrated Development Environment

Software.................................................................... 171

MPLINK Object Linker/MPLIB Object Librarian ................ 172

Multiplier

16-bit Integer and Fractional Modes Example ............ 26

NVM

OC/PWM Module Timing Characteristics.......................... 201

Operating Current (IDD)..................................................... 179

Operating Frequency vs Voltage

dsPIC30FXXXX-20 (Extended)................................. 178

Oscillator

Configurations........................................................... 151

Fail-Safe Clock Monitor..................................... 153

Fast RC (FRC) .................................................. 152

Initial Clock Source Selection ........................... 151

Low Power RC (LPRC) ..................................... 152

LP Oscillator Control ......................................... 152

Phase Locked Loop (PLL) ................................ 152

Start-up Timer (OST) ........................................ 152

Operating Modes (Table) .......................................... 149

System Overview ...................................................... 149

Oscillator Selection ........................................................... 149

Oscillator Start-up Timer

Timing Characteristics .............................................. 195

Timing Requirements................................................ 196

Output Compare Interrupts ................................................. 97

Output Compare Module..................................................... 95

Timing Characteristics .............................................. 200

Timing Requirements................................................ 200

Output Compare Operation During CPU Idle Mode............ 97

Output Compare Sleep Mode Operation............................. 97

Packaging Information ...................................................... 227

Marking ..................................................................... 227

Peripheral Module Disable (PMD) Registers .................... 161

PICkit 1 FLASH Starter Kit ................................................ 175

PICSTART Plus Development Programmer ..................... 173

Pinout Descriptions ............................................................. 15

PLL Clock Timing Specifications....................................... 193

POR. See Power-on Reset.

PORTA

PORTB

PORTC

PORTD

PORTF

PORTG

Power Saving Modes........................................................ 159

Idle............................................................................ 160

Sleep ........................................................................ 159

Sleep and Idle........................................................... 149

Power-Down Current (IPD)................................................ 185

Power-up Timer

Timing Characteristics .............................................. 195

Timing Requirements................................................ 196

PRO MATE II Universal Device Programmer ................... 173

Program Address Space..................................................... 31

Alignment and Data Access Using

Table Instructions ............................................... 32

Construction ............................................................... 31

Data Access from, Address Generation ..................... 31

Data Space Window into Operation............................ 34

Data Table Access (LS Word) .................................... 32

Data Table Access (MS Byte)..................................... 33

Memory Map............................................................... 35

Table Instructions

TBLRDH ............................................................. 32

TBLRDL.............................................................. 32

TBLWTH............................................................. 32

TBLWTL ............................................................. 32

Visibility from Data Space........................................... 33

Program and EEPROM Characteristics............................ 190

Program Counter ................................................................ 18

Programmable .................................................................. 149

Programmer’s Model .......................................................... 18

Diagram ...................................................................... 19

Programming Operations.................................................... 61

Algorithm for Program FLASH.................................... 61

Erasing a Row of Program Memory............................ 61

Initiating the Programming Sequence......................... 62

Loading Write Latches................................................ 62

Protection Against Accidental Writes to OSCCON ........... 153

QEA/QEB Input Characteristics........................................ 203

QEI Module

External Clock Timing Requirements ....................... 199

Index Pulse Timing Characteristics .......................... 204

Index Pulse Timing Requirements............................ 204

Quadrature Decoder Timing Requirements...................... 203

Reset ........................................................................ 149, 154

BOR, Programmable ................................................ 156

Brown-out Reset (BOR)............................................ 149

Oscillator Start-up Timer (OST)................................ 149

POR

Operating without FSCM and PWRT................ 156

With Long Crystal Start-up Time ...................... 156

POR (Power-on Reset)............................................. 154

Power-on Reset (POR)............................................. 149

Power-up Timer (PWRT) .......................................... 149

Reset Sequence ................................................................. 53

Reset Sources ............................................................ 53

Reset Sources

Brown-out Reset (BOR).............................................. 53

Illegal Instruction Trap ................................................ 53

Trap Lockout............................................................... 53

Uninitialized W Register Trap ..................................... 53

Watchdog Time-out .................................................... 53

Reset Timing Characteristics............................................ 195

Reset Timing Requirements ............................................. 196

RTSP Operation ................................................................. 60

 2003 Microchip Technology Inc. Advance Information DS70083C-page 243

dsPIC30F

Run-Time Self-Programming (RTSP) ................................. 59

Control Registers

NVMADR ............................................................ 59

NVMCON............................................................ 59

NVMKEY............................................................. 59

Serial Peripheral Interface. See SPI.

Simple Capture Event Mode ............................................... 91

Buffer Operation.......................................................... 92

Hall Sensor Mode ....................................................... 92

Prescaler..................................................................... 91

Timer2 and Timer3 Selection Mode............................ 92

Simple OC/PWM Mode Timing Requirements.................. 201

Simple Output Compare Match Mode................................. 96

Simple PWM Mode ............................................................. 96

Input Pin FAULT Protection ........................................ 96

Period.......................................................................... 97

Software Simulator (MPLAB SIM)..................................... 172

Software Simulator (MPLAB SIM30)................................. 172

Software Stack Pointer, Frame Pointer............................... 18

CALL Stack Frame...................................................... 37

SPI ...................................................................................... 99

SPI Module ......................................................................... 99

Framed SPI Support ................................................... 99

Operating Function Description .................................. 99

Operation During CPU IDLE Mode ........................... 101

Operation During CPU Sleep Mode.......................... 101

SDOx Disable ............................................................. 99

Slave Select Synchronization ................................... 101

SPI1 Register Map.................................................... 102

SPI2 Register Map.................................................... 102

Timing Characteristics

Master Mode (CKE = 0).................................... 208

Master Mode (CKE = 1).................................... 209

Slave Mode (CKE = 1).............................. 210, 211

Timing Requirements

Master Mode (CKE = 0).................................... 208

Master Mode (CKE = 1).................................... 209

Slave Mode (CKE = 0)...................................... 210

Slave Mode (CKE = 1)...................................... 212

Word and Byte Communication .................................. 99

STATUS Bits, Their Significance and the Initialization Condi-

tion for RCON Register, Case 1................................ 157

STATUS Bits, Their Significance and the Initialization Condi-

tion for RCON Register, Case 2................................ 158

STATUS Register ............................................................... 18

Z Status Bit ................................................................. 18

Subtractor ........................................................................... 27

Data Space Write Saturation ...................................... 29

Overflow and Saturation ............................................. 27

Round Logic................................................................ 28

Write Back................................................................... 28

Symbols used in Opcode Descriptions ............................. 164

System Integration ............................................................ 149

Table Instruction Operation Summary ................................ 59

Temperature and Voltage Specifications

AC ............................................................................. 191

DC............................................................................. 178

Timer1 Module .................................................................... 77

16-bit Asynchronous Counter Mode ........................... 77

16-bit Synchronous Counter Mode ............................. 77

16-bit Timer Mode....................................................... 77

Gate Operation ........................................................... 78

Interrupt ...................................................................... 78

Operation During Sleep Mode .................................... 78

Prescaler .................................................................... 78

Real-Time Clock ......................................................... 78

Interrupts ............................................................ 78

Oscillator Operation............................................ 78

Timer2 and Timer3 Selection Mode.................................... 96

Timer2/3 Module................................................................. 81

16-bit Timer Mode ...................................................... 81

32-bit Synchronous Counter Mode............................. 81

32-bit Timer Mode ...................................................... 81

ADC Event Trigger ..................................................... 84

Gate Operation ........................................................... 84

Interrupt ...................................................................... 84

Operation During Sleep Mode .................................... 84

Timer Prescaler .......................................................... 84

Timer4/5 Module................................................................. 87

TimerQ (QEI Module) External Clock

Timing Characteristics .............................................. 199

Timing Characteristics

A/D Conversion

High-speed (CHPS = 01, SIMSAM = 0,

ASAM = 0, SSRC = 000) ........................ 220

High-speed (CHPS = 01, SIMSAM = 0,

ASAM = 1, SSRC = 111,

SAMC = 00001)...................................... 221

Low-speed (ASAM = 0, SSRC = 000) ............ 225

Bandgap Start-up Time ............................................ 196

CAN Module I/O ....................................................... 217

CLKOUT and I/O ...................................................... 194

DCI Module

AC-Link Mode................................................... 207

Multichannel, I2S Modes................................... 205

External Clock .......................................................... 191

I2C Bus Data

Master Mode..................................................... 213

Slave Mode ...................................................... 215

I2C Bus Start/Stop Bits

Master Mode..................................................... 213

Slave Mode ...................................................... 215

Input Capture (CAPX)............................................... 200

Motor Control PWM Module ..................................... 202

Motor Control PWM Module Falult ........................... 202

OC/PWM Module...................................................... 201

Oscillator Start-up Timer........................................... 195

Output Compare Module .......................................... 200

Power-up Timer ........................................................ 195

QEI Module Index Pulse........................................... 204

Reset ........................................................................ 195

SPI Module

Master Mode (CKE = 0) ................................... 208

Master Mode (CKE = 1) ................................... 209

Slave Mode (CKE = 0) ..................................... 210

Slave Mode (CKE = 1) ..................................... 211

TimerQ (QEI Module) External Clock ....................... 199

Type A, B and C Timer External Clock..................... 197

Watchdog Timer ....................................................... 195

Timing Diagrams

CAN Bit..................................................................... 124

Frame Sync, AC-Link Start of Frame ....................... 134

Frame Sync, Multi-Channel Mode ............................ 134

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DS70083C-page 244 Advance Information  2003 Microchip Technology Inc.

I2S Interface Frame Sync.......................................... 134

PWM Output ............................................................... 97

Time-out Sequence on Power-up

(MCLR Not Tied to VDD), Case 1...................... 155

Time-out Sequence on Power-up

(MCLR Not Tied to VDD), Case 2...................... 155

Time-out Sequence on Power-up

(MCLR Tied to VDD).......................................... 155

Timing Diagrams and Specifications

DC Characteristics - Internal RC Accuracy............... 193

Timing Diagrams.See Timing Characteristics

Timing Requirements

A/D Conversion

High-speed........................................................ 222

Low-speed ........................................................ 226

Bandgap Start-up Time............................................. 196

Brown-out Reset ....................................................... 196

CAN Module I/O........................................................ 217

CLKOUT and I/O....................................................... 194

DCI Module

AC-Link Mode ................................................... 207

Multichannel, I2S Modes ................................... 206

External Clock........................................................... 192

I2C Bus Data (Master Mode)..................................... 214

I2C Bus Data (Slave Mode)....................................... 216

Input Capture ............................................................ 200

Motor Control PWM Module...................................... 202

Oscillator Start-up Timer ........................................... 196

Output Compare Module........................................... 200

Power-up Timer ........................................................ 196

QEI Module

External Clock................................................... 199

Index Pulse ....................................................... 204

Quadrature Decoder ................................................. 203

Reset......................................................................... 196

Simple OC/PWM Mode............................................. 201

SPI Module

Master Mode (CKE = 0) .................................... 208

Master Mode (CKE = 1) .................................... 209

Slave Mode (CKE = 0) ...................................... 210

Slave Mode (CKE = 1) ...................................... 212

Type A Timer External Clock .................................... 197

Type B Timer External Clock .................................... 198

Type C Timer External Clock .................................... 198

Watchdog Timer........................................................ 196

Timing Specifications

PLL Clock.................................................................. 193

Traps ................................................................................... 53

Hard and Soft.............................................................. 54

Sources....................................................................... 53

Address Error Trap ............................................. 54

Math Error Trap................................................... 53

Oscillator Fail Trap.............................................. 54

Stack Error Trap.................................................. 54

UART Module

Address Detect Mode ............................................... 115

Auto Baud Support ................................................... 116

Baud Rate Generator ............................................... 115

Enabling and Setting Up........................................... 113

Framing Error (FERR) .............................................. 115

Idle Status................................................................. 115

Loopback Mode ........................................................ 115

Operation During CPU Sleep and Idle Modes.......... 116

Overview................................................................... 111

Parity Error (PERR) .................................................. 115

Receive Break .......................................................... 115

Receive Buffer (UxRXB)........................................... 114

Receive Buffer Overrun Error (OERR Bit) ................ 114

Receive Interrupt ...................................................... 114

Receiving Data ......................................................... 114

Receiving in 8-bit or 9-bit Data Mode ....................... 114

Reception Error Handling ......................................... 114

Transmit Break ......................................................... 114

Transmit Buffer (UxTXB) .......................................... 113

Transmit Interrupt ..................................................... 114

Transmitting Data ..................................................... 113

Transmitting in 8-bit Data Mode................................ 113

Transmitting in 9-bit Data Mode................................ 113

UART1 Register Map................................................ 117

UART2 Register Map................................................ 117

UART Operation

Idle Mode.................................................................. 116

Sleep Mode .............................................................. 116

Unit ID Locations .............................................................. 149

Universal Asynchronous Receiver Transmitter. See UART.

Wake-up from Sleep ......................................................... 149

Wake-up from Sleep and Idle ............................................. 56

Watchdog Timer

Timing Characteristics .............................................. 195

Timing Requirements................................................ 196

Watchdog Timer (WDT)............................................ 149, 159

Enabling and Disabling............................................. 159

Operation.................................................................. 159

WWW, On-Line Support ..................................................... 11

 2003 Microchip Technology Inc. Advance Information DS70083C-page 245

dsPIC30F

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip

World Wide Web site.

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

and a web browser, such as Netscape® or Microsoft®

Internet Explorer. Files are also available for FTP

download from our FTP site.

Connecting to the Microchip Internet

Web Site

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP ser-

vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits.The Hot Line

Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

042003

dsPIC30F

DS70083C-page 246 Advance Information  2003 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: Technical Publications Manager

RE: Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature Number:

Questions:

FAX: (______) _________ - _________

DS70083CdsPIC30F

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

 2003 Microchip Technology Inc. Advance Information DS70083C-page 247

dsPIC30F

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

a) dsPIC30F2011ATP-E/SO = Extended temp., SOIC package, Rev. A.

b) dsPIC30F6014ATP-I/PT = Industrial temp., TQFP package, Rev. A.

c) dsPIC30F3012ATP-I/P = Industrial temp., PDIP package, Rev. A.

dsPIC30LF1001ATP-I/PT-000

Trademark

Family

Memory

Type

Flash = F

E = Extended High Temp -40°C to +125°C

I = Industrial -40°C to +85°C

Temperature

Device ID

P = Pilot

Package

PT = TQFP 10x10

PT = TQFP 12x12

PT = TQFP 14x14

SO = SOIC

SP = SDIP

P=DIP

S = Die (Waffle Pack)

W = Die (Wafers)

L = Low Voltage

Memory Size in Bytes

0 = ROMless

1 = 1K to 6K

2 = 7K to 12K

3 = 13K to 24K

4 = 25K to 48K

5 = 49K to 96K

6 = 97K to 192K

7 = 193K to 384K

8 = 385K to 768K

9 = 769K and Up

Custom ID

T = Tape and Reel

A,B,C… = Revision

dsPIC30F

DS70083C-page 248 Advance Information  2003 Microchip Technology Inc.

NOTES:

 2003 Microchip Technology Inc. Advance Information DS70083C-page 249

dsPIC30F

NOTES:

DS70083C-page 250 Advance Information  2003 Microchip Technology Inc.

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11/24/03

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