dsPIC30F Data Sheet General Purpose and Sensor Families High Performance Digital Signal Controllers 2003 Microchip Technology Inc. Advance Information DS70083C Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. DS70083C-page ii Advance Information 2003 Microchip Technology Inc. dsPIC30F dsPIC30F Enhanced Flash 16-bit Digital Signal Controllers General Purpose and Sensor Families High Performance Modified RISC CPU: Peripheral Features: * * * * * * High current sink/source I/O pins: 25 mA/25 mA * Up to 5 external interrupt sources * Timer module with programmable prescaler: - Up to five 16-bit timers/counters; optionally pair up 16-bit timers into 32-bit timer modules * 16-bit Capture input functions * 16-bit Compare/PWM output functions: - Dual Compare mode available * Data Converter Interface (DCI) supports common audio Codec protocols, including I2S and AC'97 * 3-wire SPITM modules (supports 4 Frame modes) * I2CTM module supports Multi-Master/Slave mode and 7-bit/10-bit addressing * Addressable UART modules supporting: - Interrupt on address bit - Wake-up on Start bit - 4 characters deep TX and RX FIFO buffers * CAN bus modules * * * * * * * * * * * * * * * Modified Harvard architecture C compiler optimized instruction set architecture 84 base instructions 24-bit wide instructions, 16-bit wide data path Linear program memory addressing up to 4M instruction words Linear data memory addressing up to 64 Kbytes Up to 144 Kbytes on-chip Flash program space Up to 48K instruction words Up to 8 Kbytes of on-chip data RAM Up to 4 Kbytes of non-volatile data EEPROM 16 x 16-bit working register array Three Address Generation Units that enable: - Dual data fetch - Accumulator write back for DSP operations Flexible Addressing modes supporting: - Indirect, Modulo and Bit-Reversed modes Two 40-bit wide accumulators with optional saturation logic 17-bit x 17-bit single cycle hardware fractional/ integer multiplier Single cycle Multiply-Accumulate (MAC) operation 40-stage Barrel Shifter Up to 30 MIPs operation: - DC to 40 MHz external clock input - 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x) Up to 41 interrupt sources: - 8 user selectable priority levels Vector table with up to 62 vectors: - 54 interrupt vectors - 8 processor exceptions and software traps 2003 Microchip Technology Inc. Analog Features: * 12-bit Analog-to-Digital Converter (A/D) with: - 100 Ksps conversion rate - Up to 16 input channels - Conversion available during Sleep and Idle * Programmable Low Voltage Detection (PLVD) * Programmable Brown-out Detection and Reset generation Advance Information DS70083C-page 1 dsPIC30F Special Microcontroller Features: CMOS Technology: * Enhanced Flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100K (typical) * Data EEPROM memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1M (typical) * Self-reprogrammable under software control * Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) * Flexible Watchdog Timer (WDT) with on-chip low power RC oscillator for reliable operation * Fail-Safe Clock Monitor operation: - Detects clock failure and switches to on-chip low power RC oscillator * Programmable code protection * In-Circuit Serial ProgrammingTM (ICSPTM) via 3 pins and power/ground * Selectable Power Management modes: - Sleep, Idle and Alternate Clock modes * * * * DS70083C-page 2 Low power, high speed Flash technology Wide operating voltage range (2.5V to 5.5V) Industrial and Extended temperature ranges Low power consumption Advance Information 2003 Microchip Technology Inc. dsPIC30F Bytes Instructions Input Cap Output Comp/ A/D 12-bit Std PWM 100 Ksps I2CTM SRAM EEPROM Timer Bytes Bytes 16-bit Pins SPITM Program Memory Device UART dsPIC30F Sensor Processor Family dsPIC30F2011 18 12K 4K 1024 0 3 2 2 8 ch 1 1 1 dsPIC30F3012 18 24K 8K 2048 1024 3 2 2 8 ch 1 1 1 dsPIC30F2012 28 12K 4K 1024 0 3 2 2 10 ch 1 1 1 dsPIC30F3013 28 24K 8K 2048 1024 3 2 2 10 ch 2 1 1 Pin Diagrams 18-Pin SOIC and PDIP 1 2 3 4 5 6 7 8 9 dsPIC30F2011 dsPIC30F3012 MCLR AN0/VREF+/CN2/RB0 AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 OSCI/CLKI OSCO/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 18 17 16 15 14 13 12 11 10 AVDD AVSS AN6/SCK1/INT0/OCFA/RB6 EMUD2/AN7/OC2/IC2/RB7 VDD VSS PGC/EMUC/AN5/U1RX/SDI1/SDA/CN7/RB5 PGD/EMUD/AN4/U1TX/SDO1/SCL/CN6/RB4 EMUC2/OC1/IC1/INT1/RD0 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 RF4 RF5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 SCK1/INT0/RF6 EMUC2/IC1/INT1/RD8 28 27 26 25 24 23 22 21 20 19 18 17 16 15 AVDD AVSS AN6/OCFA/RB6 EMUD2/AN7/RB7 AN8/OC1/RB8 AN9/OC2/RB9 RF4 RF5 VDD VSS PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 SCK1/INT0/RF6 EMUC2/IC1/INT1/RD8 28-Pin SDIP and SOIC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 dsPIC30F2012 MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD IC2/INT2/RD9 28-Pin SDIP and SOIC Note: 1 2 3 4 5 6 7 8 9 10 11 12 13 14 dsPIC30F3013 MCLR EMUD3/AN0/VREF+/CN2/RB0 EMUC3/AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 VDD IC2/INT2/RD9 Pinout subject to change. 2003 Microchip Technology Inc. Advance Information DS70083C-page 3 dsPIC30F CAN Output SRAM EEPROM Timer Input Codec A/D 12-bit Comp/Std Bytes 16-bit Cap Interface 100 Ksps Bytes Instructions Bytes PWM I2CTM Pins SPITM Program Memory Device UART dsPIC30F General Purpose Controller Family dsPIC30F3014 40/44 24K 8K 2048 1024 3 2 2 -- 13 ch 2 1 1 - dsPIC30F4013 40/44 48K 16K 2048 1024 5 4 4 AC'97, I2S 13 ch 2 1 1 1 dsPIC30F5011 64 66K 22K 4096 1024 5 8 8 AC'97, I2S 16 ch 2 2 1 2 dsPIC30F6011 64 132K 44K 6144 2048 5 8 8 -- 16 ch 2 2 1 2 dsPIC30F6012 64 144K 48K 8192 4096 5 8 8 AC'97, I2S 16 ch 2 2 1 2 dsPIC30F5013 80 66K 22K 4096 1024 5 8 8 AC'97, I2S 16 ch 2 2 1 2 dsPIC30F6013 80 132K 44K 6144 2048 5 8 8 -- 16 ch 2 2 1 2 dsPIC30F6014 80 144K 48K 8192 4096 5 8 8 AC'97, I2S 16 ch 2 2 1 2 Pin Diagrams 40-Pin PDIP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 dsPIC30F3014 MCLR AN0/VREF+/CN2/RB0 AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 VDD VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 INT0/RA11 IC2/INT2/RD9 RD3 VSS 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 AVDD AVSS AN9/RB9 AN10/RB10 AN11/RB11 AN12/RB12 EMUC2/OC1/RD0 EMUD2/OC2/RD1 VDD VSS RF0 RF1 U2RX/RF4 U2TX/RF5 U1RX/SDI1/SDA/RF2 EMUD3/U1TX/SDO1/SCL/RF3 EMUC3/SCK1/RF6 IC1/INT1/RD8 RD2 VDD 40-Pin PDIP Note: DS70083C-page 4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 dsPIC30F4013 MCLR AN0/VREF+/CN2/RB0 AN1/VREF-/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/IC7/CN6/RB4 AN5/IC8/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 VDD VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 INT0/RA11 IC2/INT2/RD9 OC4/RD3 VSS 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 AVDD AVSS AN9/CSCK/RB9 AN10/CSDI/RB10 AN11/CSDO/RB11 AN12/COFS/RB12 EMUC2/OC1/RD0 EMUD2/OC2/RD1 VDD VSS C1RX/RF0 C1TX/RF1 U2RX/RF4 U2TX/RF5 U1RX/SDI1/SDA/RF2 EMUD3/U1TX/SDO1/SCL/RF3 EMUC3/SCK1/RF6 IC1/INT1/RD8 OC3/RD2 VDD Pinout subject to change. Advance Information 2003 Microchip Technology Inc. dsPIC30F Pin Diagrams (Continued) 44 43 42 41 40 39 38 37 36 35 34 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 AN1/VREF-/CN3/RB1 AN0/VREF+/CN2/RB0 MCLR NC AVDD AVSS AN9/RB9 AN10/RB10 AN11/RB11 44-Pin TQFP 1 2 3 4 5 6 7 8 9 10 11 dsPIC30F3014 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 AN4/CN6/RB4 AN5/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 NC VDD VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 AN12/RB12 EMUC2/OC1/RD0 EMUD2/OC2/RD1 VDD VSS NC RF0 RF1 U2RX/RF4 U2TX/RF5 U1RX/SDI1/SDA/RF2 EMUD3/U1TX/SDO1/SCL/RF3 EMUC3/SCK1/RF6 IC1/INT1/RD8 RD2 VDD NC VSS RD3 IC2/INT2/RD9 INT0/RA11 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 Note: Pinout subject to change. 2003 Microchip Technology Inc. Advance Information DS70083C-page 5 dsPIC30F Pin Diagrams (Continued) 44 43 42 41 40 39 38 37 36 35 34 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 AN1/VREF-/CN3/RB1 AN0/VREF+/CN2/RB0 MCLR NC AVDD AVSS AN9/CSCK/RB9 AN10/CSDI/RB10 AN11/CSDO/RB11 44-Pin TQFP 1 2 3 4 5 6 7 8 9 10 11 dsPIC30F4013 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 AN4/IC7/CN6/RB4 AN5/IC8/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 NC VDD VSS OSC1/CLKI OSC2/CLKO/RC15 EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 AN12/COFS/RB12 EMUC2/OC1/RD0 EMUD2/OC2/RD1 VDD VSS NC C1RX/RF0 C1TX/RF1 U2RX/RF4 U2TX/RF5 U1RX/SDI1/SDA/RF2 EMUD3/U1TX/SDO1/SCL/RF3 EMUC3/SCK1/RF6 IC1/INT1/RD8 OC3/RD2 VDD NC VSS OC4/RD3 IC2/INT2/RD9 INT0/RA11 EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14 Note: DS70083C-page 6 Pinout subject to change. Advance Information 2003 Microchip Technology Inc. dsPIC30F Pin Diagrams (Continued) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 CSDO/RG13 CSDI/RG12 CSCK/RG14 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VSS OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 64-Pin TQFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 dsPIC30F5011 dsPIC30F6012 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 EMUC1/SOSCO/T1CK/CN0/RC14 EMUD1/SOSCI/T4CK/CN1/RC13 EMUC2/OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKI VDD SCL/RG2 SDA/RG3 EMUC3/SCK1/INT0/RF6 U1RX/SDI1/RF2 EMUD3/U1TX/SDO1/RF3 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 COFS/RG15 T2CK/RC1 T3CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 AN1/VREF-/CN3/RB1 AN0/VREF+/CN2/RB0 Note: Pinout subject to change. 2003 Microchip Technology Inc. Advance Information DS70083C-page 7 dsPIC30F Pin Diagrams (Continued) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 RG13 RG12 RG14 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VSS OC8/CN16/RD7 OC7/CN15/RD6 OC6/IC6/CN14/RD5 OC5/IC5/CN13/RD4 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 64-Pin TQFP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 dsPIC30F6011 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 EMUC1/SOSCO/T1CK/CN0/RC14 EMUD1/SOSCI/T4CK/CN1/RC13 EMUC2/OC1/RD0 IC4/INT4/RD11 IC3/INT3/RD10 IC2/INT2/RD9 IC1/INT1/RD8 VSS OSC2/CLKO/RC15 OSC1/CLKI VDD SCL/RG2 SDA/RG3 EMUC3/SCK1/INT0/RF6 U1RX/SDI1/RF2 EMUD3/U1TX/SDO1/RF3 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 U2RX/CN17/RF4 U2TX/CN18/RF5 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 RG15 T2CK/RC1 T3CK/RC2 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 MCLR SS2/CN11/RG9 VSS VDD AN5/IC8/CN7/RB5 AN4/IC7/CN6/RB4 AN3/CN5/RB3 AN2/SS1/LVDIN/CN4/RB2 AN1/VREF-/CN3/RB1 AN0/VREF+/CN2/RB0 Note: Pinout subject to change. DS70083C-page 8 Advance Information 2003 Microchip Technology Inc. dsPIC30F Pin Diagrams (Continued) IC5/RD12 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 OC7/CN15/RD6 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VSS OC8/CN16/RD7 CSCK/RG14 RA7/CN23 RA6/CN22 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 CSDO/RG13 CSDI/RG12 80-Pin TQFP 60 EMUC1/SOSCO/T1CK/CN0/RC14 59 EMUD1/SOSCI/CN1/RC13 58 EMUC2/OC1/RD0 57 56 IC4/RD11 IC3/RD10 6 55 IC2/RD9 SDI2/CN9/RG7 7 54 IC1/RD8 SDO2/CN10/RG8 MCLR 8 53 INT4/RA15 9 52 INT3/RA14 VSS COFS/RG15 1 T2CK/RC1 2 T3CK/RC2 3 T4CK/RC3 T5CK/RC4 SCK2/CN8/RG6 4 5 dsPIC30F5013 dsPIC30F6014 51 SS2/CN11/RG9 VSS 10 VDD 12 49 OSC2/CLKO/RC15 OSC1/CLKI INT1/RA12 13 48 VDD INT2/RA13 AN5/CN7/RB5 14 47 SCL/RG2 15 46 SDA/RG3 AN4/CN6/RB4 AN3/CN5/RB3 16 45 17 44 EMUC3/SCK1/INT0/RF6 SDI1/RF7 AN2/SS1/LVDIN/CN4/RB2 AN1/CN3/RB1 18 43 EMUD3/SDO1/RF8 19 42 U1RX/RF2 AN0/CN2/RB0 20 41 U1TX/RF3 Note: 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 VREF-/RA9 VREF+/RA10 AVDD AVSS AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 IC7/CN20/RD14 IC8/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5 PGD/EMUD/AN7/RB7 50 23 21 22 PGC/EMUC/AN6/OCFA/RB6 11 Pinout subject to change. 2003 Microchip Technology Inc. Advance Information DS70083C-page 9 dsPIC30F Pin Diagrams (Continued) IC5/RD12 OC4/RD3 OC3/RD2 EMUD2/OC2/RD1 OC6/CN14/RD5 OC5/CN13/RD4 IC6/CN19/RD13 OC7/CN15/RD6 C2RX/RG0 C2TX/RG1 C1TX/RF1 C1RX/RF0 VDD VSS OC8/CN16/RD7 RG14 RA7/CN23 RA6/CN22 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 RG13 RG12 80-Pin TQFP 60 EMUC1/SOSCO/T1CK/CN0/RC14 59 EMUD1/SOSCI/CN1/RC13 58 EMUC2/OC1/RD0 57 56 IC4/RD11 IC3/RD10 6 55 IC2/RD9 SDI2/CN9/RG7 7 54 IC1/RD8 SDO2/CN10/RG8 MCLR 8 53 INT4/RA15 9 52 SS2/CN11/RG9 VSS VDD 10 51 INT3/RA14 VSS 12 49 OSC2/CLKO/RC15 OSC1/CLKI INT1/RA12 VDD RG15 1 T2CK/RC1 2 T3CK/RC2 3 T4CK/RC3 T5CK/RC4 SCK2/CN8/RG6 4 5 dsPIC30F6013 11 50 13 48 INT2/RA13 AN5/CN7/RB5 14 47 SCL/RG2 15 46 SDA/RG3 AN4/CN6/RB4 AN3/CN5/RB3 16 45 EMUC3/SCK1/INT0/RF6 SDI1/RF7 Note: 28 29 30 31 32 33 34 35 36 37 38 39 40 AN11/RB11 VSS VDD AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 IC7/CN20/RD14 IC8/CN21/RD15 U2RX/CN17/RF4 U2TX/CN18/RF5 27 AVSS AN8/RB8 AN9/RB9 26 AVDD AN10/RB10 25 U1TX/RF3 24 41 VREF+/RA10 20 23 U1RX/RF2 AN0/CN2/RB0 VREF-/RA9 EMUD3/SDO1/RF8 42 21 43 19 22 18 PGD/EMUD/AN7/RB7 AN2/SS1/LVDIN/CN4/RB2 AN1/CN3/RB1 PGC/EMUC/AN6/OCFA/RB6 17 44 Pinout subject to change. DS70083C-page 10 Advance Information 2003 Microchip Technology Inc. dsPIC30F Table of Contents 1.0 Device Overview ........................................................................................................................................................................ 13 2.0 CPU Architecture Overview........................................................................................................................................................ 17 3.0 Memory Organization ................................................................................................................................................................. 31 4.0 Address Generator Units............................................................................................................................................................ 43 5.0 Interrupts .................................................................................................................................................................................... 51 6.0 Flash Program Memory.............................................................................................................................................................. 59 7.0 Data EEPROM Memory ............................................................................................................................................................. 65 8.0 I/O Ports ..................................................................................................................................................................................... 71 9.0 Timer1 Module ........................................................................................................................................................................... 77 10.0 Timer2/3 Module ........................................................................................................................................................................ 81 11.0 Timer4/5 Module ........................................................................................................................................................................ 87 12.0 Input Capture Module................................................................................................................................................................. 91 13.0 Output Compare Module ............................................................................................................................................................ 95 14.0 SPI Module................................................................................................................................................................................. 99 15.0 I2C Module ............................................................................................................................................................................... 103 16.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 111 17.0 CAN Module ............................................................................................................................................................................. 119 18.0 Data Converter Interface (DCI) Module.................................................................................................................................... 131 19.0 12-bit Analog-to-Digital Converter (A/D) Module...................................................................................................................... 141 20.0 System Integration ................................................................................................................................................................... 149 21.0 Instruction Set Summary .......................................................................................................................................................... 163 22.0 Development Support............................................................................................................................................................... 171 23.0 Electrical Characteristics .......................................................................................................................................................... 177 24.0 Packaging Information.............................................................................................................................................................. 227 Index .................................................................................................................................................................................................. 239 On-Line Support................................................................................................................................................................................. 245 Systems Information and Upgrade Hot Line ...................................................................................................................................... 245 Reader Response .............................................................................................................................................................................. 246 Product Identification System ............................................................................................................................................................ 247 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) * The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products. 2003 Microchip Technology Inc. Advance Information DS70083C-page 11 dsPIC30F NOTES: DS70083C-page 12 Advance Information 2003 Microchip Technology Inc. dsPIC30F 1.0 DEVICE OVERVIEW Figure 1-1 shows a sample device block diagram. This document contains device family specific information for the dsPIC30F family of Digital Signal Controller (DSC) devices. The dsPIC30F devices contain extensive Digital Signal Processor (DSP) functionality within a high performance 16-bit microcontroller (MCU) architecture. 2003 Microchip Technology Inc. Note: Advance Information The device(s) depicted in this block diagram are representative of the corresponding device family. Other devices of the same family may vary in terms of number of pins and multiplexing of pin functions. Typically, smaller devices in the family contain a subset of the peripherals present in the device(s) shown in this diagram. DS70083C-page 13 dsPIC30F FIGURE 1-1: dsPIC30F5013/6013/6014 BLOCK DIAGRAM RA6/CN22 RA7/CN23 VREF-/RA9 VREF+/RA10 INT1/RA12 INT2/RA13 INT3/RA14 INT4/RA15 Y Data Bus X Data Bus 16 16 Interrupt Controller PSV & Table Data Access 24 Control Block Data Latch Y Data RAM (4 Kbytes) Address Latch 16 8 24 24 Address Latch Data EEPROM (4 Kbytes) 16 PORTA AN0/CN2/RB0 AN1/CN3/RB1 AN2/SS1/LVDIN/CN4/RB2 AN3/CN5/RB3 AN4/CN6/RB4 AN5/CN7/RB5 PGC/EMUC/AN6/OCFA/RB6 PGD/EMUD/AN7/RB7 AN8/RB8 AN9/RB9 AN10/RB10 AN11/RB11 AN12/RB12 AN13/RB13 AN14/RB14 AN15/OCFB/CN12/RB15 16 X RAGU X WAGU Y AGU PCU PCH PCL Program Counter Loop Stack Control Control Logic Logic Data Latch X Data RAM (4 Kbytes) Address Latch 16 16 Program Memory (144 Kbytes) 16 16 Effective Address 16 Data Latch ROM Latch 16 24 PORTB T2CK/RC1 T3CK/RC2 T4CK/RC3 T5CK/RC4 EMUD1/SOSCI/CN1/RC13 EMUC1/SOSCO/T1CK/CN0/RC14 OSC2/CLKO/RC15 IR 16 16 16 x 16 W Reg Array Decode Instruction Decode & Control Control Signals to Various Blocks DSP Engine Power-up Timer Divide Unit ALU<16> POR/BOR Reset MCLR VDD, VSS AVDD, AVSS CAN1, CAN2 EMUC2/OC1/RD0 EMUD2/OC2/RD1 OC3/RD2 OC4/RD3 OC5/CN13/RD4 OC6/CN14/RD5 OC7/CN15/RD6 OC8/CN16/RD7 IC1/RD8 IC2/RD9 IC3/RD10 IC4/RD11 IC5/RD12 IC6/CN19/RD13 IC7/CN20/RD14 IC8/CN21/RD15 Oscillator Start-up Timer Timing Generation OSC1/CLKI PORTC 16 16 12-bit ADC Timers 16 Watchdog Timer Low Voltage Detect 16 PORTD Input Capture Module DCI Output Compare Module I2C SPI1, SPI2 UART1, UART2 C1RX/RF0 C1TX/RF1 U1RX/RF2 U1TX/RF3 U2RX/CN17/RF4 U2TX/CN18/RF5 EMUC3/SCK1/INT0/RF6 SDI1/RF7 EMUD3/SDO1/RF8 PORTF C2RX/RG0 C2TX/RG1 SCL/RG2 SDA/RG3 SCK2/CN8/RG6 SDI2/CN9/RG7 SDO2/CN10/RG8 SS2/CN11/RG9 CSDI/RG12 CSDO/RG13 CSCK/RG14 COFS/RG15 PORTG DS70083C-page 14 Advance Information 2003 Microchip Technology Inc. dsPIC30F Table 1-1 provides a brief description of device I/O pinouts and the functions that may be multiplexed to a port pin. Multiple functions may exist on one port pin. When multiplexing occurs, the peripheral module's functional requirements may force an override of the data direction of the port pin. TABLE 1-1: PINOUT I/O DESCRIPTIONS Pin Type Buffer Type AN0-AN15 I Analog AVDD P P AVSS P P CLKI I ST/CMOS CLKO O -- CN0-CN23 I ST Input change notification inputs. Can be software programmed for internal weak pull-ups on all inputs. COFS CSCK CSDI CSDO I/O I/O I O ST ST ST -- Data Converter Interface frame synchronization pin. Data Converter Interface serial clock input/output pin. Data Converter Interface serial data input pin. Data Converter Interface serial data output pin. C1RX C1TX C2RX C2TX I O I O ST -- ST -- CAN1 bus receive pin. CAN1 bus transmit pin. CAN2 bus receive pin. CAN2 bus transmit pin EMUD EMUC EMUD1 I/O I/O I/O ST ST ST EMUC1 EMUD2 EMUC2 EMUD3 I/O I/O I/O I/O ST ST ST ST ST ICD Primary Communication Channel data input/output pin. ICD Primary Communication Channel clock input/output pin. ICD Secondary Communication Channel data input/output pin. ICD Secondary Communication Channel clock input/output pin. ICD Tertiary Communication Channel data input/output pin. ICD Tertiary Communication Channel clock input/output pin. ICD Quaternary Communication Channel data input/output pin. ICD Quaternary Communication Channel clock input/output pin. Pin Name Description Analog input channels. AN0 and AN1 are also used for device programming data and clock inputs, respectively. Positive supply for analog module. Ground reference for analog module. External clock source input. Always associated with OSC1 pin function. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function. EMUC3 I/O IC1-IC8 I ST Capture inputs 1 through 8. INT0 INT1 INT2 INT3 INT4 I I I I I ST ST ST ST ST External interrupt 0. External interrupt 1. External interrupt 2. External interrupt 3. External interrupt 4. LVDIN I Analog MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active low Reset to the device. OCFA OCFB OC1-OC8 I I O ST ST -- Compare Fault A input (for Compare channels 1, 2, 3 and 4). Compare Fault B input (for Compare channels 5, 6, 7 and 8). Compare outputs 1 through 8. Legend: Low Voltage Detect Reference Voltage input pin. CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input 2003 Microchip Technology Inc. Analog = Analog input O = Output P = Power Advance Information DS70083C-page 15 dsPIC30F TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Type Buffer Type OSC1 I ST/CMOS OSC2 I/O -- Oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. PGD PGC I/O I ST ST In-Circuit Serial Programming data input/output pin. In-Circuit Serial Programming clock input pin. RA6-RA7 RA9-RA10 RA12-RA15 I/O I/O I/O ST ST ST PORTA is a bidirectional I/O port. Pin Name Description RB0-RB15 I/O ST PORTB is a bidirectional I/O port. RC1-RC4 RC13-RC15 I/O I/O ST ST PORTC is a bidirectional I/O port. RD0-RD15 I/O ST PORTD is a bidirectional I/O port. RF0-RF8 I/O ST PORTF is a bidirectional I/O port. RG0-RG3 RG6-RG9 RG12-RG15 I/O I/O I/O ST ST ST PORTG is a bidirectional I/O port. SCK1 SDI1 SDO1 SS1 SCK2 SDI2 SDO2 SS2 I/O I O I I/O I O I ST ST -- ST ST ST -- ST Synchronous serial clock input/output for SPI1. SPI1 Data In. SPI1 Data Out. SPI1 Slave Synchronization. Synchronous serial clock input/output for SPI2. SPI2 Data In. SPI2 Data Out. SPI2 Slave Synchronization. SCL SDA I/O I/O ST ST Synchronous serial clock input/output for I2C. Synchronous serial data input/output for I2C. SOSCO SOSCI O I -- ST/CMOS T1CK T2CK T3CK T4CK T5CK I I I I I ST ST ST ST ST Timer1 external clock input. Timer2 external clock input. Timer3 external clock input. Timer4 external clock input. Timer5 external clock input. U1RX U1TX U1ARX U1ATX U2RX U2TX I O I O I O ST -- ST -- ST -- UART1 Receive. UART1 Transmit. UART1 Alternate Receive. UART1 Alternate Transmit. UART2 Receive. UART2 Transmit. VDD P -- Positive supply for logic and I/O pins. VSS P -- Ground reference for logic and I/O pins. VREF+ I Analog Analog Voltage Reference (High) input. I Analog Analog Voltage Reference (Low) input. VREF- Legend: 32 kHz low power oscillator crystal output. 32 kHz low power oscillator crystal input. ST buffer when configured in RC mode; CMOS otherwise. CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input DS70083C-page 16 Analog = Analog input O = Output P = Power Advance Information 2003 Microchip Technology Inc. dsPIC30F 2.0 CPU ARCHITECTURE OVERVIEW 2.1 Core Overview The X AGU also supports bit-reversed addressing on destination effective addresses to greatly simplify input or output data reordering for radix-2 FFT algorithms. Refer to Section 4.0 for details on modulo and bit-reversed addressing. The core has a 24-bit instruction word. The Program Counter (PC) is 23-bits wide with the Least Significant (LS) bit always clear (refer to Section 3.1), and the Most Significant (MS) bit is ignored during normal program execution, except for certain specialized instructions. Thus, the PC can address up to 4M instruction words of user program space. An instruction pre-fetch mechanism is used to help maintain throughput. Program loop constructs, free from loop count management overhead, are supported using the DO and REPEAT instructions, both of which are interruptible at any point. The core supports Inherent (no operand), Relative, Literal, Memory Direct, Register Direct, Register Indirect, Register Offset and Literal Offset Addressing modes. Instructions are associated with predefined Addressing modes, depending upon their functional requirements. The working register array consists of 16 x 16-bit registers, each of which can act as data, address or offset registers. One working register (W15) operates as a software stack pointer for interrupts and calls. A DSP engine has been included to significantly enhance the core arithmetic capability and throughput. It features a high speed 17-bit by 17-bit multiplier, a 40-bit ALU, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shifter. Data in the accumulator or any working register can be shifted up to 15 bits right, or 16 bits left in a single cycle. The DSP instructions operate seamlessly with all other instructions and have been designed for optimal real-time performance. The MAC class of instructions can concurrently fetch two data operands from memory while multiplying two W registers. To enable this concurrent fetching of data operands, the data space has been split for these instructions and linear for all others. This has been achieved in a transparent and flexible manner, by dedicating certain working registers to each address space for the MAC class of instructions. The data space is 64 Kbytes (32K words) and is split into two blocks, referred to as X and Y data memory. Each block has its own independent Address Generation Unit (AGU). Most instructions operate solely through the X memory, AGU, which provides the appearance of a single unified data space. The Multiply-Accumulate (MAC) class of dual source DSP instructions operate through both the X and Y AGUs, splitting the data address space into two parts (see Section 3.2). The X and Y data space boundary is device specific and cannot be altered by the user. Each data word consists of 2 bytes, and most instructions can address data either as words or bytes. There are two methods of accessing data stored in program memory: * The upper 32 Kbytes of data space memory can be mapped into the lower half (user space) of program space at any 16K program word boundary, defined by the 8-bit Program Space Visibility Page (PSVPAG) register. This lets any instruction access program space as if it were data space, with a limitation that the access requires an additional cycle. Moreover, only the lower 16 bits of each instruction word can be accessed using this method. * Linear indirect access of 32K word pages within program space is also possible using any working register, via table read and write instructions. Table read and write instructions can be used to access all 24 bits of an instruction word. For most instructions, the core is capable of executing a data (or program data) memory read, a working register (data) read, a data memory write and a program (instruction) memory read per instruction cycle. As a result, 3-operand instructions are supported, allowing C = A+B operations to be executed in a single cycle. The core does not support a multi-stage instruction pipeline. However, a single stage instruction pre-fetch mechanism is used, which accesses and partially decodes instructions a cycle ahead of execution, in order to maximize available execution time. Most instructions execute in a single cycle with certain exceptions, as outlined in Section 2.3. The core features a vectored exception processing structure for traps and interrupts, with 62 independent vectors. The exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. Each interrupt is prioritized based on a user assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest), in conjunction with a predetermined `natural order'. Traps have fixed priorities ranging from 8 to 15. Overhead-free circular buffers (modulo addressing) are supported in both X and Y address spaces. This is primarily intended to remove the loop overhead for DSP algorithms. 2003 Microchip Technology Inc. Advance Information DS70083C-page 17 dsPIC30F 2.2 Programmer's Model 2.2.2 The programmer's model is shown in Figure 2-1 and consists of 16 x 16-bit working registers (W0 through W15), 2 x 40-bit accumulators (AccA and AccB), STATUS register (SR), Data Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and REPEAT registers (DOSTART, DOEND, DCOUNT and RCOUNT) and Program Counter (PC). The working registers can act as data, address or offset registers. All registers are memory mapped. W0 acts as the W register for file register addressing. Some of these registers have a shadow register associated with each of them, as shown in Figure 2-1. The shadow register is used as a temporary holding register and can transfer its contents to or from its host register upon the occurrence of an event. None of the shadow registers are accessible directly. The following rules apply for transfer of registers into and out of shadows. * PUSH.S and POP.S W0, W1, W2, W3, SR (DC, N, OV, Z and C bits only) are transferred. * DO instruction DOSTART, DOEND, DCOUNT shadows are pushed on loop start, and popped on loop end. When a byte operation is performed on a working register, only the Least Significant Byte of the target register is affected. However, a benefit of memory mapped working registers is that both the Least and Most Significant Bytes can be manipulated through byte wide data memory space accesses. 2.2.1 SOFTWARE STACK POINTER/ FRAME POINTER The dsPIC(R) devices contain a software stack. W15 is the dedicated software Stack Pointer (SP), and will be automatically modified by exception processing and subroutine calls and returns. However, W15 can be referenced by any instruction in the same manner as all other W registers. This simplifies the reading, writing and manipulation of the stack pointer (e.g., creating stack frames). Note: In order to protect against misaligned stack accesses, W15<0> is always clear. W15 is initialized to 0x0800 during a Reset. The user may reprogram the SP during initialization to any location within data space. W14 has been dedicated as a stack frame pointer as defined by the LNK and ULNK instructions. However, W14 can be referenced by any instruction in the same manner as all other W registers. DS70083C-page 18 STATUS REGISTER The dsPIC core has a 16-bit STATUS register (SR), the LS Byte of which is referred to as the SR Low byte (SRL) and the MS Byte as the SR High byte (SRH). See Figure 2-1 for SR layout. SRL contains all the MCU ALU operation status flags (including the Z bit), as well as the CPU Interrupt Priority Level status bits, IPL<2:0> and the Repeat Active status bit, RA. During exception processing, SRL is concatenated with the MS Byte of the PC to form a complete word value which is then stacked. The upper byte of the STATUS register contains the DSP Adder/Subtracter status bits, the DO Loop Active bit (DA) and the Digit Carry (DC) status bit. Most SR bits are read/write. Exceptions are: 1. 2. 3. 4. The DA bit: DA is read and clear only because accidentally setting it could cause erroneous operation. The RA bit: RA is a read only bit because accidentally setting it could cause erroneous operation. RA is only set on entry into a REPEAT loop, and cannot be directly cleared by software. The OV, OA, OB and OAB bits: These bits are read only and can only be set by the DSP engine overflow logic. The SA, SB and SAB bits: These are read and clear only and can only be set by the DSP engine saturation logic. Once set, these flags remain set until cleared by the user, irrespective of the results from any subsequent DSP operations. Note 1: Clearing the SAB bit will also clear both the SA and SB bits. 2: When the memory mapped STATUS register (SR) is the destination address for an operation which affects any of the SR bits, data writes are disabled to all bits. 2.2.2.1 Z Status Bit Instructions that use a carry/borrow input (ADDC, CPB, SUBB and SUBBR) will only be able to clear Z (for a non-zero result) and can never set it. A multiprecision sequence of instructions, starting with an instruction with no carry/borrow input, will thus automatically logically AND the successive results of the zero test. All results must be zero for the Z flag to remain set by the end of the sequence. All other instructions can set as well as clear the Z bit. 2.2.3 PROGRAM COUNTER The program counter is 23-bits wide; bit 0 is always clear. Therefore, the PC can address up to 4M instruction words. Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 2-1: PROGRAMMER'S MODEL D15 D0 W0/WREG PUSH.S Shadow W1 DO Shadow W2 W3 Legend W4 DSP Operand Registers W5 W6 W7 Working Registers W8 W9 DSP Address Registers W10 W11 W12/DSP Offset W13/DSP Write Back W14/Frame Pointer W15/Stack Pointer Stack Pointer Limit Register SPLIM AD39 AD15 AD31 AD0 AccA DSP Accumulators AccB PC22 PC0 Program Counter 0 0 7 TABPAG TBLPAG 7 Data Table Page Address 0 PSVPAG Program Space Visibility Page Address 15 0 RCOUNT REPEAT Loop Counter 15 0 DCOUNT DO Loop Counter 22 0 DOSTART DO Loop Start Address DOEND DO Loop End Address 22 15 0 Core Configuration Register CORCON OA OB SA SB OAB SAB DA SRH 2003 Microchip Technology Inc. DC IPL2 IPL1 IPL0 RA N OV Z C Status Register SRL Advance Information DS70083C-page 19 dsPIC30F 2.3 Instruction Flow There are 8 types of instruction flows: 1. Normal one-word, one-cycle instructions: these instructions take one effective cycle to execute as shown in Figure 2-2. FIGURE 2-2: INSTRUCTION PIPELINE FLOW: 1-WORD, 1-CYCLE TCY0 1. MOV.b #0x55,W0 Fetch 1 TCY1 TCY4 TCY5 TCY4 TCY5 Execute 2 Fetch 3 3. ADD.b W0,W1,W2 2. TCY3 Execute 1 Fetch 2 2. MOV.b #0x35,W1 TCY2 Execute 3 One-word, two-cycle (or three-cycle) instructions that are flow control instructions: these instructions include the relative branches, relative call, skips and returns. When an instruction changes the PC (other than to increment it), the pipelined fetch is discarded. This causes the instruction to take two effective cycles to execute as shown in Figure 2-3. Some instructions that change program flow require 3 cycles, such as the RETURN, RETFIE and RETLW instructions, and instructions that skip over 2-word instructions. FIGURE 2-3: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE TCY0 1. MOV #0x55,W0 Fetch 1 2. BTSC W1,#3 3. ADD W0,W1,W2 4. BRA SUB_1 5. SUB W0,W1,W3 TCY1 TCY2 TCY3 Execute 1 Fetch 2 Execute 2 Skip Taken Fetch 3 Flush Fetch 4 Fetch 5 Flush Fetch SUB_1 6. Instruction @ address SUB_1 DS70083C-page 20 Execute 4 Advance Information 2003 Microchip Technology Inc. dsPIC30F 3. One-word, two-cycle instructions that are not flow control instructions: the only instructions of this type are the MOV.D (load and store doubleword) instructions, as shown in Figure 2-4. FIGURE 2-4: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE MOV.D OPERATIONS TCY0 1. MOV Fetch 1 W0,0x1234 TCY2 4. Fetch 3 W1,0x00AA TCY5 Execute 2 R/W Cycle2 Stall Execute 3 Fetch 4 0x0CC, W0 Execute 4 Table read/write instructions: these instructions will suspend the fetching to insert a read or write cycle to the program memory. The instruction fetched while executing the table operation is saved for 1 cycle and executed in the cycle immediately after the table operation as shown in Figure 2-5. FIGURE 2-5: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE TABLE OPERATIONS TCY0 Fetch 1 1. MOV #0x1234,W0 TCY1 TCY2 TCY4 TCY5 Execute 2 Fetch 3 3. MOV #0x00AA,W1 Execute 2 Read Cycle Bus Read 3a. Table Operation 4. MOV TCY3 Execute 1 Fetch 2 2. TBLRDL [W0++],W1 5. TCY4 Execute 2 R/W Cycle 1 3a. Stall 4. MOV TCY3 Execute 1 Fetch 2 2. MOV.D [W0++],W1 3. MOV TCY1 Execute 3 Fetch 4 #0x0CC,W0 Execute 4 Two-word instructions for CALL and GOTO: in these instructions, the fetch after the instruction provides the remainder of the jump or call destination address. These instructions require 2 cycles to execute, 1 cycle to fetch the 2 instruction words (enabled by a high speed path on the second fetch), and 1 cycle to flush the pipeline as shown in Figure 2-6. FIGURE 2-6: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE GOTO, CALL TCY0 1. MOV #0x1234,W0 Fetch 1 2. GOTO LABEL 2a. Second Word 3. Instruction @ address LABEL 4. BSET TCY1 TCY2 TCY3 Fetch 2L TCY5 Update PC Fetch 2H NOP Fetch LABEL Execute LABEL Fetch 4 W1, #BIT3 2003 Microchip Technology Inc. TCY4 Execute 1 Advance Information Execute 4 DS70083C-page 21 dsPIC30F 6. Two-word instructions for DO: in these instructions, the fetch after the instruction contains an address offset. This address offset is added to the first instruction address to generate the last loop instruction address. Therefore, these instructions require 2 cycles as shown in Figure 2-7. FIGURE 2-7: INSTRUCTION PIPELINE FLOW: 2-WORD, 2-CYCLE DO, DOW TCY0 Fetch 1 1. PUSH DOEND TCY1 Execute 2 Fetch 3 3. 1st Instruction of Loop Execute 3 Instructions that are subjected to a stall due to a data dependency between the X RAGU and X WAGU: an additional cycle is inserted to resolve the resource conflict as shown in Figure 2-7. Instruction stalls caused by data dependencies are further discussed in Section 4.0. FIGURE 2-8: INSTRUCTION PIPELINE FLOW: 1-WORD, 2-CYCLE WITH INSTRUCTION STALL TCY0 1. MOV.b W0,[W1] Fetch 1 2. MOV.b [W1],PORTB TCY1 Fetch 2 DS70083C-page 22 TCY3 TCY4 TCY5 NOP Stall Execute 2 Fetch 3 3. MOV.b W0,PORTB Interrupt recognition execution: Section 6.0 for details on interrupts. TCY2 Execute 1 2a. Stall (NOP) 8. TCY4 NOP Fetch 2H 2a. Second Word 7. TCY3 Execute 1 Fetch 2L 2. DO LABEL,#COUNT TCY2 refer Execute 3 to Advance Information 2003 Microchip Technology Inc. dsPIC30F 2.4 Divide Support The dsPIC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The following instructions and data sizes are supported: 1. 2. 3. 4. 5. DIVF - 16/16 signed fractional divide DIV.sd - 32/16 signed divide DIV.ud - 32/16 unsigned divide DIV.sw - 16/16 signed divide DIV.uw - 16/16 unsigned divide The 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. The quotient for all divide instructions is stored in W0, and the remainder in W1. DIV and DIVF can specify any W register for both the 16-bit dividend and divisor. All other divides can specify any W register for the 16-bit divisor, but the 32-bit dividend must be in an aligned W register pair, such as W1:W0, W3:W2, etc. TABLE 2-1: The non-restoring divide algorithm requires one cycle for an initial dividend shift (for integer divides only), one cycle per divisor bit, and a remainder/quotient correction cycle. The correction cycle is the last cycle of the iteration loop but must be performed (even if the remainder is not required) because it may also adjust the quotient. A consequence of this is that DIVF will also produce a valid remainder (though it is of little use in fractional arithmetic). The divide instructions must be executed within a REPEAT loop. Any other form of execution (e.g., a series of discrete divide instructions) will not function correctly because the instruction flow depends on RCOUNT. The divide instruction does not automatically set up the RCOUNT value and it must, therefore, be explicitly and correctly specified in the REPEAT instruction as shown in Table 2-1 (REPEAT will execute the target instruction {operand value+1} times). The REPEAT loop count must be setup for 18 iterations of the DIV/ DIVF instruction. Thus, a complete divide operation requires 19 cycles. Note: The divide flow is interruptible. However, the user needs to save the context as appropriate. DIVIDE INSTRUCTIONS Instruction Function DIVF Signed fractional divide: Wm/Wn W0; Rem W1 DIV.sd Signed divide: (Wm+1:Wm)/Wn W0; Rem W1 DIV.sw or DIV.s Signed divide: Wm/Wn W0; Rem W1 DIV.ud Unsigned divide: (Wm+1:Wm)/Wn W0; Rem W1 DIV.uw or DIV.u Unsigned divide: Wm/Wn W0; Rem W1 2003 Microchip Technology Inc. Advance Information DS70083C-page 23 dsPIC30F 2.5 DSP Engine Concurrent operation of the DSP engine with MCU instruction flow is not possible, though both the MCU ALU and DSP engine resources may be used concurrently by the same instruction (e.g., ED and EDAC instructions). The DSP engine consists of a high speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). Data input to the DSP engine is derived from one of the following: 1. 2. 3. Directly from the W array (registers W4, W5, W6 or W7) via the X and Y data buses for the MAC class of instructions (MAC, MSC, MPY, MPY.N, ED, EDAC, CLR and MOVSAC). From the X bus for all other DSP instructions. From the X bus for all MCU instructions which use the barrel shifter. Data output from the DSP engine is written to one of the following: 1. 2. 3. The DSP engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. These instructions are ADD, SUB and NEG. The DSP engine has various options selected through various bits in the CPU Core Configuration register (CORCON), as listed below: 1. 2. 3. 4. 5. 6. 7. Fractional or integer DSP multiply (IF). Signed or unsigned DSP multiply (US). Conventional or convergent rounding (RND). Automatic saturation on/off for AccA (SATA). Automatic saturation on/off for AccB (SATB). Automatic saturation on/off for writes to data memory (SATDW). Accumulator Saturation mode selection (ACCSAT). Note: For CORCON layout, see Table 4-3. A block diagram of the DSP engine is shown in Figure 2-9. The target accumulator, as defined by the DSP instruction being executed. The X bus for MAC, MSC, CLR and MOVSAC accumulator writes, where the EA is derived from W13 only. (MPY, MPY.N, ED and EDAC do not offer an accumulator write option.) The X bus for all MCU instructions which use the barrel shifter. DS70083C-page 24 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 2-9: DSP ENGINE BLOCK DIAGRAM 40 S a 40 Round t 16 u Logic r a t e 40-bit Accumulator A 40-bit Accumulator B Carry/Borrow Out Carry/Borrow In Saturate Adder Negate 40 40 40 Barrel Shifter X Data Bus 16 40 Y Data Bus Sign-Extend 32 16 Zero Backfill 32 33 17-bit Multiplier/Scaler 16 16 To/From W Array 2003 Microchip Technology Inc. Advance Information DS70083C-page 25 dsPIC30F 2.5.1 MULTIPLIER When the multiplier is configured for fractional multiplication, the data is represented as a two's complement fraction, where the MSB is defined as a sign bit and the radix point is implied to lie just after the sign bit (QX format). The range of an N-bit two's complement fraction with this implied radix point is -1.0 to (1 - 21-N). For a 16-bit fraction, the Q15 data range is -1.0 (0x8000) to 0.999969482 (0x7FFF) including `0' and has a precision of 3.01518x10-5. In Fractional mode, the 16x16 multiply operation generates a 1.31 product which has a precision of 4.65661 x 10-10. The 17 x 17-bit multiplier is capable of signed or unsigned operation and can multiplex its output using a scaler to support either 1.31 fractional (Q31) or 32-bit integer results. The respective number representation formats are shown in caOieE OJNM. Unsigned operands are zero-extended into the 17th bit of the multiplier input value. Signed operands are sign-extended into the 17th bit of the multiplier input value. The output of the 17 x 17-bit multiplier/scaler is a 33-bit value which is sign-extended to 40 bits. Integer data is inherently represented as a signed two's complement value, where the MSB is defined as a sign bit. Generally speaking, the range of an N-bit two's complement integer is -2N-1 to 2N-1 - 1. For a 16-bit integer, the data range is -32768 (0x8000) to 32767 (0x7FFF) including `0' (see Figure 2-10). For a 32-bit integer, the data range is -2,147,483,648 (0x8000 0000) to 2,147,483,645 (0x7FFF FFFF). FIGURE 2-10: 16-BIT INTEGER AND FRACTIONAL MODES Different Representations of 0x4001 Integer: 0 1 0 0 14 13 2 2 2 0 2 12 0 0 11 2 0 0 0 0 0 0 0 0 0 1 20 .... 0x4001 = 214 + 20 = 16385 1.15 Fractional: 0 . -20 1 0 -1 -2 2 2 0 -3 2 0 0 0 0 0 0 0 0 0 0 0 1 2-15 ... 0x4001 = 2-1 + 2-15 = 0.500030518 Certain multiply operations always operate on signed data. These include the MAC/MSC, MPY[.N] and ED[AC] instructions. The 40-bit adder/subtracter may also optionally negate one of its operand inputs to change the result sign (without changing the operands). This is used to create a multiply and subtract (MSC), or multiply and negate (MPY.N) operation. In the special case when both input operands are 1.15 fractions and equal to 0x8000 (-110), the result of the multiplication is corrected to 0x7FFFFFFF (as the closest approximation to +1) by hardware before it is used. It should be noted that with the exception of DSP multiplies, the dsPIC30F ALU operates identically on integer and fractional data. Namely, an addition of two integers will yield the same result (binary number) as the addition of two fractional numbers. The only difference is how the result is interpreted by the user. However, multiplies performed by DSP operations are DS70083C-page 26 different. In these instructions, data format selection is made with the IF bit (CORCON<0>) and US bits (CORCON<12>), and it must be set accordingly (`0' for Fractional mode, `1' for Integer mode in the case of the IF bit, and `0' for Signed mode, `1' for Unsigned mode in the case of the US bit). This is required because of the implied radix point used by dsPIC30F fractions. In Integer mode, multiplying two 16-bit integers produces a 32-bit integer result. However, multiplying two 1.15 values generates a 2.30 result. Since the dsPIC30F uses 1.31 format for the accumulators, a DSP multiply in Fractional mode also includes a left shift by one bit to keep the radix point properly aligned. This feature reduces the resolution of the DSP multiplier to 2-30, but has no other effect on the computation. Advance Information 2003 Microchip Technology Inc. dsPIC30F The same multiplier is used to support the MCU multiply instructions which include integer 16-bit signed, unsigned and mixed sign multiplies. Additional data paths are provided to allow these instructions to write the result back into the W array and X data bus (via the W array). These paths are placed prior to the data scaler. The IF bit in the CORCON register, therefore, only affects the result of the MAC class of DSP instructions. All other multiply operations are assumed to be integer operations. If the user executes a MAC instruction on fractional data without clearing the IF bit, the result must be explicitly shifted left by the user program after multiplication in order to obtain the correct result. The MUL instruction may be directed to use byte or word sized operands. Byte operands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the W array. 2.5.2 DATA ACCUMULATORS AND ADDER/SUBTRACTER The data accumulator consists of a 40-bit adder/ subtracter with automatic sign extension logic. It can select one of two accumulators (A or B) as its preaccumulation source and post-accumulation destination. For the ADD and LAC instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. 2.5.2.1 Adder/Subtracter, Overflow and Saturation The adder/subtracter is a 40-bit adder with an optional zero input into one side and either true, or complement data into the other input. In the case of addition, the carry/borrow input is active high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active low and the other input is complemented. The adder/subtracter generates overflow status bits SA/SB and OA/OB, which are latched and reflected in the STATUS register: * Overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. * Overflow into guard bits 32 through 39: this is a recoverable overflow. This bit is set whenever all the guard bits bits are not identical to each other. The adder has an additional saturation block which controls accumulator data saturation, if selected. It uses the result of the adder, the overflow status bits described above, and the SATA/B (CORCON<7:6>) and ACCSAT (CORCON<4>) mode control bits to determine when and to what value to saturate. 2003 Microchip Technology Inc. Six STATUS register bits have been provided to support saturation and overflow; they are: 1. 2. 3. 4. 5. 6. OA: AccA overflowed into guard bits OB: AccB overflowed into guard bits SA: AccA saturated (bit 31 overflow and saturation) or AccA overflowed into guard bits and saturated (bit 39 overflow and saturation) SB: AccB saturated (bit 31 overflow and saturation) or AccB overflowed into guard bits and saturated (bit 39 overflow and saturation) OAB: Logical OR of OA and OB SAB: Logical OR of SA and SB The OA and OB bits are modified each time data passes through the adder/subtracter. When set, they indicate that the most recent operation has overflowed into the accumulator guard bits (bits 32 through 39). The OA and OB bits can also optionally generate an arithmetic warning trap when set and the corresponding overflow trap flag enable bit (OVATEN, OVBTEN) in the INTCON1 register (refer to Section 5.0) is set. This allows the user to take immediate action, for example, to correct system gain. The SA and SB bits are modified each time data passes through the adder/subtracter but can only be cleared by the user. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if saturation is enabled). When saturation is not enabled, SA and SB default to bit 39 overflow and thus indicate that a catastrophic overflow has occurred. If the COVTE bit in the INTCON1 register is set, SA and SB bits will generate an arithmetic warning trap when saturation is disabled. The overflow and saturation status bits can optionally be viewed in the STATUS register (SR) as the logical OR of OA and OB (in bit OAB) and the logical OR of SA and SB (in bit SAB). This allows programmers to check one bit in the STATUS register to determine if either accumulator has overflowed, or one bit to determine if either accumulator has saturated. This would be useful for complex number arithmetic which typically uses both the accumulators. Advance Information DS70083C-page 27 dsPIC30F The device supports three saturation and overflow modes: 1. 2. 3. Bit 39 Overflow and Saturation: When bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7FFFFFFFFF), or maximally negative 9.31 value (0x8000000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. This is referred to as `super saturation' and provides protection against erroneous data, or unexpected algorithm problems (e.g., gain calculations). Bit 31 Overflow and Saturation: When bit 31 overflow and saturation occurs, the saturation logic then loads the maximally positive 1.31 value (0x007FFFFFFF), or maximally negative 1.31 value (0x0080000000) into the target accumulator. The SA or SB bit is set and remains set until cleared by the user. When this Saturation mode is in effect, the guard bits are not used (so the OA, OB or OAB bits are never set). Bit 39 Catastrophic Overflow: The bit 39 overflow status bit from the adder is used to set the SA or SB bit which remain set until cleared by the user. No saturation operation is performed and the accumulator is allowed to overflow (destroying its sign). If the COVTE bit in the INTCON1 register is set, a catastrophic overflow can initiate a trap exception. 2.5.2.2 Accumulator `Write Back' The MAC class of instructions (with the exception of MPY, MPY.N, ED and EDAC) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. The write is performed across the X bus into combined X and Y address space. The following Addressing modes are supported: 1. 2. 2.5.2.3 Round Logic The round logic is a combinational block which performs a conventional (biased) or convergent (unbiased) round function during an accumulator write (store). The Round mode is determined by the state of the RND bit in the CORCON register. It generates a 16bit, 1.15 data value which is passed to the data space write saturation logic. If rounding is not indicated by the instruction, a truncated 1.15 data value is stored and the LS Word is simply discarded. The two Rounding modes are shown in Figure 2-10. Conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the ACCxH word (bits 16 through 31 of the accumulator). If the ACCxL word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xFFFF (0x8000 included), ACCxH is incremented. If ACCxL is between 0x0000 and 0x7FFF, ACCxH is left unchanged. A consequence of this algorithm is that over a succession of random rounding operations, the value will tend to be biased slightly positive. Convergent (or unbiased) rounding operates in the same manner as conventional rounding, except when ACCxL equals 0x8000. If this is the case, the LS bit (bit 16 of the accumulator) of ACCxH is examined. If it is `1', ACCxH is incremented. If it is `0', ACCxH is not modified. Assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. The SAC and SAC.R instructions store either a truncated (SAC) or rounded (SAC.R) version of the contents of the target accumulator to data memory via the X bus (subject to data saturation, see Section 2.5.2.4). Note that for the MAC class of instructions, the accumulator write back operation will function in the same manner, addressing combined MCU (X and Y) data space though the X bus. For this class of instructions, the data is always subject to rounding. W13, Register Direct: The rounded contents of the non-target accumulator are written into W13 as a 1.15 fraction. [W13]+=2, Register Indirect with Post-Increment: The rounded contents of the non-target accumulator are written into the address pointed to by W13 as a 1.15 fraction. W13 is then incremented by 2 (for a word write). DS70083C-page 28 Advance Information 2003 Microchip Technology Inc. dsPIC30F 2.5.2.4 Data Space Write Saturation 2.5.3 BARREL SHIFTER In addition to adder/subtracter saturation, writes to data space may also be saturated but without affecting the contents of the source accumulator. The data space write saturation logic block accepts a 16-bit, 1.15 fractional value from the round logic block as its input, together with overflow status from the original source (accumulator) and the 16-bit round adder. These are combined and used to select the appropriate 1.15 fractional value as output to write to data space memory. The barrel shifter is capable of performing up to 15-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. The source can be either of the two DSP accumulators, or the X bus (to support multi-bit shifts of register or memory data). If the SATDW bit in the CORCON register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly, For input data greater than 0x007FFF, data written to memory is forced to the maximum positive 1.15 value, 0x7FFF. For input data less than 0xFF8000, data written to memory is forced to the maximum negative 1.15 value, 0x8000. The MS bit of the source (bit 39) is used to determine the sign of the operand being tested. The barrel shifter is 40-bits wide, thereby obtaining a 40-bit result for DSP shift operations and a 16-bit result for MCU shift operations. Data from the X bus is presented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positions 0 to 15 for left shifts. The shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. A positive value will shift the operand right. A negative value will shift the operand left. A value of `0' will not modify the operand. If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. 2003 Microchip Technology Inc. Advance Information DS70083C-page 29 dsPIC30F NOTES: DS70083C-page 30 Advance Information 2003 Microchip Technology Inc. dsPIC30F 3.0 MEMORY ORGANIZATION 3.1 Program Address Space User program space access is restricted to the lower 4M instruction word address range (0x000000 to 0x7FFFFE) for all accesses other than TBLRD/TBLWT, which use TBLPAG<7> to determine user or configuration space access. In Table 3-1, Program Space Address Construction, bit 23 allows access to the Device ID, the User ID and the configuration bits. Otherwise, bit 23 is always clear. The program address space is 4M instruction words. It is addressable by a 24-bit value from either the 23-bit PC, table instruction EA, or data space EA, when program space is mapped into data space as defined by Table 3-1. Note that the program space address is incremented by two between successive program words in order to provide compatibility with data space addressing. TABLE 3-1: Note: The address map shown in Figure 3-5 is conceptual, and the actual memory configuration may vary across individual devices depending on available memory. PROGRAM SPACE ADDRESS CONSTRUCTION Program Space Address Access Space Access Type <23> <22:16> <15> <14:1> Instruction Access User TBLRD/TBLWT User (TBLPAG<7> = 0) TBLPAG<7:0> Data EA<15:0> TBLRD/TBLWT Configuration (TBLPAG<7> = 1) TBLPAG<7:0> Data EA<15:0> Program Space Visibility User FIGURE 3-1: <0> PC<22:1> 0 0 PSVPAG<7:0> 0 Data EA<14:0> DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION 23 bits Using Program Counter Program Counter 0 Select Using Program Space Visibility 0 0 1 EA PSVPAG Reg 8 bits 15 bits EA Using Table Instruction 1/0 User/ Configuration Space Select Note: TBLPAG Reg 8 bits 16 bits 24-bit EA Byte Select Program space visibility cannot be used to access bits <23:16> of a word in program memory. 2003 Microchip Technology Inc. Advance Information DS70083C-page 31 dsPIC30F 3.1.1 PROGRAM SPACE ALIGNMENT AND DATA ACCESS USING TABLE INSTRUCTIONS A set of table instructions are provided to move byte or word sized data to and from program space. 1. This architecture fetches 24-bit wide program memory. Consequently, instructions are always aligned. However, as the architecture is modified Harvard, data can also be present in program space. There are two methods by which program space can be accessed: via special table instructions, or through the remapping of a 16K word program space page into the upper half of data space (see Section 3.1.2). The TBLRDL and TBLWTL instructions offer a direct method of reading or writing the LS Word of any address within program space, without going through data space. The TBLRDH and TBLWTH instructions are the only method whereby the upper 8 bits of a program space word can be accessed as data. 2. 3. The PC is incremented by two for each successive 24-bit program word. This allows program memory addresses to directly map to data space addresses. Program memory can thus be regarded as two 16-bit word wide address spaces, residing side by side, each with the same address range. TBLRDL and TBLWTL access the space which contains the LS Data Word, and TBLRDH and TBLWTH access the space which contains the MS Data Byte. 4. TBLRDL: Table Read Low Word: Read the LS Word of the program address; P<15:0> maps to D<15:0>. Byte: Read one of the LS Bytes of the program address; P<7:0> maps to the destination byte when byte select = 0; P<15:8> maps to the destination byte when byte select = 1. TBLWTL: Table Write Low (refer to Section 6.0 for details on Flash Programming) TBLRDH: Table Read High Word: Read the MS Word of the program address; P<23:16> maps to D<7:0>; D<15:8> will always be = 0. Byte: Read one of the MS Bytes of the program address; P<23:16> maps to the destination byte when byte select = 0; The destination byte will always be = 0 when byte select = 1. TBLWTH: Table Write High (refer to Section 6.0 for details on Flash Programming) Figure 3-1 shows how the EA is created for table operations and data space accesses (PSV = 1). Here, P<23:0> refers to a program space word, whereas D<15:0> refers to a data space word. FIGURE 3-2: PROGRAM DATA TABLE ACCESS (LS WORD) PC Address 0x000000 0x000002 0x000004 0x000006 Program Memory `Phantom' Byte (read as `0') DS70083C-page 32 23 8 16 0 00000000 00000000 00000000 00000000 TBLRDL.B (Wn<0> = 0) TBLRDL.W TBLRDL.B (Wn<0> = 1) Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 3-3: PROGRAM DATA TABLE ACCESS (MS BYTE) TBLRDH.W PC Address 0x000000 0x000002 0x000004 0x000006 23 16 8 0 00000000 00000000 00000000 00000000 TBLRDH.B (Wn<0> = 0) Program Memory `Phantom' Byte (read as `0') 3.1.2 TBLRDH.B (Wn<0> = 1) PROGRAM SPACE VISIBILITY FROM DATA SPACE The upper 32 Kbytes of data space may optionally be mapped into any 16K word program space page. This provides transparent access of stored constant data from X data space without the need to use special instructions (i.e., TBLRDL/H, TBLWTL/H instructions). Program space access through the data space occurs if the MS bit of the data space EA is set and program space visibility is enabled by setting the PSV bit in the Core Control register (CORCON). The functions of CORCON are discussed in Section 2.5, DSP Engine. Data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. Note that the upper half of addressable data space is always part of the X data space. Therefore, when a DSP operation uses program space mapping to access this memory region, Y data space should typically contain state (variable) data for DSP operations, whereas X data space should typically contain coefficient (constant) data. Although each data space address, 0x8000 and higher, maps directly into a corresponding program memory address (see Figure 3-4), only the lower 16 bits of the 24-bit program word are used to contain the data. The upper 8 bits should be programmed to force an illegal instruction to maintain machine robustness. Refer to the Programmer's Reference Manual (DS70030) for details on instruction encoding. 2003 Microchip Technology Inc. Note that by incrementing the PC by 2 for each program memory word, the LS 15 bits of data space addresses directly map to the LS 15 bits in the corresponding program space addresses. The remaining bits are provided by the Program Space Visibility Page register, PSVPAG<7:0>, as shown in Figure 3-4. Note: PSV access is temporarily disabled during table reads/writes. For instructions that use PSV which are executed outside a REPEAT loop: * The following instructions will require one instruction cycle in addition to the specified execution time: - MAC class of instructions with data operand pre-fetch - MOV instructions - MOV.D instructions * All other instructions will require two instruction cycles in addition to the specified execution time of the instruction. For instructions that use PSV which are executed inside a REPEAT loop: * The following instances will require two instruction cycles in addition to the specified execution time of the instruction: - Execution in the first iteration - Execution in the last iteration - Execution prior to exiting the loop due to an interrupt - Execution upon re-entering the loop after an interrupt is serviced * Any other iteration of the REPEAT loop will allow the instruction accessing data, using PSV, to execute in a single cycle. Advance Information DS70083C-page 33 dsPIC30F FIGURE 3-4: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION Program Space Data Space 0x0000 EA<15> = 0 PSVPAG(1) 0x21 8 15 Data 16 Space 15 EA EA<15> = 1 0x8000 15 Address Concatenation 23 0x108000 23 15 0 0x108200 Upper Half of Data Space is Mapped into Program Space 0x10FFFF 0xFFFF BSET MOV MOV MOV CORCON,#2 #0x21, W0 W0, PSVPAG 0x8200, W0 ; PSV bit set ; Set PSVPAG register ; Access program memory location ; using a data space access Data Read Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines the page in program space to which the upper half of data space is being mapped). DS70083C-page 34 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 3-5: SAMPLE PROGRAM SPACE MEMORY MAP Reset - GOTO Instruction Reset - Target Address 000000 000002 000004 Vector Tables User Memory Space Interrupt Vector Table Reserved Alternate Vector Table User Flash Program Memory (48K instructions) Reserved (Read `0's) Data EEPROM (4 Kbytes) 00007E 000080 000084 0000FE 000100 017FFE 018000 7FEFFE 7FF000 Configuration Memory Space Reserved 8005BE 8005C0 8005FE 800600 Reserved Device Configuration Registers F7FFFE F80000 F8000E F80010 Reserved DEVID (2) Note: Data Address Space The core has two data spaces. The data spaces can be considered either separate (for some DSP instructions), or as one unified linear address range (for MCU instructions). The data spaces are accessed using two Address Generation Units (AGUs) and separate data paths. 3.2.1 7FFFFE 800000 UNITID (32 instr.) 3.2 DATA SPACES The X data space is used by all instructions and supports all Addressing modes. There are separate read and write data buses. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space. It is also the X address space data path for the dual operand read instructions (MAC class). The X write data bus is the only write path to data space for all instructions. The X data space also supports modulo addressing for all instructions, subject to Addressing mode restrictions. Bit-reversed addressing is only supported for writes to X data space. The Y data space is used in concert with the X data space by the MAC class of instructions (CLR, ED, EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to provide two concurrent data read paths. No writes occur across the Y bus. This class of instructions dedicates two W register pointers, W10 and W11, to always address Y data space, independent of X data space, whereas W8 and W9 always address X data space. Note that during accumulator write back, the data address space is considered a combination of X and Y data spaces, so the write occurs across the X bus. Consequently, the write can be to any address in the entire data space. The Y data space can only be used for the data prefetch operation associated with the MAC class of instructions. It also supports modulo addressing for automated circular buffers. Of course, all other instructions can access the Y data address space through the X data path as part of the composite linear space. The boundary between the X and Y data spaces is defined as shown in Figure 3-8 and is not user programmable. Should an EA point to data outside its own assigned address space, or to a location outside physical memory, an all zero word/byte will be returned. For example, although Y address space is visible by all non-MAC instructions using any Addressing mode, an attempt by a MAC instruction to fetch data from that space using W8 or W9 (X space pointers) will return 0x0000. FEFFFE FF0000 FFFFFE These address boundaries may vary from one device to another. 2003 Microchip Technology Inc. Advance Information DS70083C-page 35 dsPIC30F TABLE 3-2: EFFECT OF INVALID MEMORY ACCESSES Attempted Operation Data Returned EA = an unimplemented address 0x0000 W8 or W9 used to access Y data space in a MAC instruction 0x0000 W10 or W11 used to access X data space in a MAC instruction 0x0000 All effective addresses are 16 bits wide and point to bytes within the data space. Therefore, the data space address range is 64 Kbytes or 32K words. 3.2.2 DATA SPACE WIDTH The core data width is 16 bits. All internal registers are organized as 16-bit wide words. Data space memory is organized in byte addressable, 16-bit wide blocks. 3.2.3 DATA ALIGNMENT To help maintain backward compatibility with PICmicro(R) devices and improve data space memory usage efficiency, the dsPIC30F instruction set supports both word and byte operations. Data is aligned in data memory and registers as words, but all data space EAs resolve to bytes. Data byte reads will read the complete word which contains the byte, using the LS bit of any EA to determine which byte to select. The selected byte is placed onto the LS Byte of the X data path (no byte accesses are possible from the Y data path as the MAC class of instruction can only fetch words). That is, data memory and registers are organized as two parallel byte wide entities with shared (word) address decode but separate write lines. Data byte writes only write to the corresponding side of the array or register which matches the byte address. As a consequence of this byte accessibility, all effective address calculations (including those generated by the DSP operations which are restricted to word sized data) are internally scaled to step through word aligned memory. For example, the core would recognize that Post-Modified Register Indirect Addressing mode [Ws++] will result in a value of Ws+1 for byte operations and Ws+2 for word operations. All word accesses must be aligned to an even address. Misaligned word data fetches are not supported so care must be taken when mixing byte and word operations, or translating from 8-bit MCU code. Should a misaligned read or write be attempted, an address error trap will be generated. If the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. In either case, a trap will then be executed, allowing the system and/or user to examine the machine state prior to execution of the address fault. DS70083C-page 36 FIGURE 3-6: 15 DATA ALIGNMENT MS Byte 87 LS Byte 0 0001 Byte1 Byte 0 0000 0003 Byte3 Byte 2 0002 0005 Byte5 Byte 4 0004 All byte loads into any W register are loaded into the LS Byte. The MSB is not modified. A sign-extend (SE) instruction is provided to allow users to translate 8-bit signed data to 16-bit signed values. Alternatively, for 16-bit unsigned data, users can clear the MSB of any W register by executing a zero-extend (ZE) instruction on the appropriate address. Although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including the DSP instructions, operate only on words. 3.2.4 DATA SPACE MEMORY MAP The data space memory is split into two blocks, X and Y data space. A key element of this architecture is that Y space is a subset of X space, and is fully contained within X space. In order to provide an apparent linear addressing space, X and Y spaces have contiguous addresses. When executing any instruction other than one of the MAC class of instructions, the X block consists of the 64Kbyte data address space (including all Y addresses). When executing one of the MAC class of instructions, the X block consists of the 64-Kbyte data address space excluding the Y address block (for data reads only). In other words, all other instructions regard the entire data memory as one composite address space. The MAC class instructions extract the Y address space from data space and address it using EAs sourced from W10 and W11. The remaining X data space is addressed using W8 and W9. Both address spaces are concurrently accessed only with the MAC class instructions. An example data space memory map is shown in Figure 3-8. Advance Information 2003 Microchip Technology Inc. dsPIC30F 3.2.5 NEAR DATA SPACE 3.2.6 An 8-Kbyte `near' data space is reserved in X address memory space between 0x0000 and 0x1FFF, which is directly addressable via a 13-bit absolute address field within all memory direct instructions. The remaining X address space and all of the Y address space is addressable indirectly. Additionally, the whole of X data space is addressable using MOV instructions, which support memory direct addressing with a 16-bit address field. The stack pointer always points to the first available free word and grows from lower addresses towards higher addresses. It pre-decrements for stack pops and post-increments for stack pushes as shown in Figure 37. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. Note: A PC push during exception processing will concatenate the SRL register to the MSB of the PC prior to the push. SOFTWARE STACK The dsPIC devices contain a software stack. W15 is used as the stack pointer. There is a Stack Pointer Limit register (SPLIM) associated with the stack pointer. SPLIM is uninitialized at Reset. As is the case for the stack pointer, SPLIM<0> is forced to `0' because all stack operations must be word aligned. Whenever an effective address (EA) is generated using W15 as a source or destination pointer, the address thus generated is compared with the value in SPLIM. If the contents of the Stack Pointer (W15) and the SPLIM register are equal and a push operation is performed, a Stack Error Trap will not occur. The Stack Error Trap will occur on a subsequent push operation. Thus, for example, if it is desirable to cause a Stack Error Trap when the stack grows beyond address 0x2000 in RAM, initialize the SPLIM with the value, 0x1FFE. Similarly, a stack pointer underflow (stack error) trap is generated when the stack pointer address is found to be less than 0x0800, thus preventing the stack from interfering with the Special Function Register (SFR) space. A write to the SPLIM register should not be immediately followed by an indirect read operation using W15. FIGURE 3-7: CALL STACK FRAME Stack Grows Towards Higher Address 0x0000 15 0 PC<15:0> W15 (before CALL) 000000000 PC<22:16> <Free Word> W15 (after CALL) POP : [--W15] PUSH : [W15++] 2003 Microchip Technology Inc. Advance Information DS70083C-page 37 dsPIC30F FIGURE 3-8: SAMPLE DATA SPACE MEMORY MAP MS Byte Address MSB 2-Kbyte SFR Space LS Byte Address 16 bits LSB 0x0000 0x0001 SFR Space 0x07FE 0x0800 0x07FF 0x0801 8-Kbyte Near Data Space X Data RAM (X) 8-Kbyte SRAM Space 0x17FF 0x1801 0x17FE 0x1800 0x1FFF 0x1FFE Y Data RAM (Y) 0x27FF 0x27FE 0x2801 0x2800 0x8001 0x8000 X Data Unimplemented (X) Optionally Mapped into Program Memory 0xFFFE 0xFFFF Note: The address map shown in Figure 3-8 is conceptual, and may vary across individual devices depending on available memory. DS70083C-page 38 Advance Information 2003 Microchip Technology Inc. dsPIC30F DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE SFR SPACE SFR SPACE X SPACE FIGURE 3-9: Y SPACE UNUSED X SPACE (Y SPACE) X SPACE UNUSED UNUSED Non-MAC Class Ops (Read) Indirect EA from any W 2003 Microchip Technology Inc. MAC Class Ops (Read) Indirect EA from W8, W9 Advance Information Indirect EA from W10, W11 DS70083C-page 39 DS70083C-page 40 Advance Information 003E 0040 0042 DOENDL DOENDH SR -- OA OB -- -- -- -- -- -- -- Bit 14 -- -- u = uninitialized bit 003C DOSTARTH Legend: 003A DOSTARTL 0030 PCH 0038 002E PCL DCOUNT 002C ACCBU 0036 002A ACCBH RCOUNT 0028 ACCBL 0032 0026 ACCAU 0034 0024 ACCAH PSVPAG 0022 ACCAL TBLPAG 0020 SPLIM 0014 W10 001E 0012 W9 W15 0010 W8 001C 000E W7 W14 000C W6 001A 000A W5 W13 0008 W4 0018 0006 W3 W12 0004 W2 0016 0002 W11 0000 W1 Bit 15 Bit 12 Bit 11 SA -- -- -- -- -- SB -- -- -- -- -- OAB -- -- -- -- -- Sign-Extension (ACCB<39>) SAB -- -- -- -- -- Bit 10 Sign-Extension (ACCA<39>) Bit 13 CORE REGISTER MAP Address (Home) W0 SFR Name TABLE 3-3: DA -- -- -- -- -- DCOUNT RCOUNT -- -- -- PCL ACCBH ACCBL ACCAH ACCAL SPLIM W15 W14 W13 W12 W11 W10 W9 W8 W7 W6 W5 W4 W3 W2 W1 DC -- DOENDL -- IPL2 -- -- -- Bit 7 W0 / WREG Bit 8 DOSTARTL Bit 9 IPL1 Bit 6 IPL0 Bit 5 Bit 3 RA N DOENDH DOSTARTH PSVPAG TBLPAG PCH ACCBU ACCAU Bit 4 OV Bit 2 Z Bit 1 C 0 0 Bit 0 0000 0000 0000 0000 0000 0000 0uuu uuuu uuuu uuuu uuuu uuu0 0000 0000 0uuu uuuu uuuu uuuu uuuu uuu0 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Reset State dsPIC30F 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. 004E 0050 0052 YMODSRT YMODEND XBREV DISICNT -- BREN u = uninitialized bit 004C XMODEND Legend: 0048 004A XMODSRT XMODEN -- 0044 0046 CORCON Bit 15 -- YMODEN -- Bit 14 US -- -- Bit 12 -- Bit 13 EDT Bit 11 CORE REGISTER MAP (CONTINUED) Address (Home) MODCON SFR Name TABLE 3-3: DL1 Bit 9 BWM<3:0> DL2 Bit 10 YE<15:1> YS<15:1> XE<15:1> XS<15:1> DL0 Bit 8 Bit 4 SATDW ACCSAT Bit 5 YWM<3:0> SATB Bit 6 DISICNT<13:0> XB<14:0> SATA Bit 7 IPL3 Bit 3 RND Bit 1 XWM<3:0> PSV Bit 2 1 0 1 0 IF Bit 0 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuu1 uuuu uuuu uuuu uuu0 uuuu uuuu uuuu uuu1 uuuu uuuu uuuu uuu0 0000 0000 0000 0000 0000 0000 0010 0000 Reset State dsPIC30F Advance Information DS70083C-page 41 dsPIC30F NOTES: DS70083C-page 42 Advance Information 2003 Microchip Technology Inc. dsPIC30F 4.0 ADDRESS GENERATOR UNITS The dsPIC core contains two independent address generator units: the X AGU and Y AGU. Further, the X AGU has two parts: X RAGU (Read AGU) and X WAGU (Write AGU). The X RAGU and X WAGU support byte and word sized data space reads and writes for both MCU and DSP instructions. The Y AGU supports word sized data reads for the DSP MAC class of instructions only. They are each capable of supporting two types of data addressing: * Linear Addressing * Modulo (Circular) Addressing In addition, the X WAGU can support: * Bit-Reversed Addressing Linear and Modulo Data Addressing modes can be applied to data space or program space. Bit-reversed addressing is only applicable to data space addresses. 4.1 Data Space Organization Note: When executing instructions which require just one source operand to be fetched from data space, the X RAGU and X WAGU are used to calculate the effective address. The X RAGU and X WAGU can generate any address in the 64-Kbyte data space. They support all MCU Addressing modes and modulo addressing for low overhead circular buffers. The X WAGU also supports bit-reversed addressing to facilitate FFT data reorganization. The data write phase of the MAC class of instructions does not split X and Y address space. The write EA is calculated using the X WAGU and the data space is configured for full 64-Kbyte access. In the Split Data Space mode, some W register address pointers are dedicated to X RAGU, and others to Y AGU. The EAs of each operand must, therefore, be restricted within different address spaces. If they are not, one of the EAs will be outside the address space of the corresponding data space (and will fetch the bus default value, 0x0000). 4.2 Although the data space memory is organized as 16-bit words, all effective addresses (EAs) are byte addresses. Instructions can thus access individual bytes as well as properly aligned words. Word addresses must be aligned at even boundaries. Misaligned word accesses are not supported, and if attempted, will initiate an address error trap. TABLE 4-1: When executing instructions which require two source operands to be concurrently fetched (i.e., the MAC class of DSP instructions), both the X RAGU and Y AGU are used simultaneously and the data space is split into two independent address spaces, X and Y. The Y AGU supports register indirect post-modified and modulo addressing only. Instruction Addressing Modes The Addressing modes in Table 4-1 form the basis of the Addressing modes optimized to support the specific features of individual instructions. The Addressing modes provided in the MAC class of instructions are somewhat different from those in the other instruction types. Some Addressing mode combinations may lead to a one-cycle stall during instruction execution, or are not allowed, as discussed in Section 4.3. FUNDAMENTAL ADDRESSING MODES SUPPORTED Addressing Mode Description File Register Direct The address of the File register is specified explicitly. Register Direct The contents of a register are accessed directly. Register Indirect The contents of Wn forms the EA. Register Indirect Post-modified The contents of Wn forms the EA. Wn is post-modified (incremented or decremented) by a constant value. Register Indirect Pre-modified Wn is pre-modified (incremented or decremented) by a signed constant value to form the EA. Register Indirect with Register Offset The sum of Wn and Wb forms the EA. Register Indirect with Literal Offset 2003 Microchip Technology Inc. The sum of Wn and a literal forms the EA. Advance Information DS70083C-page 43 dsPIC30F 4.2.1 FILE REGISTER INSTRUCTIONS Most File register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory. These memory locations are known as File registers. Most File register instructions employ a working register, W0, which is denoted as WREG in these instructions. The destination is typically either the same File register or WREG (with the exception of the MUL instruction), which writes the result to a register or register pair. The MOV instruction can use a 16-bit address field. 4.2.2 In summary, the following Addressing modes are supported by move and accumulator instructions: * * * * * * * * MCU INSTRUCTIONS Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified Register Indirect with Register Offset (Indexed) Register Indirect with Literal Offset 8-bit Literal 16-bit Literal Note: The three-operand MCU instructions are of the form: Operand 3 = Operand 1 <function> Operand 2 Not all instructions support all the Addressing modes given above. Individual instructions may support different subsets of these Addressing modes. where Operand 1 is always a working register (i.e., the Addressing mode can only be register direct) which is referred to as Wb. Operand 2 can be the W register fetched from data memory or 5-bit literal. In twooperand instructions, the result location is the same as that of one of the operands. Certain MCU instructions are one-operand operations. The following addressing modes are supported by MCU instructions: 4.2.4 * * * * * The 2 source operand pre-fetch registers must be a member of the set {W8, W9, W10, W11}. For data reads, W8 and W9 will always be directed to the X RAGU and W10 and W11 will always be directed to the Y AGU. The effective addresses generated (before and after modification) must, therefore, be valid addresses within X data space for W8 and W9 and Y data space for W10 and W11. Register Direct Register Indirect Register Indirect Post-modified Register Indirect Pre-modified 5-bit or 10-bit Literal Note: 4.2.3 Not all instructions support all the Addressing modes given above. Individual instructions may support different subsets of these Addressing modes. MOVE AND ACCUMULATOR INSTRUCTIONS Move instructions and the DSP accumulator class of instructions provide a greater degree of addressing flexibility than other instructions. In addition to the Addressing modes supported by most MCU instructions, move and accumulator instructions also support Register Indirect with Register Offset Addressing mode, also referred to as Register Indexed mode. Note: For the MOV instructions, the Addressing mode specified in the instruction can differ for the source and destination EA. However, the 4-bit Wb (register offset) field is shared between both source and destination (but typically only used by one). DS70083C-page 44 MAC INSTRUCTIONS The dual source operand DSP instructions (CLR, ED, EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred to as MAC instructions, utilize a simplified set of Addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. Note: Register indirect with register offset addressing is only available for W9 (in X space) and W11 (in Y space). In summary, the following Addressing modes are supported by the MAC class of instructions: * * * * * Register Indirect Register Indirect Post-modified by 2 Register Indirect Post-modified by 4 Register Indirect Post-modified by 6 Register Indirect with Register Offset (Indexed) 4.2.5 OTHER INSTRUCTIONS Besides the various Addressing modes outlined above, some instructions use literal constants of various sizes. For example, BRA (branch) instructions use 16-bit signed literals to specify the branch destination directly, whereas the DISI instruction uses a 14-bit unsigned literal field. In some instructions, such as ADD Acc, the source of an operand or result is implied by the opcode itself. Certain operations, such as NOP, do not have any operands. Advance Information 2003 Microchip Technology Inc. dsPIC30F 4.3 4.3.1 4.3.2 Instruction Stalls During the instruction pre-decode, the core determines if any address register dependency is imminent across an instruction boundary. The stall detection logic compares the W register (if any) used for the destination EA of the instruction currently being executed, with the W register to be used by the source EA (if any) of the prefetched instruction. As the W registers are also memory mapped, the stall detection logic also derives an SFR address from the W register being used by the destination EA, and determines whether this address is being issued during the write phase of the instruction currently being executed. INTRODUCTION In order to maximize data space, EA calculation and operand fetch time, the X data space read and write accesses are partially pipelined. The latter half of the read phase overlaps the first half of the write phase of an instruction, as shown in Section 2.0. Address register data dependencies, also known as `Read After Write' (RAW) dependencies may, therefore, arise between successive read and write operations using common registers. They occur across instruction boundaries and are detected by the hardware. When it observes a match between the destination and source registers, a set of rules is applied to decide whether or not to stall the instruction by one cycle. Table 4-2 lists out the various RAW conditions which cause an instruction execution stall. An example of a RAW dependency is a write operation (in the current instruction) that modifies W5, followed by a read operation (in the next instruction) that uses W5 as a source address pointer. W5 will not be valid for the read operation until the earlier write completes. This problem is resolved by stalling the instruction execution for one instruction cycle, thereby allowing the write to complete before the next read is started. TABLE 4-2: RAW DEPENDENCY DETECTION RAW DEPENDENCY RULES (DETECTION BY HARDWARE) Destination Source Addressing Addressing Mode Mode Using Wn Using Wn Examples (Wn = W2) Status Direct Direct Direct Indirect Stall ADD.w MOV.w W0, W1, W2 [W2], W3 Direct Indirect with Pre- or Post-Modification Stall ADD.w MOV.w W0, W1, W2 [W2++], W3 Indirect Direct No Stall ADD.w MOV.w W0, W1, [W2] W2, W3 Indirect Indirect No Stall ADD.w MOV.w W0, W1, [W2] [W2], W3 Indirect Indirect Indirect Indirect with Pre- or Post-Modification Indirect Indirect with Pre- or Post-Modification Indirect with Pre- or Direct Post-Modification No Stall ADD.w MOV.w Stall ADD.w MOV.w W2) No Stall ADD.w MOV.w Stall ADD.w MOV.w W2) No Stall ADD.w MOV.w W0, W1, W2 W2, W3 W0, W1, [W2] ; W2=0x0004 (mapped W2) [W2], W3 ; (i.e. if W2 = addr. of W0, W1, [W2] [W2++], W3 W0, W1, [W2] ; W2=0x0004 (mapped W2) [W2++], W3 ; (i.e. if W2 = addr. of W0, W1, [W2++] W2, W3 Indirect with Pre- or Indirect Post-Modification Stall ADD.w MOV.w W0, W1, [W2++] [W2], W3 Indirect with Pre- or Indirect with Pre- or Post-Modification Post-Modification Stall ADD.w MOV.w W0, W1, [W2++] [W2++], W3 2003 Microchip Technology Inc. Advance Information DS70083C-page 45 dsPIC30F 4.4 Modulo Addressing Modulo addressing is a method of providing an automated means to support circular data buffers using hardware. The objective is to remove the need for software to perform data address boundary checks when executing tightly looped code, as is typical in many DSP algorithms. Modulo addressing can operate in either data or program space (since the data pointer mechanism is essentially the same for both). One circular buffer can be supported in each of the X (which also provides the pointers into program space) and Y data spaces. Modulo addressing can operate on any W register pointer. However, it is not advisable to use W14 or W15 for modulo addressing since these two registers are used as the stack frame pointer and stack pointer, respectively. In general, any particular circular buffer can only be configured to operate in one direction, as there are certain restrictions on the buffer start address (for incrementing buffers), or end address (for decrementing buffers) based upon the direction of the buffer. The only exception to the usage restrictions is for buffers which have a power-of-2 length. As these buffers satisfy the start and end address criteria, they may operate in a Bidirectional mode (i.e., address boundary checks will be performed on both the lower and upper address boundaries). 4.4.1 START AND END ADDRESS The modulo addressing scheme requires that a starting and an ending address be specified and loaded into the 16-bit Modulo Buffer Address registers: XMODSRT, XMODEND, YMODSRT, YMODEND (see Table 3-3). Note: The start and end addresses are the first and last byte addresses of the buffer (irrespective of whether it is a word or byte buffer, or an increasing or decreasing buffer). Moreover, the start address must be even and the end address must be odd (for both word and byte buffers). If the length of an incrementing buffer is greater than M = 2N-1, but not greater than M = 2N bytes, then the last `N' bits of the data buffer start address must be zeros. There are no such restrictions on the end address of an incrementing buffer. For example, if the buffer size (modulus value) is chosen to be 100 bytes (0x64), then the buffer start address for an incrementing buffer must contain 7 Least Significant zeros. Valid start addresses may, therefore, be 0xXX00 and 0xXX80, where `X' is any hexadecimal value. Adding the buffer length to this value and subtracting `1' will give the end address to be written into X/YMODEND. DS70083C-page 46 For example, if the start address was chosen to be 0x2000, then the X/YMODEND would be set to (0x2000 + 0x0064 - 1) = 0x2063. Note: `Start address' refers to the smallest address boundary of the circular buffer. The first access of the buffer may be at any address within the modulus range (see Section 4.4.4). In the case of a decrementing buffer, the last `N' bits of the data buffer end address must be ones. There are no such restrictions on the start address of a decrementing buffer. For example, if the buffer size (modulus value) is chosen to be 100 bytes (0x64), then the buffer end address for a decrementing buffer must contain 7 Least Significant ones. Valid end addresses may, therefore, be 0xXXFF and 0xXX7F, where `X' is any hexadecimal value. Subtracting the buffer length from this value and adding 1 will give the start address to be written into X/YMODSRT. For example, if the end address was chosen to be 0x207F, then the start address would be (0x207F - 0x0064 + 1) = 0x201C, which is the first physical address of the buffer. Note: Y space modulo addressing EA calculations assume word sized data (LS bit of every EA is always clear). The length of a circular buffer is not directly specified. It is determined by the difference between the corresponding start and end addresses. The maximum possible length of the circular buffer is 32K words (64 Kbytes). A write operation to the MODCON register should not be immediately followed by an indirect read operation using any W register. Note 1: Using a POP instruction to pop the contents of the top-of-stack (TOS) location into MODCON also constitutes a write to MODCON. Therefore, the instruction immediately following such a POP cannot be any instruction performing an indirect read operation. 2: It should be noted that some instructions perform an indirect read operation implicitly. These are: POP, RETURN, RETFIE, RETLW and ULNK. Advance Information 2003 Microchip Technology Inc. dsPIC30F 4.4.2 W ADDRESS REGISTER SELECTION The Modulo and Bit-Reversed Addressing Control register MODCON<15:0> contains enable flags as well as a W register field to specify the W address registers. The XWM and YWM fields select which registers will operate with modulo addressing. If XWM = 15, X RAGU and X WAGU modulo addressing is disabled. Similarly, if YWM = 15, Y AGU modulo addressing is disabled. Note: The XMODSRT and XMODEND registers and the XWM register selection are shared between X RAGU and X WAGU. FIGURE 4-1: The X Address Space Pointer W register (XWM), to which modulo addressing is to be applied, is stored in MODCON<3:0> (see Table 3-3). Modulo addressing is enabled for X data space when XWM is set to any value other than `15' and the XMODEN bit is set at MODCON<15>. The Y Address Space Pointer W register (YWM), to which modulo addressing is to be applied, is stored in MODCON<7:4>. Modulo addressing is enabled for Y data space when YWM is set to any value other than `15' and the YMODEN bit is set at MODCON<14>. INCREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x1100 MOV MOV MOV MOV MOV MOV #0x1100,W0 W0,XMODSRT #0x1163,W0 W0,MODEND #0x8001,W0 W0,MODCON MOV #0x0000,W0 ;W0 holds buffer fill value MOV #0x1110,W1 ;point W1 to buffer DO AGAIN,#0x31 MOV W0,[W1++] AGAIN: INC W0,W0 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;fill the 50 buffer locations ;fill the next location ;increment the fill value 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words 2003 Microchip Technology Inc. Advance Information DS70083C-page 47 dsPIC30F FIGURE 4-2: DECREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x11D0 MOV MOV MOV MOV MOV MOV #0x11D0,W0 #0,XMODSRT 0x11FF,W0 W0,XMODEND #0x8001,W0 W0,MODCON MOV #0x000F,W0 ;W0 holds buffer fill value MOV #0x11E0,W1 ;point W1 to buffer DO AGAIN,#0x17 MOV W0,[W1--] AGAIN: DEC W0,W0 ;set modulo start address ;set modulo end address ;enable W1, X AGU for modulo ;fill the 24 buffer locations ;fill the next location ; decrement the fill value 0x11FF Start Addr = 0x11D0 End Addr = 0x11FF Length = 0x0018 words DS70083C-page 48 Advance Information 2003 Microchip Technology Inc. dsPIC30F 4.4.3 MODULO ADDRESSING APPLICABILITY 4.5 Modulo addressing can be applied to the effective address (EA) calculation associated with any W register. It is important to realize that the address boundaries check for addresses less than, or greater than the upper (for incrementing buffers), and lower (for decrementing buffers) boundary addresses (not just equal to). Address changes may, therefore, jump over boundaries and still be adjusted correctly (see Section 4.4.4 for restrictions). Note: 4.4.4 The modulo corrected effective address is written back to the register only when PreModify or Post-Modify Addressing mode is used to compute the effective address. When an address offset (e.g., [W7+W2]) is used, modulo address correction is performed but the contents of the register remain unchanged. MODULO ADDRESSING RESTRICTIONS For an incrementing buffer, the circular buffer start address (lower boundary) is arbitrary but must be at a `zero' power-of-two boundary (see Section 4.4.1). For a decrementing buffer, the circular buffer end address is arbitrary but must be at a `ones' boundary. There are no restrictions regarding how much an EA calculation can exceed the address boundary being checked and still be successfully corrected. Once configured, the direction of successive addresses into a buffer should not be changed. Although all EAs will continue to be generated correctly, irrespective of offset sign, only one address boundary is checked for each type of buffer. Thus, if a buffer is set up to be an incrementing buffer by choosing an appropriate starting address, then correction of the effective address will be performed by the AGU at the upper address boundary, but no address correction will occur if the EA crosses the lower address boundary. Similarly, for a decrementing boundary, address correction will be performed by the AGU at the lower address boundary, but no address correction will take place if the EA crosses the upper address boundary. The circular buffer pointer may be freely modified in both directions without a possibility of out-of-range address access only when the start address satisfies the condition for an incrementing buffer (last `N' bits are zeroes) and the end address satisfies the condition for a decrementing buffer (last `N' bits are ones). Thus, the modulo addressing capability is truly bidirectional only for modulo-2 length buffers. Bit-Reversed Addressing Bit-reversed addressing is intended to simplify data reordering for radix-2 FFT algorithms. It is supported by the X WAGU only (i.e., for data writes only). The modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. The address source and destination are kept in normal order. Thus, the only operand requiring reversal is the modifier. 4.5.1 BIT-REVERSED ADDRESSING IMPLEMENTATION Bit-reversed addressing is enabled when: 1. 2. 3. BWM (W register selection) in the MODCON register is any value other than `15' (the stack cannot be accessed using bit-reversed addressing) and the BREN bit is set in the XBREV register and the Addressing mode used is Register Indirect with Pre-Increment or Post-Increment. If the length of a bit-reversed buffer is M = 2N bytes, then the last `N' bits of the data buffer start address must be zeros. XB<14:0> is the bit-reversed address modifier or `pivot point' which is typically a constant. In the case of an FFT computation, its value is equal to half of the FFT data buffer size. Note: All bit-reversed EA calculations assume word sized data (LS bit of every EA is always clear). The XB value is scaled accordingly to generate compatible (byte) addresses. When enabled, bit-reversed addressing will only be executed for register indirect with pre-increment or post-increment addressing and word sized data writes. It will not function for any other Addressing mode or for byte sized data, and normal addresses will be generated instead. When bit-reversed addressing is active, the W address pointer will always be added to the address modifier (XB) and the offset associated with the Register Indirect Addressing mode will be ignored. In addition, as word sized data is a requirement, the LS bit of the EA is ignored (and always clear). Note: Modulo addressing and bit-reversed addressing should not be enabled together. In the event that the user attempts to do this, bit-reversed addressing will assume priority when active for the X WAGU, and X WAGU modulo addressing will be disabled. However, modulo addressing will continue to function in the X RAGU. If bit-reversed addressing has already been enabled by setting the BREN (XBREV<15>) bit, then a write to the XBREV register should not be immediately followed by an indirect read operation using the W register that has been designated as the bit-reversed pointer. 2003 Microchip Technology Inc. Advance Information DS70083C-page 49 dsPIC30F FIGURE 4-3: BIT-REVERSED ADDRESS EXAMPLE Sequential Address b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b4 b3 b2 b1 0 Bit Locations Swapped Left-to-Right Around Center of Binary Value b15 b14 b13 b12 b11 b10 b9 b8 b7 b6 b5 b1 b2 b3 b4 0 Bit-Reversed Address Pivot Point XB = 0x0008 for a 16-word Bit-Reversed Buffer TABLE 4-3: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY) Normal Address Bit-Reversed Address A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal 0 0 0 0 0 0 0 1 0 1 0 1 0 0 0 0 0 0 0 8 0 0 0 0 1 1 0 1 2 3 0 1 1 1 0 0 0 0 4 12 0 0 1 1 0 0 0 1 4 5 0 1 0 0 1 1 0 0 2 10 0 0 1 1 1 1 0 1 6 7 0 1 1 1 1 1 0 0 6 14 1 0 0 0 8 0 0 0 1 1 1 0 0 1 9 1 0 0 1 9 1 0 1 0 10 0 1 0 1 5 1 1 0 1 1 0 1 0 11 12 1 0 1 0 0 1 1 1 13 3 1 1 0 1 13 1 0 1 1 11 1 1 1 0 14 0 1 1 1 7 1 1 1 1 15 1 1 1 1 15 TABLE 4-4: DS70083C-page 50 BIT-REVERSED ADDRESS MODIFIER VALUES Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value 32768 0x4000 16384 0x2000 8192 0x1000 4096 2048 0x0800 0x0400 1024 512 0x0200 0x0100 256 128 0x0080 0x0040 64 32 0x0020 0x0010 16 8 0x0008 0x0004 4 2 0x0002 0x0001 Advance Information 2003 Microchip Technology Inc. dsPIC30F 5.0 INTERRUPTS The dsPIC30F Sensor and General Purpose Family has up to 41 interrupt sources and 4 processor exceptions (traps) which must be arbitrated based on a priority scheme. The CPU is responsible for reading the Interrupt Vector Table (IVT) and transferring the address contained in the interrupt vector to the program counter. The interrupt vector is transferred from the program data bus into the program counter via a 24-bit wide multiplexer on the input of the program counter. The Interrupt Vector Table (IVT) and Alternate Interrupt Vector Table (AIVT) are placed near the beginning of program memory (0x000004). The IVT and AIVT are shown in Table 5-2. The interrupt controller is responsible for preprocessing the interrupts and processor exceptions prior to them being presented to the processor core. The peripheral interrupts and traps are enabled, prioritized and controlled using centralized Special Function Registers: * IFS0<15:0>, IFS1<15:0>, IFS2<15:0> All interrupt request flags are maintained in these three registers. The flags are set by their respective peripherals or external signals, and they are cleared via software. * IEC0<15:0>, IEC1<15:0>, IEC2<15:0> All interrupt enable control bits are maintained in these three registers. These control bits are used to individually enable interrupts from the peripherals or external signals. * IPC0<15:0>... IPC10<7:0> The user assignable priority level associated with each of these 41 interrupts is held centrally in these twelve registers. * IPL<3:0> The current CPU priority level is explicitly stored in the IPL bits. IPL<3> is present in the CORCON register, whereas IPL<2:0> are present in the STATUS register (SR) in the processor core. * INTCON1<15:0>, INTCON2<15:0> Global interrupt control functions are derived from these two registers. INTCON1 contains the control and status flags for the processor exceptions. The INTCON2 register controls the external interrupt request signal behavior and the use of the alternate vector table. Note: All interrupt sources can be user assigned to one of 7 priority levels, 1 through 7, via the IPCx registers. Each interrupt source is associated with an interrupt vector, as shown in Table 5-2. Levels 7 and 1 represent the highest and lowest maskable priorities, respectively. Note: Assigning a priority level of `0' to an interrupt source is equivalent to disabling that interrupt. If the NSTDIS bit (INTCON1<15>) is set, nesting of interrupts is prevented. Thus, if an interrupt is currently being serviced, processing of a new interrupt is prevented even if the new interrupt is of higher priority than the one currently being serviced. Note: The IPL bits become read only whenever the NSTDIS bit has been set to `1'. Certain interrupts have specialized control bits for features like edge or level triggered interrupts, interrupton-change, etc. Control of these features remains within the peripheral module which generates the interrupt. The DISI instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions, during which the DISI bit (INTCON2<14>) remains set. When an interrupt is serviced, the PC is loaded with the address stored in the vector location in program memory that corresponds to the interrupt. There are 63 different vectors within the IVT (refer to Table 5-2). These vectors are contained in locations 0x000004 through 0x0000FE of program memory (refer to Table 5-2). These locations contain 24-bit addresses and in order to preserve robustness, an address error trap will take place should the PC attempt to fetch any of these words during normal execution. This prevents execution of random data as a result of accidentally decrementing a PC into vector space, accidentally mapping a data space address into vector space, or the PC rolling over to 0x000000 after reaching the end of implemented program memory space. Execution of a GOTO instruction to this vector space will also generate an address error trap. Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 2003 Microchip Technology Inc. Advance Information DS70083C-page 51 dsPIC30F 5.1 TABLE 5-1: Interrupt Priority The user assignable interrupt priority (IP<2:0>) bits for each individual interrupt source are located in the LS 3 bits of each nibble within the IPCx register(s). Bit 3 of each nibble is not used and is read as a `0'. These bits define the priority level assigned to a particular interrupt by the user. Note: The user selectable priority levels start at 0 as the lowest priority and level 7 as the highest priority. Since more than one interrupt request source may be assigned to a specific user specified priority level, a means is provided to assign priority within a given level. This method is called "Natural Order Priority". Table 5-1 lists the interrupt numbers and interrupt sources for the dsPIC device and their associated vector numbers. Note 1: The natural order priority scheme has 0 as the highest priority and 53 as the lowest priority. 2: The natural order priority number is the same as the INT number. The ability for the user to assign every interrupt to one of seven priority levels implies that the user can assign a very high overall priority level to an interrupt with a low natural order priority. For example, the PLVD (Low Voltage Detect) can be given a priority of 7. The INT0 (External Interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. DS70083C-page 52 INT Number NATURAL ORDER PRIORITY Vector Number Interrupt Source Highest Natural Order Priority 0 8 INT0 - External Interrupt 0 1 9 IC1 - Input Capture 1 2 10 OC1 - Output Compare 1 3 11 T1 - Timer 1 4 12 IC2 - Input Capture 2 5 13 OC2 - Output Compare 2 6 14 T2 - Timer 2 7 15 T3 - Timer 3 8 16 SPI1 9 17 U1RX - UART1 Receiver 10 18 U1TX - UART1 Transmitter 11 19 ADC - ADC Convert Done 12 20 NVM - NVM Write Complete 13 21 SI2C - I2C Slave Interrupt 14 22 MI2C - I2C Master Interrupt 15 23 Input Change Interrupt 16 24 INT1 - External Interrupt 1 17 25 IC7 - Input Capture 7 18 26 IC8 - Input Capture 8 19 27 OC3 - Output Compare 3 20 28 OC4 - Output Compare 4 21 29 T4 - Timer 4 22 30 T5 - Timer 5 23 31 INT2 - External Interrupt 2 24 32 U2RX - UART2 Receiver 25 33 U2TX - UART2 Transmitter 26 34 SPI2 27 35 C1 - Combined IRQ for CAN1 28 36 IC3 - Input Capture 3 29 37 IC4 - Input Capture 4 30 38 IC5 - Input Capture 5 31 39 IC6 - Input Capture 6 32 40 OC5 - Output Compare 5 33 41 OC6 - Output Compare 6 34 42 OC7 - Output Compare 7 35 43 OC8 - Output Compare 8 36 44 INT3 - External Interrupt 3 37 45 INT4 - External Interrupt 4 38 46 C2 - Combined IRQ for CAN2 39-40 47-48 Reserved 41 49 DCI - Codec Transfer Done 42 50 LVD - Low Voltage Detect 43-53 51-61 Reserved Lowest Natural Order Priority Advance Information 2003 Microchip Technology Inc. dsPIC30F 5.2 Reset Sequence 5.3 A Reset is not a true exception, because the interrupt controller is not involved in the Reset process. The processor initializes its registers in response to a Reset which forces the PC to zero. The processor then begins program execution at location 0x000000. A GOTO instruction is stored in the first program memory location immediately followed by the address target for the GOTO instruction. The processor executes the GOTO to the specified address and then begins operation at the specified target (start) address. 5.2.1 Traps Traps can be considered as non-maskable, non-stable interrupts, which adhere to a predefined priority, as shown in Table 5-2. They are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. Note: RESET SOURCES In addition to external Reset and Power-on Reset (POR), there are 6 sources of error conditions which `trap' to the Reset vector. * Watchdog Time-out: The watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. * Uninitialized W Register Trap: An attempt to use an uninitialized W register as an address pointer will cause a Reset. * Illegal Instruction Trap: Attempted execution of any unused opcodes will result in an illegal instruction trap. Note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. * Brown-out Reset (BOR): A momentary dip in the power supply to the device has been detected which may result in malfunction. * Trap Lockout: Occurrence of multiple trap conditions simultaneously will cause a Reset. 2003 Microchip Technology Inc. If the user does not intend to take corrective action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the RESET instruction. If, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated. Note that many of these trap conditions can only be detected when they occur. Consequently, the questionable instruction is allowed to complete prior to trap exception processing. If the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. There are 8 fixed priority levels for traps: level 8 through level 15, which implies that the IPL3 is always set during processing of a trap. If the user is not currently executing a trap, and he sets the IPL<3:0> bits to a value of `0111' (level 7), then all interrupts are disabled but traps can still be processed. 5.3.1 TRAP SOURCES The following traps are provided with increasing priority. However, since all traps can be nested, priority has little effect. * Math Error Trap: The math error trap executes under the following four circumstances: 1. Should an attempt be made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. 2. If enabled, a math error trap will be taken when an arithmetic operation on either accumulator A or B causes an overflow from bit 31 and the accumulator guard bits are not utilized. 3. If enabled, a math error trap will be taken when an arithmetic operation on either accumulator A or B causes a catastrophic overflow from bit 39 and all saturation is disabled. 4. If the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. Advance Information DS70083C-page 53 dsPIC30F * Address Error Trap: This trap is initiated when any of the following circumstances occurs: 1. A misaligned data word access is attempted. 2. A data fetch from and unimplemented data memory location is attempted. 3. A data fetch from an unimplemented program memory location is attempted. 4. An instruction fetch from vector space is attempted. Note: In the MAC class of instructions, wherein the data space is split into X and Y data space, unimplemented X space includes all of Y space, and unimplemented Y space includes all of X space. 5. Execution of a "BRA #literal" instruction or a "GOTO #literal" instruction, where literal is an unimplemented program memory address. 6. Executing instructions after modifying the PC to point to unimplemented program memory addresses. The PC may be modified by loading a value into the stack and executing a RETURN instruction. * Stack Error Trap: This trap is initiated under the following conditions: 1. The stack pointer is loaded with a value which is greater than the (user programmable) limit value written into the SPLIM register (stack overflow). 2. The stack pointer is loaded with a value which is less than 0x0800 (simple stack underflow). * Oscillator Fail Trap: This trap is initiated if the external oscillator fails and operation becomes reliant on an internal RC backup. 5.3.2 HARD AND SOFT TRAPS It is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). In such a case, the fixed priority shown in Figure 5-2 is implemented, which may require the user to check if other traps are pending in order to completely correct the fault. `Soft' traps include exceptions of priority level 8 through level 11, inclusive. The arithmetic error trap (level 11) falls into this category of traps. Soft traps can be treated like non-maskable sources of interrupt that adhere to the priority assigned by their position in the IVT. Soft traps are processed like interrupts and require 2 cycles to be sampled and Acknowledged prior to exception processing. Therefore, additional instructions may be executed before a soft trap is Acknowledged. `Hard' traps include exceptions of priority level 12 through level 15, inclusive. The address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. Like soft traps, hard traps can also be viewed as nonmaskable sources of interrupt. The difference between hard traps and soft traps is that hard traps force the CPU to stop code execution after the instruction causing the trap has completed. Normal program execution flow will not resume until after the trap has been Acknowledged and processed. If a higher priority trap occurs while any lower priority trap is in progress, processing of the lower priority trap will be suspended and the higher priority trap will be Acknowledged and processed. The lower priority trap will remain pending until processing of the higher priority trap completes. Each hard trap that occurs must be Acknowledged before code execution of any type may continue. If a lower priority hard trap occurs while a higher priority trap is pending, Acknowledged, or is being processed, a hard trap conflict will occur. The conflict occurs because the lower priority trap cannot be Acknowledged until processing for the higher priority trap completes. The device is automatically reset in a hard trap conflict condition. The TRAPR status bit (RCON<15>) is set when the Reset occurs so that the condition may be detected in software. In the case of a math error trap or oscillator failure trap, the condition that causes the trap to occur must be removed before the respective trap flag bit in the INTCON1 register may be cleared. DS70083C-page 54 Advance Information 2003 Microchip Technology Inc. dsPIC30F 5.4 FIGURE 5-2: Interrupt Sequence Decreasing Priority All interrupt event flags are sampled in the beginning of each instruction cycle by the IFSx registers. A pending interrupt request (IRQ) is indicated by the flag bit being equal to a `1' in an IFSx register. The IRQ will cause an interrupt to occur if the corresponding bit in the Interrupt Enable (IECx) register is set. For the remainder of the instruction cycle, the priorities of all pending interrupt requests are evaluated. IVT If there is a pending IRQ with a priority level greater than the current processor priority level in the IPL bits, the processor will be interrupted. The processor then stacks the current program counter and the low byte of the processor STATUS register (SRL), as shown in Figure 5-1. The low byte of the STATUS register contains the processor priority level at the time prior to the beginning of the interrupt cycle. The processor then loads the priority level for this interrupt into the STATUS register. This action will disable all lower priority interrupts until the completion of the Interrupt Service Routine. FIGURE 5-1: Stack Grows Towards Higher Address 0x0000 15 AIVT INTERRUPT STACK FRAME 5.5 0 PC<15:0> SRL IPL3 PC<22:16> <Free Word> W15 (before CALL) W15 (after CALL) POP : [--W15] PUSH: [W15++] Note 1: The user can always lower the priority level by writing a new value into SR. The Interrupt Service Routine must clear the interrupt flag bits in the IFSx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. EXCEPTION VECTORS Reset - GOTO Instruction Reset - GOTO Address Reserved Oscillator Fail Trap Vector Address Error Trap Vector Stack Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector ~ ~ ~ Interrupt 52 Vector Interrupt 53 Vector Reserved Reserved Reserved Oscillator Fail Trap Vector Stack Error Trap Vector Address Error Trap Vector Math Error Trap Vector Reserved Vector Reserved Vector Reserved Vector Interrupt 0 Vector Interrupt 1 Vector ~ ~ ~ Interrupt 52 Vector Interrupt 53 Vector 0x000000 0x000002 0x000004 0x000014 0x00007E 0x000080 0x000082 0x000084 0x000094 0x0000FE Alternate Vector Table In program memory, the Interrupt Vector Table (IVT) is followed by the Alternate Interrupt Vector Table (AIVT), as shown in Table 5-2. Access to the alternate vector table is provided by the ALTIVT bit in the INTCON2 register. If the ALTIVT bit is set, all interrupt and exception processes will use the alternate vectors instead of the default vectors. The alternate vectors are organized in the same manner as the default vectors. The AIVT supports emulation and debugging efforts by providing a means to switch between an application and a support environment without requiring the interrupt vectors to be reprogrammed. This feature also enables switching between applications for evaluation of different software algorithms at run time. If the AIVT is not required, the program memory allocated to the AIVT may be used for other purposes. AIVT is not a protected section and may be freely programmed by the user. 2: The IPL3 bit (CORCON<3>) is always clear when interrupts are being processed. It is set only during execution of traps. The RETFIE (return from interrupt) instruction will unstack the program counter and STATUS registers to return the processor to its state prior to the interrupt sequence. 2003 Microchip Technology Inc. Advance Information DS70083C-page 55 dsPIC30F 5.6 Fast Context Saving 5.7 A context saving option is available using shadow registers. Shadow registers are provided for the DC, N, OV, Z and C bits in SR, and the registers W0 through W3. The shadows are only one level deep. The shadow registers are accessible using the PUSH.S and POP.S instructions only. When the processor vectors to an interrupt, the PUSH.S instruction can be used to store the current value of the aforementioned registers into their respective shadow registers. If an ISR of a certain priority uses the PUSH.S and POP.S instructions for fast context saving, then a higher priority ISR should not include the same instructions. Users must save the key registers in software during a lower priority interrupt if the higher priority ISR uses fast context saving. DS70083C-page 56 External Interrupt Requests The interrupt controller supports up to five external interrupt request signals, INT0-INT4. These inputs are edge sensitive; they require a low-to-high or a high-tolow transition to generate an interrupt request. The INTCON2 register has five bits, INT0EP-INT4EP, that select the polarity of the edge detection circuitry. 5.8 Wake-up from Sleep and Idle The interrupt controller may be used to wake-up the processor from either Sleep or Idle modes, if Sleep or Idle mode is active when the interrupt is generated. If an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. At the same time, the processor will wake-up from Sleep or Idle and begin execution of the Interrupt Service Routine (ISR) needed to process the interrupt request. Advance Information 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. -- -- -- -- 00A2 00A4 00A6 00A8 u = uninitialized bit IPC7 IPC8 IPC9 IPC10 Legend: -- -- -- -- -- 009E 009C IPC4 -- 00A0 009A IPC3 -- -- OC8IP<2:0> IC6IP<2:0> -- IC3IF -- -- -- IC3IE NVMIE INT2IP<2:0> C1IP<2:0> -- -- Bit 12 NVMIF OC3IP<2:0> CNIP<2:0> ADIP<2:0> -- IPC6 0098 IPC2 T1IP<2:0> T31P<2:0> -- -- -- -- IC4IE SI2CIE -- IC4IF SI2CIF -- IC5IE MI2CIE IC6IE CNIE MI2CIF IPC5 0094 0096 IPC0 0090 IEC2 IPC1 008E IEC1 -- -- 0088 008C IFS2 IEC0 IC5IF IC6IF 0086 IFS1 CNIF 0084 -- IFS0 -- -- Bit 13 -- 0080 NSTDIS Bit 14 0082 ALTIVT Bit 15 INTCON1 ADR -- -- -- -- -- -- -- -- -- -- -- -- C1IE ADIE -- C1IF ADIF -- -- Bit 11 DCIIF U2TXIF U1RXIF -- OVBTE Bit 9 LVDIE SPI2IE SPI1IE -- U2RXIF SPI1IF -- COVTE Bit 8 LVDIP<2:0> C2IP<2:0> OC7IP<2:0> IC5IP<2:0> SPI2IP<2:0> T5IP<2:0> IC8IP<2:0> MI2CIP<2:0> U1TXIP<2:0> T2IP<2:0> OC1IP<2:0> DCIIE -- U2TXIE U2RXIE U1TXIE U1RXIE LVDIF SPI2IF U1TXIF -- OVATE Bit 10 INTERRUPT CONTROLLER REGISTER MAP INTCON2 SFR Name TABLE 5-2: -- -- -- -- -- -- -- -- -- -- -- -- INT2IE T3IE -- INT2IF T3IF -- -- Bit 7 C2IE T5IE T2IE C2IF T5IF T2IF -- -- Bit 6 Bit 4 INT3IE OC4IE IC2IE INT3IF OC4IF IC2IF INT4EP MATHERR DCIIP<2:0> INT41IP<2:0> OC6IP<2:0> IC4IP<2:0> U2TXIP<2:0> T4IP<2:0> IC7IP<2:0> SI2CIP<2:0> U1RXIP<2:0> OC2IP<2:0> IC1IP<2:0> INT4IE T4IE OC2IE INT4IF T4IF OC2IF -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- OC8IE OC3IE T1IE OC8IF OC3IF T1IF INT3EP ADDRERR Bit 3 Bit 1 -- OC7IE IC8IE OC1IE OC7IF IC8IF OC1IF INT2EP -- INT3IP<2:0> OC5IP<2:0> IC3IP<2:0> U2RXIP<2:0> OC4IP<2:0> INT1IP<2:0> NVMIP<2:0> SPI1IP<2:0> IC2IP<2:0> INT0IP<2:0> OC6IE IC7IE IC1IE OC6IF IC7IF IC1IF INT1EP STKERR OSCFAIL Bit 2 0000 0000 0000 0000 Reset State -- OC5IE INT1IE INT0IE OC5IF INT1IF INT0IF 0000 0100 0100 0000 0000 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0100 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 INT0EP 0000 0000 0000 0000 -- Bit 0 dsPIC30F Advance Information DS70083C-page 57 dsPIC30F NOTES: DS70083C-page 58 Advance Information 2003 Microchip Technology Inc. dsPIC30F 6.0 6.2 FLASH PROGRAM MEMORY The dsPIC30F family of devices contains internal program Flash memory for executing user code. There are two methods by which the user can program this memory: 1. 2. 6.1 Run-Time Self-Programming (RTSP) RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions, and the following control registers: Run-Time Self-Programming (RTSP) In-Circuit Serial ProgrammingTM (ICSPTM) * NVMCON: Non-Volatile Memory Control Register * NVMKEY: Non-Volatile Memory Key Register * NVMADR: Non-Volatile Memory Address Register In-Circuit Serial Programming (ICSP) With RTSP, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 4 instructions (12 bytes) at a time. dsPIC30F devices can be serially programmed while in the end application circuit. This is simply done with two lines for Programming Clock and Programming Data (which are named PGC and PGD respectively), and three other lines for Power (VDD), Ground (VSS) and Master Clear (MCLR). this allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. 6.3 Table Instruction Operation Summary The TBLRDL and the TBLWTL instructions are used to read or write to bits<15:0> of program memory. TBLRDL and TBLWTL can access program memory in Word or Byte mode. The TBLRDH and TBLWTH instructions are used to read or write to bits<23:16> of program memory. TBLRDH and TBLWTH can access program memory in Word or Byte mode. A 24-bit program memory address is formed using bits<7:0> of the TBLPAG register and the effective address (EA) from a W register specified in the table instruction, as shown in Figure 6-1. FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS 24 bits Using Program Counter Program Counter 0 0 NVMADR Reg EA Using NVMADR Addressing 1/0 NVMADRU Reg 8 bits 16 bits Working Reg EA Using Table Instruction User/Configuration Space Select 2003 Microchip Technology Inc. 1/0 TBLPAG Reg 8 bits 16 bits 24-bit EA Advance Information Byte Select DS70083C-page 59 dsPIC30F 6.4 RTSP Operation 6.5 The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instructions or 96 bytes. Each panel consists of 128 rows or 4K x 24 instructions. RTSP allows the user to erase one row (32 instructions) at a time and to program four instructions at one time. RTSP may be used to program multiple program memory panels, but the table pointer must be changed at each panel boundary. Each panel of program memory contains write latches that hold four instructions of programming data. Prior to the actual programming operation, the write data must be loaded into the panel write latches. The data to be programmed into the panel is loaded in sequential order into the write latches: instruction 0, instruction 1, etc. The instruction words loaded must always be from a group of four boundary (e.g., loading of instructions 3, 4, 5 and 6 is not allowed). The basic sequence for RTSP programming is to set up a table pointer, then do a series of TBLWT instructions to load the write latches. Programming is performed by setting the special bits in the NVMCON register. Four TBLWTL and four TBLWTH instructions are required to load the four instructions. To fully program a row of program memory, eight cycles of four TBLWTL and four TBLWTH are required. If multiple panel programming is required, the table pointer needs to be changed and the next set of multiple write latches written. All of the table write operations are single word writes (2 instruction cycles) because only the table latches are written. A total of 8 programming passes, each writing 4 instruction words, are required per row. A 128-row panel requires 1024 programming cycles. Control Registers The four SFRs used to read and write the program Flash memory are: * * * * NVMCON NVMADR NVMADRU NVMKEY 6.5.1 NVMCON REGISTER The NVMCON register controls which blocks are to be erased, which memory type is to be programmed and start of the programming cycle. 6.5.2 NVMADR REGISTER The NVMADR register is used to hold the lower two bytes of the effective address. The NVMADR register captures the EA<15:0> of the last table instruction that has been executed and selects the row to write. 6.5.3 NVMADRU REGISTER The NVMADRU register is used to hold the upper byte of the effective address. The NVMADRU register captures the EA<23:16> of the last table instruction that has been executed. 6.5.4 NVMKEY REGISTER NVMKEY is a write only register that is used for write protection. To start a programming or an erase sequence, the user must consecutively write 0x55 and 0xAA to the NVMKEY register. Refer to Section 6.6 for further details. The Flash program memory is readable, writable, and erasable during normal operation over the entire VDD range. DS70083C-page 60 Advance Information 2003 Microchip Technology Inc. dsPIC30F 6.6 Programming Operations 4. A complete programming sequence is necessary for programming or erasing the internal Flash in RTSP mode. A programming operation is nominally 2 msec in duration and the processor stalls (waits) until the operation is finished. Setting the WR bit (NVMCON<15>) starts the operation, and the WR bit is automatically cleared when the operation is finished. 6.6.1 PROGRAMMING ALGORITHM FOR PROGRAM FLASH The user can erase one row of program Flash memory at a time. The user can program one block (4 instruction words) of Flash memory at a time. The general process is: 1. 2. 3. 5. Read one row of program Flash (32 instruction words) and store into data RAM as a data "image". Update the data image with the desired new data. Erase program Flash row. a) Setup NVMCON register for multi-word, program Flash, erase, and set WREN bit. b) Write address of row to be erased into NVMADRU/NVMADR. c) Write `55' to NVMKEY. d) Write `AA' to NVMKEY. e) Set the WR bit. This will begin erase cycle. f) CPU will stall for the duration of the erase cycle. g) The WR bit is cleared when erase cycle ends. EXAMPLE 6-1: 6. 7. Write four instruction words of data from data RAM into the program Flash write latches. Program 4 instruction words into program Flash. a) Setup NVMCON register for multi-word, program Flash, program, and set WREN bit. b) Write `55' to NVMKEY. c) Write `AA' to NVMKEY. d) Set the WR bit. This will begin program cycle. e) CPU will stall for duration of the program cycle. f) The WR bit is cleared by the hardware when program cycle ends. Repeat steps (4-5) seven more times to finish programming Flash row. Repeat steps 1 through 6 as needed to program desired amount of program Flash memory. 6.6.2 ERASING A ROW OF PROGRAM MEMORY Example 6-1 shows a code sequence that can be used to erase a row (32 instructions) of program memory. ERASING A ROW OF PROGRAM MEMORY ; Setup NVMCON for erase operation, multi word ; program memory selected, and writes enabled MOV #0x4041,W0 ; ; MOV W0,NVMCON ; Init pointer to row to be ERASED MOV #tblpage(PROG_ADDR),W0 ; ; MOV W0,NVMADRU MOV #tbloffset(PROG_ADDR),W0 ; MOV W0, NVMADR ; DISI #5 ; ; MOV #0x55,W0 ; MOV W0,NVMKEY MOV #0xAA,W1 ; ; MOV W1,NVMKEY BSET NVMCON,#WR ; NOP ; NOP ; 2003 Microchip Technology Inc. write Init NVMCON SFR Initialize PM Page Boundary SFR Intialize in-page EA[15:0] pointer Initialize NVMADR SFR Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted Advance Information DS70083C-page 61 dsPIC30F 6.6.3 LOADING WRITE LATCHES Example 6-2 shows a sequence of instructions that can be used to load the 96 bits of write latches. Four TBLWTL and four TBLWTH instructions are needed to load the write latches selected by the table pointer. EXAMPLE 6-2: LOADING WRITE LATCHES ; Set up a pointer to the first program memory location to be written ; program memory selected, and writes enabled MOV #0x0000,W0 ; ; Initialize PM Page Boundary SFR MOV W0,TBLPAG MOV #0x6000,W0 ; An example program memory address ; Perform the TBLWT instructions to write the latches ; 0th_program_word MOV #LOW_WORD_0,W2 ; MOV #HIGH_BYTE_0,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] ; Write PM high byte into program latch TBLWTH W3,[W0++] ; 1st_program_word MOV #LOW_WORD_1,W2 ; MOV #HIGH_BYTE_1,W3 ; ; Write PM low word into program latch TBLWTL W2,[W0] ; Write PM high byte into program latch TBLWTH W3,[W0++] ; 2nd_program_word MOV #LOW_WORD_2,W2 ; MOV #HIGH_BYTE_2,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] TBLWTH W3, [W0++] ; Write PM high byte into program latch ; 3rd_program_word MOV #LOW_WORD_3,W2 ; MOV #HIGH_BYTE_3,W3 ; ; Write PM low word into program latch TBLWTL W2, [W0] ; Write PM high byte into program latch TBLWTH W3, [W0++] Note: In Example 6-2, the contents of the upper byte of W3 has no effect. 6.6.4 INITIATING THE PROGRAMMING SEQUENCE For protection, the write initiate sequence for NVMKEY must be used to allow any erase or program operation to proceed. After the programming command has been executed, the user must wait for the programming time until programming is complete. The two instructions following the start of the programming sequence should be NOPs. EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE DISI #5 MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70083C-page 62 ; ; ; ; ; ; ; ; ; Block all interrupts with priority <7 for next 5 instructions Write the 0x55 key Write the 0xAA key Start the erase sequence Insert two NOPs after the erase command is asserted Advance Information 2003 Microchip Technology Inc. 0764 0766 NVMADRU NVMKEY -- -- -- WREN Bit 14 -- WR Bit 15 -- -- WRERR Bit 13 NVM REGISTER MAP u = uninitialized bit 0762 Legend: 0760 NVMCON Addr. NVMADR File Name TABLE 6-1: -- -- -- -- -- -- -- -- -- Bit 12 Bit 11 Bit 10 -- -- -- Bit 9 -- Bit 7 -- -- NVMADR<15:0> TWRI Bit 8 Bit 6 Bit 5 Bit 3 Bit 2 KEY<7:0> NVMADR<23:16> PROGOP<6:0> Bit 4 Bit 1 Bit 0 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu 0000 0000 0000 0000 All RESETS dsPIC30F 2003 Microchip Technology Inc. Advance Information DS70083C-page 63 dsPIC30F NOTES: DS70083C-page 64 Advance Information 2003 Microchip Technology Inc. dsPIC30F 7.0 DATA EEPROM MEMORY The Data EEPROM Memory is readable and writable during normal operation over the entire VDD range. The data EEPROM memory is directly mapped in the program memory address space. The four SFRs used to read and write the program Flash memory are used to access data EEPROM memory, as well. As described in Section 6.5, these registers are: * * * * NVMCON NVMADR NVMADRU NVMKEY The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit and rewrite the location. The address register NVMADR remains unchanged. Note: The EEPROM data memory allows read and write of single words and 16-word blocks. When interfacing to data memory, NVMADR in conjunction with the NVMADRU register are used to address the EEPROM location being accessed. TBLRDL and TBLWTL instructions are used to read and write data EEPROM. The dsPIC30F devices have up to 8 Kbytes (4K words) of data EEPROM with an address range from 0x7FF000 to 0x7FFFFE. A word write operation should be preceded by an erase of the corresponding memory location(s). The write typically requires 2 ms to complete but the write time will vary with voltage and temperature. A program or erase operation on the data EEPROM does not stop the instruction flow. The user is responsible for waiting for the appropriate duration of time before initiating another data EEPROM write/erase operation. Attempting to read the data EEPROM while a programming or erase operation is in progress results in unspecified data. 2003 Microchip Technology Inc. Control bit WR initiates write operations similar to program Flash writes. This bit cannot be cleared, only set, in software. They are cleared in hardware at the completion of the write operation. The inability to clear the WR bit in software prevents the accidental or premature termination of a write operation. 7.1 Interrupt flag bit NVMIF in the IFS0 register is set when write is complete. It must be cleared in software. Reading the Data EEPROM A TBLRD instruction reads a word at the current program word address. This example uses W0 as a pointer to data EEPROM. The result is placed in register W4 as shown in Example 7-1. EXAMPLE 7-1: MOV MOV MOV TBLRDL DATA EEPROM READ #LOW_ADDR_WORD,W0 ; Init Pointer #HIGH_ADDR_WORD,W1 W1,TBLPAG [ W0 ], W4 ; read data EEPROM Advance Information DS70083C-page 65 dsPIC30F 7.2 7.2.1 Erasing Data EEPROM ERASING A BLOCK OF DATA EEPROM In order to erase a block of data EEPROM, the NVMADRU and NVMADR registers must initially point to the block of memory to be erased. Configure NVMCON for erasing a block of data EEPROM, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in Example 7-2. EXAMPLE 7-2: DATA EEPROM BLOCK ERASE ; Select data EEPROM block, ERASE, WREN bits MOV #4045,W0 ; Initialize NVMCON SFR MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete 7.2.2 ERASING A WORD OF DATA EEPROM The TBLPAG and NVMADR registers must point to the block. Select erase a block of data Flash, and set the ERASE and WREN bits in the NVMCON register. Setting the WR bit initiates the erase as shown in Example 7-3. EXAMPLE 7-3: DATA EEPROM WORD ERASE ; Select data EEPROM word, ERASE, WREN bits MOV #4044,W0 MOV W0,NVMCON ; Start erase cycle by setting WR after writing key sequence DISI #5 ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate erase sequence NOP NOP ; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete DS70083C-page 66 Advance Information 2003 Microchip Technology Inc. dsPIC30F 7.3 Writing to the Data EEPROM To write an EEPROM data location, the following sequence must be followed: 1. 2. 3. Erase data EEPROM word. a) Select word, data EEPROM erase, and set WREN bit in NVMCON register. b) Write address of word to be erased into NVMADR. c) Enable NVM interrupt (optional). d) Write `55' to NVMKEY. e) Write `AA' to NVMKEY. f) Set the WR bit. This will begin erase cycle. g) Either poll NVMIF bit or wait for NVMIF interrupt. h) The WR bit is cleared when the erase cycle ends. Write data word into data EEPROM write latches. Program 1 data word into data EEPROM. a) Select word, data EEPROM program, and set WREN bit in NVMCON register. b) Enable NVM write done interrupt (optional). c) Write `55' to NVMKEY. d) Write `AA' to NVMKEY. e) Set the WR bit. This will begin program cycle. f) Either poll NVMIF bit or wait for NVM interrupt. g) The WR bit is cleared when the write cycle ends. EXAMPLE 7-4: The write will not initiate if the above sequence is not exactly followed (write 0x55 to NVMKEY, write 0xAA to NVMCON, then set WR bit) for each word. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in NVMCON must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code execution. The WREN bit should be kept clear at all times except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect the current write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. The WREN bit must be set on a previous instruction. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the Non-Volatile Memory Write Complete Interrupt Flag bit (NVMIF) is set. The user may either enable this interrupt or poll this bit. NVMIF must be cleared by software. 7.3.1 WRITING A WORD OF DATA EEPROM Once the user has erased the word to be programmed, then a table write instruction is used to write one write latch, as shown in Example 7-4. DATA EEPROM WORD WRITE ; Point to data memory MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1,TBLPAG MOV #LOW(WORD),W2 TBLWTL W2,[ W0] ; The NVMADR captures last table access address ; Select data EEPROM for 1 word op MOV #0x4004,W0 MOV W0,NVMCON ; Operate key to allow write operation DISI #5 ; Init pointer ; Get data ; Write data ; Block all interrupts with priority <7 for ; next 5 instructions MOV #0x55,W0 ; Write the 0x55 key MOV W0,NVMKEY MOV #0xAA,W1 ; Write the 0xAA key MOV W1,NVMKEY BSET NVMCON,#WR ; Initiate program sequence NOP NOP ; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete 2003 Microchip Technology Inc. Advance Information DS70083C-page 67 dsPIC30F 7.3.2 WRITING A BLOCK OF DATA EEPROM To write a block of data EEPROM, write to all sixteen latches first, then set the NVMCON register and program the block. EXAMPLE 7-5: DATA EEPROM BLOCK WRITE MOV MOV MOV MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV TBLWTL MOV MOV DISI #5 #LOW_ADDR_WORD,W0 #HIGH_ADDR_WORD,W1 W1,TBLPAG #data1,W2 W2,[ W0]++ #data2,W2 W2,[ W0]++ #data3,W2 W2,[ W0]++ #data4,W2 W2,[ W0]++ #data5,W2 W2,[ W0]++ #data6,W2 W2,[ W0]++ #data7,W2 W2,[ W0]++ #data8,W2 W2,[ W0]++ #data9,W2 W2,[ W0]++ #data10,W2 W2,[ W0]++ #data11,W2 W2,[ W0]++ #data12,W2 W2,[ W0]++ #data13,W2 W2,[ W0]++ #data14,W2 W2,[ W0]++ #data15,W2 W2,[ W0]++ #data16,W2 W2,[ W0]++ #0x400A,W0 W0,NVMCON MOV MOV MOV MOV BSET NOP NOP #0x55,W0 W0,NVMKEY #0xAA,W1 W1,NVMKEY NVMCON,#WR DS70083C-page 68 ; Init pointer ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Get 1st data write data Get 2nd data write data Get 3rd data write data Get 4th data write data Get 5th data write data Get 6th data write data Get 7th data write data Get 8th data write data Get 9th data write data Get 10th data write data Get 11th data write data Get 12th data write data Get 13th data write data Get 14th data write data Get 15th data write data Get 16th data write data. The NVMADR captures last table access address. Select data EEPROM for multi word op Operate Key to allow program operation Block all interrupts with priority <7 for next 5 instructions ; Write the 0x55 key ; Write the 0xAA key ; Start write cycle Advance Information 2003 Microchip Technology Inc. dsPIC30F 7.4 Write Verify 7.5 Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. Protection Against Spurious Write There are conditions when the device may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built-in. On power-up, the WREN bit is cleared; also, the Power-up Timer prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch, or software malfunction. 2003 Microchip Technology Inc. Advance Information DS70083C-page 69 dsPIC30F NOTES: DS70083C-page 70 Advance Information 2003 Microchip Technology Inc. dsPIC30F 8.0 I/O PORTS Writes to the latch, write the latch (LATx). Reads from the port (PORTx), read the port pins and writes to the port pins, write the latch (LATx). All of the device pins (except VDD, VSS, MCLR, and OSC1/CLKI) are shared between the peripherals and the parallel I/O ports. Any bit and its associated data and control registers that are not valid for a particular device will be disabled. That means the corresponding LATx and TRISx registers and the port pin will read as zeros. All I/O input ports feature Schmitt Trigger inputs for improved noise immunity. 8.1 When a pin is shared with another peripheral or function that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. An example is the INT4 pin. Parallel I/O (PIO) Ports When a peripheral is enabled and the peripheral is actively driving an associated pin, the use of the pin as a general purpose output pin is disabled. The I/O pin may be read but the output driver for the parallel port bit will be disabled. If a peripheral is enabled but the peripheral is not actively driving a pin, that pin may be driven by a port. The format of the registers for PORTA are shown in Table 8-1. The TRISA (Data Direction Control) register controls the direction of the RA<7:0> pins, as well as the INTx pins and the VREF pins. The LATA register supplies data to the outputs and is readable/writable. Reading the PORTA register yields the state of the input pins, while writing the PORTA register modifies the contents of the LATA register. All port pins have three registers directly associated with the operation of the port pin. The Data Direction register (TRISx) determines whether the pin is an input or an output. If the data direction bit is a `1', then the pin is an input. All port pins are defined as inputs after a Reset. Reads from the latch (LATx), read the latch. FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE Dedicated Port Module Read TRIS I/O Cell TRIS Latch Data Bus D WR TRIS CK Q Data Latch D WR LAT + WR Port Q I/O Pad CK Read LAT Read Port 2003 Microchip Technology Inc. Advance Information DS70083C-page 71 02C4 u = uninitialized bit Legend: LATA15 RA15 LATA Bit 14 Bit 13 Bit 12 LATA14 RA14 LATA13 RA13 LATA12 RA12 TRISA15 TRISA14 TRISA13 TRISA12 02C0 02C2 Bit 15 TRISA Addr. PORTA REGISTER MAP PORTA SFR Name TABLE 8-1: -- -- -- Bit 11 Bit 9 LATA10 RA10 LATA9 RA9 TRISA10 TRISA9 Bit 10 -- -- -- Bit 8 LATA7 RA7 TRISA7 Bit 7 LATA6 RA6 TRISA6 Bit 6 -- -- -- Bit 5 -- -- -- Bit 4 -- -- -- Bit 3 -- -- -- Bit 2 -- -- -- Bit 1 -- -- -- Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 1111 0110 1100 0000 Reset State dsPIC30F DS70083C-page 72 Advance Information 2003 Microchip Technology Inc. dsPIC30F A parallel I/O (PIO) port that shares a pin with a peripheral is, in general, subservient to the peripheral. The peripheral's output buffer data and control signals are provided to a pair of multiplexers. The multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the I/O pad cell. Figure 8-2 shows how ports are shared with other peripherals and the associated I/O cell (pad) to which they are connected. Table 8-2 through Table 8-6 show the formats of the registers for the shared ports, PORTB through PORTG. FIGURE 8-2: Note: The actual bits in use vary between devices. BLOCK DIAGRAM OF A SHARED PORT STRUCTURE Output Multiplexers Peripheral Module Peripheral Input Data Peripheral Module Enable I/O Cell Peripheral Output Enable Peripheral Output Data 1 Output Enable 0 1 PIO Module Output Data 0 Read TRIS I/O Pad Data Bus D WR TRIS Q CK TRIS Latch D WR LAT + WR Port Q CK Data Latch Read LAT Input Data Read Port 8.2 Configuring Analog Port Pins The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. When reading the Port register, all pins configured as analog input channels will read as cleared (a low level). 2003 Microchip Technology Inc. Advance Information DS70083C-page 73 Bit 11 Bit 10 DS70083C-page 74 02D0 u = uninitialized bit LATC Legend: LATC14 RC14 LATC13 RC13 -- -- Bit 10 Bit 9 Advance Information 02DE 02E0 02E2 TRISF PORTF LATF -- -- -- -- -- Bit 14 -- Bit 15 02E8 LATG LATD12 RD12 -- -- -- Bit 13 -- -- -- Bit 12 Bit 14 Bit 13 Bit 12 LATG15 RG15 LATG14 RG14 LATG13 RG13 LATG12 RG12 -- -- -- -- -- -- Bit 10 -- -- -- Bit 10 LATD10 RD10 Bit 11 -- -- -- Bit 11 LATD11 RD11 TRISG15 TRISG14 TRISG13 TRISG12 Bit 15 PORTG REGISTER MAP u = uninitialized bit 02E6 Legend: 02E4 TRISG Addr. PORTG SFR Name TABLE 8-6: LATD13 RD13 PORTF REGISTER MAP u = uninitialized bit Addr. SFR Name Legend: LATD14 RD14 u = uninitialized bit TABLE 8-5: Legend: LATD15 RD15 LATG9 RG9 Bit 8 LATG8 RG8 RB7 Bit 7 Bit 7 RF7 Bit 5 LATG7 RG7 TRISG7 Bit 7 Bit 4 LATG6 RG6 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State RB3 Bit 4 LATC3 RC3 RB2 Bit 2 Bit 2 LATC2 RC2 RB1 Bit 1 LATB1 Bit 1 LATC1 RC1 TRISC1 LATB2 TRISC2 Bit 3 TRISC3 Bit 3 LATB3 RB0 Bit 0 -- -- -- Bit 0 LATB0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 1110 0000 0001 1110 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 Bit 5 RF5 -- -- -- Bit 5 RD4 Bit 4 -- -- -- Bit 4 LATF4 RF4 RD3 Bit 3 LATG3 RG3 TRISG3 Bit 3 LATF3 RF3 RD2 Bit 2 LATF2 RF2 TRISF2 Bit 2 LATG2 RG2 RD1 Bit 1 LATF1 RF1 TRISF1 Bit 1 LATG1 RG1 RD0 Bit 0 LATF0 RF0 TRISF0 Bit 0 LATD0 LATG0 RG0 TRISG0 LATD1 TRISG1 LATD2 TRISG2 LATD3 TRISF3 LATD4 TRISF4 LATD5 RD5 0000 0000 0000 0000 0000 0000 0000 0000 1111 0011 1100 1111 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0001 1111 1111 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111 Bit 5 LATC4 RC4 RB4 LATB4 TRISC4 LATF5 TRISG6 Bit 6 LATF6 RF6 RB5 LATB5 TRISF5 LATD6 RD6 TRISD6 TRISF6 LATD7 RD7 -- -- -- Bit 5 Bit 6 Bit 6 -- -- -- RB6 LATB6 Bit 6 TRISD7 -- -- -- Bit 7 LATB7 LATF7 TRISG8 Bit 8 LATF8 RF8 Bit 6 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 Bit 7 TRISF7 LATD8 RD8 TRISD8 Bit 8 -- -- -- Bit 8 LATB8 RB8 TRISB8 Bit 8 TRISF8 TRISG9 Bit 9 -- -- -- Bit 9 LATD9 RD9 02D6 Bit 12 LATD Bit 13 -- -- -- Bit 9 02D4 Bit 14 -- -- -- Bit 10 LATB9 RB9 TRISB9 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 Bit 15 Bit 11 -- -- Bit 11 -- -- Bit 12 LATB10 RB10 TRISD Addr. Bit 13 LATB11 RB11 Bit 9 PORTD SFR Name Bit 14 PORTD REGISTER MAP LATC15 RC15 02CE TABLE 8-4: LATB12 RB12 TRISC15 TRISC14 TRISC13 02CC Bit 15 TRISC Addr. LATB13 RB13 PORTC REGISTER MAP PORTC SFR Name LATB14 RB14 u = uninitialized bit TABLE 8-3: Legend: LATB15 RB15 02CB Bit 12 LATB Bit 13 02C8 Bit 14 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 Bit 15 TRISB Addr. PORTB REGISTER MAP PORTB SFR Name TABLE 8-2: dsPIC30F 2003 Microchip Technology Inc. dsPIC30F 8.3 Input Change Notification Module The input change notification module provides the dsPIC30F devices the ability to generate interrupt requests to the processor, in response to a change of state on selected input pins. This module is capable of detecting input change of states even in Sleep mode, when the clocks are disabled. There are up to 24 external signals (CN0 through CN23) that may be selected (enabled) for generating an interrupt request on a change of state. TABLE 8-7: SFR Name INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8) Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000 CNEN2 00C2 -- -- -- -- -- -- -- -- 0000 0000 0000 0000 CNPU1 00C4 CN9PUE CN8PUE 0000 0000 0000 0000 CNPU2 00C6 -- -- 0000 0000 0000 0000 Legend: u = uninitialized bit Bit 0 Reset State TABLE 8-8: CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE -- -- -- -- -- -- INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) SFR Name Addr. CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000 CNEN2 00C2 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000 CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000 CNPU2 00C6 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000 Legend: u = uninitialized bit Bit 7 Bit 6 2003 Microchip Technology Inc. Bit 5 Bit 4 Bit 3 Bit 2 Advance Information Bit 1 DS70083C-page 75 dsPIC30F NOTES: DS70083C-page 76 Advance Information 2003 Microchip Technology Inc. dsPIC30F 9.0 TIMER1 MODULE 16-bit Timer Mode: In the 16-bit Timer mode, the timer increments on every instruction cycle up to a match value preloaded into the Period register PR1, then resets to `0' and continues to count. This section describes the 16-bit General Purpose (GP) Timer1 module and associated Operational modes. Figure 9-1 depicts the simplified block diagram of the 16-bit Timer1 module. When the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T1CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. The following sections provide a detailed description including setup and control registers, along with associated block diagrams for the Operational modes of the timers. 16-bit Synchronous Counter Mode: In the 16-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in PR1, then resets to `0' and continues. The Timer1 module is a 16-bit timer which can serve as the time counter for the real-time clock, or operate as a free-running interval timer/counter. The 16-bit timer has the following modes: * 16-bit Timer * 16-bit Synchronous Counter * 16-bit Asynchronous Counter When the CPU goes into the Idle mode, the timer will stop incrementing unless the respective TSIDL bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. Further, the following operational characteristics are supported: * Timer gate operation * Selectable prescaler settings * Timer operation during CPU Idle and Sleep modes * Interrupt on 16-bit Period register match or falling edge of external gate signal 16-bit Asynchronous Counter Mode: In the 16-bit Asynchronous Counter mode, the timer increments on every rising edge of the applied external clock signal. The timer counts up to a match value preloaded in PR1, then resets to `0' and continues. When the timer is configured for the Asynchronous mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing if TSIDL = 1. These Operating modes are determined by setting the appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1 presents a block diagram of the 16-bit timer module. FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM PR1 Equal Comparator x 16 TSYNC 1 Reset Sync TMR1 0 T1IF Event Flag 0 1 Q D Q CK TCS TGATE TGATE TGATE TON SOSCO/ T1CK 1x LPOSCEN SOSCI 2003 Microchip Technology Inc. TCKPS<1:0> 2 Gate Sync 01 TCY 00 Advance Information Prescaler 1, 8, 64, 256 DS70083C-page 77 dsPIC30F 9.1 Timer Gate Operation 9.4 The 16-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T1CK pin) is asserted high. Control bit TGATE (T1CON<6>) must be set to enable this mode. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). When the CPU goes into the Idle mode, the timer will stop incrementing unless TSIDL = 0. If TSIDL = 1, the timer will resume the incrementing sequence upon termination of the CPU Idle mode. 9.2 Timer Prescaler The input clock (FOSC/4 or external clock) to the 16-bit Timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits TCKPS<1:0> (T1CON<5:4>). The prescaler counter is cleared when any of the following occurs: * a write to the TMR1 register * clearing of the TON bit (T1CON<15>) * device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the timer prescaler cannot be reset since the prescaler clock is halted. TMR1 is not cleared when T1CON is written. It is cleared by writing to the TMR1 register. 9.3 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will operate if: * The timer module is enabled (TON = 1) and * The timer clock source is selected as external (TCS = 1) and * The TSYNC bit (T1CON<2>) is asserted to a logic `0' which defines the external clock source as asynchronous. When all three conditions are true, the timer will continue to count up to the Period register and be reset to 0x0000. When a match between the timer and the Period register occurs, an interrupt can be generated if the respective timer interrupt enable bit is asserted. Timer Interrupt The 16-bit timer has the ability to generate an interrupt on period match. When the timer count matches the Period register, the T1IF bit is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The timer interrupt flag, T1IF, is located in the IFS0 Control register in the interrupt controller. When the Gated Time Accumulation mode is enabled, an interrupt will also be generated on the falling edge of the gate signal (at the end of the accumulation cycle). Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. 9.5 Real-Time Clock Timer1, when operating in Real-Time Clock (RTC) mode, provides time of day and event time-stamping capabilities. Key operational features of the RTC are: * * * * Operation from 32 kHz LP oscillator 8-bit prescaler Low power Real-Time Clock interrupts These Operating modes are determined by setting the appropriate bit(s) in the T1CON Control register. 9.5.1 RTC OSCILLATOR OPERATION When the TON = 1, TCS = 1 and TGATE = 0, the timer increments on the rising edge of the 32 kHz LP oscillator output signal, up to the value specified in the Period register and is then reset to `0'. The TSYNC bit must be asserted to a logic `0' (Asynchronous mode) for correct operation. Enabling LPOSCEN (OSCCON<1>) will disable the normal Timer and Counter modes and enable a timer carry-out wake-up event. When the CPU enters Sleep mode, the RTC will continue to operate provided the 32 kHz external crystal oscillator is active and the control bits have not been changed. The TSIDL bit should be cleared to `0' in order for RTC to continue operation in Idle mode. 9.5.2 RTC INTERRUPTS When an interrupt event occurs, the respective interrupt flag, T1IF, is asserted and an interrupt will be generated if enabled. The T1IF bit must be cleared in software. The respective Timer interrupt flag, T1IF, is located in the IFS0 Status register in the interrupt controller. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T1IE. The timer interrupt enable bit is located in the IEC0 Control register in the interrupt controller. DS70083C-page 78 Advance Information 2003 Microchip Technology Inc. 0102 0104 u = uninitialized bit Legend: TON Bit 15 T1CON 0100 -- Bit 14 TSIDL Bit 13 -- Bit 12 TIMER1 REGISTER MAP PR1 Addr. SFR Name TMR1 TABLE 9-1: -- Bit 11 -- Bit 10 -- Bit 9 -- Bit 7 Bit 6 -- TGATE Period Register 1 Timer1 Register Bit 8 Bit 4 TCKPS1 TCKPS0 Bit 5 -- Bit 3 TSYNC Bit 2 TCS Bit 1 -- Bit 0 Reset State 0000 0000 0000 0000 1111 1111 1111 1111 uuuu uuuu uuuu uuuu dsPIC30F 2003 Microchip Technology Inc. Advance Information DS70083C-page 79 dsPIC30F NOTES: DS70083C-page 80 Advance Information 2003 Microchip Technology Inc. dsPIC30F 10.0 TIMER2/3 MODULE This section describes the 32-bit General Purpose (GP) Timer module (Timer2/3) and associated Operational modes. Figure 10-1 depicts the simplified block diagram of the 32-bit Timer2/3 module. Figure 10-2 and Figure 10-3 show Timer2/3 configured as two independent 16-bit timers, Timer2 and Timer3, respectively. The Timer2/3 module is a 32-bit timer (which can be configured as two 16-bit timers) with selectable Operating modes. These timers are utilized by other peripheral modules, such as: 16-bit Timer Mode: In the 16-bit mode, Timer2 and Timer3 can be configured as two independent 16-bit timers. Each timer can be set up in either 16-bit Timer mode or 16-bit Synchronous Counter mode. See Section 9.0, Timer1 Module for details on these two Operating modes. The only functional difference between Timer2 and Timer3 is that Timer2 provides synchronization of the clock prescaler output. This is useful for high frequency external clock inputs. * Input Capture * Output Compare/Simple PWM 32-bit Timer Mode: In the 32-bit Timer mode, the timer increments on every instruction cycle, up to a match value preloaded into the combined 32-bit Period register PR3/PR2, then resets to `0' and continues to count. The following sections provide a detailed description, including setup and control registers, along with associated block diagrams for the Operational modes of the timers. For synchronous 32-bit reads of the Timer2/Timer3 pair, reading the LS Word (TMR2 register) will cause the MS word to be read and latched into a 16-bit holding register, termed TMR3HLD. The 32-bit timer has the following modes: For synchronous 32-bit writes, the holding register (TMR3HLD) must first be written to. When followed by a write to the TMR2 register, the contents of TMR3HLD will be transferred and latched into the MSB of the 32-bit timer (TMR3). * Two independent 16-bit timers (Timer2 and Timer3) with all 16-bit Operating modes (except Asynchronous Counter mode) * Single 32-bit timer operation * Single 32-bit synchronous counter Further, the following operational characteristics are supported: * * * * * ADC event trigger Timer gate operation Selectable prescaler settings Timer operation during Idle and Sleep modes Interrupt on a 32-bit period register match These Operating modes are determined by setting the appropriate bit(s) in the 16-bit T2CON and T3CON SFRs. 32-bit Synchronous Counter Mode: In the 32-bit Synchronous Counter mode, the timer increments on the rising edge of the applied external clock signal which is synchronized with the internal phase clocks. The timer counts up to a match value preloaded in the combined 32-bit period register PR3/PR2, then resets to `0' and continues. When the timer is configured for the Synchronous Counter mode of operation and the CPU goes into the Idle mode, the timer will stop incrementing unless the TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer module logic will resume the incrementing sequence upon termination of the CPU Idle mode. For 32-bit timer/counter operation, Timer2 is the LS Word and Timer3 is the MS Word of the 32-bit timer. Note: For 32-bit timer operation, T3CON control bits are ignored. Only T2CON control bits are used for setup and control. Timer2 clock and gate inputs are utilized for the 32-bit timer module but an interrupt is generated with the Timer3 interrupt flag (T3IF) and the interrupt is enabled with the Timer3 interrupt enable bit (T3IE). 2003 Microchip Technology Inc. Advance Information DS70083C-page 81 dsPIC30F FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM Data Bus<15:0> TMR3HLD 16 16 Write TMR2 Read TMR2 16 Reset TMR3 TMR2 MSB LSB Sync ADC Event Trigger Equal Comparator x 32 PR3 PR2 0 T3IF Event Flag 1 D Q CK TGATE (T2CON<6>) TCS TGATE TGATE (T2CON<6>) Q TON T2CK Note: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer configuration bit T32 (T2CON<3>) must be set to `1' for a 32-bit timer/counter operation. All control bits are respective to the T2CON register. DS70083C-page 82 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM PR2 Equal Comparator x 16 TMR2 Sync Reset T2IF Event Flag 0 1 Q D Q CK TGATE TCS TGATE TGATE TON T2CK FIGURE 10-3: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER3 BLOCK DIAGRAM PR3 ADC Event Trigger Equal Comparator x 16 TMR3 Reset 0 1 Q D Q CK TGATE T3CK TGATE TCS TGATE T3IF Event Flag Sync TON 1x 01 TCY 2003 Microchip Technology Inc. TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 00 Advance Information DS70083C-page 83 dsPIC30F 10.1 Timer Gate Operation 10.4 The 32-bit timer can be placed in the Gated Time Accumulation mode. This mode allows the internal TCY to increment the respective timer when the gate input signal (T2CK pin) is asserted high. Control bit TGATE (T2CON<6>) must be set to enable this mode. When in this mode, Timer2 is the originating clock source. The TGATE setting is ignored for Timer3. The timer must be enabled (TON = 1) and the timer clock source set to internal (TCS = 0). The falling edge of the external signal terminates the count operation but does not reset the timer. The user must reset the timer in order to start counting from zero. 10.2 ADC Event Trigger When a match occurs between the 32-bit timer (TMR3/ TMR2) and the 32-bit combined period register (PR3/ PR2), a special ADC trigger event signal is generated by Timer3. 10.3 Timer Operation During Sleep Mode During CPU Sleep mode, the timer will not operate because the internal clocks are disabled. 10.5 Timer Interrupt The 32-bit timer module can generate an interrupt on period match or on the falling edge of the external gate signal. When the 32-bit timer count matches the respective 32-bit period register, or the falling edge of the external "gate" signal is detected, the T3IF bit (IFS0<7>) is asserted and an interrupt will be generated if enabled. In this mode, the T3IF interrupt flag is used as the source of the interrupt. The T3IF bit must be cleared in software. Enabling an interrupt is accomplished via the respective timer interrupt enable bit, T3IE (IEC0<7>). Timer Prescaler The input clock (FOSC/4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64, and 1:256, selected by control bits TCKPS<1:0> (T2CON<5:4> and T3CON<5:4>). For the 32-bit timer operation, the originating clock source is Timer2. The prescaler operation for Timer3 is not applicable in this mode. The prescaler counter is cleared when any of the following occurs: * a write to the TMR2/TMR3 register * clearing either of the TON (T2CON<15> or T3CON<15>) bits to `0' * device Reset, such as POR and BOR However, if the timer is disabled (TON = 0), then the Timer 2 prescaler cannot be reset since the prescaler clock is halted. TMR2/TMR3 is not cleared when T2CON/T3CON is written. DS70083C-page 84 Advance Information 2003 Microchip Technology Inc. 010A 010C 010E 0110 0112 u = uninitialized bit TMR3 PR2 PR3 T2CON T3CON Legend: TON 0108 TMR3HLD TON 0106 TMR2 -- -- TSIDL TSIDL Bit 13 -- -- Bit 12 -- -- Bit 11 Bit 15 SFR Name Addr. Bit 14 TIMER2/3 REGISTER MAP TABLE 10-1: Bit 9 Bit 7 Timer2 Register Bit 8 Bit 6 Bit 5 -- -- -- -- -- -- -- -- TGATE TGATE Period Register 3 Period Register 2 Timer3 Register Bit 4 TCKPS1 TCKPS0 TCKPS1 TCKPS0 Timer3 Holding Register (for 32-bit timer operations only) Bit 10 -- T32 Bit 3 -- -- Bit 2 TCS TCS Bit 1 -- -- Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu Reset State dsPIC30F 2003 Microchip Technology Inc. Advance Information DS70083C-page 85 dsPIC30F NOTES: DS70083C-page 86 Advance Information 2003 Microchip Technology Inc. dsPIC30F 11.0 TIMER4/5 MODULE The Operating modes of the Timer4/5 module are determined by setting the appropriate bit(s) in the 16-bit T4CON and T5CON SFRs. This section describes the second 32-bit General Purpose (GP) Timer module (Timer4/5) and associated Operational modes. Figure 11-1 depicts the simplified block diagram of the 32-bit Timer4/5 module. Figure 11-2 and Figure 11-3 show Timer4/5 configured as two independent 16-bit timers, Timer4 and Timer5, respectively. For 32-bit timer/counter operation, Timer4 is the LS Word and Timer5 is the MS Word of the 32-bit timer. Note: For 32-bit timer operation, T5CON control bits are ignored. Only T4CON control bits are used for setup and control. Timer4 clock and gate inputs are utilized for the 32-bit timer module but an interrupt is generated with the Timer5 interrupt flag (T5IF) and the interrupt is enabled with the Timer5 interrupt enable bit (T5IE). The Timer4/5 module is similar in operation to the Timer2/3 module. However, there are some differences which are listed below: * The Timer4/5 module does not support the ADC event trigger feature * Timer4/5 can not be utilized by other peripheral modules, such as input capture and output compare FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM Data Bus<15:0> TMR5HLD 16 16 Write TMR4 Read TMR4 16 Reset Equal TMR5 TMR4 MSB LSB Sync Comparator x 32 PR5 PR4 0 T5IF Event Flag 1 D Q CK TGATE (T4CON<6>) TCS TGATE TGATE (T4CON<6>) Q TON T4CK Note: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 Timer configuration bit T32 (T4CON<3>) must be set to `1' for a 32-bit timer/counter operation. All control bits are respective to the T4CON register. 2003 Microchip Technology Inc. Advance Information DS70083C-page 87 dsPIC30F FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM PR4 Equal Reset TMR4 Sync 0 1 Q D Q CK TGATE TCS TGATE T4IF Event Flag Comparator x 16 TGATE TON T4CK FIGURE 11-3: TCKPS<1:0> 2 1x Gate Sync 01 TCY 00 Prescaler 1, 8, 64, 256 16-BIT TIMER5 BLOCK DIAGRAM PR5 ADC Event Trigger Equal Comparator x 16 TMR5 Reset 0 1 Q D Q CK TGATE T5CK TGATE TCS TGATE T5IF Event Flag TON Sync 1x 01 TCY DS70083C-page 88 TCKPS<1:0> 2 Prescaler 1, 8, 64, 256 00 Advance Information 2003 Microchip Technology Inc. 0120 T5CON TON TON Bit 15 -- -- Bit 14 TSIDL TSIDL Bit 13 -- -- Bit 12 TIMER4/5 REGISTER MAP u = uninitialized 011E T4CON Legend: 011A 011C 0118 TMR5 PR4 0116 PR5 0114 TMR4 Addr. TMR5HLD SFR Name TABLE 11-1: -- -- Bit 11 Bit 9 Bit 7 Bit 6 Timer 4 Register Bit 8 Bit 5 -- -- -- -- -- -- -- -- TGATE TGATE Period Register 5 Period Register 4 Timer 5 Register TCKPS1 TCKPS1 Timer 5 Holding Register (for 32-bit operations only) Bit 10 TCKPS0 TCKPS0 Bit 4 -- T45 Bit 3 -- -- Bit 2 TCS TCS Bit 1 -- -- Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 1111 1111 1111 1111 1111 1111 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu Reset State dsPIC30F 2003 Microchip Technology Inc. Advance Information DS70083C-page 89 dsPIC30F NOTES: DS70083C-page 90 Advance Information 2003 Microchip Technology Inc. dsPIC30F 12.0 INPUT CAPTURE MODULE The key operational features of the input capture module are: This section describes the input capture module and associated Operational modes. The features provided by this module are useful in applications requiring frequency (period) and pulse measurement. Figure 12-1 depicts a block diagram of the input capture module. Input capture is useful for such modes as: * Simple Capture Event mode * Timer2 and Timer3 mode selection * Interrupt on input capture event These Operating modes are determined by setting the appropriate bits in the ICxCON register (where x = 1,2,...,N). The dsPIC devices contain up to 8 capture channels (i.e., the maximum value of N is 8). * Frequency/Period/Pulse Measurements * Additional Sources of External Interrupts FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM From GP Timer Module T3_CNT T2_CNT 16 1 ICx pin Prescaler 1, 4, 16 3 Edge Detection Logic Clock Synchronizer 16 0 ICTMR FIFO R/W Logic ICM<2:0> Mode Select ICxBUF ICBNE, ICOV ICI<1:0> Interrupt Logic ICxCON Data Bus Note: 12.1 Set Flag ICxIF Where `x' is shown, reference is made to the registers or bits associated to the respective input capture channels 1 through N. Simple Capture Event Mode The simple capture events in the dsPIC30F product family are: * * * * * Capture every falling edge Capture every rising edge Capture every 4th rising edge Capture every 16th rising edge Capture every rising and falling edge 12.1.1 CAPTURE PRESCALER There are four input capture prescaler settings specified by bits ICM<2:0> (ICxCON<2:0>). Whenever the capture channel is turned off, the prescaler counter will be cleared. In addition, any Reset will clear the prescaler counter. These simple Input Capture modes are configured by setting the appropriate bits ICM<2:0> (ICxCON<2:0>). 2003 Microchip Technology Inc. Advance Information DS70083C-page 91 dsPIC30F 12.1.2 CAPTURE BUFFER OPERATION Each capture channel has an associated FIFO buffer which is four 16-bit words deep. There are two status flags which provide status on the FIFO buffer: * ICBFNE - Input Capture Buffer Not Empty * ICOV - Input Capture Overflow The ICBFNE will be set on the first input capture event and remain set until all capture events have been read from the FIFO. As each word is read from the FIFO, the remaining words are advanced by one position within the buffer. In the event that the FIFO is full with four capture events and a fifth capture event occurs prior to a read of the FIFO, an overflow condition will occur and the ICOV bit will be set to a logic `1'. The fifth capture event is lost and is not stored in the FIFO. No additional events will be captured until all four events have been read from the buffer. If a FIFO read is performed after the last read and no new capture event has been received, the read will yield indeterminate results. 12.1.3 TIMER2 AND TIMER3 SELECTION MODE The input capture module consists of up to 8 input capture channels. Each channel can select between one of two timers for the time base, Timer2 or Timer3. Selection of the timer resource is accomplished through SFR bit, ICTMR (ICxCON<7>). Timer3 is the default timer resource available for the input capture module. 12.1.4 HALL SENSOR MODE When the input capture module is set for capture on every edge, rising and falling, ICM<2:0> = 001, the following operations are performed by the input capture logic: * The input capture interrupt flag is set on every edge, rising and falling. * The interrupt on Capture mode setting bits, ICI<1:0>, is ignored since every capture generates an interrupt. * A capture overflow condition is not generated in this mode. 12.2 Input Capture Operation During Sleep and Idle Modes An input capture event will generate a device wake-up or interrupt, if enabled, if the device is in CPU Idle or Sleep mode. Independent of the timer being enabled, the input capture module will wake-up from the CPU Sleep or Idle mode when a capture event occurs if ICM<2:0> = 111 and the interrupt enable bit is asserted. The same wakeup can generate an interrupt if the conditions for processing the interrupt have been satisfied. The wake-up feature is useful as a method of adding extra external pin interrupts. 12.2.1 INPUT CAPTURE IN CPU SLEEP MODE CPU Sleep mode allows input capture module operation with reduced functionality. In the CPU Sleep mode, the ICI<1:0> bits are not applicable and the input capture module can only function as an external interrupt source. The capture module must be configured for interrupt only on rising edge (ICM<2:0> = 111) in order for the input capture module to be used while the device is in Sleep mode. The prescale settings of 4:1 or 16:1 are not applicable in this mode. 12.2.2 INPUT CAPTURE IN CPU IDLE MODE CPU Idle mode allows input capture module operation with full functionality. In the CPU Idle mode, the Interrupt mode selected by the ICI<1:0> bits is applicable, as well as the 4:1 and 16:1 capture prescale settings which are defined by control bits ICM<2:0>. This mode requires the selected timer to be enabled. Moreover, the ICSIDL bit must be asserted to a logic `0'. If the input capture module is defined as ICM<2:0> = 111 in CPU Idle mode, the input capture pin will serve only as an external interrupt pin. 12.3 Input Capture Interrupts The input capture channels have the ability to generate an interrupt based upon the selected number of capture events. The selection number is set by control bits ICI<1:0> (ICxCON<6:5>). Each channel provides an interrupt flag (ICxIF) bit. The respective capture channel interrupt flag is located in the corresponding IFSx Status register. Enabling an interrupt is accomplished via the respective capture channel interrupt enable (ICxIE) bit. The capture interrupt enable bit is located in the corresponding IEC Control register. DS70083C-page 92 Advance Information 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. 0156 IC6CON Legend: -- -- -- -- -- -- -- -- Bit 15 -- -- -- -- -- -- -- -- Bit 14 ICSIDL ICSIDL ICSIDL ICSIDL ICSIDL ICSIDL ICSIDL ICSIDL Bit 13 -- -- -- -- -- -- -- -- Bit 12 -- -- -- -- -- -- -- -- Bit 11 INPUT CAPTURE REGISTER MAP u = uninitialized bit 015E 0154 IC6BUF IC8CON 0152 IC5CON 015C 0150 IC5BUF IC8BUF 014E IC4CON 015A 014C IC4BUF IC7CON 014A IC3CON 0158 0148 IC3BUF IC7BUF 0144 0146 IC2CON IC1CON IC2BUF 0140 0142 IC1BUF Addr. SFR Name TABLE 12-1: -- -- -- -- -- -- -- -- Bit 10 -- -- -- -- -- -- -- -- Bit 8 Bit 7 ICTMR ICTMR ICTMR ICTMR ICTMR ICTMR ICTMR -- ICTMR Input 8 Capture Register -- Input 7 Capture Register -- Input 6 Capture Register -- Input 5 Capture Register -- Input 4 Capture Register -- Input 3 Capture Register -- Input 2 Capture Register -- Input 1 Capture Register Bit 9 Bit 5 ICI<1:0> ICI<1:0> ICI<1:0> ICI<1:0> ICI<1:0> ICI<1:0> ICI<1:0> ICI<1:0> Bit 6 ICOV ICOV ICOV ICOV ICOV ICOV ICOV ICOV Bit 4 ICBNE ICBNE ICBNE ICBNE ICBNE ICBNE ICBNE ICBNE Bit 3 Bit 2 ICM<2:0> ICM<2:0> ICM<2:0> ICM<2:0> ICM<2:0> ICM<2:0> ICM<2:0> ICM<2:0> Bit 1 Bit 0 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu Reset State dsPIC30F Advance Information DS70083C-page 93 dsPIC30F NOTES: DS70083C-page 94 Advance Information 2003 Microchip Technology Inc. dsPIC30F 13.0 OUTPUT COMPARE MODULE This section describes the output compare module and associated Operational modes. The features provided by this module are useful in applications requiring Operational modes, such as: * Generation of Variable Width Output Pulses * Power Factor Correction These Operating modes are determined by setting the appropriate bits in the 16-bit OCxCON SFR (where x = 1,2,3,...,N). The dsPIC devices contain up to 8 compare channels (i.e., the maximum value of N is 8). OCxRS and OCxR in Figure 13-1 represent the Dual Compare registers. In the Dual Compare mode, the OCxR register is used for the first compare and OCxRS is used for the second compare. Figure 13-1 depicts a block diagram of the output compare module. The key operational features of the output compare module include: * * * * * * Timer2 and Timer3 Selection mode Simple Output Compare Match mode Dual Output Compare Match mode Simple PWM mode Output Compare During Sleep and Idle modes Interrupt on Output Compare/PWM Event FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM Set Flag bit OCxIF OCxRS Output Logic OCxR 3 1 OCTSEL 0 1 Note: OCx OCFA (for x = 1, 2, 3 or 4) or OCFB (for x = 5, 6, 7 or 8) From GP Timer Module TMR2<15:0 Output Enable OCM<2:0> Mode Select Comparator 0 S Q R TMR3<15:0> T2P2_MATCH T3P3_MATCH Where `x' is shown, reference is made to the registers associated with the respective output compare channels 1 through N. 2003 Microchip Technology Inc. Advance Information DS70083C-page 95 dsPIC30F 13.1 Timer2 and Timer3 Selection Mode Each output compare channel can select between one of two 16-bit timers, Timer2 or Timer3. The selection of the timers is controlled by the OCTSEL bit (OCxCON<3>). Timer2 is the default timer resource for the output compare module. 13.2 Simple Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 001, 010 or 011, the selected output compare channel is configured for one of three simple Output Compare Match modes: * Compare forces I/O pin low * Compare forces I/O pin high * Compare toggles I/O pin Dual Output Compare Match Mode When control bits OCM<2:0> (OCxCON<2:0>) = 100 or 101, the selected output compare channel is configured for one of two Dual Output Compare modes, which are: * Single Output Pulse mode * Continuous Output Pulse mode 13.3.1 * Determine instruction cycle time TCY. * Calculate desired pulse width value based on TCY. * Calculate time to start pulse from timer start value of 0x0000. * Write pulse width start and stop times into OCxR and OCxRS Compare registers (x denotes channel 1, 2, ...,N). * Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. * Set OCM<2:0> = 100. * Enable timer, TON (TxCON<15>) = 1. To initiate another single pulse, issue another write to set OCM<2:0> = 100. Simple PWM Mode When control bits OCM<2:0> (OCxCON<2:0>) = 110 or 111, the selected output compare channel is configured for the PWM mode of operation. When configured for the PWM mode of operation, OCxR is the main latch (read only) and OCxRS is the secondary latch. This enables glitchless PWM transitions. The user must perform the following steps in order to configure the output compare module for PWM operation: 1. 2. 4. For the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): DS70083C-page 96 * Determine instruction cycle time TCY. * Calculate desired pulse value based on TCY. * Calculate timer to start pulse width from timer start value of 0x0000. * Write pulse width start and stop times into OCxR and OCxRS (x denotes channel 1, 2, ...,N) Compare registers, respectively. * Set Timer Period register to value equal to, or greater than value in OCxRS Compare register. * Set OCM<2:0> = 101. * Enable timer, TON (TxCON<15>) = 1. 3. SINGLE PULSE MODE CONTINUOUS PULSE MODE For the user to configure the module for the generation of a continuous stream of output pulses, the following steps are required: 13.4 The OCxR register is used in these modes. The OCxR register is loaded with a value and is compared to the selected incrementing timer count. When a compare occurs, one of these Compare Match modes occurs. If the counter resets to zero before reaching the value in OCxR, the state of the OCx pin remains unchanged. 13.3 13.3.2 Set the PWM period by writing to the appropriate period register. Set the PWM duty cycle by writing to the OCxRS register. Configure the output compare module for PWM operation. Set the TMRx prescale value and enable the Timer, TON (TxCON<15>) = 1. 13.4.1 INPUT PIN FAULT PROTECTION FOR PWM When control bits OCM<2:0> (OCxCON<2:0>) = 111, the selected output compare channel is again configured for the PWM mode of operation with the additional feature of input FAULT protection. While in this mode, if a logic `0' is detected on the OCFA/B pin, the respective PWM output pin is placed in the high impedance input state. The OCFLT bit (OCxCON<4>) indicates whether a FAULT condition has occurred. This state will be maintained until both of the following events have occurred: * The external FAULT condition has been removed. * The PWM mode has been re-enabled by writing to the appropriate control bits. Advance Information 2003 Microchip Technology Inc. dsPIC30F 13.4.2 PWM PERIOD When the selected TMRx is equal to its respective period register, PRx, the following four events occur on the next increment cycle: The PWM period is specified by writing to the PRx register. The PWM period can be calculated using Equation 13-1. * TMRx is cleared. * The OCx pin is set. - Exception 1: If PWM duty cycle is 0x0000, the OCx pin will remain low. - Exception 2: If duty cycle is greater than PRx, the pin will remain high. * The PWM duty cycle is latched from OCxRS into OCxR. * The corresponding timer interrupt flag is set. EQUATION 13-1: PWM period = [(PRx) + 1] * 4 * TOSC * (TMRx prescale value) PWM frequency is defined as 1 / [PWM period]. See Figure 13-2 for key PWM period comparisons. Timer3 is referred to in Figure 13-2 for clarity. FIGURE 13-2: PWM OUTPUT TIMING Period Duty Cycle TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = PR3 T3IF = 1 (Interrupt Flag) OCxR = OCxRS TMR3 = Duty Cycle (OCxR) 13.5 Output Compare Operation During CPU Sleep Mode When the CPU enters Sleep mode, all internal clocks are stopped. Therefore, when the CPU enters the Sleep state, the output compare channel will drive the pin to the active state that was observed prior to entering the CPU Sleep state. For example, if the pin was high when the CPU entered the Sleep state, the pin will remain high. Likewise, if the pin was low when the CPU entered the Sleep state, the pin will remain low. In either case, the output compare module will resume operation when the device wakes up. 13.6 Output Compare Operation During CPU Idle Mode When the CPU enters the Idle mode, the output compare module can operate with full functionality. The output compare channel will operate during the CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at logic `0' and the selected time base (Timer2 or Timer3) is enabled and the TSIDL bit of the selected timer is set to logic `0'. 2003 Microchip Technology Inc. TMR3 = Duty Cycle (OCxR) 13.7 Output Compare Interrupts The output compare channels have the ability to generate an interrupt on a compare match, for whichever Match mode has been selected. For all modes except the PWM mode, when a compare event occurs, the respective interrupt flag (OCxIF) is asserted and an interrupt will be generated if enabled. The OCxIF bit is located in the corresponding IFS Status register and must be cleared in software. The interrupt is enabled via the respective compare interrupt enable (OCxIE) bit located in the corresponding IEC Control register. For the PWM mode, when an event occurs, the respective timer interrupt flag (T2IF or T3IF) is asserted and an interrupt will be generated if enabled. The IF bit is located in the IFS0 Status register and must be cleared in software. The interrupt is enabled via the respective timer interrupt enable bit (T2IE or T3IE) located in the IEC0 Control register. The output compare interrupt flag is never set during the PWM mode of operation. Advance Information DS70083C-page 97 0184 0186 0188 018A 018C 018E 0190 0192 0194 0196 OC2RS OC2R OC2CON OC3RS OC3R OC3CON DS70083C-page 98 OC4RS OC4R OC4CON 019A 019C 019E 01A0 01A2 01A4 01A6 01A8 01AA 01AC 01AE u = uninitialized bit OC5R OC5CON OC6RS OC6R OC6CON OC7RS OC7R OC7CON OC8RS OC8R OC8CON Legend: -- -- -- 0198 OC5RS -- -- -- -- -- 0182 -- -- -- -- -- -- -- -- OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL OCSIDL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 10 OC1CON Bit 11 OC1R Bit 12 0180 Bit 13 Bit 15 Addr. SFR Name OC1RS Bit 14 OUTPUT COMPARE REGISTER MAP TABLE 13-1: Bit 8 Bit 7 Bit 6 -- -- -- Output Compare 1 Main Register -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Advance Information -- -- -- -- Output Compare 8 Main Register Output Compare 8 Secondary Register -- Output Compare 7 Main Register Output Compare 7 Secondary Register -- Output Compare 6 Main Register Output Compare 6 Secondary Register -- Output Compare 5 Main Register Output Compare 5 Secondary Register -- Output Compare 4 Main Register Output Compare 4 Secondary Register -- Output Compare 3 Main Register Output Compare 3 Secondary Register -- Output Compare 2 Main Register Output Compare 2 Secondary Register -- -- -- -- -- -- -- -- -- Bit 5 Output Compare 1 Secondary Register Bit 9 OCFLT OCFLT OCFLT OCFLT OCFLT OCFLT OCFLT OCFLT Bit 4 OCTSEL OCTSEL OCTSEL OCTSEL OCTSEL OCTSEL OCTSE OCTSEL Bit 3 Bit 2 OCM<2:0> OCM<2:0> OCM<2:0> OCM<2:0> OCM<2:0> OCM<2:0> OCM<2:0> OCM<2:0> Bit 1 Bit 0 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 dsPIC30F 2003 Microchip Technology Inc. dsPIC30F 14.0 SPI MODULE The Serial Peripheral Interface (SPI) module is a synchronous serial interface. It is useful for communicating with other peripheral devices, such as EEPROMs, shift registers, display drivers and A/D converters, or other microcontrollers. It is compatible with Motorola's SPITM and SIOP interfaces. 14.1 Operating Function Description Each SPI module consists of a 16-bit shift register, SPIxSR (where x = 1 or 2), used for shifting data in and out, and a buffer register, SPIxBUF. A control register, SPIxCON, configures the module. Additionally, a status register, SPIxSTAT, indicates various status conditions. The serial interface consists of 4 pins: SDIx (serial data input), SDOx (serial data output), SCKx (shift clock input or output), and SSx (active low slave select). In Master mode operation, SCK is a clock output but in Slave mode, it is a clock input. A series of eight (8) or sixteen (16) clock pulses shift out bits from the SPIxSR to SDOx pin and simultaneously shift in data from SDIx pin. An interrupt is generated when the transfer is complete and the corresponding interrupt flag bit (SPI1IF or SPI2IF) is set. This interrupt can be disabled through an interrupt enable bit (SPI1IE or SPI2IE). The receive operation is double-buffered. When a complete byte is received, it is transferred from SPIxSR to SPIxBUF. If the receive buffer is full when new data is being transferred from SPIxSR to SPIxBUF, the module will set the SPIROV bit indicating an overflow condition. The transfer of the data from SPIxSR to SPIxBUF will not be completed and the new data will be lost. The module will not respond to SCL transitions while SPIROV is `1', effectively disabling the module until SPIxBUF is read by user software. Transmit writes are also double-buffered. The user writes to SPIxBUF. When the master or slave transfer is completed, the contents of the shift register (SPIxSR) are moved to the receive buffer. If any transmit data has been written to the buffer register, the contents of the transmit buffer are moved to SPIxSR. The received data is thus placed in SPIxBUF and the transmit data in SPIxSR is ready for the next transfer. Note: Both the transmit buffer (SPIxTXB) and the receive buffer (SPIxRXB) are mapped to the same register address, SPIxBUF. In Slave mode, data is transmitted and received as external clock pulses appear on SCK. Again, the interrupt is generated when the last bit is latched. If SSx control is enabled, then transmission and reception are enabled only when SSx = low. The SDOx output will be disabled in SSx mode with SSx high. The clock provided to the module is (FOSC/4). This clock is then prescaled by the primary (PPRE<1:0>) and the secondary (SPRE<2:0>) prescale factors. The CKE bit determines whether transmit occurs on transition from active clock state to Idle clock state, or vice versa. The CKP bit selects the Idle state (high or low) for the clock. 14.1.1 WORD AND BYTE COMMUNICATION A control bit, MODE16 (SPIxCON<10>), allows the module to communicate in either 16-bit or 8-bit mode. 16-bit operation is identical to 8-bit operation except that the number of bits transmitted is 16 instead of 8. The user software must disable the module prior to changing the MODE16 bit. The SPI module is reset when the MODE16 bit is changed by the user. A basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the SPIxSR for 8-bit operation, and data is transmitted out of bit15 of the SPIxSR for 16-bit operation. In both modes, data is shifted into bit 0 of the SPIxSR. 14.1.2 SDOx DISABLE A control bit, DISSDO, is provided to the SPIxCON register to allow the SDOx output to be disabled. This will allow the SPI module to be connected in an input only configuration. SDO can also be used for general purpose I/O. 14.2 Framed SPI Support The module supports a basic framed SPI protocol in Master or Slave mode. The control bit FRMEN enables framed SPI support and causes the SSx pin to perform the frame synchronization pulse (FSYNC) function. The control bit SPIFSD determines whether the SSx pin is an input or an output (i.e., whether the module receives or generates the frame synchronization pulse). The frame pulse is an active high pulse for a single SPI clock cycle. When frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the SPI clock. In Master mode, the clock is generated by prescaling the system clock. Data is transmitted as soon as a value is written to SPIxBUF. The interrupt is generated at the middle of the transfer of the last bit. 2003 Microchip Technology Inc. Advance Information DS70083C-page 99 dsPIC30F FIGURE 14-1: SPI BLOCK DIAGRAM Internal Data Bus Read Write SPIxBUF SPIxBUF Receive Transmit SPIxSR SDIx bit 0 SDOx SSx Shift Clock Clock Control SS & FSYNC Control Edge Select Secondary Prescaler 1,2,4,6,8 SCKx Primary Prescaler 1, 4, 16, 64 FOSC Enable Master Clock Note: x = 1 or 2. FIGURE 14-2: SPI MASTER/SLAVE CONNECTION SPI Master SPI Slave SDOx SDIy Serial Input Buffer (SPIxBUF) SDIx Shift Register (SPIxSR) MSb Serial Input Buffer (SPIyBUF) SDOy LSb Shift Register (SPIySR) MSb SCKx Serial Clock LSb SCKy PROCESSOR 1 PROCESSOR 2 Note: x = 1 or 2, y = 1 or 2. DS70083C-page 100 Advance Information 2003 Microchip Technology Inc. dsPIC30F 14.3 Slave Select Synchronization The SSx pin allows a Synchronous Slave mode. The SPI must be configured in SPI Slave mode with SSx pin control enabled (SSEN = 1). When the SSx pin is low, transmission and reception are enabled and the SDOx pin is driven. When SSx pin goes high, the SDOx pin is no longer driven. Also, the SPI module is resynchronized, and all counters/control circuitry are reset. Therefore, when the SSx pin is asserted low again, transmission/reception will begin at the MS bit even if SSx had been de-asserted in the middle of a transmit/receive. 14.4 14.5 SPI Operation During CPU Idle Mode When the device enters Idle mode, all clock sources remain functional. The SPISIDL bit (SPIxSTAT<13>) selects if the SPI module will stop or continue on Idle. If SPISIDL = 0, the module will continue to operate when the CPU enters Idle mode. If SPISIDL = 1, the module will stop when the CPU enters Idle mode. SPI Operation During CPU Sleep Mode During Sleep mode, the SPI module is shutdown. If the CPU enters Sleep mode while an SPI transaction is in progress, then the transmission and reception is aborted. The transmitter and receiver will stop in Sleep mode. However, register contents are not affected by entering or exiting Sleep mode. 2003 Microchip Technology Inc. Advance Information DS70083C-page 101 DS70083C-page 102 u = uninitialized bit Legend: 0228 022A SPI2CON SPI2BUF SPIFSD SPISIDL Bit 13 -- -- Bit 12 -- FRMEN -- Bit 14 SPIEN Bit 15 SPIFSD SPISIDL Bit 13 -- -- Bit 12 SPI2 REGISTER MAP u = uninitialized bit 0226 Legend: Addr. SFR Name SPI2STAT TABLE 14-2: 0224 SPI1BUF -- FRMEN -- 0222 SPIEN 0220 SPI1STAT Bit 14 SPI1CON Bit 15 Addr. SPI1 REGISTER MAP SFR Name TABLE 14-1: -- Bit 10 -- Bit 10 DISSDO MODE16 -- Bit 11 DISSDO MODE16 -- Bit 11 CKE -- Bit 8 SSEN -- Bit 7 CKP SPIROV Bit 6 CKE -- Bit 8 SSEN -- Bit 7 Bit 6 CKP SPIROV Transmit and Receive Buffer SMP -- Bit 9 Transmit and Receive Buffer SMP -- Bit 9 MSTEN -- Bit 5 MSTEN -- Bit 5 SPRE2 -- Bit 4 SPRE2 -- Bit 4 SPRE1 -- Bit 3 SPRE1 -- Bit 3 SPRE0 -- Bit 2 SPRE0 -- Bit 2 PPRE1 SPITBF Bit 1 PPRE1 SPITBF Bit 1 Reset State PPRE0 SPIRBF Bit 0 PPRE0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 Reset State 0000 0000 0000 0000 0000 0000 0000 0000 SPIRBF 0000 0000 0000 0000 Bit 0 dsPIC30F Advance Information 2003 Microchip Technology Inc. dsPIC30F 15.0 I2C MODULE 15.1 The Inter-Integrated Circuit (I2CTM) module provides complete hardware support for both Slave and MultiMaster modes of the I2C serial communication standard, with a 16-bit interface. This module offers the following key features: * I2C interface supporting both master and slave operation. * I2C Slave mode supports 7 and 10-bit address. * I2C Master mode supports 7 and 10-bit address. * I2C port allows bidirectional transfers between master and slaves. * Serial clock synchronization for I2C port can be used as a handshake mechanism to suspend and resume serial transfer (SCLREL control). * I2C supports multi-master operation; detects bus collision and will arbitrate accordingly. FIGURE 15-1: Operating Function Description The hardware fully implements all the master and slave functions of the I2C Standard and Fast mode specifications, as well as 7 and 10-bit addressing. Thus, the I2C module can operate either as a slave or a master on an I2C bus. 15.1.1 VARIOUS I2C MODES The following types of I2C operation are supported: * * * I2C slave operation with 7-bit address I2C slave operation with 10-bit address I2C master operation with 7 or 10-bit address See the I2C programmer's model in Figure 15-1. PROGRAMMER'S MODEL I2CRCV (8 bits) Bit 7 Bit 0 Bit 7 Bit 0 I2CTRN (8 bits) I2CBRG (9 bits) Bit 8 Bit 0 I2CCON (16 bits) Bit 15 Bit 0 Bit 15 Bit 0 I2CSTAT (16 bits) I2CADD (10 bits) Bit 9 15.1.2 PIN CONFIGURATION IN I2C MODE I 2C has a 2-pin interface: the SCL pin is clock and the SDA pin is data. 15.1.3 I2C REGISTERS I2CCON and I2CSTAT are control and status registers, respectively. The I2CCON register is readable and writable. The lower 6 bits of I2CSTAT are read only. The remaining bits of the I2CSTAT are read/write. Bit 0 The I2CADD register holds the slave address. A status bit, ADD10, indicates 10-bit Address mode. The I2CBRG acts as the baud rate generator reload value. In receive operations, I2CRSR and I2CRCV together form a double-buffered receiver. When I2CRSR receives a complete byte, it is transferred to I2CRCV and an interrupt pulse is generated. During transmission, the I2CTRN is not double-buffered. Note: I2CRSR is the shift register used for shifting data, whereas I2CRCV is the buffer register to which data bytes are written, or from which data bytes are read. I2CRCV is the receive buffer as shown in Figure 15-1. I2CTRN is the transmit register to which bytes are written during a transmit operation, as shown in Figure 15-2. 2003 Microchip Technology Inc. Advance Information Following a RESTART condition in 10-bit mode, the user only needs to match the first 7-bit address. DS70083C-page 103 dsPIC30F FIGURE 15-2: I2C BLOCK DIAGRAM Internal Data Bus I2CRCV Read SCL Shift Clock I2CRSR LSB SDA Addr_Match Match Detect Write I2CADD Read Start and Stop bit Detect I2CSTAT Write Control Logic Start, RESTART, Stop bit Generate Write I2CCON Collision Detect Acknowledge Generation Clock Stretching Read Read Write I2CTRN LSB Shift Clock Read Reload Control BRG Down Counter DS70083C-page 104 Write I2CBRG FOSC Advance Information Read 2003 Microchip Technology Inc. dsPIC30F 15.2 I2C Module Addresses Note: The I2CRCV will be loaded if the I2COV bit = 1 and the RBF flag = 0. In this case, a read of the I2CRCV was performed but the user did not clear the state of the I2COV bit before the next receive occurred. The Acknowledgement is not sent (ACK = 1) and the I2CRCV is updated. The I2CADD register contains the Slave mode addresses. The register is a 10-bit register. If the A10M bit (I2CCON<10>) is `0', the address is interpreted by the module as a 7-bit address. When an address is received, it is compared to the 7 LS bits of the I2CADD register. If the A10M bit is `1', the address is assumed to be a 10-bit address. When an address is received, it will be compared with the binary value `11110 A9 A8' (where A9 and A8 are two Most Significant bits of I2CADD). If that value matches, the next address will be compared with the Least Significant 8 bits of I2CADD, as specified in the 10-bit addressing protocol. 15.3 I2C 7-bit Slave Mode Operation Once enabled (I2CEN = 1), the slave module will wait for a Start bit to occur (i.e., the I2C module is `Idle'). Following the detection of a Start bit, 8 bits are shifted into I2CRSR and the address is compared against I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0> are compared against I2CRSR<7:1> and I2CRSR<0> is the R_W bit. All incoming bits are sampled on the rising edge of SCL. If an address match occurs, an Acknowledgement will be sent, and the slave event interrupt flag (SI2CIF) is set on the falling edge of the ninth (ACK) bit. The address match does not affect the contents of the I2CRCV buffer or the RBF bit. 15.3.1 SLAVE TRANSMISSION If the R_W bit received is a `1', then the serial port will go into Transmit mode. It will send ACK on the ninth bit and then hold SCL to `0' until the CPU responds by writing to I2CTRN. SCL is released by setting the SCLREL bit, and 8 bits of data are shifted out. Data bits are shifted out on the falling edge of SCL, such that SDA is valid during SCL high. The interrupt pulse is sent on the falling edge of the ninth clock pulse, regardless of the status of the ACK received from the master. 15.3.2 SLAVE RECEPTION If the R_W bit received is a `0' during an address match, then Receive mode is initiated. Incoming bits are sampled on the rising edge of SCL. After 8 bits are received, if I2CRCV is not full or I2COV is not set, I2CRSR is transferred to I2CRCV. ACK is sent on the ninth clock. If the RBF flag is set, indicating that I2CRCV is still holding data from a previous operation (RBF = 1), then ACK is not sent; however, the interrupt pulse is generated. In the case of an overflow, the contents of the I2CRSR are not loaded into the I2CRCV. 2003 Microchip Technology Inc. 15.4 I2C 10-bit Slave Mode Operation In 10-bit mode, the basic receive and transmit operations are the same as in the 7-bit mode. However, the criteria for address match is more complex. The I2C specification dictates that a slave must be addressed for a write operation with two address bytes following a Start bit. The A10M bit is a control bit that signifies that the address in I2CADD is a 10-bit address rather than a 7-bit address. The address detection protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. I2CADD holds the entire 10-bit address. Upon receiving an address following a Start bit, I2CRSR <7:3> is compared against a literal `11110' (the default 10-bit address) and I2CRSR<2:1> are compared against I2CADD<9:8>. If a match occurs and if R_W = 0, the interrupt pulse is sent. The ADD10 bit will be cleared to indicate a partial address match. If a match fails or R_W = 1, the ADD10 bit is cleared and the module returns to the Idle state. The low byte of the address is then received and compared with I2CADD<7:0>. If an address match occurs, the interrupt pulse is generated and the ADD10 bit is set, indicating a complete 10-bit address match. If an address match did not occur, the ADD10 bit is cleared and the module returns to the Idle state. 15.4.1 10-BIT MODE SLAVE TRANSMISSION Once a slave is addressed in this fashion with the full 10-bit address (we will refer to this state as "PRIOR_ADDR_MATCH"), the master can begin sending data bytes for a slave reception operation. 15.4.2 10-BIT MODE SLAVE RECEPTION Once addressed, the master can generate a Repeated Start, reset the high byte of the address and set the R_W bit without generating a Stop bit, thus initiating a slave transmit operation. Advance Information DS70083C-page 105 dsPIC30F 15.5 Automatic Clock Stretch In the Slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 15.5.1 TRANSMIT CLOCK STRETCHING Note 1: If the user reads the contents of the I2CRCV, clearing the RBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software regardless of the state of the RBF bit. The user should be careful to clear the RBF bit in the ISR before the next receive sequence in order to prevent an overflow condition. Both 10-bit and 7-bit Transmit modes implement clock stretching by asserting the SCLREL bit after the falling edge of the ninth clock, if the TBF bit is cleared, indicating the buffer is empty. In Slave Transmit modes, clock stretching is always performed irrespective of the STREN bit. Clock synchronization takes place following the ninth clock of the transmit sequence. If the device samples an ACK on the falling edge of the ninth clock and if the TBF bit is still clear, then the SCLREL bit is automatically cleared. The SCLREL being cleared to `0' will assert the SCL line low. The user's ISR must set the SCLREL bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the I2CTRN before the master device can initiate another transmit sequence. Note 1: If the user loads the contents of I2CTRN, setting the TBF bit before the falling edge of the ninth clock, the SCLREL bit will not be cleared and clock stretching will not occur. 2: The SCLREL bit can be set in software, regardless of the state of the TBF bit. 15.5.2 RECEIVE CLOCK STRETCHING The STREN bit in the I2CCON register can be used to enable clock stretching in Slave Receive mode. When the STREN bit is set, the SCL pin will be held low at the end of each data receive sequence. 15.5.3 CLOCK STRETCHING DURING 7-BIT ADDRESSING (STREN = 1) When the STREN bit is set in Slave Receive mode, the SCL line is held low when the buffer register is full. The method for stretching the SCL output is the same for both 7 and 10-bit Addressing modes. Clock stretching takes place following the ninth clock of the receive sequence. On the falling edge of the ninth clock at the end of the ACK sequence, if the RBF bit is set, the SCLREL bit is automatically cleared, forcing the SCL output to be held low. The user's ISR must set the SCLREL bit before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the I2CRCV before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring. DS70083C-page 106 15.5.4 CLOCK STRETCHING DURING 10-BIT ADDRESSING (STREN = 1) Clock stretching takes place automatically during the addressing sequence. Because this module has a register for the entire address, it is not necessary for the protocol to wait for the address to be updated. After the address phase is complete, clock stretching will occur on each data receive or transmit sequence as was described earlier. 15.6 Software Controlled Clock Stretching (STREN = 1) When the STREN bit is `1', the SCLREL bit may be cleared by software to allow software to control the clock stretching. The logic will synchronize writes to the SCLREL bit with the SCL clock. Clearing the SCLREL bit will not assert the SCL output until the module detects a falling edge on the SCL output and SCL is sampled low. If the SCLREL bit is cleared by the user while the SCL line has been sampled low, the SCL output will be asserted (held low). The SCL output will remain low until the SCLREL bit is set, and all other devices on the I2C bus have de-asserted SCL. This ensures that a write to the SCLREL bit will not violate the minimum high time requirement for SCL. If the STREN bit is `0', a software write to the SCLREL bit will be disregarded and have no effect on the SCLREL bit. 15.7 Interrupts The I2C module generates two interrupt flags, MI2CIF (I2C Master Interrupt Flag) and SI2CIF (I2C Slave Interrupt Flag). The MI2CIF interrupt flag is activated on completion of a master message event. The SI2CIF interrupt flag is activated on detection of a message directed to the slave. Advance Information 2003 Microchip Technology Inc. dsPIC30F 15.8 15.12 I2C Master Operation Slope Control The I2C standard requires slope control on the SDA and SCL signals for Fast mode (400 kHz). The control bit, DISSLW, enables the user to disable slew rate control if desired. It is necessary to disable the slew rate control for 1 MHz mode. The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. 15.9 In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic `0'. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an ACK bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. IPMI Support The control bit, IPMIEN, enables the module to support Intelligent Peripheral Management Interface (IPMI). When this bit is set, the module accepts and acts upon all addresses. 15.10 General Call Address Support The general call address can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledgement. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all `0's with R_W = 0. The general call address is recognized when the General Call Enable (GCEN) bit is set (I2CCON<15> = 1). Following a Start bit detection, 8 bits are shifted into I2CRSR and the address is compared with I2CADD, and is also compared with the general call address which is fixed in hardware. If a general call address match occurs, the I2CRSR is transferred to the I2CRCV after the eighth clock, the RBF flag is set and on the falling edge of the ninth bit (ACK bit), the master event interrupt flag (MI2CIF) is set. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the data direction bit. In this case, the data direction bit (R_W) is logic `1'. Thus, the first byte transmitted is a 7-bit slave address, followed by a `1' to indicate receive bit. Serial data is received via SDA while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an ACK bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. 15.12.1 I2C MASTER TRANSMISSION 15.11 I2C Master Support Transmission of a data byte, a 7-bit address, or the second half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should only write to I2CTRN when the module is in a WAIT state. This action will set the Buffer Full Flag (TBF) and allow the baud rate generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted. The Transmit Status Flag, TRSTAT (I2CSTAT<14>), indicates that a master transmit is in progress. As a master device, six operations are supported: 15.12.2 * Assert a Start condition on SDA and SCL. * Assert a RESTART condition on SDA and SCL. * Write to the I2CTRN register initiating transmission of data/address. * Generate a Stop condition on SDA and SCL. * Configure the I2C port to receive data. * Generate an ACK condition at the end of a received byte of data. Master mode reception is enabled by programming the Receive Enable bit, RCEN (I2CCON<11>). The I2C module must be Idle before the RCEN bit is set, otherwise the RCEN bit will be disregarded. The baud rate generator begins counting and on each rollover, the state of the SCL pin ACK and data are shifted into the I2CRSR on the rising edge of each clock. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the I2CRCV to determine if the address was device specific or a general call address. 2003 Microchip Technology Inc. Advance Information I2C MASTER RECEPTION DS70083C-page 107 dsPIC30F 15.12.3 BAUD RATE GENERATOR 2 In I C Master mode, the reload value for the BRG is located in the I2CBRG register. When the BRG is loaded with this value, the BRG counts down to `0' and stops until another reload has taken place. If clock arbitration is taking place, for instance, the BRG is reloaded when the SCL pin is sampled high. As per the I2C standard, FSCK may be 100 kHz or 400 kHz. However, the user can specify any baud rate up to 1 MHz. I2CBRG values of `0' or `1' are illegal. EQUATION 15-1: SERIAL CLOCK RATE FSCK = FCY / I2CBRG 15.12.4 CLOCK ARBITRATION Clock arbitration occurs when the master de-asserts the SCL pin (SCL allowed to float high) during any receive, transmit, or RESTART/Stop condition. When the SCL pin is allowed to float high, the baud rate generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the baud rate generator is reloaded with the contents of I2CBRG and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device. 15.12.5 MULTI-MASTER COMMUNICATION, BUS COLLISION, AND BUS ARBITRATION Multi-master operation support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a `1' on SDA by letting SDA float high while another master asserts a `0'. When the SCL pin floats high, data should be stable. If the expected data on SDA is a `1' and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the MI2CIF pulse and reset the master portion of the I2C port to its Idle state. If a Start, RESTART, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted, and the respective control bits in the I2CCON register are cleared to `0'. When the user services the bus collision Interrupt Service Routine, and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins, and if a Stop condition occurs, the MI2CIF bit will be set. A write to the I2CTRN will start the transmission of data at the first data bit regardless of where the transmitter left off when bus collision occurred. In a multi-master environment, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the I2CSTAT register, or the bus is Idle and the S and P bits are cleared. 15.13 I2C Module Operation During CPU Sleep and Idle Modes 15.13.1 I2C OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic `0'. If Sleep occurs in the middle of a transmission and the state machine is partially into a transmission as the clocks stop, then the transmission is aborted. Similarly, if Sleep occurs in the middle of a reception, then the reception is aborted. 15.13.2 I2C OPERATION DURING CPU IDLE MODE For the I2C, the I2CSIDL bit selects if the module will stop on Idle or continue on Idle. If I2CSIDL = 0, the module will continue operation on assertion of the Idle mode. If I2CSIDL = 1, the module will stop on Idle. If a transmit was in progress when the bus collision occurred, the transmission is halted, the TBF flag is cleared, the SDA and SCL lines are de-asserted and a value can now be written to I2CTRN. When the user services the I2C master event Interrupt Service Routine, if the I2C bus is free (i.e., the P bit is set), the user can resume communication by asserting a Start condition. DS70083C-page 108 Advance Information 2003 Microchip Technology Inc. 0206 0208 020A u = uninitialized bit I2CCON I2CSTAT I2CADD Legend: -- ACKSTAT I2CEN -- 0204 -- TRSTAT -- -- -- I2CBRG -- -- 0202 Bit 14 -- 0200 I2CRCV Bit 15 -- -- -- Bit 12 -- -- -- Bit 11 -- -- -- -- -- -- I2CSIDL SCLREL IPMIEN -- -- -- Bit 13 I2C REGISTER MAP I2CTRN SFR Name Addr. TABLE 15-1: -- BCL A10M -- -- -- Bit 10 GCSTAT DISSLW -- -- -- Bit 9 ADD10 SMEN -- -- Bit 8 IWCOL GCEN Bit 7 I2COV STREN Bit 6 Bit 3 Transmit Register Receive Register Bit 4 P ACKEN Address Register D_A ACKDT S RCEN Baud Rate Generator Bit 5 R_W PEN Bit 2 RBF RSEN Bit 1 TBF SEN Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0001 0000 0000 0000 0000 0000 0000 0000 0000 0000 1111 1111 0000 0000 0000 0000 Reset State dsPIC30F 2003 Microchip Technology Inc. Advance Information DS70083C-page 109 dsPIC30F NOTES: DS70083C-page 110 Advance Information 2003 Microchip Technology Inc. dsPIC30F 16.0 UNIVERSAL ASYNCHRONOUS RECEIVER TRANSMITTER (UART) MODULE This section describes the Universal Asynchronous Receiver/Transmitter Communications module. 16.1 UART Module Overview The key features of the UART module are: * Full-duplex, 8 or 9-bit data communication * Even, odd or no parity options (for 8-bit data) * One or two Stop bits FIGURE 16-1: * Fully integrated baud rate generator with 16-bit prescaler * Baud rates range from 38 bps to 1.875 Mbps at a 30 MHz instruction rate * 4-word deep transmit data buffer * 4-word deep receive data buffer * Parity, framing and buffer overrun error detection * Support for interrupt only on address detect (9th bit = 1) * Separate transmit and receive interrupts * Loopback mode for diagnostic support UART TRANSMITTER BLOCK DIAGRAM Internal Data Bus Control and Status bits Write UTX8 Write UxTXREG Low Byte Transmit Control - Control TSR - Control Buffer - Generate Flags - Generate Interrupt Load TSR UxTXIF UTXBRK Data Transmit Shift Register (UxTSR) `0' (Start) UxTX `1' (Stop) Parity Parity Generator 16 Divider 16x Baud Clock from Baud Rate Generator Control Signals Note: x = 1 or 2. 2003 Microchip Technology Inc. Advance Information DS70083C-page 111 dsPIC30F FIGURE 16-2: UART RECEIVER BLOCK DIAGRAM Internal Data Bus 16 Write Read Read Read UxMODE Write UxSTA URX8 UxRXREG Low Byte Receive Buffer Control - Generate Flags - Generate Interrupt - Shift Data Characters 0 * Start bit Detect * Parity Check * Stop bit Detect * Shift Clock Generation * Wake Logic Load RSR to Buffer Receive Shift Register (UxRSR) Control Signals FERR UxRX 8-9 PERR LPBACK From UxTX 1 16 Divider 16x Baud Clock from Baud Rate Generator UxRXIF DS70083C-page 112 Advance Information 2003 Microchip Technology Inc. dsPIC30F 16.2 16.2.1 Enabling and Setting Up UART ENABLING THE UART Disabling the UART module resets the buffers to empty states. Any data characters in the buffers are lost and the baud rate counter is reset. 1. 2. 3. 4. All error and status flags associated with the UART module are reset when the module is disabled. The URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and UTXBF bits are cleared, whereas RIDLE and TRMT are set. Other control bits, including ADDEN, URXISEL<1:0>, UTXISEL, as well as the UxMODE and UxBRG registers, are not affected. Clearing the UARTEN bit while the UART is active will abort all pending transmissions and receptions and reset the module as defined above. Re-enabling the UART will restart the UART in the same configuration. 16.2.4 5. Set up the UART: First, the data length, parity and number of Stop bits must be selected. Then, the transmit and receive interrupt enable and priority bits are setup in the UxMODE and UxSTA registers. Also, the appropriate baud rate value must be written to the UxBRG register. Enable the UART by setting the UARTEN bit (UxMODE<15>). Set the UTXEN bit (UxSTA<10>), thereby enabling a transmission. Write the byte to be transmitted to the lower byte of UxTXREG. The value will be transferred to the Transmit Shift register (UxTSR) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. Alternatively, the data byte may be written while UTXEN = 0, following which, the user may set UTXEN. This will cause the serial bit stream to begin immediately because the baud clock will start from a cleared state. A transmit interrupt will be generated, depending on the value of the interrupt control bit UTXISEL (UxSTA<15>). 16.3.2 ALTERNATE I/O The alternate I/O function is enabled by setting the ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX and UxARX pins (alternate transmit and alternate receive pins, respectively) are used by the UART module instead of the UxTX and UxRX pins. If ALTIO = 0, the UxTX and UxRX pins are used by the UART module. SETTING UP DATA, PARITY AND STOP BIT SELECTIONS Control bits PDSEL<1:0> in the UxMODE register are used to select the data length and parity used in the transmission. The data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. The STSEL bit determines whether one or two Stop bits will be used during data transmission. The default (power-on) setting of the UART is 8 bits, no parity and 1 Stop bit (typically represented as 8, N, 1). 2003 Microchip Technology Inc. TRANSMITTING IN 8-BIT DATA MODE The following steps must be performed in order to transmit 8-bit data: DISABLING THE UART The UART module is disabled by clearing the UARTEN bit in the UxMODE register. This is the default state after any Reset. If the UART is disabled, all I/O pins operate as port pins under the control of the latch and TRIS bits of the corresponding port pins. 16.2.3 Transmitting Data 16.3.1 The UART module is enabled by setting the UARTEN bit in the UxMODE register (where x = 1 or 2). Once enabled, the UxTX and UxRX pins are configured as an output and an input respectively, overriding the TRIS and LATCH register bit settings for the corresponding I/O port pins. The UxTX pin is at logic `1' when no transmission is taking place. 16.2.2 16.3 TRANSMITTING IN 9-BIT DATA MODE The sequence of steps involved in the transmission of 9-bit data is similar to 8-bit transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the UxTXREG register. 16.3.3 TRANSMIT BUFFER (UXTXB) The transmit buffer is 9 bits wide and 4 characters deep. Including the Transmit Shift register (UxTSR), the user effectively has a 5-deep FIFO (First-In, FirstOut) buffer. The UTXBF status bit (UxSTA<9>) indicates whether the transmit buffer is full. If a user attempts to write to a full buffer, the new data will not be accepted into the FIFO, and no data shift will occur within the buffer. This enables recovery from a buffer overrun condition. The FIFO is reset during any device Reset but is not affected when the device enters or wakes up from a Power Saving mode. Advance Information DS70083C-page 113 dsPIC30F 16.3.4 TRANSMIT INTERRUPT 16.4.2 The transmit interrupt flag (U1TXIF or U2TXIF) is located in the corresponding interrupt flag register. The transmitter generates an edge to set the UxTXIF bit. The condition for generating the interrupt depends on the UTXISEL control bit: a) b) If UTXISEL = 0, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR). This implies that the transmit buffer has at least one empty word. If UTXISEL = 1, an interrupt is generated when a word is transferred from the transmit buffer to the Transmit Shift register (UxTSR) and the transmit buffer is empty. Switching between the two Interrupt modes during operation is possible and sometimes offers more flexibility. 16.3.5 TRANSMIT BREAK RECEIVE BUFFER (UXRXB) The receive buffer is 4 words deep. Including the Receive Shift register (UxRSR), the user effectively has a 5-word deep FIFO buffer. URXDA (UxSTA<0>) = 1 indicates that the receive buffer has data available. URXDA = 0 implies that the buffer is empty. If a user attempts to read an empty buffer, the old values in the buffer will be read and no data shift will occur within the FIFO. The FIFO is reset during any device Reset. It is not affected when the device enters or wakes up from a Power Saving mode. 16.4.3 RECEIVE INTERRUPT The receive interrupt flag (U1RXIF or U2RXIF) can be read from the corresponding interrupt flag register. The interrupt flag is set by an edge generated by the receiver. The condition for setting the receive interrupt flag depends on the settings specified by the URXISEL<1:0> (UxSTA<7:6>) control bits. Setting the UTXBRK bit (UxSTA<11>) will cause the UxTX line to be driven to logic `0'. The UTXBRK bit overrides all transmission activity. Therefore, the user should generally wait for the transmitter to be Idle before setting UTXBRK. a) To send a break character, the UTXBRK bit must be set by software and must remain set for a minimum of 13 baud clock cycles. The UTXBRK bit is then cleared by software to generate Stop bits. The user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid Stop bit(s) before reloading the UxTXB, or starting other transmitter activity. Transmission of a break character does not generate a transmit interrupt. b) c) 16.4 Switching between the Interrupt modes during operation is possible, though generally not advisable during normal operation. 16.4.1 Receiving Data RECEIVING IN 8-BIT OR 9-BIT DATA MODE If URXISEL<1:0> = 00 or 01, an interrupt is generated every time a data word is transferred from the Receive Shift register (UxRSR) to the receive buffer. There may be one or more characters in the receive buffer. If URXISEL<1:0> = 10, an interrupt is generated when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 3 characters. If URXISEL<1:0> = 11, an interrupt is set when a word is transferred from the Receive Shift register (UxRSR) to the receive buffer, which as a result of the transfer, contains 4 characters (i.e., becomes full). 16.5 Reception Error Handling The following steps must be performed while receiving 8-bit or 9-bit data: 16.5.1 1. 2. 3. The OERR bit (UxSTA<1>) is set if all of the following conditions occur: 4. 5. Set up the UART (see Section 16.3.1). Enable the UART (see Section 16.3.1). A receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the URXISEL bits (UxSTA<7:6>). Read the OERR bit to determine if an overrun error has occurred. The OERR bit must be reset in software. Read the received data from UxRXREG. The act of reading UxRXREG will move the next word to the top of the receive FIFO, and the PERR and FERR values will be updated. DS70083C-page 114 a) b) c) RECEIVE BUFFER OVERRUN ERROR (OERR BIT) The receive buffer is full. The Receive Shift register is full, but unable to transfer the character to the receive buffer. The Stop bit of the character in the UxRSR is detected, indicating that the UxRSR needs to transfer the character to the buffer. Once OERR is set, no further data is shifted in UxRSR (until the OERR bit is cleared in software or a Reset occurs). The data held in UxRSR and UxRXREG remains valid. Advance Information 2003 Microchip Technology Inc. dsPIC30F 16.5.2 FRAMING ERROR (FERR) 16.6 The FERR bit (UxSTA<2>) is set if a `0' is detected instead of a Stop bit. If two Stop bits are selected, both Stop bits must be `1', otherwise FERR will be set. The read only FERR bit is buffered along with the received data. It is cleared on any Reset. 16.5.3 PARITY ERROR (PERR) The PERR bit (UxSTA<3>) is set if the parity of the received word is incorrect. This error bit is applicable only if a Parity mode (odd or even) is selected. The read only PERR bit is buffered along with the received data bytes. It is cleared on any Reset. 16.5.4 IDLE STATUS When the receiver is active (i.e., between the initial detection of the Start bit and the completion of the Stop bit), the RIDLE bit (UxSTA<4>) is `0'. Between the completion of the Stop bit and detection of the next Start bit, the RIDLE bit is `1', indicating that the UART is Idle. 16.5.5 RECEIVE BREAK The receiver will count and expect a certain number of bit times based on the values programmed in the PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>) bits. If the break is longer than 13 bit times, the reception is considered complete after the number of bit times specified by PDSEL and STSEL. The URXDA bit is set, FERR is set, zeros are loaded into the receive FIFO, interrupts are generated if appropriate and the RIDLE bit is set. When the module receives a long break signal and the receiver has detected the Start bit, the data bits and the invalid Stop bit (which sets the FERR), the receiver must wait for a valid Stop bit before looking for the next Start bit. It cannot assume that the break condition on the line is the next Start bit. Break is regarded as a character containing all `0's with the FERR bit set. The break character is loaded into the buffer. No further reception can occur until a Stop bit is received. Note that RIDLE goes high when the Stop bit has not yet been received. Address Detect Mode Setting the ADDEN bit (UxSTA<5>) enables this special mode in which a 9th bit (URX8) value of `1' identifies the received word as an address, rather than data. This mode is only applicable for 9-bit data communication. The URXISEL control bit does not have any impact on interrupt generation in this mode since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. 16.7 Loopback Mode Setting the LPBACK bit enables this special mode in which the UxTX pin is internally connected to the UxRX pin. When configured for the Loopback mode, the UxRX pin is disconnected from the internal UART receive logic. However, the UxTX pin still functions as in a normal operation. To select this mode: a) b) c) Configure UART for desired mode of operation. Set LPBACK = 1 to enable Loopback mode. Enable transmission as defined in Section 16.3. 16.8 Baud Rate Generator The UART has a 16-bit baud rate generator to allow maximum flexibility in baud rate generation. The baud rate generator register (UxBRG) is readable and writable. The baud rate is computed as follows: BRG = 16-bit value held in UxBRG register (0 through 65535) FCY = Instruction Clock Rate (1/TCY) The Baud Rate is given by Equation 16-1. EQUATION 16-1: BAUD RATE Baud Rate = FCY / (16*(BRG+1)) Therefore, the maximum baud rate possible is FCY /16 (if BRG = 0), and the minimum baud rate possible is FCY / (16* 65536). With a full 16-bit baud rate generator at 30 MIPs operation, the minimum baud rate achievable is 28.5 bps. 2003 Microchip Technology Inc. Advance Information DS70083C-page 115 dsPIC30F 16.9 16.10.2 Auto Baud Support To allow the system to determine baud rates of received characters, the input can be optionally linked to a selected capture input. To enable this mode, the user must program the input capture module to detect the falling and rising edges of the Start bit. UART OPERATION DURING CPU IDLE MODE For the UART, the USIDL bit selects if the module will stop operation when the device enters Idle mode or whether the module will continue on Idle. If USIDL = 0, the module will continue operation during Idle mode. If USIDL = 1, the module will stop on Idle. 16.10 UART Operation During CPU Sleep and Idle Modes 16.10.1 UART OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic `0'. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted. The UxTX pin is driven to logic `1'. Similarly, if entry into Sleep mode occurs while a reception is in progress, then the reception is aborted. The UxSTA, UxMODE, transmit and receive registers and buffers, and the UxBRG register are not affected by Sleep mode. If the WAKE bit (UxSTA<7>) is set before the device enters Sleep mode, then a falling edge on the UxRX pin will generate a receive interrupt. The Receive Interrupt Select mode bit (URXISEL) has no effect for this function. If the receive interrupt is enabled, then this will wake-up the device from Sleep. The UARTEN bit must be set in order to generate a wake-up interrupt. DS70083C-page 116 Advance Information 2003 Microchip Technology Inc. 0212 0214 u = uninitialized bit U1RXREG U1BRG Legend: 2003 Microchip Technology Inc. 021A 021C 021E u = uninitialized bit U2BRG Legend: -- -- -- -- -- -- USIDL -- -- Bit 13 Bit 14 -- UTXISEL UARTEN Bit 15 U2TXREG 0216 0218 U2MODE U2STA -- -- -- -- -- Bit 12 -- -- -- -- Bit 12 ALTIO Bit 10 -- Bit 11 -- -- -- Bit 10 -- -- UTXBRK UTXEN -- Bit 11 -- -- -- -- UTXBRK UTXEN UART2 REGISTER MAP -- -- -- -- -- -- USIDL -- -- U2RXREG Addr. SFR Name TABLE 16-2: 0210 U1TXREG UARTEN 020E UTXISEL 020C U1MODE U1STA Bit 13 Bit 15 SFR Name Addr. Bit 14 UART1 REGISTER MAP TABLE 16-1: -- -- UTXBF -- Bit 9 -- -- URX8 UTX8 TRMT -- Bit 8 LPBACK Bit 6 LPBACK Bit 6 ABAUD Bit 5 PERR -- Bit 3 RIDLE -- Bit 4 PERR -- Bit 3 Receive Register Transmit Register RIDLE -- Bit 4 Receive Register Transmit Register URXISEL1 URXISEL0 ADDEN WAKE Bit 7 Baud Rate Generator Prescaler URX8 UTX8 TRMT -- Bit 8 ABAUD Bit 5 URXISEL1 URXISEL0 ADDEN WAKE Bit 7 Baud Rate Generator Prescaler UTXBF -- Bit 9 Bit 1 Bit 0 Reset State Bit 1 OERR FERR OERR PDSEL1 PDSEL0 Bit 2 FERR Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 000u uuuu uuuu URXDA 0000 0001 0001 0000 STSEL 0000 0000 0000 0000 Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 000u uuuu uuuu URXDA 0000 0001 0001 0000 PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000 Bit 2 dsPIC30F Advance Information DS70083C-page 117 dsPIC30F NOTES: DS70083C-page 118 Advance Information 2003 Microchip Technology Inc. dsPIC30F 17.0 CAN MODULE 17.1 Overview The Controller Area Network (CAN) module is a serial interface, useful for communicating with other CAN modules or microcontroller devices. This interface/ protocol was designed to allow communications within noisy environments. The CAN module is a communication controller implementing the CAN 2.0 A/B protocol, as defined in the BOSCH specification. The module will support CAN 1.2, CAN 2.0A, CAN 2.0B Passive, and CAN 2.0B Active versions of the protocol. The module implementation is a full CAN system. The CAN specification is not covered within this data sheet. The reader may refer to the BOSCH CAN specification for further details. The module features are as follows: * Implementation of the CAN protocol CAN 1.2, CAN 2.0A and CAN 2.0B * Standard and extended data frames * 0-8 bytes data length * Programmable bit rate up to 1 Mbit/sec * Support for remote frames * Double-buffered receiver with two prioritized received message storage buffers (each buffer may contain up to 8 bytes of data) * 6 full (standard/extended identifier) acceptance filters, 2 associated with the high priority receive buffer and 4 associated with the low priority receive buffer * 2 full acceptance filter masks, one each associated with the high and low priority receive buffers * Three transmit buffers with application specified prioritization and abort capability (each buffer may contain up to 8 bytes of data) * Programmable wake-up functionality with integrated low-pass filter * Programmable Loopback mode supports self-test operation * Signaling via interrupt capabilities for all CAN receiver and transmitter error states * Programmable clock source * Programmable link to timer module for time-stamping and network synchronization * Low power Sleep and Idle mode The CAN bus module consists of a protocol engine and message buffering/control. The CAN protocol engine handles all functions for receiving and transmitting messages on the CAN bus. Messages are transmitted by first loading the appropriate data registers. Status and errors can be checked by reading the appropriate registers. Any message detected on the CAN bus is checked for errors and then matched against filters to see if it should be received and stored in one of the receive registers. 17.2 Frame Types The CAN module transmits various types of frames which include data messages or remote transmission requests initiated by the user, as other frames that are automatically generated for control purposes. The following frame types are supported: * Standard Data Frame: A standard data frame is generated by a node when the node wishes to transmit data. It includes an 11-bit standard identifier (SID) but not an 18-bit extended identifier (EID). * Extended Data Frame: An extended data frame is similar to a standard data frame but includes an extended identifier as well. * Remote Frame: It is possible for a destination node to request the data from the source. For this purpose, the destination node sends a remote frame with an identifier that matches the identifier of the required data frame. The appropriate data source node will then send a data frame as a response to this remote request. * Error Frame: An error frame is generated by any node that detects a bus error. An error frame consists of 2 fields: an error flag field and an error delimiter field. * Overload Frame: An overload frame can be generated by a node as a result of 2 conditions. First, the node detects a dominant bit during interframe space which is an illegal condition. Second, due to internal conditions, the node is not yet able to start reception of the next message. A node may generate a maximum of 2 sequential overload frames to delay the start of the next message. * Interframe Space: Interframe space separates a proceeding frame (of whatever type) from a following data or remote frame. 2003 Microchip Technology Inc. Advance Information DS70083C-page 119 dsPIC30F FIGURE 17-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM Acceptance Mask RXM1 BUFFERS Acceptance Filter RXF2 MESSAGE MSGREQ TXABT TXLARB TXERR MTXBUFF TXB2 MESSAGE MSGREQ TXABT TXLARB TXERR MTXBUFF MESSAGE TXB1 MSGREQ TXABT TXLARB TXERR MTXBUFF TXB0 A c c e p t R X B 0 Message Queue Control Transmit Byte Sequencer Acceptance Mask RXM0 Acceptance Filter RXF3 Acceptance Filter RXF0 Acceptance Filter RXF4 Acceptance Filter RXF1 Acceptance Filter RXF5 Identifier M A B Data Field Data Field PROTOCOL ENGINE Note 1: RERRCNT TERRCNT Transmit Error Counter CRC Generator R X B 1 Identifier Receive Error Counter Transmit Shift A c c e p t Err Pas Bus Off Receive Shift Protocol Finite State Machine CRC Check Transmit Logic Bit Timing Logic CiTX(1) CiRX(1) Bit Timing Generator i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2). DS70083C-page 120 Advance Information 2003 Microchip Technology Inc. dsPIC30F 17.3 Modes of Operation The CAN module can operate in one of several Operation modes selected by the user. These modes include: * * * * * * Initialization Mode Disable Mode Normal Operation Mode Listen Only Mode Loopback Mode Error Recognition Mode Note: Modes are requested by setting the REQOP<2:0> bits (CiCTRL<10:8>), except the Error Recognition mode which is requested through the RXM<1:0> bits (CiRXnCON<6:5>, where n = 0 or 1 represents a particular receive buffer). Entry into a mode is Acknowledged by monitoring the OPMODE<2:0> bits (CiCTRL<7:5>). The module will not change the mode and the OPMODE bits until a change in mode is acceptable, generally during bus Idle time which is defined as at least 11 consecutive recessive bits. 17.3.1 INITIALIZATION MODE In the Initialization mode, the module will not transmit or receive. The error counters are cleared and the interrupt flags remain unchanged. The programmer will have access to configuration registers that are access restricted in other modes. The module will protect the user from accidentally violating the CAN protocol through programming errors. All registers which control the configuration of the module can not be modified while the module is on-line. The CAN module will not be allowed to enter the Configuration mode while a transmission is taking place. The Configuration mode serves as a lock to protect the following registers. * * * * * All Module Control Registers Baud Rate and Interrupt Configuration Registers Bus Timing Registers Identifier Acceptance Filter Registers Identifier Acceptance Mask Registers 17.3.2 DISABLE MODE In Disable mode, the module will not transmit or receive. The module has the ability to set the WAKIF bit due to bus activity, however, any pending interrupts will remain and the error counters will retain their value. If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the module will enter the Module Disable mode. If the module is active, the module will wait for 11 recessive bits on the CAN bus, detect that condition as an Idle bus, then accept the module disable command. When the OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indicates whether the module successfully went into Module Disable mode. The I/O pins will revert to normal I/O function when the module is in the Module Disable mode. 2003 Microchip Technology Inc. The module can be programmed to apply a low-pass filter function to the CiRX input line while the module or the CPU is in Sleep mode. The WAKFIL bit (CiCFG2<14>) enables or disables the filter. 17.3.3 Typically, if the CAN module is allowed to transmit in a particular mode of operation and a transmission is requested immediately after the CAN module has been placed in that mode of operation, the module waits for 11 consecutive recessive bits on the bus before starting transmission. If the user switches to Disable Mode within this 11-bit period, then this transmission is aborted and the corresponding TXABT bit is set and TXREQ bit is cleared. NORMAL OPERATION MODE Normal Operating mode is selected when REQOP<2:0> = 000. In this mode, the module is activated and the I/O pins will assume the CAN bus functions. The module will transmit and receive CAN bus messages via the CxTX and CxRX pins. 17.3.4 LISTEN ONLY MODE If the Listen Only mode is activated, the module on the CAN bus is passive. The transmitter buffers revert to the port I/O function. The receive pins remain inputs. For the receiver, no error flags or Acknowledge signals are sent. The error counters are deactivated in this state. The Listen Only mode can be used for detecting the baud rate on the CAN bus. To use this, it is necessary that there are at least two further nodes that communicate with each other. 17.3.5 ERROR RECOGNITION MODE The module can be set to ignore all errors and receive any message. The Error Recognition mode is activated by setting the RXM<1:0> bits (CiRXnCON<6:5>) registers to `11'. In this mode, the data which is in the message assembly buffer until the time an error occurred, is copied in the receive buffer and can be read via the CPU interface. 17.3.6 LOOPBACK MODE If the Loopback mode is activated, the module will connect the internal transmit signal to the internal receive signal at the module boundary. The transmit and receive pins revert to their port I/O function. Advance Information DS70083C-page 121 dsPIC30F 17.4 17.4.1 Message Reception 17.4.4 RECEIVE BUFFERS The CAN bus module has 3 receive buffers. However, one of the receive buffers is always committed to monitoring the bus for incoming messages. This buffer is called the Message Assembly Buffer (MAB). So there are 2 receive buffers visible, RXB0 and RXB1, that can essentially instantaneously receive a complete message from the protocol engine. All messages are assembled by the MAB and are transferred to the RXBn buffers only if the acceptance filter criterion are met. When a message is received, the RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This bit can only be set by the module when a message is received. The bit is cleared by the CPU when it has completed processing the message in the buffer. If the RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt will be generated when a message is received. RXF0 and RXF1 filters with RXM0 mask are associated with RXB0. The filters RXF2, RXF3, RXF4, and RXF5 and the mask RXM1 are associated with RXB1. 17.4.2 MESSAGE ACCEPTANCE FILTERS The message acceptance filters and masks are used to determine if a message in the message assembly buffer should be loaded into either of the receive buffers. Once a valid message has been received into the Message Assembly Buffer (MAB), the identifier fields of the message are compared to the filter values. If there is a match, that message will be loaded into the appropriate receive buffer. The acceptance filter looks at incoming messages for the RXIDE bit (CiRXnSID<0>) to determine how to compare the identifiers. If the RXIDE bit is clear, the message is a standard frame and only filters with the EXIDE bit (CiRXFnSID<0>) clear are compared. If the RXIDE bit is set, the message is an extended frame, and only filters with the EXIDE bit set are compared. Configuring the RXM<1:0> bits to `01' or `10' can override the EXIDE bit. 17.4.3 MESSAGE ACCEPTANCE FILTER MASKS The mask bits essentially determine which bits to apply the filter to. If any mask bit is set to a zero, then that bit will automatically be accepted regardless of the filter bit. There are 2 programmable acceptance filter masks associated with the receive buffers, one for each buffer. RECEIVE OVERRUN An overrun condition occurs when the Message Assembly Buffer (MAB) has assembled a valid received message, the message is accepted through the acceptance filters, and when the receive buffer associated with the filter has not been designated as clear of the previous message. The overrun error flag, RXnOVR (CiINTF<15> or CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be set and the message in the MAB will be discarded. If the DBEN bit is clear, RXB1 and RXB0 operate independently. When this is the case, a message intended for RXB0 will not be diverted into RXB1 if RXB0 contains an unread message and the RX0OVR bit will be set. If the DBEN bit is set, the overrun for RXB0 is handled differently. If a valid message is received for RXB0 and RXFUL = 1 indicates that RXB0 is full and RXFUL = 0 indicates that RXB1 is empty, the message for RXB0 will be loaded into RXB1. An overrun error will not be generated for RXB0. If a valid message is received for RXB0 and RXFUL = 1, indicating that both RXB0 and RXB1 are full, the message will be lost and an overrun will be indicated for RXB1. 17.4.5 RECEIVE ERRORS The CAN module will detect the following receive errors: * Cyclic Redundancy Check (CRC) Error * Bit Stuffing Error * Invalid Message Receive Error These receive errors do not generate an interrupt. However, the receive error counter is incremented by one in case one of these errors occur. The RXWAR bit (CiINTF<9>) indicates that the receive error counter has reached the CPU warning limit of 96 and an interrupt is generated. 17.4.6 RECEIVE INTERRUPTS Receive interrupts can be divided into 3 major groups, each including various conditions that generate interrupts: * Receive Interrupt: A message has been successfully received and loaded into one of the receive buffers. This interrupt is activated immediately after receiving the End of Frame (EOF) field. Reading the RXnIF flag will indicate which receive buffer caused the interrupt. * Wake-up Interrupt: The CAN module has woken up from Disable mode or the device has woken up from Sleep mode. DS70083C-page 122 Advance Information 2003 Microchip Technology Inc. dsPIC30F * Receive Error Interrupts: A receive error interrupt will be indicated by the ERRIF bit. This bit shows that an error condition occurred. The source of the error can be determined by checking the bits in the CAN Interrupt Status register, CiINTF. - Invalid Message Received: If any type of error occurred during reception of the last message, an error will be indicated by the IVRIF bit. - Receiver Overrun: The RXnOVR bit indicates that an overrun condition occurred. - Receiver Warning: The RXWAR bit indicates that the receive error counter (RERRCNT<7:0>) has reached the warning limit of 96. - Receiver Error Passive: The RXEP bit indicates that the receive error counter has exceeded the error passive limit of 127 and the module has gone into error passive state. 17.5 17.5.1 Message Transmission TRANSMIT BUFFERS The CAN module has three transmit buffers. Each of the three buffers occupies 14 bytes of data. Eight of the bytes are the maximum 8 bytes of the transmitted message. Five bytes hold the standard and extended identifiers and other message arbitration information. 17.5.2 TRANSMIT MESSAGE PRIORITY Transmit priority is a prioritization within each node of the pending transmittable messages. There are 4 levels of transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>, where n = 0, 1 or 2 represents a particular transmit buffer) for a particular message buffer is set to `11', that buffer has the highest priority. If TXPRI<1:0> for a particular message buffer is set to `10' or `01', that buffer has an intermediate priority. If TXPRI<1:0> for a particular message buffer is `00', that buffer has the lowest priority. 17.5.3 Setting TXREQ bit simply flags a message buffer as enqueued for transmission. When the module detects an available bus, it begins transmitting the message which has been determined to have the highest priority. If the transmission completes successfully on the first attempt, the TXREQ bit is cleared automatically, and an interrupt is generated if TXIE was set. If the message transmission fails, one of the error condition flags will be set, and the TXREQ bit will remain set indicating that the message is still pending for transmission. If the message encountered an error condition during the transmission attempt, the TXERR bit will be set, and the error condition may cause an interrupt. If the message loses arbitration during the transmission attempt, the TXLARB bit is set. No interrupt is generated to signal the loss of arbitration. 17.5.4 ABORTING MESSAGE TRANSMISSION The system can also abort a message by clearing the TXREQ bit associated with each message buffer. Setting the ABAT bit (CiCTRL<12>) will request an abort of all pending messages. If the message has not yet started transmission, or if the message started but is interrupted by loss of arbitration or an error, the abort will be processed. The abort is indicated when the module sets the TXABT bit and the TXnIF flag is not automatically set. 17.5.5 TRANSMISSION ERRORS The CAN module will detect the following transmission errors: * Acknowledge Error * Form Error * Bit Error These transmission errors will not necessarily generate an interrupt but are indicated by the transmission error counter. However, each of these errors will cause the transmission error counter to be incremented by one. Once the value of the error counter exceeds the value of 96, the ERRIF (CiINTF<5>) and the TXWAR bit (CiINTF<10>) are set. Once the value of the error counter exceeds the value of 96, an interrupt is generated and the TXWAR bit in the Error Flag register is set. TRANSMISSION SEQUENCE To initiate transmission of the message, the TXREQ bit (CiTXnCON<3>) must be set. The CAN bus module resolves any timing conflicts between setting of the TXREQ bit and the Start of Frame (SOF), ensuring that if the priority was changed, it is resolved correctly before the SOF occurs. When TXREQ is set, the TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR (CiTXnCON<4>) flag bits are automatically cleared. 2003 Microchip Technology Inc. Advance Information DS70083C-page 123 dsPIC30F 17.5.6 17.6 TRANSMIT INTERRUPTS Baud Rate Setting Transmit interrupts can be divided into 2 major groups, each including various conditions that generate interrupts: All nodes on any particular CAN bus must have the same nominal bit rate. In order to set the baud rate, the following parameters have to be initialized: * Transmit Interrupt: At least one of the three transmit buffers is empty (not scheduled) and can be loaded to schedule a message for transmission. Reading the TXnIF flags will indicate which transmit buffer is available and caused the interrupt. * * * * * * * Transmit Error Interrupts: A transmission error interrupt will be indicated by the ERRIF flag. This flag shows that an error condition occurred. The source of the error can be determined by checking the error flags in the CAN Interrupt Status register, CiINTF. The flags in this register are related to receive and transmit errors. - Transmitter Warning Interrupt: The TXWAR bit indicates that the transmit error counter has reached the CPU warning limit of 96. - Transmitter Error Passive: The TXEP bit (CiINTF<12>) indicates that the transmit error counter has exceeded the error passive limit of 127 and the module has gone to error passive state. - Bus Off: The TXBO bit (CiINTF<13>) indicates that the transmit error counter has exceeded 255 and the module has gone to the bus off state. FIGURE 17-2: Synchronization Jump Width Baud Rate Prescaler Phase Segments Length determination of Phase Segment 2 Sample Point Propagation Segment bits 17.6.1 BIT TIMING All controllers on the CAN bus must have the same baud rate and bit length. However, different controllers are not required to have the same master oscillator clock. At different clock frequencies of the individual controllers, the baud rate has to be adjusted by adjusting the number of time quanta in each segment. The nominal bit time can be thought of as being divided into separate non-overlapping time segments. These segments are shown in Figure 17-2. * * * * Synchronization Segment (Sync Seg) Propagation Time Segment (Prop Seg) Phase Segment 1 (Phase1 Seg) Phase Segment 2 (Phase2 Seg) The time segments and also the nominal bit time are made up of integer units of time called time quanta or TQ. By definition, the nominal bit time has a minimum of 8 TQ and a maximum of 25 TQ. Also, by definition, the minimum nominal bit time is 1 sec corresponding to a maximum bit rate of 1 MHz. CAN BIT TIMING Input Signal Sync Prop Segment Phase Segment 1 Phase Segment 2 Sync Sample Point TQ DS70083C-page 124 Advance Information 2003 Microchip Technology Inc. dsPIC30F 17.6.2 PRESCALER SETTING 17.6.6 There is a programmable prescaler with integral values ranging from 1 to 64, in addition to a fixed divide-by-2 for clock generation. The time quantum (TQ) is a fixed unit of time derived from the oscillator period, and is given by Equation 17-1. EQUATION 17-1: TIME QUANTUM FOR CLOCK GENERATION TQ = 2 (BRP<5:0> + 1) / FCAN 17.6.3 This part of the bit time is used to compensate physical delay times within the network. These delay times consist of the signal propagation time on the bus line and the internal delay time of the nodes. The Prop Seg can be programmed from 1 TQ to 8 TQ by setting the PRSEG<2:0> bits (CiCFG2<2:0>). 17.6.4 To compensate for phase shifts between the oscillator frequencies of the different bus stations, each CAN controller must be able to synchronize to the relevant signal edge of the incoming signal. When an edge in the transmitted data is detected, the logic will compare the location of the edge to the expected time (Synchronous Segment). The circuit will then adjust the values of Phase1 Seg and Phase2 Seg. There are 2 mechanisms used to synchronize. 17.6.6.1 PROPAGATION SEGMENT PHASE SEGMENTS The phase segments are used to optimally locate the sampling of the received bit within the transmitted bit time. The sampling point is between Phase1 Seg and Phase2 Seg. These segments are lengthened or shortened by resynchronization. The end of the Phase1 Seg determines the sampling point within a bit period. The segment is programmable from 1 TQ to 8 TQ. Phase2 Seg provides delay to the next transmitted data transition. The segment is programmable from 1 TQ to 8 TQ, or it may be defined to be equal to the greater of Phase1 Seg or the information processing time (2 TQ). The Phase1 Seg is initialized by setting bits SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is initialized by setting SEG2PH<2:0> (CiCFG2<10:8>). SYNCHRONIZATION Hard Synchronization Hard synchronization is only done whenever there is a `recessive' to `dominant' edge during bus Idle indicating the start of a message. After hard synchronization, the bit time counters are restarted with the Sync Seg. Hard synchronization forces the edge which has caused the hard synchronization to lie within the synchronization segment of the restarted bit time. If a hard synchronization is done, there will not be a resynchronization within that bit time. 17.6.6.2 Resynchronization As a result of resynchronization, Phase1 Seg may be lengthened or Phase2 Seg may be shortened. The amount of lengthening or shortening of the phase buffer segment has an upper bound known as the synchronization jump width, and is specified by the SJW<1:0> bits (CiCFG1<7:6>). The value of the synchronization jump width will be added to Phase1 Seg or subtracted from Phase2 Seg. The resynchronization jump width is programmable between 1 TQ and 4 TQ. The following requirement must be fulfilled while setting the SJW<1:0> bits: Phase2 Seg > Synchronization Jump Width The following requirement must be fulfilled while setting the lengths of the phase segments: Prop Seg + Phase1 Seg > = Phase2 Seg 17.6.5 SAMPLE POINT The sample point is the point of time at which the bus level is read and interpreted as the value of that respective bit. The location is at the end of Phase1 Seg. If the bit timing is slow and contains many TQ, it is possible to specify multiple sampling of the bus line at the sample point. The level determined by the CAN bus then corresponds to the result from the majority decision of three values. The majority samples are taken at the sample point and twice before with a distance of TQ/2. The CAN module allows the user to choose between sampling three times at the same point or once at the same point, by setting or clearing the SAM bit (CiCFG2<6>). Typically, the sampling of the bit should take place at about 60 - 70% through the bit time, depending on the system parameters. 2003 Microchip Technology Inc. Advance Information DS70083C-page 125 DS70083C-page 126 -- Receive Acceptance Filter 1 Extended Identifier <5:0> -- -- -- -- -- Receive Acceptance Filter 3 Extended Identifier <5:0> 030C 0310 0312 0314 0318 C1RXF1EIDL C1RXF2SID C1RXF2EIDH C1RXF2EIDL C1RXF3SID C1RXF3EIDH 031A C1RXF3EIDL -- -- -- -- -- -- Advance Information -- -- Receive Acceptance Mask 1 Extended Identifier <5:0> -- -- C1RXM0EIDH 0332 0334 0338 C1RXM0EIDL C1RXM1SID C1RXM1EIDH 033A C1RXM1EIDL 033C Legend: -- -- -- -- -- -- -- -- -- -- -- -- Transmit Buffer 1 Extended Identifier <5:0> Transmit Buffer 1 Extended Identifier <17:14> Transmit Buffer 1 Standard Identifier <10:6> -- Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Extended Identifier <5:0> -- Transmit Buffer 2 Standard Identifier <10:6> -- -- -- Transmit Buffer 2 Extended Identifier <17:14> u = uninitialized bit 0354 034E C1TX2CON C1TX1DLC 034C C1TX2B4 0350 034A C1TX2B3 0352 0348 C1TX2B2 C1TX1EID 0346 C1TX1SID 0344 C1TX2DLC C1TX2B1 0342 -- -- Receive Acceptance Mask 0 Extended Identifier <5:0> -- -- 0330 C1RXM0SID 0340 Receive Acceptance Filter 5 Extended Identifier <5:0> 032C C1RXF5EIDL C1TX2EID -- -- C1TX2SID -- -- -- 0328 TXRTR -- -- -- TXRTR -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TXRB1 -- -- -- TXRB1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 TXABT TXLARB TXERR TXREQ Transmit Buffer 2 Byte 6 Transmit Buffer 2 Byte 4 Transmit Buffer 2 Byte 2 Transmit Buffer 2 Byte 0 DLC<3:0> DLC<3:0> -- Transmit Buffer 1 Extended Identifier <13:6> -- -- Transmit Buffer 2 Extended Identifier <13:6> Transmit Buffer 1 Standard Identifier <5:0> TXRB0 -- -- Transmit Buffer 2 Standard Identifier <5:0> TXRB0 -- Receive Acceptance Mask 1 Extended Identifier <17:6> -- Receive Acceptance Mask 0 Extended Identifier <17:6> -- Receive Acceptance Filter 5 Extended Identifier <17:6> -- Receive Acceptance Filter 4 Extended Identifier <17:6> -- Receive Acceptance Filter 3 Extended Identifier <17:6> -- Receive Acceptance Filter 2 Extended Identifier <17:6> -- Receive Acceptance Filter 1 Extended Identifier <17:6> Receive Acceptance Mask 1 Standard Identifier <10:0> -- -- -- -- Receive Acceptance Mask 0 Standard Identifier <10:0> -- Bit 4 Receive Acceptance Filter 0 Extended Identifier <17:6> Receive Acceptance Filter 5 Standard Identifier <10:0> -- C1RXF5EIDH 032A -- Bit 5 Receive Acceptance Filter 4 Standard Identifier <10:0> C1RXF5SID -- Receive Acceptance Filter 4 Extended Identifier <5:0> -- 0324 -- -- C1RXF4EIDL -- Bit 6 Receive Acceptance Filter 3 Standard Identifier <10:0> -- 0322 -- Bit 7 Receive Acceptance Filter 2 Standard Identifier <10:0> -- 0320 -- -- Bit 8 Receive Acceptance Filter 1 Standard Identifier <10:0> C1RXF4EIDH -- -- -- Receive Acceptance Filter 2 Extended Identifier <5:0> -- -- -- -- -- C1RXF4SID 031C -- -- 0308 -- Bit 9 Receive Acceptance Filter 0 Standard Identifier <10:0> Bit 10 C1RXF1EIDH 030A -- Bit 11 C1RXF1SID -- Bit 12 Receive Acceptance Filter 0 Extended Identifier <5:0> -- -- Bit 13 0302 -- -- 0304 Bit 14 Bit 15 C1RXF0EIDL 0300 CAN1 REGISTER MAP C1RXF0EIDH Addr. SFR Name C1RXF0SID TABLE 17-1: Bit 0 -- SRR Reset State 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 -- -- uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu TXIDE uuuu u000 uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu TXIDE uuuu u000 uuuu uuuu -- MIDE -- MIDE -- EXIDE 000u uuuu uuuu uu0u -- EXIDE 000u uuuu uuuu uu0u -- EXIDE 000u uuuu uuuu uu0u -- EXIDE 000u uuuu uuuu uu0u -- EXIDE 000u uuuu uuuu uu0u -- EXIDE 000u uuuu uuuu uu0u TXPRI<1:0> -- SRR -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 dsPIC30F 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. Advance Information 036E 0370 0372 0374 0376 0378 037A 037C 037E 0380 0382 0384 0386 0388 038A 038C 038E 0390 C1TX0CON C1RX1SID C1RX1EID C1RX1DLC C1RX1B1 C1RX1B2 C1RX1B3 C1RX1B4 C1RX1CON C1RX0SID C1RX0EID C1RX0DLC C1RX0B1 C1RX0B2 C1RX0B3 C1RX0B4 C1RX0CON C1CTRL Legend: Bit 12 Bit 11 -- -- -- -- -- -- -- -- -- -- Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 3 RX0OVR -- RX1OVR WAKFIL -- -- TXEP -- -- ABAT -- RXEP -- -- CANCKS -- -- -- -- -- -- TXRB1 -- -- -- Bit 8 -- -- SEG2PH<2:0> -- REQOP<2:0> -- -- -- -- -- DLC<3:0> TXABT TXLARB TXERR RXFUL -- -- -- -- -- RXRTRRO Receive Buffer 1 Byte 6 Receive Buffer 1 Byte 4 Receive Buffer 1 Byte 2 Receive Buffer 1 Byte 0 RXRB0 -- -- IVRIE IVRIF SEG2PHTS WAKIE WAKIF SAM SJW<1:0> -- -- RXRB0 -- TX2IF TX2IE SRR 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu -- 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 000u uuuu 0000 uuuu uuuu uuuu RXIDE 000u uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 000u uuuu 0000 uuuu uuuu uuuu RXIDE 000u uuuu uuuu uuuu FILHIT<2:0> DLC<3:0> TX1IF TX1IE TX0IE TX0IF RX1E RX1IF -- 0u00 0uuu uuuu uuuu 0000 0000 0000 0000 0000 0100 1000 0000 0000 0000 0000 0000 RX0IE 0000 0000 0000 0000 RX0IF 0000 0000 0000 0000 PRSEG<2:0> ICODE<2:0> BRP<5:0> Receive Error Count Register ERRIE SRR Reset State uuuu uuuu uuuu uuuu TXIDE uuuu u000 uuuu uuuu TXPRI<1:0> -- SRR DLC<3:0> -- -- Bit 0 TXPRI<1:0> Bit 1 RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000 SEG1PH<2:0> -- -- Receive Buffer 0 Byte 6 Receive Buffer 0 Byte 4 Receive Buffer 0 Byte 2 Receive Buffer 0 Byte 0 ERRIF OPMODE<2:0> RXFUL -- TXREQ Transmit Buffer 0 Byte 6 Transmit Buffer 0 Byte 4 Transmit Buffer 0 Byte 2 Transmit Buffer 0 Byte 0 Receive Buffer 0 Extended Identifier <17:6> RXRTR RXRB1 TXREQ Transmit Buffer 1 Byte 6 Transmit Buffer 1 Byte 4 Bit 2 Transmit Buffer 0 Extended Identifier <13:6> Receive Buffer 0 Standard Identifier <10:0> -- -- Bit 3 Transmit Buffer 1 Byte 2 Receive Buffer 1 Extended Identifier <17:6> RXRTR RXRB1 -- Bit 4 Transmit Buffer 1 Byte 0 Bit 5 TXABT TXLARB TXERR Bit 6 Transmit Buffer 0 Standard Identifier <5:0> TXRB0 -- Bit 7 Receive Buffer 1 Standard Identifier <10:0> -- TXRTR -- -- -- Bit 9 TXWAR RXWAR EWARN Transmit Error Count Register -- TXBO -- -- CSIDLE -- -- Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 1 -- -- -- -- Receive Buffer 1 Byte 1 -- -- CANCAP -- -- -- Receive Buffer 0 Extended Identifier <5:0> -- -- -- -- -- -- -- Receive Buffer 1 Extended Identifier <5:0> -- -- -- -- -- -- Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Extended Identifier <5:0> Transmit Buffer 0 Extended Identifier <17:14> -- -- Bit 10 -- -- Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 1 Bit 13 -- -- Bit 14 Transmit Buffer 0 Standard Identifier <10:6> -- Bit 15 CAN1 REGISTER MAP (CONTINUED) u = uninitialized bit 039A 036C C1TX0B4 C1EC 036A C1TX0B3 0398 0368 C1TX0B2 0396 0366 C1TX0DLC C1TX0B1 C1INTE 0364 C1TX0EID C1INTF 0362 C1TX0SID 0394 0360 C1TX1CON C1CFG2 035E C1TX1B4 0392 035C C1TX1B3 C1CFG1 0358 035A C1TX1B2 0356 Addr. C1TX1B1 SFR Name TABLE 17-1: dsPIC30F DS70083C-page 127 DS70083C-page 128 Advance Information 040A 040C 040E 0410 0412 C2TX2B3 C2TX2B4 C2TX2CON C2TX1SID C2TX1EID -- -- -- -- -- -- Bit 13 -- Bit 12 Bit 11 Bit 10 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 1 Transmit Buffer 1 Extended Identifier <17:14> -- Transmit Buffer 1 Standard Identifier <10:6> -- -- Transmit Buffer 2 Extended Identifier <5:0> Transmit Buffer 2 Extended Identifier <17:14> Transmit Buffer 2 Standard Identifier <10:6> -- -- -- -- -- Receive Acceptance Mask 1 Extended Identifier <5:0> -- -- Receive Acceptance Mask 0 Extended Identifier <5:0> -- -- Receive Acceptance Filter 5 Extended Identifier <5:0> -- -- Receive Acceptance Filter 4 Extended Identifier <5:0> -- -- Receive Acceptance Filter 3 Extended Identifier <5:0> -- -- Receive Acceptance Filter 2 Extended Identifier <5:0> -- -- Receive Acceptance Filter 1 Extended Identifier <5:0> -- -- Receive Acceptance Filter 0 Extended Identifier <5:0> Bit 14 Bit 15 CAN2 REGISTER MAP u = uninitialized bit 0408 C2TX2B2 Legend: 0404 0406 0402 C2TX2EID C2TX2B1 0400 C2TX2SID C2TX2DLC 03FA 03FC C2RXM1EIDH 03F8 C2RXM1SID C2RXM1EIDL 03F2 C2RXM0SID 03F4 03F0 C2RXF5EIDL C2RXM0EIDH 03EC C2RXF5EIDH C2RXM0EIDL 03E8 03EA C2RXF5SID 03E2 03E4 C2RXF4EIDH 03E0 C2RXF4SID C2RXF4EIDL 03DA 03DC C2RXF3EIDH 03D8 C2RXF3SID C2RXF3EIDL 03D2 03D4 C2RXF2EIDH 03D0 C2RXF2SID C2RXF2EIDL 03CA 03CC C2RXF1EIDH 03C8 C2RXF1SID C2RXF1EIDL 03C2 03C4 C2RXF0EIDH 03C0 C2RXF0EIDL Addr. SFR Name C2RXF0SID TABLE 17-2: Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TXRTR -- -- -- -- -- -- -- -- -- -- TXRB1 -- -- -- -- TXRB0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 TXLARB TXERR TXREQ -- -- Transmit Buffer 1 Extended Identifier <13:6> Transmit Buffer 1 Standard Identifier <5:0> TXABT Transmit Buffer 2 Byte 6 Transmit Buffer 2 Byte 4 Transmit Buffer 2 Byte 2 Transmit Buffer 2 Byte 0 DLC<3:0> Transmit Buffer 2 Extended Identifier <13:6> Transmit Buffer 2 Standard Identifier <5:0> -- Receive Acceptance Mask 1 Extended Identifier <17:6> -- Receive Acceptance Mask 0 Extended Identifier <17:6> -- Receive Acceptance Mask 1 Standard Identifier <10:0> -- -- Receive Acceptance Filter 5 Extended Identifier <17:6> -- Receive Acceptance Mask 0 Standard Identifier <10:0> -- -- Receive Acceptance Filter 4 Extended Identifier <17:6> -- Receive Acceptance Filter 5 Standard Identifier <10:0> -- -- Receive Acceptance Filter 3 Extended Identifier <17:6> -- Receive Acceptance Filter 4 Standard Identifier <10:0> -- -- Receive Acceptance Filter 2 Extended Identifier <17:6> -- Receive Acceptance Filter 3 Standard Identifier <10:0> -- -- -- Bit 3 Receive Acceptance Filter 1 Extended Identifier <17:6> -- Receive Acceptance Filter 2 Standard Identifier <10:0> -- Bit 4 Receive Acceptance Filter 0 Extended Identifier <17:6> -- Receive Acceptance Filter 1 Standard Identifier <10:0> -- Receive Acceptance Filter 0 Standard Identifier <10:0> Bit 0 -- TXIDE -- MIDE -- MIDE -- EXIDE -- EXIDE -- EXIDE -- EXIDE -- EXIDE -- EXIDE SRR TXIDE TXPRI<1:0> -- SRR -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 Reset State uuuu 0000 uuuu uuuu uuuu u000 uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu uuuu u000 uuuu uuuu uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u uuuu uu00 0000 0000 0000 uuuu uuuu uuuu 000u uuuu uuuu uu0u dsPIC30F 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. Advance Information 044C 044E 0450 C2RX0B4 C2RX0CON C2CTRL 045A C2EC Bit 14 Bit 13 Bit 12 Bit 11 -- -- -- -- Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Extended Identifier <5:0> -- RX0OVR -- -- CANCAP -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- RX1OVR WAKFIL -- -- -- -- TXEP -- -- ABAT -- -- RXEP -- -- CANCKS -- -- Bit 9 -- RXWAR -- -- RXRB1 -- EWARN -- -- RXRB1 SEG2PH<2:0> -- -- TXRB1 -- -- -- Bit 7 -- TXRB0 -- TXRB0 Bit 4 TXLARB TXERR RXFUL TXABT -- -- TXERR -- -- -- SEG2PHTS IVRIE WAKIE WAKIF SAM SJW<1:0> IVRIF -- RXRB0 TX2IE TX1IE TX1IF Receive Error Count Register ERRIE TX2IF SRR SRR TX0IE RXIDE RX1E RX1IF RX0IE RX0IF -- FILHIT0 RXIDE PRSEG<2:0> JTOFF DLC<3:0> TX0IF BRP<5:0> -- TXIDE TXPRI<1:0> -- SRR FILHIT<2:0> ICODE<2:0> -- Bit 0 TXPRI<1:0> -- Bit 1 DLC<3:0> -- -- RXRTRRO DBEN SEG1PH<2:0> -- -- Receive Buffer 0 Byte 6 Receive Buffer 0 Byte 4 Receive Buffer 0 Byte 2 Receive Buffer 0 Byte 0 ERRIF -- -- RXRTRRO Receive Buffer 1 Byte 6 Receive Buffer 1 Byte 4 Receive Buffer 1 Byte 2 Receive Buffer 1 Byte 0 RXRB0 TXREQ Transmit Buffer 0 Byte 6 Transmit Buffer 0 Byte 4 Transmit Buffer 0 Byte 2 Transmit Buffer 0 Byte 0 DLC<3:0> TXLARB OPMODE<2:0> RXFUL -- -- -- Bit 2 Transmit Buffer 0 Extended Identifier <13:6> Receive Buffer 0 Extended Identifier <17:6> -- TXREQ Transmit Buffer 1 Byte 6 Transmit Buffer 1 Byte 4 Transmit Buffer 1 Byte 2 Receive Buffer 1 Extended Identifier <17:6> -- Bit 3 Transmit Buffer 1 Byte 0 DLC<3:0> Bit 5 Transmit Buffer 0 Standard Identifier <5:0> TXABT Bit 6 Receive Buffer 0 Standard Identifier <10:0> RXRTR -- Bit 8 TXRB1 Receive Buffer 1 Standard Identifier <10:0> RXRTR -- TXRTR -- -- -- TXRTR REQOP<2:0> TXWAR -- -- -- -- -- -- -- Bit 10 Transmit Error Count Register -- TXBO -- -- CSIDLE -- Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 1 Receive Buffer 0 Extended Identifier <5:0> -- -- -- Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 1 Receive Buffer 1 Extended Identifier <5:0> -- -- -- Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Extended Identifier <5:0> Transmit Buffer 0 Extended Identifier <17:14> Transmit Buffer 0 Standard Identifier <10:6> -- Bit 15 CAN2 REGISTER MAP (CONTINUED) u = uninitialized bit 0458 C2INTE Legend: 0454 0456 C2CFG2 C2INTF 0452 044A C2RX0B3 C2CFG1 0448 C2RX0B2 0440 C2RX0SID 0446 043E C2RX1CON C2RX0B1 043C C2RX1B4 0442 043A C2RX1B3 0444 0438 C2RX1B2 C2RX0DLC 0436 C2RX1B1 C2RX0EID 0432 0434 0430 C2RX1SID C2RX1DLC 042E C2TX0CON C2RX1EID 042C C2TX0B4 042A 0422 C2TX0EID C2TX0B3 0420 C2TX0SID 0428 041E C2TX1CON C2TX0B2 041C C2TX1B4 0424 041A C2TX1B3 0426 0418 C2TX1B2 C2TX0B1 0416 C2TX1B1 C2TX0DLC 0414 Addr. C2TX1DLC SFR Name TABLE 17-2: Reset State 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0u00 0uuu uuuu uuuu 0000 0000 0000 0000 0000 0100 1000 0000 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 000u uuuu 0000 uuuu uuuu uuuu 000u uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu 000u uuuu 0000 uuuu uuuu uuuu 000u uuuu uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u000 uuuu 0000 uuuu uuuu uuuu u000 uuuu uuuu 0000 0000 0000 0000 uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu uuuu u000 dsPIC30F DS70083C-page 129 dsPIC30F NOTES: DS70083C-page 130 Advance Information 2003 Microchip Technology Inc. dsPIC30F 18.0 18.1 DATA CONVERTER INTERFACE (DCI) MODULE Module Introduction The dsPIC30F Data Converter Interface (DCI) module allows simple interfacing of devices, such as audio coder/decoders (Codecs), A/D converters and D/A converters. The following interfaces are supported: * Framed Synchronous Serial Transfer (Single or Multi-Channel) * Inter-IC Sound (I2S) Interface * AC-Link Compliant mode 18.2.3.1 COFS PIN The Codec frame synchronization (COFS) pin is used to synchronize data transfers that occur on the CSDO and CSDI pins. The COFS pin may be configured as an input or an output. The data direction for the COFS pin is determined by the COFSD control bit in the DCICON1 register. The DCI module accesses the shadow registers while the CPU is in the process of accessing the memory mapped buffer registers. 18.2.4 BUFFER DATA ALIGNMENT * Programmable word size up to 16 bits * Support for up to 16 time slots, for a maximum frame size of 256 bits * Data buffering for up to 4 samples without CPU overhead Data values are always stored left justified in the buffers since most Codec data is represented as a signed 2's complement fractional number. If the received word length is less than 16 bits, the unused LS bits in the receive buffer registers are set to `0' by the module. If the transmitted word length is less than 16 bits, the unused LS bits in the transmit buffer register are ignored by the module. The word length setup is described in subsequent sections of this document. 18.2 18.2.5 The DCI module provides the following general features: Module I/O Pins There are four I/O pins associated with the module. When enabled, the module controls the data direction of each of the four pins. 18.2.1 CSCK PIN The CSCK pin provides the serial clock for the DCI module. The CSCK pin may be configured as an input or output using the CSCKD control bit in the DCICON2 SFR. When configured as an output, the serial clock is provided by the dsPIC30F. When configured as an input, the serial clock must be provided by an external device. 18.2.2 CSDO PIN The serial data output (CSDO) pin is configured as an output only pin when the module is enabled. The CSDO pin drives the serial bus whenever data is to be transmitted. The CSDO pin is tri-stated or driven to `0' during CSCK periods when data is not transmitted, depending on the state of the CSDOM control bit. This allows other devices to place data on the serial bus during transmission periods not used by the DCI module. 18.2.3 TRANSMIT/RECEIVE SHIFT REGISTER The DCI module has a 16-bit shift register for shifting serial data in and out of the module. Data is shifted in/ out of the shift register MS bit first, since audio PCM data is transmitted in signed 2's complement format. 18.2.6 DCI BUFFER CONTROL The DCI module contains a buffer control unit for transferring data between the shadow buffer memory and the serial shift register. The buffer control unit is a simple 2-bit address counter that points to word locations in the shadow buffer memory. For the receive memory space (high address portion of DCI buffer memory), the address counter is concatenated with a `0' in the MSb location to form a 3-bit address. For the transmit memory space (high portion of DCI buffer memory), the address counter is concatenated with a `1' in the MSb location. Note: The DCI buffer control unit always accesses the same relative location in the transmit and receive buffers, so only one address counter is provided. CSDI PIN The serial data input (CSDI) pin is configured as an input only pin when the module is enabled. 2003 Microchip Technology Inc. Advance Information DS70083C-page 131 dsPIC30F FIGURE 18-1: DCI MODULE BLOCK DIAGRAM BCG Control bits SCKD FOSC/4 Sample Rate CSCK Generator FSD Word Size Selection bits 16-bit Data Bus Frame Length Selection bits DCI Mode Selection bits Frame Synchronization Generator COFS Receive Buffer Registers w/Shadow DCI Buffer Control Unit 15 Transmit Buffer Registers w/Shadow 0 DCI Shift Register CSDI CSDO DS70083C-page 132 Advance Information 2003 Microchip Technology Inc. dsPIC30F 18.3 18.3.1 18.3.4 DCI Module Operation MODULE ENABLE The DCI module is enabled or disabled by setting/ clearing the DCIEN control bit in the DCICON1 SFR. Clearing the DCIEN control bit has the effect of resetting the module. In particular, all counters associated with CSCK generation, frame sync, and the DCI buffer control unit are reset. FRAME SYNC MODE CONTROL BITS The type of frame sync signal is selected using the Frame Synchronization mode control bits (COFSM<1:0>) in the DCICON1 SFR. The following operating modes can be selected: The DCI clocks are shutdown when the DCIEN bit is cleared. * * * * When enabled, the DCI controls the data direction for the four I/O pins associated with the module. The Port, LAT and TRIS register values for these I/O pins are overridden by the DCI module when the DCIEN bit is set. The operation of the COFSM control bits depends on whether the DCI module generates the frame sync signal as a master device, or receives the frame sync signal as a slave device. It is also possible to override the CSCK pin separately when the bit clock generator is enabled. This permits the bit clock generator to operate without enabling the rest of the DCI module. The master device in a DSP/Codec pair is the device that generates the frame sync signal. The frame sync signal initiates data transfers on the CSDI and CSDO pins and usually has the same frequency as the data sample rate (COFS). 18.3.2 The DCI module is a frame sync master if the COFSD control bit is cleared and is a frame sync slave if the COFSD control bit is set. WORD SIZE SELECTION BITS The WS<3:0> word size selection bits in the DCICON2 SFR determine the number of bits in each DCI data word. Essentially, the WS<3:0> bits determine the counting period for a 4-bit counter clocked from the CSCK signal. Any data length, up to 16-bits, may be selected. The value loaded into the WS<3:0> bits is one less the desired word length. For example, a 16-bit data word size is selected when WS<3:0> = 1111. Note: 18.3.3 These WS<3:0> control bits are used only in the Multi-Channel and I2S modes. These bits have no effect in AC-Link mode since the data slot sizes are fixed by the protocol. FRAME SYNC GENERATOR The frame sync generator (COFSG) is a 4-bit counter that sets the frame length in data words. The frame sync generator is incremented each time the word size counter is reset (refer to Section 18.3.2). The period for the frame synchronization generator is set by writing the COFSG<3:0> control bits in the DCICON2 SFR. The COFSG period in clock cycles is determined by the following formula: EQUATION 18-1: COFSG PERIOD Frame Length = Word Length * (FSG Value + 1) Frame lengths, up to 16 data words, may be selected. The frame length in CSCK periods can vary up to a maximum of 256 depending on the word size that is selected. Note: Multi-Channel mode I2S mode AC-Link mode (16-bit) AC-Link mode (20-bit) 18.3.5 MASTER FRAME SYNC OPERATION When the DCI module is operating as a frame sync master device (COFSD = 0), the COFSM mode bits determine the type of frame sync pulse that is generated by the frame sync generator logic. A new COFS signal is generated when the frame sync generator resets to `0'. In the Multi-Channel mode, the frame sync pulse is driven high for the CSCK period to initiate a data transfer. The number of CSCK cycles between successive frame sync pulses will depend on the word size and frame sync generator control bits. A timing diagram for the frame sync signal in Multi-Channel mode is shown in Figure 18-2. In the AC-Link mode of operation, the frame sync signal has a fixed period and duty cycle. The AC-Link frame sync signal is high for 16 CSCK cycles and is low for 240 CSCK cycles. A timing diagram with the timing details at the start of an AC-Link frame is shown in Figure 18-3. In the I2S mode, a frame sync signal having a 50% duty cycle is generated. The period of the I2S frame sync signal in CSCK cycles is determined by the word size and frame sync generator control bits. A new I2S data transfer boundary is marked by a high-to-low or a low-to-high transition edge on the COFS pin. The COFSG control bits will have no effect in AC-Link mode since the frame length is set to 256 CSCK periods by the protocol. 2003 Microchip Technology Inc. Advance Information DS70083C-page 133 dsPIC30F 18.3.6 SLAVE FRAME SYNC OPERATION When the DCI module is operating as a frame sync slave (COFSD = 1), data transfers are controlled by the Codec device attached to the DCI module. The COFSM control bits control how the DCI module responds to incoming COFS signals. In the Multi-Channel mode, a new data frame transfer will begin one CSCK cycle after the COFS pin is sampled high (see Figure 18-2). The pulse on the COFS pin resets the frame sync generator logic. FIGURE 18-2: In the I2S mode, a new data word will be transferred one CSCK cycle after a low-to-high or a high-to-low transition is sampled on the COFS pin. A rising or falling edge on the COFS pin resets the frame sync generator logic. In the AC-Link mode, the tag slot and subsequent data slots for the next frame will be transferred one CSCK cycle after the COFS pin is sampled high. The COFSG and WS bits must be configured to provide the proper frame length when the module is operating in the Slave mode. Once a valid frame sync pulse has been sampled by the module on the COFS pin, an entire data frame transfer will take place. The module will not respond to further frame sync pulses until the data frame transfer has completed. FRAME SYNC TIMING, MULTI-CHANNEL MODE CSCK COFS CSDI/CSDO FIGURE 18-3: MSB LSB FRAME SYNC TIMING, AC-LINK START OF FRAME BIT_CLK CSDO or CSDI S12 S12 S12 Tag Tag Tag bit 2 bit 1 LSb MSb bit 14 bit 13 SYNC FIGURE 18-4: I2S INTERFACE FRAME SYNC TIMING CSCK CSDI or CSDO MSB LSB MSB LSB WS Note: A 5-bit transfer is shown here for illustration purposes. The I2S protocol does not specify word length - this will be system dependent. DS70083C-page 134 Advance Information 2003 Microchip Technology Inc. dsPIC30F 18.3.7 18.3.8 BIT CLOCK GENERATOR The DCI module has a dedicated 12-bit time base that produces the bit clock. The bit clock rate (period) is set by writing a non-zero 12-bit value to the BCG<11:0> control bits in the DCICON1 SFR. When the BCG<11:0> bits are set to zero, the bit clock will be disabled. If the BCG<11:0> bits are set to a nonzero value, the bit clock generator is enabled. These bits should be set to `0' and the CSCKD bit set to `1' if the serial clock for the DCI is received from an external device. SAMPLE CLOCK EDGE CONTROL BIT The sample clock edge (CSCKE) control bit determines the sampling edge for the CSCK signal. If the CSCK bit is cleared (default), data will be sampled on the falling edge of the CSCK signal. The AC-Link protocols and most Multi-Channel formats require that data be sampled on the falling edge of the CSCK signal. If the CSCK bit is set, data will be sampled on the rising edge of CSCK. The I2S protocol requires that data be sampled on the rising edge of the CSCK signal. The formula for the bit clock frequency is given in Equation 18-2. 18.3.9 EQUATION 18-2: In most applications, the data transfer begins one CSCK cycle after the COFS signal is sampled active. This is the default configuration of the DCI module. An alternate data alignment can be selected by setting the DJST control bit in the DCICON2 SFR. When DJST = 1, data transfers will begin during the same CSCK cycle when the COFS signal is sampled active. BIT CLOCK FREQUENCY FBCK = FCY 2 * (BCG + 1) The required bit clock frequency will be determined by the system sampling rate and frame size. Typical bit clock frequencies range from 16x to 512x the converter sample rate depending on the data converter and the communication protocol that is used. To achieve bit clock frequencies associated with common audio sampling rates, the user will need to select a crystal frequency that has an `even' binary value. Examples of such crystal frequencies are listed in Table 18-1. TABLE 18-1: DEVICE FREQUENCIES FOR COMMON CODEC CSCK FREQUENCIES FOSC PLL FCYC 2.048 MHz 16x 32.768 MIPs 4.096 MHz 8x 32.768 MIPs 4.800 MHz 8x 38.4 MIPs 9.600 MHz 4x 38.4 MIPs Note 1: When the CSCK signal is applied externally (CSCKD = 1), the BCG<11:0> bits have no effect on the operation of the DCI module. 2: When the CSCK signal is applied externally (CSCKD = 1), the external clock high and low times must meet the device timing requirements. 2003 Microchip Technology Inc. 18.3.10 DATA JUSTIFICATION CONTROL BIT TRANSMIT SLOT ENABLE BITS The TSCON SFR has control bits that are used to enable up to 16 time slots for transmission. These control bits are the TSE<15:0> bits. The size of each time slot is determined by the WS<3:0> word size selection bits and can vary up to 16 bits. If a transmit time slot is enabled via one of the TSE bits (TSEx = 1), the contents of the current transmit shadow buffer location will be loaded into the CSDO Shift register and the DCI buffer control unit is incremented to point to the next location. During an unused transmit time slot, the CSDO pin will drive `0's or will be tri-stated during all disabled time slots depending on the state of the CSDOM bit in the DCICON1 SFR. The data frame size in bits is determined by the chosen data word size and the number of data word elements in the frame. If the chosen frame size has less than 16 elements, the additional slot enable bits will have no effect. Each transmit data word is written to the 16-bit transmit buffer as left justified data. If the selected word size is less than 16 bits, then the LS bits of the transmit buffer memory will have no effect on the transmitted data. The user should write `0's to the unused LS bits of each transmit buffer location. Advance Information DS70083C-page 135 dsPIC30F 18.3.11 RECEIVE SLOT ENABLE BITS The RSCON SFR contains control bits that are used to enable up to 16 time slots for reception. These control bits are the RSE<15:0> bits. The size of each receive time slot is determined by the WS<3:0> word size selection bits and can vary from 1 to 16 bits. If a receive time slot is enabled via one of the RSE bits (RSEx = 1), the shift register contents will be written to the current DCI receive shadow buffer location and the buffer control unit will be incremented to point to the next buffer location. Data is not packed in the receive memory buffer locations if the selected word size is less than 16 bits. Each received slot data word is stored in a separate 16-bit buffer location. Data is always stored in a left justified format in the receive memory buffer. 18.3.12 SLOT ENABLE BITS OPERATION WITH FRAME SYNC The TSE and RSE control bits operate in concert with the DCI frame sync generator. In the Master mode, a COFS signal is generated whenever the frame sync generator is reset. In the Slave mode, the frame sync generator is reset whenever a COFS pulse is received. The TSE and RSE control bits allow up to 16 consecutive time slots to be enabled for transmit or receive. After the last enabled time slot has been transmitted/ received, the DCI will stop buffering data until the next occurring COFS pulse. 18.3.13 SYNCHRONOUS DATA TRANSFERS 18.3.14 The amount of data that is buffered between interrupts is determined by the buffer length (BLEN<1:0>) control bits in the DCISTAT SFR. The size of the transmit and receive buffers may be varied from 1 to 4 data words using the BLEN control bits. The BLEN control bits are compared to the current value of the DCI buffer control unit address counter. When the 2 LS bits of the DCI address counter match the BLEN<1:0> value, the buffer control unit will be reset to `0'. In addition, the contents of the receive shadow registers are transferred to the receive buffer registers and the contents of the transmit buffer registers are transferred to the transmit shadow registers. 18.3.15 BUFFER ALIGNMENT WITH DATA FRAMES There is no direct coupling between the position of the AGU address pointer and the data frame boundaries. This means that there will be an implied assignment of each transmit and receive buffer that is a function of the BLEN control bits and the number of enabled data slots via the TSE and RSE control bits. As an example, assume that a 4-word data frame is chosen and that we want to transmit on all four time slots in the frame. This configuration would be established by setting the TSE0, TSE1, TSE2, and TSE3 control bits in the TSCON SFR. With this module setup, the TXBUF0 register would be naturally assigned to slot #0, the TXBUF1 register would be naturally assigned to slot #1, and so on. Note: The DCI buffer control unit will be incremented by one word location whenever a given time slot has been enabled for transmission or reception. In most cases, data input and output transfers will be synchronized, which means that a data sample is received for a given channel at the same time a data sample is transmitted. Therefore, the transmit and receive buffers will be filled with equal amounts of data when a DCI interrupt is generated. In some cases, the amount of data transmitted and received during a data frame may not be equal. As an example, assume a two-word data frame is used. Furthermore, assume that data is only received during slot #0 but is transmitted during slot #0 and slot #1. In this case, the buffer control unit counter would be incremented twice during a data frame but only one receive register location would be filled with data. DS70083C-page 136 BUFFER LENGTH CONTROL Advance Information When more than four time slots are active within a data frame, the user code must keep track of which time slots are to be read/written at each interrupt. In some cases, the alignment between transmit/ receive buffers and their respective slot assignments could be lost. Examples of such cases include an emulation breakpoint or a hardware trap. In these situations, the user should poll the SLOT status bits to determine what data should be loaded into the buffer registers to resynchronize the software with the DCI module. 2003 Microchip Technology Inc. dsPIC30F 18.3.16 TRANSMIT STATUS BITS 18.3.19 There are two transmit status bits in the DCISTAT SFR. The TMPTY bit is set when the contents of the transmit buffer registers are transferred to the transmit shadow registers. The TMPTY bit may be polled in software to determine when the transmit buffer registers may be written. The TMPTY bit is cleared automatically by the hardware when a write to one of the four transmit buffers occurs. The TUNF bit is read only and indicates that a transmit underflow has occurred for at least one of the transmit buffer registers that is in use. The TUNF bit is set at the time the transmit buffer registers are transferred to the transmit shadow registers. The TUNF status bit is cleared automatically when the buffer register that underflowed is written by the CPU. Note: 18.3.17 The transmit status bits only indicate status for buffer locations that are used by the module. If the buffer length is set to less than four words, for example, the unused buffer locations will not affect the transmit status bits. RECEIVE STATUS BITS There are two receive status bits in the DCISTAT SFR. CSDO MODE BIT The CSDOM control bit controls the behavior of the CSDO pin during unused transmit slots. A given transmit time slot is unused if it's corresponding TSEx bit in the TSCON SFR is cleared. If the CSDOM bit is cleared (default), the CSDO pin will be low during unused time slot periods. This mode will be used when there are only two devices attached to the serial bus. If the CSDOM bit is set, the CSDO pin will be tri-stated during unused time slot periods. This mode allows multiple devices to share the same CSDO line in a multichannel application. Each device on the CSDO line is configured so that it will only transmit data during specific time slots. No two devices will transmit data during the same time slot. 18.3.20 DIGITAL LOOPBACK MODE Digital Loopback mode is enabled by setting the DLOOP control bit in the DCISTAT SFR. When the DLOOP bit is set, the module internally connects the CSDO signal to CSDI. The actual data input on the CSDI I/O pin will be ignored in Digital Loopback mode. 18.3.21 UNDERFLOW MODE CONTROL BIT The ROV status bit is read only and indicates that a receive overflow has occurred for at least one of the receive buffer locations. A receive overflow occurs when the buffer location is not read by the CPU before new data is transferred from the shadow registers. The ROV status bit is cleared automatically when the buffer register that caused the overflow is read by the CPU. When an underflow occurs, one of two actions may occur depending on the state of the Underflow mode (UNFM) control bit in the DCICON2 SFR. If the UNFM bit is cleared (default), the module will transmit `0's on the CSDO pin during the active time slot for the buffer location. In this Operating mode, the Codec device attached to the DCI module will simply be fed digital `silence'. If the UNFM control bit is set, the module will transmit the last data written to the buffer location. This Operating mode permits the user to send continuous data to the Codec device without consuming CPU overhead. When a receive overflow occurs for a specific buffer location, the old contents of the buffer are overwritten. 18.4 The RFUL status bit is read only and indicates that new data is available in the receive buffers. The RFUL bit is cleared automatically when all receive buffers in use have been read by the CPU. Note: 18.3.18 The receive status bits only indicate status for buffer locations that are used by the module. If the buffer length is set to less than four words, for example, the unused buffer locations will not affect the transmit status bits. SLOT STATUS BITS The SLOT<3:0> status bits in the DCISTAT SFR indicate the current active time slot. These bits will correspond to the value of the frame sync generator counter. The user may poll these status bits in software when a DCI interrupt occurs to determine what time slot data was last received and which time slot data should be loaded into the TXBUF registers. 2003 Microchip Technology Inc. DCI Module Interrupts The frequency of DCI module interrupts is dependent on the BLEN<1:0> control bits in the DCICON2 SFR. An interrupt to the CPU is generated each time the set buffer length has been reached and a shadow register transfer takes place. A shadow register transfer is defined as the time when the previously written TXBUF values are transferred to the transmit shadow registers and new received values in the receive shadow registers are transferred into the RXBUF registers. Advance Information DS70083C-page 137 dsPIC30F 18.5 18.5.1 DCI Module Operation During CPU Sleep and Idle Modes DCI MODULE OPERATION DURING CPU SLEEP MODE The DCI module has the ability to operate while in Sleep mode and wake the CPU when the CSCK signal is supplied by an external device (CSCKD = 1). The DCI module will generate an asynchronous interrupt when a DCI buffer transfer has completed and the CPU is in Sleep mode. 18.5.2 DCI MODULE OPERATION DURING CPU IDLE MODE If the DCISIDL control bit is cleared (default), the module will continue to operate normally even in Idle mode. If the DCISIDL bit is set, the module will halt when Idle mode is asserted. 18.6 AC-Link Mode Operation The AC-Link protocol is a 256-bit frame with one 16-bit data slot, followed by twelve 20-bit data slots. The DCI module has two Operating modes for the AC-Link protocol. These Operating modes are selected by the COFSM<1:0> control bits in the DCICON1 SFR. The first AC-Link mode is called `16-bit AC-Link mode' and is selected by setting COFSM<1:0> = 10. The second AC-Link mode is called `20-bit AC-Link mode' and is selected by setting COFSM<1:0> = 11. 18.6.1 16-BIT AC-LINK MODE In the 16-bit AC-Link mode, data word lengths are restricted to 16 bits. Note that this restriction only affects the 20-bit data time slots of the AC-Link protocol. For received time slots, the incoming data is simply truncated to 16 bits. For outgoing time slots, the 4 LS bits of the data word are set to `0' by the module. This truncation of the time slots limits the A/D and DAC data to 16 bits but permits proper data alignment in the TXBUF and RXBUF registers. Each RXBUF and TXBUF register will contain one data time slot value. 18.6.2 20-BIT AC-LINK MODE The 20-bit AC-Link mode allows all bits in the data time slots to be transmitted and received but does not maintain data alignment in the TXBUF and RXBUF registers. The 20-bit mode treats each 256-bit AC-Link frame as sixteen, 16-bit time slots. In the 20-bit AC-Link mode, the module operates as if COFSG<3:0> = 1111 and WS<3:0> = 1111. The data alignment for 20-bit data slots is ignored. For example, an entire AC-Link data frame can be transmitted and received in a packed fashion by setting all bits in the TSCON and RSCON SFRs. Since the total available buffer length is 64 bits, it would take 4 consecutive interrupts to transfer the AC-Link frame. The application software must keep track of the current AC-Link frame segment. 18.7 I2S Mode Operation The DCI module is configured for I2S mode by writing a value of `01' to the COFSM<1:0> control bits in the DCICON1 SFR. When operating in the I2S mode, the DCI module will generate frame synchronization signals with a 50% duty cycle. Each edge of the frame synchronization signal marks the boundary of a new data word transfer. The user must also select the frame length and data word size using the COFSG and WS control bits in the DCICON2 SFR. 18.7.1 I2S FRAME AND DATA WORD LENGTH SELECTION The WS and COFSG control bits are set to produce the period for one half of an I2S data frame. That is, the frame length is the total number of CSCK cycles required for a left or a right data word transfer. The BLEN bits must be set for the desired buffer length. Setting BLEN<1:0> = 01 will produce a CPU interrupt, once per I2S frame. 18.7.2 I2S DATA JUSTIFICATION As per the I2S specification, a data word transfer will, by default, begin one CSCK cycle after a transition of the WS signal. A `MS bit left justified' option can be selected using the DJST control bit in the DCICON2 SFR. If DJST = 1, the I2S data transfers will be MS bit left justified. The MS bit of the data word will be presented on the CSDO pin during the same CSCK cycle as the rising or falling edge of the COFS signal. The CSDO pin is tri-stated after the data word has been sent. The 20-bit AC-Link mode functions similar to the MultiChannel mode of the DCI module, except for the duty cycle of the frame synchronization signal. The AC-Link frame synchronization signal should remain high for 16 CSCK cycles and should be low for the following 240 cycles. DS70083C-page 138 Advance Information 2003 Microchip Technology Inc. -- -- DCIEN -- 0240 0242 0244 DCICON1 DCICON2 DCICON3 DCISTAT 2003 Microchip Technology Inc. u = uninitialized bit 025A TXBUF1 Legend: 0258 TXBUF0 025E 0256 RXBUF3 TXBUF3 0254 RXBUF2 025C 0252 RXBUF1 TXBUF2 0250 RXBUF0 RSE15 RSE14 TSE14 TSE15 0248 024C TSCON -- -- 0246 RSCON -- -- RSE13 TSE13 -- -- -- DCISIDL Bit 13 Bit 15 Addr. SFR Name Bit 14 DCI REGISTER MAP TABLE 18-2: RSE12 TSE12 -- -- -- -- Bit 12 RSE11 TSE11 SLOT3 BLEN1 DLOOP Bit 11 RSE10 TSE10 SLOT2 BLEN0 CSCKD Bit 10 Bit 7 RSE8 TSE8 SLOT0 CSDOM Bit 6 RSE7 TSE7 -- DJST Bit 5 RSE6 TSE6 -- Transmit Buffer #3 Data Register Transmit Buffer #2 Data Register Transmit Buffer #1 Data Register Transmit Buffer #0 Data Register Receive Buffer #3 Data Register Receive Buffer #2 Data Register Receive Buffer #1 Data Register RSE5 TSE5 -- BCG<11:0> COFSG<3:0> COFSD UNFM Bit 8 Receive Buffer #0 Data Register RSE9 TSE9 SLOT1 -- CSCKE Bit 9 TSE3 ROV -- Bit 3 RSE4 RSE3 TSE4 -- -- -- Bit 4 RSE2 TSE2 RFUL -- Bit 2 RSE1 TSE1 TUNF WS<3:0> COFSM1 Bit 1 Reset State RSE0 TSE0 TMPTY 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 COFSM0 0000 0000 0000 0000 Bit 0 dsPIC30F Advance Information DS70083C-page 139 dsPIC30F NOTES: DS70083C-page 140 Advance Information 2003 Microchip Technology Inc. dsPIC30F 19.0 12-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The A/D module has six 16-bit registers: * * * * * * The 12-bit Analog-to-Digital converter (A/D) allows conversion of an analog input signal to a 12-bit digital number. This module is based on a Successive Approximation Register (SAR) architecture and provides a maximum sampling rate of 100 ksps. The A/D module has up to 16 analog inputs which are multiplexed into a sample and hold amplifier. The output of the sample and hold is the input into the converter which generates the result. The analog reference voltage is software selectable to either the device supply voltage (AVDD/AVSS) or the voltage level on the (VREF+/VREF-) pin. The A/D converter has a unique feature of being able to operate while the device is in Sleep mode with RC oscillator selection. A/D Control Register 1 (ADCON1) A/D Control Register 2 (ADCON2) A/D Control Register 3 (ADCON3) A/D Input Select Register (ADCHS) A/D Port Configuration Register (ADPCFG) A/D Input Scan Selection Register (ADCSSL) The ADCON1, ADCON2 and ADCON3 registers control the operation of the A/D module. The ADCHS register selects the input channels to be converted. The ADPCFG register configures the port pins as analog inputs or as digital I/O. The ADCSSL register selects inputs for scanning. Note: The SSRC<2:0>, ASAM, SMPI<3:0>, BUFM and ALTS bits, as well as the ADCON3 and ADCSSL registers, must not be written to while ADON = 1. This would lead to indeterminate results. The block diagram of the 12-bit A/D module is shown in Figure 19-1. FIGURE 19-1: 12-BIT A/D FUNCTIONAL BLOCK DIAGRAM VREF+ AVDD AVSS VREF- AN1 0001 AN2 0010 AN3 0011 AN4 0100 AN5 0101 AN6 0110 AN7 0111 AN8 1000 AN9 1001 AN10 1010 AN11 1011 AN12 1100 AN13 1101 AN14 1110 AN15 1111 CH0G CH0R 2003 Microchip Technology Inc. Comparator DAC 12-bit SAR Conversion Logic 16-word, 12-bit Dual Port Buffer Sample/Sequence Control Sample Input Switches S/H Bus Interface 0000 Data Format AN0 Input Mux Control CH0 Advance Information DS70083C-page 141 dsPIC30F 19.1 A/D Result Buffer 19.3 Selecting the Conversion Sequence The module contains a 16-word dual port read only buffer, called ADCBUF0...ADCBUFF, to buffer the A/D results. The RAM is 12 bits wide but the data obtained is represented in one of four different 16-bit data formats. The contents of the sixteen A/D Conversion Result Buffer registers, ADCBUF0 through ADCBUFF, cannot be written by user software. Several groups of control bits select the sequence in which the A/D connects inputs to the sample/hold channel, converts a channel, writes the buffer memory and generates interrupts. 19.2 The SMPI bits select the number of acquisition/ conversion sequences that would be performed before an interrupt occurs. This can vary from 1 sample per interrupt to 16 samples per interrupt. Conversion Operation After the A/D module has been configured, the sample acquisition is started by setting the SAMP bit. Various sources, such as a programmable bit, timer time-outs and external events, will terminate acquisition and start a conversion. When the A/D conversion is complete, the result is loaded into ADCBUF0...ADCBUFF, and the DONE bit and the A/D interrupt flag ADIF are set after the number of samples specified by the SMPI bit. The ADC module can be configured for different interrupt rates as described in Section 19.3. The following steps should be followed for doing an A/D conversion: 1. 2. 3. 4. 5. 6. 7. Configure the A/D module: * Configure analog pins, voltage reference and digital I/O * Select A/D input channels * Select A/D conversion clock * Select A/D conversion trigger * Turn on A/D module Configure A/D interrupt (if required): * Clear ADIF bit * Select A/D interrupt priority Start sampling. Wait the required acquisition time. Trigger acquisition end, start conversion: Wait for A/D conversion to complete, by either: * Waiting for the A/D interrupt Read A/D result buffer, clear ADIF if required. The sequence is controlled by the sampling clocks. The BUFM bit will split the 16-word results buffer into two 8-word groups. Writing to the 8-word buffers will be alternated on each interrupt event. Use of the BUFM bit will depend on how much time is available for the moving of the buffers after the interrupt. If the processor can quickly unload a full buffer within the time it takes to acquire and convert one channel, the BUFM bit can be `0' and up to 16 conversions (corresponding to the 16 input channels) may be done per interrupt. The processor will have one acquisition and conversion time to move the sixteen conversions. If the processor cannot unload the buffer within the acquisition and conversion time, the BUFM bit should be `1'. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111, then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt occurs. The next eight conversions will be loaded into the other 1/2 of the buffer. The processor will have the entire time between interrupts to move the eight conversions. The ALTS bit can be used to alternate the inputs selected during the sampling sequence. The input multiplexer has two sets of sample inputs: MUX A and MUX B. If the ALTS bit is `0', only the MUX A inputs are selected for sampling. If the ALTS bit is `1' and SMPI<3:0> = 0000 on the first sample/convert sequence, the MUX A inputs are selected and on the next acquire/convert sequence, the MUX B inputs are selected. The CSCNA bit (ADCON2<10>) will allow the multiplexer input to be alternately scanned across a selected number of analog inputs for the MUX A group. The inputs are selected by the ADCSSL register. If a particular bit in the ADCSSL register is `1', the corresponding input is selected. The inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. If the number of inputs selected is greater than the number of samples taken per interrupt, the higher numbered inputs are unused. DS70083C-page 142 Advance Information 2003 Microchip Technology Inc. dsPIC30F 19.4 Programming the Start of Conversion Trigger If the clearing of the ADON bit coincides with an autostart, the clearing has a higher priority and a new conversion will not start. The conversion trigger will terminate acquisition and start the requested conversions. After the A/D conversion is aborted, a 2 TAD wait is required before the next sampling may be started by setting the SAMP bit. The SSRC<2:0> bits select the source of the conversion trigger. The SSRC bits provide for up to 4 alternate sources of conversion trigger. 19.6 When SSRC<2:0> = 000, the conversion trigger is under software control. Clearing the SAMP bit will cause the conversion trigger. The A/D conversion requires 15 TAD. The source of the A/D conversion clock is software selected, using a six-bit counter. There are 64 possible options for TAD. When SSRC<2:0> = 111 (Auto-Start mode), the conversion trigger is under A/D clock control. The SAMC bits select the number of A/D clocks between the start of acquisition and the start of conversion. This provides the fastest conversion rates on multiple channels. SAMC must always be at least 1 clock cycle. EQUATION 19-1: The internal RC oscillator is selected by setting the ADRC bit. For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 667 nsec. Table 19-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected, (for VDD = 5V). Aborting a Conversion Clearing the ADON bit during a conversion will abort the current conversion and stop the sampling sequencing until the next sampling trigger. The ADCBUF will not be updated with the partially completed A/D conversion sample. That is, the ADCBUF will continue to contain the value of the last completed conversion (or the last value written to the ADCBUF register). TABLE 19-1: A/D CONVERSION CLOCK TAD = TCY * (0.5*(ADCS<5:0> + 1)) Other trigger sources can come from timer modules or external interrupts. 19.5 Selecting the A/D Conversion Clock TYPICAL TAD vs. DEVICE OPERATING FREQUENCIES A/D Clock Period (TAD Values) Device FCY A/D Clock Source Select A/D Clock ADRC ADCS<5:0> 30 MHz 25 MHz 12.5 MHz 6.25 MHz 1 MHz TCY/2 0 000000 16.67 ns(2) 20 ns(2) 40 ns(2) 80 ns(2) 500 ns(2) TCY 0 000001 33.33 ns(2) 40 ns(2) 80 ns(2) 160 ns(2) 1.0 s ns(2 ns(2) ns(2) ns(2) 2.0 s(3) 2 TCY 0 000011 4 TCY 0 000111 133.32 ns(2) 160 ns(2) 320 ns(2) 640 ns(2) 4.0 s(3) 8 TCY 0 001111 266.64 ns(2) 320 ns(2) 640 ns(2) 1.28 s(3) 8.0 s(3) 16 TCY 0 011111 533.28 ns(2) 640 ns(2) 1.28 s(3) 2.56 s(3) 16.0 s(3) RC 1 xxxxxx 200-400 ns(1,4) 200-400 ns(1,4) 200-400 ns(1) Note 1: 2: 3: 4: The RC source has a typical TAD time of 300 ns for VDD > 3.0V. These values violate the minimum required TAD time of 667 ns. For faster conversion times, the selection of another clock source is recommended. A/D cannot meet full accuracy with RC clock source and FOSC > 20 MHz. 2003 Microchip Technology Inc. 66.66 80 160 200-400 ns(1,4) 200-400 ns(1,4) Advance Information 320 DS70083C-page 143 dsPIC30F 19.7 EQUATION 19-2: A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 19-2. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 19-2. The impedance for analog sources must be small enough to meet accuracy requirements at the given speed. After the analog input channel is selected (changed), this sampling must be done before the conversion can be started. = VI * (1 - e (-TC/CHOLD (RIC+RSS+RS))) 1 - (VO / VI) = e (-TC/CHOLD (RIC+RSS+RS)) VO VI = VIN - VREF- VO = n * LSB - 1/2 LSB VO / VI = (n * LSB - 1/2 LSB) / n * LSB 1 - (VO / VI) = 1 / 2n 1 / 2n = e (-TC/CHOLD (RIC+RSS+RS)) To calculate the minimum acquisition time, Equation 192 may be used. This equation assumes that the input is stepped some multiple (n) of the LSB step size and the output must be captured to within 1/2 LSb error (8192 steps for 12-bit A/D). Note: TC = CHOLD * (RIC+RSS+RS) * -In(1/2 * n) TSMP = Amplifier Settling Time + Holding Capacitor Charging Time (TC) +Temperature Coefficient The temperature coefficient is only required for temperatures > 25C. TSMP = 0.5 s + CHOLD * (RIC+RSS+RS) * -In(1/2 * n) + [(Temp - 25C)(0.05 s/C)] The CHOLD is 18 pF for the A/D. FIGURE 19-2: A/D SAMPLING TIME EQUATIONS ANALOG INPUT MODEL VDD Rs ANx CPIN 5 pF VA Sampling Switch VT = 0.6V VT = 0.6V RIC 1k SS RSS CHOLD = DAC Capacitance = 18 pF ILEAKAGE 500 nA VSS Legend: CPIN = input capacitance VT = threshold voltage ILEAKAGE = leakage current at the pin due to various junctions RIC SS CHOLD = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) Sampling 3.5 Switch 3.0 (RSS k) 2.5 2.0 1.5 1.0 0.5 0 2 3 4 5 6 VDD (V) Note: Values shown here are untested typical values for reference only. Exact electrical specifications are to be determined. DS70083C-page 144 Advance Information 2003 Microchip Technology Inc. dsPIC30F 19.8 Module Power-down Modes The module has 3 internal Power modes. When the ADON bit is `1', the module is in Active mode; it is fully powered and functional. When ADON is `0', the module is in Off mode. The digital and analog portions of the circuit are disabled for maximum current savings. In order to return to the Active mode from Off mode, the user must wait for the ADC circuitry to stabilize. 19.9 19.9.1 A/D Operation During CPU Sleep and Idle Modes 19.9.2 A/D OPERATION DURING CPU IDLE MODE The ADSIDL bit selects if the module will stop on Idle or continue on Idle. If ADSIDL = 0, the module will continue operation on assertion of Idle mode. If ADSIDL = 1, the module will stop on Idle. 19.10 Effects of a Reset A/D OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic `0'. If Sleep occurs in the middle of a conversion, the conversion is aborted. The converter will not continue with a partially completed conversion on exit from Sleep mode. Register contents are not affected by the device entering or leaving Sleep mode. The A/D module can operate during Sleep mode if the A/D clock source is set to RC (ADRC = 1). When the RC clock source is selected, the A/D module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed which eliminates all digital switching noise from the conversion. When the conversion is complete, the CONV bit will be cleared and the result loaded into the ADCBUF register. FIGURE 19-3: If the A/D interrupt is enabled, the device will wake-up from Sleep. If the A/D interrupt is not enabled, the A/ D module will then be turned off, although the ADON bit will remain set. A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion and sampling sequence is aborted. The values that are in the ADCBUF registers are not modified. The A/D Result register will contain unknown data after a Power-on Reset. 19.11 Output Formats The A/D result is 12 bits wide. The data buffer RAM is also 12 bits wide. The 12-bit data can be read in one of four different formats. The FORM<1:0> bits select the format. Each of the output formats translates to a 16-bit result on the data bus. Write data will always be in right justified (integer) format. A/D OUTPUT DATA FORMATS RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Read to Bus: Signed Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Fractional d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 Signed Integer Integer 2003 Microchip Technology Inc. d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 Advance Information DS70083C-page 145 dsPIC30F 19.12 Configuring Analog Port Pins 19.13 Connection Considerations The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bit set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The analog inputs have diodes to VDD and VSS as ESD protection. This requires that the analog input be between VDD and VSS. If the input voltage exceeds this range by greater than 0.3V (either direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. The A/D operation is independent of the state of the CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits. An external RC filter is sometimes added for antialiasing of the input signal. The R component should be selected to ensure that the sampling time requirements are satisfied. Any external components connected (via high impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. When reading the Port register, all pins configured as analog input channels will read as cleared. Pins configured as digital inputs will not convert an analog input. Analog levels on any pin that is defined as a digital input (including the ANx pins) may cause the input buffer to consume current that exceeds the device specifications. DS70083C-page 146 Advance Information 2003 Microchip Technology Inc. 2003 Microchip Technology Inc. u = uninitialized bit CSSL15 CSSL14 CSSL13 Legend: -- -- ADSIDL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 13 CSSL12 Bit 8 -- -- FORM<1:0> Bit 9 CH0SB<3:0> SAMC<4:0> CSCNA -- Bit 10 -- ADRC BUFS Bit 7 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 Bit 5 CSSL6 CSSL5 PCFG6 PCFG5 -- -- -- -- ADC Data Buffer 15 ADC Data Buffer 14 ADC Data Buffer 13 ADC Data Buffer 12 ADC Data Buffer 11 ADC Data Buffer 10 ADC Data Buffer 9 ADC Data Buffer 8 ADC Data Buffer 7 ADC Data Buffer 6 ADC Data Buffer 5 ADC Data Buffer 4 ADC Data Buffer 3 ADC Data Buffer 2 ADC Data Buffer 1 ADC Data Buffer 0 Bit 6 SSRC<2:0> PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 -- -- CH0NB -- Bit 11 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 12 PCFG15 PCFG14 PCFG13 PCFG12 02A8 02AA -- -- ADCSSL 02A6 ADCHS -- VCFG<2:0> -- ADPCFG 02A2 02A4 ADCON2 02A0 ADCON1 ADCON3 -- -- 029E ADCBUFF -- -- -- ADCBUFE 029C ADON -- ADCBUFB -- 0294 ADCBUFA -- -- ADCBUFD 029A 0292 ADCBUF9 -- -- -- 0290 ADCBUF8 -- -- -- 028E ADCBUF7 -- -- ADCBUFC 0298 028C ADCBUF6 -- -- -- 028A ADCBUF5 -- -- -- 0288 ADCBUF4 -- -- 0296 0286 ADCBUF3 -- -- -- -- Bit 14 -- 0284 ADCBUF2 -- -- Bit 15 A/D CONVERTER REGISTER MAP -- 0280 0282 ADCBUF0 ADCBUF1 Addr. SFR Name TABLE 19-2: -- Bit 3 CSSL4 PCFG4 CH0NA ASAM Bit 2 BUFM SAMP Bit 1 CSSL3 CSSL2 CSSL1 PCFG3 PCFG2 PCFG1 CH0SA<3:0> ADCS<5:0> SMPI<3:0> -- Bit 4 CSSL0 PCFG0 ALTS DONE Bit 0 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu 0000 uuuu uuuu uuuu Reset State dsPIC30F Advance Information DS70083C-page 147 dsPIC30F NOTES: DS70083C-page 148 Advance Information 2003 Microchip Technology Inc. dsPIC30F 20.0 SYSTEM INTEGRATION There are several features intended to maximize system reliability, minimize cost through elimination of external components, provide Power Saving Operating modes and offer code protection: * Oscillator Selection * Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Programmable Brown-out Reset (BOR) * Watchdog Timer (WDT) * Power Saving Modes (Sleep and Idle) * Code Protection * Unit ID Locations * In-Circuit Serial Programming (ICSP) 20.1 * Various external and internal oscillator options as clock sources * An on-chip PLL to boost internal operating frequency * A clock switching mechanism between various clock sources * Programmable clock postscaler for system power savings * A Fail-Safe Clock Monitor (FSCM) that detects clock failure and takes fail-safe measures * Clock Control register (OSCCON) * Configuration bits for main oscillator selection Table 20-1 provides a summary of the dsPIC30F Oscillator Operating modes. A simplified diagram of the oscillator system is shown in Figure 20-1. OSCILLATOR OPERATING MODES Oscillator Mode XTL Oscillator System Overview The dsPIC30F oscillator system has the following modules and features: dsPIC30F devices have a Watchdog Timer which is permanently enabled via the configuration bits or can be software controlled. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT) which provides a delay on power-up only, designed to keep the part in Reset while the power supply stabilizes. With these two timers onchip, most applications need no external Reset circuitry. TABLE 20-1: Sleep mode is designed to offer a very low current Power-down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit a wide variety of applications. In the Idle mode, the clock sources are still active but the CPU is shut-off. The RC oscillator option saves system cost while the LP crystal option saves power. Description 200 kHz-4 MHz crystal on OSC1:OSC2. XT 4 MHz-10 MHz crystal on OSC1:OSC2. XT w/ PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled. XT w/ PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled. XT w/ PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1). LP 32 kHz crystal on SOSCO:SOSCI(2). HS 10 MHz-25 MHz crystal. EC External clock input (0-40 MHz). ECIO External clock input (0-40 MHz), OSC2 pin is I/O. EC w/ PLL 4x External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1). EC w/ PLL 8x External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1). EC w/ PLL 16x External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1). ERC External RC oscillator, OSC2 pin is FOSC/4 output(3). ERCIO External RC oscillator, OSC2 pin is I/O(3). FRC 8 MHz internal RC oscillator. LPRC Note 1: 2: 3: 512 kHz internal RC oscillator. dsPIC30F maximum operating frequency of 120 MHz must be met. LP oscillator can be conveniently shared as system clock, as well as real-time clock for Timer1. Requires external R and C. Frequency operation up to 4 MHz. 2003 Microchip Technology Inc. Advance Information DS70083C-page 149 dsPIC30F Configuration bits determine the clock source upon Power-on Reset (POR) and Brown-out Reset (BOR). Thereafter, the clock source can be changed between FIGURE 20-1: permissible clock sources. The OSCCON register controls the clock switching and reflects system clock related status bits. OSCILLATOR SYSTEM BLOCK DIAGRAM Oscillator Configuration bits PWRSAV Instruction Wake-up Request OSC1 OSC2 FPLL Primary Oscillator PLL PLL x4, x8, x16 Lock COSC<1:0> Primary Osc NOSC<1:0> Primary OSWEN Oscillator Stability Detector Oscillator POR Done Start-up Clock Timer Secondary Osc Switching Programmable and Control Clock Divider Block SOSCO SOSCI 32 kHz LP Oscillator System Clock Secondary 2 Oscillator Stability Detector Internal Fast RC POST<1:0> FRC Oscillator (FRC) Internal Low LPRC Power RC Oscillator (LPRC) Fail-Safe Clock FCKSM<1:0> 2 Monitor (FSCM) CF Oscillator Trap To Timer1 DS70083C-page 150 Advance Information 2003 Microchip Technology Inc. dsPIC30F 20.2 Oscillator Configurations 20.2.1 INITIAL CLOCK SOURCE SELECTION While coming out of Power-on Reset or Brown-out Reset, the device selects its clock source based on: a) b) FOS<1:0> configuration bits that select one of four oscillator groups, and FPR<3:0> configuration bits that select one of 13 oscillator choices within the primary group. The selection is as shown in Table 20-2. TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION Oscillator Mode Oscillator Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2 Function EC Primary 1 1 1 0 1 1 CLKO ECIO Primary 1 1 1 1 0 0 I/O EC w/ PLL 4x Primary 1 1 1 1 0 1 I/O EC w/ PLL 8x Primary 1 1 1 1 1 0 I/O EC w/ PLL 16x Primary 1 1 1 1 1 1 I/O ERC Primary 1 1 1 0 0 1 CLKO ERCIO Primary 1 1 1 0 0 0 I/O XT Primary 1 1 0 1 0 0 OSC2 XT w/ PLL 4x Primary 1 1 0 1 0 1 OSC2 XT w/ PLL 8x Primary 1 1 0 1 1 0 OSC2 XT w/ PLL 16x Primary 1 1 0 1 1 1 OSC2 XTL Primary 1 1 0 0 0 X OSC2 HS Primary 1 1 0 0 1 X OSC2 LP Secondary 0 0 -- -- -- -- (Notes 1, 2) FRC Internal FRC 0 1 -- -- -- -- (Notes 1, 2) Internal LPRC 1 0 -- -- -- -- (Notes 1, 2) LPRC Note 1: 2: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. 2003 Microchip Technology Inc. Advance Information DS70083C-page 151 dsPIC30F 20.2.2 OSCILLATOR START-UP TIMER (OST) In order to ensure that a crystal oscillator (or ceramic resonator) has started and stabilized, an Oscillator Start-up Timer is included. It is a simple 10-bit counter that counts 1024 TOSC cycles before releasing the oscillator clock to the rest of the system. The time-out period is designated as TOST. The TOST time is involved every time the oscillator has to restart (i.e., on POR, BOR and wake-up from Sleep). The Oscillator Start-up Timer is applied to the LP oscillator, XT, XTL, and HS modes (upon wake-up from Sleep, POR and BOR) for the primary oscillator. 20.2.3 LP OSCILLATOR CONTROL Enabling the LP oscillator is controlled with two elements: 1. 2. The current oscillator group bits COSC<1:0>. The LPOSCEN bit (OSCON register). The LP oscillator is on (even during Sleep mode) if LPOSCEN = 1. The LP oscillator is the device clock if: * COSC<1:0> = 00 (LP selected as main oscillator) and * LPOSCEN = 1 20.2.5 FAST RC OSCILLATOR (FRC) The FRC oscillator is a fast (8 MHz nominal) internal RC oscillator. This oscillator is intended to provide reasonable device operating speeds without the use of an external crystal, ceramic resonator, or RC network. The dsPIC30F operates from the FRC oscillator whenever the current oscillator selection control bits in the OSCCON register (OSCCON<13:12>) are set to `01'. 20.2.6 LOW POWER RC OSCILLATOR (LPRC) The LPRC oscillator is a component of the Watchdog Timer (WDT) and oscillates at a nominal frequency of 512 kHz. The LPRC oscillator is the clock source for the Power-up Timer (PWRT) circuit, WDT, and clock monitor circuits. It may also be used to provide a low frequency clock source option for applications where power consumption is critical and timing accuracy is not required The LPRC oscillator is always enabled at a Power-on Reset because it is the clock source for the PWRT. After the PWRT expires, the LPRC oscillator will remain on if one of the following is TRUE: Keeping the LP oscillator on at all times allows for a fast switch to the 32 kHz system clock for lower power operation. Returning to the faster main oscillator will still require a start-up time * The Fail-Safe Clock Monitor is enabled * The WDT is enabled * The LPRC oscillator is selected as the system clock via the COSC<1:0> control bits in the OSCCON register 20.2.4 If one of the above conditions is not true, the LPRC will shut-off after the PWRT expires. PHASE LOCKED LOOP (PLL) The PLL multiplies the clock which is generated by the primary oscillator. The PLL is selectable to have either gains of x4, x8, and x16. Input and output frequency ranges are summarized in Table 20-3. TABLE 20-3: PLL FREQUENCY RANGE FIN PLL Multiplier FOUT 4 MHz-10 MHz x4 16 MHz-40 MHz 4 MHz-10 MHz x8 32 MHz-80 MHz 4 MHz-7.5 MHz x16 64 MHz-160 MHz Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. The PLL features a lock output which is asserted when the PLL enters a phase locked state. Should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. The state of this signal is reflected in the read only LOCK bit in the OSCCON register. DS70083C-page 152 Advance Information 2003 Microchip Technology Inc. dsPIC30F 20.2.7 FAIL-SAFE CLOCK MONITOR The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by appropriately programming the FCKSM configuration bits (clock switch and monitor selection bits) in the FOSC Device Configuration register. If the FSCM function is enabled, the LPRC internal oscillator will run at all times (except during Sleep mode) and will not be subject to control by the SWDTEN bit. In the event of an oscillator failure, the FSCM will generate a clock failure trap event and will switch the system clock over to the FRC oscillator. The user will then have the option to either attempt to restart the oscillator or execute a controlled shutdown. The user may decide to treat the trap as a warm Reset by simply loading the Reset address into the oscillator fail trap vector. In this event, the CF (Clock Fail) status bit (OSCCON<3>) is also set whenever a clock failure is recognized. In the event of a clock failure, the WDT is unaffected and continues to run on the LPRC clock. If the oscillator has a very slow start-up time coming out of POR, BOR or Sleep, it is possible that the PWRT timer will expire before the oscillator has started. In such cases, the FSCM will be activated and the FSCM will initiate a clock failure trap, and the COSC<1:0> bits are loaded with FRC oscillator selection. This will effectively shut-off the original oscillator that was trying to start. The OSCCON register holds the control and status bits related to clock switching. * COSC<1:0>: Read only status bits always reflect the current oscillator group in effect. * NOSC<1:0>: Control bits which are written to indicate the new oscillator group of choice. - On POR and BOR, COSC<1:0> and NOSC<1:0> are both loaded with the configuration bit values FOS<1:0>. * LOCK: The LOCK status bit indicates a PLL lock. * CF: Read only status bit indicating if a clock fail detect has occurred. * OSWEN: Control bit changes from a `0' to a `1' when a clock transition sequence is initiated. Clearing the OSWEN control bit will abort a clock transition in progress (used for hang-up situations). If configuration bits FCKSM<1:0> = 1x, then the clock switching and Fail-Safe Clock monitoring functions are disabled. This is the default configuration bit setting. If clock switching is disabled, then the FOS<1:0> and FPR<3:0> bits directly control the oscillator selection and the COSC<1:0> bits do not control the clock selection. However, these bits will reflect the clock source selection. Note: The user may detect this situation and restart the oscillator in the clock fail trap ISR. Upon a clock failure detection, the FSCM module will initiate a clock switch to the FRC oscillator as follows: 1. 2. 3. The COSC bits (OSCCON<13:12>) are loaded with the FRC oscillator selection value. CF bit is set (OSCCON<3>). OSWEN control bit (OSCCON<0>) is cleared. For the purpose of clock switching, the clock sources are sectioned into four groups: 1. 2. 3. 4. Primary Secondary Internal FRC Internal LPRC 20.2.8 The application should not attempt to switch to a clock of frequency lower than 100 KHz when the fail-safe clock monitor is enabled. If such clock switching is performed, the device may generate an oscillator fail trap and switch to the Fast RC oscillator. PROTECTION AGAINST ACCIDENTAL WRITES TO OSCCON A write to the OSCCON register is intentionally made difficult because it controls clock switching and clock scaling. To write to the OSCCON low byte, the following code sequence must be executed without any other instructions in between: Byte Write "0x46" to OSCCON low Byte Write "0x57" to OSCCON low The user can switch between these functional groups but cannot switch between options within a group. If the primary group is selected, then the choice within the group is always determined by the FPR<3:0> configuration bits. Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. To write to the OSCCON high byte, the following instructions must be executed without any other instructions in between: Byte Write "0x78" to OSCCON high Byte Write "0x9A" to OSCCON high Byte write is allowed for one instruction cycle. Write the desired value or use bit manipulation instruction. 2003 Microchip Technology Inc. Advance Information DS70083C-page 153 dsPIC30F 20.3 Reset The dsPIC30F differentiates between various kinds of Reset: a) b) c) d) e) f) g) h) Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep Watchdog Timer (WDT) Reset (during normal operation) Programmable Brown-out Reset (BOR) RESET Instruction Reset caused by trap lockup (TRAPR) Reset caused by illegal opcode or by using an uninitialized W register as an address pointer (IOPUWR) FIGURE 20-2: Different registers are affected in different ways by various Reset conditions. Most registers are not affected by a WDT wake-up since this is viewed as the resumption of normal operation. Status bits from the RCON register are set or cleared differently in different Reset situations, as indicated in Table 20-4. These bits are used in software to determine the nature of the Reset. A block diagram of the On-Chip Reset Circuit is shown in Figure 20-2. A MCLR noise filter is provided in the MCLR Reset path. The filter detects and ignores small pulses. Internally generated Resets do not drive MCLR pin low. RESET SYSTEM BLOCK DIAGRAM RESET Instruction Digital Glitch Filter MCLR Sleep or Idle WDT Module VDD Rise Detect POR S VDD Brown-out Reset BOR BOREN R Q SYSRST Trap Conflict Illegal Opcode/ Uninitialized W Register 20.3.1 POR: POWER-ON RESET A power-on event will generate an internal POR pulse when a VDD rise is detected. The Reset pulse will occur at the POR circuit threshold voltage (VPOR) which is nominally 1.85V. The device supply voltage characteristics must meet specified starting voltage and rise rate requirements. The POR pulse will reset a POR timer and place the device in the Reset state. The POR also selects the device clock source identified by the oscillator configuration fuses. The POR circuit inserts a small delay, TPOR, which is nominally 10 s and ensures that the device bias circuits are stable. Furthermore, a user selected powerup time-out (TPWRT) is applied. The TPWRT parameter is based on device configuration bits and can be 0 ms (no delay), 4 ms, 16 ms, or 64 ms. The total delay is at device power-up, TPOR + TPWRT. When these delays have expired, SYSRST will be negated on the next leading edge of the Q1 clock and the PC will jump to the Reset vector. The timing for the SYSRST signal is shown in Figure 20-3 through Figure 20-5. DS70083C-page 154 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 20-4: VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 FIGURE 20-5: VDD MCLR INTERNAL POR TOST OST TIME-OUT TPWRT PWRT TIME-OUT INTERNAL Reset 2003 Microchip Technology Inc. Advance Information DS70083C-page 155 dsPIC30F 20.3.1.1 POR with Long Crystal Start-up Time (with FSCM Enabled) The oscillator start-up circuitry is not linked to the POR circuitry. Some crystal circuits (especially low frequency crystals) will have a relatively long start-up time. Therefore, one or more of the following conditions is possible after the POR timer and the PWRT have expired: * The oscillator circuit has not begun to oscillate. * The Oscillator Start-up Timer has not expired (if a crystal oscillator is used). * The PLL has not achieved a LOCK (if PLL is used). If the FSCM is enabled and one of the above conditions is true, then a clock failure trap will occur. The device will automatically switch to the FRC oscillator and the user can switch to the desired crystal oscillator in the trap ISR. 20.3.1.2 Operating without FSCM and PWRT A BOR will generate a Reset pulse which will reset the device. The BOR will select the clock source based on the device configuration bit values (FOS<1:0> and FPR<3:0>). Furthermore, if an Oscillator mode is selected, the BOR will activate the Oscillator Start-up Timer (OST). The system clock is held until OST expires. If the PLL is used, then the clock will be held until the LOCK bit (OSCCON<5>) is `1'. Concurrently, the POR time-out (TPOR) and the PWRT time-out (TPWRT) will be applied before the internal Reset is released. If TPWRT = 0 and a crystal oscillator is being used, then a nominal delay of TFSCM = 100 s is applied. The total delay in this case is (TPOR + TFSCM). The BOR status bit (RCON<1>) will be set to indicate that a BOR has occurred. The BOR circuit, if enabled, will continue to operate while in Sleep or Idle modes and will reset the device should VDD fall below the BOR threshold voltage. FIGURE 20-6: If the FSCM is disabled and the Power-up Timer (PWRT) is also disabled, then the device will exit rapidly from Reset on power-up. If the clock source is FRC, LPRC, EXTRC or EC, it will be active immediately. If the FSCM is disabled and the system clock has not started, the device will be in a frozen state at the Reset vector until the system clock starts. From the user's perspective, the device will appear to be in Reset until a system clock is available. 20.3.2 The BOR module allows selection of one of the following voltage trip points: * * * * VDD D C Note 1: 2: 3: Note: 2.0V 2.7V 4.2V 4.5V Note: R R1 BOR: PROGRAMMABLE BROWN-OUT RESET The BOR (Brown-out Reset) module is based on an internal voltage reference circuit. The main purpose of the BOR module is to generate a device Reset when a brown-out condition occurs. Brown-out conditions are generally caused by glitches on the AC mains (i.e., missing portions of the AC cycle waveform due to bad power transmission lines, or voltage sags due to excessive current draw when a large inductive load is turned on). EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) MCLR dsPIC30F External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. R should be suitably chosen so as to make sure that the voltage drop across R does not violate the device's electrical specifications. R1 should be suitably chosen so as to limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD), or Electrical Overstress (EOS). Dedicated supervisory devices, such as the MCP1XX and MCP8XX, may also be used as an external Power-on Reset circuit. The BOR voltage trip points indicated here are nominal values provided for design guidance only. Refer to the Electrical Specifications in the specific device data sheet for BOR voltage limit specifications. DS70083C-page 156 Advance Information 2003 Microchip Technology Inc. dsPIC30F Table 20-4 shows the Reset conditions for the RCON register. Since the control bits within the RCON register are R/W, the information in the table implies that all the bits are negated prior to the action specified in the condition column. TABLE 20-4: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 1 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 0 0 0 0 0 0 0 0 1 MCLR Reset during normal operation 0x000000 0 0 1 0 0 0 0 0 0 Software Reset during normal operation 0x000000 0 0 0 1 0 0 0 0 0 MCLR Reset during Sleep 0x000000 0 0 1 0 0 0 1 0 0 MCLR Reset during Idle 0x000000 0 0 1 0 0 1 0 0 0 WDT Time-out Reset 0x000000 0 0 0 0 1 0 0 0 0 PC + 2 WDT Wake-up 0 0 0 0 1 0 1 0 0 Interrupt Wake-up from Sleep PC + 2 (1) 0 0 0 0 0 0 1 0 0 Clock Failure Trap 0x000004 0 0 0 0 0 0 0 0 0 Trap Reset 0x000000 1 0 0 0 0 0 0 0 0 Illegal Operation Trap 0x000000 0 1 0 0 0 0 0 0 0 Legend: Note 1: u = unchanged, x = unknown, - = unimplemented bit, read as `0' When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. 2003 Microchip Technology Inc. Advance Information DS70083C-page 157 dsPIC30F Table 20-5 shows a second example of the bit conditions for the RCON register. In this case, it is not assumed the user has set/cleared specific bits prior to action specified in the condition column. TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER: CASE 2 Condition Program Counter TRAPR IOPUWR EXTR SWR WDTO Idle Sleep POR BOR Power-on Reset 0x000000 0 0 0 0 0 0 0 1 1 Brown-out Reset 0x000000 u u u u u u u 0 1 MCLR Reset during normal operation 0x000000 u u 1 0 0 0 0 u u Software Reset during normal operation 0x000000 u u 0 1 0 0 0 u u MCLR Reset during Sleep 0x000000 u u 1 u 0 0 1 u u MCLR Reset during Idle 0x000000 u u 1 u 0 1 0 u u WDT Time-out Reset 0x000000 u u 0 0 1 0 0 u u PC + 2 WDT Wake-up u u u u 1 u 1 u u Interrupt Wake-up from Sleep PC + 2 (1) u u u u u u 1 u u Clock Failure Trap 0x000004 u u u u u u u u u Trap Reset 0x000000 1 u u u u u u u u Illegal Operation Reset 0x000000 u 1 u u u u u u u Legend: Note 1: u = unchanged, x = unknown, - = unimplemented bit, read as `0' When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector. DS70083C-page 158 Advance Information 2003 Microchip Technology Inc. dsPIC30F 20.4 20.4.1 Watchdog Timer (WDT) 20.6 WATCHDOG TIMER OPERATION The primary function of the Watchdog Timer (WDT) is to reset the processor in the event of a software malfunction. The WDT is a free-running timer which runs off an on-chip RC oscillator, requiring no external component. Therefore, the WDT timer will continue to operate even if the main processor clock (e.g., the crystal oscillator) fails. 20.4.2 ENABLING AND DISABLING THE WDT The Watchdog Timer can be "Enabled" or "Disabled" only through a configuration bit (FWDTEN) in the Configuration register, FWDT. Setting FWDTEN = 1 enables the Watchdog Timer. The enabling is done when programming the device. By default, after chip erase, FWDTEN bit = 1. Any device programmer capable of programming dsPIC30F devices allows programming of this and other configuration bits. If enabled, the WDT will increment until it overflows or "times out". A WDT time-out will force a device Reset (except during Sleep). To prevent a WDT time-out, the user must clear the Watchdog Timer using a CLRWDT instruction. If a WDT times out during Sleep, the device will wakeup. The WDTO bit in the RCON register will be cleared to indicate a wake-up resulting from a WDT time-out. Setting FWDTEN = 0 allows user software to enable/ disable the Watchdog Timer via the SWDTEN (RCON<5>) control bit. Power Saving Modes There are two power saving states that can be entered through the execution of a special instruction, PWRSAV; these are Sleep and Idle. The format of the PWRSAV instruction is as follows: PWRSAV <parameter>, where `parameter' defines Idle or Sleep mode. 20.6.1 The Fail-Safe Clock Monitor is not functional during Sleep since there is no clock to monitor. However, LPRC clock remains active if WDT is operational during Sleep. The brown-out protection circuit and the Low Voltage Detect circuit, if enabled, will remain functional during Sleep. The processor wakes up from Sleep if at least one of the following conditions has occurred: * any interrupt that is individually enabled and meets the required priority level * any Reset (POR, BOR and MCLR) * WDT time-out On waking up from Sleep mode, the processor will restart the same clock that was active prior to entry into Sleep mode. When clock switching is enabled, bits COSC<1:0> will determine the oscillator source that will be used on wake-up. If clock switch is disabled, then there is only one system clock. Note: 20.5 Low Voltage Detect The Low Voltage Detect (LVD) module is used to detect when the VDD of the device drops below a threshold value, VLVD, which is determined by the LVDL<3:0> bits (RCON<11:8>) and is thus user programmable. The internal voltage reference circuitry requires a nominal amount of time to stabilize, and the BGST bit (RCON<13>) indicates when the voltage reference has stabilized. In some devices, the LVD threshold voltage may be applied externally on the LVDIN pin. The LVD module is enabled by setting the LVDEN bit (RCON<12>). 2003 Microchip Technology Inc. SLEEP MODE In Sleep mode, the clock to the CPU and peripherals is shutdown. If an on-chip oscillator is being used, it is shutdown. If a POR or BOR occurred, the selection of the oscillator is based on the FOS<1:0> and FPR<3:0> configuration bits. If the clock source is an oscillator, the clock to the device will be held off until OST times out (indicating a stable oscillator). If PLL is used, the system clock is held off until LOCK = 1 (indicating that the PLL is stable). In either case, TPOR, TLOCK and TPWRT delays are applied. If EC, FRC, LPRC or EXTRC oscillators are used, then a delay of TPOR (~ 10 s) is applied. This is the smallest delay possible on wake-up from Sleep. Moreover, if LP oscillator was active during Sleep and LP is the oscillator used on wake-up, then the start-up delay will be equal to TPOR. PWRT delay and OST timer delay are not applied. In order to have -the smallest possible start-up delay when waking up from Sleep, one of these faster wake-up options should be selected before entering Sleep. Advance Information DS70083C-page 159 dsPIC30F Any interrupt that is individually enabled (using the corresponding IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Sleep status bit in the RCON register is set upon wake-up. Note: In spite of various delays applied (TPOR, TLOCK and TPWRT), the crystal oscillator (and PLL) may not be active at the end of the time-out (e.g., for low frequency crystals). In such cases, if FSCM is enabled, then the device will detect this as a clock failure and process the clock failure trap, the FRC oscillator will be enabled and the user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the device will simply suspend execution of code until the clock is stable and will remain in Sleep until the oscillator clock has started. All Resets will wake-up the processor from Sleep mode. Any Reset, other than POR, will set the Sleep status bit. In a POR, the Sleep bit is cleared. If the Watchdog Timer is enabled, then the processor will wake-up from Sleep mode upon WDT time-out. The Sleep and WDTO status bits are both set. 20.6.2 IDLE MODE Any interrupt that is individually enabled (using IE bit) and meets the prevailing priority level will be able to wake-up the processor. The processor will process the interrupt and branch to the ISR. The Idle status bit in the RCON register is set upon wake-up. Any Reset other than POR will set the Idle status bit. On a POR, the Idle bit is cleared. If Watchdog Timer is enabled, then the processor will wake-up from Idle mode upon WDT time-out. The Idle and WDTO status bits are both set. Unlike wake-up from Sleep, there are no time delays involved in wake-up from Idle. 20.7 The configuration bits in each device configuration register specify some of the Device modes and are programmed by a device programmer, or by using the In-Circuit Serial ProgrammingTM (ICSPTM) feature of the device. Each device configuration register is a 24-bit register, but only the lower 16 bits of each register are used to hold configuration data. There are four device configuration registers available to the user: 1. 2. In Idle mode, the clock to the CPU is shutdown while peripherals keep running. Unlike Sleep mode, the clock source remains active. Device Configuration Registers 3. FOSC (0xF80000): Oscillator Configuration Register FWDT (0xF80002): Watchdog Timer Configuration Register FBORPOR (0xF80004): BOR and POR Configuration Register FGS (0xF8000A): General Code Segment Configuration Register Several peripherals have a control bit in each module that allows them to operate during Idle. 4. LPRC Fail-Safe Clock remains active if clock failure detect is enabled. The placement of the configuration bits is automatically handled when you select the device in your device programmer. The desired state of the configuration bits may be specified in the source code (dependent on the language tool used), or through the programming interface. After the device has been programmed, the application software may read the configuration bit values through the table read instructions. For additional information, please refer to the Programming Specifications of the device. The processor wakes up from Idle if at least one of the following conditions has occurred: * any interrupt that is individually enabled (IE bit is `1') and meets the required priority level * any Reset (POR, BOR, MCLR) * WDT time-out Upon wake-up from Idle mode, the clock is re-applied to the CPU and instruction execution begins immediately, starting with the instruction following the PWRSAV instruction. DS70083C-page 160 Note: Advance Information If the code protection configuration fuse bits (FGS<GCP> and FGS<GWRP>) have been programmed, an erase of the entire code-protected device is only possible at voltages VDD 4.5V. 2003 Microchip Technology Inc. dsPIC30F 20.8 Peripheral Module Disable (PMD) Registers The Peripheral Module Disable (PMD) registers provide a method to disable a peripheral module by stopping all clock sources supplied to that module. When a peripheral is disabled via the appropriate PMD control bit, the peripheral is in a minimum power consumption state. The control and status registers associated with the peripheral will also be disabled so writes to those registers will have no effect and read values will be invalid. A peripheral module will only be enabled if both the associated bit in the the PMD register is cleared and the peripheral is supported by the specific dsPIC variant. If the peripheral is present in the device, it is enabled in the PMD register by default. Note: If a PMD bit is set, the corresponding module is disabled after a delay of 1 instruction cycle. Similarly, if a PMD bit is cleared, the corresponding module is enabled after a delay of 1 instruction cycle (assuming the module control registers are already configured to enable module operation). 20.9 When MPLAB ICD2 is selected as a Debugger, the InCircuit Debugging functionality is enabled. This function allows simple debugging functions when used with MPLAB IDE. When the device has this feature enabled, some of the resources are not available for general use. These resources include the first 80 bytes of Data RAM and two I/O pins. One of four pairs of Debug I/O pins may be selected by the user using configuration options in MPLAB IDE. These pin pairs are named EMUD/EMUC, EMUD1/ EMUC1, EMUD2/EMUC2 and MUD3/EMUC3. In each case, the selected EMUD pin is the Emulation/ Debug Data line, and the EMUC pin is the Emulation/ Debug Clock line. These pins will interface to the MPLAB ICD 2 module available from Microchip. The selected pair of Debug I/O pins is used by MPLAB ICD 2 to send commands and receive responses, as well as to send and receive data. To use the In-Circuit Debugger function of the device, the design must implement ICSP connections to MCLR, VDD, VSS, PGC, PGD, and the selected EMUDx/EMUCx pin pair. This gives rise to two possibilities: 1. 2. 2003 Microchip Technology Inc. In-Circuit Debugger If EMUD/EMUC is selected as the Debug I/O pin pair, then only a 5-pin interface is required, as the EMUD and EMUC pin functions are multiplexed with the PGD and PGC pin functions in all dsPIC30F devices. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/ EMUC3 is selected as the Debug I/O pin pair, then a 7-pin interface is required, as the EMUDx/EMUCx pin functions (x = 1, 2 or 3) are not multiplexed with the PGD and PGC pin functions. Advance Information DS70083C-page 161 DS70083C-page 162 PMD2 IC8MD T5MD -- IC7MD T4MD -- Bit 13 IC6MD T3MD IC5MD T2MD COSC<1:0> LVDEN Bit 12 IC4MD T1MD -- Bit 11 Bit 9 MCLREN -- -- F80004 F8000A FBORPOR FGS Bit 14 -- -- -- FSCKM<1:0> -- F80002 FWDTEN -- F80000 FOSC FWDT Bit 15 -- Bits 23-16 -- -- -- -- Bit 13 -- -- -- -- Bit 12 -- -- -- -- Bit 11 IC1MD DCIMD -- IC2MD -- IC3MD NOSC<1:0> Bit 8 -- LVDL<3:0> Bit 10 DEVICE CONFIGURATION REGISTER MAP Addr. TABLE 20-7: File Name Bit 14 TRAPR IOPUWR BGST Bit 15 SYSTEM INTEGRATION REGISTER MAP Reset state depends on type of Reset. Reset state depends on configuration bits. 0770 0772 PMD1 1: 2: 0742 Note 0740 OSCCON Addr. RCON SFR Name TABLE 20-6: SWR Bit 6 U2MD -- -- -- -- Bit 10 Bit 8 OC6MD U1MD LOCK SWDTEN Bit 5 -- -- -- -- -- -- FOS<1:0> Bit 9 OC8MD OC7MD I2CMD POST<1:0> EXTR Bit 7 CF Sleep Bit 3 -- BOREN -- -- Bit 7 OC5MD C2MD -- Idle Bit 2 -- -- -- -- Bit 6 C1MD -- Bit 4 OC2MD -- BORV<1:0> -- POR Bit 0 (Note 2) (Note 1) Reset State -- -- Bit 3 Bit 1 -- -- Bit 0 GCP GWRP FPWRT<1:0> FWPSB<3:0> FPR<3:0> Bit 2 OC1MD 0000 0000 0000 0000 ADCMD 0000 0000 0000 0000 LPOSCEN OSWEN BOR Bit 1 FWPSA<1:0> -- Bit 5 OC4MD OC3MD SPI2MD SPI1MD -- WDTO Bit 4 dsPIC30F Advance Information 2003 Microchip Technology Inc. dsPIC30F 21.0 INSTRUCTION SET SUMMARY The dsPIC30F instruction set adds many enhancements to the previous PICmicro(R) instruction sets, while maintaining an easy migration from PICmicro instruction sets. Most instructions are a single program memory word (24 bits). Only three instructions require two program memory locations. Each single word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into five basic categories: * * * * * Most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: * The W register (with or without an address modifier) or file register (specified by the value of `Ws' or `f') * The bit in the W register or file register (specified by a literal value or indirectly by the contents of register `Wb') The literal instructions that involve data movement may use some of the following operands: * A literal value to be loaded into a W register or file register (specified by the value of `k') * The W register or file register where the literal value is to be loaded (specified by `Wb' or `f') However, literal instructions that involve arithmetic or logical operations use some of the following operands: Word or byte-oriented operations Bit-oriented operations Literal operations DSP operations Control operations Table 21-1 shows the general symbols used in describing the instructions. The dsPIC30F instruction set summary in Table 21-2 lists all the instructions, along with the status flags affected by each instruction. Most word or byte-oriented W register instructions (including barrel shift instructions) have three operands: * The first source operand which is typically a register `Wb' without any address modifier * The second source operand which is typically a register `Ws' with or without an address modifier * The destination of the result which is typically a register `Wd' with or without an address modifier However, word or byte-oriented file register instructions have two operands: * The file register specified by the value `f' * The destination, which could either be the file register `f' or the W0 register, which is denoted as `WREG' * The first source operand which is a register `Wb' without any address modifier * The second source operand which is a literal value * The destination of the result (only if not the same as the first source operand) which is typically a register `Wd' with or without an address modifier The MAC class of DSP instructions may use some of the following operands: * The accumulator (A or B) to be used (required operand) * The W registers to be used as the two operands * The X and Y address space pre-fetch operations * The X and Y address space pre-fetch destinations * The accumulator write back destination The other DSP instructions do not involve any multiplication, and may include: * The accumulator to be used (required) * The source or destination operand (designated as Wso or Wdo, respectively) with or without an address modifier * The amount of shift specified by a W register `Wn' or a literal value The control instructions may use some of the following operands: * A program memory address * The mode of the table read and table write instructions 2003 Microchip Technology Inc. Advance Information DS70083C-page 163 dsPIC30F All instructions are a single word, except for certain double-word instructions, which were made doubleword instructions so that all the required information is available in these 48 bits. In the second word, the 8 MSbs are `0's. If this second word is executed as an instruction (by itself), it will execute as a NOP. Most single word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (unconditional/computed branch), indirect CALL/GOTO, all table reads and writes, and RETURN/RETFIE instructions, TABLE 21-1: which are single word instructions but take two or three cycles. Certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is performed, depending on whether the instruction being skipped is a single word or twoword instruction. Moreover, double-word moves require two cycles. The double-word instructions execute in two instruction cycles. Note: For more details on the instruction set, refer to the Programmer's Reference Manual. SYMBOLS USED IN OPCODE DESCRIPTIONS Field Description #text Means literal defined by "text" (text) Means "content of text" [text] Means "the location addressed by text" { } Optional field or operation <n:m> Register bit field .b Byte mode selection .d Double-Word mode selection .S Shadow register select .w Word mode selection (default) Acc One of two accumulators {A, B} AWB Accumulator write back destination address register {W13, [W13]+=2} bit4 4-bit bit selection field (used in word addressed instructions) {0...15} C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero Expr Absolute address, label or expression (resolved by the linker) f File register address {0x0000...0x1FFF} lit1 1-bit unsigned literal {0,1} lit4 4-bit unsigned literal {0...15} lit5 5-bit unsigned literal {0...31} lit8 8-bit unsigned literal {0...255} lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode lit14 14-bit unsigned literal {0...16384} lit16 16-bit unsigned literal {0...65535} lit23 23-bit unsigned literal {0...8388608}; LSB must be 0 None Field does not require an entry, may be blank OA, OB, SA, SB DSP status bits: AccA Overflow, AccB Overflow, AccA Saturate, AccB Saturate PC Program Counter Slit10 10-bit signed literal {-512...511} Slit16 16-bit signed literal {-32768...32767} Slit6 6-bit signed literal {-16...16} DS70083C-page 164 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED) Field Description Wb Base W register {W0..W15} Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } Wdo Destination W register { Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] } Wm,Wn Dividend, Divisor working register pair (direct addressing) Wm*Wm Multiplicand and Multiplier working register pair for Square instructions {W4*W4,W5*W5,W6*W6,W7*W7} Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions {W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7} Wn One of 16 working registers {W0..W15} Wnd One of 16 destination working registers {W0..W15} Wns One of 16 source working registers {W0..W15} WREG W0 (working register used in file register instructions) Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } Wso Source W register { Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] } Wx X data space pre-fetch address register for DSP instructions {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2, [W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2, [W9+W12],none} Wxd X data space pre-fetch destination register for DSP instructions {W4..W7} Wy Y data space pre-fetch address register for DSP instructions {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2, [W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2, [W11+W12], none} Wyd Y data space pre-fetch destination register for DSP instructions {W4..W7} 2003 Microchip Technology Inc. Advance Information DS70083C-page 165 dsPIC30F TABLE 21-2: Base Instr # 1 2 3 4 5 6 7 8 INSTRUCTION SET OVERVIEW Assembly Mnemonic ADD ADDC AND ASR BCLR BRA BSET BSW Assembly Syntax Description # of # of Words Cycles Status Flags Affected ADD Acc Add Accumulators 1 1 ADD f f = f + WREG 1 1 OA,OB,SA,SB C,DC,N,OV,Z ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z AND f f = f .AND. WREG 1 1 N,Z AND f,WREG WREG = f .AND. WREG 1 1 N,Z AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z BCLR f,#bit4 Bit Clear f 1 1 None BCLR Ws,#bit4 Bit Clear Ws 1 1 None BRA C,Expr Branch if Carry 1 1 (2) None BRA GE,Expr Branch if greater than or equal 1 1 (2) None BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None BRA GT,Expr Branch if greater than 1 1 (2) None BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None BRA LE,Expr Branch if less than or equal 1 1 (2) None BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None BRA LT,Expr Branch if less than 1 1 (2) None BRA LTU,Expr Branch if unsigned less than 1 1 (2) None BRA N,Expr Branch if Negative 1 1 (2) None BRA NC,Expr Branch if Not Carry 1 1 (2) None BRA NN,Expr Branch if Not Negative 1 1 (2) None BRA NOV,Expr Branch if Not Overflow 1 1 (2) None BRA NZ,Expr Branch if Not Zero 1 1 (2) None BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None BRA OV,Expr Branch if Overflow 1 1 (2) None BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None BRA Expr Branch Unconditionally 1 2 None BRA Z,Expr Branch if Zero 1 1 (2) None BRA Wn Computed Branch 1 2 None BSET f,#bit4 Bit Set f 1 1 None BSET Ws,#bit4 Bit Set Ws 1 1 None BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None DS70083C-page 166 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 21-2: Base Instr # 9 10 11 12 13 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic BTG BTSC BTSS BTST BTSTS 14 CALL 15 CLR Assembly Syntax f,#bit4 Bit Toggle f 1 1 Ws,#bit4 Bit Toggle Ws 1 1 None BTSC f,#bit4 Bit Test f, Skip if Clear 1 1 (2 or 3) None BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1 (2 or 3) None BTSS f,#bit4 Bit Test f, Skip if Set 1 1 (2 or 3) None BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1 (2 or 3) None BTST f,#bit4 Bit Test f 1 1 Z Ws,#bit4 Bit Test Ws to C 1 1 C BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z BTSTS f,#bit4 Bit Test then Set f 1 1 Z C BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z CALL lit23 Call subroutine 2 2 None CALL Wn Call indirect subroutine 1 2 None CLR f f = 0x0000 1 1 None CLR WREG WREG = 0x0000 1 1 None CLR Ws Ws = 0x0000 1 1 None CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB Clear Watchdog Timer 1 1 WDTO,Sleep f f=f 1 1 N,Z COM f,WREG WREG = f 1 1 N,Z COM Ws,Wd Wd = Ws 1 1 N,Z CP f Compare f with WREG 1 1 C,DC,N,OV,Z 17 COM COM 20 21 CP0 CP1 CPB None BTST.C CLRWDT 19 Status Flags Affected BTG CLRWDT CP # of # of Words Cycles BTG 16 18 Description CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z C,DC,N,OV,Z CP1 f Compare f with 0xFFFF 1 1 CP1 Ws Compare Ws with 0xFFFF 1 1 C,DC,N,OV,Z CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z CPB Wb,Ws Compare Wb with Ws, with Borrow (Wb - Ws - C) 1 1 C,DC,N,OV,Z 22 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1 (2 or 3) None 23 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1 (2 or 3) None 24 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1 (2 or 3) None 25 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 1 1 (2 or 3) None 26 DAW DAW Wn Wn = decimal adjust Wn 1 1 C 27 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z 28 DEC2 DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z C,DC,N,OV,Z DEC2 f f = f -2 1 1 DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z 2003 Microchip Technology Inc. Advance Information DS70083C-page 167 dsPIC30F TABLE 21-2: Base Instr # INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic Assembly Syntax Description # of # of Words Cycles Status Flags Affected 29 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None 30 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV N,Z,C,OV 31 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 32 DO DO #lit14,Expr Do code to PC+Expr, lit14+1 times 2 2 None DO Wn,Expr Do code to PC+Expr, (Wn)+1 times 2 2 None 33 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB, SA,SB,SAB 34 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB, SA,SB,SAB 35 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None 36 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C 37 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C 38 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C 39 GOTO GOTO Expr Go to address 2 2 None GOTO Wn Go to indirect 1 2 None 40 INC INC f f=f+1 1 1 C,DC,N,OV,Z INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z INC2 f f=f+2 1 1 C,DC,N,OV,Z INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z IOR f f = f .IOR. WREG 1 1 N,Z IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z 41 42 INC2 IOR IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB, SA,SB,SAB 44 LNK LNK #lit14 Link frame pointer 1 1 None 45 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z 43 46 47 48 MAC MOV MOVSAC LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd, AWB Multiply and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB, SA,SB,SAB MOV f,Wn Move f to Wn 1 1 None MOV f Move f to f 1 1 N,Z MOV f,WREG Move f to WREG 1 1 N,Z MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None MOV Wn,f Move Wn to f 1 1 None MOV Wso,Wdo Move Ws to Wd 1 1 None MOV WREG,f Move WREG to f 1 1 N,Z MOV.D Wns,Wd Move Double from W(ns):W(ns+1) to Wd 1 2 None MOV.D Ws,Wnd Move Double from Ws to W(nd+1):W(nd) 1 2 None Pre-fetch and store accumulator 1 1 None MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB DS70083C-page 168 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 21-2: Base Instr # 49 INSTRUCTION SET OVERVIEW (CONTINUED) Assembly Mnemonic MPY Assembly Syntax Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB, SA,SB,SAB Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None Multiply and Subtract from Accumulator 1 1 OA,OB,OAB, SA,SB,SAB MPY.N MPY.N MSC MSC 52 MUL 54 55 NOP POP Wm*Wm,Acc,Wx,Wxd,Wy,Wyd, AWB MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(Ws) 1 1 None MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) * unsigned(lit5) 1 1 None MUL f W3:W2 = f * WREG 1 1 None NEG Acc Negate Accumulator 1 1 OA,OB,OAB, SA,SB,SAB NEG f f=f+1 1 1 C,DC,N,OV,Z NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z NEG Ws,Wd C,DC,N,OV,Z Wd = Ws + 1 1 1 NOP No Operation 1 1 None NOPR No Operation 1 1 None POP f Pop f from top-of-stack (TOS) 1 1 None POP Wdo Pop from top-of-stack (TOS) to Wdo 1 1 None POP.D Wnd Pop from top-of-stack (TOS) to W(nd):W(nd+1) 1 2 None Pop Shadow Registers 1 1 All Push f to top-of-stack (TOS) 1 1 None None POP.S 56 PUSH Status Flags Affected Wm*Wn,Acc,Wx,Wxd,Wy,Wyd 50 NEG # of # of Words Cycles MPY 51 53 Description PUSH f PUSH Wso Push Wso to top-of-stack (TOS) 1 1 PUSH.D Wns Push W(ns):W(ns+1) to top-of-stack (TOS) 1 2 None Push Shadow Registers 1 1 None WDTO,Sleep PUSH.S 57 PWRSAV PWRSAV Go into Sleep or Idle mode 1 1 58 RCALL RCALL Expr Relative Call 1 2 None RCALL Wn Computed Call 1 2 None 59 REPEAT #lit1 REPEAT #lit14 Repeat Next Instruction lit14+1 times 1 2 None REPEAT Wn Repeat Next Instruction (Wn)+1 times 1 2 None 60 RESET RESET Software device Reset 1 1 None 61 RETFIE RETFIE Return from interrupt 1 3 (2) None 62 RETLW RETLW None 63 RETURN RETURN 64 RLC RLC 65 66 67 RLNC RRC RRNC #lit10,Wn Return with literal in Wn 1 3 (2) Return from Subroutine 1 3 (2) None f f = Rotate Left through Carry f 1 1 C,N,Z RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z N,Z RLNC f f = Rotate Left (No Carry) f 1 1 RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z C,N,Z RRC f f = Rotate Right through Carry f 1 1 RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z N,Z RRNC f f = Rotate Right (No Carry) f 1 1 RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z 2003 Microchip Technology Inc. Advance Information DS70083C-page 169 dsPIC30F TABLE 21-2: Base Instr # 68 Assembly Mnemonic SAC 69 SE 70 SETM 71 72 73 74 75 76 INSTRUCTION SET OVERVIEW (CONTINUED) SFTAC SL SUB SUBB SUBR SUBBR Assembly Syntax Description # of # of Words Cycles Status Flags Affected SAC Acc,#Slit4,Wdo Store Accumulator 1 1 SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None None SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z SETM f f = 0xFFFF 1 1 None SETM WREG WREG = 0xFFFF 1 1 None SETM Ws Ws = 0xFFFF 1 1 None SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB, SA,SB,SAB SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB, SA,SB,SAB SL f f = Left Shift f 1 1 C,N,OV,Z SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z SUB Acc Subtract Accumulators 1 1 OA,OB,OAB, SA,SB,SAB SUB f f = f - WREG 1 1 C,DC,N,OV,Z SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 SUBB Wb,#lit5,Wd Wd = Wb - lit5 - (C) 1 1 SUBR f f = WREG - f 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z C,DC,N,OV,Z SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z SWAP.b Wn Wn = nibble swap Wn 1 1 None 77 SWAP SWAP Wn Wn = byte swap Wn 1 1 None 78 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None 79 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None 80 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None 81 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None 82 ULNK ULNK Unlink frame pointer 1 1 None 83 XOR XOR f f = f .XOR. WREG 1 1 N,Z XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z 84 ZE XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N DS70083C-page 170 Advance Information 2003 Microchip Technology Inc. dsPIC30F 22.0 DEVELOPMENT SUPPORT The PICmicro(R) microcontrollers are supported with a full range of hardware and software development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library * Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator * Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator * In-Circuit Debugger - MPLAB ICD 2 * Device Programmers - PRO MATE(R) II Universal Device Programmer - PICSTART(R) Plus Development Programmer * Low Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board * Evaluation Kits - KEELOQ(R) - PICDEM MSC - microID(R) - CAN - PowerSmart(R) - Analog 22.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows(R) based application that contains: * An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) * A full-featured editor with color coded context * A multiple project manager * Customizable data windows with direct edit of contents * High level source code debugging * Mouse over variable inspection * Extensive on-line help The MPLAB IDE allows you to: * Edit your source files (either assembly or C) * One touch assemble (or compile) and download to PICmicro emulator and simulator tools (automatically updates all project information) * Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 22.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PICmicro MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: * Integration into MPLAB IDE projects * User defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process 2003 Microchip Technology Inc. Advance Information DS70083C-page 171 dsPIC30F 22.3 MPLAB C17 and MPLAB C18 C Compilers The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip's PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 22.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from pre-compiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of pre-compiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 22.5 MPLAB C30 C Compiler MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high level source debugging with the MPLAB IDE. MPLAB ASM30 Assembler, Linker, and Librarian MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it's object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 22.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PICmicro series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break, or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 22.8 The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many commandline options and language extensions to take full advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code generator. DS70083C-page 172 22.6 MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high speed simulator is designed to debug, analyze and optimize time intensive DSP routines. Advance Information 2003 Microchip Technology Inc. dsPIC30F 22.9 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PICmicro microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft(R) Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 22.10 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PICmicro microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory, and the ability to view variables in real-time. 22.11 MPLAB ICD 2 In-Circuit Debugger Microchip's In-Circuit Debugger, MPLAB ICD 2, is a powerful, low cost, run-time development tool, connecting to the host PC via an RS-232 or high speed USB interface. This tool is based on the Flash PICmicro MCUs and can be used to develop for these and other PICmicro microcontrollers. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip's In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single-stepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PICmicro devices. 22.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify, and program PICmicro devices without a PC connection. It can also set code protection in this mode. 22.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PICmicro devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 2003 Microchip Technology Inc. Advance Information DS70083C-page 173 dsPIC30F 22.14 PICDEM 1 PICmicro Demonstration Board 22.17 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 22.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a 16 x 2 LCD display. Also included is the book and CD-ROM "TCP/IP Lean, Web Servers for Embedded Systems," by Jeremy Bentham 22.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18-, 28-, and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs, and sample PIC18F452 and PIC16F877 Flash microcontrollers. DS70083C-page 174 22.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8-, 14-, and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low power operation with the super capacitor circuit, and jumpers allow on-board hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2x16 liquid crystal display, PCB footprints for H-Bridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User's Guide. 22.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board Flash memory. A generous prototype area is available for user hardware expansion. Advance Information 2003 Microchip Technology Inc. dsPIC30F 22.20 PICDEM 18R PIC18C601/801 Demonstration Board 22.23 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/De-multiplexed and 16-bit Memory modes. The board includes 2 Mb external Flash memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. 22.21 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PICmicro microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature on-board LIN transceivers. A PIC16F874 Flash microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 22.22 PICkitTM 1 Flash Starter Kit A complete "development system in a box", the PICkit Flash Starter Kit includes a convenient multi-section board for programming, evaluation, and development of 8/14-pin Flash PIC(R) microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the user's guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB(R) IDE (Integrated Development Environment) software, software and hardware "Tips 'n Tricks for 8-pin Flash PIC(R) Microcontrollers" Handbook and a USB Interface Cable. Supports all current 8/14-pin Flash PIC microcontrollers, as well as many future planned devices. 2003 Microchip Technology Inc. 22.24 Evaluation and Programming Tools * KEELOQ evaluation and programming tools for Microchip's HCS Secure Data Products * CAN developers kit for automotive network applications * Analog design boards and filter design software * PowerSmart battery charging evaluation/ calibration kits * IrDA(R) development kit * microID development and rfLabTM development software * SEEVAL(R) designer kit for memory evaluation and endurance calculations * PICDEM MSC demo boards for Switching mode power supply, high power IR driver, delta sigma ADC, and flow rate sensor Check the Microchip web page and the latest Product Line Card for the complete list of demonstration and evaluation kits. Advance Information DS70083C-page 175 dsPIC30F NOTES: DS70083C-page 176 Advance Information 2003 Microchip Technology Inc. dsPIC30F 23.0 ELECTRICAL CHARACTERISTICS This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual (DS70046). Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Absolute Maximum Ratings() Ambient temperature under bias.............................................................................................................-40C to +125C Storage temperature .............................................................................................................................. -65C to +150C Voltage on any pin with respect to VSS (except VDD and MCLR) ................................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V Voltage on MCLR with respect to VSS (Note 1) ......................................................................................... 0V to +13.25V Total power dissipation (Note 2) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) ..........................................................................................................20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ................................................................................................... 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports ..................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL) 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR/VPP pin, rather than pulling this pin directly to VSS. NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note: All peripheral electrical characteristics are specified. For exact peripherals available on specific devices, please refer the the Family Cross Reference Table. 2003 Microchip Technology Inc. Advance Information DS70083C-page 177 dsPIC30F 23.1 DC Characteristics TABLE 23-1: OPERATING MIPS VS. VOLTAGE Max MIPS VDD Range Temp Range 4.5-5.5V -40C to 85C 4.5-5.5V -40C to 125C 3.0-3.6V -40C to 85C 3.0-3.6V -40C to 125C 2.5-3.0V -40C to 85C 2.5-3.0V -40C to 125C TABLE 23-2: dsPIC30FXXX-30I dsPIC30FXXX-20I 30 20 20 15 10 7.5 20 15 7.5 DC TEMPERATURE AND VOLTAGE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param No. dsPIC30FXXX-20E Symbol Characteristic Min Typ(1) Max Units -- 5.5 V Industrial temperature Extended temperature Conditions Operating Voltage(2) VDD Supply Voltage 2.5 DC11 VDD Supply Voltage 2.5 -- 5.5 V DC12 VDR RAM Data Retention Voltage(3) -- 1.5 -- V DC16 VPOR VDD Start Voltage to ensure internal Power-on Reset signal -- VSS -- V DC17 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 DC10 Note 1: 2: 3: V/ms 0-5V in 0.1 sec 0-3V in 60 ms Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. This is the limit to which VDD can be lowered without losing RAM data. DS70083C-page 178 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions -- -- mA -40C DC20a 4 -- mA 25C DC20b -- -- mA 85C Operating Current (IDD)(2) DC20 DC20c -- -- mA 125C DC20d -- -- mA -40C DC20e 7 -- mA 25C DC20f -- -- mA 85C DC20g -- -- mA 125C DC21 -- -- mA -40C DC21a 8 -- mA 25C DC21b -- -- mA 85C DC21c -- -- mA 125C DC21d -- -- mA -40C DC21e 15 -- mA 25C DC21f -- -- mA 85C DC21g -- -- mA 125C DC22 -- -- mA -40C DC22a -- -- mA 25C DC22b -- -- mA 85C DC22c -- -- mA 125C DC22d -- -- mA -40C DC22e -- -- mA 25C DC22f -- -- mA 85C DC22g -- -- mA 125C DC23 -- -- mA -40C DC23a 13 -- mA 25C DC23b -- -- mA 85C DC23c -- -- mA 125C DC23d -- -- mA -40C DC23e 22 -- mA 25C DC23f -- -- mA 85C DC23g -- -- mA 125C Note 1: 2: 3V 1 MIPS EC mode 5V 3V 2.5 MIPS EC mode 5V 3V 10 MIPS EC mode 5V 3V 4 MIPS EC mode, 4X PLL 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. 2003 Microchip Technology Inc. Advance Information DS70083C-page 179 dsPIC30F TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Operating Current (IDD)(2) DC24 -- -- mA -40C DC24a 29 -- mA 25C DC24b -- -- mA 85C DC24c -- -- mA 125C DC24d -- -- mA -40C DC24e 50 -- mA 25C DC24f -- -- mA 85C DC24g -- -- mA 125C DC25 -- -- mA -40C DC25a 23 -- mA 25C DC25b -- -- mA 85C DC25c -- -- mA 125C DC25d -- -- mA -40C DC25e 41 -- mA 25C DC25f -- -- mA 85C DC25g -- -- mA 125C DC26 -- -- mA -40C DC26a 39 -- mA 25C DC26b -- -- mA 85C DC26c -- -- mA 125C DC26d -- -- mA -40C DC26e 70 -- mA 25C DC26f -- -- mA 85C DC26g -- -- mA 125C DC27 -- -- mA -40C DC27a 50 -- mA 25C DC27b -- -- mA 85C DC27c -- -- mA -40C DC27d 90 -- mA 25C DC27e -- -- mA 85C -- -- mA 125C DC27f Note 1: 2: 3V 10 MIPS EC mode, 4X PLL 5V 3V 8 MIPS EC mode, 8X PLL 5V 3V 15 MIPS EC mode, 8X PLL 5V 3V 20 MIPS EC mode, 8X PLL 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. DS70083C-page 180 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-3: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions -- mA -40C Operating Current (IDD)(2) DC28 -- DC28a 42 -- mA 25C DC28b -- -- mA 85C DC28c -- -- mA -40C DC28d 76 -- mA 25C DC28e -- -- mA 85C DC28f -- -- mA 125C DC29 -- -- mA -40C DC29a 146 -- mA 25C DC29b -- -- mA 85C DC29c -- -- mA 125C DC30 -- -- mA -40C DC30a 7.0 -- mA 25C DC30b -- -- mA 85C DC30c -- -- mA 125C DC30d -- -- mA -40C DC30e 12 -- mA 25C DC30f -- -- mA 85C DC30g -- -- mA 125C DC31 -- -- mA -40C DC31a 1.5 -- mA 25C DC31b -- -- mA 85C DC31c -- -- mA 125C DC31d -- -- mA -40C DC31e 2.5 -- mA 25C DC31f -- -- mA 85C -- -- mA 125C DC31g Note 1: 2: 3V 16 MIPS EC mode, 16X PLL 5V 5V 30 MIPS EC mode, 16X PLL 3V FRC (~ 2 MIPS) 5V 3V LPRC (~ 512 kHz) 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1 driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD. MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data Memory are operational. No peripheral modules are operating. 2003 Microchip Technology Inc. Advance Information DS70083C-page 181 dsPIC30F TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC40 -- -- mA -40C DC40a 3 -- mA 25C DC40b -- -- mA 85C DC40c -- -- mA 125C DC40d -- -- mA -40C DC40e 5 -- mA 25C DC40f -- -- mA 85C DC40g -- -- mA 125C DC41 -- -- mA -40C DC41a 4.8 -- mA 25C DC41b -- -- mA 85C DC41c -- -- mA 125C DC41d -- -- mA -40C DC41e 8.6 -- mA 25C DC41f -- -- mA 85C DC41g -- -- mA 125C DC42 -- -- mA -40C DC42a -- -- mA 25C DC42b -- -- mA 85C DC42c -- -- mA 125C DC42d -- -- mA -40C DC42e -- -- mA 25C DC42f -- -- mA 85C DC42g -- -- mA 125C DC43 -- -- mA -40C DC43a 7.7 -- mA 25C DC43b -- -- mA 85C DC43c -- -- mA 125C DC43d -- -- mA -40C DC43e 13 -- mA 25C DC43f -- -- mA 85C DC43g -- -- mA 125C Note 1: 2: 3V 1 MIPS EC mode 5V 3V 2.5 MIPS EC mode 5V 3V 10 MIPS EC mode 5V 3V 4 MIPS EC mode, 4X PLL 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with Core off, Clock on and all modules turned off. DS70083C-page 182 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC44 -- DC44a 15 DC44b -- -- mA -40C -- mA 25C -- mA 85C DC44c -- -- mA 125C DC44d -- -- mA -40C DC44e 29 -- mA 25C DC44f -- -- mA 85C DC44g -- -- mA 125C DC45 -- -- mA -40C DC45a 13 -- mA 25C DC45b -- -- mA 85C DC45c -- -- mA 125C DC45d -- -- mA -40C DC45e 24 -- mA 25C DC45f -- -- mA 85C DC45g -- -- mA 125C DC46 -- -- mA -40C DC46a 22 -- mA 25C DC46b -- -- mA 85C DC46c -- -- mA 125C DC46d -- -- mA -40C DC46e 40 -- mA 25C DC46f -- -- mA 85C DC46g -- -- mA 125C DC47 -- -- mA -40C DC47a 29 -- mA 25C DC47b -- -- mA 85C DC47c -- -- mA -40C DC47d 52 -- mA 25C DC47e -- -- mA 85C -- -- mA 125C DC47f Note 1: 2: 3V 10 MIPS EC mode, 4X PLL 5V 3V 8 MIPS EC mode, 8X PLL 5V 3V 15 MIPS EC mode, 8X PLL 5V 3V 20 MIPS EC mode, 8X PLL 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with Core off, Clock on and all modules turned off. 2003 Microchip Technology Inc. Advance Information DS70083C-page 183 dsPIC30F TABLE 23-4: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Idle Current (IIDLE): Core OFF Clock ON Base Current(2) DC48 -- -- mA -40C DC48a 24 -- mA 25C DC48b -- -- mA 85C DC48c -- -- mA -40C DC48d 43 -- mA 25C DC48e -- -- mA 85C DC48f -- -- mA 125C DC49 -- -- mA -40C DC49a 73 -- mA 25C DC49b -- -- mA 85C DC49c -- -- mA 125C DC50 -- -- mA -40C DC50a 4.0 -- mA 25C DC50b -- -- mA 85C DC50c -- -- mA 125C DC50d -- -- mA -40C DC50e 7.0 -- mA 25C DC50f -- -- mA 85C DC50g -- -- mA 125C DC51 -- -- mA -40C DC51a 1.0 -- mA 25C DC51b -- -- mA 85C DC51c -- -- mA 125C DC51d -- -- mA -40C DC51e 1.5 -- mA 25C DC51f -- -- mA 85C -- -- mA 125C DC51g Note 1: 2: 3V 16 MIPS EC mode, 16X PLL 5V 5V 30 MIPS EC mode, 16X PLL 3V FRC (~ 2 MIPS) 5V 3V LPRC (~ 512 kHz) 5V Data in "Typical" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IIDLE current is measured with Core off, Clock on and all modules turned off. DS70083C-page 184 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Power Down Current (IPD)(2) DC60 -- -- A -40C DC60a 50 -- A 25C DC60b -- -- A 85C DC60c -- -- A 125C DC60d -- -- A -40C DC60e 100 -- A 25C DC60f -- -- A 85C DC60g -- -- A 125C DC61 -- -- A -40C DC61a 10 -- A 25C DC61b -- -- A 85C DC61c -- -- A 125C DC61d -- -- A -40C DC61e 20 -- A 25C DC61f -- -- A 85C DC61g -- -- A 125C DC62 -- -- A -40C DC62a -- -- A 25C DC62b -- -- A 85C DC62c -- -- A 125C DC62d -- -- A -40C DC62e -- -- A 25C DC62f -- -- A 85C DC62g -- -- A 125C DC63 -- -- A -40C DC63a 40 -- A 25C DC63b -- -- A 85C DC63c -- -- A 125C DC63d -- -- A -40C DC63e 50 -- A 25C DC63f -- -- A 85C DC63g -- -- A 125C Note 1: 2: 3: 3V Base Power Down Current(3) 5V 3V Watchdog Timer Current: IWDT(3) 5V 3V Timer 1 w/32 kHz Crystal: ITI32(3) 5V 3V BOR On: IBOR(3) 5V Data in the Typical column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. 2003 Microchip Technology Inc. Advance Information DS70083C-page 185 dsPIC30F TABLE 23-5: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Parameter No. Typical(1) Max Units Conditions Power Down Current (IPD)(2) DC64 -- -- A -40C DC64a -- -- A 25C DC64b -- -- A 85C DC64c -- -- A 125C DC64d -- -- A -40C DC64e -- -- A 25C DC64f -- -- A 85C DC64g -- -- A 125C DC65 -- -- A -40C DC65a -- -- A 25C DC65b -- -- A 85C DC65c -- -- A 125C DC65d -- -- A -40C DC65e -- -- A 25C DC65f -- -- A 85C DC65g -- -- A 125C DC66 -- -- A -40C DC66a 25 -- A 25C DC66b -- -- A 85C DC66c -- -- A 125C DC66d -- -- A -40C DC66e 30 -- A 25C DC66f -- -- A 85C DC66g -- -- A 125C Note 1: 2: 3: 3V 10-bit ADC: IADC10(3) 5V 3V 12-bit ADC: IADC12(3) 5V 3V Low Voltage Detect: ILVD(3) 5V Data in the Typical column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled high. LVD, BOR, WDT, etc. are all switched off. The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. DS70083C-page 186 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-6: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. Min Typ(1) Max Units I/O pins: with Schmitt Trigger buffer VSS -- 0.2 VDD V DI15 MCLR VSS -- 0.2 VDD V DI16 OSC1 (in XT, HS and LP modes) VSS -- 0.2 VDD V VIL DI10 Characteristic Conditions Input Low Voltage(2) (3) DI17 OSC1 (in RC mode) VSS -- 0.3 VDD V DI18 SDA, SCL TBD -- TBD V SM bus disabled SDA, SCL TBD -- TBD V SM bus enabled I/O pins: with Schmitt Trigger buffer 0.8 VDD -- VDD V DI25 MCLR 0.8 VDD -- VDD V DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD -- VDD V DI27 (3) OSC1 (in RC mode) 0.9 VDD -- VDD V DI28 SDA, SCL TBD -- TBD V SM bus disabled DI29 SDA, SCL TBD -- TBD V SM bus enabled 50 250 400 A VDD = 5V, VPIN = VSS TBD TBD TBD A VDD = 3V, VPIN = VSS I/O ports -- 0.01 1 A VSS VPIN VDD, Pin at hi-impedance DI55 MCLR -- 0.05 5 A VSS VPIN VDD DI56 OSC1 -- 0.05 5 A VSS VPIN VDD, XT, HS and LP Osc mode DI19 VIH DI20 ICNPU Input High Voltage(2) CNXX Pull-up Current(2) DI30 DI31 IIL DI50 Note 1: 2: 3: 4: 5: Input Leakage Current(2)(4)(5) Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that the dsPIC30F device be driven with an external clock while in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. 2003 Microchip Technology Inc. Advance Information DS70083C-page 187 dsPIC30F TABLE 23-7: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units -- -- 0.6 V IOL = 8.5 mA, VDD = 5V Conditions Output Low Voltage(2) VOL DO10 I/O ports -- -- TBD V IOL = 2.0 mA, VDD = 3V DO16 OSC2/CLKOUT -- -- 0.6 V IOL = 1.6 mA, VDD = 5V (RC or EC Osc mode) -- -- TBD V IOL = 2.0 mA, VDD = 3V VDD - 0.7 -- -- V IOH = -3.0 mA, VDD = 5V TBD -- -- V IOH = -2.0 mA, VDD = 3V Output High Voltage(2) VOH DO20 I/O ports DO26 OSC2/CLKOUT (RC or EC Osc mode) VDD - 0.7 -- -- V IOH = -1.3 mA, VDD = 5V TBD -- -- V IOH = -2.0 mA, VDD = 3V Capacitive Loading Specs on Output Pins(2) DO50 COSC2 OSC2/SOSC2 pin -- -- 15 pF In XTL, XT, HS and LP modes when external clock is used to drive OSC1. DO56 CIO All I/O pins and OSC2 -- -- 50 pF RC or EC Osc mode DO58 CB SCL, SDA -- -- 400 pF In I2C mode Note 1: 2: Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. FIGURE 23-1: LOW-VOLTAGE DETECT CHARACTERISTICS VDD LV10 LVDIF (LVDIF set by hardware) DS70083C-page 188 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-8: ELECTRICAL CHARACTERISTICS: LVDL Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param No. LV10 Characteristic(1) Symbol VPLVD Min Typ Max Units LVDL Voltage on VDD transition LVDL = 0000(2) high to low -- -- -- V LVDL = 0001(2) -- -- -- V LVDL = 0010(2) -- -- -- V -- -- -- V LVDL = 0100 2.50 -- 2.65 V LVDL = 0101 2.70 -- 2.86 V LVDL = 0110 2.80 -- 2.97 V LVDL = 0111 3.00 -- 3.18 V LVDL = 1000 3.30 -- 3.50 V LVDL = 1001 3.50 -- 3.71 V LVDL = 1010 3.60 -- 3.82 V LVDL = 1011 3.80 -- 4.03 V LVDL = 1100 4.00 -- 4.24 V LVDL = 1101 4.20 -- 4.45 V LVDL = 1110 4.50 -- 4.77 V LVDL = 1111 -- -- -- V LVDL = 0011 LV15 Note 1: 2: VLVDIN External LVD input pin threshold voltage (2) Conditions These parameters are characterized but not tested in manufacturing. These values not in usable operating range. FIGURE 23-2: BROWN-OUT RESET CHARACTERISTICS VDD BO10 (Device in Brown-out Reset) BO15 (Device not in Brown-out Reset) RESET (due to BOR) Power Up Time-out 2003 Microchip Technology Inc. Advance Information DS70083C-page 189 dsPIC30F TABLE 23-9: ELECTRICAL CHARACTERISTICS: BOR Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param No. Symbol VBOR BO10 Min Typ(1) Max Units BORV = 00(3) -- -- -- V BORV = 01 2.7 -- 2.86 V BORV = 10 4.2 -- 4.46 V BORV = 11 4.5 -- 4.78 V -- 5 -- mV Characteristic BOR Voltage(2) on VDD transition high to low Conditions Not in operating range BO15 VBHYS Note 1: Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. 00 values not in usable operating range. 2: 3: TABLE 23-10: DC CHARACTERISTICS: PROGRAM AND EEPROM Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended DC CHARACTERISTICS Param Symbol No. Characteristic Min Typ(1) Max Units Conditions Data EEPROM Memory(2) D120 ED Byte Endurance 100K 1M -- E/W D121 VDRW VDD for Read/Write VMIN -- 5.5 V D122 TDEW Erase/Write Cycle Time -- 2 -- ms D123 TRETD Characteristic Retention 40 100 -- Year -40C TA +85C Using EECON to read/write VMIN = Minimum operating voltage Provided no other specifications are violated Program FLASH Memory(2) D130 EP Cell Endurance 10K 100K -- E/W D131 VPR VDD for Read VMIN -- 5.5 V D132 VEB VDD for Block Erase 3.0 -- 5.5 V D133 VPEW VDD for Erase/Write 3.0 -- 5.5 V D134 TPEW Erase/Write Cycle Time -- 2 -- ms D135 TRETD Characteristic Retention 40 100 -- Year D136 TEB ICSP Block Erase Time -- 4 -- ms Note 1: 2: -40C TA +85C VMIN = Minimum operating voltage Provided no other specifications are violated Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are characterized but not tested in manufacturing. DS70083C-page 190 Advance Information 2003 Microchip Technology Inc. dsPIC30F 23.2 AC Characteristics and Timing Parameters The information contained in this section defines dsPIC30F AC characteristics and timing parameters. TABLE 23-11: TEMPERATURE AND VOLTAGE SPECIFICATIONS - AC Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Operating voltage VDD range as described in DC Spec Section 23.0. AC CHARACTERISTICS FIGURE 23-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load Condition 1 - for all pins except OSC2 Load Condition 2 - for OSC2 VDD/2 RL CL Pin VSS CL Pin RL = 464 CL = 50 pF for all pins except OSC2 5 pF for OSC2 output VSS FIGURE 23-4: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 OS20 OS30 OS25 OS30 OS31 OS31 CLKOUT OS40 2003 Microchip Technology Inc. Advance Information OS41 DS70083C-page 191 dsPIC30F TABLE 23-12: EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. FOSC OS10 Min Typ(1) Max Units External CLKIN Frequency(2) (External clocks allowed only in EC mode) DC 4 4 4 -- -- -- -- 40 10 10 7.5 MHz MHz MHz MHz EC EC with 4x PLL EC with 8x PLL EC with 16x PLL Oscillator Frequency(2) DC 0.4 4 4 4 4 10 31 -- -- -- -- -- -- -- -- -- -- 8 512 4 4 10 10 10 7.5 25 33 -- -- MHz MHz MHz MHz MHz MHz MHz kHz MHz kHz RC XTL XT XT with 4x PLL XT with 8x PLL XT with 16x PLL HS LP FRC internal LPRC internal -- -- -- -- See parameter OS10 for FOSC value Characteristic Conditions OS20 TOSC TOSC = 1/FOSC OS25 TCY Instruction Cycle Time(2)(3) 33 -- DC ns See Table 23-14 OS30 TosL, TosH External Clock(2) in (OSC1) High or Low Time TBD TBD TBD TBD -- -- -- -- -- ns ns s ns XTL osc XT osc LP osc HS osc OS31 TosR, TosF External Clock(2) in (OSC1) Rise or Fall Time -- -- -- -- -- TBD TBD TBD TBD ns ns ns ns XTL osc XT osc LP osc HS osc OS40 TckR CLKOUT Rise Time(2)(4) -- 6 10 ns OS41 TckF CLKOUT Fall Time(2)(4) -- 6 10 ns Note 1: 2: 3: 4: Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. These parameters are characterized but not tested in manufacturing. Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin. CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY). DS70083C-page 192 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-13: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions OS50 FPLLI PLL Input Frequency Range(2) 4 -- 10 MHz EC, XT modes with PLL OS51 FSYS On-chip PLL Output(2) 16 -- 120 MHz EC, XT modes with PLL OS52 TLOC PLL Start-up Time (Lock Time) -- 20 50 s OS53 DCLK CLKOUT Stability (Jitter) TBD 1 TBD % Note 1: 2: Measured over 100 ms period These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. TABLE 23-14: INTERNAL CLOCK TIMING EXAMPLES Clock Oscillator Mode FOSC (MHz)(1) TCY (sec)(2) MIPS(3) w/o PLL MIPS(3) w PLL x4 MIPS(3) w PLL x8 MIPS(3) w PLL x16 EC 0.200 20.0 0.05 -- -- -- XT Note 1: 2: 3: 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 -- 25 0.16 25.0 -- -- -- 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 -- Assumption: Oscillator Postscaler is divide by 1. Instruction Execution Cycle Time: TCY = 1 / MIPS. Instruction Execution Frequency: MIPS = (FOSC * PLLx) / 4 [since there are 4 Q clocks per instruction cycle]. TABLE 23-15: INTERNAL RC ACCURACY Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic Min Typ Max Units Conditions F14 TBD +/-1 TBD % +25C VDD = 3V F15 TBD -- TBD % -10C to +85C VDD = 3V FRC @ Freq = 8 MHz(1) F16 TBD -- TBD % -40C to +85C VDD = 3V F17 TBD +/-1 TBD % +25C VDD = 5V F18 TBD -- TBD % -10C to +85C VDD = 5V F19 TBD -- TBD % -40C to +85C VDD = 5V TBD -- TBD % -40C to +85C VDD = 3V TBD -- TBD % -40C to +85C VDD = 5V (2) LPRC @ Freq = 512 kHz F20 F21 Note 1: 2: 3: Frequency calibrated at 25C. TUN bits can be used to compensate for temperature drift. LPRC frequency after calibration. Change of LPRC frequency as VDD changes. 2003 Microchip Technology Inc. Advance Information DS70083C-page 193 dsPIC30F FIGURE 23-5: CLKOUT AND I/O TIMING CHARACTERISTICS I/O Pin (Input) DI35 DI40 I/O Pin (Output) New Value Old Value DO31 DO32 Note: Refer to Figure 23-3 for load conditions. TABLE 23-16: CLKOUT AND I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. DO31 Symbol TIOR Characteristic(1)(2)(3) Port output rise time Min Typ(4) Max Units Conditions -- 10 25 ns -- DO32 TIOF Port output fall time -- 10 25 ns -- DI35 TINP INTx pin high or low time (output) 20 -- -- ns -- TRBP CNx high or low time (input) 2 TCY -- -- ns -- DI40 Note 1: 2: 3: 4: These parameters are asynchronous events not related to any internal clock edges Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC. These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. DS70083C-page 194 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-6: VDD RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS SY12 MCLR SY10 Internal POR SY11 PWRT Time-out OSC Time-out SY30 Internal RESET Watchdog Timer RESET SY13 SY20 SY13 I/O Pins SY35 FSCM Delay Note: Refer to Figure 23-3 for load conditions. 2003 Microchip Technology Inc. Advance Information DS70083C-page 195 dsPIC30F TABLE 23-17: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) SY10 TmcL MCLR Pulse Width (low) SY11 TPWRT Power-up Timer Period Min Typ(2) Max Units Conditions 2 -- -- s -40C to +85C TBD TBD TBD TBD 0 4 16 64 TBD TBD TBD TBD ms -40C to +85C User programmable -40C to +85C SY12 TPOR Power On Reset Delay 3 10 30 s SY13 TIOZ I/O Hi-impedance from MCLR Low or Watchdog Timer Reset -- -- 100 ns SY20 TWDT1 Watchdog Timer Time-out Period (No Prescaler) 1.8 2.0 2.2 ms VDD = 5V, -40C to +85C 1.9 2.1 2.3 ms VDD = 3V, -40C to +85C SY25 TBOR Brown-out Reset Pulse Width(3) 100 -- -- s VDD VBOR (D034) SY30 TOST Oscillation Start-up Timer Period -- 1024 TOSC -- -- TOSC = OSC1 period SY35 TFSCM Fail-Safe Clock Monitor Delay -- 100 -- s -40C to +85C TWDT2 Note 1: 2: 3: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Refer to Figure 23-2 and Table 23-9 for BOR. FIGURE 23-7: BAND GAP START-UP TIME CHARACTERISTICS VBGAP 0V Enable Band Gap (see Note) Band Gap Stable SY40 Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set. TABLE 23-18: BAND GAP START-UP TIME REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. SY40 Note 1: 2: Symbol TBGAP Characteristic(1) Min Typ(2) Max Units Band Gap Start-up Time -- 20 50 s Conditions Defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. RCON<13>Status bit These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. DS70083C-page 196 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS TxCK Tx1 Tx1 Tx15 Tx2 OS60 TMRX Note: Refer to Figure 23-3 for load conditions. TABLE 23-19: TYPE A TIMER EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. TA11 TA10 TA15 Symbol TTXH TTXL TTXP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Conditions Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Must also meet parameter TA15 Synchronous, with prescaler 10 -- -- ns Asynchronous 10 -- -- ns Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Synchronous, with prescaler 10 -- -- ns Asynchronous 10 -- -- ns TCY + 10 -- -- ns Greater of: 20 ns or (TCY + 40)/N -- -- -- TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler Asynchronous OS60 Ft1 TA20 TCKEXTMRL Delay from External TQCK Clock Edge to Timer Increment Note: SOSC1/T1CK oscillator input frequency range (oscillator enabled by setting bit TCS (T1CON, bit 1)) 20 -- -- ns DC -- 50 kHz 6 TOSC -- 2 TOSC Must also meet parameter TA15 N = prescale value (1, 8, 64, 256) Timer1 is a Type A. 2003 Microchip Technology Inc. Advance Information DS70083C-page 197 dsPIC30F TABLE 23-20: TYPE B TIMER EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. TB11 TB10 TB15 Symbol TtxH TtxL TtxP Characteristic TxCK High Time TxCK Low Time Min Typ Max Units Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Synchronous, with prescaler 10 -- -- ns Synchronous, no prescaler 0.5 TCY + 20 -- -- ns Synchronous, with prescaler 10 -- -- ns TCY + 10 -- -- ns -- 6 TOSC -- TxCK Input Period Synchronous, no prescaler Synchronous, with prescaler TB20 Note: TCKEXTMRL Delay from External TQCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 2 TOSC Conditions Must also meet parameter TB15 Must also meet parameter TB15 N = prescale value (1, 8, 64, 256) Timer2 and Timer4 are Type B. TABLE 23-21: TYPE C TIMER EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min Typ Max Units Conditions TC11 TtxH TxCK High Time Synchronous 0.5 TCY + 20 -- -- ns Must also meet parameter TC15 TC10 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 -- -- ns Must also meet parameter TC15 TC15 TtxP TxCK Input Period Synchronous, no prescaler TCY + 10 -- -- ns N = prescale value (1, 8, 64, 256) -- 6 TOSC -- Synchronous, with prescaler TC20 Note: TCKEXTMRL Delay from External TQCK Clock Edge to Timer Increment Greater of: 20 ns or (TCY + 40)/N 2 TOSC Timer3 and Timer5 are Type C. DS70083C-page 198 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-9: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS QEB TQ1 TQ1 TQ15 TQ2 POSCNT TABLE 23-22: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ Max Units Conditions TQ11 TtQH TQCK High Time Synchronous, with prescaler TCY + 20 -- ns Must also meet parameter TQ15 TQ10 TtQL TQCK Low Time Synchronous, with prescaler TCY + 20 -- ns Must also meet parameter TQ15 TQ15 TtQP TQCP Input Period Synchronous, with prescaler 2 * TCY + 40 -- ns -- TQ20 TCKEXTMRL Delay from External TQCK Clock Edge to Timer Increment Tosc 5 Tosc ns -- Note 1: These parameters are characterized but not tested in manufacturing. 2003 Microchip Technology Inc. Advance Information DS70083C-page 199 dsPIC30F FIGURE 23-10: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS ICX IC10 IC11 IC15 Note: Refer to Figure 23-3 for load conditions. TABLE 23-23: INPUT CAPTURE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period No Prescaler Min Max Units 0.5 TCY + 20 -- ns With Prescaler No Prescaler 10 -- ns 0.5 TCY + 20 -- ns With Prescaler Note 1: 10 -- ns (2 TCY + 40)/N -- ns Conditions N = prescale value (1, 4, 16) These parameters are characterized but not tested in manufacturing. FIGURE 23-11: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS OCx (Output Compare or PWM Mode) OC10 OC11 Note: Refer to Figure 23-3 for load conditions. TABLE 23-24: OUTPUT COMPARE MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol No. Characteristic(1) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Min Typ(2) Max Units Conditions OC10 TccF OCx Output Fall Time -- 10 25 ns -- OC11 TccR OCx Output Rise Time -- 10 25 ns -- Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70083C-page 200 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-12: OC/PWM MODULE TIMING CHARACTERISTICS OC20 OCFA/OCFB OC15 OCx TABLE 23-25: SIMPLE OC/PWM MODE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic(1) Min Typ(2) Max Units 25 ns OC15 TFD Fault Input to PWM I/O Change -- -- OC20 TFLT Fault Input Pulse Width -- -- Note 1: 2: Conditions VDD = 3V TBD ns VDD = 5V 50 ns VDD = 3V TBD ns VDD = 5V -40C to +85C -40C to +85C These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. 2003 Microchip Technology Inc. Advance Information DS70083C-page 201 dsPIC30F FIGURE 23-13: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS MP30 FLTA/B MP20 PWMx FIGURE 23-14: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS MP11 MP10 PWMx Note: Refer to Figure 23-3 for load conditions. TABLE 23-26: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions MP10 TFPWM PWM Output Fall Time -- 10 25 ns VDD = 5V -40C to +85C MP11 TRPWM PWM Output Rise Time -- 10 25 ns VDD = 5V -40C to +85C MP12 TFPWM PWM Output Fall Time -- TBD TBD ns VDD = 3V -40C to +85C MP13 MP20 MP30 Note 1: 2: TRPWM PWM Output Rise Time -- TBD TBD ns VDD = 3V -40C to +85C TFD Fault Input to PWM I/O Change -- -- 25 ns VDD = 3V -40C to +85C TFH Fault Input Hold Time -- -- TBD ns VDD = 5V 50 ns VDD = 3V TBD ns VDD = 5V -40C to +85C These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. DS70083C-page 202 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-15: QEA/QEB INPUT CHARACTERISTICS TQ36 QEA (input) TQ3 TQ3 TQ35 QEB (input) TQ4 TQ4 TQ3 TQ3 TQ3 QEB Internal TABLE 23-27: QUADRATURE DECODER TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Typ(2) Max Units Conditions 6 TCY -- ns -- TQ30 TQUL Quadrature Input Low Time TQ31 TQUH Quadrature Input High Time 6 TCY -- ns -- TQ35 TQUIN Quadrature Input Period 12 TCY -- ns -- TQ36 TQUP Quadrature Phase Period 3 TCY -- ns TQ40 TQUFL Filter Time to Recognize Low, with Digital Filter 3 * N * TCY -- ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ41 TQUFH Filter Time to Recognize High, with Digital Filter 3 * N * TCY -- ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) Note 1: 2: These parameters are characterized but not tested in manufacturing. N = Index Channel Digital Filter Clock Divide Select Bits. Refer to Section 16. "Quadrature Encoder Interface (QEI)" in the dsPIC30F Family Reference Manual. 2003 Microchip Technology Inc. Advance Information -- DS70083C-page 203 dsPIC30F FIGURE 23-16: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS QEA (input) QEB (input) Ungated Index TQ50 TQ51 Index Internal TQ55 Position TABLE 23-28: QEI INDEX PULSE TIMING REQUIREMENTS AC CHARACTERISTICS Param No. Symbol Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended Characteristic(1) Min Max Units Conditions TQ50 TqIL Filter Time to Recognize Low, with Digital Filter 3 * N * TCY -- ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ51 TqiH Filter Time to Recognize High, with Digital Filter 3 * N * TCY -- ns N = 1, 2, 4, 16, 32, 64, 128 and 256 (Note 2) TQ55 Tqidxr Index Pulse Recognized to Position Counter Reset (Ungated Index) 3 TCY -- ns Note 1: 2: -- These parameters are characterized but not tested in manufacturing. Alignment of Index Pulses to QEA and QEB is shown for Position Counter reset timing only. Shown for forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but Index Pulse recognition occurs on falling edge. DS70083C-page 204 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-17: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS CSCK (SCKE = 1) CS11 CS10 CS21 CS20 CS20 CS21 CSCK (SCKE = 0) COFS CS55 CS56 CS35 CS51 CSDO HIGH-Z 70 CS50 LSb MSb CS30 CSDI MSb IN HIGH-Z CS31 LSb IN CS40 CS41 Note: Refer to Figure 23-3 for load conditions. 2003 Microchip Technology Inc. Advance Information DS70083C-page 205 dsPIC30F TABLE 23-29: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol TcSCKL CS10 Characteristic(1) Min Typ(2) Max Units Conditions TCY / 2 + 20 -- -- ns -- 30 -- -- ns -- TCY / 2 + 20 -- -- ns -- CSCK Output High Time(3) (CSCK pin is an output) 30 -- -- ns -- CSCK Input Low Time (CSCK pin is an input) CSCK Output Low Time(3) (CSCK pin is an output) TcSCKH CS11 CSCK Input High Time (CSCK pin is an input) CS20 TcSCKF CSCK Output Fall Time(4) (CSCK pin is an output) -- 10 25 ns -- CS21 TcSCKR CSCK Output Rise Time(4) (CSCK pin is an output) -- 10 25 ns -- CS30 TcSDOF CSDO Data Output Fall Time(4) -- 10 25 ns -- Time(4) CS31 TcSDOR CSDO Data Output Rise -- 10 25 ns -- CS35 TDV Clock edge to CSDO data valid -- -- 10 ns -- CS36 TDIV Clock edge to CSDO tri-stated 10 -- 20 ns -- CS40 TCSDI Setup time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 -- -- ns -- CS41 THCSDI Hold time of CSDI data input to CSCK edge (CSCK pin is input or output) 20 -- -- ns -- CS50 TcoFSF COFS Fall Time (COFS pin is output) -- 10 25 ns Note 1 CS51 TcoFSR COFS Rise Time (COFS pin is output) -- 10 25 ns Note 1 CS55 TscoFS Setup time of COFS data input to CSCK edge (COFS pin is input) 20 -- -- ns -- CS56 THCOFS Hold time of COFS data input to CSCK edge (COFS pin is input) 20 -- -- ns -- Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all DCI pins. DS70083C-page 206 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-18: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS BIT_CLK (CSCK) CS61 CS60 CS62 CS21 CS20 CS71 CS70 CS72 SYNC (COFS) CS76 CS75 CS80 SDO (CSDO) MSb LSb LSb CS76 CS75 MSb IN SDI (CSDI) CS65 CS66 TABLE 23-30: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. CS60 CS61 CS62 CS65 CS66 CS70 CS71 CS72 CS75 CS76 CS77 CS78 CS80 Note Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions TBCLKL TBCLKH TBCLK TSACL BIT_CLK Low Time 36 40.7 45 ns -- BIT_CLK High Time 36 40.7 45 ns -- BIT_CLK Period -- 81.4 -- ns Bit clock is input Input Setup Time to -- -- 10 ns -- Falling Edge of BIT_CLK THACL Input Hold Time from -- -- 10 ns -- Falling Edge of BIT_CLK TSYNCLO SYNC Data Output Low Time -- 19.5 -- s Note 1 -- 1.3 -- s Note 1 TSYNCHI SYNC Data Output High Time SYNC Data Output Period -- 20.8 -- s Note 1 TSYNC TRACL Rise Time, SYNC, SDATA_OUT -- 10 25 ns CLOAD = 50 pF, VDD = 5V TFACL Fall Time, SYNC, SDATA_OUT -- 10 25 ns CLOAD = 50 pF, VDD = 5V Rise Time, SYNC, SDATA_OUT -- TBD TBD ns CLOAD = 50 pF, VDD = 3V TRACL Fall Time, SYNC, SDATA_OUT -- TBD TBD ns CLOAD = 50 pF, VDD = 3V TFACL -- -- 15 ns -- TOVDACL Output valid delay from rising edge of BIT_CLK 1: These parameters are characterized but not tested in manufacturing. 2: These values assume BIT_CLK frequency is 12.288 MHz. 3: Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. 2003 Microchip Technology Inc. Advance Information DS70083C-page 207 dsPIC30F FIGURE 23-19: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS SCKx (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKx (CKP = 1) SP35 BIT14 - - - - - -1 MSb SDOx SP31 SDIx LSb SP30 MSb IN LSb IN BIT14 - - - -1 SP40 SP41 Note: Refer to Figure 23-3 for load conditions. TABLE 23-31: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions -- -- ns -- TscL SCKX Output Low Time(3) TCY / 2 SP11 TscH SCKX Output High Time(3) TCY / 2 -- -- ns -- SP20 TscF SCKX Output Fall Time(4 -- 10 25 ns -- SP21 TscR SCKX Output Rise Time(4) -- 10 25 ns -- SP30 TdoF SDOX Data Output Fall Time(4) -- 10 25 ns -- SP10 Time(4) SP31 TdoR SDOX Data Output Rise -- 10 25 ns -- SP35 TscH2doV, TscL2doV SDOX Data Output Valid after SCKX Edge -- -- 30 ns -- SP40 TdiV2scH, TdiV2scL Setup Time of SDIX Data Input to SCKX Edge 20 -- -- ns -- SP41 TscH2diL, TscL2diL Hold Time of SDIX Data Input to SCKX Edge 20 -- -- ns -- Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70083C-page 208 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-20: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS SP36 SCKX (CKP = 0) SP11 SP10 SP21 SP20 SP20 SP21 SCKX (CKP = 1) SP35 SDOX BIT14 - - - - - -1 MSb SP40 SDIX LSb SP30,SP31 MSb IN BIT14 - - - -1 LSb IN SP41 Note: Refer to Figure 23-3 for load conditions. TABLE 23-32: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX output low time(3) TCY / 2 -- -- ns -- SP11 TscH SCKX output high time(3) TCY / 2 -- -- ns -- -- 10 25 ns -- -- 10 25 ns -- -- 10 25 ns -- -- 10 25 ns -- time(4) SP20 TscF SCKX output fall SP21 TscR SCKX output rise time(4) time(4) SP30 TdoF SDOX data output fall SP31 TdoR SDOX data output rise time(4) SP35 TscH2doV, SDOX data output valid after TscL2doV SCKX edge -- -- 30 ns -- SP36 TdoV2sc, SDOX data output setup to TdoV2scL first SCKX edge 30 -- -- ns -- SP40 TdiV2scH, Setup time of SDIX data input TdiV2scL to SCKX edge 20 -- -- ns -- SP41 TscH2diL, TscL2diL 20 -- -- ns -- Note 1: 2: 3: 4: Hold time of SDIX data input to SCKX edge These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not violate this specification. Assumes 50 pF load on all SPI pins. 2003 Microchip Technology Inc. Advance Information DS70083C-page 209 dsPIC30F FIGURE 23-21: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS SSX SP52 SP50 SCKX (CKP = 0) SP11 SP10 SP20 SP21 SP20 SP21 SCKX (CKP = 1) SP35 MSb SDOX LSb BIT14 - - - - - -1 SP51 SP30,SP31 SDIX MSb IN SP40 BIT14 - - - -1 LSb IN SP41 Note: Refer to Figure 23-3 for load conditions. TABLE 23-33: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. SP10 Symbol TscL Characteristic(1) Min Typ(2) Max Units Conditions SCKX Input Low Time 30 -- -- ns -- SP11 TscH SCKX Input High Time 30 -- -- ns -- SP20 TscF SCKX Output Fall Time(3) -- 10 25 ns -- -- 10 25 ns -- -- 10 25 ns -- Time(3) SP21 TscR SCKX Output Rise SP30 TdoF SDOX Data Output Fall Time(3) SDOX Data Output Rise Time (3) SP31 TdoR -- 10 25 ns -- SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge -- -- 30 ns -- SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 -- -- ns -- SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 -- -- ns -- SP50 TssL2scH, SSX to SCKX or SCKX Input TssL2scL 120 -- -- ns -- SP51 TssH2doZ SSX to SDOX Output Hi-Impedance(3) 10 -- 50 ns -- Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Assumes 50 pF load on all SPI pins. 3: DS70083C-page 210 Advance Information 2003 Microchip Technology Inc. dsPIC30F Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions 1.5 TCY +40 -- -- ns -- SP52 TscH2ssH SSX after SCK Edge TscL2ssH Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. Assumes 50 pF load on all SPI pins. 3: FIGURE 23-22: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SSX SP52 SP50 SCKX (CKP = 0) SP11 SP10 SP20 SP21 SP20 SP21 SCKX (CKP = 1) SP35 SP52 MSb SDOX BIT14 - - - - - -1 LSb SP30,SP31 SDIX MSb IN BIT14 - - - -1 SP51 LSb IN SP41 SP40 Note: Refer to Figure 23-3 for load conditions. 2003 Microchip Technology Inc. Advance Information DS70083C-page 211 dsPIC30F TABLE 23-34: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions SP10 TscL SCKX Input Low Time 30 -- -- ns -- SP11 TscH SCKX Input High Time 30 -- -- ns -- SP20 TscF SCKX Output Fall Time(3) -- 10 25 ns -- SP21 TscR SCKX Output Rise Time(3) -- 10 25 ns -- -- 10 25 ns -- -- 10 25 ns -- (3) SP30 TdoF SDOX Data Output Fall Time SP31 TdoR SDOX Data Output Rise Time(3) SP35 TscH2doV, SDOX Data Output Valid after TscL2doV SCKX Edge -- -- 30 ns -- SP40 TdiV2scH, Setup Time of SDIX Data Input TdiV2scL to SCKX Edge 20 -- -- ns -- SP41 TscH2diL, Hold Time of SDIX Data Input TscL2diL to SCKX Edge 20 -- -- ns -- SP50 TssL2scH, SSX to SCKX or SCKX input TssL2scL 120 -- -- ns -- SP51 TssH2doZ SS to SDOX Output Hi-Impedance(4) 10 -- 50 ns -- SP52 TscH2ssH SSX after SCKX Edge TscL2ssH 1.5 TCY + 40 -- -- ns -- SP60 TssL2doV SDOX Data Output Valid after SCKX Edge -- -- 50 ns -- Note 1: 2: 3: 4: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. The minimum clock period for SCK is 100 ns. Therefore, the clock generated in master mode must not violate this specification. Assumes 50 pF load on all SPI pins. DS70083C-page 212 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-23: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCL IM31 IM34 IM30 IM33 SDA Stop Condition Start Condition Note: Refer to Figure 23-3 for load conditions. FIGURE 23-24: I2C BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 IM21 IM11 IM10 SCL IM11 IM26 IM10 IM25 IM33 SDA In IM40 IM40 IM45 SDA Out Note: Refer to Figure 23-3 for load conditions. 2003 Microchip Technology Inc. Advance Information DS70083C-page 213 dsPIC30F TABLE 23-35: I2C BUS DATA TIMING REQUIREMENTS (MASTER MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. IM10 Min(1) Max Units Conditions TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) -- ms -- 400 kHz mode TCY / 2 (BRG + 1) -- ms -- 1 MHz mode(2) TCY / 2 (BRG + 1) -- ms -- Clock High Time 100 kHz mode TCY / 2 (BRG + 1) -- ms -- 400 kHz mode TCY / 2 (BRG + 1) -- ms -- THI:SCL IM11 Characteristic TCY / 2 (BRG + 1) -- ms 100 kHz mode -- 300 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) -- 100 ns 100 kHz mode -- 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(2) -- 300 ns 100 kHz mode 250 -- ns 400 kHz mode 100 -- ns 1 MHz mode(2) TBD -- ns 100 kHz mode 0 -- ns 400 kHz mode 0 0.9 ms 1 MHz mode(2) TBD -- ns 100 kHz mode TCY / 2 (BRG + 1) -- ms 400 kHz mode TCY / 2 (BRG + 1) -- ms 1 MHz mode TF:SCL IM20 TR:SCL IM21 SDA and SCL Fall Time SDA and SCL Rise Time TSU:DAT Data Input Setup Time IM25 THD:DAT Data Input Hold Time IM26 TSU:STA IM30 Start Condition Setup Time THD:STA Start Condition Hold Time IM31 TSU:STO Stop Condition Setup Time IM33 THD:STO Stop Condition IM34 Hold Time TAA:SCL IM40 Output Valid From Clock CB IM50 Note 1: 2: -- CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF -- -- Only relevant for repeated Start condition 1 MHz mode(2) TCY / 2 (BRG + 1) -- ms 100 kHz mode TCY / 2 (BRG + 1) -- ms 400 kHz mode TCY / 2 (BRG + 1) -- ms 1 MHz mode(2) TCY / 2 (BRG + 1) -- ms 100 kHz mode TCY / 2 (BRG + 1) -- ms 400 kHz mode TCY / 2 (BRG + 1) -- ms 1 MHz mode(2) TCY / 2 (BRG + 1) -- ms 100 kHz mode TCY / 2 (BRG + 1) -- ns 400 kHz mode TCY / 2 (BRG + 1) -- ns 1 MHz mode(2) TCY / 2 (BRG + 1) -- ns 100 kHz mode -- 3500 ns -- 400 kHz mode -- 1000 ns -- (2) -- -- ns 100 kHz mode 4.7 -- ms 400 kHz mode 1.3 -- ms 1 MHz mode(2) TBD -- ms -- 400 pF 1 MHz mode TBF:SDA Bus Free Time IM45 (2) Bus Capacitive Loading After this period the first clock pulse is generated -- -- -- Time the bus must be free before a new transmission can start BRG is the value of the I2C Baud Rate Generator. Refer to Section 21 "Inter-Integrated CircuitTM (I2C)" in the dsPIC30F Family Reference Manual. Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). DS70083C-page 214 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-25: I2C BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCL IS34 IS31 IS30 IS33 SDA Stop Condition Start Condition FIGURE 23-26: I2C BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 IS21 IS11 IS10 SCL IS30 IS26 IS31 IS25 IS33 SDA In IS40 IS40 IS45 SDA Out 2003 Microchip Technology Inc. Advance Information DS70083C-page 215 dsPIC30F TABLE 23-36: I2C BUS DATA TIMING REQUIREMENTS (SLAVE MODE) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. IS10 IS11 IS20 IS21 IS25 IS26 IS30 IS31 IS33 IS34 IS40 IS45 IS50 Note 1: Symbol TLO:SCL THI:SCL TF:SCL TR:SCL TSU:DAT THD:DAT TSU:STA THD:STA TSU:STO THD:STO TAA:SCL TBF:SDA CB Characteristic Clock Low Time Clock High Time SDA and SCL Fall Time SDA and SCL Rise Time Data Input Setup Time Data Input Hold Time Min Max Units 100 kHz mode 4.7 -- s Device must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 -- s Device must operate at a minimum of 10 MHz. 1 MHz mode(1) 0.5 -- s 100 kHz mode 4.0 -- s Device must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 -- s Device must operate at a minimum of 10 MHz 1 MHz mode(1) 0.5 -- s 100 kHz mode -- 300 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) -- 100 ns 100 kHz mode -- 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns 1 MHz mode(1) -- 300 ns 100 kHz mode 250 -- ns 400 kHz mode 100 -- ns 1 MHz mode(1) 100 -- ns 100 kHz mode 0 -- ns 400 kHz mode 0 0.9 1 MHz mode(1) s 0 0.3 s 100 kHz mode 4.7 -- s 400 kHz mode 0.6 -- 1 MHz mode(1) s 0.25 -- s 100 kHz mode 4.0 -- s 400 kHz mode 0.6 -- 1 MHz mode(1) s 0.25 -- s 100 kHz mode 4.7 -- s 400 kHz mode 0.6 -- 1 MHz mode(1) s 0.6 -- s Stop Condition 100 kHz mode 4000 -- ns Hold Time 400 kHz mode 600 -- ns 1 MHz mode(1) 250 Start Condition Setup Time Start Condition Hold Time Stop Condition Setup Time 0 3500 ns 0 1000 ns 1 MHz mode(1) 0 350 ns 100 kHz mode 4.7 -- s 400 kHz mode 1.3 -- 1 MHz mode(1) s 0.5 -- s -- 400 pF Bus Capacitive Loading -- -- CB is specified to be from 10 to 400 pF CB is specified to be from 10 to 400 pF -- -- Only relevant for repeated Start condition After this period the first clock pulse is generated -- -- ns Output Valid From 100 kHz mode Clock 400 kHz mode Bus Free Time Conditions -- Time the bus must be free before a new transmission can start -- Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only). DS70083C-page 216 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-27: CXTX Pin (output) CAN MODULE I/O TIMING CHARACTERISTICS New Value Old Value CA10 CA11 CXRX Pin (input) CA20 TABLE 23-37: CAN MODULE I/O TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Characteristic(1) Symbol Min Typ(2) Max Units Conditions CA10 TioF Port Output Fall Time -- 10 25 ns -- CA11 TioR Port Output Rise Time -- 10 25 ns -- CA20 Tcwf Pulse Width to Trigger CAN Wakeup Filter 500 ns -- Note 1: 2: These parameters are characterized but not tested in manufacturing. Data in "Typ" column is at 5V, 25C unless otherwise stated. Parameters are for design guidance only and are not tested. 2003 Microchip Technology Inc. Advance Information DS70083C-page 217 dsPIC30F TABLE 23-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD - 0.3 or 2.7 Lesser of VDD + 0.3 or 5.5 V -- AD02 AVSS Module VSS Supply Vss - 0.3 VSS + 0.3 V -- AD05 VREFH Reference Voltage High AVDD V -- Reference Inputs AVss+2.7 AD06 VREFL Reference Voltage Low AD07 VREF Absolute Reference Voltage AVss AVDD - 2.7 V -- AVss - 0.3 AVDD + 0.3 V -- AD08 IREF Current Drain 300 3 A A A/D operating A/D off AD10 VINH-VINL Full-Scale Input Span VREFH V -- AD11 VIN Absolute Input Voltage AVDD + 0.3 V -- AD12 -- Leakage Current -- 0.001 0.244 A VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V Source Impedance = 10 kW AD13 -- Leakage Current -- 0.001 0.244 A VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Source Impedance = 10 kW AD15 RSS Switch Resistance -- 5K -- -- AD16 CSAMPLE Sample Capacitor -- 2.5 pF -- AD17 RIN Recommended Impedance Of Analog Voltage Source -- -- AD20 Nr Resolution bits -- AD21 INL Integral Nonlinearity -- 0.5 < 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD21A INL Integral Nonlinearity -- 0.5 < 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22 DNL Differential Nonlinearity -- 0.5 < 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD22A DNL Differential Nonlinearity -- 0.5 < 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V GERR Gain Error -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD23A GERR Gain Error -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V -- 200 .001 Analog Input VREFL AVSS - 0.3 10K DC Accuracy AD23 Note 1: 2: 10 data bits Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. DS70083C-page 218 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions EOFF Offset Error -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD24A EOFF Offset Error -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD25 -- Monotonicity(2) -- -- -- -- AD26 CMRR Common-Mode Rejection -- TBD -- dB -- AD27 PSRR Power Supply Rejection Ratio -- TBD -- dB -- AD28 CTLK Channel to Channel Crosstalk -- TBD -- dB -- AD30 THD Total Harmonic Distortion -- TBD -- dB -- AD31 SINAD Signal to Noise and Distortion -- TBD -- dB -- AD32 SFDR Spurious Free Dynamic Range -- TBD -- dB -- AD33 FNYQ Input Signal Bandwidth -- -- 250 kHz -- AD34 ENOB Effective Number of Bits -- TBD TBD bits -- AD24 Guaranteed Dynamic Performance Note 1: 2: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. 2003 Microchip Technology Inc. Advance Information DS70083C-page 219 dsPIC30F FIGURE 23-28: HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution BSF SAMP BCF SAMP SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc AD61 AD60 TSAMP AD55 AD55 DONE ADIF ADRES(0) ADRES(1) 1 2 3 4 5 6 8 9 5 6 8 9 1 - Software sets ADCON. SAMP to start sampling. 2 - Sampling starts after discharge period. TSAMP is described in the dsPIC30F MCU Family Reference Manual, Section 17. 3 - Software clears ADCON. SAMP to start conversion. 4 - Sampling ends, conversion sequence starts. 5 - Convert bit 9. 6 - Convert bit 8. 8 - Convert bit 0. 9 - One TAD for end of conversion. DS70083C-page 220 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-29: HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001) AD50 ADCLK Instruction Execution BSF ADON SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc TSAMP TSAMP AD55 TCONV AD55 DONE ADIF ADRES(0) ADRES(1) 1 2 3 4 5 6 7 3 4 5 6 8 3 1 - Software sets ADCON. ADON to start AD operation. 5 - Convert bit 0. 2 - Sampling starts after discharge period. TSAMP is described in the dsPIC30F Family Reference Manual, Section 17. 6 - One TAD for end of conversion. 3 - Convert bit 9. 8 - Sample for time specified by SAMC. TSAMP is described in the dsPIC30F Family Reference Manual, Section 17. 4 - Convert bit 8. 2003 Microchip Technology Inc. 4 7 - Begin conversion of next channel Advance Information DS70083C-page 221 dsPIC30F TABLE 23-39: HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param Symbol No. Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD A/D Clock Period 154 833 AD51 tRC A/D Internal RC Oscillator Period 700 AD55 tCONV Conversion Time AD56 FCNV Throughput Rate ns 900 1100 VDD = 5V (Note 1) VDD = 2.7V (Note 1) ns -- ns -- Conversion Rate 13 TAD 500 100 ksps ksps VDD = VREF = 5V VDD = VREF = 2.7V Timing Parameters AD60 tPCS Conversion Start from Sample Trigger AD61 tPSS AD62 AD63 Note 1: -- -- TAD ns -- Sample Start from Setting Sample (SAMP) Bit 0.5 TAD -- 1.5 TAD ns -- tCSS Conversion Completion to Sample Start (ASAM = 1) -- -- TBD ns -- tDPU Time to Stabilize Analog Stage from A/D Off to A/D On -- -- TBD s -- Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. DS70083C-page 222 Advance Information 2003 Microchip Technology Inc. dsPIC30F TABLE 23-40: 12-BIT LOW-SPEED A/D MODULE SPECIFICATIONS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Device Supply AD01 AVDD Module VDD Supply Greater of VDD - 0.3 or 2.7 -- Lesser of VDD + 0.3 or 5.5 V -- AD02 AVSS Module VSS Supply VSS - 0.3 -- VSS + 0.3 V -- AD05 VREFH Reference Voltage High AVDD V -- Reference Inputs AD06 VREFL Reference Voltage Low AD07 VREF Absolute Reference Voltage AD08 IREF Current Drain AD10 VINH-VINL Full-Scale Input Span AVSS + 2.7 -- AVSS -- AVDD - 2.7 V -- AVSS - 0.3 -- AVDD + 0.3 V -- -- 200 .001 300 3 A A A/D operating A/D off VREFH V See Note Analog Input VREFL AD11 VIN Absolute Input Voltage AVDD + 0.3 V AD12 -- Leakage Current AVSS - 0.3 -- 0.001 0.610 A VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V Source Impedance = 1 kW AD13 -- Leakage Current -- 0.001 0.610 A VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V Source Impedance = 1 kW AD15 RSS Switch Resistance -- 5K -- AD16 CSAMPLE Sample Capacitor -- 18 AD17 RIN Recommended Impedance of Analog Voltage Source -- -- AD20 Nr Resolution AD21 INL Integral Nonlinearity -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD21A INL Integral Nonlinearity -- 0.75 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD22 DNL Differential Nonlinearity -- 0.5 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD22A DNL Differential Nonlinearity -- 0.5 1 LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V GERR Gain Error -- 1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD23A GERR Gain Error -- 1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V 1K -- -- pF -- W -- DC Accuracy AD23 Note 1: 12 data bits bits The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. 2003 Microchip Technology Inc. Advance Information DS70083C-page 223 dsPIC30F TABLE 23-40: 12-BIT LOW-SPEED A/D MODULE SPECIFICATIONS (CONTINUED) Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions EOFF Offset Error -- 1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 5V AD24A EOFF Offset Error -- 1.25 TBD LSb VINL = AVSS = VREFL = 0V, AVDD = VREFH = 3V AD25 -- Monotonicity(1) -- -- -- -- AD26 CMRR Common-Mode Rejection -- TBD -- dB -- AD27 PSRR Power Supply Rejection Ratio -- TBD -- dB -- AD28 CTLK Channel to Channel Crosstalk -- TBD -- dB -- AD30 THD Total Harmonic Distortion -- -- -- dB -- AD31 SINAD Signal to Noise and Distortion -- TBD -- dB -- AD32 SFDR Spurious Free Dynamic Range -- TBD -- dB -- AD33 FNYQ Input Signal Bandwidth -- -- 50 kHz -- AD34 ENOB Effective Number of Bits -- TBD TBD bits -- AD24 Guaranteed Dynamic Performance Note 1: The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. DS70083C-page 224 Advance Information 2003 Microchip Technology Inc. dsPIC30F FIGURE 23-30: LOW-SPEED A/D CONVERSION TIMING CHARACTERISTICS (ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution BSF SAMP BCF SAMP SAMP ch0_dischrg ch0_samp eoc AD61 AD60 TSAMP AD55 DONE ADIF ADRES(0) 1 2 3 4 5 6 7 8 9 1 - Software sets ADCON. SAMP to start sampling. 2 - Sampling starts after discharge period. TSAMP is described in the dsPIC30F Family Reference Manual, Section 18. 3 - Software clears ADCON. SAMP to start conversion. 4 - Sampling ends, conversion sequence starts. 5 - Convert bit 11. 6 - Convert bit 10. 7 - Convert bit 1. 8 - Convert bit 0. 9 - One TAD for end of conversion. 2003 Microchip Technology Inc. Advance Information DS70083C-page 225 dsPIC30F TABLE 23-41: LOW-SPEED A/D CONVERSION TIMING REQUIREMENTS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40C TA +85C for Industrial -40C TA +125C for Extended AC CHARACTERISTICS Param No. Symbol Characteristic Min. Typ Max. Units Conditions Clock Parameters AD50 TAD A/D Clock Period 667 1.4 -- -- ns s VDD = 5V (Note 1) VDD = 2.7V (Note 1) AD51 tRC A/D Internal RC Oscillator Period 1.2 1.5 1.8 s -- AD55 tCONV Conversion Time -- 15 TAD ns -- AD56 FCNV Throughput Rate -- -- Conversion Rate 100 50 ksps ksps VDD = VREF = 5V VDD = VREF = 2.7V Timing Parameters AD60 tPCS Conversion Start from Sample Trigger AD61 tPSS AD62 AD63 Note 1: -- -- TAD ns -- Sample Start from Setting Sample (SAMP) Bit 0.5 TAD -- 1.5 TAD ns -- tCSS Conversion Completion to Sample Start (ASAM = 1) -- -- TBD ns -- tDPU Time to Stabilize Analog Stage from A/D Off to A/D On -- -- TBD s -- Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity performance, especially at elevated temperatures. DS70083C-page 226 Advance Information 2003 Microchip Technology Inc. dsPIC30F 24.0 PACKAGING INFORMATION 24.1 Package Marking Information 18-Lead PDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 28-Lead PDIP (Skinny DIP) dsPIC30F3012-I/P 0348017 Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead SOIC dsPIC30F2012-I/SP 0348017 Example dsPIC30F2011 -I/SO XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN 0348017 28-Lead SOIC (.300") Example XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN Note: * PICXXFXXXX/SO 0310017 Customer specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard device marking consists of Microchip part number, year code, week code, and traceability code. For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2003 Microchip Technology Inc. Advance Information DS70083C-page 227 dsPIC30F 40-Lead PDIP Example XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX YYWWNNN dsPIC30F3014-I/P 0348017 44-Lead TQFP Example XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN dsPIC30F 3014-I/PT 0348017 64-Lead TQFP (10x10x1mm) XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN dsPIC30F 5011-I/PT 0348017 64-Lead TQFP (14x14x1mm) XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN Example dsPIC30F6011 -I/PT 0348017 80-Lead TQFP Example XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN DS70083C-page 228 Example dsPIC30F5013 -I/PT 0348017 Advance Information 2003 Microchip Technology Inc. dsPIC30F 18-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p B eB Units Dimension Limits n p MIN INCHES* NOM 18 .100 .155 .130 MAX MILLIMETERS NOM 18 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 22.61 22.80 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness .115 .145 A2 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width .240 .250 .260 E1 Overall Length D .890 .898 .905 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 B1 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-007 2003 Microchip Technology Inc. Advance Information MAX 4.32 3.68 8.26 6.60 22.99 3.43 0.38 1.78 0.56 10.92 15 15 DS70083C-page 229 dsPIC30F 28-Lead Skinny Plastic Dual In-line (SP) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c B1 A1 eB Units Number of Pins Pitch p B Dimension Limits n p INCHES* MIN NOM MILLIMETERS MAX MIN NOM 28 MAX 28 .100 2.54 Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06 Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 8.26 Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49 Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18 Tip to Seating Plane .125 .130 .135 3.18 3.30 3.43 Lead Thickness L c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .040 .053 .065 1.02 1.33 1.65 B .016 .019 .022 0.41 0.48 0.56 eB .320 .350 .430 8.13 8.89 10.92 Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom 0.38 5 10 15 5 10 15 5 10 15 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-095 Drawing No. C04-070 DS70083C-page 230 Advance Information 2003 Microchip Technology Inc. dsPIC30F 18-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E p E1 D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .446 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 18 .050 .099 .091 .008 .407 .295 .454 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .462 .029 .050 8 .012 .020 15 15 MILLIMETERS NOM 18 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 11.33 11.53 0.25 0.50 0.41 0.84 0 4 0.23 0.27 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 11.73 0.74 1.27 8 0.30 0.51 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 2003 Microchip Technology Inc. Advance Information DS70083C-page 231 dsPIC30F 28-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E E1 p D B 2 1 n h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Top Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B A1 MIN .093 .088 .004 .394 .288 .695 .010 .016 0 .009 .014 0 0 INCHES* NOM 28 .050 .099 .091 .008 .407 .295 .704 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .712 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 28 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.32 7.49 17.65 17.87 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 18.08 0.74 1.27 8 0.33 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-052 DS70083C-page 232 Advance Information 2003 Microchip Technology Inc. dsPIC30F 40-Lead Plastic Dual In-line (P) - 600 mil (PDIP) E1 D 2 1 n E A2 A L c B1 A1 eB p B Units Dimension Limits n p MIN INCHES* NOM 40 .100 .175 .150 MAX MILLIMETERS NOM 40 2.54 4.06 4.45 3.56 3.81 0.38 15.11 15.24 13.46 13.84 51.94 52.26 3.05 3.30 0.20 0.29 0.76 1.27 0.36 0.46 15.75 16.51 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .160 .190 Molded Package Thickness .140 .160 A2 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .595 .600 .625 Molded Package Width E1 .530 .545 .560 Overall Length D 2.045 2.058 2.065 Tip to Seating Plane L .120 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width .030 .050 .070 B1 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .620 .650 .680 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-011 Drawing No. C04-016 2003 Microchip Technology Inc. Advance Information MAX 4.83 4.06 15.88 14.22 52.45 3.43 0.38 1.78 0.56 17.27 15 15 DS70083C-page 233 dsPIC30F 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c L A1 A2 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic n1 A A2 A1 L (F) MIN .039 .037 .002 .018 E D E1 D1 c B CH 0 .463 .463 .390 .390 .004 .012 .025 5 5 INCHES NOM 44 .031 11 .043 .039 .004 .024 .039 3.5 .472 .472 .394 .394 .006 .015 .035 10 10 MAX .047 .041 .006 .030 7 .482 .482 .398 .398 .008 .017 .045 15 15 MILLIMETERS* NOM 44 0.80 11 1.00 1.10 0.95 1.00 0.05 0.10 0.45 0.60 1.00 0 3.5 11.75 12.00 11.75 12.00 9.90 10.00 9.90 10.00 0.09 0.15 0.30 0.38 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.15 0.75 7 12.25 12.25 10.10 10.10 0.20 0.44 1.14 15 15 Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-076 DS70083C-page 234 Advance Information 2003 Microchip Technology Inc. dsPIC30F 64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c A2 L A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) E D E1 D1 c B CH MIN .039 .037 .002 .018 0 .463 .463 .390 .390 .005 .007 .025 5 5 INCHES NOM 64 .020 16 .043 .039 .006 .024 .039 3.5 .472 .472 .394 .394 .007 .009 .035 10 10 MAX .047 .041 .010 .030 7 .482 .482 .398 .398 .009 .011 .045 15 15 MILLIMETERS* NOM 64 0.50 16 1.00 1.10 0.95 1.00 0.05 0.15 0.45 0.60 1.00 0 3.5 11.75 12.00 11.75 12.00 9.90 10.00 9.90 10.00 0.13 0.18 0.17 0.22 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.25 0.75 7 12.25 12.25 10.10 10.10 0.23 0.27 1.14 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-085 2003 Microchip Technology Inc. Advance Information DS70083C-page 235 dsPIC30F 64-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c A2 L A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) E D E1 D1 c B CH INCHES NOM 64 .032 16 MIN .037 .002 .018 .039 .024 .039 0 MAX MIN MILLIMETERS* NOM 64 0.80 16 .047 .041 .006 .030 0.95 0.05 0.45 7 0 .630 .630 .551 .551 .004 .019 11 11 .013 1.00 0.60 1.00 MAX 1.20 1.05 0.15 0.75 7 16.00 16.00 14.00 14.00 .008 .018 0.09 0.30 13 13 11 11 0.32 0.20 0.45 13 13 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-085 DS70083C-page 236 Advance Information 2003 Microchip Technology Inc. dsPIC30F 80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c L A2 A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) MIN .039 .037 .002 .018 E D E1 D1 c B CH 0 .541 .541 .463 .463 .004 .007 .025 5 5 INCHES NOM 80 .020 20 .043 .039 .004 .024 .039 3.5 .551 .551 .472 .472 .006 .009 .035 10 10 MAX .047 .041 .006 .030 7 .561 .561 .482 .482 .008 .011 .045 15 15 MILLIMETERS* NOM 80 0.50 20 1.00 1.10 0.95 1.00 0.05 0.10 0.45 0.60 1.00 0 3.5 13.75 14.00 13.75 14.00 11.75 12.00 11.75 12.00 0.09 0.15 0.17 0.22 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.15 0.75 7 14.25 14.25 12.25 12.25 0.20 0.27 1.14 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-092 2003 Microchip Technology Inc. Advance Information DS70083C-page 237 dsPIC30F 80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c L A2 A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) INCHES NOM 80 .026 20 MIN .037 .002 .018 .039 .024 .039 MAX MIN .047 .041 .006 .030 0.95 0.05 0.45 7 0 0 E D E1 D1 c B CH . .004 .009 11 11 MILLIMETERS* NOM 80 0.65 20 .630 .630 .551 .551 .013 1.00 0.60 1.00 MAX 1.20 1.05 0.15 0.75 7 16.00 16.00 14.00 14.00 .008 .015 0.09 0.22 13 13 11 11 0.32 0.20 0.38 13 13 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-092 DS70083C-page 238 Advance Information 2003 Microchip Technology Inc. dsPIC30F INDEX Numerics 12-bit Analog-to-Digital Converter (A/D) Module .............. 141 A A/D .................................................................................... 141 Aborting a Conversion .............................................. 143 ADCHS Register ....................................................... 141 ADCON1 Register..................................................... 141 ADCON2 Register..................................................... 141 ADCON3 Register..................................................... 141 ADCSSL Register ..................................................... 141 ADPCFG Register..................................................... 141 Configuring Analog Port Pins.............................. 73, 146 Connection Considerations....................................... 146 Conversion Operation ............................................... 142 Effects of a Reset...................................................... 145 Operation During CPU Idle Mode ............................. 145 Operation During CPU Sleep Mode.......................... 145 Output Formats ......................................................... 145 Power-down Modes .................................................. 145 Programming the Sample Trigger............................. 143 Register Map............................................................. 147 Result Buffer ............................................................. 142 Sampling Requirements............................................ 144 Selecting the Conversion Clock ................................ 143 Selecting the Conversion Sequence......................... 142 TAD vs. Device Operating Frequencies..................... 143 AC Characteristics ............................................................ 191 Load Conditions ........................................................ 191 AC Temperature and Voltage Specifications .................... 191 AC-Link Mode Operation .................................................. 138 16-bit Mode ............................................................... 138 20-bit Mode ............................................................... 138 Address Generator Units .................................................... 43 Alternate Vector Table ........................................................ 55 Analog-to-Digital Converter. See A/D. Assembler MPASM Assembler................................................... 171 Automatic Clock Stretch.................................................... 106 During 10-bit Addressing (STREN = 1) .................... 106 During 7-bit Addressing (STREN = 1) ...................... 106 Receive Mode ........................................................... 106 Transmit Mode .......................................................... 106 B Bandgap Start-up Time Requirements............................................................ 196 Timing Characteristics .............................................. 196 Barrel Shifter ....................................................................... 29 Bit Reversed Addressing Example ...................................................................... 50 Implementation ........................................................... 49 Bit-Reversed Addressing .................................................... 49 Modifier Values Table ................................................. 50 Sequence Table (16-Entry)......................................... 50 Block Diagrams 12-bit A/D Functional ................................................ 141 16-bit Timer1 Module .................................................. 77 16-bit Timer2............................................................... 83 16-bit Timer3............................................................... 83 16-bit Timer4............................................................... 88 16-bit Timer5............................................................... 88 32-bit Timer2/3............................................................ 82 2003 Microchip Technology Inc. 32-bit Timer4/5 ........................................................... 87 Analog Input Model................................................... 144 CAN Buffers and Protocol Engine ............................ 120 DCI Module............................................................... 132 Dedicated Port Structure ............................................ 71 DSP Engine ................................................................ 25 dsPIC30F5013/6013/6014.......................................... 14 External Power-on Reset Circuit .............................. 156 I2C ............................................................................ 104 Input Capture Mode.................................................... 91 Oscillator System...................................................... 150 Output Compare Mode ............................................... 95 RESET System......................................................... 154 Shared Port Structure................................................. 73 SPI............................................................................ 100 SPI Master/Slave Connection................................... 100 UART Receiver......................................................... 112 UART Transmitter..................................................... 111 BOR Characteristics ......................................................... 190 BOR. See Brown-out Reset. Brown-out Reset Characteristics.......................................................... 189 Timing Requirements ............................................... 196 C C Compilers MPLAB C17.............................................................. 172 MPLAB C18.............................................................. 172 MPLAB C30.............................................................. 172 CAN Module ..................................................................... 119 Baud Rate Setting .................................................... 124 CAN1 Register Map.................................................. 126 CAN2 Register Map.................................................. 128 Frame Types ............................................................ 119 I/O Timing Characteristics ........................................ 217 I/O Timing Requirements.......................................... 217 Message Reception.................................................. 122 Message Transmission............................................. 123 Modes of Operation .................................................. 121 Overview................................................................... 119 CLKOUT and I/O Timing Characteristics.......................................................... 194 Requirements ........................................................... 194 Code Examples Data EEPROM Block Erase ....................................... 66 Data EEPROM Block Write ........................................ 68 Data EEPROM Read.................................................. 65 Data EEPROM Word Erase ....................................... 66 Data EEPROM Word Write ........................................ 67 Erasing a Row of Program Memory ........................... 61 Initiating a Programming Sequence ........................... 62 Loading Write Latches................................................ 62 Code Protection ................................................................ 149 Core Architecture................................................................ 17 Overview..................................................................... 17 D Data Accumulators and Adder/............................... 27, 28, 29 Data Address Space........................................................... 35 Alignment.................................................................... 36 Alignment (Figure) ...................................................... 36 Effect of Invalid Memory Accesses (Table) ................ 36 MCU and DSP (MAC Class) Instructions Example .... 39 Memory Map............................................................... 36 Near Data Space ........................................................ 37 Sample Memory Map ................................................. 38 Advance Information DS70083C-page 239 dsPIC30F Software Stack ............................................................ 37 Spaces ........................................................................ 35 Width........................................................................... 36 Data Converter Interface (DCI) Module ............................ 131 Data EEPROM Memory ...................................................... 65 Erasing ........................................................................ 66 Erasing, Block ............................................................. 66 Erasing, Word ............................................................. 66 Protection Against Spurious Write .............................. 69 Reading....................................................................... 65 Write Verify ................................................................. 69 Writing ......................................................................... 67 Writing, Block .............................................................. 68 Writing, Word .............................................................. 67 Data Space Organization .................................................... 43 DC Characteristics ............................................................ 178 BOR .......................................................................... 190 Brown-out Reset ....................................................... 189 I/O Pin Input Specifications ....................................... 187 I/O Pin Output Specifications .................................... 188 Idle Current (IIDLE) .................................................... 182 Low-Voltage Detect................................................... 188 LVDL ......................................................................... 189 Operating Current (IDD)............................................. 179 Power-Down Current (IPD) ........................................ 185 Program and EEPROM............................................. 190 Temperature and Voltage Specifications .................. 178 DCI Module Bit Clock Generator................................................... 135 Buffer Alignment with Data Frames .......................... 136 Buffer Control ............................................................ 131 Buffer Data Alignment ............................................... 131 Buffer Length Control................................................ 136 COFS Pin.................................................................. 131 CSCK Pin.................................................................. 131 CSDI Pin ................................................................... 131 CSDO Mode Bit ........................................................ 137 CSDO Pin ................................................................. 131 Data Justification Control Bit ..................................... 135 Device Frequencies for Common Codec CSCK Frequencies (Table)............................... 135 Digital Loopback Mode ............................................. 137 Enable....................................................................... 133 Frame Sync Generator ............................................. 133 Frame Sync Mode Control Bits ................................. 133 I/O Pins ..................................................................... 131 Interrupts ................................................................... 137 Introduction ............................................................... 131 Master Frame Sync Operation .................................. 133 Operation .................................................................. 133 Operation During CPU Idle Mode ............................. 138 Operation During CPU Sleep Mode .......................... 138 Receive Slot Enable Bits........................................... 136 Receive Status Bits ................................................... 137 Register Map............................................................. 139 Sample Clock Edge Control Bit................................. 135 Slave Frame Sync Operation .................................... 134 Slot Enable Bits Operation with Frame Sync ............ 136 Slot Status Bits.......................................................... 137 Synchronous Data Transfers .................................... 136 Timing Characteristics AC-Link Mode ................................................... 207 Multichannel, I2S Modes ................................... 205 DS70083C-page 240 Timing Requirements AC-Link Mode................................................... 207 Multichannel, I2S Modes................................... 206 Transmit Slot Enable Bits ......................................... 135 Transmit Status Bits.................................................. 137 Transmit/Receive Shift Register ............................... 131 Underflow Mode Control Bit...................................... 137 Word Size Selection Bits .......................................... 133 Demonstration Boards PICDEM 1................................................................. 174 PICDEM 17............................................................... 174 PICDEM 18R PIC18C601/801.................................. 175 PICDEM 2 Plus......................................................... 174 PICDEM 3 PIC16C92X............................................. 174 PICDEM 4................................................................. 174 PICDEM LIN PIC16C43X ......................................... 175 PICDEM USB PIC16C7X5 ....................................... 175 PICDEM.net Internet/Ethernet .................................. 174 Development Support ....................................................... 171 Device Configuration Register Map ............................................................ 162 Device Configuration Registers FBORPOR ................................................................ 160 FGS .......................................................................... 160 FOSC........................................................................ 160 FWDT ....................................................................... 160 Device Overview................................................................. 13 Disabling the UART .......................................................... 113 Divide Support .................................................................... 23 Instructions (Table) ..................................................... 23 DSP Engine ........................................................................ 24 Multiplier ..................................................................... 26 Dual Output Compare Match Mode .................................... 96 Continuous Pulse Mode.............................................. 96 Single Pulse Mode...................................................... 96 E Electrical Characteristics .................................................. 177 AC............................................................................. 191 DC ............................................................................ 178 Enabling and Setting Up UART Alternate I/O ............................................................. 113 Setting Up Data, Parity and Stop Bit Selections ....... 113 Enabling the UART ........................................................... 113 Equations A/D Conversion Clock............................................... 143 A/D Sampling Time................................................... 144 Baud Rate................................................................. 115 Bit Clock Frequency.................................................. 135 COFSG Period.......................................................... 133 Serial Clock Rate ...................................................... 108 Time Quantum for Clock Generation ........................ 125 Errata .................................................................................. 11 Evaluation and Programming Tools.................................. 175 Exception Processing ......................................................... 51 External Clock Timing Characteristics Type A, B and C Timer ............................................. 197 External Clock Timing Requirements ............................... 192 Type A Timer ............................................................ 197 Type B Timer ............................................................ 198 Type C Timer ............................................................ 198 External Interrupt Requests ................................................ 56 Advance Information 2003 Microchip Technology Inc. dsPIC30F F Fast Context Saving............................................................ 56 Flash Program Memory ...................................................... 59 Control Registers ........................................................ 60 NVMADR ............................................................ 60 NVMADRU.......................................................... 60 NVMCON ............................................................ 60 NVMKEY............................................................. 60 I I/O Pin Specifications Input .......................................................................... 187 Output ....................................................................... 188 I/O Ports .............................................................................. 71 Parallel (PIO) .............................................................. 71 I2C ..................................................................................... 103 I2C 10-bit Slave Mode Operation ...................................... 105 Reception.................................................................. 105 Transmission............................................................. 105 I2C 7-bit Slave Mode Operation ........................................ 105 I2C 7-bit Slave Mode Operation Reception.................................................................. 105 Transmission............................................................. 105 I2C Master Mode Operation .............................................. 107 Baud Rate Generator................................................ 108 Clock Arbitration........................................................ 108 Multi-Master Communication, Bus Collision and Bus Arbitration ........................................... 108 Reception.................................................................. 107 Transmission............................................................. 107 I2C Master Mode Support ................................................. 107 I2C Module ........................................................................ 103 Addresses ................................................................. 105 Bus Data Timing Characteristics Master Mode ..................................................... 213 Slave Mode ....................................................... 215 Bus Data Timing Requirements Master Mode ..................................................... 214 Slave Mode ....................................................... 216 Bus Start/Stop Bits Timing Characteristics Master Mode ..................................................... 213 Slave Mode ....................................................... 215 General Call Address Support .................................. 107 Interrupts................................................................... 106 IPMI Support ............................................................. 107 Operating Function Description ................................ 103 Operation During CPU Sleep and Idle Modes .......... 108 Pin Configuration ...................................................... 103 Register Map............................................................. 109 Registers................................................................... 103 Slope Control ............................................................ 107 Software Controlled Clock Stretching (STREN = 1)..................................................... 106 Various Modes .......................................................... 103 I2C Module Programmer's Model................................................. 103 I2S Mode Operation .......................................................... 138 Data Justification....................................................... 138 Frame and Data Word Length Selection................... 138 Idle Current (IIDLE) ............................................................ 182 In-Circuit Serial Programming (ICSP) ......................... 59, 149 Input Capture (CAPX) Timing Characteristics .................. 200 Input Capture Module ......................................................... 91 Interrupts..................................................................... 92 Register Map............................................................... 93 2003 Microchip Technology Inc. Input Capture Operation During Sleep and Idle Modes...... 92 CPU Idle Mode ........................................................... 92 CPU Sleep Mode........................................................ 92 Input Capture Timing Requirements................................. 200 Input Change Notification Module....................................... 75 Register Map (Bits 15-8)............................................. 75 Register Map (Bits 7-0)............................................... 75 Input Characteristics QEA/QEB ................................................................. 203 Instruction Addressing Modes ............................................ 43 File Register Instructions ............................................ 44 Fundamental Modes Supported ................................. 43 MAC Instructions ........................................................ 44 MCU Instructions ........................................................ 44 Move and Accumulator Instructions ........................... 44 Other Instructions ....................................................... 44 Instruction Flow................................................................... 20 Pipeline 1-Word, 1-Cycle (Figure) .................................... 20 1-Word, 2-Cycle (Figure) .................................... 20 1-Word, 2-Cycle MOV.D Operations (Figure)..... 21 1-Word, 2-Cycle Table Operations (Figure) ....... 21 1-Word, 2-Cycle with Instruction Stall (Figure) ... 22 2-Word, 2-Cycle DO, DOW (Figure)................... 22 2-Word, 2-Cycle GOTO, CALL (Figure) ............. 21 Instruction Set Overview................................................................... 166 Summary .................................................................. 163 Instruction Stalls ................................................................. 45 Introduction................................................................. 45 Raw Dependency Detection ....................................... 45 Inter-Integrated Circuit. See I2C. Internal Clock Timing Examples ....................................... 193 Interrupt Controller Register Map .............................................................. 57 Interrupt Priority .................................................................. 52 Interrupt Sequence ............................................................. 55 Interrupt Stack Frame................................................. 55 L Load Conditions................................................................ 191 Low Voltage Detect (LVD) ................................................ 159 Low-Voltage Detect Characteristics.................................. 188 LVDL Characteristics ........................................................ 189 M Memory Organization ......................................................... 31 Core Register Map ..................................................... 40 Modes of Operation Disable...................................................................... 121 Error Recognition...................................................... 121 Initialization............................................................... 121 Listen Only................................................................ 121 Loopback .................................................................. 121 Normal Operation ..................................................... 121 Modulo Addressing ............................................................. 46 Applicability................................................................. 49 Decrementing Buffer Operation Example................... 48 Incrementing Buffer Operation Example .................... 47 Restrictions................................................................. 49 Start and End Address ............................................... 46 W Address Register Selection.................................... 47 Motor Control PWM Module Fault Timing Characteristics ..................................... 202 Timing Characteristics .............................................. 202 Timing Requirements ............................................... 202 Advance Information DS70083C-page 241 dsPIC30F MPLAB ASM30 Assembler, Linker, Librarian ................... 172 MPLAB ICD 2 In-Circuit Debugger.................................... 173 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator .................................................... 173 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator .................................................... 173 MPLAB Integrated Development Environment Software .................................................................... 171 MPLINK Object Linker/MPLIB Object Librarian ................ 172 Multiplier 16-bit Integer and Fractional Modes Example ............ 26 N NVM Register Map............................................................... 63 O OC/PWM Module Timing Characteristics.......................... 201 Operating Current (IDD)..................................................... 179 Operating Frequency vs Voltage dsPIC30FXXXX-20 (Extended)................................. 178 Oscillator Configurations ........................................................... 151 Fail-Safe Clock Monitor..................................... 153 Fast RC (FRC) .................................................. 152 Initial Clock Source Selection ........................... 151 Low Power RC (LPRC) ..................................... 152 LP Oscillator Control ......................................... 152 Phase Locked Loop (PLL) ................................ 152 Start-up Timer (OST) ........................................ 152 Operating Modes (Table) .......................................... 149 System Overview ...................................................... 149 Oscillator Selection ........................................................... 149 Oscillator Start-up Timer Timing Characteristics .............................................. 195 Timing Requirements ................................................ 196 Output Compare Interrupts ................................................. 97 Output Compare Module..................................................... 95 Register Map............................................................... 98 Timing Characteristics .............................................. 200 Timing Requirements ................................................ 200 Output Compare Operation During CPU Idle Mode............ 97 Output Compare Sleep Mode Operation............................. 97 Power Saving Modes........................................................ 159 Idle ............................................................................ 160 Sleep ........................................................................ 159 Sleep and Idle........................................................... 149 Power-Down Current (IPD)................................................ 185 Power-up Timer Timing Characteristics .............................................. 195 Timing Requirements................................................ 196 PRO MATE II Universal Device Programmer ................... 173 Program Address Space..................................................... 31 Alignment and Data Access Using Table Instructions ............................................... 32 Construction ............................................................... 31 Data Access from, Address Generation ..................... 31 Data Space Window into Operation............................ 34 Data Table Access (LS Word) .................................... 32 Data Table Access (MS Byte)..................................... 33 Memory Map............................................................... 35 Table Instructions TBLRDH ............................................................. 32 TBLRDL.............................................................. 32 TBLWTH............................................................. 32 TBLWTL ............................................................. 32 Visibility from Data Space........................................... 33 Program and EEPROM Characteristics............................ 190 Program Counter ................................................................ 18 Programmable .................................................................. 149 Programmer's Model .......................................................... 18 Diagram ...................................................................... 19 Programming Operations.................................................... 61 Algorithm for Program FLASH .................................... 61 Erasing a Row of Program Memory............................ 61 Initiating the Programming Sequence......................... 62 Loading Write Latches ................................................ 62 Protection Against Accidental Writes to OSCCON ........... 153 Q QEA/QEB Input Characteristics........................................ 203 QEI Module External Clock Timing Requirements ....................... 199 Index Pulse Timing Characteristics .......................... 204 Index Pulse Timing Requirements............................ 204 Quadrature Decoder Timing Requirements...................... 203 P R Packaging Information ...................................................... 227 Marking ..................................................................... 227 Peripheral Module Disable (PMD) Registers .................... 161 PICkit 1 FLASH Starter Kit ................................................ 175 PICSTART Plus Development Programmer ..................... 173 Pinout Descriptions ............................................................. 15 PLL Clock Timing Specifications....................................... 193 POR. See Power-on Reset. PORTA Register Map............................................................... 72 PORTB Register Map............................................................... 74 PORTC Register Map............................................................... 74 PORTD Register Map............................................................... 74 PORTF Register Map............................................................... 74 PORTG Register Map............................................................... 74 Reset ........................................................................ 149, 154 BOR, Programmable ................................................ 156 Brown-out Reset (BOR)............................................ 149 Oscillator Start-up Timer (OST) ................................ 149 POR Operating without FSCM and PWRT................ 156 With Long Crystal Start-up Time ...................... 156 POR (Power-on Reset)............................................. 154 Power-on Reset (POR)............................................. 149 Power-up Timer (PWRT) .......................................... 149 Reset Sequence ................................................................. 53 Reset Sources ............................................................ 53 Reset Sources Brown-out Reset (BOR).............................................. 53 Illegal Instruction Trap ................................................ 53 Trap Lockout............................................................... 53 Uninitialized W Register Trap ..................................... 53 Watchdog Time-out .................................................... 53 Reset Timing Characteristics............................................ 195 Reset Timing Requirements ............................................. 196 RTSP Operation ................................................................. 60 DS70083C-page 242 Advance Information 2003 Microchip Technology Inc. dsPIC30F Run-Time Self-Programming (RTSP) ................................. 59 Control Registers NVMADR ............................................................ 59 NVMCON ............................................................ 59 NVMKEY............................................................. 59 S Serial Peripheral Interface. See SPI. Simple Capture Event Mode ............................................... 91 Buffer Operation.......................................................... 92 Hall Sensor Mode ....................................................... 92 Prescaler..................................................................... 91 Timer2 and Timer3 Selection Mode............................ 92 Simple OC/PWM Mode Timing Requirements.................. 201 Simple Output Compare Match Mode................................. 96 Simple PWM Mode ............................................................. 96 Input Pin FAULT Protection ........................................ 96 Period.......................................................................... 97 Software Simulator (MPLAB SIM)..................................... 172 Software Simulator (MPLAB SIM30)................................. 172 Software Stack Pointer, Frame Pointer............................... 18 CALL Stack Frame...................................................... 37 SPI ...................................................................................... 99 SPI Module ......................................................................... 99 Framed SPI Support ................................................... 99 Operating Function Description .................................. 99 Operation During CPU IDLE Mode ........................... 101 Operation During CPU Sleep Mode.......................... 101 SDOx Disable ............................................................. 99 Slave Select Synchronization ................................... 101 SPI1 Register Map.................................................... 102 SPI2 Register Map.................................................... 102 Timing Characteristics Master Mode (CKE = 0).................................... 208 Master Mode (CKE = 1).................................... 209 Slave Mode (CKE = 1).............................. 210, 211 Timing Requirements Master Mode (CKE = 0).................................... 208 Master Mode (CKE = 1).................................... 209 Slave Mode (CKE = 0)...................................... 210 Slave Mode (CKE = 1)...................................... 212 Word and Byte Communication .................................. 99 STATUS Bits, Their Significance and the Initialization Condition for RCON Register, Case 1................................ 157 STATUS Bits, Their Significance and the Initialization Condition for RCON Register, Case 2................................ 158 STATUS Register ............................................................... 18 Z Status Bit ................................................................. 18 Subtractor ........................................................................... 27 Data Space Write Saturation ...................................... 29 Overflow and Saturation ............................................. 27 Round Logic................................................................ 28 Write Back................................................................... 28 Symbols used in Opcode Descriptions ............................. 164 System Integration ............................................................ 149 Register Map............................................................. 162 T Table Instruction Operation Summary ................................ 59 Temperature and Voltage Specifications AC ............................................................................. 191 DC............................................................................. 178 Timer1 Module .................................................................... 77 16-bit Asynchronous Counter Mode ........................... 77 16-bit Synchronous Counter Mode ............................. 77 16-bit Timer Mode....................................................... 77 2003 Microchip Technology Inc. Gate Operation ........................................................... 78 Interrupt ...................................................................... 78 Operation During Sleep Mode .................................... 78 Prescaler .................................................................... 78 Real-Time Clock ......................................................... 78 Interrupts ............................................................ 78 Oscillator Operation............................................ 78 Register Map .............................................................. 79 Timer2 and Timer3 Selection Mode.................................... 96 Timer2/3 Module................................................................. 81 16-bit Timer Mode ...................................................... 81 32-bit Synchronous Counter Mode............................. 81 32-bit Timer Mode ...................................................... 81 ADC Event Trigger ..................................................... 84 Gate Operation ........................................................... 84 Interrupt ...................................................................... 84 Operation During Sleep Mode .................................... 84 Register Map .............................................................. 85 Timer Prescaler .......................................................... 84 Timer4/5 Module................................................................. 87 Register Map .............................................................. 89 TimerQ (QEI Module) External Clock Timing Characteristics .............................................. 199 Timing Characteristics A/D Conversion High-speed (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) ........................ 220 High-speed (CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)...................................... 221 Low-speed (ASAM = 0, SSRC = 000) ............ 225 Bandgap Start-up Time ............................................ 196 CAN Module I/O ....................................................... 217 CLKOUT and I/O ...................................................... 194 DCI Module AC-Link Mode................................................... 207 Multichannel, I2S Modes................................... 205 External Clock .......................................................... 191 I2C Bus Data Master Mode..................................................... 213 Slave Mode ...................................................... 215 I2C Bus Start/Stop Bits Master Mode..................................................... 213 Slave Mode ...................................................... 215 Input Capture (CAPX)............................................... 200 Motor Control PWM Module ..................................... 202 Motor Control PWM Module Falult ........................... 202 OC/PWM Module...................................................... 201 Oscillator Start-up Timer........................................... 195 Output Compare Module .......................................... 200 Power-up Timer ........................................................ 195 QEI Module Index Pulse........................................... 204 Reset ........................................................................ 195 SPI Module Master Mode (CKE = 0) ................................... 208 Master Mode (CKE = 1) ................................... 209 Slave Mode (CKE = 0) ..................................... 210 Slave Mode (CKE = 1) ..................................... 211 TimerQ (QEI Module) External Clock ....................... 199 Type A, B and C Timer External Clock..................... 197 Watchdog Timer ....................................................... 195 Timing Diagrams CAN Bit..................................................................... 124 Frame Sync, AC-Link Start of Frame ....................... 134 Frame Sync, Multi-Channel Mode ............................ 134 Advance Information DS70083C-page 243 dsPIC30F I2S Interface Frame Sync.......................................... 134 PWM Output ............................................................... 97 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 1...................... 155 Time-out Sequence on Power-up (MCLR Not Tied to VDD), Case 2...................... 155 Time-out Sequence on Power-up (MCLR Tied to VDD).......................................... 155 Timing Diagrams and Specifications DC Characteristics - Internal RC Accuracy ............... 193 Timing Diagrams.See Timing Characteristics Timing Requirements A/D Conversion High-speed........................................................ 222 Low-speed ........................................................ 226 Bandgap Start-up Time ............................................. 196 Brown-out Reset ....................................................... 196 CAN Module I/O ........................................................ 217 CLKOUT and I/O....................................................... 194 DCI Module AC-Link Mode ................................................... 207 Multichannel, I2S Modes ................................... 206 External Clock ........................................................... 192 I2C Bus Data (Master Mode)..................................... 214 I2C Bus Data (Slave Mode)....................................... 216 Input Capture ............................................................ 200 Motor Control PWM Module...................................... 202 Oscillator Start-up Timer ........................................... 196 Output Compare Module........................................... 200 Power-up Timer ........................................................ 196 QEI Module External Clock................................................... 199 Index Pulse ....................................................... 204 Quadrature Decoder ................................................. 203 Reset......................................................................... 196 Simple OC/PWM Mode ............................................. 201 SPI Module Master Mode (CKE = 0) .................................... 208 Master Mode (CKE = 1) .................................... 209 Slave Mode (CKE = 0) ...................................... 210 Slave Mode (CKE = 1) ...................................... 212 Type A Timer External Clock .................................... 197 Type B Timer External Clock .................................... 198 Type C Timer External Clock .................................... 198 Watchdog Timer........................................................ 196 Timing Specifications PLL Clock.................................................................. 193 Traps ................................................................................... 53 Hard and Soft .............................................................. 54 Sources ....................................................................... 53 Address Error Trap ............................................. 54 Math Error Trap................................................... 53 Oscillator Fail Trap.............................................. 54 Stack Error Trap.................................................. 54 DS70083C-page 244 U UART Module Address Detect Mode ............................................... 115 Auto Baud Support ................................................... 116 Baud Rate Generator ............................................... 115 Enabling and Setting Up ........................................... 113 Framing Error (FERR) .............................................. 115 Idle Status................................................................. 115 Loopback Mode ........................................................ 115 Operation During CPU Sleep and Idle Modes .......... 116 Overview................................................................... 111 Parity Error (PERR) .................................................. 115 Receive Break .......................................................... 115 Receive Buffer (UxRXB) ........................................... 114 Receive Buffer Overrun Error (OERR Bit) ................ 114 Receive Interrupt ...................................................... 114 Receiving Data ......................................................... 114 Receiving in 8-bit or 9-bit Data Mode ....................... 114 Reception Error Handling ......................................... 114 Transmit Break ......................................................... 114 Transmit Buffer (UxTXB) .......................................... 113 Transmit Interrupt ..................................................... 114 Transmitting Data ..................................................... 113 Transmitting in 8-bit Data Mode................................ 113 Transmitting in 9-bit Data Mode................................ 113 UART1 Register Map................................................ 117 UART2 Register Map................................................ 117 UART Operation Idle Mode .................................................................. 116 Sleep Mode .............................................................. 116 Unit ID Locations .............................................................. 149 Universal Asynchronous Receiver Transmitter. See UART. W Wake-up from Sleep ......................................................... 149 Wake-up from Sleep and Idle ............................................. 56 Watchdog Timer Timing Characteristics .............................................. 195 Timing Requirements................................................ 196 Watchdog Timer (WDT)............................................ 149, 159 Enabling and Disabling ............................................. 159 Operation .................................................................. 159 WWW, On-Line Support ..................................................... 11 Advance Information 2003 Microchip Technology Inc. dsPIC30F ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape(R) or Microsoft(R) Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 042003 The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 2003 Microchip Technology Inc. Advance Information DS70083C-page 245 dsPIC30F READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: dsPIC30F Y N Literature Number: DS70083C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS70083C-page 246 Advance Information 2003 Microchip Technology Inc. dsPIC30F PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. d s P I C 3 0 L F 1 0 0 1 AT P - I / P T- 0 0 0 Custom ID Trademark Family PT PT PT SO SP P S W L = Low Voltage Memory Type Flash = F Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up = = = = = = = = Package TQFP 10x10 TQFP 12x12 TQFP 14x14 SOIC SDIP DIP Die (Waffle Pack) Die (Wafers) Temperature I = Industrial -40C to +85C E = Extended High Temp -40C to +125C P = Pilot T = Tape and Reel A,B,C... = Revision Device ID Examples: a) dsPIC30F2011ATP-E/SO = Extended temp., SOIC package, Rev. A. b) dsPIC30F6014ATP-I/PT = Industrial temp., TQFP package, Rev. A. c) dsPIC30F3012ATP-I/P = Industrial temp., PDIP package, Rev. A. 2003 Microchip Technology Inc. Advance Information DS70083C-page 247 dsPIC30F NOTES: DS70083C-page 248 Advance Information 2003 Microchip Technology Inc. dsPIC30F NOTES: 2003 Microchip Technology Inc. Advance Information DS70083C-page 249 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC Korea Corporate Office Australia 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Atlanta Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. 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