Surface Mount QSOP Resistor Networks IRC Advanced Film Division QSOP Series * Reliable, no internal cavity * High resistor density - .025" lead spacing * Standard JEDEC 16, 20, and 24 pin packages * Ultra-stable TaNSil(R) resistors on silicon substrates * Standard Sn/Pb and Pb-free terminations available IRC's TaNSil(R) QSOP resistor networks are the perfect solution for high volume applications that demand a small wiring board footprint. The .025" lead spacing provides higher lead density, increased component count, lower resistor cost, and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking, low cost and miniature package. Excellent performance in harsh, humid environments is a trademark of IRC's self-passivating TaNSil(R) resistor film. The QSOP series is ideally suited for the latest surface mount assembly techniques and each lead can be 100% visually inspected. The compliant gull wing leads relieve thermal expansion and contraction stresses created by soldering and temperature excursions. For applications requiring high performance resistor networks in a low cost, surface mount package, specify IRC QSOP resistor networks. Environmental Data Electrical Data Resistance Range 10 - 250K Absolute Tolerance To 0.1% Ratio Tolerance to R1 To 0.05% Absolute TCR To 25ppm/C Tracking TCR To 5ppm/C Element Power Rating @ 70C Isolated Schematic Bussed Schematic Package Power Rating @ 70C Rated Operating________________ Voltage (not to exceed Power X Resistance) Operating Temperature Noise 100mW 50mW 16-Pin 20-Pin 24-Pin 750mW 1.0W 1.0W 100 Volts Test Per MIL-PRF-83401 Typical Delta R Max Delta R Thermal Shock 0.02% 0.1% Power Conditioning 0.03% 0.1% High Temperature Exposure 0.03% 0.05% Short-time Overload 0.02% 0.05% Low Temperature Storage 0.03% 0.05% Life 0.05% 0.1% -55C to +125C <-30dB General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. (c) IRC Advanced Film Division * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Email: afdsales@irctt.com * Website: www.irctt.com A subsidiary of TT electronics plc QSOP Series Issue February 2005 Surface Mount QSOP Resistor Networks IRC Advanced Film Division Manufacturing Capability Data ISOLATED SCHEMATIC A Absolute TCR (ppm/C) BUSSED SCHEMATIC B Ohmic Range ( ) Available Tolerances Available Ratio Tolerances Best TCR Tracking (ppm/C) Ohmic Range ( ) Available Tolerances Available Ratio Tolerances Best TCR Tracking (ppm/C) 10 - 25 FGJ FG 50 10 - 25 FGJ FG 200 26 - 50 DFGJ CDFG 10 26 - 50 FGJ DFG 100 51 - 200 CDFGJ CDFG 5 51 - 100 DFGJ CDFG 50 201 - 250K BCDFGJ ABCDFG 5 101 - 200 DFGJ BCDFG 25 201 - 500 BCDFGJ BCDFG 20 501 - 100K BCDFGJ ABCDFG 5 250 100 26 - 50 DFGJ CDFG 10 26 - 50 FGJ DFG 100 51 - 200 CDFGJ CDFG 5 51 - 100 DFGJ CDFG 50 201 - 250K BCDFGJ ABFG 5 101 - 200 DFGJ BCDFG 25 201 - 500 BCDFGJ BCDFG 20 501 - 100K BCDFGJ ABCDFG 5 26 - 50 DFGJ CDFG 10 51 - 100 DFGJ CDFG 50 51 - 200 CDFGJ CDFG 5 101 - 200 DFGJ BCDFG 25 201 - 250K BCDFGJ ABFG 5 201 - 500 BCDFGJ BCDFG 20 501 - 100K BCDFGJ ABCDFG 5 50 51 - 200 CDFGJ CDFG 5 201 - 500 BCDFGJ BCDFG 20 201 - 250K BCDFGJ ABFG 5 501 - 100K BCDFGJ ABCDFG 5 25 (c) IRC Advanced Film Division * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Email: afdsales@irctt.com * Website: www.irctt.com QSOP Series Issue February 2005 Surface Mount QSOP Resistor Networks IRC Advanced Film Division Physical Data N N R1 1 2 3 Schematic A Isolated 0.154" .003" 0.236" .008" N R1 1 0.025" Typ 1 2 Schematic B Bussed L Note: N = number of pins (16, 20, 24) 0.064" .003" 0.010" .002" # OF PINS DIMENSION "L" 16 0.193" 0.004" 20 0.341" 0.004" 24 0.341" 0.004" 0.006" .002" Note: All dimesions exclude mold flash and end flash which shall not exceed 0.006" per side. Power Derating Data Ordering Data Prefix 100 % Of Rated Power 3 GUS - QS8 A - 01 - 1002 - F B Style QS8 = 16-pin Network QS0 = 20-pin Network QSC = 24-pin Network Schematic and Termination A = Isolated network w/ standard Sn/Pb terminations ALF= Isolated network w/ Pb-free terminations B = Bussed network w/ standard Sn/Pb terminations BLF= Bussed network w/ Pb-free terminations 50 Absolute TCR Code 00 = 250ppm/C; 01 = 100ppm/C 02 = 50ppm/C; 03 = 25ppm/C 10 25 70 Temperature in C 125 Resistance Code 4-Digit Resistance Code Ex: 1002 = 10K, 50R1 = 50.1 Absolute Tolerance Code J = 5%; G = 2%; F = 1%; D = 0.5% C = 0.25%; B = 0.1% Ratio Tolerance Code (optional) G = 2%; F = 1%; D = 0.5%; C = 0.25%; B = 0.1%; A = 0.05% Packaging Specify tubes or tape & reel. For additional information or to discuss your specific requirements, please contact our Applications Team using the contact details below. (c) IRC Advanced Film Division * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Email: afdsales@irctt.com * Website: www.irctt.com QSOP Series Issue February 2005 International Resistive Company Advanced Film Division 4222 South Staples Street Corpus Christi, Texas 78411, USA Lead Free Certification & RoHS Compliance Telephone: +1(361)992-7900 Facsimile: +1(361)992-3377 Email: ircafd@irctt.com Website: www.irctt.com Rev: 10-Apr-2006 Information Matrix by Family LR / LRF CURRENT SENSE RESISTORS New Part Numbers for Lead Free Components TIMELINE Scheduled Transition Date Code (YYWW) (Date that manufacturing will shift to lead free.) LR2512LFLRF2512LFLR2010LFLRF2010LFLR1206LFLRF1206LF- 0501 SC3-LRF 3W CURRENT SENSE / POWER RESISTORS PFC THIN FILM CHIP RESISTORS PWC THICK WCR THICK FILM PULSE FILM CHIP CHIP RESISTORS RESISTOR WCA - WCC THICK FILM CHIP ARRAY PRECISION CHIP RESISTORSNICHROME SOIC SILICON RESISTOR NETWORKS (SOIC) QSOP SILICON RESISTOR NETWORKS TSSSOP SILICON RESISTOR NETWORKS SOT23 & SOT143 SILICON RESISTOR NETWORKS WIREBONDABLE CHIP RESISTORS SON CERAMIC PRECISION R-NETS SIP-DIP-FLAT PACK CERAMIC R-NETS 4769LF- 4761LF- 4789LF4781LF- 4709LF- 4701LF1989LF- 1987LF- 1999LF1998LF- 8989LF- 8987LF8999LF- 8998LF- SC3LFLRF3WLF- PFC-W0603LFPFC-W0805LFPFC-W1206LFPFC-D1206LF- WCR0402LFWCR0603LFWCR0805LFWCR1206LFWCR1210LFWCR2010LFWCR2512LF- PWC0805LFPWC1206LFPWC2010LFPWC2512LF- WCA0804LFWCC0804LF- PCF-W0402LFPCF-W0603LFPCF-W0805LFPCF-W1206LFPCF-W1210LF- SS4ALF- SS4BLFSS7ALF- SS7BLFSS8ALF- SS8BLFSL8ALF- SL8BLFSL0ALF- SL0BLF- QS8ALF- QS8BLFQS0ALF- QS0BLFQSCALF- QSCBLF- TS8ALF- TS8BLFTS0ALF- TS0BLFTSCALF- TSCBLF- SOT23LFSOT143LF- R0202T0303- NS4ALB- NS4BLFNS7ALF- NS7BLFNS8ALF- NS8BLFN959LF- N954LFN989LF- N987LFN999LF- N998LF- 0501 0501 0432 0501 0501 0501 0501 0501 0501 0501 always lead free 0501 TBD TBD (Note 1) TBD (Note 1) TBD (Note 1) TBD (Note 1) always lead free None planned (Note 2) None planned (Note 2) Matte tin over nickel Matte tin over copper alloy Matte tin over copper alloy Matte tin over copper alloy Matte tin over copper alloy Aluminum Matte tin over nickel Gold over nickel or HSD with SAC alloy Discontinuation Date Code For Tin-Lead Finish (YYWW) None Planned None planned None Planned TBD (Note 1) 0432 0501 (Date after which no tin-lead will be manufactured.) (Note 2) (Note 2) (Note 2) Lead-Free finish Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over nickel nickel nickel nickel nickel nickel NONE PLANNED REFLOW CONDITIONS Peak Reflow Temperature (C) MSL in accordance with J-STD 020C COMPONENT AND PACKAGE MARKING Component Marking (Pb Free Indicator) Packaging Marking (Pb Free Indicator on reel, tube, etc.) RoHS Compliance including DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 and DIRECTIVE 2003/11/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 6 February 2003 260C 1 260C 1 260C 1 260C 1 260C 1 260C 1 260C 1 TBD TBD TBD TBD TBD TBD TBD TBD TBD N/A 260C 1 260C 1 No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes none lead (Note 3) none lead (Note 3) none lead (Note 3) none none none none none none none none none none none none none none none none nickel bismuth nickel antimony nickel bismuth antimony nickel SL = Antimony none none none none nickel nickel RESTRICTED SUBSTANCES Reference: EIA/EICTA/GPSSI JOINT INDUSTRY GUIDEMATERIAL COMPOSITION DECLARATION GUIDE (DRAFT XX-XXXX, September 19, 2003) LEVEL-A none none none LEVEL-B none none none IMDS (short) nickel nickel nickel IMDS REPORTABLE SUBSTANCES Reference: IMDS International list of reportable substances Note 1- If a planned phaseout of tin-lead terminations is required, a PCN will be posted providing at least 6 months of notification. Note 2- Tin-lead terminations will not be phased out unless a suitable replacement is approved by DSCC. Note 3- Lead is in thick film glass and permitted under RoHS Directive, exemption 5. QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls QF008: IRC Lead Free Product Availability and Material Declaration Sheets Index Worksheet Number Product Family Product 1 PFC W0603LF Precision Thin Film Chip Resistor 2 PFC W0805LF Precision Thin Film Chip Resistor 3 PFC W1206LF Precision Thin Film Chip Resistor 4 LRC LR1206LF Thick Film Current Sense Resistor 5 LRC LR2010LF Thick Film Current Sense Resistor 6 LRC LR2512LF Thick Film Current Sense Resistor 7 LRC LRF3WLF 8 SCW SC3LF 9 LRZ LRZ1206LF 3 Watt Chip Resistor Ultra Low Resistance Jumper Resistor 10 LRZ LRZ2010LF Ultra Low Resistance Jumper Resistor 11 LRZ LRZ2512LF Ultra Low Resistance Jumper Resistor 12 SON N999LF 13 WCR WCR0603LF General Purpose Thick Film Resistor Description 3 Watt Current Sense Resistor Flat Precision Resistor Array 14 WCR WCR0805LF General Purpose Thick Film Resistor 15 WCR WCR1206LF General Purpose Thick Film Resistor 16 WCR WCR1210LF General Purpose Thick Film Resistor 17 WCR WCR2010LF General Purpose Thick Film Resistor 18 WCR WCR2512LF General Purpose Thick Film Resistor 19 QSC QSCXLF 24 Lead QSOP Network 20 QS0 QS0XLF 20 Lead QSOP Network 21 QS8 QS8XLF 16 Lead QSOP Network 22 SS4 SS4XLF 8 Lead Narrow SOIC Network 23 SS7 QS7XLF 14 Lead Narrow SOIC Networks 24 SS8 SS8XLF 16 Lead Narrow SOIC Network 25 SL0 SL0XLF 20 Lead Wide SOIC Network 26 SL8 SL8XLF 16 Lead Wide SOIC Network 27 SLC SLCXLF 24 Lead Wide SOIC Network 28 PWC PWC0805LF Pulse Withstanding Chip 29 PWC PWC1206LF Pulse Withstanding Chip 30 PWC PWC2010LF Pulse Withstanding Chip 31 PWC PWC2512LF Pulse Withstanding Chip 32 PCF PCF0603LF Precision Nichrome Chip Resistor 33 PCF PCF0805LF Precision Nichrome Chip Resistor 34 PCF PCF1206LF Precision Nichrome Chip Resistor 35 PCF PCF1210LF Precision Nichrome Chip Resistor 36 WCA WCA0804LF Thick Film Resistor Array 37 WCA WCC0804LF Thick Film Resistor Array 38 SOT SOT23LF 3 Lead Resistor Network 39 SOT SOT143LF 4 Lead Resistor Network Rev: April 10, 2006 QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls IRC Lead Free Product Availability & Material Declaration TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (grams) PFC-W0603LF-XX-XXXX-Y 0.0032 Break-up of component and Percent of Total Mass of Material Part Substrate 88.18% Rev Date: 10-Apr-06 Material Classification Ceramic Ceramic / Glass Substance CAS # Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 Total Resistor / Conductor Thin Films 1.97% Organic Coating Epoxy Overcoat Sputtered Film Sputtered Film Sputtered Film Plated Film Total CoatingThermosetting and Marking 3.81% Total White Polymer Marking Ink Tantalum Nitride Titanium Palladium Gold Epoxide Titanium Oxide (TiO2) Molybdenum Cobalt-Zinc Aluminate (CoAlSiO2) Cobalt Electroplating 100.00% Plating Plating Plating Total 88.178% 0.0256% 0.0540% 0.1489% 1.7379% 67942-34-9 13463-67-7 7439-98-7 23.30% 20.00% 23.30% 0.0272 0.0234 0.0272 0.8467% 0.7267% 0.8467% 68186-87-8 7440-48-4 13.40% 20.00% 100.00% 20.00% 3.00% 1.00% 3.00% 1.00% 0.55% 0.55% 0.0157 0.0234 0.1168 0.0011 0.0002 0.0001 0.0002 0.0001 0.0000 0.0000 0.4869% 0.7267% 70.90% 100.00% 0.0041 0.0057 0.1265% 18.96% 15.14% 65.90% 100.00% 0.0368 0.0294 0.1280 0.1943 1.1459% 0.9147% 3.9824% 3.2145 100.0000% 7440-50-8 7440-02-0 7440-31-5 Total Component Weight (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls Weight Percent of Break-up Component 87.7375% 0.1764% 0.2645% 0.0008 0.0017 0.0048 0.0559 0.0632 Triethyl Phosphate 78-40-0 Castor Oil, Hydrogenated 8001-78-3 N-butyl Alcohol 71-36-3 Cyclohexane 85-42-7 Trade secret TS0000-11-6 Tributyl phophate 126-78-3 Formaldehyde 50-00-0 Non Hazardous as defined in OSHA Standard 29 CFR 1910.1200 Copper Nickel Tin Wt % Wt (mg) 99.50% 2.8203 0.20% 0.0057 0.30% 0.0085 100.00% 2.8345 Weight Percent of Total Mass 1.30% 2.75% 7.57% 88.38% 100.00% 7440-32-6 7440-05-3 7440-57-5 Total Termination 6.04% Substance mass 1.966% 3.634% 0.0357% 0.0054% 0.0018% 0.0054% 0.0018% 0.0010% 0.0010% 0.178% 6.043% 100.000% IRC Lead Free Product Availability & Material Declaration TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (grams) PFC-W0805LF-XX-XXXX-Y 0.0065 Break-up of component and Percent of Total Mass of Material Part Substrate 90.39% Rev Date: 10-Apr-06 Material Classification Ceramic Ceramic / Glass Substance CAS # Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 Total Thin Films 1.87% Organic Coating and Marking 2.26% Resistor / Conductor Epoxy Overcoat Sputtered Film Sputtered Film Sputtered Film Plated Film Total CoatingThermosetting Total White Polymer Marking Ink Tantalum Nitride Titanium Palladium Gold Epoxide Titanium Oxide (TiO2) Molybdenum Cobalt-Zinc Aluminate (CoAlSiO2) Cobalt 100.00% Electroplating Plating Plating Plating Total 90.393% 0.0262% 0.0512% 0.1411% 1.6470% 67942-34-9 13463-67-7 7439-98-7 23.30% 20.00% 23.30% 0.0328 0.0281 0.0328 0.5063% 0.4346% 0.5063% 68186-87-8 7440-48-4 13.40% 20.00% 100.00% 20.00% 3.00% 1.00% 3.00% 1.00% 0.55% 0.55% 0.0188 0.0281 0.1406 0.0011 0.0002 0.0001 0.0002 0.0001 0.0000 0.0000 0.2912% 0.4346% 70.90% 100.00% 0.0041 0.0057 0.0628% 18.96% 15.14% 65.90% 100.00% 0.0672 0.0537 0.2337 0.3546 1.0391% 0.8295% 3.6114% 6.4706 100.0000% 7440-50-8 7440-02-0 7440-31-5 Total Component Weight (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls Weight Percent of Break-up Component 89.9410% 0.1808% 0.2712% 0.0017 0.0033 0.0091 0.1066 0.1207 Triethyl Phosphate 78-40-0 Castor Oil, Hydrogenated 8001-78-3 N-butyl Alcohol 71-36-3 Cyclohexane 85-42-7 Trade secret TS0000-11-6 Tributyl phophate 126-78-3 Formaldehyde 50-00-0 Non Hazardous as defined in OSHA Standard 29 CFR 1910.1200 Copper Nickel Tin Wt % Wt (mg) 99.50% 5.8198 0.20% 0.0117 0.30% 0.0175 100.00% 5.8490 Weight Percent of Total Mass 1.41% 2.74% 7.56% 88.29% 100.00% 7440-32-6 7440-05-3 7440-57-5 Total Termination 5.48% Substance mass 1.866% 2.173% 0.0177% 0.0027% 0.0009% 0.0027% 0.0009% 0.0005% 0.0005% 0.089% 5.480% 100.000% IRC Lead Free Product Availability & Material Declaration TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (grams) PFC-W1206LF-XX-XXXX-Y 0.0141 Break-up of component and Percent of Total Mass of Material Part Substrate 93.29% Rev Date: 10-Apr-06 Material Classification Ceramic Ceramic / Glass Substance CAS # Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 Total Thin Films 1.19% Organic Coating and Marking 2.31% Resistor / Conductor Epoxy Overcoat Sputtered Film Sputtered Film Sputtered Film Plated Film Total CoatingThermosetting Total White Polymer Marking Ink Tantalum Nitride Titanium Palladium Gold Epoxide Titanium Oxide (TiO2) Molybdenum Cobalt-Zinc Aluminate (CoAlSiO2) Cobalt 100.00% Electroplating Plating Plating Plating Total 93.291% 0.0238% 0.0325% 0.0896% 1.0460% 67942-34-9 13463-67-7 7439-98-7 23.30% 20.00% 23.30% 0.0733 0.0629 0.0733 0.5190% 0.4455% 0.5190% 68186-87-8 7440-48-4 13.40% 20.00% 100.00% 20.00% 3.00% 1.00% 3.00% 1.00% 0.55% 0.55% 0.0422 0.0629 0.3147 0.0023 0.0003 0.0001 0.0003 0.0001 0.0001 0.0001 0.2985% 0.4455% 70.90% 100.00% 0.0081 0.0115 0.0576% 18.96% 15.14% 65.90% 100.00% 0.0859 0.0686 0.2987 0.4533 0.6083% 0.4856% 2.1141% 14.1292 100.0000% 7440-50-8 7440-02-0 7440-31-5 Total Component Weight (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls Weight Percent of Break-up Component 92.8250% 0.1866% 0.2799% 0.0034 0.0046 0.0127 0.1478 0.1684 Triethyl Phosphate 78-40-0 Castor Oil, Hydrogenated 8001-78-3 N-butyl Alcohol 71-36-3 Cyclohexane 85-42-7 Trade secret TS0000-11-6 Tributyl phophate 126-78-3 Formaldehyde 50-00-0 Non Hazardous as defined in OSHA Standard 29 CFR 1910.1200 Copper Nickel Tin Wt % Wt (mg) 99.50% 13.1154 0.20% 0.0264 0.30% 0.0395 100.00% 13.1813 Weight Percent of Total Mass 2.00% 2.73% 7.52% 87.76% 100.00% 7440-32-6 7440-05-3 7440-57-5 Total Termination 3.21% Substance mass 1.192% 2.228% 0.0162% 0.0024% 0.0008% 0.0024% 0.0008% 0.0004% 0.0004% 0.081% 3.208% 100.000% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LR1206LF-XX-XXXX-Y LRC-LRF1206LF-XX-XXXX-Y Break-up of component Substrate Weight (mg) Rev Date: 11.576 10-Apr-06 wt% 72.56% Material/ wt(mg) Process 8.4 Ceramic Material Classification Ceramic/ Glass 72.562% Thick Film 21.78% 2.521 Conductor 13.044% Copper Alloy Marking 0.583% Termination 5.66% 0.655 Sputter 0.199% Plating 5.46% Substrate+Thick film+Termination 100.00% 11.576 Magnesium oxide Silicon Dioxide Metal Copper Alloy Copper Copper Oxide Resistor 2.331% Epoxy Overcoat (Organic) 5.822% Substance name Aluminum oxide Thermoplastic Lacquer/Paint 1344-28-1 Substance wt % 96.43% Substance wt (mg) 8.100 Substance wt % of total part mass 69.971% 1309-48-4 1.19% 0.100 0.863% 14808-60-7 2.38% 0.200 1.727% 100.00% 8.400 72.562% 97.17% 2.83% 1.467 0.043 12.675% 0.369% 100.00% 1.510 13.044% 42.64% 39.36% 3.60% 9.38% 0.72% 0.72% 3.58% 0.115 0.106 0.010 0.025 0.002 0.002 0.010 0.99% 0.92% 0.08% 0.22% 0.02% 0.02% 0.08% CAS # 7440-50-8 1317-39-1 Copper Nickel Silicon Dioxide Barium Oxide Titanium Dioxide Aluminum Oxide Boric Acid , Anhygrous 7440-50-8 7440-02-0 14808-60-7 7440-39-3 13463-67-7 1344-28-1 10043-35-3 100.00% 0.270 2.331% Epoxy Resin 25068-38-6 37.40% 0.252 2.178% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.119 0.016 0.043 0.243 1.031% 0.140% 0.373% 2.102% 100.00% 0.674 5.822% 35.90% 59.10% 4.90% 0.10% 0.024 0.040 0.003 0.000 0.209% 0.344% 0.029% 0.001% 100.00% 0.067 0.583% 2.521 21.780% 26.09% 73.91% 0.006 0.017 0.052% 0.147% 100.00% 0.023 0.199% 66.03% 11.24% 22.73% 0.417 0.071 0.144 3.605% 0.614% 1.241% 100.00% 0.632 5.459% 0.655 5.658% 11.576 100.00% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Titanium Palladium Copper Nickel Tin 63148-62-9 13463-67-7 68611-44-9 26644-00-8 7440-32-6 7440-05-3 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 11.576 Initial Breakup Component wt % 72.56% 21.78% 5.66% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LR2010LF-XX-XXXX-Y LRC-LRF2010LF-XX-XXXX-Y Break-up of component Substrate Thick Film Weight (mg) Rev Date: 37.640 10-Apr-06 wt% 77.11% 17.64% Material/ wt(mg) Process 29.0 Ceramic 77.114% 6.640 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy Copper 9.661% Copper Oxide Resistor 2.625% Copper Alloy Epoxy Overcoat (Organic) 5.250% Marking 0.105% Termination 5.24% 1.974 Sputter 0.146% Plating 5.10% Substrate+Thick film+Termination 100.00% 37.640 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide Thermoplastic Lacquer/Paint Copper Nickel Silicon Dioxide Barium Oxide Titanium Dioxide Aluminum Oxide Boric Acid , Anhygrous CAS # 1344-28-1 1309-48-4 14808-60-7 7440-50-8 1317-39-1 7440-50-8 7440-02-0 14808-60-7 7440-39-3 13463-67-7 1344-28-1 10043-35-3 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 27.990 0.345 0.691 Substance wt % of total part mass 74.361% 0.918% 1.835% Initial Breakup Component wt % 100.00% 29.026 77.114% 77.11% 97.17% 3.533 9.387% 2.83% 0.103 0.273% 100.00% 3.636 9.661% 42.64% 39.36% 3.60% 9.38% 0.72% 0.72% 3.58% 0.421 0.389 0.036 0.093 0.007 0.007 0.035 1.12% 1.03% 0.09% 0.25% 0.02% 0.02% 0.09% 100.00% 0.988 2.625% Epoxy Resin 25068-38-6 37.40% 0.739 1.964% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.350 0.047 0.126 0.713 0.929% 0.126% 0.336% 1.895% 100.00% 1.976 5.250% 35.90% 59.10% 4.90% 0.10% 0.014 0.023 0.002 0.000 0.038% 0.062% 0.005% 0.000% 100.00% 0.040 0.105% 6.640 17.642% 0.014 0.041 0.038% 0.108% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 26.09% 73.91% 100.00% 0.055 0.146% 66.03% 11.24% 22.73% 1.267 0.216 0.436 3.367% 0.573% 1.159% 100.00% 1.919 5.098% 1.974 5.244% 37.640 100.00% 37.640 17.64% 5.24% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LR2512LF-XX-XXXX-Y LRC-LRF2512LF-XX-XXXX-Y Break-up of component Substrate Thick Film Weight (mg) Rev Date: 54.985 10-Apr-06 wt% 78.19% Material/ wt(mg) Process 43.0 Ceramic 78.190% 17.11% 9.408 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy 8.634% Resistor 2.807% Copper Alloy Termination 4.70% Epoxy Overcoat (Organic) 5.613% Thermoplastic Marking 0.056% Lacquer/Paint 2.584 Sputter 0.158% Plating 4.54% Substrate+Thick film+Termination 100.00% 54.985 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 CAS # Copper 7440-50-8 Copper Oxide 1317-39-1 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 41.458 0.512 1.023 Substance wt % of total part mass 75.399% 0.930% 1.861% Initial Breakup Component wt % 100.00% 42.993 78.190% 78.19% 97.17% 4.613 8.390% 2.83% 0.134 0.244% 100.00% 4.748 8.634% 42.64% 39.36% 3.60% 9.38% 0.72% 0.72% 3.58% 0.658 0.607 0.056 0.145 0.011 0.011 0.055 1.20% 1.10% 0.10% 0.26% 0.02% 0.02% 0.10% Copper Nickel Silicon Dioxide Barium Oxide Titanium Dioxide Aluminum Oxide Boric Acid , Anhygrous 7440-50-8 7440-02-0 14808-60-7 7440-39-3 13463-67-7 1344-28-1 10043-35-3 100.00% 1.543 2.807% Epoxy Resin 25068-38-6 37.40% 1.154 2.099% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.546 0.074 0.198 1.114 0.994% 0.135% 0.359% 2.026% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 100.00% 3.086 5.613% 35.90% 59.10% 4.90% 0.10% 0.011 0.018 0.002 0.000 0.020% 0.033% 0.003% 0.000% 100.00% 0.031 0.056% 9.408 17.110% 0.023 0.064 0.041% 0.117% 26.09% 73.91% 100.00% 0.087 0.158% 66.03% 11.24% 22.73% 1.649 0.281 0.567 2.999% 0.510% 1.032% 100.00% 2.497 4.541% 2.584 4.699% 54.985 100.00% 54.985 17.11% 4.70% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LRF3WLF-XX-XXXX-Y Break-up of component Substrate Thick Film Weight (mg) 56.918 Rev Date: 10-Apr-06 wt% 75.47% Material/ wt(mg) Process 43.0 Ceramic 75.473% 16.53% 9.408 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy 8.341% Resistor 2.711% Copper Alloy Termination 8.00% Epoxy Overcoat (Organic) 5.423% Thermoplastic Marking 0.054% Lacquer/Paint 4.552 Sputter 0.272% Plating 7.73% Substrate+Thick film+Termination 100.00% 56.918 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 CAS # Copper 7440-50-8 Copper Oxide 1317-39-1 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 41.424 0.511 1.022 Substance wt % of total part mass 72.779% 0.898% 1.796% Initial Breakup Component wt % 100.00% 42.958 75.473% 75.47% 97.17% 4.613 8.105% 2.83% 0.134 0.236% 100.00% 4.748 8.341% 42.64% 39.36% 3.60% 9.38% 0.72% 0.72% 3.58% 0.658 0.607 0.056 0.145 0.011 0.011 0.055 1.16% 1.07% 0.10% 0.25% 0.02% 0.02% 0.10% Copper Nickel Silicon Dioxide Barium Oxide Titanium Dioxide Aluminum Oxide Boric Acid , Anhygrous 7440-50-8 7440-02-0 14808-60-7 7440-39-3 13463-67-7 1344-28-1 10043-35-3 100.00% 1.543 2.711% Epoxy Resin 25068-38-6 37.40% 1.154 2.028% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.546 0.074 0.198 1.114 0.960% 0.130% 0.347% 1.958% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 100.00% 3.086 5.423% 35.90% 59.10% 4.90% 0.10% 0.011 0.018 0.002 0.000 0.019% 0.032% 0.003% 0.000% 100.00% 0.031 0.054% 9.408 16.529% 0.040 0.115 0.071% 0.201% 26.09% 73.91% 100.00% 0.155 0.272% 66.03% 11.24% 22.73% 2.903 0.494 0.999 5.101% 0.868% 1.756% 100.00% 4.397 7.725% 4.552 7.997% 56.918 100.00% 56.918 16.53% 8.00% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number SCW-SC3LF-XX-XXXX-Y Break-up of component Substrate Thick Film Weight (mg) 56.918 Rev Date: 10-Apr-06 wt% 75.47% Material/ wt(mg) Process 43.0 Ceramic 75.473% 16.53% 9.408 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy 8.341% Resistor 2.711% Copper Alloy Termination 8.00% Epoxy Overcoat (Organic) 5.423% Thermoplastic Marking 0.054% Lacquer/Paint 4.552 Sputter 0.272% Plating 7.73% Substrate+Thick film+Termination 100.00% 56.918 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 CAS # Copper 7440-50-8 Copper Oxide 1317-39-1 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 41.424 0.511 1.022 Substance wt % of total part mass 72.779% 0.898% 1.796% Initial Breakup Component wt % 100.00% 42.958 75.473% 75.47% 97.17% 4.613 8.105% 2.83% 0.134 0.236% 100.00% 4.748 8.341% 42.64% 39.36% 3.60% 9.38% 0.72% 0.72% 3.58% 0.658 0.607 0.056 0.145 0.011 0.011 0.055 1.16% 1.07% 0.10% 0.25% 0.02% 0.02% 0.10% Copper Nickel Silicon Dioxide Barium Oxide Titanium Dioxide Aluminum Oxide Boric Acid , Anhygrous 7440-50-8 7440-02-0 14808-60-7 7440-39-3 13463-67-7 1344-28-1 10043-35-3 100.00% 1.543 2.711% Epoxy Resin 25068-38-6 37.40% 1.154 2.028% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.546 0.074 0.198 1.114 0.960% 0.130% 0.347% 1.958% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 100.00% 3.086 5.423% 35.90% 59.10% 4.90% 0.10% 0.011 0.018 0.002 0.000 0.019% 0.032% 0.003% 0.000% 100.00% 0.031 0.054% 9.408 16.529% 0.040 0.115 0.071% 0.201% 26.09% 73.91% 100.00% 0.155 0.272% 66.03% 11.24% 22.73% 2.903 0.494 0.999 5.101% 0.868% 1.756% 100.00% 4.397 7.725% 4.552 7.997% 56.918 100.00% 56.918 16.53% 8.00% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LRZ1206LF-R000 Break-up of component Substrate Thick Film Weight (mg) 13.796 wt% 60.89% 34.37% Rev Date: 10-Apr-06 wt(mg) Material/ Process 8.4 Ceramic 60.887% 4.741 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy Copper Copper Oxide 28.991% Termination 4.75% Epoxy Overcoat (Organic) 4.885% Thermoplastic Marking 0.489% Lacquer/Paint 0.655 Sputter 0.167% Plating 4.58% Substrate+Thick film+Termination 100.00% 13.796 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide CAS # 1344-28-1 1309-48-4 14808-60-7 7440-50-8 1317-39-1 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 8.100 0.100 0.200 Substance wt % of total part mass 58.713% 0.725% 1.449% Initial Breakup Component wt % 60.89% 100.00% 8.400 60.887% 97.17% 3.886 28.170% 2.83% 0.113 0.820% 100.00% 4.000 28.991% Epoxy Resin 25068-38-6 37.40% 0.252 1.827% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.119 0.016 0.043 0.243 0.865% 0.117% 0.313% 1.764% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 100.00% 0.674 4.885% 35.90% 59.10% 4.90% 0.10% 0.024 0.040 0.003 0.000 0.176% 0.289% 0.024% 0.000% 100.00% 0.067 0.489% 4.741 34.365% 0.006 0.017 0.043% 0.123% 26.09% 73.91% 100.00% 0.023 0.167% 66.03% 11.24% 22.73% 0.417 0.071 0.144 3.025% 0.515% 1.041% 100.00% 0.632 4.581% 0.655 4.748% 13.796 100.00% 13.796 34.37% 4.75% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LRZ2010LF-R000 Break-up of component Substrate Thick Film Weight (mg) 37.012 Rev Date: 10-Apr-06 wt% 78.42% Material/ wt(mg) Process 29.0 Ceramic 78.424% 16.24% 6.012 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy 10.797% Termination 5.33% Epoxy Overcoat (Organic) 5.340% Thermoplastic Marking 0.107% Lacquer/Paint 1.974 Sputter 0.149% Plating 5.18% Substrate+Thick film+Termination 100.00% 37.012 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide 1344-28-1 1309-48-4 14808-60-7 CAS # Copper 7440-50-8 Copper Oxide 1317-39-1 Substance wt % of total part mass 75.624% 0.933% 1.866% Initial Breakup Component wt % 29.026 78.424% 78.42% 3.883 10.491% Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 27.990 0.345 0.691 100.00% 97.17% 2.83% 0.113 0.306% 100.00% 3.996 10.797% Epoxy Resin 25068-38-6 37.40% 0.739 1.997% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.350 0.047 0.126 0.713 0.945% 0.128% 0.342% 1.928% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate 63148-62-9 13463-67-7 68611-44-9 26644-00-8 Titanium Palladium 7440-32-6 7440-05-3 Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 100.00% 1.976 5.340% 35.90% 59.10% 4.90% 0.10% 0.014 0.023 0.002 0.000 0.038% 0.063% 0.005% 0.000% 100.00% 0.040 0.107% 6.012 16.243% 0.014 0.041 0.039% 0.110% 26.09% 73.91% 100.00% 0.055 0.149% 66.03% 11.24% 22.73% 1.267 0.216 0.436 3.424% 0.583% 1.178% 100.00% 1.919 5.185% 1.974 5.333% 37.012 100.00% 37.012 16.24% 5.33% 100.00% IRC Lead Free Product Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number LRC-LRZ2512LF-R000 Break-up of component Substrate Thick Film Weight (mg) 53.442 wt% 80.45% 14.72% Rev Date: 10-Apr-06 Material/ wt(mg) Process 43.0 Ceramic 80.448% 7.865 Conductor Material Classification Ceramic/ Glass Metal Copper Alloy Copper 8.884% Epoxy Overcoat (Organic) 5.775% Marking 0.058% Termination 4.84% 2.584 Sputter 0.163% Plating 4.67% Substrate+Thick film+Termination 100.00% 53.442 Substance name Aluminum oxide Magnesium oxide Silicon Dioxide Copper Oxide Thermoplastic Lacquer/Paint CAS # 1344-28-1 1309-48-4 14808-60-7 7440-50-8 1317-39-1 Substance wt % 96.43% 1.19% 2.38% Substance wt (mg) 41.458 0.512 1.023 Substance wt % of total part mass 77.576% 0.957% 1.915% Initial Breakup Component wt % 100.00% 42.993 80.448% 80.45% 97.17% 4.613 8.632% 2.83% 0.134 0.251% 100.00% 4.748 8.884% Epoxy Resin 25068-38-6 37.40% 1.154 2.160% Titanium Oxide (TiO2) Silane Diclorodimethly Molybdenum Cobalt-Zinc Aluminate (CoAiSiO2) 13463-67-7 68611-44-9 7439-98-7 68186-87-8 17.70% 2.40% 6.40% 36.10% 0.546 0.074 0.198 1.114 1.022% 0.139% 0.370% 2.085% 100.00% 3.086 5.775% 35.90% 59.10% 4.90% 0.10% 0.011 0.018 0.002 0.000 0.021% 0.034% 0.003% 0.000% 100.00% 0.031 0.058% 7.865 14.717% 26.09% 73.91% 0.023 0.064 0.042% 0.120% 100.00% 0.087 0.163% 66.03% 11.24% 22.73% 1.649 0.281 0.567 3.085% 0.525% 1.062% 100.00% 2.497 4.672% Silicon Resin Titanium Oxide (TiO2) Silane Diclorodimethly Dimethyl acid Pyrophosphate Titanium Palladium Copper Nickel Tin 63148-62-9 13463-67-7 68611-44-9 26644-00-8 7440-32-6 7440-05-3 7440-50-8 7440-02-0 7440-31-5 Total wt (mg) 2.584 4.835% 53.442 100.00% 53.442 14.72% 4.84% 100.00% IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) Rev Date: 135 10-Apr-06 Material Material Classification SON-N999LF-XX-XXXX-Y Break-up of component and Percent of Total Mass of Part Substrate 96.34% Ceramic Ceramic / Glass Substance Aluminum oxide Magnesium oxide Silicon Dioxide CAS # 1344-28-1 1309-48-4 14808-60-7 Total Thin Films 0.42% Organic Coating and Marking 2.22% Resistor / Conductor Sputtered Film Sputtered Film Sputtered Film Plated Film Total Epoxy Overcoat Marking Ink Termination 1.02% 100% Electroplating Tantalum Nitride Titanium Palladium Gold 7440-32-6 7440-05-3 7440-57-5 Coating-Thermosetting Plastic Epoxide 67942-34-9 Titanium Oxide (TiO2) 13463-67-7 Molybdenum 7439-98-7 Cobalt-Zinc Aluminate 68186-87-8 Cobalt 7440-48-4 Total White Polymer Triethyl Phosphate 78-40-0 Castor Oil, Hydrogenated 8001-78-3 N-butyl Alcohol 71-36-3 Cyclohexane 85-42-7 Trade secret TS0000-11-6 Tributyl phophate 126-78-3 Formaldehyde 50-00-0 Non Hazardous as defined in OSHA Standard 29 CFR 1910.1200 Total Plating Plating Plating Total Copper Nickel Tin 7440-50-8 7440-02-0 7440-31-5 Substance mass Weight Percent of Total Mass 95.86% 0.19% 0.29% Wt % 99.5% 0.2% 0.3% 100% Wt (mg) 129.724 0.261 0.391 130.375 1.079% 2.121% 5.844% 91% 100% 0.006 0.012 0.033 0.516 0.567 0.00% 0.01% 0.02% 0.38% 23.300% 20.000% 23.300% 13.400% 20.000% 100% 20.000% 3.000% 1.000% 3.000% 1.000% 0.550% 0.550% 0.687 0.590 0.687 0.395 0.590 2.950 0.011 0.002 0.001 0.002 0.001 0.000 0.000 0.51% 0.44% 0.51% 0.29% 0.44% 70.900% 0.041 0.03% 100% 0.057 7.629% 17.253% 75.118% 100% 0.105 0.238 1.036 1.380 0.08% 0.18% 0.77% 135.330 100% Total Component Weight (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls Weight Percent of Break-up Component 96.34% 0.42% 2.18% 0.01% 0.00% 0.00% 0.00% 0.00% 0.00% 0.00% 0.04% 1.02% 100% IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part Number Weight (mg) WCR0603LF-XXXX-X-X-XX 2.5 10-Apr-06 Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) Base (body) Rev Date: CAS no Substance Mass (mg) Alumina Alumina (Al2O3) 1344-28-1 1.8000 Silver Silver (Ag) 7440-22-4 0.0880 Palladium Palladium (Pd) 7440-05-3 0.0020 Silicon Oxide (SiO2) 14808-60-7 0.0010 Cupric Oxide (Cuo) 1317-38-0 0.0010 1.8000 Printed Electrode 76% Glass Vanadiumu Oxide 1314-62-1 0.0010 Managanese Oxide (Mno2) 1313-13-9 0.0010 Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0030 Zirconium Oxide Zirconium Oxide 1314-23-4 0.0030 Silver Silver (Ag) 7440-22-4 0.0702 Palladium Palladium (Pd) 7440-05-3 0.0250 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0080 0.1000 Lead Oxide (PbO) 1317-36-8 0.0009 Ruthenium Oxide(RuO2) 12036-10-1 0.0050 Lead Ruthenium Oxide Resistive body Lead Oxide (PbO) 1317-36-8 0.0004 Silicon Oxide (SiO2) 14808-60-7 0.0080 5.2% Glass Boron Oxide (B2O3) 1303-86-2 0.0050 Aluminium Oxide (Al2O3) 1344-28-1 0.0030 Others 0.0030 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0006 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0009 Lead Oxide (PbO) 1317-36-8 0.0180 Not Available 0.0080 0.1300 Glass Pre-Coat 2% Others Pigment Overcoat Pigment 0.0240 Epoxy Resin Epoxy Resin 68928-70-1 0.0450 Phenolic Resin Phenolic Resin 9003-35-4 0.0250 Filler Filler 12141-46-7 0.0220 Carbon Black Carbon Black 1333-86-4 0.0080 Epoxy Resin Epoxy Resin 68928-70-1 0.0090 Phenolic Resin Phenolic Resin 9003-35-4 0.0054 Filler Filler 12141-46-7 0.0050 Titanium Dioxide Titanium Dioxide 13463-67-7 0.0006 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0050 Silver Silver (Metallic) 7440-22-4 0.0950 4% 0.1500 Marking .8% 0.0200 Terminations 4% Plated Electrode 4% Nickel Nickel (Ni) 10101-97-0 0.1000 Plated Electrode 4% Solder Solder (Sn) 7440-31-5 0.1000 0.3000 SUM (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 2.5000 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) Rev Date: WCR0805LF-XXXX-X-X-XX 5.2 10-Apr-06 Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) Base (body) Alumina Alumina (Al2O3) CAS no Substance Mass (mg) 1344-28-1 3.7440 3.7440 72.00% Printed Electrode Silver Silver (Ag) 7440-22-4 0.1830 Palladium Palladium (Pd) 7440-05-3 0.0042 Silicon Oxide (SiO2) 14808-60-7 0.0021 Cupric Oxide (Cuo) 1317-38-0 0.0021 Glass Vanadiumu Oxide 1314-62-1 0.0021 Managanese Oxide (Mno2) 1313-13-9 0.0021 Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0062 Zirconium Oxide Zirconium Oxide 1314-23-4 0.0062 Silver Silver (Ag) 7440-22-4 0.1070 Palladium Palladium (Pd) 7440-05-3 0.0946 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0166 0.2080 4.00% Lead Oxide (PbO) 1317-36-8 0.0066 Ruthenium Oxide(RuO2) 12036-10-1 0.0104 Lead Ruthenium Oxide Lead Oxide (PbO) 1317-36-8 0.0110 Silicon Oxide (SiO2) 14808-60-7 0.0166 Resistive body Glass Boron Oxide (B2O3) 1303-86-2 0.0104 Aluminium Oxide (Al2O3) 1344-28-1 0.0062 Others 0.0062 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0012 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0019 Lead Oxide (PbO) 1317-36-8 0.0190 Not Available 0.0166 0.2889 5.56% Glass Pre-Coat Others Pigment Pigment 0.0499 Epoxy Resin Epoxy Resin 68928-70-1 0.0936 Phenolic Resin Phenolic Resin 9003-35-4 0.0520 Filler Filler 12141-46-7 0.0458 Carbon Black Carbon Black 1333-86-4 0.0166 Epoxy Resin Epoxy Resin 68928-70-1 0.0187 Phenolic Resin Phenolic Resin 9003-35-4 0.0112 Overcoat 0.2936 5.65% Marking Filler Filler 12141-46-7 0.0104 Titanium Dioxide Titanium Dioxide 13463-67-7 0.0012 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0104 Silver Silver (Metallic) 7440-22-4 0.1976 Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.2080 Plated Electrode Solder Solder (Sn) 7440-31-5 0.2080 0.0416 0.80% Terminations 0.6240 12.00% 100.00% SUM (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 5.2000 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) WCR1206LF-XXXX-X-X-XX 9.8 Base (body) Rev Date: 10-Apr-06 Alumina Alumina (Al2O3) 1344-28-1 7.0560 Silver Silver (Ag) 7440-22-4 0.3450 Palladium Palladium (Pd) 7440-05-3 0.0078 Silicon Oxide (SiO2) 14808-60-7 0.0039 7.0560 72.00% Printed Electrode Cupric Oxide (Cuo) 1317-38-0 0.0039 Vanadiumu Oxide 1314-62-1 0.0039 Managanese Oxide (Mno2) 1313-13-9 0.0039 Glass Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.0118 Zirconium Oxide Zirconium Oxide 1314-23-4 0.0118 Silver Silver (Ag) 7440-22-4 0.2207 Palladium Palladium (Pd) 7440-05-3 0.1588 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.0314 Lead Oxide (PbO) 1317-36-8 0.0133 Ruthenium Oxide(RuO2) 12036-10-1 0.0196 Lead Oxide (PbO) 1317-36-8 0.0140 Silicon Oxide (SiO2) 14808-60-7 0.0314 Boron Oxide (B2O3) 1303-86-2 0.0196 Aluminium Oxide (Al2O3) 1344-28-1 0.0118 0.3920 4.00% Lead Ruthenium Oxide Resistive body Glass Others 0.0118 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.0024 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.0035 0.5381 5.49% Lead Oxide (PbO) 1317-36-8 0.0420 Not Available 0.0314 68928-70-1 0.1764 0.0980 Glass Pre-Coat Others 0.0941 Pigment Pigment Epoxy Resin Epoxy Resin Phenolic Resin Phenolic Resin 9003-35-4 Filler Filler 12141-46-7 0.0862 Carbon Black Carbon Black 1333-86-4 0.0314 Epoxy Resin Epoxy Resin 68928-70-1 0.0353 Phenolic Resin Phenolic Resin 9003-35-4 0.0212 Filler Filler 12141-46-7 0.0196 Titanium Dioxide Titanium Dioxide 13463-67-7 0.0024 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.0196 Silver Silver (Metallic) 7440-22-4 0.3724 Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.3920 Plated Electrode Solder Solder (Sn) 7440-31-5 0.3920 Overcoat 0.5594 5.71% Marking 0.0784 0.80% Terminations 1.1760 12.00% SUM (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 9.8000 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) Rev Date: WCR1210LF-XXXX-X-X-XX 16.0 10-Apr-06 Breakdown of component Ceramic CAS no Substance Mass (mg) Alumina Material name (e.g. Sn alloy) Alumina (Al2O3) Substance name (e.g. Copper Cu) 1344-28-1 2.1750 Silver Silver (Ag) 7440-22-4 0.4630 Palladium Palladium (Pd) 7440-05-3 0.3770 Silicon Oxide (SiO2) 14808-60-7 0.3760 Cupric Oxide (Cuo) 1317-38-0 0.3760 Vanadiumu Oxide 1314-62-1 0.3760 0.3760 2.1750 13.59% Conductor Glass Managanese Oxide (Mno2) 1313-13-9 Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.3780 Zirconium Oxide Zirconium Oxide 1314-23-4 0.3780 3.1000 19.38% Silver Silver (Ag) 7440-22-4 0.4452 Palladium Palladium (Pd) 7440-05-3 0.4000 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.3830 Lead Oxide (PbO) 1317-36-8 0.3759 Ruthenium Oxide(RuO2) 12036-10-1 0.3800 Lead Oxide (PbO) 1317-36-8 0.3754 Silicon Oxide (SiO2) 14808-60-7 0.3830 Boron Oxide (B2O3) 1303-86-2 0.3800 Aluminium Oxide (Al2O3) 1344-28-1 0.3780 Lead Ruthenium Oxide Resistive body Glass Others 0.3780 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.3756 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.3759 4.6300 28.94% Lead Oxide (PbO) 1317-36-8 0.3930 Not Available 0.3830 Glass Others Pigment Pigment 0.3990 Coating Epoxy Resin Epoxy Resin 68928-70-1 0.4200 Phenolic Resin Phenolic Resin 9003-35-4 0.4000 Filler Filler 12141-46-7 0.3970 Carbon Black Carbon Black 1333-86-4 0.3830 Epoxy Resin Epoxy Resin 68928-70-1 0.3840 Phenolic Resin Phenolic Resin 9003-35-4 0.3804 Filler Filler 12141-46-7 0.3800 Titanium Dioxide Titanium Dioxide 13463-67-7 0.3756 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.3800 Silver Silver (Metallic) 7440-22-4 0.4700 Plated Electrode Nickel Nickel (Ni) 7440-22-4 0.4750 Plated Electrode Solder Solder (Sn) 7440-31-5 0.4750 2.7750 17.34% Marking 1.5200 9.50% Terminations 1.8000 11.25% SUM (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 16.0000 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) WCR2010LF-XXXX-X-X-XX 24.0 10-Apr-06 Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) Ceramic Rev Date: CAS no Substance Mass (mg) Alumina Alumina (Al2O3) 7440-50-8 4.2662 Silver Silver (Ag) 7440-22-4 0.7052 Palladium Palladium (Pd) 7440-05-3 0.5264 Silicon Oxide (SiO2) 14808-60-7 0.5243 4.2662 Conductor Cupric Oxide (Cuo) 1317-38-0 0.5243 Vanadiumu Oxide 1314-62-1 0.5243 Glass Managanese Oxide (Mno2) 1313-13-9 0.5243 Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.5284 Zirconium Oxide Zirconium Oxide 1314-23-4 0.5284 Silver Silver (Ag) 7440-22-4 0.6292 Palladium Palladium (Pd) 7440-05-3 0.6168 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.5388 Lead Oxide (PbO) 1317-36-8 0.5288 Ruthenium Oxide(RuO2) 12036-10-1 0.5326 4.3857 Lead Ruthenium Oxide Lead Oxide (PbO) 1317-36-8 0.5332 Silicon Oxide (SiO2) 14808-60-7 0.5388 Resistive body Glass Boron Oxide (B2O3) 1303-86-2 0.5326 Aluminium Oxide (Al2O3) 1344-28-1 0.5284 Others 0.5282 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.5234 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.5241 Lead Oxide (PbO) 1317-36-8 0.5412 6.5551 Glass Others Pigment Pigment Epoxy Resin Phenolic Resin 0.5721 Not Available 0.5388 Epoxy Resin 68928-70-1 0.6158 Phenolic Resin 9003-35-4 0.5742 Filler Filler 12141-46-7 0.5680 Carbon Black Carbon Black 1333-86-4 0.5388 Epoxy Resin Epoxy Resin 68928-70-1 0.5409 Phenolic Resin Phenolic Resin 9003-35-4 0.5334 Filler Filler 12141-46-7 0.5333 Titanium Dioxide Titanium Dioxide 13463-67-7 0.5234 1.6522 Coating 2.2969 Marking 2.1311 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.5326 Silver Silver (Metallic) 7440-22-4 0.7198 Plated Electrode Nickel Nickel (Ni) 10101-97-0 0.7302 Plated Electrode Solder Solder (Sn) 7440-31-5 0.7302 Terminations 2.7129 SUM (mg) QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 24.0000 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) Rev Date: WCR2512LF-XXXX-X-X-XX 40.0 10-Apr-06 Breakdown of component Material name (e.g. Sn alloy) Substance name (e.g. Copper Cu) Ceramic Alumina Alumina (Al2O3) CAS no Substance Mass (mg) 1344-28-1 7.8949 19.74% Conductor Silver Silver (Ag) 7440-22-4 1.1839 Palladium Palladium (Pd) 7440-05-3 0.8467 Silicon Oxide (SiO2) 14808-60-7 0.8428 Cupric Oxide (Cuo) 1317-38-0 0.8428 Glass Vanadiumu Oxide 1314-62-1 0.8428 Managanese Oxide (Mno2) 1313-13-9 0.8428 Bismuth Oxide Bismuth Oxide (Bi2O3) 1304-76-3 0.8507 Zirconium Oxide Zirconium Oxide 1314-23-4 0.8507 17.76% 7.1032 Silver Silver (Ag) 7440-22-4 1.0596 Palladium Palladium (Pd) 7440-05-3 0.9977 Ruthenium Oxide Ruthenium Oxide(RuO2) 12036-10-1 0.8703 Lead Oxide (PbO) 1317-36-8 0.8522 Ruthenium Oxide(RuO2) 12036-10-1 0.8585 Lead Oxide (PbO) 1317-36-8 0.8529 Silicon Oxide (SiO2) 14808-60-7 0.8703 Boron Oxide (B2O3) 1303-86-2 0.8585 Aluminium Oxide (Al2O3) 1344-28-1 0.8507 Lead Ruthenium Oxide Resistive body Glass Others 0.8507 Cupric Oxide Cupric Oxide (Cuo) 1317-38-0 0.5050 Managanese Oxide Managanese Oxide (Mno2) 1313-13-9 0.8424 Lead Oxide (PbO) 1317-36-8 1.1476 Not Available 1.1370 25.67% 10.2687 Glass Others Pigment Pigment 1.1997 Coating Epoxy Resin Epoxy Resin 68928-70-1 1.0153 Phenolic Resin Phenolic Resin 9003-35-4 0.9369 Filler Filler 12141-46-7 0.9660 Carbon Black Carbon Black 1333-86-4 0.8703 Epoxy Resin Epoxy Resin 68928-70-1 0.8742 Phenolic Resin Phenolic Resin 9003-35-4 0.8601 Filler Filler 12141-46-7 0.8585 Titanium Dioxide Titanium Dioxide 13463-67-7 0.8413 Cobalt Oxide Cobalt Oxide (Co304) 1308-06-1 0.8585 Silver Silver (Metallic) 7440-22-4 1.2113 Plated Electrode Nickel Nickel (Ni) 10101-97-0 1.2309 Plated Electrode Solder Solder (Sn) 7440-31-5 1.2309 SUM (mg) 40.5050 18.18% 7.2726 Marking 8.59% 3.4341 Terminations 11.33% 4.5316 QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-QSCXLF-XX-XXXX-YZ Break-up Component & % of Weight (mg) 137.6470 Process or Material Rev Date: 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 4.06% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 37.01% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.02% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.005589 100.000% 0.005589 7440-50-8 97.500% 0.0496743 36.088182% Iron (Fe) 7439-89-6 2.500% 0.0012737 0.925338% 100.000% 0.050948 Epoxy resin Proprietary 15.000% 0.0000045 0.003269% Silver (Ag) 7440-21-3 80.000% 0.000024 0.017436% Aromatic Amine Proprietary 5.000% 0.0000015 0.001090% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.0655452 Epoxy, Cresol Novolac 29690-82-2 2.500% 0.0019278 1.400539% Phenol Resin Propietary 6.000% 0.00462672 3.361294% Marking Ink 100.00% 47.618328% Epoxy Resin Propietary 6.000% 0.00462672 3.361294% Carbon Black 1333-86-4 0.500% 0.00038556 0.280108% 100.000% 0.077112 Tin (Sn) 7440-31-5 100.000% 2.26% 0.18% 0.439530% 0.000605 56.02% Lead (Terminal) Finish 4.060386% Copper (Cu) 0.44% Encapsulation mass wt(g) 2.261582% 0.003113 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.118056% N/A 35.000% 0.0000875 0.063568% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.137647 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-QS0XLF-XX-XXXX-YZ Break-up Component & % of Weight (mg) 130.6548 Process or Material Rev Date: 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 4.28% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 33.36% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.02% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.005589 100.000% 0.005589 7440-50-8 97.500% 0.042501225 32.529409% Iron (Fe) 7439-89-6 2.500% 0.001089775 0.834087% 100.000% 0.043591 Epoxy resin Proprietary 15.000% 0.0000045 0.003444% Silver (Ag) 7440-21-3 80.000% 0.000024 0.018369% Aromatic Amine Proprietary 5.000% 0.0000015 0.001148% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.066381855 50.807065% Epoxy,Cresol Novolac 29690-82-2 2.500% 0.001952408 1.494325% Phenol Resin Propietary 6.000% 0.004685778 3.586381% Epoxy Resin Propietary 6.000% 0.004685778 3.586381% Carbon Black 1333-86-4 0.500% 0.000390482 0.298865% 100.000% 0.0780963 Tin (Sn) 7440-31-5 100.000% 1.99% Marking Ink 0.19% 100.00% 0.385958% 0.000504273 59.77% Lead (Terminal) Finish 4.277685% Copper (Cu) 0.39% Encapsulation mass wt(g) 1.985538% 0.0025942 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.124374% N/A 35.000% 0.0000875 0.066970% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.130654773 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-QS8XLF-XX-XXXX-YZ (16 QSOP) Break-up Component & % of Weight (mg) 84.0361 Process or Material Rev Date: 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 5.92% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 41.96% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.04% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.004972805 100.000% 0.004972805 7440-50-8 97.500% 0.034381741 40.913072% Iron (Fe) 7439-89-6 2.500% 0.000881583 1.049053% 100.000% 0.035263324 Epoxy resin Proprietary 15.000% 0.0000045 0.005355% Silver (Ag) 7440-21-3 80.000% 0.000024 0.028559% Aromatic Amine Proprietary 5.000% 0.0000015 0.001785% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.034885016 Epoxy,Cresol Novolac 29690-82-2 2.500% 0.00102603 1.220940% Phenol Resin Propietary 6.000% 0.002462472 2.930255% Marking Ink 100.00% 41.511952% Epoxy Resin Propietary 6.000% 0.002462472 2.930255% Carbon Black 1333-86-4 0.500% 0.000205206 0.244188% 100.000% 0.041041195 Tin (Sn) 7440-31-5 100.000% 2.47% 0.30% 0.480055% 0.000403419 48.84% Lead (Terminal) Finish 5.917464% Copper (Cu) 0.48% Encapsulation mass wt(g) 2.469575% 0.002075334 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.193369% N/A 35.000% 0.0000875 0.104122% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.084036077 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-SS4XLF-XX-XXXX-YZ Break-up Component & % of Weight (mg) 77.8355 Process or Material Rev Date: 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Silicon Die 3.87% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 38.66% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.04% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.003012 100.000% 0.003012 7440-50-8 97.500% 0.029342625 37.698255% Iron (Fe) 7439-89-6 2.500% 0.000752375 0.966622% 100.000% 0.030095 Epoxy resin Proprietary 15.000% 0.0000045 0.005781% Silver (Ag) 7440-21-3 80.000% 0.000024 0.030834% Aromatic Amine Proprietary 5.000% 0.0000015 0.001927% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.03664945 47.085777% Epoxy,Cresol Novolac 29690-82-2 2.500% 0.001077925 1.384876% Phenol Resin Propietary 6.000% 0.00258702 3.323702% Epoxy Resin Propietary 6.000% 0.00258702 3.323702% Carbon Black 1333-86-4 0.500% 0.000215585 0.276975% 100.000% 0.043117 Tin (Sn) 7440-31-5 100.000% 1.45% Marking Ink 0.32% 100.00% 0.259136% 0.0002017 55.40% Lead (Terminal) Finish 3.869700% Copper (Cu) 0.26% Encapsulation mass wt(g) 1.451523% 0.0011298 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.208774% N/A 35.000% 0.0000875 0.112417% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.0778355 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-SS7XLF-XX-XXXX-YZ Break-up Component & % of Weight (mg) 138.5532 Process or Material Rev. Date 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 3.87% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 39.21% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.02% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.0068603 100.000% 0.0068603 7440-50-8 97.500% 0.052966292 38.228123% Iron (Fe) 7439-89-6 2.500% 0.001358111 0.966622% 100.000% 0.0543244 Epoxy resin Proprietary 15.000% 0.0000045 0.003248% Silver (Ag) 7440-21-3 80.000% 0.000024 0.017322% Aromatic Amine Proprietary 5.000% 0.0000015 0.001083% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.063544591 45.862951% Epoxy,Cresol Novolac 29690-82-2 2.500% 0.001868959 1.348910% Phenol Resin Propietary 6.000% 0.004485501 3.237385% Epoxy Resin Propietary 6.000% 0.004485501 3.237385% Carbon Black 1333-86-4 0.500% 0.000373792 0.269782% 100.000% 0.074758342 Tin (Sn) 7440-31-5 100.000% 1.43% Marking Ink 0.18% 100.00% 0.254769% 0.000352991 53.96% Lead (Terminal) Finish 4.951383% Copper (Cu) 0.25% Encapsulation mass wt(g) 1.427016% 0.001977176 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.117283% N/A 35.000% 0.0000875 0.063153% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.138553211 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-SS8XLF-XX-XXXX-YZ Break-up Component & % of Weight (mg) 158.2001 Process or Material Rev. Date 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 4.34% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 38.97% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.02% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.0068603 100.000% 0.0068603 7440-50-8 97.500% 0.060105143 37.993108% Iron (Fe) 7439-89-6 2.500% 0.001541158 0.974182% 100.000% 0.0616463 Epoxy resin Proprietary 15.000% 0.0000045 0.002844% Silver (Ag) 7440-21-3 80.000% 0.000024 0.015171% Aromatic Amine Proprietary 5.000% 0.0000015 0.000948% 100.000% 0.00003 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G600 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.073737925 46.610537% Epoxy,Cresol Novolac 29690-82-2 2.500% 0.002168763 1.370898% Phenol Resin Propietary 6.000% 0.00520503 3.290156% Epoxy Resin Propietary 6.000% 0.00520503 3.290156% Carbon Black 1333-86-4 0.500% 0.000433753 0.274180% 100.000% 0.0867505 Tin (Sn) 7440-31-5 100.000% 1.43% Marking Ink 0.16% 100.00% 0.255006% 0.00040342 54.84% Lead (Terminal) Finish 4.336470% Copper (Cu) 0.26% Encapsulation mass wt(g) 1.428318% 0.0022596 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. t i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.102718% N/A 35.000% 0.0000875 0.055310% 0.00025 100.000000% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.15820012 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-SL8XLF-XX-XXXX-YZ (0.300" SOIC, 16 lead) Break-up Component & % of Weight (mg) 504.1594 Process or Material Rev. Date 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 3.82% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 28.43% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.01% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.019262098 100.000% 0.019262098 7440-50-8 97.500% 0.139772963 27.723965% Iron (Fe) 7439-89-6 2.500% 0.003583922 0.710871% 100.000% 0.143356885 Epoxy resin Proprietary 15.000% 7.72223E-06 0.001279% Silver (Ag) 7440-21-3 80.000% 4.11852E-05 0.006820% Aromatic Amine Proprietary 5.000% 2.57408E-06 0.000426% 100.000% 5.14815E-05 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G700 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.365994012 60.604044% Epoxy Resin Propietary 7.000% 0.030140683 4.990921% Phenol Resin Propietary 3.500% 0.015070342 2.495461% Brominated Epoxy Resin 40039-93-8 0.550% 0.002368197 0.392144% Carbon Black 1333-86-4 0.300% 0.001291744 0.213897% Antimony trioxide 1309-64-4 0.500% 0.002152906 0.356494% 96.850% 0.43058119 Tin (Sn) 7440-31-5 100.000% 0.95% Marking Ink 0.05% 100.00% 0.083501% 0.000504273 66.66% Lead (Terminal) Finish 3.820637% Copper (Cu) 0.08% Encapsulation mass wt(g) 0.945665% 0.004767658 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.032232% N/A 35.000% 0.0000875 0.017356% 0.00025 97.900240% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.504159356 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number (GUS-SL007, 0.300" SOIC, 20 lead) Break-up Component & % of Weight (mg) 603.9102 Process or Material Rev. Date 10-Apr-06 Material Classification Substance CAS Number Substance Mass wt% Chip 3.40% Leadframe Silicon Die Copper-Iron Alloy CD194 Ceramic/Glass Copper Alloy 24.19% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.01% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.020503008 100.000% 0.020503008 7440-50-8 97.500% 0.142409167 23.581182% Iron (Fe) 7439-89-6 2.500% 0.003651517 0.604646% 100.000% 0.146060684 Epoxy resin Proprietary 15.000% 7.72223E-06 0.001279% Silver (Ag) 7440-21-3 80.000% 4.11852E-05 0.006820% Aromatic Amine Proprietary 5.000% 2.57408E-06 0.000426% 100.000% 5.14815E-05 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G700 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.365994012 60.604044% Epoxy Resin Propietary 7.000% 0.030140683 4.990921% Phenol Resin Propietary 3.500% 0.015070342 2.495461% Brominated Epoxy Resin 40039-93-8 0.550% 0.002368197 0.392144% Carbon Black 1333-86-4 0.300% 0.001291744 0.213897% Antimony trioxide 1309-64-4 0.500% 0.002152906 0.356494% 96.850% 0.43058119 Tin (Sn) 7440-31-5 100.000% 0.99% Marking Ink 0.04% 100.00% 0.083501% 0.000504273 71.30% Lead (Terminal) Finish 3.395042% Copper (Cu) 0.08% Encapsulation mass wt(g) 0.986831% 0.005959573 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.026908% N/A 35.000% 0.0000875 0.014489% 0.00025 97.754085% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.60391021 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number GUS-SLCXLF-XX-XXXX-YZ (0.300" SOIC, 24 lead) Break-up Component & % of Chip 1.53% Leadframe Weight (mg) 727.9627 Process or Material Silicon Die Copper-Iron Alloy CD194 Rev. Date 10-Apr-06 Material Classification Ceramic/Glass Copper Alloy 24.61% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.01% Bonding Wire Gold Wire Metal Low Unalloyed Substance Silicon (Si) + inorganic components CAS Number Substance Mass 7440-21-3 wt(g) 100.000% 0.01110798 100.000% 0.01110798 7440-50-8 97.500% 0.174675735 23.995149% Iron (Fe) 7439-89-6 2.500% 0.004478865 0.615260% 100.000% 0.1791546 Epoxy resin Proprietary 15.000% 7.72223E-06 0.001061% Silver (Ag) 7440-21-3 80.000% 4.11852E-05 0.005658% Aromatic Amine Proprietary 5.000% 2.57408E-06 0.000354% 100.000% 5.14815E-05 Gold (Au) 7440-57-5 100.000% Epoxy Resin, G700 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 85.000% 0.450195731 61.843240% Epoxy Resin Propietary 7.000% 0.037074943 5.092973% Phenol Resin Propietary 3.500% 0.018537471 2.546486% Brominated Epoxy Resin 40039-93-8 0.550% 0.002913031 0.400162% Carbon Black 1333-86-4 0.300% 0.001588926 0.218270% Antimony trioxide 1309-64-4 0.500% 0.00264821 0.363784% 96.850% 0.529642036 Tin (Sn) 7440-31-5 100.000% 0.98% Marking Ink 0.03% 100.00% 0.083126% 0.000605128 72.76% Lead (Terminal) Finish 1.525900% Copper (Cu) 0.08% Encapsulation mass wt% 0.982398% 0.007151488 Teca-Print AG ink Screen Printing Ink (cured). MDS Pigment portion, not to declare. i l ID 9448512 Organic Ingredient, not to declare. N/A 65.000% 0.0001625 0.022323% N/A 35.000% 0.0000875 0.012020% 0.00025 97.708162% Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.727962714 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PWC0805LF Rev. Date Component Name Substrate Alumina Printed Terminations Silver alloy in glass Material Resistive Element Metals/metal oxides in Lead glass Pb free terminations Weight Constituent CAS Number (mg) 3.10 Aluminium oxide 1344-28-1 Other oxides 0.25 0.25 Silver 7440-22-4 Palladium Metal oxides 7440-05-3 Silver 7440-22-4 0.01 0.03 88% 2% 10% 35% Palladium Lead in glass Ruthenium oxide Silicon dioxide Other oxides 7440-05-3 65997-18-4 12036-10-1 7631-86-9 0.04 0.04 0.03 0.02 0.03 15% 17% 13% 8% 12% 65997-18-4 0.09 0.05 0.02 60% 30% 10% Lead glass 0.15 Lead in glass Other oxides Pigments Outer Protection and Marking Epoxy resin 0.15 Epoxy resin Inner Terminations Silver in resin 0.07 Phenolic resin Fillers Pigments 0.20 0.04 0.03 0.01 Silver 7440-22-4 Epoxy resin Cobalt oxide 1307-96-6 Nickel 0.20 Nickel 7440-02-0 Tin 0.20 Tin 7440-31-5 4.50 mg Product Weight: 0.22 Composition (% by weight) 96% 4% 0.09 Inner Protection Outer Terminations 10-Apr-06 Weight (mg) 2.98 0.12 0.19 0.01 0.00 0.20 0.20 45% 25% 23% 7% 95% 3% 2% 100% 100% April 2005 IR IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PWC1206LF Rev. Date Component Name Substrate Alumina Printed Terminations Silver alloy in glass Material Resistive Element Metals/metal oxides in Lead glass Pb free terminations Weight Constituent CAS Number (mg) 7.49 Aluminium oxide 1344-28-1 Other oxides 0.38 0.32 Silver 7440-22-4 Palladium Metal oxides 7440-05-3 Silver 7440-22-4 0.01 0.04 88% 2% 10% 35% Palladium Lead in glass Ruthenium oxide Silicon dioxide Other oxides 7440-05-3 65997-18-4 12036-10-1 7631-86-9 0.05 0.05 0.04 0.03 0.04 15% 17% 13% 8% 12% 65997-18-4 0.19 0.10 0.03 60% 30% 10% 0.12 0.07 0.06 0.02 45% 25% 23% 7% Lead glass 0.32 Lead in glass Other oxides Pigments Outer Protection Epoxy resin 0.27 Epoxy resin Phenolic resin Fillers Pigments Inner Terminations Silver in resin 0.44 Silver 7440-22-4 Epoxy resin Cobalt oxide 1307-96-6 Nickel 0.28 Nickel 7440-02-0 Tin plating 0.28 Tin 7440-31-5 9.8 mg Product Weight: 0.33 Composition (% by weight) 96% 4% 0.11 Inner Protection Outer Terminations 10-Apr-06 Weight (mg) 7.19 0.30 0.42 0.01 0.01 0.28 0.28 95% 3% 2% 100% 100% IR August 2004 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PWC2010LF Rev. Date Component Name Substrate Alumina Printed Terminations Silver alloy in glass Material Resistive Element Metals/metal oxides in Lead glass Pb free terminations Weight Constituent CAS Number (mg) 20.37 Aluminium oxide 1344-28-1 Other oxides 0.67 0.64 Silver 7440-22-4 Palladium Metal oxides 7440-05-3 Silver 7440-22-4 0.01 0.07 88% 2% 10% 35% Palladium Lead in glass Ruthenium oxide Silicon dioxide Other oxides 7440-05-3 65997-18-4 12036-10-1 7631-86-9 0.10 0.11 0.08 0.05 0.08 15% 17% 13% 8% 12% 65997-18-4 0.48 0.24 0.08 60% 30% 10% 0.30 0.17 0.15 0.05 45% 25% 23% 7% Lead glass 0.80 Lead in glass Other oxides Pigments Outer Protection Epoxy resin 0.67 Epoxy resin Phenolic resin Fillers Pigments Inner Terminations Silver in resin 0.80 Silver 7440-22-4 Epoxy resin Cobalt oxide 1307-96-6 Nickel 0.50 Nickel 7440-02-0 Tin plating 0.50 Tin 7440-31-5 25.0 mg Product Weight: 0.59 Composition (% by weight) 96% 4% 0.22 Inner Protection Outer Terminations 10-Apr-06 Weight (mg) 19.56 0.81 0.76 0.02 0.02 0.50 0.50 95% 3% 2% 100% 100% IR August 2004 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PWC2512LF Rev. Date Component Name Substrate Alumina Printed Terminations Silver alloy in glass Material Resistive Element Metals/metal oxides in Lead glass Pb free terminations Weight Constituent CAS Number (mg) 34.80 Aluminium oxide 1344-28-1 Other oxides 0.80 0.80 Silver 7440-22-4 Palladium Metal oxides 7440-05-3 Silver 7440-22-4 0.02 0.08 88% 2% 10% 35% Palladium Lead in glass Ruthenium oxide Silicon dioxide Other oxides 7440-05-3 65997-18-4 12036-10-1 7631-86-9 0.12 0.14 0.10 0.06 0.10 15% 17% 13% 8% 12% 65997-18-4 0.72 0.36 0.12 60% 30% 10% 0.45 0.25 0.23 0.07 45% 25% 23% 7% Lead glass 1.20 Lead in glass Other oxides Pigments Outer Protection Epoxy resin 1.00 Epoxy resin Phenolic resin Fillers Pigments Inner Terminations Silver in resin 1.20 Silver 7440-22-4 Epoxy resin Cobalt oxide 1307-96-6 Nickel 0.60 Nickel 7440-02-0 Tin plating 0.60 Tin 7440-31-5 41.0 mg Product Weight: 0.70 Composition (% by weight) 96% 4% 0.28 Inner Protection Outer Terminations 10-Apr-06 Weight (mg) 33.41 1.39 1.14 0.04 0.02 0.60 0.60 95% 3% 2% 100% 100% IR August 2004 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PCF0603LF Rev. Date 10-Apr-06 Component Name Substrate Resistive element Inner electrode Protection coat (1) Protection coat (2) Material Alumina Nichrome alloy Copper alloy Epoxy Resin Epoxy Resin Weight (mg) 1.892 0.0003 0.065 0.015 0.015 Weight (mg) Weight (%) Aluminum oxide Substance Name 1344-28-1 CAS number 1.7974 95.0% Silicon Dioxide 14808-60-7 0.0568 3.0% Magnesium oxide 1309-48-4 0.0378 2.0% Nickel 7440-02-0 0.0002 80.0% Chrome 7440-47-3 0.0001 20.0% Copper 7440-50-8 0.0026 4.0% Nickel 7440-02-0 0.0624 96.0% Epoxy Resin 29690-82-2 0.0041 27.5% Polyimide 25036-53-7 0.0021 14.0% Packed agent 14807-96-6 0.0024 16.0% Packed agent 14808-60-7 0.0024 16.0% Iron oxide 1309-38-2 0.0005 3.0% Silica 7631-86-6 0.0005 3.0% Antifoaming agent 63148-62-9 0.0001 0.5% Ethel diglycol 124-17-4 0.0030 20.0% Epoxy Resin 29690-82-2 108-95-2 0.0045 30.0% Phenol 0.0002 1.3% Carbon black 1333-86-4 0.0005 3.0% Pigment 0.0005 3.0% Silicon dioxide 0.0023 15.0% 0.0002 1.0% 60676-86-0 Pigment Antimony trioxide 1309-64-4 Addition agent Marking Epoxy Resin 0.007 112-34-5 0.0038 25.0% 64742-94-5 0.0012 8.2% Epoxy Resin 29690-82-2 0.0026 37.5% Titanium oxide 13463-67-7 0.0025 35.0% 0.0011 15.0% 0.0005 7.5% 0.0004 5.0% 0.0510 100.0% 7440-21-3 Addition agent Product Weight: 0.051 2.0 10.0% Solvent naphtha Silica Tin Plating 3.5% 0.0015 Diglycol monobutyl ethel Pigment Outer electrode 0.0005 Tin 7440-31-5 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PCF0805LF Rev. Date 10-Apr-06 Component Name Substrate Resistive element Inner electrode Protection coat (1) Protection coat (2) Material Alumina Nichrome alloy Copper alloy Epoxy Resin Epoxy Resin Weight (mg) 3.61 0.0007 0.119 0.028 0.028 Substance Name CAS number 1344-28-1 Silicon Dioxide 14808-60-7 0.1083 3.0% Magnesium oxide 1309-48-4 0.0722 2.0% Nickel 7440-02-0 0.0006 80.0% Chrome 7440-47-3 0.0001 20.0% Copper 7440-50-8 0.0048 4.0% Nickel 7440-02-0 0.1142 96.0% Epoxy Resin 29690-82-2 0.0077 27.5% Polyimide 25036-53-7 0.0039 14.0% Packed agent 14807-96-6 0.0045 16.0% Packed agent 14808-60-7 0.0045 16.0% Iron oxide 1309-38-2 0.0008 3.0% Silica 7631-86-6 0.0008 3.0% Antifoaming agent 63148-62-9 0.0001 0.5% Ethel diglycol 124-17-4 0.0056 20.0% Epoxy Resin 29690-82-2 108-95-2 0.0084 30.0% 0.0004 1.3% 1333-86-4 0.0008 3.0% Carbon black Silicon dioxide 60676-86-0 Pigment Antimony trioxide 1309-64-4 Addition agent 0.015 Tin Plating Product Weight: 0.094 3.9 0.0008 3.0% 0.0042 15.0% 0.0003 1.0% 0.0010 3.5% 0.0028 10.0% Diglycol monobutyl ethel 112-34-5 0.0070 25.0% Solvent naphtha 64742-94-5 0.0023 8.2% Epoxy Resin 29690-82-2 0.0056 37.5% Titanium oxide 13463-67-7 0.0053 35.0% Pigment 0.0023 15.0% Silica 0.0011 7.5% 0.0008 5.0% 0.0940 100.0% 7440-21-3 Addition agent Outer electrode 95.0% Aluminum oxide Pigment Epoxy Resin Weight (%) 3.4295 Phenol Marking Weight (mg) Tin 7440-31-5 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PCF1206LF Rev. Date 10-Apr-06 Component Name Substrate Resistive element Inner electrode Protection coat (1) Protection coat (2) Material Alumina Nichrome alloy Copper alloy Epoxy Resin Epoxy Resin Weight (mg) 6.93 0.0003 0.22 0.1 0.1 Weight (mg) Weight (%) Aluminum oxide Substance Name 1344-28-1 CAS number 6.5835 95.0% Silicon Dioxide 14808-60-7 0.2079 3.0% Magnesium oxide 1309-48-4 0.1386 2.0% Nickel 7440-02-0 0.0002 80.0% Chrome 7440-47-3 0.0001 20.0% Copper 7440-50-8 0.0088 4.0% Nickel 7440-02-0 0.2112 96.0% Epoxy Resin 29690-82-2 0.0275 27.5% Polyimide 25036-53-7 0.0140 14.0% Packed agent 14807-96-6 0.0160 16.0% Packed agent 14808-60-7 0.0160 16.0% Iron oxide 1309-38-2 0.0030 3.0% Silica 7631-86-6 0.0030 3.0% Antifoaming agent 63148-62-9 0.0005 0.5% Ethel diglycol 124-17-4 0.0200 20.0% Epoxy Resin 29690-82-2 108-95-2 0.0300 30.0% Phenol 0.0013 1.3% Carbon black 1333-86-4 0.0030 3.0% Pigment 0.0030 3.0% Silicon dioxide 0.0150 15.0% 0.0010 1.0% 60676-86-0 Pigment Antimony trioxide 1309-64-4 Addition agent Marking Epoxy Resin 0.0015 112-34-5 0.0250 25.0% 64742-94-5 0.0082 8.2% Epoxy Resin 29690-82-2 0.0006 37.5% Titanium oxide 13463-67-7 0.0005 35.0% 0.0002 15.0% 0.0001 7.5% 0.0001 5.0% 0.1100 100.0% 7440-21-3 Addition agent 0.11 Product Weight: 7.5 10.0% Solvent naphtha Silica Tin Plating 3.5% 0.0100 Diglycol monobutyl ethel Pigment Outer electrode 0.0035 Tin 7440-31-5 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration PCF1210LF Rev. Date 10-Apr-06 Component Name Substrate Resistive element Inner electrode Protection coat (1) Protection coat (2) Material Alumina Nichrome alloy Copper alloy Epoxy Resin Epoxy Resin Weight (mg) 11.81 0.0005 0.36 0.2 0.2 Weight (mg) Weight (%) Aluminum oxide Substance Name 1344-28-1 CAS number 11.2195 95.0% Silicon Dioxide 14808-60-7 0.3543 3.0% Magnesium oxide 1309-48-4 0.2362 2.0% Nickel 7440-02-0 0.0004 80.0% Chrome 7440-47-3 0.0001 20.0% Copper 7440-50-8 0.0144 4.0% Nickel 7440-02-0 0.3456 96.0% Epoxy Resin 29690-82-2 0.0550 27.5% Polyimide 25036-53-7 0.0280 14.0% Packed agent 14807-96-6 0.0320 16.0% Packed agent 14808-60-7 0.0320 16.0% Iron oxide 1309-38-2 0.0060 3.0% Silica 7631-86-6 0.0060 3.0% Antifoaming agent 63148-62-9 0.0010 0.5% Ethel diglycol 124-17-4 0.0400 20.0% Epoxy Resin 29690-82-2 108-95-2 0.0600 30.0% Phenol 0.0026 1.3% Carbon black 1333-86-4 0.0060 3.0% Pigment 0.0060 3.0% Silicon dioxide 0.0300 15.0% 0.0020 1.0% 60676-86-0 Pigment Antimony trioxide 1309-64-4 Addition agent Marking Epoxy Resin 0.025 112-34-5 0.0500 25.0% 64742-94-5 0.0164 8.2% Epoxy Resin 29690-82-2 0.0094 37.5% Titanium oxide 13463-67-7 0.0088 35.0% 0.0038 15.0% 0.0019 7.5% 0.0013 5.0% 0.1900 100.0% 7440-21-3 Addition agent Product Weight: 0.19 12.8 10.0% Solvent naphtha Silica Tin Plating 3.5% 0.0200 Diglycol monobutyl ethel Pigment Outer electrode 0.0070 Tin 7440-31-5 IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration WCA0804LF Rev. Date 10-Apr-06 Component name wt (mg) Material Substance name CAS number Substance wt Substance wt % (mg) 96.45 5.870 1.11 0.068 2.09 0.127 0.35 0.021 Alumina substrate 88.20% 6.086 Alumina Aluminum Oxide Magnesium Oxide Silicon Dioxide Calcium Oxide 1344-28-1 1309-48-4 14808-60-7 1305-78-8 Thick film circuit 7.32% 0.505 Thick film Boron Trioxide Bismuth Oxide Chromic Oxide Antimony Trioxide Manganese Dioxide Zinc Oxide Vanadium Pentoxide Lead Monoxide Copper Oxide Aluminum Oxide Ruthenium Oxide Silicon Dioxide Palladium Silver Others 1303-86-2 1304-76-3 1308-38-9 1309-64-4 1313-13-9 1314-13-2 1314-62-1 1317-36-8 1317-38-0 1344-28-1 12036-10-1 14808-60-7 7440-05-3 7440-22-4 10.56 0.80 0.79 0.06 1.01 0.47 0.16 30.52 1.28 3.14 1.85 10.72 1.64 36.75 0.25 0.053 0.004 0.004 0.0003 0.005 0.002 0.001 0.154 0.006 0.016 0.009 0.054 0.008 0.186 0.001 Electrode plating 4.48% 0.309 Plating Nickel Tin 7440-02-0 7440-31-5 55.00 45.00 0.170 0.139 Product weight: 6.9 mg IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Material Declaration WCC0804LF Rev. Date 10-Apr-06 Component name wt (mg) Material Substance name CAS number Substance wt Substance wt % (mg) 96.45 8.658 1.11 0.100 2.09 0.188 0.35 0.031 Alumina substrate 90.68% 8.977 Alumina Aluminum Oxide Magnesium Oxide Silicon Dioxide Calcium Oxide 1344-28-1 1309-48-4 14808-60-7 1305-78-8 Thick film circuit 6.22% 0.616 Thick film Boron Trioxide Bismuth Oxide Chromic Oxide Antimony Trioxide Manganese Dioxide Zinc Oxide Vanadium Pentoxide Lead Monoxide Copper Oxide Aluminum Oxide Ruthenium Oxide Silicon Dioxide Palladium Silver Others 1303-86-2 1304-76-3 1308-38-9 1309-64-4 1313-13-9 1314-13-2 1314-62-1 1317-36-8 1317-38-0 1344-28-1 12036-10-1 14808-60-7 7440-05-3 7440-22-4 10.46 1.43 0.89 0.07 1.24 0.62 0.29 29.83 1.24 2.84 1.99 10.74 1.80 36.08 0.48 0.064 0.009 0.005 0.0004 0.008 0.004 0.002 0.184 0.008 0.017 0.012 0.066 0.011 0.222 0.003 Electrode plating 3.10% 0.307 Plating Nickel Tin 7440-02-0 7440-31-5 55.00 45.00 0.169 0.138 Product weight: 9.9 mg IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number Weight (mg) SOT-SOT23-XX-XXXX-XXXX-YZ Break-up Component & % of Rev. Date 9.2566 10-Apr-06 Process or Material Material Classification Substance CAS Number Substance Mass wt% Chip 3.63% Leadframe Ceramic/Glass Silicon Die Copper-Iron Alloy CD194 Copper Alloy 34.90% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.14% Bonding Wire Gold Wire Metal Low Unalloyed Silicon (Si) + inorganic components 7440-21-3 100.000% 0.000335828 100.000% 0.000335828 7440-50-8 97.500% 0.003150082 34.030483% Iron (Fe) 7439-89-6 2.500% 8.07713E-05 0.872576% 100.000% 0.003230853 Epoxy resin Proprietary 15.000% 1.93056E-06 0.020856% Silver (Ag) 7440-21-3 80.000% 1.02963E-05 0.111232% Aromatic Amine Proprietary 5.000% 6.4352E-07 0.006952% 100.000% 1.28704E-05 Gold (Au) 7440-57-5 100.000% Epoxy Resin, CEL9220 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 84.500% 0.004580513 49.483505% Epoxy Resin Propietary 3.500% 0.000189725 2.049613% Phenol Resin Propietary 3.500% 0.000189725 2.049613% Epoxy Resin Propietary 2.000% 0.000108415 1.171207% Carbon Black 1333-86-4 0.200% 1.08415E-05 0.117121% Metal Hydroxide Propietary 5.800% 0.000314402 3.396501% Others Propietary 0.500% 2.71036E-05 0.292802% 100.000% 0.005420726 100.000% 0.000226531 Tin (Sn) 7440-31-5 2.45% 100.00% 0.322349% 2.98387E-05 58.56% Lead (Terminal) Finish 3.627966% Copper (Cu) 0.32% Encapsulation mass wt(g) 0.000226531 Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.009256647 2.447225% IRC Lead Free Product Availability & Material Declaration Sheets TT Electronics IRC- Advance Film Division Corpus Christi, Texas Part number SOT-SOT143-XXXX-XX Break-up Component & % of Chip 3.24% Leadframe Weight (mg) Date 11.9394 10-Apr-06 Process or Material Material Classification Ceramic/Glass Silicon Die Copper-Iron Alloy CD194 Copper Alloy 38.68% Die attach conductive epoxy Abelbond 84-1LMSISR4 Adhesive/sealants 0.11% Bonding Wire Gold Wire Metal Low Unalloyed Substance Silicon (Si) + inorganic components CAS Number 7440-21-3 Substance Mass wt(g) 100.000% 0.00038661 100.000% 0.00038661 7440-50-8 97.500% 0.004502724 37.713191% Iron (Fe) 7439-89-6 2.500% 0.000115454 0.967005% 100.000% 0.004618178 Epoxy resin Proprietary 15.000% 1.93056E-06 0.016170% Silver (Ag) 7440-21-3 80.000% 1.02963E-05 0.086238% Aromatic Amine Proprietary 5.000% 6.4352E-07 0.005390% 100.000% 1.28704E-05 Gold (Au) 7440-57-5 100.000% Epoxy Resin, CEL9220 Coating/Laquer Tin Plating Coating/Plating Fused Silica 60676-86-0 84.500% 0.005502982 46.090997% Epoxy Resin Propietary 3.500% 0.000227934 1.909095% Phenol Resin Propietary 3.500% 0.000227934 1.909095% Epoxy Resin Propietary 2.000% 0.000130248 1.090911% Carbon Black 1333-86-4 0.200% 1.30248E-05 0.109091% Metal Hydroxide Propietary 5.800% 0.000377719 3.163642% Others Propietary 0.500% 3.2562E-05 0.272728% 100.000% 0.006512405 100.000% 0.000369538 Tin (Sn) 7440-31-5 3.10% 100.00% 0.333224% 3.97849E-05 54.55% Lead (Terminal) Finish 3.238106% Copper (Cu) 0.33% Encapsulation mass wt% 0.000369538 Total Component wt (g): QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls 0.011939386 3.095117%