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DS-LBA710-R03 1
LBA710
Dual Single-Pole OptoMOS® Relay
Normally Open & Normally Closed
Part # Description
LBA710 8-Pin DIP (50/Tube)
LBA710S 8-Pin Surface Mount (50/Tube)
LBA710STR 8-Pin Surface Mount (1000/Reel)
Parameter Rating Units
Blocking Voltage 60 V
Load Current 1 Arms / ADC
On-Resistance (max) 0.6
LED Current to Operate 2 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
LBA710 is a 60V, 1A, 0.6 dual Solid State Relay
integrating independent single-pole normally open
(1-Form-A) and single-pole normally closed
(1-Form-B) relays into a single package. It features
a superior combination of low on-resistance and 1A
load current handling capability.
• Security
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment-Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
• Low On-Resistance (0.6)
• Low Control Current (2mA)
• 3750Vrms Input/Output Isolation
• 100% Solid State
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Surface Mount Version
• Small 8-Pin Package
• Tape & Reel available
• Flammability Rating UL 94 V-0
1
2
3
4
8
7
6
5
+ Control
– Control
+ Control
– Control
Normally Closed
Form-B
Normally Open
Form-A
Switching Characteristics
of Normally Open Devices
Switching Characteristics
of Normally Closed Devices
Form-B
IF
10% 90%
ILOAD
toff ton
Form-A
IF
ILOAD
10%
90%
ton toff
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LBA710
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics: Form-A (Normally Open)
Load Current
Continuous IF=2mA IL--1
Arms / ADC
Peak IF=2mA, t < 10ms ILPK --±5 A
P
On-Resistance IF=2mA, IL=1A RON - 0.21 0.6
Switching Speeds
Turn-On Output (Activate) IF=5mA, VL=10V ton - 0.7 5 ms
Turn-Off Output (Deactivate) toff - 0.09 5
Off-State Leakage Current IF=0mA, VL=60V ILEAK --1 A
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -44- pF
Output Characteristics: Form-B (Normally Closed)
Load Current
Continuous IF=0mA IL--1
Arms / ADC
Peak IF=0mA, t < 10ms ILPK --±5 A
P
On-Resistance IF=0mA, IL=1A RON - 0.39 0.6
Switching Speeds
Turn-On Output (Deactivate) IF=5mA, VL=10V ton - 0.63 5 ms
Turn-Off Output (Activate) toff - 1.5 5
Off-State Leakage Current IF=2mA, VL=60V ILEAK --1 A
Output Capacitance IF=2mA, VL=50V, f=1MHz COUT - 125 - pF
Input Characteristics: Form-A and Form-B
Input Control Current to Activate IL=1A IF--2 mA
Input Control Current to Deactivate - IF0.1 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics: Form-A and Form-B
Capacitance, Input to Output VIO=0V, f=1MHz CIO -3- pF
*NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package total power dissipation value.
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
ESD Rating, Human Body Model 8 kV
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC
Electrical Characteristics @ 25ºC
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R03
LED Current (mA)
Device Count (N)
0
5
10
15
20
Form-A
Typical LED Current to Operate
(N=50, IL=1A)
0.65 0.69 0.73 0.77 0.81 0.85 0.89
Turn-On Time (ms)
0.57 0.61 0.65 0.69 0.73 0.77 0.81
Device Count (N)
0
5
10
15
20
25
Form-A
Typical Turn-On Time
(N=50, IF=5mA)
Turn-Off Time (ms)
0.077 0.082 0.087 0.092 0.097 0.102
Device Count (N)
0
5
10
15
20
Form-A
Typical Turn-Off Time
(N=50, IF=5mA)
LED Forward Voltage (V)
1.220 1.225 1.230 1.235 1.240 1.245 1.250
Device Count (N)
0
5
10
15
20
25
30
Form-A
Typical LED Forward Voltage Drop
(N=50)
On-Resistance (:)
0.206 0.207 0.208 0.209 0.210 0.211 0.212
Device Count (N)
0
5
10
15
20
25
Form-A
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=1A)
Blocking Voltage (VP)
65.5 66.0 66.5 67.0 67.5 68.0 68.5
Device Count (N)
0
5
10
15
20
Form-A
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.70
0.75
0.80
0.85
0.90
0.95
Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=500mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
0
500
1000
1500
2000
2500
Form-A
Typical Turn-On Time
vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
50
55
60
65
70
75
80
85
90
Form-A
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Form-A
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (Ps)
0
200
400
600
800
1000
1200
Form-A
Typical Turn-On
vs. LED Forward Current
(IL=100mA, TA=25ºC)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
77.1
77.2
77.3
77.4
77.5
77.6
77.7
77.8
Form-A
Typical Turn-Off
vs. LED Forward Current
(IL=100mA, TA=25ºC)
Form-A PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our Application Department.
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Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0.12
0.14
0.16
0.18
0.20
0.22
0.24
0.26
Form-A
Typical On-Resistance
vs. Temperature
(IF=2mA, IL=500mA)
Voltage (V)
-1.0 -0.5 0.0 0.5 1.0
Current (A)
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
Typical Load Current
vs. Load Voltage
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Form-A
Maximum Load Current
vs. Temperature
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
62
63
64
65
66
67
68
69
70
Form-A
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
5
10
15
20
Form-A
Typical Leakage vs. Temperature
Measured Across Pins 5&6
(VL=60V)
Load Voltage (V)
0.1 1 10 100
Output Capacitence (pF)
20
40
60
80
100
120
Form-A
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0
1
2
3
4
5
6
Form-A
Energy Rating Curve
Form-A PERFORMANCE DATA (continued)*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our Application Department.
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LED Current (mA)
0.20 0.21 0.22 0.23 0.24 0.25 0.26
Device Count (N)
0
5
10
15
20
25
Form-B
Typical LED Current to Operate
(N=50, IL=1A)
Turn-On Time (ms)
0.54 0.57 0.60 0.63 0.66 0.69 0.72
Device Count (N)
0
5
10
15
20
25
Form-B
Typical Turn-On Time
(N=50, IF=5mA)
Turn-Off Time (ms)
1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9
Device Count (N)
0
5
10
15
20
Form-B
Typical Turn-Off Time
(N=50, IF=5mA)
LED Forward Voltage (V)
1.220 1.225 1.230 1.235 1.240 1.245 1.250
Device Count (N)
0
5
10
15
20
25
30
Form-B
Typical LED Forward Voltage Drop
(N=50)
On-Resistance (:)
0.381 0.384 0.387 0.390 0.393 0.396 0.399
Device Count (N)
0
5
10
15
20
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=1A)
Blocking Voltage (VP)
69 71 73 75 77 79 81
Device Count (N)
0
5
10
15
20
25
Form-B
Typical Blocking Voltage Distribution
(N=50, IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.12
0.16
0.20
0.24
0.28
0.32
Form-B
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.4
0.5
0.6
0.7
0.8
0.9
Form-B
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
Form-B
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Form-B
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=2mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (ms)
0.620
0.622
0.624
0.626
0.628
0.630
0.632
0.634
0.636
0.638
0.640
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (ms)
0
1
2
3
4
5
6
7
8
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Form-B PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our Application Department.
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LBA710
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our Application Department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0.28
0.32
0.36
0.40
0.44
0.48
Form-B
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=500mA)
Voltage (V)
-0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4
Current (A)
-1.0
-0.5
0.0
0.5
1.0
Form-B
Typical Load Current
vs. Load Voltage
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (A)
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Form-B
Maximum Load Current
vs. Temperature
(IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
73
74
75
76
77
78
79
80
81
Form-B
Typical Blocking Voltage
vs. Temperature
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (PA)
0.00
0.02
0.04
0.06
0.08
0.10
Form-B
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=2mA, VL=60V)
Load Voltage (V)
0.1 1 10 100
Output Capacitance (pF)
100
150
200
250
300
350
400
450
Form-B
Output Capacitance
vs. Load Voltage
(IF=2mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0
1
2
3
4
5
6
Form-B
Energy Rating Curve
Form-B PERFORMANCE DATA (continued)*
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LBA710 / LBA710S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LBA710 / LBA710S 250ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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LBA710
Mechanical Dimensions
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
LBA710
LBA710S
INTEGRATED CIRCUITS DIVISION
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9
LBA710
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LBA710-R03
©Copyright 2017, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/18/2017
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
LBA710STR Tape & Reel
Mouser Electronics
Authorized Distributor
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