KSD-T0H007-002 3
STK0250
Electrical Characteristics (Ta=25°C)
Characteristic Symbol Test Condition Min. Typ. Max. Unit
Drain-source breakdown voltage BVDSS ID=250µA, VGS=0 500 - - V
Gate-threshold voltage VGS(th) ID=250µA, VDS= VGS 3.0 - 5.0 V
Drain-source leakage current IDSS V
DS=500V, VGS=0V - - 1
µA
Gate-source leakage IGSS VDS=0V, VGS=±30V - -
±100 nA
Drain-Source on-resistance ④ RDS(ON) V
GS=10V, ID=0.3A - 3.1 3.4
Ω
Forward transfer admittance ④ gfs V
DS=10V, ID=0.3A - 1.4 - S
Input capacitance Ciss - 268 402
Output capacitance Coss - 13 19.5
Reverse transfer capacitance Crss
VGS=0V, VDS=25V, f=1MHz
- 6.5 9.8
pF
Turn -o n de lay ti me td(on) - 8.5 -
Rise time tr - 10.2 -
Turn-off delay time td(off) - 19 -
Fall time tf
VDD=250V, VGS=10V
ID=0.6A, RG=25Ω
③④
- 10.2 -
ns
Total gate charge Qg - 8.5 12.8
Gate-source charge Qgs - 1.7 2.6
Gate-drain charge Qgd
VDD=250V, VGS=10V
ID=0.6A
③④ - 3.0 4.5
nC
Source-Drain Diode Ratings and Characteristics (Ta=25°C)
Characteristic Symbol Test Condition Min Typ Max Unit
Continuous source current IS - - 0.6
Source current (Pulsed) ① ISP
Integral reverse diode
in the MOSFET - - 2.4
A
Forward voltage ④ VSD V
GS=0V, IS=0.3A - - 1.2 V
Reverse recovery time trr - 200 - ns
Reverse recovery charge Qrr
Is=0.6A, VGS=0V
dis/dt=100A/us - 0.7 - uC
Note ;
① Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature
② L=20mH, IAS=0.6A, VDD=50V, RG=25Ω
③ Pulse Test : Pulse Width< 300us, Duty cycle≤2%
④ Essentially independent of operating temperature