Datasheet Temperature Sensor ICs Thermostat Output with Variable Detection Temperature BDExxx0G Series General Description Key Specifications BDExxx0G series are low quiescent current (16A), high accuracy thermostat (temperature switch) ICs. This IC has a built-in temperature sensor, reference voltage regulator, D/A converter, and comparator. The IC's OS terminal changes its logic state upon detection of temperature. An open-drain output (Active-L) is available in this series. Features 5C-step Selectable Detection Temperature with Control. ESD Rating of 8kV (HBM) Excellent Ripple Rejection Characteristic Power Supply Voltage Range: 2.9V to 5.5V Supply Current: 16.0A (Typ) Detection Temperature Range: +55C to +115C Detection Temperature Accuracy: 4.0C (Max) @Ta=-20C to +115C Hysteresis Temperature: 10C (Typ) High Accuracy Analog Output: 3.5C (Max) @Ta=30C Analog Output Temperature Sensitivity: -10.68mV/C (Typ) Operating Temperature Range: -30C to +130C Package W(Typ) x D(Typ) x H(Max) Applications Thermal Protection for Electrical Equipment (Notebook PC, Cellular phone, FPD-TV, etc.). Fan Control for Thermal Management. SSOP5 2.90mm x 2.80mm x 1.25mm Block Diagram and Pin Configuration TOP VIEW CTRL 1 OUT V Temp TEMP TEMP SENSOR 3 OS 4 VDD + - Vref VREF GND 2 5 Iref IREF Pin Descriptions Pin No. Pin Name Function 1 CTRL Detection Temperature Setting 2 GND 3 TEMP Set to Open state or connect to a high input impedance node (over 10M). 4 VDD Ground Output voltage in inverse proportion to the temperature (Typ -10.68mV/C) Power Supply Voltage 5 OS Digital Thermostat Output Open-Drain type. Use pull-up resistor of over 10k. Product structureSilicon monolithic integrated circuit .www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211114001 Comment Refer to page 9/11 for the temperature settings. (Temperature / Output Format Table) This product has no designed protection against radioactive rays 1/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Absolute Maximum Ratings (Ta = 25C) Parameters Symbol Limit Unit +7.0 (Note 1) Power Supply Voltage VDD -0.3 to Input Voltage (CTRL) VIN -0.3 to +VDD+0.3 V Input Current (CTRL) IIN -1.0, +0.1 mA OS Terminal Voltage VOS -0.3 to +7.0 V OS Terminal Current IOS 5.0 mA Power Dissipation Pd 0.54 (Note 2) W Tstg -55 to +150 C Storage Temperature Range V (Note 1) However, not exceeding Pd. (Note 2) When mounted on ROHM standard board, derate by 5.40mW/C for Ta higher than 25 C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameters Symbol Min Typ Max Unit Power Supply Voltage VDD 2.9 3.0 5.5 V Operating Temperature Range Topr -30 - +130 C Electrical Characteristics (Unless otherwise specified, VDD = 3.0V, Ta = 25C) Parameter Supply Current Symbol IDD Limits Min Typ Max - 16.0 20.0 Unit Conditions A VCTRL = 3.0V Ta = 30C Analog Output TEMP Output Voltage VTEMP 1.716 1.753 1.790 V VSE -10.28 -10.68 -11.08 mV/C VTEMPRL - - 1 mV difference of IOUT : 0A / 2A IL - - 1.0 A VOS = 5.0V VOL - - 0.4 V IOS = 1.2mA Input L Voltage VIL GND - 0.6 V Input H Voltage VIH 2.4 - VDD V TEMP Temperature Sensitivity TEMP Load Regulation Ta = -30C to +100C OS Output Open Drain OS Leakage Current OS Output Voltage CTRL (Note) Radiation hardiness is not designed. Temperature Accuracy (Unless otherwise specified, VDD = 3.0V) Parameters Symbol Limit Min Typ Max Unit Conditions Thermostat (Temperature Switch) Detection Temperature Accuracy Tacc - - 4.0 C Detection Temperature Hysteresis Thys 7.5 10.0 12.5 C TTEMP - - 3.5 C Ta = -20C to +115C Analog Output TEMP Temperature Accuracy www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/11 Ta = 30C TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Typical Performance Curves 3.0 25 VDD=3V SupplyIDD Current [uA] : IDD [A] TEMPVTemp Voltage :[V] VTEMP [V] 2.5 2.0 1.5 1.0 20 15 10 5 0.5 Ta=25C 0.0 0 -80 -40 0 40 80 0 120 160 1 2 4 5 6 7 8 SupplyVDD Voltage [V] : VDD [V] Temperature : Ta [C] Temperature [] Figure 2. Supply Current vs Supply Voltage Figure 1. TEMP Voltage vs Temperature (Temperature Sensitivity) 3.0 25 Ta=25C 0 2.5 VTemp [mV] TEMP Voltage : VTEMP [V] TEMP Voltage : VTEMP [V] VTemp [V] 3 2.0 1.5 1.0 0.5 -25 -50 -75 -100 -125 -150 VDD=3V, Ta=25C -175 0.0 -200 0 1 2 3 4 5 6 7 8 0 2 3 4 5 Output Current : ITEMP [A] ITemp [uA] SupplyVDD Voltage [V]: VDD [V] Figure 4. TEMP Voltage vs Output Current Figure 3. TEMP Voltage vs Supply Voltage www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 3/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Typical Performance Curves - continued 3.0 VOS[V] OS Output Voltage : VOS [V] VDD=3V, Ta=25C 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 Load Current IOS [mA]: IOS [mA] Figure 5. OS Output Voltage vs Load Current www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Application Information 1. Functional Diagram (ex. Detection Temperature 110C) Analog Output Voltage (VTEMP) [V] 3.0 2.5 Temperature Sensitivity (-10.68mV/C Typical) 2.0 1.5 VTEMP@30C (1.753V Typical) 1.0 0.5 -50 -30 -10 30 10 70 90 130 110 OS Output Voltage (VOS) [V] Temperature [C] Temperature Hysteresis (10C Typical) VOS 0 -50 -30 -10 10 30 50 70 90 110 130 Temperature [C] www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series I/O Equivalent Circuits CTRL OS VDD OS CTRL GND GND Use pull-up resistor of more than 10k. TEMP VDD TEMP GND Please do not connect a pull-down resistor. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Operational Notes - continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B N Parasitic Elements P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 6. Example of monolithic IC structure www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Ordering Information B D E x x x 0 G - TR Detect Temp. 060: 60C 070: 70C 080: 80C 090: 90C 100: 100C 110: 110C Output Format 0 : Active-L Package G:SSOP5 Packaging and forming specification TR: Embossed tape and reel (SSOP5) Lineup Temperature / Output Format Table CTRL status description (L : Low, O : Open, Detection Temperature (C) Product CTRL Name L H O H : High) OS Output Format BDE1100G 105 110 115 Open-Drain Active-L BDE1000G 95 100 105 Open-Drain Active-L BDE0900G 85 90 95 Open-Drain Active-L BDE0800G 75 80 85 Open-Drain Active-L BDE0700G 65 70 75 Open-Drain Active-L BDE0600G 55 60 65 Open-Drain Active-L Marking Diagram SSOP5 (TOP VIEW) Part Number Marking LOT Number Orderable Part Number Part Number Marking BDE1100G-TR eB BDE1000G-TR eC BDE0900G-TR eD BDE0800G-TR eE BDE0700G-TR eF BDE0600G-TR eG www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SSOP5 10/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 BDExxx0G Series Revision History Date Revision 06.Nov.2015 001 Changes New Release www.rohm.com (c) 2015 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/11 TSZ02201-0M2M0F515100-1-2 06.Nov.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). 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