SFH4211 - OSRAM GmbH - Pdf.Support

SFH 4211

GaAs-IR-Lumineszenzdiode in SMT-Gehäuse

GaAs Infrared Emitter in SMT Package

2001-02-22 1

Wesentliche Merkmale

• GaAs-LED mit sehr hohem Wirkungsgrad

• Gute Linearität (Ie = f [IF]) bei hohen Strömen

• Gleichstrom- (mit Modulation) oder

Impulsbetrieb möglich

• Hohe Zuverlässigkeit

• Hohe Impulsbelastbarkeit

• Oberflächenmontage geeignet

• Gegurtet lieferbar

• SFH 4211 Gehäusegleich mit SFH 320

Anwendungen

• Miniaturlichtschranken für Gleich- und

Wechsellichtbetrieb, Lochstreifenleser

• Industrieelektronik

• „Messen/Steuern/Regeln“

• Automobiltechnik

• Sensorik

• Alarm- und Sicherungssysteme

• IR-Freiraumübertragung

Typ

Type Bestellnummer

Ordering Code Gehäuse

Package

SFH 4211 Q62702-P1825

Kathodenkennzeic hnung: abgese t zte Ecke

cathode marking: bevelled edge

TOPLED®

Features

•Very highly efficient GaAs-LED

•Good Linearity (Ie = f [IF]) at high currents

•DC (with modulation) or pulsed operations are

possible

•High reliability

•High pulse handling capability

•Suitable for surface mounting (SMT)

•Available on tape and reel

•SFH 4211 same package as SFH 320

Applications

•Miniature photointerrupters

•Industrial electronics

•For drive and control circuits

•Automotive technology

•Sensor technology

•Alarm and safety equipment

•IR free air transmission

2001-02-22 2

SFH 4211

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 …+ 100 °C

Sperrspannung

Reverse voltage VR5V

Durchlaßstrom

Forward current IF100 mA

Stoßstrom, τ = 10 µs, D = 0

Surge current IFSM 3A

Verlustleistung

Power dissipation Ptot 160 mW

Wärmewiderstand Sperrs chicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 16 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 16 mm2 each

Wärmewiderstand Sperrschicht - Lötstelle bei

Montage auf Metall-Block

Thermal resistance junction - soldering point,

mounted on metal block

RthJA

RthJS

450

200

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 100 mA, tp = 20 ms

λpeak 950 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 100 mA

∆λ 55 nm

Abstrahlwinkel

Half angle ϕ± 60 Grad

deg.

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimensions of the active chip area L×B

L×W0.3 ×0.3 mm

SFH 4211

2001-02-22 3

Schaltzeiten, Ιe von 10% auf 90% und von 90%

auf 10%, bei IF = 100 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf0.5 µs

Kapazität,

Capacitance

VR = 0 V, f = 1 MHz

Co25 pF

Durchlaßspannung,

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µsVF

1.3 (≤ 1.5)

1.9 (≤ 2.5) V

Sperrstrom,

Reverse current

VR = 5 V

IR0.01 (≤ 1) µA

Gesamtstrahlungsfluß,

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe20 mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 100 mA

Temperature coefficient of Ie or Φe,

IF = 100 mA

TCI– 0.55 %/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA TCV– 1.5 mV/K

Temperaturkoeffizient von λ, IF = 100 mA

Temperature coefficient of λ, IF = 100 mA TCλ+ 0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2001-02-22 4

SFH 4211

Radiation Characteristics

Srel = f (ϕ)

Strahlstärke Ie in Achsrichtung

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie>2.5 mW/sr

Strahlstärke

Radiant intensity

IF = 1 A, tp = 100 µs

Ie typ. 45 mW/sr

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚ OHL01660

50˚

60˚

70˚

80˚

90˚

100˚ 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

SFH 4211

2001-02-22 5

Relati ve Sp ectral Emi ssi o n

Irel = f (λ)

Forward Curren t

IF = f (VF), single pulse, tp = 20 µs

OHR01938

rel

0880 920 960 1000

1060

100

OHR01554

-3

-2

-1

0123456V8

Radiant Intensity

Single pulse , tp = 20 µs

Max. Permissible Forward Current

IF = f (TA)

Ιe

Ιe 100 mA = f (IF)

OHR01551

-3

-2

-1

e 100 mA

-2

-1

10A

OHR00883

100

120

20 40 60 80 100 120

˚C

thjA

= 450 K/W

Permissible Pulse Handling

Capability IF = f (tp), duty cycle

D= parameter, TA = 20 °C

OHR00860

-5

10 2

10 3

10 4

0.2

0.5

0.1

0.005

0.01

0.02

0.05

-4

10 -3

10 -2

10 -1

10 0

10 1

10 2

10s

2001-02-22 6

SFH 4211

Maßzeichnung

Package Outlines

Maße werden wi e fo lgt angegeben: m m (inc h) / D im ensions are s pecified as follo w s: mm (inch).

GPLY6724

0.7 (0.028)

0.9 (0.035)

1.7 (0.067)

2.1 (0.083)

0.12 (0.005)

0.18 (0.007)

0.5 (0.020)

1.1 (0.043)

3.3 (0.130)

3.7 (0.146)

0.4 (0.016)

0.6 (0.024)

2.6 (0.102)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

Cathode marking

3.0 (0.118)

3.4 (0.134)

(2.4) (0.095)

0.1 (0.004) (typ.)

4˚±1

SFH 4211

2001-02-22 7

Zusätzliche Informationen über allgem eine Lötbedingungen erhalten S ie auf Anf rage.

For additional information on general soldering conditions please contact us.

Published by OSRAM Opto Semiconductors GmbH & Co. OHG

Wernerwerkstrasse 2, D-93049 Regensburg

Attention please!

The inform at ion describes the type of co m ponent and sha ll not be c ons idered as assured char ac te ris tic s .

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recyc ling operat ors known t o you. We can also help y ou – get in touch wit h your near est sales offic e.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted

to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain

and sust ain human life. If th ey fail, it is reaso nable to assume that the health of the user m ay be enda ngered.

Löthinweise

Soldering Conditions

Bauform

Types Tauch-, Schwall- und Schlepplötung

Dip, Wave and Drag Soldering Reflowlötung

Reflow Soldering

Lötbad-

temperatur

Temperature

of the

Soldering Bath

Maximal

zulässige

Lötzeit

Max. Perm.

Soldering Time

Abstand

Lötstelle –

Gehäuse

Distance

between

Solder Joint

and Case

Lötzonen-

temperatur

Temperature

of Soldering

Zone

Maximale

Durchlaufzeit

Max. Transit

Time

TOPLED®260 °C 10 s –245 °C10s