PIC18F4220-I/ML - Microchip Technology, Inc.

PIC18F2220/2320/4220/4320

Data Sheet

28/40/44-Pin High-Performance

Enhanced Flash Microcontrollers

with 10-Bit A/D and nanoWatt Technology

Information contained in this publication regarding device

applications a nd the like is p ro vid ed only f or yo ur c o n ve nience

and may be supers eded by updates. It is y our res po nsibilit y to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accur on,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART,

PRO MATE, PowerSmart, rfPIC and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MX DEV, MXLAB,

SEEV AL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active

Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PIC kit,

PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,

PowerInf o, PowerMate, PowerTool, REAL ICE, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance, UNI/O, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrit y of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violat ion of the Digital Millennium Copyright Act. If suc h a c t s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

T empe, Arizona, Gresham, Oregon and Mountain View , California. The

Company’s quality system processes and procedures are for its

PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

Low-Power Features:

• Power Managed modes:

- Run: CPU on, pe ripherals on

- Idle: CPU off, peripherals on

- Sleep: CPU off, peripherals off

• Pow er Consumption modes :

- PRI_RUN: 150 μA, 1 MHz, 2V

- PRI_IDLE: 37 μA, 1 MHz, 2V

- SEC_RUN: 14 μA, 32 kHz, 2V

- SEC_IDLE: 5.8 μA, 32 kHz, 2V

- RC_RUN: 110 μA, 1 MHz, 2V

- RC_IDLE: 52 μA, 1 MHz, 2V

- Sleep: 0.1 μA, 1 MHz, 2V

• Timer1 Oscillator: 1.1 μA, 32 kHz, 2V

• Watchdog Timer: 2.1 μA

• Two-Speed Os ci ll ator Start-up

Oscillators:

• Four Crystal modes:

- LP, XT, HS: up to 25 MHz

- HSPLL: 4-10 MHz (16-40 MHz internal)

• Two External RC modes, up to 4 MHz

• Two External Clock modes, up to 40 MHz

• Internal oscillator block:

- 8 user selectable frequencies: 31 kHz, 125 kHz,

250 kHz, 50 0 kHz, 1 MH z, 2 MHz, 4 MHz, 8 MHz

- 125 kHz-8 MHz calibrated to 1%

- Two modes select one or two I/O pins

- OSCTUNE – Allows user to shift frequency

• Secondary oscillator using Timer1 @ 32 kHz

• Fail-Safe Clock Monitor

- Allows for safe shutdown if peripheral clock stops

Peripheral Highl ight s:

• High current sink/source 25 mA/25 mA

• Three extern al inte rrup t s

• Up to 2 Capture/Compare/PWM (CCP) modules:

- Capture is 16-bit, max. resolution is 6.25 ns (TCY/16)

- Compare is 16-bit, max. resolution is 100 ns (TCY)

- PWM output: PWM resolution is 1 to 10-bit

• Enhanced Capture/Compare/PWM (ECCP) module:

- One, two or four PWM outputs

- Selectab le pol ari ty

- Programmable dead-time

- Auto-Shutdown and Auto-Restart

• Compatible 10-bit, up to 13-c han nel

Analog-to-Digital Converter module (A/D) with

progra mmable acquisit ion time

• Dual analog comparators

• Addressable USART module:

- RS-232 operation using internal oscillator

block (no external crystal required)

Special Microcontroller Features:

• 100,000 erase/write cycle Enhanced Flash program

memory typical

• 1,000,000 erase/wri te cycle Dat a EEPROM memo ry

typical

• Flash/Data EEPROM Retention: > 40 years

• Self-programmable under software control

• Priority levels for interrupts

• 8 x 8 Single-Cycle Hardware Multiplier

• Extended Watchdog Timer (WDT):

- Programmable period from 41 ms to 131s

- 2% stability over VDD and Temperature

• Single-supply 5V In-Circuit Serial Programming™

(ICSP™) vi a two pins

• In-Circuit Debug (ICD) via two pins

• Wide operating voltage range: 2.0V to 5.5V

Device

Program Memory Data Memory

I/O 10-bit

A/D (ch)

CCP/

ECCP

(PWM)

MSSP

USART

Comparators

Timers

8/16-bit

Flash

(bytes) # Single Word

Instructions SRAM

(bytes) EEPROM

(bytes) SPI™ Master

I2C™

PIC18F2220 4096 2048 512 256 25 10 2/0 Y Y Y 2 2/3

PIC18F2320 8192 4096 512 256 25 10 2/0 Y Y Y 2 2/3

PIC18F4220 4096 2048 512 256 36 13 1/1 Y Y Y 2 2/3

PIC18F4320 8192 4096 512 256 36 13 1/1 Y Y Y 2 2/3

28/40/44-Pin High-Per forman ce, Enhanced Fl ash MCUs

with 10-bit A/D and nanoWatt Technology

PIC18F2220/2320/4220/4320

Pin Diagrams

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/AN11/KBI0

RB3/AN9/CCP2*

RB2/AN8/INT2

RB1/AN10/INT1

RB0/AN12/INT0

VDD

VSS

RD7/PSP7/P1D

RD6/PSP6/P1C

RD5/PSP5/P1B

RD4/PSP4

RC7/RX/DT

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CVREF

RA3/AN3/VREF+

RA4/T0CKI/C1OUT

RA5/AN4/SS/LVDIN/C2OUT

RE0/AN5/RD

RE1/AN6/WR

RE2/AN7/CS

VDD

VSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2*

RC2/CCP1/P1A

RC3/SCK/SCL

RD0/PSP0

RD1/PSP1

PIC18F4320

PIC18F2320

14 15

MCLR/VPP/RE3

RA0/AN0

RA1/AN1

RA2/AN2/VREF-/CVREF

RA3/AN3/VREF+

RA4/T0CKI/C1OUT

RA5/AN4/SS/LVDIN/C2OUT

VSS

OSC1/CLKI/RA7

OSC2/CLKO/RA6

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2*

RC2/CCP1/P1A

RC3/SCK/SCL

RB7/KBI3/PGD

RB6//KBI2/PGC

RB5/KBI1/PGM

RB4/AN11/KBI0

RB3/AN9/CCP2*

RB2/AN8/INT2

RB1/AN10/INT1

RB0/AN12/INT0

VDD

VSS

RC7/RX/DT

RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

PDIP

SPDIP, SOIC

Note: Pin compatible with 40-pin PIC16C7X devices.

PIC18F4220

PIC18F2220

* RB3 is the alternate pin for the CCP2 pin multiplexing.

PIC18F2220/2320/4220/4320

Pin Diagrams (Cont.’d)

PIC18F4220

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/AN11/KBI0

NC RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

RD1/PSP1

RD0/PSP0

RC3/SCK/SCL

RC2/CCP1/P1A

RC1/T1OSI/CCP2*

RC0/T1OSO/T1CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

VSS

VDD

RE2/AN7/CS

RE1/AN6/WR

RE0/AN5/RD

RA5/AN4/SS/LVDIN/C2OUT

RA4/T0CKI/C1OUT

RC7/RX/DT

RD4/PSP4

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

VSS

VDD

RB0/AN12/INT0

RB1/AN10/INT1

RB2/AN8/INT2

RB3/AN9/CCP2*

TQFP

* RB3 is the alternate pin for the CCP2 pin multiplexing.

PIC18F4320

PIC18F4220

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

MCLR/VPP/RE3

RB3/AN9/CCP2*

RB7/KBI3/PGD

RB6/KBI2/PGC

RB5/KBI1/PGM

RB4/AN11/KBI0

NC RC6/TX/CK

RC5/SDO

RC4/SDI/SDA

RD3/PSP3

RD2/PSP2

RD1/PSP1

RD0/PSP0

RC3/SCK/SCL

RC2/CCP1/P1A

RC1/T1OSI/CCP2*

RC0/T1OSO/T1CKI

OSC2/CLKO/RA6

OSC1/CLKI/RA7

VSS

VDD

RE2/AN7/CS

RE1/AN6/WR

RE0/AN5/RD

RA5/AN4/SS/LVDIN/C2OUT

RA4/T0CKI/C1OUT

RC7/RX/DT

RD4/PSP4

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

VSS

VDD

RB0/AN12/INT0

RB1/AN10/INT1

RB2/AN8/INT2

QFN

PIC18F4320

* RB3 is the alternate pin for the CCP2 pin multiplexing.

PIC18F2220/2320/4220/4320
DS39599D-page 4 © 2006 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 19
3.0 Power Managed Modes ................ ..... .. .... .. .. .. .. .. ....... .. .. .. .. .. .... ..... .. .. .. .. .... .. .. ..... .. .... .. .. .. .. .. ......................................................... 29
4.0 Reset.......................................................................................................................................................................................... 43
5.0 Memory O rganization................................................................................................................................................................. 53
6.0 Flash Pro g ram Memory.......................... ........................... ..................... ........................... ......................................................... 71
7.0 Data EEPR OM Mem o ry.... ............... ........................... ........................... ........................... ......................................................... 81
8.0 8 X 8 Hardware Mult iplier........ ..................... ..................... ............... ..................... ..................................................................... 85
9.0 Interrupts.................................................................................................................................................................................... 87
10.0 I/O Ports ...................... ........................... ........................... ........................... ............................................................................ 101
11.0 Tim er0 Module ......................................................................................................................................................................... 117
12.0 Tim er1 Module ......................................................................................................................................................................... 121
13.0 Tim er2 Module ......................................................................................................................................................................... 127
14.0 Tim er3 Module ......................................................................................................................................................................... 129
15.0 Capture/Compare/PWM (CCP) Modules ................................................. ............. ...... .... ............. ............................................ 133
16.0 Enhanc ed Capture/Com pare/PW M (ECCP) Module................................................................................................................ 141
17.0 Master Synchronous Serial Port (M SSP ) Module ............................................................................... ..................................... 155
18.0 Addressable Universal Synchronous  Async hronous Receiv er Transmitter (USA RT ).............................................................. 195
19.0 10-bit Analog-to-Digital Converter (A/D) Module...................................................................................................................... 211
20.0 Comparator Module................................ .. .... .. .... ......... .. .... .... .. ......... .. .... .... .. ......... .... .. .... ......................................................... 221
21.0 Comparator Voltage Reference Module........... .. ....... .... .. .... .. ....... .... .. .... .. .... ....... .. .... .. .... .. ....... .... ............................................ 227
22.0 Low-V oltage Detect.................................................................................................................................................................. 231
23.0 Specia l Features of the CPU..... ............................ ..................... ........................... ................................................................... 237
24.0 Instruction Set Summary.......................................................................................................................................................... 255
25.0 Development Support............................................................................................................................................................... 299
26.0 Electrical Characteristics.......................................................................................................................................................... 305
27.0 DC and AC Characteristics Graphs and Tables.................. .. ......... .... .... .... .. ......... .... .... .. ......... .... .... ........................................ 343
28.0 Packagin g  In fo r mation................. ..................... ............................ ..................... ....................................................................... 361
Appendix A: Revision History............................................................................................................................................................. 369
Appendix B: Device Differences......................................................................................................................................................... 369
Appendix C: Conversion Considerations ..................... ....... .. .... .. .... .. ....... .... .. .... .. ....... .... .. .... .. .... ....................................................... 370
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 370
Appendix E: Migration from Mid-Range to Enhanced Devices . .... .... ......... .... .... .... ........... .... .... ......... .... .... .... .................................... 371
Appendix F: Migration from High-End to Enhanced Devices......................... .. .... .. ......... .. .... .. .... ....... .... .. .... ...................................... 371
Index .................................................................................................................................................................................................. 373
On-Line Support.................................... ......... .. .... .... .. ......... .... .. .... .... ....... .... .. .... .... ....... .... ................................................................. 383
Systems Information and Upgrade Hot Line...................................................................................................................................... 383
Reader Response.............................................................................................................................................................................. 384
PIC18F2220/2320/4220/4320 Product Identification System ............................................................................................................ 385

PIC18F2220/2320/4220/4320

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip

products. To this end, we will continue to improve our pu blications to better s uit your needs. Our publications will be refined and

enhanced as new volumes and updates are introduced.

If you have any questions o r c omm ents regarding this publication, please c ontact the M arketing Communications Department via

E-mail at docerrors@mail.microchip.com or fax the R eader Response Form in the back of th is data sheet to (480) 792-4150.

We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of an y page.

The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision

of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microc hip sales office (see last page)

• The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277

When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include

literature number) you are using.

Customer Noti fic atio n Syst em

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

1.0 DEVICE OVERVIEW

This do cu me n t conta i ns dev ic e spec if i c in f orm at i on fo r

the following devices:

This family offers the advantages of all PIC18 micro-

controllers – namely, high computational performance

at an economical price with the addition of high-

endurance Enhanced Flash program memory. On top

of these features, the PIC18F2220/2320/4220/4320

family introduces design enhancements that make

these microcontrollers a logical choice for many

high-performance, power sensitive applications.

1.1 New Core Features

1.1.1 nanoWatt TECHNOLOGY

All of the devices in the PIC18F2220/2320/4220/4320

family incorporate a range of features that can signifi-

cantly reduce power consumption during operation.

Key items include:

•Alternate Run Modes: By clocking the controller

from the Timer1 source or the internal oscillator

block, power consumption during code execution

can be reduced by as much as 90%.

•Multiple Idle Modes: The controller can also run

with its CPU core disabled, but the peripherals are

still active. In these states, power consumption can

be reduced even further, to as little as 4% of normal

operation requirements.

•On-the-fly Mode Switching: The power managed

modes are invoked by user code during operation,

allow ing t he us er to in corpor ate p ower s aving ideas

into their appl ic atio n’s softw are desig n.

•Lower Consumption in Key Modules: The power

requirements for both Timer1 and the Watchdog

Timer have been reduced by up to 80%, with typical

values of 1.8 and 2.2 μA, respectively.

1.1.2 MULTIPLE OSCILLATOR OPTIONS

AND FEATURES

All of the devices in the PIC18F2220/2320/4220/4320

family offer nine different oscillator options, allowing

user s a wide range o f choice s in develo ping applic ation

hardware. These include:

• Four Crystal modes using crystals or ceramic

resonators.

• Two External Clock modes offering the option of

using two pins (oscillator input and a divide-by-4

clock output) or one pin (oscillator input with the

second pin reassigned as general I/O).

• Two External RC Oscillator modes with the same

pin options as the External Clock modes.

• An internal oscillator block, which pr ovides a 31 kHz

INTRC clock and an 8 MHz clock with 6 program

selectable divider ratios (4 MHz to 125 kHz) for a

total of 8 clock frequencies.

Besides its availability as a clock source, the internal

oscill ato r blo ck pro vid es a s t ab le re ference sourc e th at

gives the family additional features for robust

operation:

•Fail-Safe Clock Monitor: This option constantly

monitors the main clock source against a reference

signal provided by the internal oscillator. If a clock

failure occurs, the controller is switched to the

internal oscillator block, allowing for continued

low-speed operation or a safe application shutdown.

•Two-Speed Start-up: This option allows the internal

oscillator to serve as the clock source from Power-on

Reset, or wake-up from Sleep mo de, until the primary

clock source is available. This allows for code execu-

tion during what would otherwise be the clo ck start-up

interval and can even allow an application to perform

routine background activities and return to Sleep

without returning to full power operation.

1.2 Other Special Features

•Memory Endurance: The Enhanced Flash cells for

both program memory and data EEPROM are rated

to last for many thousands of erase/write cycles – up

to 100,000 for program memory and 1,000,000 for

EEPROM. Data retention without refresh is

conservatively estim ated to be greater than 40 ye ars.

•Self-programmability: These devices can write to

their own program memory spaces under internal

software control. By using a bootloader routine

located in the protected Boot Bloc k at the top of pro-

gram memory, it becomes possible to create an

application that can update itself in the field.

•Enhanced CCP Module: In PWM mode, this

module provides 1, 2 or 4 modulated outputs for

controlling half-bridge and full-bridge drivers. Other

features include Auto-Shutdown for disabling PWM

outputs on interrupt or other select conditions and

Auto-Restart to reactivate outputs once the

conditi on has clea red.

•Addressable USART: This serial communication

module is capable of standard RS-232 operation

using the internal oscillator block, removing the

need for an external crystal (and its accompanying

power requirement) in applications that talk to the

outside world.

•10-bit A/D Converter: This module incorporates

programmable acquisition time, allowing for a chan-

nel to be selected and a conversion to be initiated

without waiting for a sampling period and thus,

reduce code ov erhead.

•Extended Watchdog Timer (WDT): This enhanced

version incorporates a 16-bit prescaler, allowing a

time-out range from 4 ms to over 2 minutes, that is

stable across operating voltage and temperature.

• PIC18F2220 • PIC18F4220

• PIC18F2320 • PIC18F4320

PIC18F2220/2320/4220/4320

1.3 Details on Individual Family

Members

Devic es in the PIC18F 2220/2320/42 20/4320 famil y are

available in 28-pin (PIC18F2X20) and 40/44-pin

(PIC18F4X20) packages. Block diagrams for the two

groups are shown in Figure 1-1 and Figure 1-2.

The devices are differentiated from each other in five

ways:

1. Flash program memory (4 Kbytes for

PIC18FX220 devices, 8 Kbytes for PIC18FX320)

2. A/D channels (10 for PIC18F2X20 devices, 13 for

PIC18F4X20 devices)

3. I/O ports (3 bidirectional ports and 1 input only

port on PIC18F2X20 devices, 5 bidirectional

ports on PIC18F4X20 devices)

4. CCP and Enhanced CCP implementation

(PIC18F2X20 devices have 2 standard CCP

modules, PIC18F4X20 devices have one

standard CCP module and one ECCP module)

5. Parallel Slave Port (present only on

PIC18F4 X20 dev ic es )

All other feature s for devi ces in th is family are ide ntical.

These are summarized in Table 1-1.

The pinouts for all devices are listed in Table 1-2 and

Table 1-3.

TABLE 1-1: DEVICE FEATURES

Features PIC18F2220 PIC18F2320 PIC18F4220 PIC18F4320

Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz

Program Memo ry (Bytes ) 4096 8192 4096 8192

Program Memo ry (Instructions) 2048 4 096 20 48 4096

Data Memory (Bytes) 512 512 512 512

Data EEPROM Memory (Bytes) 256 256 256 256

Interrupt Sources 19 19 20 20

I/O Ports Ports A, B, C (E) Ports A, B, C (E) Ports A, B, C, D, E Ports A, B, C, D, E

Timers 4 4 4 4

Capture/Compare/PWM Modules 2 2 1 1

Enhanced Capture/

Compare/PWM Modules 0011

Serial Communications MSSP,

Addressable

USART

MSSP,

Addressable

USART

MSSP,

Addressable

USART

MSSP,

Addressable

USART

Parallel Communications (PSP) No No Yes Yes

10-bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels

Resets (and Delays) POR, BOR,

RESET Ins truction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

Stack Underflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

St ac k Unde rflow

(PWRT, OST),

MCLR (optional),

WDT

POR, BOR,

RESET Instruction,

Stack Full,

St ac k Unde rflow

(PWRT, OST),

MCLR (optional),

WDT

Programmable Low -Voltage

Detect Yes Yes Yes Yes

Programmab le Brown-o ut Rese t Yes Yes Yes Yes

Instruction Set 75 Instr uctions 75 Instructions 75 Instructions 75 Instructions

Packages 28-pin SPDIP

28-pin SOIC 28-pin SPDIP

28-pin SOIC 40-pin P DIP

44-pin TQFP

44-pin QFN

40-pin P DIP

44-pin TQFP

44-pin QFN

PIC18F2220/2320/4220/4320

FIGURE 1-1: PIC18F2220/2320 BLOCK DIAGRAM

Instruction

Decode &

Control

PORTA

PORTB

PORTC

RA4/T0CKI/C1OUT

RA5/AN4/SS/LVDIN/C2OUT

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1/P1A

RC3/SCK/SCL

RC4/SDI/SDA

RC5/SDO

RC6/TX/CK

RC7/RX/DT

Addressable

CCP1 Synchronous

Timer0 Timer1 Timer2

Serial Port

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

Converter

Data Latch

Data RAM

Address Latch

Address<12>

12(2)

BSR FSR0

FSR1

FSR2

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

WREG

BIT OP 8

ALU<8>

Address Latch

Program Memory

(4 Kbytes)

Data Latch

inc/dec logic

21 8

Data Bus<8>

Instruction

ROM Latch

Timer3

CCP2

Bank0, F

PCLATU

PCU OSC2/CLKO/RA6(3)

USART

Master

Table Latch

Table Pointer <2>

inc/dec

logic

RB0/AN12/INT0

RB4/AN11/KBI0

RB1/AN10/INT1

RB2/AN8/INT2

RB3/AN9/CCP2(1)

RB5/KBI1/PGM

RB6/KBI2/PGC

RB7/KBI3/PGD

Data EEPROM

OSC1/CLKI/RA7(3)

Decode

10-bit A/ D

PORTE

RE3(2)

Power-up

Timer

Power-on

Reset

Watchdog

Timer

MCLR(2)

VDD, VSS

Brown-out

Reset

Precision

Reference

Voltage

Low-Voltage

Programming

In-Circuit

Debugger

Oscillator

Start-up Timer

Internal

OSC1

(3)

OSC2

(3)

T1OSI

T1OSO

INT RC

Oscillator

Fail-Safe

Clock Monitor

Note 1: Optional multiplexing of CCP2 input/output with RB3 is enabled by selection of the CCPMX2 configuration bit.

2: RE3 is available only when the MCLR Resets are disabled.

3: OSC1, OSC2, CLKI and CLKO are only ava ilable in select o scillator modes and when th ese pins are not being use d as digital I/O.

Refer to Section 2.0 “Oscillator Configurations” for additional information.

Oscillator

Block

(512 Bytes)

(8- or 16-bit) (16-bit) (8-bit) (16-bit)

(256 Bytes)

PIC18F2220/2320/4220/4320

FIGURE 1-2: PIC18F4220/4320 BLOCK DIAGRAM

Instruction

Decode &

Control

Note 1: Optional multiplexing of CCP2 input/output with RB3 is enabled by selection of the CCP2MX configuration bit.

2: RE3 is available only when the MCLR Resets are disabled.

3: OSC1, OSC2, CLKI and CL KO are only av ailable in se lect oscillator modes and when th ese pins a re not being us ed as digital I /O.

Refer to Section 2.0 “Oscillator Configurations” for additional information.

Addressable

Enhanced Synchronous

Timer0 Timer1 Timer2

Seri a l Po r t

Converter

Data Latch

Data RAM

Address Latch

Address<12>

12(2)

BSR FSR0

FSR1

FSR2

412 4

PCH PCL

PCLATH

31 Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

WREG

BIT OP 8

ALU<8>

Address Latch

Progr am Me mory

(8 Kbytes)

Data Latch

inc/dec logic

21 8

Data Bus<8>

Instruction

ROM Latch

Timer3

CCP2

Bank0, F

PCLATU

PCU

USART

Master

Table Latch

Table Pointer <2>

inc/dec

logic

Data EEPROM

Decode

10-bit A/D

RE3(2)

PORTD

PORTE

RE0/AN5/RD

RE1/AN6/WR

RE2/AN7/CS

RD0/PSP0

RD1/PSP1

RD2/PSP2

RD3/PSP3

RD4/PSP4

RD5/PSP5/P1B

RD6/PSP6/P1C

RD7/PSP7/P1D

Power-up

Timer

Power-on

Reset

Watchdog

Timer

VDD, VSS

Brown-out

Reset

Precision

Reference

Voltage

Low-Voltage

Programming

In-Circuit

Debugger

Oscillator

Start-up Timer

OSC1

(3)

OSC2

(3)

T1OSI

T1OSO

Fail-Safe

Clock Monitor

PORTA

PORTB

PORTC

RA4/T0CKI/C1OUT

RA5/AN4/SS/LVDIN/C2OUT

RC0/T1OSO/T1CKI

RC1/T1OSI/CCP2(1)

RC2/CCP1/P1A

RC3/SCK/SCL

RC4/SDI/SDA

RC5/SDO

RC6/TX/CK

RC7/RX/DT

RA3/AN3/VREF+

RA2/AN2/VREF-/CVREF

RA1/AN1

RA0/AN0

OSC2/CLKO/RA6(3)

RB0/AN12/INT0

RB4/AN11/KBI0

RB1/AN10/INT1

RB2/AN8/INT2

RB3/AN9/CCP2(1)

RB5/KBI1/PGM

RB6/KBI2/PGC

RB7/KBI3/PGD

OSC1/CLKI/RA7(3)

CCP

MCLR

(2)

Internal

INT RC

Oscillator

Block

(8- or 16-bit) (16-bit) (8-bit) (16-bit)

(256 Bytes)

(512 Bytes)

PIC18F2220/2320/4220/4320

TABLE 1-2: PIC18F2220/2320 PINOUT I/O DESCRIPTIONS

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP SOIC

MCLR/VPP/RE3

MCLR

VPP

RE3

11I

Master Clear (input) or programming voltage (input).

Master Clea r (Reset) inpu t. This pin is an active-low Reset

to the device.

Programming voltage input.

Digital input.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

99I

I/O

CMOS

TTL

Oscillator crystal or external clock input.

Oscillator crystal input or external clock source input.

ST buffer when configured in RC mode, CMOS otherwise.

External clock source input. Always associated with pin

function OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

10 10 O

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal or resonator

in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO which has 1/4 the

frequency of OSC1 and denotes the instruction cycle rate.

General purpose I/O pin.

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

I/O

ITTL

Analog Digital I/O.

Analog input 0.

RA1/AN1

RA1

AN1

I/O

ITTL

Analog Digital I/O.

Analog input 1.

RA2/AN2/VREF-/CVREF

RA2

AN2

VREF-

CVREF

I/O

TTL

Analog

Digital I/O.

Analog input 2.

A/D Reference Voltage (Low) input.

Comparator Reference Voltage output.

RA3/AN3/VREF+

RA3

AN3

VREF+

I/O

TTL

Analog

Digital I/O.

Analog input 3.

A/D Reference Voltage (High) input.

RA4/T0CKI/C1OUT

RA4

T0CKI

C1OUT

I/O

ST/OD

—

Digital I/O. Open-drain when configured as output.

Timer0 external clock input.

Compar ator 1 output.

RA5/AN4/SS/LVDIN/C2OUT

RA5

AN4

LVDIN

C2OUT

I/O

TTL

Analog

TTL

Analog

—

Digital I/O.

Analog input 4.

SPI Slave Select input.

Low-Voltage Detect input.

Compar ator 2 output.

RA6 See the OSC2/CLKO/RA6 pin.

RA7 See the OSC1/CLKI/RA7 pin.

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for C CP2 when CCP2MX (CONFI G3H<0>) is set.

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTB is a bidirectional I/O port. PORTB can be software

programmed for internal weak pull-ups on all inputs.

RB0/AN12/INT0

RB0

AN12

INT0

21 21 I/O

TTL

Analog

Digital I/O.

Analog input 12.

External inte rrup t 0.

RB1/AN10/INT1

RB1

AN10

INT1

22 22 I/O

TTL

Analog

Digital I/O.

Analog input 10.

External inte rrup t 1.

RB2/AN8/INT2

RB2

AN8

INT2

23 23 I/O

TTL

Analog

Digital I/O.

Analog input 8.

External inte rrup t 2.

RB3/AN9/CCP2

RB3

AN9

CCP2(1)

24 24 I/O

I/O

TTL

Analog

Digital I/O.

Analog input 9.

Capture2 input, Compare2 output, PWM2 output.

RB4/AN11/KBI0

RB4

AN11

KBI0

25 25 I/O

TTL

Analog

TTL

Digital I/O.

Analog input 11.

Interrupt-on-change pin.

RB5/KBI1/PGM

RB5

KBI1

PGM

26 26 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

Low-voltage ICSP programming enable pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

27 27 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit D ebu gge r and ICSP program mi ng cl ock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

28 28 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit D ebu gge r and ICSP program mi ng data pin.

TABLE 1-2: PIC18F2220/2320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP SOIC

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for CCP2 when CCP2MX (CONFIG3H<0>) is set .

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTC is a bidirectional I/O port.

RC0/T1OSO/T1CKI

RC0

T1OSO

T1CKI

11 11 I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1/Timer3 external clock input.

RC1/T1OSI/CCP2

RC1

T1OSI

CCP2(2)

12 12 I/O

I/O

CMOS

Digital I/O.

Timer1 oscillator input.

Capture2 input, Compare2 output, PWM2 output.

RC2/CCP1/P1A

RC2

CCP1

P1A

13 13 I/O

I/O

—

Digital I/O.

Capture1 input/Compare1 output/PWM1 output.

Enhanced CCP 1 output .

RC3/SCK/SCL

RC3

SCK

SCL

14 14 I/O

I/O

Digital I/O.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C mode.

RC4/SDI/SDA

RC4

SDI

SDA

15 15 I/O

I/O

Digital I/O.

SPI data in.

I2C data I/O.

RC5/SDO

RC5

SDO

16 16 I/O

OST

—Digital I/O.

SPI data out.

RC6/TX/CK

RC6

17 17 I/O

I/O

—

Digital I/O.

USART asynchronous transmit.

USART synchronous clock (see related RX/DT).

RC7/RX/DT

RC7

18 18 I/O

I/O

Digital I/O.

USART asynchronous receive.

USART synchronous data (see related TX/CK).

RE3 — — — — See MCLR/VPP/RE3 pin.

VSS 8, 19 8, 19 P — Ground reference for logic and I/O pins.

VDD 20 20 P — Positive supply for logic and I/O pins.

TABLE 1-2: PIC18F2220/2320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP SOIC

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for C CP2 when CCP2MX (CONFI G3H<0>) is set.

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

TABLE 1-3: PIC18F4220/4320 PINOUT I/O DESCRIPTIONS

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

MCLR/VPP/RE3

MCLR

VPP

RE3

11818I

Master Clear (input) or programming voltage (input).

Master Clear (Reset) input. This pin is an active-low

Reset to the device.

Programmi ng vol t ag e inpu t.

Digital input.

OSC1/CLKI/RA7

OSC1

CLKI

RA7

13 30 32 I

I/O

CMOS

TTL

Oscillator cryst al or external c lock input.

Oscillator cryst al input or ex ternal cloc k source i nput.

ST buffer when configured in RC mode, CMOS otherwise.

External cloc k source input. Always associated with

pin function OSC1. (See related OSC1/CLKI,

OSC2/CLKO pins.)

General purpose I/O pin.

OSC2/CLKO/RA6

OSC2

CLKO

RA6

14 31 33 O

I/O

—

TTL

Oscillator crystal or clock output.

Oscillator crystal output. Connects to crystal or resonator

in Crystal Oscillator mode.

In RC mode, OSC2 pin outputs CLKO which has 1/4 the

frequency of OSC1 and denotes the instruction cycle rate.

General purpose I/O pin.

PORTA is a bidirectional I/O port.

RA0/AN0

RA0

AN0

21919

I/O

ITTL

Analog Digital I/O.

Analog input 0.

RA1/AN1

RA1

AN1

32020

I/O

ITTL

Analog Digital I/O.

Analog input 1.

RA2/AN2/VREF-/CVREF

RA2

AN2

VREF-

CVREF

42121

I/O

TTL

Analog

Digital I/O.

Analog input 2.

A/D refe rence voltage (Low) input.

Comparator reference voltage output.

RA3/AN3/VREF+

RA3

AN3

VREF+

52222

I/O

TTL

Analog

Digital I/O.

Analog input 3.

A/D refe rence vol tage (High) input.

RA4/T0CKI/C1OUT

RA4

T0CKI

C1OUT

62323

I/O

ST/OD

—

Digital I/O. Open-drain when configured as output.

Timer0 external clock input.

Compar ator 1 output .

RA5/AN4/SS/LVDIN/

C2OUT

RA5

AN4

LVDIN

C2OUT

72424

I/O

TTL

Analog

TTL

Analog

—

Digital I/O.

Analog input 4.

SPI slave select input.

Low-Voltage Detect input.

Comparator 2 output.

RA6 See the OSC2/CLKO/RA6 pin.

RA7 See the OSC1/CLKI/RA7 pin.

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for CCP2 when CCP2MX (CONFIG3H<0>) is set .

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTB is a bidirectional I/O port. PORTB can be software

programmed for internal weak pull-ups on all inputs.

RB0/AN12/INT0

RB0

AN12

INT0

33 8 9 I/O

TTL

Analog

Digital I/O.

Analog input 12.

External interrupt 0.

RB1/AN10/INT1

RB1

AN10

INT1

34 9 10 I/O

TTL

Analog

Digital I/O.

Analog input 10.

External interrupt 1.

RB2/AN8/INT2

RB2

AN8

INT2

35 10 11 I/O

TTL

Analog

Digital I/O.

Analog input 8.

External interrupt 2.

RB3/AN9/CCP2

RB3

AN9

CCP2(1)

36 11 12 I/O

I/O

TTL

Analog

Digital I/O.

Analog input 9.

Capture2 input, Compare2 output, PWM2 output.

RB4/AN11/KBI0

RB4

AN11

KBI0

37 14 14 I/O

TTL

Analog

TTL

Digital I/O.

Analog input 11.

Interrupt-on-change pin.

RB5/KBI1/PGM

RB5

KBI1

PGM

38 15 15 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

Low-voltage ICSP programming enable pin.

RB6/KBI2/PGC

RB6

KBI2

PGC

39 16 16 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming clock pin.

RB7/KBI3/PGD

RB7

KBI3

PGD

40 17 17 I/O

I/O

TTL

Digital I/O.

Interrupt-on-change pin.

In-Circuit Debugger and ICSP programming data pin.

TABLE 1-3: PIC18F4220/4320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for C CP2 when CCP2MX (CONFI G3H<0>) is set.

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTC is a bidirectional I/O port.

RC0/T1OSO/T1CKI

RC0

T1OSO

T1CKI

15 32 34 I/O

—

Digital I/O.

Timer1 oscillator output.

Timer1/Timer3 external clock input.

RC1/T1OSI/CCP2

RC1

T1OSI

CCP2(2)

16 35 35 I/O

I/O

CMOS

Digital I/O.

Timer1 oscillator input.

Capture2 input, Compare2 output, PWM2 output.

RC2/CCP1/P1A

RC2

CCP1

P1A

17 36 36 I/O

I/O

—

Digital I/O.

Capture1 input/Compare1 output/PWM1 output.

Enhanced CCP1 output.

RC3/SCK/SCL

RC3

SCK

SCL

18 37 37 I/O

I/O

Digital I/O.

Synchronous serial clock input/output for SPI mode.

Synchronous serial clock input/output for I2C mode.

RC4/SDI/SDA

RC4

SDI

SDA

23 42 42 I/O

I/O

Digital I/O.

SPI data in.

I2C data I/O.

RC5/SDO

RC5

SDO

24 43 43 I/O

OST

—Digital I/O.

SPI data out.

RC6/TX/CK

RC6

25 44 44 I/O

I/O

—

Digital I/O.

USART asy nc hro nou s trans m it.

USART synchronous clock (see related RX/DT).

RC7/RX/DT

RC7

26 1 1 I/O

I/O

Digital I/O.

USART asy nc hro nou s r ece iv e.

USART synchronous data (see related TX/CK).

TABLE 1-3: PIC18F4220/4320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for CCP2 when CCP2MX (CONFIG3H<0>) is set .

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTD is a bidirectional I/O port or a Parallel Slave Port

(PSP) for interfacing to a microprocessor port. These pins

have TTL input buffers when PSP module is enabled.

RD0/PSP0

RD0

PSP0

19 38 38 I/O

I/O ST

TTL Digital I/O.

Parallel Slave Port data.

RD1/PSP1

RD1

PSP1

20 39 39 I/O

I/O ST

TTL Digital I/O.

Parallel Slave Port data.

RD2/PSP2

RD2

PSP2

21 40 40 I/O

I/O ST

TTL Digital I/O.

Parallel Slave Port data.

RD3/PSP3

RD3

PSP3

22 41 41 I/O

I/O ST

TTL Digital I/O.

Parallel Slave Port data.

RD4/PSP4

RD4

PSP4

27 2 2 I/O

I/O ST

TTL Digital I/O.

Parallel Slave Port data.

RD5/PSP5/P1B

RD5

PSP5

P1B

28 3 3 I/O

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

RD6/PSP6/P1C

RD6

PSP6

P1C

29 4 4 I/O

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

RD7/PSP7/P1D

RD7

PSP7

P1D

30 5 5 I/O

I/O

TTL

—

Digital I/O.

Parallel Slave Port data.

Enhanced CCP1 output.

TABLE 1-3: PIC18F4220/4320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for C CP2 when CCP2MX (CONFI G3H<0>) is set.

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

PORTE is a bidirectional I/O port.

RE0/AN5/RD

RE0

AN5

82525

I/O

Analog

TTL

Digital I/O.

Analog input 5.

Read control for Parallel Slave Port

(see also WR and CS pins).

RE1/AN6/WR

RE1

AN6

92626

I/O

Analog

TTL

Digital I/O.

Analog input 6.

Write control for Parallel Slave Port

(see CS and RD pins).

RE2/AN7/CS

RE2

AN7

10 27 27 I/O

Analog

TTL

Digital I/O.

Analog input 7.

Chip select control for Parallel Slave Port

(see related RD and WR).

RE3 1 18 18 — — See MCLR/VPP/RE3 pin.

VSS 12,

31 6, 29 6, 30,

31 P — Ground reference for logic and I/O pins.

VDD 11, 32 7, 28 7, 8,

28, 29 P — Positive supply for logic and I/O pins.

NC — — 13 NC NC No connect.

TABLE 1-3: PIC18F4220/4320 PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin Number Pin

Type Buffer

Type Description

PDIP TQFP QFN

Legend: TTL = TTL compatible input CMOS= CMOS compatible input or output

ST = Schmitt Trigger input with CMOS levels I = Input

O = Output P = Power

OD = Open-drain (no diode to VDD)

Note 1: Default assignment for CCP2 when CCP2MX (CONFIG3H<0>) is set .

2: Alternate assignment for CCP2 when CCP2MX is cleared.

PIC18F2220/2320/4220/4320

2.0 OSCILLATOR

CONFIGURATIONS

2.1 Oscillator Types

The PIC18F2X20 and PIC18F4X20 devices can be

operated in ten dif ferent osci llator modes. The user can

program the configuration bits, FOSC3:FOSC0, in

Configuration Register 1H to select one of these ten

modes:

1. LP Lo w-Power Cry stal

2. XT Crystal/Resonator

3. HS High-Speed Crystal/Resonator

4. HSPLL High-Speed Crystal/Resonator

with PLL enabled

5. RC Ex tern al R esi st or/C apacitor with

FOSC/4 output on RA6

6. RCIO Extern al Resi st or/C apacito r with

I/O on RA 6

7. INTIO1 Internal Oscillator with FOSC/4

output on RA6 and I/O on RA7

8. INTIO2 Internal Oscil lat or with I/O on RA6

and RA7

9. EC Extern al Cloc k with FOSC/4 output

10. ECIO External Clock with I/O on RA6

2.2 Crystal Oscillator/Ceramic

Resonators

In XT, LP, HS or HSPLL Oscillator modes, a crystal or

ceramic resonator is connected to the OSC1 and

OSC2 pins to establish oscillation. Figure 2-1 shows

the pin connections.

The oscillator design requires the use of a parallel cut

crystal.

FIGURE 2-1: CRYSTAL/CERAMIC

RESONATOR OPERATION

(XT, LP, HS OR HSPLL

CONFIGURATION)

T ABLE 2-1: CAPACITOR SELECTION FOR

CERAMIC RESONATORS

Note: Use of a series cut crystal may give a fre-

quency out of the crystal manufacturers

specifications.

Typi cal C apacitor Values Used:

Mode Freq OSC1 OSC2

XT 455 kHz

2.0 MHz

4.0 MHz

56 pF

47 pF

33 pF

56 pF

47 pF

33 pF

HS 8.0 MHz

16.0 MHz 27 pF

22 pF 27 pF

22 pF

Capacitor values are for design guidance only.

These capacitors were tested with the resonators

listed below for basic start-up and operation. These

values are not optimized.

Dif ferent cap acitor values may be required to prod uce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes on page 20 for additional information.

Reson ators U sed :

455 kHz 4.0 MHz

2.0 MHz 8.0 MHz

16.0 MHz

Note 1: See Table 2-1 and Table 2-2 for initial values

of C1 and C2.

2: A series resistor (RS) may be required for AT

strip cut crystals.

3: RF varies with the oscillator mode chosen.

C1(1)

C2(1)

XTAL

OSC2

OSC1

RF(3)

Sleep

Logic

PIC18FXXXX

RS(2)

Internal

PIC18F2220/2320/4220/4320

TABLE 2-2: CAPACITOR SELECTION FOR

CRYSTAL OSCILLATOR

An external clock source may also be connected to the

OSC1 pin in the HS mode, as shown in Figure 2-2.

FIGURE 2-2: EXTERNAL CLOCK INPUT

OPERATION (HS OSC

CONFIGURATION)

2.3 HSPLL

A Phase Locked Loop (PLL) circuit is provided as an

option for users who wish to use a lower frequency

crystal oscillator circuit, or to clock the device up to its

highest rated frequency from a crystal oscillator. This

may be useful for customers who are concerned with

EMI due to high-frequency crystals.

The HSPL L mode make s use of the HS mode oscil lator

for freque ncies u p to 10 MH z. A PLL t hen multipl ies the

oscillator output frequency by 4 to produce an internal

clock frequency up to 40 MHz.

The PLL is enabled only when the oscillator configura-

tion bits are programmed for HSPLL mode. If

programmed for any other mode, the PLL is not

enabled.

FIGURE 2-3: PLL BLOCK DIAGRAM

Osc Type Crystal

Freq

Typical Cap acitor V al ues

Tested:

C1 C2

LP 32 kHz 33 pF 33 pF

200 kHz 15 pF 15 pF

XT 1 MHz 33 pF 33 pF

4 MHz 27 pF 27 pF

HS 4 MHz 27 pF 27 pF

8 MHz 22 pF 22 pF

20 MHz 15 pF 15 pF

Capacitor values are for design guidance only.

These capacitors were tested with the crystals listed

below fo r ba si c start-up and operat ion. These values

are not optimized.

Dif ferent capa citor values may be require d to produce

acceptable oscillator operation. The user should test

the performance of the oscillator over the expected

VDD and temperature range for the application.

See the notes following this table for additional

information. Cryst a ls Us ed:

32 kHz 4 MHz

200 kHz 8 MHz

1 MHz 20 MH z

Note 1: Higher capacitance increases the stability

of the oscillator, but also increases the

start-up time.

2: When operating below 3V VDD, or when

using certain ceramic resonators at any

voltage, it may be necessary to use the

HS mode or switch to a crystal oscillator.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: RS may be required to avoid overdriving

crystals with low dr iv e lev el spe ci fic ati on.

5: Always veri fy os ci lla tor pe rform an ce ov er

the VDD and temperature range that is

expected for the application.

OSC1

OSC2

Open

Clock from

Ext. System PIC18FXXXX

(HS Mode)

MUX

VCO

Loop

Filter

Crystal

Osc

OSC2

OSC1

PLL Enable

FIN

FOUT

SYSCLK

Phase

Comparator

HS Osc Enable

÷4

(from Configuration Register 1H)

HS Mode

PIC18F2220/2320/4220/4320

2.4 External Clock Input

The EC and ECIO Oscilla tor modes require an externa l

clock source to be conn ected to the OSC1 pi n. There is

no oscillator start-up time required after a Power-on

Reset or after an exit from Sleep mode.

In the EC Oscillator mode, the oscillator frequency

divided by 4 is available on the OSC2 pin. This signal

may be u s ed f or t e st pu r pos es or t o sy nc hr o n iz e ot he r

logic. Figure 2-4 shows the pin connections for the EC

Oscillator mode.

FIGURE 2-4: EXTER NAL CLOCK INPUT

OPERATION

(EC CONFIGURATION)

The ECIO O sc illator mode func ti ons li ke t he EC m od e,

except that the OSC2 pin becomes an additional gen-

eral purpose I/O pin. The I/O pin becomes bit 6 of

PORTA (RA6). Figure 2-5 shows the pin connections

for the ECIO Oscillator mode.

FIGURE 2-5: EXTER NAL CLOCK INPUT

OPERATION

(ECIO CONFIGURATION)

2.5 RC Oscillator

For timing insensitive applications, the “RC” and

“RCIO” device options offer additional cost savings.

The RC oscillator frequency is a function of the supply

voltage, the resistor (REXT) and capacitor (CEXT) val-

ues and the operating temperature. In addition to this,

the oscil lator frequen cy will vary from unit to unit due to

normal manufacturing variation. Furthermore, the dif-

ference in lead frame capacitance between package

types will also affect the oscillation frequency, espe-

cially for low CEXT values. The user also needs to take

into account variation due to tolerance of external R

and C components used. Figure 2-6 shows how the

R/C combination is connected.

In the RC Oscillator mode, the oscillator frequency

divided by 4 is available on the OSC2 pin. This signal

may be us ed f or t e st pu r pos es or t o sy nc hr o n iz e ot he r

logic.

FIGURE 2-6: RC OSCILLATOR MODE

The RCIO Oscillator mode (Figure 2-7) functions like

the RC mode, except that the OSC2 pin becomes an

additional general purpose I/O pin. The I/O pin

becomes bit 6 of PORTA (RA6).

FIGURE 2-7: RCIO OSCILLATOR MODE

OSC1/CLKI

OSC2/CLKO

FOSC/4

Clock from

Ext. System PIC18FXXXX

OSC1/CLKI

I/O (OSC2)

RA6

Clock from

Ext. System PIC18FXXXX

OSC2/CLKO

CEXT

REXT

PIC18FXXXX

OSC1

FOSC/4

Internal

Clock

VDD

VSS

Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ

CEXT > 20 pF

CEXT

REXT

PIC18FXXXX

OSC1 Internal

Clock

VDD

VSS

Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ

CEXT > 20 pF

I/O (OSC2)

RA6

PIC18F2220/2320/4220/4320

2.6 Internal Oscillator Block

The PIC18F2X20/4X20 devices include an internal

oscill ator block which generat es two dif fere nt clock si g-

nals. Ei ther can be use d as the system’s clock source.

This can eliminate the need for external oscillator

circuits on the OSC1 and/or OSC2 pins.

The main output (INTOSC) is an 8 MHz clock source

which can be used to directly drive the system clock. It

also drives a postscaler which can provide a range of

clock frequencies from 125 kHz to 4 MHz. The

INTOSC output is enabled when a system clock

frequency from 125 kHz to 8 MHz is selected.

The other clock source is the internal RC oscillator

(INTRC) which provides a 31 kHz output. The INTRC

oscillator is enabled by selecting the internal oscillator

block as the system clock source or when any of the

following are enabled:

• Power-up Timer

• Fail-Safe Clock Monitor

• Watchdog Timer

• Two-Speed S t a r t-up

These features are discussed in greater detail in

Section 23.0 “Special Features of the CPU”.

The clock source frequency (INTOSC direct, INTRC

direct or INTOSC postscaler) is selected by configuring

the IRCF bits of the OSCCON register (page 26).

2.6.1 INTIO MODES

Using the internal oscillator as the clock source can

elimin ate the need for up to tw o ext erna l os c ill ato r pins

which can then be used for digital I/O. Two distinct

configurations are available:

• In INTIO1 mode, the OSC2 pin outputs FOSC/4,

while OSC1 fu nc tio ns as RA 7 fo r dig it a l in put and

output.

• In INTIO2 mode, OSC1 functions as RA7 and

OSC2 functions as RA6, both for digital input and

output.

2.6.2 INTRC OUTPUT FREQUENCY

The internal oscillator block is calibrated at the factory

to produce an INTOSC output frequency of 8.0 MHz.

This changes the frequency of the INTRC source from

its nominal 31.25 kHz. Peripherals and features that

depend on the INTRC source will be affected by this

shift in frequency.

Once set during factory calibration, the INTRC

frequency will remain within ±1% as temperature and

VDD change across their full specified operating

ranges.

2.6.3 OSCTUNE REGISTER

The internal oscillator’s output has been calibrated at

the factory but can be adjusted in the user's applica tion.

This is done by writing to the OSCTUNE register

(Register 2-1). The tuning sensitivity is constant

throughout the tuning range.

When the O SC TUN E reg is ter is mo di fied , the IN T O SC

and INTRC frequencies will begin shifting to the new

frequency. The INTRC clock will reach the new fre-

quency within 8 clock cycles (approximately

8*32μs = 256 μs). The INTOSC clock will stabilize

within 1 ms. Code executi on conti nues du ring this shift.

There is no indic ation tha t the shif t has occ urred. Op er-

ation of features that depend on the INTRC clock

source frequency, such as the WDT, Fail-Safe Clock

Monitor and peripherals, will also be affected by the

change in freq uency.

PIC18F2220/2320/4220/4320

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5-0 TUN<5:0>: Frequency Tuning bits

011111 = Maximum frequency (+12.5%, approximately)

• •

000001

000000 = Center frequency. Oscillator module is running at the calibrated frequency.

111111

• •

100000 = Minimum frequency (-12.5%, approximately)

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

2.7 Clock Sources and Oscillator

Switching

Like previous PIC18 devices, the PIC18F2X20 and

PIC18F4X20 devices include a feature that allows the

system clock source to be switched from the main

oscillator to an alternate low-frequency clock source.

PIC18F2X20/4X20 devices offer two alternate clock

sources. When enabled, these give additional options

for switching to the various power managed operating

modes.

Essentially, there are three clock sources for these

devices:

• Primary oscillators

• Secondary oscillators

• Internal oscillator block

The primary oscillators include the External Crystal

and Resonator modes, the External RC modes, the

External Clock modes and the internal oscillator block.

The par ticula r mode is defin ed on POR by the content s

of Configuration Register 1H. The details of these

modes are covered earlier in this chapter.

The secondary oscillat ors are those external sources

not connected to the OSC1 or OSC2 pins. These

sources may continue to operate even after the

controller is placed in a power managed mode.

PIC18F2X20/4X20 devices offer only the Timer1

oscill ator as a seconda ry oscillator. This oscil lator , in all

power managed modes, is often the time base for

functions such as a real-time clock.

Most often, a 32.768 kHz watch crystal is connected

betwee n the RC0/T1OSO/ T1CKI and RC1/T1O SI pins.

Like the LP mode oscillator circuit, loading capacitors

are also connected from each pin to ground.

The Timer1 oscillator is discussed in greater detail in

Section 12.2 “Timer1 Oscillator”.

In addi tion to be ing a prim ary clock s ource, the internal

oscillator block is available as a power managed

mode cl oc k s ourc e. The INTRC s ou rce is also us ed a s

the clock source for several special features, such as

the WDT and Fail-Safe Clock Monitor.

The clock sources for the PIC18F2X20/4X20 devices

are shown in Figure 2-8. See Section 12.0 “Timer1

Module” for furth er details of the T imer1 os cillator . See

Section 23.1 “Configuration Bits” for Configuration

2.7.1 OSCILLATOR CONTROL REGISTER

The OSCCON register (Register 2-2) controls several

aspects of the system clock’s operation, both in full

power operation and in power managed modes.

The System Clock Select bits, SCS1:SCS0, select the

clock source that is used when the device is operating

in pow er mana ged mode s. The a vailabl e clock s ources

are the primary clock (defined in Configuration

and the internal oscillator block. The clock selection

has no effect until a SLEEP instruction is executed and

the device enters a power managed mode of operation.

The SCS bits are cleared on all forms of Reset.

The Intern al Oscillator Select bit s, IRCF2:IRCF0, select

the freque ncy o utput of the int erna l oscill ator blo ck th at

is use d to driv e th e syst em cl ock. T he choi ces ar e the

INTRC source, the INTOSC source (8 MHz) or one of

the six frequencies derived from the INTOSC

postscaler (125 kHz to 4 MHz). If the internal oscillator

block is supplying the system clock, changing the

states of th ese bi ts will ha ve an immedi ate ch ange on

the internal oscillator’s output.

The OSTS, IO FS an d T1 RUN bit s ind icate wh ich cl oc k

source is currently providing the system clock. The

OSTS indicates that the Oscillator Start-up Timer has

timed out and the pri mary clock is providin g the system

clock in primary clock modes. The IOFS bit indicates

when the internal oscillator block has stabilized and is

providing the system clock in RC Clock modes. The

T1RUN bit (T1CON<6>) indicates when the Timer1

oscillator is providing the system clock in secondary

clock modes. If none of these bit s are s et, the INTRC i s

providing the system clock, or the internal oscillator

block has just started and is not yet stable.

The IDLEN bit controls the selective shutdown of the

controll er’s CPU in power managed mo des. The use of

these bits is discussed in more detail in Section 3.0

“Power Managed Modes”.

Note 1: The Timer1 oscillator must be enabled to

select the secondary clock source. The

T imer 1 oscilla tor is enable d by setting the

T1OSCEN bit in the T ime r1 Control re gis-

ter (T1CON<3>). If the Timer1 oscillator

is not enabled, then any attempt to set the

SCS0 bit will be ignored.

2: It is recommended that the Timer1

oscillator be operating and stable before

executi ng the SLEEP in str u ction or a ver y

long delay may occur while the Timer1

oscillator starts.

PIC18F2220/2320/4220/4320

FIGURE 2-8: PIC18F2X20/4X20 CLOCK DIAGRAM

PIC18F2X20/4X20

4 x PLL

CONFIG1H<3:0>

Secondary Oscillator

T1OSCEN

Enable

Oscillator

T1OSO

T1OSI

Clock Source Option

for Other Modules

OSC1

OSC2

Sleep

Primary Oscillator

HSPLL

LP, XT, HS, RC, EC

T1OSC

CPU

Peripherals

IDLEN

Postscaler

MUX

8 MHz

4 MHz

2 MHz

1 MHz

500 kHz

125 kHz

250 kHz

OSCCON<6:4>

111

110

101

100

011

010

001

000

31 kHz

INTRC

Source

Internal

Oscillator

Block

WDT, FSCM

8 MHz

Internal Oscillator

(INTOSC)

OSCCON<6:4>

Clock

Control OSCCON<1:0>

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0

IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0

bit 7 bit 0

bit 7 IDLEN: Idle Enable bit

1 = Idle mode enabled; CPU core is not clocked in power managed modes

0 = Run mode enabled; CPU core is clocked in power managed modes

bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits

111 = 8 MHz (8 MHz source drives clock directly)

110 = 4 MHz

101 = 2 MHz

100 = 1 MHz

011 = 500 kHz

010 = 250 kHz

001 = 125 kHz

000 = 31 kHz (INTRC source drives clock directly)

bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)

1 = Oscillator start-up time-out timer has expired; primary oscillator is running

0 = Oscillator start-up time-out timer is running; primary oscillator is not ready

bit 2 IOFS: INTOSC Frequency Stable bit

1 = INTOSC frequency is stable

0 = INTOSC frequency is not stable

bit 1-0 SCS1:SCS0: System Clock Select bits

1x = Internal oscillator block (RC modes)

01 = Timer1 oscillator (Secondary modes)(2)

00 = Primary oscillator (Sleep and PRI_IDLE modes)

Note 1: Depends on state of IESO bit in Configuration Register 1H.

2: SCS0 may not be set while T1OSCEN (T1CON<3>) is clear.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

© 2006 Microchip Technology Inc. DS39599D-page 27
PIC18F2220/2320/4220/4320
2.7.2 OSCILLA TOR TR ANSIT ION S
The PIC18F2X20/4X20 devices contain circuitry  to pre-
vent clocking “glitches” when switching between clock
sour ces. A sh ort p aus e in the sy stem c lock o ccurs  dur-
ing the clock switch. The length of this pause is
betwee n 8 and 9 clock pe riods of the new  clock sourc e.
This ensures that the new clock source is stable and
that its pulse width will not be less than the shortest
pulse width of the two clock sources.
Clock transitions are discussed in greater detail in
Section 3.1.2 “Entering Power Managed Modes”.
2.8 Effects of Power Managed Modes 
on the Various Clock Sources
When the device executes a SLEEP instruction, the
system is switched to one of the power managed
modes, depending on the state of the IDLEN and
SCS1:SCS0 bits of the OSCCON register. See
Section 3.0 “Power Managed Modes” for details.
When PRI_IDLE mode is selected, the designated pri-
mary oscillator continues to run without interruption.
For all other power managed modes, the oscillator
using the OSC1 pin is disabled. The OSC1 pin (and
OSC2  pin, if us ed by th e oscillat or) will  stop oscil lating. 
In secondary clock modes (SEC_RUN and
SEC_IDLE),  the  Timer1 oscilla tor  is  op erat ing  an d p ro-
viding  the s ystem c lock.  The T ime r1 osci llator  may als o
run in all power managed modes if required to clock
Ti mer1 or Timer3.
In internal oscillator modes (RC_RUN and RC_IDLE),
the internal oscillator block provides the system clock
source. The INTRC output can be used directly to
provide the system clock and may be enabled to
support various special features, regardless of the
power managed mode (see Section 23.2 “Watchdog
Time r (WDT)” thro ugh Section 23.4 “Fail-Safe Clock
Monitor”). The INT OSC out put at 8 MH z may be used
directly to clock the system or may be divided down
first.  The INTO SC output is disabl ed if the system cl ock
is provided directly from the INTRC output.
If the Sleep mode is selected, all clock sources are
stopped. Since all the transistor switching currents
have been stopped, Sleep mode achieves the lowest
current consumption of the device (only leakage
currents).
Enabling any on-chip feature that will operate during
Sleep w ill increase  the current co nsumed during Sl eep.
The INTRC is required to support WDT operation. The
Timer1 oscillator may be operating to support a real-
time cl ock. Ot her feat ures may be  operat ing that d o not
require a system clock source (i.e., SSP slave, PSP,
INTn pins, A/D conversions and others).
2.9 Power-up Delays
Power-up delays are controlled by two timers so that no
external Reset circuitry is required for most applica-
tions. The delays ensure that the device is kept in
Reset  until the  device powe r supply i s stable  under nor-
mal circumstances and the primary clock is operating
and stable. For additional information on power-up
delays, see Section 4.1 “Power-on Reset (POR)”
through Section 4 .5 “Brown-out Reset (BOR)”.
The first timer is the Power-up Timer (PWRT) which
provides a fixed delay on power-up (parameter 33,
Table 26-10), if enabled, in Configuration Register 2L.
The second timer is the Oscillator Start-up Timer
(OST), intended to keep the chip in Reset until the crys-
tal oscillator is stable (LP, XT and HS modes). The OST
does this by counting 1024 oscillator cycles before
allowing the oscillator to clock the device.
When the HSPLL Oscillator mode is selected, the
device  is k ept in  Res et for  an add itiona l 2 ms, follow ing
the HS mode OST delay, so the PLL can lock to the
inco mi ng cl ock  frequ enc y.
There is  a delay  of  5 to 10 μs, following POR, while the
controller becomes ready to execute instructions. This
delay runs concurrently with any other delays. This
may be  the  onl y  delay that oc cu rs  wh en  any  o f the  EC ,
RC or INTIO modes are used as the primary clock
source.
TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE  
OSC Mode OSC1 Pin OSC2 Pin
RC, INTIO1 Floating, external resistor 
should pull high At logic low (clock/4 output)
RCIO, INTIO2 Floating, external resistor 
should pull high Configu red as PORTA, bit 6
ECIO Floating, pulled by external clock Configured as PORTA, bit 6
EC Floating, pulled by external clock At logic low (clock/4 output)
LP, XT, and HS Feedback  inve rter dis ab led  at 
quiescent voltage level Feedback inverter disabled at 
quiescent voltage level
Note: See Table 4-1 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

3.0 POWER MANAGED MODES

The PIC18F2X20 and PIC18F4X20 devices offer a total

of six operating modes for more efficient power

management (see Table 3-1). These operating modes

provide a variety of options for selective power

conservation in applications where resources may be

limited (i.e., battery-powered devices).

There are three categories of power managed modes:

• Sleep mode

• Idle mo des

• Run modes

These categories define which portions of the device

are clo cked and some times , what sp eed. The Ru n and

Idle modes may use any of the three available clock

sources (primary, secondary or INTOSC multiplexer);

the Sleep mode does not use a clock source.

The clock switching feature offered in other PIC18

devices (i.e., using the Timer1 oscillator in place of the

primary oscillator) and the Sleep mode offered by all

PICmicro® devices (where all system clocks are

stopped) are both offered in the PIC18F2X20/4X20

devices (SEC_RUN and Sleep modes, respectively).

However, additional power managed modes are avail-

able tha t allow t he user grea ter flexib ility in d eterminin g

what portions of the device are operating. The power

managed modes are event driven; that is, some

specific event must occur for the device to enter or

(more particularly) exit these operating modes.

For PIC18F2X20/4X20 devices, the power managed

modes are invoked by using the existing SLEEP

instruction. All modes exit to PRI_RUN mode when trig-

gered by an interrupt, a Reset, or a WDT time-out

(PRI_RUN mode is the normal full power execution

mode; the C PU and peri phe rals are cl ock ed by the p ri-

mary oscillator source). In addition, power managed

Run modes may also exit to Sleep mode or their

corresponding Idle mode.

3.1 Selecting Power Managed Modes

Selecting a power managed mode requires deciding if

the CPU is to be clocked or not and selecting a clock

source. The I D LEN bi t co ntrols CPU clo cking w hil e th e

SC1:SCS0 bits select a clock source. The individual

modes, bit settings, clock sources and affected

modules are summarized in Table 3-1.

3.1.1 CLOCK SOURCES

The clock source is selected by setting the SCS bits of

the OSCCON register. Three clock sources are avail-

able for use in power manag ed Idle modes: the prim ary

clock (as configured in Configuration Register 1H), the

secondary clock (Timer1 oscillator) and the internal

oscillator block. The secondary and internal oscillator

block sources are available for the power managed

modes (PRI_RUN mode is the normal full power exe-

cution mode; the CPU and peripherals are clocked by

the primary oscillator source).

TABLE 3-1: POWER MANAGED MODES

Mode

OSCCON Bits Module Clocking

Available Clock and Oscillator Source

IDLEN

<7> SCS1:SCS0

<1:0> CPU Peripherals

Sleep 000 Off Off None – All clock s are disabled

PRI_RUN 000Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC, INTRC(1).

This is the normal full power execution mode.

SEC_RUN 001Clocke d Clocked Secondary – Timer1 Os ci lla tor

RC_RUN 01xClocked Clocked Internal Oscillator Block(1)

PRI_IDLE 100 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC

SEC_IDLE 101 Off Clocked Secon dary – Timer1 Oscillator

RC_IDLE 11x Off Clocked Internal Oscillator Block(1)

Note 1: Includes INTOSC and INTOSC postscaler, as well as the INTRC source.

PIC18F2220/2320/4220/4320

3.1.2 ENTERING POWER MANAGED

MODES

In general, entry, exit and switching between power

managed clock sources requires clock source

switching. In each case, the sequence of events is the

same.

Any change in the power managed mode begins with

loading the OSCCON register and executing a SLEEP

instruction. The SCS1:SCS0 bits select one of three

power managed clock sources; the primary clock (as

defined in Configuration Register 1H), the secondary

clock (the Timer1 oscillator) and the internal oscillator

block (use d in RC modes) . Modi fyi ng th e SCS bi ts will

have no effect until a SLEEP instruction is executed.

Entry to the power managed mode is triggered by the

execution of a SLEEP instruction.

Figure 3-5 shows how the system is clocked while

switching from the primary clock to the Timer1 oscilla-

tor. When the SLEEP instruction is executed, clocks to

the device are stopped at the beginning of the next

instruction cycle. Eight clock cycles from the new clock

source are counted to synchronize with the new clock

source. After eight clock pulses from the new clock

source are counted, clocks from the new clock source

resume clocking the system. The actual length of the

paus e is betwe en eight and nine cl ock peri ods from th e

new clock source. This ensures that the new clock

source is stab le a nd th at its puls e w idth will no t be l es s

than the shortest pulse width of the two clock sources.

Three bi t s in dicat e the current cloc k so urce: OSTS an d

IOFS in the OSCCON register and T1RUN in the

T1CON re gister. Only one of the se bit s will be se t while

in a pow er managed mode other tha n PRI_RUN. Whe n

the OSTS bit is set, the primary clock is providing the

system clock. When the IOFS bit is set, the INTOSC

output is providing a stable 8 MHz clock source and is

prov iding the system cl ock. W hen the T1 RUN bit is set,

the Timer1 oscillator is providing the system clock. If

none of these bits are set, then either the INTRC clock

sour ce is cl oc ki ng t he sy stem or the INTOSC so urc e i s

not yet stable.

If the internal oscillator block is configured as the pri-

mary clock source in Configuration Register 1H, then

both the OSTS and IOFS bits may be set when in

PRI_RUN or PRI_IDLE modes. This indicates that the

primary clock (INTOSC output) is generating a stable

8 MHz output. Entering a power managed RC mode

(same frequency) would clear the OSTS bit.

3.1. 3 MULTIPLE SLEEP C OMMANDS

The power managed mode that is invoked with the

SLEEP instruction is determined by the settings of the

IDLEN and SCS bits at the time the instruction is exe-

cuted. If another SLEEP instruction is executed, the

device will enter the power managed mode specifie d by

these same bits at that time. If the bits have changed,

the device will enter the new power managed mode

specified by the new bit settings.

3.1.4 COMPARISONS BETWEEN RUN

AND IDLE MODES

Clock source selection for the Run modes is identical to

the corresponding Idle modes. When a SLEEP instruc-

tion is executed, the SCS bits in the OSCCON register

are used to switch to a different clock source. As a

result, i f the re i s a ch ange of cloc k s ource at the time a

SLEEP instruction is executed, a clock switch will occu r.

In Idle modes, the CPU is not clocked and is not run-

ning. In Run modes, the C PU i s cl oc ked a nd ex ecuting

code. This difference modifies the operation of the

WDT when it times ou t. I n Id le mo des , a WDT tim e-o ut

results in a wake from power managed modes. In Run

modes, a WDT time-out results in a WDT Reset (see

Table 3-2).

During a wake-up from an Idle mode, the CPU starts

executing code by entering the corresponding Run

mode until the primary clock becomes ready. When the

primary clock be comes ready, the clock source is auto-

matically switched to the primary clock. The IDLEN and

SCS bits are unchanged during and after the wake-up.

Figur e 3-2 shows how the system is clocked during the

clock source switch. The example assumes the device

was in SEC_IDLE or SEC_RUN mode when a wake is

triggered (the primary clock was configured in HSPLL

mode).

Note 1: Cautio n should be used when m odifying a

single IRCF bit. If VDD is less than 3V, it is

possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

2: Executing a SLEEP instruction does not

necessarily place the device into Sleep

mode; executing a SLEEP instruction is

simply a tri gger to place th e controller in to

a power managed mode selected by the

OSCCON register, one of which is Sleep

mode.

PIC18F2220/2320/4220/4320

3.2 Sleep Mode

The power managed Sleep mode in the PIC18F2X20/

4X20 devices is identical to that offered in all other

PICmicro controllers. It is entered by clearing the

IDLEN and SCS1:SCS0 bits (this is the Reset state)

and executing the SLEEP instr uctio n. T his shuts down

the primary oscillator and the OSTS bit is cleared (see

Figure 3-1).

When a wake even t occurs i n Sleep mo de (by int errupt,

Reset or WDT time-o ut), the syst em will not be c locked

until the primary clock source becomes ready (see

Figure 3-2), or it will be clocked from the internal

oscillator block if either the Two-Speed Start-up or the

Fail-Safe Clock Moni tor are enabled (see Section 23.0

“Special Features of the CPU”). In either case, the

OSTS bit is set whe n the primary c loc k is pro vi din g th e

system clocks. The IDLEN and SCS bits are not

affec ted by the wake-up.

3.3 Idle Modes

The IDLEN bit allows the controller’s CPU to be

selectively shut down while the peripherals continue to

operat e. Clearing ID LEN allows the C PU to be cl ocked.

Setting IDLEN disables clocks to the CPU, effectively

stopping program execution (see Register 2-2). The

peripherals continue to be clocked regardless of the

setting of the IDLEN bit.

There is o ne e xc ept ion to ho w the IDLEN bi t fun cti ons.

When all the low-power OSCCON bits are cleared

(IDLEN:SCS1:SCS0 = 000), the device enters Sleep

mode upon the execution of the SLEEP instruction. This

is both the Rese t state of the OSCCON reg ister and the

setting that selects Sleep mode. This maintains com-

patibility with other PICmicro devices that do not offer

power managed modes.

If the Idle Enab le bit, IDLEN (OSCCON<7>), i s set to a

‘1’ when a SLEEP instruction is executed, the

peripherals will be clocked from the clock source

select ed using the SCS1:SCS0 bit s; however, the CPU

will not be clocked. Since the CPU is not executing

instructions, the only exits from any of the Idle modes

are by interrupt, WDT time-out or a Reset.

When a wake-up event occurs, CPU execution is

delayed approxim ately 10 μs while it becom es ready to

execute code. When the CPU begins executing code,

it is clocked by the same clock source as was selected

in the power managed mode (i.e., when waking from

RC_IDLE mode, the internal oscillator block will clock

the CPU an d periphe rals until the primary c lock so urce

becomes ready – this is essentially RC_RUN mode).

This continues until the primary clock source becomes

ready. When the primary clock becomes ready, the

OSTS bit is set and the system clock source is

switched to the primary clock (see Figure 3-4). The

IDLEN and SCS bits are not affected by the wake-up.

While in any Idle mode or the Sleep mode, a WDT time-out

will r esult in a W DT wake-u p t o full pow er op eratio n.

TABLE 3-2: COMPARISON BETWEEN POWER MANAGED MODES

Power

Managed

Mode CPU is clocked by ... WDT time-out

causes a ... Peripherals are

clocked by ...

Clock during wake-up

(while primary becomes

ready)

Sleep Not clocked (not running) Wake-up Not clocked None or INTOSC multiplexer if

Two-Speed Start-up or

Fail-Safe Clock Monitor are

enabled.

Any Idle mode Not clocked (not running) Wake-up Primary, Secondary or

INTOSC multiplexer Unchanged from Idle mode

(CPU operates as in

corresponding Run mode).

Any Run mode Secondary or INTOSC

multiplexer Reset Secondary or INTOSC

multiplexer Unchanged from Run mode.

PIC18F2220/2320/4220/4320

FIGURE 3-1: TIMING TRANSITION FOR ENTRY TO SLEEP MODE

FIGURE 3-2: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL)

Q4Q3Q2

OSC1

Peripheral

Sleep

Program

Q1Q1

Counter

Clock

CPU

Clock

PC + 2PC

Q3 Q4 Q1 Q2

OSC1

Peripheral

Program PC

PLL Clock

Q3 Q4

Output

CPU Clock

Q1 Q2 Q3 Q4 Q1 Q2

Clock

Counter PC + 8

PC + 6

Q1 Q2 Q3 Q4

Wake-up Event

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

TOST(1) TPLL(1)

OSTS bit Set

PC + 4

PC + 2

PIC18F2220/2320/4220/4320

3.3.1 PRI_IDLE MODE

This mode is unique among the three Low-Power Idle

modes in that it does not disable the primary system

clock. For timing sensitive applications, this allows for

the fastest resumption of device operation, with its

more accurate primary clock source, since the clock

source does not have to “warm up” or transition from

another oscillator.

PRI_IDLE mode is entered by setting the IDLEN bit,

clearing the SCS bits and executing a SLEEP instruc-

tion. Although the CPU is disabled, the peripherals

continue to be clocked from the primary clock source

specified in Configuration Register 1H. The OSTS bit

remains set in PRI_IDLE mode (see Figure 3-3).

When a wake-up event occurs, the CPU is clocked

from the primary clock source. A delay of approxi-

mately 10 μs is required between the wake-up event

and when code execution starts. This is required to

allow the CPU to become ready to execute instructions.

After the wake-up, the OSTS bit remains set. The

IDLEN and SCS bits are not affected by the wake-up

(see Figure 3-4).

FIGURE 3-3: TRANSITION TIMING TO PRI_IDLE MODE

FIGURE 3-4: TRANSITION TIMING FOR WAKE FROM PRI_IDLE MODE

Peripheral

Program PC PC + 2

OSC1

Q3 Q4 Q1

CPU Clock

Clock

Counter

OSC1

Peripheral

Program PC

CPU Clock

PC + 2

Q1 Q3 Q4

Clock

Counter

Wake-up Event

CPU Start-up Delay

PIC18F2220/2320/4220/4320

3.3.2 SEC_ID LE MODE

In SEC_IDLE mode, the CPU is disabled but the

peripherals continue to be clocked from the Timer1

oscillator. This mode is entered by setting the IDLEN

bit, modifying to SCS1:SCS0 = 01 and executing a

SLEEP instruction. When the clock source is switched

to the Timer1 oscillator (see Figure 3-5), the primary

oscill ator is shut do wn, th e OSTS bit is cleared and the

T1RUN bit is set.

When a wake-up event occurs, the peripherals continue

to be clocked from the Timer1 oscillator. After a 10 μs

delay following the wake-up event, the CPU begins exe-

cuting code, being clocked by the Timer1 oscillator . The

microcontroller operates in SEC_RUN mode until the

primary clo ck becomes ready. When the primary clock

becomes ready , a clock switch back to the primary clock

occurs (see Fig ure 3-6). When the clock switch is com-

plete, th e T1RUN bit is cleared, th e OSTS bit i s set and

the primary clock is providing the system clock. The

IDLEN and SCS bits are not affected by the wake-up;

the Timer1 oscillator continues to run.

FIGURE 3-5: TIMING TRANSITION FOR ENTRY TO SEC_IDLE MODE

FIGURE 3-6: TIMING TRA NSITION FOR WAKE FROM SEC_RUN MODE (HSPLL)

Note: The Timer1 oscillator should already be

running prior to entering SEC_IDLE mode.

If the T1OSCEN bit is not set when try-

ing to set the SCS0 bit (OSCCON<0>),

the write to SCS0 will not occur. If the

Timer1 oscillator is enabled but not yet

running, peripheral clocks will be delayed

unti l th e os cilla tor has s tarte d; i n su ch sit -

uations, initial oscillator operation is far

from stable and unpredictable operation

may re sult.

Q4Q3Q2

OSC1

Peripheral

Program

T1OSI

Counter

Clock

CPU

Clock

PC + 2PC

12345678

Clock Transition

Q1 Q3 Q4

OSC1

Peripheral

Program PC PC + 2

T1OSI

PLL Clock

PC + 6

Output

Q3 Q4 Q1

CPU Clock

PC + 4

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

Wake-up from Interrupt Event

TOST(1) TPLL(1)

12345678

Clock Transition

OSTS bit Set

PIC18F2220/2320/4220/4320

3.3.3 RC_IDLE MODE

In RC_I DL E m od e, t he C PU is d is abl ed but th e p erip h-

erals co nti nue to b e c loc ke d fro m the internal oscilla tor

block using the INTOSC multiplexer. This mode allows

for cont rollable power c onservation during Idle periods .

This mode is entered by setting the IDLEN bit, setting

SCS1 (SCS0 is ignored) and executing a SLEEP

instruction. The INTOSC multiplexer may be used to

select a higher clock frequency by modifying the IRCF

bits be for e ex ecut in g the SLEEP instruction. When the

clock source is switched to the INTOSC multiplexer

(see Figure 3-7), the primary oscillator is shut down

and the OSTS bit is cleared.

If the IRCF bits are set to a non-zero value (thus

enabling the INTOSC output), the IOFS bit becomes

set after the INTOSC output becomes stable, in about

1 ms. Clocks to the peripherals continue while the

INTOSC source stabilizes. If the IRCF bits were previ-

ously at a non -zero value before the SLEEP instruction

was executed and the INTOSC source was already

stable, the IOFS bit will remain set. If the IRCF bits are

all clear, the INTOSC output is not enabled and the

IOFS bit will remain clear; there will be no indication of

the cu rrent clock source.

When a wake-up event occurs, the peripherals con-

tinue to be clocked from the INTOSC multiplexer. After

a 10 μs delay following the wake-up event, the CPU

begins executing code, being clocked by the INTOSC

multiplexer. The microcontroller operates in RC_RUN

mode unt il the prima ry clock becomes read y. When the

primary clock becomes ready, a clock switch back to

the primary clock occurs (see Figure 3-8). When the

clock switch is complete, the IOFS bit is cleared, the

OSTS bit is set and the primary clock is providing the

system c lock. The ID LEN and SCS bit s are not a ffected

by the w ake-up . The INTR C source will c ontinu e to run

if either the WDT or the Fail-Safe Clock Monitor is

enabled.

FIGURE 3-7: TIMING TRANSITION TO RC_IDLE MODE

FIGURE 3-8: TIMING TRANSITION FOR W AKE FROM RC_RUN MODE (RC_RUN TO PRI_RUN)

Q4Q3Q2

OSC1

Peripheral

Program

INTRC

Counter

Clock

CPU

Clock

PC + 2PC

12345678

Clock Transition

Q1 Q3 Q4

OSC1

Peripheral

Program PC PC + 2

INTOSC

PLL Clock

PC + 6

Output

Q3 Q4 Q1

CPU Clock

PC + 4

Clock

Counter

Q2 Q2 Q3

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

Wake-up from Interrupt Event

TOST(1) TPLL(1)

12345678

Clock Transition

OSTS bit Set

Multiplexer

PIC18F2220/2320/4220/4320

3.4 Run Modes

If the IDLEN bit is clear when a SLEEP instruction is

executed, the CPU and peripherals are both clocked

from the source selected using the SCS1:SCS0 bits.

While t hese operating mo des may not af ford the power

conservation of Idle or Sleep modes, they do allow the

device to continue executing instructions by using a

lower frequency clock source. RC_RUN mode also

offers the possibility of executing code at a frequency

great er than the primary cloc k .

Wake-up from a power managed Run mode can be

triggered by an interrupt, or any Reset, to return to full

power o pera tio n. As the CPU i s exec uti ng c od e in Ru n

modes, several additional exits from Run modes are

possib le. They inclu de exit to Sleep m ode, exit to a cor-

respo ndin g Idl e mode , and exit by exec utin g a RESET

instruction. While the device is in any of the power

managed Run modes, a WDT time-out will result in a

WDT R eset.

3.4.1 PRI_RUN MODE

The PRI_RUN mode is the normal full power execution

mode. If the SLEEP instruction is never executed, the

microc ontroller opera tes in this mode (a SLEEP instruc-

tion is executed to enter all other power managed

modes). All other power managed modes exit to

PRI_RUN mode when an interrupt or WDT time-out

occur.

There is no entry to PRI_RUN mode. The OSTS bit is

set. The IOFS bit may be set if the internal oscillator

block is the primary clock source (see Section 2.7.1

“Oscillator Control Register”).

3.4.2 SEC_RUN MODE

The SEC_RUN mode is the compatible mode to the

“clock switching” feature offered in other PIC18

devices. In this mode, the CPU and peripherals are

clock ed from the T imer1 os cillator. This gives users the

option of lower power consumption while still using a

high accuracy clock source.

SEC_RUN mode is entered by clearing the IDLEN bit,

setting SCS1:SCS0 = 01 and executing a SLEEP

instr ucti on. Th e syste m clock source is switched to the

Timer1 oscillator (see Figure 3-9), the primary oscilla-

tor is shut down, the T1RUN bit (T1CON<6>) is set and

the OSTS bit is cleared.

When a wake-up event occurs, the peripherals and

CPU conti nue to b e clocked f rom the Timer1 oscilla tor

while the primary clock is started. When the primary

clock becomes ready , a clock switch back to the primary

clock occurs (see Figure 3-6). When the clock switch is

complete, the T1RUN bit is cleared, the OSTS bit is set

and the primary clock is providing the system clock. The

IDLEN and SCS bits are not affected by the wake-up;

the Timer1 oscillator continues to run.

Firmware can force an exit from SEC_RUN mode. By

clearing the T1OSCEN bit (T1CON<3>), an exit from

SEC_RUN back to normal full power operation is trig-

gered. The Timer1 oscillator will continue to run and

provide the system clock even though the T1OSCEN bit

is cleared. The primary clock is started. When the pri-

mary clock be comes ready, a clock switch back to th e

primary clock occ urs (see Figure 3-6). When the clock

switch is complete, the Timer1 oscillator is disabled, the

T1RUN bit is cleared, the OSTS bit is set and the pri-

mary clock is providing the system clock. The IDLEN

and SCS bits are not affected by the wake-up.

FIGURE 3-9: TIMING TRANSITION FOR ENTRY TO SEC_RUN MODE

Note: The Timer1 oscillator should already be

running pri or to entering SEC_RUN mod e.

If the T1OSCEN bit is not set when try-

ing to set the SCS0 bit, the write to

SCS0 will not occur . If the T imer1 oscill a-

tor is ena ble d, b ut no t ye t running, system

clocks will be delayed until the oscillator

has st arte d; in such sit uation s, initi al osci l-

lator operation is far from stable and

unpredictable operation may result.

Q4Q3Q2

OSC1

Peripheral

Program

T1OSI

Counter

Clock

CPU

Clock

PC + 2PC

12345678

Clock Transition

Q4Q3

Q2 Q1 Q3

PC + 2

PIC18F2220/2320/4220/4320

3.4.3 RC_RUN MODE

In RC_RUN mode, the CPU and peripherals are

clocked from the internal oscillator block using the

INTOSC multiplexer and the primary clock is shut

down. When using the INTRC source, this mode pro-

vides the best power conservation of all the Run modes

while still executin g code. It wo rks well for use r appl ica-

tions which are not highly timing sensitive or do not

require high-speed clocks at all times.

If the primary clock source is the internal oscillator

block (ei ther of the INTIO1 or INTIO 2 oscill ators), there

are no distinguishable differences between PRI_RUN

and RC_RUN modes during execution. However, a

clock switch delay will occur during entry to, and exit

from, RC_RUN mode. Therefore, if the primary clock

source is the internal oscillator block, the use of

RC_RUN mode is not recommended.

This m ode i s e nte red by c lea rin g th e ID LEN b it, se ttin g

SCS1 (SCS0 is ignored) and executing a SLEEP

instruction. The IRCF bits may select the clock

frequency before the SLEEP instruction is executed.

When the clock source is switched to the INTOSC

multiplexer (see Figure 3-10), the primary oscillator is

shut down and the OSTS bit is cleared.

The IRCF bits may be modified at any time to immedi-

ately change the system clock speed. Executing a

SLEEP instruction is not required to select a new clock

frequency from the INTOSC multiplexer.

If the IRCF bits are all clear, the INTOSC output is not

enabled and the IOFS bit wi ll remain clear; t here will b e

no indication of the current clock source. The INTRC

source is providing the system clocks.

If the IRCF bits are changed from all clear (thus

enabling the INTOSC output), the IOFS bit becomes

set after the INTOSC output bec omes st able. Cloc ks to

the system continue while the INTOSC source

stabilizes in approximately 1 ms.

If the IRCF bits were previously at a non-zero value

before the SLEEP instruction was executed and the

INTOSC source was already stable, the IOFS bit will

remain set.

When a wake-up ev ent occurs, t he system continues to

be clocked from the INTOSC multiplexer while the pri-

mary cl ock is st arted. When the p rimary clock becomes

ready, a clock switch to the primary clock occurs (see

Figure 3-8). When the clock switch is complete, the

IOFS bit is c leared, the O STS bit is se t and the prim ary

clock is providing the system clock. The IDLEN and

SCS bits are not affected by the wake-up. The INTRC

source will continue to run if either the WDT or the

Fail- Safe Cloc k Mo nito r is enab led .

FIGURE 3-10: TIMING TRA NSITION TO RC_RUN MODE

Note: Cau tio n s hou ld be u se d w he n m odi fy ing a

single IRCF bit. If VDD is less than 3V, it is

possible to select a higher clock speed

than is supported by the low VDD.

Improper device operation may result if

the VDD/FOSC specifications are violated.

Q3Q2Q1

OSC1

Peripheral

Program

INTRC

Counter

Clock

CPU

Clock

PC + 2PC

12345678

Clock Transition

Q3Q2Q1 Q4 Q2Q1 Q3

PC + 4

PIC18F2220/2320/4220/4320

3.4.4 EXIT TO IDLE MODE

An exit from a power managed Run mode to its corre-

sponding Idle mode is executed by setting the IDLEN

bit and executing a SLEEP instruction. The CPU is

halted at the beginning of the instruction following the

SLEEP instruction. There are no changes to any of the

clock source status bits (OSTS, IOFS or T1RUN).

While th e CPU is halte d, the periphe rals c ontin ue to b e

clocked from the previously selected clock source.

3.4.5 EXIT TO SLEEP MODE

An exit from a power managed Run mode to Sleep

mode is executed by clearing the IDLEN and

SCS1:SCS0 bits and executing a SLEEP instruction.

The code is no different than the method used to invoke

Sleep mode from the normal operating (full power)

mode.

The primary clock and internal oscillator block are dis-

abled. The INTRC will continue to operate if the WDT

is enabled. The Timer1 oscillator will continue to run, if

enabled , in the T1CO N registe r. All clock so urce st atu s

bits are cleared (OSTS, IOFS and T1RUN).

3.5 Wake-up From Power Managed

Modes

An exit from any of the power managed modes is trig-

gered by a n interrupt, a Reset, or a WDT ti me-out. Thi s

section discusses the triggers that cause exits from

power managed modes. The clocking subsystem

actions are discussed in each of the power managed

modes (see Section 3.2 “Sleep Mode” through

Section 3.4 “Run Modes”).

Device behavior during Low-Power mode exits is

summa riz ed in Table 3-3.

3.5. 1 EXIT BY INTERRUPT

Any of the available interrupt sources can cause the

device to exit a power managed mode and resume full

power operation. To enable this functionality, an inter-

rupt sou r ce mu st be e nab led by setti ng it s en able bit in

one of the IN TCON or PIE registers. Th e exit sequenc e

is initiated when the corresponding interrupt flag bit is

set. On all exits from Lower Power mode by interrupt,

code execution branches to the interrupt vector if the

GIE/GIEH bit (INTCON<7>) is set. Otherwise, code

execution continues or resumes without branching

(see Section 9.0 “Interrupts”).

Note: If application code is timing sensitive, it

should wait for the OSTS bit to become set

before continuing. Use the interval during

the low-power exit sequence (before

OSTS is set) to perform timing insensitive

“housekeeping” tasks.

PIC18F2220/2320/4220/4320

TABLE 3-3: ACTIVITY AND EXIT DELAY ON WAKE-UP FROM SLEEP MODE OR

ANY IDLE MODE (BY CLOCK SOURCES)

Clock in Power

Managed Mode Primary Syste m

Clock

Power

Managed

Mode Exit

Delay

Clock Ready

Status Bit

(OSCCON)

Activity During Wake-up from

Power Managed Mode

Exit by Interrupt Exit by Reset

Primary System

Clock

(PRI_IDLE mode)

LP, XT, HS

5-10 μs(5) OSTS CPU and peripherals

clocke d by p rimary cl ock

and executing

instructions.

Not clocked or

Two-Speed Start-up

(if enabled)(3).

HSPLL

EC, RC, INTRC(1) —

INTOSC(2) IOFS

T1OSC or

INTRC(1)

LP, XT, HS OST OSTS CPU and peripherals

clocked by selected

power managed mode

clock and executing

instruct ion s until primar y

clock source becomes

ready.

HSPLL OST + 2 ms

EC, RC, INTRC(1) 5-10 μs(5) —

INTOSC(2) 1ms

(4) IOFS

INTOSC(2)

LP, XT, HS OST OSTS

HSPLL OST + 2 ms

EC, RC, INTRC(1) 5-10 μs(5) —

INTOSC(2) None IOFS

Sleep mode

LP, XT, HS OST OSTS Not clocked or

Two-Speed Start-up (if

enabled) until primary

clock source becomes

ready(3).

HSPLL OST + 2 ms

EC, RC, INTRC(1) 5-10 μs(5) —

INTOSC(2) 1ms

(4) IOFS

Note 1: In this instance, refers specifically to the INTRC clock source.

2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies.

3: Two-Speed Start-up is covered in greater detail in Section 23 .3 “Two-Speed Start-up”.

4: Execution continues during the INTOSC stabilization period.

5: Required delay when waking from Sleep and all Idle modes. This delay runs concurrently with any other

required delays (see Section 3.3 “Idle Modes”).

PIC18F2220/2320/4220/4320

3.5. 2 EXIT BY RESET

Normally, the device is held in Reset by the Oscillator

St art-up Timer (O ST) until th e primary clo ck (defined in

Configuration Register 1H) becomes ready. At that

time, the OSTS bit is set and the device begins

executing code.

Code execution can begin before the primary clock

becomes ready. If either the Two-Speed Start-up (see

Section 23.3 “Two-Speed Start-up”) or Fail-Safe

Clock Monitor (see Section 23.4 “Fail-Safe Clock

Monitor”) are enabled in Configuration Register 1H,

the device may begin execution as soon as the Reset

source has cleared. Execution is clocked by the

INTOSC multiplexer driven by the internal oscillator

block. Since the OSCCON regist er is cle ared follow ing

all Resets, the INTRC clock source is selected. A higher

speed clock may be selected by modifying the IRCF bits

in the OSCCON register. Execution is clocked by the

internal oscillator block until either the primary clock

becomes rea dy, or a po wer managed mode is ente red

before the primary clock becomes ready; the primary

clock is then shut down.

3.5.3 EXIT BY WDT TIME-OUT

A WDT time-out will cause different actions depending

on which power managed mode the device is in when

the time-out occurs.

If th e dev ice i s not ex ec uting code (all I dle mode s and

Sleep mo de), the time-out will resu lt i n a wak e-u p fro m

the power managed mode (see Section 3.2 “Sleep

Mode” through Section 3.4 “Run Modes”).

If the device is executing code (all Run modes), the

time-out will result in a WDT Reset (see Section 23.2

“Watchdog Timer (WDT)”).

The WDT timer and postscaler are cleared by execut-

ing a SLEEP or CLRWDT instruction, the loss of a

currently selected clock source (if the Fail-Safe Clock

Monitor is enabled) and modifying the IRCF bits in the

OSCCON register if the internal oscillator block is the

system clock source.

3.5.4 E XIT WITHOUT AN OSCILLATOR

START-UP DELAY

Certain exits from power managed modes do not

invoke the OST at all. These are:

• PRI_IDLE mode, where the primary clock source

is not stopped; and

• the primary clock source is not any of the LP, XT,

HS or HSPLL modes.

In these cases, the primary clock source either does

not require an oscillator start-up delay, since it is

already running (PRI_IDLE), or normally does not

require an oscillator start-up delay (RC, EC and INTIO

Oscillator modes).

However, a fixed delay (appro xi ma tel y 10 μs) f ollowing

the wake-up event is required when leaving Sleep and

Idle modes. This delay is required for the CPU to pre-

pare for execution. Instruction execution resumes on

the first clock cycle following this delay.

3.6 INTOSC Frequency Drift

The factory calibrates the internal oscillator block

output (INTOSC) for 8 MHz. However, this frequency

may drift as VDD or temperature changes, which can

affect the controller operation in a variety of ways.

It is possible to adjust the INTOSC frequency by modi-

fying the value in the OSCTUNE register. This has the

side effect that the INTRC clock source frequency is

also affected. However, the features that use the

INTRC source often do not require an exact frequency.

These features i nclude the Fail-Safe Clock M onitor, the

Watchdog Timer and the RC_RUN/RC_IDLE modes

when the INTRC clock source is selected.

Being able to adjust the INTOSC requires knowing

when an adjustment is required, in which direction it

should be made and in some cases, how large a

change is needed. Three examples are shown but

other techniques may be used .

PIC18F2220/2320/4220/4320

3.6.1 EXAMPLE – USART

An adjustment may be indicated when the USART

begins to generate framing errors or receives data

with errors while in Asynchronous mode. Framing

errors indicate that the system clock frequency is too

high – try decrementing the value in the OSCTUNE

data may suggest that the system clock speed is too

low – increment OSCTUNE.

3.6.2 EXAMPLE – TIMERS

This technique compares system clock speed to some

reference clock. Two timers may be used; one timer is

clocked by the peripheral clock, while the other is

clocked by a fixed reference source, such as the

Tim er1 oscillator.

Both timers are cleared but the timer clocked by the ref-

erence gen erates interr upts. Whe n an interrupt occ urs,

the internally clocked timer is read and both timers are

cleared. If the internally clocked timer value is greater

than expected, then the internal oscillator block is

running too fast – decrement OSCTUNE.

3.6.3 EXAMPLE – CCP IN CAPTURE

MODE

A CCP module can use free running Timer1 (or

Timer 3), cl oc ke d by th e int ernal oscilla tor bl ock and an

external event with a known period (i.e., AC power fre-

quency). The time of the first event is captured in the

CCPRxH:CCPRxL registers and is recorded for use

later. When the second event causes a capture, the

time of the firs t eve nt is su btra cte d fro m the tim e of th e

second event. Since the period of the external event is

known, the time difference between events can be

calculated.

If the measured time is much greater than the

calculated time, the internal oscillator block is running

too fast – dec rement OSCTUNE. If the me asured ti me

is much less than the calculated time, the internal

oscillator block is running too slow – increment

OSCTUNE.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

4.0 RESET

The PIC18F2X20/4X20 devices differentiate between

various kinds of Reset:

a) Power-on Reset (POR)

b) MCLR Reset while executing instructions

c) MCLR Reset when not executing instructions

d) Watchdog Ti mer (WDT) Reset (during

execution)

e) Programmable Brown-out Reset (BOR)

f) RESET Inst ruction

g) Stack Full Reset

h) Stack Underflow Reset

Most registers are unaffected by a Reset. Their status

is unknown on POR and unchanged by all other

Resets. The other registers are forced to a “Reset

state” depending on the type of Reset that occurred.

Most registers are not affected by a WDT wake-up

since this is viewed as the resumption of normal oper-

ation. Status bits from the RCON register, RI, TO, PD,

POR and BOR , are set or cleared differently in different

Reset situations as indicated in Table 4-2. These bits

are used in software to determine the nature of the

Reset. See Table 4-3 for a full description of the Reset

state s of all regi sters.

A simp lified block di agram o f the on -chip R eset cir cuit

is sh own i n Figure 4-1.

The enhanced MCU devices have a MCLR noise filter

in the MCLR Reset path. The filter will detect and

ignore small pulses.

The MC LR pin is not driven low by any internal Resets,

inc luding the WDT.

The MC LR input provid ed by the MCLR p in ca n be dis -

abled w ith the MC L RE bit i n C on fig urat ion R egi ste r 3H

(CONFIG3H<7>). See Section 23.1 “Configuration

Bits” for more information.

FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT

External Reset

MCLR

VDD

OSC1

WDT

Time-out

VDD Rise

Detect

OST/PWRT

INTRC

(1)

POR Pulse

OST

10-bit Ripple Counter

PWRT

Chip_Reset

11- bit Ripple Counter

Enable OST(2)

Enable PWRT

Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin.

2: See Table 4-1 for time-out situations.

Brown-out

Reset BOREN

RESET

Instruction

Stack

Pointer Stack Full/Underflow Reset

Sleep

( )_IDLE

1024 Cycles

65.5 ms

32 μs

MCLRE

PIC18F2220/2320/4220/4320
DS39599D-page 44 © 2006 Microchip Technology Inc.
4.1 Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip when
VDD rise is d etected. To ta ke advant age of t he POR cir-
cuitry, just tie the MCLR pin through a resistor (1k to
10 kΩ) to VDD. This will eliminate external RC compo-
nents usually needed to create a Power-on Reset
delay. A minimum rise rate for VDD is specified
(param eter D004) . For a  slow rise t ime, see  Figure 4-2.
When the device start s  normal  operation (i.e ., ex its the
Reset condition), device operating parameters (volt-
age, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
FIGURE 4-2: EXTERN AL POWER-ON 
RESET CIRCUIT (FOR 
SLOW VDD POWER-UP)        
4.2 Power-up Timer (PWRT)
The Power-up Timer (PWRT) of the PIC18F2X20/4X20
devices is an 11-bit counter, which uses the INTRC
source as the clock input. This yields a count of
2048 x 32 μs = 65.6 ms. While the PWRT is counting,
the device is held in Reset.
The powe r-up tim e de lay  depe nd s on the  INTRC  cl oc k
and will vary from chip-to-chip due to temperature and
process variation. See DC parameter #33 for details.
The PWRT is enabled by clearing configuration bit,
PWRTEN.
4.3 Oscillator Start-up Timer (OST)
The Oscillator Start-up Timer (OST) provides a 1024
oscillator cycle (from OSC1 input) delay after the
PWR T delay is  over (parame ter #33). This  ensures th at
the crystal oscillator or resonator has started and
stabilized.
The OST time-out is invoked only for XT, LP, HS and
HSPLL modes and only on Power-on Reset, or on exit
from most pow er ma nag ed mo des .
4.4 PLL Lock Time-out
With the PLL enabled in its PLL mode, the time-out
sequence following a Power-on Reset is slightly
different from other oscillator modes. A portion of the
Power-up Timer is used to provi de a fix ed time-ou t that
is suf ficie nt for t he PLL to l ock to the  main  oscillator f re-
quency. This PLL lock time-out (TPLL) is typically 2 ms
and follows the oscillator start-up time-out.
4.5 Brown-out Reset (BOR)
A configuration bit, BOREN, can disable (if clear/
programmed) or enable (if set) the Brown-out Reset cir-
cuitry. If VDD falls below VBOR (parameter D005) for
greate r than TBOR (p arameter #35 ), the brown-ou t situ-
ation will reset the chip. A Reset may not occur if VDD
falls below VBOR for less than TBOR. The chip will
remain in Brown-out Reset until VDD rises above  VBOR.
If the Powe r-up T imer is enabled, i t will be invo ked after
VDD rises above VBOR; it then will keep the chip in
Reset for an additional time delay TPWRT (parameter
#33). If VDD drops below VBOR while the Power-up
Timer  is running, th e c hi p w i ll  go  back into  a Bro w n-o ut
Reset and the Power-up Timer will be initialized. Once
VDD rises above VBOR, the Power-up Timer will execute
the additional time delay. Enabling BOR Reset does
not automatically enable the PWRT.
4.6 Time-out Sequence
On power-up, the time-out sequence is as follows:
First, afte r t he POR  pul se  has cle are d, PWRT time-o ut
is inv oked (if e nabled). Th en, the OS T is activa ted. The
tot al time-o ut wi ll var y base d on o scill ator co nfi guratio n
and the st atus of the PWRT. For example, in RC mod e
with the PWR T disabled , there wi ll be no time-out at all.
Figure 4-3, Figure 4-4, Figure 4-5, Figure 4-6 and
Figure 4-7 depict time-out sequences on power-up.
Since the  time-outs  occur from the PO R pulse, if MCLR
is kept  low  long e nough,  all ti me-outs wi ll exp ire. Brin g-
ing MCLR high will begin execution immediately
(Figure 4-5). This is useful for testing purposes or to
synchronize more than one PIC18FXXXX device
operating in parallel.
Table 4-2 s hows the Re set condi tions for so me Specia l
Function Registers, while Table 4-3 shows the Reset
conditions for all the registers. 
Note 1: External Power-on Reset circuit is
required only if the VDD power-up slope is
too slow. The diode D helps discharge the
capacitor quickly when VDD powers down.
2: R < 40 kΩ is  recommended to  make sure
that the voltage drop across R does not
violate the device’s electrical specification.
3: R1 ≥ 1 kΩ wil l limit any current flowing int o
MCLR from external capacitor C, in the
event of MCLR/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
MCLR
PIC18FXXXX
VDD

PIC18F2220/2320/4220/4320

TABLE 4-1: TIME-OUT IN VARIOUS SITUATIONS

TABLE 4-2: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR

RCON REGISTER

Oscillator

Configuration

Power-up(2) and Brown-out Exit from

Power Managed Mode

PWRTEN = 0PWRTEN = 1

HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2)

HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC

EC, ECIO 66 ms(1) ——

RC, RCIO 66 ms(1) ——

INTIO1, INTIO2 66 ms(1) ——

Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay.

2: 2 ms is the nominal time requi red for the 4x PLL to lock.

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-1 R/W-1

IPEN ——RITO PD POR BOR

bit 7 bit 0

Note: Refer to Section 5.14 “RCON Re gister” for bit definitio ns.

Condition Program

Counter RCON

Power-on Reset 0000h 0--1 1100 1 1 1 0 0 0 0

RESET Inst ruction 0000h 0--0 uuuu 0 u u u u u u

Brown-out 0000h 0--1 11u- 1 1 1 u 0 u u

MCLR during powe r managed

Run modes 0000h 0--u 1uuu u 1 u u u u u

MCLR during powe r managed

Idle modes and Sleep mode 0000h 0--u 10uu u 1 0 u u u u

WDT Ti me -out du ring full p ow er

or power managed Run mode 0000h 0--u 0uuu u 0 u u u u u

MCLR during full pow er

execution 0000h 0--u uuuu u u u u u

Stack Full Reset (STVREN = 1)1u

Stack Underflow Reset

(STVREN = 1)u1

Stack Underflow Error (not an

actual Reset, STVREN = 0)0000h u--u uuuu u u u u u u 1

WDT Time- out duri ng pow er

managed Idle or Sleep modes PC + 2 u--u 00uu u 0 0 u u u u

Interrupt exit from power

managed modes PC + 2 u--u u0uu u u 0 u u u u

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’

Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the

inter rupt ve cto r (0x00 000 8h or 0x00 001 8h ).

PIC18F2220/2320/4220/4320

TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Rese ts

Wake-up via WDT

or Interrupt

TOSU 2220 2320 4220 4320 ---0 0000 ---0 0000 ---0 uuuu(3)

TOSH 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu(3)

TOSL 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu(3)

STKPTR 2220 2320 4220 4320 uu-0 0000 00-0 0000 uu-u uuuu(3)

PCLATU 2220 2320 4220 4320 ---0 0000 ---0 0000 ---u uuuu

PCLATH 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

PCL 2220 2320 4220 4320 0000 0000 0000 0000 PC + 2(2)

TBLPTRU 2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

TBLPTRH 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TBLPTRL 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TABLAT 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

PRODH 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

PRODL 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

INTCON 2220 2320 4220 4320 0000 000x 0000 000u uuuu uuuu(1)

INTCON2 2220 2320 4220 4320 1111 -1-1 1111 -1-1 uuuu -u-u(1)

INTCON3 2220 2320 4220 4320 11-0 0-00 11-0 0-00 uu-u u-uu(1)

INDF0 2220 2320 4220 4320 N/A N/A N/A

POSTINC0 2220 2320 4220 4320 N/A N/A N/A

POSTDEC0 2220 2320 4220 4320 N/A N/A N/A

PREINC0 2220 2320 4220 4320 N/A N/A N/A

PLUSW0 2220 2320 4220 4320 N/A N/A N/A

FSR0H 2220 2320 4220 4320 ---- xxxx ---- uuuu ---- uuuu

FSR0L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

WREG 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

INDF1 2220 2320 4220 4320 N/A N/A N/A

POSTINC1 2220 2320 4220 4320 N/A N/A N/A

POSTDEC1 2220 2320 4220 4320 N/A N/A N/A

PREINC1 2220 2320 4220 4320 N/A N/A N/A

PLUSW1 2220 2320 4220 4320 N/A N/A N/A

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cell s ind ic ate co nditions do not apply for the desig nat ed dev ic e.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the w ak e-up is du e to an interru pt and the G IEL o r G IEH bi t i s set, the T O SU , TOSH and TOSL ar e

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 4-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

PIC18F2220/2320/4220/4320

FSR1H 2220 2320 4220 4320 ---- xxxx ---- uuuu ---- uuuu

FSR1L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

BSR 2220 2320 4220 4320 ---- 0000 ---- 0000 ---- uuuu

INDF2 2220 2320 4220 4320 N/A N/A N/A

POSTINC2 2220 2320 4220 4320 N/A N/A N/A

POSTDEC2 2220 2320 4220 4320 N/A N/A N/A

PREINC2 2220 2320 4220 4320 N/A N/A N/A

PLUSW2 2220 2320 4220 4320 N/A N/A N/A

FSR2H 2220 2320 4220 4320 ---- xxxx ---- uuuu ---- uuuu

FSR2L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

STATUS 2220 2320 4220 4320 ---x xxxx ---u uuuu ---u uuuu

TMR0H 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TMR0L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

T0CON 2220 2320 4220 4320 1111 1111 1111 1111 uuuu uuuu

OSCCON 2220 2320 4220 4320 0000 q000 0000 q000 uuuu qquu

LVDCON 2220 2320 4220 4320 --00 0101 --00 0101 --uu uuuu

WDTCON 2220 2320 4220 4320 ---- ---0 ---- ---0 ---- ---u

RCON(4) 2220 2320 4220 4320 0--1 11q0 0--q qquu u--u qquu

TMR1H 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

TMR1L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

T1CON 2220 2320 4220 4320 0000 0000 u0uu uuuu uuuu uuuu

TMR2 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

PR2 2220 2320 4220 4320 1111 1111 1111 1111 1111 1111

T2CON 2220 2320 4220 4320 -000 0000 -000 0000 -uuu uuuu

SSPBUF 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

SSPADD 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

SSPSTAT 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

SSPCON1 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

SSPCON2 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Rese ts

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cell s ind ic ate co nditions do not apply for the desig nat ed dev ic e.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the w ak e-up is du e to an interru pt a nd the G IEL o r G IEH bi t i s s et, the T O SU, TOSH an d TOSL ar e

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 4-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

PIC18F2220/2320/4220/4320

ADRESH 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

ADRESL 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

ADCON0 2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

ADCON1 2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

ADCON2 2220 2320 4220 4320 0-00 0000 0-00 0000 u-uu uuuu

CCPR1H 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR1L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

CCP1CON 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

CCPR2H 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

CCPR2L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

CCP2CON 2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

PWM1CON 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

ECCPAS 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

CVRCON 2220 2320 4220 4320 000- 0000 000- 0000 uuu- uuuu

CMCON 2220 2320 4220 4320 0000 0111 0000 0111 uuuu uuuu

TMR3H 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

TMR3L 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

T3CON 2220 2320 4220 4320 0000 0000 uuuu uuuu uuuu uuuu

SPBRG 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

RCREG 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TXREG 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

TXSTA 2220 2320 4220 4320 0000 -010 0000 -010 uuuu -uuu

RCSTA 2220 2320 4220 4320 0000 000x 0000 000x uuuu uuuu

EEADR 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

EEDATA 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

EECON1 2220 2320 4220 4320 xx-0 x000 uu-0 u000 uu-0 u000

EECON2 2220 2320 4220 4320 0000 0000 0000 0000 0000 0000

TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Rese ts

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cell s ind ic ate co nditions do not apply for the desig nat ed dev ic e.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the w ak e-up is du e to an interru pt and the G IEL o r G IEH bi t i s set, the T O SU , TOSH and TOSL ar e

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 4-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

PIC18F2220/2320/4220/4320

IPR2 2220 2320 4220 4320 11-1 1111 11-1 1111 uu-u uuuu

PIR2 2220 2320 4220 4320 00-0 0000 00-0 0000 uu-u uuuu(1)

PIE2 2220 2320 4220 4320 00-0 0000 00-0 0000 uu-u uuuu

IPR1 2220 2320 4220 4320 1111 1111 1111 1111 uuuu uuuu

2220 2320 4220 4320 -111 1111 -111 1111 -uuu uuuu

PIR1 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu(1)

2220 2320 4220 4320 -000 0000 -000 0000 -uuu uuuu(1)

PIE1 2220 2320 4220 4320 0000 0000 0000 0000 uuuu uuuu

2220 2320 4220 4320 -000 0000 -000 0000 -uuu uuuu

OSCTUNE 2220 2320 4220 4320 --00 0000 --00 0000 --uu uuuu

TRISE 2220 2320 4220 4320 0000 -111 0000 -111 uuuu -uuu

TRISD 2220 2320 4220 4320 1111 1111 1111 1111 uuuu uuuu

TRISC 2220 2320 4220 4320 1111 1111 1111 1111 uuuu uuuu

TRISB 2220 2320 4220 4320 1111 1111 1111 1111 uuuu uuuu

TRISA(5) 2220 2320 4220 4320 1111 1111(5) 1111 1111(5) uuuu uuuu(5)

LATE 2220 2320 4220 4320 ---- -xxx ---- -uuu ---- -uuu

LATD 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

LATC 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

LATB 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

LATA(5) 2220 2320 4220 4320 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5)

PORTE 2220 2320 4220 4320 ---- xxxx ---- xxxx ---- uuuu

PORTD 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

PORTC 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

PORTB 2220 2320 4220 4320 xxxx xxxx uuuu uuuu uuuu uuuu

PORTA(5) 2220 2320 4220 4320 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5)

TABLE 4-3: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED)

Brown-out Reset

MCLR Resets

WDT Reset

RESET Instruction

Stack Rese ts

Wake-up via WDT

or Interrupt

Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition.

Shaded cell s ind ic ate co nditions do not apply for the desig nat ed dev ic e.

Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up).

2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the

interrupt vector (0008h or 0018h).

3: When the w ak e-up is du e to an interru pt a nd the G IEL o r G IEH bi t i s s et, the T O SU, TOSH an d TOSL ar e

updated with the current value of the PC. The STKPTR is modified to point to the next location in the

hardware stack.

4: See Table 4-2 for Reset value for specific condition.

5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When

not enabled as PORTA pins, they are disabled and read ‘0’.

PIC18F2220/2320/4220/4320

FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT)

FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

TPWRT

TOST

VDD

MCLR

Internal POR

PWRT Time-out

OST Time-out

Internal Reset

TPWRT

TOST

VDD

MCLR

Internal POR

PWRT Time-out

OST Time-out

Inte rn a l Rese t

VDD

MCLR

Intern a l POR

PWRT T ime-out

OST Time-out

Internal Reset

TPWRT

TOST

PIC18F2220/2320/4220/4320

FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT)

FIGURE 4-7: TIME-OUT SEQUENCE ON POR W/ PLL ENABLED (MCLR TIED TO VDD)

VDD

MCLR

Internal POR

PWRT Time-out

OST Time-out

Internal Reset

0V 1V 5V

TPWRT

TOST

TPWRT

TOST

VDD

MCLR

Internal POR

PWRT Time-out

OST Time-out

Internal Reset

PLL Time-out

TPLL

Note: TOST = 1024 clock cycles.

TPLL ≈ 2 ms max. First three stages of the PWRT timer.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

5.0 MEMORY ORGANIZATION

There are three memory types in Enhanced MCU

devices. Th ese memory types are:

• Program Memory

• Data RAM

• Data EEPROM

Dat a and progr am memory use sep arate busses which

allow for concurrent access of these types.

Addition al detai led informat ion for Flas h program mem-

ory and data EEPROM is provided in Section 6.0

“Flash Program Memory” and Section 7.0 “Data

EEPROM Memory”, respec tiv el y.

FIGURE 5-1: PROGRAM MEMORY MAP

AND STACK FOR

PIC18F2220/4220

5.1 Program Memory Organization

A 21-b it progr am count er is capab le of ad dressin g the

2-Mb yte prog ram m emo ry space. Ac ces s ing a l ocation

between the physically implemented memory and the

2-Mbyte address will cause a read of all ‘0’s (a NOP

instruction).

The PIC18F2220 and PIC18F4220 each have

4 Kbytes of Flash memory and can store up to 2,048

single-word instructions.

The PIC18F2320 and PIC18F4320 each have

8 Kbytes of Flash memory and can store up to 4,096

single-word instructions.

The Rese t vector addres s is at 0000h and the interru pt

vector addresses are at 0008h and 0018h.

The Program Memory Maps for PIC18F2220/4220 and

PIC18F2320/4320 devices are shown in Figure 5-1

and Figure 5-2, respectively.

FIGURE 5-2: PROGRAM MEMORY MAP

AND STACK FOR

PIC18F2320/4320

PC<20:0>

Stack Level 1

•

Stack Level 31

Reset Vector

Low Priority Interrupt Vector

•

CALL,RCALL,RETURN

RETFIE,RETLW

0000h

0018h

On-Chip

Program Memory

High Priority Interrupt Vector 0008h

User Memo ry Spa ce

1FFFFFh

1000h

0FFFh

Read ‘0’

200000h

PC<20:0>

Stack Level 1

•

Stack Level 31

Reset Vector

Low Priority Interrupt Vector

•

CALL,RCALL,RETURN

RETFIE,RETLW

0000h

0018h

2000h

1FFFh

On-Chip

Program Memory

High Priority Interrupt Vector 0008h

User Memo ry Spa ce

Read ‘0’

1FFFFFh

200000h

PIC18F2220/2320/4220/4320

5.2 Return Address Stack

The return address s t ac k al low s any comb in atio n of up

to 31 program calls and interrupts to occur. The PC

(Program Counter) is pushed onto the stack when a

CALL or RCALL instruction is execute d or an interrup t is

Acknow le dge d. Th e PC val ue is pul led of f th e stack on

a RETURN, RETLW or a RETFIE inst ructi on. PCL ATU

and PCLATH are not affected by any of the RETURN or

CALL instructi ons .

The stack operates as a 31-word by 21-bit RAM and a

5-bit stack pointer, with the stack pointer initialized to

00000b after all Resets. There is no RAM associated

with stack pointer 00000b. This is only a Reset value.

During a CALL type instruction, causing a push onto the

stack, the stack pointer is first incremented and the

RAM location pointed to by the stack pointer is written

with the contents of the PC (already pointing to the

instruction following the CALL). During a RETURN type

instruction, causing a pop from the stack, the contents

of the RAM location pointed to by the STKPTR are

transferred to the PC and then the stack pointer is

decremented.

The stack space is not part of either program or data

space . The stack point er is read able and wri table and

the addre ss on the top of the stac k is readable a nd writ-

able through the top-of-stack Special File Registers.

Data can also be pushed to, or popped from, the stack

using the top-of-stack SFRs. Status bits indicate if the

stack is full, has overflowed or underflowed.

5.2.1 TOP-OF-STACK ACCESS

The top of the stack is readable and writable. Three

contents of the stack location pointed to by the

STKPTR register (Figure 5-3). This allows users to

implem ent a software st ack if nece ssary . Afte r a CALL,

RCALL or interrupt, the software can read the pushed

value by reading the TOSU, TOSH and TOSL registers.

These v alues can b e placed on a u ser define d software

stack. At return time, the software can replace the

TOSU, TOSH and TOSL and do a return.

The user must disable the global interrupt enable bits

while accessing the stack to prevent inadvertent stack

corruption.

5.2.2 RETURN STACK POINTER

(STKPTR)

The STKP TR reg ister (Re giste r 5-1) co nta ins the st ack

pointer value, the STKFUL (Stack Full) status bit and

the STKUNF (Stack Underflow) status bits. The value

of the stack pointer can be 0 through 31. The stack

pointer increments before values are pushed onto the

stack and decrements after values are popped off the

stack. At Reset, the stack pointer value will be zero.

The user may read and write the stack pointer value.

This feature can be used by a Real-Time Operating

System for return stack maintenance.

After t he PC is pus hed on to the st ack 31 times (wi thout

popping any values off the stack), the STKFUL bit is

set. The STKFUL bit is cleared by software or by a

POR.

The action that takes place when the stack becomes

full depends on the state of the STVREN (Stack Over-

flow Reset Enable) configuration bit. (Refer to

Section 23.1 “Configuration Bit s” for a descrip tion of

the device configuration bits.) If STVREN is set

(default), the 31st push will push the (PC + 2) value

onto the stack, set the STKFUL bit and reset the

device. The STKFUL bit will remain set and the stack

pointer will be set to zero.

If STVREN is clea red, the STKFUL bit will be se t on the

31st push and the stack pointer will increment to 31.

Any additional pushes will not overwrite the 31st push,

and STKPTR will remain at 31.

When the stack has been popped enough times to

unload th e stack, the ne xt pop will return a value of zero

to the PC and sets the STKUNF bit, while the stack

pointer remains at zero. The STKUNF bit will remain

set until cleared by software or a POR occurs.

FIGURE 5-3: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS

Note: Returning a value of zero to the PC on an

underflow has the effect of vectoring the

program to the Reset vector, where the

stack conditions can be verified and

appropriate actions can be taken. This is

not the same as a Reset, as the contents

of the SFRs are not affected.

00011

001A34h

11111

11110

11101

00010

00001

00000

00010

Return Address Stack

Top-of-Stack 000D58h

TOSLTOSHTOSU 34h1Ah00h STKPTR<4:0>

PIC18F2220/2320/4220/4320

5.2.3 PUSH AND POP INSTRUCTIONS

Since the Top-of-Stac k (TOS) is rea dab le a nd wr itable,

the abili ty to push v alues onto the stac k and pull values

off t he st ack, wit hout distu rbing norm al program ex ecu-

tion, is a d esirable optio n. To push th e current PC value

onto the stack, a PUSH instruction can be executed.

This will increm ent t he sta ck point er and load the cur-

rent PC value onto the stack. TOSU, TOSH and TOSL

can then be modified to place data or a return address

on the stack.

The ability to pull the TOS value off of the stack and

replace it with the value that was previously pushed

onto the stack, without disturbing normal execution, is

achieved by using the POP inst ruction. T he POP instru c-

tion discards the current TOS by decrementing the

stack pointer. The previous value pushed onto the

stack then becomes the TOS value.

5.2.4 ST ACK FULL/UNDERFLOW RESETS

These Resets are enabled by programming the

STVREN bit in Configuration Register 4L. When the

STVREN bit is cleared, a full or un derflow cond ition will

set the appropriate STKFUL or STKUNF bit but not

cause a device Reset. When the STVREN bit is set, a

full or underflow condition will set the appropriate

STKFUL or STKUNF bit and then cause a device

Reset. The STKFUL or STKUNF bits are cleared by the

user software or a POR Reset.

R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0

bit 7 bit 0

bit 7(1) STKFUL: Stack Full Flag bit

1 = Stack became full or overflowed

0 = Stack has not become full or overflowed

bit 6(1) STKUNF: Stack Underflow Flag bit

1 = Stack underflow occurred

0 = Stack underflow did not occur

bit 5 Unimplemented: Read as ‘0’

bit 4-0 SP4:SP0: Stack Pointe r Location bits

Note 1: Bit 7 and bit 6 are clea red by user sof twa re or by a POR.

Legend:

R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

5.3 Fast Register Stack

A “fast return” option is available for interrupts. A Fast

BSR registers and are only one in depth. The stack is

not readable or writable and is loaded with the current

value o f the correspo nding registe r when the pro cessor

vectors for an interrupt. The values in the registers are

then loaded back into the working registers if the

RETFIE, FAST instruction is used to return from the

interrupt.

All int errupt source s will push va lues into the sta ck reg-

isters. If both low and high priority interrupts are

enabled, the stack registers cannot be used reliably to

return from lo w priority interrupt s. If a high pri ority inter-

rupt occurs while servicing a low priority interrupt, the

stac k reg is ter v al ues s tor ed by the l ow p r iori ty in terru pt

will be overwritten. Users must save the key registers

in software during a low priority interrupt.

If interrupt pri ority is not used, all interrupts may use the

Fast Register Stack for returns from interrupt.

If no interrupts are used, the Fast Register S ta ck can b e

used to rest ore the S tatus, WREG and BSR register s at

the end of a subroutine call. To use the Fast Register

Stack for a subroutine call, a CALL label, FAST

instruction must be executed to save the Status,

WREG and BSR registers to the Fast Register S t ack. A

RETURN, FAST instruction is then ex ec uted to restore

these registers from the Fast Register Stack.

Example 5-1 shows a source code example that uses

the Fast Register Stack during a subroutine call and

return.

EXAMPLE 5-1: FAST REGISTER STACK

CODE EXAMPLE

5.4 PCL, PCLATH and PCLATU

The Program Counter (PC) spec ifies the addres s of the

instruction to fetch for execution. The PC is 21-bits

wide. The low byte, known as the PCL register, is both

readable and writable. The high byte, or PCH register,

cont ains th e PC<15 :8> bit s and is not direc tly read able

or writable. Updates to the PCH register may be per-

formed th rough the PCLATH regis ter . The upper by te is

called PCU. This register contains the PC<20:16> bits

and is not directly readable or writable. Updates to the

PCU register may be performed through the PCLATU

The contents of PCLATH and PCLATU will be trans-

ferred to the program counter by any operation that

writes PCL. Similarly, the upper two bytes of the pro-

gram counter will be transferred to PCLATH and

PCLATU by an operation that reads PCL. This is useful

for computed offsets to the PC (see Section 5.8.1

“Computed GOTO”).

The PC addresses bytes in the program memory. To

prevent the PC from becoming misaligned with word

instructions, the LSB of PCL is fixed to a value of ‘0’.

The PC increments by 2 to address sequential

instruc t ion s in the prog ram memo ry.

The CALL, RCALL, GOTO and program branch

instructions write to the program counter directly. For

these instructions, the contents of PCLATH and

PCLATU are not transferred to the program counter.

CALL SUB1, FAST ;STATUS, WREG, BSR

;SAVED IN FAST REGISTER

;STACK

•

SUB1 •

•

RETURN FAST ;RESTORE VALUES SAVED

;IN FAST REGISTER STACK

PIC18F2220/2320/4220/4320

5.5 Clocking Scheme/Instruction

Cycle

The clock input (from OSC1) is internally divided by

four to generate four non-overlapping quadrature

clocks, nam el y Q 1, Q 2, Q3 and Q4. I nte rnal ly, the Pro-

gram Counter (PC) is incremented every Q1, the

instruction is fetched from the program memory and

latched into the instruction register in Q4. The instruc-

tion is decoded and executed during the following Q1

through Q4. The clocks and instruction execution flow

are shown in Figure 5-4.

5.6 Instruction Flow/Pipelining

An “Instruction Cycle” consists of four Q cycles (Q1,

Q2, Q3 and Q 4). The instructio n fe tch and ex ecu te a r e

pipelined such that fetch takes one instruction cycle,

while decode and execute take another instruction

cycle. However, due to the pipelining, each instruction

effectively executes in one cycle. If an instruction

causes the program counter to change (e.g., GOTO),

then tw o cycles are req uired to com plete the ins truction

(Example 5-2).

A fetch cycle begins with the Program Counter (PC)

incrementing in Q1.

In the ex ecution cycle , the fetched instruction i s latched

into the “Instruction Register” (IR) in cycle Q1. This

instruction is then decoded and executed during the

Q2, Q 3 and Q4 c ycles. Data mem ory is read during Q2

(operand read) and written during Q4 (destination

write).

FIGURE 5-4: CLOCK/INSTRUCTION CYCLE

EXAMPLE 5-2: INSTRUCTION PIPELINE FLOW

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

OSC1

OSC2/CLKO

(RC mode)

PC PC+2 PC+4

Fetch INST (PC)

Execute IN ST (PC-2)

Fetch INST (PC+2)

Execute IN ST (P C)

Fetch INST (PC+4)

Execute INST (PC+2)

Internal

Phase

Clock

All instruc tions are single cycle, exc ept for any program branche s. These tak e two cycles since the fetch in struction

is “flushed” from the pipeline while the new instruction is being fetched and then executed.

TCY0TCY1TCY2TCY3TCY4TCY5

1. MOVLW 55h Fetch 1 Execute 1

2. MOVWF PORTB Fetch 2 Execute 2

3. BRA SUB_1 Fetch 3 Execute 3

4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)

5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1

PIC18F2220/2320/4220/4320
DS39599D-page 58 © 2006 Microchip Technology Inc.
5.7 Instructions in Program Memory
The program memory is addressed in bytes. Instruc-
tions are stored as two bytes or four bytes in program
memory. The Least Significant Byte of an instruction
word is always stored in a program memory location
with an even address (LSB = 0). Figure 5-5 shows an
exampl e of how instruc tion word s are stored i n the pro-
gram memory. To maintain alignment with instruction
boundaries, the PC increments in steps of 2 and the
LSB will always read ‘0’ (see Section 5.4 “PCL,
PCLATH and PCLATU”).
The CALL and GOTO instructions have the absolute pro-
gram memory address embedded into the instruction.
Since instructions are always stored on word bound-
aries, the data contained in the instruction is a word
address. The word address is written to PC<20:1>,
which accesses the desired byte address in program
memory. Instruction #2 in Figure 5-5 shows how the
instruction ‘GOTO 000006h’ is enc oded in the pro gram
memory. Progra m br anc h i nstruc tio ns , w hic h e ncode a
relative address offset, operate in the same manner.
The offset value stored in a branch instruction repre-
sents the number of single-word instructions that the
PC will be offset by. Section 24.0 “Instruction Set
Summary” provides further details of the instruction
set.
FIGURE 5-5: INS TRUCTIONS IN PROGRAM MEMORY
5.7.1 TW O-WORD INSTRUCTIONS
PIC18F2X20/4X20 devices have four two-word instruc-
tions: MOVFF, CALL, GOTO and LFSR. The second
word of these instructions has the 4 MSBs set to ‘1’s
and is decoded as a NOP instruction. The lower 12 bits
of the second word contain data to be used by the
instruction. If the first word of the instruction is exe-
cuted, the data in the second word is accessed. If the
second  word of the in struction is  executed by it self (first
word was  skip ped), it  will  execute  as a  NOP. This action
is necessary when  the two-word inst ruction is preceded
by a conditional instruction that results in a skip opera-
tion. A program example that demonstrates this con-
cept is shown in Example 5-3. Refer to Section 24.0
“Instruction Set Summary” for further details of the
instruction se t.
EXAMPLE 5-3: TWO-WORD INSTRUCTIONS
Word Address
LSB = 1LSB = 0↓
Program Memory
Byte Locations  →        000000h
000002h
000004h
000006h
Instruction 1: MOVLW 055h 0Fh 55h 000008h
Instruction 2: GOTO 000006h EFh 03h 00000Ah
F0h 00h 00000Ch
Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh
F4h 56h 000010h
000012h
000014h
CASE 1:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word
1111 0100 0101 0110 ; Execute this word as a NOP
0010 0100 0000 0000 ADDWF REG3 ; continue code
CASE 2:
Object Code Source Code
0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?
1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word
1111 0100 0101 0110 ; 2nd word of instruction
0010 0100 0000 0000 ADDWF REG3 ; continue code

PIC18F2220/2320/4220/4320

5.8 Look-up Tables

Look-up tables are implemented two ways:

• Computed GOTO

• Table Reads

5.8.1 COMPUTED GOTO

A comput ed GOTO is a ccom pli shed by addi ng a n offset

to the program counter. An example is shown in

Example 5-4.

A look-up table can be formed with an ADDWF PCL

instruction and a group of RETLW 0xnn instructions.

WREG is loaded with an offset into the table before

execut ing a c al l to tha t table. Th e fi rst instructi on of th e

called routine is the ADDWF PCL instruction. The next

instruction executed will be one of the RETLW 0xnn

instructions that returns the value 0xnn to the calling

function.

The offset value (in WREG) specifies the number of

bytes that the program counter should advance and

should be multiples of 2 (LSB = 0).

In this method, only one data byte may be stored in

each instruction location and room on the return

address stack is required.

EXAMPLE 5-4: COMPUTED GOTO USING

AN OFFSET VALUE

5.8.2 TABLE READS/TABLE WRITES

A better method of storing data in program memory

allow s two bytes of dat a to be stored in each instruc tion

location.

Look-up table data may be stored two bytes per pro-

gram word by using table reads and writes. The table

pointer (TBLPTR) specifies the byte address and the

table latch (TABLAT) contains the data that is read

from, or written to pro gram memory. Data is tr ansferred

to/from program memory, one byte at a time.

The Table Read/Table Write operation is discussed

further in Section 6.1 “Table Reads and Table

Writes”.

5.9 Data Memory Organizati on

The data memory is im ple me nte d as static RAM . Eac h

allowing up to 4096 bytes of data memory. Figure 5-6

shows the data memory organization for the

PIC18F2X20/4X20 devices.

The data memory map is divided into as many as 16

banks that contain 256 bytes each. The lower 4 bits of

the Bank Select Register (BSR<3:0>) select which

bank wil l be ac cessed . Th e uppe r 4 bit s o f the BSR a re

not implemented.

The data memory contains Special Function Registers

(SFR) and General Purpose Registers (GPR). The

SFRs are used for control and status of the controller

and periph eral function s, while GPRs ar e used for dat a

storage and scratch pad operations in the user’s appli-

cation. The SFRs start at the last location of Bank 15

(FFFh) and extend towa rds F80h. Any remaining sp ace

beyond the SFRs in the bank may be implemented as

GPRs. GPRs start at the first location of Bank 0 and

grow up w ards . An y re ad of a n un im ple me nte d l ocation

will read as ‘0’s.

The entire data memory may be accessed directly or

indirec tly. Dir ect add ress in g m ay re qui re th e us e of the

BSR register. Indirect addressing requires the use of a

File Select Register (FSRn) and a corresponding Indi-

rect File Operand (INDFn). Each FSR holds a 12-bit

address value that can be used to access any location

in the data memory map without banking. See

Section 5.12 “Indirect Addressing, INDF and FSR

Registers” for indirect addressing details.

The instruction set and architecture allow operations

across all banks . This may be acc omplished by indirec t

address ing or by the us e of th e MOVFF instruction. The

MOVFF instruction is a two-word/two-cycle instruction

that moves a value from one register to another.

To ensure that commonly used registers (SFRs and

select GPRs) can be accessed in a single cycle,

regardless of the current BSR values, an Access Bank

is imp lemented. A segm ent of Bank 0 and a segment of

Bank 15 comprise the Access RAM. Section 5.10

“Access Bank” provides a detailed description of the

Access RAM.

5.9.1 GENERAL PURPOSE

Enhanced MCU devices may have banked memory in

the GPR area. GPRs are not initialized by a Power-on

Reset and are unchanged on all other Resets.

Data RAM is available for use as GPR registers by all

instructions. The second half of Bank 15 (F80h to

FFFh) contains SFRs. All other banks of data memory

contain GPRs, starting with Bank 0.

MOVFW OFFSET

CALL TABLE

ORG 0xnn00

TABLE ADDWF PCL

RETLW 0xnn

•

PIC18F2220/2320/4220/4320

FIGURE 5-6: DATA MEMORY MAP FOR PIC18F2X20/4X20 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory Map

BSR<3:0>

= 0000

= 0001

= 1111

080h

07Fh

F80h

FFFh

00h

7Fh

80h

FFh

Access Bank

When a = 0:

The BSR is ignored and the

Access Bank is used.

The first 128 bytes are

general purpose RAM

(from Bank 0).

The second 128 bytes are

Special Function Registers

(from Bank 15).

When a = 1:

The BSR specifies the bank

used by the instruction.

F7Fh

F00h

EFFh

1FFh

100h

0FFh

000h

Access RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

Unused

Access RAM High

Access RAM Low

Bank 2

200h

Unused

Read ‘00h’

= 1110

= 0010 (SFRs)

PIC18F2220/2320/4220/4320

5.9.2 SPECIAL FUNCTION REGISTERS

The Special Function Registers (SFRs) are registers

used by the CPU and peripheral modules for controlling

the desired operation of the device. These registers are

implemented as static RAM. A list of these registers is

given in Table 5-1 and Table 5-2.

The SFRs can be classified into two sets: those asso-

ciated with the “core” function and those related to the

peripheral functions. Those registers related to the

“core” are descri bed i n t his s ection, while those rel ate d

to the operation of the peripheral features are

describ ed in the se cti on of that peri pheral feature.

The SFRs are typically distributed among the

peripherals whose functions they control.

The unused SFR locations will be unimplemented and

read as ‘0’s.

TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2X20/4X20 DEVICES

Address Name Address Name Address Name Address Name

FFFh TOSU FDFh INDF2(2) FBFh CCPR1H F9Fh IPR1

FFEh TOSH FDEh POSTINC2(2) FBEh CCPR1L F9Eh PIR1

FFDh TOSL FDDh POSTDEC2(2) FBDh CCP1CON F9Dh PIE1

FFCh STKPTR FDCh PREINC2(2) FBCh CCPR2H F9Ch —

FFBh PCLATU FDBh PLUSW2(2) FBBh CCPR2L F9Bh OSCTUNE

FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah —

FF9h PCL FD9h FSR2L FB9h — F99h —

FF8h TBLPTRU FD8h STATUS FB8h — F98h —

FF7h TBLPTRH FD7h TMR0H FB7h PWM1CON(1) F97h —

FF6h TBLPTRL FD6h TMR0L FB6h ECCPAS(1) F96h TRISE(1)

FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD(1)

FF4h PRODH FD4h — FB4h CMCON F94h TRISC

FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB

FF2h INTCON FD2h LVDCON FB2h TMR3L F92h TRISA

FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —

FF0h INTCON3 FD0h RCON FB0h — F90h —

FEFh INDF0(2) FCFh TMR1H FAFh SPBRG F8Fh —

FEEh POSTINC0(2) FCEh TMR1L FAEh RCREG F8Eh —

FEDh POSTDEC0(2) FCDh T1CON FADh TXREG F8Dh LATE(1)

FECh PREINC0(2) FCCh TMR2 FACh TXSTA F8Ch LATD(1)

FEBh PLUSW0(2) FCBh PR2 FABh RCSTA F8Bh LATC

FEAh FSR0H FCAh T2CON FAAh — F8Ah LATB

FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA

FE8h WREG FC8h SSPADD FA8h EEDATA F88h —

FE7h INDF1(2) FC7h SSPSTAT FA7h EECON2 F87h —

FE6h POSTINC1(2) FC6h SSPCON1 FA6h EECON1 F86h —

FE5h POSTDEC1(2) FC5h SSPCON2 FA5h — F85h —

FE4h PREINC1(2) FC4h ADRESH FA4h — F84h PORTE

FE3h PLUSW1(2) FC3h ADRESL FA3h — F83h PORTD(1)

FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC

FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB

FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA

Legend: — = Unimplemented registers, read as ‘0’.

Note 1: This register is not available on PIC18F2X20 devices.

2: This is not a physical register.

PIC18F2220/2320/4220/4320
DS39599D-page 62 © 2006 Microchip Technology Inc.
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2220/2320/4220/4320)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Deta ils on 
page:
TOSU — — — Top-of-Stack Upper Byt e (T OS<20:16>) ---0 0000 46, 54
TO SH Top-of-Stack High Byte (TOS<15:8>) 0000 0000 46, 54
TOSL Top-of-Stack Low Byte (TOS<7:0>) 0000 0000 46, 54
STKPTR STKFUL STKUNF — Return Stack Pointer 00-0 0000 46, 55
PCLATU ——bit 21
(3) Holding Register for PC<20:16> ---0 0000 46, 56
PCLATH Hol d ing Regi st er for  PC<15:8> 0000 0000 46, 56
PCL PC Low Byte (PC<7:0>) 0000 0000 46, 56
TBLPTRU —— bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 46, 74
TBLPTRH Program Memory Table P ointe r High Byte (TBLPTR<15:8>) 0000 0000 46, 74
TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 0000 0000 46, 74
TABLAT Program Memory Table Latc h 0000 0000 46, 74
PRODH Product Register High Byte xxxx xxxx 46, 85
PRODL Product Register Low Byte xxxx xxxx 46, 85
INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 46, 89
INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP1111 -1-1 46, 90
INTCON3 INT2IP INT1IP —INT2IEINT1IE— INT2IF INT1IF 11-0 0-00 46, 91
INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) n/a 46, 66
POSTINC0 U ses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) n/a 46, 66
POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) n/a 46, 66
PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) n/a 46, 66
PLUSW0 Uses contents of FSR0 to address data memory  – value  of FSR0 offset by W (not a physical register) n/a 46, 66
FSR0H — — — — Indirect Data Memory Address Pointer 0 High ---- 0000 46, 66
FSR0L Indirect Data Memory Address Pointer 0 Low Byte xxxx xxxx 46, 66
WREG Worki ng Regi s ter xxxx xxxx 46
INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) n/a 46, 66
POSTINC1 U ses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) n/a 46, 66
POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) n/a 46, 66
PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) n/a 46, 66
PLUSW1 Uses contents of FSR1 to address data memory  – value  of FSR1 offset by W (not a physical register) n/a 46, 66
FSR1H — — — — Indirect Data Memory Address Pointer 1 High ---- 0000 47, 66
FSR1L Indirect Data Memory Address Pointer 1 Low Byte xxxx xxxx 47, 66
BSR — — — — Bank Select Register ---- 0000 47, 65
INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) n/a 47, 66
POSTINC2 U ses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) n/a 47, 66
POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) n/a 47, 66
PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) n/a 47, 66
PLUSW2 Uses contents of FSR2 to address data memory  – value  of FSR2 offset by W (not a physical register)   n/a 47, 66
FSR2H — — — — Indirect Data Memory Address Pointer 2 High ---- 0000 47, 66
FSR2L Indirect Data Memory Address Pointer 2 Low Byte xxxx xxxx 47, 66
STATUS — — —NOVZDCC---x xxxx 47, 68
TMR0H Timer0 Register High Byte 0000 0000 47, 119
TMR0L Timer0 Register Low Byte xxxx xxxx 47, 119
T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 47, 117
Legend: x = unknow n , u = unchanged, - = unimplemented, q = value depends on condition
Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator mode only and read 
‘0’ in all other oscillator modes.
2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.
3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.
4: If PBADEN = 0, PORTB<4:0> are configured as digital input and read unknown and if PBADEN = 1, PORTB<4:0> are configured as 
analog input and read ‘0’ following a Reset.
5: These registers and/or bits are not implemented on the PIC18F2X20 devices and read as ‘0’.
6: The RE3 port bit is only available when MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’. Otherwise, RE3 reads ‘0’. This bit is 
read-only.

© 2006 Microchip Technology Inc. DS39599D-page 63
PIC18F2220/2320/4220/4320
OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 q000 26, 47
LVDCON —— IRVST LVDEN LVDL3 LVDL2 LVDL1 LVDL0 --00 0101 47, 233
WDTCON — — — — — — —SWDTEN--- ---0 47, 246
RCON IPEN ——RITO PD POR BOR 0--1 11q0 45, 69, 98
TMR1H Timer1 Register High Byte xxxx xxxx 47, 125
TMR1L Timer1 Register Low Byte xxxx xxxx 47, 125
T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 47, 121
TMR2 Timer2 Register 0000 0000 47, 127
PR2 Timer2 Period Register 1111 1111 47, 127
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 47, 127
SSPBUF SSP Receive Buff er/Transmit Register xxxx xxxx 47, 156, 
164
SSPADD SSP Address Register in I2C Slave mode. SSP Baud Rate Reload Register in I2C Master mode. 0000 0000 47, 164
SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 47, 156, 
165
SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 47, 157, 
166
SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 47, 167
ADRESH A/D Result Register High Byte xxxx xxxx 48, 220
ADRESL A/D Result Register Low Byte xxxx xxxx 48, 220
ADCON0 —— CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 48, 211
ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0000 48, 212
ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 48, 213
CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 48, 134
CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 48, 134
CCP1CON P1M1(5) P1M0(5) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 48, 133, 
141
CCPR2H Capture/Compare/PWM Register 2 High Byte xxxx xxxx 48, 134
CCPR2L Capture/Compare/PWM Register 2 Low Byte xxxx xxxx 48, 134
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 48, 133
PWM1CON(5) PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 48, 149
ECCPAS(5) ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 48, 150
CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 48, 227
CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 48, 221
TMR3H Timer3 Register High Byte xxxx xxxx 48, 131
TMR3L Timer3 Register Low Byte xxxx xxxx 48, 131
T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 48, 129
SPBRG USART Baud Rate Generator 0000 0000 48, 198
RCREG USART Receive Register 0000 0000 48, 204, 
203
TXREG USART Transmit Register 0000 0000 48, 202, 
203
TXSTA CSRC TX9 TXEN SYNC — BRGH TRMT TX9D 0000 -010 48, 196
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 48, 197
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2220/2320/4220/4320) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Deta ils on 
page:
Legend: x = unknow n , u = unchanged, - = unimplemented, q = value depends on condition
Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator mode only and read 
‘0’ in all other oscillator modes.
2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.
3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.
4: If PBADEN = 0, PORTB<4:0> are configured as digital input and read unknown and if PBADEN = 1, PORTB<4:0> are configured as 
analog input and read ‘0’ following a Reset.
5: These registers and/or bits are not implemented on the PIC18F2X20 devices and read as ‘0’.
6: The RE3 port bit is only available when MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’. Otherwise, RE3 reads ‘0’. This bit is 
read-only.

PIC18F2220/2320/4220/4320
DS39599D-page 64 © 2006 Microchip Technology Inc.
EEADR EEPROM Address Register 0000 0000 48, 81
EEDATA EEPROM Data Register 0000 0000 48, 84
EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 48, 72, 81
EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 48, 73, 82
IPR2 OSCFIP CMIP — EEIP BCLIP LVDIP TMR3IP CCP2IP 11-1 1111 49, 97
PIR2 OSCFIF CMIF — EEIF BCLIF LVDIF TMR3IF CCP2IF 00-0 0000 49, 93
PIE2 OSCFIE CMIE — EEIE BCLIE LVDIE TMR3IE CCP2IE 00-0 0000 49, 95
IPR1 PSPIP(5) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 49, 96
PIR1 PSPIF(5) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 49, 92
PIE1 PSPIE(5) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 49, 94
OSCTUNE —— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000 23, 49
TRISE(5) IBF OBF IBOV PSPMODE — Data Direction bits for PORTE(5) 0000 -111 49, 112
TRISD(5) Data Direction Control Register for PORTD 1111 1111 49, 110
TRISC Data Direction Control Register for PORTC 1111 1111 49, 108
TRISB Data Direction Control Register for PORTB 1111 1111 49, 106
TRISA TRISA7(2) TRISA6(1) Data Direction Control Register for PORTA 1111 1111 49, 103
LATE(5) — — — — — Read/Write PORTE Data Latch ---- -xxx 49, 113
LATD(5) Read/Write PORTD Data Latch xxxx xxxx 49, 110
LATC Read/Write PORTC Data Latch xxxx xxxx 49, 108
LATB Read/Write PORTB Data Latch xxxx xxxx 49, 106
LATA LATA<7>(2) LATA<6>(1) Read/Write PORTA Data Latch xxxx xxxx 49, 103
PORTE — — — —RE3
(6) Read P ORTE pins,
Write PORTE Data Latch(5) ---- xxxx 49, 113
PORTD R ea d PORTD pins, Write PORTD Data Latch xxxx xxxx 49, 110
PORTC R ea d PORTC pins, Write PORTC Data Latch xxxx xxxx 49, 108
PORTB Read PORTB pi ns,  Write PORTB Data Latch(4) xxxx xxxx 49, 106
PORTA RA7(2) RA6(1) Read PORTA pins, Write PORTA Data Latch xx0x 0000 49, 103
TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2220/2320/4220/4320) (CONTINUED)
File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Deta ils on 
page:
Legend: x = unknow n , u = unchanged, - = unimplemented, q = value depends on condition
Note 1: RA6 and associated bits are configured as port pins in RCIO, ECIO and INTIO2 (with port function on RA6) Oscillator mode only and read 
‘0’ in all other oscillator modes.
2: RA7 and associated bits are configured as port pins in INTIO2 Oscillator mode only and read ‘0’ in all other modes.
3: Bit 21 of the PC is only available in Test mode and Serial Programming modes.
4: If PBADEN = 0, PORTB<4:0> are configured as digital input and read unknown and if PBADEN = 1, PORTB<4:0> are configured as 
analog input and read ‘0’ following a Reset.
5: These registers and/or bits are not implemented on the PIC18F2X20 devices and read as ‘0’.
6: The RE3 port bit is only available when MCLRE fuse (CONFIG3H<7>) is programmed to ‘0’. Otherwise, RE3 reads ‘0’. This bit is 
read-only.

PIC18F2220/2320/4220/4320

5.10 Access Bank

The Access Bank is an architectural enhancement

which is very useful for C compiler code optimization.

The techniques used by the C compiler may also be

useful for programs written in assembly.

This data memory region can be used for:

• Intermediate computational values

• Local variables of subroutines

• Faster context saving/switching of variables

• Comm on va riab les

• Faster evaluation/control of SFRs (no banking)

The Access Bank is comprised of the last 128 bytes in

Bank 15 (SFRs) and the first 128 bytes in Bank 0.

These two sections will be referred to as Access RAM

High and Access RAM Low, respectively. Figure 5-6

indicates the Access RAM areas.

A bit in the instruc tio n w ord sp ec ifie s if the opera tion is

to occur i n the bank sp ec ifi ed by the BSR regis ter o r in

the Access Bank. This bit is denoted as the ‘a’ bit (for

access bit).

When forced in the Access Bank (a = 0), the last

address in Access RAM Low is followed by the first

address in Access RAM High. Access RAM High maps

the Special Function Registers, so these registers can

be accessed without any software overhead. This is

useful for testing status flags and modifying control bits.

5.11 Bank Select Register (BSR)

The need for a large general purpose memory space

dictates a RAM banking scheme. The data memory is

parti tion ed into as ma ny as sixtee n ban ks. When using

direct addressing, the BSR should be configured for the

desired bank.

BSR<3:0> holds the upper 4 bits of the 12-bit RAM

address. The BSR<7:4> bits will always read ‘0’s a nd

writes will have no effect (see Figure 5-7).

A MOVLB instruction has been provided in the

instruction set to assist in selecting banks.

If the currently selected bank is not implemented, any

read will return all ‘0’s and all writes are ignored. The

S tatus register bit s will be set/cleared as appro priate for

the instruction performed.

Each Bank extends up to FFh (256 bytes). All data

memory is implemented as static RAM.

A MOVFF instruction ignores the BSR since the 12-bit

addresses are embedded into the instruction word.

Section 5.12 “Indirect Addressing, INDF and FSR

Registers” provides a description of indirect address-

ing which allows linear addressing of the entire RAM

space.

FIGURE 5-7: DIRECT ADDRESSING

Note 1: For register file map detail, see Table 5-1.

2: The access bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to the

registers of the Access Bank.

3: The MOVFF instruction embeds the entire 12-bit address in the instruction.

Data

Memory(1)

Direct Addressing

Bank Select(2) Location Select(3)

BSR<3:0> 7 0

From Opcode(3)

00h 01h 0Eh 0Fh

Bank 0 Ba nk 1 B ank 14 Bank 15

1FFh

100h

0FFh

000h

EFFh

E00h

FFFh

F00h

BSR<7:4>

0000

PIC18F2220/2320/4220/4320

5.12 Indirect Addressing, INDF and

FSR Registers

Indir ect addressing is a mod e of addressing dat a mem-

ory, where the data memory address in the instruction

is not fi xe d. An FSR reg is ter i s u se d as a poi nter to the

data memory locat ion that is to be read or written. Since

this poi nter i s in RAM, the con ten t s c an be mo difi ed by

the program. This can be useful for data tables in the

data memory and for software stacks. Figure 5-8

shows how the fetched instruction is modified prior to

being executed.

Indirect addressing is possible by using one of the

INDF regi sters. Any ins tru ction using the IN DF reg is ter

actually accesses the register pointed to by the File

Select Register, FSR. Reading the INDF register itself,

indirectly (FSR = 0), will read 00h. Writing to the INDF

Figure 5-9.

The INDFn register is not a physical register. Address-

ing INDFn actually addresses the register whose

address is contained in the FSRn register (FSRn is a

pointer); this is indirect addressing.

Exampl e 5-5 shows a s imple use o f indirect add ressing

to clear the RAM in Bank 1 (locations 100h-1FFh) in a

minimum number of instructions.

EXAMPLE 5-5: HOW TO CLEAR RAM

(BANK 1) USING

INDIRECT ADDRESSING

There are three indirect addressing registers. To

address the entire data memory space (4096 bytes),

these registers are 12 bits wide. To store the 12 bits of

addressing information, two 8-bit registers are

required:

1. FSR0: composed of FSR0H:FSR0L

2. FSR1: composed of FSR1H:FSR1L

3. FSR2: composed of FSR2H:FSR2L

In addition, there are registers INDF0, INDF1 and

INDF2, which are not physically implemented. Reading

or writing to these registers activates indirect address-

ing with the value in the corresponding FSR register

being the ad dress of the data. If an i nstruct ion w rite s a

value t o IN DF0, the val ue w ill be wr itt en to t he address

pointed to by FSR0H:FSR0L. A read f rom INDF 1 reads

the data from the address pointed to by

FSR1H:FSR1L. INDFn can be used in code anywhere

an operand can be used.

If INDF0, INDF1 or INDF2 are read indirectly via an

FSR, all ‘0’s are read (zero bit is set). Similarly, if

INDF0, INDF1 or INDF2 are written to indirectly, the

operation will be equivale nt to a NOP instruction and the

status bits are not affected.

5.12.1 INDIRECT ADDRESSING

OPERATION

Each FSR register has an INDF register associated

with it, plus four additional register addresses. Perform-

ing an operation using one of these five registers

determines how the FSR will be modified during

indirect addressing.

When data access is performed using one of the five

INDFn locations, the address selected will configure

the FSRn register to:

• Do nothing to FSRn after an indirect access (no

change) – INDFn

• Auto-decr ement FSRn after an indirect access

(post-decrement) – POSTDECn

• Auto-increment FSRn after an indirect access

(post-increment) – POSTINCn

• Auto- increment FSRn before an indirect access

(pre-increment) – PREINCn

• Use the value in the WREG register as an offset

to FSRn . Do not modif y the value of the WREG or

the FSRn register after an indirect access (no

change) – PLUSWn

When using the auto-increment or auto-decrement

features, the effect on the FSR is not reflected in the

Status register. For example, if the indirect address

causes the FSR to equal ‘0’, the Z bit will not be set.

Auto-incrementing or auto-decrementing an FSR

affects all 12 bits. That is, when FSRnL overflows from

an increment, FSRnH will be incremented

automatically.

Adding these features allows the FSRn to be used as a

stack pointer, in addition to its use for table operations

in d ata me mory.

Each FSR has an address associated with it that per-

forms an indexed indirect access. When a data access

to this INDFn location (PLUSWn) occurs, the FSRn is

configu r ed to add th e s ig ned v alu e in the WREG re gis -

ter and th e v alu e i n F S R to f orm the add res s befo re a n

indirect access. The FSR value is not changed. The

WREG offset range is -128 to +127.

If an FSR regist er conta ins a value that poin ts to one of

the INDFn, an indirect read will read 00 h (zero bit is set)

while an indirect write will be equivalent to a NOP

(sta tus bits are not affected).

If an indirect addressing write is performed when the

target address is an FSRnH or FSRnL register, the

data is written to the FSR register but no pre- or

post-increment/decrement is performed.

LFSR FSR0,0x100 ;

NEXT CLRF POSTINC0 ; Clear INDF

; register then

; inc pointer

BTFSS FSR0H, 1 ; All done with

; Bank1?

GOTO NEXT ; NO, clear next

CONTINUE ; YES, continue

PIC18F2220/2320/4220/4320

FIGURE 5-8: INDIRECT ADDRESSING OPERATION

FIGURE 5-9: INDIRECT ADDRESSING

Opcode Address

File Address = access of an indirect addressing register

FSR

Instruction

Executed

Instruction

Fetched

RAM

Opcode File

BSR<3:0>

FFFh

Note 1: For register file map detail, see Table 5-1.

Data

Memory(1)

Indirect Addressing

FSRnH:FSRnL

0FFFh

0000h

Location Select

11 0

PIC18F2220/2320/4220/4320

5.13 Status Register

The S tatus register , shown in Register 5-2, contains the

arithmetic status of the ALU. The St atus register can be

the opera nd for any instru cti on as wi th an y other regis-

ter . If the S tatus register is th e destination for an instruc-

tion that affects the Z, DC, C, OV or N bits, then the

write to th ese fiv e bit s is dis abled . These bit s ar e set or

cleared according to the device logic. Therefore, the

result of an instruction with the Status register as

destination may be different than intended.

For example, CLRF STATUS will clear the upper three

bits and set the Z bit. This leaves the Status register

as 000u u1uu (where u = unchanged).

It is recommended, therefore, that only BCF, BSF,

SWAPF, MOVFF and MOVWF instructions are used to

alter the Status register, because these instructions do

not affect the Z, C, DC, OV or N bits in the Status reg-

ister . For other instruct ions not aff ecting any st atus bits ,

see Table 24-2.

Note: The C and DC bits operate as a borrow

and digit borrow bit respectively, in

subtraction.

U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x

— — —NOVZDCC

bit 7 bit 0

bit 7-5 Unimplemented: Read as ‘0’

bit 4 N: Negative bit

This bit is used for signed arithmetic (2’s complement). It indicates whether the result was

negative (ALU MSB = 1).

1 = Result was negative

0 = Result was positive

bit 3 OV: Ov erflow bit

This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit

magnitude which causes the sign bit (bit 7) to change state.

1 = Overflow occurred for signed arithmetic (in this arithmetic operation)

0 = No overflow occurred

bit 2 Z: Zero bit

1 = The result of an arithmetic or logic operation is zero

0 = The result of an arithmetic or logic operation is not zero

bit 1 DC: Digi t carry/borrow bit

For ADDWF, ADDLW, SUBLW and SUBWF instructions.

1 = A carry-out from the 4th low order bit of the result occurred

0 = No carry-out from the 4th low order bit of the result

Note: For borrow, the polarity is reversed. A subtraction is executed by adding the two’s

complement of the second operand. For rotate (RRF, RLF) instructions, this bit is

loaded with either the bit 4 or bit 3 of the source register.

bit 0 C: Carry/borrow bit

For ADDWF, ADDLW, SUBLW and SUBWF instructions.

1 = A carry-out from the Most Significant bit of the result occurred

0 = No carry-out from the Most Significant bit of the result occurred

Note: For borrow, the polarity is reversed. A subtraction is executed by adding the two’s

complement of the second operand. For rotate (RRF, RLF) instructions, this bit is

loaded with either the high or low order bit of the source register.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

5.14 RCON Register

The Reset Control (RCON) register contains flag bits

that allow differentiation between the sources of a

device Reset. These flags include the TO, PD, POR,

BOR and RI bi ts. Thi s register is re adable an d writ able.

Note 1: If the BOREN configuration bit is set

(Brown-out Reset enabled), the BOR bit

is ‘1’ on a Power-on Reset. After a Brown-

out Reset has occurred, the BOR bit will

be cle ared and mu st be set by firmware to

indicate the occurrence of the next

Brown-out Reset.

2: It is re commended that the POR bit be set

after a Power-on Reset has been

detected so that subsequent Power-on

Resets may be detect ed.

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0

IPEN ——RITO PD POR BOR

bit 7 bit 0

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts

0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)

bit 6-5 Unimplemented: Read as ‘0’

bit 4 RI: RESET Instruction Flag bit

1 = The RESET instruction was not executed (set by firmware only)

0 = The RESET in struction was exe cuted causi ng a devic e Reset (mu st be set i n software aft er

a Br own-out Reset occurs)

bit 3 TO: Watchdog Time-out Flag bit

1 = Set by power-up, CLRWDT instruction or SLEEP instruction

0 = A WDT time-out occurred

bit 2 PD: Power-down Detection Flag bit

1 = Set by power-up or by the CLRWDT instructi on

0 = Cleared by execution of the SLEEP instruction

bit 1 POR: Power-on Reset Status bit

1 = A Power-on Reset has not occurred (set by firmware only)

0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)

bit 0 BOR: Brown-out Reset Status bit

1 = A Brown-out Reset has not occurred (set by firmware only)

0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

6.0 FLASH PROGRAM MEMORY

The Flash program memory is readable, writable and

erasable during normal operation over the entire VDD

range.

A read from program memory is executed on one byte

at a time. A write to program memory is executed on

blocks o f 8 bytes at a ti me . Pro gram m em ory is er ase d

in blocks of 64 bytes at a time. A bulk erase operation

may not be issued from user code.

While writing or erasing program memory, instruction

fetches cease until the operation is complete. The

program memory cannot be accessed during the write

or erase, therefore, code cannot execute. An internal

programming timer terminates program memory writes

and erases.

A value wri tten to program memory does not need to be

a valid instruction. Executing a program memory

location that forms an invalid instruction results in a

NOP.

6.1 Table Reads and Table Writes

In order to read and write program memory, there are

two o per atio ns that al low the proc ess or t o mov e byt es

between the program memory space and the data

RAM:

• Table Read (TBLRD)

• Table Write (TBLWT)

The program memory space is 16 bits wide while the

data RAM space is 8 bits wide. Table reads and table

writes move data between these two memory spaces

through an 8-bit register (TABLAT).

Table read operations retrieve data from program

memory and place it into TABLAT in the data RAM

space. Figure 6-1 shows the operation of a table read

with program memo ry and data RAM.

Table write operations store data from TABLAT in the

data memory space into holding registers in program

memory. The procedure to write the contents of the

holding registers into program memory is detailed in

Section 6.5 “Writing to Flash Program Memory”.

Figure 6-2 shows the operation of a table write with

program memory and data RAM.

Table operations work with byte entities. A table block

cont aining dat a, rather than program instruct ions, is not

required to be word aligned. Therefore, a table block

can st art and en d at any by te address. If a tab le write is

being used to write executable code into program

memory, program instructions will need to be word

aligned (TBLPTRL<0> = 0).

The EEPROM on-chip timer controls the write and

erase times. The write and erase voltages are gener-

ated by an on-chip charge pump rated to operate over

the voltage range of the device for byte or word

operations.

FIGURE 6-1: TABLE READ OPERATION

Table Pointer(1) Table Latch (8-bit)

Program Memory

TBLPTRH TBLPTRL TABLAT

TBLPTRU

Instruction: TBLRD*

Note 1: Table Pointer points to a byte in program memory.

Program Memory

(TBLPTR)

PIC18F2220/2320/4220/4320

FIGURE 6-2: TABLE WRITE OPERATION

6.2 Control Registers

Several control registers are used in conjunction with

the TBLRD and TBLWT instructions. These include the:

• EECON1 register

• EECON2 register

• TABLAT register

• TBLPTR registers

6.2.1 EECON1 AND EECON2 REGISTERS

EECON1 is the control register for memory accesses.

EECON2 is not a physical register. Reading EECON2

will read all ‘0’s. The EECON2 register is used

exclusively in the memory write and erase sequences.

Control bit, EEPGD, dete rmine s if the a cc ess wil l be to

program or data EEPROM memory. When clear,

operations will access the data EEPROM memory.

When set, program memory is accessed.

Control bit, CFGS, determines if the access will be to

the configuration registers or to program memory/data

EEPROM memory. When set, subsequent operations

access configuration registers. When CFGS is clear,

the EEPGD bit selects either program Flash or data

EEPROM memory.

The FREE bit controls program memory erase opera-

tions. When the FREE bit is set, the erase operation is

initiated on the next WR command. When FREE is

clear, only writes are enabled.

The WREN bit enables and disables erase and write

operations. When set, erase and write operations are

allowed. When clear, erase and write operations are

disabl ed – the WR bit cannot be set w hile the W REN bit

is cle ar . Thi s proces s help s to pre vent accid ental writes

to memory du e to errant (unexp ected) code execution.

Firmware should keep the WREN bit clear at all times

except when starting erase or write operations. Once

firmware has set the WR bit, the WREN bit may be

cleared. Clearing the WREN bit will not affect the

operation in progress.

The WRERR bit is set when a write operation is inter-

rupted by a Reset. In these situations, the user can

check the WRERR bit and rewrite the location . It will b e

necessary to reload the data and address registers

(EEDAT A and EEAD R) as these registers have cleare d

as a result of the Reset.

Control bits, RD and WR, start read and erase/write

operatio ns, respectiv ely . Thes e bits are se t by firmware

and cleared by hardware at the completion of the

operation.

The RD bit cannot be set when accessing program

memory (EEPGD = 1). Program memory is read using

table read instructio ns. See Se ction 6.3 “Reading the

Flash Program Memory” regarding table reads.

Table Pointer(1) Table Latch (8-bit)

TBLPTRH TBLPTRL TABLAT

Program Memory

(TBLPTR)

TBLPTRU

Instruction: TBLWT*

Note 1: Table Pointer actually points to one of eight holding registers, the address of which is determined by

TBLPTRL<2:0>. The process for physically writing data to the program memory array is discussed in

Section 6.5 “Writing to Flash Program Memory”.

Holding Registers

Program Memory

Note: Interru pt flag bi t, EEIF in t he PIR2 regi ster,

is set when the write is complete. It must

be cleared in sof tw are.

PIC18F2220/2320/4220/4320

R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0

EEPGD CFGS — FREE WRERR WREN WR RD

bit 7 bit 0

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access program Flash memory

0 = Access data EEPROM memory

bit 6 CFGS: Flash Program/Data EE or Configuration Select bit

1 = Access configuration registers

0 = Access program Flash or data EEPROM memory

bit 5 Unimplemented: Read as ‘0’

bit 4 FREE: Flash Row Erase Enable bit

1 = Erase the program memory row addressed by TBLPTR on the next WR command

(cleared by completion of erase operation – TBLPTR<5:0> are ignored)

0 = Perform write only

bit 3 WRERR: EEPROM Error Flag bit

1 = A write operation was prematurely terminated (any Reset during self-timed programming)

0 = The write operation completed normally

Note: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows

tracing of the error condition.

bit 2 WREN: Write Enable bit

1 = Allows eras e or write cycles

0 = Inhibits erase or write cycles

bit 1 WR: Write Control bit

1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write

cycle. (The operation is self-timed and the bit is cleared by hardware once write is

complete. The WR bit can only be set (not cleared) in software.)

0 = Write cycle completed

bit 0 RD: Read Control bit

1 = Initiates a m emory re ad (R ead tak es o ne cyc le. RD is cleared in hardw are. Th e R D bit can

only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1.)

0 = Read completed

Legend:

R = Readable bit S = Settable only U = Unimplem ented bit, rea d as ‘0’ W = Writable bit

- n = V alue at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

6.2.2 TABLAT – TABLE LATCH REGISTER

The Table Latch (TABLAT) is an 8-bit register mapped

into the SFR sp ace. The Table Latc h register is used to

hold 8-bit data during data transfers between program

memory and data RAM.

6.2.3 TBLPTR – TABLE POINTER

The Table Pointe r (TBLPTR) reg ister ad dre ss es a byte

within the program memory . The TBLPTR is comprised

of three SFR regis ters: Table Point er Uppe r Byte, Table

Pointer High Byte and Table Pointer Low Byte

(TBLPTRU:TBLPTRH:TBLPTRL). These three regis-

ters join to form a 22-bit wide pointer. The low order

21 bits allow the device to address up to 2 Mbytes of

program memory space. Setting the 22nd bit allows

access to the device ID, the user ID and the

configuration bits.

The table pointer, TBLPTR, is used by the TBLRD and

TBLWT instructions. These instructions can update the

TBLPTR in one of four ways based on the table opera-

tion. These operations are shown in Table 6-1. These

operations on the TBLPTR only affect the low order

21 bits.

6.2.4 TABLE POINTER BOUNDARIES

TBLPTR is used in reads, writes and erases of the

Flash program memory.

When a TBLRD is executed, all 22 bits of the Table

Pointer determine which byte is read from program or

configuration memory into TABLAT.

When a TBLWT is executed, the three LSbs of the Table

Pointer (TBLPTR<2:0>) determine which of the eight

program memory holding registers is written to. When

the timed write to program memory (long write) begins,

the 19 MSbs of the TBLPTR (TBLPTR<2 1:3>) will deter-

mine which program memory block of 8 bytes is written

to (TBLPTR<2:0> are ignored). For more detail, see

Section 6.5 “Writing to Flash Program Memory”.

When an erase of program memory is executed, the

16 MSbs of the Table Pointer (TBLP TR<21 :6>) point to

the 64-byte block that will be erased. The Least

Significant bits (TBLPTR<5:0>) are ignored.

Figure 6-3 describes the relevant boundaries of

TBLPTR based on Flash program memory operations.

TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS

FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION

Example Operation on Table Pointer

TBLRD*

TBLWT* TBLPTR is not modified

TBLRD*+

TBLWT*+ TBLPTR is incremented after the read/write

TBLRD*-

TBLWT*- TBLPTR is decremented after the read/write

TBLRD+*

TBLWT+* TBLPTR is incremented before the read/write

21 16 15 87 0

ERASE – TBLPTR<21:6>

LONG WRITE – TBLPTR<21:3>

READ or WRITE – TBLPTR<21:0 >

TBLPTRL

TBLPTRH

TBLPTRU

PIC18F2220/2320/4220/4320

6.3 Reading the Flash Program

Memory

The TBLRD instruction is used to retrieve data from

program memory and place it into data RAM. Table

reads fro m program memory are pe rformed one byte at

a time.

TBLPTR points to a byte address in program space.

Executing a TBLRD instruction places the byte pointed

to into TABLAT. In addition, TBLPTR can be modified

automatically for the next table read operation.

The interna l program memory is typically org anized by

words. The Least Significan t bit of th e address selects

between the high and low bytes of the word. Figure 6-4

shows the interface between the internal program

memory and the TABLAT.

FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY

EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD

Odd (High) Byte

Program Memory

Even (Low) Byte

TABLAT

TBLPTR

Instruction Register

(IR) Read Register

LSB = 1

TBLPTR

LSB = 0

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base

MOVWF TBLPTRU ; address of the word

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW

MOVWF TBLPTRL

READ_WORD

TBLRD*+ ; read into TABLAT and increment TBLPTR

MOVFW TABLAT ; get data

MOVWF WORD_EVEN

TBLRD*+ ; read into TABLAT and increment TBLPTR

MOVFW TABLAT ; get data

MOVWF WORD_ODD

PIC18F2220/2320/4220/4320

6.4 Erasing Flash Program Memory

The minimum erase block size is 32 words or 64 bytes

under firmware control. Only through the use of an

external programmer, or through ICSP control, can

larger blo cks of program m emory be bulk eras ed. Word

erase in Flash memory is not supported.

When initiating an erase sequence from the micro-

controll er itsel f, a block of 64 by tes of program me mory

is erased. The Most Significant 16 bits of the

TBLPTR<21:6> point to the block being erased;

TBLPTR<5:0> are ignored.

The EECON1 regis te r com ma nds the era se operation.

The EEPGD bit must be set to point to the Flash pro-

gram memory. The CFGS bit must be clear to access

program Flash and data EEPROM memory. The

WREN bit must be set to enable write operations. The

FREE bit is set to select an erase operation. The WR

bit is set as part of the required instruction sequence

(as shown in Example 6-2) and starts the actual erase

operation. It is not necessary to load the TABLAT

For protection, the write initiate sequence using

EECON2 must be used.

A long w rite i s nec essary for erasing th e inte rnal Fl ash.

Instruction execution is halted while in a long write

cycle. The long write will be terminated by the internal

program ming timer.

6.4.1 FLASH PROGRAM MEMORY

ERASE SEQUENCE

The sequence of events for erasing a block of internal

program memory location is:

1. Load Table Pointer with address of row being

erased.

2. Set the EECON1 register for the erase operation:

• set EEPGD bit to point to program

memory;

• clear the CFGS bit to access program

memory;

• set WREN bit to enable writes;

• set FREE bit to enable the erase.

3. Disable int errup ts.

4. Write 55h to EECON2.

5. Write AAh to EECON2.

6. Set the WR bit. This will begin the row erase

cycle.

7. The CPU will stall for duration of the erase

(about 2 ms using internal timer).

8. Execute a NOP.

9. Re-enable interrupts.

EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW

MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW

MOVWF TBLPTRL

ERASE_ROW

BSF EECON1,EEPGD ; point to Flash program memory

BSF EECON1,WREN ; enable write to memory

BSF EECON1,FREE ; enable Row Erase operation

BCF INTCON,GIE ; disable interrupts

MOVLW 55h

MOVWF EECON2 ; write 55H

Required MOVLW AAh

Sequence MOVWF EECON2 ; write AAH

BSF EECON2,WR ; start erase (CPU stall)

NOP

BSF INTCON,GIE ; re-enable interrupts

PIC18F2220/2320/4220/4320

6.5 Writing to Flash Program Memory

The programming block size is 4 words or 8 bytes.

Word or byte programming is not supported.

Table writes a re us ed inte rnally to lo ad th e holdi ng reg-

isters n eeded to program the Flash m emory. There ar e

8 holding registers used by the table writes for

programming.

Since the Table Latch (TABLAT) is only a single byte,

the TBLWT instruction has to be executed 8 times for

each programming operation. All of the table write

operat ions will ess entially be sh ort writes becaus e only

the hold ing re gisters are w ritte n. At the end of upda ting

8 registers , the EECON1 register must be w ritten to, to

start the programming operation with a long write.

The long write is necessary for programming the inter-

nal F lash. Inst ruction e xecutio n is halt ed while in a lon g

write cycle. The long write will be terminated by the

internal programming timer.

FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY

6.5.1 FLASH PROGRAM MEMORY WRITE

SEQUENCE

The sequence of events for programming an internal

program memory location should be:

1. Read 64 bytes into R AM.

2. Update data values in RAM as necessary.

3. Load Table Pointer with address being erased.

4. Do the row erase procedure (see Section 6.4.1

“Flash Program Memory Erase Sequenc e”).

5. Load Table Pointer with address of first byte

being written.

6. Write the first 8 bytes into the holding registers

with auto-increment.

7. Set the EECON 1 register for the wri te operation:

• set EEPGD bit to point to program

memory;

• clear the CFGS bit to access program

memory;

• set WREN bit to enable byte writes.

8. Disable int errup ts.

9. Write 55h to EECON2.

10. Write AAh to EECON2.

11. Set the WR bit. This will begin the w rite cy cl e.

12. The CPU wil l st all for d uration o f the wr ite (abo ut

2 ms using internal timer).

13. Execute a NOP.

14. Re-enable interrupts.

15. Repeat steps 6-14 seven times, to write 64

bytes.

16. Verify the memory (table read).

This procedure will require about 18 ms to update one

row of 64 bytes of memory. An example of the required

code is given in Example 6-3.

Holding Register

TABLAT

Holding Register

TBLPTR = xxxxx7

Holding Register

TBLPTR = xxxxx1

Holding Register

TBLPTR = xxxxx0

88 8 8

Write Register

TBLPTR = xxxxx2

Program Memory

PIC18F2220/2320/4220/4320

EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY

MOVLW D'64 ; number of bytes in erase block

MOVWF COUNTER

MOVLW BUFFER_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW BUFFER_ADDR_LOW

MOVWF FSR0L

MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW ; 6 LSB = 0

MOVWF TBLPTRL

READ_BLOCK

TBLRD*+ ; read into TABLAT, and inc

MOVFW TABLAT ; get data

MOVWF POSTINC0 ; store data and increment FSR0

DECFSZ COUNTER ; done?

GOTO READ_BLOCK ; repeat

MODIFY_WORD

MOVLW DATA_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW DATA_ADDR_LOW

MOVWF FSR0L

MOVLW NEW_DATA_LOW ; update buffer word and increment FSR0

MOVWF POSTINC0

MOVLW NEW_DATA_HIGH ; update buffer word

MOVWF INDF0

ERASE_BLOCK

MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base

MOVWF TBLPTRU ; address of the memory block

MOVLW CODE_ADDR_HIGH

MOVWF TBLPTRH

MOVLW CODE_ADDR_LOW ; 6 LSB = 0

MOVWF TBLPTRL

BCF EECON1,CFGS ; point to PROG/EEPROM memory

BSF EECON1,EEPGD ; point to Flash program memory

BSF EECON1,WREN ; enable write to memory

BSF EECON1,FREE ; enable Row Erase operation

BCF INTCON,GIE ; disable interrupts

MOVLW 55h ; Required sequence

MOVWF EECON2 ; write 55H

MOVLW AAh

MOVWF EECON2 ; write AAH

BSF EECON1,WR ; start erase (CPU stall)

NOP

BSF INTCON,GIE ; re-enable interrupts

WRITE_BUFFER_BACK

MOVLW 8 ; number of write buffer groups of 8 bytes

MOVWF COUNTER_HI

MOVLW BUFFER_ADDR_HIGH ; point to buffer

MOVWF FSR0H

MOVLW BUFFER_ADDR_LOW

MOVWF FSR0L

PROGRAM_LOOP

MOVLW 8 ; number of bytes in holding register

MOVWF COUNTER

WRITE_WORD_TO_HREGS

MOVFW POSTINC0 ; get low byte of buffer data and increment FSR0

MOVWF TABLAT ; present data to table latch

TBLWT+* ; short write

; to internal TBLWT holding register, increment

TBLPTR

DECFSZ COUNTER ; loop until buffers are full

GOTO WRITE_WORD_TO_HREGS

PIC18F2220/2320/4220/4320

EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED)

6.5.2 WRITE VERIFY

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

6.5.3 UNEXPECTED TERMINATION OF

WRITE OPERATION

If a wri te is term in ate d by an unpl an ned ev en t, s uc h a s

loss of power or an unexpected Reset, the memory

locatio n jus t progra mmed shou ld be verifi ed and repr o-

grammed if needed. The WRERR bit is set when a

write operation is interrupted by a MCLR Reset, or a

WDT Time-out Reset, during normal operation. In

these situations, users can check the WRERR bit and

rewr ite the location.

6.6 Flash Program Operation During

Code Protection

See Section 23.0 “Special Features of the CPU”

(Section 23.5 “Program Verification and Code Pro-

tection”) for details on code protection of Flash

program memory.

TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY

PROGRAM_MEMORY

BCF INTCON,GIE ; disable interrupts

MOVLW 55h ; required sequence

MOVWF EECON2 ; write 55H

MOVLW AAh

MOVWF EECON2 ; write AAH

BSF EECON1,WR ; start program (CPU stall)

NOP

BSF INTCON,GIE ; re-enable interrupts

DECFSZ COUNTER_HI ; loop until done

GOTO PROGRAM_LOOP

BCF EECON1,WREN ; disable write to memory

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:

POR, BOR

Value on

all other

Resets

TBLPTRU —— bit 21 Program Memory Table Pointer Upper Byte

(TBLPTR<20:16>) --00 0000 --00 0000

TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 0000 0000 0000 0000

TBLPTRL Program Memory Table Pointer High Byte (TBLPTR<7:0>) 0000 0000 0000 0000

TABLAT Progr am Mem ory Table Latch 0000 0000 0000 0000

INTCON GIE/GIEH PEIE/GIEL TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u

EECON2 EEPROM Control Register 2 (not a physical register) — —

EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 uu-0 u000

IPR2 OSCFIP CMIP — EEIP BCLIP LVDIP TMR3IP CCP2IP 11-1 1111 ---1 1111

PIR2 OSCFIF CMIF — EEIF BCLIF LVDIF TMR3IF CCP2IF 00-0 0000 ---0 0000

PIE2 OSCFIE CMIE — EEIE BCLIE LVDIE TMR3IE CCP2IE 00-0 0000 ---0 0000

Legend: x = unknown, u = unchanged, r = reserved, - = unimplemented, read as ‘0’.

Shaded cells are not used during Flash/EEPROM access.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

7.0 DATA EEPROM MEMORY

The dat a EEPROM is reada ble and writ able durin g nor-

mal operation over the entire VDD range. The data

memory is not directly mapped in the register file

space. Instead, it is indirectly addressed through the

Special Function Registers (SFR).

There are four SFRs used to read and write the

program and data EEPROM memory. These registers

are:

• EECON1

• EECON2

• EEDATA

• EEADR

The EEPROM dat a memory allows byte read and write.

When interfacing to the data memory block, EEDATA

holds the 8-bit data for read/write and EEADR holds the

address of the EEPROM location being accessed.

These devices have 256 bytes of data EEPROM with

an address range from 00h to FFh.

The EEPROM data memory is ra ted for h igh er ase/w rite

cycle endurance. A byte write automatically erases the

location and writes the new data (erase-before-write). The

write time is controlled by an on-chip timer . The write time

will vary with voltage and temperature, as well as from

chip to chip. Ple ase refe r to parameter D1 22 (Table 26-1

in Section 26.0 “Electrical Characteristics”) for exact

limits.

7.1 EEADR

The address register can address 256 bytes of data

EEPROM.

7.2 EECON1 and EECON2 Registers

EECON1 is the control register for memory accesses.

EECON2 is not a physical register. Reading EECON2

will read all ‘0’s. The EECON2 register is used

exclusively in the memory write and erase sequences.

Control bit EEPGD determines if the access will be to

program or data EEPROM memory. When clear, oper-

ations will access the data EEPROM memory. When

set, program memory is accessed.

Control bit CFGS determines if the access will be to the

configuration registers or to program memory/data

EEPROM memory. When set, subsequent operations

access configuration registers. When CFGS is clear,

the EEPGD bit selects either program Flash or data

EEPROM memory.

The WREN bit enables and disables erase and write

operations. When set, erase and write operations are

allowed. When clear, erase and write operations are

disabl ed; th e WR bi t ca nno t be s et w hi le the WREN b it

is clear. This mechanism helps to prevent accidental

writes to memory due to errant (unexpected) code

execution.

Firmware should keep the WREN bit clear at all times

except when starting erase or write operations. Once

firmware has set the WR bit, the WREN bit may be

cleared. Clearing the WREN bit will not affect the

operation in progress.

The WRERR bit is set when a write operation is inter-

rupted by a Reset. In these situations, the user can

check the WRERR b it and rewrite the locati on. It is nec -

essary to reload the data and address registers

(EEDATA and EEADR), as these registers have

cleared as a result of the Reset.

Control bits, RD and WR, start read and erase/write

operat ions, respec tively . These bi ts are set by fi rmware

and cleared by hardware at the completion of the

operation.

The RD bit cannot be set when accessing program

memory (EEPGD = 1). Program memory is read using

table read instructions. See Section 6.1 “Table Read s

and Table Writes” regarding table reads.

Note: Interru pt flag bi t, EEIF in t he PIR2 regi ster,

is set when write is complete. It must be

cleared in software.

PIC18F2220/2320/4220/4320

R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0

EEPGD CFGS — FREE WRERR WREN WR RD

bit 7 bit 0

bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit

1 = Access program Flash memory

0 = Access data EEPROM memory

bit 6 CFGS: Flash Program/Data EE or Configuration Select bit

1 = Access configuration or calibration registers

0 = Access program Flash or data EEPROM memory

bit 5 Unimplemented: Read as ‘0’

bit 4 FREE: Flash Row Erase Enable bit

1 = Erase the program me mory row addresse d by TBLP TR on the next WR comm and (cleared

by completion of erase operation)

0 = Perform write only

bit 3 WRERR: EEPROM Error Flag bit

1 = A write operation was prematurely terminated

(MCLR or WDT Reset during self-timed erase or program operation)

0 = The write operation completed normally

Note: When a WRERR occurs, the EEPGD or FREE bits are not cleared. This allows

tracing of the error condition.

bit 2 WREN: Erase/Writ e Enable b it

1 = Allows erase/write cycles

0 = Inhibits erase/write cycles

bit 1 WR: Write Control bit

1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle.

(The operation is s elf -tim ed and the bi t is cleare d b y ha rdw are o nce wr i te is c om ple te. The

WR bit can only be set (not cleared) in software.)

0 = Write cycle is completed

bit 0 RD: Re ad Control bit

1 = Initiates a m em ory read (Re ad t ak es one cycle. R D is c lea red i n h ard ware. The RD bi t c an

only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1.)

0 = Read completed

Legend:

R = Readable bit S = Settable only U = Unimplemented bit, read as ‘0’ W = Writ able bit

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

7.3 Reading the Data EEPROM

Memory

To read a data memory location, the user must write th e

address to the EEADR register, clear the EEPGD con-

trol bit (EECON1<7>) and then set control bit, RD

(EECON1<0>). The data is available for the very next

instruction cycle; therefore, the EEDATA register can

be read by the next instruction. EEDATA will hold this

value u ntil an other re ad opera tion o r unt il it is written to

by the user (during a write operation).

7.4 Writing to the Data EEPROM

Memory

To write an EEPROM data location, the address must

first be written to the EEADR register and the data

written to the EEDATA register. The sequence in

Example 7-2 must be followed to initiate the write cycle.

The write will not begin if this sequence is not exactly

follow ed (write 55h to E ECON2, write AAh to EECON2,

then set WR bit) for each byte. It is strongly recom-

mended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in EECON1 must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution (i.e., runaway programs). The WREN bit should

be kept clear at all times except when updating the

EEPROM. The WREN bit is not cleared by hardware.

After a write sequence has been initiated, EECON1,

EEADR and EEDATA cannot be modified. The WR bit

will be inhibited from being set unless the WREN bit is

set. The WREN bit must be set on a previous instruc-

tion. Both WR a nd WREN c an not be se t with th e s am e

instruction.

At the completion of the write cycle, the WR bit is

cleared in hardware and the EEPROM Interrupt Flag bit

(EEIF) is set. The user may either enable this interrupt

or poll this bit. EEIF must be cleared by software.

7.5 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

7.6 Protection Against Spurious Write

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared.

Also, the Power-up Timer (72 ms duration) prevents

EEPROM write.

The writ e in iti ate sequence an d the WR EN bi t tog eth er

help prevent an accidental write during brown-out,

power glitch, or software malfunction.

EXAMPLE 7-1: DATA EEPROM READ

EXAMPLE 7-2: DATA EEPROM WRITE

MOVLW DATA_EE_ADDR ;

MOVWF EEADR ; Data Memory Address to read

BCF EECON1, EEPGD ; Point to DATA memory

BSF EECON1, RD ; EEPROM Read

MOVF EEDATA, W ; W = EEDATA

MOVLW DATA_EE_ADDR ;

MOVWF EEADR ; Data Memory Address to write

MOVLW DATA_EE_DATA ;

MOVWF EEDATA ; Data Memory Value to write

BCF EECON1, EEPGD ; Point to DATA memory

BSF EECON1, WREN ; Enable writes

BCF INTCON, GIE ; Disable Interrupts

MOVLW 55h ;

Required MOVWF EECON2 ; Write 55h

Sequence MOVLW AAh ;

MOVWF EECON2 ; Write AAh

BSF EECON1, WR ; Set WR bit to begin write

BSF INTCON, GIE ; Enable Interrupts

SLEEP ; Wait for interrupt to signal write complete

BCF EECON1, WREN ; Disable writes

PIC18F2220/2320/4220/4320

7.7 Operation During Code-Protect

Data EEPROM memory has its own code-protect bits in

configuration words. External read and write opera-

tions are disabled if either of these mechanisms are

enabled.

The mic rocontroll er its elf can bo th read and write to the

internal Data EEPROM regardless of the state of the

code-protect configuration bit. Refer to Section 23.0

“Special Features of the CPU” for additional

information.

7.8 Using the Data EEPROM

The dat a EEPROM is a hi gh-endu rance, byte a ddress-

able array that has been optimized for the storage of

frequently changing information (e.g., program vari-

ables or other data that are updated often). Frequently

changing values will typically be updated more often

than specification D124 or D124A. If this is not the

case, an array refresh must be performed. For this

reason, variables that change infrequently (such as

constants, IDs, calibration, etc.) should be stored in

Flash program memory.

A simple data EEPROM refresh routine is shown in

Example 7-3.

EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE

TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY

Note: If data EEPROM is only used to store

const a nts and/or data th at changes rarely,

an array refresh is likely not required. See

spec ification D124 or D124 A.

CLRF EEADR ; Start at address 0

BCF EECON1, CFGS ; Set for memory

BCF EECON1, EEPGD ; Set for Data EEPROM

BCF INTCON, GIE ; Disable interrupts

BSF EECON1, WREN ; Enable writes

LOOP ; Loop to refresh array

BSF EECON1, RD ; Read current address

MOVLW 55h ;

MOVWF EECON2 ; Write 55h

MOVLW AAh ;

MOVWF EECON2 ; Write AAh

BSF EECON1, WR ; Set WR bit to begin write

BTFSC EECON1, WR ; Wait for write to complete

BRA $-2

INCFSZ EEADR, F ; Increment address

BRA Loop ; Not zero, do it again

BCF EECON1, WREN ; Disable writes

BSF INTCON, GIE ; Enable interrupts

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on:

POR, BOR

Valu e on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u

EEADR EEPRO M Addres s Registe r 0000 0000 0000 0000

EEDATA EEPROM Data Register 0000 0000 0000 0000

EECON2 EEPROM Control Register 2 (not a physical register) — —

EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 uu-0 u000

IPR2 OSCFIP CMIP —EEIPBCLIP LVDIP TMR3IP CCP2IP 11-1 1111 ---1 1111

PIR2 OSCFIF CMIF —EEIFBCLIF LVDIF TMR3IF CCP2IF 00-0 0000 ---0 0000

PIE2 OSCFIE CMIE —EEIEBCLIE LVDIE TMR3IE CCP2IE 00-0 0000 ---0 0000

Legend: x = unknown, u = unchanged, r = reserved, - = unimplemented, read as ‘0’.

Shaded cells are not used during Flash/EEPROM access.

PIC18F2220/2320/4220/4320

8.0 8 X 8 HARDWARE MULTIPLIER

8.1 Introduction

An 8 x 8 hardware multiplier is included in the ALU of

the PIC18 F2X20/4X20 de vices. By mak ing the multi ply

a har dware operat ion, i t compl etes i n a sing le in struc-

tion cycle. This is an unsigned multiply that gives a

16-bit result. The result is stored into the 16-bit product

affect any flags in the Status register.

Making the 8 x 8 multiplier execute in a single-cycle

gives the following adv antages:

• Higher computational throughput

• Reduc es code siz e requ irem en t s for multip ly

algorithms

The performance increase allows the device to be used

in applications previously reserved for Digital Signal

Processors.

Table 8-1 shows a performance comparison between

enhanced devices using the single-cycle hardware

multiply and performing the same function without the

hardware multiply.

TABLE 8-1: PERFORMANCE COMPARISON

8.2 Operation

Example 8-1 shows the sequence to do an 8 x 8

unsigned multiply. Only one instruction is required

when one arg um ent of the mul tipl y is al ready loade d i n

the WREG register.

Exampl e 8-2 shows the sequence t o do an 8 x 8 signed

multi ply. To acco unt fo r t he sign bits o f the a rgu men ts,

each argument’s Most Significant bit (MSb) is tested

and the appropriate subtractions are done.

EXAMPLE 8- 1: 8 x 8 UNSIGNED

MULTIP L Y ROU TI NE

EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY

ROUTINE

Routine Multiply Method Program

Memory

(Words)

Cycles

(Max)

Time

@ 40 MHz @ 10 MHz @ 4 MHz

8 x 8 unsigned Without hardware multi ply 13 69 6.9 μs 27.6 μs 69 μs

Hardware multiply 1 1 100 ns 400 ns 1 μs

8 x 8 signed Without hardware multi ply 33 91 9.1 μs 36.4 μs 91 μs

Hardware multiply 6 6 600 ns 2.4 μs6 μs

16 x 16 unsigned Without hardw are mu lti ply 21 242 24.2 μs 96.8 μs 242 μs

Hardware multiply 28 28 2.8 μs11.2 μs28 μs

16 x 16 signed Without hard ware mu ltiply 52 254 25.4 μs102.6 μs 254 μs

Hardware multiply 35 40 4.0 μs 16.0 μs 40 μs

MOVF ARG1, W ;

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

MOVF ARG1, W

MULWF ARG2 ; ARG1 * ARG2 ->

; PRODH:PRODL

BTFSC ARG2, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG1

MOVF ARG2, W

BTFSC ARG1, SB ; Test Sign Bit

SUBWF PRODH, F ; PRODH = PRODH

; - ARG2

PIC18F2220/2320/4220/4320

Example 8-3 shows the sequence to do a 16 x 16

unsigned multiply. Equation 8-1 shows the algorithm

that is us ed. The 32-b it result is st ored in four re gisters,

RES3:RES0.

EQUATION 8-1: 16 x 16 UNSIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 8- 3: 16 x 16 UNSIGNED

MULTIPLY ROUTINE

Example 8-4 shows the sequence to do a 16 x 16

signed multiply. Equation 8-2 shows the algorithm

used. The 32-bit result is stored in four registers,

RES3:RES0. To account for the sign bits of the argu-

ment s, each argum ent p ai rs’ M ost S ignifi cant bit (M Sb)

is tested and the appropriate subtractions are done.

EQUATION 8-2: 16 x 16 SIGNED

MULTIPLICATION

ALGORITHM

EXAMPLE 8-4: 16 x 16 SIGNED

MU LTIPLY ROUTINE

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L ->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

;

MOVF ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H ->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

;

MOVF ARG1L, W

MULWF ARG2H ; ARG1L * ARG2H ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

MOVF ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L

= (ARG1H • ARG2H • 216) +

(ARG1H • ARG2L • 28) +

(ARG1L • ARG2H • 28) +

(ARG1L • ARG2L)

MOVF ARG1L, W

MULWF ARG2L ; ARG1L * ARG2L ->

; PRODH:PRODL

MOVFF PRODH, RES1 ;

MOVFF PRODL, RES0 ;

;

MOVF ARG1H, W

MULWF ARG2H ; ARG1H * ARG2H ->

; PRODH:PRODL

MOVFF PRODH, RES3 ;

MOVFF PRODL, RES2 ;

;

MOVF ARG1L, W

MULWF ARG2H ; ARG1L * ARG2H ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

MOVF ARG1H, W ;

MULWF ARG2L ; ARG1H * ARG2L ->

; PRODH:PRODL

MOVF PRODL, W ;

ADDWF RES1, F ; Add cross

MOVF PRODH, W ; products

ADDWFC RES2, F ;

CLRF WREG ;

ADDWFC RES3, F ;

;

BTFSS ARG2H, 7 ; ARG2H:ARG2L neg?

BRA SIGN_ARG1 ; no, check ARG1

MOVF ARG1L, W ;

SUBWF RES2 ;

MOVF ARG1H, W ;

SUBWFB RES3

;

SIGN_ARG1

BTFSS ARG1H, 7 ; ARG1H:ARG1L neg?

BRA CONT_CODE ; no, done

MOVF ARG2L, W ;

SUBWF RES2 ;

MOVF ARG2H, W ;

SUBWFB RES3

;

CONT_CODE

RES3:RES0

= ARG1H:ARG1L • ARG2H:ARG2L

= (ARG1H • ARG2H • 216) +

(ARG1H • ARG2L • 28) +

(ARG1L • ARG2H ² 28) +

(ARG1L • ARG2L) +

(-1 • ARG2H<7> • ARG1H:ARG1L • 216) +

(-1 • ARG1H<7> • ARG2H:ARG2L • 216)

PIC18F2220/2320/4220/4320

9.0 INTERRUPTS

The PIC18F2320/4320 devices have multiple interrupt

sources and an interrupt priority feature that allows

each interrupt source to be assigned a high priority

level or a low priority level. The high priority interrupt

vector is at 000008h and the low priority interrupt vector

is at 000018h. High priority interrupt events will

interrupt any low priority interrupts that may be in

progress.

There are ten registers which are used to control

interrupt operation. These registers are:

• RCON

•INTCON

• INTCON2

• INTCON3

• PIR1, PIR2

• PIE1, PIE2

• IPR1, IPR2

It is recommended that the Microchip header files

suppli ed with MP LAB® IDE be used fo r the symb olic bit

names in these registers. This allows the assembler/

compil er to automa tical ly ta ke care of the pla ceme nt of

these bits within the specified register.

In general, each interrupt source has three bits to

control its operation. The functions of these bits are:

• Flag bit to indicate that an interrupt event

occurred

• Enable bit that allows program execution to

branch to the interrupt vector address when the

flag bit is set

• Priority bit to select high priority or low priority

(most interrupt sources have priority bits)

The interrupt priority feature is enabled by setting the

IPEN bit (RCON<7>). When interrupt priority is

enabled, there are two bits which enable interrupts

globall y. Setting the GIEH bit (INTCO N<7>) enable s all

interrupts that have the priority bit set (high priority).

Setting the GIEL bit (INTCON<6>) enables all inter-

rupts that have the priority bit cleared (low priority).

When the interrupt flag, enable bit and appropriate

global int errupt enab le bit are set, the interrup t will vec-

tor immediately to address 000008h or 000018h,

depending on the priority bit setting. Individual inter-

rupts can be disabled through their corresponding

enable bits.

When the IPEN bit is cleared (default state), the

interrupt priority feature is disabled and interrupts are

compatible with PICmicro® mid-rang e devices. I n Com-

patib ility mode, the interrupt p riority bits for each source

have no effect. INTCON<6> is the PEIE bit which

enables/disables all peripheral interrupt sources.

INTCON<7> is the GIE bit which enables/disables all

interrupt sources. All interrupts branch to address

000008h in Compatibility mode.

When an interrupt is responded to, the global interrupt

enable bit is cleared to disable further interrupts. If the

IPEN bit is clear ed, this is the GIE bit. If interrupt priority

levels are used, this will be either the GIEH or GIEL bit.

High priority interrupt sources can interrupt a low

priority interrupt. Low priority interrupts are not

processed while high priority interrupts are in progress.

The return address is pushed onto the stack and the

PC is loaded with the interrupt vector address

(000008h or 000018h). Once in the Interrupt Service

Routine, the source(s) of the interrupt can be deter-

mined by polling the interrupt flag bits. The interrupt

flag bit s must be cleared in software be fore re-enab ling

interrupts to avoid recursive interrupts.

The “return from interrupt” instruction, RETFIE, exits

the interrup t routine and set s the GIE bit (GIEH or GI EL

if priority levels are used) which re-enables interrupts.

For external interrupt events, such as the INT pins or

the POR TB input chang e interrupt, the i nterrupt latenc y

will be three to four instruction cycles. The exact

latency is the same for one or two-cycle instructions.

Individual interrupt flag bits are set regardless of the

status of their corresponding enable bit or the GIE bit.

Note: Do not use the MOVFF instruction to modify

any of the interrupt control registers while

any interrupt is enabled. Doing so may

cause erratic microcontroller behavior.

PIC18F2220/2320/4220/4320

FIGURE 9-1: INTE RRUPT LOGIC

TMR0IE

GIEH/GIE

GIEL/PEIE

Wake -up if in

Interrupt to CPU

Vector to Location

0008h

INT2IF

INT2IE

INT2IP

INT1IF

INT1IE

INT1IP

TMR0IF

TMR0IE

TMR0IP

INT0IF

INT0IE

RBIF

RBIE

RBIP

IPEN

TMR0IF

TMR0IP

INT1IF

INT1IE

INT1IP

INT2IF

INT2IE

INT2IP

RBIF

RBIE

RBIP

INT0IF

INT0IE

GIEL\PEIE

Interrupt to CPU

Vector to Location

IPEN

IPE

0018h

PSPIF

PSPIE

PSPIP

PSPIF

PSPIE

PSPIP

ADIF

ADIE

ADIP

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

ADIF

ADIE

ADIP

High Priority Interrupt Generation

Low Priority Interrupt Generation

RCIF

RCIE

RCIP

Additional Peripheral Interrupts

Power Managed Mode

PIC18F2220/2320/4220/4320

9.1 INTCON Registers

The INTCON registers are readable and writable

bits.

Note: Interru pt flag bit s ar e set when an inter rupt

condition occurs regardless of the state of

its corresponding enable bit or the global

enable bit. User software should ensure

the appropriate interrupt flag bits are clear

prior to enabling an interrupt. This feature

allows for software polling.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x

GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF

bit 7 bit 0

bit 7 GIE/GIEH: Global Interrupt Enable bit

When IPEN = 0:

1 = Enables all unmasked interrupts

0 = Disables all interrupts

When IPEN = 1:

1 = Enables all high priority interrupts

0 = Disables all high priority interrupts

bit 6 PEIE/GIEL: Perip hera l Interr upt Enab le bit

When IPEN = 0:

1 = Enables all unmasked peripheral interrupts

0 = Disables all pe ripheral interrupts

When IPEN = 1:

1 = Enables all low priority peripheral interrupts

0 = Disables all low priority peripheral interrupts

bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit

1 = Enables the TMR0 overflow interrupt

0 = Disables the TMR0 overflow interrupt

bit 4 INT0IE: INT0 External Interrupt Enable bit

1 = Enables the INT0 external interrupt

0 = Disables the INT0 external interrupt

bit 3 RBIE: RB Port Change Interrupt Enable bit

1 = Enables the RB port change interrupt

0 = Disables the RB port change inte rrup t

bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit

1 = TMR0 re gister has overflowe d (must be cleare d in software)

0 = TMR0 re gister did no t overfl ow

bit 1 INT0IF: INT0 External Interrupt Flag bit

1 = The INT0 external interrupt occurred (must be cleared in software)

0 = The INT0 external interrupt did not occur

bit 0 RBIF: RB Port Change Interrupt Flag bit

1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)

0 = None of the RB7:RB4 pins have changed state

Note: A mismatch condition will continue to set this bit. Reading PORTB will end the

mismatch condition and allow the bit to be cleared.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1

RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP—RBIP

bit 7 bit 0

bit 7 RBPU: PORTB Pull-up Enable bit

1 = All PORTB pull-ups are disabled

0 = PORTB pull-ups are enabled by individual port latch values

bit 6 INTEDG0: Extern al Inte rrup t0 Edge Sele ct bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 5 INTEDG1: Extern al Inte rrup t1 Edge Sele ct bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 4 INTEDG2: Extern al Inte rrup t2 Edge Sele ct bit

1 = Interrupt on rising edge

0 = Interrupt on falling edge

bit 3 Unimplemented: Read as ‘0’

bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit

1 = High priority

0 = Low priority

bit 1 Unimplemented: Read as ‘0’

bit 0 RBIP: RB Port Change Interrupt Priority bit

1 = High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: In ter ru pt f l ag bi ts a r e s et wh en a n int e r rup t co ndi t io n o cc ur s reg a rdl es s o f th e state

of it s corre spond ing en able bit or the globa l ena ble bi t. User softw are s hould ensu re

the approp riate inte rrupt flag bits are clear prior to e nabling a n interrup t. This fe ature

allows for sof tware pol li ng.

PIC18F2220/2320/4220/4320

R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0

INT2IP INT1IP —INT2IEINT1IE— INT2IF INT1IF

bit 7 bit 0

bit 7 INT2IP: INT2 External Interrupt Priority bit

1 = High p riority

0 = Low priority

bit 6 INT1IP: INT1 External Interrupt Priority bit

1 = High p riority

0 = Low priority

bit 5 Unimplemented: Read as ‘0’

bit 4 INT2IE: INT2 External Interrupt Enable bit

1 = Enables the INT2 external interrupt

0 = Disables the INT2 external interrupt

bit 3 INT1IE: INT1 External Interrupt Enable bit

1 = Enables the INT1 external interrupt

0 = Disables the INT1 external interrupt

bit 2 Unimplemented: Read as ‘0’

bit 1 INT2IF: INT2 External Interrupt Flag bit

1 = The INT2 external interrupt occurred (must be cleared in software)

0 = The INT2 external interrupt did not occur

bit 0 INT1IF: INT1 External Interrupt Flag bit

1 = The INT1 external interrupt occurred (must be cleared in software)

0 = The INT1 external interrupt did not occur

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Note: In ter ru pt f l ag bi ts a r e s et wh en a n int e r rup t co ndi t io n o cc ur s reg a rdl es s o f th e state

of it s corre spond ing en able bit or the globa l ena ble bi t. User softw are s hould ensu re

the approp riate inte rrupt flag bits are clear prior to e nabling a n interrup t. This fe ature

allows for sof tware pol lin g.

PIC18F2220/2320/4220/4320

9.2 PIR Registers

The PIR regi sters c onta in the ind ividual fl ag bit s for the

peripheral interrupts. Due to the number of peripheral

interrupt sources, there are two Peripheral Interrupt

Flag registers (PIR1, PIR2).

Note 1: Interrupt flag bits are set when an interrupt

conditi on occ urs regardle ss of th e st ate of

its corresponding enable bit or the global

enable bit, GIE (INTCON<7>).

2: User software should ensure the appropri-

ate interrupt flag bits are cleared prior to

enabling an interrupt and after servicing

that interrupt.

R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0

PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF

bit 7 bit 0

bit 7 PSPIF(1): Parallel Slave Port Read/Write Interrupt Flag bit

1 = A read or a write operation has taken place (must be cleared in software)

0 = No read or writ e has occurred

Note 1: This bit is reserved on PIC18F2X20 devices; always maintain this bit clear.

bit 6 ADIF: A/D Converter Interrupt Flag bit

1 = An A/D conversion completed (must be cleared in software)

0 = The A/D conversion is not complete

bit 5 RCIF: USART Receive Interrupt Flag bit

1 = The USART receive buffer, RCREG, is full (cleared when RCREG is read)

0 = The USART receiv e buffer is empty

bit 4 TXIF: USART Transmit Interrupt Flag bit

1 = The USART transmit buffer, TXREG, is empty (cleared when TXREG is written)

0 = The USART transmit buffer is full

bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit

1 = The transmission/reception is complete (must be cleared in software)

0 = Waiting to transmit/receive

bit 2 CCP1IF: CCP1 Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurre d (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Unused in this mode .

bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit

1 = TMR2 to PR2 match occurred (must be cleared in software)

0 = No TMR2 to PR2 match occurred

bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit

1 = TMR1 register overflowed (must be cleared in software)

0 = TMR1 re gister did no t overfl ow

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

OSCFIF CMIF — EEIF BCLIF LVDIF TMR3IF CCP2IF

bit 7 bit 0

bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit

1 = System oscill ator faile d, clock input has change d to INT OSC (mu st be clea red in softwa re)

0 = System clock operating

bit 6 CMIF: Comparator Interrupt Flag bit

1 = Comparator input has changed (must be cleared in software)

0 = Comparator input has not changed

bit 5 Unimplemented: Read as ‘0’

bit 4 EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit

1 = The write operation is complete (must be cleared in software)

0 = The write operation is not complete, or has not been started

bit 3 BCLIF: Bus Collision Interrupt Flag bit

1 = A bus collision occurred (must be cl eared in s oftware)

0 = No bus collision occurred

bit 2 LVDIF: Low-Voltage Detec t Interrupt Flag bit

1 = A low-voltage condition occurred (must be cleared in software)

0 = The device voltage is above the Low-Voltage Detect trip point

bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit

1 = TMR3 register overflowed (must be cleared in software)

0 = TMR3 register did not overflow

bit 0 CCP2IF: CCPx Interrupt Flag bit

Capture mode:

1 = A TMR1 register capture occurred (must be cleared in software)

0 = No TMR1 register capture occurred

Compare mode:

1 = A TMR1 register compare match occurred (must be cleared in software)

0 = No TMR1 register compare match occurred

PWM mode:

Unused in this mode.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

9.3 PIE Registers

The PIE registers contain the individual enable bits for

the peripheral interrupts. Due to the number of periph-

eral interrupt sources, there are two Peripheral Inter-

rupt E nable registers (PIE1, PIE2). When IPEN = 0, the

PEIE bit must be set to enable any of these peripheral

interrupts.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE

bit 7 bit 0

bit 7 PSPIE(1): Parallel Slave Port Read/Write Interrupt Enable bit

1 = Enables the PSP read/write interrupt

0 = Disables the PSP read/write interrupt

Note 1: This bit is reserved on PIC18F2X20 devices; always maintain this bit clear.

bit 6 ADIE: A/D Converter Interrupt Enable bit

1 = Enables the A/D interrupt

0 = Disables the A/D interrupt

bit 5 RCIE: USART Rece iv e Interru pt Enab le bit

1 = Enables the USART receive interrupt

0 = Disables the USART receive interrupt

bit 4 TXIE: USART Transmit Interrupt Enable bit

1 = Enables the USART transmit interrupt

0 = Disables the USART transmit interrupt

bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit

1 = Enables the MSSP interrupt

0 = Disables the MSSP interrupt

bit 2 CCP1IE: CCP1 Interrupt Enable bit

1 = Enables the CCP1 interrupt

0 = Disables the CCP1 interrupt

bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit

1 = Enables the TMR2 to PR2 match interrupt

0 = Disables the TMR2 to PR2 match interrupt

bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit

1 = Enables the TMR1 overflow interrupt

0 = Disables the TMR1 overflow interrupt

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

OSCFIE CMIE — EEIE BCLIE LVDIE TMR3IE CCP2IE

bit 7 bit 0

bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 6 CMIE: Comparator Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 5 Unimplemented: Read as ‘0’

bit 4 EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 3 BCLIE: Bus Collision Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 2 LVDIE: Low-Voltage Detect Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit

1 = Enabled

0 =Disabled

bit 0 CCP2IE: CCP2 Interrupt Enable bit

1 = Enabled

0 =Disabled

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

9.4 IPR Registers

The IPR registers contain the individual priority bits for

the peripheral interrupts. Due to the number of periph-

eral interrupt sources, there are two Peripheral Inter-

rupt Priority registers (IPR1, IPR2). Using the priority

bits requires that the In terrupt Priority Enabl e (IPEN) bit

be set.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP

bit 7 bit 0

bit 7 PSPIP(1): Parallel Slave Port Read/Write Interrupt Priority bit

1 =High priority

0 = Low priority

Note 1: This bit is reserved on PIC18F2X20 devices; always maintain this bit set.

bit 6 ADIP: A/D Converter Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5 RCIP: USART Receive Interrupt Priority bit

1 =High priority

0 = Low priority

bit 4 TXIP: USART Transmit Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit

1 =High priority

0 = Low priority

bit 2 CCP1IP: CCP1 Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

OSCFIP CMIP — EEIP BCLIP LVDIP TMR3IP CCP2IP

bit 7 bit 0

bit 7 OSCFIP: Oscilla tor Fail Interrupt Priority bit

1 =High priority

0 = Low priority

bit 6 CMIP: Comparator Interrupt Priority bit

1 =High priority

0 = Low priority

bit 5 Unimplemented: Read as ‘0’

bit 4 EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit

1 =High priority

0 = Low priority

bit 3 BCLIP: Bus Collision Interrupt Priority bit

1 =High priority

0 = Low priority

bit 2 LVDIP: Low-Voltage Detect Interrupt Priority bit

1 =High priority

0 = Low priority

bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit

1 =High priority

0 = Low priority

bit 0 CCP2IP: CCP2 Interrupt Priority bit

1 =High priority

0 = Low priority

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

9.5 RCON Register

The RCO N register con tains bits used to determine th e

cause of the last Reset or wake-up from power man-

aged mode. RCON also contains the bit that enables

interrupt priorities (IPEN).

R/W-0 U-0 U-0 R/W-1 R-1 R-1 R/W-0 R/W-0

IPEN ——RITO PD POR BOR

bit 7 bit 0

bit 7 IPEN: Interrupt Priority Enable bit

1 = Enable priority levels on interrupts

0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode)

bit 6-5 Unimplemented: Read as ‘0’

bit 4 RI: RESET Instruction Flag bit

1 = The RESET instruction was not executed (set by firmware only)

0 = The RESET instruction was executed causing a device Reset (must be set in software after

a Br own-out Reset occurs)

bit 3 TO: Watchdog Time-out Flag bit

1 = Set by power-up, CLRWDT instruction or SLEEP instruction

0 = A WDT time-out occurred

bit 2 PD: Power-Down Detection Flag bit

1 = Set by power-up or by the CLRWDT instructi on

0 = Cleared by execution of the SLEEP instruction

bit 1 POR: Power-on Reset Status bit

1 = A Power-on Reset has not occurred (set by firmware only)

0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)

bit 0 BOR: Brown-out Reset Status bit

1 = A Brown-out Reset has not occurred (set by firmware only)

0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

9.6 INTn Pin Interrupts

External interrupts on the RB0/INT0, RB1/INT1 and

RB2/INT2 pins are edge triggered: either rising if the

corresp onding INTEDGx b it is set in the INTCON2 re g-

ister, or fall in g i f t he INTEDGx bi t i s cl ear. When a v ali d

edge appears on the RBx/INTx pin, the corresponding

flag bit, INTxF, is set. This interrupt can be disabled by

clearing the corresponding enable bit, INTxE. Flag bit,

INTxF, must be cleared in so ftware in the In terrupt Ser-

vice Routine before re-enabling the interrupt. All exter-

nal interrupts (INT0, INT1 and INT2) can wake-up the

process or fr om the power ma naged m odes if bit INT xE

was set prior to going into power managed modes. If

the globa l i nterrupt enable b it G IE is set, th e processor

will branch to the interrupt vector following wake-up.

Interrupt priority for INT1 and INT2 is determined by the

value contained in the Interrupt Priority bits, INT1IP

(INTCON3<6>) and INT2IP (INTCON3<7>). There is

no priority bit associated with INT0. It is always a high

priority interrupt source.

9.7 TMR0 Interrupt

In 8-bit mode (which is the default), an overflow

(FFh →00h) in the TMR0 register will set flag bit

TMR0IF. In 16-bi t mode, an o verflow (FFFF h → 0000h)

in the TMR0H :TMR0L register s will set flag bit TMR0IF.

The interrup t can be enable d/dis abled by setting/cle ar-

ing en able bit, T MR0IE (I NTCON< 5>). In terrupt priorit y

for Timer0 is determined by the value contained in the

interrupt priority bit, TMR0IP (INTCON2<2>). See

Section 11.0 “Timer0 Module” for further details on

the Timer0 module.

9.8 PORTB Interrupt-on-Change

An input change on PORTB<7:4> sets flag bit, RBIF

(INTCON<0>). The interrupt can be enabled/disabled

by setting/clearing enable bit, RBIE (INTCON<3>).

Interrupt priority for PORTB interrupt-on-change is

determined by the value contained in the interrupt

priority bit, RBIP (INTCON2<0>).

9.9 Context Saving During Interrupts

During interrupts, the return PC address i s saved on the

stack. Additional ly , the WREG, S tatus and BSR registers

are saved on the fast return stack. If a fast return from

interrupt is not used (See Section 5.3 “Fast Register

Stack”), the user may need to save the WREG, Status

and BSR registers on entry to the Interrupt Service Rou-

tine. Depending on the user’s application, other registers

may also need to be saved. Example 9-1 saves and

restores the WREG, Status and BSR registers during an

Interrupt Service Routine.

EXAMPLE 9-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM

MOVWF W_TEMP ; W_TEMP is in virtual bank

MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere

MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere

;

; USER ISR CODE

;

MOVFF BSR_TEMP, BSR ; Restore BSR

MOVF W_TEMP, W ; Restore WREG

MOVFF STATUS_TEMP, STATUS ; Restore STATUS

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

10.0 I/O PORTS

Depending on the device selected and features

enabled, there are up to five ports available. Some pins

of th e I/O ports are multi ple xed with an a lter nate f unc -

tion from the peripheral features on the device. In gen-

eral, when a peripheral is enabled, that pin may not be

used as a general purpose I/O pin.

Each port has three registers for its operation. These

registers are:

• TRIS register (Data Direction register)

• POR T register (rea ds the lev els on the pin s of the

device)

• LAT register (Data Latch)

The Dat a Latch (LAT register ) is useful for read -modify-

write operations on the value that the I/O pins are

driving.

A simplified model of a generic I/O port without the

interf aces to o ther peripheral s i s sho w n in Fi gure 10-1.

FIGURE 10-1: GENERIC I/O PORT

OPERATION

10.1 PORTA , TRISA and LATA

Registers

PORTA is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISA. Setting a

TRISA bit (= 1) will make the co rresponding PORT A pin

an input (i.e., put the corresponding output driver in a

High-Impedance mode). Clearing a TRISA bit (= 0) will

make the correspondin g POR T A p in an output (i.e., p ut

the contents of the output latch on the selected pin).

Reading the PORTA register reads the status of the

pins, whereas writing to it, will write to the port latch.

The Data La tch register (LA TA) is also memory m apped.

Read-modify-write operations on the LATA register read

and write the latched output valu e for PORTA.

The RA4 pin is multiplexed with the Timer0 module

clock input and one of the comparator outputs to

become the RA4/T0CKI/C1OUT pin. Pins RA6 and

RA7 are multiplexed with the main oscillator pins; they

are enabled as oscillator or I/O pins by the selection of

the main oscillator in Configuration Register 1H (see

Section 23.1 “Configuration Bits” for details). When

they are not used as port pins, RA6 and RA7 and their

associated TRIS and LAT bits are read as ‘0’.

The other PORTA pins are multiplexed with analog

inputs, the analog VREF+ and VREF- inputs and the com-

parator voltage reference output. The operation of pins,

RA3:RA0 and RA5, as A/D conver ter inputs is selected

by cleari ng/setting the cont rol bits in the ADCON1 r eg-

ister (A/D Control Register 1). Pins RA0 through RA5

may also be used as comparator inputs or outputs by

setting the appropriate bits in the CMCON register.

The R A4/T0C KI/C1O UT pin is a Schmit t Trigg er inpu t

and an open-drain output. All other PORTA pins have

TTL input levels and full CMOS output drivers.

The TRISA register controls the direction of the RA pins

even when they are being used as analog inputs. The

user must ensure the bits in the TRISA register are

maintained set when using them as analog inputs.

EXAMPLE 10-1: INITIALIZING PORTA

Data

Bus

WR LAT

WR TRIS

RD Port

Data Latch

TRIS Latch

RD TRIS

Input

Buffer

I/O pin(1)

RD LAT

or Port

Note 1: I/O pins have diode protection to VDD and VSS.

Note: On a Power-on Reset, RA5 and RA3:RA0

are configured as analog inputs and read

as ‘0’. RA4 is configured as a digital input.

CLRF PORTA ; Initialize PORTA by

; clearing output

; data latches

CLRF LATA ; Alternate method

; to clear output

; data latches

MOVLW 0x07 ; Configure A/D

MOVWF ADCON1 ; for digital inputs

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISA ; Set RA<3:0> as inputs

; RA<5:4> as outputs

PIC18F2220/2320/4220/4320

FIGURE 10-2: BLOCK DIAGRAM OF

RA3:RA0 AND RA5 PINS

FIGURE 10-3: BLOCK DIAGRAM OF

RA6 PIN

FIGURE 10-4: BLOCK DIAGRAM OF

RA4/T0CKI PIN

FIGURE 10-5: BLOCK DIAGRAM OF

RA7 PIN

Data

Bus

WR LATA

WR TRISA

Data Latch

TRIS Latch

RD TRISA

RD PORTA

VSS

VDD

I/O pin(1)

Note 1: I/O pins have protection diodes to VDD and VSS.

Analog

Input

Mode

TTL

Input

Buffer

To A/D Converter and LVD Modules

RD LATA

PORTA

SS Input (RA5 only)

Data

Bus

WR LATA

Data Latch

TRIS Latch

RD PORTA

VSS

VDD

I/O pin(1)

Note 1: I/O pins have protection diodes to VDD and VSS.

PORTA

RD LATA

RA6 Enable

ECIO or

Enable

TTL

Input

Buffer

RCIO

TRISA

Data

Bus

WR TRISA

RD PORTA

Data Latch

TRIS Latch

Schmitt

Trigger

Input

Buffer

VSS

I/O pin(1)

TMR0 Clock Input

RD LATA

WR LATA

PORTA

Note 1: I/O pins have protection diodes to VDD and VSS.

RD TRISA

Data

Bus

WR LATA

Data Latch

TRIS Latch

RD PORTA

VSS

VDD

I/O pin(1)

Note 1: I/O pins have protection diodes to VDD and VSS.

PORTA

RD LATA

Enable

TTL

Input

Buffer

RA7

TRISA

RA7 Enab le To Oscillator

PIC18F2220/2320/4220/4320

TABLE 10-1: PORTA FUNCTIONS

TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA

Name Bit# Buffer Function

RA0/AN0 bit 0 TTL Input/output or analog input.

RA1/AN1 bit 1 TTL Input/output or analog input.

RA2/AN2/VREF-/CVREF bit 2 TTL Input/output, analog input, VREF- or Comparator VREF output.

RA3/AN3/VREF+ bit 3 TTL Input/output, analog input or VREF+.

RA4/T0CKI/C1OUT bit 4 ST Input/output, external clock input for Timer0 or Comparator 1

output. Output is open-drain type.

RA5/AN4/SS/LVDIN/C2OUT bit 5 TTL Input/output, analog input, Slave Select input for Synchronous

Serial Port, Low-Voltage Detect input or Comparator 2 output.

OSC2/CLKO/RA6 bit 6 TTL OSC2, clock output or I/O pin.

OSC1/CLKI/RA7 bit 7 TTL OSC1, clock input or I/O pin.

Legend: TTL = TTL input, ST = Schmitt Trigger input

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Valu e on

all othe r

Resets

PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 uu0u 0000

LATA LATA7(1) LATA6(1) LATA Data Latch Register xxxx xxxx uuuu uuuu

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register 1111 1111 1111 1111

ADCON1 — — VCFG1 VCFG0PCFG3PCFG2PCFG1PCFG0--00 0000 --00 0000

CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111

CVRCON CVREN CVROE CVRR —CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000

Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.

Note 1: RA7:RA6 and their associated latch and data direction bits are enabled as I/O pins based on oscillator configuration;

otherwise, they are read as ‘0’.

PIC18F2220/2320/4220/4320

10.2 PORTB, TRISB and LATB

Registers

PORTB is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISB. Setting a

TRISB bit (= 1) will make the corresponding PORTB

pin an input (i.e., put the corresponding output driver in

a High-Impedance mode). Clearing a TRISB bit (= 0)

will make th e corresp onding POR TB pi n an out put (i.e .,

put the contents of the output latch on the selected pin).

The Data Latch register (LATB) is also memory

mapped. Read-modify-write operations on the LATB

PORTB.

EXAMPLE 10-2: INITIALIZI NG PORTB

Each of th e POR TB pins has a we ak inte rnal pul l-up. A

single control bit can turn on all the pull-ups. This is per-

formed by clearing bit RBPU (INTCON2<7>). The

weak pull-up is automatically turned off when the port

pin is configured as an output. The pull-ups are

disabled on a Power-on Reset.

Four of the PORTB pins (RB7:RB4) have an interrupt-

on-change feature. Only pins configured as inputs can

cause this interrupt to occur (i.e., any RB7:RB4 pin

configured as an output is excluded from the interrupt-

on-change comparison). The input pins (of RB7:RB4)

are compared with the old value latched on the last

read of PORTB. The “mismatch” outputs of RB7:RB4

are OR’ed together to generate the RB Port Change

Interrupt with Flag bit, RBIF (INTCON<0>).

This interrupt can wake the device from Sleep. The

user, in the Interrupt Service Routine, can clear the

interrupt in the following manner:

a) Any read or write of PORTB (except with the

MOVFF (ANY), PORTB instruction). This will

end the mismatch condition.

b) Clear flag bit RBIF.

A mism at c h c ond it i on wi ll co nti n ue to s et f lag bi t RB IF.

Reading PORTB will end the mismatch condition and

allow flag bit RBIF to be cleared.

The interrupt-on-change feature is recommended for

wake-up on key depression operation and operations

where PORTB is only used for the interrupt-on-change

feature. Polling of PORTB is not recommended while

using the interrupt-on-change feature.

RB3 can be configured by the configuration bit,

CCP2MX, as the alternate peripheral pin for the CCP2

module (CCP2MX = 0).

FIGURE 10-6: BLOCK DIAGRAM OF

RB7:RB5 PINS

Note: On a Power-on Reset, RB4:RB0 are con-

figured as analog inputs by default and

read as ‘0’; RB7:RB5 are configured as

digital inputs.

By programming the configuration bit,

PBADEN (CONFIG3H<1>), RB4:RB0 will

alternatively be configured as digita l inputs

on POR.

CLRF PORTB ; Initialize PORTB by

; clearing output

; data latches

CLRF LATB ; Alternate method

; to clear output

; data latches

MOVLW 0x0F ; Set RB<4:0> as

MOVWF ADCON1 ; digital I/O pins

; (required if config bit

; PBADEN is set)

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISB ; Set RB<3:0> as inputs

; RB<5:4> as outputs

; RB<7:6> as inputs

Data Latch

From other

RBPU(2) P

VDD

I/O pin(1)

Data Bus

WR LATB

WR TRISB

Set RBIF

TRIS Latch

RD TRISB

RD PORTB

RB7:RB5 and

Weak

Pull-up

RD PORTB

Latch

TTL

Input

Buffer ST

Buffer

RB7:RB5 in Serial Programming Mode

RD LATB

or PORTB

Note 1: I/O pins have diode protec tion to V DD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s)

and clear the RBPU bit (INTCON2<7>).

RB4 pins

PIC18F2220/2320/4220/4320

FIGURE 10-7: BLOCK DIAGRAM OF

RB2:RB0 PINS FIGURE 10-8: BLOCK DIAGRAM OF

RB4 PIN

FIGURE 10-9: BLOCK DIAGRAM OF RB3/CCP2 PIN

Data Latch

RBPU(2)

VDD

Data Bus

WR LATB

WR TRISB

RD TRISB

RD PORTB

Weak

Pull-up

INTx

I/O pin(1)

Schmitt Trigger

Buffer

TRIS Latch

RD LATB

or PORTB

Note 1: I/O pins have diode protection to VDD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS

bit(s) and clear the RBPU bit (INTCON2<7>).

To A/D Converter

Analog Input Mode

TTL

Input

Buffer

Data Latch

From RB7:RB5

RBPU(2) P

VDD

I/O pin(1)

Data Bus

WR LATB

WR TRISB

Set RBIF

TRIS Latch

RD TRISB

RD PORTB

Weak

Pull-up

RD PORTB

Latch

TTL

Input

Buffer

RD LATB

or PORTB

Note 1: I/O pins have diode protec tion to V DD and VSS.

2: To enable weak pull-ups, set the appropriate TRIS bit(s)

and clear the RBPU bit (INTCON2<7>).

To A/D Converter

Port/CCP2 Select

Data Bus

WR LATB

WR TRISB

Data Latch

TRIS Latch

RD TRISC

CCP2 Data Out

VDD

VSS

RD PORTB

CCP2 Inpu t

RB3 pin(1)

or PORTB

RD LATC

Schmitt

Trigger

Note 1: I/O pins have diode protection to VDD and VSS.

VDD

Weak

Pull-up

RBPU

TTL Input

Buffer

Analog Input Mode

Analog Inpu t Mod e

To A/D Converter

PIC18F2220/2320/4220/4320

TABLE 10-3: PORTB FUNCTIONS

TABLE 10-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB

Name Bit# Buffer Function

RB0/AN12/INT0 bit 0 TTL(1)/ST(2) Input/output pin, analog input or external interrupt input 0.

Internal software programmable weak pull-up.

RB1/AN10/INT1 bit 1 TTL(1)/ST(2) Input/output pin, analog input or external interrupt input 1.

Internal software programmable weak pull-up.

RB2/AN8/INT2 bit 2 TTL(1)/ST(2) Input/output pin, analog input or external interrupt input 2.

Internal software programmable weak pull-up.

RB3/AN9/CCP2 bit 3 TTL(1)/ST(3) Input/output pin or analog input. Capture2 input/Compare2 output/

PWM output when CCP2MX configuration bit is set(4).

Internal software programmable weak pull-up.

RB4/AN11 /KBI0 bit 4 TTL Input/output pin (with interrupt-on-change) or analog input.

Internal software programmable weak pull-up.

RB5/KBI1/PGM bit 5 TTL/ST(5) Input/output pin (with interrupt-on-change). Internal software

programmable weak pull-up. Low-voltage ICSP enable pin.

RB6/KBI2/PGC bit 6 TTL/ST(5) Input/output pin (with interrupt-on-change). Internal software

programmable we ak pull-u p. Se rial prog ramming clock.

RB7/KBI3/PGD bit 7 TTL/ST(5) Input/output pin (with interrupt-on-change). Internal software

progra mmable we ak pull-up. Serial programming data.

Legend: TTL = TTL input, ST = Schmitt T rig ge r input

Note 1: This buffer is a TTL input when configured as digital I/O.

2: This buffer is a Schmitt Trigger input when configured as the external interrupt.

3: This buffer is a Schmitt Trigger input when configured as the CCP2 input.

4: A device configuration bit selects which I/O pin the CCP2 pin is multiplexed on.

5: This buffer is a Schmitt Trigger input when used in Serial Programming mode.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxq qqqq uuuu uuuu

LATB LATB Data Latch Register xxxx xxxx uuuu uuuu

TRISB PORTB Data Direction Register 1111 1111 1111 1111

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 —TMR0IP —RBIP1111 -1-1 1111 -1-1

INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 11-0 0-00

ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0000 --00 0000

Legend: x = unknown, u = unchanged, q = value depends on condition. Shaded cells are not used by PORTB.

PIC18F2220/2320/4220/4320

10.3 PORTC, TRISC and LATC

Registers

PORTC is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISC. Setting a

TRISC bit (= 1) will make the corresponding PORTC

pin an input (i.e., put the corresponding output driver in

a High-Impedance mode). Clearing a TRISC bit (= 0)

will mak e the correspo nding PORT C pin an ou tput (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LATC) is also memory

mapped. Read-modify-write operations on the LATC

PORTC.

PORT C is multip lexed with s everal periphe ral function s

(Table 10-5). The pins have Schmitt Trigger input buff-

ers. RC1 is normally configured by configuration bit,

CCP2MX (CONFIG3H<0>), as the default peripheral

pin of the CCP2 module (default/erased state,

CCP2MX = 1).

When enabling peripheral functions, care should be

taken in defining TRIS bits for each PORTC pin. Some

peripherals override the TRIS bit to make a pin an output,

while other peripherals override the TRIS bit to make a

pin an input. The user should refer to the corresponding

periph eral se ctio n for the corre ct TRIS bit se tting s.

The contents of the TRISC register are affected by

peripheral overrides. Reading TRISC always returns

the current contents even though a peripheral device

may be overriding one or more of the pins.

EXAMPLE 10-3: INITIALIZING PORTC

FIGURE 10-10: PORTC BLOCK DIAGRAM (PERIPHERAL OUTPUT OVERRIDE)

Note: On a Power-on Reset, these pins are

configured as digital inputs.

CLRF PORTC ; Initialize PORTC by

; clearing output

; data latches

CLRF LATC ; Alternate method

; to clear output

; data latches

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISC ; Set RC<3:0> as inputs

; RC<5:4> as outputs

; RC<7:6> as inputs

Data Bus

WR LATC or

WR TRISC

RD TRISC

Periphe ra l Data Out

RD PORTC

Periphe ra l Data In

WR PORTC

RD LATC

Periphe ral Output

Schmitt

Port/Peripheral Se le c t(2)

Enable(3)

VSS

VDD

I/O pin(1)

Note 1: I/O pins have diode protection to VDD and VSS.

2: Port/Peripheral Select signal selects between port data (output) and peripheral output.

3: Peripheral Output Enable is only active if Peripheral Select is active.

Data Latch

TRIS Latch

Trigger

PIC18F2220/2320/4220/4320

TABLE 10-5: PORTC FUNCTIONS

TABLE 10-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC

Name Bit# Buffer Type Function

RC0/T1OSO/T1CKI bit 0 ST Input/output port pin or Timer1 oscillator output/Timer1 clock input.

RC1/T1OSI/CCP2 bit 1 ST Input/output port pin, Timer1 oscillator input or Capture2 input/

Compare2 output/PWM output when CCP2MX configuration bit is

disabled.

RC2/CCP1/P1A(1) bit 2 ST Input/output port pin, Capture1 input/Compare1 output/PWM1 output

or enhanced PWM output A(1).

RC3/SCK/SCL bit 3 ST RC3 can also be the synchronous serial clock for both SPI and I2C

modes.

RC4/SDI/SDA bit 4 ST RC4 can also be the SPI Data In (SPI mode) or Data I/O (I2C mode).

RC5/SDO bit 5 ST Input/output port pin or Synchronous Serial Port data output.

RC6/TX/CK bit 6 ST Input/output port pin, Addressable USART Asynchronous Transmit or

Addressable USART Synchronous Clock.

RC7/RX/DT bit 7 ST Input/output port pin, Addressable USART Asynchronous Receive or

Addressable USART Synchronous Data.

Legend: ST = Schm itt Trigg er inpu t

Note 1: Enhanced PWM output is available only on PIC18F4X20 devices.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

Value on

all other

Resets

PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx uuuu uuuu

LATC LATC Data Latch Register xxxx xxxx uuuu uuuu

TRISC PORTC Data Direction Register 1111 1111 1111 1111

Legend: x = unknown, u = unchanged

PIC18F2220/2320/4220/4320

10.4 PORTD, TRISD and LATD

Registers

PORTD is an 8-bit wide, bidirectional port. The corre-

sponding data direction register is TRISD. Setting a

TRISD bit (= 1) will make the corresponding PORTD

pin an input (i.e., put the corresponding output driver in

a High-Impedance mode). Clearing a TRISD bit (= 0)

will mak e the correspo nding PORT D pin an ou tput (i.e.,

put the contents of the output latch on the selected pin).

The Data Latch register (LA TD) is also memory mapped.

Read-modify-write operations on the LATD register read

and write the latched output val ue for POR TD.

All pins on PORTD are implemented with Schmitt Trig-

ger input buffers. Each pin is individually configurable

as an input or output.

Three of the PORTD pins are multiplexed with outputs

P1B, P1C and P1D of the Enhanc ed CCP modu le. The

operation of these additional PWM output pins is

covered in greater detail in Section 16.0 “Enhanced

Capture/Compare/PWM (ECCP) Module”.

POR TD can also be co nfigured as a n 8 - bit w ide m icr o-

processor port (Parallel Slave Port) by setting control

bit, PSPMODE (TRISE<4>). In this mode, the input

buffers are TTL. See Section 10.6 “Parallel Slave

Port” for additional information on the Parallel Slave

Port (PSP).

EXAMPLE 10-4: INITIALIZING PORTD

FIGURE 10-11: BLOCK DIAGRAM OF RD7:RD5 PINS

Note: PORTD is only ava ilable on PIC1 8F4X20

devices.

Note: On a Power-on Reset, these pins are

configured as digital inputs.

Note: When the enhanced PWM mode is used

with either dual or quad outputs, the PSP

functions of PORTD are automatically

disabled.

CLRF PORTD ; Initialize PORTD by

; clearing output

; data latches

CLRF LATD ; Alternate method

; to clear output

; data latches

MOVLW 0xCF ; Value used to

; initialize data

; direction

MOVWF TRISD : Set RD<3:0> as inputs

; RD<5:4> as outputs

; RD<7:6> as inputs

Data Bus

WR LATD

WR TRISD

Data Latch

TRIS Latch

RD TRISD

I/O pin(1)

RD LATD

or PORTD

VDD

VSS

RD PORTD

PSP Write

PSP Read

Note 1: I/O pins have diode protection to VDD and VSS.

TTL Buffer

Schmitt Trigger

Input Buffer

PORTD/CCP1 Select

CCP Data Out

PSPMODE

PIC18F2220/2320/4220/4320

FIGURE 10-12: BLOCK DIAGRAM OF RD4:RD0 PINS

TABLE 10-7: PORTD FUNCTIONS

TABLE 10-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD

Name Bit# Buffer Type Function

RD0/PSP0 bit 0 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 0.

RD1/PSP1 bit 1 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 1.

RD2/PSP2 bit 2 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 2.

RD3/PSP3 bit 3 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 3.

RD4/PSP4 bit 4 ST/TTL(1) Input/output port pin or Parallel Slave Port bit 4.

RD5/PSP5/P1B bit 5 ST/TTL(1) Input/output port pin, Parallel Slave Port bit 5 or enhanced PWM output P1B.

RD6/PSP6/P1C bit 6 ST/TTL(1) Input/output port pin, Parallel Slave Port bit 6 or enhanc ed PWM output P1C.

RD7/PSP7/P1D bit 7 ST/TTL(1) Input/output port pin, Parallel Slave Port bit 7 or enhanc ed PWM output P1D.

Legend: ST = Schmitt Trigger input, TTL = TTL input

Note 1: Input buffers are Schmitt Triggers when in I/O mode and TTL buffers when in Parallel Slave Port mode.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx uuuu uuuu

LATD LATD Data Latch Register xxxx xxxx uuuu uuuu

TRISD PORTD Data Direction Register 1111 1111 1111 1111

TRISE IBF OBF IBOV PSPMODE —PORTE Data Direction bits 0000 -111 0000 -111

CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PORTD.

Data Bus

WR LATD

WR TRISD

Data Latch

TRIS Latch

RD TRISD

I/O pin(1)

RD LATD

or PORTD

VDD

VSS

RD PORTD

PSP Write

PSP Read

Note 1: I/O pins have diode pro tection to VDD and VSS.

TTL Buffer

Schmitt Trigger

Input Buffer

PORTD/CCP1 Select

PSPMODE

PIC18F2220/2320/4220/4320

10.5 PORTE, TRISE and LATE

Registers

Depen din g on the pa rtic ul ar PIC18F 2X20 /4X2 0 dev ic e

select ed, POR TE is im plement ed in two dif fe rent ways.

For PIC18F4X20 devices, PORTE is a 4-bit wide port.

Three pins (RE0/AN5/RD, RE1/AN6/WR and RE2/

AN7/CS) are individually configurable as inputs or out-

puts. These pins have Schmitt Trigger input buffers.

When sel ec ted as a n an alo g input, these pin s w il l rea d

as ‘0’s.

The corresponding data direction register is TRISE.

Setting a TRISE bit (= 1) will make the corresponding

PORTE pin an input (i.e. , put th e c orrespo ndi ng outp ut

driver in a High-Impedance mode). Clearing a TRISE

bit (= 0) will make the corresponding PORTE pin an

output (i.e., put the contents of the output latch on the

selected pin).

TRISE con trol s th e di rec tio n of t he R E pi ns ev en when

they are being used as analog inputs. The user must

make sure to keep the pins configured as inputs when

using them as analog inputs.

The upper four bits of the TRISE register also control

the operati on of the Parallel Slav e Port. Their operatio n

is explained in Register 10-1.

The Data Latch register (LATE) is also memory

mapped. Read-modify-write operations on the LATE

PORTE.

The fourth pin of PORTE (MCLR/VPP/RE3 ) is an i npu t

only pin . Its operation is contro lle d by the M C LRE co n-

figuration bit in Configuration Register 3H

(CONFIG3H<7>). When selected as a port pin

(MCLRE = 0), it functions as a dig ital input onl y pin ; as

such, i t does not have TRIS or L AT bits a ssociated wi th

its operation. Otherwise, it functions as the device’s

Master Clear input. In either configuration, RE3 also

functions as the programming voltage input during

programming.

EXAMPLE 10-5: INITIALIZING PORTE

10.5.1 PORTE IN 28-PIN DEVICES

For PIC18F2X20 devices, PORTE is only available

when Master Clear functionality is disabled

(CONFIG3H<7> = 0). In these cases, PORTE is a

single bit, input only port comprised of RE3 only. The

pin operates as previously described.

FIGURE 10-13: BLOCK DIAGRAM OF

RE2:RE0 PINS

FIGURE 10-14: BLOCK DIAGRAM OF

MCLR/VPP/RE3 PIN

Note: On a Power-on Reset, RE2:RE0 are

configured as analog inputs.

Note: On a Power-on Reset, RE3 is enabled as

a digital input only if Master Clear

functionality is disabled.

CLRF PORTE ; Initialize PORTE by

; clearing output

; data latches

CLRF LATE ; Alternate method

; to clear output

; data latches

MOVLW 0x0A ; Configure A/D

MOVWF ADCON1 ; for digital inputs

MOVLW 0x03 ; Value used to

; initialize data

; direction

MOVWF TRISC ; Set RE<0> as inputs

; RE<1> as outputs

; RE<2> as inputs

Data

Bus

WR LATE

WR TRISE

RD PORTE

Data Latch

TRIS Latch

RD TRISE

Schmitt

Trigger

Input

Buffer

I/O pin(1)

RD LATE

PORTE

To Analog Converter

Note 1: I/O pins have diode protection to VDD and VSS.

MCLR/VPP/

Data Bus

RD PORTE

RD LATE

Schmitt

Trigger

MCLRE

RD TRISE

Latch

Filter

Low-Level

MCLR Detect

High-Voltage Detect

Interna l MCLR

RE3

PIC18F2220/2320/4220/4320

R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1

IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0

bit 7 bit 0

bit 7 IBF: Input Buffer Full Status bit

1 = A word has been received and waiting to be read by the CPU

0 = No word has been received

bit 6 OBF: Output Buffer Full Status bit

1 = The output buffer still holds a previously written word

0 = The output buffer has been read

bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode)

1 = A write occurred when a previously input word has not been read (must be cleared in

software)

0 = No overflow occurred

bit 4 PSPMODE: Parallel Slave Port Mode Select bit

1 = Parallel Slave Port mode

0 = General Purpose I/O mode

bit 3 Unimplemented: Re ad as ‘0’

bit 2 TRISE2: RE2 Direction Control bit

1 = Input

0 = Output

bit 1 TRISE1: RE1 Direction Control bit

1 = Input

0 = Output

bit 0 TRISE0: RE0 Direction Control bit

1 = Input

0 = Output

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

TABLE 10-9: PORTE FUNCTIONS

TABLE 10-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE

Name Bit# Buffer Type Function

RE0/AN5/RD bit 0 ST/TTL(1) Input/output port pin, analog input or read control input in Parallel Slave

Port mode.

For RD (PSP Control mode):

1 = PSP is Idle

0 = Read operation. Reads PORTD register (if chip selected).

RE1/AN6/WR bit 1 ST/TTL(1) Input/output port pin, analog input or write control input in Parallel

Slave Port mode.

For WR (PSP Control mode):

1 = PSP is Idle

0 = Write operation. Writes PORTD register (if chip selected).

RE2/AN7/CS bit 2 ST/TTL(1) Input/output port pin, analog input or chip select control input in Parallel

Slave Port mode.

For CS (PSP Control mode):

1 = PSP is Idle

0 = External device is selected

MCLR/VPP/RE3 bit 3 ST Input only po rt pin or pro gramm ing volt age inp ut (if MCLR is dis abled);

Master Clear input or programming voltage input (if MCLR is enabled ).

Legend: ST = Schmitt Trigger input, TTL = TTL input

Note 1: Input buffers are Schmitt Triggers when in I/O mode and TTL buffers when in Parallel Slave Port mode.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

PORTE — — — —RE3

(1) RE2 RE1 RE0 ---- q000 ---- q000

LATE — — — — — LATE Data Latch Register ---- -xxx ---- -uuu

TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 0000 -111

ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0000 --00 0000

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’, q = value depends on condition.

Shaded cells are not used by PORTE.

Note 1: Implemented only when Master Clear functionality is disabled (CONFIG3H<7> = 0).

PIC18F2220/2320/4220/4320

10.6 Parallel Slave Port

In addition to its function as a general I/O port, PORTD

can also operate as an 8-bit wide Parallel Slave Port

(PSP) or microprocessor port. PSP operation is con-

trolled by the 4 upper bits of the TRISE register

(Register 10-1). Setting control bit, PSPMODE

(TRISE<4>), enables PSP operation, as long as the

Enhanced CCP module is not operating in dual output

or quad output PWM mode. In Slave mode, the port is

asynchronously readable and writable by the external

world.

The PSP can directly interface to an 8-bit micro-

processor data bus. The external microprocessor can

read or write the POR TD latch a s an 8-bit latc h. Setting

the control bit, PSPMODE, enables the PORTE I/O

pins to become control inputs for the microprocessor

port. When set, port p in RE0 is the RD inp ut, RE1 is the

WR input and RE2 is the CS (Chip Select) input. For

this functionality, the corresponding data direction bits

of the TRISE register (TRISE<2:0>) must be config-

ured as inputs (set). The A/D port configuration bits

PFCG3:PFCG0 (ADCON1<3:0>) must also be set to

‘1010’.

A write to the PSP occurs when both the CS and WR

lines are first detected low and ends when either are

detecte d high. The PSPIF and IBF fla g bits are both set

when the write ends.

A read from t he PSP occurs when both the CS and R D

lines are first detected low. The data in PORTD is read

out and the OBF bit is set. If the user writes new data

to POR TD to set OBF, the data is immedia tely read out;

however, the OBF bit is not set.

When either the CS or RD lines are detected high, the

PORTD pins return to the input state and the PSPIF bit is

set. User applications should wait for PSPIF to be set

before servicing the PSP; when this happens, the IBF and

OBF bits can be polled and the appropriate action taken.

The timing for the control signals in Write and Read

modes is shown in Figure 10-16 and Figure 10-17,

respectively.

FIGURE 10-15: PORTD AND PORTE

BLOC K DIAG RAM

(PARALLEL SLAVE PORT)

Note: The Parallel Slave Po rt is only available on

PIC18F4 X20 dev ic es .

Data Bus

WR LATD RDx pin

RD PORTD

One bit of PORTD

Set Interrupt Flag

PSPIF (PIR1< 7>)

Read

Chip Select

Write

TTL

WR PORTD

RD LATD

Data Latch

Note: I/O pins have diode protection to VDD and VSS.

PORTE Pins

PIC18F2220/2320/4220/4320

FIGURE 10-16: PARALLEL SLAVE PORT WRITE WAVEFORMS

FIGURE 10-17: PARALLEL SLAVE PORT READ WAVEFORMS

TABLE 10-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT

Q1 Q2 Q3 Q4

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

IBF

OBF

PSPIF

PORTD<7:0>

Q1 Q2 Q3 Q4

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

IBF

PSPIF

OBF

PORTD<7:0>

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Valu e on

all othe r

Resets

PORTD Port Data Latch when written; Port pins when read xxxx xxxx uuuu uuuu

LATD LATD Data Latch bits xxxx xxxx uuuu uuuu

TRISD PORTD Data Direction bits 1111 1111 1111 1111

PORTE — — — — RE3 RE2 RE1 RE0 ---- 0000 ---- 0000

LATE — — — — — L ATE Data Latch bits ---- -xxx ---- -uuu

TRISE IBF OBF IBOV PSPMODE — PORTE Data Direction bits 0000 -111 0000 -111

INTCON GIE/

GIEH PEIE/

GIEL TMR0IF INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0000 --00 0000

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

11.0 T IMER0 MODULE

The Timer0 module has the following features:

• Software selectable as an 8-bit or 16-bit

timer/counter

• Readable and writable

• Dedicated 8-bit software programmable prescaler

• Clock source selectable to be external or internal

• Interrupt-on-overflow from FFh to 00h in 8-bit

mode and FFFFh to 0000h in 16-bit mode

• Edge select for external clock

Figure 11-1 shows a simplified block diagram of the

Timer0 module in 8-bit mode and Figure 11-2 shows a

simplified block diagram of the Timer0 module in 16-bit

mode.

The T0CON register (Register 11-1) is a readable and

writ able registe r th at co ntro ls al l the aspec t s o f Ti mer 0,

including the prescale selection.

R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1

TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0

bit 7 bit 0

bit 7 TMR0ON: Timer0 On/Off Control bit

1 = Enables Timer0

0 = Stops Timer0

bit 6 T08BIT: Timer0 8-bit/16-bit Control bit

1 = Timer0 is configured as an 8-bit timer/counter

0 = Timer0 is configured as a 16-bit timer/counter

bit 5 T0CS: Tim er0 Cloc k Sourc e Sele ct bit

1 = Transition on T0CKI pin

0 = Internal instruction cycle clock (CLKO)

bit 4 T0SE: Timer0 Source Edge Select bit

1 = Increment on high-to-low transition on T0CKI pin

0 = Increment on low-to-high transition on T0CKI pin

bit 3 PSA: Timer0 Prescaler Assignment bit

1 = TImer0 prescaler is not assigned. Timer0 clock input bypasses prescaler.

0 = Timer0 prescaler is assigned. Ti mer0 clock input comes from prescaler output.

bit 2-0 T0PS2:T0PS0: Timer0 Prescaler Select bits

111 = 1:256 prescale value

110 = 1:128 prescale value

101 = 1:64 prescale value

100 = 1:32 prescale value

011 = 1:16 prescale value

010 = 1:8 prescale value

001 = 1:4 prescale value

000 = 1:2 prescale value

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

FIGURE 11-1: TIMER0 BLOCK DIAGRAM IN 8-BIT MODE

FIGURE 11-2: TIMER0 BLOCK DIAGRAM IN 16-BIT MODE

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI maximum prescale.

RA4/T0CKI/C1OUT

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks TMR0

(2 TCY delay)

Data Bus

PSA

T0PS2, T0PS1, T0PS0 Set Interrupt

Flag bit TMR0IF

on Overflow

Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI maximum prescale.

T0SE

T0CS

FOSC/4

Programmable

Prescaler

Sync with

Internal

Clocks TMR0L

(2 TCY delay)

Data Bus<7:0>

PSA

T0PS2, T0PS1, T0PS0

Set Interrupt

Flag bit TMR0 IF

on Overflow

TMR0

TMR0H

High Byte

Read TMR0L

Write TMR0L

RA4/T0CKI/C1OUT

PIC18F2220/2320/4220/4320

11.1 Timer0 O p e r at io n

Timer0 can operate as a timer or as a counter.

Timer mode is selected by clearing the T0CS bit. In

Timer mode, the Timer0 module will increment every

instruc tion cy cle (with out pr escal er). If the TMR0 regis-

ter is w ritten , the i ncrem ent is inhi bited f or the follow ing

two instruction cycles. The user can work around this

by writing an adjusted value to the TMR0 register.

Counter mode is selected by setting the T0CS bit. In

Counter mode, Timer0 will increment, either on every

rising or fal ling edge of pi n RA4/T0CKI . The increme nt-

ing edge is determined by the Timer0 Source Edge

Select bit (T0SE). Clearing the T0SE bit selects the

rising edge.

When an external cl ock input i s used for T ime r0, it must

meet certain requirements. The requirements ensure

the external clock can be synchronized with the int ernal

phase clock (TOSC). Also, th ere is a delay in the actual

incrementing of Timer0 after synchronization.

11.2 Prescaler

An 8-bi t counter i s availabl e as a presc aler for the T imer0

modul e. Th e pre sc a le r i s no t re ad able or w ri t able.

The PSA and T0PS2:T0PS0 bits determine the

prescaler assignment and prescale ratio.

Clearing b it PSA will assign the prescaler to the Timer0

module. When the prescaler is assigned to the Timer0

module, prescale values of 1:2, 1:4,..., 1:256 are

selectable.

When assigned to the Timer0 module, all instructions

writing to the TMR0 register (e.g., CLRF TMR0, MOVWF

TMR0, BSF TMR0, x....etc.) will clear the prescaler

count.

11.2.1 SW ITCHI NG PRESCALER

ASSIGNMENT

The prescaler assignment is fully under software

control (i.e., it can be changed “on-the-fly” during

program executi on).

11.3 Timer0 Int e rr u p t

The TMR0 interrupt is generated when the TMR0

FFFFh to 0000h in 16-bit mode. This overflow sets the

TMR0IF bit. The interrupt can be masked by clearing

the TMR0IE bit. The TMR0IF bit must be cleared in

software by the Timer0 module Interrupt Service

Routine before re-enabling this interrupt. The TMR0

interrupt cannot awaken the processor from Sleep

mode, s ince the tim er requires clock cycles, eve n when

T0CS is set.

11.4 16-Bit Mode Timer Reads and

Writes

TMR0H is not the high byte of the timer/counter in

16-bit mode but is actually a buffered version of the

high byte of T imer0 (refer to Figure 1 1-2). The high byte

of the Timer0 counter/timer is not directly readable nor

writable. TMR0H is updated with the contents of the

high byte of Timer0 during a read of TMR0L. This pro-

vides the ability to read all 16 bits of Timer0, without

having to verify that the read of the high and low byte

were va lid, du e to a ro llove r betwe en su cces sive re ads

of the high and low byte.

A write to the high byte of Timer0 must also take place

through th e TMR0H Buf fer reg ister. T ime r0 high byte i s

updated with the contents of TMR0H when a write

occurs to TMR0L. Th is allows all 1 6 bits of T imer0 to be

updated at onc e.

TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0

Note: Writing to TMR0 when the prescaler is

assign ed to Timer0 will clear th e pr escal er

count but will not change the prescaler

assignment.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all othe r

Resets

TMR0L Timer0 Module Low Byte Register xxxx xxxx uuuu uuuu

TMR0H Timer0 Module High Byte Register 0000 0000 0000 0000

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 1111 1111

TRISA RA7(1) RA6(1) PORTA Data Direction Register 1111 1111 1111 1111

Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by Timer0.

Note 1: RA6 and RA7 are enabled as I/O pins depending on the oscillator mode selected in Configuration Word 1H.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

12.0 T IMER1 MODULE

The Timer1 module timer/counter has the following

features:

• 16-bit timer/counter (two 8-bit registers: TMR1H

and TMR1L)

• Readable and writable (both registers)

• Internal or external clock select

• Interrupt-on-overflow from FFFFh to 0000h

• Reset from CCP module special event trigger

• Status of system clock operation

Figure 12-1 is a simplified block diagram of the Timer1

module.

module and contains the Timer1 Oscillator Enable bit

(T1OSCEN). Timer1 can be enabled or disabled by

setting or clearing control bit, TMR1ON (T1CON<0>).

The T imer1 oscill ator can be used as a secondary clock

source in power mana ged mo des. When the T1RUN bit

is set, the T imer1 oscillator is providing the system clock.

If the Fail-Safe Clock Monitor is enabled and the Timer1

oscillator fails while providing the system clock, polling

the T1RUN bit will indicate whether the clock is being

provided by the Timer1 o scilla tor or another source.

Timer1 can also be used to provide Real-Time Clock

(RTC) functionality to applications with only a minimal

addition of external components and code overhead.

R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON

bit 7 bit 0

bit 7 RD16: 16-bit Read/Wri te Mode Enable bit

1 = Enables register read/write of TImer1 in one 16-bit operation

0 = Enables register read/write of Timer1 in two 8-bit operations

bit 6 T1RUN: Timer1 System Clock Status bit

1 = System clock is derived from Timer1 oscillator

0 = System clock is derived from another source

bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Presca le Select b its

11 = 1:8 prescale value

10 = 1:4 prescale value

01 = 1:2 prescale value

00 = 1:1 prescale value

bit 3 T1OSCEN: Timer1 Osci llator En able bit

1 = Timer1 oscillator is enabled

0 = Timer1 oscillator is shut-off

The oscillator inverter and feedback resistor are turned off to eliminate power drain.

bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit

When TMR1CS = 1 (External Clock):

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR1CS = 0 (Inter nal Clock):

This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.

bit 1 TMR1CS: Timer1 Clock Source Select bit

1 = External clock from pin RC0/T1OSO/T13CKI (on the rising edge)

0 = Internal clock (FOSC/4)

bit 0 TMR1ON: Timer1 On bit

1 = Enables Timer1

0 = Stops Timer1

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

12.1 Timer1 Operation

Timer1 can operate in one of these modes:

•As a timer

• As a synchronous counter

• As an asynchronous counter

The operating mode is determined by the Clock Select

bit, TMR1CS (T1CON<1>).

When TMR1CS = 0, Timer1 increments every instruc-

tion cycle. When TMR1CS = 1, Timer 1 increm ents on

every rising edge of the external clock input, or the

Timer1 oscillator, if enabled.

When the Timer1 oscillator is enabled (T1OSCEN is

set), the RC1/T1OSI/CCP2 and RC0/T1OSO/T1CKI

pins become inputs. The TRISC1:TRISC0 values are

ignored and the pins read as ‘0’.

Timer1 also has an internal “Reset input”. This Reset

can be generated by the CCP module (see

Section 15.4.4 “Special Event Trigger”).

FIGURE 12-1: TIMER1 BLOCK DIAGRAM

FIGURE 12-2: TIMER1 BLOCK DIAGRAM: 16-BIT READ/WRITE MODE

T1OSC

TMR1H TMR1L

T1SYNC

TMR1CS

T1CKPS1:T1CKPS0 Peripheral Clocks

FOSC/4

Internal

Clock

TMR1ON

On/Off

Prescaler

1, 2, 4, 8 Synchronize

det

Synchronized

Clock Input

TMR1IF

Overflow TMR1 CLR

CCP Special Event Trigger

T1OSCEN

Enable

Oscillator(1)

Interrupt

Flag bit

Note 1: When enable bit T1OSCEN is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

T1OSI

T1CKI/T1OSO

Timer 1 TMR1L

T1OSC T1SYNC

TMR1CS

T1CKPS1:T1CKPS0

Peripheral Clocks

T1OSCEN

Enable

Oscillator(1)

TMR1IF

Overflow

Interrupt

FOSC/4

Internal

Clock

TMR1ON

on/off

Prescaler

1, 2, 4, 8 Synchronize

det

Synchronized

Clock Input

T1CKI/T1OSO

T1OSI

TMR1

Flag bit

Note 1: When enable bit T1OSCEN is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

High Byte

Data Bus<7:0>

TMR1H 8

Read TMR1L

Write TMR1L

CLR

CCP Special Event Trigger

PIC18F2220/2320/4220/4320

12.2 Timer1 Oscillator

A crystal oscillator circuit is built-in between pins,

T1OSI (input) and T1OSO (amplifier output). It is

enabled by setting c ontrol bit, T1O SCEN (T1CON<3>).

The osc illato r is a lo w-powe r osci llator ra ted for 3 2 kHz

crystals. It will continue to run during all power man-

aged modes. The circuit for a typical LP oscillator is

shown in Figure 12-3. Table 12-1 shows the capacitor

selection for the Timer1 oscillator.

The user m us t pro vi de a sof tware time delay to ensure

proper start-up of the Timer1 oscillator.

FIG UR E 12 -3 : EXTERNAL COMPONENTS

FOR THE TIMER1 LP

OSCILLATOR

TABLE 12-1: CAPACITOR SELECTION FOR

THE TIMER OSCILLATOR(2,3,4)

12.3 Timer1 Oscillator Layout

Considerations

The Timer1 oscillator circuit draws very little power

during operation. Due to the low power nature of the

oscillator, it may also be sensitive to rapidly changing

signals in close proximity.

The oscillator circuit, shown in Figure 12-3, should be

located as close as possible to the microcontroller.

There sho uld be no circu its pas sing within the oscillator

circuit boundaries other than VSS or VDD.

If a high-speed c ircui t m us t b e l oc ate d n ear the os c ill a-

tor (such as the CCP1 pin in output compare or PWM

mode, or the primary oscillator using the OSC2 pin), a

grounded guard ring around the oscillator circuit, as

shown in Figure 12-4, may be helpful when used on a

single-sided PCB or in addition to a ground plane.

FIGURE 12-4: OSCILLATOR CIRCUIT

WITH GROUNDED GUARD

RING

Osc Type Freq C1 C2

LP 32 kHz 27 pF(1) 27 pF(1)

Note 1: Microchip suggests this value as a starting

point in vali dating the oscillator circu it.

2: Highe r cap acitanc e increases th e stabi lity

of the oscillator but also increases the

start - up time.

3: Since each resonator/crystal has its own

characteristics, the user should consult

the resonator/crystal manufacturer for

appropriate values of external

components.

4: Capacitor values are for design guidance

only.

Note: See the Notes with Table 12-1 for additiona

information about capacitor selection.

XTAL

PIC18FXXXX

T1OSI

T1OSO

32.768 kHz

33 pF

VDD

OSC1

VSS

OSC2

RC0

RC1

RC2

Note: Not drawn to scale.

PIC18F2220/2320/4220/4320

12.4 Timer1 Interrupt

The TMR1 register pair (TMR1H:TMR1L) increments

from 0000h to FFFFh and rolls over to 0000h. The

Timer1 interrupt, if enabled, is generated on overflow

which is latched in interrupt flag bit, TMR1IF

(PIR1<0>). This interrupt can be enabled/disabled by

setting/clearing Timer1 interrupt enable bit, TMR1IE

(PIE1<0>).

12.5 Resetting Timer1 Using a CCP

Trigger Output

If the CCP module is configured in Compare mode to

generate a “special event trigger” (CCP1M3:CCP1M0

= 1011), this signal will reset Timer1 and start an A/D

conversion if the A/D module is enabled (see

Section 15.4.4 “Special Event Trigger” for more

information).

T ime r1 must be c onfigured fo r either T ime r or Synchro-

nized Counter mode to take advantage of this feature.

If Timer1 is running in Asynchronous Counter mode,

this Reset operation may not work.

In the event that a write to Timer1 coincides with a

special event trigger from CCP1, the write will take

precedence.

In this mode of operation, the CCPR1H:CCPR1L

Timer1.

12.6 Timer1 16-Bit Read/Write Mode

Timer1 can be configured for 16-bit reads and writes

(see Figure 12-2). When the RD16 control bit

(T1CON< 7>) is set, the add ress fo r TMR1H is mappe d

to a buffer r egist er fo r the high b yte o f Timer1. A read

from TMR1L will load the contents of the high byte of

Timer1 into the Timer1 high byte buffer. This provides

the user with the ability to accurately read all 16 bits of

Timer1 without having to determine whether a read of

the high byte, followed by a read of the low byte, is valid

due to a rollover between reads.

A write to the high byte of Timer1 must also take place

through th e TMR1H Buf fer reg ister. T ime r1 high byte i s

updated with the contents of TMR1H when a write

occurs to TMR 1L . Thi s a ll ows a us er to write all 16 bits

to both the high and low bytes of Timer1 at once.

The high b yt e of Timer1 is not di rec tly readable or wri t-

able in thi s m ode . All rea ds and wri tes must t ak e pl ac e

through the Timer1 High Byte Buffer register. Writes to

TMR1H do not clear the Timer1 prescaler. The

prescaler is only clear ed on w rites to TMR1 L.

12.7 Using Timer1 as a Real-Time

Clock

Adding an extern al LP os cilla tor to Timer1 (s uch a s the

one described in Section 12.2 “Timer1 Oscillator”

above), g ives use rs the optio n to includ e RTC fu nction-

ality to their applications. This is accomplished with an

inexpensive watch crystal to provide an accurate time

base and several lines of application code to calculate

the time. When operating in Sleep mode and using a

battery or supercapacitor as a power source, it can

completely eliminate the need for a separate RTC

device and battery backup.

The application code routine, RTCisr, shown in

Example 12-1, demonstrates a simple method to

increment a counter at one-second intervals using an

Interrupt Service Rou tin e. Incrementi ng the TMR1 reg-

ister p air to overflow, triggers the interru pt and calls the

routine, w hich in creme nts the seco nds cou nter by on e;

additional counters for minutes and hours are

inc remented as t he previous count er overfl ow.

Since the register pair is 16 bits wide, counting up to

overflow the register directly from a 32.768 kHz clock

would take 2 seconds. To force the overflow at the

required one-second intervals, it is necessary to pre-

load it; the simplest method is to set the MSbit of

TMR1H with a BSF instruction. Note that the TMR1L

introduce cumulative error over many cycles.

For this m ethod to be a ccurate, T imer 1 must oper ate in

Asynchronous mode and the Timer1 overflow interrupt

must be enabled (PIE1<0> = 1) as shown in the rou-

tine, RTCinit. The Timer1 oscillator must also be

enabled and running at all times.

Note: The special event triggers from the CCP1

module will not set interrupt flag bit,

TMR1IF (PIR1<0>).

PIC18F2220/2320/4220/4320

EXAMPLE 12-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE

TABLE 12-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER

RTCinit

MOVLW 0x80 ; Preload TMR1 register pair

MOVWF TMR1H ; for 1 second overflow

CLRF TMR1L

MOVLW b’00001111’ ; Configure for external clock,

MOVWF T1OSC ; Asynchronous operation, external oscillator

CLRF secs ; Initialize timekeeping registers

CLRF mins ;

MOVLW .12

MOVWF hours

BSF PIE1, TMR1IE ; Enable Timer1 interrupt

RETURN

RTCisr

BSF TMR1H,7 ; Preload for 1 sec overflow

BCF PIR1,TMR1IF ; Clear interrupt flag

INCF secs,F ; Increment seconds

MOVLW .59 ; 60 seconds elapsed?

CPFSGT secs

RETURN ; No, done

CLRF secs ; Clear seconds

INCF mins,F ; Increment minutes

MOVLW .59 ; 60 minutes elapsed?

CPFSGT mins

RETURN ; No, done

CLRF mins ; clear minutes

INCF hours,F ; Increment hours

MOVLW .23 ; 24 hours elapsed?

CPFSGT hours

RETURN ; No, done

MOVLW .01 ; Reset hours to 1

MOVWF hours

RETURN ; Done

Na m e Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 B it 0 Va lue on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu

TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 u0uu uuuu

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.

Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on the PIC18F2X20 devices; always maintain these bits clear.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

13.0 T IMER2 MODULE

The Timer2 module timer has the following features:

• 8-bit timer (TMR2 register)

• 8-bit period register (PR2)

• Readable and writable (both registers)

• Software programmable prescaler (1:1, 1:4, 1:16)

• Software programmable postscaler (1:1 to 1:16)

• Interrupt on TMR2 match with PR2

• SSP module optional use of TMR2 output to

generate clock shift

Timer2 has a control register shown in Register 13-1.

TMR2 can b e shut-off by cl earing control bit, T MR2O N

(T2CON<2>), to minimize power consumption.

Figure 13-1 is a simplified block diagram of the Timer2

module . Registe r 13-1 shows the T imer2 C ontrol regi s-

ter. The prescaler and postscaler selection of Timer2

are controlled by this register.

13.1 Timer2 Operation

Timer2 can be used as the PWM time base for the

PWM mode of the CCP module. The TMR2 register is

readable and writable and is cleared on any device

Reset. The i npu t clo ck (FOSC/4) has a prescale option

of 1:1, 1:4 or 1:16, selected by control bits,

T2CKPS1:T2CKPS0 (T2CON<1:0>). The match out-

put of TMR2 goes through a 4-bit postscaler (which

gives a 1:1 to 1:16 scaling inclusive) to generate a

TMR2 interrupt (latched in flag bit, TMR2IF (PIR1<1>)).

The prescaler and postscaler counters are cleared

when any of the following occurs:

• A write to the TMR2 register

• A write to the T2CON register

• Any device Reset (Power-on Reset, MCLR Rese t,

Watchdog Timer Reset or Brown-out Reset)

TMR2 is not cleared when T2CON is written.

U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6-3 TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits

0000 = 1:1 postscale

0001 = 1:2 postscale

•

1111 = 1:16 postsc ale

bit 2 TMR2ON: Timer2 On bit

1 = Timer2 is on

0 = Timer2 is off

bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits

00 = Prescaler is 1

01 = Prescaler is 4

1x = Prescaler is 1 6

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

13.2 Timer2 Interrupt

The Timer2 module has an 8-bit period register, PR2.

Timer2 increments from 00h until it matches PR2 and

then resets to 00h on the next increment cycle. PR2 is

a readable and writable register. The PR2 register is

initialized to FFh upon Reset.

13.3 Output of TMR2

The output of TMR2 (before the post scaler) is fed to the

Synchron ous Seria l Port m odu le whi ch op tio nal ly use s

it to generate the shift clock.

FIGURE 13-1: TIMER2 BLOCK DIAGRAM

TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER

Comparator

TMR2 Sets Flag

TMR2

Output(1)

Reset

Postscaler

Prescaler

PR2

FOSC/4

1:1 to 1:16

1:1, 1:4, 1:16

bit TMR2IF

Note 1: TMR2 register output can be software selected by the SSP module as a baud clock.

TOUTPS3:TOUTPS0

T2CKPS1:T2CKPS0

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TMR2 Timer2 Module Register 0000 0000 0000 0000

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000

PR2 Timer2 Period Register 1111 1111 1111 1111

OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 qq00 0000 qq00

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.

Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on the PIC18F2X2 devices; always maintain these bits clear.

PIC18F2220/2320/4220/4320

14.0 TIMER3 MODULE

The Timer3 module timer/counter has the following

features:

• 16-bit timer/counter (two 8-bit registers: TMR3H

and TMR3L)

• Readable and writable (both registers)

• Internal or external clock select

• Interrupt-on-overflow from FFFFh to 0000h

• Reset from CCP module trigger

Figure 14-1 is a simplified block diagram of the Timer3

module.

module and sets the CCP clock source.

module, as well as contains the Timer1 Oscillator

Enable bit (T 1OSC EN) whic h ca n be a c lock sour ce f or

Timer3.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON

bit 7 bit 0

bit 7 RD16: 16-bit Read/Write Mode Enable bit

1 = Enables register read/write of Timer3 in one 16-bit operation

0 = Enables register read/write of Timer3 in two 8-bit operations

bit 6, 3 T3CCP2:T3CCP1: Timer3 and Timer1 to CCPx Enable bits

1x = Timer3 is the clock source for compare/capture CCP modules

01 = Timer3 is the clock source for compare/capture of CCP2,

Timer1 is the clock source for compare/capture of CCP1

00 = Timer1 is the clock source for compare/capture CCP modules

bit 5-4 T3CKPS1:T3CKPS0: Timer3 Input Clock Prescale Select bits

11 = 1:8 prescale value

10 = 1:4 prescale value

01 = 1:2 prescale value

00 = 1:1 prescale value

bit 2 T3SYNC: Timer3 E xternal Clock Input Synchronization Control bit

(Not usable if the system clock comes from Timer1/Timer3.)

When TMR3CS = 1:

1 = Do not synchronize external clock input

0 = Synchronize external clock input

When TMR3CS = 0:

This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0.

bit 1 TMR3CS: Timer3 Clock Source Select bit

1 = External clock input from Timer1 oscillator or T1CKI (on the rising edge after the first

falling edg e)

0 = Internal clock (FOSC/4)

bit 0 TMR3ON: Timer3 On bit

1 = Enables Timer3

0 = Stops Timer3

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

14.1 Timer3 Operation

Timer3 can operate in one of these modes:

•As a timer

• As a synchronous counter

• As an asynchronous counter

The operating mode is determined by the clock select

bit, TMR3CS (T3CON<1>).

When TMR3CS = 0, Timer3 increments every instruc-

tion cycle. When TMR3CS = 1, Timer 3 increm ents on

every rising edge of the Timer1 external clock input or

the Timer1 oscillator if enabled.

When the Timer1 oscillator is enabled (T1OSCEN is

set), the RC1/T1OSI/CCP2 and RC0/T1OSO/T1CKI

pins b ecome inputs . That is, the TRISC1:TRISC0 valu e

is ignored and the pins are read as ‘0’.

Timer3 also has an internal “Reset input”. This Reset

can be generated by the CCP module (see

Section 15.4.4 “Special Event Trigger”).

FIGURE 14-1: TIMER3 BLOCK DIAGRAM

FIGURE 14-2: TIMER3 BLOCK DIAGRAM CONFIGURED IN 16-BIT READ/WRITE MODE

TMR3H TMR3L

T1OSC

T3SYNC

TMR3CS

T3CKPS1:T3CKPS0

Peripheral Clocks

T1OSCEN

Enable

Oscillator(1)

TMR3IF

Overflow

Interrupt

FOSC/4

Internal

Clock

TMR3ON

On/Off

Prescaler

1, 2, 4, 8 Synchronize

det

Synchronized

Clock Inp ut

T1OSO/

T1OSI

Flag bit

Note 1: When enable bit T1OSCEN is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

T1CKI

CLR

CCP Special Event Trigger

T3CCPx

Timer3

TMR3L

T1OSC T3SYNC

TMR3CS

T3CKPS1:T3CKPS0 Peripheral Clocks

T1OSCEN

Enable

Oscillator(1)

FOSC/4

Internal

Clock

TMR3ON

On/Off

Prescaler

1, 2, 4, 8 Synchronize

det

Synchronized

Clock Input

T1OSO/

T1OSI

TMR3

T1CKI

CLR

CCP Special Event Trigger

T3CCPx

To Timer1 Clock Input

Note 1: When the T1OSCEN bit is cleared, the inverter and feedback resistor are turned off. This eliminates power drain.

High Byte

Data Bus<7:0>

TMR3H 8

Read TMR3L

Write TMR3L

Set TMR3IF Flag bit

on Overflow

PIC18F2220/2320/4220/4320

14.2 Timer1 Oscillator

The Timer1 oscill ator may be us ed as the clo ck so urc e

for Timer3. The Timer1 oscillator is enabled by setting

the T1OSC EN (T 1CON<3>) bit. The oscil lator i s a low-

power oscillator rated for 32 kHz crystals. See

Section 12.2 “Timer1 Oscillator” for further details.

14.3 Timer3 Interrupt

The TMR3 register pair (TMR3H:TMR3L) increments

from 0000h to FFFFh and rolls over to 0000h. The

TMR3 interrupt, if enabled, is generated on overflow

which is latched in interrupt flag bit, TMR3IF

(PIR2<1>). This interrupt can be enabled/disabled by

setting/clearing TMR3 Interrupt Enable bit, TMR3IE

(PIE2<1>).

14.4 Resetting Timer3 Using a CCP

Trigger Output

If the CCP module is configured in Compare mode

to generate a “special event trigger”

(CCP1M3:CCP1M0 = 1011), this signal will reset

Ti m e r3 . S e e Section 15.4.4 “Special Event Trigger”

for more information.

T imer 3 must be co nfigured fo r either T i mer or Synch ro-

nized Counter mode to take advantage of this feature.

If Timer3 is running in Asynchronous Counter mode,

this Reset operation may not work. In the event that a

write to Timer3 coincides with a special event trigger

from CCP1 , the write will t ake precedence. In this mode

of operation, the CCPR1H:CCPR1L register pair

effectively becomes the period register for Timer3.

TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER

Note: The special event triggers from the CCP

module will not set interrupt flag bit,

TMR3IF (PIR1<0>).

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR2 OSCIF CMIF —EEIF BCLIF LVDIF TMR3IF CCP2IF 00-0 0000 00-0 0000

PIE2 OSCIE CMIE —EEIE BCLIE LVDIE TMR3IE CCP2IE 00-0 0000 00-0 0000

IPR2 OSCIP CMIP —EEIP BCLIP LVDIP TMR3IP CCP2IP 11-1 1111 11-1 1111

TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu

TMR3H Ho lding Register for the Most Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 u0uu uuuu

T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 uuuu uuuu

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

15.0 CAPTURE/COMPARE/PWM

(CCP) MODULES

The standard CCP (Capture/Compare/PWM) module

contains a 16-bit register that can operate as a 16-bit

Capture register, a 16-bit Compare register or a PWM

Master/Slave Duty Cycle register. Table 15-1 shows

the timer resources required for each of the CCP

module modes.

The ope ration of C CP1 is identical t o that of CC P2, with

the exception of the special event trigger. Therefore,

operatio n of a CCP module i s described with respe ct to

CCP1 except where noted. Table 15-2 shows the

interaction of the CCP modules.

Note: In 28-pin devices, both CCP1 and CCP2

function as standard CCP modules. In

40-pin devices, CCP1 is implemented as

an Enhanced CCP module, offering addi-

tional capabilities in PWM mode. Capture

and Compare modes are identical in all

modules regardless of the device.

Please see Section 16.0 “Enhanced

Capture/Compare/PWM (ECCP) Mod-

ule” for a discussion of the enhanced

PWM capabilities of the CCP1 module.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0

bit 7 bit 0

bit 7-6 Reserved: Read as ‘0’.

See Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”.

bit 5-4 DCxB1:DCxB0: PWM Duty Cycle bit 1 and bit 0

Capture mode:

Unused.

Compare mode:

Unused.

PWM mo de:

These b it s are the tw o LSb s (bit 1 and bit 0) o f th e 1 0-bi t PWM d uty c ycle. The upper eig ht bits

(DCx9:DCx2) of the duty cycle are found in CCPRxL.

bit 3-0 CCPxM3:CCPxM0: CCPx Mode Select bits

0000 = Capture/Compare/PWM disabled (resets CCPx module)

0001 = Reserved

0010 = Compare mode, toggle output on match (CCPxIF bit is set)

0011 = Reserved

0100 = Capture mode, every falling edge

0101 = Capture mode, every rising ed ge

0110 = Capture mode, every 4th rising edge

0111 = Capture mode, every 16th rising edge

1000 = Compare mode, initialize CCP pin Low; on compare match, force CCP pin High

(CCPxIF bit is set)

1001 = Compare mode, initialize CCP pin High; on compare match, force CCP pin Low

(CCPxIF bit is set)

1010 = Compare mode, generate software interrupt on comp a re match (CCPxIF bit is s et, CCP

pin operates as a port pin for input and output)

1011 = Compare mode, trigger special event (CCP2IF bit is set)

11xx =PWM mode

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

15.1 CCP1 Module

Capture/Compare/PWM Register 1 (CCPR1) is com-

prised of two 8-bit registers: CCPR1L (low byte) and

CCPR1H (high byte). The CCP1CON register controls

the operation of CCP1. All are readable and writable.

TABLE 15-1: CCP MODE - TIMER

RESOURCE

15.2 CCP2 Module

Capture/Compare/PWM Register 2 (CCPR2) is com-

prised of two 8-bit registers: CCPR2L (low byte) and

CCPR2H (high byte). The CCP2CON register controls

the operation of CCP2. All are readable and writable.

CCP2 functions identically to CCP1 except for the

enhanced PWM modes offered by CCP2

TABLE 15-2: INTERACTION OF TWO CCP MODULES

CCP Mode Timer Resource

Capture

Compare

PWM

Timer1 or Timer3

Timer2

CCPx Mode CCPy Mode Interaction

Capture Capture TMR1 or TMR3 time base. Time base can be different for each CCP.

Capture Compare The compare could be co nfigured for the special even t trigger which clears e ither TMR1

or TMR3 depending upon which time base is used.

Compare Compare The compare(s) could be configured for the special event trigger which clears TMR1 or

TMR3 depending upon which time base is used.

PWM PWM The PWMs will have the same frequency and update rate (TMR2 interrupt).

PWM Capture None.

PWM Compare None.

PIC18F2220/2320/4220/4320

15.3 Capture Mode

In Capture mode, CCPR1H:CCPR1L captures the 16-bit

value of the TMR1 or TMR3 registers when an event

occurs on pin RC2/CCP1/P1A. An event is defined as

one of the following:

• every falling edge

• every rising edge

• every 4th rising edge

• every 16th rising edge

The event is selected by co ntrol bits, CCP1M3:CCP1M0

(CCP1CON<3:0>). When a capture is made, the inter-

rupt request flag bit, CCP1IF (PIR1<2>), is set; it must

be cleared in software. If another capture occurs before

the value in register CCPR1 is read, the old captured

value is overwritten by the new c aptured valu e.

15.3.1 CCP PIN CONFIGURATION

In Capture mode, the RC2/CCP1/P1A pin should be

configu red as an in put by setti ng the TRISC<2 > bit.

15.3.2 TIMER1/TIMER3 MODE SELECTION

The timers that are to be used with the ca pture feature

(either T ime r1 and/or T imer3) must be run ning in T imer

mode or Synchronized Counter mode. In Asynchro-

nous Counter mode, the capture operation may not

work. The timer to be used with each CCP module is

selected in the T3CON register.

15.3.3 SOFTWARE INTERRUPT

When the Capture mode is changed, a false capture

interrupt may be generated. The user should keep bit

CCP1IE (PIE1<2>) clear to avoid false interrupts and

should clear the flag bit, CCP1IF, following any such

change in ope rati ng mod e.

15.3.4 CCP PRESCALER

There are four prescaler settings specified by bits

CCP1M3:CCP1M0. Whenever the CCP module is

turned off, or the CCP module is not in Capture mode,

the prescaler counter is cleared. This means that any

Reset will clear the prescaler counter.

Switching from one capture prescaler to another may

generate an interrupt. Also, the prescaler counter will

not be cleare d, therefore , the first cap ture may be from

a non-zero prescaler. Example 15-1 shows the recom-

mended method for switching between capture

prescalers. This example also clears the prescaler

counter and will not generate the “false” interrupt.

EXAMPLE 15-1: CHANGING BETWEEN

CAPTURE PRESCALERS

FIGURE 15-1: CAPTURE MODE OPERATION BLOCK DIAGRAM

Note: If the RC2/CCP1/P1A is configured as an

output, a write to the port can cause a

capture co ndition. CLRF CCP1CON, F ; Turn CCP module off

MOVLW NEW_CAPT_PS ; Load WREG with the

; new prescaler mode

; value and CCP ON

MOVWF CCP1CON ; Load CCP1CON with

; this value

CCPR1H CCPR1L

TMR1H TMR1L

Set Flag bit CCP1IF TMR3

Enable

Q’s CCP1CON<3:0>

CCP1 pin

Prescaler

÷ 1, 4, 16

and

Edge Detect

TMR3H TMR3L

TMR1

Enable

T3CCP2

CCPR2H CCPR2L

TMR1H TMR1L

Set Flag bit CCP2IF

TMR3

Enable

Q’s CCP2CON<3:0>

CCP2 pin

Prescaler

÷ 1, 4, 16

and

Edge Detect

TMR3H TMR3L

TMR1

Enable

T3CCP2

T3CCP1

T3CCP2

T3CCP1

PIC18F2220/2320/4220/4320

15.4 Compare Mode

In Compare mode, the 16-bit CCPR1 (CCPR2) register

value is constantly compared against either the

TMR1 register pair value, or the TMR3 register pair

value. When a match occurs, the RC2/CCP1/P1A

(RC1/T1OSI/CCP2) pin:

• Is driven High

• Is driv en Low

• Toggles output (High to Low or Low to High)

• Remains unchanged (interrupt only)

The action on the pin is based on the value of control

bits, CCP1M3:CCP1M0 (CCP2M3:CCP2M0). At the

same time, interrupt flag bit, CCP1IF (CCP2IF), is set.

15.4.1 CCP PIN CONFIGURATION

The user must configure the CCPx pin as an output by

clearing the appropriate TRISC bit.

15.4.2 TIMER1/TIMER3 MODE SELECTION

Timer1 and/or Timer3 must be running in Timer mode,

or Synchronized Counter mode, if the CCP module is

using the compare feature. In Asynchronous Counter

mode, the compare operation may not work.

15.4.3 SOFTWARE INTERRUPT MODE

When genera te software in terrupt is chose n, the CCP1

pin is not af fected. On ly a CCP interrupt is generated (if

enabled).

15.4.4 SPECIAL EVENT TRIGGER

In this mode, an internal hardware trigger is generated

which may be used to initiate an action.

The special event trigger output of CCP1 resets the

TMR1 regi ste r pai r. Thi s al lows the CCPR 1 re gis ter to

ef fectively b e a 16-bit progra mmable pe riod registe r for

Timer1.

The special trigger output of CCP2 resets either the

TMR1 or TMR3 register pair. Additionally, the CCP2

special event trigger will start an A/D conversion if the

A/D module is en abled.

FIGURE 15-2: COMPARE MODE OPERATION BLOCK DIAGRAM

Note: Clearing the CCP1CON register will force

the RC2/CCP1/P1A compare output latch

to the default low level. This is not the

PORTC I/O data latch. Note: The special event trigger from the CCP2

module will not set the Timer1 or Timer3

interr upt flag bit s .

CCPR1H CCPR1L

TMR1H TMR1L

Comparator

ROutput

Logic

Special Ev ent Trigger

Set Flag bit CCP1IF

Match

RC2/CCP1/P1A

TRISC<2> CCP1CON<3:0>

Mode Select

Output Enable

Special Event Trigger will:

Reset Timer1 or Timer3 but not set Timer1 or Timer3 interrupt flag bit

and set bit GO/DONE (ADCON0<2>) which starts an A/D conversion (CCP2 only)

TMR3H TMR3L

T3CCP2

CCPR2H CCPR2L

Comparator

T3CCP2

T3CCP1

ROutput

Logic

Special Event Trigger

Set Flag bit CCP2IF

Match

RC1/T1OSI/CCP2

TRISC<1> CCP2CON<3:0>

Mode Select

Output Enable

PIC18F2220/2320/4220/4320

TABLE 15-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TRISC PORTC Data Direction Register 1111 1111 1111 1111

TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu

TMR1H H olding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu

CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu

CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu

CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000

CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu

CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu

CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000

PIR2 OSCFIF CMIF —EEIF BCLIF LVDIF TMR3IF CCP2IF 00-0 0000 00-0 0000

PIE2 OSCFIE CMIE —EEIE BCLIE LVDIE TMR3IE CCP2IE 00-0 0000 00-0 0000

IPR2 OSCFIP CMIP —EEIP BCLIP LVDIP TMR3IP CCP2IP 11-1 1111 11-1 1111

TMR3L Holding Register for the Least Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu

TMR3H H olding Register for the Most Significant Byte of the 16-bit TMR3 Register xxxx xxxx uuuu uuuu

T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 uuuu uuuu

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by Capture and Timer1.

Note 1: These bits are reserved on the PIC18F2X20 devices; always maintain these bits clear.

PIC18F2220/2320/4220/4320

15.5 PWM Mode

In Pulse Width Modulation (PWM) mode, the CCP1 pin

produces up to a 10-bit resolution PWM output. Since

the CCP1 pin is multiplexed with the PORTC data latch,

the TRISC<2> bit must be cleared to make the CCP1

pin an output.

Figure 15-3 shows a simplified block diagram of the

CCP module in PWM mode.

For a ste p-by-step proc edure on how t o set up the CC P

module for PWM operation, see Section 15.5.3

“Setup for PWM Operation”.

FIGURE 15-3: SIMPLIFIED PWM BLOCK

DIAGRAM

A PWM output (Figure 15-4) has a time base (period)

and a time that the output is high (duty cycle). The

frequency of the PWM is the inverse of the period

(1/period).

FIGURE 15-4: PWM OUTPUT

15.5.1 PW M PE RIO D

The PWM period is specified by writing to the PR2

following equation.

EQUATION 15-1:

PWM frequency is defined as 1/[PWM period]. When

TMR2 is e qual to PR 2, the foll owing three event s occur

on the next increment cycle:

•TMR2 is cleared

• The CCP1 pin is set (if PW M duty cycle = 0%, the

CCP1 pin will not be set)

• The PWM du ty cycle is copied from CCPR1L into

CCPR1H

15.5.2 PW M DUTY CYCL E

The PWM duty cycle is specified by writing to the

CCPR1L register and to the CCP1CON<5:4> bits. Up

to 10- b i t re so l uti on is av ai l ab le. T he CC PR 1 L c ontai ns

the eight MSbs and the CCP1CON<5:4> contains the

two LSbs. This 10-bit value is represented by

CCPR1L:CCP1CON<5:4>. The PWM duty cycle is

calculated by the following equation.

EQUATION 15-2:

CCPR1L and CCP1CON<5:4> can be written to at any

time but the duty cycle value is not copied into

CCPR1H un til a match between PR2 and TMR2 occurs

(i.e., the period is complete). In PWM mode, CCPR1H

is a read- only regi ster.

Note: Clearing the CCP1CON register will force

the CCP1 PWM o utpu t latch to the de fau lt

low level. This is not the PORTC I/O data

latch.

CCPR1L

CCPR1H (Slave)

Comparator

TMR2

Comparator

PR2

(Not e 1)

Duty Cycle Registers CCP1CON<5:4>

Clear Timer,

CCP1 pin and

latch D.C.

TRISC<2>

RC2/CCP1/P1A

Note: 8-bi t timer is concatenated with 2-bit internal Q clock or

2 bits of the prescaler to create 10-bit time base.

Period

Duty Cycle

TMR2 = PR2

TMR2 = Duty Cycle

TMR2 = PR2

Note: The Timer2 postscaler (see Section 13.0

“Timer2 Module”) is not used in the

determination of the PWM frequency. The

postscaler could be used to have a servo

update rate at a different frequency than

the PWM output.

PWM Period = [(PR2) + 1] • 4 • TOSC •

(TMR2 Prescale Value)

PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) •

TOSC • (TMR2 Prescal e Val ue)

PIC18F2220/2320/4220/4320

The CCPR1H register and a 2-bit internal latch are

used to double-buffer the PWM duty cycle. This

double-b uf feri ng is esse ntial for g litchl ess PWM ope ra-

tion. When the CCPR1H and 2-bit latch match TMR2,

concatenated with an internal 2-bit Q clock or two bits

of the TMR2 prescaler, the CCP1 pin is cleared. The

maximum PWM resolution (bits) for a given PWM

frequency is given by the following equation.

EQUATION 15-3:

15.5.3 SETUP FOR PWM OPERATION

The following steps should be taken when configuring

the CCP module for PWM operation:

1. Set the PW M peri od by w riting to the PR2 r egiste r.

2. Set the PWM duty cycle by writing to the

CCPR1L register and the CCP1CON<5:4> bits.

3. Make the CCP1 pin an output by clearing the

TRISC<2> bit.

4. Set the TMR2 prescale value and enab le Time r2

by writing to T2CON.

5. Configure th e CCP1 module for PWM operation.

TABLE 15-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz

TABLE 15-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2

Note: If the PWM duty cycle value is longer than

the PWM period, the CCP1 pin will not be

cleared.

PWM Resolution (max) =

FOSC

FPWM

log

log(2) bits

⎛

⎝

⎞

⎠

PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz

Timer Prescaler (1, 4, 16)1641111

PR2 Value FFh FFh FFh 3Fh 1Fh 17h

Maximum Resolution (bits) 10 10 10 8 7 6.58

Name Bi t 7 Bit 6 Bit 5 Bit 4 Bit 3 B it 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TRISC PORTC Data Direction Register 1111 1111 1111 1111

TMR2 T imer2 Module Register 0000 0000 0000 0000

PR2 T imer2 Module Period Register 1111 1111 1111 1111

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000

CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu

CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu

CCP1CON —— DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000

CCPR2L Capture/Compare/PWM Register 2 (LSB) xxxx xxxx uuuu uuuu

CCPR2H Capture/Compare/PWM Register 2 (MSB) xxxx xxxx uuuu uuuu

CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 0000

OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 qq00 0000 qq00

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PWM and Timer2.

Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on the PIC18F2X20 devices; always maintain these bits clear.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

16.0 ENHANCED CAPTURE/

COMPARE/PWM (ECCP)

MODULE

In 40 and 44-pin devices, the CCP1 module is

implemented as a standard CCP module with

enhanced PWM capabilities. Operation of the Capture,

Compare and standard single output PWM modes is

described in Section 15.0 “Capture/Compare/PWM

(CCP) Modules”. Di sc ussion in that s ec tio n re lati ng to

PWM frequency and duty cycle also apply to the

enhanced PWM mode.

The ECCP module differs from the CCP with the addi-

tion of an enhanced PWM mode which allows for 2 or

4 output channels, user-selectable polarity, dead band

control and automatic shutdown and restart. These

features are discussed in detail in Section 16.4

“Enhanced PWM Mode”.

The control register for CCP1 is shown in Register 16-1.

It differs from the CCP1CON register of PIC18F2X20

devices in that the two Most Significant bits are

implemented to control enhanc ed PW M functionali ty.

Note: The E CCP (Enh anced Capt ure/ Comp are/

PWM) module is only available on

PIC18F4 X20 dev ic es .

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0

bit 7 bit 0

bit 7-6 P1M1:P1M0: PWM Output Configuration bits

If CCP1M<3:2 > = 00, 01, 10 (Capture, Compare, or disabled):

xx =P1A assigned as Capture/Compare input; P1B, P1C, P1D assigned as port pins

If CCP1M<3:2 > = 11 (PWM modes):

00 =Single output; P1A modulated; P1B, P1C, P1D assigned as port pins

01 =Full-bridge output forward; P1D modulated; P1A active; P1B, P1C inactive

10 =Half-bridge output; P1A, P1B modulated with dead band control; P1C, P1D assigned as port pins

11 =Full-bridge output reverse; P1B modulated; P1C active ; P1A, P1D inactive

bit 5-4 DC1B1:DC1B0: PWM Duty Cycle Lea st Significant bit s

Capture mode:

Unused.

Compare mode:

Unused.

PWM mo de:

These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.

bit 3-0 CCP1M3:CCP1M0: ECCP1 Mode Select bi ts

0000 =Capture/Compare/PWM off (resets ECCP module)

0001 =Unused (reserved)

0010 =Compare mode, toggle output on match (ECCP1IF bit is set)

0011 =Unused (reserved)

0100 =Capture mode, every falling edge

0101 =Capture mode, every rising edge

0110 =Capture mode, every 4th rising edge

0111 =Capture mode, every 16th rising edge

1000 =Compare mode, set output on match (ECCP1IF bit is set)

1001 =Compare mode, clear output on match (ECCP1IF bit is set)

1010 = Comp are m ode , gen era te so ftw are int errup t on m atc h (ECC P1IF bit i s se t, EC CP1 pi n

operates as a port pin for input and output)

1011 =Comp are mode, trig ger special ev ent (ECCP1IF bi t is set, ECCP reset s TMR1or TMR 2

and starts an A/D conversion if the A/D module is enabled)

1100 =PWM mode, P1A, P1C active-high, P1B, P1D active-high

1101 =PWM mode, P1A, P1C active-high, P1B, P1D active-low

1110 =PWM mode, P1A, P1C active-low, P1B, P1D active-high

1111 =PWM mode, P1A, P1C active-low, P1B, P1D active-low

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320
DS39599D-page 142 © 2006 Microchip Technology Inc.
In addi tion t o t he ex pan ded fu nctio ns of  the C CP1C ON
register, the ECCP  mo dule h as two  additi onal re giste rs
associated with enhanced PWM operation and
Auto-Shutdown features:
•PWM1CON
• ECCPAS
All other registers associated with the ECCP module
are identical to those used for the CCP1 module in
PIC18F2X20 devices, including register and individual
bit names. Likewise, the timer assignments and inter-
actions between the two CCP modules are identical,
regardle ss of whe ther CCP1  is a s tandard  or enha nced
module.
16.1 ECCP Outputs 
The Enhanced CCP module may have up to four  outputs
depending on the selected operating mode. These out-
puts, design ated P1A through P1D, are multiplexed with
I/O pins on PORTC and PORTD. The pin assignments
are summarized in Table 16-1.
To configure I/O pins as PWM outputs, the proper PWM
mode must be selected by setting the P1Mn and
CCP1Mn bits (CCP1CON<7:6> and <3:0>, respec-
tively). The appropriate TRISC and TRISD direction
bits for the port pins must also be set as outputs. 
16.2 Capture and Compare Modes
The Capture and Compare modes of the ECCP module
are ide ntical in o peration to th at of CCP1,  as discusse d
in  Section 15.3 “Capture Mode” and Section 15.4
“Compare Mode”. No changes are required when
moving between these modules on PIC18F2X20 and
PIC18F4 X20 dev ic es .
16.3 Standard PWM Mode
When configured in Single Output mode, the ECCP
module functions identically to the standard CCP
module in PWM mode, as described in Section 15.4
“Compare Mode”.
TABLE 16-1: PIN ASSIGNMENTS FOR VARIOUS ECCP MODES  
Note: When setting up single output PWM opera-
tions , users  are free to us e either of the pro -
cesses described in Section 15.5.3 “Setup
for PWM Operation” or Section 16.4.7
“Setup for PWM Operation”. The latter is
more ge neric but  will wor k for eith er single
or multi output PWM.
ECCP Mode CCP1CON
Configuration RC2 RD5 RD6 RD7
Compatible CCP 00xx11xx CCP1 RD5/PSP5 RD6/PSP6 RD7/PSP7
Dual PWM 10xx11xx P1A P1B RD6/PSP6 RD6/PSP6
Quad PWM x1xx11xx P1A P1B P1C P1D
Legend: x = Don’t care. Shaded cells indicate pin assignments not used by ECCP in a given mode.
Note 1: TRIS register values must be configured appropriately.
2: With ECCP in Dual or Quad PWM mode, the PSP input/output control of PORTD is overridden by P1B, 
P1C and P1D.

PIC18F2220/2320/4220/4320

16.4 Enhanced PWM Mode

The Enhanced PWM mode provides additional PWM

output options for a broader range of control applica-

tions. Th e module i s an upwardl y compat ible vers ion of

the st andard CCP m odule and o ffers up to four output s,

designated P1A through P1D. Users are also able to

select the polarity of the signal (either active-high or

active -low). The module’ s outpu t mode an d polarit y are

configured by setting the P1M1:P1M0 and

CCP1M3:CCP1M0 bits of the CCP1CON register

(CCP1CON<7:6> and CCP1CON<3:0>, respectively).

Figure 16-1 shows a simplified block diagram of PWM

operatio n. All con trol regi sters are double -buf fe red and

are loaded at the beginning of a new PWM cycle (the

period boundary when Timer2 resets) in order to pre-

vent gli tches on any of the outputs. The exception is the

PWM Delay register, ECCP1DEL, which is loaded at

either the duty cycle boundary or the boundary period

(whichever comes first). Because of the buffering, the

modul e wai ts un t il th e as si gn ed ti m er rese ts in ste ad of

starting immediately. This means that enhanced PWM

waveforms do not exactly match the standard PWM

wavef orms but are instead offset by one fu ll ins truc tio n

cycle (4 TOSC).

As before, the user must manually configure the

appropriate TRISD bits for output.

16.4.1 PWM OUTPUT CONFIGURATIONS

The P1M1:P1M0 bits in the CCP1CON register allow

one of four configurations:

• Single Output

• Half-Bridge Output

• Full-Brid ge Output, For ward mode

• Full-Bridge Output, Reverse mode

The Single Output mode is the Standard PWM mode

discussed in Section 15.5 “PWM Mode”. The Half-

Bridge and Full-Bridge Output modes are covered in

detail in the sections that follow.

The general relationship of the outputs in all

configurations is summarized in Figure 16-2.

FIGURE 16-1: SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE

CCPR1L

CCPR1H (Slave)

Comparator

TMR2

Comparator

PR2

(Note 1)

Duty Cycle Registers CCP1CON<5:4>

Clear Timer,

set CCP1 pin and

latch D.C.

Note: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock or 2 bits of the prescaler to create the 10-bit time ba se.

TRISD<4>

RC2/CCP1/P1A

TRISD<5>

RD5/PSP5/P1B

TRISD<6>

RD6/PSP6/P1C

TRISD<7>

RD7/PSP7/P1D

Output

Controller

P1M1<1:0> 2CCP1M<3:0>

PWM1CON

CCP1/P1A

P1B

P1C

P1D

PIC18F2220/2320/4220/4320

FIGURE 16-2: PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE)

FIGURE 16-3: PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)

Relationships:

• Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value)

• Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)

• Delay = 4 * TOSC * (PWM1CON<6:0>)

Note 1: Dead band delay is programmed using the PWM1CON register (see Section 16.4.4 “Programmable Dead Band Delay”).

Period

SIGNAL PR2+1

CCP1CON

<7:6>

P1A Modulated

P1B Modulated

P1A Acti ve

P1B Inactive

P1C Inactive

P1D Modulated

P1A Inactive

P1B Modulated

P1C Ac tive

P1D Inactive

Duty

Cycle

(Single Output)

(Half-Bridge)

(Full-Bridge,

Forward)

(Full-Bridge,

Reverse)

Delay(1) Delay(1)

Period

SIGNAL PR2+1

CCP1CON

<7:6>

P1A Modulated

P1B Modulated

P1A Acti ve

P1B Inactive

P1C Inactive

P1D Modulated

P1A Inactive

P1B Modulated

P1C Ac tive

P1D Inactive

Duty

Cycle

(Single Output)

(Half-Bridge)

(Full-Bridge,

Forward)

(Full-Bridge,

Reverse)

Delay(1) Delay(1)

PIC18F2220/2320/4220/4320

16.4.2 HALF-BRIDGE MODE

In the Half-Bridge Output mode, two pins are used as

outputs to drive push-pull loads. The PWM output sig-

nal is outp ut on the RC2/CCP1 /P1A pin, while the com -

plementary PWM output signal is output on the RD5/

PSP5/P1B pin (Figure 16-4). This mode can be used

for half-b ridge applic ations, as show n in Figure 16-5, or

for full-bridge applications where four power switches

are being modulated with two PWM signals.

In Half-Bridge Output mode, the programmable dead

band delay can be used to prevent shoot-through

current in half-bridge power devices. The value of bits

PDC6:PDC0 sets the number of instruction cycles

befor e the output is driven acti ve. If the v alue is g reater

than the duty cycle, the corresponding output remains

inactive during the entire cycle. See Section 16.4.4

“Programmable Dead Band Delay” for more details

of the dead band delay operations.

Since the P1A and P1B outputs are multiplexed with

the PORTC<2> and PORTD<5> data latches, the

TRISC<2> and TRISD<5> bits must be cleared to

configure P1A and P1B as outputs.

FIGURE 16-4: HALF-BRIDGE PWM

OUTPUT

FIGURE 16-5: EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS

Period

Duty Cycle

(1)

P1A(2)

P1B(2)

td = Dead Band Delay

Period

(1) (1)

Note 1: At this time, the TMR2 register is equal to the PR2

2: Output signals are shown as active-high.

PIC18F4220/4320

P1A

P1B

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

PIC18F4220/4320

P1A

P1B

Standard Half-Bridge Circuit (“Push-Pull”)

Half-Bridge Output Driving a Full-Bridge Cir c uit

PIC18F2220/2320/4220/4320

16.4.3 FULL-BRIDGE MODE

In Full-Bridge Output mode, four pins are used as out-

puts; however, only two outputs are active at a time. In

the Forwa rd mode, pin R C2/CCP1/P1A is continuou sly

active and pin RD7/PSP7/P1D is modulated. In the

Reverse mode, RD6/PSP6/P1C pin is continuously

active and RD5/PSP5/P1B pin is modulated. These are

illustrated in Figure 16-6.

P1A, P1B, P1C and P1D outputs are multiplexed with

the PORTC<2> and PORTD<5:7> data latches. The

TRISC<2> and TRISD<5:7> bits must be cleared to

make the P1A, P1B, P1C and P1D pins output.

FIGURE 16-6: FULL-BRIDGE PWM OUTPUT

Period

Duty Cycle

P1A(2)

P1B(2)

P1C(2)

P1D(2)

FORWARD MODE

(1)

Period

Duty Cycle

P1A(2)

P1C(2)

P1D(2)

P1B(2)

REVER SE MO D E

(1)

Note 1: At this time, the TMR2 register is equal to the PR2 register.

Note 2: Output signal is shown as active-high.

PIC18F2220/2320/4220/4320

FIGURE 16-7: EXAMPL E OF FULL-BRIDGE APPLICATION

16.4.3.1 Direction Change in Full-Bridge

Mode

In the Full-Bridge Output mode, the P1M1 bit in the

CCP1CON regis ter al lows us ers to contr ol the forwar d/

reverse direction. When the application firmware

changes this direction control bit, the module will

assume the new direction on the next PWM cycle.

Just before the end of the c urrent PWM period, the mod-

ulated outputs (P1B and P1D) are placed in their inactive

state, while the unmodulated outpu ts (P1A and P1C) are

switched to drive in the o pposite direction. This occurs in

a time interval of 4 TOSC * (Timer2 Prescale Value)

before the next PWM period begins. The Timer2

prescaler will be either 1, 4 or 16, depending on the

value of the T2CKPS bit (T2CON<1:0>). During the

interval from the switch of the unmodulated outputs to

the beginning of the next period, the modulated outputs

(P1B and P1D) remain inactive. This relationship is

shown in Figure 16-8.

Note that in the Full-Bridge Output mode, the ECCP

module does no t prov id e any dea d band delay. In gen-

eral, since only one output is modulated at all times,

dead band delay is not required. However, there is a

situation where a dead band delay might be required.

This situation occurs when both of the following

conditions are true:

1. The direction of the PWM output changes when

the duty cycle of the output is at or near 100%.

2. The tu rn-off ti me of the po wer swi tch, in cluding

the power device and driver circuit, is greater

than the turn-on tim e.

Figure 16-9 shows an example where the PWM direc-

tion changes from forward to reverse at a near 100%

duty cycle. At time t1, the outputs P1A and P1D

become inactive, while output P1C becomes active. In

this example, since the turn-off time of the power

device s is longer th an the turn-on time, a shoot-through

current may flow through power devices QC and QD

(see Figure 16-7) for the duration of ‘t’. The same

phenomenon will occur to power devices QA and QB

for PWM direction change from reverse to forward.

If changing PWM direction at high duty cycle is required

for an application, one of the following requirements

must b e met:

1. Reduce PWM for a PWM period before

changing directions.

2. Use switch drivers that can drive the switches off

faster than they can drive them on.

Other options to prevent shoot-through current may

exist.

PIC18F4220/4320

P1A

P1C

FET

Driver

FET

Driver

V+

V-

Load

FET

Driver

FET

Driver

P1B

P1D

QB QD

PIC18F2220/2320/4220/4320

FIGURE 16-8: PWM DIRE CTION CHANGE

FIGURE 16-9: PWM DIRE CTION CHANGE AT NEAR 100% DUTY CYCLE(1)

Period(1)

SIGNAL

Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle.

2: When changing directions, the P1A and P1C signals switch before the end of t he current PWM cycle at intervals of

4 TOSC, 16 TOSC or 64 TOSC, depending on the T imer2 prescaler value. The modulated P1B and P1D signals are

inac t ive a t th i s ti me.

Period

(Note 2)

P1A (Active High)

P1B (Active High)

P1C (Active High)

P1D (Active High)

Forward Period Reverse Period

P1A

ton(2)

toff(3)

t = toff – ton(2,3)

P1B

P1C

P1D

External Switch D

Potential

Shoot-Through

Current

Note 1: All signals are shown as active-high.

2: ton is the turn-on delay of power switch QC and its driver.

3: toff is the turn-off delay of power switch QD and its driver.

External Switch C

PIC18F2220/2320/4220/4320

16.4.4 PROGRAMMABLE DEAD BAND

DELAY

In half-bridge applications, where all power switches

are modulated at the PWM frequency at all times, the

power switches normally require more time to turn off

than to turn on. If both the upper and lower power

switc he s a re sw it ched at the same time (one turne d o n

and the other turned off), both switches may be on for

a short period of time until one switch completely turns

off. During this brief interv al, a very hig h current (shoot-

through current) may flow through both power

switches, shorting the bridge supply. To avoid this

potentia lly des tructiv e shoot -through current from flow-

ing during switching, turning on either of the power

switches is normally delayed to allow the other switch

to completely turn off.

In the Half-Bridge Output mode, a digitally program-

mable dead band delay is available to avoid shoot-

through current from destroying the bridge power

switches. The delay occurs at the signal transition from

the non-active state to the active state. See Figure 16-4

for illustration. The lower seven bits of the PWM1CON

microcontrolle r instruction cycles (TCY or 4 TOSC).

16.4.5 ENHANCED PWM

AUTO-SHUTDOWN

When the ECCP is programmed for any of the

enhanced PWM modes, the active output pins may be

configured for auto-shutdown. Auto-shutdown immedi-

ately places the enhanced PWM output pins into a

defined shutdown state when a shutdown event

occurs.

A shutdown event can be caused by either of the two

comparator modules or the INT0 pin (or any combina-

tion of these three sources). The comparators may be

used to monitor a v oltage in put proportio nal to a c urrent

being monitored in the bridge circuit. If the voltage

exceeds a threshold, the comparator switches state

and triggers a shutdown. Alternatively, a digital signal

on the IN T0 pi n c an als o t r igg er a sh ut d ow n. The auto-

shutdown feature can be disabled by not selecting any

auto-shu tdown s ources. The auto-shut down sour ces to

be used are selected using the ECCPAS2:ECCPAS0

bits (ECCPAS<6:4>).

When a shutdown occurs, the output pins are asyn-

chronously placed in their shutdown states, specified

by the PSSAC1:PSSAC0 and PSSBD1:PSSBD0 bits

(ECCPAS<3:0>). Each pin pair (P1A/P1C and P1B/

P1D) m ay be s et to dr ive hig h, driv e lo w or be t ri-st ated

(not driving). The ECCPASE bit (ECCPAS<7>) is also

set to hold the enhanced PWM outputs in their

shutdown states.

The ECCPASE bit is s et by hardware when a shutdow n

event o cc urs. If automatic re starts are no t e nab led , th e

ECCPASE bit is c leared by f irmware when t he caus e of

the shutdown clears. If automatic restarts are enabled,

the ECCPASE bit is automatically cleared when the

cause of the auto-shutdown has cleared.

If the ECCPASE bit is set when a PWM period begins,

the PWM o utputs remain in their shutdown state for that

entire PW M peri od. Wh en the ECCPASE bi t is cle ared,

the PWM outputs will return to normal operation at the

beginning of the next PWM period.

Note: Writing to the ECCPASE bit is disabled

while a shutdown condition is active.

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0

bit 7 bit 0

bit 7 PRSEN: PWM Restart Enable bit

1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event

goes away; the PWM restarts automatically

0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM

bit 6-0 PDC<6:0>: PWM Delay Count bits

Number of FOSC/4 ( 4 * TOSC) cycles between the scheduled time when a PWM signal should

transition active and the actual time it transitions active.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

CONTROL REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0

bit 7 bit 0

bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit

0 = ECCP outputs are operating

1 = A shutdown event has occurred; ECCP outputs are in shutdown state

bit 6-4 ECCPAS<2:0>: ECCP Auto-Shutdown Source Select bits

000 = Auto-shutdown is disabled

001 = Comparator 1 output

010 = Comparator 2 output

011 = Either Comparator 1 or 2

100 = INT0

101 = INT0 or Comparator 1

110 = INT0 or Comparator 2

111 = INT0 or Comparator 1 or Comparator 2

bit 3-2 PSSAC<1:0>: Pin A and C Shutdown State Control bits

00 = Drive Pins A and C to ‘0’

01 = Drive Pins A and C to ‘1’

1x = Pins A and C tri-state

bit 1-0 PSSBD<1:0>: Pin B and D Shutdown State Control bits

00 = Drive Pins B and D to ‘0’

01 = Drive Pins B and D to ‘1’

1x = Pins B and D tri-state

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

16.4.5.1 Auto-Shutdown and Automatic

Restart

The auto-shutdown feature can be configured to allow

automatic restarts of the module following a shutdown

event. This is enabled by setting the PRSEN bit of the

PWM1CON register (PWM1CON<7>).

In Shut down mode with PRSEN = 1 (Figure 16-10), the

ECCPASE bit will remain set for as long as the cause

of the shutdown continues. When the shutdown condi-

tion clears, the ECCPASE bit is cleared. If PRSEN = 0

(Fig ure 16 -11), o nce a s hutdo wn c ond iti on oc cur s, the

ECCPASE bit will remain set until it is cleared by firm-

ware. Once ECCPASE is cleared, the enhanced PWM

will resume at the beginning of the next PWM period.

Independent of the PRSEN bit setting, if the auto-

shutdown source is one of the comparators, the shut-

down cond iti on is a le vel. The E CCPASE bit cannot be

cleared as long as the cause of the shutdown persists.

The Auto-Shu tdown mode can be forced by writing a ‘1’

to the ECCPASE bit.

16.4.6 START-UP CONSIDERATIONS

When the EC CP module is use d in the PWM mode, th e

applic ation hardware m ust use the p roper external pull-

up and/or pull-down resistors on the PWM output pins.

When the microcontroller is released from Reset, all of

the I/O p ins are in the h igh-impedan ce state. The exter-

nal circuits must keep the power switch devices in the

off state until the microcontroller drives the I/O pins with

the proper signal levels or ac tivates the PWM output(s).

The CCP1M1:CCP1M0 bits (CCP1CON<1:0>) allow

the user to choose whether the PW M output signals are

active-high or active-low for each pair of PWM output

pins (P1A/ P1C an d P1 B/P1D ). T he PWM output polar-

ities mu st b e sele cted bef ore the PWM pins a re confi g-

ured as outputs. Changing the polarity configuration

while the PWM pins are configured as outputs is not

recommended since it may result in damage to the

application circuits.

The P1A, P1 B, P1C and P1D outpu t latche s may not be

in the proper sta tes when the PWM module is initial ized.

Enabling the PWM pins for output at the same time as

the ECCP module may cause damage to the applic ation

circuit. The ECCP module must be enabled in the proper

output mode and co mplete a full PWM cy cle before con-

figuring the PWM pins as outputs. The completion of a

full PWM cycle is indicated by the TMR2IF bit being set

as the second PWM period begins .

FIGURE 16-10: PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED)

FIGURE 16-11: PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED)

Note: Writing to the ECCPASE bit is disabled

while a shutdown condition is active.

Shutdown

PWM

ECCPASE bit

Activity

Event

PWM Period PWM Period PWM Period

Duty Cycle

Dead Time

Duty Cycle

Dead Time

Duty Cycle

Dead Time

Shutdown

PWM

ECCPASE b i t

Activity

Event

PWM Perio d PWM Period P W M Period

ECCPASE

Cleared by Firmware

Duty Cycle

Dead Time

Duty Cycle

Dead Time

Duty Cycle

Dead Time

PIC18F2220/2320/4220/4320

16.4.7 SE TUP F OR PWM OP ERAT ION

The following steps should be taken when configuring

the ECCP1 module for PWM operation:

1. Configure the PWM pins P1A and P1B (and

P1C and P1D, if used) as inputs by setting the

corresponding TRISC and TRISD bits.

2. Set the PWM period by loading the PR2 register .

3. Configure the ECCP module for the desired

PWM mode and configuration by loading the

CCP1CON register with the appropriate values:

• Select one of the available output

configurations and direction with the

P1M1:P1M0 bits.

• Select the polarities of the PWM output

signals with the CCP1M3:CCP1M0 bits.

4. Set the PWM duty cycl e by loadi ng the C CPR1L

5. For Half-Brid ge Output m ode, set the d ead band

delay by loading PWM1CON<6:0> with the

appropriate value.

6. If auto-shutdown operation is required, load the

ECCPAS register:

• Select the auto-shutdown sources using the

ECCPAS<2:0> bits.

• Select the shutdown states of the PWM

output pins using PSSAC1:PSSAC0 and

PSSBD1:PSSBD0 bits.

• Set the ECCPASE bit (ECCPAS<7>).

• Config ure the com parato rs us ing the CMCON

• Configure the comparator inputs as analog

inputs.

7. If auto-restart operation is required, set the

PRSEN bit (PWM1CON<7>).

8. Configure and start TMR2:

• Clear the TMR2 interrupt flag bit by clearing

the TMR2IF bit (PIR1<1>).

• Set the TMR2 prescale value by loading the

T2CKPS bits (T2CON<1:0>).

• Enable Timer2 by setting the TMR2ON bit

(T2CON<2>).

9. Enable PWM outputs after a new PWM cycle

has started:

• W a it until TMR 2 overflo ws (TMR 2IF bit is se t).

• Enable the CCP1/P1A, P1B, P1C and/or P1D

pin outputs by clearing the respective TRISC

and TRISD bits.

• Clear the ECCPASE bit (ECCPAS<7>).

16.4.8 OPERATION IN POWER MANAGED

MODES

In Sleep mode, all clock sources are disabled. Timer2

will not increment and the state of the module will not

change. If the ECCP pin is driving a value, it will con-

tinue to drive that value. When the device wakes up, it

will conti nue from this st ate. If T wo-Spee d St art-ups are

enabled, the initial start-up frequency from INTOSC

and the postscaler may not be stable immediately.

In PRI_IDLE mode, the primary clock will continue to

clock the ECCP module without change.

In all ot her power managed m odes, the selecte d power

managed mode clock will clock Timer2. Other power

manage d mode clock s wil l mo st likely be d ifferent tha n

the primary clock frequency.

16.4.8.1 OPERATION WITH FAIL-SAFE

CLOCK MONITOR

If the Fail-Safe Clock Monitor is enabled

(CONFIG1H<6> is programmed), a clock failure will

force the device into the RC_RUN Power Managed

mode and the OSCFIF bit (PIR2<7>) will be set. The

ECCP will then be clocked from the internal oscillator

clock source which may have a different clock

frequency than the primary clock. By loading the

IRCF2:IRCF0 bits on Resets, the user can obtain a

frequency higher than the default INTRC clock source

in the event of a clock failure.

See the previous section for additional details.

16.4.9 EFFECTS OF A RESET

Both Power-on and subsequent Resets will force all

ports to Input mode and the CCP registers to their

Reset states.

This forces the Enhanced CCP module to reset to a

state compatible with the standard CCP module.

PIC18F2220/2320/4220/4320

TABLE 16-2: REGISTERS ASSOCIATED WITH ENHANCED PWM AND TIMER2

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

RCON IPEN — — RI TO PD POR BOR 0--1 11qq 0--q qquu

PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TMR2 Timer2 Module Register 0000 0000 0000 0000

PR2 Timer2 Module Period Register 1111 1111 1111 1111

T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000

TRISC PORTC Data Direction Register 1111 1111 1111 1111

TRISD PORTD Data Direction Register 1111 1111 1111 1111

CCPR1H Enhanced Capture/Compare/PWM Register 1 High Byte xxxx xxxx uuuu uuuu

CCPR1L Enhanced Capture/Compare/PWM Register 1 Low Byte xxxx xxxx uuuu uuuu

CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000

ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000

PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000

OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0000 q000 0000 q000

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’.

Shaded cells are not used by the ECCP module in enhanced PWM mode.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

17.0 MASTER SYNCHRONOUS

SERIAL PORT (MSSP)

MODULE

17.1 Master SSP (MSSP) Module

Overview

The Master Synchronous Serial Port (MSSP) module is

a serial interface useful for communicating with other

periphera l or m icroc ontroll er devic es. Th ese p eriphera l

devices may be serial EEPROMs, shift registers, dis-

play drivers, A/D converters, etc. The MSSP module

can operate in one of two modes:

• Serial Peripheral Interface (SPI)

• Inter-Integrated Circuit (I2C)

- Full Master mode

- Slave mode (with general address call)

The I2C interface supports the following modes in

hardware:

•Master mode

• Multi-Master mode

• Slave mode

17.2 Control Registers

The MSSP module has three associated registers.

These include a status register (SSPSTAT) and two

control registers (SSPCON1 and SSPCON2). The use

of the se registers and their indiv idu al c on figuration bits

differ significantly, depending on whether the MSSP

module is operated in SPI or I2C mode.

Additional details are provided under the individual

sections.

17.3 SPI Mode

The S PI mode allo ws 8 bits of dat a to be sy nchronousl y

transmitted and received, simultaneously. All four

modes of SPI are supported. To accomplish

communication, typically three pins are used:

• Serial Data Out (SDO) – RC5/SDO

• Serial Data In (SDI) – RC4/SDI/SDA

• Serial Clock (SCK) – RC3/SCK/SCL

Additionally, a fourth pin may be used when in a Slave

mode of operation:

• Slave Select (SS) – RA5/AN4/SS/LVDIN/C2OUT

module when operating in SPI mode.

FIGURE 17-1: MSSP BLOCK DIAGRAM

(SPI MODE)

(

)

Read Write

Internal

Data Bus

SSPSR reg

SSPM3:SSPM0

bit 0 Shift

Clock

SS Control

Enable

Edge

Select

Clock Select

TMR2 Output

TOSC

Prescaler

4, 16, 64

Edge

Select

Data to TX/RX in SSPSR

TRIS bit

SMP:CKE

RC5/SDO

SSPBUF reg

RA5/AN4/SS/

RC3/SCK/

SCL

RC4/SDI/SDA

LVDIN/C2OUT

PIC18F2220/2320/4220/4320

17.3.1 REGISTERS

The MSSP module has four registers for SPI mode

operation. These are:

• MSSP Control Register 1 (SSPCON1)

• MSSP Status Register (SSPSTAT)

• Serial Receive/Transmit Buffer (SSPBUF)

• MSSP Shift Register (SSPSR) – Not directly

accessible

SSPCON1 and SSPSTAT are the control and status

ter is readable and writable. The lower six bits of the

SSPSTAT are read-only. The upper two bits of the

SSPSTAT are read/write.

SSPSR is the shift register used for shifting data in or

out. SSPBUF is the buffer register to which data bytes

are written to or read from.

In receive operations, SSPSR and SSPBUF together

create a double-buffered receiver. When SSPSR

receives a complete byte, it is transferred to SSPBUF

and the SSPIF interrupt is set.

During transmission, the SSPBUF is not double-

buff ered. A write to SSPBUF will write to bo th SSPBUF

and SSPSR.

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A PSR/WUA BF

bit 7 bit 0

bit 7 SMP: Sample bit

SPI Master mode:

1 = Input data sampled at end of data output time

0 = Input data sampled at middle of data output time

SPI Slave mode:

SMP must be cleared when SPI is used in Slave mode.

bit 6 CKE: SPI Clock Edge Select bit

When CKP = 0:

1 = Data transmitted on rising edge of SCK

0 = Data transmitted on falling edge of SCK

When CKP = 1:

1 = Data transmitted on falling edge of SCK

0 = Data transmitted on rising edge of SCK

bit 5 D/A: Data/Address bit

Used in I2C mode only.

bit 4 P: Stop bit

Used in I2C mode only.

bit 3 S: Start bit

Used in I2C mode only.

bit 2 R/W: Read /W ri te bit information

Used in I2C mode only.

bit 1 UA: Update Address bit

Used in I2C mode only.

bit 0 BF: Buffer Full Status bit (Receive mode only)

1 = Receive complete, SSPBUF is full

0 = Receive not complete, SSPBUF is empty

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0

bit 7 bit 0

bit 7 WCOL: Write Collision Detect bit (Transmit mode only)

1 = The SSPBUF register is written while it is still transmitting the previous word (must be

cleared in sof tware)

0 = No collision

bit 6 SSPOV: Receive Overflow Indicator bit

SPI Slave mode:

1 = A new byte is rec eived while the SSPBUF register is still holdin g the previo us data. In c ase

of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode.The user

must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be

cleared in sof tware).

0 = No over flow

Note: In Master mode, the overflow bit is not set since each new reception (and

transmission) is initiated by writing to the SSPBUF register.

bit 5 SSPEN: Synchronous Serial Port Enable bit

1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins

0 = Disables serial port and configures these pins as I/O port pins

Note: When the MSSP is enabled in SPI mode, these pins must be properly configured

as input or output.

bit 4 CKP: Clock Polarity Select bit

1 = Idle state for clock is a high level

0 = Idle state for clock is a low level

bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits

0101 = SPI Slave mode, clock = SCK pin , SS pin co ntro l dis abl ed , SS can be used as I/O pin

0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled

0011 = SPI Master mode, clock = TMR2 output/2

0010 = SPI Master mode, clock = FOSC/64

0001 = SPI Master mode, clock = FOSC/16

0000 = SPI Master mode, clock = FOSC/4

Note: Bit combinations not specifically listed here are either reserved or implemented in

I2C mode only.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

17.3.2 OPERATION

When initializing the SPI, several options need to be

specif ied. This is done by progra mming the ap propriate

control bits (SSPCON1<5:0> and SSPSTAT<7:6>).

These control bits allow the following to be specified:

• Master mode (SCK is the clock output)

• Slave mode (SCK is the clock input)

• Clock Polarity (Idle state of SCK)

• Data Input Sample Phase (middle or end of data

output time)

• Clock Edge (output data on rising/falling edge of

SCK)

• Clock Rate (Master mode only)

• Slave Select mode (Slave mode only)

The MSSP consists of a Transmit/Receive Shift regis-

ter (SSPSR) and a Buffer register (SSPBUF). The

SSPSR shifts the data in and out of the device, MSb

first. The SSPBUF holds the data that was written to the

SSPSR until the received da ta is ready. Once the 8 bits

of data have been received, that byte is moved to the

SSPBUF register. Then the Buffer Full Detect bit, BF

(SSPSTAT<0>), and the interrupt flag bit, SSPIF, are

set. This double-buffering of the received data

(SSPBUF) allows the next byte to start reception before

reading the data tha t was just r eceived. Any write to the

SSPBUF register during transmission /reception of dat a

will be ignored and the Write Collision Detect bit,

WCOL (SSPCON1<7>), will be set. User software

must cl ear the WC OL bit s o that it can be d etermi ned if

the following write(s) to the SSPBUF register

completed successfully.

When the application software is expecting to receive

valid da ta, the SSPBUF shoul d be read before th e next

byte of dat a to transfer is writ ten to the SSPBUF. Buffer

Full bit, BF (SSPSTAT<0>), indicates when SSPBUF

has been loaded with the received data (transmission

is complete). When the SSPBUF is read, the BF bit is

cleared. This data may be irrelevant if the SPI is only a

transmitter. Generally, the MSSP interrupt is used to

determine when the transmission/reception has com-

pleted. T he SSPBUF must be rea d and/or written. If the

interrupt method is not going to be used, then software

polling can be d one to ensure that a write collision d oes

not occur. Example 17-1 shows the loading of the

SSPBUF (SSPSR) for data transmission.

The SSPSR is n ot directly reada ble or wri table and can

only be accessed by addressing the SSPBUF register.

Additionally, the MSSP Status register (SSPSTAT)

indicates the various status conditions.

EXAMPLE 17-1: LOADING THE SSPBUF (SSPSR) REGISTER

LOOP BTFSS SSPSTAT, BF ;Has data been received(transmit complete)?

BRA LOOP ;No

MOVF SSPBUF, W ;WREG reg = contents of SSPBUF

MOVWF RXDATA ;Save in user RAM, if data is meaningful

MOVF TXDATA, W ;W reg = contents of TXDATA

MOVWF SSPBUF ;New data to xmit

PIC18F2220/2320/4220/4320

17.3.3 ENABLING SPI I/O

To enable the serial port, SSP Enable bit, SSPEN

(SSPCON1<5>), must be set. To reset or reconfigure

SPI mode, clear the SSPEN bit, re-initialize the

SSPCON registers and then set the SSPEN bit. This

configures the SDI, SDO, SCK and SS pins as serial

port pin s. For the pins t o behave as the serial p ort fun c-

tion, some must have their data direction bits (in the

TRIS register) appropriately programmed. That is:

• SDI must hav e TRI SC <4> bit cl eare d

• SDO must have TRISC<5> bit cleared

• SCK (Master mode) must have TRISC<3> bit

cleared

• SCK (Slave mode) must have TRISC<3> bit set

•SS

must have TRISC<4> bit set

Any seri al port fu nction th at is no t desired may be over-

ridden by programming the corresponding data

direction (TRIS) register to the opposite value.

17.3.4 TYPICAL CO NNEC TI ON

microcontrollers. The master controller (Processor 1)

initiates the data transfer by sending the SCK signal.

Data is shifted out of both shift registers on their pro-

grammed clock e dge and l atched on the oppos ite edge

of the cloc k. Both processors should be programmed to

the same Clock Polarity (CKP), then both controllers

would send and receive data at the same time.

Whether the data is meaningful (or dummy data)

depends on the application software. This leads to

three scenarios for data transmission:

• Master sends data – Slave sends dummy data

• Master sends data – Slave s ends data

• Master sends dummy data – Slave sends data

FIGURE 17-2: SPI MASTER/SLAVE CONNECTION

Serial Input Buffer

(SSPBUF)

Shift Register

(SSPSR)

MSb LSb

SDO

SDI

PROC ESSOR 1

SCK

SPI Master SSPM3:SSPM0 = 00xxb

Serial Input Buffer

(SSPBUF)

Shift Register

(SSPSR)

LSb

MSb

SDI

SDO

PROCESSOR 2

SCK

SPI Slave SSPM3 :SSPM0 = 010xb

Serial Clock

PIC18F2220/2320/4220/4320

17.3.5 MASTER MODE

The master can initiate the data transfer at any time

because it controls the SCK. The master determines

when the slave (Processor 2, Figure 17-2) is to

broadcast data by the software protocol.

In Master mode, the data is transmitted/received as

soon as the SSPBUF registe r is written to. If the SPI is

only going to receive, the SDO output could be dis-

abled (programmed as an input). The SSPSR register

will continue to shift in the signal p resent on the S DI pin

at the programmed clock rate. As each byte is

received, it will be loaded into the SSPBUF register as

if a normal received byte (interrupts and status bits

appropriately set). This could be useful in receiver

applications as a “Line Activity Monitor” mode.

The clock polarity is selecte d by appropriate ly program-

ming the CKP bit (SSPCON1<4>). This then, would

give waveforms for SPI communication as shown in

Figure 17-3, Figure 17-5 and Figure 17-6, where the

MSB is t rans m itted first. In Mas ter mo de, the SPI cl oc k

rate (bit rate) is user programmable to be one of the

following:

•F

OSC/4 (or TCY)

•FOSC/16 (or 4 • TCY)

•F

OSC/64 (or 16 • TCY)

• (Timer2 output)/2

The maximum data rate is approximately 3.0 Mbps,

limited by timing requirements (see Table 26-14

through Table 26-17).

Figure 17-3 shows the waveforms for Master mode.

When the CKE bit is set, the SDO data is valid before

there is a clock edge on SCK. The change of the input

sample is shown based on the state of the SMP bit. The

time when the SSPBUF is loaded with the received

dat a is shown.

FIGURE 17-3: SPI MODE WAVEFORM (MASTER MODE)

SCK

(CKP = 0

SCK

(CKP = 1

SCK

(CKP = 0

SCK

(CKP = 1

4 Clock

Modes

Input

Sample

Input

Sample

SDI bit 7 bit 0

SDO bit 7 bit 6 bit 5 b it 4 bit 3 bit 2 bit 1 bit 0

bit 7 bit 0

SDI

SSPIF

(SMP = 1)

(SMP = 0)

(SMP = 1)

CKE = 1)

CKE = 0)

CKE = 1)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0

(CKE = 0)

(CKE = 1)

Next Q4 Cycl e

after Q2↓

PIC18F2220/2320/4220/4320

17.3.6 SLAVE MODE

In Slave m ode , the dat a is transmi tted and rece iv ed a s

the external clock pulses appear on SCK. When the

last bit is latched, the SSPIF interrupt flag bit is set.

While in Slave mode, the external clock is supplied by

the external clock source on the SCK pin. This external

clock must meet the minimum high and low times as

specified in the electrical specifications.

While in power managed modes, the slave can trans-

mit/receive data. When a byte is received, the device

will wake-up from power managed modes.

17.3.7 SLAVE SELECT CONTROL

The SS pin allo ws a ma ster co ntroll er to se lect one of

several slave controllers for communications in sys-

tems with more than one slave. The SPI must be in

Slave mode with SS pin control enabled

(SSPCON1<3:0> = 04h). The SS pin is configured for

input by setting TRISA<5>. When the SS pin is low,

transmission and reception are enabled and the SDO

pin is driven. When the SS pin goes high, the SDO pin

is tri-stated, even if in the middle of a transmitted byte.

External pull-up/pull-down resistors may be desirable,

depending on the application.

When the SPI module resets, SSPSR is cleared. This

can be d one by ei ther driv in g th e SS p in to a high level

or clearing the SSPEN bit.

To emulate two-wire communication, the SDO pin can

be connected to the SDI pin. When the SPI needs to

operate as a receiver the SDO pin can be configured as

an input. This disables transmissions from the SDO.

The SDI can always be left as an input (SDI function)

since it cann ot cre ate a bus con flict.

FIGURE 17-4: SLAVE SYNCHRONIZATION WAVEFORM

Note 1: When the SPI is in Slave mode with SS pin

control enabled (SSPCON1<3:0> = 0100),

the SPI module will reset when the SS pin is

set high.

2: If the SPI is us ed in Slave mo de with CK E

set, then the SS pin control must be

enabled.

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI

bit 7

SDO bit 7 bit 6 bit 7

SSPIF

Interrupt

(SMP = 0)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

Flag

bit 0

bit 7 bit 0

Next Q4 Cycle

after Q2↓

PIC18F2220/2320/4220/4320

FIGURE 17-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)

FIGURE 17-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI bit 7 bit 0

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bi t 0

SSPIF

Interrupt

(SMP = 0)

CKE = 0)

(SMP = 0)

Write to

SSPBUF

SSPSR to

SSPBUF

Flag

Optional

Next Q4 Cycle

after Q2↓

SCK

(CKP = 1

SCK

(CKP = 0

Input

Sample

SDI bit 7 bit 0

SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 b it 1 bit 0

SSPIF

Interrupt

(SMP = 0)

CKE = 1)

(SMP = 0)

Wr i te to

SSPBUF

SSPSR to

SSPBUF

Flag

Not Optional

Next Q4 Cycle

after Q2↓

PIC18F2220/2320/4220/4320

17.3.8 MASTER IN POWER MANAGED

MODES

In Master mode, module clocks may be operating at a

different speed than when in full power mode, or in the

case o f the Sleep Power Ma naged mo de, all c locks are

halted.

In most power managed modes, a clock is provided to

the peripherals and is derived from the primary clock

source, the secondary clock (T imer1 oscill ator at 32.768

kHz) or the internal oscillator block (one of eight frequen-

cies between 31 kHz and 8 MHz). See Section 2.7

“Clock Sources and Oscillator Switching” for

additional information.

In most cases, the speed that the master clocks SPI

data is not important; however, this should be

evaluated for each system.

If MSSP inte rrupts are en abled, they can wake the con-

troller from a power managed mode when the master

completes sending data. If an exit from a power

manage d mode is no t desi red, MS SP int errupt s sh ould

be disabled.

If the Sleep mode is selected, all module clocks are

halted and the transmission/reception will pause until

the device wakes from the power managed mode. After

the device returns to full power mode, the module will

resume transmitting and receiving data.

17.3.8.1 Slave in Power Managed Modes

In Slave mode, the SPI Transmit/Receive Shift register

operat es asyn chron ously to the devi ce . This allows the

device to be placed in any power managed mode and

data to be shifted into the SPI Transmit/Receive Shift

interrupt flag bit will be set and if MSSP interrupts are

enabled, will wake the device from a power managed

mode.

17.3.9 EFFECTS OF A RESET

A Reset disables the MSSP module and terminat es the

current transfer.

17.3.10 BUS MODE COMPATIBILITY

Table 17-1 shows the compatibility between the

standard SPI modes and the states of the CKP and

CKE control bits.

TABLE 17-1: SPI BUS MODES

There is also an SMP bit which controls when the data

is sampled.

TABLE 17-2: REGISTERS ASSOCIATED WITH SPI OPERATION

Standard SPI Mode

Terminology

Control Bits State

CKP CKE

0, 0 0 1

0, 1 0 0

1, 0 1 1

1, 1 1 0

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all othe r

Resets

INTCON GIE/GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

TRISC PORTC Data Direction Register 1111 1111 1111 1111

SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu

SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000

TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Register --11 1111 --11 1111

SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode.

Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on the PIC18F2X20 devices; always maintain these bits clear.

PIC18F2220/2320/4220/4320

17.4 I2C Mode

The MSSP module in I2C mode fully implements all

master an d sla ve func tion s (including ge nera l ca ll sup-

port) and provides interrupts on Start and Stop bits in

hardware to determine a free bus (multi-master func-

tion). The MSSP module implements the standard

mode specifications, as well as 7-bit and 10-bit

addressing.

Two pins are used for data transfer:

• Serial Clock (SCL) – RC3/SCK/SCL

• Serial Data (SDA) – RC4/SDI/SDA

The user m ust con figure th ese pin s as inp uts using th e

TRISC<4:3> bits.

FIGURE 17-7: MSSP BLOCK DIAGRAM

(I2C MODE)

17.4.1 REGISTERS

The MSSP module has six registers for I2C operation.

These are:

• MSSP Control Register 1 (SSPCON1)

• MSSP Control Register 2 (SSPCON2)

• MSSP Status Register (SSPSTAT)

• Serial Receive/Transmit Buffer (SSPBUF)

• MSSP Shift Register (SSPSR) – Not directly

accessible

• MSSP Address Register (SSPADD)

SSPCON1, SSPCON2 and SSPSTAT are the control

and status registers in I2C mode operation. The

SSPCON1 and SSPCON2 registers are readable and

writable. The lower six bits of the SSPSTAT are

read-only. The upper two bits of the SSPSTAT are

read/write.

SSPSR is the shift register used for shifting data in or

out. SSPBUF is the buffer register to which data bytes

are written to or read from.

SSPADD register holds the slave device address

when the SSP is configured in I2C Slav e mod e. W hen

the SSP is configured in Master mode, the lower

seven bits of SSPADD act as the Baud Rate

Generator reload value.

In receive operations, SSPSR and SSPBUF together

create a double-buffered receiver. When SSPSR

receives a complete byte, it is transferred to SSPBUF

and the SSPIF interrupt is set.

During transmission, the SSPBUF is not double-

buff ered. A write to SSPBUF will write to bo th SSPBUF

and SSPSR.

Read Write

SSPSR reg

Match Detect

SSPADD reg

Start and

Stop bit Detect

SSPBUF reg

Internal

Data Bus

Addr Match

Set, Reset

S, P bits

(SSPS TAT reg

)

RC3/SCK/ Shift

Clock

MSb LSb

RC4/SDI/

SDA

SCL

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0

SMP CKE D/A PSR/WUA BF

bit 7 bit 0

bit 7 SMP: Slew Rate Control bit

In Master or Slave mode:

1 = Slew rate control disabled

0 = Slew rate control enabled

bit 6 CKE: SMBus Select bit

In Master or Slave mode:

1 = Enable SMBus specific inputs

0 = Disable SMBus specific inputs

bit 5 D/A: Da ta/Address bit

In Master mode:

Reserved.

In Slave mode:

1 = Indicates that the last byte received or transmitted was data

0 = Indicates that the last byte received or transmitted was address

bit 4 P: Stop bit

1 = Indicates that a Stop bit has been detected last

0 = Stop bit was not detected last

Note: This bit is cleared on Reset when SSPEN is cleared or a S tart bi t has been detected.

bit 3 S: Start bit

1 = Indicates that a Start bit has been detected last

0 = Start bit was not detected last

Note: This bi t is cleared on Reset when SSPEN is cleared or a S top bit has been detected.

bit 2 R/W: Read/Write bit Inform ation (I2C mode only)

In Slave mode:

1 = Read

0 = Write

Note: This bit holds the R/W bit information following the last address match. This bit is

only valid from the address match to the next Start bit, Stop bit or not ACK bit.

In Master mode:

1 = Transmit is in progress

0 = Transmit is not in progress

Note: OR’ing this bit with the SSPCON2 bits, SEN, RSEN, PEN, RCEN or ACKEN will

indicate if the MSSP is in Idle mode.

bit 1 UA: Update Address (10-bit Slave mode only)

1 = Indicates that the user needs to update the address in the SSPADD register

0 = Address does not need to be updated

bit 0 BF: Buffer Full Status bit

In Trans mit mode:

1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full

0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty

In Receive mode:

1 = Receive complete, SSPBUF is full

0 = Receive not complete, SSPBUF is empty

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0

bit 7 bit 0

bit 7 WCOL: Write Collision Detect bit

In Master Transmit mode:

1 = A write to the SSPBUF register was attempted while the I2C co ndit io ns wer e no t vali d fo r

a transmission to be started (must be cleared in softwar e)

0 = No collision

In Slave Transmit mode:

1 = The SSPBUF register is written while it is still transmitting the previous word (must be

cleared i n software)

0 = No collision

In Receive mode (Master or Slave modes):

This is a “don’t care” bit.

bit 6 SSPOV: Receive Overflow Indicator bit

In Receive mode:

1 = A byte is received while the SSPBUF register is still holding the previous byte (must be

cleared i n software)

0 = No overflow

In Trans mit mode:

This is a “don’t care” bit in Transmit mode.

bit 5 SSPEN: Synchronous Serial Port Enable bit

1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins

0 = Disables serial port and configures these pins as I/O port pins

Note: When enabled, the SDA and SCL pins must be configured as input pins.

bit 4 CKP: SCK Release Control bit

In Slave mode:

1 = Release clock

0 = Holds clock low (clock stretch), used to ensure data setup time

In Master mode:

Unused in this mode.

bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits

1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled

1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled

1011 = I2C Firmware Controlled Master mode (Slave Idle)

1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1))

0111 = I2C Slave mode, 10-bit address

0110 = I2C Slave mode, 7-bit address

Note: Bit combinations not specifically listed here are either reserved, or implemented in

SPI mode only.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN

bit 7 bit 0

bit 7 GCEN: General Call Ena ble bit (Slave mode only)

1 = Enable interrupt when a general call address (0000h) is received in the SSPSR

0 = General call address disabled

bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only)

1 = Acknowledge was not received from slave

0 = Acknowledge was received from s lave

bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only)

1 = Not Acknowledge

0 = Acknowledge

Note: Value that will be transmitted when the user initiates an Acknowledge sequence at

the end of a receive.

bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)

1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit.

Automatically cleared by hardware.

0 = Acknowledge sequence Idle

bit 3 RCEN: Receive Enable bit (Master mode only)

1 = Enables Receive mode for I2C

0 = Receive Idle

bit 2 PEN: Stop Condition Enable bit (Master mode only)

1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Stop condition Idle

bit 1 RSEN: Repeated Start Condition Enabled bit (Master mode only)

1 = Initiate Repeated S tart condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Repea ted Start condition Idle

bit 0 SEN: Start Condition Enabled/Stretch Enabled bit

In Master mode:

1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.

0 = Start condition Idle

In Slave mode:

1 = Clock stretching is enabled for both Slave Transmit and Slave Receive (stretch enabled)

0 = Clock stretching is disabled

Note: For bits ACKEN, RCEN, PEN, RSEN, SEN: If th e I2C module is n ot in the Idle mod e,

this bit may not be set (no spooling) and the SSPBUF may not be written (or writes

to the SSPBUF are disabled).

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

17.4.2 OPERATION

The MSSP module functions are enabled by setting

MSSP Enable bit, SSPEN (SSPCON1<5>).

The SSPCON1 register allows control of the I2C oper-

ation. F our mode selection bits (SSPCON1<3:0>) allow

one of the following I2C modes to be selected:

•I

2C Mas ter mode, clock = F OSC/(4 * (SSP ADD + 1))

•I

2C Slave mode (7-bit address)

•I

2C Slave mode (10-bit address)

•I

2C Slave mode (7-bit address), with Start and

Stop bit interrupts enabled

•I

2C Slave mode (10-bit address), with Start and

Stop bit interrupts enabled

•I

2C Firmware Controlled Master mode,

slave is Idle

Selection of any I2C mode, with the SSPEN bit set,

forces the SCL and SDA pins to be open-drain, pro-

vided these pins are programmed to inputs by setting

the appro priate TRISC b its. To ensure proper o peration

of the module, pull-up resistors must be provided

externally to the SCL and SDA pins.

17.4.3 SLAVE MODE

In Slave mod e, the SCL and SDA pins mu st be co nfi g-

ured as inputs (TRISC<4:3> set). The MSSP module

will override the input state with the output data when

required (slave-transmitter).

The I2C Slav e m od e h ardwa re w i ll alw a ys ge nera te a n

interrupt on an address match. Through the mode

select bits, the user can also choose to interrupt on

Start and Stop bits.

When an add ress is match ed, or the d at a trans fer after

an add res s mat ch i s rece ived , th e ha rdw are au tom ati-

cally will generate the Acknowledge (ACK) pulse and

load the SSPBUF register with the received value

currently in the SSPSR register.

Any combination of the following conditions will cause

the MSSP module not to give this ACK pulse:

• The Buffer Full bit, BF (SSPSTAT<0>), was set

before the transfer was received.

• The overflow bit, SSPOV (SSPCON1<6>), was

set before the transfer was received.

In this case, the SSPSR register value is not loaded

into the SSPBUF but bit SSPIF (PIR1<3>) is set. The

BF bit is cleared by reading the SSPBUF register , while

bit SSPOV is cleared by software.

The SCL clock input must have a minimum high and

low fo r pro per op erati on. The high an d l ow ti me s o f th e

I2C specification, as well as the requirement of the

MSSP module, are shown in timing parameter #100

and parameter #101.

17.4.3.1 Addressing

Once the MSSP module has been enabled, it waits for

a S t art conditio n to occur. Following the S t art co ndition,

the 8 bits are shifted into the SSPSR reg ister . All incom-

ing bits are sampled with the rising edge of the clock

(SCL) line. The value of register SSPSR<7:1> is com-

pared to the value of the SSPADD register. The

address is compared on the falling edge of the eighth

clock (SCL) pulse. If the addresses match and the BF

and SSPOV bits are clear, the following events occur:

1. The SSPSR register value is loaded into the

SSPBUF register.

2. The Buffer Full bit, BF, is set.

3. An ACK pulse is generated.

4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is

set (interrupt is generated if enabled) on the

falling edge of the ninth SCL pulse.

In 10-bit Address mode, two address bytes need to be

received by the slave. The five Most Significant bits

(MSbs) o f the firs t address b yte specify if this i s a 10-b it

address. Bit R/W (SSPSTAT<2>) must specify a write

so the slave device will receive the second address

byte. For a 10-bit address, the first byte would equal

‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two

MSbs of the address. The sequence of events for

10-bit address is as follows, with steps 7 through 9 for

the slave-transmitter:

1. Receive first (high) byte of address (bits SSPIF,

BF and bit UA (SSPSTAT<1>) are set).

2. Update the SSPADD register with second (low)

byte of Address (clears bit UA and releases the

SCL line).

3. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

4. Receive second (low) byte of address (bits

SSPIF, BF and UA are set).

5. Update t he SSPADD re gister with the f irst (high)

byte of a ddre ss . If m at ch rel ea ses SCL line, thi s

will clea r bit UA.

6. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

7. Receive Repeated Start condition.

8. Receive first (high) byte of address (bits SSPIF

and BF are set).

9. Read the SSPBUF register (clears bit BF) and

clear flag bit SSPIF.

PIC18F2220/2320/4220/4320

17.4.3.2 Reception

When the R/W bit of the address byte is clear and an

address match occurs, the R/W bit of the SSPSTAT

the SSPBUF register and the SDA line is held low

(ACK).

When the address byte overflow condition exists, then

the no Ack no w led ge (ACK ) pul se is g iv en. An ov erfl ow

conditi on is define d as eith er bit, BF (SSPSTAT<0>), is

set or bit, SSPOV (SSPCON1<6>), is set.

An MSSP interrupt is generated for each data transfer

byte. Flag bit, SSPIF (PIR1<3>), must be cleared in

software. The SSPSTAT register is used to determine

the status of the byte.

If SEN is enabled (SSPCON2<0> = 1), RC3/SCK/SCL

will be held low (clock stretch) following each data

transfer. The clock must be released by setting bit,

CKP (SSPCON1<4>). See Section 17.4.4 “Clock

Stretching” for more detail.

17.4.3.3 Transmission

When the R/W bit of the incoming address byte is set

and an address match occurs, the R/W bit of the

SSPSTAT register is set. The received address is

loaded into the SSPBUF register. The ACK pulse will

be sent on the ninth bit and pin RC3/SCK/SCL is held

low regardless of SEN (see Section 17.4.4 “Clock

Stretching” for more detail). By stretching the clock,

the master will be unable to assert another clock pulse

until the s lav e is don e preparing th e tran sm it da t a. Th e

transmit data mus t be loaded i nto the SSPBUF reg ister

which also loads the SSPSR register. Then pin RC3/

SCK/SCL should be enabled by setting bit, CKP

(SSPCON1<4>). The eight data bits are shifted out on

the falli ng ed ge of the SC L inp ut. This en sure s th at the

SDA signal is valid during the SCL high time

(Figure 17-9).

The ACK pulse from the master-receiver is latched on

the rising edge of the nin th SCL input pu lse. If the SDA

line is high (not ACK), then the data transfer is com-

plete. In this case, when the ACK is latched by the

slave, the slave logic is reset (resets SSPSTAT regis-

ter) and the slave monitors for another occurrence of

the Start bit. If the SDA line was low (ACK), the next

transmit data must be loaded into the SSPBUF register .

Again, pin RC3/SCK/SCL must be enabled by setting

bit CKP.

An MSSP interrupt is generated for each data transfer

byte. The SSPIF bit must be cleared in software and

the SSPSTAT register is used to determine the status

of the byte. The SSPIF bit is set on the falling edge of

the ninth clock pulse.

PIC18F2220/2320/4220/4320

FIGURE 17-8: I2C SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

S1 234 56 7891 2345 67 8912345 789 P

A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0

ACK

Receiving Data

ACK

Receiving Data

R/W = 0

ACK

Receiving Address

Cleared in software

SSPBUF is read

Bus master

terminates

transfer

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(PIR1<3>)

CKP (CKP does not reset to ‘0’ whe n SE N = 0)

PIC18F2220/2320/4220/4320

FIGURE 17-9: I2C SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS)

SDA

SCL

SSPIF (PIR1<3>)

BF (SSPSTAT<0>)

A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0

1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9

SSPBUF is w ritten in software

Cleared in software

SCL held low

while CPU

responds to SSPIF

From SSPIF ISR

Data in

sampled

ACK

Transmitting Data

R/W =

ACK

Receiving Address

A7 D7

D6 D5 D4 D3 D2 D1 D0

2 3 4 5 6 7 8 9

SSP BUF is wr it te n in s o ft w a r e

Cleared in software From SSPIF ISR

Transmitting Data

CKP

ACK

CK P is s e t in so f tw a re CK P is s e t in so f tw a re

PIC18F2220/2320/4220/4320

FIGURE 17-10 : I2C SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S123456789 123456789 12345 789 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7 D6D5D4D3 D1D0

Receive Data Byte

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

(PIR1<3>) Cleared in software

Receive Second Byte of Address

Cleared by hardware

when SSPADD is updated

with low byte of address

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address

SSPBUF is written with

contents of SSPSR Dummy read of SSPBUF

to clear BF flag

ACK

CKP

12345 789

D7 D6 D5 D4 D3 D1 D0

Receive Data Byte

Bus master

terminates

transfer

ACK

Cleared in software Cleared in software

SSPOV (SSPCON1<6>)

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(CKP does not reset to ‘0’ when SEN = 0)

Clock is held low until

update of SSPADD has

taken place

PIC18F2220/2320/4220/4320

FIGURE 17-11: I2C SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S123456789 123456789 12345 789 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 1 1 1 1 0 A8

R/W = 1

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

Bus master

terminates

transfer

(PIR1<3>)

Receive Second Byte of Address

Cleared by hardware when

SSPADD is updated with low

byte of address

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address.

SSPBUF is written with

contents of SSPSR Dummy read of SSPBUF

to clear BF flag

Receive First Byte of Address

12345 789

D7 D6 D5 D4 D3 D1

ACK

Tran smitting Data Byte

Dummy read of SSPBUF

to clear BF flag

Cleared in software

Write of SSPBUF

initiates transmit

Cleared in software

Completion of

clears BF flag

CKP (SSPCON1<4>)

CKP is set in software

CKP is automatically cleared in hardware holding SCL low

Clock is held low until

update of SSPADD has

taken place

data transmission

Clock is held low until

CKP is set to ‘1’

BF flag is clear

third address sequence

at the end of the

PIC18F2220/2320/4220/4320

17.4.4 CLOCK STRETCHING

Both 7 and 10-bit Slave modes implement automatic

clock stretching during a transmit sequence.

The SEN bit (SSPCON2<0>) al lows clock stretch ing to

be enabled during receives. Setting SEN will cause

the SCL pin to be held low at the end of each data

receive sequence.

17.4.4.1 Clock Stretching for 7-bit Slave

Receive Mode (SEN = 1)

In 7-bit Slave Receive mode, on the falling edge of the

ninth clock at the end of the ACK sequence if the BF bit

is set, the CKP bit in the SSPCON1 register is automat-

ically cleared, forcing the SCL output to be held low.

The CKP being cleared to ‘0’ will assert the SCL line

low. The CKP bit must be set in the user ’s ISR before

reception is allowed to continue. By holding the SCL

line low, the user has time to service the ISR and read

the contents of the SSPBUF before the master device

can initiate another receive sequence. This w ill prevent

buffer overruns from occurring (see Figure 17-13).

17.4.4.2 Clock Stretching for 10-bit Slave

Receive Mode (SEN = 1)

In 10-bit Slave Receive mode, during the address

sequence, clock stretching automatically takes place

but the CKP bit is not cleared. During this time, if the

UA bit is set after the ninth clock, clock stretching is

initiated. The UA bit is set after receiving the upper

byte of the 10-bit address and following the receive of

the second byte of the 10-bit address with the R/W bit

cleared to ‘0’. The release of the clock line occurs

upon upd ati ng SSPADD. Clock stretching will oc cur on

each data receive sequence as described in 7-bit

mode.

17.4.4.3 Clock Stretching for 7-bit Slave

Transmit Mode

7-bit Sl ave Tra nsmit mode i mplem ent s clock stretc hing

by clearing the CKP bit after the falling edge of the

ninth clock if the BF bit is clear. This occurs regardless

of the state of the SEN bit.

The user’s ISR must set the CKP bit before transmis-

sion is allowed to continue. By holding the SCL line

low, the user has time to service the ISR and load the

contents of the SSPBUF before the master device can

initiate another transmit sequence (see Figure 17-9).

17.4.4.4 Clock Stretching for 10-bit Slave

Transmit Mode

In 10-bit Slave Transmit mode, clock stretching is con-

trolled during the first two address sequences by the

state of the UA bit, just as it is in 10-bit Slave Receive

mode. The first two addresses are followed by a third

address sequence which contains the high order bits

of the 10-bit address and the R/W bit set to ‘1’. After

the third address sequence is performed, the UA bit is

not set, the module is now configured in Transmit

mode and clock stretching is controlled by the BF flag

as in 7-bit Slave Transmit mode (see Figure 17-11).

Note 1: If the user reads the contents of the

SSPBUF before the falling edge of the

ninth clock, thus clearing the BF bit, the

CKP bit will not be cleared and clock

stretching will not occur.

2: The CKP bit can be set in software

regardless of the state of the BF bit. The

user should be careful to clear the BF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

Note: If the user polls the UA bit and clears it by

updating the SSPADD register before the

falling edge of the ni nth c lock oc curs and i f

the user hasn’t cleared the BF bit by read-

ing the SSPBUF register before that time,

then the CKP bit will still NOT be asserted

low. Clock stretching on the basis of the

state of the BF bit only occurs during a

data sequence, not an address sequence.

Note 1: If the u ser lo ads t he co nten t s of SSPBUF,

setting the BF bit before the falling edge of

the ninth clock, the CKP bit will not be

cleared and clock stretching will n ot occur .

2: The CKP bit can be set in software

regardless of the state of the BF bit.

PIC18F2220/2320/4220/4320

17.4.4.5 Clock Synchronization and

the CKP bit (SEN = 1)

The SEN bit is also used to synchronize writes to the

CKP bit. If a user clears the CKP bit, the SCL output is

forced to ‘0’. When the SEN bit is set to ‘1’, setting the

CKP bit will not assert the SCL output low until the

SCL output is already sampled low. If the user

attempts to drive SCL low, the CKP bit will not assert

the SCL line until an external I2C master device has

already asserted the SCL line. The SCL output will

remain low until the CKP bit is set and all other

devices on the I2C bus have deasserted SCL. This

ensures that a write to the CKP bit will not violate the

minimum high time requirement for SCL (see

Figure 17-12).

FIGURE 17-12: CLOCK SYNCHRONIZATION TIMING

Note: If the SEN bit is ‘0’, clearing the CKP bit

will result in immediately driving the SCL

output to ‘0’ regardless of the current

state.

SDA

SCL

DX-1DX

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

SSPCON1

CKP

Master device

deasserts clock

Master device

asserts clock

PIC18F2220/2320/4220/4320

FIGURE 17-13 : I2C SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

S123456789 123456789 12345 789 P

A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0

ACK

Receiving Data

ACK

Receiving Data

R/W = 0

ACK

Receiving Address

Cleared in software

SSPBUF is read

Bus master

terminates

transfer

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

(PIR1<3>)

CKP

written

to ‘1’ in

If BF is cleared

prior to the falling

edge of the 9th clock,

CKP will not be reset

to ‘0’ and no clock

stretching will occur

software

Clock is held low until

CKP is set to ‘1’

Clock is not held low

because buffer full bit is

clear prior to falling edge

of 9th clock Clock is not held low

because ACK = 1

BF is set after falling

edge of the 9th clock,

CKP is reset to ‘0’ and

clock stretching occurs

PIC18F2220/2320/4220/4320

FIGURE 17-14 : I2C SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

S123456789 123456789 12345 789 P

1 1 1 1 0 A9A8 A7 A6A5A4A3A2A1A0 D7D6D5D4D3 D1D0

Receive Data Byte

ACK

R/W = 0

ACK

Receive First Byte of Address

Cleared in software

(PIR1<3>) Cleared in so ftware

Receive Second Byte of Address

Cleared by hardware when

SSPADD is updated with low

byte of address after falling edge

UA (SSPSTAT<1>)

Clock is held low until

update of SSPADD has

taken place

UA is set indicating that

the SSPADD needs to be

updated

UA is set indicating that

SSPADD needs to be

updated

Cleared by hardware when

SSPADD is updated with high

byte of address after falling edge

SSPBUF is writ ten with

contents of SSPSR Dummy read of SSPBUF

to clear BF flag

ACK

CKP

12345 789

D7 D6 D5 D4 D3 D1 D0

Receive Data Byte

Bus master

terminates

transfer

ACK

Cleared in software Cleared in software

SSPOV (SSPCON1<6>)

CKP written to ‘1’

Note: An update of th e SSPADD

edge of the n i nth clock will

have no effect on UA and

UA will remain set.

Note: An update of the SSPADD

edge of the ninth clock will

have no effect on UA and

UA will remain set. in software

Clock is held low until

update of SSPADD has

taken place

of ninth clock.

of ninth clock

SSPOV is set

because SSPBUF is

still full. ACK is not sent.

Dummy read of SSPBUF

to clear BF flag

Clock is held low until

CKP is set to ‘1’Clock is not held low

because ACK = 1

PIC18F2220/2320/4220/4320

17.4.5 GENERAL CALL ADDRESS

SUPPORT

The addressing procedure for the I2C bus is such that

the first byte after the Start condition usually deter-

mines which device will be the slave addressed by the

master. The exception is the general call address,

which can address all devices. When this address is

used, all devices should, in theory, respond with an

Acknowledge.

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R/W = 0.

The general call address is recognized when the

General Call Enable bit (GCEN) is enabled

(SSPCON2<7> set). Following a Start bit detect, 8 bits

are shifted into the SSPSR and the address is com-

pared against the SSPADD. It is also compared to the

general call address and fixed in hardware.

If the general call address matches, the SSPSR is

transferre d to the S SPBUF, the BF flag bit i s set (eigh th

bit) and on the falling edg e of the ninth bit (ACK b it), the

SSPIF interrupt flag bit is set.

When the i nterrupt is serv iced, the source f or the inter-

rupt can be checked by reading the contents of the

SSPBUF. The value can be used to determine if the

address was device specific or a general call address.

In 10-bit mode, the SSPADD is required to be updated

for the seco nd half of the address to match an d the UA

bit is set (SSPSTAT<1>). If the general call address is

sampled when the GCEN bit is set while the slave is

configured in 10-bit Address mode, then the second

half of the address is not necessary, the UA bit will not

be set and the slave will begin receiving data after the

Acknowledge (Figure 17-15).

FIGURE 17-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE

(7 OR 10-BIT ADDRESS MODE)

SDA

SCL S

SSPIF

BF (SSPSTAT<0>)

SSPOV (SSPCON1<6>)

Cleared in software

SSPBUF is read

R/W = 0

ACK

General Call Address

Address is compared to general call address

GCEN (SSPCON2<7>)

Receiving Data ACK

123456789123456789

D7 D6 D5 D4 D3 D2 D1 D0

after ACK, set interrupt

‘0’

‘1’

PIC18F2220/2320/4220/4320

17.4.6 MASTER MODE

Master mode is enabled by setting and clearing the

appropria te SSPM bit s in SSPCON1 and by set ting the

SSPEN bit. In Master mode, the SCL and SDA lines

are manipulated by the MSSP hardware.

Master mode of operation is supported by interrupt

generation on the detection of the Start and Stop con-

ditions . The S t op (P) a nd Start (S) bi ts are clea red fro m

a Reset o r when the MSSP m odule is di sabled. Co ntrol

of the I2C bus m ay be tak en when the P bit is set or the

bus is Idle, with both the S and P bits clear.

In Firmware Controlled Master mode, user code

conducts all I2C bus operations based on Start and

Stop bit conditions.

Once Master mode is enabled, the user has six

options.

1. Assert a Start condition on SDA and SCL.

2. Assert a Repeated Start condition on SDA and

SCL.

3. Write to the SSPBUF register initiating

transmission of data/address.

4. Configu re the I2C port to receive data.

5. Generate an Acknowledge condition at the end

of a received byte of data.

6. Generate a Stop condition on SDA and S CL.

The following events will cause SSP Interrupt Flag bit,

SSPIF, to be set (SSP interrupt if enabled):

• Start Condition

• Stop Condition

• Data Transfer Byte Transmitted/Received

• Acknowledge Transmit

• Repeat ed Start

FIGURE 17-16: MSSP BLOCK DIAGRAM (I2C MASTER MODE)

Note: The MSSP module, when configured in

I2C Mast er mode, does n ot allow que ueing

of events. For instance, the user is not

allowed to initiate a Start condition and

immediately write the SSPBUF register to

initiate transmission before the S tart condi -

tion is complet e. In th is case , the SSPBUF

will not be w ri tten to an d the WCOL bit will

be set, indicating that a write to the

SSPBUF did not occur.

Read Write

SSPSR

Start bit, Stop bit,

SSPBUF

Internal

Data Bus

Set/Reset, S, P, WCOL (SSPSTAT)

Shift

Clock

MSb LSb

SDA

Acknowledge

Generate

SCL

SCL In

Bus Collision

SDA In

Receive Enable

Clock Cntl

Clock Arbitrate/WCOL Detect

(hold off clock source)

SSPADD<6:0>

Baud

Set SS PIF, BCLIF

Reset ACKSTAT, PEN (SSPCON2)

Rate

Generator

SSPM3:SSPM0

Start bit Detect

Stop bit Detect

Write Collision Detect

Clock Arbitration

State Counter for

end of XMIT/RCV

PIC18F2220/2320/4220/4320

17.4.6.1 I2C Master Mode Operation

The master device generates all of the serial clock

pulses and the S t a rt and Stop condition s. A transf er is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the beginning of the next serial transfer , the I2C bus will

not be released.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

recei vin g dev ice ( 7 bits) and the Rea d/Writ e (R/ W) bit.

In this case, the R/W bit w ill be l ogic ‘0’ . S eri al d ata is

transmi tted 8 b it s at a ti me . Afte r each byte i s t rans m it-

ted, an Acknowledge bit is received. Start and Stop

conditions are output to indicate the beginning and the

end of a serial transfer.

In Master Rec eive mode, t he first byte transm itted con-

tains the slave address of the transmitting device

(7 bits) and th e R/W bit. In this case, the R/W bit w ill b e

logic ‘ 1’. Thus, the first byte transmitted is a 7-bit slave

address followed by a ‘1’ to indicate the receive bit.

Serial data is received via SDA, while SCL outputs the

serial clock. Serial data is received 8 bits at a time. After

each byte is received, an Acknowledge bit is transmit-

ted. Start and Stop conditions indicate the beginning

and end of transmission.

The Baud Rate Generator used for the SPI mode

operation is used to set the SCL clock frequency for

either 100 kHz, 400 kHz or 1 MHz I2C operation. See

Section 17.4.7 “Baud Rate” for more detail.

A typical transmit sequence would go as follows:

1. The user generates a Start condition by setting

the Start enable bit, SEN (SSPCON2<0>).

2. SSPIF is set. The MSSP module will wait the

required start time before any other operation

takes place.

3. The user loads the SSPBUF with the slave

address to transmit.

4. Address is shi fted out the SDA pin unt il all 8 bit s

are transmitted.

5. The MSSP module shifts in the ACK bit from the

slave device and writes its value into the

SSPCON2 register (SSPCON2<6>).

6. The MSSP mo dule g enerate s an interrup t at th e

end of th e ninth c lock cyc le by settin g the SSPIF

bit.

7. The user loads the SSPBUF with eight bits of

data.

8. Data is sh ifted ou t the SDA pin until all 8 bit s are

transmitted.

9. The MSSP module shifts in the ACK bit from the

slave device and writes its value into the

SSPCON2 register (SSPCON2<6>).

10. The MSSP module g enerate s an interrup t at th e

end of th e ninth c lock cyc le by settin g the SSPIF

bit.

11. The user generates a Stop condition by setting

the Stop Enable bit, PEN (SSPCON2<2>).

12. Interrupt is genera ted once the Stop condition i s

complete.

PIC18F2220/2320/4220/4320

17.4.7 BAUD RATE

In I2C Master mode, the Baud Rate Generator (BRG)

reload value is placed in the lower 7 bits of the

SSPADD register (Register 17-17). When a write

occurs to SSPBUF, the Baud Rate Generator will au to-

matically begin counting. The BRG counts down to ‘0’

and stops until another reload has taken place. The

BRG count is decremented twice per instruction cycle

(TCY) on the Q2 and Q4 clocks. In I 2C Master mode, the

BRG is reloaded automatically.

Once the given operation is complete (i.e., transmis-

sion of th e last dat a bit is followe d by ACK), the int ernal

cloc k will au tomati cally stop coun ting and the SC L pin

will remain in its last state.

Table 17-3 demonstrates clock rates based on

instruction cycles and the BRG value loaded into

SSPADD.

17.4.7. 1 Ba ud Rate Gener at ion in Power

Managed Modes

When the device is operating in a power managed

mode, the clock source to the Baud Rate Generator

may change frequency or stop, depending on the

power managed mode and clock source selected.

In most power modes, the Baud Rate Generator

continues to be clocked but may be clocked from the

primary clock (selected in a configuration word), the

secondary clock (Timer1 oscillator at 32.768 kHz) or

the internal oscillator block (one of eight frequencies

between 31 kHz and 8 MHz). If the Sleep mode is

selected, all clocks are stopped and the Baud Rate

Generato r will not be clocked.

FIGURE 17-17: BAUD RATE GENERATOR BLOCK DIAGRAM

TABLE 17-3: I2C CLOCK RATE W/BRG

SSPM3:SSPM0

BRG Down Counter

CLKO FOSC/4

SSPADD<6:0>

SSPM3:SSPM0

SCL Reload

Control Reload

FOSC FCY FCY*2 SSPADD VALUE

(See Register 17-4,

Mode 1000)

FSCL(2)

(2 Rollovers of BRG)

40 MHz 10 MHz 20 MHz 18h 400 kHz(1)

40 MHz 10 MHz 20 MHz 1Fh 312.5 kHz

40 MHz 10 MHz 20 MHz 63h 100 kHz

16 MHz 4 MHz 8 MHz 09h 400 kHz(1)

16 MHz 4 MHz 8 MHz 0Bh 308 kHz

16 MHz 4 MHz 8 MHz 27h 100 kHz

4 MHz 1 MHz 2 MHz 02h 333 kHz(1)

4 MHz 1 MHz 2 MHz 09h 100kHz

4 MHz 1 MHz 2 MHz 00h 1 MHz(1)

Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than

100 kHz) in all details, but may be used with care where higher rates are required by the application.

2: Actual clock rate will de pend on bus condition s. Bus cap ac itance can increase rise time and extend the lo w

time of the clock period, reducin g the ef fectiv e cloc k frequency (see Section 17.4.7.2 “Clock Arbitration”).

PIC18F2220/2320/4220/4320

17.4.7.2 Clock Arbitration

Clock arbitration occurs when the master, during any

receive, transmit or Repeated Start/Stop condition,

deasserts the SCL pin (SCL allowed to float high).

When the SCL pin is allowed to float high, the Baud

Rate Generator (BRG) is suspended from counting

until the SCL pin is actually sampled high. When the

SCL pin is sampled high, the Baud Rate Generator is

reloaded with the contents of SSPADD<6:0> and

begins counting. This ensures that the SCL high time

will always be at least one BRG rollover count in the

event that the clock is held low by an external device

(Figure 17-18).

FIGURE 17-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION

SDA

SCL

SCL deasserted but slave holds

DX-1DX

BRG

SCL is sampled high, reload takes

place and BRG starts its count

03h 02h 01h 00h (hold off) 03h 02h

Reload

BRG

Value

SCL low (clock arbitration) SCL allowed to transition high

BRG decrements on

Q2 and Q4 cycles

PIC18F2220/2320/4220/4320

17.4.8 I2C MASTER MODE START

CONDITION TIMING

To initiate a Start condition, the user sets the Start

Condition Ena ble bi t, SEN (SSPCON2< 0>). If th e SDA

and SC L pins a re sam pled high, t he Baud Rat e Gener-

ator is reloaded with the contents of SSPADD<6:0>

and starts its count. If SCL and SDA are both sampled

high when the Baud Rate Generator times out (TBRG),

the SDA pin is d riv en lo w. The action of the SD A bein g

driven low while SCL is high is the Start condition and

causes the S bit (SSPSTAT<3>) to be set. Following

this, the Baud Rate Ge nerator is reloaded w ith the con-

tents of SSPADD<6:0> and resumes its count. When

the Baud Rate Gene rator times o ut (TBRG), the SEN bit

(SSPCON2<0>) will be automatically cleared by

hardware, the Baud Rate Generator is suspended,

leavin g th e SD A l in e h eld lo w and th e Start co ndi tio n i s

complete.

17.4.8.1 WCOL Status Flag

If the user writes the SSPBUF when a Start sequence

is in progress, the W C OL is s et and the contents o f th e

buffer are unchanged (the write doesn’t occur).

FIGURE 17-19: FIRST START BIT T IMING

Note: If at the beginning of the Start condition,

the SDA and SCL pins are already sam-

pled low or if during the S tart condition, the

SCL line is sampled low before the SDA

line is driven low, a bus collision occurs,

the Bus Collision Interrupt Flag, BCLIF, is

set, the Start condition is aborted and the

I2C module is reset into its Idle state.

Note: Because queueing of events is not

allowed, writing to the lower 5 bits of

SSPCON2 is disabled until the Start

conditi on is complete.

SDA

SCL

TBRG

1st bit 2nd bit

TBRG

SDA = 1, At completion of Start bit,

SCL = 1

Write to SSPBUF occurs here

TBRG

hardware clears SEN bit

TBRG

Write to SEN bit occurs here Set S bit (SSPSTAT<3>)

and sets SSPIF bit

PIC18F2220/2320/4220/4320

17.4.9 I2C MASTER MODE REPEATED

START CONDITION TIMING

A Repeated Start condition occurs when the RSEN bit

(SSPCON2<1>) is programmed high and the I2C logic

module is in the Idle state. When the RSEN bit is set,

the SCL pin is asserted lo w. When the SCL pin is sam-

pled low, the Baud Rate Generator is loaded with the

contents of SSPADD<5:0> and begins counting. The

SDA pin is released (brought high) for one Baud Rate

Generator coun t (TBRG). When th e Baud Rate Gene ra-

tor times out, if SDA is sampled high, the SCL pin will

be deasserted (brought high). When SCL is sampled

high, the Baud Rate Generator is reloaded with the

contents of SSPADD<6:0> and begins counting. SDA

and SCL must be sampled high for one TBRG. This

action is then followed by assertion of the SDA pin

(SDA = 0) for one TBRG while SCL is high. Following

this, the RSEN bit (SSPCON2<1>) will be automatically

cleared and the Baud Rate Generator will not be

reloaded, leaving the SDA pin held low. As soon as a

Start condition is detected on the SDA and SCL pins,

the S bit (SSPSTAT<3>) will be set. The SSPIF bit will

not be set until the Baud Rate Generator has timed out.

Immediately following the SSPIF bit getting set, the

user may write the SSPBUF with the 7-bit address in

7-bit mode, or the default first address in 10-bit mode.

After the first eight bits are transmitted and an ACK is

received, the user may then transmit an ad ditional eight

bits of address (10-bit mode) or eight bits of data (7-bit

mode).

17.4.9.1 WCOL Status Flag

If the user writes the SSPBUF when a Repeated Start

sequenc e is in pro gress , the WCOL is set and the con-

tents of the buffer are unchanged (the write doesn’t

occur).

FIGURE 17-20: REPEAT START CONDITION WAVEFORM

Note 1: If RSEN is programmed while any other

event is in progress, it will not take effect.

2: A bus col lis ion dur ing the Rep eate d Start

conditi on oc curs if:

• SDA is sampled low when SCL goes

from low to high.

• SCL goes low before SDA is

asserted low. This may indicate that

another master is attempting to

transmit a data ‘1’.

Note: Because queueing of events is not

allowed, writing of the lower 5 bits of

SSPCON2 is disabled until the Repeated

Start condition is complete.

SDA

SCL

Sr = Repeated Start

Write to SSPCON2

Writ e to SSPBUF occurs here

Falling edge of ninth clock,

end of Xmit

At completion of Start bit,

hardw are clea rs R SEN bi t

1st bit

Set S (SSPSTAT<3>)

TBRG

SDA = 1,

SCL (no change). SCL = 1

occurs here.

TBRG TBRG TBRG

and sets SSPIF

PIC18F2220/2320/4220/4320

17.4.10 I2C MASTER MODE

TRANSMISSION

Transmission of a data byte, a 7-bit address or the

other half of a 10-bit address is accomplished by simply

writing a value to the SSPBUF register. This action will

set the Buf fer Full Flag bi t, BF, and allow the Baud Rate

Generator to begin counting and start the next

transmission. Each bit of address/data will be shifted

out onto the SDA pin after the falling edge of SCL is

asserted (see data hold time specification parameter

#106). SCL is held low for one Baud Rate Generator

rollove r count (TBRG). Data should be valid before SCL

is released high (see data setup time specification

parameter #107). Whe n the SCL pin is rel eased high, it

is held that way for TBRG. The data on the SDA pin

must remain stable for that duration and some hold

time after the next falli ng ed ge of SCL. After the eigh th

bit is shifted out (the falling edge of the eighth clock),

the BF flag is cleared and the master releases SDA.

This allows the slave device being addressed to

respond with an ACK bit, during the nin th bi t tim e, if an

address match occurred or if data was received prop-

erly . The status of ACK is written i nto th e ACKDT bit on

the falli ng edge of the ninth clock. If the master receives

an Acknowledge, the Acknowledge Status bit,

ACKSTA T, is cleared ; if not, the bit is se t. After the ninth

clock, the SSPIF bit is set and the master clock (Baud

Rate Generator) is suspended until the next data byte

is loaded into the SSPBUF, leaving SCL low and SDA

unchanged (Figure 17-21).

After the write to the SSPBUF, each bit of address will

be shifted out on the fal lin g ed ge of SCL until al l s eve n

address bits and the R/W bit are complet ed. On the fall-

ing edge of the eighth clock, the master will deassert

the SDA pin, allowing the slave to respond with an

Acknowledge. On the falling edge of the ninth clock, the

master will sample the SDA pin to see if the address

was rec ognized by a sla ve. The st atus of the ACK bit is

loaded into the ACKSTAT status bit (SSPCON2<6>).

Following the falling edge of the ninth clock transmis-

sion of the address, the SSPIF is set, the BF flag is

cleared and th e Baud Ra te Genera tor is t urned of f until

another write to the SSPBUF takes p lac e, ho ldi ng SCL

low and allowing SDA to float.

17.4.10.1 BF Status Flag

In Transmit mode, the BF bit (SSPSTAT<0>) is set

when the CPU writes to SSPBUF and is cleared when

all 8 bits are shifted out.

17.4.10.2 WCOL Status Flag

If the user writes the SSPBUF when a transmit is

already in progress (i.e., SSPSR is still shifting out a

data byte), the WCOL is set and the contents of the

buffer are unchanged (the write doesn’t occur).

WCOL must be cleared in software.

17.4.10.3 ACKSTAT Status Flag

In T ran smit mod e, the ACKSTAT bit (SSPCON2<6>) is

cleared when the slave has sent an Acknowledge

(ACK =0) and is set when the slav e does not Acknowl-

edge (ACK = 1). A slave sends an Acknowledge when

it has recognized its address (including a general call)

or when the slave has properly received its data.

17.4.11 I2C MASTER MODE RECEPTION

Master mode recepti on is enabl ed by progra mmin g the

Receive Enable bit, RCEN (SSPCON2<3>).

The Baud Rate Generator begins counting and on each

rollover, the state of the SCL pin changes (high to low/

low to high) and data is shifted into the SSPSR. After

the falling edge of the eighth clock, the receive enable

flag is automatically cleared, the contents of the

SSPSR are loaded into the SSPBUF, the BF flag bit is

set, the SSPIF flag bit is set and the Baud Rate

Generator is suspended from counting, holding SCL

low. The MSSP is now in Idle state, awaiting the next

command. When the b uffer is re ad by the C PU, t he BF

flag bit is automatically cleared. The user can then

send an Acknowledge bit at the end of reception by

setting the Acknowledg e Sequence Ena ble bit, ACKEN

(SSPCON2<4>).

17.4.11.1 BF Status Flag

In receiv e op eration, the B F bit is s et whe n an add r es s

or data byte is loaded into SSPBUF from SSPSR. It is

cleared when the SSPBUF register is read.

17.4.11.2 SSPOV Status Flag

In receive operation, the SSPOV bit is set when 8 bits

are received into the SSPSR and the BF flag bit is

already set from a p revious reception.

17.4.11.3 WCOL Status Flag

If the user writes the SSPBUF when a receive is

already in progress (i.e., SSPSR is still shifting in a data

byte), th e WCOL bi t is set an d the conte nts of th e buffer

are unchanged (the write doesn’t occur).

Note: The MSSP module must be in an Idle state

before the RCEN bit is set or the RCEN bit

will be disregarded.

PIC18F2220/2320/4220/4320

FIGURE 17-21 : I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)

SDA

SCL

SSPIF

BF (SSPSTAT<0>)

SEN

A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0

ACK

Transmitting Data or Second Half

R/W = 0Transmit Address to Slave

123456789 123456789 P

Cleared in software service routine

SSPBUF is written in software

from SSP interrup t

After Start condition, SEN cleared by hardware

SSPBUF written with 7-bit address and R/W,

start transmit

SCL held low

while CPU

responds to SSPIF

SEN = 0

of 10-bit Address

Write SSPCON2<0> SEN = 1,

Start condition begins From slave, clear ACKSTAT bit SSPCON2<6>

ACKSTAT in

SSPCON2 = 1

Cleared in softwar e

SSPBUF written

PEN

Cleared in software

R/W

PIC18F2220/2320/4220/4320

FIGURE 17-22 : I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)

D3D4

D6D7

A7 A6 A5 A4 A3 A2 A1

SDA

SCL 12345678912345678 91234

Bus master

terminates

transfer

ACK Receiving Data from Slave

Receiving Data from Slave D0

D3D4

D6D7

ACK

R/W = 1

Transmit Address to Slave

SSPIF

ACK is not sent

Write to SSPCON2<0> (SEN = 1),

Write to SSPBUF occurs here, ACK f ro m Slav e

Master configured as a receiver

by programming SSPCON2<3> (RCEN = 1)PEN bit = 1

written here

Data shifted in on falling edge of CLK

Cleared in software

start XMIT

SEN = 0

SSPOV

SDA = 0, SCL = 1,

while CPU

(SSPSTAT<0>)

ACK

Last bit is shifted into SSPSR and

contents are unloaded into SSPBUF

Cleared in software

Set SSPIF interrupt

at end of receive

Set P bit

(SSPSTAT<4>)

and SSPIF

Cleared in

software

ACK from master,

Set SS PIF at end

Set SSPIF interrupt

at end of Acknowledge

sequence

Set SSPIF interrupt

at end of Acknow-

ledge sequence

of receive

Set ACKEN, start Acknowledge sequence,

SSPOV is set because

SSPBUF is still full

SDA = ACK DT = 1

RCEN cleared

automatically

RCEN = 1, start

next receive

Write to SSPCON2<4>

to start Acknowledge sequence,

SDA = ACKDT (SSPCON2<5>) = 0

RCEN cleared

automatically

responds to SSPIF

ACKEN

begin Start condition

Cleared in software

SDA = ACKDT = 0

PIC18F2220/2320/4220/4320

17.4.12 ACKNOWLEDGE SEQUENCE TIMING

An Acknowledge sequence is enabled by setting the

Acknowledge Sequence Enable bit, ACKEN

(SSPCON2<4>). When this bit is set, the SCL pin is

pulled low an d th e cont en ts of t he Ack no w le dge da ta bit

are pr esen ted on the SD A pin. If th e user wish es to gen -

erate an Acknowledge, then the ACKDT bit should be

cleared. If not, the user should set the ACKDT bit before

starting an Acknowledge sequence. The Baud Rate

Generato r then count s for one ro llover perio d (TBRG) and

the SCL pin is deasserted (pulled high). When the SCL

pin is sampled high (clock arbitration), the Baud Rate

Generator counts for TBRG. The SCL pin is then pulled

low. Following this, the ACKEN bit is automatically

cleared, the Baud Rate Generator is turned off and the

MSSP m odu le t hen goes in to Id le m od e ( Fig ure 17-23).

17.4.12.1 WCOL Status Flag

If the user writes the SSPBUF when an Acknowledge

sequence is in progress, then WCOL is set and the

contents of the bu f fer are un chang ed (the w rite doe sn ’t

occur).

17.4.13 STOP CONDITION TIMING

A Stop bit is asserted on the SDA pin at the end of a

receive/transmit by setting the Stop Sequence Enable

bit, PEN (SSPCON2<2>). At the end of a receive/

transmit, the SCL line is held low after the falling edge

of the ninth clock. When the PEN bit is set, the master

will assert th e SDA line low. When the SDA li ne is sam-

pled low, the Baud Rate Generator is reloaded and

counts down to 0. When the Baud Rate Generator

times out, the SCL pin will be brought high and one

TBRG (Baud Rate Generator rollover count) later, the

SDA pin will be deass erted. Wh en the SDA pin is sam-

pled hi gh whil e SCL is high, the P bit (SSPSTAT<4 >) is

set. A TBRG later, the PEN bit is c leared and the SSPIF

bit is set (Figure 17-24).

17.4.13.1 WCOL Status Flag

If the user writes the SSPBUF when a Stop sequence

is in progress, then the WCOL bit is set and the con-

tents of the buffer are unchanged (the write doesn’t

occur).

FIGURE 17-23: ACKNOWLEDGE SEQUENCE WAVEFORM

FIGURE 17-24: STOP COND ITION RECEIVE OR TRANSMIT MODE

Note: TBRG = one Baud Rate Generator period.

SDA

SCL

Set SSPIF at the end

Acknowledge sequence starts here,

write to SSPCO N 2, ACKEN automatically cleared

Cleared in

TBRG TBRG

of receive

ACK

ACKEN = 1, ACKDT = 0

SSPIF

software Set SSP IF at the end

of Acknowledge sequence

Cleared in software

SCL

SDA

SDA asserted low before rising edge of clock

Write to SSPCON2,

set PEN

Falling edge of

SCL = 1 for TBRG, followed by SDA = 1 for TBRG

9th clock

SCL brought high after TBRG

Note: TBRG = one Baud Rate Generator period.

TBRG TBRG

after SDA sampled high. P bit (SSPSTAT<4>) is set.

TBRG

to setup Stop condition

ACK

TBRG

PEN bit (SSPCON2<2>) is cleared by

hardware and the SSPIF bit is set

PIC18F2220/2320/4220/4320

17.4.14 POWER MANAGED MODE

OPERATION

While in any power managed mode, the I2C module

can receive addresses or data and when an address

match or complete byte transfer occurs, wake the

processor from Sleep (if the MSSP interrupt is

enabled).

17.4.15 EFFECT OF A RESET

A Reset disable s the MSSP module and terminates the

current transfer.

17.4.16 MULT I-MAS TER MO DE

In Multi-Master mode, the interrupt generation on the

detection of the Start and Stop conditions allows the

deter mination of when the bus i s free. The S top (P) and

Start (S) bits are cleared from a Reset or when the

MSSP module is disabled. Control of the I 2C bus may

be taken when the P bit (SSPSTAT<4>) is set or the

bus is idle with both the S and P bits clear. When the

bus is busy, enabling the SSP interrupt will generate

the interrupt when the Stop condition occurs.

In multi-master operation, the SDA line must be moni-

tored for arbitration to see if the signal level is the

expected output level. This check is performed in

hardware with the result placed in the BCLIF bit.

The states where arbitration can be lost are:

• Address Transfe r

• Data Transfer

• A Start Condition

• A Repeated Start Condition

• An Acknowledge Condition

17.4.17 MULTI -MASTER COMMUNICATION,

BUS COLLISION AND BUS

ARBITRATION

Multi-Master mode support is achieved by bus arbitra-

tion. When the master outputs address/data bits onto

the SDA pin, arbitration takes place when the master

outputs a ‘1’ on SDA by letting SDA float high and

another master asserts a ‘0’. When the SCL pin floats

high, data should be stable. If the expected data on

SDA is a ‘1’ and the data sample d on th e SDA pin = 0,

then a bus collision has taken place. The master will set

the Bus Collision Interrupt Flag, BCLIF, and reset the

I2C port to its Idle state (Figure 17-25).

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the BF flag is

cleared, the SDA and SCL lines are dea sserted and the

SSPBUF can b e written to . When the us er servic es th e

bus collision Interrupt Service Routine and if the I2C

bus is free, the user can resume communication by

asserting a Start condition.

If a Start, Repeated Start, S top or Acknowledge condition

was in progress when the bus collision occurred, the con-

dition is abor ted, the SDA and SCL lines ar e deassert ed,

and the re spect iv e co nt rol bits in the SS PC ON2 re gi ster

are cleared. When the user services the bus collision

Interrupt Service Routine and if the I2C bus is free, the

user can resume communication by asserting a Start

condition.

The master will continue to monitor the SDA and SCL

pins. If a Stop condition occurs, the SSPIF bit will be set.

A write to the SSPBUF will start the transmission of

data at the first data bit regardless of where the

transmitter left off when the bus collision occurred.

In Multi-Master mode, the interrupt generation on the

detection of Start and Stop conditions allows the determi-

nation of when the bus is free. Control of the I2C bus can

be taken when the P bit is set in the SSPSTAT register or

the bus is Id le and the S and P bit s are cle ared.

FIGURE 17-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE

SDA

SCL

BCLIF

SDA release d

SDA line pulled low

by another source Sample SDA. While SCL is high,

data doesn’t match what is driven

Bus collision has occurred.

Set Bus Collision

Interrupt Flag (BCLIF)

by the master.

by master

Data changes

while SCL = 0

PIC18F2220/2320/4220/4320

17.4.17.1 Bus Collision During a Start

Condition

During a Start condition, a bus collision occurs if:

a) SDA or SCL is sampled low at the beginning of

the Start condition (Figure 17-26).

b) SCL is s am pled low before SD A is asserted low

(Figure 17-27).

During a Start condition, both the SDA and the SCL

pins are monitored.

If the SDA pin is already low or the SCL pin is already

low, then all of the following occur:

• The Start condition is aborted

• The BCLIF flag is set

• The MSSP module is reset to its Idle state

(Figure 17-26)

The Start condition begins with the SDA and SCL pins

deasserted. When the SDA pin is sampled high, the

Baud Rate Generator is loaded from SSPADD<6:0>

and counts down to 0. If the SCL pin is sampled low

while SDA is high, a bus collision occurs because it is

assumed that another master is attempting to drive a

data ‘1’ during the Start condition.

If the SDA pin is sampled low during this count, the

BRG is reset and the SDA line is asserted early

(Figure 17-28). If, however , a ‘1’ is sampled on the SDA

pin, the S DA pin is asserted low at th e end of the BRG

count. The Baud Rate Generator is then reloaded and

counts down to 0 and during this time, if the SCL pins

are sampled as ‘0’, a bus collision does not occur. At

the end of the BRG count, the SCL pin is asserted low.

FIGURE 17-26: BUS COLLISION DURING START CONDITION (SDA ONLY)

Note: The reason that bus collision is not a factor

duri ng a Start cond itio n is t hat no t wo bus

masters can assert a St art condition at the

exact same time. Therefore, one master

will always assert SDA before the other.

This condition does not cause a bus colli-

sion because the two masters must be

allowed to arbitrate the first address fol-

lowin g the S t art conditi on. If the addres s is

the same, arbitration must be allowed to

continue into the data portion, Repeated

Start or Stop conditions.

SDA

SCL

SEN SDA sam pled low before

SDA goes low before the SEN bit is set.

S bit and SSPIF set because

SSP module reset into Idle state.

SEN cleared automatically because of bus collision.

S bit and SSPIF set because

Set SEN, enable Start

condition if SDA = 1, SCL = 1

SDA = 0, SC L = 1.

BCLIF

SSPIF

SDA = 0, SCL = 1.

SSPIF and BCLIF are

cleared in software

SSPIF and BCLIF are

cleared in software

Set BCLIF,

Start condition. Set BCLIF.

PIC18F2220/2320/4220/4320

FIGURE 17-27: BUS COLLISION DURING START CONDITION (SCL = 0)

FIGURE 17-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION

SDA

SCL

SEN bus collision occurs. Set BCLIF.

SCL = 0 before SDA = 0,

Set SEN, enable Start

sequence if SDA = 1, SCL = 1

TBRG TBRG

SDA = 0, SCL = 1

BCLIF

SSPIF

Interrupt cleared

in software

bus collision occurs. Set BCLIF.

SCL = 0 before BRG time-out,

‘0’‘0’

SDA

SCL

SEN

Set S

Set SEN, enable Start

sequence if SDA = 1, SCL = 1

Less than TBRG TBRG

SDA = 0, SCL = 1

BCLIF

SSPIF

Interrupts cleared

in software

set SS PIF

SDA = 0, SCL = 1,

SDA pulled low by other master .

Reset BRG and assert SDA.

SCL pulled low after BRG

Time-out

Set SS PIF

‘0’

PIC18F2220/2320/4220/4320

17.4.17.2 Bus Collision During a Repeated

Start Condition

During a Repeated Start condition, a bus collision

occu rs if:

a) A low level is sampled on SDA when SCL goes

from low level to high level.

b) SCL goes low before SDA is asserted low, indi-

cating that another master is attempting to

transmit a data ‘1’.

When the user dea sserts SDA and the pin is a llowed to

float high, the BRG is loaded with SSPADD<6:0> and

counts down to 0. The SCL pin is then deasserted and

when sampled high, the SDA pin is sampled.

If SDA is low, a bus collision has occurred (i.e., another

master is attempting to transmit a data ‘0’, Figure 17-29).

If SDA is sampled high, the BRG is reloaded and begins

countin g. If SDA goes fro m high to low befo re the BRG

times out, no bus collision occurs because no two

masters can assert SDA at exactly the same time.

If SCL goes from hig h to low bef ore th e BRG time s o ut

and SDA has not al ready been asserted, a bus collision

occurs. In this case, another master is attempting to

tran smit a data ‘1’ during the Repeated Start condition

(see Figure 17-30).

If at the end of the BRG time-out, both SCL and SDA

are still high, the SDA pin is driven low and the BRG is

relo aded an d begins counti ng. At the end of the co unt

regardless of the status of the SCL pin, the SCL pin is

driven low and the Repeated Start condition is

complete.

FIGURE 17-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)

FIGURE 17-30: BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)

SDA

SCL

RSEN

BCLIF

SSPIF

Sample SDA when SCL goes high.

If SDA = 0, set BCLIF and release SDA and SCL.

Cleared in software

‘0’

SDA

SCL

BCLIF

RSEN

SSPIF

Interrupt cleare d

in software

SCL goes low before SDA,

set BCLIF. Release SDA and SCL.

TBRG TBRG

‘0’

PIC18F2220/2320/4220/4320

17.4.17.3 Bus Collision During a Stop

Condition

Bus collision occurs during a Stop condition if:

a) After the SDA pin has been deasserted and

allowed to float high, SDA is sampled low after

the BRG has timed out.

b) After the SCL pin is deasserted, SCL is sampled

low before SDA goes high.

The Stop condition begins with SDA asserted low.

When SDA is sampled low, the SCL pin is allowed to

floa t. Wh en t he p in i s sa mpled hig h (c loc k arbi tr atio n),

the Baud R ate Generator is loaded w ith SSP AD D<6:0>

and count s dow n to 0. After the BRG times out, SDA is

sampled. If SDA is sampled low, a bus collision has

occurred. This is due to another master attempting to

drive a da t a ‘ 0’ (Register 17-31 ). If the SCL pi n is sam-

pled low be fore SDA is all owed to float high , a bus co l-

lision occurs. This is another case of another master

attempting to drive a data ‘0’ (Figure 17-32).

FIGURE 17-31: BUS COLLISION DURING A STOP CONDITION (CASE 1)

FIGURE 17-32: BUS COLLISION DURING A STOP CONDITION (CASE 2)

SDA

SCL

BCLIF

PEN

SSPIF

TBRG TBRG TBRG

SDA asserted low

SDA sampled

low after TBRG,

set BCLIF

‘0’

SDA

SCL

BCLIF

PEN

SSPIF

TBRG TBRG TBRG

Assert SDA SCL goes low before SDA goes high,

set BCLIF

‘0’

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

18.0 ADDRESSABLE UNIVERSAL

SYNCHRONOUS

ASYNCHRONOUS RECEIVER

TRANSMITTER (USART)

The Universal Synchronous Asynchronous Receiver

Transmitter (USART) module is one of the two serial

I/O modules available in the PIC18F2X20/4X20 family

of mic rocon troll ers. ( USART is also know n as a Serial

Communications Interface or SCI.) The USART can be

configured as a full-duplex asynchronous system that

can communicate with peripheral devices, such as

CRT terminals and personal computers, or it can be

configured as a half-duplex synchronous system that

can co mmun icate with periph eral de vice s, such as A/D

or D/A integrated circuits, serial EEPROMs, etc.

The USART can be configured in the following modes:

• Asynchronous (full-duplex)

• Synchronous – Master (half-du plex)

• Synchronous – Slave (half-dup lex)

The RC6/TX/CK and RC7/RX/DT pins must be config-

ured as s ho wn for use with the U n iv ersal Sy nc hro nou s

Asynchronous Receiver Transmitter:

• SPEN (RCSTA<7>) bit must be set (= 1)

• TRISC<7> bit mu st be set (= 1)

• TRISC<6> bit mu st be cle ared (= 0)

Status and Control register (RCSTA).

18.1 Asynchronous Operation in Power

Managed Modes

The USAR T may o perate in Asy nchron ous m ode whil e

the periphe ral clocks are be ing provide d by the interna l

oscill ator block. Th is mode makes it possibl e to remove

the cr yst al or res onator t hat is c ommonly conne ct ed as

the primary clock on the OSC1 and OSC2 pins.

The factory calibrates the internal oscillator block out-

put (INT OSC) for 8 MHz. However, this frequency may

drift as VDD or temperature changes and this directly

af fect s t he as ynch ronous baud rate. Two methods ma y

be used to adjust the baud rate clock, but both require

a reference clock source of some kind.

The firs t (preferre d) method uses the OS CTUNE re gis-

ter to a djust the INT OSC output back to 8 MHz. Adjus t-

ing the value in the OSCTUNE register allows for fine

resolution changes to the system clock source (see

Section 3.6 “INTOSC Frequency Drift” for more

information).

The other method adjusts the value in the Baud Rate

Generator since there may be not be fine enough res-

olution when adjusting the Baud Rate Generator to

compensate for a gradual change in the peripheral

clock frequency.

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R-1 R/W-0

CSRC TX9 TXEN SYNC —BRGHTRMTTX9D

bit 7 bit 0

bit 7 CSRC: Clock Source Select bit

Asynchronous mode:

Don’t care.

Synchronous mode:

1 = Master mode (clock generated internally from BRG)

0 = Slave mode (clock from external source)

bit 6 TX9: 9-bit Transmit Enable bit

1 = Selects 9-bit transmission

0 = Selects 8-bit transmission

bit 5 TXEN: Transmit Enable bit

1 = Transmit enabled

0 = Transmit disabled

Note: SREN/CREN overrides TXEN in Sync mode.

bit 4 SYNC: USART Mode Select bit

1 = Synchronous mode

0 = Asynchronous mode

bit 3 Unimplemented: Read as ‘0’

bit 2 BRGH: High Baud Rate Select bit

Asynchronous mode:

1 = High speed

0 = Low speed

Synchronous mode:

Unused in this mode .

bit 1 TRMT: Transmit Shift Register Status bit

1 = TSR empty

0 = TSR full

bit 0 TX9D: 9th bit of Transmit Data

Can be address/data bit or a parity bit.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x

SPEN RX9 SREN CREN ADDEN FERR OERR RX9D

bit 7 bit 0

bit 7 SPEN: Serial Port Enable bit

1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)

0 = Serial port disabled

bit 6 RX9: 9-bit Receive Enable bit

1 = Selects 9-bit reception

0 = Selects 8-bit reception

bit 5 SREN: Single Receive Enable bit

Asynchronous mode:

Don’t care.

Synchronous mode – Master:

1 = Enables single receive

0 = Disables single receive

This bit is cleared after reception is complete.

Synchronous mode – Slave:

Don’t care.

bit 4 CREN: Conti nuous Receive Enab le bit

Asynchronous mode:

1 = Enables receiver

0 = Disables receiver

Synchronous mode:

1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)

0 = Disables con t in uou s r ece iv e

bit 3 ADDEN: Address Detect Enable bit

Asynchronous mode 9-bit (RX9 = 1):

1 = Enable address detection, enable interrupt and load the receive buffer when RSR<8>

is set

0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit

bit 2 FERR: Framing Error bit

1 = Framing error (can be updated by reading RCREG regi ster and receiving next valid byte)

0 = No framing error

bit 1 OERR: Overrun Error bit

1 = Overrun error (can be cleared by clearing bit CREN)

0 = No overrun error

bit 0 RX9D: 9th bit of Received Data

This can be address/data bit or a parity bit and must be calculated by user firmware.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

18.2 USART Baud Rate Generator (BRG)

The BRG supports both the Asynchronous and

Synchronous modes of the USART. It is a dedicated

8-bit Baud Rate Generator. The SPBRG register

controls the period of a free-running 8-bit timer. In

Asynchronous mode, bit BRGH (TXSTA<2>) also con-

trols the bau d rate . In Sync hro nou s m ode , bi t BRGH i s

ignored. Table 18-1 s hows th e fo rmu la f or c om putation

of the baud rate for dif ferent U SART mo des whic h only

apply in Master mode (internal clock).

Given the desired baud rate and FOSC, the nearest

integer value for the SPBRG register can be calculate d

using the formula in Table 18-1. From this, the error in

baud rate can be determined.

Example 18-1 shows the calculation of the baud rate

error for the following conditions:

•F

OSC = 16 MHz

• Desired Baud Rate = 9600

• BRGH = 0

• SYNC = 0

It may be advantageous to use the high baud rate

(BRGH = 1), ev en fo r s lowe r b aud c lock s, be cau se th e

FOSC/(16 (X + 1)) equation can reduce the baud rate

error in some cases.

Writing a new value to the SPBRG register causes the

BRG timer to be reset (or cleared). This ensures the

BRG does not wait for a timer overflow before

outputting the new baud rate.

18.2.1 POWER MANAGED MODE

OPERATION

The sys tem cl ock is used to generate the des ired bau d

rate; however, when a power managed mode is

entered, the clock source may be operating at a differ-

ent frequency than in PRI_RUN mode. In Sleep mode,

no clocks are present and in PRI_IDLE, the primary

clock source continues to provide clocks to the baud

rate generator; however, in other power managed

modes, the clock frequency will probably change. This

may require the value in SPBRG to be adjusted.

18.2.2 SAMPLING

The dat a on the RC7/RX/DT pin is sa mpled three times

by a majority detect circuit to determine if a high or a

low level is present at the RX pin.

EXAMPLE 18-1: CALCULATING BAUD RATE ERROR

TABLE 18-1: BAUD RATE FORMULA

TABLE 18-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR

SYNC BRGH = 0 (Low Speed) BRG H = 1 (High Speed)

0 (Asynchronous)

1 (Synchronous) Baud Rate = FOSC/(64 (X + 1))

Baud Rate = FOSC/(4 (X + 1)) Ba ud R ate = FOSC/(16 (X + 1))

N/A

Legend: X = value in SPBRG (0 to 255)

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

TXSTA CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 0000 -010 0000 -010

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used by the BRG.

Desire d Baud Rate = FOSC/(64 (X + 1))

Solving for X: X = ((FOSC/Desired Baud Rate)/64) – 1

X = ((16000000/9600 )/ 6 4) – 1

X = [ 25.042 ] = 25

Calculated Baud Rate = 16000000/(64 (25 + 1))

= 9615

Error = (Calcul a ted Baud Rate – Desired Baud Rate)

Desired Baud Rate = (9615 – 9600)/9600

= 0.16%

PIC18F2220/2320/4220/4320

TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 0, LOW SPEED)

BAUD

RATE

(K)

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 16.000 MHz FOSC = 10.000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 — — — — — — 0.98 225.52 255 0.61 103.45 255

1.2 — — — 1.22 1.73 255 1.20 0.16 207 1.20 0.16 129

2.4 2.44 1.73 255 2.40 0.16 129 2.40 0.16 103 2.40 0.16 64

9.6 9.62 0.16 64 9.47 -1.36 32 9.62 0.16 25 9.77 1.73 15

19.2 18.94 -1.36 32 19.53 1.73 15 19.23 0.16 12 19.53 1.73 7

38.4 39.06 1.73 15 39.06 1.73 7 35.71 -6.99 6 39.06 1.73 3

57.6 56.82 -1.36 10 62.50 8.51 4 62.50 8.51 3 52.08 -9.58 2

76.8 78.13 1.73 7 78.13 1.73 3 83.33 8.51 2 78.13 1.73 1

96.0 89.29 -6.99 6 104.17 8.51 2 — — — — — —

115.2 125.00 8.51 4 — — — 125.00 8.51 1 78.13 -32.18 1

250.0 208.33 -16.67 2 — — 250.00 0.00 0 — — —

300.0 312.50 4.17 1 312.50 4.17 0 — — — — — —

625.0 625.00 0.00 0 — — — — — — — — —

BAUD

RATE

(K)

FOSC = 8.000000 MHz FOSC = 7.159090 MHz FOSC = 5.068800 MHz FOSC = 4.000000 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.49 62.76 255 0.44 45.65 255 0.31 3.13 255 0.30 0.16 207

1.2 1.20 0.16 103 1.20 0.23 92 1.20 0.00 65 1.20 0.16 51

2.4 2.40 0.16 51 2.38 -0.83 46 2.40 0.00 32 2.40 0.16 25

9.6 9.62 0.16 12 9.32 -2.90 11 9.90 3.13 7 8.93 -6.99 6

19.2 17.86 -6.99 6 18.64 -2.90 5 19.80 3.13 3 20.83 8.51 2

38.4 41.67 8.51 2 37.29 -2.90 2 39.60 3.13 1 31.25 -18.62 1

57.6 62.50 8.51 1 55.93 -2.90 1 — — — 62.50 8.51 0

— — — — — — — 79.20 3.13 0 — — —

115.2 125.00 8.51 0 111.86 -2.90 0 — — — — — —

BAUD

RATE

(K)

FOSC = 3.579545 MHz FOSC = 2.000000 MHz FOSC = 1.000000 MHz FOSC = 0.032768 MHz

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

0.3 0.30 0.23 185 0.30 0.16 103 0.30 0.16 51 0.26 -14.67 1

1.2 1.19 -0.83 46 1.20 0.16 25 1.20 0.16 12 — — —

2.4 2.43 1.32 22 2.40 0.16 12 2.23 -6.99 6 — — —

9.6 9.32 -2.90 5 10.42 8.51 2 7.81 -18.62 1 — — —

19.2 18.64 -2.90 2 15.63 -18.62 1 15.63 -18.62 0 — — —

38.4 — — — 31.25 -18.62 0 — — — — — —

57.6 55.93 -2.90 0 — — — — — — — — —

PIC18F2220/2320/4220/4320

TABLE 18-4: BAUD RATES FOR ASYNCHRONOUS MODE (BRGH = 1, HIGH SPEED)

BAUD

RATE

(K)

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 16.000 MHz FOSC = 10.000 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

2.4 — — — 4.88 103.45 255 3.91 62.76 255 2.44 1.73 255

9.6 9.77 1.73 255 9.62 0.16 129 9.62 0.16 103 9.63 0.16 64

19.2 19.23 0.16 129 19.23 0.16 64 19.23 0.16 51 18.94 -1.36 32

38.4 38.46 0.16 64 37.88 -1.36 32 38.46 0.16 25 39.06 1.73 15

57.6 58.14 0.94 42 56.82 -1.36 21 58.82 2.12 16 56.82 -1.36 10

76.8 75.76 -1.36 32 78.13 1.73 15 76.92 0.16 12 78.13 1.73 7

96.0 96.15 0.16 25 96.15 0.16 12 100.00 4.17 9 89.29 -6.99 6

115.2 113.64 -1.36 21 113.64 -1.36 10 111.11 -3.55 8 125.00 8.51 4

250.0 250.00 0.00 9 250.00 0.00 4 250.00 0.00 3 208.33 -16.67 2

300.0 312.50 4.17 7 312.50 4.17 3 333.33 11.11 2 312.50 4.17 1

500.0 500.00 0.00 4 416.67 -16.67 2 500.00 0.00 1 — — —

625.0 625.00 0.00 3 625.00 0.00 1 — — — 625.00 0.00 0

1000.0 833.33 -16.67 2 — — — 1000.00 0.00 0 — — —

1250.0 1250.00 0.00 1 1250.00 0.00 0 — — — — — —

BAUD

RATE

(K)

FOSC = 8.000000 MHz FOSC = 7.159090 MHz FOSC = 5.068800 MHz FOSC = 4.000 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

0.3 — — — — — — — — — 0.98 225.52 255

1.2 1.95 62.76 255 1.75 45.65 255 1.24 3.13 255 1.20 0.16 207

2.4 2.40 0.16 207 2.41 0.23 185 2.40 0.00 131 2.40 0.16 103

9.6 9.62 0.16 51 9.52 -0.83 46 9.60 0.00 32 9.62 0.16 25

19.2 19.23 0.16 25 19.45 1.32 22 18.64 -2.94 16 19.23 0.16 12

38.4 38.46 0.16 12 37.29 -2.90 11 39.60 3.13 7 35.71 -6.99 6

57.6 55.56 -3.55 8 55.93 -2.90 7 52.80 -8.33 5 62.50 8.51 3

76.8 71.43 -6.99 6 74.57 -2.90 5 79.20 3.13 3 83.33 8.51 2

96.0 100.00 4.17 4 89.49 -6.78 4 — — — — — —

115.2 125.00 8.51 3 111.86 -2.90 3 105.60 -8.33 2 125.00 8.51 1

250.0 250.00 0.00 1 223.72 -10.51 1 — — — 250.00 0.00 0

300.0 — — — — — — 316.80 5.60 0 — — —

500.0 500.00 0.00 0 447.44 -10.51 0 — — — — — —

BAUD

RATE

(K)

FOSC = 3.579545 MHz FOSC = 2.000000 MHz FOSC = 1.000000 MHz FOSC = 0.032768 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

0.3 0.87 191.30 255 0.49 62.76 255 0.30 0.16 207 0.29 -2.48 6

1.2 1.20 0.23 185 1.20 0.16 103 1.20 0.16 51 1.02 -14.67 1

2.4 2.41 0.23 92 2.40 0.16 51 2.40 0.16 25 2.05 -14.67 0

9.6 9.73 1.32 22 9.62 0.16 12 8.93 -6.99 6 — — —

19.2 18.64 -2.90 11 17.86 -6.99 6 20.83 8.51 2 — — —

38.4 37.29 -2.90 5 41.67 8.51 2 31.25 -18.62 1 — — —

57.6 55.93 -2.90 3 62.50 8.51 1 62.50 8.51 0 — — —

76.8 74.57 -2.90 2 — — — — — — — — —

115.2 111.86 -2.90 1 125.00 8.51 0 — — — — — —

250.0 223.72 -10.51 0 — — — — — — — — —

PIC18F2220/2320/4220/4320

TABLE 18-5: BAUD RATES FOR SYNCHRONOUS MODE (SYNC = 1)

BAUD

RATE

(K)

FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 16.000 MHz FOSC = 10.000 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate

(K)

Error

SPBRG

value

(decimal)

9.6 — — — — — — 15.63 62.76 255 9.77 1.73 255

19.2 — — — 19.53 1.73 255 19.23 0.16 207 19.23 0.16 129

38.4 39.06 1.73 255 38.46 0.16 129 38.46 0.16 103 38.46 0.16 64

57.6 57.47 -0.22 173 57.47 -0.22 86 57.97 0.64 68 58.14 0.94 42

76.8 76.92 0.16 129 76.92 0.16 64 76.92 0.16 51 75.76 -1.36 32

96.0 96.15 0.16 103 96.15 0.16 51 95.24 -0.79 41 96.15 0.16 25

250.0 250.00 0.00 39 250.00 0.00 19 250.00 0.00 15 250.00 0.00 9

300.0 303.03 1.01 32 294.12 -1.96 16 307.69 2.56 12 312.50 4.17 7

500.0 500.00 0.00 19 500.00 0.00 9 500.00 0.00 7 500.00 0.00 4

625.0 625.00 0.00 15 625.00 0.00 7 666.67 6.67 5 625.00 0.00 3

1000.0 1000.00 0.00 9 1000.00 0.00 4 1000.00 0.00 3 833.33 -16.67 2

1250.0 1250.00 0.00 7 1250.00 0.00 3 1333.33 6.67 2 1250.00 0.00 1

BAUD

RATE

(K)

FOSC = 8.000000 MHz FOSC = 7.159090 MHz FOSC = 5.068800 MHz FOSC = 4.000 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

2.4 7.81 225.52 255 6.99 191.30 255 4.95 106.25 255 3.91 62.76 255

9.6 9.62 0.16 207 9.62 0.23 185 9.60 0.00 131 9.62 0.16 103

19.2 19.23 0.16 103 19.24 0.23 92 19.20 0.00 65 19.23 0.16 51

38.4 38.46 0.16 51 38.08 -0.83 46 38.40 0.00 32 38.46 0.16 25

57.6 57.14 -0.79 34 57.73 0.23 30 57.60 0.00 21 58.82 2.12 16

76.8 76.92 0.16 25 77.82 1.32 22 74.54 -2.94 16 76.92 0.16 12

96.0 95.24 -0.79 20 94.20 -1.88 18 97.48 1.54 12 100.00 4.17 9

250.0 250.00 0.00 7 255.68 2.27 6 253.44 1.38 4 250.00 0.00 3

300.0 285.71 -4.76 6 298.30 -0.57 5 316.80 5.60 3 333.33 11.11 2

500.0 500.00 0.00 3 447.44 -10.51 3 422.40 -15.52 2 500.00 0.00 1

625.0 666.67 6.67 2 596.59 -4.55 2 633.60 1.38 1 — — —

1000.0 1000.00 0.00 1 894.89 -10.51 1 — — — 1000.00 0.00 0

1250.0 — — — 1789.77 43.18 0 1267.20 1.38 0 — — —

BAUD

RATE

(K)

FOSC = 3.579545 MHz FOSC = 2.000000 MHz FOSC = 1.000000 MHz FOSC = 0.032768 MHz

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

Actual

Rate (K) %

Error

SPBRG

value

(decimal)

0.3 — — — — — — 0.98 225.52 255 0.30 1.14 26

1.2 — — — 1.95 62.76 255 1.20 0.16 207 1.17 -2.48 6

2.4 3.50 45.65 255 2.40 0.16 207 2.40 0.16 103 2.73 13.78 2

9.6 9.62 0.23 92 9.62 0.16 51 9.62 0.16 25 8.19 -14.67 0

19.2 19.04 -0.83 46 19.23 0.16 25 19,.23 0.16 12 — — —

38.4 38.91 1.32 22 38.46 0.16 12 35.71 -6.99 6 — — —

57.6 55.93 -2.90 15 55.56 -3.55 8 62.50 8.51 3 — — —

76.8 74.57 -2.90 11 71.43 -6.99 6 83.33 8.51 2 — — —

96.0 99.43 3.57 8 100.00 4.17 4 — — — — — —

250.0 223.72 -10.51 3 250.00 0.00 1 250.00 0.00 0 — — —

500.0 447.44 -10.51 1 500.00 0.00 0 — — — — — —

PIC18F2220/2320/4220/4320

18.3 USART Asynchronous Mode

In this mode, the USART uses standard Non-Return-

to-Zero (NRZ) format (one Start bit, eight or nine data

bits and one Stop bit). The most common data format

is 8 bits. An on-chip dedicated 8-bit Baud Rate Gener-

ator can be used to de rive st and ard baud rate freque n-

cies from the oscillator. The USART transmits and

receives the LSb first. The USART’s transmitter and

receive r are func tionally in depend ent but use the same

data format and baud rate. The Baud Rate Generator

produces a clock, either x16 or x64 of the bit shift rate,

dependi ng on bi t BRGH (TXSTA<2>). Parity is not sup-

ported by the hardware but can be implemented in soft-

ware (and stored as the ninth data bit). Asynchronous

mode functions in all power managed modes except

Sleep mode when call clock sources are stopped.

When in PRI_IDLE mode, no changes to the Baud

Rate Generator values are required; however, other

power managed mode clocks may operate at another

frequency than the primary clock. Therefore, the Baud

Rate generator values may need adjusting.

Asynchronous mode is selected by clearing bit, SYNC

(TXSTA<4>).

The USART Asynchronous module consists of the

following important elements:

• Baud Rate Ge nerator

• Sampling Circuit

• Asynchronous Transmitter

• Asynchronous Receiver

18.3.1 USART ASYNCHRONOUS

TRANSMITTER

The USART transmitter block diagram is shown in

Figure 18-1. The heart of the transmitter is the T ransmit

(Serial) Shift Register (TSR). The shift register obtains

its data from the Read/Write Transmit Buffer, TXREG.

The TXREG register is loaded with data in software.

The TSR register is not loaded until the Stop bit has

been transmitted from the previous load. As soon as

the Stop bit is transmitted, the TSR is loaded with new

data from the TXREG register (if available). Once the

TXREG register transfers the data to the TSR register

(occurs in one TCY), the TXREG register is empty and

flag bit, TXIF (PIR1<4>), is set. This interrupt can be

enabled/disabled by setting/clearing enable bit, TXIE

(PIE1<4>). Flag bit TXIF will be set regardless of the

state of enable bit TXIE and cannot be cleared in soft-

ware. Flag bit TXIF is not cleared immediately upon

loading the Transmit Buffer register, TXREG. TXIF

beco mes v alid in th e seco nd instr uct ion cyc le fo llowin g

the load i nstruc tion. Po lling T XIF im medi ately f ollowin g

a load of TXREG will return invalid results. While flag bit

TXIF indicated the status of the TXREG register,

another bit, TRMT (TXSTA<1>), shows the status of

the TSR register. Status bit TRMT is a read-only bit

whic h is set when th e TSR r egis ter is e mpty. No in ter-

rupt logic is tied to this bit, theref ore, the use r must pol l

this bit in order to determine whether the TSR register

is empty.

FIGURE 18-1: USART TRANSMIT BLOCK DIAGRAM

Note 1: The TSR register is not mapped in data

memory so it is not available to the user.

2: Flag bit T XIF is set when en able bit TXEN

is set.

TXIF

TXIE

Interrupt

TXEN Baud Rate CLK

SPBRG

Baud Rate Generator TX9D

MSb LSb

Data Bus

TXREG Register

TSR Register

(8) 0

TX9

TRMT SPEN

RC6/TX/CK pin

Pin Buffer

and Control

• • •

PIC18F2220/2320/4220/4320

FIGURE 18-2: ASYNCHRONOUS TRANSMISSION

FIGURE 18-3: ASYNCHRONOUS TRANSMISSION (BACK TO BACK)

TABLE 18-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION

Word 1 Stop bit

Word 1

Tra nsmit Shift Reg

Start bit bit 0 bit 1 bit 7/8

Write to TXREG Word 1

BRG Output

(Shift Clock)

RC6/TX/CK (pin)

TXIF bit

(Transmit Buffer

Reg. Empty Flag)

TRMT bit

(Tran s mit Sh ift

Reg. Empty Flag)

1 TCY

Tra nsmit Shift Reg.

Write to TXREG

BRG Output

(Shift Clock)

RC6/TX/CK (pin)

TXIF bit

(Interrupt Reg. Flag)

TRMT bit

(Transmit Shift

Reg. Empty Flag)

Word 1 Word 2

Start bit Stop bit Start bit

Transmit Shift Reg.

Word 1 Word 2

bit 0 bit 1 bit 7/8 bit 0

Note: This ti ming diagr am shows two consecut ive tran smis s ions.

1 TCY

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

TXREG USART Transmit Register 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission.

Note 1: The PSPIF, PSPIE and PSPIP bits are res erved on the PIC18F2X20 devices; always main t ain these bit s clear.

PIC18F2220/2320/4220/4320

18.3.2 USART ASYNCHRONOUS

RECEIVER

The receiver block diagram is shown in Figure 18-4.

The data is received on the RC7/RX/DT p in an d dri ve s

the data recovery block. The data recovery block is

actuall y a high-spe ed shifter , op erating at x16 times th e

baud rate , whereas th e main receive serial shifte r oper-

ates at the bit rate or at FOSC. This mode would

typically be used in RS-232 systems.

To set up an Asynchronous Reception:

1. Initialize th e SPBRG re gis te r for the ap prop ria te

baud rate. If a high-speed baud rate is desired,

set bit BRGH (Section 18.2 “USART Baud

Rate Generator (BRG)”).

2. Enable the asynchronous serial port by clearing

bit SYNC and setting bit SPEN.

3. If interrupts are desired, set enable bit RCIE.

4. If 9-bit reception is desired, set bit RX9.

5. Enable the reception by setting bit CREN.

6. Flag bit RCIF will be set when reception is com-

plete an d an interru pt will be generated i f enable

bit RCIE wa s set.

7. Read the RCSTA register to get the ninth bit (if

enabled) and determine if any error occurred

during r eception.

8. Read the 8-bit received data by reading the

RCREG register.

9. If any error occurred, clear the error by clearing

enable bit C RE N.

10. If using interrupt s, ensu re that t he GIE a nd PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

18.3.3 SETTING UP 9-BIT MODE WITH

ADDRESS DETECT

This m ode w o uld ty pi cally be us ed in RS-485 sy ste ms .

To set up an Asynchronous Reception with address

detect enable:

1. Initialize the SPBRG re gister for the approp ria te

baud rate . If a hig h-s pee d b aud rate is requ ire d,

set the BRGH bit.

2. Enable the asy nch ron ous seri al port by clearin g

the SYNC bit and setting the SPEN bit.

3. If in terrupts a re requ ired, se t the RCE N bit and

select the desired pr iority level with the RCIP bit.

4. Set the RX9 bit to enable 9-bit reception.

5. Set the ADDEN bit to enable address detect.

6. Enable reception by setting the CREN bit.

7. The RCIF bit will be set when reception is

complete. The interrupt will be Acknowledged if

the RCIE and GIE bits are set.

8. Read the RCSTA register to determine if any

error occurred during reception, as well as read

bit 9 of data (if app lic able).

9. Read RCREG to determine if the device is being

addressed.

10. If any error occurred, clear the CREN bit.

11. If the device has been addressed, clear the

ADDEN bit to allow all received data into the

receive buffer and interrupt the CPU.

FIGURE 18-4: USART RECEIVE BLOCK DIAGRAM

x64 B aud Rate CLK

SPBRG

Baud Rate Generator

RC7/RX/DT

Pin Buffer

and Control

SPEN

Data

Recovery

CREN OERR FERR

RSR Register

MSb LSb

RX9D RCREG Register FIFO

Interrupt RCIF

RCIE Data Bus

÷ 64

÷ 16

or Stop Start

(8) 710

RX9

• • •

PIC18F2220/2320/4220/4320

To set up an Asynchronous Transmission:

1. Initialize th e SPBRG re gis te r for the ap prop ria te

baud rate. If a high-speed baud rate is desired,

set bit BRGH (Section 18.2 “USART Baud

Rate Generator (BRG)”).

2. Enable the asynchronous serial port by clearing

bit SYNC and setting bit SPEN.

3. If interrupts are desired, set enable bit TXIE.

4. If 9-bit transmission is desired, set Transmit bit,

TX9. Can be used as address/data bit.

5. Enable the transmission by setting bit TXEN

which will also set bit TXIF.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit TX9D.

7. Load data to the TXREG register (starts

transmission).

8. If using interrup ts, ensu re that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 18-5: ASYNCHRONOUS RECEPTION

TABLE 18-7: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION

Start

bit bit 7/8bit 1bit 0 bit 7/8 bit 0Stop

bit

Start

bit Start

bit

bit 7/8 Stop

bit

RX (pin)

Reg

Rcv Buffer Reg

Rcv Shift

Read Rcv

Buffer Reg

RCREG

RCIF

(Interrupt Flag)

OERR bit

CREN

Word 1

RCREG Word 2

RCREG

Stop

bit

Note: This timing diagram shows three words appearing on the RX input. The RCREG (Receive Buffer) is read after the third word,

causing the OERR (Overrun) bit to be set.

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

RCREG USART Receive Register 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGHTRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = un im pl em e nte d lo cations r ea d as ‘0’. Shaded cells are not used for asynchronous reception.

Note 1: The PSPI F, PSPIE and PSPI P bit s are reserve d on the P IC18F2 X20 de vices ; always maint ain these b its clear.

PIC18F2220/2320/4220/4320

18.4 USART Synchronous Master

Mode

In Sync hronous Ma ster mode, the data is transmi tted in

a half-duplex manner (i.e., transmission and reception

do not occur at the same time). When transmitting data,

the reception is inhibited and vice versa. Synchronous

mode is entered by setting bit, SYNC (TXSTA<4>). In

additio n, enabl e bit, SPEN (RCSTA<7>), is set in order

to configure the RC6/TX/CK and RC7/RX/DT I/O pins

to CK (clock) and DT (data) lines, respectively. The

Master mode ind icates t hat the pr ocessor transmit s the

master clock on the CK line. The Master mode is

entered by setting bit, CSRC (TXSTA<7>).

18.4.1 USART SYNCHRONOUS MASTER

TRANSMISSION

The USART transmitter block diagram is shown in

Figure 18-1. The heart of the transmitter is the Transmit

(Serial) Shift Register (TSR). The shift register obtains

its data from the Read/Write Transmit Buffer register,

TXREG. The TXREG register is loaded with data in

software. The TSR register is not loaded until the last

bit has been transmitted from the previous load. As

soon as the last bit is transmitted, the TSR is loaded

with new data from the TXREG (if available). Once the

TXREG register transfers the data to the TSR register

(occurs in one TCYCLE), the TXREG i s empt y and in ter-

rupt bit, TXIF (PIR1<4>), is set. The interrupt can be

enabled/disabled by setting/clearing enable bit, TXIE

(PIE1<4>). Flag bit TXIF will be set regardless of the

state of enable bit TXIE and cannot be cleared in soft-

ware. It will re set only wh en ne w dat a is loa ded i nto the

TXREG register . While flag bi t TXIF indicates the status

of the TXREG register , anot her bit, TRMT (TXSTA<1>),

shows the status of the TSR register. TRMT is a read-

only bit which is set when the TSR is empty. No inter-

rupt log ic is tied to th is bi t so the us er has to p oll th is b it

in order to determine if the TSR register is empty. The

TSR is not mapped in dat a memory so it is not available

to the user.

To set up a Synchronous Master Transmission:

1. Initialize the SPBRG re gister for the approp ria te

baud rate (Section 18.2 “USART Baud Rate

Generator (BRG)”).

2. Enable the synchronous master serial port by

setting bits SYNC, SPEN and CSRC.

3. If interrupts are desired, set enable bit TXIE.

4. If 9-bit transmission is desired, set bit TX9.

5. Enable the transmission by setting bit TXEN.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit TX9D.

7. S tart transmission by loading da ta to the TXREG

8. If using interrup ts, ensu re that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 18-6: SYNCHRONOUS TRANSMISSION

bit 0 bit 1 bit 7

Word 1

Q1 Q2 Q3Q4 Q1 Q2Q3 Q4 Q1 Q2Q3 Q4 Q1 Q2Q3 Q4Q1 Q2 Q3Q4 Q3Q4 Q1Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2Q3 Q4Q1 Q2Q3 Q4

bit 2 bit 0 bit 1 bit 7

RC7/RX/DT

RC6/TX/CK

Write to

TXREG Reg

TXIF bit

(Inte rru pt Flag )

TRMT

TXEN bit ‘1’ ‘1’

Word 2

TRMT b it

Write Word 1 Write Word 2

Note: Sync Master mode, SPBRG = 0; continuous transmission of two 8-bit words.

PIC18F2220/2320/4220/4320

FIGURE 18-7: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)

TABLE 18-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION

RC7/RX/DT pin

RC6/TX/CK pin

Write to

TXREG reg

TXIF bit

TRMT bit

bit 0 bit 1 bit 2 bit 6 bit 7

TXEN b it

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

TXREG USAR T Transm it Regis ter 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = unimplemented, read as ‘0’. Shade d cel ls are not use d for sync hrono us ma ster tra nsmis sion .

Note 1: The PSPIF, PSPIE and PS PIP bi ts are r es erv ed o n the PI C 18 F2X 20 de v ic es; a lw a ys ma in tain th es e bi t s c le ar.

PIC18F2220/2320/4220/4320

18.4.2 USART SYNCHRONOUS MASTER

RECEPTION

Once Synchronous mode is selected, reception is

enabled by setting either enable bit, SREN

(RCSTA<5>), or enable bit, CREN (RCSTA<4>). Data

is sam pled on the RC 7/RX/DT pin on the falling edge of

the clock. If enable bit SREN is set, only a single word

is received. If enable bit CREN is set, the reception is

continuous until CREN is cleared. If both bits are set,

then CRE N tak es prece den ce .

To set up a Synchronous Master Reception:

1. Initialize th e SPBRG re gis te r for the ap prop ria te

baud rate (Section 18.2 “USART Baud Rate

Generator (BRG)”).

2. Enable the synchronous master serial port by

setting bits SYNC, SPEN and CSRC.

3. Ensure bits CREN and SREN are clear.

4. If interrupts are desired, set enable bit RCIE.

5. If 9-bit reception is desired, set bit RX9.

6. If a single reception is required, set bit SREN.

For continuous reception, set bit CREN.

7. Interrupt fla g bit RCIF will be se t when receptio n

is complete and an interrupt will be generated if

the enable bit RCIE was set.

8. Read the RCSTA register to get the ninth bit (if

enabled) and determine if any error occurred

during reception.

9. Read the 8-bit received data by reading the

RCREG register.

10. If any error occurred, clear the error by clearing

bit CREN.

11. If using interrup ts, ensure tha t the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

FIGURE 18-8: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)

TABLE 18-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

RCREG USART Receive Register 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded c el ls a re no t u s ed fo r s yn c hro no us mas te r re c ep tio n.

Note 1: The PSPIF, PSPIE and PSPIP bi ts are res erved on the PIC1 8F2X20 dev ices; alway s maint ain these bi ts clea r .

CREN bit

RC7/RX/DT pin

RC6/TX/CK pin

Write to

bit SREN

SREN bit

RCIF bit

(Interrupt)

Read

RXREG

Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q2 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

‘0’

bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7

‘0’

Q1 Q2 Q3 Q4

Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.

PIC18F2220/2320/4220/4320

18.5 USART Synchronous Slave Mode

Synchronous Slave mode differs from the Master mode

in the fact that the shift clock is supplied externally at

the RC6/TX/ CK pin (inst ead of being supplied internally

in Master mode). This allows the device to transfer or

receive dat a whi le in an y po wer mana ged mo de. Slave

mode is entered by clearing bit, CSRC (T XSTA<7>).

18.5.1 USART SYNCHRONOUS SLAVE

TRANSMIT

The operation of the Synchronous Master and Slave

modes are identical, except in the case of the Sleep

mode.

If two words are written to the TXREG and then the

SLEEP instruction is executed, the following will occur:

a) The first word will immediately transfer to the

TSR register and transmit.

b) The second word will remain in TXREG register.

c) Flag bit TXIF will not be set.

d) When the first word has been shifted out of TSR,

the TXREG register will transfer the second

word to the TSR and flag bit TXIF will now be

set.

e) If enable bit TXIE is set, the interrupt will wake

the chip from Sleep. If the global interrupt is

enabled , the p rog ram wil l bran ch to the in terrupt

vector.

To set up a Synchronous Slave Transmission:

1. Enable the synchronous slave serial port by

setting bits SYNC and SPEN and clearing bit

CSRC.

2. Clear bits CREN and SREN.

3. If interrupts are desired, set enable bit TXIE.

4. If 9-bit transmission is desired, set bit TX9.

5. Enable the transmission by setting enable bit

TXEN.

6. If 9-bit transmission is selected, the ninth bit

should be loaded in bit TX9D.

7. S tart transmission by loading da ta to the TXREG

8. If using interrup ts, ensu re that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

TABLE 18-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION

Name B it 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

TXREG USART Transmit Register 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknow n, - = unimplem ented, read as ‘0’. Shaded cells are not used for s ynchronous slav e transmission.

Note 1: The PSPIF, PSPIE and PSPIP bits are reserved on the PIC18F2X20 devices; al ways maint ain these bits clear.

PIC18F2220/2320/4220/4320

18.5.2 USART SYNCHRONOUS SLAVE

RECEPTION

The operation of the Synchronous Master and Slave

modes is identical, except in the case of Sleep or any

Idle mode and bit SREN, which is a “don't care” in

Slave mode.

If recei ve is en abl ed by se ttin g b it CREN prior to en ter-

ing Sleep or any Idle mode, then a word may be

received while in this pow e r man age d mod e. O nce the

word is rec eived, th e RSR register will tran sfer the da ta

to the RCRE G register and if enable bi t RCIE bit is se t,

the interrupt generated will wake the chip from the

power managed mode. If the global interrupt is

enabled , the progra m will branch to the interrupt vector .

To set up a Synchronous Slave Reception:

1. Enable the synchronous master serial port by

setting bits SYNC and SPEN and clearing bit

CSRC.

2. If interrupts are desired, set enable bit RCIE.

3. If 9-bit reception is desired, set bit RX9.

4. To enable reception, set enable bit CREN.

5. Flag bit RCIF will be set when reception is

complete. An interrupt will be generated if

enable bit RCIE was set.

6. Read the RCSTA register to get the ninth bit (if

enabled) and determine if any error occurred

during reception.

7. Read the 8-bit received data by reading the

RCREG register.

8. If any error occurred, clear the error by clearing

bit CREN.

9. If using interrup ts, ensu re that the GIE and PEIE

bits in the INTCON register (INTCON<7:6>) are

set.

TABLE 18-11: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 0000 000u

PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 -00x 0000 -00x

RCREG USART Receive Register 0000 0000 0000 0000

TXSTA CSRC TX9 TXEN SYNC —BRGH TRMT TX9D 0000 -010 0000 -010

SPBRG Baud Rate Generator Register 0000 0000 0000 0000

Legend: x = unknown, - = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception.

Note 1: The PSPIF, PSPIE and PSPIP bit s are reser ved on the PIC1 8F2X2 0 devic es; al ways maint ain these bit s clea r.

PIC18F2220/2320/4220/4320

19.0 10-BIT ANA LOG-TO-D IGITAL

CONVERTER (A/D) MODULE

The Analog-to-Digital (A/D) converter module has 10

inputs for the PIC18F2X20 devices and 13 for the

PIC18F4X20 devices. This module allows conversion

of an analog input signal to a corresponding 10-bit

digital number.

A new feature for the A/D converter is the addition of

programmable acquisition time. This feature allows the

user to select a new channel for conversion and setting

the GO/DONE bit immediately . When the GO/DONE bit is

set, the selected channel is sampled for the programmed

acquisition time before a conversion is actually started.

This removes the firmware overhead that may have been

required to allow for an acquisition (sampling) period (see

Configuring Automatic Acquisition Time”).

The module has five registers:

• A/D Result High Register (ADRESH)

• A/D Result Low Register (ADRESL)

• A/D Control Register 0 (ADCON0)

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

The ADCON0 register, shown in Register 19-1,

controls the operation of the A/D module. The

ADCON1 register, shown in Register 19-2, configures

the functions of the port pins. The ADCON2 register,

shown in Register 19-3, configures the A/D clock

source, p rogrammed acquisi tion time and justification.

U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

—— CHS3 CHS2 CHS1 CHS0 GO/DONE ADON

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5-3 CHS3:CHS0: Analog Channel Select bits

0000 = Channel 0 (AN0)

0001 = Channel 1 (AN1)

0010 = Channel 2 (AN2)

0011 = Channel 3 (AN3)

0100 = Channel 4 (AN4)

0101 = Channel 5 (AN5)(1,2)

0110 = Channel 6 (AN6)(1,2)

0111 = Channel 7 (AN7)(1,2)

1000 = Channel 8 (AN8)

1001 = Channel 9 (AN9)

1010 = Channel 10 (AN10)

1011 = Channel 11 (AN11)

1100 = Channel 12 (AN12)

1101 = Unimplemented(2)

1110 = Unimplemented(2)

1111 = Unimplemented(2)

Note 1: These channels are not implemented on the PIC18F2X20 (28-pin) devices.

2: Performing a conversion on unimplemented channels returns full-scale results.

bit 1 GO/DONE: A/D Conversion Status bit

When ADON = 1:

1 = A/D conversion in progress

0 = A/D Idle

bit 0 ADON: A/D On bit

1 = A/D converter module is enabled

0 = A/D converter module is disabled

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

U-0 U-0 R/W-0 R/W-0 R/W-q(1) R/W-q(1) R/W-q(1) R/W-q(1)

—— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5 VCFG1: Voltage Reference Configuration bit, VREFL Source

1 =V

REF- (AN2)

0 =AV

bit 4 VCFG0: Voltage Reference Configuration bit, VREFH Source

1 =VREF+ (AN3)

0 =AV

bit 3-0 PCFG3:PCFG0: A/D Port Configuration Control bits

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

A = Analog input D = Digital I/O

Note 1: The POR value of the PCFG bits depends on the value of the PBAD bit

Configuration Register 3H. When PBAD = 1, PCFG<3:0> = 0000; when PBAD = 0

PCFG<3:0> = 0111.

2: AN5 through AN7 are available only in PIC18F4X20 devices.

PCFG3:

PCFG0

AN12

AN11

AN10

AN9

AN8

AN7(2)

AN6(2)

AN5(2)

AN4

AN3

AN2

AN1

AN0

0000(1) AAAAAAAAAAAAA

0001 AAAAAAAAAAAAA

0010 AAAAAAAAAAAAA

0011 DAAAAAAAAAAAA

0100 DDAAAAAAAAAAA

0101 DDDAAAAAAAAAA

0110 DDDDAAAAAAAAA

0111(1) DDDDDAAAAAAAA

1000 DDDDDDAAAAAAA

1001 DDDDDDDAAAAAA

1010 DDDDDDDDAAAAA

1011 DDDDDDDDDAAAA

1100 DDDDDDDDDDAAA

1101 DDDDDDDDDDDAA

1110 DDDDDDDDDDDDA

1111 DDDDDDDDDDDDD

PIC18F2220/2320/4220/4320

R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0

bit 7 bit 0

bit 7 ADFM: A/D Result Format Select bit

1 = Right justified

0 = Left justified

bit 6 Unimplemented: Re ad as ‘0’

bit 5-3 ACQT2:ACQT0: A/D Acquis ition Time Select bits

111 = 20 TAD

110 = 16 TAD

101 = 12 TAD

100 = 8 TAD

011 = 6 TAD

010 = 4 TAD

001 = 2 TAD

000 = 0 TAD(1)

bit 2-0 ADCS1:ADCS0: A/D Conversion Clock Select bits

111 = FRC (clock derived from A/D RC oscillator)(1)

110 = FOSC/64

101 = FOSC/16

100 = FOSC/4

011 = FRC (clock derived from A/D RC oscillator)(1)

010 = FOSC/32

001 = FOSC/8

000 = FOSC/2

Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is

added bef ore the A/D c lock st arts. This allows the SLEEP inst ruction to be executed

before starting a conversion.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

The analog reference voltage is software selectable to

either the device’s positive and negative supply voltage

(AVDD and AVSS), or the volt age leve l on the RA3/ AN3/

VREF+ and RA2/AN2/VREF-/CVREF pins.

The A/D converter has a unique feature of being able

to operate while the device is in Sleep mode. To oper-

ate in SLEEP, the A/D conversion clock must be

derived from the A/D’s internal RC oscillator.

The output of the sample and hold is the input into the

converter which generates the result via successive

approximation.

A device Reset forces all registers to their Reset state.

This forces the A/D module to be turned off and any

conversion in progress is aborted.

Each port pi n associ ated with the A/D converter can be

configured as an analog input or as a digital I/O. The

ADRESH and ADRESL registers contain the result of

the A/D conversion. When the A/D conversion is com-

plete, the result is loaded into the ADRESH/ADRESL

registers, the GO/DONE bit (ADCON0 register) is

cleared and A/D Interrupt Flag bit, ADIF, is set. The block

diagram of the A/D module is s hown in Figure 19-1.

FIGURE 19-1: A/D BLOCK DIAGRAM

(Input Voltage)

VAIN

VREFH

Reference

Voltage

AVDD

VCFG1:VCFG0

CHS3:CHS0

AN7(1)

AN6(1)

AN5(1)

AN4

AN3/VREF+

AN2/VREF-

AN1

AN0

0111

0110

0101

0100

0011

0010

0001

0000

VREFL

AVSS

AN12(2)

AN11

AN10

AN9

AN8

1100

1011

1010

1001

1000

Note 1: Channels AN5 through AN7 are not available on PIC18F2X20 devices.

2: I/O pins have diode protection to VDD and VSS.

10-bit

Converter

A/D

PIC18F2220/2320/4220/4320

The value in the ADRESH/ADRESL registers is not

modified for a Power-on Reset. The ADRESH/

ADRESL registers will contain unknown data after a

Power-on Reset.

After the A/D module has been configured as desired,

the sele cted channe l m ust be acquire d b efor e the con-

version is started. The analog input channels must

have their corresponding TRIS bits selected as an

input. To determine acquisition time, see Section 19.1

“A/D Acquisition Requirements”. After this acquisi-

tion time has elapsed, the A/D conversion can be

started. An acquisition time can be programmed to

occur bet ween setting th e GO/DONE bit an d the actual

start of the conversion.

The following steps should be followed to do an A/D

conversion:

1. Configure th e A/D module:

• Config ure an alog pins, volt age refere nce and

digital I/O (ADCON1)

• Select A/D input channel (ADCON0)

• Select A/D acquisition time (ADCON2)

• Select A/D con ve rsi on cl ock (ADCO N 2)

• Turn on A/D module (ADCON0)

2. Configure A/D interrupt (if desired):

• Clear ADIF bit

• Set ADIE bit

• Set GIE bit

3. Wait the required acquisition time (if required).

4. Start conversion:

• Set GO/DONE bit (ADCON0 register)

5. Wait for A/D conversion to complete, by either:

• Polling for the GO/DONE bit to be cleared

• Waiting for the A/D interrupt

6. Read A/D Result registers (ADRESH:ADRESL);

clear bit ADIF if required.

7. For next conversion, go to step 1 or step 2, as

required. The A/D conversion time per bit is

defined as TAD. A minimum wait of 2 TAD is

required before next acquisition starts.

FIGURE 19-2: ANALOG INPUT MODEL

VAIN CPIN

Rs ANx

5 pF

VDD

VT = 0.6V

VT = 0.6 V ILEAKAGE

RIC ≤ 1k

Sampling

Switch

SS RSS

CHOLD = 120 pF

VSS

Sampling Switch

567891011

(kΩ)

VDD

± 500 nA

Legend: CPIN

ILEAKAGE

RIC

CHOLD

= input capacitance

= threshold voltage

= leakage current at the pin due to

= interconnect resistance

= sampling switch

= sample/hold capacitance (from DAC)

various junctions

= sam pling sw itch resistan ceRSS

PIC18F2220/2320/4220/4320

19.1 A/D Acquisition Requirements

For the A/D converter to meet its specified accurac y , the

Charge Holding Capacitor (CHOLD) must be allowed to

fully charge to the input channel voltage level. The ana-

log input model is shown in Figure 19-2. The source

impedance (RS) and the internal sampling switch (RSS)

impedance directly affect the time required to charge the

capacitor CHOLD. The sampling switch (RSS) impedance

varies over the device vol tage (VDD). The source imped-

ance af fects the offset volt age at the analog in put (due to

pin leakage current). The maximum recommended

impedance for analog sources is 2.5 kΩ. After the

analog input c hannel is selected (c hanged), the c hannel

must be sampled for at least the minimum acquisition

time before starting a co nversion.

To calculate the minimum acquisition time,

Equation 19-1 may be used. This equation assumes

that 1/2 LSb erro r is used (1024 step s for the A/D). The

1/2 LSb e rror is th e ma ximu m erro r a llowed fo r t he A/D

to meet its specified resolution.

Example 19-1 shows the calculation of the minimum

required acquisition time TACQ. This calcu lation is based

on the following applic ation sy stem ass umptions :

CHOLD = 120 pF

RS= 2.5 kΩ

Conve rsi on Error ≤1/2 LS b

VDD =5V → Rss = 7 kΩ

Temperature = 50°C (system max.)

VHOLD = 0V @ time = 0

19.2 A/D VREF+ and VREF- References

If external voltage references are used instead of the

internal AVDD and AVSS sources, the source imped-

ance of the VREF+ and VREF- volta ge sour c e s must be

considered. During acquisition, currents supplied by

these sources are insignificant. However, during con-

version, the A/D module sinks and sources current

through the reference sources.

In order to maintain the A/D accuracy, the voltage ref-

erence source impedances should be kept low to

reduce volt ag e cha nges. These volt age chan ges o ccur

as reference currents flow through the reference

source impedance. The maximum recommended

impedance of the VREF+ and VREF- external

reference voltage sources is 75Ω.

EQUATION 19-1: ACQUISITION TIME

EQUATION 19-2: MINIMUM A/D HOLDING CAPACITOR

EXAMPLE 19-1: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME

Note: When th e conversion is started, the holding

capacitor is disconnected from the input pin. Note: When using external references, the

source impedance of the external voltage

references must be less than 75Ω in order

to achieve the specified ADC resolution. A

higher reference source impedance will

increase the ADC offset and gain errors.

Resistive volt age dividers will not provide a

low enough source impedance. To ensure

the best possible ADC performance, exter-

nal VREF inputs should be buffered with an

op amp or other low-impedance circuit.

TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient

=TAMP + TC + TCOFF

VHOLD = (VREF – (VREF/2048)) • (1 – e(-Tc/CHOLD(RIC + RSS + RS)))

TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048)

TACQ =TAMP + TC + TCOFF

TAMP =5 μs

TCOFF =(Temp – 25°C)(0.05 μs/°C)

(50°C – 25°C)(0.05 μs/°C)

1.25 μs

Temperature coefficient is only required for temperatures > 25°C. Below 25°C, TCOFF = 0 μs.

TC – -(CHOLD)(RIC + RSS + RS) ln(1/2047) μs

-(120 pF) (1 kΩ + 7 kΩ + 2.5 kΩ) ln(0.0004883) μs

9.61 μs

TACQ =5 μs + 1.25 μs + 9.61 μs

12.86 μs

PIC18F2220/2320/4220/4320

19.3 Selecting and Configuring

Automatic Acquisition Time

The ADCON2 register allows the user to select an

acquisition time that occurs each time the GO/DONE

bit is set.

When the GO/DON E bit is set, sampling is stopped and

a conve rsion begins. Th e user is responsi ble for ens ur-

ing the required acquisition time has passed between

selecting the desired input channel and setting the

GO/DONE bit. This occurs when the ACQT2:ACQT0

bits (ADCON2<5 :3>) remai n in their Re set state (‘000’)

and is compatible with devices that do not offer

progra mmab le ac qui sition times.

If desired, the ACQT bits can be set to select a

programmable acquisition time for the A/D module.

When the GO/DONE bit is set, the A/D module contin-

ues to sample the input for the selected acquisition

time, th en automatic ally begins a conversio n. Since the

acquis iti on time is pro gram m ed, t here ma y be no need

to wait for an acquisition time between selecting a

channel and setting the GO/DONE bit.

In either case, when the conversion is completed, the

GO/DONE bit is cleared, the ADIF flag is set and the

A/D begins sampling the currently selected channel

again. If an acquisition time is programmed, there is

nothing to indicate if the acquisition time has ended or

if the conversion has begun.

19.4 Selecting the A/D Conversion Clock

The A/D conversion time per bit is defined as TAD. The

A/D c on vers ion re qui res 11 TAD per 10-bit conversion.

The source of the A/D conversion clock is software

selectable. There are seven possible options for TAD:

•2 T

OSC

•4 TOSC

•8 TOSC

•16 TOSC

•32 TOSC

•64 TOSC

• Intern al RC Os cillator

For correct A/D conversions, the A/D conversion clock

(TAD) must be as short as possible, but greater than the

minimum TAD (approximately 2 μs, see parameter #130

for more information).

Table 19-1 shows the resultant TAD t im es der i ve d fr o m

the device operating frequencies and the A/D clock

source selected.

TABLE 19-1: TAD vs. DEVICE OPERATING FREQUENCIES

AD Clock Source (TAD) Maximum Device Frequency

Operation ADCS2:ADCS0 PIC18FXX20 PIC18LFXX20(4)

2 TOSC 000 1.25 MHz 666 kHz

4 TOSC 100 2.50 MHz 1.33 MHz

8 TOSC 001 5.00 MHz 2.66 MHz

16 TOSC 101 10 .0 MHz 5.33 MHz

32 TOSC 010 20.0 MHz 10.65 MHz

64 TOSC 110 40.0 MHz 21.33 MHz

RC(3) x11 1.00 MHz(1) 1.00 MHz(2)

Note 1: The RC source has a typical TAD time of 4 μs.

2: The R C source has a ty pical TAD time of 6 μs.

3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D

accuracy may be out of spec ificati on.

4: Low-power devices only.

PIC18F2220/2320/4220/4320

19.5 Operation in Power Managed

Modes

The selection of the automatic acquisition time and A/D

conversion clock is determined in part by the clock

source and frequency w hile i n a power manag ed mode.

If the A/D is expected to operate while the device is in

a power managed mode, the ACQT2:ACQT0 and

ADCS2:ADCS0 bits in ADCON2 should be updated in

accordance with the power managed mode clock that

will be used. Afte r the power ma naged mode is en tered

(either of the power managed Run modes), an A/D

acquisition or conversion may be started. Once an

acquisition or conversion is started, the device should

continue to be clocked by the same power managed

mode cl oc k s o u rce unti l the convers io n ha s been com-

pleted. If desired, the device may be placed into the

corresponding power managed Idle mode during the

conversion.

If the power managed mode clock frequency is less

than 1 MHz, the A/D RC clock source should be

selected.

Operation in Sleep mode requires the A/D RC clock to

be sel ected. If bits ACQ T2:ACQ T0 are s et to ‘000’ and

a conv er s io n i s s tart e d, t h e co nv ers io n wi ll b e de lay ed

one instruction cycle to allow execution of the SLEEP

instruction and entry to Sleep mode. The IDLEN and

SCS bits in the OSCCON register must have already

been cleared prior to starting the conversion.

19.6 Configuring Analog Port Pins

The ADCON1, TRISA, TRISB and TRISE registers all

configure the A/D port pins. The port pins needed as

analog inputs must have their corresponding TRIS bits

set (input) . If the TRIS bit is cleare d (output), the digit al

output level (VOH or VOL) will be converted.

The A/D operation is independent of the state of the

CHS3:CHS0 bits and the TRIS bits.

Note 1: When reading the port register, all pins

configured as analog input channels will

read as c lea red (a lo w l evel). Pins co nfi g-

ured as digital inputs will convert an ana-

log input. Analog levels on a digitally

configured input will be accurately

converted.

2: Analog levels on any pin defined as a

digital input may cause the digital input

buffer to consume current out of the

device’s specification limits.

3: The PBADEN bit in the Configuration

as analog or digital pins by controlling

how the PCFG0 bits in ADCON1 are

reset.

PIC18F2220/2320/4220/4320

19.7 A/D Conversions

Figure 19-3 shows the operation of the A/D converter

after the GO bit has been set and the ACQT2:ACQT0

bits are cleared. A conversion is started aft er the follow-

ing instruction to allow entry into Sleep mode before the

conversion begins.

Figure 19-4 shows the operation of the A/D converter

after the GO bit has been set and the ACQT2:ACQT0

bits are set to ‘010’ and selecting a 4 TAD acquisition

time before the conversion starts.

Clearing the GO/DONE bit during a conversion will abort

the current conversion. The A/D Result register pair will

NOT be updated with the partially completed A/D

conversion sample. This means the ADRESH:ADRESL

registers will continue to contain the value of the last

completed conversion (or the last value written to the

ADRESH:ADRESL registers).

After the A/D conversion is completed or aborted, a

AD wait is required before the next acquisition can

be started. After this wait, acquisition on the selected

channel is automatically started.

FIGURE 19-3: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0)

FIGURE 19-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD)

Note: The GO/DONE bit should NOT be set in

the sam e inst ructio n that tu rns on the A/D.

TAD1TAD2TAD3 TAD4TAD5 TAD6TAD7TAD8 TAD11

Set GO bit

Holding capacitor is disconnected from analog input (typically 100 ns)

TAD9TAD10TCY - TAD

Next Q4: ADRESH/ADRESL are loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is connected to analog input.

Conversion starts

b9 b6 b5 b4 b3 b2 b1

b8 b7

123 4 5 67811

Set GO bit

(Holding capacitor is disconnected)

910

Next Q4: ADRESH:ADRESL are loaded, GO bit is cleared,

ADIF bit is set, holding capacitor is reconnected to analog input.

Conversion starts

1234

(Holding capacitor continues

acquiring input)

TACQT Cycles TAD Cycles

Automatic

Acquisition

Time

b0b9 b6 b5 b4 b3 b2 b1

b8 b7

PIC18F2220/2320/4220/4320

19.8 Use of the CCP2 Trigger

An A/D convers ion can be st arted by the “special eve nt

trigger” of the CCP2 module. This requires that the

CCP2M3:CCP2M0 bits (CCP2CON<3:0>) be pro-

grammed as ‘1011’ and tha t the A/D modu le is enabled

(ADON bit is set). When the trigger occurs, the GO/

DONE bit will be set, starting the A/D acquisition and

conversion and the Timer1 (or Timer3) counter will be

reset to zero. Timer1 (or Timer3) is reset to automati-

cally repeat the A/D acquisition period with minimal

software overhead (moving ADRESH/ADRESL to the

desired location). The appropriate analog input chan-

nel must be selected and the minimum acquisition

period is either timed by the user or an appropriate

TACQ time, selected before the “special event trigger”,

sets the GO/DONE bit (starts a conversion).

If the A/D module is not enabled (A DON is c leared), the

“special event trigger” will be ignored by the A/D

module but will still reset the Timer1 (or Timer3)

counter.

TABLE 19-2: SUMMARY OF A/D REGISTERS

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Va lue on

POR, BOR

Value on

all other

Resets

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 0000 0000 0000

PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000

PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000

IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 1111 1111

PIR2 OSCFIF CMIF —EEIF BCLIF LVDIF TMR3IF CCP2IF 00-0 0000 00-0 0000

PIE2 OSCFIE CMIE —EEIE BCLIE LVDIE TMR3IE CCP2IE 00-0 0000 00-0 0000

IPR2 OSCFIP CMIP —EEIP BCLIP LVDIP TMR3IP CCP2IP 11-1 1111 11-1 1111

ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu

ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu

ADCON0 —— CHS3 CHS3 CHS1 CHS0 GO/DONE ADON --00 0000 --00 0000

ADCON1 —— VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 qqqq --00 qqqq

ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 0-00 0000

PORTA RA7(4) RA6(4) RA5 RA4 RA3 RA2 RA1 RA0 --0x 0000 --0u 0000

TRISA TRISA7(4) TRISA6(4) --11 1111 --11 1111

PORTB Read PORTB pins, Write LATB Latch xxxx xxxx uuuu uuuu

TRISB PORTB Data Direction Register 1111 1111 1111 1111

LATB PORTB Output Data Latch xxxx xxxx uuuu uuuu

PORTE — — — —RE3

(2) Read PORTE pins, Write LATE(4) ---- xxxx ---- uuuu

TRISE(3) IBF OBE IBOV PSPMODE — PORTE Data Direction 0000 -111 0000 -111

LATE(3) — — — — P ORTE Ou tput D a ta L a tch ---- -xxx ---- -uuu

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’, q = value depends on condition.

Shaded cells are not used for A/D conversion.

Note 1: RE3 port bit is available only as an input pin when MCLRE bit in configuration register is ‘0’.

2: This register is not implemented on PIC18F2X20 devices.

3: These bits are not implemented on PIC18F2X20 devices.

4: These pins may be configured as port pins depending on the oscillator mode selected.

PIC18F2220/2320/4220/4320

20.0 COMPARATOR MODULE

The com pa rator modul e con tain s two an al og comp ar a-

tors. The inputs and outputs for the comparators are

multiplexed with the RA0 through RA5 pins. The on-

chip voltage reference (Section 21.0 “Comparator

Voltage Reference Module”) can also be an input to

the comparators .

The CMCON register, shown as Register 20-1,

controls the comparator module’s input and output

multiplexers. A block diagram of the various

comparator configurations is shown in Figure 20-1.

20.1 Comparator Configuration

There are eight modes of operation for the comparators.

The CM bits (CMCON<2:0>) are used to select these

modes. Figure 20-1 shows the eight possible modes.

The TRISA register controls the data direction of the

comparator pin s for each mode. If the Comp arator mode

is changed, the comparator ou tput level may n ot be valid

for the specified mode change delay shown in the

Electrical Specifications (see Section 26.0 “Electrical

Characteristics”).

Note: Compara tor in terr upts sh ould be dis abled

during a Comparator mode change.

Otherwise, a false interrupt may occur.

R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1

C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0

bit 7 bit 0

bit 7 C2OUT: Comparator 2 Output bit

When C2INV = 0:

1 = C2 VIN+ > C2 VIN-

0 = C2 VIN+ < C2 VIN-

When C2INV = 1:

1 = C2 VIN+ < C2 VIN-

0 = C2 VIN+ > C2 VIN-

bit 6 C1OUT: Comparator 1 Output bit

When C1INV = 0:

1 = C1 VIN+ > C1 VIN-

0 = C1 VIN+ < C1 VIN-

When C1INV = 1:

1 = C1 VIN+ < C1 VIN-

0 = C1 VIN+ > C1 VIN-

bit 5 C2INV: Compar ator 2 Output Inversion bit

1 = C2 output inverted

0 = C2 output not inverted

bit 4 C1INV: Compar ator 1 Output Inversion bit

1 = C1 output inverted

0 = C1 output not inverted

bit 3 CIS: C omparator Input Switch bit

When CM2:CM0 = 110:

1 =C1 VIN- connects to RA3/AN3

C2 VIN- connects to RA2/AN2

0 =C1 V

IN- connects to RA0/AN0

C2 VIN- connects to RA1/AN1

bit 2-0 CM2:CM0: Com p ar ator Mode bits

Figure 20-1 shows the Comparator modes and CM2:CM0 bit settings.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

FIGURE 20-1: COMPARATOR I/O OPERATING MODES

Comparators RESET

CM<2:0> = 000

RA0/AN0 VIN-

VIN+

RA3/AN3/ C1OUT

Two Independent Comparators

CM<2:0> = 010

RA1/AN1 VIN-

VIN+

RA2/AN2/ C2OUT

VIN-

VIN+C1OUT

Two Common Reference Comparators

CM<2:0> = 100

VIN-

VIN+C2OUT

VIN-

VIN+Off (Read as ‘0’)

One Independent Comparator with Output

CM<2:0> = 001

VIN-

VIN+C1OUT

VIN-

VIN+Off (Read as ‘0’)

Comparators Off (POR Default Value)

CM<2:0> = 111

VIN-

VIN+Off (Read as ‘0’)

VIN-

VIN+C1OUT

Four Inputs Multiplexed to Two Comparators

CM<2:0> = 110

VIN-

VIN+C2OUT

From VREF Module

CIS = 0

CIS = 1

CIS = 0

CIS = 1

VIN-

VIN+C1OUT

Two Common Reference Comparators with Outputs

CM<2:0> = 101

VIN-

VIN+C2OUT

A = Analog Input, port reads zeros always, overrides TRISA bit(2).

D = Digital Input.

CIS (CMCON<3>) is the Comparator Input Switch; CVROE (CVRCON<6>) is the Voltage Reference Output Switch.

CVREF

VIN-

VIN+C1OUT

Two Independent Comparators with Outputs

CM<2:0> = 011

VIN-

VIN+C2OUT

RA4/T0CKI/C1OUT(1)

RA5/AN4/SS/LVDIN/C2OUT(1)

RA4/T0CKI/C1OUT(1)

RA5/AN4/SS/LVDIN/C2OUT(1)

RA4/T0CKI/C1OUT(1)

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

RA3/AN3/

RA1/AN1

RA2/AN2/

VREF+

VREF-/CVREF

VREF+

VREF-/CVREF

VREF+

Note 1: RA4 mus t be configured as an output pin in TRISA<4> when used to output C1OUT. RA5 ignores TRISA<5> when

used as an output for C2OUT.

2: Mode 110 is exception. Comparator input pins obey TRISA bits.

VREF-/CVREF

CVROE = 1

CVROE = 0

VREF+

VREF-/CVREF

VREF+

VREF-/CVREF

VREF+

VREF-/CVREF

VIN-

VIN+Off (Read as ‘0’)

VIN-

VIN+Off (Read as ‘0’)

RA3/AN3/

RA1/AN1

RA2/AN2/

RA0/AN0

VREF+

VREF-/CVREF

PIC18F2220/2320/4220/4320

20.2 Comparator Operation

A single comparator is shown in Figure 20-2, along with

the relationship between the analog input levels and

the digit al ou tput. When the an alog input a t VIN+ is less

than the analog input VIN-, the outp ut of the comp arator

is a digital low level. When the analog input at VIN+ is

greater than the analog input VIN-, the output of the

comparator is a digital high level. The shaded areas of

the output of the comparator in Figure 20-2 represent

the uncertainty due to input offsets and response time.

20.3 Comparator Reference

An external or internal reference signal may be used

depending on the comparator operating mode. The

analog signal present at VIN- is comp ar ed to the si gna l

at VIN+ and the digital output of the comparator is

adjusted accordingly (Figure 20-2).

FIGURE 20-2: SINGLE COMP ARATOR

20.3.1 EXTERNAL REFERENCE SIGNAL

When external voltage references are used, the

comparator module can b e configured to have the com-

parators operate from the same or different reference

sour ces. How ever , th resho ld detecto r applica tions ma y

require th e s am e re fere nce. Th e reference sign al m us t

be between VSS and VDD and can be appl ied to eithe r

pin of the comparator(s).

20.3.2 INTERNAL REFERENCE SIGNAL

The comparator module also allows the selection of an

internally generated voltage reference for the compara-

tors. Section 21.0 “Comparator Voltage Reference

Module” contains a detailed description of the compar-

ator voltage reference module that provides this signal.

The internal reference sign al is used whe n com p arators

are in mode, CM2:CM0 = 110 (Figure 20-1). In this

mode, the internal voltage reference is applied to the

VIN+ pin of both comparators.

Depending on the setting of the CVROE bit

(CVRCON<6>), the voltage reference may also be

available on pin RA2.

20.4 Comparator Response Time

Response time is the minimum time, after selecting a

new reference voltage or input source, before the

comparator output has a valid level. If the internal ref-

erence is changed, the maximum delay of the internal

voltage reference must be considered when using the

comparator outputs. Otherwise, the maximum delay of

the comparators should be used (see Table 26-2 in

Section 26.0 “Electrical Characteristics”).

20.5 Comparator Outputs

The comparator outputs are read through the CMCON

output s may al so be dire ctly output to the RA4 a nd RA5

I/O pins . When enab led, multipl exers in th e output p ath

of the RA4 and RA5 pins will switch and the output of

each pin will be th e un sy nc hro niz ed outp ut o f the com-

parator. The uncertainty of each of the comparators is

related t o the input of fset volta ge and the resp onse time

given in the specifications. Figure 20-3 shows the

comp ara tor outp ut blo ck diagram.

The TRISA bits will still function as an output enable/

disable for the RA4 and RA5 pins while in this mode.

The polarity of the comparator outputs can be changed

using the C2INV and C1INV bits (CMCON<4:5 >).

–

VIN+

VIN-Output

IN–

IN+

utput

Output

VIN+

VIN-

Note 1: When reading the Port register, all pins

configu red a s anal og inp uts will read as a

‘0’. Pins configured as digital inputs will

convert an analog input according to the

Schmitt Trigger input specification.

2: Analog levels on any pin defined as a

digital input may cau se the in put bu f f e r to

consume more current than is specified.

PIC18F2220/2320/4220/4320

FIGURE 20-3: COMPARATOR OUTPUT BLOCK DIAGRAM

20.6 Comparator Interrupts

The comparator interrupt flag is set whenever there is

a change in the output value of either comparator.

Software will need to maintain information about the

stat us of the out put bits, as rea d from CMCON<7:6> , to

determine the actual change that occurred. The CMIF

bit (PIR re gisters) is the Compara tor Interrupt Fl ag. The

CMIF bit is cleared by firmware. Since it is also po ssible

to write a ‘1’ to this register, a simulated interrupt may

be initiated.

The CMIE bit (PIE reg isters) and the PEIE bit (INTC ON

the GIE bit must also be set. If any of these bits are

clear, the interrupt is not enabled, though the CMIF bit

will still be set if an interrupt condition occurs.

The user , in the Interrupt Service Routine, can clear the

interrupt in the following manner:

a) Any read or write of CMCON will end the

mismatch condition.

b) Clear flag bit CMIF.

A mismatc h co ndi tio n will co nti nue to set fla g bit CMIF.

Reading CMCON will end the mismatch condition and

allow flag bit CMIF to be cleared.

To RA4 or

RA5 Pin

Bus

Data

Read CMCON

Set

MULTIPLEX

CMIF

bit

Port Pins

Read CMCON

Reset

From

other

Comparator

CxINV

Note: If a change in the CMCON register

(C1OUT or C2OUT) should occur when a

read operation is being executed (start of

the Q2 cycle), then the CMIF (PIR

registers) interrupt flag may not get set.

PIC18F2220/2320/4220/4320

20.7 Comparato r Operation in Power

Managed Modes

When a comparator is active and the device is placed

in a power managed mode, the comparator remains

active and the interrupt is functional if enabled. This

interrupt will wake-up the device from a power

managed mode when enabled. Each operational com-

parator will consume additional current, as shown in

the comparator specifications. To minimize power

consumption while in a power managed mode, turn off

the comparators (CM<2:0> = 111) before entering the

power managed modes. If the device wakes up from a

power managed mode, the contents of the CMCON

20.8 Effects of a Reset

A device Reset forces the CMCON register to its Reset

stat e, causing the comparator module to be in the Com-

parator Reset mode (CM<2:0> = 111). This ensures

that all potential inputs are analog inputs. Device cur-

rent is minimized when digital inputs are present at

Reset time. The comparators will be powered down

during the Reset interval.

20.9 Analog Input Connection

Considerations

A simplified circuit for an analog input is shown in

Figure 20-4. Since the analog pins are connected to a

digital output, they have reverse biased diodes to VDD

and VSS. Therefore, the analog input must be between

VSS and VDD. If the input volt age exceed s this range by

more than 0.6V, one of the diodes is forward biased

and a la tch-up condition may occur . A maximum source

impedance of 10 kΩ is recommended for the analog

sources.

FIGURE 20-4: COMPARATOR ANALOG INPUT MODEL

RS < 10k

AIN CPIN

5 pF

VDD

VT = 0.6V

RIC

ILEAKAGE

±500 nA

VSS

Legend: CPIN = Input Capacitance

VT= Threshold Voltage

ILEAKAGE = Leakage Current at the pin due to various junctions

RIC = Interconnect Resistance

RS= Source Impedance

VA = Analog Voltage

Comparator

Input

PIC18F2220/2320/4220/4320

TABLE 20-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR

Value on

all other

Resets

CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111

CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000

INTCON GIE/

GIEH PEIE/

GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 0000 0000 0000

PIR2 —CMIF— — BCLIF LVDIF TMR3IF CCP2IF -0-- 0000 -0-- 0000

PIE2 —CMIE— — BCLIE LVDIE TMR3IE CCP2IE -0-- 0000 -0-- 0000

IPR2 —CMIP— — BCLIP LVDIP TMR3IP CCP2IP -1-- 1111 -1-- 1111

PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 xx0x 0000

LATA —— LATA Data Output Register xxxx xxxx xxxx xxxx

TRISA —— PORTA Data Direction Register 1111 1111 1111 1111

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’.

Shaded cells are unused by the comparator module.

Note 1: These pins are enabled based on oscillator configuration (see Configuration Register 1H).

PIC18F2220/2320/4220/4320

21.0 COMPARATOR VOLTAGE

REFERENCE MODULE

The comparator voltage reference is a 16-tap resistor

ladder n etwork th at provid es a sel ectabl e volt age refer-

ence. The resistor ladder is segmented to provide two

ranges of CVREF values and has a power-down func-

tion to conserve power when the reference is not being

used. The CVRCON register controls the operation of

the reference as shown in Register 21-1. The block

diagram is given in Figure 21-1.

The comparator reference supply voltage comes from

VDD and VSS.

21.1 Configuring the Comparator

Voltage Reference

The comparator volt age reference can output 16 distinct

voltage levels for each range. The equations used to cal-

culate the output of the comparator voltage reference

are as follows:

EQUATION 21-1:

The settling time of the comparator voltage reference

must be considered when changing the CVREF

output (see Table 26-2 in Section 26.0 “Electrical

Characteristics”).

If CVRR = 1:

CVREF = (CVR<3:0>) •

If CVRR = 0:

CVREF = (CVR<3:0> + 8) •

VDD

R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0

bit 7 bit 0

bit 7 CVREN: Comparator Voltage Reference Enable bit

1 =CV

REF circuit powered on

0 =CV

REF circuit powered down

bit 6 CVROE: Comparator VREF Output Enable bit

1 =CV

REF voltage level is also output on the RA2/AN2/VREF-/CVREF(1) pin

0 =CV

REF voltage is disconnected from the RA2/AN2/VREF-/CVREF pi n

Note 1: CVROE overrides the TR ISA<2> bit setting.

bit 5 CVRR: Comparator VREF Range Selection bit

1 = 0.00 VDD to 0.75 VDD, with VDD/24 step size

0 = 0.25 VDD to 0.75 VDD, with VDD/32 step size

bit 4 Unimplemented: Read as ‘0’

bit 3-0 CVR3:CVR0: Comparator VREF Value Selection 0 ≤ VR3:VR0 ≤ 15 bits

When CVRR = 1:

CVREF = (CVR<3:0>) •

When CVRR = 0:

CVREF = 1/4 • (CVRSRC) + (CVR<3:0> + 8) •

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

24 VDD

PIC18F2220/2320/4220/4320

FIGURE 21-1: VOLTAGE REFERENCE BLOCK DIAGRAM

21.2 Voltage Reference Accuracy/Error

The full range of voltage reference cannot be realized

due to the construction of the module. The transistors

on the top and bottom of the resistor ladder network

(Figure 21-1) keep CVREF from approaching the refer-

ence source rails. The voltage reference is derived

from VDD; therefore, the CVREF output changes with

fluctuations in VDD. The tested absolute accuracy of

the voltage reference can be found in Section 26.0

“Electri cal Characteristics”.

21.3 Operation in Power Managed

Modes

The con t en ts of the C VR CO N r egi st er are no t aff ec ted

by entry to or exit from powe r managed mode s. To min-

imize current consumption in power managed modes,

the volt age re ference mo dule shoul d be disabled ; how-

ever, this can cause an interrupt from the comparators

so the comparator interrupt should also be disabled

while the CVRCON register is being modified.

21.4 Effects of a Reset

A device Reset disa bles the volt age reference b y clear-

ing the CVRCON register. This also disconnects the

reference from the RA2 pin, selects the high-voltage

range and selects the lowest voltage tap from the

resistor divider.

21.5 Connection Considerations

The voltage reference module operates independently

of the comparator module. The output of the reference

generator may be output using the RA2 pin if the

CVROE bit is set. Enabling the voltage reference out-

put onto the RA2 pin, with an input signal present, will

increase current consumption.

The RA2 pin can be used as a simple D/A output with

lim ite d dr i ve c apa bi lit y. Du e to t he l i mi te d c ur r e nt dr i ve

capability, an external buffer must be used on the

voltage reference output for external connections to

VREF. Figure 21-2 shows an example buffering

technique.

CVR3

CVR0

(From CVRCON<3:0>)

16-1 Analog Mux

8R RRRR

CVREN

CVREF

16 Stages

VDD

CVRR

CVROE

RA2/AN2/VREF-/CVREF

PIC18F2220/2320/4220/4320

FIGURE 21-2: VOLT AGE REFERENCE OUTPUT BUFFER EXAMPLE

TABLE 21-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE

CVREF Output

–

CVREF

Module

Voltage

Reference

Output

Impedance

R(1) RA2

Note 1: R is dependent upon the voltage reference configuration bits (CVRCON<3:0> and CVRCON<5>).

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on

POR

Value on

all other

Resets

CVRCON CVREN CVROE CVRR — CVR3 CVR2 CVR1 CVR0 000- 0000 000- 0000

CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 0000 0111

TRISA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 1111 1111 1111 1111

Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’.

Shaded cells are not used with the comparator voltage reference.

Note 1: These pins are enabled based on oscillator configuration (see Configuration Register 1H).

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

22.0 LOW-VOLTAGE DETECT

In many applications, the ability to determine if the

device voltage (VDD) is below a specified voltage level

is a desirable feature. A window of operation for the

application can be created, where the application soft-

ware can do “housekeeping tasks” before the device

voltage exits the valid operating range. This can be

done using the Low-Voltage Detect (LVD) module.

This module is a software programmable circuitry,

where a device voltage trip point can be specified.

When the v oltage of the device becomes lower th en the

specif ied poin t, an inter rupt flag is set. If the interrupt is

enabled , the program exec ution will bran ch to the inter-

rupt vec tor addre ss and th e softw are c an then respon d

to that interrupt source.

The Low-Voltage Detect circuitry is completely under

software control. This allows the circuitry to be turned

off by the software which minimizes the current

consum pt ion for the devic e.

Figure 22-1 show s a possibl e applic ation vol tag e curve

(typically for batteries). Over time, the device voltage

decreases. When the device voltage equals voltage VA,

the LVD logic generates an interrupt. This occurs at

time TA. The application software then has the time,

until the device voltage is no longer in valid operating

range, to sh ut down the s ystem. Voltage poi nt VB is the

minimum valid operating voltage specification. This

occur s at time TB. The difference, TB – TA, is the total

time for shutdown.

The block diagram for the LVD module is shown in

Figure 22-2. A comparator uses an internally gener-

ated reference voltage as the set point. When the

selected tap output of the device voltage crosses the

set point (is lower than), the LVDIF bit is set.

Each node in the resistor divider represents a “trip

point” voltage. The “trip point” voltage is the minimum

supply voltage level at which the device can operate

before t he LVD module asserts an interr upt. When th e

supply voltage is equal to the trip point, the voltage

tapped off of the resistor array is equal to the 1.2V

internal reference voltage generated by the voltage ref-

erence module. The comparator then generates an

interrupt signal setting the LVDIF bit. This voltage is

software programmable to any one of 16 values (see

Figure 22-2). The trip point is selected by programming

the LVDL3:LVDL0 bits (LVDCON<3:0>).

FIGURE 22-1: TYPICAL LOW-VOLTAGE DETECT APPLICATION

Time

Voltage

TATB

VA = LVD trip point

VB = Minimum valid device

operating voltage

Legend:

PIC18F2220/2320/4220/4320

FIGURE 22-2: LOW-VOLT AGE DETECT (LVD) BLOCK DIAGRAM

The LVD module has an additional feature that allows

the user to supply the sense voltage to the module

from an external source. This mode is enabled when

bits LVDL3:LVDL0 are set to ‘1111’. In this state, the

comparator input is multiplexed from the external input

pin, LVDIN (Figure 22-3). This gives users flexibility

because it allows them to configure the Low-Voltage

Detect interrupt to occur at any voltage in the valid

operating range.

FIGURE 22-3: LOW-VOLTAGE DETECT (LVD) WITH EXTERNAL INPUT BLOCK DIAGRAM

LVDIF

VDD

16 to 1 MUX

LVDEN

LVD Control

Internally Generated

Reference Voltage

LVDIN

1.2V

LVD

LVD Control

16 to 1 MUX

BGAP

BODEN

LVDEN

VxEN

LVDIN

VDD VDD

Externally Generated

Trip Point

PIC18F2220/2320/4220/4320

22.1 Control Register

The Low-Voltage Detect Control register controls the

operation of the Low-Voltage Detect circuitry.

U-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1

—— IRVST LVDEN LVDL3 LVDL2 LVDL1 LVDL0

bit 7 bit 0

bit 7-6 Unimplemented: Read as ‘0’

bit 5 IRVST: Internal Refe rence Voltage Stable Flag bit

1 = Indicates that the Low-Voltage Detect logic will generate the interrupt flag at the specified

voltage range

0 = Indicates that the Low-Voltage Detect logic will not generate the interrupt flag at the

specified voltage range and the LVD interrupt should not be enabled

bit 4 LVDEN: Low-Voltage Detect Power Enable bit

1 = Enables LVD, powers up LVD circuit

0 = Disables LVD, powers down LVD circuit

bit 3-0 LVDL 3:LVDL0: Low-Voltage Detection Limit bits

1111 = External analog input is used (input comes from the LVDIN pin)

1110 = 4.50V-4.78V

1101 = 4.20V-4.46V

1100 = 4.00V-4.26V

1011 = 3.80V-4.04V

1010 = 3.60V-3.84V

1001 = 3.50V-3.72V

1000 = 3.30V-3.52V

0111 = 3.00V-3.20V

0110 = 2.80V-2.98V

0101 = 2.70V-2.86V

0100 = 2.50V-2.66V

0011 = 2.40V-2.55V

0010 = 2.20V-2.34V

0001 = 2.00V-2.12V

0000 = Reserved

Note: LVDL3:LVDL0 modes which result in a trip point below the valid operating voltage

of the device are not tested.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

- n = Value at POR ‘ 1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

PIC18F2220/2320/4220/4320

22.2 Operation

Depen ding on the power s our ce for th e devi ce volt ag e,

the voltage normally decreases relatively slowly. This

means that the LVD module does not need to be

constantly operating. To decrease the current require-

ments, the LVD circuitry only needs to be enabled for

short peri ods wher e the volt age is che cked. After d oing

the check, the LVD module may be disabled.

Each tim e that the LVD mo dule i s enab led, th e circ uitry

requires some time to stabilize. After the circuitry has

stabilized, all status flags may be cleared. The module

will then indicate the proper state of the system.

The following steps are needed to set up the LVD

module:

1. Write the value to the LVDL3:LVDL0 bits

(LVDCON register) which selects the desired

LVD trip point.

2. Ensure that LVD interrupts are disabled (the

LVDIE bit is cleared or the GIE bit is cleared).

3. Enable the LVD module (set the LVDEN bit in

the LVDCON register).

4. Wait for the LVD module to stabilize (the IRVST

bit to become set).

5. Clear the LVD interrupt flag, which may have

falsely become set, until the LVD module has

stabilized (clear the LVDIF bit).

6. Enable the LVD interru pt (set the LVDIE and th e

GIE bits).

Figure 22-4 shows typical waveforms that the LVD

module may be used to detect.

FIGURE 22-4: LOW-VOLTAGE DETECT WAVEFORMS

VLVD

VDD

LVDIF

VLVD

VDD

Enable LVD

Internally Generated TIVRST

LV DIF may not be set

Enable LVD

LVDIF

LVDIF cleared in software

LV DIF cleared in software,

CASE 1:

CASE 2:

LV DIF remains set since LVD condition still exists

Reference Stable

Internally Generated

Reference Stable TIVRST

PIC18F2220/2320/4220/4320

22.2.1 REFERENCE VOLTAGE SET POINT

The internal reference voltage of the LVD module may

be used by other internal circuitry (the Programmable

Brown-out Reset). If these circuits are disabled (lower

current consumption), the reference voltage circuit

requires a time to become stable before a low-voltage

condition can be reliably detected. This time is invariant

of system clock speed. This start-up time is specified in

electrical specification parameter #36. The low-voltage

interrupt flag will not be enabled until a stable reference

voltage is reached. Refer to the waveform in Figure 22-4.

22.2.2 CURRENT CONSUMPTION

When the module is enabled, the LVD comparator and

voltage divider are enabled and will consume st atic cur-

rent. The voltage divider can be tapped from multiple

places in the resistor array. Total current consumption,

when enabled, is specified in electrical specification

parameter #D022B.

22.3 Operation During Sleep

When enabled, the LVD circuitry continues to operate

during Sleep. If the device voltage crosses the trip

point, the L VDIF bit will be set and the devi ce will wake-

up from Sleep. Device execution will continue from the

interr upt vecto r address if interru pts h ave been globall y

enabled.

22.4 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the LVD module to be turned off.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

23.0 SPECIAL FEATURES OF THE

CPU

PIC18F2X20/4X20 devices include several features

intended to maximize system reliability and minimize

cost through elimination of external components.

These are:

• Oscillator Selection

• Resets:

- Power-on Reset (P OR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Brown-out Reset (BOR)

• Interrupts

• Watchdog Timer (WDT)

• Fail-Safe Clock Monitor

• Two-Speed Start-up

• Code Protection

• ID Locations

• In-Circuit Serial Programming

The oscillator can be configured for the application

dependi ng on frequ ency, powe r, acc uracy and cost. All

of the options are discussed in detail in Section 2.0

“Oscillator Configurations”.

A complete discussion of device Resets and interrupts

is avail able in previous sections of this data sheet.

In addition to their Power-up and Oscillator Start-up

Timers provided for Resets, PIC18F2X20/4X20

device s hav e a Watchdog Time r whi ch is eith er perm a-

nently enabled via the configuration bits or software

controlled (if configured as disabled).

The inclu sio n of an in ternal RC oscill ator also provides

the additional benefits of a Fail-Safe Clock Monitor

(FSCM) and Two-Speed Start-up. FSCM provides for

background monitoring of the peripheral clock and

automatic switchover in the event of its failure. Two-

Speed Start-up enables code to be executed almost

immediately on start-up while the primary clock source

completes its start-up delays.

All of these features are enabled and configured by

setting the appropriate configuration register bits.

23.1 Configuration Bits

The con figuration bit s can be programme d (read as ‘0’)

or left unprogrammed (read as ‘1’) to select various

device configurations. These bits are mapped starting

at program memory location 300000h.

The user will note that address 300000h is beyond the

user program memory space. In fact, it belongs to the

configuration memory space (300000h-3FFFFFh)

which can only be accessed using table reads and

table writes.

Programming the configuration registers is done in a

manner s imilar to p rogrammin g the Flas h memo ry. The

EECON1 regist er WR bit sta rts a se lf-tim ed w rite to the

configuration register. In normal operation mode, a

TBLWT instruc tion with the TBLP TR pointi ng to the con-

figuration register sets up the address and the data for

the configuration register write. Setting the WR bit

start s a long write to the configuration register . The con-

figuratio n regis ters are writt en a by te at a t ime. To write

or erase a configuration cell, a TBLWT instruction can

write a ‘1’ or a ‘0’ into the cell. For additional details on

Flash programming, refer to Section 6.5 “Writing to

Flash Program Memory”.

TABLE 23-1: CONFIGURATION BITS AND DEVICE IDS

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default/

Unprogrammed

Value

300001h CONFIG1H IESO FSCM ——FOSC3FOSC2FOSC1FOSC011-- 1111

300002h CONFIG2L — — — — BORV1 BORV0 BOR PWRT ---- 1111

300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDT ---1 1111

300005h CONFIG3H MCLRE — — — — —PBADCCP2MX1--- --11

300006h CONFIG4L DEBUG — — — —LVP—STVR1--- -1-1

300008h CONFIG5L — — — — CP3 CP2 CP1 CP0 ---- 1111

300009h CONFIG5H CPD CPB — — — — — — 11-- ----

30000Ah CONFIG6L — — — — WRT3 WRT2 WRT1 WRT0 ---- 1111

30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- ----

30000Ch CONFIG7L — — — — EBTR3 EBTR2 EBTR1 EBTR0 ---- 1111

30000Dh CONFIG7H —EBTRB— — — — — — -1-- ----

3FFFFEh DEVID1(1) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(1)

3FFFFFh DEVID2(1) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 0101

Legend: x = unknown, u = unchanged, - = unimplemented, q = value depends on condition.

Shaded cells are unimplemented, read as ‘0’.

Note 1: See Register 23-14 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user.

PIC18F2220/2320/4220/4320

R/P-1 R/P-1 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

IESO FSCM ——FOSC3FOSC2FOSC1FOSC0

bit 7 bit 0

bit 7 IESO: Internal External Switch Over bit

1 = Internal External Switch Over mode enabled

0 = Internal External Switch Over mode disabled

bit 6 FSCM: Fail-Safe Clock Monitor enable bit

1 = Fail-Safe Clock Monitor enabled

0 = Fail-Safe Clock Monitor disabled

bit 5-4 Unimplemented: Read as ‘0’

bit 3-0 FOSC<3:0>: Oscillator Sele cti on bits

11xx = External RC oscillator, CLKO function on RA6

1001 = Internal oscillator block, CLKO function on RA6 and port function on RA7

1000 = Internal oscillator block, port function on RA6 and port function on RA7

0111 = External RC oscillator, port function on RA6

0110 = HS oscillator, PLL enabled (clock frequency = 4 x FOSC1)

0101 = EC oscillator, port function on RA6

0100 = EC oscillator, CLKO function on RA6

0010 = HS oscillator

0001 = XT oscillator

0000 = LP oscillator

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

— — — — BORV1 BORV0 BOR PWRT

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3-2 BORV1:BORV0: Brown-out Reset Voltage bits

11 = VBOR se t to 2.0V

10 = VBOR se t to 2.7V

01 = VBOR se t to 4.2V

00 = VBOR se t to 4.5V

bit 1 BOR: Brown-out Reset enable bit(1)

1 = Brown-out Reset enabled

0 = Brown-out Reset disabled

bit 0 PWRT: Power-up Timer enable bit(1)

1 = PWRT disabled

0 = PWRT enabled

Note 1: The Power-up T imer is deco upled from Brown-o ut Reset, allowin g these feature s to

be independently controlled.

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1

— — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDT

bit 7 bit 0

bit 7-5 Unimplemented: Re ad as ‘0’

bit 4-1 WDPS<3:0>: Watchdog Timer Postscale Select bits

1111 = 1:32,768

1110 = 1:16,384

1101 = 1:8,192

1100 = 1:4,096

1011 = 1:2,048

1010 = 1:1,024

1001 = 1:512

1000 = 1:256

0111 = 1:128

0110 = 1:64

0101 = 1:32

0100 = 1:16

0011 = 1:8

0010 = 1:4

0001 = 1:2

0000 = 1:1

bit 0 WDT: Watchdog Timer Enable bit

1 = WDT enabled

0 = WDT disabled (control is placed on the SWDTEN bit)

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

R/P-1 U-0 U-0 U-0 U-0 U-0 R/P-1 R/P-1

MCLRE ————— PBAD CCP2MX

bit 7 bit 0

bit 7 MCLRE: MCLR Pin Enable bit

1 = MCLR pin enabled; RE3 input pin disabled

0 = RE3 input pin enabled; MCLR disabled

bit 6-2 Unimplemented: Read as ‘0’

bit 1 PBAD: POR TB A/D Enab le bit (Af fect s ADCON1 Res et sta te. ADCON1 controls POR TB<4:0 >

pin configuration.)

1 = PORTB<4:0> pins are configured as analog input channels on Reset

0 = PORTB<4:0> pins are configured as digital I/O on Reset

bit 0 CCP2MX: CCP2 Mux bit

1 = CCP2 input/output is multiplexed with RC1

0 = CCP2 input/output is multiplexed with RB3

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

R/P-1 U-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1

DEBUG — — — —LVP—STVR

bit 7 bit 0

bit 7 DEBUG: Background Debugger Enable bit

1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins

0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug

bit 6-3 Unimplemented: Read as ‘0’

bit 2 LVP: Low-Voltage ICSP Enable bit

1 = Low-voltage ICSP enabled

0 = Low-voltage ICSP disabled

bit 1 Unimplemented: Read as ‘0’

bit 0 STVR: St ac k Full /Und erfl ow Reset Enab le bit

1 = Stack full/underflow will cause Reset

0 = Stack full/underflow will not cause Reset

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1

————CP3

(1) CP2(1) CP1 CP0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 CP3: Code P rotecti on bit(1)

1 = Block 3 (001800-001FFFh) not code-protected

0 = Block 3 (001800-001FFFh) code-protected

bit 2 CP2: Code P rotecti on bit(1)

1 = Block 2 (001000-0017FFh) not code-protected

0 = Block 2 (001000-0017FFh) code-protected

bit 1 CP1: Code P rotecti on bit

1 = Block 1 (000800-000FFFh) not code-protected

0 = Block 1 (000800-000FFFh) code-protected

bit 0 CP0: Code P rotecti on bit

1 = Block 0 (000200-0007FFh) not code-protected

0 = Block 0 (000200-0007FFh) code-protected

Note 1: Unimplemented in PIC18FX220 devices; maintain this bit set.

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0

CPD CPB — — — — — —

bit 7 bit 0

bit 7 CPD: Data EEPROM Code Protection bit

1 = Data EEPROM not code-protected

0 = Data EEPROM code-protected

bit 6 CPB: Boot Block Code Protection bit

1 = Boot block (000000-0001FFh) not code-protected

0 = Boot block (000000-0001FFh) code-protected

bit 5-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

— — — —WRT3

(1) WRT2(1) WRT1 WRT0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 WRT3: Write Pr otection bit (1)

1 = Block 3 (001800-001FFFh) not write-protected

0 = Block 3 (001800-001FFFh) write-protected

bit 2 WRT2: Write Pr otection bit (1)

1 = Block 2 (001000-0017FFh) not write-protected

0 = Block 2 (001000-0017FFh) write-protected

bit 1 WRT1: Write Pr otection bit

1 = Block 1 (000800-000FFFh) not write-protected

0 = Block 1 (000800-000FFFh) write-protected

bit 0 WRT0: Write Pr otection bit

1 = Block 0 (000200-0007FFh) not write-protected

0 = Block 0 (000200-0007FFh) write-protected

Note 1: Unimplemented in PIC18FX220 devices; maintain this bit set.

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

R/P-1 R/P-1 R-1 U-0 U-0 U-0 U-0 U-0

WRTD WRTB WRTC — — — — —

bit 7 bit 0

bit 7 WRTD: Data EEPROM Write Protection bit

1 = Data EEPROM not write-protected

0 = Data EEPROM write-protected

bit 6 WRTB: Boot Block Write Protection bit

1 = Boot block (000000-0001FFh) not write-protected

0 = Boot block (000000-0001FFh) write-protected

bit 5 WRTC: Configuration Register Write Protection bit

1 = Configuration registers (300000-3000FFh) not write-protected

0 = Configuration registers (300000-3000FFh) write-protected

Note: This bit is read-only in normal execution mode; it can be written only in Program

mode.

bit 4-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

U-0 U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1

———— EBTR3(1) EBTR2(1) EBTR1 EBTR0

bit 7 bit 0

bit 7-4 Unimplemented: Read as ‘0’

bit 3 EBTR3: Table Read Protection bit(1)

1 = Block 3 (001800-001FFFh) not protected from table reads executed in other blocks

0 = Block 3 (001800-001FFFh) protected from table reads executed in other blocks

bit 2 EBTR2: Table Read Protection bit(1)

1 = Block 2 (001000-0017FFh) not protected from table reads executed in other blocks

0 = Block 2 (001000-0017FFh) protected from table reads executed in other blocks

bit 1 EBTR1: Table Read Protection bit

1 = Block 1 (000800-000FFFh) not protected from table reads executed in other blocks

0 = Block 1 (000800-000FFFh) protected from table reads executed in other blocks

bit 0 EBTR0: Table Read Protection bit

1 = Block 0 (000200-0007FFh) not protected from table reads executed in other blocks

0 = Block 0 (000200-0007FFh) protected from table reads executed in other blocks

Note 1: Unimplemented in PIC18FX220 devices; maintain this bit set.

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

U-0 R/P-1 U-0 U-0 U-0 U-0 U-0 U-0

— EBTRB — — — — — —

bit 7 bit 0

bit 7 Unimplemented: Read as ‘0’

bit 6 EBTRB: Boot Bloc k Table Read P rote c tion bit

1 = Boot block (000000-0001FFh) not protected from table reads executed in other blocks

0 = Boot block (000000-0001FFh) protected from table reads executed in other blocks

bit 5-0 Unimplemented: Read as ‘0’

Legend:

R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

RRRRRRRR

DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0

bit 7 bit 0

bit 7-5 DEV2:DEV0: Device ID bits

000 = PIC18F4220

001 = PIC18F4320

100 = PIC18F2220

101 = PIC18F2320

bit 4-0 REV4:REV0: Revi si on ID bits

These bits are used to indicate the device revision.

Legend:

R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

RRRRRRRR

DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3

bit 7 bit 0

bit 7-0 DEV10:DEV3: Device ID bits

These bits are used with the DEV2:DEV0 bits in the Device ID Register 1 to identify the

part number.

0000 0101 = PIC18F2220/2320/4220/4320 devices

Note: These values for DEV10:DEV3 may be shared with other devices. The specific

device is always identified by using the entire DEV10:DEV0 bit sequence.

Legend:

R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’

- n = Value when device is unprogrammed u = Unchanged from programmed state

PIC18F2220/2320/4220/4320

23.2 Watchdog Timer (WDT)

For PIC18F2X20/4X20 devices, the WDT is driven by

the INTRC source. When the WDT is enabled, the

clock s ourc e is a ls o e nab le d. The nominal W D T p erio d

is 4 ms and has the same stability as the INTRC

oscillator.

The 4 ms period of the WDT is multiplied by a 16-bit

postscaler. Any output of the WDT postscaler is

selected by a multiplexer, controlled by bits in Configu-

ration Register 2H. Available periods range from 4 ms

to 131.072 seconds (2.18 minutes). The WDT and

post scaler are cleare d when any of the following events

occur: execute a SLEEP or CLRWDT instruction, the

IRCF bits (OSCCON<6:4>) are changed or a clock

failure has occurred.

Adjustm ents to the internal o scillator c lock pe riod using

the OSCTUNE register also affect the period of the

WDT by the same factor. For example, if the INTRC

period is increased by 3%, then the WDT period is

increased by 3%.

23.2.1 CONTROL REGISTER

Regi ste r 23-14 show s t he WDT CON re gi s te r. Th is is a

readable and writab le re gis ter which co nt a ins a co ntro l

bit that allows software to override the WDT enable

configuration bit, but only if the configuration bit has

disabled the WDT.

FIGURE 23-1: WDT BLOCK DIAGRAM

Note 1: The CLRWDT and SLEEP instructions

clear the WDT and postscaler counts

when executed.

2: Changing the setting of the IRCF bits

(OSCCON<6:4> clears the WDT and

postscaler counts.

3: When a CLRWDT instruction is executed,

the postscaler count will be cleared.

INTRC Source

WDT

Wake-up

Reset

WDT

WDT Counter

Progr amm able P ostscale r

1:1 to 1:32,768

Enable WDT

WDTPS<3:0>

SWDTEN

WDTEN

CLRWDT

from Sleep

Reset

All Device Resets

Sleep

INTRC Control

÷125

Change on IRCF bits

PIC18F2220/2320/4220/4320

TABLE 23-2: SUMMARY OF WATCHDOG TIMER REGISTERS

U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0

— — — — — — —SWDTEN

bit 7 bit 0

bit 7-1 Unimplemented: Read as ‘0’

bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit

1 = Watchdog Timer is on

0 = Watchdog Timer is off

Note 1: This bit has no ef fect if the con figuration bit, WDTEN (CON FIG2H<0>), is enabled.

Legend:

R = Readable bit W = Writ a ble bit

U = Unimplemented bit, re ad as ‘0’ - n = Value at POR

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

CONFIG2H — — — WDTPS3 WDTPS2 WDTPS2 WDTPS0 WDTEN

RCON IPEN — — RI TO PD POR BOR

WDTCON — — — — — — —SWDTEN

Legend: Shaded cells are not us ed by the Watchdo g Time r.

PIC18F2220/2320/4220/4320

23.3 Two-Speed Start-up

The Two-Speed Start-up feature helps to minimize the

latency period from oscillator st art-up to code execution

by allowing the microcontroller to use the INTRC oscil -

lator as a clo ck sourc e until the prim ary c loc k so urc e i s

available. It is enabled by setting the IESO bit in

Conf iguration Register 1H (CONFIG1H<7>).

T wo-Speed Start-up is available only if the primary oscil-

lator mode is LP, XT, HS or HSPLL (Crystal-based

modes). Other sources do not require a OST start-up

delay; for these, Two-Speed St art-up is di sabled.

When ena bled, Resets and wake- ups from Sleep mode

cause the device to configure it self to run from the inter-

nal oscillator block as the clock source, following the

time-out of the Power-up Timer after a POR Reset is

enabled . Thi s allo ws alm ost imme diate c ode ex ecutio n

while the primary oscillator starts and the OST is run-

ning. On ce the OST times ou t, the device automat ically

switches to PRI_RUN mode.

Because the OSCCON register is cleared on Reset

event s , the IN T O SC (or pos t s ca ler) clock source is not

initially available after a Reset event; the INTRC clock

is used directly at its base frequency. To use a higher

clock speed on wake-up, the INTOSC or postscaler

clock sour ces can be sele cted to provide a higher cloc k

speed by setting bits IFRC2:IFRC0 immediately after

Reset. For wake-ups from Sleep, the INTOSC or

postscaler clock sources can be selected by setting

IFRC2:IFRC0 prior to entering Sleep mode.

In all other power managed modes, T wo-Speed S tart-up

is not used. The device will be clocked by the currently

selected clock source until the primary clock source

becomes available. The setting of the IESO bit is

ignored.

23.3.1 SPECIAL CONSIDERATIONS FOR

USING TWO-SPEED START-UP

While using the INTRC oscillator in T wo-Speed S tart-up,

the device still obeys the normal command sequences

for entering power managed modes, including serial

SLEEP instructions (refer to Section 3.1.3 “Multiple

Sleep Commands”). In practice, this means that user

code can change the SCS1:SCS0 bit settings and issue

SLEEP commands b efore the OST times out. This would

allow an application to briefly wake-up, perform routine

“housekeeping” tasks and return to Sleep before the

device starts to operate from the primary oscilla tor.

User code can a lso c heck if t he primar y clo ck s our ce i s

currently providing th e system cloc king by check ing the

status of the OSTS bit (OSCCON<3>). If the bit is set,

the primary oscillator is providing the system clock.

Otherwise, the internal oscillator block is providing the

clock during wake-up from Reset or Sleep mode.

FIGURE 23-2: TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL)

Q1 Q3 Q4

OSC1

Peripheral

Program PC PC + 2

INTOSC

PLL Clock

PC + 6

Output

Q3 Q4 Q1

CPU Clock

PC + 4

Clock

Counter

Q2 Q2 Q3 Q4

Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale.

Wake from Interrupt Event

TOST(1) TPLL(1)

12345678

Clock Transition

OSTS bit Set

Multiplexer

PIC18F2220/2320/4220/4320

23.4 Fail-Safe Clock Monitor

The Fail-Safe Clock Monitor (FSCM) allows the micro-

controller to continue operation, in the event of an

external oscillator failure, by automatically switching

the system clock to the internal oscillator block. The

FSCM function is enabled by setting the Fail-Safe

Clock Monitor Enable bit, FCMEN (CONFIG1H<6>).

When FSCM is enabled, the INTRC oscillator runs at

all times to monitor clocks to peripherals and provide

an instant backup clock in the event of a clock failure.

Clock monitoring (shown in Figure 23-3) is accom-

plished by creating a sample clock signal, which is the

INTRC output divided by 64. This allows ample time

between FSCM sample clocks for a peripheral clock

edge to occur. The peripheral system clock and the

sample clock are presented as inputs to the Clock Mon-

itor latch (CM). Th e CM i s se t o n the fallin g e dg e o f th e

system clock source but cleared on the rising edge of

the sa mple clock.

FIGURE 23-3: FSCM BLOCK DIAGRAM

Clock failure is te sted on th e fallin g edge of th e sampl e

clock. If a sample clock falling edge occurs while CM is

still set, a clock failure has been detec ted (Figure 23-4).

This causes the following:

• The FSCM gene rates an osci llator fail in terrupt by

setting bit, OSCFIF (PIR2<7>)

• The system clock source is swit ched t o the

internal oscillator block (OSCCON is not updated

to show the current clock source – this is the

fail-safe condition)

•The WDT is reset

Since the postscaler frequency from the internal oscil-

lator block may not be sufficiently stable, it may be

desirable to select another clock configuration and

enter an alternate power managed mode (see

Section 23.3.1 “Special Considerations for Using

Two-Speed Start-up” and Section 3.1.3 “Multiple

Sleep Commands” for more details). This can be

done to attempt a partial recovery or execute a

controlled shutdown.

To use a higher clock speed on wake-up, the INTOSC

or postscaler clock sources can be selected to provide

a higher clock speed by setting bits IFRC2:IFRC0

immediate ly a fter Res et. Fo r wak e-up s fro m Sle ep, th e

INTOSC or postscaler clock sources can be selected

by setting IFRC2:IFRC0 prior to entering Sleep mode.

Adjustments to the internal oscillator block using the

OSCTUNE register also affect the period of the FSCM

by the same factor. This can usually be neglected, as

the cloc k freq uen cy be ing monitored is generally m uc h

higher than the sample clock frequency.

The FS CM will dete ct failure s of the p rimary or sec ond-

ary clock sources only. If the internal oscillator block

fails, no failure would be detected, nor would any actio n

be possible.

23.4.1 FSCM AND THE WATCHDOG T IMER

Both the FSCM and the WDT are clocked by the

INTRC oscillator. Since the WDT operates with a sep-

arate divider and counter, disabling the WDT has no

effe ct on the operation of the INTRC oscillator when the

FSCM is enabled.

As already noted, the clock source is switched to the

INTOSC clock when a clock failure is detected.

Depending on the frequency selected by the

IRCF2:IRCF0 bits, this may mean a substantial change

in the speed of code execution. If the WDT is enabled

with a small prescale value, a decrease in clock speed

allows a WDT time-out to occur and a subsequent

device Reset. For this reason, fail-safe clock events

also reset the WDT and postscaler, allowing it to start

timing from when execution speed was changed and

decreasing the likelihood of an erroneous time-out.

Peripheral

INTRC ÷ 64

(32 μs) 488 Hz

(2.048 ms)

Clock Monitor

Latch (CM)

(edge-triggered)

Clock

Failure

Detected

Source

Clock

PIC18F2220/2320/4220/4320

23.4.2 EXITING FAIL-SAFE OPERATION

The fail-safe condition is terminated by either a device

Reset or by entering a power managed mode. On Reset,

the controller starts the primary clock source specified in

Configuration Register 1H (with any required start-up

delays that are requ ired for the oscillat or mode, such as

OST or PLL timer). The INTOSC multiplexer provides the

system clock until the primary clock source becomes

ready (similar to a Two-speed Start-up). The clock system

source is then switched to the primary clock (indicated by

the OSTS bit in the OSCCON register becoming set). The

Fail-Safe Clock Monitor then resumes monitoring the

peripheral clock.

The primary clock source may never b ecome ready dur-

ing start-up. In this case, operation is clocked by the

INTOSC multiplexer . The OSCCON register will remain in

its Reset state until a power managed mode is entered.

Entering a power managed mode by loading the

OSCCON register and executing a SLEEP instruction

will clear the fail-safe condition. When the fail-safe

condition is cleared, the clock monitor will resume

monitoring the peripheral clock.

FIGURE 23-4: FSCM TIMING DIAGRAM

OSCFIF

CM Output

System

Clock

Output

Sample Clock

Failure

Detected

Oscillator

Failure

Note: The system clock is normally at a much higher frequency than the sample clock. T he relative frequencies in

this example have been chosen for clarity.

(Q)

CM Test CM Test CM Test

PIC18F2220/2320/4220/4320

23.4.3 FSCM INTERRUPTS IN POWER

MANAGED MODES

As previously mentioned, entering a power managed

mode clears the fail-safe condition. By entering a

power managed mode, the clock multiplexer selects

the clock source selected by the OSCCON register.

Fail-safe monitoring of the power managed clock

sour ce res ume s in the powe r mana ged mode.

If an oscillator failure occurs during power managed

operation, the subsequent events depend on whether

or not the oscillator failure interrupt is enabled. If

enabled (OSCFIF = 1), code execution will be clocked

by the INTOSC multiplexer. An automatic transition

back to the failed clock source will not occur.

If the interrupt is disabled, the device will not exit the

power managed mode o n oscillat or failure . Instead , the

device will cont inue to operat e as before bu t clocked b y

the INTOSC multiplexer. While in Idle mode, subse-

quent interrupts will cause the CPU to begin executing

instructions while being clocked by the INTOSC multi-

plexer. The de vi ce w ill no t tra ns iti on to a dif f e rent clock

source until the fail-safe condition is cleared.

23.4.4 PO R OR WAKE FROM SLEEP

The FS CM is d esigned to d etect oscillato r failure at any

point after the device has exited Power-on Reset

(POR) or Low-Power Sleep mode. When the primary

system clock is EC, RC or INTRC modes, monitoring

can begin immediately following these events.

For oscillator modes involving a crystal or resonator

(HS, HSPLL, LP or XT), the situation is somewhat dif-

ferent. Since the oscillator may require a start-up time

consid erably longer th an the FCSM s ample clock tim e,

a false clock failure may be detected. To prevent this,

the internal oscillator block is automatically configured

as the system clock and functions until the primary

clock is stable (the OST and PLL timers have timed

out). This is identical to Two-Speed Start-up mode.

Once the primary clock is stable, the INTRC returns to

its role as the FSCM source.

As not ed in Section 23.3.1 “Special Considerations

for Using Two-Speed Start-up”, it is also possible to

select another clock configuration and enter an alter-

nate power managed mode while waiting for the pri-

mary system clock to become stable. When the new

powere d manag ed mode is selecte d, th e primary cl ock

is disabled.

Note: The sa me logi c tha t prevents false oscill a-

tor failure interrupts on POR or wake from

Sleep wi ll also preven t the detect ion of the

oscillator’s failure to start at all following

these events. This can be avoided by

monitoring the OSTS bit and using a tim-

ing routine to determine if the oscillator is

taking too long to start. Even so, no

oscillator failure interrupt will be flagged.

PIC18F2220/2320/4220/4320

23.5 Program Verification and

Code Protection

The overall structure of the code protection on the

PIC18 Flash devices differs significantly from other

PICmicro® devices.

The user program memory is divided into five blocks.

One of these is a boot block of 512 bytes. The remain-

der of the memory is divided into four blocks on binar y

boundaries.

Each of the five blocks has three code protection bits

associated with them. They are:

• Code-Protect bit (CPn)

• Write-Protect bit (WRTn)

• External Block Table Read bit (EBTRn)

Figure 23-5 shows the program memory organization

for 4 and 8-Kbyte de vice s and the specifi c code protec -

tion bit associated with each block. The actual locations

of the bits are summarized in Table 23-3.

FIGURE 23-5: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2X20/4X20

TABLE 23-3: SUMMARY OF CODE PROTECTION REGISTERS

MEMORY SIZE/DEVICE Block Code Protection

Controlled By:

4Kbytes

(PIC18F2220/4220) 8Kbytes

(PIC18F2320/4320) Address

Range

Boot Block Boot Block 000000h

0001FFh CPB, WRTB, EBTRB

Block 0 Block 0 000200h

0007FFh CP0, WRT0, EBTR0

Block 1 Block 1 000800h

000FFFh CP1, WR T1 , EBTR1

Unimplemented

Read ‘0’s Block 2 001000h

0017FFh CP2, WRT2, EBTR2

Unimplemented

Read ‘0’s Block 3 001800h

001FFFh CP3, WR T3 , EBTR3

Unimplemented

Read ‘0’s Unimplemented

Read ‘0’s

002000h

1FFFFFh

(Unimplemented Memory Space)

File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

300008h CONFIG5L ———— CP3 CP2 CP1 CP0

300009h CONFIG5H CPD CPB — — — — — —

30000Ah CONFIG6L ———— WRT3 WRT2 WRT1 WRT0

30000Bh CONFIG6H WRTD WRTB WRTC — — — — —

30000Ch CONFIG7L ———— EBTR3 EBTR2 EBTR1 EBTR0

30000Dh CONFIG7H — EBTRB — — — — — —

Legend: Shaded cells are unimplemented.

PIC18F2220/2320/4220/4320

23.5.1 PROGRAM MEMORY

CODE PROTECTION

The program memory may be read to or written from

any location using the table read and table write

instructions. The device ID may be read with table

reads. The configuration registers may be read and

written with the table read and table write instructions.

In normal execution mode, the CPn bits have no direct

effect. CPn bits inhibit external reads and writes. A

block of user memory may be protected from table

writes if the WRTn configuration bit is ‘0’. The EBTRn

bits control table reads. For a block of user memory

with the EBTRn bit set to ‘0’, a table read instruction

that executes from within that block is allowed to read.

A table read instruction that executes from a location

outside of that block is not allowed to read and will

result in reading ‘0’s. Figures 23-6 through 23-8

illustrate table write and table read protection.

FIGURE 23-6: TABLE WRITE (WRTn) DISALLOWED

Note: Code protection bits may only be written to

a ‘0’ from a ‘1’ state. It is not possible to

write a ‘1’ to a bit in the ‘0’ st ate. Code pr o-

tection bits are only set to ‘1’ by a full chip

erase or block erase f unction. The full c hip

erase and block erase functions can only

be initiated via ICSP or an external

programmer.

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 01

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLWT *

TBLPTR = 0002FFh

PC = 0007FEh

TBLWT *

PC = 0017FEh

Results: All table writes disabled to Blockn whenever WRTn = 0.

PIC18F2220/2320/4220/4320

FIGURE 23-7: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED

FIGURE 23-8: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WR T0, EBTR0 = 10

WR T1, EBTR1 = 11

WR T2, EBTR2 = 11

WR T3, EBTR3 = 11

TBLRD *

TBLP TR = 0002F Fh

PC = 000FFEh

Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0.

TABLAT register returns a value of ‘0’.

000000h

0001FFh

000200h

0007FFh

000800h

000FFFh

001000h

0017FFh

001800h

001FFFh

WRTB, EBTRB = 11

WRT0, EBTR0 = 10

WRT1, EBTR1 = 11

WRT2, EBTR2 = 11

WRT3, EBTR3 = 11

TBLRD *

TBLPTR = 0002FFh

PC = 0007FEh

Results: Table reads permitted within Blockn, even when EBTRBn = 0.

TABLAT register returns the value of the data at the location TBLPTR.

PIC18F2220/2320/4220/4320

23.5.2 DATA EEPROM

CODE PROTECTION

The entire data EEPROM is protected from external

reads and writes by two bits: CPD and WRTD. CPD

inhibits external reads and writes of data EEPROM.

WRTD inhibits external writes to data EEPROM. The

CPU can continue to read and write data EEPROM

regardless of the protection bit settings.

23.5.3 CONFIGURATION REGISTER

PROTECTION

The con figurat ion registers can be write-pro tected. Th e

WRTC bit controls protection of the configuration

registers. In normal execution mode, the WRTC bit is

readable only. WRTC can only be written via ICSP or

an external programmer.

23.6 ID Locations

Eight memo ry loc ation s (200 000h-20 0007h ) are de sig-

nated as ID loc ati ons , whe re the user can s tore ch ec k-

sum or other code identification numbers. These

locatio ns are b oth read abl e a nd w ri table durin g no rma l

execution through the TBLRD and TBLWT instructions,

or du r ing p r ogr am / ve rif y. Th e ID lo cat io n s c a n be r e ad

when the de vice is code-protected.

23.7 In-Circuit Serial Progra mming

PIC18F2X20/4X20 microcontrollers can be serially

progra mmed w hile in t he en d app licati on c ircuit. This i s

simply done with tw o lines for cl ock and data and thre e

other lines for power, ground and the programming

voltage. This allows customers to manufacture boards

with unprogrammed devices and then program the

microcontroller just before shipping the product. This

also allows the most recent firmware or a custom

firmware to be programmed (see Table 23-5).

23.8 In-Circuit Debugger

When the DEBUG bit in configuration register,

CONFIG4L, is programmed to a ‘0’, the In-Circuit

Debug ger fun ct ion ali ty is enabled. This fun ct ion allo w s

simple debugging functions when used with MPLAB®

IDE. When the microcontroller has this feature

enabled, some resources are not available for general

use. Table 23-4 shows which resources are required by

the background debugger.

TABLE 23-4: DEBUGGER RESOURCES

To use the In-Circuit Debugger function of the micro-

controller, the design must implement In-Circuit Serial

Programming connections to MCLR/VPP, VDD, VSS,

RB7 and RB6. This will interface to the In-Circuit

Debugger module available from Microchip or one of

the third party develop m ent tool companies.

23.9 Low-Voltage ICSP Programming

The LVP bit in Configuration Register 4L

(CONFIG4L<2>) enables Low-Vo ltage ICSP Program-

ming (LVP). When LVP is enabled, the microcontroller

can be programmed without requiring high voltage

being applied to the MCLR/VPP pi n, bu t t h e R B 5/P G M

pin is then dedi cated to c ontrolling Program mod e entry

and is not available as a general purpose I/O pin.

LVP is enabled in erased devices.

While programming using LVP, VDD is applied to the

MCLR/VPP pin as in normal execution mode. To enter

Programming mode, VDD is applied to the PGM pin.

If Low-Voltage ICSP Programming mode will not be

used, the LVP bit can be cleared and RB5/PGM

become s a vaila ble as the dig ita l I/O p in, RB5. Th e LVP

bit may be set or cleared only when using standard

high-voltage programming (VIHH applied to the MCLR/

VPP pin). Once LVP has been disabled, only the stan-

dard high-voltage programming is available and must

be used to program the device.

Memory that is not code -protected ca n be erased usin g

either a b lock erase, or erased ro w by row, then writte n

at any s pecified VDD. If co de-protected m emory is to be

erased, a block erase is required. If a block erase is to

be performed when using Low-Voltage Programming,

the device must be supplied with VDD of 4.5V to 5.5V.

TABLE 23-5: ICSP/ICD CONNECTIONS

I/O pins: RB6, RB7

Stack: 2 levels

Program Me mory: 512 by tes

Data Memory: 10 bytes

Note 1: High-voltage programming is always

available, regardless of the state of the

LVP bit or the PGM pin, by applying VIHH

to the MCLR pin.

2: When Low-Voltage Programming is

enabled, the RB5 pin can no longer be

used as a general purpose I/O pin.

3: When LVP is enabled, externally pull the

PGM pin to VSS to allow normal program

execution.

Signal Pin Notes

PGD RB7

May require is olation from

application circuits

PGC RB6

MCLR MCLR

VDD VDD

VSS VSS

PGM RB5 Pull RB5 low if LVP is enabled

PIC18F2220/2320/4220/4320

24.0 INSTRUCTION SET SUMMARY

The PIC18 ins truction set adds many enhanc ements to

the previous PICmicro instruction sets, while maintain-

ing an easy migration from these PICmicro instruction

sets.

Most instructions are a single program memory word

(16 bit s) but there are three instructions that require two

program memory locations.

Each single-word instruction is a 16-bit word divided

into an o pcode, whi ch specifies the instructi on type and

one or more operands, which further specify the oper-

ation of the instruction.

The instruction set is highly orthogonal and is grouped

into four basic categories:

•Byte-oriented operations

•Bit-oriented operations

•Literal operati ons

•Control operations

The PIC18 instruction set summary in Table 24-2 lists

byte-oriented, bit-oriented, literal and control opera-

tions. Table 24-1 shows the opcode field descriptions.

Most byte-oriented in str uct ions have t hree op erands:

1. The file register (specified by ‘f’)

2. The destination of the result

(specified by ‘d’)

3. The access ed memory

(specified by ‘a’)

The file register designator ‘f’ specifies which file

The destination designator ‘d’ specifies where the

result of the operation is to be placed. If ‘d’ is zero, the

result is placed in the WREG register. If ‘d’ is one, the

result is placed in the file register specified in the

instruction.

All bit-oriented instructions have three operands:

1. The file register (specified by ‘f’)

2. The bit in the file register

(specified by ‘b’)

3. The access ed memory

(specified by ‘a’)

The bit field design ator ‘b’ sele cts the numb er of the bit

affected by the operation, while the file register desig-

nator ‘f’ represents the number of the file in which the

bit is located.

The literal instructions may use some of the following

operands:

• A literal value to be loaded into a file register

(specified by ‘k’)

• The desired FSR r egister to load the literal value

into (specified by ‘f’)

• No operan d requi red

(specified by ‘—’)

The control instruct ions may u se some of t he followin g

operands:

• A program memory address (specified by ‘n’)

• The mode of the CALL or RETURN instructions

(specified by ‘s’)

• The mode of the table read and table write

ins tructions (specif ied by ‘m’)

• No operand requir ed

(specified by ‘—’)

All instructions are a single word except for three dou-

ble word instructions. These three instructions were

made double word instructions so that all the required

information is available in these 32 bits. In the second

word, the 4 MSbs are ‘1’s. If this second word is

exec uted as a n ins truc tio n (b y itsel f), i t wil l ex ecut e as

a NOP.

All single-word instructions are executed in a single

inst ruc tion c yc le , un le ss a conditional te st is true o r th e

program counter is changed as a result of the instruc-

tion. In th ese cases, the execution takes two i nstruction

cycles with the additional instruction cycle(s) executed

as a NOP.

The doubl e word instru ctions ex ecute in two i nstructio n

cycles.

One in struction cycle consist s of f our oscil lator peri ods.

Thus, for an oscillator frequency of 4 MHz, the normal

instruction execution time is 1 μs. If a conditional test is

true, or the program counter is changed as a result of

an instruction, the instruction execution time is 2 μs.

Two-word branch instructions (if true) would take 3 μs.

Figure 24-1 shows the general formats that the

inst ruc t ion s can have .

All examp le s us e the fo rma t ‘nnh’ to represent a hexa-

decimal number, where ‘h’ signifies a hexadecimal

digit.

The Instruction Set Summary, shown in Table 24-2,

lists the instructions recognized by the Microchip

Assembler (MPASMTM). Section 24.2 “Instruction

Set” provides a description of each instruction.

24.1 READ-MODIFY-WRITE OPERATIONS

Any instruction that specifies a file register as part of

the instruction performs a Read-Modify-Write (R-M-W)

operatio n. The register i s read, the dat a is modifie d and

the result is stored ac cording to ei ther the inst ruction or

the destination designator ‘d’. A read operation is per-

formed on a reg ister even if the instructi on writes to that

For example, a “BCF PORTB,1” instruction will read

PORTB, clear bit 1 of the data, then write the result

back to PORTB. The read operation would have the

unintended result that any condition that sets the RBIF

flag would be cleared. The R-M-W operation may also

copy the level of an input pin to its corresponding output

latch.

PIC18F2220/2320/4220/4320

TABLE 24-1: OPCODE FIELD DESCRIPTIONS

Field Description

aRAM access bit:

a = 0: RAM location in Access RAM (BSR register is ignored)

a = 1: RAM bank is specified by BSR register

bbb Bit address within an 8-bit file register (0 to 7).

BSR Bank Select Register. Used to select the current RAM bank.

dDestination select bit:

d = 0: store result in WREG

d = 1: store result in file register f

dest Destination either the WREG register or the specified register file location.

f8-bit register file address (0x00 to 0xFF).

fs 12-bit register file address (0x000 to 0xFFF). This is the source address.

fd 12-bit register file address (0x000 to 0xFFF). This is the destination address.

kLiteral field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value).

label Label name.

mm The mode of the TBLPTR register for the table read and table write instructions.

Only used with table read and table write instructions:

*No Change to register (such as TBLPTR with table reads and writes).

*+ Post-Increment register (suc h as TBLPTR with table reads and writes).

*- Post-Decrement register (such as TBLPTR with table reads and writes).

+* Pre-Increment register (such as TBLPTR with table reads and writes).

nThe relative address (2’s complement number) for relative branch instructions, or the direct address for

Call/Branch and Return instructions.

PRODH Product of Multiply High Byte.

PRODL Product of Multiply Low Byte.

sFast Call/Return mode select bit:

s = 0: do not update into/from shadow registers

s = 1: certain registers loaded into/from shadow registers (Fast mode)

uUnused or Unchanged.

WREG Working register (accumulator).

xDon't care (‘0’ or ‘1’) .

The assembler will generate code with x = 0. It is the recomm ended form of use for compatibility with all

Microchip software tools.

TBLPTR 21-bit Table Pointer (points to a Program Memory location).

TABLAT 8-bit Table Latch.

TOS Top-of-Stack.

PC Program Counter.

PCL Program Counter Low Byte.

PCH Program Counter High Byte.

PCLATH Program Counter High Byte Latch.

PCLATU Program Counter Upper Byte Latch.

GIE Global Interrupt Enable bit.

WDT Watchdog Timer.

TO Time-out bit.

PD Power-down bit.

C, DC, Z, OV, N ALU status bits Carry, Digit Carry, Zero, Overflow, Negative.

[ ] Optional.

( ) Contents.

→Assigned to.

< > Register bit field.

∈In the set of.

italics User defined term (font is courier).

PIC18F2220/2320/4220/4320

FIGURE 24-1: GENERAL FORMAT FOR INSTRUCTIONS

Byte-oriented file register operations

15 10 9 8 7 0

d = 0 for result destination to be WREG register

OPCODE d a f (FILE #)

d = 1 for result destina tion to be file register (f)

a = 0 to force Acces s B ank

Bit-oriented file register operations

15 12 11 9 8 7 0

OPCODE b (BIT #) a f (FILE #)

b = 3-bit position of bit in file register (f)

Literal operations

15 8 7 0

OPCODE k (literal)

k = 8-bit immediate value

Byte to Byte move operations (2-word)

15 12 11 0

OPCODE f (Source FILE #)

CALL, GOTO and Branch operations

15 8 7 0

OPCODE n<7:0> (literal)

n = 20-bit immediate value

a = 1 for BSR to select bank

f = 8-bit file register address

a = 0 to force Access Bank

a = 1 for BSR to select bank

f = 8-bit file register address

15 12 11 0

1111 n<19:8> (literal)

15 12 11 0

1111 f (Destina tion FILE #)

f = 12-bit file register address

Control operations

Example Instruction

ADDWF MYREG, W, B

MOVFF MYREG1, MYREG2

BSF MYREG, bit, B

MOVLW 0x7F

GOTO Label

15 8 7 0

OPCODE n<7:0> (literal)

15 12 11 0

n<19:8> (literal)

CALL MYFUNC

15 11 10 0

OPCOD E n<10:0> ( li t e r a l )

S = Fast bit

BRA MYFUNC

15 8 7 0

OPCODE n<7:0> (literal) BC MYFUNC

PIC18F2220/2320/4220/4320

TABLE 24-2: PIC18FXXX INSTRUCTION SET

Mnemonic,

Operands Description Cycles 16-Bit Instruction Word Status

Affected Notes

MSb LSb

BYTE-ORIENTED FILE REGISTER OPERATIONS

ADDWF

ADDWFC

ANDWF

CLRF

COMF

CPFSEQ

CPFSGT

CPFSLT

DECF

DECFSZ

DCFSNZ

INCF

INCFSZ

INFSNZ

IORWF

MOVF

MOVFF

MOVWF

MULWF

NEGF

RLCF

RLNCF

RRCF

RRNCF

SETF

SUBFWB

SUBWF

SUBWFB

SWAPF

TSTFSZ

XORWF

f, d, a

f, a

f, d, a

f, a

f, d, a

fs, fd

f, a

f, d, a

f, a

f, d, a

f, a

f, d, a

Add WREG and f

Add WREG and Carry bit to f

AND WREG with f

Clear f

Comple ment f

Compare f with WREG, skip =

Compare f with WREG, skip >

Compare f with WREG, skip <

Decrement f

Decrement f, Skip if 0

Decrement f, Skip if Not 0

Increment f

Increment f, Skip if 0

Increment f, Skip if Not 0

Inclusive OR WREG with f

Move f

Move fs (source) to 1st word

fd (destinati on) 2nd word

Move WREG to f

Multipl y WR EG with f

Negate f

Rotate Left f through Carry

Rotate Left f (No Carry)

Rotate Right f through Carry

Rotate Right f (No Carry)

Set f

Subtract f from WREG with

borrow

Subtract WREG from f

Subtract WREG from f with

borrow

Swap nibbles in f

Test f, skip if 0

Exclusive OR WREG with f

1 (2 or 3)

0010

0001

0110

0001

0110

0000

0010

0100

0010

0011

0100

0001

0101

1100

1111

0110

0000

0110

0011

0100

0011

0100

0110

0101

0011

0110

0001

01da

00da

01da

101a

11da

001a

010a

000a

01da

11da

10da

11da

10da

00da

ffff

111a

001a

110a

01da

00da

100a

01da

11da

10da

011a

10da

ffff

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

None

C, DC, Z, OV, N

None

Z, N

None

C, DC, Z, OV, N

C, Z, N

Z, N

C, Z, N

Z, N

None

C, DC, Z, OV, N

None

Z, N

1, 2

1,2

1, 2

1, 2, 3, 4

1, 2

1, 2, 3, 4

1, 2

BIT-ORIENTED FILE REGISTER OPERATIONS

BCF

BSF

BTFSC

BTFSS

BTG

f, b, a

f, d, a

Bit Clear f

Bit Set f

Bit Test f, Skip if Clear

Bit Test f, Skip if Set

Bit Toggle f

1 (2 or 3)

1001

1000

1011

1010

0111

bbba

ffff

None

1, 2

3, 4

1, 2

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless th e first word of th e instructi on retrieve s the inform ation embedd ed in these 16 bits . This ens ures that all

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

PIC18F2220/2320/4220/4320

CONTROL OPERATIONS

BNC

BNN

BNOV

BNZ

BOV

BRA

CALL

CLRWDT

DAW

GOTO

NOP

POP

PUSH

RCALL

RESET

RETFIE

RETLW

RETURN

SLEEP

n, s

—

Branch if Carry

Branch if Negative

Branch if Not Carry

Branch if Not Negative

Branch if Not Overflow

Branch if Not Zero

Branch if Overflow

Branch Unconditionally

Branch if Zero

Call subroutine 1st word

2nd word

Clear Watchdog Timer

Deci mal Adjust WREG

Go to address 1st word

2nd word

No Operation

No Operation (Note 4)

Pop top of return stack (TOS)

Push top of return stack (TOS)

Relative Call

Software dev ic e Reset

Return from interrupt enable

Return with literal in WREG

Return from Subroutine

Go into Standby mode

1 (2)

1110

1101

1110

1111

0000

1110

1111

0000

1111

0000

1101

0000

0010

0110

0011

0111

0101

0001

0100

0nnn

0000

110s

kkkk

0000

1111

kkkk

0000

xxxx

0000

1nnn

0000

1100

0000

nnnn

kkkk

0000

kkkk

0000

xxxx

0000

nnnn

1111

0001

kkkk

0001

0000

nnnn

kkkk

0100

0111

kkkk

0000

xxxx

0110

0101

nnnn

1111

000s

kkkk

001s

0011

None

TO, PD

C, DC

None

All

GIE/GIEH,

PEIE/GIEL

None

TO, PD

TABLE 24-2: PIC18FXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles 16-Bit Instruction Word Status

Affected Notes

MSb LSb

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless th e first word of th e instructi on retrieve s the inform ation emb edded in these 16 bits . This ens ures that al l

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

PIC18F2220/2320/4220/4320

LITERAL OPERATIONS

ADDLW

ANDLW

IORLW

LFSR

MOVLB

MOVLW

MULLW

RETLW

SUBLW

XORLW

f, k

Add literal and WREG

AND literal with WREG

Inclusive OR literal with WREG

Move literal (12-bit) 2nd word

to FSRx 1st word

Move literal to BSR<3:0>

Move literal to WREG

Multipl y literal w ith WREG

Return with literal in WREG

Subtract WREG from literal

Exclusive OR literal with

WREG

0000

1110

1111

0000

1111

1011

1001

1110

0000

0001

1110

1101

1100

1000

1010

kkkk

00ff

kkkk

0000

kkkk

C, DC, Z, OV, N

Z, N

None

C, DC, Z, OV, N

Z, N

DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS

TBLRD*

TBLRD*+

TBLRD*-

TBLRD+*

TBLWT*

TBLWT*+

TBLWT*-

TBLWT+*

Table Read

Table Read with post-increment

Table Read with post-decrement

Table Read with pre-increment

Table Write

Table Write with post-increment

Table Write with post-decrement

Table Write with pre-increment

2 (5)

0000

1000

1001

1010

1011

1100

1101

1110

1111

None

TABLE 24-2: PIC18FXXX INSTRUCTION SET (CONTINUED)

Mnemonic,

Operands Description Cycles 16-Bit Instruction Word Status

Affected Notes

MSb LSb

Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that

value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is

driven low by an external device, the data will be written back with a ‘0’.

2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared

if assigned.

3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The

second cycle is executed as a NOP.

4: Some instructions are 2-word instructions. The second word of these instructions will be executed as a NOP

unless th e first word of th e instructi on retrieve s the inform ation embedd ed in these 16 bits . This ens ures that all

program memory locations have a valid instruction.

5: If the table write starts the write cycle to internal memory, the write will continue until terminated.

PIC18F2220/2320/4220/4320

24.2 Instruction Set

ADDLW ADD literal to W

Syntax: [ label ] ADDLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) + k → W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1111 kkkk kkkk

Desc ription: The c ontents of W are added to the

8-bit literal ‘k’ and the result is

placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Wri te to W

Example:ADDLW 0x15

Before Instruction

W = 0x10

After Instruction

W = 0x25

ADDWF ADD W to f

Syntax: [ label ] ADDWF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) + (f) → dest

Status Affecte d: N, OV, C, DC, Z

Encoding: 0010 01da ffff ffff

Description: Add W to register ‘f’. If ‘d’ is ‘0’, the

result is store d in W. If ‘d’ is ‘1’, the

result is stored back in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank will be selected. If ‘a’ is ‘1’,

the BSR is used.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:ADDWF REG, W

Before Instruc tio n

W = 0x17

REG = 0xC2

After Instruction

W=0xD9

REG = 0xC2

PIC18F2220/2320/4220/4320

ADDWFC ADD W and Carry bit to f

Syntax: [ label ] ADDWFC f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) + (f) + (C) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0010 00da ffff ffff

Description: Add W, the Carry flag and data

memory location ‘f’. If ‘d’ is ‘0’, the

result is placed in W. If ‘d’ is ‘1’, the

resu lt is pla ced in da ta me mory lo ca -

tion ‘f’. If ‘a’ is ‘0’, the Access Bank

will be sel ec ted . If ‘a’ is ‘1’, the BSR

will not be overrid den .

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:ADDWFC REG, W

Before Instruction

Carry bit = 1

REG = 0x02

W = 0x4D

After Instruction

Carry bit = 0

REG = 0x02

W = 0x50

ANDLW AND literal with W

Syntax: [ label ] ANDLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .AND. k → W

St at us Af fe cte d: N, Z

Encoding: 0000 1011 kkkk kkkk

Description: The contents of W are ANDed with

the 8-bit literal ‘k’. The result is

placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’ Process

Data Write to W

Example:ANDLW 0x5F

Before Instruc tio n

W=0xA3

After Instruction

W = 0x03

PIC18F2220/2320/4220/4320

ANDWF AND W with f

Syntax: [ label ] ANDWF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .AND. (f) → dest

Status Affected: N, Z

Encoding: 0001 01da ffff ffff

Desc ription: The co ntents of W are AND’ed with

stored in W. If ‘d’ is ‘1’, the result is

stored back in register ‘f’ (default).

If ‘a’ is ‘0’, the Access Bank will be

selected. If ‘a’ is ‘1’, the BSR will

not be overridden (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:ANDWF REG, W

Before Instruction

W = 0x17

REG = 0xC2

After Instruction

W = 0x02

REG = 0xC2

BC Bra nch if Carry

Syntax: [ label ] BC n

Operands: -128 ≤ n ≤ 127

Operation: if carry bit is ’1’

(PC) + 2 + 2n → PC

St at us Af fe cte d: No ne

Encoding: 1110 0010 nnnn nnnn

Description: If the Carry bit is ‘1’, then the

progr am w ill branc h.

The 2’s complement nu mber ‘2n’ i s

added to the PC. Since the PC will

have incremented to fetch the next

instruc tion, the n ew a ddr ess will be

PC+2+2 n. This inst ruction is th en a

two- cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump :Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BC JUMP

Before Instruc tio n

PC = address (HERE)

After Instruction

If Carry = 1;

PC = address (JUMP)

If Carry = 0;

PC = address (HERE+2)

PIC18F2220/2320/4220/4320

BCF Bit Clear f

Syntax: [ label ] BCF f,b[,a]

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: 0 → f

Status Affected: None

Encoding: 1001 bbba ffff ffff

Description: Bit ‘b’ in register ‘f’ is cleared. If ‘a’

is ‘0’, the Access Bank will be

selec ted, over riding the BSR value .

If ‘a’ = 1, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:BCF FLAG_REG, 7

Before Instruction

FLAG_R EG = 0xC 7

After Instruction

FLAG_REG = 0x47

BN Branch if Negative

Syntax: [ label ] BN n

Operands: -128 ≤ n ≤ 127

Operation: if negative bit is ’1’

(PC) + 2 + 2n → PC

St at us Af fe cte d: No ne

Encoding: 1110 0110 nnnn nnnn

Description: If the Negative bit is ‘1’, then the

progr am w ill branc h.

The 2’s complement nu mber ‘2n’ i s

added to the PC. Since the PC will

have incremented to fetch the next

instruc tion, the n ew a ddr ess will be

PC+2+2 n. This inst ruction is th en a

two- cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump :Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BN Jump

Before Instruc tio n

PC = address (HERE)

After Instruction

If Negative = 1;

PC = address (Jump)

If Negative = 0;

PC = address (HERE+2)

PIC18F2220/2320/4220/4320

BNC Branch if Not Carry

Syntax: [ label ] BNC n

Operands: -128 ≤ n ≤ 127

Operation: if carry bit is ’0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0011 nnnn nnnn

Description: If the Carry bit is ‘0’, then the

program will branch.

The 2’s co mp lem en t nu mb er ‘ 2n’ is

added to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC+2+2 n. This inst ructio n is t hen a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump: Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BNC Jump

Before Instruction

PC = address (HERE)

After Instruction

If Carry = 0;

PC = address (Jump)

If Carry = 1;

PC = address (HERE+2)

BNN Branch if Not Negative

Syntax: [ label ] BNN n

Operands: -128 ≤ n ≤ 127

Operation: if negative bit is ’0’

(PC) + 2 + 2n → PC

St at us Af fe cte d: No ne

Encoding: 1110 0111 nnnn nnnn

Description: If the Negative bit is ‘0’, then the

progr am w ill branc h.

The 2’s complement nu mber ‘2n’ i s

added to the PC. Since the PC will

have incremented to fetch the next

instruc tion, the n ew a ddr ess will be

PC+2+2 n. This inst ruction is th en a

two- cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump :Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BNN Jump

Before Instruc tio n

PC = address (HERE)

After Instruction

If Negative = 0;

PC = address (Jump)

If Negative = 1;

PC = address (HERE+2)

PIC18F2220/2320/4220/4320

BNOV Branch if Not Overflow

Syntax: [ label ] BNOV n

Operands: -128 ≤ n ≤ 127

Operation: if overflow bit is ’0’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0101 nnnn nnnn

Description: If the Overfl ow bit is ‘0’, then the

program will branch.

The 2’s co mp lem en t nu mb er ‘ 2n’ is

added to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC+2+2 n. This inst ructio n is t hen a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump: Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BNOV Jump

Before Instruction

PC = address (HERE)

After Instruction

If Overflow = 0;

PC = address (Jump)

If Overflow = 1;

PC = address (HERE+2)

BNZ Branch if Not Zero

Syntax: [ label ] BNZ n

Operands: -128 ≤ n ≤ 127

Operati on: if zero bit is ’0’

(PC) + 2 + 2n → PC

St at us Af fe cte d: No ne

Encoding: 1110 0001 nnnn nnnn

Description: If the Zero bit is ‘0’, then the

progr am w ill branc h.

The 2’s complement nu mber ‘2n’ i s

added to the PC. Since the PC will

have incremented to fetch the next

instruc tion, the n ew a ddr ess will be

PC+2+2 n. This inst ruction is th en a

two- cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump :Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BNZ Jump

Before Instruc tio n

PC = address (HERE)

After Instruction

If Zero = 0;

PC = address (Jump)

If Zero = 1;

PC = address (HERE+2)

PIC18F2220/2320/4220/4320

BRA Unconditional Branch

Syntax: [ label ] BRA n

Operands: -1024 ≤ n ≤ 1023

Operation: (PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1101 0nnn nnnn nnnn

Description: Add the 2’s complement number

‘2n’ to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC+2+2n. This instruction is a

two-cycle instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

Example:HERE BRA Jump

Before Instruction

PC = address (HERE)

After Instruction

PC = address (Jump)

BSF Bit Set f

Syntax: [ label ] BSF f,b[,a]

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: 1 → f

St at us Af fe cte d: No ne

Encoding: 1000 bbba ffff ffff

Descr iption : Bit ‘b’ in re gister ‘f’ is s et. If ‘a’ is ‘0’,

Access Bank will be selected, over-

riding th e BSR value. If ‘a’ = 1, th en

the b ank wi ll be selec ted as per th e

BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:BSF FLAG_REG, 7

Before Instruc tio n

FLAG_REG = 0x0A

After Instruction

FLAG_REG = 0x8A

PIC18F2220/2320/4220/4320

BTFSC Bit Test File, Skip if Clear

Syntax: [ label ] BTFSC f,b[,a]

Operands: 0 ≤ f ≤ 255

0 ≤ b ≤ 7

a ∈ [0,1]

Operation: skip if (f) = 0

Status Affected: None

Encoding: 1011 bbba ffff ffff

Description: If bit ‘b’ in register ‘f’ is ‘0’, then the

next instruction is skipped.

If bit ‘b’ is ‘0’, then the next instruc-

tion fetched during the current

instruction execution is discarded

and a NOP is execut ed inste ad, ma k-

ing this a two-cycle instruction. If ‘a’

is ‘0’, the Access Bank will be

selec ted, overriding the BSR value. If

‘a’ = 1, then the bank will be se lecte d

as per the BSR value (default).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE

FALSE

TRUE

BTFSC

FLAG, 1

Before Instruction

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (TRUE)

If FLAG<1> = 1;

PC = address (FALSE)

BTFSS Bit Test File, Skip if Set

Syntax: [ label ] BTFSS f,b[,a]

Operands: 0 ≤ f ≤ 255

0 ≤ b < 7

a ∈ [0,1]

Operation: skip if (f) = 1

St at us Af fe cte d: No ne

Encoding: 1010 bbba ffff ffff

Description: If bit ‘b’ in register ‘f’ is ‘1’, then the

next instruction is skipped.

If bit ‘b’ is ‘1’, then the next instruc-

tion fetched during the current

instruction execution is discarded

and a NOP is executed instead, mak-

ing this a two-cycle instruction. If ‘a’

is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ = 1, then the ban k will be s elect ed

as pe r the BSR valu e (defaul t).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE

FALSE

TRUE

BTFSS

FLAG, 1

Before Instruc tio n

PC = address (HERE)

After Instruction

If FLAG<1> = 0;

PC = address (FALSE)

If FLAG<1> = 1;

PC = address (TRUE)

PIC18F2220/2320/4220/4320

BTG Bit Toggle f

Syntax: [ label ] BTG f,b[,a]

Operands: 0 ≤ f ≤ 255

0 ≤ b < 7

a ∈ [0,1]

Operation: (f) → f

Status Affected: None

Encoding: 0111 bbba ffff ffff

Description: Bit ‘b’ in data memory location ‘f’ is

inverte d. If ‘a ’ is ‘0’, th e Ac cess Bank

will be selected, overriding the BSR

value. If ‘ a’ = 1, then the ban k w i ll be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:BTG PORTC, 4

Before Instruction:

PORTC = 0111 0101 [0x75]

After Instruction:

PORTC = 0110 0101 [0x65]

BOV Branch if Overflow

Syntax: [ label ] BOV n

Operands: -128 ≤ n ≤ 127

Operation: if overflow bit is ’1’

(PC) + 2 + 2n → PC

St at us Af fe cte d: No ne

Encoding: 1110 0100 nnnn nnnn

Description: If the Overflow bit is ‘1’, then the

progr am w ill branc h.

The 2’s complement nu mber ‘2n’ i s

added to the PC. Since the PC will

have incremented to fetch the next

instruc tion, the n ew a ddr ess will be

PC+2+2 n. This inst ruction is th en a

two- cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump :Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BOV JUMP

Before Instruc tio n

PC = address (HERE)

After Instruction

If Overflow = 1;

PC = address (JUMP)

If Overflow = 0;

PC = address (HERE+2)

PIC18F2220/2320/4220/4320

BZ Branch if Zero

Syntax: [ label ] BZ n

Operands: -128 ≤ n ≤ 127

Operation: if Zero bit is ’1’

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1110 0000 nnnn nnnn

Description: If the Zero bit is ‘1’, then the

program will branch.

The 2’s co mp lem en t nu mb er ‘ 2n’ is

added to the PC. Since the PC will

have incremented to fetch the next

instruction, the new address will be

PC+2+2 n. This inst ructio n is t hen a

two-cycle instruction.

Words: 1

Cycles: 1(2)

Q Cycle Activity:

If Jump: Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data Write to PC

operation No

operation

If No Jump:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’ Process

Data No

operation

Example:HERE BZ Jump

Before Instruction

PC = address (HERE)

After Instruction

If Zero = 1;

PC = address (Jump)

If Zero = 0;

PC = address (HERE+2)

CALL Subroutine Call

Syntax: [ label ] CALL k [,s]

Operands: 0 ≤ k ≤ 1048575

s ∈ [0,1]

Operati on: (PC) + 4 → TOS,

k → PC<20:1>,

if s = 1

(W) → WS,

(STATUS) → ST ATUSS,

(BSR) → BSRS

St at us Af fe cte d: No ne

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>) 1110

1111

110s

k19kkk

k7kkk

kkkk

kkkk0

kkkk8

Description: Subroutine call of entire 2 Mbyte

memory range. First, return

address (PC+ 4) is pushe d onto the

return st ack. If ‘s’ = 1, the W , Status

and BSR regi sters are also pushed

into their respective shadow regis-

ters, WS, STATUSS and BSRS. If

‘s’ = 0, no update occurs (default ).

Then, the 20-bit value ‘k’ is loaded

into PC<20:1>. CALL is a two-cyc le

instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>, Push PC to

stack Read literal

‘k’<19:8>,

Write to PC

operation No

operation

Example:HERE CALL THERE,FAST

Before Instruc tio n

PC = address (HERE)

After Instruction

PC = address (THERE)

TOS = address (HERE + 4)

WS = W

BSRS = BSR

STATUSS= STATUS

PIC18F2220/2320/4220/4320

CLRF Clear f

Syntax: [ label ] CLRF f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: 000h → f

1 → Z

Status Affected: Z

Encoding: 0110 101a ffff ffff

Description: Clears the contents of the specified

Bank w ill be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:CLRF FLAG_REG

Before Instruction

FLAG_REG = 0x5A

After Instruction

FLAG_REG = 0x00

CLRWDT Clear Watchdog Timer

Syntax: [ label ] CLRWDT

Operands: None

Operation: 000h → WDT,

000h → WDT postscal er,

1 → TO,

1 → PD

St at us Af fe cte d: TO, PD

Encoding: 0000 0000 0000 0100

Description: CLRWDT instruction resets the

Watchdog Timer. It also resets the

postscaler of the WDT. Status bits

TO and PD are set.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation Process

Data No

operation

Example:CLRWDT

Before Instruc tio n

WDT Counter = ?

After Instruction

WDT Counter = 0x00

WDT Postscaler = 0

TO =1

PD =1

PIC18F2220/2320/4220/4320

COMF Complement f

Syntax: [ label ] COMF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: → dest

Status Affected: N, Z

Encoding: 0001 11da ffff ffff

Desc ript ion : The con t en t s of regi ste r ‘f’ are

complemented. If ‘d’ is ‘0’, the

result is store d in W. If ‘d’ is ‘1’, the

result is sto r ed back in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank w ill be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:COMF REG, W

Before Instruction

REG = 0x13

After Instruction

REG = 0x13

W=0xEC

)

CPFSEQ Compare f with W, skip if f = W

Syntax: [ label ] CPFSEQ f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) – (W),

skip if (f) = (W)

(unsign ed comparis on )

St at us Af fe cte d: No ne

Encoding: 0110 001a ffff ffff

Description: Compares the contents of data

memory location ‘f ’ to the contents

of W by performing an unsigned

subtraction.

If ‘f’ = W, then the fetched instruc-

tion is discarded and a NOP is

executed instead, making this a

two-cycle instruction. If ‘a’ is ‘0’, the

Access Bank will be selected, over-

riding th e BSR value. If ‘a’ = 1, th en

the bank wi ll be selec ted as p er the

BSR value (defaul t).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data No

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE CPFSEQ REG

NEQUAL :

EQUAL :

Before Instruc tio n

PC Address = HERE

W=?

REG = ?

After Instruction

If REG = W;

PC = Address (EQUAL)

If REG ≠ W;

PC = Address (NEQUAL)

PIC18F2220/2320/4220/4320

CPFSGT Compare f with W, skip if f > W

Syntax: [ label ] CPFSGT f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) − (W),

skip if (f) > (W)

(unsigned comparison)

Status Affected: None

Encoding: 0110 010a ffff ffff

Description: Compares the contents of data

memory location 'f' to the contents

of the W by performing an

unsign ed su btraction.

If the conten ts of ‘f’ are greater t han

the contents of WREG, then the

fetched instruct ion is disca rded and

a NOP is exec uted instead, making

this a two-cycle instruction. If ‘a’ is

‘0’, the Access Bank will be

selec ted, over riding the BSR value .

If ‘a’ = 1, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1(2)

Note: 3 cycles if s k ip a nd fo llo w ed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data No

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE CPFSGT REG

NGREATER :

GREATER :

Before Instruction

PC = Address (HERE)

W= ?

After Instruction

If REG > W;

PC = Address (GREATER)

If REG ≤ W;

PC = Address (NGREATER)

CPFSLT Compare f with W, skip if f < W

Syntax: [ label ] CPFSLT f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (f) – (W),

skip if (f) < (W)

(unsign ed comparis on )

St at us Af fe cte d: No ne

Encoding: 0110 000a ffff ffff

Description: Compares the contents of data

memory location ‘f ’ to the contents

of W by performing an unsigned

subtraction.

If the contents of ‘f’ are less than

the con tents of W , then the fet che d

instruction is discarded and a NOP

is execut ed instead, m aking this a

two-cycle instruction. If ‘a’ is ‘0’, the

Access Bank will be selected. If ’a’

is ‘1’, the BSR will not be

overridden (default).

Words: 1

Cycles: 1(2)

Note: 3 cy cl es i f s ki p and fo llowed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data No

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE CPFSLT REG

NLESS :

LESS :

Before Instruc tio n

PC = Address (HERE)

W= ?

After Instruction

If REG < W;

PC = Address (LESS)

If REG ≥ W;

PC = Address (NLESS)

PIC18F2220/2320/4220/4320

DAW Decimal Adjust W Register

Syntax: [ label ] DAW

Operands: None

Operation: If [W<3:0> >9] or [DC = 1] then

(W<3:0>) + 6 → W<3:0>;

else

(W<3:0>) → W<3:0>;

If [W<7:4> >9] or [C = 1] then

(W<7:4>) + 6 → W<7:4>;

else

(W<7:4>) → W<7 :4>;

Status Affected: C, DC

Encoding: 0000 0000 0000 0111

Description: DAW adjusts the eight-bit value in

W, resulting from the earlier addi-

tion of two variables (each in

packed BCD format) and produces

a correct packed BCD result. Th e

carry bit may be set by DAW regard-

less of its setting prior to the DAW

execution.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example1:DAW

Before Instruction

W=0xA5

C=0

DC = 0

After Instruction

W = 0x05

C=1

DC = 0

Example 2:

Before Instruction

W=0xCE

C=0

DC = 0

After Instruction

W = 0x34

C=1

DC = 0

DECF Decrement f

Syntax: [ label ] DECF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest

Status Affected: C, DC, N, OV, Z

Encoding: 0000 01da ffff ffff

Description: Decrement register ‘f’. If ‘d’ is ‘0’,

the result is stored in W. If ‘d’ is ‘1’,

the resu lt is stor ed bac k in regi ste r

‘f’ (default). If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (defaul t).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:DECF CNT,

Before Instruc tio n

CNT = 0x01

Z=0

After Instruction

CNT = 0x00

Z=1

PIC18F2220/2320/4220/4320

DECFSZ Decrement f, skip if 0

Syntax: [ label ] DECFSZ f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest,

skip if result = 0

Status Affected: None

Encoding: 0010 11da ffff ffff

Desc ript ion : The con t en t s of regi ste r ‘f’ are

decremented. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d’ is ‘1’, the result

is pl aced back in register ‘f’

(default).

If the result is ‘0’, the next instruc-

tion which is already fetched is dis-

carded and a NOP is executed

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access

Bank w ill be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE DECFSZ CNT

GOTO LOOP

CONTINUE

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT - 1

If CNT = 0;

PC = Address (CONTINUE)

If CNT ≠0;

PC = Address (HERE+2)

DCFSNZ Decrement f, skip if not 0

Syntax: [ label ] DCFSNZ f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – 1 → dest,

skip if result ≠ 0

St at us Af fe cte d: No ne

Encoding: 0100 11da ffff ffff

Description: The contents of register ‘f’ are

decremented. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d ’ is ‘1’, the result

is pl aced back in register ‘f’

(default).

If the result is not ‘0’, the next

instruc tion which is already fetc hed

is disca rded and a NOP is executed

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (defaul t).

Words: 1

Cycles: 1(2)

Note: 3 cy c les if sk ip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE DCFSNZ TEMP

ZERO :

NZERO :

Before Instruc tio n

TEMP = ?

After Instruction

TEMP = TEMP - 1,

If TEMP = 0;

PC = Address (ZERO)

If TEMP ≠0;

PC = Address (NZERO)

PIC18F2220/2320/4220/4320

GOTO Unconditional Branch

Syntax: [ label ] GOTO k

Operands: 0 ≤ k ≤ 1048575

Operation: k → PC<20:1>

Status Affected: None

Encoding:

1st word (k<7:0>)

2nd word(k<19:8>) 1110

1111

k19kkk

k7kkk

kkkk

kkkk0

kkkk8

Description: GOTO allows an unconditional

branch anywhere within entire

2-Mbyte memory range. The 20-bit

value ‘k’ is loaded into PC<20:1>.

GOTO is always a two-cycle

instruction.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’<7:0>, No

operation Read literal

‘k’<19:8>,

Write to PC

operation No

operation

Example:GOTO THERE

After Instruction

PC = Address (THERE)

INCF Increment f

Syntax: [ label ] INCF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest

Status Affected: C, DC, N, OV, Z

Encoding: 0010 10da ffff ffff

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d ’ is ‘1’, th e result

is pl aced back in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (defaul t).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:INCF CNT,

Before Instruc tio n

CNT = 0xFF

Z=0

C=?

DC = ?

After Instruction

CNT = 0x00

Z=1

C=1

DC = 1

PIC18F2220/2320/4220/4320

INCFSZ Increment f, skip if 0

Syntax: [ label ] INCFSZ f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest,

skip if result = 0

Status Affected: None

Encoding: 0011 11da ffff ffff

Desc ript ion : The con t en t s of regi ste r ‘f’ are

incremented. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d ’ is ‘1’, th e result

is pl aced back in register ‘f’

(default).

If the result is ‘0’, the next

instruc tion w hich is al ready f etched

is disc arded an d a NOP is ex ec ute d

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access

Bank w ill be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1(2)

Note: 3 cycl es if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE INCFSZ CNT

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

CNT = CNT + 1

If CNT = 0;

PC = Address (ZERO)

If CNT ≠0;

PC = Address (NZERO)

INFSNZ Increment f, skip if not 0

Syntax: [ label ] INFSNZ f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) + 1 → dest,

skip if result ≠ 0

St at us Af fe cte d: No ne

Encoding: 0100 10da ffff ffff

Description: The contents of register ‘f’ are

incremented. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d ’ is ‘1’, th e result

is pl aced back in register ‘f’

(default).

If the result is not ‘0’, the next

instruc tion w hich is al ready fe tched

is disc arded and a NOP is ex ec uted

instead, making it a two-cycle

instruction. If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (defaul t).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE INFSNZ REG

ZERO

NZERO

Before Instruc tio n

PC = Address (HERE)

After Instruction

REG = REG + 1

If REG ≠0;

PC = Address (NZERO)

If REG = 0;

PC = Address (ZERO)

PIC18F2220/2320/4220/4320

IORLW Inclusive OR literal with W

Syntax: [ label ] IORLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .OR. k → W

Status Affected: N, Z

Encoding: 0000 1001 kkkk kkkk

Description: The contents of W are OR’ed with

the eight-bit literal ‘k’. The result is

placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Wri te to W

Example:IORLW 0x35

Before Instruction

W = 0x9A

After Instruction

W=0xBF

IORWF Inclusive OR W with f

Syntax: [ label ] IORWF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .OR. (f) → dest

St at us Af fe cte d: N, Z

Encoding: 0001 00da ffff ffff

Description: Inclusive OR W with register ‘f’. If

‘d’ is ‘0’, the result is pla ced in W. If

‘d’ is ‘1’, the result is p laced back in

Access Bank will be selected, over-

riding th e BSR value. If ‘a’ = 1, th en

the bank wi ll be selec ted as p er the

BSR value (defaul t).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:IORWF RESULT, W

Before Instruc tio n

RESULT = 0x13

W = 0x91

After Instruction

RESULT = 0x13

W = 0x93

PIC18F2220/2320/4220/4320

LFSR Load FSR

Syntax: [ label ] LFSR f,k

Operands: 0 ≤ f ≤ 2

0 ≤ k ≤ 4095

Operation: k → FSRf

Status Affected: None

Encoding: 1110

1111

1110

0000

00ff

k7kkk

k11kkk

kkkk

Desc ription: The 12-bi t literal ‘k’ is loade d into

the file select register pointed to

by ‘f’.

Words: 2

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’ MSB Process

Data Write

literal ‘k’

MSB to

FSRfH

Decode Read literal

‘k’ LSB Process

Data Write literal

‘k’ to FSRfL

Example:LFSR 2, 0x3AB

After Instruction

FSR2H = 0x03

FSR2L = 0xAB

MOVF Move f

Syntax: [ label ] MOVF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: f → dest

St at us Af fe cte d: N, Z

Encoding: 0101 00da ffff ffff

Description: The contents of register ‘f’ are

moved to a destination dependent

upon the s tatus of ‘d’. If ‘d’ is ‘0’, the

result is place d in W. I f ‘d’ is ‘1’, the

result is placed back in regi ster ‘f’

(default). Location ‘f’ can be any-

where in the 25 6-b yte bank . If ‘a ’ is

‘0’, the Access Bank will be

selec ted, overri ding the BSR value .

If ‘a’ = 1, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write W

Example:MOVF REG, W

Before Instruc tio n

REG = 0x22

W=0xFF

After Instruction

REG = 0x22

W = 0x22

PIC18F2220/2320/4220/4320

MOVFF Move f to f

Syntax: [ label ] MOVFF fs,fd

Operands: 0 ≤ fs ≤ 4095

0 ≤ fd ≤ 4095

Operation: (fs) → fd

Status Affected: None

Encoding:

1st word (source)

2nd word (destin.) 1100

1111

ffff

ffffs

ffffd

Description: The contents of source register ‘fs’

are moved to destination register

‘fd’. Location of source ‘fs’ can be

anywhere in the 4096-byte data

space (000h to FFFh) and location

of destination ‘fd’ can also be

anywhere from 000h to FFFh.

Either so urc e or de st ination can be

W (a useful special situat ion).

MOVFF is particularly useful for

transferring a data memory location

to a periph eral register (such as the

transmit buffer or an I/O port).

The MOVFF instruction cannot use

the PCL, T OSU, T OSH or TOSL as

the destination register.

The MOVFF instruction should not

be use d to modi fy in terrupt s etting s

while any interrupt is enabled (see

Page 87).

Words: 2

Cycles: 2 (3)

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

(src)

Process

Data No

operation

Decode No

operation

No dummy

read

operation Write

(dest)

Example:MOVFF REG1, REG2

Before Instruction

REG1 = 0x33

REG2 = 0x11

After Instruction

REG1 = 0x33,

REG2 = 0x33

MOVLB Move literal to low nibble in BSR

Syntax: [ label ] MOVLB k

Operands: 0 ≤ k ≤ 255

Operation: k → BSR

St at us Af fe cte d: None

Encoding: 0000 0001 kkkk kkkk

Description: The 8-bit literal ‘k’ is loaded into

the Bank Select Register (BSR).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘k’ Process

Data Write

literal ‘k’ to

BSR

Example:MOVLB 5

Before Instruc tio n

BSR register = 0x02

After Instruction

BSR register = 0x05

PIC18F2220/2320/4220/4320

MOVLW Move literal to W

Syntax: [ label ] MOVLW k

Operands: 0 ≤ k ≤ 255

Operation: k → W

Status Affected: None

Encoding: 0000 1110 kkkk kkkk

Desc ription: The ei ght-bit literal ‘k’ is lo aded into

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Wri te to W

Example:MOVLW 0x5A

After Instruction

W = 0x5A

MOVWF Move W to f

Syntax: [ label ] MOVWF f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (W) → f

St at us Af fe cte d: No ne

Encoding: 0110 111a ffff ffff

Description: Move data from W to register ‘f’.

Location ‘f’ can be anywher e in the

256-byte bank. If ‘a’ is ‘0’, the

Access Bank will be selected, over-

riding th e BSR value. If ‘a’ = 1, th en

the b ank wi ll be selec ted as per th e

BSR value (defaul t).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:MOVWF REG

Before Instruc tio n

W = 0x4F

REG = 0xFF

After Instruction

W = 0x4F

REG = 0x4F

PIC18F2220/2320/4220/4320

MULLW Multiply Literal with W

Syntax: [ label ] MULLW k

Operands: 0 ≤ k ≤ 255

Operati on: (W) x k → PRODH:PRODL

Status Affected: None

Encoding: 0000 1101 kkkk kkkk

Description: An unsigned multiplication is

carried out be tween the conte nts

of W and the 8-bit literal ‘k’. The

16-bit result is placed in

PRODH:PRODL register pair.

PRODH contains the high byte.

W is unchanged.

None of the status flags are

affected.

Note that neithe r overflow nor

carry is possible in this opera-

tion. A z ero re su lt is poss ib le bu t

not detected.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Write

registers

PRODH:

PRODL

Example:MULLW 0xC4

Before Instruction

W=0xE2

PRODH = ?

PRODL = ?

After Instruction

W=0xE2

PRODH = 0xAD

PRODL = 0x08

MULWF M ultiply W with f

Syntax: [ label ] MULWF f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: (W) x (f) → PRODH:PRODL

St at us Af fe cte d: None

Encoding: 0000 001a ffff ffff

Description: An unsigned multiplication is

carried o ut betw een the content s

of W and the reg ister file location

‘f’. The 16-bit result is stored in

the P RODH :PROD L regi ster

pair . PRODH contains the high

byte.

Both W and ‘f’ are unchanged.

None of the status flags are

affected.

Note that neither overflow nor

carry is possible in this opera-

tion. A zero resul t is poss ible but

not detected. If ‘a’ is ‘0’, the

Access Bank will be selected,

overriding the BSR value. If

‘a’= 1, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

registers

PRODH:

PRODL

Example:MULWF REG

Before Instruc tio n

W=0xC4

REG = 0xB5

PRODH = ?

PRODL = ?

After Instruction

W=0xC4

REG = 0xB5

PRODH = 0x8A

PRODL = 0x94

PIC18F2220/2320/4220/4320

NEGF Negate f

Syntax: [ label ] NEGF f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: ( f ) + 1 → f

Status Affected: N, OV, C, DC, Z

Encoding: 0110 110a ffff ffff

Description: Location ‘f’ is negated using two’s

compl ement. The re sult is pla ced in

the data memory location ‘f’. If ‘a’

is ‘0’, the Access Bank will be

selec ted, over riding the BSR value .

If ‘a’ = 1, then the bank will be

selected as per the BSR value.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:NEGF REG, 1

Before Instruction

REG = 0011 1010 [0x3A]

After Instruction

REG = 1100 0110 [0xC6]

NOP No Operation

Syntax: [ label ] NOP

Operands: None

Operation: No operation

St at us Af fe cte d: No ne

Encoding: 0000

1111

0000

xxxx

0000

xxxx

0000

xxxx

Description: No operation.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation No

operation

Example:

None.

PIC18F2220/2320/4220/4320

POP Pop Top of Return Stack

Syntax: [ label ] POP

Operands: None

Operation: (TOS) → bit bucket

Status Affected: None

Encoding: 0000 0000 0000 0110

Description: The TOS value is pulled off the

return stack and is discarded. The

T OS val ue then becomes th e pre vi-

ous val ue that was pushe d onto the

return stack.

This instruction is provided to

enable the user to properly manage

the return stack to incorporate a

software stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation POP TOS

value No

operation

Example:POP

GOTO NEW

Before Instruction

TOS = 0x0031A2

Stack (1 level down) = 0x014332

After Instruction

TOS = 0x014332

PC = NEW

PUSH Push Top of Return Stack

Syntax: [ label ] PUSH

Operands: None

Operation: (PC+2) → TOS

St at us Af fe cte d: No ne

Encoding: 0000 0000 0000 0101

Descr iption: The PC+2 is pus hed onto the top of

the return s tac k. The previou s TO S

value is pushed down on the stack.

This instruction allows to implement

a software stack by modifying TOS,

and then push it onto the return

stack.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode PUSH PC+2

onto return

stack

operation No

operation

Example:PUSH

Before Instruc tio n

TOS = 0x00345A

PC = 0x000124

After Instruction

PC = 0x000126

TOS = 0x000126

Stack (1 level down) = 0x00345A

PIC18F2220/2320/4220/4320

RCALL Relative Call

Syntax: [ label ] RCALL n

Operands: -1024 ≤ n ≤ 1023

Operation: (PC) + 2 → TOS,

(PC) + 2 + 2n → PC

Status Affected: None

Encoding: 1101 1nnn nnnn nnnn

Description: Subroutine call with a jump up to

1K from the current location. First,

return address (PC+2) is pushed

onto the stack. Then, add the 2’s

compl ement number ‘2n’ to the PC.

Since t he PC will hav e incremented

to fetch the next instruction, the

new add ress will be PC+2+2n. This

instr uction is a two-cycle

instruction.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read literal

‘n’

Push PC to

stack

Process

Data Write to PC

operation No

operation

Example:HERE RCALL Jump

Before Instruction

PC = Address (HERE)

After Instruction

PC = Address (Jump)

TOS = Address (HERE+2)

RESET Reset

Syntax: [ label ] RESET

Operands: None

Operation: Reset all registers and flags that

are affect ed by a MCLR Reset.

St at us Af fe cte d: Al l

Encoding: 0000 0000 1111 1111

Description: This instruction provides a way to

execute a MCLR Reset in software.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Start

reset No

operation No

operation

Example:RESET

After Instruction

Registers = Reset Value

Flags* = Reset Value

PIC18F2220/2320/4220/4320

RETFIE Return from Interrupt

Syntax: [ label ] RETFIE [s]

Operands: s ∈ [0,1]

Operation: (TOS) → PC,

1 → GIE/GIEH or PEIE/GIEL,

if s = 1

(WS) → W,

(STATUSS) → STATUS,

(BSRS) → BSR,

PCLATU, PCLATH are unchanged.

Status Affected: GIE/GIEH, PEIE/GIEL.

Encoding: 0000 0000 0001 000s

Description: Return from Interrupt. Stack is

popped and Top-of-Stack (TOS) is

loaded into the PC. Interrupts are

enabled by setting either the high

or low priority global interrupt

enable bit. If ‘s’ = 1, the contents of

the shadow regi ste rs WS,

STATUSS and BSRS are loaded

into their corresponding registers,

W, Status and BSR. If ‘s’ = 0, no

update of these registers occurs

(default).

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation No

operation pop PC from

stack

Set GIEH or

GIEL

operation No

operation

Example:RETFIE 1

After Interrupt

PC = TOS

W=WS

BSR = BSRS

STATUS = STATUSS

GIE/ GIEH, PEIE/GIEL = 1

RETLW Return Literal to W

Syntax: [ label ] RETLW k

Operands: 0 ≤ k ≤ 255

Operation: k → W,

(TOS) → PC,

PCLATU, PCLATH are unchanged

St at us Af fe cte d: No ne

Encoding: 0000 1100 kkkk kkkk

Descr ipti on : W is loaded w ith the e igh t-bi t lit eral

‘k’. The program counter is loaded

from the top of t he st ack (the retu rn

address) . The high address latch

(PCLATH) remains unchanged.

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data pop PC from

stack, Write

to W

operation No

operation

Example:

CALL TABLE ; W contains table

; offset value

; W now has

; table value

TABLE

ADDWF PCL ; W = offset

RETLW k0 ; Begin table

RETLW k1 ;

RETLW kn ; End of table

Before Instruc tio n

W = 0x07

After Instruction

W = value of kn

PIC18F2220/2320/4220/4320

RETURN Return from Subroutine

Syntax: [ label ] RETURN [s]

Operands: s ∈ [0,1]

Operation: (TOS) → PC,

if s = 1

(WS) → W,

(STATUSS) → STATUS,

(BSRS) → BSR,

PCLATU, PCLATH are unchanged

Status Affected: None

Encoding: 0000 0000 0001 001s

Description: Return from subroutine. The stack

is popped and the top of the stack

(TOS) is loaded into the program

counte r . If ‘s’= 1, the contents of the

shadow regi ste rs WS, STATUSS

and BSRS are lo aded int o their cor-

responding registers, W, Status

and BSR. If ‘s’ = 0, no update of

these registers occurs (default).

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation Process

Data pop PC from

stack

operation No

operation

Example:RETURN

After Interrupt

PC = TOS

RLCF Rotate Left f through Carry

Syntax: [ label ] RLCF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n+1>,

(f<7>) → C,

St at us Af fe cte d: C, N, Z

Encoding: 0011 01da ffff ffff

Description: The contents of register ‘f’ are

rotated one bit to the left through

the Carry Fla g. If ‘d’ is ‘0’, the result

is place d in W . If ‘d’ is ‘1’, the result

is stored back in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ = 1, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:RLCF REG, W

Before Instruc tio n

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=1100 1100

C=1

Cregister f

PIC18F2220/2320/4220/4320

RLNCF Rotate Left f (no carry)

Syntax: [ label ] RLNCF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n+1>,

(f<7>) → dest<0>

Status Affected: N, Z

Encoding: 0100 01da ffff ffff

Description: The contents of register ‘f’ are

rotate d one bit to th e left. If ‘d’ is ‘0’,

the resul t is plac ed in W. If ‘d ’ is ‘1’,

the result is stored back in register

‘f’ (default). If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:RLNCF REG

Before Instruction

REG = 1010 1011

After Instruction

REG = 0101 0111

RRCF Ro tate Right f through Carry

Syntax: [ label ] RRCF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n-1>,

(f<0>) → C,

Status Affecte d: C, N, Z

Encoding: 0011 00da ffff ffff

Description: The contents of register ‘f’ are

rotated one bit to the right through

the Carry Flag. If ‘d’ is ‘0’, the result

is plac ed in W. If ‘d ’ is ‘1’, th e result

is pl aced back in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank will be selected, overriding

the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the

BSR value (defaul t).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:RRCF REG, W

Before Instruc tio n

REG = 1110 0110

C=0

After Instruction

REG = 1110 0110

W=0111 0011

C=0

Cregister f

PIC18F2220/2320/4220/4320

RRNCF Rotate Right f (no carry)

Syntax: [ label ] RRNCF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<n>) → dest<n-1>,

(f<0>) → dest<7>

Status Affected: N, Z

Encoding: 0100 00da ffff ffff

Desc ript ion : The con t en t s of regi ste r ‘f’ are

rotated one bit to the right. If ‘d’ is

‘0’, the res ult is pl aced in W. If ‘d ’ is

‘1’, the result is placed back in reg-

ister ‘f’ (default). If ‘a’ is ‘0’, the

Access Bank will be selected, over-

riding the BSR value. If ‘a’ is ‘1’,

then the bank will be selected as

per the B SR value (default ).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example 1:RRNCF REG, 1, 0

Before Instruction

REG = 1101 0111

After Instruction

REG = 1110 1011

Example 2:RRNCF REG, W

Before Instruction

W=?

REG = 1101 0111

After Instruction

W=1110 1011

REG = 1101 0111

SETF Set f

Syntax: [ label ] SETF f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: FFh → f

St at us Af fe cte d: No ne

Encoding: 0110 100a ffff ffff

Description: The contents of the specified regis-

ter are set to FFh. If ‘a’ is ‘0’, the

Access Bank will be selected, over-

riding the BSR value. If ‘a’ is ‘1’,

then the bank will be selected as

per the BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write

Example:SETF REG

Before Instruc tio n

REG = 0x5A

After Instruction

REG = 0xFF

PIC18F2220/2320/4220/4320

SLEEP Enter SLEEP mode

Syntax: [ label ] SLEEP

Operands: None

Operation: 00h → WDT,

0 → WDT postscaler,

1 → TO,

0 → PD

Status Affected: TO, PD

Encoding: 0000 0000 0000 0011

Descript ion: The power-down s tatus bit (PD) i s

cleared. The time-out status bit

(TO) is set. Watchdog Timer and

its po s tscaler are cleared.

The processor is put into Sleep

mode with the oscillator stopped.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation Process

Data Go to

Sleep

Example:SLEEP

Before Instruction

TO =?

PD =?

After Instruction

TO =1 †

PD =0

† If WDT causes wake-up, this bit is cleared.

SUBFWB Subtract f from W with borrow

Syntax: [ label ] SUBFWB f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) – (f) – (C) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 01da ffff ffff

Description: Subtract register ‘f’ and carry flag

(borrow) from W (2’s complement

method). If ‘d’ is ‘0’, the result is

stored in W. If ‘d’ is ‘1’, the result is

stored in register ‘d’ (default). If ‘a’

is ‘0’, the Access Bank will be

selected, overriding the BSR value.

If ‘a’ is ‘1’, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example 1:SUBFWB REG

Before Instruc tio n

REG = 0x03

W = 0x02

C = 0x01

After Instruction

REG = 0xFF

W = 0x02

C = 0x00

Z = 0x00

N = 0x01 ; result is negative

Example 2:SUBFWB REG, 0, 0

Before Instruc tio n

REG = 2

W=5

C=1

After Instruction

REG = 2

W=3

C=1

Z=0

N = 0 ; result is positive

Example 3:SUBFWB REG, 1, 0

Before Instruc tio n

REG = 1

W=2

C=0

After Instruction

REG = 0

W=2

C=1

Z = 1 ; resul t is z e ro

N=0

PIC18F2220/2320/4220/4320

SUBLW Subtract W from literal

Syntax: [ label ]SUBLW k

Operands: 0 ≤ k ≤ 255

Operation: k – (W) → W

Status Affected: N, OV, C, DC, Z

Encoding: 0000 1000 kkkk kkkk

Descriptio n: W is subtracted fr om the eight-bit

literal ‘k’. The result is placed in

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Wri te to W

Example 1: SUBLW 0x02

Before Instruction

W=1

C=?

After Instruction

W=1

C = 1 ; result is positive

Z=0

N=0

Example 2:SUBLW 0x02

Before Instruction

W=2

C=?

After Instruction

W=0

C = 1 ; result is zero

Z=1

N=0

Example 3:SUBLW 0x02

Before Instruction

W=3

C=?

After Instruction

W = F F ; (2’s complement)

C = 0 ; result is negative

Z=0

N=1

SUBWF Subtract W from f

Syntax: [ label ] SUBWF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operati on: (f) – (W) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 11da ffff ffff

Description: Subtract W from register ‘f’ (2’s

complement method). If ‘d’ is ‘0’,

the result is stored in W. If ‘d’ is

‘1’, the result is stored back in

the Access Bank will be selected,

overriding the BSR value. If ‘a’ is

‘1’, then the bank will be selected

as per the BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example 1:SUBWF REG

Before Instruc tio n

REG = 3

W=2

C=?

After Instruction

REG = 1

W=2

C = 1 ; result is positive

Z=0

N=0

Example 2:SUBWF REG, W

Before Instruc tio n

REG = 2

W=2

C=?

After Instruction

REG = 2

W=0

C = 1 ; result is ze r o

Z=1

N=0

Example 3:SUBWF REG

Before Instruc tio n

REG = 0x01

W = 0x02

C=?

After Instruction

REG = 0xFFh ;(2’s complement)

W = 0x02

C = 0x00 ; result is negative

Z = 0x00

N = 0x01

PIC18F2220/2320/4220/4320

SUBWFB Subtract W from f with Borrow

Syntax: [ label ] SUBWFB f [,d [,a]]

Operands: 0 ≤ f ≤ 25 5

d ∈ [0,1]

a ∈ [0,1]

Operation: (f) – (W) – (C) → dest

Status Affected: N, OV, C, DC, Z

Encoding: 0101 10da ffff ffff

Description: Subtract W and the carry flag (bor-

row) from register ‘f’ (2’s complement

method). If ‘d’ is ‘0’, the result is

stored in W. If ‘d’ is ‘1’, the result is

stored back in register ‘f’ (default). If

‘a’ is ‘0’, the Access Bank will be

selected, overriding the BSR value. If

‘a’ is ‘1’, then the bank will be

selected as per the BSR value

(default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example 1:SUBWFB REG, 1, 0

Before Instruc tio n

REG = 0x19 (0001 1001)

W= 0x0D (0000 1101)

C = 0x01

After Instruction

REG = 0x0C (0000 1011)

W= 0x0D (0000 1101)

C = 0x01

Z = 0x00

N = 0x00 ; result is positive

Example 2: SUBWFB REG, 0, 0

Before Instruc tio n

REG = 0x1B (0001 1011)

W= 0x1A (0001 1010)

C = 0x00

After Instruction

REG = 0x1B (0001 1011)

W = 0x00

C = 0x01

Z = 0x01 ; resu lt is zero

N = 0x00

Example 3: SUBWFB REG, 1, 0

Before Instruc tio n

REG = 0x03 (0000 0011)

W= 0x0E (0000 1101)

C = 0x01

After Instruction

REG = 0xF5 (1111 0100)

; [2’s comp]

W= 0x0E (0000 1101)

C = 0x00

Z = 0x00

N = 0x01 ; resu lt is negative

PIC18F2220/2320/4220/4320

SWAPF Swap f

Syntax: [ label ] SWAPF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (f<3:0>) → dest<7 :4>,

(f<7:4>) → des t<3 :0>

Status Affected: None

Encoding: 0011 10da ffff ffff

Desc ription : The upper an d lowe r nibbles of reg-

ister ‘f’ are exchanged. If ‘d’ is ‘0’,

the resul t is plac ed in W. If ‘ d’ is ‘1’,

the result is placed in register ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank w ill be selected, overriding

the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:SWAPF REG

Before Instruction

REG = 0x53

After Instruction

REG = 0x35

PIC18F2220/2320/4220/4320

TBLRD Table Read

Syntax: [ label ] TBLRD ( *; *+; *-; +*)

Operands: None

Operation: if TBLRD *,

(Prog Mem (TBLPTR)) → TABLAT;

TBLPTR - No Change;

if TBLRD *+,

(Prog Mem (TBLPTR)) → TABLAT;

(TBLPTR) +1 → TBLPTR;

if TBLRD *-,

(Prog Mem (TBLPTR)) → TABLAT;

(TBLPTR) -1 → TBLPTR;

if TBLRD +*,

(TBLPTR) +1 → TBLPTR;

(Prog Mem (TBLPTR)) → TABLAT;

Status Affected:None

Encoding: 0000 0000 0000 10nn

nn=0 *

=1 *+

=2 *-

=3 +*

Description: This instruct ion is used to read the

contents o f Program Mem ory (P.M.). To

address the program memory, a pointer

called Table Pointer (TBLPTR) is used.

The TBLPTR (a 21-bit pointer) points

to each byte in the program memory.

TBLP TR has a 2 Mby te address ra nge.

TBLPTR [0] = 0: Least Significant

Byte of Program

Memory Word

TBLPTR [0] = 1: Most Significant

Byte of Program

Memory Word

The TBLRD instruction can modify the

value of TBLPTR as follows:

• no change

• post-increment

• post-decrement

• pre-increment

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation No

operation

operation No oper atio n

(Read Program

Memory)

operation No operation

(Write TABLAT)

TBLRD Table Read (cont’d)

Example1:TBLRD *+ ;

Before Instruc tio n

TABLAT = 0x55

TBLPTR = 0x00A356

MEMORY(0x00A356) = 0x34

After Instruction

TABLAT = 0x34

TBLPTR = 0x00A357

Example2:TBLRD +* ;

Before Instruc tio n

TABLAT = 0xAA

TBLPTR = 0x01A357

MEMORY(0x01A357) = 0x12

MEMORY(0x01A358) = 0x34

After Instruction

TABLAT = 0x34

TBLPTR = 0x01A358

PIC18F2220/2320/4220/4320

TBLWT Table Write

Syntax: [ label ] TBLWT ( *; *+; *-; +*)

Operands: None

Operation: if TBLWT*,

(TABLAT) → Holding Register;

TBLPTR - No Change;

if TBLWT*+,

(TABLAT) → Holding Register;

(TBLPTR) +1 → TBLPTR;

if TBLWT*-,

(TABLAT) → Hold ing Regis ter;

(TBLPTR) -1 → TBLPTR;

if TBLWT+*,

(TBLPTR) +1 → TBLPTR;

(TABLAT) → Holding Register;

Status Affected: None

Encoding: 0000 0000 0000 11nn

nn=0 *

=1 *+

=2 *-

=3 +*

Description: This instruction uses the 3 LSBs of

TBLPTR to determine which of the 8

holding reg isters the TABLAT is written

to. The holding registers are used to

program the contents of Program

Memory (P.M.). (Refer to Section 6.0

“Flash Program Memory” for

additional details on programming

Flash memory.)

The TBLPTR (a 21-bit pointer) points

to each byte in the program memory.

TBLP TR has a 2 MBtye add res s

range. The LS b of th e TBLPTR s elect s

which byte of the program memory

location to access.

TBLPTR[0] = 0:Least Sign ificant

Byte of Program

Memory Word

TBLPTR[0] = 1:Most Significant

Byte of Program

Memory Word

The TBLWT instruction can modify the

value of TBLPTR as follows:

• no chang e

• post-increment

• post-decrement

• pre-increment

TBLWT Table Write (Continued)

Words: 1

Cycles: 2

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode No

operation No

operation

operation No

operation

(Read

TABLAT)

operation No

operation

(Write to

Holding

Example1:TBLWT *+;

Before Instruc tio n

TABLAT = 0x55

TBLPTR = 0x00A356

HOLDING REGISTER

(0x00A356) = 0xFF

After Instructions (table write completion)

TABLAT = 0x55

TBLPTR = 0x00A357

HOLDING REGISTER

(0x00A356) = 0x55

Example 2:TBLWT +*;

Before Instruc tio n

TABLAT = 0x34

TBLPTR = 0x01389A

HOLDING REGISTER

(0x01389A) = 0xFF

HOLDING REGISTER

(0x01389B) = 0xFF

After Instruction (table write completion)

TABLAT = 0x34

TBLPTR = 0x01389B

HOLDING REGISTER

(0x01389A) = 0xFF

HOLDING REGISTER

(0x01389B) = 0x34

PIC18F2220/2320/4220/4320

TSTFSZ Test f, skip if 0

Syntax: [ label ] TSTFSZ f [,a]

Operands: 0 ≤ f ≤ 255

a ∈ [0,1]

Operation: skip if f = 0

Status Affected: None

Encoding: 0110 011a ffff ffff

Description: If ‘f’ = 0, the nex t ins truc tio n,

fetched during the current instruc-

tion execution is discarded and a

NOP is exec uted, m aking thi s a two-

cycle instruction. If ‘a’ is ‘0’, the

Access Ba nk w il l b e s elec ted , ov er-

riding the BSR value. If ‘a’ is ‘1’,

then the bank will be selected as

per the B SR value (default ).

Words: 1

Cycles: 1(2)

Note: 3 cycles if skip and followed

by a 2-word instruction.

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data No

operation

If skip: Q1 Q2 Q3 Q4

operation No

operation

If skip and followed by 2-word instruction:

Q1 Q2 Q3 Q4

operation No

operation

operation No

operation

Example:HERE TSTFSZ CNT

NZERO :

ZERO :

Before Instruction

PC = Address (HERE)

After Instruction

If CNT = 0x00,

PC = Address (ZERO)

If CNT ≠0x00,

PC = Address (NZERO)

XORLW Exclusive OR literal with W

Syntax: [ label ] XORLW k

Operands: 0 ≤ k ≤ 255

Operation: (W) .XOR. k → W

St at us Af fe cte d: N, Z

Encoding: 0000 1010 kkkk kkkk

Description: The contents of W are XOR’ed

with the 8-bit literal ‘k’. The result

is placed in W.

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

literal ‘k’ Process

Data Write to W

Example:XORLW 0xAF

Before Instruc tio n

W=0xB5

After Instruction

W = 0x1A

PIC18F2220/2320/4220/4320

XORWF Exclusive OR W with f

Syntax: [ label ] XORWF f [,d [,a]]

Operands: 0 ≤ f ≤ 255

d ∈ [0,1]

a ∈ [0,1]

Operation: (W) .XOR. (f) → dest

Status Affected: N, Z

Encoding: 0001 10da ffff ffff

Description: Exclusive OR the contents of W

with register ‘f’. If ‘d’ is ‘0’, the result

is stored in W. If ‘d’ is ‘1’, the result

is stored bac k in t he regi ste r ‘f’

(default). If ‘a’ is ‘0’, the Access

Bank w ill be selected, overriding

the BSR value. If ‘a’ is ‘1’, then the

bank will be selected as per the

BSR value (default).

Words: 1

Cycles: 1

Q Cycle Activity:

Q1 Q2 Q3 Q4

Decode Read

Data Write to

destination

Example:XORWF REG

Before Instruction

REG = 0xAF

W=0xB5

After Instruction

REG = 0x1A

W=0xB5

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

25.0 DEVELOPMENT SUPPORT

The PICmicro® microcontrollers are supported with a

full ran ge of hardware a nd softwa re develo pment to ols:

• Integrated Development Environment

- MPLAB® IDE Software

• Assemblers/Compilers/Linkers

- MPASMTM Assembler

- MPLAB C17 and MPLAB C18 C Compilers

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB C30 C Compiler

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

- MPLAB dsPIC30 Software Simulator

•Emulators

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB ICE 4000 In-Circuit Emulator

• In-Circuit Debugger

- MPLAB ICD 2

• Device Progra mmers

-PRO MATE

® II Universa l D evi ce P rogramm er

- PICSTART® Plus Development Programmer

• Low-Cost Demonstration Boards

- PICDEMTM 1 Demonstration Board

- PICDEM.netTM De monstration Board

- PICDEM 2 Plus Demonstration Board

- PICDEM 3 Demonstration Board

- PICDEM 4 Demonstration Board

- PICDEM 17 Demonstration Board

- PICDEM 18R Demonstration Board

- PICDEM LIN Demonstration Board

- PICDEM USB Demonstration Board

• Evaluation Kits

-K

EELOQ®

- P ICDEM MSC

-microID

-CAN

- PowerSmart®

-Analog

25.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows®

based application that contains:

• An interface to debugging t ools

- simulator

- programmer (sold separately)

- emulator (sold separately)

- in-circuit debugger (sold separately)

• A full-featured editor with color coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Mouse over variable inspection

• Exten si ve on-l in e help

The MPLAB IDE allows you to:

• Edit your source files (eithe r asse mbly or C)

• One touch assemble (or compile) and download

to PICmicro emulator and simulator tools

(automatically updates all project information)

• Debug us ing :

- source files (as sembl y or C)

- absolute listing file (mixed assembly and C)

- machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve whe n upgrading to tools with increasin g flexibi lity

and power.

25.2 MPASM Assembler

The MPASM assembler is a full-featured, universal

macro assembler for all PICmicro MCUs.

The MPASM assembler generates relocatable object

files for the MPLINK object linker, Intel® standard HEX

files, M AP files to detail memory u sage and symbol re f-

erence, a bsolute LST files that cont ain source lines and

generated machine code and COFF files for

debugging.

The MPASM assembler features include:

• Integration into MPLAB IDE projects

• User de fined m acros to strea mline assemb ly cod e

• Condit ion al as sem bl y for multi-purpose sourc e

files

• Directives that allow complete control over the

assembly process

PIC18F2220/2320/4220/4320

25.3 MPLAB C17 and MPLAB C18

C Compilers

The MPLAB C17 and MPLAB C18 Code Development

Systems are complete ANSI C compilers for

Microchip’s PIC17CXXX and PIC18CXXX family of

microcontrollers. These compilers provide powerful

integration capabilities, superior code optimization and

ease of use not found with other compilers.

For easy source level debugging, the compilers provide

symbol info rmation tha t is optimized to the MPLAB IDE

debugger.

25.4 MPLINK Object Linker/

MPLIB Object Librari an

The MPLINK object linker combines relocatable

objects created by the MPASM assembler and the

MPLAB C17 and MPLAB C18 C compilers. It can link

relocatable objects from precompiled libraries, using

directives from a linker script.

The MPLIB object librarian manages the creation and

modification of library files of precompiled code. When

a routine from a library is called from a source file , only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, de letion and extraction

25.5 MPLAB C30 C Compiler

The MPLAB C30 C compiler is a full-featured, ANSI

compliant, optimizing compiler that translates standard

ANSI C programs into dsPIC30F assembly language

source. The compiler also supports many command-

line options and language extensions to take full

adv antage of the dsPIC 30F dev ice ha rdwar e capab ili-

ties and afford fine control of the compiler code

generator.

MPLAB C30 is distributed with a complete ANSI C

standard library. All library functions have been vali-

dated an d c on form to the ANSI C li brary standard. Th e

library includes functions for string manipulation,

dynamic memory allocation, data conversion, time-

keepin g and math func tions (trigonome tric, expone ntial

and hyperbolic). The compiler provides symbolic

information for high-level source debugging with the

MPLAB IDE.

25.6 MPLAB ASM30 Assembler, Linker

and Librarian

MPLAB ASM30 assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 compiler uses the

assembler to produce it’s object file. The assembler

generates relocatable object files that can then be

archived or linke d with other relocatable ob ject files and

arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res

of the assembler include:

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich dire cti ve set

• Flexible macro language

• MPLAB IDE compatibility

25.7 MPLAB SIM Software Simulator

The MPLAB SIM sof tware simulat or allows code deve l-

opment in a PC hosted environment by simulating the

PICmicro series microcontrollers on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a file, or use r de fined key p ress, to any pin. The exec u-

tion can be performed in Single-Step, Execute Until

Break or Trace mode.

The MPLAB SIM simulator fully supports symbolic

debugging using the MPLAB C17 and MPLAB C18

C Compilers, as well as the MPASM assembler. The

software simulator offers the flexibility to develop and

debug code outside of the laboratory environment,

making it an excellent, economical software

development tool.

25.8 MPLAB SIM30 Software Simulator

The MPLAB SIM30 software simulator allows code

develop ment in a PC hosted en vironment by simulating

the dsPIC30F series microcontrollers on an instruct ion

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a file, or user defined key press, to any of the pins.

The MPLAB SIM30 simulator fully supports symbolic

debugging using the MPLAB C30 C Compiler and

MPLAB ASM30 assembler . The simulator runs in either

a Command Line mode for automated tasks, or from

MPLAB IDE. This high-speed simulator is designed to

debug, analyze and optimize time intensive DSP

routines.

PIC18F2220/2320/4220/4320

25.9 MPLAB ICE 2000

High-Performance Universal

In-Circui t Emu lator

The MPLAB ICE 2000 universal in-circuit emulator is

intended to provide the product development engineer

with a complete microcontroller design tool set for

PICmicro microcontrollers. Software control of the

MPLAB ICE 2000 in-circuit emulator is advanced by

the MPLAB Integrated Development Environment,

which all ows ed iting, b uildin g, do wnlo ading and sourc e

debuggi ng from a singl e envi ronm en t.

The MPLAB ICE 2000 is a full-featured emulator sys-

tem with enhanced trace, trigger and data monitoring

featur es. Interchangea ble processo r modules al low the

system to be easi ly reconfi gured for emula tion of d iffer-

ent processors. The universal architecture of the

MPLAB ICE in-circuit emulator allows expansion to

support new PICmicro microcontrollers.

The MPLAB ICE 2000 in-circuit emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft® Windows 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

25.10 MPLAB ICE 4000

High-Performance Universal

In-Circui t Emu lator

The MPLAB ICE 4000 universal in-circuit emulator is

intended to provide the product development engineer

with a co mplete micro controller de sign tool se t for high-

end PICmicro microcontrollers. Software control of the

MPLAB ICE in-circuit emulator is provided by the

MPLAB Integrated Development Environment, which

allows editing, building, downloading and source

debuggi ng from a singl e envi ronm en t.

The MPLAB ICD 4000 is a premium emulator system,

providing the features of MPLAB ICE 2000, but with

increased emulation memory and high-speed perfor-

mance for dsPIC30F and PIC18XXXX devices. Its

advanc ed emulator fe atures inc lude complex t riggering

and timing, up to 2 Mb of emulation memory and the

ability to view variables in real-time.

The MPLAB ICE 4000 in-circuit emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft Windows 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

25.11 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low-cost, run-time development tool,

connecting to the host PC via an RS-232 or high-speed

USB interface. This tool is based on the Flash

PICmicro MCUs and can be used to develop for these

and other PICmicro microcontrollers. The MPLAB

ICD 2 utilizes the in-circuit debugging capability built

into the Flash devices. This feature, along with

Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM)

protocol , offe rs cost ef fective i n-circuit Flash debug ging

from the graphical user interface of the MPLAB Inte-

grated Development Environment. This enables a

designer to develop and debug source code by setting

breakpoints, single-stepping and watching variables,

CPU status and peripheral registers. Running at full

speed enables testing hardware and applications in

real-tim e. MPLAB ICD 2 also serves as a de velop ment

programmer for selected PICmicro devices.

25.12 PRO MATE II Universal Device

Programmer

The PRO MATE II is a universal, CE compliant device

programmer with programmable voltage verification at

VDDMIN and VDDMAX for maxi mum reli abili ty. It feature s

an LCD display for instructions and error messages

and a modular detachable socket assembly to support

various package types. In Stand-Alone mode, the

PRO MATE II device programmer can read, verify and

program PICmicro devices without a PC connection. It

can also set code protection in this mode.

25.13 PICSTART Plus Development

Programmer

The PICSTART Plus development programmer is an

easy-to-use, low-cost, prototype programmer. It con-

nects to the PC via a COM (RS-232) port. MPLAB

Inte grated Dev elopmen t En vironme nt so ftware makes

using the programmer simple and efficient. The

PICSTART Plus development programmer supports

most PICmicro devices up to 40 pins. Larger pin count

devices, such as the PIC16C92X and PIC17C76X,

may be supported with an adapter socket. The

PICSTART Plus development programmer is CE

compliant.

PIC18F2220/2320/4220/4320

25.14 PICDEM 1 PICmicro

Demonstration Board

The PICDEM 1 demo nstrat ion boa rd demo nstrate s the

capabilities of the PIC16C5X (PIC16C54 to

PIC16C58A), PIC16C61, PIC16C62X, PIC16C71,

PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All

necessary hardware and software is included to run

basic demo programs. The sample microcontrollers

provi d ed wi t h the P IC DE M 1 de mo ns t rat i on b oar d c an

be pro gramme d with a PRO MATE II de vice pr ogram-

mer or a PICSTART Plus development programmer.

The PICDE M 1 demonstrati on board can be conne cted

to the MPLAB ICE in-circuit emulator for testing. A

proto type area extends the ci rcuitry for a dditio nal appli-

cation components. Features include an RS-232

interface, a potentiometer for simulated analog input,

push button switches and eight LEDs.

25.15 PICDEM.net Internet/Ethernet

Demonstration Board

The PICDEM.net demonstration board is an Internet/

Ethernet demonstration board using the PIC18F452

microcontroller and TCP/IP firmware. The board

supports any 40-pin DIP device that conforms to the

standard pinout used by the PIC16F877 or

PIC18C452. This kit features a user friendly TCP/IP

stack, web server with HTML, a 24L256 Serial

EEPROM for Xmodem download to web pages into

Serial EEPROM, ICSP/MPLAB ICD 2 interface con-

nector, an Ethernet interface, RS-232 interface and a

16 x 2 LCD display. Also included is the book and

CD-ROM “TCP/IP Lean, Web Servers for Embedded

Systems,” by Jeremy Bentham

25.16 PICDEM 2 Plus

Demonstration Board

The PICDEM 2 Plus demonstration board supports

many 18, 28 and 40-pin microcontrollers, including

PIC16F87X and PIC18FXX2 devices. All the neces-

sary ha rdware and s oftware is included to run the dem -

onstration programs. The sample microcontrollers

provi d ed wi t h the P IC DE M 2 de mo ns t rat i on b oar d c an

be pro gramme d with a PRO MATE II de vice pr ogram-

mer, PICSTART Plus development programmer, or

MPLAB ICD 2 with a Universal Programmer Adapter.

The MPLAB I CD 2 and MPLAB I CE in-circuit emul ators

may also be used with the PICDEM 2 demonstration

board to test firmware. A prototype area extends the

circuitry for additional application components. Some

of the features include an RS-232 interface, a 2 x 16

LCD display , a piezo speaker , an on-board temperature

sensor, four LEDs and sample PIC18F452 and

PIC16F8 77 Fla sh mi cro con trol le rs.

25.17 PICDEM 3 PIC16C92X

Demonstration Board

The PICDEM 3 demonstration board supports the

PIC16C923 and PIC16C924 in the PLCC package. All

the necessary hardware and software is included to run

the demonstration programs.

25.18 PICDEM 4 8/14/18-Pin

Demonstration Board

The PICDEM 4 can be used to demonstrate the capa-

bilities of the 8, 14 and 18-pin PIC16XXXX and

PIC18XXXX MCUs, including the PIC16F818/819,

PIC16F8 7/88, PIC16 F62 XA and th e PIC18 F132 0 fam -

ily of microcontrollers. PICDEM 4 is intended to show-

case the many features of these low pin count parts,

including LIN and Motor Control using ECCP. Special

provisions are made for low-power operation with the

supercapacitor circuit and jumpers allow on-board

hardware to be disabled to eliminate current draw in

this mode. Included on the demo board are provisions

for Crystal, RC or Canned Oscillator modes, a five volt

regulato r for use with a ni ne volt wall ad apter or battery,

DB-9 RS-232 interface, ICD connector for program-

ming via ICSP and development with MPLAB ICD 2,

2x16 liquid crystal display, PCB footprints for H-Bridge

motor driver, LIN transceiver and EEPROM. Also

included are: header for expansion, eight LEDs, four

potentiometers, three push buttons and a prototyping

area. Included with the kit is a PIC16F627A and a

PIC18F1320. Tutorial firmware is included along with

the User’s Guide.

25.19 PICDEM 17 Demonstration Board

The P ICDEM 17 de mo ns t rat i on bo a rd is an ev al u at i on

board that demonstrates the capabilities of several

Microchip microcontrollers, including PIC17C752,

PIC17C756A, PIC17C762 and PIC17C766. A pro-

grammed sample i s included. T he PRO MA TE II device

programmer, or the PICSTART Plus development pro-

grammer, can be us ed to re program the device for us er

tailored application development. The PICDEM 17

demonstration board supports program download and

execution from external on-board Flash memory. A

generous proto typ e area is av ailab le for user hardw are

expansion.

PIC18F2220/2320/4220/4320

25.20 PICDEM 18R PIC18C601/801

Demonstration Board

The PICDEM 18R demonstration board serves to assist

development of the PIC18C601/801 family of Microchip

microcontrollers. It provides hardware implementation

of both 8-bit Multiplexed/Demultiplexed and 16-bit

Memory modes. The board includes 2 Mb external

Flash memory and 128 Kb SRAM memory, as well as

serial EEPROM, allowing access to the wide range of

memory types supported by the PIC18C601/801.

25.21 PICDEM LIN PIC16C43X

Demonstration Board

The pow erfu l LI N hard w are a nd s of tw are kit includes a

series of boards and three PICmicro microcontrollers.

The small footprint PIC16C432 and PIC16C433 are

used as slaves in the LIN communication and feature

on-board LIN transceivers. A PIC16F874 Flash

microcontroller serves as the master. All three micro-

controllers are programmed with firmware to provide

LIN b us communication.

25.22 PICkitTM 1 Flash Starter Kit

A complete “development system in a box”, the PICkit

Flash Starter Kit includes a convenient multi-section

board for p rogramming, evaluation a nd development of

8/14-pin Flash PIC® microcontrollers. Powered via

USB, the board operates under a simple Windows GUI.

The PICkit 1 Starter Kit includes the user's guide (on

CD ROM), PICkit 1 tutorial software and code for vari-

ous application s. Als o inc luded are M P LAB® IDE (Inte-

grated Development Environment) software, software

and hardware “Tips 'n Tricks for 8-pin Flash PIC®

Microcontrollers” Handbook and a USB Interface

Cable. Supports all current 8/14-pin Flash PIC

microcontrollers, as well as many future planned

devices.

25.23 PICDEM USB PIC16C7X5

Demonstration Board

The PICDEM U SB Demo ns trati on Board sho w s o f f th e

capabilities of the PIC16C745 and PIC16C765 USB

microcontrollers. This board provides the basis for

future USB products.

25.24 Evaluati on and

Programming Tools

In additio n to the PICDEM seri es of circuits, Microchip

has a line of evaluation kits and demonstration software

for the se products.

•K

EELOQ evaluation and prog ram mi ng too ls for

Microchip’s HCS Secure Data Products

• CAN developers kit for automotive network

applications

• Analog design boards and filter design software

• PowerSmart battery charging evaluation/

calibration kits

•IrDA

® development kit

• microID development and rfLabTM development

software

• SEEVAL® designer k it f or m em ory ev al uation and

endurance calculations

• PICDEM MSC demo boards for Switching mode

power supply, high-power IR driver, delta sigma

ADC and flow rate sensor

Check the Microchip web page and the latest Product

Line Card for the complete list of demonstration and

evaluation kits.

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

26.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings (†)

Ambient temperature under bias.............................................................................................................-55°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD, MCLR and RA4)..........................................-0.3V to (VDD + 0.3V)

Vo lt a ge on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V

Vo lt a ge on MCLR with respect to VSS (Note 2)......................................................................................... 0V to +13.25V

Voltage on RA4 with respect to VSS............................................................................................................... 0V to +8.5V

Total power diss ipation (Note 1) ...............................................................................................................................1.0W

Maximum curr ent o ut of VSS pin ...........................................................................................................................300 mA

Maximum curr ent i nto VDD pin..............................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD).............................................................................................................. ±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin....................................................................................................25 mA

Maximum curr ent su nk by all ports .......................................................................................................................200mA

Maximum current sourced by all ports..................................................................................................................200 mA

Note 1: Power diss ipation is ca lcu la t ed as follows :

Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)

2: V o ltage sp ikes below VSS at the MCLR/VPP pin, induc ing c urrent s g reater than 8 0 mA , ma y ca use l atch-u p.

Thus, a se ries resisto r of 50-100Ω should be u sed w he n a ppl yi ng a “low” level to the MC L R/VPP pin, rath er

than pulling this pin directly to VSS.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

PIC18F2220/2320/4220/4320

FIGURE 26-1: PIC18F2220/2320/4220/4320 V OLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

FIGURE 26-2: PIC18F2220/2320/4220/4320 V OLT AGE-FREQUENCY GRAPH (EXTENDED)

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18F2X20/4X20

4.2V

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

25 MHz

5.0V

3.5V

3.0V

2.5V

PIC18F2X20/4X20

4.2V

PIC18F2220/2320/4220/4320

FIGURE 26-3: PIC18LF2220/2320/4220/4320 VOLT AGE-FREQUENCY GRAPH (INDUSTRIAL)

Frequency

Voltage

6.0V

5.5V

4.5V

4.0V

2.0V

40 MHz

5.0V

3.5V

3.0V

2.5V

PIC18LF2X20/4X20

FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V ) + 4 MHz

Note: VDDAPPMIN is the minimum voltage of the PICmicro® device in the a pplication.

4 MHz

4.2V

PIC18F2220/2320/4220/4320

26.1 DC Characteristics: Supply Voltage

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

VDD Supply Voltage

D001 PIC18LF2X20/4X20 2.0 — 5.5 V HS, XT, RC and LP Osc mode

PIC18F2X20/4X20 4.2 —5.5 V

D002 VDR RAM Data Retention

Voltage(1) 1.5 — — V

D003 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

— — 0.7 V See section on Power-on Reset for details

D004 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 — — V/ms See section on Power-on Reset for details

VBOR Brown-out Reset Volta ge

PIC18LF2X20/4X20 Industrial Low Voltage

D005 BORV1:BORV0 = 11 NA — NA V Reserved

BORV1:BORV0 = 10 2.50 2.72 2.94 V

BORV1:BORV0 = 01 3.88 4.22 4.56 V

BORV1:BORV0 = 00 4.18 4.54 4.90 V

D005 PIC18F2X20/4X20 Industrial

BORV1:BORV0 = 1x NA —NA VNot in operating voltage range of device

BORV1:BORV0 = 01 3.88 4.22 4.56 V

BORV1:BORV0 = 00 4.18 4.54 4.90 V

D005E PIC18F2X20/4X20 Extended

BORV1:BORV0 = 1x NA —NA VNot in operating voltage range of device

BORV1:BORV0 = 01 3.71 4.22 4.73 V

BORV1:BORV0 = 00 4.00 4.54 5.08 V

Legend: Shading of rows is to assist in readability of the table.

Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data.

PIC18F2220/2320/4220/4320

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Power-down Current (IPD)(1)

PIC18LF2X20/4X20 0.1 0.5 μA -40°C VDD = 2.0V,

(Sleep mode)

0.1 0.5 μA +25°C

0.2 1.7 μA +85°C

PIC18LF2X20/4X20 0.1 0.5 μA -40°C VDD = 3.0V,

(Sleep mode)

0.1 0.5 μA +25°C

0.3 1.7 μA +85°C

All devices 0.1 2.0 μA -40°C

VDD = 5.0V,

(Sleep mode)

0.1 2.0 μA +25°C

0.4 6.5 μA +85°C

Extended devices 11.2 50 μA +125°C

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 11 25 μA -40°C VDD = 2.0V

FOSC = 31 kHz

(RC_RUN mode,

internal oscillator source)

13 25 μA+25°C

14 25 μA+85°C

PIC18LF2X20/4X20 34 40 μA -40°C VDD = 3.0V28 40 μA+25°C

25 40 μA+85°C

All devices 77 80 μA -40°C

VDD = 5.0V

62 80 μA+25°C

53 80 μA+85°C

Extended devices 50 80 μA +125°C

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 100 220 μA -40°C VDD = 2.0V

FOSC = 1 MHz

(RC_RUN mode,

internal oscillator source)

110 220 μA+25°C

120 220 μA+85°C

PIC18LF2X20/4X20 180 330 μA -40°C VDD = 3.0V180 330 μA+25°C

170 330 μA+85°C

All devices 340 5 50 μA -40°C

VDD = 5.0V

330 550 μA+25°C

310 550 μA+85°C

Extended devices 410 650 μA +125°C

PIC18LF2X20/4X20 350 600 μA -40°C VDD = 2.0V

FOSC = 4 MHz

(RC_RUN mode,

internal oscillator source)

360 600 μA+25°C

370 600 μA+85°C

PIC18LF2X20/4X20 580 900 μA -40°C VDD = 3.0V580 900 μA+25°C

560 900 μA+85°C

All devices 1.1 1.8 mA -40°C

VDD = 5.0V

1.1 1.8 mA +25°C

1.0 1.8 mA +85°C

Extended devices 1.2 1.8 mA +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320 (Industri al) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperat ure

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 4.7 8 μA -40°C VDD = 2.0V

FOSC = 31 kHz

(RC_IDLE mode,

internal oscillator source)

4.6 8 μA+25°C

5.1 11 μA+85°C

PIC18LF2X20/4X20 6.9 11 μA -40°C VDD = 3.0V6.3 11 μA+25°C

6.8 15 μA+85°C

All devices 12 16 μA -40°C

VDD = 5.0V

10 16 μA+25°C

10 22 μA+85°C

Extended devices 25 75 μA +125°C

PIC18LF2X20/4X20 49 150 μA -40°C VDD = 2.0V

FOSC = 1 MHz

(RC_IDLE mode,

internal oscillator source)

52 150 μA+25°C

56 150 μA+85°C

PIC18LF2X20/4X20 73 180 μA -40°C VDD = 3.0V77 180 μA+25°C

77 180 μA+85°C

All devices 130 3 00 μA -40°C

VDD = 5.0V

130 300 μA+25°C

130 300 μA+85°C

Extended devices 350 435 μA +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 140 275 μA -40°C VDD = 2.0V

FOSC = 4 MHz

(RC_IDLE mode,

internal oscillator source)

140 275 μA+25°C

150 275 μA+85°C

PIC18LF2X20/4X20 220 375 μA -40°C VDD = 3.0V220 375 μA+25°C

210 375 μA+85°C

All devices 390 8 00 μA -40°C

VDD = 5.0V

400 800 μA+25°C

380 800 μA+85°C

Extended devices 410 800 μA +125°C

PIC18LF2X20/4X20 150 250 μA -40°C VDD = 2.0V

FOSC = 1 M HZ

(PRI_RUN,

EC oscillator)

150 250 μA+25°C

160 250 μA+85°C

PIC18LF2X20/4X20 340 350 μA -40°C VDD = 3.0V300 350 μA+25°C

280 350 μA+85°C

All devices 0.72 1.0 mA -40°C

VDD = 5.0V

0.63 1.0 mA +25°C

0.57 1.0 mA +85°C

Extended devices 0.53 1.0 mA +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320 (Industri al) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperat ure

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 440 600 μA -40°C VDD = 2.0V

FOSC = 4 MHz

(PRI_RUN,

EC oscillator)

450 600 μA+25°C

460 600 μA+85°C

PIC18LF2X20/4X20 0.80 1.0 mA -40°C VDD = 3.0V0.78 1.0 mA +25°C

0.77 1.0 mA +85°C

All devices 1.6 2.0 mA -40°C

VDD = 5.0V

1.5 2.0 mA +25°C

1.5 2.0 mA +85°C

Extended devices 1.5 2.0 mA +125°C

Extended devices 6.3 9.0 mA +125°C VDD = 4.2V FOSC = 25 MHZ

(PRI_RUN,

EC oscillator)

7.9 10.0 mA +125°C VDD = 5.0V

All devices 9.5 12 mA -40°C VDD = 4.2V FOSC = 40 MHZ

(PRI_RUN,

EC oscillator)

9.7 12 mA +25°C

9.9 12 mA +85°C

All devices 11.9 15 mA -40°C VDD = 5.0V12.1 15 mA +25°C

12.3 15 mA +85°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

PIC18LF2X20/4X20 37 50 μA -40°C VDD = 2.0V

FOSC = 1 MHz

(PRI_IDLE mode,

EC oscillator)

37 50 μA+25°C

38 60 μA+85°C

PIC18LF2X20/4X20 58 80 μA -40°C VDD = 3.0V59 80 μA+25°C

60 100 μA+85°C

All devices 110 180 μA -40°C

VDD = 5.0V

110 180 μA+25°C

110 180 μA+85°C

Extended devices 125 300 μA +125°C

PIC18LF2X20/4X20 140 180 μA -40°C VDD = 2.0V

FOSC = 4 MHz

(PRI_IDLE mode,

EC oscillator)

140 180 μA+25°C

140 180 μA+85°C

PIC18LF2X20/4X20 220 280 μA -40°C VDD = 3.0V230 280 μA+25°C

230 280 μA+85°C

All devices 410 5 25 μA -40°C

VDD = 5.0V

420 525 μA+25°C

430 525 μA+85°C

Extended devices 450 800 μA +125°C

Extended devices 2.2 3.0 mA +125°C VDD = 4.2V FOSC = 25 MHZ

(PRI_IDLE,

EC oscillator)

2.7 3.5 mA +125°C VDD = 5.0V

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320 (Industri al) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperat ure

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Supply Current (IDD)(2,3)

All devices 3.1 4.1 mA -40°C VDD = 4.2 V FOSC = 40 MHz

(PRI_IDLE mode,

EC oscillator)

3.2 4.1 mA +25°C

3.3 4.1 mA +85°C

All devices 4.4 5.1 mA -40°C VDD = 5.0V4.6 5.1 mA +25°C

4.6 5.1 mA +85°C

PIC18LF2X20/4X20 9 15 μA -40°C VDD = 2.0V

FOSC = 32 kHz (4)

(SEC_RUN mode,

Timer1 as clock)

10 15 μA+25°C

13 18 μA+85°C

PIC18LF2X20/4X20 22 30 μA -40°C VDD = 3.0V21 30 μA+25°C

20 35 μA+85°C

All devices 50 80 μA -40°C VDD = 5.0V50 80 μA+25°C

45 85 μA+85°C

PIC18LF2X20/4X20 5.1 9 μA -40°C VDD = 2.0V

FOSC = 32 kHz (4)

(SEC_IDLE mode,

Timer1 as clock)

5.8 9 μA+25°C

7.9 11 μA+85°C

PIC18LF2X20/4X20 7.9 12 μA -40°C VDD = 3.0V8.9 12 μA+25°C

10.5 14 μA+85°C

All devices 13 20 μA -40°C VDD = 5.0V16 20 μA+25°C

18 25 μA+85°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)

D022

(ΔIWDT)Watchdog Timer 1.5 3.8 μA -40°C VDD = 2.0V2.2 3.8 μA+25°C

2.7 4.0 μA+85°C

2.3 4.6 μA -40°C VDD = 3.0V2.7 4.6 μA+25°C

3.1 4.8 μA+85°C

3.0 10.0 μA -40°C

VDD = 5.0V

3.3 10.0 μA+25°C

3.9 10.0 μA+85°C

Extended devices only 4.0 13.0 μA +125°C

D022A Brown-out Reset 17 35.0 μA-40°C to +85°CV

DD = 3.0V

(ΔIBOR) 47 45.0 μA-40°C to +85°CVDD = 5.0V

Extended devices only 48 50.0 μA-40°C to +125°C

D022B Low-Voltage Detect 14 25.0 μA-40°C to +85°CVDD = 2.0V

(ΔILVD) 18 35.0 μA-40°C to +85°CVDD = 3.0V

21 45.0 μA-40°C to +85°CVDD = 5.0V

Extended devices only 24 50.0 μA-40°C to +125°C

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320 (Industri al) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperat ure

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

D025 Timer1 Oscillator 2.1 2.2 μA-40°CVDD = 2.0V 32 kHz on Timer1(4)

(ΔIOSCB)1.82.2μA+25°C

2.1 2.2 μA+85°C

2.2 3.8 μA-40°CVDD = 3.0V 32 kHz on Timer1(4)

2.6 3.8 μA+25°C

2.9 3.8 μA+85°C

3.0 6.0 μA-40°CVDD = 5.0V 32 kHz on Timer1(4)

3.2 6.0 μA+25°C

3.4 7.0 μA+85°C

D026

(ΔIAD)A/D Converter 1.0 2.0 μA-40°C to +85°CVDD = 2.0V

A/D on, not converting

1.0 2.0 μA-40°C to +85°CVDD = 3.0V

1.0 2.0 μA-40°C to +85°CVDD = 5.0V

Extended devices only 1.0 8.0 μA-40°C to +125°CVDD = 5.0V

26.2 DC Characteristics: Power-Down and Supply Current

PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial) (Continued)

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Condi t ions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Typ Max Units Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with

the part in Sleep mode, with all I/O pins in high-impedanc e state and tied to VDD or VSS and all features that add delta

current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;

MCLR = VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated

by the formula Ir = VDD/2REXT (mA) with REXT in kΩ.

4: S tandard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2220/2320/4220/4320

26.3 DC Characteristics: PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temp erature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Symbol Characteristic Min Max Units Conditions

VIL Input Low Volta ge

I/O ports:

D030 with TTL buf fer VSS 0.15 VDD VVDD < 4.5V

D030A — 0.8 V 4.5V ≤ VDD ≤ 5.5V

D031 with Schmitt Trigger buffer

RC3 and RC4 VSS

VSS 0.2 VDD

0.3 VDD V

D032 MCLR VSS 0.2 VDD V

D032A OSC1 and T1OSI VSS 0.2 VDD V LP, XT, HS, HSPLL

modes(1)

D033 OSC1 VSS 0.2 VDD VEC mode

(1)

VIH Input High Volt age

I/O ports:

D040 with TTL buf fer 0.25 V DD + 0.8V VDD VVDD < 4.5V

D040A 2.0 VDD V4.5V ≤ VDD ≤ 5.5V

D041 with Schmitt Trigger buffer

RC3 and RC4 0.8 VDD

0.7 VDD VDD

VDD V

D042 MCLR 0.8 VDD VDD V

D042A OSC1 an d T1OSI 1.6 VDD V L P, XT, HS, HSPLL

modes(1)

D043 OSC1 0.8 VDD VDD VEC mode

(1)

IIL Input Leakage Current (2,3)

D060 I/O ports — ±0.2 μAVSS ≤ VPIN ≤ VDD,

Pin at high-impedance

D061 MCLR, RA4 — ±1.0 μAVss ≤ VPIN ≤ VDD

D063 OSC1 — ±1.0 μAVss ≤ VPIN ≤ VDD

IPU Weak Pull-up Current

D070 IPURB PORTB weak pull- up current 50 400 μAVDD = 5V, VPIN = VSS

Note 1: In RC oscillat or c on figu rati on, the OSC 1/CL KI pin is a Sc hm itt Trigger input. It is not recommend ed that the

PICmicro device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: Parameter is characterized but not tested.

PIC18F2220/2320/4220/4320

VOL Output Low Voltage

D080 I/O ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V,

-40°C to +85°C

D080A — 0.6 V IOL = 7.0 mA, VDD = 4.5V,

-40°C to +125°C

D083 OSC2/CLKO

(RC mode) —0.6VI

OL = 1.6 mA, VDD = 4.5V,

-40°C to +85°C

D083A — 0.6 V IOL = 1.2 mA, VDD = 4.5V,

-40°C to +125°C

VOH Output High Voltage(3)

D090 I/O ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V,

-40°C to +85°C

D090A VDD – 0.7 — V IOH = -2.5 mA, VDD = 4.5V,

-40°C to +125°C

D092 OSC2/CLKO

(RC mode) VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V,

-40°C to +85°C

D092A VDD – 0.7 — V IOH = -1.0 mA, VDD = 4.5V,

-40°C to +125°C

D150 VOD Open-Drain High Voltage — 8.5 V RA4 pin

Capacitive Loading Specs

on Output Pins

D100(4) COSC2 OSC2 pin —15 pF In XT, HS and LP modes

when external clock is

used to drive OSC1

D101 CIO All I/O pins and OSC2

(in RC mode) — 50 pF To meet the AC Timing

Specifications

D102 CBSCL, SDA — 400 pF In I2C mode

26.3 DC Characteristics: PIC18F2220/2320/ 4220/4320 (Industrial)

PIC18LF2220/2320/ 4220/4320 (Industrial) ( Co ntinued)

DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)

Operating temp erature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Symbol Characteristic Min Max Units Conditions

Note 1: In RC oscillat or c on figu rati on, the OSC 1/CL KI pin is a Sc hm itt Trigger input. It is not recommend ed that the

PICmicro device be driven with an external clock while in RC mode.

2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

3: Negative current is defined as current sourced by the pin.

4: Parameter is characterized but not tested.

PIC18F2220/2320/4220/4320

TABLE 26-1: MEMORY PROGRAMMING REQUIREMENTS

DC Character ist ics Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Sym Characteristic Min Typ† Max Units Conditions

Internal Program Memory

Programming Specifications

D110 VPP Voltage on MCLR/VPP pin 9.00 — 13.25 V (Note 2)

D112 IPP Current into MCLR/VPP pin — — 300 μA

D113 IDDP Supply Current during

Programming ——1.0mA

Data EEPROM Memory

D120 EDByte Endurance 100K

10K 1M

100K —

—E/W

E/W -40°C to +85°C

-40°C to +125°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write

VMIN = Minimum operating

voltage

D122 TDEW Erase/Write Cycle Time — 4 — ms

D123 TRETD Characteristic Retention 40 — — Year Provided no other

specifications are violated

D124 TREF Nu mber of Total Eras e/Writ e

Cycles before Re fresh(1) 1M

100K 10M

1M —

—E/W

E/W -40°C to +85°C

-40°C to +125°C

Program Flash Memory

D130 EPCell Endurance 10K

1K 100K

10K —

—E/W

E/W -40°C to +85°C

-40°C to +125°C

D131 VPR VDD for Read V MIN —5.5VVMIN = Minimum operating

voltage

D132 VIE VDD for Block Erase 4.5 — 5.5 V Using ICSP port

D132A VIW VDD for Externally Timed Erase

or Write 4.5 — 5.5 V Using ICSP port

D132B VPEW VDD for Self-timed Write VMIN —5.5VVMIN = Minimum operating

voltage

D133 TIE ICSP Block Erase Cycle Ti me — 4 — ms VDD > 4.5V

D133A TIW ICSP E rase or Write Cycle Time

(externall y tim ed) 1——msVDD > 4.5V

D133A TIW Self-tim ed Write Cycle Time — 2 — ms

D134 TRETD Characteristic Retention 40 — — Year Provided no other

specifications are violated

† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested .

Note 1: Refer to Section 7.8 “Using the Data EEPROM” for a more detailed discussion on data EEPROM

endurance.

2: Required only if Low-Voltage Programming is disabled.

PIC18F2220/2320/4220/4320

TABLE 26-2: COMPARATOR SPECIFICATIONS

TABLE 26-3: VOLTAGE REFERENCE SPECIFICATIONS

Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +125°C, unless otherwise stated.

Param

No. Sym Characteristics Min Typ Max Units Comments

D300 VIOFF Input Offset Voltage — ± 5.0 ± 10 mV

D301 VICM Input Common Mode Voltage* 0 — VDD – 1.5 V

D302 CMRR Co mm on Mo de Re je cti on Ra tio * 55 — — d B

300

300A TRESP Response Time(1)* —150400

600 ns

ns PIC18FXX20

PIC18LFXX20

301 TMC2OV Comparator Mode Change to

Output Valid * ——10μs

* These parameters are characterized but not tested.

Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions

from VSS to VDD.

Operating Condit ions : 3.0V < VDD < 5.5V, -40°C < TA < +125°C, unless otherwise stated.

Param

No. Sym Characteristics Min Typ Max Units Comments

D310 VRES Resolution VDD/24 — VDD/32 LSb

D311 VRAA Absol ute Accuracy —

——

—1/2

1/2 LSb

LSb Low Range (VRR = 1)

High Range (VRR = 0)

D312 VRUR Unit Resistor Value (R)*—2k—Ω

310 TSET Settling Time(1)* — — 10 μs

* These parameters are characterized but not tested.

Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.

PIC18F2220/2320/4220/4320

FIGURE 26-4: LOW-VOLTAGE DETECT CHARACTERISTICS

TABLE 26-4: LOW-VOLTAGE DETECT CHARACTERISTICS

PIC18LF2220/2320/4220/4320

(Industrial) Standard Operating Conditions (unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F2220/2320/4220/4320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Symbol Characteristic Min Typ† Max Units Conditions

D420 LVD Voltage on VDD Transition High to Low Industrial

PIC18LF2X20/4X20 LVDL<3:0> = 0000 N/A N/A N/A V Reserved

LVDL<3:0> = 0001 N/A N/A N/A V Reserved

LVDL<3:0> = 0010 2.15 2.26 2.37 V

LVDL<3:0> = 0011 2.33 2.45 2.58 V

LVDL<3:0> = 0100 2.43 2.55 2.68 V

LVDL<3:0> = 0101 2.63 2.77 2.91 V

LVDL<3:0> = 0110 2.73 2.87 3.01 V

LVDL<3:0> = 0111 2.91 3.07 3.22 V

LVDL<3:0> = 1000 3.20 3.36 3.53 V

LVDL<3:0> = 1001 3.39 3.57 3.75 V

LVDL<3:0> = 1010 3.49 3.67 3.85 V

LVDL<3:0> = 1011 3.68 3.87 4.07 V

LVDL<3:0> = 1100 3.87 4.07 4.28 V

LVDL<3:0> = 1101 4.06 4.28 4.49 V

LVDL<3:0> = 1110 4.37 4.60 4.82 V

D420 LVD Voltage on VDD Transition High to Low Industrial

PIC18F2X20/4X20 LVDL<3:0> = 1011 3.68 3.87 4.07 V

LVDL<3:0> = 1100 3.87 4.07 4.28 V

LVDL<3:0> = 1101 4.06 4.28 4.49 V

LVDL<3:0> = 1110 4.37 4.60 4.82 V

D420E LVD Voltage on VDD Transition High to Low Extended

PIC18F2X20/4X20 LVDL<3:0> = 1011 3.48 3.87 4.25 V

LVDL<3:0> = 1100 3.66 4.07 4.48 V

LVDL<3:0> = 1101 3.85 4.28 4.70 V

LVDL<3:0> = 1110 4.14 4.60 5.05 V

Legend: Shading of rows is to assist in readability of the table.

† Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization.

VLVD

LVDIF

VDD

(LVDIF set by hardware)

(LVDIF can be

cleared in software)

PIC18F2220/2320/4220/4320

26.4 AC (Timing) Charact eristics

26.4.1 TIMING PARAME TER SYMBOLOGY

The timing parameter symbols have been created

following one of the following formats:

1. TppS2ppS 3. TCC:ST (I2C specifications only)

2. TppS 4. Ts (I2C specifications only)

TF Frequency T Time

Lowercase letters (pp) and their meanings:

pp cc CCP1 osc OSC1

ck CLKO rd RD

cs CS rw RD or WR

di SDI sc SCK

do SDO ss SS

dt Data in t0 T0CKI

io I/O port t1 T1CKI

mc MCLR wr WR

Uppe rcase letters and th eir meanings:

SF Fall P Period

HHigh RRise

I Invalid (High-impedance) V Valid

L Low Z High-impedance

I2C only

AA outpu t access High High

BUF Bus free Low Low

TCC:ST (I2C specifications only)

CC HD Hold SU Setup

ST DAT DATA input hold STO Stop condition

STA Start condition

PIC18F2220/2320/4220/4320

26.4.2 TIMING CONDITIONS

The temperature and voltages specified in Table 26-5

apply to all timing specifications unless otherwise

noted. Figure 26-5 specifies the load conditions for the

timing specificati o n s.

TABLE 26-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 26-5: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

Note: Becaus e of space limitations, the generic

terms “PIC18 FXX20” and “PIC18LFXX2 0”

are used throughout this section to refer

to the PIC18F2220/2320/4220/4320 and

PIC18LF2220/2320/4220/4320 families of

devices specifically and only those

devices.

AC CHARACTERISTICS

S tandard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Operating voltage VDD range as described in DC spec Section 26.1 and

Section 26.3.

LF parts operate up to industrial temperatures only.

VDD/2

VSS

RL=464Ω

CL= 50 pF f or all pins except OSC2/CLKO

and including D and E outputs as ports

Load Condition 1 Load Condition 2

PIC18F2220/2320/4220/4320

26.4.3 TIMING DIAGRAMS AND SPECIFICATIONS

FIGURE 26-6: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL)

TABLE 26-6: EXTERNAL CLOCK TIMING REQUIREMENT S

OSC1

CLKO

Q4 Q1 Q2 Q3 Q4 Q1

23344

Param.

No. Symbol Characteristic Min Max Units Conditions

1A FOSC External CLKI Frequency(1) DC 40 MHz EC, ECIO (industrial)

DC 25 MHz EC, ECIO (exten ded )

Oscillator Frequency(1) DC 4 MHz RC osc

0.1 1 MHz XT osc

4 25 MHz HS osc

4 10 MHz HS + PLL osc (industrial)

4 6.25 MHz HS + PLL osc (extended)

5 33 kHz LP Osc mode

OSC External CLKI Period(1) 25 — n s EC, ECIO (industrial)

40 — ns EC, ECIO (exten ded )

Oscillator Period(1) 250 — ns RC osc

1—μsXT osc

100 250

250 ns

ns HS osc

HS + PLL osc (industrial)

160 250 ns HS + PLL osc (extended)

30 — μsLP osc

2TCY Ins tr ucti on Cycle Time(1) 100

160 —

—ns

ns TCY = 4/FOSC (industrial)

TCY = 4/FOSC (extended)

3TOSL,

TOSHExternal Clock in (OSC1)

High or Low Time 30 — ns XT osc

2.5 — μsLP osc

10 — ns HS osc

OSR,

TOSFExternal Clock in (OSC1)

Rise or Fall Time — 20 ns XT osc

— 50 ns LP osc

— 7.5 ns HS osc

Note 1: Instruction cy cle period (TCY) equals four times the input oscillator time base period for all configurations

except PLL. All specified values are based on characterization data for that particular oscillator type under

standard operating conditions with the device executing code. Exceeding these specified limits may result

in an unst abl e oscilla tor ope ration an d/or high er than expected current consumption. All devices are tested

to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock

input is used, the “max.” cycle time limit is “DC” (no clock) for all devices.

PIC18F2220/2320/4220/4320

TABLE 26-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V)

Param

No. Sym Characteristic Min Typ† Max Units Conditions

F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS mode only

F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HS mode only

F12 tPLL PLL Start-up Time (Lock Time) — — 2 ms

F13 ΔCLK CLKO Stability (Jitter) -2 — +2 %

† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested .

TABLE 26-8: INTERNAL RC ACCURACY: PIC18F2220/2320/4220/4320 (Industrial)

PIC18LF2220/2320/4220/4320 (Industrial, Extended)

PIC18LF1220/1320

(Industrial) Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

PIC18F1220/1320

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial

-40°C ≤ TA ≤ +125°C for extended

Param

No. Device Min Typ Max Units Conditions

INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1)

F14 PIC18LF2220/2320/4220/4320 -2 +/-1 2 % +25°C VDD = 2.7-3.3V

F15 -5 — 5 % -10°C to +85°C VDD = 2.7-3.3V

F16 -10 — 10 % -40°C to +85°C VDD = 2.7-3.3V

F17 PIC18F2220/2320/4220/4320 -2 +/-1 2 % +25°C VDD = 4.5-5.5V

F18 -5 — 5 % -10°C to +85°C VDD = 4.5-5.5V

F19 -10 —10 %-40°C to +85°C VDD = 4.5-5.5V

INTRC Accuracy @ Freq = 31 kHz(2)

F20 PIC18LF2220/2320/4220/4320 26. 562 — 35.938 kHz -40°C to +85°C V DD = 2.7-3.3V

F21 PIC18F2220/2320/4220/4320 26.562 —35.938 kHz -40°C to +85°C VDD = 4.5-5.5V

Legend: Shading of rows is to assist in readability of the table.

Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.

2: INTRC frequency after calibration.

3: Change of INTRC frequency as VDD changes.

PIC18F2220/2320/4220/4320

FIGURE 26-7: CLKO AND I/O TIMING

TABLE 26-9: CLKO AND I/O TIMING REQUIREMENTS

Note: Refer to Figure 26-5 for load conditions.

OSC1

CLKO

I/O pin

(Input)

I/O pin

(Output)

Q4 Q1 Q2 Q3

13 14

20, 21

19 18

Old Value New Value

Param

No. Symbol Characteristic Min Typ Max Units Conditions

10 TOSH2CKLOSC1 ↑ to CLKO ↓ — 75 200 ns (1)

11 TOSH2CKHOSC1 ↑ to CLKO ↑ — 75 200 ns (1)

12 TCKR CLKO Rise Time — 35 100 ns (1)

13 TCKF CLKO Fall Time — 35 100 ns (1)

14 TCKL2IOVCLKO ↓ to Port Out Valid — — 0.5 TCY + 2 0 ns (1)

15 TIOV2CKH Port In Valid before CLKO ↑ 0.25 TCY + 25 — — ns (1)

16 TCKH2IOI Port In Hold after CLKO ↑ 0——ns(1)

17 TOSH2IOVOSC1↑ (Q1 cycle) to Port Out Valid — 50 150 ns

18 TOSH2IOIOSC1↑ (Q2 cycle) to Port

Input Invalid

(I/O in hold time)

PIC18FXX20 100 — — ns

18A PIC18LFXX20 200 — — ns

19 TIOV2OSH Port Input Valid to OS C 1↑ ( I/O i n se tu p t im e) 0 — — ns

20 TIOR Port Output Rise Time PIC18FXX20 — 10 25 ns

20A PIC18LFXX20 — — 60 ns

21 TIOF Port Output Fall Time PIC18FXX20 — 10 25 ns

21A PIC18LFXX20 — — 60 ns

Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.

PIC18F2220/2320/4220/4320

FIGURE 26-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING

FIGURE 26-9: BROWN-OUT RESET TIMING

TABLE 26-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET REQUIREMENTS

Param.

No. Symbol Characteristic Min Typ Max Units Conditions

30 TMCLMCLR Pulse Width (low) 2 — — μs

31 TWDT W atchdog T imer T ime-out Period (no postscaler) 3.48 4.00 4.71 ms

32 TOST Oscillation St art -up Timer Period 1024 TOSC — 1024 TOSC —TOSC = OSC1 period

33 TPWRT Power-up Timer Period 57.0 65.5 77.2 ms

34 TIOZ I/O High-Impedance from M CLR Low or

Watchdog Timer Reset —2—μs

35 TBOR Br own-out Reset Pulse Width 200 — — μsVDD ≤ BVDD (see D005)

36 TIVRST Time for Internal Reference Volt age to become

stable —2050μs

37 TLVD Low-Volt age Detect Pulse Width 200 — — μsVDD ≤ VLVD

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

Reset

Watchdog

Timer

Reset

I/O pins

Note: Refer to Figure 26-5 for load conditions.

VDD BVDD

35 VBGAP = 1.2V

VIRVST

Enable Internal

Internal Reference 36

Reference Voltage

Voltage Stable

PIC18F2220/2320/4220/4320

FIGURE 26-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS

TABLE 26-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS

Note: Refer to Figure 26-5 for load conditions.

T0CKI

T1OSO/T1CKI

TMR0 or

TMR1

Param

No. Symbol Characteristic Min Max Units Conditions

40 TT0H T0C KI High P ulse Width No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

41 TT0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

42 TT0P T0CKI Period No prescaler TCY + 10 — ns

With prescaler Greater of:

20 ns or TCY + 40

—nsN = prescale

value

(1, 2, 4,..., 256)

45 TT1H T1CKI

High Time Synchronous, no prescaler 0.5 TCY + 20 — ns

Synchronous,

with prescaler PIC18FXX20 10 — ns

PIC18LFXX20 25 — ns

Asynchronous PIC18FXX20 30 — ns

PIC18LFXX20 50 — ns

46 TT1L T1CKI

Low Time Synchronous, no prescaler 0.5 TCY + 5 — ns

Synchronous,

with prescaler PIC18FXX20 10 — ns

PIC18LFXX20 25 — ns

Asynchronous PIC18FXX20 30 — ns

PIC18LFXX20 50 — ns

47 TT1P T1CKI

Input

Period

Synchronous Greater of:

20 ns or TCY + 40

—nsN = prescale

value

(1, 2, 4, 8)

Asynchronous 60 — ns

FT1 T1CKI Oscillator Input Frequency Range DC 50 kHz

48 TCKE2TMRI Delay from External T1CKI Clock Edge to

Timer Increment 2 TOSC 7 TOSC —

PIC18F2220/2320/4220/4320

FIGURE 26-11: CAPTURE/COMPARE/PWM T IMINGS (ALL CCP MODULES)

TABLE 26-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES)

Note: Refer to Figure 26-5 for load conditions.

CCPx

(Capture Mode)

50 51

CCPx

53 54

(Compare or PWM Mode)

Param

No. Symbol Characteristic Min Max Units Conditions

50 TCCL CCPx Input Low

Time No prescaler 0.5 TCY + 20 — ns

With

prescaler PIC18FXX20 10 — ns

PIC18LFXX20 20 — ns

51 TCCH CCPx Input High

Time No prescaler 0.5 TCY + 20 — ns

With

prescaler PIC18FXX20 10 — ns

PIC18LFXX20 20 — ns

52 TCCP CCPx Input Period 3 TCY + 40

N—nsN = prescale

value (1,4 or 16)

53 TCCR CCPx Output Fall Time PIC18FXX20 — 25 ns

PIC18LFXX20 — 45 ns

54 TCCF CCPx Output Fall Time PIC18FXX20 — 25 ns

PIC18LFXX20 — 45 ns

PIC18F2220/2320/4220/4320

FIGURE 26-12: PARALLEL SLAVE PORT TIMING (PIC18F4X20)

TABLE 26-13: PARALLEL SLAVE PORT REQUIREMENTS (PIC18F4X20)

Note: Refer to Figure 26-5 for load conditions.

RE2/CS

RE0/RD

RE1/WR

RD7:RD0

Param.

No. Symbol Characteristic Min Max Units Conditions

62 TDTV2WRH Data in valid before WR ↑ or CS ↑

(setup time) 20 — ns

63 TWRH2DTIWR ↑ or CS ↑ to data–i n invalid

(hold time) PIC18FXX20 20 — ns

PIC18LFXX20 35 — ns

64 TRDL2DTVRD ↓ and CS ↓ to data–out valid — 80 ns

65 TRDH2DTIRD ↑ or CS ↓ to data–out invalid 10 30 ns

66 TIBFINH Inhibit of the IBF flag bit being cleared from

WR ↑ or CS ↑—3 T

PIC18F2220/2320/4220/4320

FIGURE 26-13 : EXAMPL E SPI MA STER MODE TIMING (CKE = 0)

TABLE 26-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

73 74

75, 76

MSb LSb

bit 6 - - - - - -1

MSb In LSb In

bit 6 - - - -1

Note: Refer to Figure 26-5 for load conditions.

Param

No. Symbol Characteristic Min Max Units Conditions

70 TSSL2SCH,

TSSL2SCLSS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TSCH SCK Input High Time

(Slave mode) Continuous 1.25 TCY + 30 — ns

71A Sing le Byte 40 — ns (Note 1)

72 TSCL SCK Input Low Time

(Slave mode) Continuous 1.25 TCY + 30 — ns

72A Sing le Byte 40 — ns (Note 1)

73 TDIV2SCH,

TDIV2SCLSetup Time of SDI Data Input to SCK Edge 100 — ns

73A TB2BLast C lock Edg e of Byt e 1 to th e 1st Cl ock Ed ge

of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TSCH2DIL,

TSCL2DILHold Time of SDI Data Input to SCK Edge 100 — ns

75 TDOR SDO Data Output Rise Time PIC18FXX20 — 25 ns

PIC18LFXX20 — 45 ns

76 TDOF SDO Data Output Fall Time — 25 ns

78 TSCR SCK Output Rise Time

(Master mode) PIC18FXX20 — 25 ns

PIC18LFXX20 — 45 ns

79 TSCF SCK Output Fall Time (Master mode) — 25 ns

80 TSCH2DOV,

TSCL2DOVSDO Data Output Valid after

SCK Edge PIC18FXX20 — 50 ns

PIC18LFXX20 — 100 ns

Note 1: Requires the use of Parameter # 73A.

2: Only if Parameter # 71A and # 72A are used.

PIC18F2220/2320/4220/4320

FIGURE 26-14 : EXAMPL E SPI MA STER MODE TIMING (CKE = 1)

TABLE 26-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1)

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

75, 76

MSb

MSb In

bit 6 - - - - - -1

LSb In

bit 6 - - - -1

LSb

Note: Refer to Figure 26-5 for load conditions.

Param.

No. Symbol Characteristic Min Max Units Conditions

71 TSCH SCK Input High Time

(Slave mode) Continuous 1.25 TCY + 30 — ns

71A Single Byte 40 — n s (Note 1)

72 TSCL SCK Input Low Time

(Slave mode) Continuous 1.25 TCY + 30 — ns

72A Single Byte 40 — n s (Note 1)

73 TDIV2SCH,

TDIV2SCLSetup Time of SDI Data Input to SCK Edge 100 — ns

73A TB2BLast C l oc k Edge of By te 1 to the 1s t Clo ck Ed ge

of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TSCH2DIL,

TSCL2DILHold Time of SDI Data Input to SCK Edge 100 — ns

75 TDOR SDO Data Output Rise Time PIC18FXX20 — 25 ns

PIC18LFXX20 45 ns

76 TDOF SDO Data Output Fall Time — 25 ns

78 TSCR SCK Output Rise Time

(Master mode) PIC18FXX20 — 25 ns

PIC18LFXX20 45 ns

79 TSCF SCK Output Fall Time (Master mode) — 25 ns

80 TSCH2DOV,

TSCL2DOVSDO Data Output Valid after

SCK Edge PIC18FXX20 — 50 ns

PIC18LFXX20 100 ns

81 TDOV2SCH,

TDOV2SCLSDO Data Output Setup to SCK Edge TCY —ns

Note 1: Requires the use of Parameter # 73A.

2: Only if Parameter # 71A and # 72A are used.

PIC18F2220/2320/4220/4320

FIGURE 26-15: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0)

TABLE 26-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TSSL2SCH,

TSSL2SCLSS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TSCH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TSCL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73 TDIV2SCH,

TDIV2SCLSetup Time of SDI Data Input to SCK Edge 100 — ns

73A TB2BLast Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TSCH2DIL,

TSCL2DILHold Time of SDI Data Input to SCK Edge 100 — ns

75 TDOR SDO Data Output Rise Time PIC18FXX20 — 25 ns

PIC18LFXX20 45 ns

76 TDOF SDO Data Output Fall Time — 25 ns

77 TSSH2DOZSS ↑ to SDO Output High-Impedance 10 50 ns

78 TSCR SCK Output Rise Time (Master mode) PIC18FXX20 — 25 ns

PIC18LFXX20 45 ns

79 TSCF SCK Output Fall Time (Master mode) — 25 ns

80 TSCH2DOV,

TSCL2DOVSDO Data Output Valid after SCK Edge PIC18FXX20 — 50 ns

PIC18LFXX20 100 ns

83 TscH2ssH,

TscL2ssH SS ↑ after SCK Edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter # 73A.

2: Only if Parameter # 71A and # 72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

73 74

75, 76 77

SDI

MSb LSb

bit 6 - - - - - -1

MSb In bit 6 - - - -1 LSb In

Note: Refer to Figure 26-5 for load conditions.

PIC18F2220/2320/4220/4320

FIGURE 26-16: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1)

TABLE 26-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1)

Param

No. Symbol Characteristic Min Max Units Conditions

70 TSSL2SCH,

TSSL2SCLSS ↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TSCH SCK Input High Time

(Slave mode) Continuous 1.2 5 TCY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TSCL SCK Input Low Time

(Slave mode) Continuous 1.2 5 TCY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73A TB2BLast Clock Edge of Byte 1 to the First Clo ck Edge of Byte 2 1.5 TCY + 40 — ns (Note 2)

74 TSCH2DIL,

TSCL2DILHold Time of SDI Data Input to SCK Edge 100 — ns

75 TDOR SDO Data Output Rise Time PIC18FXX20 — 25 ns

PIC18LFXX20 45 ns

76 TDOF SDO Data Output Fall Time — 25 ns

77 TSSH2DOZSS↑ to SDO Output High-Impedance 10 50 ns

78 TSCR SCK Output Rise Time

(Master mode) PIC18FXX20 — 25 ns

PIC18LFXX20 — 45 ns

79 TSCF SCK Output Fall Ti me (Master mode) — 25 ns

80 TSCH2DOV,

TSCL2DOVSDO Data Output Valid after SCK

Edge PIC18FXX20 — 50 ns

PIC18LFXX20 — 100 ns

82 TSSL2DOV SDO Data Output Valid after SS ↓

Edge PIC18FXX20 — 50 ns

PIC18LFXX20 — 100 ns

83 TscH2ssH,

TscL2ssH SS ↑ after SCK edge 1.5 TCY + 40 — ns

Note 1: Requires the use of Parameter # 73A.

2: Only if Parameter # 71A and # 72A are used.

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

SDI

75, 76

MSb bit 6 - - - - - -1 LSb

MSb In bit 6 - - - -1 LSb In

Note: Refer to Figure 26-5 for load conditions.

PIC18F2220/2320/4220/4320

FIGURE 26-17 : I2C BUS START/STOP BITS TIMING

TABLE 26-18: I2C BUS START/STOP BITS REQUIREMENTS (SLAVE MODE)

FIGURE 26-18 : I2C BUS DATA TIMING

Note: Refer to Figure 26-5 for load conditions.

SCL

SDA

Start

Condition Stop

Condition

Param.

No. Symbol Characteristic Min Max Units Conditions

90 TSU:STA Start condition 100 kHz mode 4700 — ns Only relevant for Repeated

Start condition

Setup time 400 kHz mode 600 —

91 THD:STA Start condition 100 kHz mode 4000 — ns After this period, the first

clock pul se is generated

Hold time 400 kHz mode 600 —

92 TSU:STO Stop condition 100 kHz mode 4700 — ns

Setup time 400 kHz mode 600 —

93 THD:STO Stop condition 100 kHz mode 4000 — ns

Hold time 400 kHz mode 600 —

Note: Refer to Figure 26-5 for load conditions.

91 92

100

101

103

106 107

109 109 110

102

SCL

SDA

Out

PIC18F2220/2320/4220/4320

TABLE 26-19: I2C BUS DATA REQUIREMENT S (SLAVE MODE)

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 4.0 — μs PIC 18FXX20 must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — μs PIC18FXX20 m ust operate at a

minimum of 10 MHz

SSP module 1.5 TCY —

101 TLOW Clock Low Time 100 kHz mode 4.7 — μs PIC18F XX20 m ust operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — μs PIC18FXX20 m ust operate at a

minimum of 10 MHz

SSP module 1.5 TCY —

102 TRSDA and SCL Rise

Time 100 kHz mode — 1000 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from 10 to 400 pF

103 TFS DA and SCL Fall

Time 100 kHz mode — 300 ns

400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from 10 to 400 pF

90 TSU:STA S t art Condition Setup

Time 100 kHz mode 4.7 — μs On ly relevant for Repeated

Start condition

400 kHz mode 0.6 — μs

91 THD:STA Start Condition Hold

Time 100 kHz mode 4.0 — μs After this period, the first clock pulse is

generated

400 kHz mode 0.6 — μs

106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

107 TSU:DAT Data Input Setup

Time 100 kHz mode 250 — ns (Note 2)

400 kHz mode 100 — ns

92 TSU:STO S top Condition Setup

Time 100 kHz mode 4.7 — μs

400 kHz mode 0.6 — μs

109 TAA Output Valid from

Clock 100 kHz mode — 3500 ns (Note 1)

400 kHz mode — — ns

110 TBUF Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free before a

new transmission can start

400 kHz mode 1.3 — μs

D102 CBBus Capacitive Loading — 400 pF

Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns)

of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

2: A fast mode I2C bus device can be used in a standard mode I2C bus system but the requirement, TSU:DAT ≥250 ns,

must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If

such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line,

TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification), before the SCL line

is released.

PIC18F2220/2320/4220/4320

FIGURE 26-19: MASTER SSP I2C BUS START/STOP BITS TIMING WAVEFORMS

TABLE 26-20: MASTER SSP I2C BUS START/STOP BITS REQUIREMENTS

FIGURE 26-20: MASTER SSP I2C BUS DATA TIMING

Note: Refer to Figure 26-5 for load conditions.

91 93

SCL

SDA

Start

Condition Stop

Condition

90 92

Param.

No. Symbol Characteristic Min Max Units Conditions

90 TSU:STA Start condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Only relevant for

Repeated Start condition

Setup time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

91 THD:STA Start condition 100 kHz mode 2(TOSC)(BRG + 1) — ns After this period, the first

clock pulse is generated

Hold time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

92 TSU:STO Stop conditio n 100 kHz mode 2(TOSC)(BRG + 1) — n s

Setup time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

93 THD:STO Stop condition 100 kHz mode 2(TOSC)(BRG + 1) — ns

Hold time 400 kHz mode 2(TOSC)(BRG + 1) —

1 MHz mode(1) 2(TOSC)(BRG + 1) —

Note 1: Maximum pin capacitance = 10 pF for all I2C pins.

Note: Refer to Figure 26-5 for load conditions.

90 91 92

100 101

103

106 107

109 109 110

102

SCL

SDA

Out

PIC18F2220/2320/4220/4320

TABLE 26-21: MASTER SSP I2C BUS DATA REQUIREMENTS

Param.

No. Symbol Characteristic Min Max Units Conditions

100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mode(1) 2(TOSC)(BRG + 1) — ms

102 TRSDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mo de(1) — 300 ns

103 TFSDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB 300 ns

1 MHz mo de(1) — 100 ns

90 TSU:STA Start Condition

Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for

Repeated Start condition

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mo de(1) 2(TOSC)(BRG + 1) — ms

91 THD:STA Start Condition

Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first

clock pulse is generated

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mo de(1) 2(TOSC)(BRG + 1) — ms

106 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 ms

1 MHz mo de(1) TBD — ns

107 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns (Note 2)

400 kHz mode 100 — ns

1 MHz mo de(1) TBD — ns

92 TSU:STO Stop Condition

Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms

400 kHz mode 2(TOSC)(BRG + 1) — ms

1 MHz mo de(1) 2(TOSC)(BRG + 1) — ms

109 TAA Output Valid from

Clock 100 kHz mode — 3500 ns

400 kHz mode — 1000 ns

1 MHz mo de(1) ——ns

110 TBUF Bus Free Tim e 100 kHz mode 4.7 — ms Tim e the bus must be free

before a n ew transmi ssion

can start

400 kHz mode 1.3 — ms

1 MHz mo de(1) TBD — ms

D102 CBBus Capacitive Loading — 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I2C pins.

2: A fast mode I 2C bu s d evice can be used in a s tand ard mod e I2C bus s ystem, bu t par ameter # 107 ≥250 ns,

must then be met. This will automatically be the case if the device does not stretch the LOW period of the

SCL signa l. I f su ch a device d oe s s tretc h t he L OW peri od o f th e SCL s ign al , it m us t ou tpu t the nex t da t a b it

to the SDA line, p aram eter # 102 + p aramet er #107 = 1000 + 250 = 1250 ns (for 100 kHz m ode), befo re the

SCL line is released.

PIC18F2220/2320/4220/4320

FIGURE 26-21: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING

TABLE 26-22: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS

FIGURE 26-22: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING

TABLE 26-23: USART SYNCHRONOUS RECEIVE REQUIREMENTS

121 121

120 122

RC6/TX/CK

RC7/RX/DT

Note: Refer to Figure 26-5 for load conditions.

Param

No. Symbol Characteristic Min Max Units Conditions

120 TCKH2DTV SYNC XMIT (MASTER & SLAVE)

Clock High to Data Out Valid PIC18FXX20 — 40 ns

PIC18LFXX20 — 100 ns

121 TCKRF Clock Out Rise Time and Fall Time

(Master mode) PIC18FXX20 — 20 ns

PIC18LFXX20 — 50 ns

122 TDTRF Data Out Rise Time and Fall Time PIC18FXX20 — 20 ns

PIC18LFXX20 — 50 ns

125

126

RC6/TX/CK

RC7/RX/DT

Note: Refer to Figure 26-5 for load conditions.

Param.

No. Symbol Characteristic Min Max Units Conditions

125 TDTV2CKL SYNC RCV (MASTER & SLAVE)

Data Hold before CK ↓ (DT hold time) 10 — ns

126 TCKL2DTL Data Hold after CK ↓ (DT hold time) 15 — ns

PIC18F2220/2320/4220/4320

TABLE 26-24: A/D CONVERTER CHARACTERISTICS: PIC18F2220/2320/4220/4320 (INDUSTRIAL)

PIC18F2220/2320/4220/4320 (EXTENDED)

PIC18LF2220/2320/4220/4320 (INDUSTRIAL)

Param

No. Symbol Characteristic Min Typ Max Units Conditions

A01 NRResolution — — 10 bit ΔVREF ≥ 3.0V

A03 EIL Integr al Lin ear ity Error — — <±1 LSb ΔVREF ≥ 3.0V

A04 EDL Differential Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V

A06 EOFF Offset Error — — <±1 LSb ΔVREF ≥ 3.0V

A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V

A10 — Monotonicity guaranteed(2) —

A20 ΔVREF Reference Voltage Range

(VREFH – VREFL)3—AV

DD – AV SS V For 10-bit resolution

A21 VREFH Reference Voltage High AVSS + 3.0V — AVDD + 0.3V V For 10-bit resolution

A22 VREFL Reference Voltage Lo w AVSS – 0.3V — AVDD – 3. 0V V For 10-bit resolu tion

A25 VAIN Analog Input Voltage VREFL —VREFH V

A28 AVDD Analog Supply Voltage VDD – 0.3 — VDD + 0.3 V Tie to VDD

A29 AVSS Analog Supply Voltage VSS – 0.3 — V SS + 0.3 V Tie to VSS

A30 ZAIN Recomm end ed Impedance of

Analog Voltage Source ——2.5

(4) kΩ

A40 IAD A/D Current

from VDD PIC18FXX20 — — 180(5) μA Average current during

conversion(1)

PIC18LFXX20 — — 90(5) μA

A50 IREF VREF Input Current (3) —

——

—±5(5)

±150(5) μA

μADuring VAIN acquisition.

Duri ng A/ D conversion

cycle.

Note 1: When A/D is of f, it will not con sume any current other tha n mino r leaka ge curr ent. The power -down curr ent

spec includes any such leakage from the A/D module.

2: The A/D conversion result never decreases with an increase in the input voltage and has no missing

codes.

3: VREFH current is from RA3/AN3/VREF+ pin or AVDD, whichever is selected as the VREFH source.

VREFL current is from RA2/AN2/VREF- pin or AVSS, whichever is selected as the VREFL source.

4: Assume qu iet env ironm ent. If a djace nt pins ha ve high-fre quency s ignal s (ana log or d igit al ), ZAIN m ay ne ed

to be reduced to as low as 1 kΩ to fight crosstalk effects.

5: For guidance only.

PIC18F2220/2320/4220/4320

FIGURE 26-23: A/D CONVERSION TIMING

TABLE 26-25: A/D CONVERSION REQUIREMENTS

Param

No. Symbol Characteristic Min Max Units Conditions

130 TAD A/D Clock Period PIC18FXX20 1.6 20(2) μsTOSC based, VREF ≥ 3.0V

PIC18LFXX20 3.0 20(2) μsTOSC based, VREF full range

PIC18FXX20 2.0 6.0 μs A/D RC mode

PIC18LFXX20 3.0 9.0 μs A/D RC mode

131 TCNV C onversion Time

(not including acquisition time)(1) 11 12 TAD

Note 1: ADRES register may be read on the following TCY cycle.

2: The time of the A/D clock period is dependent on the device frequency and the TAD clock divide r.

131

130

132

BSF ADCON0, GO

A/D CLK

A/D DATA

ADRES

ADIF

SAMPLE

OLD_DATA

SAMPLING STOPPED

DONE

NEW_DATA

(Note 2)

987 21 0

Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be

executed.

2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input.

. . . . . .

TCY

PIC18F2220/2320/4220/4320

27.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES

“T ypical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean – 3σ)

respectively, where σ is a standa rd deviation, ov er the whol e temperature range .

FIGURE 27-1: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C

FIGURE 27-2: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +85°C

Note: The g r ap hs and t ables prov ide d followin g th is no te a r e a s t ati sti ca l s um ma ry based on a l im ite d n um ber of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.

0.0

0.1

0.2

0.3

0.4

0.5

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-3: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C

FIGURE 27-4: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

1.0 1.5 2.0 2.5 3.0 3.5 4.0

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-5: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C

FIGURE 27-6: TYPICAL IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, +25°C

0.0

0.5

1.0

1.5

2.0

2.5

1.0 1.5 2.0 2.5 3.0 3.5 4.0

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

4 8 12 16 20 24 28 32 36 40

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V 2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-7: MAXIMUM IDD vs. FOSC OVER VDD PRI_RUN, EC MODE, -40°C TO +125°C

FIGURE 27-8: TYPICAL IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, +25°C

4 8 12 16 20 24 28 32 36 40

FOSC (MHz)

IDD (mA)

5.0V

5.5V

4.0V

4.5V

3.0V

3.5V

2.0V 2.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.000

0.005

0.010

0.015

0.020

0.025

0.030

0.035

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (M Hz)

IDD (mA)

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-9: MAXIMUM IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +85°C

FIGURE 27-10 : MAX IMU M IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C

0.000

0.005

0.010

0.015

0.020

0.025

0.030

0.035

0.040

0.045

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (M Hz)

IDD (mA)

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

0.090

0.100

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20

FOSC (MHz)

IDD (mA)

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-11: TYPICAL IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, +25°C

FIGURE 27-12 : MAX IMU M IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C

Typical I vs F over V PRI_IDLE, EC mode, +25°C

100

200

300

400

500

600

1.0 1.5 2.0 2.5 3.0 3.5 4.0

FOSC (MHz)

IDD (μA)

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

100

200

300

400

500

600

1.0 1.5 2.0 2.5 3.0 3.5 4.0

FOSC (MHz)

IDD (μA)

4.0V

4.5V

3.0V

3.5V

2.0V

2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-13: TYP ICAL IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, +25°C

FIGURE 27-14 : MAX IMU M IDD vs. FOSC OVER VDD PRI_IDLE, EC MODE, -40°C TO +125°C

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

4 8 12 16 20 24 28 32 36 40

FOSC (MHz)

IDD (mA)

4.0V

4.5V

3.0V

3.5V

2.0V 2.5V

5.0V5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

4 8 12 16 20 24 28 32 36 40

FOSC (MHz)

IDD (mA)

4.0V

4.5V

3.0V

3.5V

2.0V 2.5V

5.0V

5.5V

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-15: TYP ICAL IPD vs. VDD (+25°C), 125 kHz TO 8 MHz RC_RUN MODE,

ALL PERIPHERALS DISABLED

FIGURE 27-16 : MAX IMU M IPD vs. VDD (-40°C TO +125°C), 125 kHz TO 8 MHz RC_RUN,

ALL PERIPHERALS DISABLED

500

1000

1500

2000

2500

3000

2.02.53.03.54.04.55.05.5

VDD (V)

IPD (μA)

8 MHz

125 kHz

4 MHz

2 MHz

1 MHz

250 kHz and 500 kHz curves are

bounded by 125 k Hz and 1 MHz

curves.

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

500

1000

1500

2000

2500

3000

3500

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

8 MHz

125 kHz

4 MHz

2 MHz

1 MHz

250 kHz and 500 kHz curves are

bounded by 125 kH z and 1 MHz

curves.

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-17: TYPICAL AND MAXIMUM IPD vs. VDD (-40°C TO +125°C), 31.25 kHz RC_RUN,

ALL PERIPHERALS DISABLED

FIGURE 27-18: TYP ICAL IPD vs. VDD (+25°C), 125 kHz TO 8 MHz RC_IDLE MODE,

ALL PERIPHERALS DISABLED

100

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Typ (+25°C)

Max (+85°C)

Max (+125°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

100

150

200

250

300

350

400

450

500

550

600

650

700

750

800

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

8 MHz

125 kHz

4 MHz

2 MHz

1 MHz

250 kHz and 500 kHz curves are

bounded by 125 k H z and 1 MHz

curves.

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-19 : MAX IMU M IPD vs. VDD (-40°C TO +125°C), 125 kHz TO 8 MHz RC_IDLE,

ALL PERIPHERALS DISABLED

FIGURE 27-20: TYPICAL AND MAXIMUM IPD vs. VDD (-40°C TO +125°C), 31.25 kHz RC_IDLE,

ALL PERIPHERALS DISABLED

100

150

200

250

300

350

400

450

500

550

600

650

700

750

800

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

8 MHz

125 kHz

4 MHz

2 MHz

1 MHz

250 kHz and 500 kHz curves are

bounded by 125 kHz and 1 MHz

curves.

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

100

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Typ (+25°C )

Max (+85°C)

Max ( +125°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-21 : IPD SEC_RUN MODE, -10°C TO +70°C 32.768 kHz XTAL 2 X 22 pF,

ALL PERIPHERALS DISABLED

FIGURE 27-22 : IPD SEC_IDLE, -10°C TO +70°C 32.768 kHz 2 X 22 pF,

ALL PERIPHERALS DISABLED

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Typ (+25°C)

Max (+70°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Typ (+25°C)

Max (+70°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-23 : TOTAL IPD, -40°C TO +125°C SLEEP MODE, ALL PERIPHERALS DISABLED

FIGURE 27-24 : VOH vs. IOH OVER TEMPERATURE (-40°C TO +125°C), VDD = 3.0V

0.001

0.01

0.1

100

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Max (+85°C)

Max (+125°C)

Typ (+25°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 20 25

IOH (-mA)

VOH (V)

Max (+125°C)

Min (+125°C)

Typ (+25°C)

PIC18F2220/2320/4220/4320

FIGURE 27-25 : VOH vs. IOH OVER TEMPERATURE (-40°C TO +125° C), VDD = 5.0V

FIGURE 27-26 : VOL vs. IOL OVER TEMPER ATURE (-40°C TO +125°C), VDD = 3.0V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0 5 10 15 20 25

IOH (-mA)

VOH (V)

Max (+125°C)

Min (+125°C)

Typ (+25°C)

V vs I over Temp (-40°C to +125°C) V = 3.0V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0 5 10 15 20 25

IOL (-mA)

VOL (V)

Max (+125°C)

Max (+85°C)

Typ (+25°C)

Min (+125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-27 : VOL vs. IOL OVER TEMPERATURE (-40°C TO +125°C), VDD = 5.0V

FIGURE 27-28 : Δ IPD TIMER1 OSCILLATOR, -10°C TO +70°C SLEEP MODE,

TMR1 COUNTER DISABLED

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 5 10 15 20 25

IOL (-mA)

VOL (V)

Max (+125°C)

Max (+85°C)

Typ (+25°C)

Min (+125°C)

IPD Timer1 Oscillator, -10°C to +70°C SLEEP mode, TMR1 counter disabled

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

2.02.53.03.54.04.55.05.5

VDD (V)

IPD (μA)

Typ (+25°C)

Max (- 10°C to +70°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-29 : ΔIPD FSCM vs. VDD OVER T EMPERATURE PRI_IDLE, EC OSCILLATOR AT 32 kHz,

-40°C TO +125°C

FIGURE 27-30 : ΔIPD WDT, -40°C TO +125°C SLEEP MODE, ALL PERIPHERALS DISABLED

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

ΔIPD (μA)

Typ (+25°C )

Max (-40°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

ΔIPD (μA)

Typ (+2 5 °C)

Max (+85°C)

Max (+125°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-31 : ΔIPD LVD vs. VDD SLEEP MODE, LVD = 2.00V -2.12V

FIGURE 27-32 : ΔIPD BOR vs. VDD, -40°C TO +12 5°C SLEEP MODE,

BOR ENABLED AT 2.00V-2.16V

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Typ (+25 °C)

Max (+85°C)

Max (+125°C)

Low-Voltage Detection Range

Normal Operating Range

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

2.02.53.03.54.04.55.05.5

VDD (V)

IPD (μA)

Max (+125°C)

Typ (+25°C)

Device may be in Res et

Device is Operating

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

PIC18F2220/2320/4220/4320

FIGURE 27-33 : ΔIPD A/D, -40°C TO +125°C SLEEP MODE, A/D ENABLED (NOT CONVERTING)

FIGURE 27-34: AVERAGE FOSC vs. VDD FOR VARIOUS R'S EXTERNAL RC MODE,

C = 20 pF, TEMPERATURE = +25°C

0.001

0.01

0.1

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

IPD (μA)

Max (+125°C)

Max (+85°C)

Typ (+25°C)

Typical: statistical mean @ 25°C

Maximum: mean + 3σ (-40°C to +125°C)

Minimum: mean – 3σ (-40°C to +125°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

Freq (MH z)

5.1K

10K

33K

100K

Operation above 4 MHz is not recomended

PIC18F2220/2320/4220/4320

FIGURE 27-35: AVERAGE FOSC vs. VDD FOR VARIOUS R'S EXTERNAL RC MODE,

C = 100 pF, TEMPERATURE = +25°C

FIGURE 27-36: AVERAGE FOSC vs. VDD FOR VARIOUS R'S EXTERNAL RC MODE,

C = 300 pF, TEMPERATURE = +25°C

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

Freq (MH z)

5.1K

10K

33K

100K

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

VDD (V)

Freq (MH z)

5.1K

10K

33K

100K

PIC18F2220/2320/4220/4320

28.0 P ACKAGING INFORMATION

28.1 Package Marking Information

28-Lead SP DIP

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2220-I/SP

0610017

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F2320-E/SO

0610017

40-Lead PDIP

XXXXXXXXXXXXXXXXXX

YYWWNNN

Example

PIC18F4220-I/P

0610017

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week o f January 1 is w eek ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Micr ochip p art number cann ot be mark ed on on e line, it will

be carried over to the next line, thus limiting the number of available

characters f or customer- specific informati on.

PIC18F2220/2320/4220/4320

Package Marking Information (Continued)

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

PIC18F4220

Example

-I/ML

0610017

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

PIC18F4320

-I/PT0610017

PIC18F2220/2320/4220/4320

28.2 Package Details

The following sections give the technical details of the packages.

28-Lead Skinny Plasti c Dual In-line (SP) – 300 mil Body (PDIP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

1510515105

Mold D raft Angle Bottom 1510515105

Mold D raft Angle Top 10.928.898.13.430.350.320

Overall Row Spacing

0.560.480.41.022.019.016BLower Lead Width 1.651.331.02.065.053.040B1Upper Lead Width 0.380.290.20.015.012.008

Lead Thickness 3.433.303.18.135.130.125LTip to Seating Plane 35.1834.6734.161.3851.3651.345DOvera ll Length 7.497.246.99.295.285.275E1Molded Package Width 8.267.877.62.325.310.300EShoulder to Shoulder Width 0.38.015A1Base to Seatin g Plane 3.433.303.18.135.130.125A2Molded Package Thickness 4.063.813.56.160.150.140ATop to Seating Plan e 2.54.100

Pitch 2828

Num ber of Pin s MAXNOMMINMAXNOMMINDime nsion Lim its MILLIMETERSINCHES

Units

Notes:

JEDEC Equivalent: MO-095

Drawing No. C04-070

Contro ll in g P a ra met er

Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

Significant Cha racteristic

PIC18F2220/2320/4220/4320

28-Lead Plasti c Small Outline (SO) – Wide, 300 mil Body (SOIC)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Foot Angle Top φ048048

1512015120

Mold Draft Angle Bottom 1512015120

Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.330.280.23.013.011.009

Lead Thickness

1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 18.0817.8717.65.712.704.695DOverall Length 7.597.497.32.299.295.288E1Molded Package Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088A2Molded Package Thickness 2.642.502.36.104.099.093AOverall Height 1.27

.050

Pitch 2828

Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MS-013

Drawing No. C04-052

§ Significant Characteristic

PIC18F2220/2320/4220/4320

40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

1510515105

Mold Draft Angle Bottom 1510515105

Mold Draft Angle Top 17.2716.5115.75.680.650.620eBOverall Row Spacing §0.560.460.36.022.018.014BLower Lead Width 1.781.270.76.070.050.030B1Upper Lead Width 0.380.290.20.015.012.008

Lead Thic kness 3.433.303.05.135.130.120LTip to Seating Plane 52.4552.2651.942.0652.0582.045DOverall Length 14.2213.8413.46.560.545.530

Molded Package Width 15.8815.2415.11.625.600.595EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 4.063.813.56.160.150.140A2Molded Package Thickness 4.834.454.06.190.175.160ATop to Seating Plane 2.54.100

Pitch 4040

Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MO-011

Drawing No. C04-016

§ Significant Characteristic

PIC18F2220/2320/4220/4320

44-Lead Plastic Thin Quad Flatp ack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

A1 A2

#leads=n1

D1 D

CH x 45°

1.140.890.64.045.035.025CH

Pin 1 Corner Chamfer

1.00 REF..039 REF.F

Footprint (Reference)

Units INCHES MILLIMETERS

Dimension Limits MIN NOM MAX MIN NOM MAX

Number of Pins n44 44

Pitch p.031 0.80

Overall Height A .039 .043 .047 1.00 1.10 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff A1 .002 .004 .006 0.05 0.10 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle

03.5 7 03.5 7

Overall Width E .463 .472 .482 11.75 12.00 12.25

Overall Length D .463 .472 .482 11.75 12.00 12.25

Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10

Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10

Pins per Side n1 11 11

Lead Thickness c.004 .006 .008 0.09 0.15 0.20

Lead Width B .012 .015 .017 0.30 0.38 0.44

Mold Draft Angle Top

5 10 15 5 10 15

Mold Dra ft An g le Bottom

5 10 15 5 10 15

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

Notes:

JEDEC Equivalent: MS-026 Revised 07-22-05

Controlling Parameter

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

Drawing No. C04-076

PIC18F2220/2320/4220/4320

44-Lead Plasti c Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Number of Pins

Pitch

Overall Height

Standoff

Contact Thickness

Overall Width

Exposed Pad Width

Overall Length

Exposed Pad Length

Contact Width

Contact Length §

Contact-to-Exposed Pad §

Units

Dimension Limits

0.80

0.00

6.30

0.25

0.30

0.20

0.65 BSC

0.90

0.02

0.20 REF

8.00 BSC

6.45

8.00 BSC

6.45

0.30

0.40

—

1.00

0.05

6.80

0.38

0.50

—

MIN NOM MAX

MILLIMETERS

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic

3. Package is saw singulated

4. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–103, Sept. 8, 2006

A3A1

TOP VIEW BOTTOM VIEW

NOTE 1

EXPOSED

PAD

PIC18F2220/2320/4220/4320

NOTES:

© 2006 Microchip Technology Inc. DS39599D-page 369
PIC18F2220/2320/4220/4320
APPENDIX A: REVISION HISTORY
Revision A (June 2002)
Original data sheet for PIC18F2X20/4X20 devices.
Revision B (October 2002)
This revision includes major changes to Section 2.0
“Oscillator Configurations” an d Section 3.0 “Power
Managed  Modes” , updat es to the  Electri cal Speci fica-
tions in Section 26.0 “Electrical Characteristics”
and minor corrections to the data sheet text.
Revision C (October 2003)
This rev is ion  in cl ude s updates to  the  Elec tric al  Spe ci fi-
cations in Section 26.0 “Electrical Characteristics”
and to the DC Characteristics Graphs and Charts in
Section 27.0 “DC and AC Characteristics Graphs
and Tables” and minor corrections to the data sheet
text.
Revision D (October 2006)
This revision includes updates to the packaging
diagrams.
APPENDIX B: DEVICE 
DIFFERENCES
The differences between the devices listed in this data
sheet are shown in Table B-1.
TABLE B-1: DEVICE DIFFERENCES          
Features PIC18F2220 PIC18F2320 PIC18F4220 PIC18F4320
Program Memo ry (Bytes ) 4096 8192 4096 8192
Program Memo ry (Instructions) 2048 4096 2048 4096
Interrupt Sources 19 19 20 20
I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E
Capture/Compare/PWM Modules 2 2 1 1
Enhanced Capture/Compare/
PWM Modules 0011
Parallel Communications (PSP) No No Yes Yes
10-bit Analog-to-Digital Module 10 input channels 10 input channels 13 input channels 13 input channels
Packages 28-pin SPDIP
28-pin SOIC 28-pin SPDIP
28-pin SOIC
40-pin P DIP
44-pin TQFP
44-pin QFN
40-pin P DIP
44-pin TQFP
44-pin QFN

PIC18F2220/2320/4220/4320

APPENDIX C: CONVERSION

CONSIDERATIONS

This appendix discusses the considerations for con-

verting from previous versions of a device to the ones

listed in this data sheet. Typically, these changes are

due to the differences in the process technology used.

An example of this type of conversion is from a

PIC16C74A to a PIC16C74B.

Not Applicable

APPENDIX D: MIGRATION FROM

BASELINE TO

ENHANCED DEVICES

This section disc usses how to migrate fr om a Baseline

device (i.e., PIC16C5X) to an Enhanced MCU device

(i.e., PIC18FXXX).

The following are the list of modifications over the

PIC16C5X mic roc on trol ler fam il y:

Not Currently Av ail able

PIC18F2220/2320/4220/4320

APPENDIX E: MIGRATION FROM

MID-RANGE TO

ENHANCED DEVICES

A detailed discussion of the differences between the

mid-range MCU devices (i.e., PIC16CXXX) and the

enhanced devices (i.e., PIC18FXXX) is provided in

AN716, “Migrating Designs from PIC16C74A/74B to

PIC18C442.” The changes discussed, while device

specific, are generally applicable to all mid-range to

enhanced device migrations.

This Ap plicatio n Note is availab le as L iterature Nu mber

DS00716.

APPENDIX F: MIGRATION FROM

HIGH-END TO

ENHANCED DEVICES

A detailed discussion of the migration pathway and

differences between the high-end MCU devices (i.e.,

PIC17CXXX) and the enhanced devices (i.e.,

PIC18FXXX) is provided in AN726, “PIC17CXXX to

PIC18CXXX Migration.” This Application Note is

available as Literature Number DS00726.

PIC18F2220/2320/4220/4320

NOTES:

© 2006 Microchip Technology Inc. DS39599D-page 373
PIC18F2220/2320/4220/4320
INDEX
A
A/D ...................................................................................211
A/D Converter Interrupt, Configuring .......................215
Acquisition Requirements ........................................216
ADCON0 Register ....................................................211
ADCON1 Register ....................................................211
ADCON2 Register ....................................................211
ADRESH Register ............................................ 211, 214
ADRESL Register ....................................................211
Analog Port Pins, Configuring ..................................218
Associated Registers ...............................................220
Automatic Acquisition Time ......................................217
Calculating the Minimum Required 
Acquisition Time ...............................................216
Configuring the Module ............................................215
Conversion Clock (TAD) ...........................................217
Conversion Status (GO/DONE Bit) ..........................214
Conversions .............................................................219
Converter Characteristics  ........................................341
Operation in Power Managed Modes ......................218
Special Event Trigger (CCP) ............................136, 220
Use of the CCP2 Trigger ..........................................220
VREF+ and VREF- References  ..................................216
Absolute Maximum Ratings  .............................................305
AC (Timing) Characteristics .............................................323
Load Conditions for Device 
Timing Specifications .......................................324
Parameter Symbology .............................................323
Temperature and Voltage Specifications .................324
Timing Conditions ....................................................324
Access Bank ......................................................................65
ACKSTAT Status Flag .....................................................185
ADCON0 Register ............................................................211
GO/DONE Bit ...........................................................214
ADCON1 Register ............................................................211
ADCON2 Register ............................................................211
ADDLW ............................................................................261
Addressable Universal Synchronous Asynchronous 
Receiver Transmitter. See USART.
ADDWF ............................................................................261
ADDWFC .........................................................................262
ADRESH Register ............................................................211
ADRESL Register .................................................... 211, 214
Analog-to-Digital Converter. See A/D.
ANDLW ............................................................................262
ANDWF ............................................................................263
Assembler
MPASM Ass e mbler ..................................................299
B
Bank Select Register (BSR) ...............................................65
Baud Rate Generator .......................................................181
BC ....................................................................................263
BCF ..................................................................................264
BF Status Flag .................................................................185
Block Diagrams
A/D ...........................................................................214
Analog Input Model ..................................................215
Baud Rate Generator ...............................................181
Capture Mode Operation .........................................135
Comparator I/O Operating Modes ............................222
Comparator Output ..................................................224
Comparator Voltage Reference ...............................228
Compare Mode Operation ....................................... 136
External Power-on Reset Circuit 
(Slow VDD Power-up) ........................................ 44
Fail-Safe Clock Monitor ........................................... 248
Generic I/O Port Operation ...................................... 101
Interrupt Logic ............................................................ 88
Low-Voltage Detect (LVD) ....................................... 232
Low-Voltage Detect (LVD) with External Input ........ 232
MCLR/VPP/RE3 Pin ................................................. 111
MSSP (I2C Master Mode) ........................................ 179
MSSP (I2C Mode) .................................................... 164
MSSP (SPI Mode) ................................................... 155
On-Chip Reset Circuit ................................................ 43
PIC18F2220/2320 ....................................................... 9
PIC18F4220/4320 ..................................................... 10
PLL ............................................................................ 20
PORTC (Peripheral Output Override) ...................... 107
PORTD and PORTE (Parallel Slave Port) ............... 114
PWM (Enhanced) .................................................... 143
PWM (Standard) ...................................................... 138
RA3:RA0 and RA5 Pins ........................................... 102
RA4/T0CKI Pin ........................................................ 102
RA6 Pin ................................................................... 102
RA7 Pin ................................................................... 102
RB2:RB0 Pins .......................................................... 105
RB3/CCP2 Pin ......................................................... 105
RB4 Pin ................................................................... 105
RB7:RB5 Pins .......................................................... 104
RD4:RD0 Pins ......................................................... 110
RD7:RD5 Pins ......................................................... 109
RE2:RE0 Pins .......................................................... 111
Reads from Flash Program Memory .......................... 75
System Clock ............................................................. 25
Table Read Operation ............................................... 71
Table Write Operation ................................................ 72
Table Writes to Flash Program Memory .................... 77
Timer0 in 16-bit Mode .............................................. 118
Timer0 in 8-bit Mode ................................................ 118
Timer1 ..................................................................... 122
Timer1 (16-bit Read/Write Mode) ............................ 122
Timer2 ..................................................................... 128
Timer3 ..................................................................... 130
Timer3 (16-bit Read/Write Mode) ............................ 130
USART Receive ....................................................... 204
USART Transmi t ...................................................... 202
Watchdog Timer ...................................................... 245
BN .................................................................................... 264
BNC ................................................................................. 265
BNN ................................................................................. 265
BNOV ............................................................................... 266
BNZ .................................................................................. 266
BOR. See Brown-out Reset.
BOV ................................................................................. 269
BRA ................................................................................. 267
BRG. See Baud Rate Generator.
Brown-out Reset (BOR) ..............................................44, 237
BSF .................................................................................. 267
BTFSC ............................................................................. 268
BTFSS ............................................................................. 268
BTG ................................................................................. 269
BZ .................................................................................... 270

PIC18F2220/2320/4220/4320
DS39599D-page 374 © 2006 Microchip Technology Inc.
C
C Compilers
MPLAB C17 .............................................................300
MPLAB C18 .............................................................300
MPLAB C30 .............................................................300
CALL ................................................................................270
Capture (CCP Module) .....................................................135
Associated Registers ...............................................137
CCP Pin Configuration .............................................135
CCPR1H:CCPR1L Registers ...................................135
Software Interrupt .....................................................135
Timer1/Timer3 Mode Selection ................................135
Capture (ECCP Module) ..................................................142
Capture/Compare/PWM (CCP) ........................................133
Capture Mode. See Capture.
CCP1 ........................................................................134
CCPR1H Register ............................................134
CCPR1L Register ............................................134
CCP2 ........................................................................134
CCPR2H Register ............................................134
CCPR2L Register ............................................134
Compare Mode. See Compare.
Interaction of Two CCP Modules .............................134
PWM Mode. See PW M .
Timer Resources ......................................................134
Clock Sources ....................................................................24
Selection Using OSCCON Register ...........................24
Clocking Scheme/Instruction Cycle ....................................57
CLRF ................................................................................271
CLRWDT ..........................................................................271
Code Examples
16 x 16 Signed Multiply Routine .................................86
16 x 16 Unsigned Multiply Routine .............................86
8 x 8 Signed Multiply Routine .....................................85
8 x 8 Unsigned Multiply Routine .................................85
Changing Between Capture Prescalers ...................135
Computed GOTO Using an Offset Value ...................59
Data EEPROM Read .................................................83
Data EEPROM Refresh Routine ................................84
Data EEPROM Write ..................................................83
Erasing a Flash Program Memory Row .....................76
Fast Register Stack ....................................................56
How to Clear RAM (Bank 1) Using 
Indirect Addressing ............................................66
Implementing a Real-Time Clock Using a 
Timer1 Interrupt Service  ..................................125
Initia lizing PORTA  ....................................................101
Initia lizing PORTB  ....................................................104
Initia lizing PORTC ....................................................107
Initia lizing PORTD ....................................................109
Initia lizing PORTE  ....................................................111
Loading the SSPBUF (SSPSR ) Register .................158
Reading a Flash Program Memory Word ...................75
Saving Status, WREG and BSR Registers 
in RAM ...............................................................99
Writing to Flash Program Memory .......................78–79
Code Protection .......................................................237, 251
COMF ...............................................................................272
Comparator ...................................................................... 221
Analog Input Connection Considerations ................ 225
Associated Registers ............................................... 226
Configuration ........................................................... 221
Effects o f  a Reset .................................................... 225
Interrupts .................................................................. 224
Operation ................................................................. 223
Operation in Power Managed Modes ...................... 225
Outputs .................................................................... 223
Reference ................................................................ 223
Response Time ........................................................ 223
Comparator Specifications ............................................... 321
Comparator Voltage Reference ....................................... 227
Accuracy and Error .................................................. 228
Associated Registers ............................................... 229
Configuring .............................................................. 227
Connection Considerations ...................................... 228
Effects o f  a Reset .................................................... 228
Operation in Power Managed Modes ...................... 228
Compare (CCP Module) .................................................. 136
Associated Registers ............................................... 137
CCP Pin Configuration ............................................. 136
CCPR1 Register ...................................................... 136
Softwar e  In terrupt .................................................... 136
Special Event Trigger .......................................136, 220
Timer1/Timer3 Mode Selection ................................ 136
Compare (ECCP Mode) ................................................... 142
Computed GOTO ............................................................... 59
Configuration Bits ............................................................ 237
Configuration Register Protection .................................... 254
Context Saving During Interrupts ....................................... 99
Control Registers
EECON1 and EECON2 ............................................. 72
Conversion Considerations .............................................. 370
CPFSEQ .......................................................................... 272
CPFSGT .......................................................................... 273
CPFSLT ........................................................................... 273
Crystal Oscillator/Ceramic Resonator ................................ 19
D
Data EEPROM Code Protection ...................................... 254
Data EEPROM Memory ..................................................... 81
Associated Registers ................................................. 84
EEADR Register ........................................................ 81
EECON1 and EECON2 Registers ............................. 81
Operation During Code-Protect ................................. 84
Protection Against Spurious Write ............................. 83
Reading ..................................................................... 83
Using .......................................................................... 84
Write Verify ................................................................ 83
Writing ........................................................................ 83
Data Memory ..................................................................... 59
General Purpose Registers ....................................... 59
Map for PIC18F2X20/4X20 ........................................ 60
Special Function Registers ........................................ 61
DAW ................................................................................ 274
DC and AC Characteristics
Graphs and Tables .................................................. 343
DC Characteristics ........................................................... 318
Power-Down and Supply Current ............................ 309
Supply Voltage ......................................................... 308
DCFSNZ .......................................................................... 275
DECF ............................................................................... 274
DECFSZ .......................................................................... 275

© 2006 Microchip Technology Inc. DS39599D-page 375
PIC18F2220/2320/4220/4320
Demonstration Boards
PICDEM 1 ................................................................302
PICDEM 17 ..............................................................302
PICDEM 18R PIC18C601/801 .................................303
PICDEM 2 Plus ........................................................302
PICDEM 3 PIC16C92X ............................................302
PICDEM 4 ................................................................302
PICDEM LIN PIC16C43X ........................................303
PICDEM USB PIC16C7X5 .......................................303
PICDEM.net Internet/Ethernet .................................302
Development Support ......................................................299
Device Differences ...........................................................369
Device Overview  ..................................................................7
Features (table) ............................................................8
New Core Features ......................................................7
Other Special Features ................................................7
Direct Addressing ...............................................................67
E
ECCP ...............................................................................141
Auto-Shutdown ........................................................149
and Automatic Restart .....................................151
Capture and Compare Modes ..................................142
Outputs ....................................................................142
Standard PWM Mode ...............................................142
Start-up Considerations ...........................................151
Effects of Power Managed Modes on 
Various Clock Sources ...............................................27
Electrical Characteristics ..................................................305
Enhanced Capture/Compare/PWM (ECCP) ....................141
Capture Mode. See Capture (ECCP Module).
PWM Mode. See PWM (ECCP Module).
Enhanced CCP Auto-Shutdown .......................................149
Enhanced PWM Mode. See PWM (EC CP Module).  
Equations
16 x 16 Signed Multiplication Algorithm .....................86
16 x 16 Unsigned Multiplication Algorithm .................86
A/D Acquisition Time ................................................216
A/D Minimum Holding Capacitor ..............................216
Errata ...................................................................................5
Evaluation and Programming Tools .................................303
External Clock Input ...........................................................21
F
Fail-Safe Clock Monitor ............................................ 237, 248
Interrupts in Power Managed Modes .......................250
POR or Wake-up from Sleep ...................................250
WDT During Oscillator Failure .................................248
Fast Register Stack ............................................................56
Firmware Instructions  .......................................................255
Flash Program Memory ......................................................71
Associated Registers .................................................79
Control Registers .......................................................72
Erase Sequence ........................................................76
Erasing .......................................................................76
Operation During Code-Protect .................................79
Reading ......................................................................75
TABLAT Register .......................................................74
Table Pointer ..............................................................74
Boundaries Based on Operation ........................74
Table Pointer Boundaries ..........................................74
Table Reads and Table Writes ..................................71
Unexpected Termination of Write Operation ..............79
Write Verify ................................................................79
Writing to ....................................................................77
FSCM. See Fail-Safe Clock Monitor.
G
GOTO .............................................................................. 276
H
Hardware Multiplier ............................................................ 85
Introduction ................................................................ 85
Operation ................................................................... 85
Performance Comp arison .......................................... 85
HSPLL ............................................................................... 20
I
I/O Por ts ........................................................................... 101
I2C Mode
ACK Pulse ........................................................168, 169
Acknowledge Sequence Timing .............................. 188
Baud Rate Generator .............................................. 181
Bus Collision During a Repeated 
Start Condition ................................................. 192
Bus Collision During a Start Condition ..................... 190
Bus Collision During a Stop Condition ..................... 193
Clock Arbitration ...................................................... 182
Clock Stretching ....................................................... 174
Effect of a Reset ...................................................... 189
General Call Address Support ................................. 178
Master Mode ............................................................ 179
Master Mode (Reception, 7-bit Address) ................. 187
Master Mode Operation ........................................... 180
Master Mode Reception ........................................... 185
Master Mode Repeated Start 
Condition Timing .............................................. 184
Master Mode Start Condition Timing ....................... 183
Master Mode Transmission ..................................... 185
Multi-Master Communication, Bus Collision 
and Bus Arbitration .......................................... 189
Multi-Master Mode ................................................... 189
Operation ................................................................. 168
Operation in Power Managed Mode ........................ 189
Read/Write Bit Information (R/W Bit) ................168, 169
Registers ................................................................. 164
Serial Clock (RC3/SCK/SCL) ................................... 169
Slave Mode .............................................................. 168
Addressing ....................................................... 168
Reception ........................................................ 169
Transmission ................................................... 169
Stop Condition Timing ............................................. 188
ID Locations ..............................................................237, 254
INCF ................................................................................ 276
INCFSZ ............................................................................ 277
In-Circuit Debugger .......................................................... 254
In-Circuit Serial Programming (ICSP) .......................237, 254
Indirect Addressing
INDF and FSR Registers ........................................... 66
Operation ................................................................... 66
Indirect Addressing Operation ........................................... 67
Indirect File Operand ......................................................... 59
INFSNZ ............................................................................ 277
Initialization Conditions for all Registers .......................46–49
Instruction Cycle ................................................................ 57
Instruction Flow/Pipelining ................................................. 57
Instruction Format ............................................................ 257

PIC18F2220/2320/4220/4320
DS39599D-page 376 © 2006 Microchip Technology Inc.
Instruction Set ..................................................................255
ADDLW ....................................................................261
ADDWF ....................................................................261
ADDWFC .................................................................262
ANDLW ....................................................................262
ANDWF ....................................................................263
BC ............................................................................263
BCF ..........................................................................264
BN ............................................................................264
BNC ..........................................................................265
BNN ..........................................................................265
BNOV .......................................................................266
BNZ ..........................................................................266
BOV ..........................................................................269
BRA ..........................................................................267
BSF ..........................................................................267
BTFSC .....................................................................268
BTFSS ......................................................................268
BTG ..........................................................................269
BZ .............................................................................270
CALL ........................................................................270
CLRF ........................................................................271
CLRWDT ..................................................................271
COMF .......................................................................272
CPFSEQ ..................................................................272
CPFSGT ...................................................................273
CPFSLT ...................................................................273
DAW .........................................................................274
DCFSNZ ...................................................................275
DECF .......................................................................274
DECFSZ ...................................................................275
GOTO .......................................................................276
INCF .........................................................................276
INCFSZ ....................................................................277
INFSNZ ....................................................................277
IORLW .....................................................................278
IORWF .....................................................................278
LFSR ........................................................................279
MOVF .......................................................................279
MOVFF .....................................................................280
MOVLB .....................................................................280
MOVLW ....................................................................281
MOVWF ...................................................................281
MULLW ....................................................................282
MULWF ....................................................................282
NEGF .......................................................................283
NOP .........................................................................283
POP ..........................................................................284
PUSH .......................................................................284
RCALL ......................................................................285
Reset ........................................................................285
RETFIE ....................................................................286
RETLW .....................................................................286
RETURN ..................................................................287
RLCF ........................................................................287
RLNCF .....................................................................288
RRCF .......................................................................288
RRNCF .....................................................................289
SETF ........................................................................289
SLEEP ......................................................................290
SUBFWB ..................................................................290
SUBLW .................................................................... 291
SUBWF .................................................................... 291
SUBWFB ................................................................. 292
SWAPF .................................................................... 293
TBLRD ..................................................................... 294
TBLWT ..................................................................... 295
TSTFSZ ................................................................... 296
XORLW .................................................................... 296
XORWF ................................................................... 297
Summary Table ....................................................... 258
INTCON Register
RBIF Bit ................................................................... 104
INTCON Registers ............................................................. 89
Inter-Integrated Circuit. See I2C.
Internal Oscillator Block ..................................................... 22
Adjustment ................................................................. 22
INTIO Modes ............................................................. 22
INTRC Output Frequency .......................................... 22
OSCTUNE Register ................................................... 22
Internal RC Oscillator
Use with WDT .......................................................... 245
Interrupt Sources ............................................................. 237
A/D Conversion Complete ....................................... 215
Capture Complete (CCP) ......................................... 135
Compare Complete (CCP) ....................................... 136
Interrupt-on-Change (RB7:RB4) .............................. 104
INTn Pi n  ..................................................................... 99
PORTB, Interrupt-on-Change .................................... 99
TMR0 ......................................................................... 99
TMR1 Overflow ........................................................ 121
TMR2  to  PR 2 M atch  ................................................ 128
TMR2  to  PR 2  Match ( PWM) .............................127, 138
TMR3 Overflow .................................................129, 131
USART Receive/Transmit Complete ....................... 195
Interrupts ............................................................................ 87
Interrupts, Enable Bits
CCP1 Enable (CCP1IE Bit) ..................................... 135
Interrupts, Flag Bits
CCP1 Flag (CCP1IF Bit) .......................................... 135
CCP1IF Flag (CCP1IF Bit) ....................................... 136
Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ..... 104
INTOSC Frequency Drift .................................................... 40
INTO SC, INTRC.  See Internal Oscillator Block.
IORLW ............................................................................. 278
IORWF ............................................................................. 278
IPR Registers ..................................................................... 96
L
LFSR ................................................................................ 279
Look-up Tables .................................................................. 59
Low-Voltage Detect ......................................................... 231
Characteristics ......................................................... 322
Effects o f  a Reset .................................................... 235
Operation ................................................................. 234
Current Consumption ....................................... 235
Reference Voltage Set Point ........................... 235
Operation During Sleep ........................................... 235
Low-Voltage ICSP Programming ..................................... 254
LVD. See Low-Voltage Detect. 

© 2006 Microchip Technology Inc. DS39599D-page 377
PIC18F2220/2320/4220/4320
M
Master Synchronous Serial Port (MSSP). See MSSP .
Memory Organization .........................................................53
Data Memory .............................................................59
Program Mem ory  .......................................................53
Memory Programm i ng Requirement s ..............................320
Migration from Baseline to Enhanced Devices ................370
Migration from High-End to Enhanced Devices ...............371
Migration from Mid-Range to Enhanced Devices .............371
MOVF ...............................................................................279
MOVFF .............................................................................280
MOVLB .............................................................................280
MOVLW ............................................................................281
MOVWF ...........................................................................281
MPLAB ASM30 Assembler, Linker, Librarian ..................300
MPLAB ICD 2 In-Circuit Debugger ...................................301
MPLAB ICE 2000 High Performance 
Universal In-Circuit Emulator ...................................301
MPLAB ICE 4000 High Performance 
Universal In-Circuit Emulator ...................................301
MPLAB Integrated Development 
Environment Software ..............................................299
MPLINK Object Linker/MPLIB Object Librarian ...............300
MSSP ...............................................................................155
Control Registers (General) .....................................155
Enabling SPI I/O ......................................................159
I2C Master Mode ......................................................179
I2C Mode
I2C Slave Mode ........................................................168
Operation .................................................................158
Overview ..................................................................155
Slave Select Control ................................................161
SPI Master Mode .....................................................160
SPI Master/Slave Connection ..................................159
SPI Mode .................................................................155
SPI Slave Mode .......................................................161
Typical Connection ..................................................159
MULLW ............................................................................282
MULWF ............................................................................282
N
NEGF ...............................................................................283
NOP .................................................................................283
O
Opcode Field Descriptions ...............................................256
OPTION_REG Register
PSA Bit .....................................................................119
T0CS  Bit ...................................................................119
T0PS 2:T0PS0 Bits ...................................................119
T0SE Bit  ...................................................................119
Oscillator Configuration ......................................................19
EC ..............................................................................19
ECIO ..........................................................................19
HS ..............................................................................19
HSPLL ........................................................................19
Internal Oscillator Block .............................................22
INTIO1 .......................................................................19
INTIO2 .......................................................................19
LP ...............................................................................19
RC ..............................................................................19
RCIO ..........................................................................19
XT ..............................................................................19
Oscillator Selection ..........................................................237
Oscillator Start-up Timer (OST) ............................27, 44, 237
Oscillator Switching ........................................................... 24
Oscillator Transiti ons ......................................................... 27
Oscillator, Timer1 ......................................................121, 131
Oscillator, Timer3 ............................................................. 129
P
Packaging Information ..................................................... 361
Marking .............................................................361, 362
Parallel Slave Port (PSP) ..........................................109, 114
Associated Registers ............................................... 115
CS (Chip Select) ...............................................113, 114
PORTD .................................................................... 114
RD (Read Input) ................................................113, 114
RE0/AN5/RD Pin ..................................................... 113
RE1/AN6/WR Pin  ..................................................... 113
RE2/AN7/CS Pin ...................................................... 113
Select (PS PMODE Bi t) .....................................109, 114
WR (Write Input) ...............................................113, 114
PICkit 1 Flash Starter Kit ................................................. 303
PICSTART Plus Deve lopment Program mer .................... 301
PIE Registers ..................................................................... 94
Pin Functions
MCLR/VPP/RE3 ....................................................11, 14
OSC1/CLKI/RA7 ...................................................11, 14
OSC2/CLKO/RA6 .................................................11, 14
RA0/AN0 ...............................................................11, 14
RA1/AN1 ...............................................................11, 14
RA2/AN2/VREF-/CVREF .........................................11, 14
RA3/AN3/VREF+ ...................................................11, 14
RA4/T0CKI/C1OUT ..............................................11, 14
RA5/AN4/SS/LVDIN/C2OUT ................................11, 14
RB0/AN12/INT0 ....................................................12, 15
RB1/AN10/INT1 ....................................................12, 15
RB2/AN8/INT2 ......................................................12, 15
RB3/AN9/CCP2 ....................................................12, 15
RB4/AN11/KBI0 ....................................................12, 15
RB5/KBI1/PGM .....................................................12, 15
RB6/KBI2/PGC .....................................................12, 15
RB7/KBI3/PGD .......................................................... 12
RB7/PGD ................................................................... 15
RC0/T1OSO/T1CKI ..............................................13, 16
RC1/T1OSI/CCP2 .................................................13, 16
RC2/CCP1/P1A ....................................................13, 16
RC3/SCK/SCL ......................................................13, 16
RC4/SDI/SDA .......................................................13, 16
RC5/SDO ..............................................................13, 16
RC6/TX/CK ...........................................................13, 16
RC7/RX/DT ...........................................................13, 16
RD0/PSP0 ................................................................. 17
RD1/PSP1 ................................................................. 17
RD2/PSP2 ................................................................. 17
RD3/PSP3 ................................................................. 17
RD4/PSP4 ................................................................. 17
RD5/PSP5/P1B ......................................................... 17
RD6/PSP6/P1C ......................................................... 17
RD7/PSP7/P1D ......................................................... 17
RE0/AN5/RD .............................................................. 18
RE1/AN6/WR ............................................................. 18
RE2/AN7/CS .............................................................. 18
RE3 ............................................................................ 18
VDD .......................................................................13, 18
VSS .......................................................................13, 18

PIC18F2220/2320/4220/4320
DS39599D-page 378 © 2006 Microchip Technology Inc.
Pinout I/O Descriptions
PIC18F2220/2320 ......................................................11
PIC18F4220/4320 ......................................................14
PIR Registers .....................................................................92
PLL Lock Time-out .............................................................44
Pointer, FSRn .....................................................................66
POP ..................................................................................284
POR. See Power-on Reset.
PORTA
Associated Registers ...............................................103
LATA Register ..........................................................101
PORTA Register ......................................................101
TRISA Register ........................................................101
PORTB
Associated Registers ...............................................106
LATB Register ..........................................................104
PORTB Register ......................................................104
RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) ........104
TRISB Register ........................................................104
PORTC
Associated Registers ...............................................108
LATC Register ..........................................................107
PORTC Register ......................................................107
TRISC Register ........................................................107
PORTD
Associated Registers ...............................................110
LATD Register ..........................................................109
Parallel Slave Port (PSP) Function ..........................109
PORTD Register ......................................................109
TRISD Register ........................................................109
PORTE
Analog Port Pins ......................................................113
Associated Registers ...............................................113
LATE Register ..........................................................111
PORTE Register ......................................................111
PSP Mode Select (PS PM ODE Bit)  ..........................109
RE0/AN5/RD Pin ......................................................113
RE1/AN6/WR Pin .....................................................113
RE2/AN7/CS Pin ......................................................113
TRISE Register ........................................................111
Postscaler, WDT
Assignment (PSA Bit) ...............................................119
Rate Select (T0PS2:T0PS0 Bits) .............................119
Power Managed Modes .....................................................29
Entering ......................................................................30
Idle Modes ..................................................................31
Run Modes .................................................................36
Selecting ....................................................................29
Sleep Mode ................................................................31
Summary (table) .........................................................29
Wake-up from .............................................................38
Power-on Reset (POR) ..............................................44, 237
Power-up Delays ................................................................27
Pow e r-up Timer (PWRT) ...................................... 27, 44, 237
Prescaler, Capture ...........................................................135
Prescaler, Timer0 .............................................................119
Assignment (PSA Bit) ...............................................119
Rate Select (T0PS2:T0PS0 Bits) .............................119
Prescaler, Timer2 .............................................................139
PRO MATE II Universal Device Programmer ...................301
Product Identifi catio n  System  ...........................................385
Program Counter
PCL Register ..............................................................56
PCLATH Register .......................................................56
PCLATU Register .......................................................56
Program Mem ory
Instructions ................................................................ 58
Two-Word .......................................................... 58
Interrupt Vector .......................................................... 53
Map and Stack for PIC18F2220/4220 ....................... 53
Map and Stack for PIC18F2320/4320 ....................... 53
Reset Vector .............................................................. 53
Program Mem ory Code Prot ecti on .................................. 252
Program Ver ification  ........................................................ 251
Program Verificat ion and Code Protection
Associated Registers ............................................... 251
Programm ing, Device Ins tr uctions  ................................... 255
PSP. See Parallel Slave Port.
Pulse Width Modulation. See PWM (CCP Module) 
and PWM (ECCP Module).
PUSH ............................................................................... 284
PUSH  and POP Instruc t ions .............................................. 55
PWM (CCP Module) ........................................................ 138
Associated Registers ............................................... 139
CCPR1H:CCPR1L Registers ................................... 138
Duty Cycle ............................................................... 138
Example Frequencies/Resolutions .......................... 139
Period ...................................................................... 138
Setup for PWM Operation ........................................ 139
TMR2  to  PR 2 M atch  .........................................127, 138
PWM (ECCP Module) ...................................................... 143
Associated Registers ............................................... 153
Direction Change in Full-Bridge Output Mode ......... 147
Effects o f  a Reset .................................................... 152
Full-Bridge Application Example .............................. 147
Full-Bridge Mode ..................................................... 146
Half-Bridge Mode ..................................................... 145
Half-Bridge Output Mode Applications Example ...... 145
Operation in Power Managed Modes ...................... 152
Operation with Fail-Safe Clock Monitor ................... 152
Output Configurations .............................................. 143
Output Relationships (Active-High State) ................ 144
Output Relationships (Active-Low State) ................. 144
Programmable Dead Band Delay ............................ 149
Setup for Operation ................................................. 152
Shoot-Through Current ............................................ 149
Start-up Considerations ........................................... 151
Q
Q Clock ............................................................................ 139
R
RAM. See Data Me mory.
RC Oscillator ...................................................................... 21
RCIO Oscillator Mode ................................................ 21
RCALL ............................................................................. 285
RCON Register
Bit Status During Initializati on .................................... 45
Bits and Positions ...................................................... 45
RCSTA Register
SPEN Bit  .................................................................. 195
Register File ....................................................................... 59
Registers
ADCON0 (A/D Control 0) ......................................... 211
ADCON1 (A/D Control 1) ......................................... 212
ADCON2 (A/D Control 2) ......................................... 213
CCP1CON (Enhanced CCP 
Operation Control 1) ........................................ 141
CCPxCON (Capture/Compare/PWM Control) ......... 133
CMCON (Comparator Control) ................................ 221
CONFIG1H (Configuration 1 High) .......................... 238

© 2006 Microchip Technology Inc. DS39599D-page 379
PIC18F2220/2320/4220/4320
CONFIG2H (Configuration 2 High) ..........................239
CONFIG2L (Configuration 2 Low) ............................239
CONFIG3H (Configuration 3 High) ..........................240
CONFIG4L (Configuration 4 Low) ............................240
CONFIG5H (Configuration 5 High) ..........................241
CONFIG5L (Configuration 5 Low) ............................241
CONFIG6H (Configuration 6 High) ..........................242
CONFIG6L (Configuration 6 Low) ............................242
CONFIG7H (Configuration 7 High) ..........................243
CONFIG7L (Configuration 7 Low) ............................243
CVRCON (Comparator Voltage 
Reference Control) ...........................................227
Device ID Register 1 ................................................244
Device ID Register 2 ................................................244
ECCPAS (Enhanced CCP 
Auto-Shutdown Control) ...................................150
EECON1 (Data EEPROM Control 1) ................... 73, 82
INTCON (Interrupt Control)  ........................................89
INTCON2 (Interrupt Control 2) ...................................90
INTCON3 (Interrupt Control 3) ...................................91
IPR1 (Peripheral Interrupt Priority 1) ..........................96
IPR2 (Peripheral Interrupt Priority 2) ..........................97
LVDCON (LVD Control) ...........................................233
OSCCON (Oscillator Control) ....................................26
OSCTUNE (Oscillator Tuning) ...................................23
PIE1 (Peripheral Interrupt Enable 1) ..........................94
PIE2 (Peripheral Interrupt Enable 2) ..........................95
PIR1 (Peripheral Interrupt Request 
(Flag) 1) .............................................................92
PIR2 (Peripheral Interrupt Request 
(Flag) 2) .............................................................93
PWM1CON (Enhanced PWM Configuration) ...........149
RCON (Reset Control) ......................................... 69, 98
RCSTA (Receive Status and Control) ......................197
SSPCON1 (MS SP  Control 1, I2C Mode) .................166
SSPCON1 (MS SP  Control 1, SPI Mode) .................157
SSPCON2 (MS SP  Control 2, I2C Mode) .................167
SSPS TA T (MSSP Status, I2C Mode) .......................165
SSPSTA T (M SS P Sta tus,  SPI Mode)  ......................156
Status .........................................................................68
STKPTR (Stack Pointer) ............................................55
Summary .............................................................. 62–64
T0CON (Timer0 Control) ..........................................117
T1CON (Timer 1 Control) .........................................121
T2CON (Timer 2 Control) .........................................127
T3CON (Timer3 Control) ..........................................129
TRISE ......................................................................112
TXSTA (Transmit Status and Control) .....................196
WDTCON (Watchdog Tim er Contro l) .......................246
Reset ..........................................................................43, 285
Resets ..............................................................................237
RETFIE ............................................................................286
RETLW .............................................................................286
RETURN ..........................................................................287
Return Address Stack ........................................................54
Return Stack Pointer (STKPTR) ........................................54
Revision History ...............................................................369
RLCF ................................................................................287
RLNCF .............................................................................288
RRCF ...............................................................................288
RRNCF .............................................................................289
S
SCI. See USART.
SCK ................................................................................. 155
SDI ................................................................................... 155
SDO ................................................................................. 155
Serial Clock (SCK) Pin ..................................................... 155
Serial Communication Interface. See USART.
Serial  D a ta In (SD I)  Pin ................................................... 155
Serial Data Out (SDO) Pin ............................................... 155
Serial Peripheral Interface. See SPI Mode.
SETF ................................................................................ 289
Shoot-Through Current .................................................... 149
Slave Select (SS) Pin ...................................................... 155
SLEEP ............................................................................. 290
Sleep
OSC1 and OSC2 Pin States ...................................... 27
Software Simulator (MPLAB SIM) ................................... 300
Software Simulator (MPLAB SIM30) ............................... 300
Special Event Trigger. See Compare 
(CCP Module)
Special Features of the CPU ........................................... 237
Special Function Registers ................................................ 61
Map ............................................................................ 61
SPI Mode
Associated Registers ............................................... 163
Bus Mode Compatibility ........................................... 163
Effects o f  a Reset .................................................... 163
Master in Power Managed Modes ........................... 163
Master Mode ............................................................ 160
Master/Slave Connection ......................................... 159
Registers ................................................................. 156
Serial Clock .............................................................. 155
Serial  D a ta  In ........................................................... 155
Serial Data Out ........................................................ 155
Slave in Power Managed Modes ............................. 163
Slave Mode .............................................................. 161
Slave Select ............................................................. 155
SPI Clock ................................................................. 160
SS .................................................................................... 155
SSP I2C Mode. See I2C.
SSPBUF Register .................................................... 160
SSPSR Register ...................................................... 160
TMR2 Output for Clock Shift .............................127, 128
SSPOV St atus Flag  ......................................................... 185
SSPSTAT Register
R/W Bit .............................................................168, 169
Stack Full/Underflow Resets .............................................. 55
SUBFWB ......................................................................... 290
SUBLW ............................................................................ 291
SUBWF ............................................................................ 291
SUBWFB ......................................................................... 292
SWAPF ............................................................................ 293
T
TABLAT Register ............................................................... 74
Table Pointer Operations (table) ........................................ 74
Table Reads/Table Writes ................................................. 59
TBLPTR Register ............................................................... 74
TBLRD ............................................................................. 294
TBLWT ............................................................................. 295
Time-out in Various Situations (table) ................................ 45
Time-out Sequence ........................................................... 44

PIC18F2220/2320/4220/4320
DS39599D-page 380 © 2006 Microchip Technology Inc.
Timer0 ..............................................................................117
16-bit Mode Timer Reads and Writes ......................119
Associated Registers ...............................................119
Clock Source Edge Select (T0SE Bit) ......................119
Clock Source Select (T0CS Bit) ...............................119
Interrupt ....................................................................119
Operation .................................................................119
Prescaler. See Prescaler, T imer0.
Switching Prescaler Assignment ..............................119
Timer1 ..............................................................................121
16-bit Read/Write Mode ...........................................124
Associated Registers ...............................................125
Interrupt ....................................................................124
Operation .................................................................122
Oscillator ..........................................................121, 123
Oscillator Layout Considerations .............................123
Overflow Interrupt .....................................................121
Resetting, Using a Special Event 
Trigger Output (CCP) .......................................124
Special Event Trigger (CCP) ....................................136
TMR1H Register ......................................................121
TMR1L Register .......................................................121
Use as a Real-Time Clock .......................................124
Timer2 ..............................................................................127
Associated Registers ...............................................128
Operation .................................................................127
Postscaler. See Postscaler, Timer2.
PR2 Register ....................................................127, 138
Prescaler. See Prescaler, T imer2.
SSP Clock Shi f t ................................................127, 128
TMR2 Register .........................................................127
TMR2 to PR2 Match Interrupt .................. 127, 128, 138
Timer3 ..............................................................................129
Associated Registers ...............................................131
Operation .................................................................130
Oscillator ..........................................................129, 131
Overflow Interrupt .............................................129, 131
Resetting, Using a Special Event 
Trigger Output (CCP) .......................................131
TMR3H Register ......................................................129
TMR3L Register .......................................................129
Timing Diagrams
A/D Conversion ........................................................342
Acknowledge Sequence ...........................................188
Asynchronous Reception .........................................205
Asynchronous Transmission ....................................203
Asynchronous Transmission (Back to Back) ............203
Baud Rate Generator with Clock Arbitration ............182
BRG Reset Due to SDA Arbitration 
During Start Condition ......................................191
Brown-out Reset (BOR) ...........................................328
Bus Collision During a Repeated 
Start Condition (Case 1) ..................................192
Bus Collision During a Repeated 
Start Condition (Case 2) ..................................192
Bus Collision During a Stop Condition 
(Case 1) ...........................................................193
Bus Collision During a Stop Condition 
(Case 2) ...........................................................193
Bus Collision During Start Condition 
(SCL = 0) ..........................................................191
Bus Collision During Start Condition 
(SDA Only) .......................................................190
Bus Collision for Transmit and 
Acknowledge ....................................................189
Capture/Compare/PWM (CCP) ............................... 330
CLKO and I/O .......................................................... 327
Clock Synchronization ............................................. 175
Clock, Instruction Cycle ............................................. 57
Example SPI Master Mode (CK E = 0) ..................... 332
Example SPI Master Mode (CK E = 1) ..................... 333
Example SPI Slave Mode (CKE = 0) ....................... 334
Example SPI Slave Mode (CKE = 1) ....................... 335
External Clock (All Modes except PLL) ................... 325
Fail-Safe Clock Monitor (FSCM)  .............................. 249
First Start Bit ............................................................ 183
Full-Bridge PWM Output .......................................... 146
Half-Bridge PWM Output ......................................... 145
I2C Bus Data ............................................................ 336
I2C Bus Start/Stop Bits ............................................ 336
I2C Master Mode (Transmission, 
7 or 10-bit Address) ......................................... 186
I2C Slave Mode (Transmission, 10-bit Address) ...... 173
I2C Slave Mode (Transmission, 7-bit Address) ........ 171
I2C Slave Mode with SEN = 0 
(Reception, 10-bit Address) ............................. 172
I2C Slave Mode with SEN = 0 
(Reception, 7-bit Address) ............................... 170
I2C Slave Mode with SEN = 1 
(Reception, 10-bit Address) ............................. 177
I2C Slave Mode with SEN = 1 
(Reception, 7-bit Address) ............................... 176
Low-Voltage Detect ................................................. 234
Low-Voltage Detect Characteristics ......................... 322
Master SSP I 2C Bus Data ........................................ 338
Master SSP I 2C Bus Start /S top Bits ........................ 338
Parallel Slave Port (PIC18F4X20) ........................... 331
Parallel Slave Port (PSP) Read ............................... 115
Parallel Slave Port (PSP) Write ............................... 115
PWM Auto-Shutdown (PRSEN = 0, 
Auto-Restart Disabled) .................................... 151
PWM Auto-Shutdown (PRSEN = 1, 
Auto-Restart Enabled) ..................................... 151
PWM Direction Change ........................................... 148
PWM Direction Change at Near 
100% Duty Cycle ............................................. 148
PWM Output  ............................................................ 138
Repeat Start Condition ............................................ 184
Reset, Watchdog Timer (WDT), 
Oscillator Start-up Timer (OST), 
Power-up Timer (PW RT ) ................................. 328
Slave Mode General Call Address 
Sequence (7 or 10-bit Address Mode) ............. 178
Slave Synchronization ............................................. 161
Slow Rise Time (MCLR Tied to VDD, 
VDD Rise > TPWRT) ............................................ 51
SPI Mode (Master Mode) ......................................... 160
SPI Mode (Slave Mode with CKE = 0) ..................... 162
SPI Mode (Slave Mode with CKE = 1) ..................... 162
Stop Condition Receive or Transmit Mode .............. 188
Synchronous Transmission ..................................... 206
Synchronous Transmission (T hrough TXEN)  .......... 207
Time-out Sequence on POR w/ 
PLL Enabled (MCLR Tied to VDD) ..................... 51
Time-out Sequence on Power-up 
(MCLR No t Ti e d  to  V DD): Case 1 ....................... 50
Time-out Sequence on Power-up 
(MCLR No t Ti e d  to  V DD): Case 2 ....................... 50
Time-out Sequence on Power-up 
(MCLR Tied to VDD, VDD Rise TPWRT) .............. 50

© 2006 Microchip Technology Inc. DS39599D-page 381
PIC18F2220/2320/4220/4320
Timer0 and Timer1 External Clock ..........................329
Transition for Entry to SEC_IDLE Mode ....................34
Transition for Entry to SEC_RUN Mode ....................36
Transition for Entry to Sleep Mode ............................32
Transition for Two-Speed Start-up 
(INTOSC to HSPLL) .........................................247
Transition for Wake from PRI_IDLE Mode .................33
Transition for Wake from RC_RUN Mode  
(RC_RUN to PRI_RUN) .....................................35
Transition for Wake from SEC_RUN Mode 
(HSPLL) .............................................................34
Transition for Wake from Sleep (HSPLL) ...................32
Transition to PRI_IDLE Mode ....................................33
Transition to RC_IDLE Mode .....................................35
Transition to RC_RUN Mode .....................................37
USART Synchronous Receive 
(Master/Slave) ..................................................340
USART Synchronous Reception 
(Master Mode, SREN) ......................................208
USART SynchronousTransmission 
(Master/Slave) ..................................................340
Timing Diagrams and Specifications ................................325
A/D Conversion Requirements ................................342
Capture/Compare/PWM Requirements ...................330
CLKO and I/O Requirements ...................................327
DC Characteristics - Internal RC Accuracy ..............326
Example SPI Mode Requirements 
(Master Mode, CKE = 0) ..................................332
Example SPI Mode Requirements 
(Master Mode, CKE = 1) ..................................333
Example SPI Mode Requirements 
(Slave Mode, CKE = 0) ....................................334
Example SPI Slave Mode Requirements  
(CKE = 1) .........................................................335
External Clock Requirements ..................................325
I2C Bus Data Requirements (Slave Mode) ..............337
Master SSP I2C Bus Data Requirements ................339
Master SSP I2C Bus Start /S top Bits 
Requirements ...................................................338
Parallel Slave Port Requirements (PIC18F4X20) ....331
PLL Clock .................................................................326
Reset, Watchdog Timer, Oscillator 
Start-up Timer, Power-up Timer 
and Brown-out Reset Requirements ................328
Timer0 and Timer1 External Clock 
Requirements ...................................................329
USART Synchronous Receive 
Requirements ...................................................340
USART Synchronous Transmission 
Requirements ...................................................340
Top-of-St a ck Acc e ss  ..........................................................54
TRISE Register
PSPM ODE Bit ..........................................................109
TSTFSZ ............................................................................296
Two-Speed Start-up .................................................237, 247
Two-Word Instruc tions
Example Cases ..........................................................58
TXSTA Register
BRGH Bit  .................................................................198
U
USART ............................................................................. 195
Asynchronous Mode ................................................ 202
Associated Registers, Receive ........................ 205
Associated Registers, Transmit ....................... 203
Receiver .......................................................... 204
Transmitter ...................................................... 202
Baud Rate Generator (BRG) ................................... 198
Associated Registers ....................................... 198
Baud Rate Formula ......................................... 198
Baud Rates, Asynchronous Mode 
(BRGH = 0, Low Speed) .......................... 199
Baud Rates, Asynchronous Mode 
(BRGH = 1, High Speed) ......................... 200
Baud Rates, Synchronous Mode 
(SYNC = 1) .............................................. 201
High Baud Rate Select (BRGH Bit) ................. 198
Operation in Power Managed Mode ................ 198
Sampling .......................................................... 198
Serial Port Enable (SPEN Bit) ................................. 195
Setting Up 9-bit Mode with Address Detect ............. 204
Synchronous Master Mode ...................................... 206
Associated Registers, Reception ..................... 208
Associated Registers, Transmit ....................... 207
Reception ........................................................ 208
Transmission ................................................... 206
Synchronous Slave Mode ........................................ 209
Associated Registers, Receive ........................ 210
Associated Registers, Transmit ....................... 209
Reception ........................................................ 210
Transmission ................................................... 209
V
Voltage Reference Specifications .................................... 321
W
Watchdog Timer (WDT) ............................................237, 245
Associated Registers ............................................... 246
Control Register ....................................................... 245
During Oscillator Failure .......................................... 248
Programming Considerations .................................. 245
WCOL .............................................................................. 183
WCOL Status Flag ............................................183, 185, 188
WWW, On-Line Support ...................................................... 5
X
XORLW ............................................................................ 296
XORWF ........................................................................... 297

PIC18F2220/2320/4220/4320

NOTES:

PIC18F2220/2320/4220/4320

THE MICROCHIP WEB SITE

Microc hip pro vides onl ine s upport v ia our W WW site at

www.microchip.c om . Thi s web si te i s us ed as a m ean s

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

information:

•Product Support – Data sheets and errata,

application notes and sample programs, design

resources, user’s guides and hardware support

docume nts , latest softw are releas es and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online dis cu ss io n gr oups, Micro chip con sul tant

program member listing

•Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,

listing of seminars and even ts, listin gs of

Microchip sales offices, distributors and factory

representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE

Microchip’s customer notification service helps keep

customers current on Microchip products. Subscribers

will receive e-mail notification whenever there are

changes, updates, revisions or errata related to a

specif ied produ ct family or develo pment tool of interes t.

To register, access the Microchip web site at

www.microchip.com, click on Customer Change

Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance

through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor,

representative or field application engineer (FAE) for

support. Local sales offices are also available to help

customers. A listing of sales offices and locations is

included in the back of this document.

Technical suppo rt is avail able throug h the we b site

at: http://support.microchip.com

PIC18F2220/2320/4220/4320

READER RESPONSE

It is ou r intention to provide you w it h th e b es t documentation po ss ible to ens ure suc c es sfu l u se of y ou r Mic r oc hip pro d-

uct. If you wi sh to prov ide you r comment s on org anizatio n, clar ity, subject matter, and ways in whic h our doc umenta tion

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: Technical Publications Manager

RE: Reader Response Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature Number:

Questions:

FAX: (______) _________ - _________

DS39599DPIC18F2220/2320/4220/4320

1. What are the best features of this docume nt?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

PIC18F2220/2320/4220/4320

PIC18F2220/2320/4220/4320 PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. −X/XX XXX

PatternPackageTemperature

Range

Device

Device PIC18F2220/2320/4220/4320(1),

PIC18F2220/2320/4220/4320T(1,2);

VDD range 4.2V to 5.5V

PIC18LF2220/2320/4220/4320(1),

PIC18LF2220/2320/4220/4320T(1,2);

VDD range 2.0V to 5.5V

Temperature

Range I= -40°C to +85°C (Industrial)

Package PT = TQFP (Thin Quad Flatpack)

SO = SOIC

SP = Skinny Plastic DIP

P=PDIP

ML = QFN

Pattern QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) PI C18LF4320-I/P 301 = Industrial temp.,

PDIP package, Extended VDD limits,

QTP pattern #301.

b) PIC18LF2220-I/SO = Industrial temp.,

SOIC package, Extended VDD limits.

c) PIC18F4220-I/P = Industrial temp., PDIP

package, normal VDD limits.

Note 1: F = St andard Voltage Range

LF = Wide Voltage Range

2: T = in tape and reel – SOIC

and TQFP packages only.

AMERICAS

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Atlanta

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Boston

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Chicago

Itasc a , IL

Tel: 630-285-0071

Fax: 630-285-0075

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Detroit

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Los A n ge les

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

Santa Clara

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Habour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7250

Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-4182-8400

Fax: 91-80-4182-8422

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Korea - Gumi

Tel: 82-54-473-4301

Fax: 82-54-473-4302

Korea - Seoul

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Malaysia - Penang

Tel: 60-4-646-8870

Fax: 60-4-646-5086

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Taiwan - T aipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Thail a nd - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-3910

Fax: 43-7242-2244-393

Denmark - Copenhage n

Tel: 45-4450-2828

Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-14 4-44

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Sp ain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08 -91

UK - Wokingham

Tel: 44-118-921- 5869

Fax: 44-118-921-5820

WORLDWIDE SALES AND SERVICE

08/29/06