© 2008 Microchip Technology Inc. DS70149D
dsPIC30F5015/5016
Data Sheet
High-Performance, 16-bit
Digital Signal Controllers
DS70149D-page ii © 2008 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, rfPIC and SmartShunt are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
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SQTP is a service mark of Microchip Technology Incorporated
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All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc. DS70149D-page 3
High-Performance Modified RISC CPU:
Modified Harvard architecture
C compiler optimized instruction set architecture
with flexible Addressing modes
83 base instructions
24-bit wide instructions, 16-bit wide data path
66 Kbytes on-chip Flash program space
(Instruction words)
2 Kbytes of on-chip data RAM
1 Kbyte of nonvolatile data EEPROM
Up to 30 MIPS operation:
- DC to 40 MHz external clock input
- 4 MHz-10 MHz oscillator input with
PLL active (4x, 8x, 16x)
36 interrupt sources:
- 5 external interrupt sources
- 8 user-selectable priority levels for each
interrupt source
- 4 processor trap sources
16 x 16-bit working register array
DSP Engine Features:
Dual data fetch
Accumulator write back for DSP operations
Modulo and Bit-Reversed Addressing modes
Two 40-bit wide accumulators with optional
saturation logic
17-bit x 17-bit single-cycle hardware
fractional/integer multiplier
All DSP instructions single cycle
±16-bit single-cycle shift
Peripheral Features:
High-current sink/source I/O pins: 25 mA/25 mA
•Timer module with programmable prescaler:
- Five 16-bit timers/counters; optionally pair
16-bit timers into 32-bit timer modules
16-bit Capture input functions
16-bit Compare/PWM output functions
3-wire SPI modules (supports 4 Frame modes)
•I
2C™ module supports Multi-Master/Slave mode
and 7-bit/10-bit addressing
1 UART modules with FIFO Buffers
1 CAN modules, 2.0B compliant
Motor Control PWM Module Features:
8 PWM output channels
- Complementary or Independent Output
modes
- Edge and Center-Aligned modes
4 duty cycle generators
Dedicated time base
Programmable output polarity
Dead-Time control for Complementary mode
Manual output control
Trigger for A/D conversions
Quadrature Encoder Interface Module
Features:
Phase A, Phase B and Index Pulse input
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Interrupt on position counter rollover/underflow
Analog Features:
10-bit Analog-to-Digital Converter (ADC) with
4 S/H Inputs:
- 1 Msps conversion rate
- 16 input channels
- Conversion available during Sleep and Idle
Programmable Brown-out Reset
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
High-Performance, 16-bit Digital Signal Controllers
dsPIC30F5015/5016
DS70149D-page 4 © 2008 Microchip Technology Inc.
Special Microcontroller Features:
Enhanced Flash program memory:
- 10,000 erase/write cycle (min.) for
industrial temperature range, 100K (typical)
Data EEPROM memory:
- 100,000 erase/write cycle (min.) for
industrial temperature range, 1M (typical)
Self-reprogrammable under software control
Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
Flexible Watchdog Timer (WDT) with on-chip,
low-power RC oscillator for reliable operation
Fail-Safe Clock Monitor operation detects clock
failure and switches to on-chip, low-power RC
oscillator
Programmable code protection
In-Circuit Serial Programming™ (ICSP™)
programming capability
Selectable Power Management modes:
- Sleep, Idle and Alternate Clock modes
CMOS Technology:
Low-power, high-speed Flash technology
Wide operating voltage range (2.5V to 5.5V)
Industrial and Extended temperature ranges
Low power consumption
dsPIC30F Motor Control and Power Conversion Family
Device Pins
Program
Mem. Bytes/
Instructions
SRAM
Bytes
EEPROM
Bytes
Timer
16-bit
Input
Cap
Output
Comp/Std
PWM
Motor
Control
PWM
A/D 10-bit
1 Msps
Quad
Enc
UART
SPI
I2CTM
CAN
dsPIC30F5015 64 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1
dsPIC30F5016 80 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1
© 2008 Microchip Technology Inc. DS70149D-page 5
dsPIC30F5015/5016
Pin Diagram
72
74
73
71
70
69
68
67
66
65
64
63
62
61
20
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
50
49
48
47
46
45
44
21
41
40
39
38
37
36
35
34
23
24
25
26
27
28
29
30
31
32
33
dsPIC30F5016
17
18
19
75
1
57
56
55
54
53
52
51
60
59
58
43
42
76
78
77
79
22
80
RD12
OC4/RD3
OC3/RD2
EMUD2/OC2/RD1
PWM2L/RE2
PWM1H/RE1
PWM1L/RE0
RG0
RG1
C1TX/RF1
C1RX/RF0
PWM3L/RE4
PWM2H/RE3
CN16/UPDN/RD7
CN14/RD5
EMUC2/OC1/RD0
IC4/RD11
IC2/RD9
IC1/RD8
INT4/RA15
IC3/RD10
INT3/RA14
VSS
OSC1/CLKI
VDD
SCL/RG2
U1RX/RF2
U1TX/RF3
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/CN1/RC13
VREF+/RA10
VREF-/RA9
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VDD
CN17/RF4
CN21/RD15
CN18/RF5
AN6/OCFA/RB6
AN7/RB7
PWM4H/RE7
T2CK/RC1
T4CK/RC3
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
SS2/CN11/RG9
AN4/QEA/CN6/RB4
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
PGC/EMUC/AN1/CN3/RB1
PGD/EMUD/AN0/CN2/RB0
VSS
VDD
PWM3H/RE5
PWM4L/RE6
FLTB/INT2/RE9
FLTA/INT1/RE8
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
VDD
VSS
CN13/RD4
CN19/RD13
SDA/RG3
SDI1/RF7
EMUD3/SDO1/RF8
AN5/QEB/CN7/RB5
VSS
OSC2/CLKO/RC15
CN15/RD6
EMUC3/SCK1/INT0/RF6
CN20/RD14
80-Pin TQFP
.
dsPIC30F5015/5016
DS70149D-page 6 © 2008 Microchip Technology Inc.
Pin Diagram
dsPIC30F5015
64-Pin TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13 36
35
34
33
32
31
30
29
28
27
26
64
63
62
61
60
59
58
57
56
14
15
16
17
18
19
20
21
22
23
24
25
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
EMUC2/OC1/RD0
IC4/INT4/RD11
IC2/FLTB/INT2/RD9
IC1/FLTA/INT1/RD8
VSS
OSC2/CLKO/RC15
OSC1/CLKI
VDD
SCL/RG2
EMUC3/SCK1/INT0/RF6
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
MCLR
VSS
VDD
AN3/INDX/CN5/RB3
AN2/SS1/CN4/RB2
AN1/VREF-/CN3/RB1
AN0/VREF+/CN2/RB0
UPDN/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
VSS
PWM1L/RE0
C1TX/RF1
PWM1H/RE1
EMUD2/OC2/RD1
OC3/RD2
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
AVDD
AVSS
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
VSS
VDD
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
CN18/RF5
CN17/RF4
SDA/RG3
43
42
41
40
39
38
37
44
48
47
46
50
49
51
54
53
52
55
45
SS2/CN11/RG9
AN5/QEB/CN7/RB5
AN4/QEA/CN6/RB4
IC3/INT3/RD10
VDD
C1RX/RF0
OC4/RD3
CN15/RD6
CN14/RD5
CN13/RD4
© 2008 Microchip Technology Inc. DS70149D-page 7
dsPIC30F5015/5016
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 17
3.0 Memory Organization ................................................................................................................................................................. 25
4.0 Address Generator Units............................................................................................................................................................ 37
5.0 Interrupts .................................................................................................................................................................................... 43
6.0 Flash Program Memory.............................................................................................................................................................. 51
7.0 Data EEPROM Memory ............................................................................................................................................................. 57
8.0 I/O Ports ..................................................................................................................................................................................... 61
9.0 Timer1 Module ........................................................................................................................................................................... 67
10.0 Timer2/3 Module ........................................................................................................................................................................ 71
11.0 Timer4/5 Module ....................................................................................................................................................................... 77
12.0 Input Capture Module ................................................................................................................................................................ 81
13.0 Output Compare Module ............................................................................................................................................................ 85
14.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 89
15.0 Motor Control PWM Module ....................................................................................................................................................... 95
16.0 SPI™ Module ........................................................................................................................................................................... 105
17.0 I2C™ Module ........................................................................................................................................................................... 109
18.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 117
19.0 CAN Module ............................................................................................................................................................................. 125
20.0 System Integration ................................................................................................................................................................... 135
21.0 10-bit High-Speed Analog-to-Digital Converter (ADC) Module ................................................................................................ 151
22.0 Instruction Set Summary .......................................................................................................................................................... 163
23.0 Development Support............................................................................................................................................................... 171
24.0 Electrical Characteristics .......................................................................................................................................................... 175
25.0 Packaging Information.............................................................................................................................................................. 215
Appendix A: ....................................................................................................................................................................................... 219
Index ................................................................................................................................................................................................. 221
The Microchip Web Site ..................................................................................................................................................................... 227
Customer Change Notification Service .............................................................................................................................................. 227
Customer Support.............................................................................................................................................................................. 227
Reader Response .............................................................................................................................................................................. 228
Product Identification System ............................................................................................................................................................ 229
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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dsPIC30F5015/5016
DS70149D-page 8 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 9
dsPIC30F5015/5016
1.0 DEVICE OVERVIEW
This document contains device specific information for
the DSTEMP and DSTEMP devices. The dsPIC30F
devices contain extensive Digital Signal Processor
(DSP) functionality within a high-performance 16-bit
microcontroller (MCU) architecture.
Figure 1-1 is a block diagram of the DSTEMP device.
Following the block diagram, Table 1-1 provides a brief
description of the device I/O pinout and the functions
that are multiplexed to the port pins on the DSTEMP.
Figure 1-2 is a block diagram of the DSTEMP device.
Following the block diagram, Table 1-2 provides a brief
description of the device I/O pinout and the functions
that are multiplexed to the port pins on the DSTEMP.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 10 © 2008 Microchip Technology Inc.
FIGURE 1-1: dsPIC30F5015 BLOCK DIAGRAM
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
Power-up
Timer
Oscillator
Start-up Timer
POR/BOR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLKI
MCLR
VDD, VSS
AN4/QEA/CN6/RB4
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
Low-Voltage
Detect
UART1
SPI1, Motor Control
PWM
Timing
Generation
CAN1
AN5/QEB/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Program Memory
(66 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C
QEI
PGC/EMUC/AN6/OCFA/RB6
PGD/EMUD/AN7/RB7
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9 CN18/RF5
EMUC3/SCK1/INT0/RF6
Input
Capture
Module
Output
Compare
Module
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/T4CK/CN1/RC13
PORTB
C1RX/RF0
C1TX/RF1
U1RX/SDI1/RF2
EMUD3/U1TX/SDO1/RF3
SCL/RG2
SDA/RG3
PORTG PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effective Address
X RAGU
X WAGU
Y AGU
AN0/VREF+/CN2/RB0
AN1/VREF-/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
OSC2/CLKO/RC15
CN17/RF4
AVDD, AVSS
SPI2
16
16
16
16
16
PORTC
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(1 Kbyte)
RAM
X Data
(1 Kbyte)
RAM
Address
Latch
Address
Latch
Control Signals
to Various Blocks
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
CN13/RD4
CN14/RD5
CN15/RD6
UPDN/CN16/RD7
IC1/FLTA/INT1/RD8
IC2/FLTB/INT2/RD9
IC3/INT3/RD10
IC4/INT4/RD11
16
Data EEPROM
(1 Kbyte)
16
© 2008 Microchip Technology Inc. DS70149D-page 11
dsPIC30F5015/5016
Table 1-1 provides a brief description of the device I/O
pinout and the functions that are multiplexed to the port
pins on the DSTEMP device. Multiple functions may
exist on one port pin. When multiplexing occurs, the
peripheral module’s functional requirements may force
an override of the data direction of the port pin.
TABLE 1-1: I/O PIN DESCRIPTIONS FOR dsPIC30F5015
Pin Name Pin
Type
Buffer
Type Description
AN0-AN15 I Analog Analog input channels.
AN0 and AN1 are also used for device programming data and clock inputs,
respectively.
AVDD P P Positive supply for analog module. This pin must be connected at all times.
AVSS P P Ground reference for analog module.
CLKI
CLKO
I
O
ST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
CN0-CN18 I ST Input change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
C1RX
C1TX
I
O
ST
CAN1 bus receive pin.
CAN1 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC4 I ST Capture inputs 1 through 4.
INDX
QEA
QEB
UPDN
I
I
I
O
ST
ST
ST
CMOS
Quadrature Encoder Index Pulse input.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F5015/5016
DS70149D-page 12 © 2008 Microchip Technology Inc.
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active-
low Reset to the device.
OCFA
OC1-OC4
I
O
ST
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare outputs 1 through 4.
OSC1
OSC2
I
I/O
ST/CMOS
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RB0-RB15 I/O ST PORTB is a bidirectional I/O port.
RC13-RC15 I/O ST PORTC is a bidirectional I/O port.
RD0-RD11 I/O ST PORTD is a bidirectional I/O port.
RE0-RE7 I/O ST PORTE is a bidirectional I/O port.
RF0-RF6 I/O ST PORTF is a bidirectional I/O port.
RG2-RG3
RG6-RG9
I/O
I/O
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
ST
ST
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA
I/O
I/O
ST
ST
Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI
O
I
ST/CMOS
32 kHz low-power oscillator crystal output.
32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
T1CK
T4CK
I
I
ST
ST
Timer1 external clock input.
Timer4 external clock input.
U1RX
U1TX
I
O
ST
UART1 Receive.
UART1 Transmit.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
VREF+ I Analog Analog Voltage Reference (High) input.
VREF- I Analog Analog Voltage Reference (Low) input.
TABLE 1-1: I/O PIN DESCRIPTIONS FOR dsPIC30F5015 (CONTINUED)
Pin Name Pin
Type
Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2008 Microchip Technology Inc. DS70149D-page 13
dsPIC30F5015/5016
FIGURE 1-2: dsPIC30F5016 BLOCK DIAGRAM
AN8/RB8
AN9/RB9
AN10/RB10
AN11/RB11
Power-up
Timer
Oscillator
Start-up Timer
POR/BOR
Reset
Watchdog
Timer
Instruction
Decode &
Control
OSC1/CLKI
MCLR
VDD, VSS
AN4/QEA/CN6/RB4
AN12/RB12
AN13/RB13
AN14/RB14
AN15/CN12/RB15
Low-Voltage
Detect
UART1
SPI1, Motor Control
PWM
INT4/RA15
INT3/RA14
VREF+/RA10
VREF-/RA9
Timing
Generation
CAN1
AN5/QEB/CN7/RB5
16
PCH PCL
Program Counter
ALU<16>
16
Address Latch
Program Memory
(66 Kbytes)
Data Latch
24
24
24
24
X Data Bus
IR
I2C
QEI
AN6/OCFA/RB6
AN7/RB7
PCU
PWM1L/RE0
PWM1H/RE1
PWM2L/RE2
PWM2H/RE3
PWM3L/RE4
10-bit ADC
Timers
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
FLTA/INT1/RE8
FLTB/INT2/RE9
SCK2/CN8/RG6
SDI2/CN9/RG7
SDO2/CN10/RG8
SS2/CN11/RG9
CN18/RF5
EMUC3/SCK1/INT0/RF6
SDI1/RF7
EMUD3/SDO1/RF8
Input
Capture
Module
Output
Compare
Module
EMUC1/SOSCO/T1CK/CN0/RC14
EMUD1/SOSCI/CN1/RC13
T4CK/RC3
T2CK/RC1
PORTB
C1RX/RF0
C1TX/RF1
U1RX/RF2
U1TX/RF3
RG0
RG1
SCL/RG2
SDA/RG3
PORTG PORTF
PORTD
16
16 16
16 x 16
W Reg Array
Divide
Unit
Engine
DSP
Decode
ROM Latch
16
Y Data Bus
Effective Address
X RAGU
X WAGU
Y AGU
PGD/EMUD/AN0/CN2/RB0
PGC/EMUC/AN1/CN3/RB1
AN2/SS1/CN4/RB2
AN3/INDX/CN5/RB3
OSC2/CLKO/RC15
CN17/RF4
AVDD, AVSS
SPI2
16
16
16
16
16
PORTA
PORTC
PORTE
16
16
16
16
8
Interrupt
Controller
PSV & Table
Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
(1 Kbyte)
RAM
X Data
(1 Kbyte)
RAM
Address
Latch
Address
Latch
Control Signals
to Various Blocks
EMUC2/OC1/RD0
EMUD2/OC2/RD1
OC3/RD2
OC4/RD3
CN13/RD4
CN14/RD5
CN15/RD6
CN16/UPDN/RD7
IC1/RD8
IC2/RD9
IC3/RD10
IC4/RD11
RD12
CN19/RD13
CN20/RD14
CN21/RD15
16
Data EEPROM
(1 Kbyte)
16
dsPIC30F5015/5016
DS70149D-page 14 © 2008 Microchip Technology Inc.
Table 1-1 provides a brief description of the device I/O
pinout and the functions that are multiplexed to the port
pins on the DSTEMP. Multiple functions may exist on
one port pin. When multiplexing occurs, the peripheral
module’s functional requirements may force an over-
ride of the data direction of the port pin.
TABLE 1-2: I/O PIN DESCRIPTIONS FOR dsPIC30F5016
Pin Name Pin
Type
Buffer
Type Description
AN0-AN15 I Analog Analog input channels.
AN0 and AN1 are also used for device programming data and clock inputs,
respectively.
AVDD P P Positive supply for analog module.
AVSS P P Ground reference for analog module.
CLKI
CLKO
I
O
ST/CMOS
External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always
associated with OSC2 pin function.
CN0-CN21 I ST Input change notification inputs.
Can be software programmed for internal weak pull-ups on all inputs.
C1RX
C1TX
I
O
ST
CAN1 bus receive pin.
CAN1 bus transmit pin.
EMUD
EMUC
EMUD1
EMUC1
EMUD2
EMUC2
EMUD3
EMUC3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
ST
ST
ST
ST
ST
ST
ST
ST
ICD Primary Communication Channel data input/output pin.
ICD Primary Communication Channel clock input/output pin.
ICD Secondary Communication Channel data input/output pin.
ICD Secondary Communication Channel clock input/output pin.
ICD Tertiary Communication Channel data input/output pin.
ICD Tertiary Communication Channel clock input/output pin.
ICD Quaternary Communication Channel data input/output pin.
ICD Quaternary Communication Channel clock input/output pin.
IC1-IC4 I ST Capture inputs 1 through 8.
INDX
QEA
QEB
UPDN
I
I
I
O
ST
ST
ST
CMOS
Quadrature Encoder Index Pulse input.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Quadrature Encoder Phase A input in QEI mode.
Auxiliary Timer External Clock/Gate input in Timer mode.
Position Up/Down Counter Direction State.
INT0
INT1
INT2
INT3
INT4
I
I
I
I
I
ST
ST
ST
ST
ST
External interrupt 0.
External interrupt 1.
External interrupt 2.
External interrupt 3.
External interrupt 4.
FLTA
FLTB
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM4L
PWM4H
I
I
O
O
O
O
O
O
O
O
ST
ST
PWM Fault A input.
PWM Fault B input.
PWM 1 Low output.
PWM 1 High output.
PWM 2 Low output.
PWM 2 High output.
PWM 3 Low output.
PWM 3 High output.
PWM 4 Low output.
PWM 4 High output.
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
© 2008 Microchip Technology Inc. DS70149D-page 15
dsPIC30F5015/5016
MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an active-
low Reset to the device.
OCFA
OCFB
OC1-OC4
I
I
O
ST
ST
Compare Fault A input (for Compare channels 1, 2, 3 and 4).
Compare Fault B input (for Compare channels 5, 6, 7 and 8).
Compare outputs 1 through 4.
OSC1
OSC2
I
I/O
ST/CMOS
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator
mode. Optionally functions as CLKO in RC and EC modes.
PGD
PGC
I/O
I
ST
ST
In-Circuit Serial Programming™ data input/output pin.
In-Circuit Serial Programming clock input pin.
RA9-RA10
RA14-RA15
I/O
I/O
ST
ST
PORTA is a bidirectional I/O port.
RB0-RB15 I/O ST PORTB is a bidirectional I/O port.
RC1
RC3
RC13-RC15
I/O
I/O
I/O
ST
ST
ST
PORTC is a bidirectional I/O port.
RD0-RD15 I/O ST PORTD is a bidirectional I/O port.
RE0-RE9 I/O ST PORTE is a bidirectional I/O port.
RF0-RF8 I/O ST PORTF is a bidirectional I/O port.
RG0-RG3
RG6-RG9
I/O
I/O
ST
ST
PORTG is a bidirectional I/O port.
SCK1
SDI1
SDO1
SS1
SCK2
SDI2
SDO2
SS2
I/O
I
O
I
I/O
I
O
I
ST
ST
ST
ST
ST
ST
Synchronous serial clock input/output for SPI #1.
SPI #1 Data In.
SPI #1 Data Out.
SPI #1 Slave Synchronization.
Synchronous serial clock input/output for SPI #2.
SPI #2 Data In.
SPI #2 Data Out.
SPI #2 Slave Synchronization.
SCL
SDA
I/O
I/O
ST
ST
Synchronous serial clock input/output for I2C™.
Synchronous serial data input/output for I2C.
SOSCO
SOSCI
O
I
ST/CMOS
32 kHz low-power oscillator crystal output.
32 kHz low-power oscillator crystal input. ST buffer when configured in RC
mode; CMOS otherwise.
T1CK
T2CK
T4CK
I
I
I
ST
ST
ST
Timer1 external clock input.
Timer2 external clock input.
Timer4 external clock input.
U1RX
U1TX
I
O
ST
UART1 Receive.
UART1 Transmit.
VDD P Positive supply for logic and I/O pins.
VSS P Ground reference for logic and I/O pins.
VREF+ I Analog Analog Voltage Reference (High) input.
VREF- I Analog Analog Voltage Reference (Low) input.
TABLE 1-2: I/O PIN DESCRIPTIONS FOR dsPIC30F5016 (CONTINUED)
Pin Name Pin
Type
Buffer
Type Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input
ST = Schmitt Trigger input with CMOS levels O = Output
I = Input P = Power
dsPIC30F5015/5016
DS70149D-page 16 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 17
dsPIC30F5015/5016
2.0 CPU ARCHITECTURE
OVERVIEW
This document provides a summary of the
dsPIC30F5015/5016 CPU and peripheral function. For
a complete description of this functionality, please refer
to the dsPIC30F Family Reference Manual”
(DS70046).
2.1 Core Overview
The core has a 24-bit instruction word. The Program
Counter (PC) is 23 bits wide with the Least Significant
bit (LSb) always clear (see Section 3.1 “Program
Address Space”), and the Most Significant bit (MSb)
is ignored during normal program execution, except for
certain specialized instructions. Thus, the PC can
address up to 4M instruction words of user program
space. An instruction prefetch mechanism is used to
help maintain throughput. Program loop constructs,
free from loop count management overhead, are
supported using the DO and REPEAT instructions, both
of which are interruptible at any point.
The working register array consists of 16x16-bit
registers, each of which can act as data, address or
offset registers. One working register (W15) operates
as a software Stack Pointer for interrupts and calls.
The data space is 64 Kbytes (32K words) and is split
into two blocks, referred to as X and Y data memory.
Each block has its own independent Address
Generation Unit (AGU). Most instructions operate
solely through the X memory AGU, which provides the
appearance of a single unified data space. The
Multiply-Accumulate (MAC) class of dual source DSP
instructions operate through both the X and Y AGUs,
splitting the data address space into two parts (see
Section 3.2 “Data Address Space”). The X and Y
data space boundary is device specific and cannot be
altered by the user. Each data word consists of 2 bytes,
and most instructions can address data either as words
or bytes.
There are two methods of accessing data stored in
program memory:
The upper 32 Kbytes of data space memory can be
mapped into the lower half (user space) of program
space at any 16K program word boundary, defined
by the 8-bit Program Space Visibility Page
(PSVPAG) register. This lets any instruction access
program space as if it were data space, with a limi-
tation that the access requires an additional cycle.
Moreover, only the lower 16 bits of each instruction
word can be accessed using this
method.
Linear indirect access of 32K word pages within
program space is also possible using any working
register, via table read and write instructions.
Table read and write instructions can be used to
access all 24 bits of an instruction word.
Overhead-free circular buffers (Modulo Addressing)
are supported in both X and Y address spaces. This is
primarily intended to remove the loop overhead for
DSP algorithms.
The X AGU also supports Bit-Reversed Addressing on
destination effective addresses, to greatly simplify input
or output data reordering for radix-2 FFT algorithms.
Refer to Section 4.0 “Address Generator Units” for
details on Modulo and Bit-Reversed Addressing.
The core supports Inherent (no operand), Relative,
Literal, Memory Direct, Register Direct, Register
Indirect, Register Offset and Literal Offset Addressing
modes. Instructions are associated with predefined
addressing modes, depending upon their functional
requirements.
For most instructions, the core is capable of executing
a data (or program data) memory read, a working
register (data) read, a data memory write and a
program (instruction) memory read per instruction
cycle. As a result, 3-operand instructions are
supported, allowing C = A + B operations to be
executed in a single cycle.
A DSP engine has been included to significantly
enhance the core arithmetic capability and throughput.
It features a high-speed 17-bit by 17-bit multiplier, a
40-bit ALU, two 40-bit saturating accumulators and a
40-bit bidirectional barrel shifter. Data in the
accumulator or any working register can be shifted up
to 16 bits right or 16 bits left in a single cycle. The DSP
instructions operate seamlessly with all other
instructions and have been designed for optimal
real-time performance. The MAC class of instructions
can concurrently fetch two data operands from mem-
ory, while multiplying two W registers. To enable this
concurrent fetching of data operands, the data space
has been split for these instructions and linear for all
others. This has been achieved in a transparent and
flexible manner, by dedicating certain working registers
to each address space for the MAC class of
instructions.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 18 © 2008 Microchip Technology Inc.
The core does not support a multi-stage instruction
pipeline. However, a single stage instruction prefetch
mechanism is used, which accesses and partially
decodes instructions a cycle ahead of execution, in
order to maximize available execution time. Most
instructions execute in a single cycle, with certain
exceptions.
The core features a vectored exception processing
structure for traps and interrupts, with 62 independent
vectors. The exceptions consist of up to 8 traps (of
which 4 are reserved) and 54 interrupts. Each interrupt
is prioritized based on a user assigned priority between
1 and 7 (1 being the lowest priority and 7 being the
highest) in conjunction with a predetermined ‘natural
order’. Traps have fixed priorities, ranging from 8 to 15.
2.2 Programmer’s Model
The programmer’s model is shown in Figure 2-1 and
consists of 16x16-bit working registers (W0 through
W15), 2x40-bit accumulators (ACCA and ACCB),
STATUS register (SR), Data Table Page register
(TBLPAG), Program Space Visibility Page register
(PSVPAG), DO and REPEAT registers (DOSTART,
DOEND, DCOUNT and RCOUNT) and Program
Counter (PC). The working registers can act as data,
address or offset registers. All registers are memory
mapped. W0 acts as the W register for file register
addressing.
Some of these registers have a shadow register
associated with each of them, as shown in Figure 2-1.
The shadow register is used as a temporary holding
register and can transfer its contents to or from its host
register upon the occurrence of an event. None of the
shadow registers are accessible directly. The following
rules apply for transfer of registers into and out of
shadows.
PUSH.S and POP.S
W0, W1, W2, W3, SR (DC, N, OV, Z and C bits
only) are transferred.
DO instruction
DOSTART, DOEND, DCOUNT shadows are
pushed on loop start, and popped on loop end.
When a byte operation is performed on a working
register, only the Least Significant Byte (LSB) of the
target register is affected. However, a benefit of
memory mapped working registers is that both the
Least and Most Significant Bytes (MSBs) can be
manipulated through byte-wide data memory space
accesses.
2.2.1 SOFTWARE STACK POINTER/
FRAME POINTER
The dsPIC® DSC devices contain a software stack.
W15 is the dedicated software Stack Pointer (SP), and
will be automatically modified by exception processing
and subroutine calls and returns. However, W15 can be
referenced by any instruction in the same manner as all
other W registers. This simplifies the reading, writing
and manipulation of the Stack Pointer (for example,
creating stack frames).
W15 is initialized to 0x0800 during a Reset. The user
may reprogram the SP during initialization to any
location within data space.
W14 has been dedicated as a Stack Frame Pointer as
defined by the LNK and ULNK instructions. However,
W14 can be referenced by any instruction in the same
manner as all other W registers.
2.2.2 STATUS REGISTER
The dsPIC DSC core has a 16-bit STATUS register
(SR), the LSB of which is referred to as the SR Low
Byte (SRL) and the MSB as the SR High Byte (SRH).
See Figure 2-1 for SR layout.
SRL contains all the MCU ALU operation Status flags
(including the Z bit), as well as the CPU Interrupt
Priority Level Status bits, IPL<2:0>, and the Repeat
Active Status bit, RA. During exception processing,
SRL is concatenated with the MSB of the PC to form a
complete word value which is then stacked.
The upper byte of the SR register contains the DSP
Adder/Subtracter Status bits, the DO Loop Active bit
(DA) and the Digit Carry (DC) Status bit.
2.2.3 PROGRAM COUNTER
The Program Counter is 23 bits wide. Bit 0 is always
clear. Therefore, the PC can address up to 4M
instruction words.
Note: In order to protect against misaligned
stack accesses, W15<0> is always clear.
© 2008 Microchip Technology Inc. DS70149D-page 19
dsPIC30F5015/5016
FIGURE 2-1: dsPIC30F5015/5016 PROGRAMMERS MODEL
TABPAG
PC22 PC0
7 0
D0D15
Program Counter
Data Table Page Address
STATUS Register
Working Registers
DSP Operand
Registers
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12/DSP Offset
W13/DSP Write Back
W14/Frame Pointer
W15/Stack Pointer
DSP Address
Registers
AD39 AD0AD31
DSP
Accumulators
ACCA
ACCB
PSVPAG
7 0
Program Space Visibility Page Address
Z
0
OA OB SA SB
RCOUNT
15 0
REPEAT Loop Counter
DCOUNT
15 0
DO Loop Counter
DOSTART
22 0
DO Loop Start Address
IPL2 IPL1
SPLIM Stack Pointer Limit Register
AD15
SRL
PUSH.S Shadow
DO Shadow
OAB SAB
15 0
Core Configuration Register
Legend
CORCON
DA DC RA N
TBLPAG
PSVPAG
IPL0 OV
W0/WREG
SRH
DO Loop End Address
DOEND
22
C
dsPIC30F5015/5016
DS70149D-page 20 © 2008 Microchip Technology Inc.
2.3 Divide Support
The dsPIC DSC devices feature a 16/16-bit signed
fractional divide operation, as well as 32/16-bit and
16/16-bit signed and unsigned integer divide
operations, in the form of single instruction iterative
divides. The following instructions and data sizes are
supported:
1. DIVF – 16/16 signed fractional divide
2. DIV.sd – 32/16 signed divide
3. DIV.ud – 32/16 unsigned divide
4. DIV.sw – 16/16 signed divide
5. DIV.uw – 16/16 unsigned divide
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a series
of discrete divide instructions) will not function correctly
because the instruction flow depends on RCOUNT. The
divide instruction does not automatically set up the
RCOUNT value, and it must, therefore, be explicitly and
correctly specified in the REPEAT instruction, as shown
in Table 2-1 (REPEAT will execute the target instruction
{operand value+1} times). The REPEAT loop count must
be set up for 18 iterations of the DIV/DIVF instruction.
Thus, a complete divide operation requires 19 cycles.
TABLE 2-1: DIVIDE INSTRUCTIONS
2.4 DSP Engine
The DSP engine consists of a high-speed 17-bit x 17-bit
multiplier, a barrel shifter, and a 40-bit adder/subtracter
(with two target accumulators, round and saturation
logic).
The dsPIC30F devices have a single instruction flow
which can execute either DSP or MCU instructions.
Many of the hardware resources are shared between
the DSP and MCU instructions. For example, the
instruction set has both DSP and MCU multiply
instructions which use the same hardware multiplier.
The DSP engine also has the capability to perform
inherent accumulator-to-accumulator operations, which
require no additional data. These instructions are ADD,
SUB and NEG.
The DSP engine has various options selected through
various bits in the CPU Core Configuration register
(CORCON), as listed below:
Fractional or Integer DSP Multiply (IF)
Signed or Unsigned DSP Multiply (US)
Conventional or Convergent Rounding (RND)
Automatic Saturation On/Off for ACCA (SATA)
Automatic Saturation On/Off for ACCB (SATB)
Automatic Saturation On/Off for Writes to Data
Memory (SATDW)
Accumulator Saturation mode Selection
(ACCSAT)
A block diagram of the DSP engine is shown in
Figure 2-2.
Note: The divide flow is interruptible. However,
the user needs to save the context as
appropriate.
Instruction Function
DIVF Signed fractional divide: Wm/Wn W0; Rem W1
DIV.sd Signed divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.ud Unsigned divide: (Wm+1:Wm)/Wn W0; Rem W1
DIV.sw Signed divide: Wm/Wn W0; Rem W1
DIV.uw Unsigned divide: Wm/Wn W0; Rem W1
Note: For CORCON layout, see Table 3-3.
TABLE 2-2: DSP INSTRUCTION
SUMMARY
Instruction Algebraic Operation
CLR A = 0
ED A = (x - y)2
EDAC A = A + (x - y)2
MAC A = A + (x * y)
MOVSAC No change in A
MPY A = x * y
MPY.N A = - x * y
MSC A = A - x * y
© 2008 Microchip Technology Inc. DS70149D-page 21
dsPIC30F5015/5016
FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM
Zero Backfill
Sign-Extend
Barrel
Shifter
40-bit Accumulator A
40-bit Accumulator B Round
Logic
X Data Bus
To/From W Array
Adder
Saturate
Negate
32
32
33
16
16 16
16
40 40
40 40
S
a
t
u
r
a
t
e
Y Data Bus
40
Carry/Borrow Out
Carry/Borrow In
16
40
Multiplier/Scaler
17-bit
dsPIC30F5015/5016
DS70149D-page 22 © 2008 Microchip Technology Inc.
2.4.1 MULTIPLIER
The 17x17-bit multiplier is capable of signed or
unsigned operations and can multiplex its output using
a scaler to support either 1.31 fractional (Q31) or 32-bit
integer results. Unsigned operands are zero-extended
into the 17th bit of the multiplier input value. Signed
operands are sign-extended into the 17th bit of the
multiplier input value. The output of the 17x17-bit
multiplier/scaler is a 33-bit value, which is
sign-extended to 40 bits. Integer data is inherently
represented as a signed two’s complement value,
where the MSB is defined as a sign bit. Generally
speaking, the range of an N-bit two’s complement
integer is -2N-1 to 2N-1 – 1. For a 16-bit integer, the data
range is -32768 (0x8000) to 32767 (0x7FFF), including
0. For a 32-bit integer, the data range is -2,147,483,648
(0x8000 0000) to 2,147,483,645 (0x7FFF FFFF).
When the multiplier is configured for fractional
multiplication, the data is represented as a two’s
complement fraction, where the MSB is defined as a
sign bit and the radix point is implied to lie just after the
sign bit (QX format). The range of an N-bit two’s
complement fraction with this implied radix point is -1.0
to (1 – 21-N). For a 16-bit fraction, the Q15 data range
is -1.0 (0x8000) to 0.999969482 (0x7FFF), including 0
and has a precision of 3.01518x10-5. In Fractional
mode, a 16x16 multiply operation generates a 1.31
product, which has a precision of 4.65661x10-10.
The same multiplier is used to support the MCU
multiply instructions, which include integer 16-bit
signed, unsigned and mixed sign multiplies.
The MUL instruction may be directed to use byte or
word-sized operands. Byte operands will direct a 16-bit
result, and word operands will direct a 32-bit result to
the specified register(s) in the W array.
2.4.2 DATA ACCUMULATORS AND
ADDER/SUBTRACTER
The data accumulator consists of a 40-bit
adder/subtracter with automatic sign extension logic. It
can select one of two accumulators (A or B) as its
pre-accumulation source and post-accumulation
destination. For the ADD and LAC instructions, the data
to be accumulated or loaded can be optionally scaled
via the barrel shifter, prior to accumulation.
2.4.2.1 Adder/Subtracter, Overflow and
Saturation
The adder/subtracter is a 40-bit adder with an optional
zero input into one side and either true or complement
data into the other input. In the case of addition, the
carry/borrow input is active-high and the other input is
true data (not complemented), whereas in the case of
subtraction, the carry/borrow input is active-low and the
other input is complemented. The adder/subtracter
generates Overflow Status bits, SA/SB and OA/OB,
which are latched and reflected in the STATUS register.
Overflow from bit 39: this is a catastrophic
overflow in which the sign of the accumulator is
destroyed.
Overflow into guard bits 32 through 39: this is a
recoverable overflow. This bit is set whenever all
the guard bits are not identical to each other.
The adder has an additional saturation block which
controls accumulator data saturation, if selected. It
uses the result of the adder, the Overflow Status bits
described above, and the SATA/B (CORCON<7:6>)
and ACCSAT (CORCON<4>) mode control bits to
determine when and to what value to saturate.
Six STATUS register bits have been provided to
support saturation and overflow; they are:
1. OA:
ACCA overflowed into guard bits
2. OB:
ACCB overflowed into guard bits
3. SA:
ACCA saturated (bit 31 overflow and saturation)
or
ACCA overflowed into guard bits and saturated
(bit 39 overflow and saturation)
4. SB:
ACCB saturated (bit 31 overflow and saturation)
or
ACCB overflowed into guard bits and saturated
(bit 39 overflow and saturation)
5. OAB:
Logical OR of OA and OB
6. SAB:
Logical OR of SA and SB
The OA and OB bits are modified each time data
passes through the adder/subtracter. When set, they
indicate that the most recent operation has overflowed
into the accumulator guard bits (bits 32 through 39).
The OA and OB bits can also optionally generate an
arithmetic warning trap when set and the
corresponding overflow trap flag enable bit (OVATE,
OVBTE) in the INTCON1 register (refer to Section 5.0
“Interrupts”) is set. This allows the user to take
immediate action, for example, to correct system gain.
© 2008 Microchip Technology Inc. DS70149D-page 23
dsPIC30F5015/5016
The SA and SB bits are modified each time data passes
through the adder/subtracter, but can only be cleared by
the user. When set, they indicate that the accumulator
has overflowed its maximum range (bit 31 for 32-bit
saturation, or bit 39 for 40-bit saturation) and will be
saturated (if saturation is enabled). When saturation is
not enabled, SA and SB default to bit 39 overflow and
thus indicate that a catastrophic overflow has occurred.
If the COVTE bit in the INTCON1 register is set, SA and
SB bits will generate an arithmetic warning trap when
saturation is disabled.
The Overflow and Saturation Status bits can optionally
be viewed in the STATUS register (SR) as the logical
OR of OA and OB (in bit OAB) and the logical OR of SA
and SB (in bit SAB). This allows programmers to check
one bit in the STATUS register to determine if either
accumulator has overflowed, or one bit to determine if
either accumulator has saturated. This would be useful
for complex number arithmetic which typically uses
both the accumulators.
The device supports three Saturation and Overflow
modes.
1. Bit 39 Overflow and Saturation:
When bit 39 overflow and saturation occurs, the
saturation logic loads the maximally positive 9.31
(0x7FFFFFFFFF) or maximally negative 9.31
value (0x8000000000) into the target
accumulator. The SA or SB bit is set and
remains set until cleared by the user. This is
referred to as ‘super saturation’ and provides pro-
tection against erroneous data or unexpected
algorithm problems (e.g., gain calculations).
2. Bit 31 Overflow and Saturation:
When bit 31 overflow and saturation occurs, the
saturation logic then loads the maximally
positive 1.31 value (0x007FFFFFFF) or
maximally negative 1.31 value (0x0080000000)
into the target accumulator. The SA or SB bit is
set and remains set until cleared by the user.
When this Saturation mode is in effect, the guard
bits are not used (so the OA, OB or OAB bits are
never set).
3. Bit 39 Catastrophic Overflow
The bit 39 Overflow Status bit from the adder is
used to set the SA or SB bit, which remain set
until cleared by the user. No saturation operation
is performed and the accumulator is allowed to
overflow (destroying its sign). If the COVTE bit in
the INTCON1 register is set, a catastrophic
overflow can initiate a trap exception.
2.4.2.2 Accumulator ‘Write Back’
The MAC class of instructions (with the exception of
MPY, MPY.N, ED and EDAC) can optionally write a
rounded version of the high word (bits 31 through 16)
of the accumulator that is not targeted by the instruction
into data space memory. The write is performed across
the X bus into combined X and Y address space. The
following addressing modes are supported:
1. W13, Register Direct:
The rounded contents of the non-target
accumulator are written into W13 as a 1.15
fraction.
2. [W13]+ = 2, Register Indirect with Post-Increment:
The rounded contents of the non-target
accumulator are written into the address pointed
to by W13 as a 1.15 fraction. W13 is then
incremented by 2 (for a word write).
2.4.2.3 Round Logic
The round logic is a combinational block, which
performs a conventional (biased) or convergent
(unbiased) round function during an accumulator write
(store). The Round mode is determined by the state of
the RND bit in the CORCON register. It generates a
16-bit, 1.15 data value which is passed to the data
space write saturation logic. If rounding is not indicated
by the instruction, a truncated 1.15 data value is stored
and the least significant word (lsw) is simply discarded.
Conventional rounding takes bit 15 of the accumulator,
zero-extends it and adds it to the ACCxH word (bits 16
through 31 of the accumulator). If the ACCxL word (bits
0 through 15 of the accumulator) is between 0x8000
and 0xFFFF (0x8000 included), ACCxH is
incremented. If ACCxL is between 0x0000 and 0x7FFF,
ACCxH is left unchanged. A consequence of this
algorithm is that over a succession of random rounding
operations, the value will tend to be biased slightly
positive.
Convergent (or unbiased) rounding operates in the
same manner as conventional rounding, except when
ACCxL equals 0x8000. If this is the case, the LSb (bit
16 of the accumulator) of ACCxH is examined. If it is ‘1’,
ACCxH is incremented. If it is ‘0’, ACCxH is not
modified. Assuming that bit 16 is effectively random in
nature, this scheme will remove any rounding bias that
may accumulate.
The SAC and SAC.R instructions store either a
truncated (SAC) or rounded (SAC.R) version of the
contents of the target accumulator to data memory, via
the X bus (subject to data saturation, see
Section 2.4.2.4 “Data Space Write Saturation”).
Note that for the MAC class of instructions, the
accumulator write back operation will function in the
same manner, addressing combined MCU (X and Y)
data space though the X bus. For this class of
instructions, the data is always subject to rounding.
dsPIC30F5015/5016
DS70149D-page 24 © 2008 Microchip Technology Inc.
2.4.2.4 Data Space Write Saturation
In addition to adder/subtracter saturation, writes to data
space may also be saturated, but without affecting the
contents of the source accumulator. The data space write
saturation logic block accepts a 16-bit, 1.15 fractional
value from the round logic block as its input, together with
overflow status from the original source (accumulator)
and the 16-bit round adder. These are combined and
used to select the appropriate 1.15 fractional value as
output to write to data space memory.
If the SATDW bit in the CORCON register is set, data
(after rounding or truncation) is tested for overflow and
adjusted accordingly. For input data greater than
0x007FFF, data written to memory is forced to the
maximum positive 1.15 value, 0x7FFF. For input data
less than 0xFF8000, data written to memory is forced
to the maximum negative 1.15 value, 0x8000. The MSb
of the source (bit 39) is used to determine the sign of
the operand being tested.
If the SATDW bit in the CORCON register is not set, the
input data is always passed through unmodified under
all conditions.
2.4.3 BARREL SHIFTER
The barrel shifter is capable of performing up to 16-bit
arithmetic or logic right shifts, or up to 16-bit left shifts
in a single cycle. The source can be either of the two
DSP accumulators or the X bus (to support multi-bit
shifts of register or memory data).
The shifter requires a signed binary value to determine
both the magnitude (number of bits) and direction of the
shift operation. A positive value will shift the operand
right. A negative value will shift the operand left. A
value of ‘0’ will not modify the operand.
The barrel shifter is 40 bits wide, thereby obtaining a
40-bit result for DSP shift operations and a 16-bit result
for MCU shift operations. Data from the X bus is
presented to the barrel shifter between bit positions 16
to 31 for right shifts, and bit positions 0 to 15 for left
shifts.
© 2008 Microchip Technology Inc. DS70149D-page 25
dsPIC30F5015/5016
3.0 MEMORY ORGANIZATION
3.1 Program Address Space
The program address space is 4M instruction words. It
is addressable by the 23-bit PC, table instruction
Effective Address (EA), or data space EA, when
program space is mapped into data space, as defined
by Table 3-1. Note that the program space address is
incremented by two between successive program
words, in order to provide compatibility with data space
addressing.
User program space access is restricted to the lower
4M instruction word address range (0x000000 to
0x7FFFFE), for all accesses other than TBLRD/TBLWT,
which use TBLPAG<7> to determine user or
configuration space access. In TABLE 3-1: “Program
Space Address Construction”, bit 23 allows access
to the Device ID, the User ID and the Configuration bits.
Otherwise, bit 23 is always clear.
FIGURE 3-1:
PROGRAM SPACE
MEMORY MAP FOR
dsPIC30F5015/5016
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Reset - Target Address
User Memory
Space
000000
00007E
000002
000080
Device Configuration
User Flash
Program Memory
00B000
00AFFE
Configuration Memory
Space
Data EEPROM
(22K instructions)
(1 Kbyte)
800000
F80000
Registers F8000E
F80010
DEVID (2)
FEFFFE
FF0000
FFFFFE
Reserved
F7FFFE
Reserved
7FFC00
7FFBFE
(Read ‘0’s)
8005FE
800600
UNITID (32 instr.)
8005BE
8005C0
Reset - GOTO Instruction
000004
Reserved
7FFFFE
Reserved
000100
0000FE
000084
Alternate Vector Table
Reserved
Interrupt Vector Table
Vector Tables
dsPIC30F5015/5016
DS70149D-page 26 © 2008 Microchip Technology Inc.
TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION
FIGURE 3-2: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
Access Type Access
Space
Program Space Address
<23> <22:16> <15> <14:1> <0>
Instruction Access User 0 PC<22:1> 0
TBLRD/TBLWT User
(TBLPAG<7> = 0)
TBLPAG<7:0> Data EA<15:0>
TBLRD/TBLWT Configuration
(TBLPAG<7> = 1)
TBLPAG<7:0> Data EA<15:0>
Program Space Visibility User 0 PSVPAG<7:0> Data EA<14:0>
0Program Counter
23 bits
1
PSVPAG Reg
8 bits
EA
15 bits
Program
Using
Select
TBLPAG Reg
8 bits
EA
16 bits
Using
Byte
24-bit EA
0
0
1/0
Select
User/
Configuration
Table
Instruction
Program
Space
Counter
Using
Space
Select
Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.
Visibility
© 2008 Microchip Technology Inc. DS70149D-page 27
dsPIC30F5015/5016
3.1.1 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
This architecture fetches 24-bit wide program memory.
Consequently, instructions are always aligned.
However, as the architecture is modified Harvard, data
can also be present in program space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the remapping of a 16K word program space page into
the upper half of data space (see Section 3.1.2 “Data
Access From Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL
instructions offer a direct method of reading or writing
the least significant word of any address within
program space, without going through data space. The
TBLRDH and TBLWTH instructions are the only method
whereby the upper 8 bits of a program space word can
be accessed as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two 16-bit
word wide address spaces, residing side by side, each
with the same address range. TBLRDL and TBLWTL
access the space that contains the least significant
word, and TBLRDH and TBLWTH access the space that
contains the MSB.
Figure 3-2 shows how the EA is created for table
operations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
A set of table instructions are provided to move byte or
word-sized data to and from program space.
1. TBLRDL: Table Read Low
Word: Read the least significant word of the
program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LSBs of the program
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> maps to the destination byte when byte
select = 1.
2. TBLWTL: Table Write Low (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
3. TBLRDH: Table Read High
Word: Read the most significant word of the
program address;
P<23:16> maps to D<7:0>; D<15:8> always
is = 0.
Byte: Read one of the MSBs of the program
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be = 0 when
byte select = 1.
4. TBLWTH: Table Write High (refer to Section 6.0
“Flash Program Memory” for details on Flash
Programming).
FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’).
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)
dsPIC30F5015/5016
DS70149D-page 28 © 2008 Microchip Technology Inc.
FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MSB)
3.1.2 DATA ACCESS FROM PROGRAM
MEMORY USING PROGRAM SPACE
VISIBILITY
The upper 32 Kbytes of data space may optionally be
mapped into any 16K word program space page. This
provides transparent access of stored constant data
from X data space, without the need to use special
instructions (i.e., TBLRDL/H, TBLWTL/H instructions).
Program space access through the data space occurs
if the MSb of the data space EA is set and program
space visibility is enabled, by setting the PSV bit in the
Core Control register (CORCON). The functions of
CORCON are discussed in Section 2.4 “DSP
Engine”.
Data accesses to this area add an additional cycle to
the instruction being executed, since two program
memory fetches are required.
Note that the upper half of addressable data space is
always part of the X data space. Therefore, when a
DSP operation uses program space mapping to access
this memory region, Y data space should typically
contain state (variable) data for DSP operations,
whereas X data space should typically contain
coefficient (constant) data.
Although each data space address, 0x8000 and higher,
maps directly into a corresponding program memory
address (see Figure 3-5), only the lower 16 bits of the
24-bit program word are used to contain the data. The
upper 8 bits should be programmed to force an illegal
instruction to maintain machine robustness. Refer
to the “dsPIC30F/33F Programmer’s Reference
Manual” (DS70157) for details on instruction encoding.
Note that by incrementing the PC by 2 for each
program memory word, the Least Significant 15 bits of
data space addresses directly map to the Least
Significant 15 bits in the corresponding program space
addresses. The remaining bits are provided by the
Program Space Visibility Page register, PSVPAG<7:0>,
as shown in Figure 3-5.
For instructions which use PSV that are executed
outside a REPEAT loop:
The following instructions will require one
instruction cycle in addition to the specified
execution time:
-MAC class of instructions with data operand
prefetch
-MOV instructions
-MOV.D instructions
All other instructions will require two instruction
cycles in addition to the specified execution time
of the instruction.
For instructions that use PSV which are executed
inside a REPEAT loop:
The following instances will require two instruction
cycles in addition to the specified execution time
of the instruction:
- Execution in the first iteration
- Execution in the last iteration
- Execution prior to exiting the loop due to an
interrupt
- Execution upon re-entering the loop after an
interrupt is serviced
Any other iteration of the REPEAT loop will allow
the instruction, accessing data using PSV, to
execute in a single cycle.
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(Read as ‘0’)
TBLRDH.W
TBLRDH.B (Wn<0> = 1)
TBLRDH.B (Wn<0> = 0)
Note: PSV access is temporarily disabled during
table reads/writes.
© 2008 Microchip Technology Inc. DS70149D-page 29
dsPIC30F5015/5016
FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
3.2 Data Address Space
The core has two data spaces. The data spaces can be
considered either separate (for some DSP
instructions), or as one unified linear address range (for
MCU instructions). The data spaces are accessed
using two Address Generation Units (AGUs) and
separate data paths.
3.2.1 DATA SPACE MEMORY MAP
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent linear
addressing space, X and Y spaces have contiguous
addresses.
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the
64 Kbyte data address space (including all Y
addresses). When executing one of the MAC class of
instructions, the X block consists of the 64 Kbyte data
address space excluding the Y address block (for data
reads only). In other words, all other instructions
regard the entire data memory as one composite
address space. The MAC class instructions extract the
Y address space from data space and address it using
EAs sourced from W10 and W11. The remaining X
data space is addressed using W8 and W9. Both
address spaces are concurrently accessed only with
the MAC class instructions.
A data space memory map is shown in Figure 3-6.
Figure 3-7 shows a graphical summary of how X and Y
data spaces are accessed for MCU and DSP
instructions.
23 15 0
PSVPAG(1)
15
15
EA<15> =
0
EA<15> = 1
16
Data
Space
EA
Data Space Program Space
8
15 23
0x0000
0x8000
0xFFFF
0x00
0x017FFE
Data Read
Upper Half of Data
Space is Mapped
into Program Space
Note 1: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
0x001200
Address
Concatenation
BSET CORCON,#2 ; PSV bit set
MOV #0x00, W0 ; Set PSVPAG register
MOV W0, PSVPAG
MOV 0x9200, W0 ; Access program memory location
; using a data space access
0x000100
dsPIC30F5015/5016
DS70149D-page 30 © 2008 Microchip Technology Inc.
FIGURE 3-6: dsPIC30F5015/5016 DATA SPACE MEMORY MAP
0x0000
0x07FE
0x0BFE
0xFFFE
LSB
Address
16 bits
LSBMSB
MSB
Address
0x0001
0x07FF
0x0BFF
0xFFFF
0x8001 0x8000
Optionally
Mapped
into Program
Memory
0x0FFF 0x0FFE
0x10000x1001
0x0801 0x0800
0x0C01
0x0C00
Near
Data
2 Kbyte
SFR Space
2 Kbyte
SRAM Space
8 Kbyte
Space
Unimplemented (X)
X Data
SFR Space
X Data RAM (X)
Y Data RAM (Y)
0x1FFF 0x1FFE
Unimplemented
Unimplemented
© 2008 Microchip Technology Inc. DS70149D-page 31
dsPIC30F5015/5016
FIGURE 3-7: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE
SFR SPACE
(Y SPACE)
X SPACE
SFR SPACE
UNUSED
X SPACE
X SPACE
Y SPACE
UNUSED
UNUSED
Non-MAC Class Ops (Read/Write) MAC Class Ops Read-Only
Indirect EA using any W Indirect EA using W10, W11 Indirect EA using W8, W9
MAC Class Ops (Write)
dsPIC30F5015/5016
DS70149D-page 32 © 2008 Microchip Technology Inc.
3.2.2 DATA SPACES
The X data space is used by all instructions and
supports all addressing modes. There are separate
read and write data buses. The X read data bus is the
return data path for all instructions that view data space
as combined X and Y address space. It is also the X
address space data path for the dual operand read
instructions (MAC class). The X write data bus is the
only write path to data space for all instructions.
The X data space also supports Modulo Addressing for
all instructions, subject to addressing mode
restrictions. Bit-Reversed Addressing is only supported
for writes to X data space.
The Y data space is used in concert with the X data
space by the MAC class of instructions (CLR, ED, EDAC,
MAC, MOVSAC, MPY, MPY.N and MSC) to provide two
concurrent data read paths. No writes occur across the
Y bus. This class of instructions dedicates two W
register pointers, W10 and W11, to always address Y
data space, independent of X data space, whereas W8
and W9 always address X data space. Note that during
accumulator write back, the data address space is
considered a combination of X and Y data spaces, so
the write occurs across the X bus. Consequently, the
write can be to any address in the entire data space.
The Y data space can only be used for the data
prefetch operation associated with the MAC class of
instructions. It also supports Modulo Addressing for
automated circular buffers. Of course, all other instruc-
tions can access the Y data address space through the
X data path, as part of the composite linear space.
The boundary between the X and Y data spaces is
defined as shown in Figure 3-6 and is not user
programmable. Should an EA point to data outside its
own assigned address space, or to a location outside
physical memory, an all-zero word/byte will be
returned. For example, although Y address space is
visible by all non-MAC instructions using any address-
ing mode, an attempt by a MAC instruction to fetch data
from that space, using W8 or W9 (X space pointers),
will return 0x0000.
All effective addresses are 16 bits wide and point to
bytes within the data space. Therefore, the data space
address range is 64 Kbytes or 32K words.
3.2.3 DATA SPACE WIDTH
The core data width is 16 bits. All internal registers are
organized as 16-bit wide words. Data space memory is
organized in byte addressable, 16-bit wide blocks.
3.2.4 DATA ALIGNMENT
To help maintain backward compatibility with
PIC®MCU devices and improve data space memory
usage efficiency, the dsPIC30F instruction set supports
both word and byte operations. Data is aligned in data
memory and registers as words, but all data space EAs
resolve to bytes. Data byte reads will read the complete
word, which contains the byte, using the LSb of any EA
to determine which byte to select. The selected byte is
placed onto the LSB of the X data path (no byte
accesses are possible from the Y data path as the MAC
class of instruction can only fetch words). That is, data
memory and registers are organized as two parallel
byte wide entities with shared (word) address decode,
but separate write lines. Data byte writes only write to
the corresponding side of the array or register which
matches the byte address.
As a consequence of this byte accessibility, all effective
address calculations (including those generated by the
DSP operations, which are restricted to word-sized
data) are internally scaled to step through word-aligned
memory. For example, the core would recognize that
Post-Modified Register Indirect Addressing mode,
[Ws++], will result in a value of Ws + 1 for byte
operations and Ws + 2 for word operations.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, so
care must be taken when mixing byte and word
operations, or translating from 8-bit MCU code. Should
a misaligned read or write be attempted, an address
error trap will be generated. If the error occurred on a
read, the instruction underway is completed, whereas if
it occurred on a write, the instruction will be executed
but the write will not occur. In either case, a trap will
then be executed, allowing the system and/or user to
examine the machine state prior to execution of the
address fault.
FIGURE 3-8: DATA ALIGNMENT
TABLE 3-2: EFFECT OF INVALID
MEMORY ACCESSES
Attempted Operation Data Returned
EA = an unimplemented address 0x0000
W8 or W9 used to access Y data
space in a MAC instruction
0x0000
W10 or W11 used to access X
data space in a MAC instruction
0x0000
15 8 7 0
0001
0003
0005
0000
0002
0004
Byte 1 Byte 0
Byte 3 Byte 2
Byte 5 Byte 4
LSBMSB
© 2008 Microchip Technology Inc. DS70149D-page 33
dsPIC30F5015/5016
All byte loads into any W register are loaded into the
LSB. The MSB is not modified.
A sign-extend (SE) instruction is provided to allow
users to translate 8-bit signed data to 16-bit signed
values. Alternatively, for 16-bit unsigned data, users
can clear the MSB of any W register by executing a
zero-extend (ZE) instruction on the appropriate
address.
Although most instructions are capable of operating on
word or byte data sizes, it should be noted that some
instructions, including the DSP instructions, operate
only on words.
3.2.5 NEAR DATA SPACE
An 8 Kbyte ‘near data space is reserved in X address
memory space between 0x0000 and 0x1FFF, which is
directly addressable via a 13-bit absolute address field
within all memory direct instructions. The remaining X
address space and all of the Y address space is
addressable indirectly. Additionally, the whole of X data
space is addressable using MOV instructions, which
support memory direct addressing with a 16-bit
address field.
3.2.6 SOFTWARE STACK
The dsPIC DSC device contains a software stack. W15
is used as the Stack Pointer.
The Stack Pointer always points to the first available
free word and grows from lower addresses towards
higher addresses. It pre-decrements for stack pops and
post-increments for stack pushes, as shown in
Figure 3-9. Note that for a PC push during any CALL
instruction, the MSB of the PC is zero-extended before
the push, ensuring that the MSB is always clear.
There is a Stack Pointer Limit register (SPLIM) associ-
ated with the Stack Pointer. SPLIM is uninitialized at
Reset. As is the case for the Stack Pointer, SPLIM<0>
is forced to ‘0’, because all stack operations must be
word-aligned. Whenever an Effective Address (EA) is
generated using W15 as a source or destination
pointer, the address thus generated is compared with
the value in SPLIM. If the contents of the Stack Pointer
(W15) and the SPLIM register are equal and a push
operation is performed, a stack error trap will not occur.
The stack error trap will occur on a subsequent push
operation. Thus, for example, if it is desirable to cause
a stack error trap when the stack grows beyond
address 0x2000 in RAM, initialize the SPLIM with the
value, 0x1FFE.
Similarly, a Stack Pointer underflow (stack error) trap is
generated when the Stack Pointer address is found to
be less than 0x0800, thus preventing the stack from
interfering with the Special Function Register (SFR)
space.
A write to the SPLIM register should not be immediately
followed by an indirect read operation using W15.
FIGURE 3-9: CALL STACK FRAME
Note: A PC push during exception processing
will concatenate the SRL register to the
MSB of the PC prior to the push.
<Free Word>
PC<15:0>
000000000
015
W15 (before CALL)
W15 (after CALL)
Stack Grows Towards
Higher Address
PUSH: [W15++]
POP: [--W15]
0x0000
PC<22:16>
dsPIC30F5015/5016
DS70149D-page 34 © 2008 Microchip Technology Inc.
TABLE 3-3: CORE REGISTER MAP(1)
SFR Name Address
(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
W0 0000 W0/WREG 0000 0000 0000 0000
W1 0002 W1 0000 0000 0000 0000
W2 0004 W2 0000 0000 0000 0000
W3 0006 W3 0000 0000 0000 0000
W4 0008 W4 0000 0000 0000 0000
W5 000A W5 0000 0000 0000 0000
W6 000C W6 0000 0000 0000 0000
W7 000E W7 0000 0000 0000 0000
W8 0010 W8 0000 0000 0000 0000
W9 0012 W9 0000 0000 0000 0000
W10 0014 W10 0000 0000 0000 0000
W11 0016 W11 0000 0000 0000 0000
W12 0018 W12 0000 0000 0000 0000
W13 001A W13 0000 0000 0000 0000
W14 001C W14 0000 0000 0000 0000
W15 001E W15 0000 1000 0000 0000
SPLIM 0020 SPLIM 0000 0000 0000 0000
ACCAL 0022 ACCAL 0000 0000 0000 0000
ACCAH 0024 ACCAH 0000 0000 0000 0000
ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000
ACCBL 0028 ACCBL 0000 0000 0000 0000
ACCBH 002A ACCBH 0000 0000 0000 0000
ACCBU 002C Sign-Extension (ACCB<39>) ACCBU 0000 0000 0000 0000
PCL 002E PCL 0000 0000 0000 0000
PCH 0030 —PCH
0000 0000 0000 0000
TBLPAG 0032 —TBLPAG
0000 0000 0000 0000
PSVPAG 0034 PSVPAG 0000 0000 0000 0000
RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu
DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu
DOSTARTL 003A DOSTARTL 0uuuu uuuu uuuu uuu0
DOSTARTH 003C —DOSTARTH
0000 0000 0uuu uuuu
DOENDL 003E DOENDL 0uuuu uuuu uuuu uuu0
DOENDH 0040 DOENDH 0000 0000 0uuu uuuu
SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000
CORCON 0044 US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 35
dsPIC30F5015/5016
MODCON 0046 XMODEN YMODEN BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000
XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0
XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1
YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0
YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1
XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu
DISICNT 0052 DISICNT<13:0> 0000 0000 0000 0000
TABLE 3-3: CORE REGISTER MAP(1) (CONTINUED)
SFR Name Address
(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 36 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 37
dsPIC30F5015/5016
4.0 ADDRESS GENERATOR UNITS
The dsPIC DSC core contains two independent
Address Generator Units (AGU): the X AGU and Y
AGU. The Y AGU supports word-sized data reads for
the DSP MAC class of instructions only. The dsPIC DSC
AGUs support three types of data addressing:
Linear Addressing
Modulo (Circular) Addressing
Bit-Reversed Addressing
Linear and Modulo Data Addressing modes can be
applied to data space or program space. Bit-Reversed
Addressing is only applicable to data space addresses.
4.1 Instruction Addressing Modes
The addressing modes in Table 4-1 form the basis of
the addressing modes optimized to support the specific
features of individual instructions. The addressing
modes provided in the MAC class of instructions are
somewhat different from those in the other instruction
types.
4.1.1 FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address field
(f) to directly address data present in the first 8192 bytes
of data memory (near data space). Most file register
instructions employ a working register W0, which is
denoted as WREG in these instructions. The destination
is typically either the same file register, or WREG (with
the exception of the MUL instruction), which writes the
result to a register or register pair. The MOV instruction
allows additional flexibility and can access the entire
data space during file register operation.
4.1.2 MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where Operand 1 is always a working register (i.e., the
addressing mode can only be Register Direct), which is
referred to as Wb. Operand 2 can be a W register,
fetched from data memory, or a 5-bit literal. The result
location can be either a W register or an address
location. The following addressing modes are
supported by MCU instructions:
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
5-bit or 10-bit Literal
TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Addressing Mode Description
File Register Direct The address of the file register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn forms the EA.
Register Indirect Post-Modified The contents of Wn forms the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.
dsPIC30F5015/5016
DS70149D-page 38 © 2008 Microchip Technology Inc.
4.1.3 MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP Accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing modes supported by most MCU
instructions, Move and Accumulator instructions also
support Register Indirect with Register Offset
Addressing mode, also referred to as Register Indexed
mode.
In summary, the following addressing modes are
supported by Move and Accumulator instructions:
Register Direct
Register Indirect
Register Indirect Post-Modified
Register Indirect Pre-Modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
4.1.4 MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through Register Indirect
tables.
The two source operand prefetch registers must be a
member of the set {W8, W9, W10, W11}. For data
reads, W8 and W9 will always be directed to the X
RAGU and W10 and W11 will always be directed to the
Y AGU. The effective addresses generated (before and
after modification) must, therefore, be valid addresses
within X data space for W8 and W9 and Y data space
for W10 and W11.
In summary, the following addressing modes are
supported by the MAC class of instructions:
Register Indirect
Register Indirect Post-Modified by 2
Register Indirect Post-Modified by 4
Register Indirect Post-Modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5 OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2 Modulo Addressing
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can be
supported in each of the X (which also provides the
pointers into program space) and Y data spaces. Modulo
Addressing can operate on any W register pointer. How-
ever, it is not advisable to use W14 or W15 for Modulo
Addressing, since these two registers are used as the
Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain restrictions on the buffer start address (for incre-
menting buffers) or end address (for decrementing buf-
fers) based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers which have a power-of-2 length. As these
buffers satisfy the start and end address criteria, they
may operate in a Bidirectional mode, (i.e., address
boundary checks will be performed on both the lower
and upper address boundaries).
Note: For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA.
However, the 4-bit Wb (Register Offset)
field is shared between both source and
destination (but typically only used by
one).
Note: Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Note: Register Indirect with Register Offset
Addressing is only available for W9 (in X
space) and W11 (in Y space).
© 2008 Microchip Technology Inc. DS70149D-page 39
dsPIC30F5015/5016
4.2.1 START AND END ADDRESS
The Modulo Addressing scheme requires that a
starting and an ending address be specified and
loaded into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
The length of a circular buffer is not directly specified. It
is determined by the difference between the
corresponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
4.2.2 W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags, as
well as a W register field to specify the W Address
registers. The XWM and YWM fields select which
registers will operate with Modulo Addressing.
If XWM = 15, X RAGU and X WAGU Modulo
Addressing are disabled. Similarly, if YWM = 15, Y
AGU Modulo Addressing is disabled.
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than 15 and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than 15
and the YMODEN bit is set at MODCON<14>.
FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE
Note: Y-space Modulo Addressing EA
calculations assume word-sized data (LSb
of every EA is always clear).
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
Byte
Address MOV #0x1100,W0
MOV W0, XMODSRT ;set modulo start address
MOV #0x1163,W0
MOV W0,MODEND ;set modulo end address
MOV #0x8001,W0
MOV W0,MODCON ;enable W1, X AGU for modulo
MOV #0x0000,W0 ;W0 holds buffer fill value
MOV #0x1110,W1 ;point W1 to buffer
DO AGAIN,#0x31 ;fill the 50 buffer locations
MOV W0, [W1++] ;fill the next location
AGAIN: INC W0,W0 ;increment the fill value
dsPIC30F5015/5016
DS70149D-page 40 © 2008 Microchip Technology Inc.
4.2.3 MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W register.
It is important to realize that the address boundaries
check for addresses less than or greater than the upper
(for incrementing buffers) and lower (for decrementing
buffers) boundary addresses (not just equal to). Address
changes may, therefore, jump beyond boundaries and
still be adjusted correctly.
4.3 Bit-Reversed Addressing
Bit-Reversed Addressing is intended to simplify data
reordering for radix-2 FFT algorithms. It is supported by
the X AGU for data writes only.
The modifier, which may be a constant value or register
contents, is regarded as having its bit order reversed.
The address source and destination are kept in normal
order. Thus, the only operand requiring reversal is the
modifier.
4.3.1 BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing is enabled when:
1. BWM (W register selection) in the MODCON
register is any value other than 15 (the stack can
not be accessed using Bit-Reversed Addressing)
and
2. the BREN bit is set in the XBREV register and
3. the addressing mode used is Register Indirect
with Pre-Increment or Post-Increment.
If the length of a Bit-Reversed buffer is M = 2N bytes,
then the last ‘N’ bits of the data buffer start address
must be zeros.
XB<14:0> is the Bit-Reversed Address modifier or
‘pivot point’ which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
When enabled, Bit-Reversed Addressing will only be
executed for Register Indirect with Pre-Increment or
Post-Increment Addressing and word-sized data writes.
It will not function for any other addressing mode or for
byte-sized data, and normal addresses will be generated
instead. When Bit-Reversed Addressing is active, the W
address pointer will always be added to the address
modifier (XB) and the offset associated with the Register
Indirect Addressing mode will be ignored. In addition, as
word-sized data is a requirement, the LSb of the EA is
ignored (and always clear).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, then a write to
the XBREV register should not be immediately followed
by an indirect read operation using the W register that
has been designated as the Bit-Reversed Pointer.
FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE
Note: The modulo corrected Effective Address is
written back to the register only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7 + W2])
is used, modulo address correction is per-
formed, but the contents of the register
remains unchanged.
Note: All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note: Modulo Addressing and Bit-Reversed
Addressing should not be enabled
together. In the event that the user
attempts to do this, Bit-Reversed Address-
ing will assume priority when active for the
X WAGU, and X WAGU Modulo Address-
ing will be disabled. However, Modulo
Addressing will continue to function in the
X RAGU.
b3 b2 b1 0
b2 b3 b4 0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16-word Bit-Reversed Buffer
b7 b6 b5 b1
b7 b6 b5 b4b11 b10 b9 b8
b11 b10 b9 b8
b15 b14 b13 b12
b15 b14 b13 b12
Sequential Address
Pivot Point
© 2008 Microchip Technology Inc. DS70149D-page 41
dsPIC30F5015/5016
TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)
TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER
Normal Address Bit-Reversed Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0000 00000 0
0001 11000 8
0010 20100 4
0011 31100 12
0100 40010 2
0101 51010 10
0110 60110 6
0111 71110 14
1000 80001 1
1001 91001 9
1010 10 0101 5
1011 11 1101 13
1100 12 0011 3
1101 13 1011 11
1110 14 0111 7
1111 15 1111 15
Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value
4096 0x0800
2048 0x0400
1024 0x0200
512 0x0100
256 0x0080
128 0x0040
64 0x0020
32 0x0010
16 0x0008
8 0x0004
4 0x0002
2 0x0001
dsPIC30F5015/5016
DS70149D-page 42 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 43
dsPIC30F5015/5016
5.0 INTERRUPTS
The dsPIC30F5015/5016 has 36 interrupt sources and
4 processor exceptions (traps), which must be
arbitrated based on a priority scheme.
The CPU is responsible for reading the Interrupt
Vector Table (IVT) and transferring the address
contained in the interrupt vector to the program
counter. The interrupt vector is transferred from the
program data bus into the program counter, via a
24-bit wide multiplexer on the input of the program
counter.
The Interrupt Vector Table (IVT) and Alternate
Interrupt Vector Table (AIVT) are placed near the
beginning of program memory (0x000004). The IVT
and AIVT are shown in Figure 5-1.
The interrupt controller is responsible for
pre-processing the interrupts and processor
exceptions, prior to their being presented to the
processor core. The peripheral interrupts and traps are
enabled, prioritized and controlled using centralized
Special Function Registers:
IFS0<15:0>, IFS1<15:0>, IFS2<15:0>
All Interrupt Request Flags are maintained in
these three registers. The flags are set by their
respective peripherals or external signals, and
they are cleared via software.
IEC0<15:0>, IEC1<15:0>, IEC2<15:0>
All Interrupt Enable Control bits are maintained in
these three registers. These control bits are used
to individually enable interrupts from the
peripherals or external signals.
IPC0<15:0>... IPC11<7:0>
The user assignable priority level associated with
each of these 44 interrupts is held centrally in
these twelve registers.
•IPL<3:0>
The current CPU priority level is explicitly stored
in the IPL bits. IPL<3> is present in the CORCON
register, whereas IPL<2:0> are present in the
STATUS register (SR) in the processor core.
INTCON1<15:0>, INTCON2<15:0>
Global interrupt control functions are derived from
these two registers. INTCON1 contains the
control and status flags for the processor
exceptions. The INTCON2 register controls the
external interrupt request signal behavior and the
use of the alternate vector table.
All interrupt sources can be user assigned to one of
seven priority levels, 1 through 7, via the IPCx
registers. Each interrupt source is associated with an
interrupt vector, as shown in Table 5-1. Levels 7 and 1
represent the highest and lowest maskable priorities,
respectively.
If the NSTDIS bit (INTCON1<15>) is set, nesting of
interrupts is prevented. Thus, if an interrupt is currently
being serviced, processing of a new interrupt is
prevented, even if the new interrupt is of higher priority
than the one currently being serviced.
Certain interrupts have specialized control bits for
features like edge or level triggered interrupts,
interrupt-on-change, etc. Control of these features
remains within the peripheral module which generates
the interrupt.
The DISI instruction can be used to disable the
processing of interrupts of priorities 6 and lower for a
certain number of instructions, during which the DISI bit
(INTCON2<14>) remains set.
When an interrupt is serviced, the PC is loaded with the
address stored in the vector location in program
memory that corresponds to the interrupt. There are 63
different vectors within the IVT (refer to Figure 5-2).
These vectors are contained in locations 0x000004
through 0x0000FE of program memory (refer to
Figure 5-2). These locations contain 24-bit addresses,
and in order to preserve robustness, an address error
trap will take place should the PC attempt to fetch any
of these words during normal execution. This prevents
execution of random data as a result of accidentally
decrementing a PC into vector space, accidentally
mapping a data space address into vector space or the
PC rolling over to 0x000000 after reaching the end of
implemented program memory space. Execution of a
GOTO instruction to this vector space will also generate
an address error trap.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Interrupt flag bits get set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit. User
software should ensure the appropriate
interrupt flag bits are clear prior to
enabling an interrupt.
Note: Assigning a priority level of 0 to an
interrupt source is equivalent to disabling
that interrupt.
Note: The IPL bits become read-only whenever
the NSTDIS bit has been set to ‘1’.
dsPIC30F5015/5016
DS70149D-page 44 © 2008 Microchip Technology Inc.
5.1 Interrupt Priority
The user-assignable Interrupt Priority (IP<2:0>) bits for
each individual interrupt source are located in the Least
Significant 3 bits of each nibble within the IPCx
register(s). Bit 3 of each nibble is not used and is read
as a ‘0’. These bits define the priority level assigned to
a particular interrupt by the user.
Since more than one interrupt request source may be
assigned to a specific user-assigned priority level, a
means is provided to assign priority within a given level.
This method is called “Natural Order Priority”.
Natural Order Priority is determined by the position of
an interrupt in the vector table, and only affects
interrupt operation when multiple interrupts with the
same user-assigned priority become pending at the
same time.
Table 5-1 lists the interrupt numbers and interrupt
sources for the dsPIC DSC devices and their
associated vector numbers.
The ability for the user to assign every interrupt to one
of seven priority levels means that the user can assign
a very high overall priority level to an interrupt with a
low natural order priority.
TABLE 5-1: INTERRUPT VECTOR TABLE
Note: The user-assignable priority levels start at
0, as the lowest priority and level 7, as the
highest priority.
Note 1: The Natural Order Priority scheme has 0
as the highest priority and 53 as the
lowest priority.
2: The Natural Order Priority number is the
same as the INT number.
Interrupt
Number
Vector
Number Interrupt Source
Highest Natural Order Priority
0 8 INT0 – External Interrupt 0
1 9 IC1 – Input Capture 1
2 10 OC1 – Output Compare 1
3 11 T1 – Timer1
4 12 IC2 – Input Capture 2
5 13 OC2 – Output Compare 2
6 14 T2 – Timer2
7 15 T3 – Timer3
816SPI1
9 17 U1RX – UART1 Receiver
10 18 U1TX – UART1 Transmitter
11 19 ADC – ADC Convert Done
12 20 NVM – NVM Write Complete
13 21 SI2C – I2C™ Slave Interrupt
14 22 MI2C – I2C Master Interrupt
15 23 Input Change Interrupt
16 24 INT1 – External Interrupt 1
17 25 Reserved
18 26 Reserved
19 27 OC3 – Output Compare 3
20 28 OC4 – Output Compare 4
21 29 T4 – Timer4
22 30 T5 – Timer5
23 31 INT2 – External Interrupt 2
24 32 Reserved
25 33 Reserved
26 34 SPI2
27 35 C1 – Combined IRQ for CAN1
28 36 IC3 – Input Capture 3
29 37 IC4 – Input Capture 4
30 38 Reserved
31 39 Reserved
32 40 Reserved
33 41 Reserved
34 42 Reserved
35 43 Reserved
36 44 INT3 – External Interrupt 3
37 45 INT4 – External Interrupt 4
38 46 Reserved
39 47 PWM – PWM Period Match
40 48 QEI – QEI Interrupt
41 49 Reserved
42 50 Reserved
43 51 FLTA – PWM Fault A
44 52 FLTB – PWM Fault B
45-53 53-61 Reserved
Lowest Natural Order Priority
© 2008 Microchip Technology Inc. DS70149D-page 45
dsPIC30F5015/5016
5.2 Reset Sequence
A Reset is not a true exception because the interrupt
controller is not involved in the Reset process. The
processor initializes its registers in response to a Reset
which forces the PC to zero. The processor then begins
program execution at location 0x000000. A GOTO
instruction is stored in the first program memory
location, immediately followed by the address target for
the GOTO instruction. The processor executes the GOTO
to the specified address and then begins operation at
the specified target (start) address.
5.2.1 RESET SOURCES
There are 6 sources of error which will cause a device
Reset.
Watchdog Time-out:
The Watchdog has timed out, indicating that the
processor is no longer executing the correct flow
of code.
Uninitialized W Register Trap:
An attempt to use an uninitialized W register as
an Address Pointer will cause a Reset.
Illegal Instruction Trap:
Attempted execution of any unused opcodes will
result in an illegal instruction trap. Note that a
fetch of an illegal instruction does not result in an
illegal instruction trap if that instruction is flushed
prior to execution due to a flow change.
Brown-out Reset (BOR):
A momentary dip in the power supply to the
device has been detected which may result in
malfunction.
Trap Lockout:
Occurrence of multiple trap conditions
simultaneously will cause a Reset.
5.3 Traps
Traps can be considered as non-maskable interrupts
indicating a software or hardware error, which adhere
to a predefined priority, as shown in Figure 5-1. They
are intended to provide the user a means to correct
erroneous operation during debug and when operating
within the application.
Note that many of these trap conditions can only be
detected when they occur. Consequently, the
questionable instruction is allowed to complete prior to
trap exception processing. If the user chooses to
recover from the error, the result of the erroneous
action that caused the trap may have to be corrected.
There are 8 fixed priority levels for traps: Level 8
through Level 15, which means that IPL3 is always set
during processing of a trap.
If the user is not currently executing a trap, and sets
the IPL<3:0> bits to a value of ‘0111’ (Level 7), then all
interrupts are disabled, but traps can still be processed.
5.3.1 TRAP SOURCES
The following traps are provided with increasing
priority. However, since all traps can be nested, priority
has little effect.
Math Error Trap:
The math error trap executes under the following four
circumstances:
Should an attempt be made to divide by zero, the
divide operation will be aborted on a cycle
boundary and the trap taken.
If enabled, a math error trap will be taken when an
arithmetic operation on either Accumulator A or B
causes an overflow from bit 31 and the
Accumulator Guard bits are not utilized.
If enabled, a math error trap will be taken when an
arithmetic operation on either Accumulator A or B
causes a catastrophic overflow from bit 39 and all
saturation is disabled.
If the shift amount specified in a shift instruction is
greater than the maximum allowed shift amount, a
trap will occur.
Note: If the user does not intend to take correc-
tive action in the event of a trap error
condition, these vectors must be loaded
with the address of a default handler that
simply contains the RESET instruction. If,
on the other hand, one of the vectors
containing an invalid address is called, an
address error trap is generated.
dsPIC30F5015/5016
DS70149D-page 46 © 2008 Microchip Technology Inc.
Address Error Trap:
This trap is initiated when any of the following
circumstances occurs:
A misaligned data word access is attempted.
A data fetch from unimplemented data memory
location is attempted.
A data access of an unimplemented program
memory location is attempted.
An instruction fetch from vector space is
attempted.
Execution of a “BRA #literal” instruction or a
GOTO #literal” instruction, where literal is
an unimplemented program memory address.
Executing instructions after modifying the PC to
point to unimplemented program memory
addresses. The PC may be modified by loading a
value into the stack and executing a RETURN
instruction.
Stack Error Trap:
This trap is initiated under the following conditions:
The Stack Pointer is loaded with a value which is
greater than the (user-programmable) limit value
written into the SPLIM register (stack overflow).
The Stack Pointer is loaded with a value which is
less than 0x0800 (simple stack underflow).
Oscillator Fail Trap:
This trap is initiated if the external oscillator fails and
operation becomes reliant on an internal RC backup.
5.3.2 HARD AND SOFT TRAPS
It is possible that multiple traps can become active
within the same cycle (e.g., a misaligned word stack
write to an overflowed address). In such a case, the
fixed priority shown in Figure 5-2 is implemented,
which may require the user to check if other traps are
pending in order to completely correct the Fault.
‘Soft’ traps include exceptions of priority level 8 through
level 11, inclusive. The arithmetic error trap (level 11)
falls into this category of traps.
‘Hard’ traps include exceptions of priority level 12
through level 15, inclusive. The address error (level
12), stack error (level 13) and oscillator error (level 14)
traps fall into this category.
Each hard trap that occurs must be Acknowledged
before code execution of any type may continue. If a
lower priority hard trap occurs while a higher priority
trap is pending, acknowledged, or is being processed,
a hard trap conflict will occur.
The device is automatically reset in a hard trap conflict
condition. The TRAPR Status bit (RCON<15>) is set
when the Reset occurs, so that the condition may be
detected in software.
FIGURE 5-1: TRAP VECTORS
Note: In the MAC class of instructions, wherein
the data space is split into X and Y data
space, unimplemented X space includes
all of Y space, and unimplemented Y
space includes all of X space.
Address Error Trap Vector
Oscillator Fail Trap Vector
Stack Error Trap Vector
Reserved Vector
Math Error Trap Vector
Reserved
Oscillator Fail Trap Vector
Address Error Trap Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
Math Error Trap Vector
Decreasing
Priority
0x000000
0x000014
Reserved
Stack Error Trap Vector
Reserved Vector
Reserved Vector
Interrupt 0 Vector
Interrupt 1 Vector
Interrupt 52 Vector
Interrupt 53 Vector
IVT
AIVT
0x000080
0x00007E
0x0000FE
Reserved
0x000094
Reset - GOTO Instruction
Reset - GOTO Address 0x000002
Reserved 0x000082
0x000084
0x000004
Reserved Vector
© 2008 Microchip Technology Inc. DS70149D-page 47
dsPIC30F5015/5016
5.4 Interrupt Sequence
All interrupt event flags are sampled in the beginning of
each instruction cycle by the IFSx registers. A pending
Interrupt Request (IRQ) is indicated by the flag bit
being equal to a ‘1’ in an IFSx register. The IRQ will
cause an interrupt to occur if the corresponding bit in
the Interrupt Enable (IECx) register is set. For the
remainder of the instruction cycle, the priorities of all
pending interrupt requests are evaluated.
If there is a pending IRQ with a priority level greater
than the current processor priority level in the IPL bits,
the processor will be interrupted.
The processor then stacks the current program counter
and the low byte of the processor STATUS register
(SRL), as shown in Figure 5-2. The low byte of the
STATUS register contains the processor priority level at
the time prior to the beginning of the interrupt cycle.
The processor then loads the priority level for this
interrupt into the STATUS register. This action will
disable all lower priority interrupts until the completion
of the Interrupt Service Routine.
FIGURE 5-2: INTERRUPT STACK
FRAME
The RETFIE (Return from Interrupt) instruction will
unstack the program counter and STATUS registers to
return the processor to its state prior to the interrupt
sequence.
5.5 Alternate Vector Table
In program memory, the Interrupt Vector Table (IVT) is
followed by the Alternate Interrupt Vector Table (AIVT),
as shown in Figure 5-1. Access to the Alternate Vector
Table is provided by the ALTIVT bit in the INTCON2
register. If the ALTIVT bit is set, all interrupt and
exception processes will use the alternate vectors
instead of the default vectors. The alternate vectors are
organized in the same manner as the default vectors.
The AIVT supports emulation and debugging efforts by
providing a means to switch between an application
and a support environment, without requiring the
interrupt vectors to be reprogrammed. This feature also
enables switching between applications for evaluation
of different software algorithms at run time.
If the AIVT is not required, the program memory
allocated to the AIVT may be used for other purposes.
AIVT is not a protected section and may be freely
programmed by the user.
5.6 Fast Context Saving
A context saving option is available using shadow
registers. Shadow registers are provided for the DC, N,
OV, Z and C bits in SR, and the registers W0 through
W3. The shadows are only one level deep. The shadow
registers are accessible using the PUSH.S and POP.S
instructions only.
When the processor vectors to an interrupt, the
PUSH.S instruction can be used to store the current
value of the aforementioned registers into their
respective shadow registers.
If an ISR of a certain priority uses the PUSH.S and
POP.S instructions for fast context saving, then a
higher priority ISR should not include the same
instructions. Users must save the key registers in
software during a lower priority interrupt if the higher
priority ISR uses fast context saving.
5.7 External Interrupt Requests
The interrupt controller supports five external interrupt
request signals, INT0-INT4. These inputs are edge
sensitive; they require a low-to-high or a high-to-low
transition to generate an interrupt request. The
INTCON2 register has five bits, INT0EP-INT4EP, that
select the polarity of the edge detection circuitry.
5.8 Wake-up from Sleep and Idle
The interrupt controller may be used to wake-up the
processor from either Sleep or Idle mode, if Sleep or
Idle mode is active when the interrupt is generated.
If an enabled interrupt request of sufficient priority is
received by the interrupt controller, then the standard
interrupt request is presented to the processor. At the
same time, the processor will wake-up from Sleep or
Idle and begin execution of the Interrupt Service
Routine (ISR) needed to process the interrupt request.
Note 1: The user can always lower the priority level
by writing a new value into SR. The Interrupt
Service Routine must clear the interrupt flag
bits in the IFSx register before lowering the
processor interrupt priority in order to avoid
recursive interrupts.
2: The IPL3 bit (CORCON<3>) is always clear
when interrupts are being processed. It is
set only during execution of traps.
<Free Word>
015
W15 (before CALL)
W15 (after CALL)
Stack Grows Towards
Higher Address
PUSH : [W15++]
POP : [--W15]
0x0000
PC<15:0>
SRL IPL3 PC<22:16>
dsPIC30F5015/5016
DS70149D-page 48 © 2008 Microchip Technology Inc.
TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F5015(1)
SFR
Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
INTCON1 0080 NSTDIS OVATE OVBTE COVTE MATHERR ADDRERR STKERR OSCFAIL 0000 0000 0000 0000
INTCON2 0082 ALTIVT DISI INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000
IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000
IFS1 0086 IC4IF IC3IF C1IF SPI2IF INT2IF T5IF T4IF OC4IF OC3IF —INT1IF
0000 0000 0000 0000
IFS2 0088 FLTBIF FLTAIF QEIIF PWMIF INT4IF INT3IF 0000 0000 0000 0000
IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000
IEC1 008E IC4IE IC3IE C1IE SPI2IE INT2IE T5IE T4IE OC4IE OC3IE —INT1IE
0000 0000 0000 0000
IEC2 0090 FLTBIE FLTAIE QEIIE PWMIE INT4IE INT3IE 0000 0000 0000 0000
IPC0 0094 T1IP<2:0> —OC1IP<2:0>—IC1IP<2:0> INT0IP<2:0> 0100 0100 0100 0100
IPC1 0096 T31P<2:0> T2IP<2:0> OC2IP<2:0> —IC2IP<2:0>
0100 0100 0100 0100
IPC2 0098 —ADIP<2:0> U1TXIP<2:0> U1RXIP<2:0> SPI1IP<2:0> 0100 0100 0100 0100
IPC3 009A CNIP<2:0> —MI2CIP<2:0> SI2CIP<2:0> —NVMIP<2:0>
0100 0100 0100 0100
IPC4 009C OC3IP<2:0> INT1IP<2:0> 0100 0000 0000 0100
IPC5 009E INT2IP<2:0> T5IP<2:0> T4IP<2:0> —OC4IP<2:0>
0100 0100 0100 0100
IPC6 00A0 C1IP<2:0> SPI2IP<2:0> 0100 0100 0000 0000
IPC7 00A2 —IC4IP<2:0> —IC3IP<2:0>
0000 0000 0100 0100
IPC8 00A4 0000 0000 0000 0000
IPC9 00A6 PWMIP<2:0> —INT41IP<2:0> INT3IP<2:0> 0100 0000 0100 0100
IPC10 00A8 FLTAIP<2:0> —QEIIP<2:0>
0100 0000 0000 0100
IPC11 00AA FLTBIP<2:0> 0000 0000 0000 0100
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 49
dsPIC30F5015/5016
TABLE 5-3: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC30F5016(1)
SFR
Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
INTCON1 0080 NSTDIS OVATE OVBTE COVTE MATHERR ADDRERR STKERR OSCFAIL 0000 0000 0000 0000
INTCON2 0082 ALTIVT INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000
IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000
IFS1 0086 IC4IF IC3IF C1IF SPI2IF INT2IF T5IF T4IF OC4IF OC3IF —INT1IF
0000 0000 0000 0000
IFS2 0088 FLTBIF FLTAIF QEIIF PWMIF INT4IF INT3IF 0000 0000 0000 0000
IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000
IEC1 008E IC4IE IC3IE C1IE SPI2IE INT2IE T5IE T4IE OC4IE OC3IE —INT1IE
0000 0000 0000 0000
IEC2 0090 FLTBIE FLTAIE QEIIE PWMIE INT4IE INT3IE 0000 0000 0000 0000
IPC0 0094 T1IP<2:0> —OC1IP<2:0>—IC1IP<2:0> INT0IP<2:0> 0100 0100 0100 0100
IPC1 0096 T31P<2:0> T2IP<2:0> OC2IP<2:0> —IC2IP<2:0>
0100 0100 0100 0100
IPC2 0098 —ADIP<2:0> U1TXIP<2:0> U1RXIP<2:0> SPI1IP<2:0> 0100 0100 0100 0100
IPC3 009A CNIP<2:0> —MI2CIP<2:0> SI2CIP<2:0> —NVMIP<2:0>
0100 0100 0100 0100
IPC4 009C OC3IP<2:0> INT1IP<2:0> 0100 0000 0000 0100
IPC5 009E INT2IP<2:0> T5IP<2:0> T4IP<2:0> —OC4IP<2:0>
0100 0100 0100 0100
IPC6 00A0 C1IP<2:0> SPI2IP<2:0> 0100 0100 0000 0000
IPC7 00A2 —IC4IP<2:0> —IC3IP<2:0>
0000 0000 0100 0100
IPC8 00A4 0000 0000 0000 0100
IPC9 00A6 PWMIP<2:0> —INT41IP<2:0> INT3IP<2:0> 0100 0000 0100 0100
IPC10 00A8 FLTAIP<2:0> —QEIIP<2:0>
0100 0000 0000 0100
IPC11 00AA FLTBIP<2:0> 0000 0000 0000 0100
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 50 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 51
dsPIC30F5015/5016
6.0 FLASH PROGRAM MEMORY
The dsPIC30F family of devices contains internal
program Flash memory for executing user code. There
are two methods by which the user can program this
memory:
1. In-Circuit Serial Programming™ (ICSP™)
programming capability
2. Run-Time Self-Programming (RTSP)
6.1 In-Circuit Serial Programming
(ICSP)
dsPIC30F devices can be serially programmed while in
the end application circuit. This is simply done with two
lines for Programming Clock and Programming Data
(which are named PGC and PGD respectively), and
three other lines for Power (VDD), Ground (VSS) and
Master Clear (MCLR). This allows customers to
manufacture boards with unprogrammed devices, and
then program the microcontroller just before shipping
the product. This also allows the most recent firmware
or a custom firmware to be programmed.
6.2 Run-Time Self-Programming
(RTSP)
RTSP is accomplished using TBLRD (table read) and
TBLWT (table write) instructions.
With RTSP, the user may erase program memory,
32 instructions (96 bytes) at a time and can write
program memory data, 32 instructions (96 bytes) at a
time.
6.3 Table Instruction Operation Summary
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of program memory.
TBLRDL and TBLWTL can access program memory in
Word or Byte mode.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of program memory. TBLRDH
and TBLWTH can access program memory in Word or
Byte mode.
A 24-bit program memory address is formed using
bits<7:0> of the TBLPAG register and the Effective
Address (EA) from a W register specified in the table
instruction, as shown in Figure 6-1.
FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
0Program Counter
24 bits
NVMADRU Reg
8 bits 16 bits
Program
Using
TBLPAG Reg
8 bits
Working Reg EA
16 bits
Using
Byte
24-bit EA
1/0
0
1/0
Select
Table
Instruction
NVMADR
Addressing
Counter
Using
NVMADR Reg EA
User/Configuration
Space Select
dsPIC30F5015/5016
DS70149D-page 52 © 2008 Microchip Technology Inc.
6.4 RTSP Operation
The dsPIC30F Flash program memory is organized
into rows and panels. Each row consists of 32
instructions, or 96 bytes. Each panel consists of 128
rows, or 4K x 24 instructions. RTSP allows the user to
erase one row (32 instructions) at a time and to
program 32 instructions at one time.
Each panel of program memory contains write latches
that hold 32 instructions of programming data. Prior to
the actual programming operation, the write data must
be loaded into the panel write latches. The data to be
programmed into the panel is loaded in sequential
order into the write latches; instruction 0, instruction 1,
etc. The addresses loaded must always be from an
even group of 32 boundary.
The basic sequence for RTSP programming is to set up
a Table Pointer, then do a series of TBLWT instructions
to load the write latches. Programming is performed by
setting the special bits in the NVMCON register.
32 TBLWTL and 32 TBLWTH instructions are required to
load the 32 instructions.
All of the table write operations are single-word writes
(2 instruction cycles), because only the table latches
are written.
After the latches are written, a programming operation
needs to be initiated to program the data.
The Flash program memory is readable, writable and
erasable during normal operation over the entire VDD
range.
6.5 RTSP Control Registers
The four SFRs used to read and write the program
Flash memory are:
•NVMCON
NVMADR
NVMADRU
NVMKEY
6.5.1 NVMCON REGISTER
The NVMCON register controls which blocks are to be
erased, which memory type is to be programmed and
start of the programming cycle.
6.5.2 NVMADR REGISTER
The NVMADR register is used to hold the lower two
bytes of the Effective Address. The NVMADR register
captures the EA<15:0> of the last table instruction that
has been executed and selects the row to write.
6.5.3 NVMADRU REGISTER
The NVMADRU register is used to hold the upper byte
of the Effective Address. The NVMADRU register
captures the EA<23:16> of the last table instruction
that has been executed.
6.5.4 NVMKEY REGISTER
NVMKEY is a write-only register that is used for write
protection. To start a programming or an erase
sequence, the user must consecutively write 0x55 and
0xAA to the NVMKEY register. Refer to Section 6.6
“Programming Operations” for further details.
Note: The user can also directly write to the
NVMADR and NVMADRU registers to
specify a program memory address for
erasing or programming.
© 2008 Microchip Technology Inc. DS70149D-page 53
dsPIC30F5015/5016
6.6 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. A programming operation is nominally 2 msec in
duration and the processor stalls (waits) until the oper-
ation is finished. Setting the WR bit (NVMCON<15>)
starts the operation, and the WR bit is automatically
cleared when the operation is finished.
6.6.1 PROGRAMMING ALGORITHM FOR
PROGRAM FLASH
The user can erase or program one row of program
Flash memory at a time. The general process is:
1. Read one row of program Flash (32 instruction
words) and store into data RAM as a data
“image”.
2. Update the data image with the desired new
data.
3. Erase program Flash row.
a) Set up NVMCON register for multi-word,
program Flash, erase, and set WREN bit.
b) Write address of row to be erased into
NVMADRU/NVMDR.
c) Write ‘0x55’ to NVMKEY.
d) Write ‘0xAA’ to NVMKEY.
e) Set the WR bit. This will begin erase cycle.
f) CPU will stall for the duration of the erase
cycle.
g) The WR bit is cleared when erase cycle
ends.
4. Write 32 instruction words of data from data
RAM “image” into the program Flash write
latches.
5. Program 32 instruction words into program
Flash.
a) Set up NVMCON register for multi-word,
program Flash, program, and set WREN
bit.
b) Write ‘0x55’ to NVMKEY.
c) Write ‘0xAA’ to NVMKEY.
d) Set the WR bit. This will begin program
cycle.
e) CPU will stall for duration of the program
cycle.
f) The WR bit is cleared by the hardware
when program cycle ends.
6. Repeat steps 1 through 5 as needed to program
desired amount of program Flash memory.
6.6.2 ERASING A ROW OF PROGRAM
MEMORY
Example 6-1 shows a code sequence that can be used
to erase a row (32 instructions) of program memory.
EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY
; Setup NVMCON for erase operation, multi word write
; program memory selected, and writes enabled
MOV #0x4041,W0 ;
MOV W0,NVMCON ; Init NVMCON SFR
; Init pointer to row to be ERASED
MOV #tblpage(PROG_ADDR),W0 ;
MOV W0,NVMADRU ; Initialize PM Page Boundary SFR
MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer
MOV W0, NVMADR ; Intialize NVMADR SFR
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
dsPIC30F5015/5016
DS70149D-page 54 © 2008 Microchip Technology Inc.
6.6.3 LOADING WRITE LATCHES
Example 6-2 shows a sequence of instructions that
can be used to load the 96 bytes of write latches.
32 TBLWTL and 32 TBLWTH instructions are needed to
load the write latches selected by the Table Pointer.
EXAMPLE 6-2: LOADING WRITE LATCHES
6.6.4 INITIATING THE PROGRAMMING
SEQUENCE
For protection, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user must wait for the programming time
until programming is complete. The two instructions
following the start of the programming sequence
should be NOPs.
EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
MOV #0x0000,W0 ;
MOV W0,TBLPAG ; Initialize PM Page Boundary SFR
MOV #0x6000,W0 ; An example program memory address
; Perform the TBLWT instructions to write the latches
; 0th_program_word
MOV #LOW_WORD_0,W2 ;
MOV #HIGH_BYTE_0,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 1st_program_word
MOV #LOW_WORD_1,W2 ;
MOV #HIGH_BYTE_1,W3 ;
TBLWTL W2,[W0] ; Write PM low word into program latch
TBLWTH W3,[W0++] ; Write PM high byte into program latch
; 2nd_program_word
MOV #LOW_WORD_2,W2 ;
MOV #HIGH_BYTE_2,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
; 31st_program_word
MOV #LOW_WORD_31,W2 ;
MOV #HIGH_BYTE_31,W3 ;
TBLWTL W2, [W0] ; Write PM low word into program latch
TBLWTH W3, [W0++] ; Write PM high byte into program latch
Note: In Example 6-2, the contents of the upper byte of W3 has no effect.
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start the erase sequence
NOP ; Insert two NOPs after the erase
NOP ; command is asserted
© 2008 Microchip Technology Inc. DS70149D-page 55
dsPIC30F5015/5016
TABLE 6-1: NVM REGISTER MAP(1)
File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets
NVMCON 0760 WR WREN WRERR TWRI —PROGOP<6:0> 0000 0000 0000 0000
NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu
NVMADRU 0764 NVMADR<23:16> 0000 0000 uuuu uuuu
NVMKEY 0766 —KEY<7:0> 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 56 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 57
dsPIC30F5015/5016
7.0 DATA EEPROM MEMORY
The data EEPROM memory is readable and writable
during normal operation over the entire VDD range. The
data EEPROM memory is directly mapped in the
program memory address space.
The four SFRs used to read and write the program
Flash memory are used to access data EEPROM
memory, as well. As described in Section 4.0
“Address Generator Units”, these registers are:
•NVMCON
NVMADR
NVMADRU
NVMKEY
The EEPROM data memory allows read and write of
single words and 16-word blocks. When interfacing to
data memory, NVMADR, in conjunction with the
NVMADRU register, is used to address the EEPROM
location being accessed. TBLRDL and TBLWTL
instructions are used to read and write data EEPROM.
A word write operation should be preceded by an erase
of the corresponding memory location(s). The write
typically requires 2 ms to complete, but the write time
will vary with voltage and temperature.
A program or erase operation on the data EEPROM
does not stop the instruction flow. The user is respon-
sible for waiting for the appropriate duration of time
before initiating another data EEPROM write/erase
operation. Attempting to read the data EEPROM while
a programming or erase operation is in progress results
in unspecified data.
Control bit WR initiates write operations, similar to pro-
gram Flash writes. This bit cannot be cleared, only set,
in software. This bit is cleared in hardware at the com-
pletion of the write operation. The inability to clear the
WR bit in software prevents the accidental or
premature termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear. The WRERR bit is
set when a write operation is interrupted by a MCLR
Reset, or a WDT Time-out Reset, during normal oper-
ation. In these situations, following Reset, the user can
check the WRERR bit and rewrite the location. The
address register NVMADR remains unchanged.
7.1 Reading the Data EEPROM
A TBLRD instruction reads a word at the current
program word address. This example uses W0 as a
pointer to data EEPROM. The result is placed in
register W4, as shown in Example 7-1.
EXAMPLE 7-1: DATA EEPROM READ
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Interrupt flag bit NVMIF in the IFS0 regis-
ter is set when write is complete. It must be
cleared in software.
MOV #LOW_ADDR_WORD,W0 ; Init Pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1
,
TBLPAG
TBLRDL [ W0 ], W4 ; read data EEPROM
dsPIC30F5015/5016
DS70149D-page 58 © 2008 Microchip Technology Inc.
7.2 Erasing Data EEPROM
7.2.1 ERASING A BLOCK OF DATA
EEPROM
In order to erase a block of data EEPROM, the
NVMADRU and NVMADR registers must initially
point to the block of memory to be erased. Configure
NVMCON for erasing a block of data EEPROM, and
set the ERASE and WREN bits in the NVMCON
register. Setting the WR bit initiates the erase, as
shown in Example 7-2.
EXAMPLE 7-2: DATA EEPROM BLOCK ERASE
7.2.2 ERASING A WORD OF DATA
EEPROM
The NVMADRU and NVMADR registers must point to
the block. Erase a block of data Flash and set the
ERASE and WREN bits in the NVMCON register.
Setting the WR bit initiates the erase, as shown in
Example 7-3.
EXAMPLE 7-3: DATA EEPROM WORD ERASE
; Select data EEPROM block, ERASE, WREN bits
MOV #4045,W0
MOV W0,NVMCON ; Initialize NVMCON SFR
; Start erase cycle by setting WR after writing key sequence
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
; Select data EEPROM word, ERASE, WREN bits
MOV #4044,W0
MOV W0,NVMCON
; Start erase cycle by setting WR after writing key sequence
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0 ;
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1 ;
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate erase sequence
NOP
NOP
; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete
© 2008 Microchip Technology Inc. DS70149D-page 59
dsPIC30F5015/5016
7.3 Writing to the Data EEPROM
To write an EEPROM data location, the following
sequence must be followed:
1. Erase data EEPROM word.
a) Select word, data EEPROM, erase and set
WREN bit in NVMCON register.
b) Write address of word to be erased into
NVMADRU/NVMADR.
c) Enable NVM interrupt (optional).
d) Write ‘0x55’ to NVMKEY.
e) Write ‘0xAA’ to NVMKEY.
f) Set the WR bit. This will begin erase cycle.
g) Either poll NVMIF bit or wait for NVMIF
interrupt.
h) The WR bit is cleared when the erase cycle
ends.
2. Write data word into data EEPROM write
latches.
3. Program 1 data word into data EEPROM.
a) Select word, data EEPROM, program and
set WREN bit in NVMCON register.
b) Enable NVM write done interrupt (optional).
c) Write ‘0x55’ to NVMKEY.
d) Write ‘0xAA’ to NVMKEY.
e) Set the WR bit. This will begin program
cycle.
f) Either poll NVMIF bit or wait for NVM
interrupt.
g) The WR bit is cleared when the write cycle
ends.
The write will not initiate if the above sequence is not
exactly followed (write 0x55 to NVMKEY, write 0xAA to
NVMCON, then set WR bit) for each word. It is strongly
recommended that interrupts be disabled during this
code segment.
Additionally, the WREN bit in NVMCON must be set to
enable writes. This mechanism prevents accidental
writes to data EEPROM, due to unexpected code
execution. The WREN bit should be kept clear at all
times, except when updating the EEPROM. The
WREN bit is not cleared by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect the current write cycle. The WR
bit will be inhibited from being set unless the WREN bit
is set. The WREN bit must be set on a previous
instruction. Both WR and WREN cannot be set with the
same instruction.
At the completion of the write cycle, the WR bit is
cleared in hardware and the Nonvolatile Memory Write
Complete Interrupt Flag bit (NVMIF) is set. The user
may either enable this interrupt, or poll this bit. NVMIF
must be cleared by software.
7.3.1 WRITING A WORD OF DATA
EEPROM
Once the user has erased the word to be programmed,
then a table write instruction is used to write one write
latch, as shown in Example 7-4.
EXAMPLE 7-4: DATA EEPROM WORD WRITE
; Point to data memory
MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #LOW(WORD),W2 ; Get data
TBLWTL W2,[ W0] ; Write data
; The NVMADR captures last table access address
; Select data EEPROM for 1 word op
MOV #0x4004,W0
MOV W0,NVMCON
; Operate key to allow write operation
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Initiate program sequence
NOP
NOP
; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle
; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete
dsPIC30F5015/5016
DS70149D-page 60 © 2008 Microchip Technology Inc.
7.3.2 WRITING A BLOCK OF DATA
EEPROM
To write a block of data EEPROM, write to all sixteen
latches first, then set the NVMCON register and
program the block.
EXAMPLE 7-5: DATA EEPROM BLOCK WRITE
7.4 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the
memory should be verified against the original value.
This should be used in applications where excessive
writes can stress bits near the specification limit.
7.5 Protection Against Spurious Write
There are conditions when the device may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, the WREN bit is cleared;
also, the Power-up Timer prevents EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during brown-out,
power glitch or software malfunction.
MOV #LOW_ADDR_WORD,W0 ; Init pointer
MOV #HIGH_ADDR_WORD,W1
MOV W1,TBLPAG
MOV #data1,W2 ; Get 1st data
TBLWTL W2,[ W0]++ ; write data
MOV #data2,W2 ; Get 2nd data
TBLWTL W2,[ W0]++ ; write data
MOV #data3,W2 ; Get 3rd data
TBLWTL W2,[ W0]++ ; write data
MOV #data4,W2 ; Get 4th data
TBLWTL W2,[ W0]++ ; write data
MOV #data5,W2 ; Get 5th data
TBLWTL W2,[ W0]++ ; write data
MOV #data6,W2 ; Get 6th data
TBLWTL W2,[ W0]++ ; write data
MOV #data7,W2 ; Get 7th data
TBLWTL W2,[ W0]++ ; write data
MOV #data8,W2 ; Get 8th data
TBLWTL W2,[ W0]++ ; write data
MOV #data9,W2 ; Get 9th data
TBLWTL W2,[ W0]++ ; write data
MOV #data10,W2 ; Get 10th data
TBLWTL W2,[ W0]++ ; write data
MOV #data11,W2 ; Get 11th data
TBLWTL W2,[ W0]++ ; write data
MOV #data12,W2 ; Get 12th data
TBLWTL W2,[ W0]++ ; write data
MOV #data13,W2 ; Get 13th data
TBLWTL W2,[ W0]++ ; write data
MOV #data14,W2 ; Get 14th data
TBLWTL W2,[ W0]++ ; write data
MOV #data15,W2 ; Get 15th data
TBLWTL W2,[ W0]++ ; write data
MOV #data16,W2 ; Get 16th data
TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.
MOV #0x400A,W0 ; Select data EEPROM for multi word op
MOV W0,NVMCON ; Operate Key to allow program operation
DISI #5 ; Block all interrupts with priority <7
; for next 5 instructions
MOV #0x55,W0
MOV W0,NVMKEY ; Write the 0x55 key
MOV #0xAA,W1
MOV W1,NVMKEY ; Write the 0xAA key
BSET NVMCON,#WR ; Start write cycle
NOP
NOP
© 2008 Microchip Technology Inc. DS70149D-page 61
dsPIC30F5015/5016
8.0 I/O PORTS
All of the device pins (except VDD, VSS, MCLR and
OSC1/CLKI) are shared between the peripherals and
the parallel I/O ports.
All I/O input ports feature Schmitt Trigger inputs for
improved noise immunity.
8.1 Parallel I/O (PIO) Ports
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as
a general purpose output pin is disabled. The I/O pin
may be read, but the output driver for the parallel port
bit will be disabled. If a peripheral is enabled, but the
peripheral is not actively driving a pin, that pin may be
driven by a port.
All port pins have three registers directly associated
with the operation of the port pin. The data direction
register (TRISx) determines whether the pin is an input
or an output. If the data direction bit is a 1’, then the pin
is an input. All port pins are defined as inputs after a
Reset. Reads from the latch (LATx), read the latch.
Writes to the latch, write the latch (LATx). Reads from
the port (PORTx), read the port pins and writes to the
port pins, write the latch (LATx).
Any bit and its associated data and control registers
that are not valid for a particular device will be
disabled. That means the corresponding LATx and
TRISx registers and the port pin will read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port because
there is no other competing source of outputs. An
example is the INT4 pin.
The format of the registers for PORTA are shown in
Table 8-2.
The TRISA (Data Direction Control) register controls
the direction of the RA<7:0> pins, as well as the INTx
pins and the VREF pins. The LATA register supplies
data to the outputs and is readable/writable. Reading
the PORTA register yields the state of the input pins,
while writing the PORTA register modifies the contents
of the LATA register.
A parallel I/O (PIO) port that shares a pin with a
peripheral is, in general, subservient to the peripheral.
The peripheral’s output buffer data and control signals
are provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pad cell. Figure 8-2 shows how ports are shared
with other peripherals, and the associated I/O cell (pad)
to which they are connected. Table 8-1 and Table 8-2
show the formats of the registers for the shared ports,
PORTB through PORTG.
FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
QD
CK
WR LAT+
TRIS Latch
I/O Pad
WR Port
Data Bus
QD
CK
Data Latch
Read LAT
Read Port
Read TRIS
WR TRIS
I/O Cell
Dedicated Port Module
dsPIC30F5015/5016
DS70149D-page 62 © 2008 Microchip Technology Inc.
FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE
8.2 Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the A/D port pins. The port pins that are
desired as analog inputs must have their
corresponding TRIS bit set (input). If the TRIS bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
When reading the PORT register, all pins configured as
analog input channels will read as cleared (a low level).
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
8.2.1 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically this instruction
would be a NOP.
EXAMPLE 8-1: PORT WRITE/READ
EXAMPLE
QD
CK
WR LAT +
TRIS Latch
I/O Pad
WR Port
Data Bus
QD
CK
Data Latch
Read LAT
Read Port
Read TRIS
1
0
1
0
WR TRIS
Peripheral Output Data
Peripheral Input Data
I/O Cell
Peripheral Module
Peripheral Output Enable
PIO Module
Output Multiplexers
Input Data
Peripheral Module Enable
Output Enable
Output Data
MOV 0xFF00, W0 ; Configure PORTB<15:8>
; as inputs
MOV W0, TRISBB ; and PORTB<7:0> as outputs
NOP ; Delay 1 cycle
BTSS PORTB, #13 ; Next Instruction
© 2008 Microchip Technology Inc. DS70149D-page 63
dsPIC30F5015/5016
TABLE 8-1: dsPIC30F5015 PORT REGISTER MAP(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0 0000 0000 0000 0000
PORTA 02C2 0000 0000 0000 0000
LATA 02C4 0000 0000 0000 0000
TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISC 02CC TRISC15 TRISC14 TRISC13 1110 0000 0000 0000
PORTC 02CE RC15 RC14 RC13 0000 0000 0000 0000
LATC 02D0 LATC15 LATC14 LATC13 0000 0000 0000 0000
TRISD 02D2 ——— TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 0000 1111 1111 1111
PORTD 02D4 ——— RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000
TRISE 02D8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0000 1111 1111
PORTE 02DA RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02EE TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111
PORTF 02E0 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
LATF 02E2 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000
TRISG 02E4 ————— TRISG9 TRISG8 TRISG7 TRISG6 —TRISG3TRISG2 0000 0011 1100 1100
PORTG 02E6 ————— RG9 RG8 RG7 RG6 —RG3RG2 0000 0000 0000 0000
LATG 02E8 ————— LATG9 LATG8 LATG7 LATG6 —LATG3LATG2 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 64 © 2008 Microchip Technology Inc.
TABLE 8-2: dsPIC30F5016 PORT REGISTER MAP(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TRISA 02C0 TRISA15 TRISA14 TRISA10 TRISA9 1100 0110 0000 0000
PORTA 02C2 RA15 RA14 RA10 RA9 0000 0000 0000 0000
LATA 02C4 LATA15 LATA14 LATA10 LATA9 0000 0000 0000 0000
TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000
LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000
TRISC 02CC TRISC15 TRISC14 TRISC13 TRISC3 TRISC1 1110 0000 0000 1010
PORTC 02CE RC15 RC14 RC13 RC3 RC1 0000 0000 0000 0000
LATC 02D0 LATC15 LATC14 LATC13 LATC3 LATC1 0000 0000 0000 0000
TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000
LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000
TRISE 02D8 TRISE9 TRISE8 TRISE7 TRISE6 TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0011 1111 1111
PORTE 02DA RE9 RE8 RE7 RE6 RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000
LATE 02DC LATE9 LATE8 LATE7 LATE6 LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000
TRISF 02EE TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111
PORTF 02E0 RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000
LATF 02E2 LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000
TRISG 02E4 ————— TRISG9 TRISG8 TRISG7 TRISG6 TRISG3 TRISG2 TRISG1 TRISG0 0000 0011 1100 1111
PORTG 02E6 ————— RG9 RG8 RG7 RG6 RG3 RG2 RG1 RG0 0000 0000 0000 0000
LATG 02E8 ————— LATG9 LATG8 LATG7 LATG6 LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 65
dsPIC30F5015/5016
8.3 Input Change Notification Module
The input change notification module provides the
dsPIC30F devices the ability to generate interrupt
requests to the processor in response to a
change-of-state on selected input pins. This module is
capable of detecting input change-of-states, even in
Sleep mode when the clocks are disabled. There are
22 external signals (CN0 through CN21) that may be
selected (enabled) for generating an interrupt request
on a change-of-state.
Please refer to the pin diagrams for CN pin locations.
TABLE 8-3: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8) FOR dsPIC30F5015(1)
TABLE 8-4: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F5015(1)
TABLE 8-5: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 15-8) FOR dsPIC30F5016(1)
TABLE 8-6: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0) FOR dsPIC30F5016(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State
CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000
CNEN2 00C2 0000 0000 0000 0000
CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000
CNPU2 00C6 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SFR
Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000
CNEN2 00C2 ———— CN18IE CN17IE CN16IE 0000 0000 0000 0000
CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000
CNPU2 00C6 ———— CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State
CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000
CNEN2 00C2 0000 0000 0000 0000
CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000
CNPU2 00C6 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SFR
Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000
CNEN2 00C2 CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000
CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000
CNPU2 00C6 CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 66 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 67
dsPIC30F5015/5016
9.0 TIMER1 MODULE
This section describes the 16-bit General Purpose
(GP) Timer1 module and associated operational
modes.
The following sections provide a detailed description,
including setup and control registers along with
associated block diagrams for the operational modes of
the timers.
The Timer1 module is a 16-bit timer which can serve as
the time counter for the real-time clock, or operate as a
free-running interval timer/counter. The 16-bit timer has
the following modes:
16-bit Timer
16-bit Synchronous Counter
16-bit Asynchronous Counter
Further, the following operational characteristics are
supported:
Timer gate operation
Selectable prescaler settings
Timer operation during CPU Idle and Sleep
modes
Interrupt on 16-bit Period register match or falling
edge of external gate signal
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1
presents a block diagram of the 16-bit timer module.
16-bit Timer Mode: In the 16-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the Period register, PR1, then
resets to ‘0’ and continues to count.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the TSIDL (T1CON<13>)
bit = 0. If TSIDL = 1, the timer module logic will resume
the incrementing sequence upon termination of the
CPU Idle mode.
16-bit Synchronous Counter Mode: In the 16-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
When the CPU goes into the Idle mode, the timer will
stop incrementing, unless the respective TSIDL bit = 0.
If TSIDL = 1, the timer module logic will resume the
incrementing sequence upon termination of the CPU
Idle mode.
16-bit Asynchronous Counter Mode: In the 16-bit
Asynchronous Counter mode, the timer increments on
every rising edge of the applied external clock signal.
The timer counts up to a match value preloaded in PR1,
then resets to ‘0’ and continues.
When the timer is configured for the Asynchronous mode
of operation and the CPU goes into the Idle mode, the
timer will stop incrementing if TSIDL = 1.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Timer1 is a Type A timer. Please refer to
the specifications for a Type A timer in
Section 24.0 Electrical Characteristics
of this document.
dsPIC30F5015/5016
DS70149D-page 68 © 2008 Microchip Technology Inc.
FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)
9.1 Timer Gate Operation
The 16-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T1CK pin) is asserted high. Control bit TGATE
(T1CON<6>) must be set to enable this mode. The
timer must be enabled (TON = 1) and the timer clock
source set to internal (TCS = 0).
When the CPU goes into the Idle mode, the timer will
stop incrementing unless TSIDL = 0. If TSIDL = 1, the
timer will resume the incrementing sequence upon
termination of the CPU Idle mode.
9.2 Timer Prescaler
The input clock (FOSC/4 or external clock) to the 16-bit
timer has a prescale option of 1:1, 1:8, 1:64 and 1:256,
selected by control bits, TCKPS<1:0> (T1CON<5:4>).
The prescaler counter is cleared when any of the
following occurs:
a write to the TMR1 register
clearing of the TON bit (T1CON<15>)
device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
timer prescaler cannot be reset since the prescaler
clock is halted.
TMR1 is not cleared when T1CON is written. It is
cleared by writing to the TMR1 register.
9.3 Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will operate if:
The timer module is enabled (TON = 1) and
The timer clock source is selected as external
(TCS = 1) and
The TSYNC bit (T1CON<2>) is asserted to a logic
0’, which defines the external clock source as
asynchronous
When all three conditions are true, the timer will
continue to count up to the Period register and be reset
to 0x0000.
When a match between the timer and the Period
register occurs, an interrupt can be generated, if the
respective timer interrupt enable bit is asserted.
TON
Sync
SOSCI
SOSCO/
PR1
T1IF
Equal
Comparator x 16
TMR1
Reset
LPOSCEN
Event Flag
1
0
TSYNC
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
T
CY
1
0
T1CK
TCS
1
x
0
1
TGATE
0
0
Gate
Sync
© 2008 Microchip Technology Inc. DS70149D-page 69
dsPIC30F5015/5016
9.4 Timer Interrupt
The 16-bit timer has the ability to generate an interrupt
on period match. When the timer count matches the
Period register, the T1IF bit is asserted and an interrupt
will be generated, if enabled. The T1IF bit must be
cleared in software. The Timer Interrupt Flag, T1IF, is
located in the IFS0 Control register in the interrupt
controller.
When the Gated Time Accumulation mode is enabled,
an interrupt will also be generated on the falling edge of
the gate signal (at the end of the accumulation cycle).
Enabling an interrupt is accomplished via the respective
Timer Interrupt Enable bit, T1IE. The Timer Interrupt
Enable bit is located in the IEC0 Control register in the
interrupt controller.
9.5 Real-Time Clock
Timer1, when operating in Real-Time Clock (RTC)
mode, provides time-of-day and event time-stamping
capabilities. Key operational features of the RTC are:
Operation from 32 kHz LP oscillator
8-bit prescaler
Low power
Real-Time Clock Interrupts
These operating modes are determined by setting the
appropriate bit(s) in the T1CON Control register.
FIGURE 9-2: RECOMMENDED
COMPONENTS FOR
TIMER1 LP OSCILLATOR
RTC
9.5.1 RTC OSCILLATOR OPERATION
When the TON = 1, TCS = 1 and TGATE = 0, the timer
increments on the rising edge of the 32 kHz LP
oscillator output signal, up to the value specified in the
Period register, and is then reset to ‘0’.
The TSYNC bit must be asserted to a logic ‘0
(Asynchronous mode) for correct operation.
Enabling LPOSCEN (OSCCON<1>) will disable the
normal Timer and Counter modes and enable a timer
carry-out wake-up event.
When the CPU enters Sleep mode, the RTC will
continue to operate, provided the 32 kHz external
crystal oscillator is active and the control bits have not
been changed. The TSIDL bit should be cleared to ‘0
in order for RTC to continue operation in Idle mode.
9.5.2 RTC INTERRUPTS
When an interrupt event occurs, the respective
interrupt flag, T1IF, is asserted and an interrupt will be
generated, if enabled. The T1IF bit must be cleared in
software. The respective Timer Interrupt Flag, T1IF, is
located in the IFS0 Status register in the interrupt
controller.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T1IE. The Timer
Interrupt Enable bit is located in the IEC0 Control
register in the interrupt controller.
SOSCI
SOSCO
R
C1
C2
dsPIC30FXXXX
32.768 kHz
XTAL
C1 = C2 = 18 pF; R = 100K
dsPIC30F5015/5016
DS70149D-page 70 © 2008 Microchip Technology Inc.
TABLE 9-1: TIMER1 REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu
PR1 0102 Period Register 1 1111 1111 1111 1111
T1CON 0104 TON —TSIDL TGATE TCKPS1 TCKPS0 TSYNC TCS 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 71
dsPIC30F5015/5016
10.0 TIMER2/3 MODULE
This section describes the 32-bit General Purpose
(GP) timer module (Timer2/3) and associated
operational modes. Figure 10-1 depicts the simplified
block diagram of the 32-bit Timer2/3 module.
Figure 10-2 and Figure 10-3 show Timer2/3 configured
as two independent 16-bit timers: Timer2 and Timer3,
respectively.
The Timer2/3 module is a 32-bit timer, which can be
configured as two 16-bit timers, with selectable
operating modes. These timers are utilized by other
peripheral modules such as:
Input Capture
Output Compare/Simple PWM
The following sections provide a detailed description,
including setup and control registers, along with
associated block diagrams for the operational modes of
the timers.
The 32-bit timer has the following modes:
Two independent 16-bit timers (Timer2 and
Timer3) with all 16-bit operating modes (except
Asynchronous Counter mode)
Single 32-bit Timer operation
Single 32-bit Synchronous Counter
Further, the following operational characteristics are
supported:
ADC Event Trigger
Timer Gate Operation
Selectable Prescaler Settings
Timer Operation during Idle and Sleep modes
Interrupt on a 32-bit Period register Match
These operating modes are determined by setting the
appropriate bit(s) in the 16-bit T2CON and T3CON
SFRs.
For 32-bit timer/counter operation, Timer2 is the least
significant word and Timer3 is the most significant word
of the 32-bit timer.
16-bit Mode: In 16-bit mode, Timer2 and Timer3 can be
configured as two independent 16-bit timers. Each timer
can be set up in either 16-bit Timer mode or 16-bit
Synchronous Counter mode. See Section 9.0 “Timer1
Module” for details on these two operating modes.
The only functional difference between Timer2 and
Timer3 is that Timer2 provides synchronization of the
clock prescaler output. This is useful for high-frequency
external clock inputs.
32-bit Timer Mode: In the 32-bit Timer mode, the timer
increments on every instruction cycle up to a match
value, preloaded into the combined 32-bit Period
register, PR3/PR2, then resets to ‘0’ and continues to
count.
For synchronous 32-bit reads of the Timer2/Timer3
pair, reading the least significant word (TMR2 register)
will cause the most significant word to be read and
latched into a 16-bit holding register, termed
TMR3HLD.
For synchronous 32-bit writes, the holding register
(TMR3HLD) must first be written to. When followed by
a write to the TMR2 register, the contents of TMR3HLD
will be transferred and latched into the MSB of the
32-bit timer (TMR3).
32-bit Synchronous Counter Mode: In the 32-bit
Synchronous Counter mode, the timer increments on
the rising edge of the applied external clock signal,
which is synchronized with the internal phase clocks.
The timer counts up to a match value preloaded in the
combined 32-bit Period register, PR3/PR2, then resets
to ‘0’ and continues.
When the timer is configured for the Synchronous
Counter mode of operation and the CPU goes into the
Idle mode, the timer will stop incrementing, unless the
TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer
module logic will resume the incrementing sequence
upon termination of the CPU Idle mode.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Timer2 is a Type B timer and Timer3 is a
Type C timer. Please refer to the
appropriate timer type in Section 24.0
Electrical Characteristics of this
document.
Note: For 32-bit timer operation, T3CON control
bits are ignored. Only T2CON control bits
are used for setup and control. Timer2
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer3 Interrupt Flag
(T3IF) and the interrupt is enabled with the
Timer3 Interrupt Enable bit (T3IE).
dsPIC30F5015/5016
DS70149D-page 72 © 2008 Microchip Technology Inc.
FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM
TMR3 TMR2
T3IF
Equal Comparator x 32
PR3 PR2
Reset
LSB
MSB
Event Flag
Note: Timer Configuration bit T32, (T2CON<3>), must be set to 1’ for a 32-bit timer/counter operation. All control
bits are respective to the T2CON register.
Data Bus<15:0>
TMR3HLD
Read TMR2
Write TMR2 16
16
16
Q
QD
CK
TGATE (T2CON<6>)
(T2CON<6>)
TGATE
0
1
TON
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY
TCS
1 x
0 1
TGATE
0 0
Gate
T2CK
Sync
ADC Event Trigger
Sync
© 2008 Microchip Technology Inc. DS70149D-page 73
dsPIC30F5015/5016
FIGURE 10-2: 16-BIT TIMER2 BLOCK DIAGRAM (TYPE B TIMER)
FIGURE 10-3: 16-BIT TIMER3 BLOCK DIAGRAM (TYPE C TIMER)
TON
Sync
PR2
T2IF
Equal Comparator x 16
TMR2
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
Gate
T2CK(1)
Sync
Note 1: T2CK input is not available on dsPIC30F5015. This input is grounded as shown in Figure 10-3.
TON
PR3
T3IF
Equal Comparator x 16
TMR3
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
TCY
1
0
TCS
1 x
0 1
TGATE
0 0
ADC Event Trigger
Sync
Note: The dsPIC30F5015/5016 devices do not have external pin inputs to Timer3. In these devices, the following
modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
dsPIC30F5015/5016
DS70149D-page 74 © 2008 Microchip Technology Inc.
10.1 Timer Gate Operation
The 32-bit timer can be placed in the Gated Time
Accumulation mode. This mode allows the internal TCY
to increment the respective timer when the gate input
signal (T2CK pin) is asserted high. Control bit TGATE
(T2CON<6>) must be set to enable this mode. When in
this mode, Timer2 is the originating clock source. The
TGATE setting is ignored for Timer3. The timer must be
enabled (TON = 1) and the timer clock source set to
internal (TCS = 0).
The falling edge of the external signal terminates the
count operation, but does not reset the timer. The user
must reset the timer in order to start counting from zero.
10.2 ADC Event Trigger
When a match occurs between the 32-bit timer (TMR3/
TMR2) and the 32-bit combined Period register (PR3/
PR2), a special ADC trigger event signal is generated
by Timer3.
10.3 Timer Prescaler
The input clock (FOSC/4 or external clock) to the timer
has a prescale option of 1:1, 1:8, 1:64 and 1:256
selected by control bits TCKPS<1:0> (T2CON<5:4>
and T3CON<5:4>). For the 32-bit timer operation, the
originating clock source is Timer2. The prescaler
operation for Timer3 is not applicable in this mode. The
prescaler counter is cleared when any of the following
occurs:
a write to the TMR2/TMR3 register
clearing either of the TON (T2CON<15> or
T3CON<15>) bits to ‘0
device Reset such as POR and BOR
However, if the timer is disabled (TON = 0), then the
Timer2 prescaler cannot be reset, since the prescaler
clock is halted.
TMR2/TMR3 is not cleared when T2CON/T3CON is
written.
10.4 Timer Operation During Sleep
Mode
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
10.5 Timer Interrupt
The 32-bit timer module can generate an interrupt on
period match, or on the falling edge of the external gate
signal. When the 32-bit timer count matches the
respective 32-bit Period register, or the falling edge of
the external “gate” signal is detected, the T3IF bit
(IFS0<7>) is asserted and an interrupt will be gener-
ated if enabled. In this mode, the T3IF interrupt flag is
used as the source of the interrupt. The T3IF bit must
be cleared in software.
Enabling an interrupt is accomplished via the
respective Timer Interrupt Enable bit, T3IE (IEC0<7>).
© 2008 Microchip Technology Inc. DS70149D-page 75
dsPIC30F5015/5016
TABLE 10-1: TIMER2/3 REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu
TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu
TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu
PR2 010C Period Register 2 1111 1111 1111 1111
PR3 010E Period Register 3 1111 1111 1111 1111
T2CON 0110 TON —TSIDL TGATE TCKPS1 TCKPS0 T32 TCS(2) 0000 0000 0000 0000
T3CON 0112 TON —TSIDL TGATE TCKPS1 TCKPS0 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
2: This bit is not available in dsPIC30F5015 devices.
dsPIC30F5015/5016
DS70149D-page 76 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 77
dsPIC30F5015/5016
11.0 TIMER4/5 MODULE
This section describes the second 32-bit General
Purpose timer module (Timer4/5) and associated
operational modes. Figure 11-1 depicts the simplified
block diagram of the 32-bit Timer4/5 module.
Figure 11-2 and Figure 11-3 show Timer4/5 configured
as two independent 16-bit timers, Timer4 and Timer5,
respectively.
The Timer4/5 module is similar in operation to the
Timer2/3 module. However, there are some
differences, which are listed below:
The Timer4/5 module does not support the ADC
Event Trigger feature
Timer4/5 can not be utilized by other peripheral
modules such as Input Capture and Output Compare
The operating modes of the Timer4/5 module are
determined by setting the appropriate bit(s) in the 16-bit
T4CON and T5CON SFRs.
For 32-bit timer/counter operation, Timer4 is the least
significant word and Timer5 is the most significant word
of the 32-bit timer.
FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Timer4 is a Type B timer and Timer5 is a
Type C timer. Please refer to the appropri-
ate timer type in Section 24.0 Electrical
Characteristics of this document.
Note: For 32-bit timer operation, T5CON control
bits are ignored. Only T4CON control bits
are used for setup and control. Timer4
clock and gate inputs are utilized for the
32-bit timer module, but an interrupt is
generated with the Timer5 Interrupt Flag
(T5IF) and the interrupt is enabled with the
Timer5 Interrupt Enable bit (T5IE).
TMR5
TMR4
T5IF
Equal Comparator x 32
PR5
PR4
Reset
LSB
MSB
Event Flag
Note: Timer Configuration bit T45, (T4CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All
control bits are respective to the T4CON register.
Data Bus<15:0>
TMR5HLD
Read TMR4
Write TMR4
16
16
16
Q
QD
CK
TGATE (T4CON<6>)
(T4CON<6>)
TGATE
0
1
TON
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TCY
TCS
1
x
0
1
TGATE
0
0
Gate
T4CK
Sync
Sync
dsPIC30F5015/5016
DS70149D-page 78 © 2008 Microchip Technology Inc.
FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM (TYPE B TIMER)
FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM (TYPE C TIMER)
TON
Sync
PR4
T4IF
Equal
Comparator x 16
TMR4
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
T
CY
1
0
TCS
1 x
0 1
TGATE
0 0
Gate
T4CK
Sync
TON
PR5
T5IF
Equal
Comparator x 16
TMR5
Reset
Event Flag
Q
QD
CK
TGATE
TCKPS<1:0>
Prescaler
1, 8, 64, 256
2
TGATE
T
CY
1
0
TCS
1 x
0 1
TGATE
0 0
ADC Event Trigger
Sync
Note: The dsPIC30F5015/5016 devices do not have an external pin input to Timer5. In these devices, the
following modes should not be used:
1. TCS = 1
2. TCS = 0 and TGATE = 1 (gated time accumulation)
© 2008 Microchip Technology Inc. DS70149D-page 79
dsPIC30F5015/5016
TABLE 11-1: TIMER4/5 REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
TMR4 0114 Timer4 Register uuuu uuuu uuuu uuuu
TMR5HLD 0116 Timer5 Holding Register (For 32-bit operations only) uuuu uuuu uuuu uuuu
TMR5 0118 Timer5 Register uuuu uuuu uuuu uuuu
PR4 011A Period Register 4 1111 1111 1111 1111
PR5 011C Period Register 5 1111 1111 1111 1111
T4CON 011E TON —TSIDL TGATE TCKPS1 TCKPS0 T45 —TCS 0000 0000 0000 0000
T5CON 0120 TON —TSIDL TGATE TCKPS1 TCKPS0 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 80 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 81
dsPIC30F5015/5016
12.0 INPUT CAPTURE MODULE
This section describes the input capture module and
associated operational modes. The features provided by
this module are useful in applications requiring
frequency (period) and pulse measurement. Figure 12-1
depicts a block diagram of the input capture module.
Input capture is useful for such modes as:
Frequency/Period/Pulse Measurements
Additional sources of External Interrupts
The key operational features of the input capture
module are:
Simple Capture Event mode
Timer2 and Timer3 mode selection
Interrupt on input capture event
These operating modes are determined by setting the
appropriate bits in the ICxCON register
(where x = 1,2,...,N). The dsPIC30F5015/5016 device
has 8 capture channels.
12.1 Simple Capture Event Mode
The simple capture events in the dsPIC30F product
family are:
Capture every falling edge
Capture every rising edge
Capture every 4th rising edge
Capture every 16th rising edge
Capture every rising and falling edge
These simple Input Capture modes are configured by
setting the appropriate bits ICM<2:0> (ICxCON<2:0>).
12.1.1 CAPTURE PRESCALER
There are four input capture prescaler settings,
specified by bits ICM<2:0> (ICxCON<2:0>). Whenever
the capture channel is turned off, the prescaler counter
will be cleared. In addition, any Reset will clear the
prescaler counter.
FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
ICxBUF
Prescaler
ICx
ICM<2:0>
Mode Select
3
Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input
capture channels 1 through N.
10
Set Flag
Pin
ICxIF
ICTMR
T2_CNT T3_CNT
Edge
Detection
Logic
Clock
Synchronizer
1, 4, 16
From General Purpose Timer Module
16 16
FIFO
R/W
Logic
ICI<1:0>
ICBNE, ICOV
ICxCON
Interrupt
Logic
Set Flag
ICxIF
Data Bus
dsPIC30F5015/5016
DS70149D-page 82 © 2008 Microchip Technology Inc.
12.1.2 CAPTURE BUFFER OPERATION
Each capture channel has an associated FIFO buffer,
which is four 16-bit words deep. There are two status
flags, which provide status on the FIFO buffer:
ICBFNE – Input Capture Buffer Not Empty
ICOV – Input Capture Overflow
The ICBFNE will be set on the first input capture event
and remain set until all capture events have been read
from the FIFO. As each word is read from the FIFO, the
remaining words are advanced by one position within
the buffer.
In the event that the FIFO is full with four capture
events and a fifth capture event occurs prior to a read
of the FIFO, an overflow condition will occur and the
ICOV bit will be set to a logic ‘1’. The fifth capture event
is lost and is not stored in the FIFO. No additional
events will be captured till all four events have been
read from the buffer.
If a FIFO read is performed after the last read and no
new capture event has been received, the read will
yield indeterminate results.
12.1.3 TIMER2 AND TIMER3 SELECTION
MODE
Each capture channel can select between one of two
timers for the time base, Timer2 or Timer3.
Selection of the timer resource is accomplished
through SFR bit ICTMR (ICxCON<7>). Timer3 is the
default timer resource available for the input capture
module.
12.1.4 HALL SENSOR MODE
When the input capture module is set for capture on
every edge, rising and falling, ICM<2:0> = 001, the
following operations are performed by the input
capture logic:
The input capture interrupt flag is set on every
edge, rising and falling
The interrupt on Capture mode setting bits,
ICI<1:0>, is ignored, since every capture
generates an interrupt
A capture overflow condition is not generated in
this mode
12.2 Input Capture Operation During
Sleep and Idle Modes
An input capture event will generate a device wake-up
or interrupt, if enabled, if the device is in CPU Idle or
Sleep mode.
Independent of the timer being enabled, the input
capture module will wake-up from the CPU Sleep or
Idle mode when a capture event occurs, if
ICM<2:0> = 111 and the interrupt enable bit is
asserted. The same wake-up can generate an
interrupt if the conditions for processing the interrupt
have been satisfied. The wake-up feature is useful as
a method of adding extra external pin interrupts.
12.2.1 INPUT CAPTURE IN CPU SLEEP
MODE
CPU Sleep mode allows input capture module
opera tion with reduced functionality. In the CPU Sleep
mode, the ICI<1:0> bits are not applicable, and the
input capture module can only function as an external
interrupt source.
The capture module must be configured for interrupt
only on the rising edge (ICM<2:0> = 111) in order for
the input capture module to be used while the device
is in Sleep mode. The prescale settings of 4:1 or 16:1
are not applicable in this mode.
12.2.2 INPUT CAPTURE IN CPU IDLE
MODE
CPU Idle mode allows input capture module operation
with full functionality. In the CPU Idle mode, the Interrupt
mode selected by the ICI<1:0> bits is applicable, as well
as the 4:1 and 16:1 capture prescale settings, which are
defined by control bits ICM<2:0>. This mode requires
the selected timer to be enabled. Moreover, the ICSIDL
bit must be asserted to a logic ‘0’.
If the input capture module is defined as
ICM<2:0> = 111 in CPU Idle mode, the input capture
pin will serve only as an external interrupt pin.
12.3 Input Capture Interrupts
The input capture channels have the ability to generate
an interrupt, based upon the selected number of
capture events. The selection number is set by control
bits ICI<1:0> (ICxCON<6:5>).
Each channel provides an interrupt flag (ICxIF) bit. The
respective capture channel interrupt flag is located in
the corresponding IFSx Status register.
Enabling an interrupt is accomplished via the
respective Capture Channel Interrupt Enable (ICxIE)
bit. The Capture Interrupt Enable bit is located in the
corresponding IEC Control register.
© 2008 Microchip Technology Inc. DS70149D-page 83
dsPIC30F5015/5016
TABLE 12-1: INPUT CAPTURE REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu
IC1CON 0142 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu
IC2CON 0146 —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu
IC3CON 014A —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu
IC4CON 014E —ICSIDL ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 84 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 85
dsPIC30F5015/5016
13.0 OUTPUT COMPARE MODULE
This section describes the output compare module and
associated operational modes. The features provided
by this module are useful in applications requiring
operational modes such as:
Generation of Variable Width Output Pulses
Power Factor Correction
Figure 13-1 depicts a block diagram of the output
compare module.
The key operational features of the output compare
module include:
Timer2 and Timer3 Selection mode
Simple Output Compare Match mode
Dual Output Compare Match mode
Simple PWM mode
Output Compare during Sleep and Idle modes
Interrupt on Output Compare/PWM Event
These operating modes are determined by setting the
appropriate bits in the 16-bit OCxCON SFR
(where x = 1,2,3,...,N). The dsPIC30F5015/5016
device has 8 compare channels.
OCxRS and OCxR in the figure represent the Dual
Compare registers. In the Dual Compare mode, the
OCxR register is used for the first compare and OCxRS
FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
OCxR
Comparator
Output
Logic
QS
R
OCM<2:0>
Output Enable
OCx
Set Flag bit
OCxIF
OCxRS
Mode Select
3
Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare
channels 1 through N.
OCFA
OCTSEL 01
T2P2_MATCH
TMR2<15:0 TMR3<15:0> T3P3_MATCH
From General Purpose
(for x = 1, 2, 3 or 4)
01
Timer Module
dsPIC30F5015/5016
DS70149D-page 86 © 2008 Microchip Technology Inc.
13.1 Timer2 and Timer3 Selection Mode
Each output compare channel can select between one
of two 16-bit timers; Timer2 or Timer3.
The selection of the timers is controlled by the OCTSEL
bit (OCxCON<3>). Timer2 is the default timer resource
for the output compare module.
13.2 Simple Output Compare Match
Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 001,
010 or 011, the selected output compare channel is
configured for one of three simple output compare
match modes:
Compare forces I/O pin low
Compare forces I/O pin high
Compare toggles I/O pin
The OCxR register is used in these modes. The OCxR
register is loaded with a value and is compared to the
selected incrementing timer count. When a compare
occurs, one of these compare match modes occurs. If
the counter resets to zero before reaching the value in
OCxR, the state of the OCx pin remains unchanged.
13.3 Dual Output Compare Match Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 100
or 101, the selected output compare channel is
configured for one of two dual output compare modes,
which are:
Single Output Pulse mode
Continuous Output Pulse mode
13.3.1 SINGLE-PULSE MODE
For the user to configure the module for the generation
of a single output pulse, the following steps are
required (assuming timer is off):
Determine instruction cycle time TCY.
Calculate desired pulse width value based on TCY.
Calculate time to start pulse from timer start value
of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS Compare registers (x denotes
channel 1, 2, ...,N).
Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
Set OCM<2:0> = 100.
Enable timer, TON (TxCON<15>) = 1.
To initiate another single pulse, issue another write to
set OCM<2:0> = 100.
13.3.2 CONTINUOUS PULSE MODE
For the user to configure the module for the generation
of a continuous stream of output pulses, the following
steps are required:
Determine instruction cycle time TCY.
Calculate desired pulse value based on TCY.
Calculate timer to start pulse width from timer start
value of 0x0000.
Write pulse width start and stop times into OCxR
and OCxRS (x denotes channel 1, 2, ...,N)
Compare registers, respectively.
Set Timer Period register to value equal to, or
greater than, value in OCxRS Compare register.
Set OCM<2:0> = 101.
Enable timer, TON (TxCON<15>) = 1.
13.4 Simple PWM Mode
When control bits OCM<2:0> (OCxCON<2:0>) = 110
or 111, the selected output compare channel is
configured for the PWM mode of operation. When
configured for the PWM mode of operation, OCxR is
the main latch (read-only) and OCxRS is the secondary
latch. This enables glitchless PWM transitions.
The user must perform the following steps in order to
configure the output compare module for PWM
operation:
1. Set the PWM period by writing to the appropriate
Period register.
2. Set the PWM duty cycle by writing to the OCxRS
register.
3. Configure the output compare module for PWM
operation.
4. Set the TMRx prescale value and enable the
timer, TON (TxCON<15>) = 1.
13.4.1 INPUT PIN FAULT PROTECTION
FOR PWM
When control bits OCM<2:0> (OCxCON<2:0>) = 111,
the selected output compare channel is again
configured for the PWM mode of operation, with the
additional feature of input Fault protection. While in this
mode, if a logic ‘0’ is detected on the OCFA pin, the
respective PWM output pin is placed in the
high-impedance input state. The OCFLT bit
(OCxCON<4>) indicates whether a Fault condition has
occurred. This state will be maintained until both of the
following events have occurred:
The external Fault condition has been removed.
The PWM mode has been re-enabled by writing
to the appropriate control bits.
© 2008 Microchip Technology Inc. DS70149D-page 87
dsPIC30F5015/5016
13.4.2 PWM PERIOD
The PWM period is specified by writing to the PRx
register. The PWM period can be calculated using
Equation 13-1.
EQUATION 13-1: PWM PERIOD
PWM frequency is defined as 1/[PWM period].
When the selected TMRx is equal to its respective
Period register, PRx, the following four events occur on
the next increment cycle:
TMRx is cleared.
The OCx pin is set.
- Exception 1: If PWM duty cycle is 0x0000,
the OCx pin will remain low.
- Exception 2: If duty cycle is greater than PRx,
the pin will remain high.
The PWM duty cycle is latched from OCxRS into
OCxR.
The corresponding timer interrupt flag is set.
See Figure 13-1 for key PWM period comparisons.
Timer3 is referred to in the figure for clarity.
FIGURE 13-1: PWM OUTPUT TIMING
13.5 Output Compare Operation During
CPU Sleep Mode
When the CPU enters the Sleep mode, all internal
clocks are stopped. Therefore, when the CPU enters
the Sleep state, the output compare channel will drive
the pin to the active state that was observed prior to
entering the CPU Sleep state.
For example, if the pin was high when the CPU
entered the Sleep state, the pin will remain high.
Likewise, if the pin was low when the CPU entered the
Sleep state, the pin will remain low. In either case, the
output compare module will resume operation when
the device wakes up.
13.6 Output Compare Operation During
CPU Idle Mode
When the CPU enters the Idle mode, the output
compare module can operate with full functionality.
The output compare channel will operate during the
CPU Idle mode if the OCSIDL bit (OCxCON<13>) is at
logic ‘0’ and the selected time base (Timer2 or Timer3)
is enabled and the TSIDL bit of the selected timer is
set to logic ‘0’.
13.7 Output Compare Interrupts
The output compare channels have the ability to
generate an interrupt on a compare match, for
whichever match mode has been selected.
For all modes except the PWM mode, when a compare
event occurs, the respective interrupt flag (OCxIF) is
asserted and an interrupt will be generated, if enabled.
The OCxIF bit is located in the corresponding IFS
Status register and must be cleared in software. The
interrupt is enabled via the respective Compare
Interrupt Enable (OCxIE) bit, located in the
corresponding IEC Control register.
For the PWM mode, when an event occurs, the
respective Timer Interrupt Flag (T2IF or T3IF) is
asserted and an interrupt will be generated, if enabled.
The IF bit is located in the IFS0 Status register and
must be cleared in software. The interrupt is enabled
via the respective Timer Interrupt Enable bit (T2IE or
T3IE), located in the IEC0 Control register. The output
compare interrupt flag is never set during the PWM
mode of operation.
PWM Period = [(PRx) + 1] • 4 • TOSC
(TMRx Prescale Value)
Period
Duty Cycle
TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR)
TMR3 = PR3
T3IF = 1
(Interrupt Flag)
OCxR = OCxRS
TMR3 = PR3
(Interrupt Flag)
OCxR = OCxRS
T3IF = 1
dsPIC30F5015/5016
DS70149D-page 88 © 2008 Microchip Technology Inc.
TABLE 13-1: OUTPUT COMPARE REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000
OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000
OC1CON 0184 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000
OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000
OC2CON 018A —OCSIDL OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000
OC3RS 018C Output Compare 3 Secondary Register 0000 0000 0000 0000
OC3R 018E Output Compare 3 Main Register 0000 0000 0000 0000
OC3CON 0190 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
OC4RS 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000
OC4R 0194 Output Compare 4 Main Register 0000 0000 0000 0000
OC4CON 0196 —OCSIDL OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 89
dsPIC30F5015/5016
14.0 QUADRATURE ENCODER
INTERFACE (QEI) MODULE
This section describes the Quadrature Encoder Interface
(QEI) module and associated operational modes. The
QEI module provides the interface to incremental
encoders for obtaining mechanical position data.
The operational features of the QEI include:
Three input channels for two phase signals and
index pulse
16-bit up/down position counter
Count direction status
Position Measurement (x2 and x4) mode
Programmable digital noise filters on inputs
Alternate 16-bit Timer/Counter mode
Quadrature Encoder Interface interrupts
These operating modes are determined by setting the
appropriate bits QEIM<2:0> (QEICON<10:8>).
Figure 14-1 depicts the Quadrature Encoder Interface
block diagram.
FIGURE 14-1: QUADRATURE ENCODER INTERFACE BLOCK DIAGRAM
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
16-bit Up/Down Counter
Comparator/
Max Count Register
Quadrature
Programmable
Digital Filter
QEA
Programmable
Digital Filter
INDX
1Up/Down
Existing Pin Logic
UPDN
3
Encoder
Programmable
Digital Filter
QEB
Interface Logic
QEIM<2:0>
Mode Select
3
(POSCNT)
(MAXCNT)
PCDOUT
QEIIF
Event
Flag
Reset
Equal
2
TCY
1
0
TQCS
TQCKPS<1:0>
2
1, 8, 64, 256
Prescaler
Q
QD
CK
TQGATE
QEIM<2:0>
Synchronize
Det
1
0
Sleep Input
0
1
UDSRC
QEICON<11> Zero Detect
0
dsPIC30F5015/5016
DS70149D-page 90 © 2008 Microchip Technology Inc.
14.1 Quadrature Encoder Interface
Logic
A typical incremental (a.k.a. optical) encoder has three
outputs: Phase A, Phase B and an index pulse. These
signals are useful and often required in position and
speed control of ACIM and SR motors.
The two channels, Phase A (QEA) and Phase B (QEB),
have a unique relationship. If Phase A leads Phase B,
then the direction (of the motor) is deemed positive or
forward. If Phase A lags Phase B, then the direction (of
the motor) is deemed negative or reverse.
A third channel, termed index pulse, occurs once per
revolution and is used as a reference to establish an
absolute position. The index pulse coincides with
Phase A and Phase B, both low.
14.2 16-bit Up/Down Position Counter
Mode
The 16-bit up/down counter counts up or down on
every count pulse, which is generated by the difference
of the Phase A and Phase B input signals. The counter
acts as an integrator, whose count value is proportional
to position. The direction of the count is determined by
the UPDN signal, which is generated by the
Quadrature Encoder Interface logic.
14.2.1 POSITION COUNTER ERROR
CHECKING
Position count error checking in the QEI is provided for
and indicated by the CNTERR bit (QEICON<15>). The
error checking only applies when the position counter
is configured for Reset on the Index Pulse modes
(QEIM<2:0> = 110 or 100). In these modes, the
contents of the POSCNT register are compared with
the values (0xFFFF or MAXCNT + 1, depending on
direction). If these values are detected, an error
condition is generated by setting the CNTERR bit and
a QEI count error interrupt is generated. The QEI count
error interrupt can be disabled by setting the CEID bit
(DFLTCON<8>). The position counter continues to
count encoder edges after an error has been detected.
The POSCNT register continues to count up/down until
a natural rollover/underflow. No interrupt is generated
for the natural rollover/underflow event. The CNTERR
bit is a read/write bit and reset in software by the user.
14.2.2 POSITION COUNTER RESET
The Position Counter Reset Enable bit, POSRES
(QEICON<2>), controls whether the position counter is
reset when the index pulse is detected. This bit is only
applicable when QEIM<2:0> = 100 or 110.
If the POSRES bit is set to ‘1’, then the position counter
is reset when the index pulse is detected. If the
POSRES bit is set to ‘0’, then the position counter is not
reset when the index pulse is detected. The position
counter will continue counting up or down, and will be
reset on the rollover or underflow condition.
The interrupt is still generated on the detection of the
index pulse and not on the position counter
overflow/underflow.
14.2.3 COUNT DIRECTION STATUS
As mentioned in the previous section, the QEI logic
generates an UPDN signal, based upon the
relationship between Phase A and Phase B. In addition
to the output pin, the state of this internal UPDN signal
is supplied to a SFR bit, UPDN (QEICON<11>), as a
read-only bit. To place the state of this signal on an I/O
pin, the SFR bit, PCDOUT (QEICON<6>), must be ‘1’.
14.3 Position Measurement Mode
There are two measurement modes which are
supported and are termed x2 and x4. These modes are
selected by the QEIM<2:0> mode select bits located in
SFR QEICON<10:8>.
When control bits QEIM<2:0> = 100 or 101, the x2
Measurement mode is selected and the QEI logic only
looks at the Phase A input for the position counter
increment rate. Every rising and falling edge of the
Phase A signal causes the position counter to be
incremented or decremented. The Phase B signal is
still utilized for the determination of the counter
direction, just as in the x4 mode.
Within the x2 Measurement mode, there are two
variations of how the position counter is reset:
Position counter reset by detection of index pulse,
QEIM<2:0> = 100.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 101.
When control bits QEIM<2:0> = 110 or 111, the x4
Measurement mode is selected and the QEI logic looks
at both edges of the Phase A and Phase B input
signals. Every edge of both signals causes the position
counter to increment or decrement.
Within the x4 Measurement mode, there are two
variations of how the position counter is reset:
Position counter reset by detection of index pulse,
QEIM<2:0> = 110.
Position counter reset by match with MAXCNT,
QEIM<2:0> = 111.
The x4 Measurement mode provides for finer
resolution data (more position counts) for determining
motor position.
© 2008 Microchip Technology Inc. DS70149D-page 91
dsPIC30F5015/5016
14.4 Programmable Digital Noise
Filters
The digital noise filter section is responsible for
rejecting noise on the incoming quadrature signals.
Schmitt Trigger inputs and a three-clock cycle delay fil-
ter combine to reject low-level noise and large, short
duration noise spikes that typically occur in noise prone
applications, such as a motor system.
The filter ensures that the filtered output signal is not
permitted to change until a stable value has been
registered for three consecutive clock cycles.
For the QEA, QEB and INDX pins, the clock divide
frequency for the digital filter is programmed by bits
QECK<2:0> (DFLTCON<6:4>) and are derived from
the base instruction cycle TCY.
To enable the filter output for channels QEA, QEB and
INDX, the QEOUT bit must be ‘1’. The filter network for
all channels is disabled on POR and BOR.
14.5 Alternate 16-bit Timer/Counter
When the QEI module is not configured for the QEI
mode, QEIM<2:0> = 001, the module can be
configured as a simple 16-bit timer/counter. The setup
and control of the auxiliary timer is accomplished
through the QEICON SFR register. This timer functions
identically to Timer1. The QEA pin is used as the timer
clock input.
When configured as a timer, the POSCNT register
serves as the Timer Count register and the MAXCNT
register serves as the Period register. When a
Timer/Period register match occurs, the QEI interrupt
flag will be asserted.
The only exception between the general purpose
timers and this timer is the added feature of external
up/down input select. When the UPDN pin is asserted
high, the timer will increment up. When the UPDN pin
is asserted low, the timer will be decremented.
The UPDN control/Status bit (QEICON<11>) can be
used to select the count direction state of the Timer
register. When UPDN = 1, the timer will count up. When
UPDN = 0, the timer will count down.
In addition, control bit, UDSRC (QEICON<0>),
determines whether the timer count direction state is
based on the logic state written into the UPDN
control/Status bit (QEICON<11>), or the QEB pin state.
When UDSRC = 1, the timer count direction is
controlled from the QEB pin. Likewise, when
UDSRC = 0, the timer count direction is controlled by
the UPDN bit.
14.6 QEI Module Operation During CPU
Sleep Mode
14.6.1 QEI OPERATION DURING CPU
SLEEP MODE
The QEI module will be halted during the CPU Sleep
mode.
14.6.2 TIMER OPERATION DURING CPU
SLEEP MODE
During CPU Sleep mode, the timer will not operate,
because the internal clocks are disabled.
14.7 QEI Module Operation During CPU
Idle Mode
Since the QEI module can function as a Quadrature
Encoder Interface, or as a 16-bit timer, the following
section describes operation of the module in both
modes.
14.7.1 QEI OPERATION DURING CPU IDLE
MODE
When the CPU is placed in the Idle mode, the QEI
module will operate if the QEISIDL bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
executing POR and BOR. For halting the QEI module
during the CPU Idle mode, QEISIDL should be set to ‘1’.
Note: Changing the operational mode (i.e., from
QEI to Timer or vice versa), will not affect
the Timer/Position Count register contents.
Note: This timer does not support the External
Asynchronous Counter mode of operation.
If using an external clock source, the clock
will automatically be synchronized to the
internal instruction cycle.
dsPIC30F5015/5016
DS70149D-page 92 © 2008 Microchip Technology Inc.
14.7.2 TIMER OPERATION DURING CPU
IDLE MODE
When the CPU is placed in the Idle mode and the QEI
module is configured in the 16-bit Timer mode, the
16-bit timer will operate if the QEISIDL bit
(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon
executing POR and BOR. For halting the timer module
during the CPU Idle mode, QEISIDL should be set
to 1’.
If the QEISIDL bit is cleared, the timer will function
normally, as if the CPU Idle mode had not been
entered.
14.8 Quadrature Encoder Interface
Interrupts
The Quadrature Encoder Interface has the ability to
generate an interrupt on occurrence of the following
events:
Interrupt on 16-bit up/down position counter
rollover/underflow
Detection of qualified index pulse, or if CNTERR
bit is set
Timer period match event (overflow/underflow)
Gate accumulation event
The QEI Interrupt Flag bit, QEIIF, is asserted upon
occurrence of any of the above events. The QEIIF bit
must be cleared in software. QEIIF is located in the
IFS2 Status register.
Enabling an interrupt is accomplished via the
respective enable bit, QEIIE. The QEIIE bit is located in
the IEC2 Control register.
© 2008 Microchip Technology Inc. DS70149D-page 93
dsPIC30F5015/5016
TABLE 14-1: QEI REGISTER MAP(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
QEICON 0122 CNTERR QEISIDL INDX UPDN QEIM<2:0> SWPAB PCDOUT TQGATE TQCKPS<1:0> POSRES TQCS UDSRC 0000 0000 0000 0000
DFLTCON 0124 IMV<1:0> CEID QEOUT QECK2 QECK1 QECK0 0000 0000 0000 0000
POSCNT 0126 Position Counter<15:0> 0000 0000 0000 0000
MAXCNT 0128 Maximun Count<15:0> 1111 1111 1111 1111
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 94 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 95
dsPIC30F5015/5016
15.0 MOTOR CONTROL PWM
MODULE
This module simplifies the task of generating multiple,
synchronized Pulse-Width Modulated (PWM) outputs.
In particular, the following power and motion control
applications are supported by the PWM module:
Three Phase AC Induction Motor
Switched Reluctance (SR) Motor
Brushless DC (BLDC) Motor
Uninterruptible Power Supply (UPS)
The PWM module has the following features:
8 PWM I/O pins with 4 duty cycle generators
Up to 16-bit resolution
‘On-the-Fly’ PWM frequency changes
Edge and Center-Aligned Output modes
Single-Pulse Generation mode
Interrupt support for asymmetrical updates in
Center-Aligned mode
Output override control for Electrically
Commutative Motor (ECM) operation
‘Special Event’ comparator for scheduling other
peripheral events
Fault pins to optionally drive each of the PWM
output pins to a defined state
Duty cycle updates are configurable to be
immediate or synchronized to the PWM time base
This module contains 4 duty cycle generators,
numbered 1 through 4. The module has 8 PWM output
pins, numbered PWM1H/PWM1L through
PWM4H/PWM4L. The eight I/O pins are grouped into
high/low numbered pairs, denoted by the suffix H or L,
respectively. For complementary loads, the low PWM
pins are always the complement of the corresponding
high I/O pin.
The PWM module allows several modes of operation
which are beneficial for specific power control
applications.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 96 © 2008 Microchip Technology Inc.
FIGURE 15-1: PWM MODULE BLOCK DIAGRAM
PDC4
PDC4 Buffer
PWMCON1
PTPER Buffer
PWMCON2
PTPER
PTMR
Comparator
Comparator
Channel 4 Dead-Time
Generator and
PTCON
SEVTCMP
Comparator Special Event Trigger
FLTBCON
OVDCON
PWM Enable and Mode SFRs
PWM Manual
Control SFR
Channel 3 Dead-Time
Generator and
Channel 2 Dead-Time
Generator and
PWM Generator
#3
PWM Generator
#2
PWM Generator #4
SEVTDIR
PTDIR
DTCON1 Dead-Time Control SFRs
Special Event
Postscaler
PWM1L
PWM1H
PWM2L
PWM2H
PWM3L
PWM3H
PWM Generator
#1 Channel 1 Dead-Time
Generator and
Note: Details of PWM Generator #1, #2 and #3 not shown for clarity.
16-bit Data Bus
PWM4L
PWM4H
DTCON2
FLTACON Fault Pin Control SFRs
PWM Time Base
Output
Driver
Block
FLTB
FLTA
Override Logic
Override Logic
Override Logic
Override Logic
© 2008 Microchip Technology Inc. DS70149D-page 97
dsPIC30F5015/5016
15.1 PWM Time Base
The PWM time base is provided by a 15-bit timer with
a prescaler and postscaler. The time base is accessible
via the PTMR SFR. PTMR<15> is a read-only Status
bit, PTDIR, that indicates the present count direction of
the PWM time base. If PTDIR is cleared, PTMR is
counting upwards. If PTDIR is set, PTMR is counting
downwards. The PWM time base is configured via the
PTCON SFR. The time base is enabled/disabled by
setting/clearing the PTEN bit in the PTCON SFR.
PTMR is not cleared when the PTEN bit is cleared in
software.
The PTPER SFR sets the counting period for PTMR.
The user must write a 15-bit value to PTPER<14:0>.
When the value in PTMR<14:0> matches the value in
PTPER<14:0>, the time base will either reset to ‘0’, or
reverse the count direction on the next occurring clock
cycle. The action taken depends on the operating
mode of the time base.
The PWM time base can be configured for four different
modes of operation:
Free-Running mode
Single-Shot mode
Continuous Up/Down Count mode
Continuous Up/Down Count mode with interrupts
for double updates
These four modes are selected by the PTMOD<1:0>
bits in the PTCON SFR. The Up/Down Counting modes
support center-aligned PWM generation. The
Single-Shot mode allows the PWM module to support
pulse control of certain Electronically Commutative
Motors (ECMs).
The interrupt signals generated by the PWM time base
depend on the mode selection bits (PTMOD<1:0>) and
the postscaler bits (PTOPS<3:0>) in the PTCON SFR.
15.1.1 FREE-RUNNING MODE
In Free-Running mode, the PWM time base counts
upwards until the value in the Time Base Period
register (PTPER) is matched. The PTMR register is
reset on the following input clock edge and the time
base will continue to count upwards as long as the
PTEN bit remains set.
When the PWM time base is in the Free-Running mode
(PTMOD<1:0> = 00), an interrupt event is generated
each time a match with the PTPER register occurs and
the PTMR register is reset to zero. The postscaler
selection bits may be used in this mode of the timer to
reduce the frequency of the interrupt events.
15.1.2 SINGLE-SHOT MODE
In the Single-Shot Counting mode, the PWM time base
begins counting upwards when the PTEN bit is set.
When the value in the PTMR register matches the
PTPER register, the PTMR register will be reset on the
following input clock edge and the PTEN bit will be
cleared by the hardware to halt the time base.
When the PWM time base is in the Single-Shot mode
(PTMOD<1:0> = 01), an interrupt event is generated
when a match with the PTPER register occurs, the
PTMR register is reset to zero on the following input
clock edge, and the PTEN bit is cleared. The postscaler
selection bits have no effect in this mode of the timer.
15.1.3 CONTINUOUS UP/DOWN
COUNTING MODES
In the Continuous Up/Down Counting modes, the PWM
time base counts upwards until the value in the PTPER
register is matched. The timer will begin counting
downwards on the following input clock edge. The
PTDIR bit in the PTCON SFR is read-only and
indicates the counting direction. The PTDIR bit is set
when the timer counts downwards.
In the Up/Down Counting mode (PTMOD<1:0> = 10),
an interrupt event is generated each time the value of
the PTMR register becomes zero and the PWM time
base begins to count upwards. The postscaler
selection bits may be used in this mode of the timer to
reduce the frequency of the interrupt events.
Note: If the Period register is set to 0x0000, the
timer will stop counting, and the interrupt
and the special event trigger will not be
generated, even if the special event value
is also 0x0000. The module will not update
the Period register if it is already at
0x0000; therefore, the user must disable
the module in order to update the Period
register.
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DS70149D-page 98 © 2008 Microchip Technology Inc.
15.1.4 DOUBLE UPDATE MODE
In the Double Update mode (PTMOD<1:0> = 11), an
interrupt event is generated each time the PTMR
register is equal to zero, as well as each time a period
match occurs. The postscaler selection bits have no
effect in this mode of the timer.
The Double Update mode provides two additional
functions to the user. First, the control loop bandwidth
is doubled because the PWM duty cycles can be
updated, twice per period. Second, asymmetrical
center-aligned PWM waveforms can be generated,
which are useful for minimizing output waveform
distortion in certain motor control applications.
15.1.5 PWM TIME BASE PRESCALER
The input clock to PTMR (FOSC/4), has prescaler
options of 1:1, 1:4, 1:16, or 1:64, selected by control
bits PTCKPS<1:0> in the PTCON SFR. The prescaler
counter is cleared when any of the following occurs:
a write to the PTMR register
a write to the PTCON register
any device Reset
PTMR is not cleared when PTCON is written.
15.1.6 PWM TIME BASE POSTSCALER
The match output of PTMR can optionally be
post-scaled through a 4-bit postscaler (which gives a
1:1 to 1:16 scaling).
The postscaler counter is cleared when any of the
following occurs:
a write to the PTMR register
a write to the PTCON register
any device Reset
The PTMR register is not cleared when PTCON is written.
15.2 PWM Period
PTPER is a 15-bit register and is used to set the counting
period for the PWM time base. PTPER is a
double-buffered register. The PTPER buffer contents are
loaded into the PTPER register at the following instants:
Free-Running and Single-Shot modes: When the
PTMR register is reset to zero after a match with
the PTPER register.
Up/Down Counting modes: When the PTMR
register is zero.
The value held in the PTPER buffer is automatically
loaded into the PTPER register when the PWM time
base is disabled (PTEN = 0).
The PWM period can be determined using
Equation 15-1:
EQUATION 15-1: PWM PERIOD
If the PWM time base is configured for one of the
Up/Down Count modes, the PWM period is given by
Equation 15-2.
EQUATION 15-2: PWM PERIOD (UP/DOWN
MODE)
The maximum resolution (in bits) for a given device
oscillator and PWM frequency can be determined using
Equation 15-3:
EQUATION 15-3: PWM RESOLUTION
15.3 Edge-Aligned PWM
Edge-aligned PWM signals are produced by the module
when the PWM time base is in the Free-Running or
Single-Shot mode. For edge-aligned PWM outputs, the
output has a period specified by the value in PTPER
and a duty cycle specified by the appropriate Duty Cycle
register (see Figure 15-2). The PWM output is driven
active at the beginning of the period (PTMR = 0) and is
driven inactive when the value in the Duty Cycle register
matches PTMR.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the
output on the PWM pin will be active for the entire
PWM period if the value in the Duty Cycle register is
greater than the value held in the PTPER register.
FIGURE 15-2: EDGE-ALIGNED PWM
Note: Programming a value of 0x0001 in the
Period register could generate a
continuous interrupt pulse and hence,
must be avoided.
TPWM = TCY (PTPER + 1)
(PTMR Prescale Value)
TPWM = 2 • TCY • (PTPER + 1)
(PTMR Prescale Value)
Resolution = log (2 TPWM/TCY)
log (2)
Period
Duty Cycle
0
PTPER
PTMR
Value
New Duty Cycle Latched
© 2008 Microchip Technology Inc. DS70149D-page 99
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15.4 Center-Aligned PWM
Center-aligned PWM signals are produced by the
module when the PWM time base is configured in an
Up/Down Counting mode (see Figure 15-3).
The PWM compare output is driven to the active state
when the value of the Duty Cycle register matches the
value of PTMR and the PWM time base is counting
downwards (PTDIR = 1). The PWM compare output is
driven to the inactive state when the PWM time base is
counting upwards (PTDIR = 0) and the value in the
PTMR register matches the duty cycle value.
If the value in a particular Duty Cycle register is zero,
then the output on the corresponding PWM pin will be
inactive for the entire PWM period. In addition, the out-
put on the PWM pin will be active for the entire PWM
period if the value in the Duty Cycle register is equal to
the value held in the PTPER register.
FIGURE 15-3: CENTER-ALIGNED PWM
15.5 PWM Duty Cycle Comparison
Units
There are four 16-bit Special Function Registers
(PDC1, PDC2, PDC3 and PDC4) used to specify duty
cycle values for the PWM module.
The value in each Duty Cycle register determines the
amount of time that the PWM output is in the active
state. The Duty Cycle registers are 16 bits wide. The
LSb of a Duty Cycle register determines whether the
PWM edge occurs in the beginning. Thus, the PWM
resolution is effectively doubled.
15.5.1 DUTY CYCLE REGISTER BUFFERS
The four PWM Duty Cycle registers are double-buffered
to allow glitchless updates of the PWM outputs. For each
duty cycle, there is a Duty Cycle register that is accessi-
ble by the user, and a second Duty Cycle register that
holds the actual compare value used in the present
PWM period.
For edge-aligned PWM output, a new duty cycle value
will be updated whenever a match with the PTPER reg-
ister occurs and PTMR is reset. The contents of the
duty cycle buffers are automatically loaded into the
Duty Cycle registers when the PWM time base is dis-
abled (PTEN = 0) and the UDIS bit is cleared in
PWMCON2.
When the PWM time base is in the Up/Down Counting
mode, new duty cycle values are updated when the
value of the PTMR register is zero and the PWM time
base begins to count upwards. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
When the PWM time base is in the Up/Down Counting
mode with double updates, new duty cycle values are
updated when the value of the PTMR register is zero,
and when the value of the PTMR register matches the
value in the PTPER register. The contents of the duty
cycle buffers are automatically loaded into the Duty
Cycle registers when the PWM time base is disabled
(PTEN = 0).
15.5.2 DUTY CYCLE IMMEDIATE
UPDATES
When the Immediate Update Enable bit is set (IUE = 1),
any write to the Duty Cycle registers updates the new
duty cycle value immediately. This feature gives the
option to the user to allow immediate updates of the
active PWM Duty Cycle registers instead of waiting for
the end of the current time base period. System stabil-
ity is improved in closed-loop servo applications by
reducing the delay between system observation and
the issuance of system corrective commands when
immediate updates are enabled.
If the PWM output is active at the time the new duty
cycle is written, and the new duty cycle is less than the
current time base value, the PWM pulse width is
shortened.
If the PWM output is active at the time the new duty
cycle is written, and the new duty cycle is greater than
the current time base value, the PWM pulse width is
lengthened.
If the PWM output is inactive at the time the new duty
cycle is written, and the new duty cycle is greater than
the current time base value, the PWM output becomes
active immediately and remains active for the new
written duty cycle value.
0
PTPER PTMR
Value
Period
Period/2
Duty
Cycle
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15.6 Complementary PWM Operation
In the Complementary mode of operation, each pair of
PWM outputs is obtained by a complementary PWM
signal. A dead time may be optionally inserted during
device switching, when both outputs are inactive for a
short period (Refer to Section 15.7 “Dead-Time
Generators”).
In Complementary mode, the duty cycle comparison
units are assigned to the PWM outputs as follows:
PDC1 register controls PWM1H/PWM1L outputs
PDC2 register controls PWM2H/PWM2L outputs
PDC3 register controls PWM3H/PWM3L outputs
PDC4 register controls PWM4H/PWM4L outputs
The Complementary mode is selected for each PWM
I/O pin pair by clearing the appropriate PMODx bit in the
PWMCON1 SFR. The PWM I/O pins are set to
Complementary mode by default upon a device Reset.
15.7 Dead-Time Generators
Dead-time generation may be provided when any of the
PWM I/O pin pairs are operating in the Complementary
Output mode. The PWM outputs use Push-Pull drive
circuits. Due to the inability of the power output devices
to switch instantaneously, some amount of time must be
provided between the turn off event of one PWM output
in a complementary pair and the turn on event of the
other transistor.
The PWM module allows two different dead times to be
programmed. These two dead times may be used in
one of two methods described below to increase user
flexibility:
The PWM output signals can be optimized for
different turn off times in the high side and low
side transistors in a complementary pair of
transistors. The first dead time is inserted
between the turn off event of the lower transistor
of the complementary pair and the turn on event
of the upper transistor. The second dead time is
inserted between the turn off event of the upper
transistor and the turn on event of the lower
transistor.
The two dead times can be assigned to individual
PWM I/O pin pairs. This operating mode allows
the PWM module to drive different transistor/load
combinations with each complementary PWM I/O
pin pair.
15.7.1 DEAD-TIME GENERATORS
Each complementary output pair for the PWM module
has a 6-bit down counter that is used to produce the
dead-time insertion. As shown in Figure 15-4, each
dead-time unit has a rising and falling edge detector
connected to the duty cycle comparison output.
15.7.2 DEAD-TIME ASSIGNMENT
The DTCON2 SFR contains control bits that allow the
dead times to be assigned to each of the
complementary outputs. Table 15-1 summarizes the
function of each dead-time selection control bit.
TABLE 15-1: DEAD-TIME SELECTION BITS
15.7.3 DEAD-TIME RANGES
The amount of dead time provided by each dead-time
unit is selected by specifying the input clock prescaler
value and a 6-bit unsigned value. The amount of dead
time provided by each unit may be set independently.
Four input clock prescaler selections have been
provided to allow a suitable range of dead times, based
on the device operating frequency. The clock prescaler
option may be selected independently for each of the
two dead-time values. The dead-time clock prescaler
values are selected using the DTAPS<1:0> and
DTBPS<1:0> control bits in the DTCON1 SFR. One of
four clock prescaler options (TCY, 2 TCY, 4 TCY or 8 TCY)
may be selected for each of the dead-time values.
After the prescaler values are selected, the dead time
for each unit is adjusted by loading two 6-bit unsigned
values into the DTCON1 SFR.
The dead-time unit prescalers are cleared on the
following events:
On a load of the down timer due to a duty cycle
comparison edge event.
On a write to the DTCON1 or DTCON2 registers.
On any device Reset.
Bit Function
DTS1A Selects PWM1L/PWM1H active edge dead time.
DTS1I Selects PWM1L/PWM1H inactive edge
dead time.
DTS2A Selects PWM2L/PWM2H active edge dead time.
DTS2I Selects PWM2L/PWM2H inactive edge
dead time.
DTS3A Selects PWM3L/PWM3H active edge dead time.
DTS3I Selects PWM3L/PWM3H inactive edge
dead time.
DTS4A Selects PWM4L/PWM4H active edge dead time.
DTS4I Selects PWM4L/PWM4H inactive edge
dead time.
Note: The user should not modify the DTCON1
or DTCON2 values while the PWM
module is operating (PTEN = 1).
Unexpected results may occur.
© 2008 Microchip Technology Inc. DS70149D-page 101
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FIGURE 15-4: DEAD-TIME TIMING DIAGRAM
15.8 Independent PWM Output
An Independent PWM Output mode is required for
driving certain types of loads. A particular PWM output
pair is in the Independent Output mode when the
corresponding PMOD bit in the PWMCON1 register is
set. No dead-time control is implemented between
adjacent PWM I/O pins when the module is operating
in the Independent mode and both I/O pins are allowed
to be active simultaneously.
In the Independent mode, each duty cycle generator is
connected to both of the PWM I/O pins in an output
pair. By using the associated Duty Cycle register and
the appropriate bits in the OVDCON register, the user
may select the following signal output options for each
PWM I/O pin operating in the Independent mode:
I/O pin outputs PWM signal
I/O pin inactive
I/O pin active
15.9 Single-Pulse PWM Operation
The PWM module produces single-pulse outputs when
the PTCON control bits PTMOD<1:0> = 10. Only
edge-aligned outputs may be produced in the
Single-Pulse mode. In Single-Pulse mode, the PWM
I/O pin(s) are driven to the active state when the PTEN
bit is set. When a match with a Duty Cycle register
occurs, the PWM I/O pin is driven to the inactive state.
When a match with the PTPER register occurs, the
PTMR register is cleared, all active PWM I/O pins are
driven to the inactive state, the PTEN bit is cleared and
an interrupt is generated.
15.10 PWM Output Override
The PWM output override bits allow the user to
manually drive the PWM I/O pins to specified logic
states, independent of the duty cycle comparison units.
All control bits associated with the PWM output
override function are contained in the OVDCON
register. The upper half of the OVDCON register
contains eight bits, POVDxH<4:1> and POVDxL<4:1>,
that determine which PWM I/O pins will be overridden.
The lower half of the OVDCON register contains eight
bits, POUTxH<4:1> and POUTxL<4:1>, that determine
the state of the PWM I/O pins when a particular output
is overridden via the POVD bits.
15.10.1 COMPLEMENTARY OUTPUT MODE
When a PWMxL pin is driven active via the OVDCON
register, the output signal is forced to be the
complement of the corresponding PWMxH pin in the
pair. Dead-time insertion is still performed when PWM
channels are overridden manually.
15.10.2 OVERRIDE SYNCHRONIZATION
If the OSYNC bit in the PWMCON2 register is set, all
output overrides performed via the OVDCON register
are synchronized to the PWM time base. Synchronous
output overrides occur at the following times:
Edge-Aligned mode, when PTMR is zero.
Center-Aligned modes, when PTMR is zero and
when the value of PTMR matches PTPER.
Duty Cycle Generator
PWMxH
PWMxL
Time selected by DTSxA bit (A or B) Time selected by DTSxI bit (A or B)
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DS70149D-page 102 © 2008 Microchip Technology Inc.
15.11 PWM Output and Polarity Control
There are three device Configuration bits associated
with the PWM module that provide PWM output pin
control:
HPOL Configuration bit
LPOL Configuration bit
PWMPIN Configuration bit
These three bits in the FBORPOR Configuration
register (see Section 20.6 “Device Configuration
Registers”) work in conjunction with the four PWM
Enable bits (PWMEN<4:1>) located in the PWMCON1
SFR. The Configuration bits and PWM enable bits
ensure that the PWM pins are in the correct states after
a device Reset occurs. The PWMPIN configuration
fuse allows the PWM module outputs to be optionally
enabled on a device Reset. If PWMPIN = 0, the PWM
outputs will be driven to their inactive states at Reset. If
PWMPIN = 1 (default), the PWM outputs will be
tri-stated. The HPOL bit specifies the polarity for the
PWMxH outputs, whereas the LPOL bit specifies the
polarity for the PWMxL outputs.
15.11.1 OUTPUT PIN CONTROL
The PENxH and PENxL control bits in the PWMCON1
SFR enable each high PWM output pin and each low
PWM output pin, respectively. If a particular PWM out-
put pin is not enabled, it is treated as a general purpose
I/O pin.
15.12 PWM FAULT Pins
There are two Fault pins (FLTA and FLTB) associated
with the PWM module. When asserted, these pins can
optionally drive each of the PWM I/O pins to a defined
state.
15.12.1 FAULT PIN ENABLE BITS
The FLTACON and FLTBCON SFRs each have 4 con-
trol bits that determine whether a particular pair of
PWM I/O pins is to be controlled by the Fault input pin.
To enable a specific PWM I/O pin pair for Fault over-
rides, the corresponding bit should be set in the
FLTACON or FLTBCON register.
If all enable bits are cleared in the FLTACON or
FLTBCON registers, then the corresponding Fault input
pin has no effect on the PWM module and the pin may
be used as a general purpose interrupt or I/O pin.
15.12.2 FAULT STATES
The FLTACON and FLTBCON Special Function Regis-
ters have 8 bits each that determine the state of each
PWM I/O pin when it is overridden by a Fault input.
When these bits are cleared, the PWM I/O pin is driven
to the inactive state. If the bit is set, the PWM I/O pin
will be driven to the active state. The active and inactive
states are referenced to the polarity defined for each
PWM I/O pin (HPOL and LPOL polarity control bits).
A special case exists when a PWM module I/O pair is
in the Complementary mode and both pins are
programmed to be active on a Fault condition. The
PWMxH pin always has priority in the Complementary
mode, so that both I/O pins cannot be driven active
simultaneously.
15.12.3 FAULT PIN PRIORITY
If both Fault input pins have been assigned to control a
particular PWM I/O pin, the Fault state programmed for
the Fault A input pin will take priority over the Fault B
input pin.
15.12.4 FAULT INPUT MODES
Each of the Fault input pins has two modes of
operation:
Latched Mode: When the Fault pin is driven low,
the PWM outputs will go to the states defined in
the FLTACON/FLTBCON register. The PWM
outputs will remain in this state until the Fault pin
is driven high and the corresponding interrupt flag
has been cleared in software. When both of these
actions have occurred, the PWM outputs will
return to normal operation at the beginning of the
next PWM cycle or half-cycle boundary. If the
interrupt flag is cleared before the Fault condition
ends, the PWM module will wait until the Fault pin
is no longer asserted, to restore the outputs.
Cycle-by-Cycle Mode: When the Fault input pin
is driven low, the PWM outputs remain in the
defined Fault states for as long as the Fault pin is
held low. After the Fault pin is driven high, the
PWM outputs return to normal operation at the
beginning of the following PWM cycle or
half-cycle boundary.
The operating mode for each Fault input pin is selected
using the FLTAM and FLTBM control bits in the
FLTACON and FLTBCON Special Function Registers.
Each of the Fault pins can be controlled manually in
software.
Note: The Fault pin logic can operate
independent of the PWM logic. If all the
enable bits in the FLTACON/FLTBCON
registers are cleared, then the Fault pin(s)
could be used as general purpose
interrupt pin(s). Each Fault pin has an
interrupt vector, interrupt flag bit and
interrupt priority bits associated with it.
© 2008 Microchip Technology Inc. DS70149D-page 103
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15.13 PWM Update Lockout
For a complex PWM application, the user may need to
write up to four Duty Cycle registers and the Time Base
Period register, PTPER, at a given time. In some appli-
cations, it is important that all buffer registers be written
before the new duty cycle and period values are loaded
for use by the module.
The PWM update lockout feature is enabled by setting
the UDIS control bit and clearing the IUE control bit in
the PWMCON2 SFR. The UDIS bit affects all Duty
Cycle Buffer registers and the PWM time base period
buffer, PTPER. No duty cycle changes or period value
changes will have effect while UDIS = 1.
If the IUE bit is set, any change to the Duty Cycle
registers is immediately updated regardless of the bit
state of the UDI. The PWM Period register update
(PTPER) is not affected by the IUE control bit.
15.14 PWM Special Event Trigger
The PWM module has a special event trigger that
allows A/D conversions to be synchronized to the PWM
time base. The A/D sampling and conversion time may
be programmed to occur at any point within the PWM
period. The special event trigger allows the user to
minimize the delay between the time when A/D conver-
sion results are acquired and the time when the duty
cycle value is updated.
The PWM special event trigger has an SFR named
SEVTCMP, and five control bits to control its operation.
The PTMR value for which a special event trigger
should occur is loaded into the SEVTCMP register.
When the PWM time base is in an Up/Down Counting
mode, an additional control bit is required to specify the
counting phase for the special event trigger. The count
phase is selected using the SEVTDIR control bit in the
SEVTCMP SFR. If the SEVTDIR bit is cleared, the
special event trigger will occur on the upward counting
cycle of the PWM time base. If the SEVTDIR bit is set,
the special event trigger will occur on the downward
count cycle of the PWM time base. The SEVTDIR
control bit has no effect unless the PWM time base is
configured for an Up/Down Counting mode.
15.14.1 SPECIAL EVENT TRIGGER
POSTSCALER
The PWM special event trigger has a postscaler that
allows a 1:1 to 1:16 postscale ratio. The postscaler is
configured by writing the SEVOPS<3:0> control bits in
the PWMCON2 SFR.
The special event output postscaler is cleared on the
following events:
Any write to the SEVTCMP register
Any device Reset
15.15 PWM Operation During CPU Sleep
Mode
The Fault A and Fault B input pins have the ability to
wake the CPU from Sleep mode. The PWM module
generates an interrupt if either of the Fault pins is
driven low while in Sleep.
15.16 PWM Operation During CPU Idle
Mode
The PTCON SFR contains a PTSIDL control bit. This
bit determines if the PWM module will continue to
operate or stop when the device enters Idle mode. If
PTSIDL = 0, the module will continue to operate. If
PTSIDL = 1, the module will stop operation as long as
the CPU remains in Idle mode.
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DS70149D-page 104 © 2008 Microchip Technology Inc.
TABLE 15-2: 8-OUTPUT PWM REGISTER MAP(1)
SFR Name Addr Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
PTCON 01C0 PTEN —PTSIDL———— PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000
PTMR 01C2 PTDIR PWM Timer Count Value 0000 0000 0000 0000
PTPER 01C4 PWM Time Base Period Register 0111 1111 1111 1111
SEVTCMP 01C6 SEVTDIR PWM Special Event Compare Register 0000 0000 0000 0000
PWMCON1 01C8 PTMOD4 PTMOD3 PTMOD2 PTMOD1 PEN4H PEN3H PEN2H PEN1H PEN4L PEN3L PEN2L PEN1L 0000 0000 1111 1111
PWMCON2 01CA SEVOPS<3:0> IUE OSYNC UDIS 0000 0000 0000 0000
DTCON1 01CC DTBPS<1:0> Dead-Time B Value DTAPS<1:0> Dead-Time A Value 0000 0000 0000 0000
DTCON2 01CE DTS4A DTS4I DTS3A DTS3I DTS2A DTS2I DTS1A DTS1I 0000 0000 0000 0000
FLTACON 01D0 FAOV4H FAOV4L FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM FAEN4 FAEN3 FAEN2 FAEN1 0000 0000 0000 0000
FLTBCON 01D2 FBOV4H FBOV4L FBOV3H FBOV3L FBOV2H FBOV2L FBOV1H FBOV1L FLTBM FBEN4 FBEN3 FBEN2 FBEN1 0000 0000 0000 0000
OVDCON 01D4 POVD4H POVD4L POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L POUT4H POUT4L POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000
PDC1 01D6 PWM Duty Cycle 1 Register 0000 0000 0000 0000
PDC2 01D8 PWM Duty Cycle 2 Register 0000 0000 0000 0000
PDC3 01DA PWM Duty Cycle 3 Register 0000 0000 0000 0000
PDC4 01DC PWM Duty Cycle 4 Register 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 105
dsPIC30F5015/5016
16.0 SPI™ MODULE
The Serial Peripheral Interface (SPI™) module is a
synchronous serial interface. It is useful for
communicating with other peripheral devices such as
EEPROMs, shift registers, display drivers and A/D
converters, or other microcontrollers. It is compatible
with Motorola’s SPI and SIOP interfaces.
16.1 Operating Function Description
Each SPI module consists of a 16-bit Shift register,
SPIxSR (where x = 1 or 2), used for shifting data in
and out, and a Buffer register, SPIxBUF. A Control
register, SPIxCON, configures the module.
Additionally, a status register, SPIxSTAT, indicates
various status conditions.
The serial interface consists of 4 pins: SDIx (serial
data input), SDOx (serial data output), SCKx (shift
clock input or output), and SSx (active-low slave
select).
In Master mode operation, SCK is a clock output, but
in Slave mode, it is a clock input.
A series of eight (8) or sixteen (16) clock pulses shifts
out bits from the SPIxSR to SDOx pin and
simultaneously shifts in data from SDIx pin. An
interrupt is generated when the transfer is complete
and the corresponding Interrupt Flag bit (SPI1IF or
SPI2IF) is set. This interrupt can be disabled through
an Interrupt Enable bit (SPI1IE or SPI2IE).
The receive operation is double-buffered. When a
complete byte is received, it is transferred from
SPIxSR to SPIxBUF.
If the receive buffer is full when new data is being
transferred from SPIxSR to SPIxBUF, the module will
set the SPIROV bit, indicating an overflow condition.
The transfer of the data from SPIxSR to SPIxBUF will
not be completed and the new data will be lost. The
module will not respond to SCL transitions while
SPIROV is ‘1’, effectively disabling the module until
SPIxBUF is read by user software.
Transmit writes are also double-buffered. The user
writes to SPIxBUF. When the master or slave transfer
is completed, the contents of the Shift register
(SPIxSR) is moved to the receive buffer. If any
transmit data has been written to the Buffer register,
the contents of the transmit buffer are moved to
SPIxSR. The received data is thus placed in SPIxBUF
and the transmit data in SPIxSR is ready for the next
transfer.
In Master mode, the clock is generated by prescaling
the system clock. Data is transmitted as soon as a
value is written to SPIxBUF. The interrupt is generated
at the middle of the transfer of the last bit.
In Slave mode, data is transmitted and received as
external clock pulses appear on SCK. Again, the
interrupt is generated when the last bit is latched. If
SSx control is enabled, then transmission and
reception are enabled only when SSx = low. The
SDOx output will be disabled in SSx mode with SSx
high.
The clock provided to the module is (FOSC/4). This
clock is then prescaled by the primary (PPRE<1:0>)
and the secondary (SPRE<2:0>) prescale factors. The
CKE bit determines whether transmit occurs on
transition from active clock state to Idle clock state, or
vice versa. The CKP bit selects the Idle state (high or
low) for the clock.
16.1.1 WORD AND BYTE
COMMUNICATION
A control bit, MODE16 (SPIxCON<10>), allows the
module to communicate in either 16-bit or 8-bit mode.
16-bit operation is identical to 8-bit operation, except
that the number of bits transmitted is 16 instead of 8.
The user software must disable the module prior to
changing the MODE16 bit. The SPI module is reset
when the MODE16 bit is changed by the user.
A basic difference between 8-bit and 16-bit operation is
that the data is transmitted out of bit 7 of the SPIxSR for
8-bit operation, and data is transmitted out of bit 15 of
the SPIxSR for 16-bit operation. In both modes, data is
shifted into bit 0 of the SPIxSR.
16.1.2 SDOx DISABLE
A control bit, DISSDO, is provided to the SPIxCON
register to allow the SDOx output to be disabled. This
will allow the SPI module to be connected in an input
only configuration. SDO can also be used for general
purpose I/O.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: The user must perform reads of SPIxBUF
if the module is used in a transmit only
configuration to avoid a receive overflow
condition (SPIROV = 1).
Note: Both the transmit buffer (SPIxTXB) and
the receive buffer (SPIxRXB) are mapped
to the same register address, SPIxBUF.
dsPIC30F5015/5016
DS70149D-page 106 © 2008 Microchip Technology Inc.
FIGURE 16-1: SPI BLOCK DIAGRAM
FIGURE 16-2: SPI MASTER/SLAVE CONNECTION
Note: x = 1 or 2.
Read Write
Internal
Data Bus
SDIx
SDOx
SSx
SCKx
SPIxSR
SPIxBUF
bit 0
Shift
clock
Edge
Select
FCY
Primary
1, 4, 16, 64
Enable Master Clock
Prescaler
Secondary
Prescaler
1:1-1:8
SS & FSYNC
Control
Clock
Control
Transmit
SPIxBUF
Receive
Serial Input Buffer
(SPIxBUF)
Shift Register
(SPIxSR)
MSb LSb
SDOx
SDIx
PROCESSOR 1
SCKx
SPI Master
Serial Input Buffer
(SPIyBUF)
Shift Register
(SPIySR)
LSb
MSb
SDIy
SDOy
PROCESSOR 2
SCKy
SPI Slave
Serial Clock
Note: x = 1 or 2, y = 1 or 2.
© 2008 Microchip Technology Inc. DS70149D-page 107
dsPIC30F5015/5016
16.2 Framed SPI Support
The module supports a basic framed SPI protocol in
Master or Slave mode. The control bit FRMEN enables
framed SPI support and causes the SSx pin to perform
the frame synchronization pulse (FSYNC) function.
The control bit, SPIFSD, determines whether the SSx
pin is an input or an output (i.e., whether the module
receives or generates the frame synchronization
pulse). The frame pulse is an active-high pulse for a
single SPI clock cycle. When frame synchronization is
enabled, the data transmission starts only on the
subsequent transmit edge of the SPI clock.
16.3 Slave Select Synchronization
The SSx pin allows a Synchronous Slave mode. The
SPI must be configured in SPI Slave mode, with SSx
pin control enabled (SSEN = 1). When the SSx pin is
low, transmission and reception are enabled, and the
SDOx pin is driven. When SSx pin goes high, the SDOx
pin is no longer driven. Also, the SPI module is
re-synchronized, and all counters/control circuitry are
reset. Therefore, when the SSx pin is asserted low
again, transmission/reception will begin at the MSb,
even if SSx had been deasserted in the middle of a
transmit/receive.
16.4 SPI Operation During CPU Sleep
Mode
During Sleep mode, the SPI module is shutdown. If the
CPU enters Sleep mode while an SPI transaction is in
progress, then the transmission and reception is
aborted.
The transmitter and receiver will stop in Sleep mode.
However, register contents are not affected by
entering or exiting Sleep mode.
16.5 SPI Operation During CPU Idle
Mode
When the device enters Idle mode, all clock sources
remain functional. The SPISIDL bit (SPIxSTAT<13>)
selects if the SPI module will stop or continue on Idle.
If SPISIDL = 0, the module will continue to operate
when the CPU enters Idle mode. If SPISIDL = 1, the
module will stop when the CPU enters Idle mode.
dsPIC30F5015/5016
DS70149D-page 108 © 2008 Microchip Technology Inc.
TABLE 16-1: SPI1 REGISTER MAP(1)
TABLE 16-2: SPI2 REGISTER MAP(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
SPI1STAT 0220 SPIEN SPISIDL —SPIROV SPITBF SPIRBF 0000 0000 0000 0000
SPI1CON 0222 FRMEN SPIFSD DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
SPI2STAT 0226 SPIEN SPISIDL —SPIROV SPITBF SPIRBF 0000 0000 0000 0000
SPI2CON 0228 FRMEN SPIFSD DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000
SPI2BUF 022A Transmit and Receive Buffer 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 109
dsPIC30F5015/5016
17.0 I2C™ MODULE
The Inter-Integrated Circuit (I2C™) module provides
complete hardware support for both Slave and
Multi-Master modes of the I2C serial communication
standard, with a 16-bit interface.
This module offers the following key features:
•I
2C interface supporting both Master and Slave
operation.
•I
2C Slave mode supports 7 and 10-bit address.
•I
2C Master mode supports 7 and 10-bit address.
•I
2C port allows bidirectional transfers between
master and slaves.
Serial clock synchronization for I2C port can be
used as a handshake mechanism to suspend and
resume serial transfer (SCLREL control).
•I
2C supports Multi-Master operation; detects bus
collision and will arbitrate accordingly.
17.1 Operating Function Description
The hardware fully implements all the master and slave
functions of the I2C Standard and Fast mode
specifications, as well as 7 and 10-bit addressing.
Thus, the I2C module can operate either as a slave or
a master on an I2C bus.
17.1.1 VARIOUS I2C MODES
The following types of I2C operation are supported:
•I
2C Slave operation with 7-bit address
•I
2C Slave operation with 10-bit address
•I
2C Master operation with 7 or 10-bit address
See the I2C programmer’s model in Figure 17-1.
17.1.2 PIN CONFIGURATION IN I2C MODE
I2C has a 2-pin interface; pin SCL is clock and pin SDA
is data.
17.1.3 I2C REGISTERS
I2CCON and I2CSTAT are control and status registers,
respectively. The I2CCON register is readable and writ-
able. The lower 6 bits of I2CSTAT are read-only. The
remaining bits of the I2CSTAT are read/write.
I2CRSR is the Shift register used for shifting data,
whereas I2CRCV is the Buffer register to which data
bytes are written, or from which data bytes are read.
I2CRCV is the Receive buffer, as shown in Figure 16-1.
I2CTRN is the Transmit register to which bytes are
written during a transmit operation, as shown in
Figure 16-2.
The I2CADD register holds the slave address. A Status
bit, ADD10, indicates 10-bit Address mode. The
I2CBRG acts as the Baud Rate Generator (BRG)
reload value.
In receive operations, I2CRSR and I2CRCV together
form a double-buffered receiver. When I2CRSR receives
a complete byte, it is transferred to I2CRCV and an
interrupt pulse is generated. During transmission, the
I2CTRN is not double-buffered.
FIGURE 17-1: PROGRAMMER’S MODEL
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Note: Following a Restart condition in 10-bit
mode, the user only needs to match the
first 7-bit address.
bit 7 bit 0
I2CRCV (8 bits)
bit 7 bit 0
I2CTRN (8 bits)
bit 8 bit 0
I2CBRG (9 bits)
bit 15 bit 0
I2CCON (16 bits)
bit 15 bit 0
I2CSTAT (16 bits)
bit 9 bit 0
I2CADD (10 bits)
dsPIC30F5015/5016
DS70149D-page 110 © 2008 Microchip Technology Inc.
FIGURE 17-2: I2C™ BLOCK DIAGRAM
I2CRSR
I2CRCV
Internal
Data Bus
SCL
SDA
Shift
Match Detect
I2CADD
Start and
Stop bit Detect
Clock
Addr_Match
Clock
Stretching
I2CTRN
LSB
Shift
Clock
Write
Read
BRG Down I2CBRG
Reload
Control
FCY
Start, Restart,
Stop bit Generate
Write
Read
Acknowledge
Generation
Collision
Detect
Write
Read
Write
Read
I2CCON
Write
Read
I2CSTAT
Control Logic
Read
LSB
Counter
© 2008 Microchip Technology Inc. DS70149D-page 111
dsPIC30F5015/5016
17.2 I2C Module Addresses
The I2CADD register contains the Slave mode
addresses. The register is a 10-bit register.
If the A10M bit (I2CCON<10>) is ‘0’, the address is
interpreted by the module as a 7-bit address. When an
address is received, it is compared to the 7 LSbs of the
I2CADD register.
If the A10M bit is ‘1’, the address is assumed to be a
10-bit address. When an address is received, it is
compared with the binary value 1 1 1 1 0 A9 A8
(where A9, A8 are two Most Significant bits of
I2CADD). If that value matches, the next address is
compared with the Least Significant 8 bits of I2CADD,
as specified in the 10-bit addressing protocol.
TABLE 17-1: 7-BIT I2C™ SLAVE
ADDRESSES SUPPORTED BY
DSPIC30F
17.3 I2C 7-bit Slave Mode Operation
Once enabled (I2CEN = 1), the slave module will wait
for a Start bit to occur (i.e., the I2C module is ‘Idle’).
Following the detection of a Start bit, 8 bits are shifted
into I2CRSR and the address is compared against
I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>
are compared against I2CRSR<7:1> and I2CRSR<0>
is the R_W bit. All incoming bits are sampled on the
rising edge of SCL.
If an address match occurs, an Acknowledgement will
be sent, and the Slave Event Interrupt Flag (SI2CIF) is
set on the falling edge of the ninth (ACK) bit. The
address match does not affect the contents of the
I2CRCV buffer or the RBF bit.
17.3.1 SLAVE TRANSMISSION
If the R_W bit received is a ‘1’, then the serial port will
go into Transmit mode. It will send ACK on the ninth bit
and then hold SCL to ‘0’ until the CPU responds by
writing to I2CTRN. SCL is released by setting the
SCLREL bit, and 8 bits of data are shifted out. Data bits
are shifted out on the falling edge of SCL, such that
SDA is valid during SCL high (see timing diagram). The
interrupt pulse is sent on the falling edge of the ninth
clock pulse, regardless of the status of the ACK
received from the master.
17.3.2 SLAVE RECEPTION
If the R_W bit received is a ‘0’ during an address
match, then Receive mode is initiated. Incoming bits
are sampled on the rising edge of SCL. After 8 bits are
received, if I2CRCV is not full or I2COV is not set,
I2CRSR is transferred to I2CRCV. ACK is sent on the
ninth clock.
If the RBF flag is set, indicating that I2CRCV is still
holding data from a previous operation (RBF = 1), then
ACK is not sent; however, the interrupt pulse is gener-
ated. In the case of an overflow, the contents of the
I2CRSR are not loaded into the I2CRCV.
17.4 I2C 10-bit Slave Mode Operation
In 10-bit mode, the basic receive and transmit opera-
tions are the same as in the 7-bit mode. However, the
criteria for address match is more complex.
The I2C specification dictates that a slave must be
addressed for a write operation, with two address bytes
following a Start bit.
The A10M bit is a control bit that signifies that the
address in I2CADD is a 10-bit address rather than a
7-bit address. The address detection protocol for the
first byte of a message address is identical for 7-bit
and 10-bit messages, but the bits being compared are
different.
I2CADD holds the entire 10-bit address. Upon
receiving an address following a Start bit, I2CRSR
<7:3> is compared against a literal ‘11110’ (the default
10-bit address) and I2CRSR<2:1> are compared
against I2CADD<9:8>. If a match occurs and if
R_W = 0, the interrupt pulse is sent. The ADD10 bit will
be cleared to indicate a partial address match. If a
match fails or R_W = 1, the ADD10 bit is cleared and
the module returns to the Idle state.
The low byte of the address is then received and
compared with I2CADD<7:0>. If an address match
occurs, the interrupt pulse is generated and the ADD10
bit is set, indicating a complete 10-bit address match. If
an address match did not occur, the ADD10 bit is
cleared and the module returns to the Idle state.
0x00 General call address or start byte
0x01-0x03 Reserved
0x04-0x07 HS mode Master codes
0x08-0x77 Valid 7-bit addresses
0x78-0x7b Valid 10-bit addresses
(lower 7 bits)
0x7c-0x7f Reserved
Note: The I2CRCV will be loaded if the I2COV
bit = 1 and the RBF flag = 0. In this case,
a read of the I2CRCV was performed, but
the user did not clear the state of the
I2COV bit before the next receive
occurred. The Acknowledgement is not
sent (ACK = 1) and the I2CRCV is
updated.
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DS70149D-page 112 © 2008 Microchip Technology Inc.
17.4.1 10-BIT MODE SLAVE
TRANSMISSION
Once a slave is addressed in this fashion, with the full
10-bit address (we will refer to this state as
“PRIOR_ADDR_MATCH”), the master can begin
sending data bytes for a slave reception operation.
17.4.2 10-BIT MODE SLAVE RECEPTION
Once addressed, the master can generate a Repeated
Start, reset the high byte of the address and set the
R_W bit without generating a Stop bit, thus initiating a
slave transmit operation.
17.5 Automatic Clock Stretch
In the slave modes, the module can synchronize buffer
reads and write to the master device by clock
stretching.
17.5.1 TRANSMIT CLOCK STRETCHING
Both 10-bit and 7-bit transmit modes implement clock
stretching by asserting the SCLREL bit after the falling
edge of the ninth clock if the TBF bit is cleared,
indicating the buffer is empty.
In slave transmit modes, clock stretching is always
performed, irrespective of the STREN bit.
Clock synchronization takes place following the ninth
clock of the transmit sequence. If the device samples
an ACK on the falling edge of the ninth clock, and if the
TBF bit is still clear, then the SCLREL bit is
automatically cleared. The SCLREL being cleared to
0’ will assert the SCL line low. The user’s ISR must
set the SCLREL bit before transmission is allowed to
continue. By holding the SCL line low, the user has
time to service the ISR and load the contents of the
I2CTRN before the master device can initiate another
transmit sequence.
17.5.2 RECEIVE CLOCK STRETCHING
The STREN bit in the I2CCON register can be used to
enable clock stretching in Slave Receive mode. When
the STREN bit is set, the SCL pin will be held low at
the end of each data receive sequence.
17.5.3 CLOCK STRETCHING DURING
7-BIT ADDRESSING (STREN = 1)
When the STREN bit is set in Slave Receive mode,
the SCL line is held low when the Buffer register is full.
The method for stretching the SCL output is the same
for both 7 and 10-bit addressing modes.
Clock stretching takes place following the ninth clock of
the receive sequence. On the falling edge of the ninth
clock at the end of the ACK sequence, if the RBF bit is
set, the SCLREL bit is automatically cleared, forcing the
SCL output to be held low. The user’s ISR must set the
SCLREL bit before reception is allowed to continue. By
holding the SCL line low, the user has time to service
the ISR and read the contents of the I2CRCV before the
master device can initiate another receive sequence.
This will prevent buffer overruns from occurring.
17.5.4 CLOCK STRETCHING DURING
10-BIT ADDRESSING (STREN = 1)
Clock stretching takes place automatically during the
addressing sequence. Because this module has a
register for the entire address, it is not necessary for
the protocol to wait for the address to be updated.
After the address phase is complete, clock stretching
will occur on each data receive or transmit sequence
as was described earlier.
17.6 Software Controlled Clock
Stretching (STREN = 1)
When the STREN bit is ‘1’, the SCLREL bit may be
cleared by software to allow software to control the
clock stretching. The logic will synchronize writes to
the SCLREL bit with the SCL clock. Clearing the
SCLREL bit will not assert the SCL output until the
module detects a falling edge on the SCL output and
SCL is sampled low. If the SCLREL bit is cleared by
the user while the SCL line has been sampled low, the
SCL output will be asserted (held low). The SCL
output will remain low until the SCLREL bit is set, and
all other devices on the I2C bus have deasserted SCL.
This ensures that a write to the SCLREL bit will not
violate the minimum high time requirement for SCL.
If the STREN bit is ‘0’, a software write to the SCLREL
bit will be disregarded and have no effect on the
SCLREL bit.
Note 1: If the user loads the contents of I2CTRN,
setting the TBF bit before the falling edge
of the ninth clock, the SCLREL bit will not
be cleared and clock stretching will not
occur.
2: The SCLREL bit can be set in software,
regardless of the state of the TBF bit.
Note 1: If the user reads the contents of the
I2CRCV, clearing the RBF bit before the
falling edge of the ninth clock, the
SCLREL bit will not be cleared and clock
stretching will not occur.
2: The SCLREL bit can be set in software,
regardless of the state of the RBF bit. The
user should be careful to clear the RBF bit
in the ISR before the next receive
sequence in order to prevent an overflow
condition.
© 2008 Microchip Technology Inc. DS70149D-page 113
dsPIC30F5015/5016
17.7 Interrupts
The I2C module generates two interrupt flags, MI2CIF
(I2C Master Interrupt Flag) and SI2CIF (I2C Slave
Interrupt Flag). The MI2CIF interrupt flag is activated
on completion of a master message event. The SI2CIF
interrupt flag is activated on detection of a message
directed to the slave.
17.8 Slope Control
The I2C standard requires slope control on the SDA
and SCL signals for Fast Mode (400 kHz). The control
bit, DISSLW, enables the user to disable slew rate
control, if desired. It is necessary to disable the slew
rate control for 1 MHz mode.
17.9 IPMI Support
The control bit, IPMIEN, enables the module to support
Intelligent Peripheral Management Interface (IPMI).
When this bit is set, the module accepts and acts upon
all addresses.
17.10 General Call Address Support
The general call address can address all devices.
When this address is used, all devices should, in
theory, respond with an Acknowledgement.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all ‘0’s with R_W = 0.
The general call address is recognized when the General
Call Enable (GCEN) bit is set (I2CCON<7> = 1).
Following a Start bit detection, 8 bits are shifted into
I2CRSR and the address is compared with I2CADD, and
is also compared with the general call address which is
fixed in hardware.
If a general call address match occurs, the I2CRSR is
transferred to the I2CRCV after the eighth clock, the
RBF flag is set, and on the falling edge of the ninth bit
(ACK bit), the master event interrupt flag (MI2CIF) is
set.
When the interrupt is serviced, the source for the inter-
rupt can be checked by reading the contents of the
I2CRCV to determine if the address was device
specific, or a general call address.
17.11 I2C Master Support
As a Master device, six operations are supported.
Assert a Start condition on SDA and SCL.
Assert a Restart condition on SDA and SCL.
Write to the I2CTRN register initiating
transmission of data/address.
Generate a Stop condition on SDA and SCL.
Configure the I2C port to receive data.
Generate an ACK condition at the end of a
received byte of data.
17.12 I2C Master Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the data direction bit. In
this case, the data direction bit (R_W) is logic ‘0’. Serial
data is transmitted 8 bits at a time. After each byte is
transmitted, an ACK bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the data direction bit. In this case, the data
direction bit (R_W) is logic ‘1’. Thus, the first byte
transmitted is a 7-bit slave address, followed by a ‘1’ to
indicate receive bit. Serial data is received via SDA,
while SCL outputs the serial clock. Serial data is
received 8 bits at a time. After each byte is received, an
ACK bit is transmitted. Start and Stop conditions
indicate the beginning and end of transmission.
17.12.1 I2C MASTER TRANSMISSION
Transmission of a data byte, a 7-bit address, or the sec-
ond half of a 10-bit address is accomplished by simply
writing a value to I2CTRN register. The user should
only write to I2CTRN when the module is in a WAIT
state. This action will set the buffer full flag (TBF) and
allow the Baud Rate Generator to begin counting and
start the next transmission. Each bit of address/data
will be shifted out onto the SDA pin after the falling
edge of SCL is asserted. The Transmit Status Flag,
TRSTAT (I2CSTAT<14>), indicates that a master
transmit is in progress.
17.12.2 I2C MASTER RECEPTION
Master mode reception is enabled by programming the
receive enable (RCEN) bit (I2CCON<3>). The I2C
module must be Idle before the RCEN bit is set,
otherwise the RCEN bit will be disregarded. The Baud
Rate Generator begins counting, and on each rollover,
the state of the SCL pin toggles, and data is shifted in
to the I2CRSR on the rising edge of each clock.
17.12.3 BAUD RATE GENERATOR
In I2C Master mode, the reload value for the BRG is
located in the I2CBRG register. When the BRG is
loaded with this value, the BRG counts down to ‘0’ and
stops until another reload has taken place. If clock
arbitration is taking place, for instance, the BRG is
reloaded when the SCL pin is sampled high.
dsPIC30F5015/5016
DS70149D-page 114 © 2008 Microchip Technology Inc.
As per the I2C standard, FSCK may be 100 kHz or
400 kHz. However, the user can specify any baud rate
up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.
EQUATION 17-1: SERIAL CLOCK RATE
17.12.4 CLOCK ARBITRATION
Clock arbitration occurs when the master de-asserts
the SCL pin (SCL allowed to float high) during any
receive, transmit, or Restart/Stop condition. When the
SCL pin is allowed to float high, the Baud Rate
Generator is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of I2CBRG and begins counting. This
ensures that the SCL high time will always be at least
one BRG rollover count in the event that the clock is
held low by an external device.
17.12.5 MULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master operation support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA, by letting SDA float high
while another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA
pin = 0, then a bus collision has taken place. The
master will set the MI2CIF pulse and reset the master
portion of the I2C port to its Idle state.
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the TBF flag is
cleared, the SDA and SCL lines are deasserted, and a
value can now be written to I2CTRN. When the user
services the I2C master event Interrupt Service
Routine, if the I2C bus is free (i.e., the P bit is set), the
user can resume communication by asserting a Start
condition.
If a Start, Restart, Stop or Acknowledge condition was
in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are deas-
serted, and the respective control bits in the I2CCON
register are cleared to ‘0’. When the user services the
bus collision Interrupt Service Routine, and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
The Master will continue to monitor the SDA and SCL
pins, and if a Stop condition occurs, the MI2CIF bit will
be set.
A write to the I2CTRN will start the transmission of data
at the first data bit, regardless of where the transmitter
left off when bus collision occurred.
In a Multi-Master environment, the interrupt generation
on the detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the I2CSTAT
register, or the bus is Idle and the S and P bits are
cleared.
17.13 I2C Module Operation During CPU
Sleep and Idle Modes
17.13.1 I2C OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
Sleep occurs in the middle of a transmission, and the
state machine is partially into a transmission as the
clocks stop, then the transmission is aborted. Similarly,
if Sleep occurs in the middle of a reception, then the
reception is aborted.
17.13.2 I2C OPERATION DURING CPU IDLE
MODE
For the I2C, the I2CSIDL bit selects if the module will
stop on Idle or continue on Idle. If I2CSIDL = 0, the
module will continue operation on assertion of the Idle
mode. If I2CSIDL = 1, the module will stop on Idle.
I2CBRG FCY
FSCL
-------------FCY
1 111 111,,
---------------------------
⎝⎠
⎛⎞
1()=
© 2008 Microchip Technology Inc. DS70149D-page 115
dsPIC30F5015/5016
TABLE 17-2: I2C™ REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
I2CRCV 0200 Receive Register 0000 0000 0000 0000
I2CTRN 0202 Transmit Register 0000 0000 1111 1111
I2CBRG 0204 Baud Rate Generator 0000 0000 0000 0000
I2CCON 0206 I2CEN I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000
I2CSTAT 0208 ACKSTAT TRSTAT BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000
I2CADD 020A Address Register 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 116 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 117
dsPIC30F5015/5016
18.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART) MODULE
This section describes the Universal Asynchronous
Receiver/Transmitter Communications module.
18.1 UART Module Overview
The key features of the UART module are:
Full-duplex, 8 or 9-bit data communication
Even, Odd or No Parity options (for 8-bit data)
One or two Stop bits
Fully integrated Baud Rate Generator with 16-bit
prescaler
Baud rates range from 38 bps to 1.875 Mbps at a
30 MHz instruction rate
4-word deep transmit data buffer
4-word deep receive data buffer
Parity, Framing and Buffer Overrun error
detection
Support for Interrupt only on Address Detect
(9th bit = 1)
Separate Transmit and Receive Interrupts
Loopback mode for diagnostic support
FIGURE 18-1: UART TRANSMITTER BLOCK DIAGRAM
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
Write Write
UTX8 UxTXREG Low Byte
Load TSR
Transmit Control
– Control TSR
– Control Buffer
– Generate Flags
– Generate Interrupt
Control and Status bits
UxTXIF
Data
0’ (Start)
1’ (Stop)
Parity Parity
Generator
Transmit Shift Register (UxTSR)
16 Divider
Control
Signals
16X Baud Clock
from Baud Rate
Generator
Internal Data Bus
UTXBRK
Note: x = 1
UxTX
dsPIC30F5015/5016
DS70149D-page 118 © 2008 Microchip Technology Inc.
FIGURE 18-2: UART RECEIVER BLOCK DIAGRAM
Read
URX8 UxRXREG Low Byte
Load RSR
UxMODE
Receive Buffer Control
– Generate Flags
– Generate Interrupt
UxRXIF
UxRX
· Start bit Detect
Receive Shift Register
16 Divider
Control
Signals
UxSTA
– Shift Data Characters
Read Read
Write Write
to Buffer
8-9
(UxRSR)
PERR
FERR
· Parity Check
· Stop bit Detect
· Shift Clock Generation
· Wake Logic
16
Internal Data Bus
1
0
LPBACK
From UxTX
16x Baud Clock from
Baud Rate Generator
Note: x = 1
© 2008 Microchip Technology Inc. DS70149D-page 119
dsPIC30F5015/5016
18.2 Enabling and Setting Up UART
18.2.1 ENABLING THE UART
The UART module is enabled by setting the UARTEN
bit in the UxMODE register (where x = 1). Once
enabled, the UxTX and UxRX pins are configured as an
output and an input respectively, overriding the TRIS
and LATCH register bit settings for the corresponding
I/O port pins. The UxTX pin is at logic ‘1’ when no
transmission is taking place.
18.2.2 DISABLING THE UART
The UART module is disabled by clearing the
UARTEN bit in the UxMODE register. This is the
default state after any Reset. If the UART is disabled,
all I/O pins operate as port pins under the control of
the latch and TRIS bits of the corresponding port pins.
Disabling the UART module resets the buffers to
empty states. Any data characters in the buffers are
lost, and the baud rate counter is reset.
All error and status flags associated with the UART
module are reset when the module is disabled. The
URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and
UTXBF bits are cleared, whereas RIDLE and TRMT
are set. Other control bits, including ADDEN,
URXISEL<1:0>, UTXISEL, as well as the UxMODE
and UxBRG registers, are not affected.
Clearing the UARTEN bit while the UART is active will
abort all pending transmissions and receptions and
reset the module as defined above. Re-enabling the
UART will restart the UART in the same configuration.
18.2.3 SETTING UP DATA, PARITY AND
STOP BIT SELECTIONS
Control bits, PDSEL<1:0>, in the UxMODE register are
used to select the data length and parity used in the
transmission. The data length may either be 8 bits with
even, odd or no parity, or 9 bits with no parity.
The STSEL bit determines whether one or two Stop bits
will be used during data transmission.
The default (Power-on) setting of the UART is 8 bits, no
parity, 1 Stop bit (typically represented as 8, N, 1).
18.3 Transmitting Data
18.3.1 TRANSMITTING IN 8-BIT DATA
MODE
The following steps must be performed in order to
transmit 8-bit data:
1. Set up the UART:
First, the data length, parity and number of Stop
bits must be selected. Then, the Transmit and
Receive Interrupt enable and priority bits are
setup in the UxMODE and UxSTA registers.
Also, the appropriate baud rate value must be
written to the UxBRG register.
2. Enable the UART by setting the UARTEN bit
(UxMODE<15>).
3. Set the UTXEN bit (UxSTA<10>), thereby
enabling a transmission.
4. Write the byte to be transmitted to the lower byte
of UxTXREG. The value will be transferred to the
Transmit Shift register (UxTSR) immediately
and the serial bit stream will start shifting out
during the next rising edge of the baud clock.
Alternatively, the data byte may be written while
UTXEN = 0, following which, the user may set
UTXEN. This will cause the serial bit stream to
begin immediately because the baud clock will
start from a cleared state.
5. A Transmit interrupt will be generated depend-
ing on the value of the interrupt control bit
UTXISEL (UxSTA<15>).
18.3.2 TRANSMITTING IN 9-BIT DATA
MODE
The sequence of steps involved in the transmission of
9-bit data is similar to 8-bit transmission, except that a
16-bit data word (of which the upper 7 bits are always
clear) must be written to the UxTXREG register.
18.3.3 TRANSMIT BUFFER (UXTXB)
The transmit buffer is 9 bits wide and 4 characters
deep. Including the Transmit Shift register (UxTSR),
the user effectively has a 5-deep FIFO (First-In,
First-Out) buffer. The UTXBF Status bit (UxSTA<9>)
indicates whether the transmit buffer is full.
If a user attempts to write to a full buffer, the new data
will not be accepted into the FIFO, and no data shift
will occur within the buffer. This enables recovery from
a buffer overrun condition.
The FIFO is reset during any device Reset, but is not
affected when the device enters or wakes up from a
Power-Saving mode.
Note: The UTXEN bit must be set after the
UARTEN bit is set to enable UART
transmissions.
dsPIC30F5015/5016
DS70149D-page 120 © 2008 Microchip Technology Inc.
18.3.4 TRANSMIT INTERRUPT
The transmit interrupt flag (U1TXIF) is located in the
corresponding Interrupt Flag register.
The transmitter generates an edge to set the UxTXIF
bit. The condition for generating the interrupt depends
on UTXISEL control bit:
a) If UTXISEL = 0, an interrupt is generated when
a word is transferred from the Transmit buffer to
the Transmit Shift register (UxTSR). This implies
that the transmit buffer has at least one empty
word.
b) If UTXISEL = 1, an interrupt is generated when
a word is transferred from the Transmit buffer to
the Transmit Shift register (UxTSR) and the
Transmit buffer is empty.
Switching between the two interrupt modes during
operation is possible and sometimes offers more
flexibility.
18.3.5 TRANSMIT BREAK
Setting the UTXBRK bit (UxSTA<11>) will cause the
UxTX line to be driven to logic ‘0’. The UTXBRK bit
overrides all transmission activity. Therefore, the user
should generally wait for the transmitter to be Idle
before setting UTXBRK.
To send a break character, the UTXBRK bit must be
set by software and must remain set for a minimum of
13 baud clock cycles. The UTXBRK bit is then cleared
by software to generate Stop bits. The user must wait
for a duration of at least one or two baud clock cycles
in order to ensure a valid Stop bit(s) before reloading
the UxTXB or starting other transmitter activity.
Transmission of a break character does not generate a
transmit interrupt.
18.4 Receiving Data
18.4.1 RECEIVING IN 8-BIT OR 9-BIT DATA
MODE
The following steps must be performed while receiving
8-bit or 9-bit data:
1. Set up the UART (see Section 18.3.1
“Transmitting in 8-bit Data Mode”).
2. Enable the UART (see Section 18.3.1
“Transmitting in 8-bit Data Mode”).
3. A receive interrupt will be generated when one
or more data words have been received,
depending on the receive interrupt settings
specified by the URXISEL bits (UxSTA<7:6>).
4. Read the OERR bit to determine if an overrun
error has occurred. The OERR bit must be reset
in software.
5. Read the received data from UxRXREG. The act
of reading UxRXREG will move the next word to
the top of the receive FIFO, and the PERR and
FERR values will be updated.
18.4.2 RECEIVE BUFFER (UXRXB)
The receive buffer is 4 words deep. Including the
Receive Shift register (UxRSR), the user effectively
has a 5-word deep FIFO buffer.
URXDA (UxSTA<0>) = 1 indicates that the receive
buffer has data available. URXDA = 0 implies that the
buffer is empty. If a user attempts to read an empty
buffer, the old values in the buffer will be read and no
data shift will occur within the FIFO.
The FIFO is reset during any device Reset. It is not
affected when the device enters or wakes up from a
Power-Saving mode.
18.4.3 RECEIVE INTERRUPT
The receive interrupt flag (U1RXIF or U2RXIF) can be
read from the corresponding Interrupt Flag register.
The interrupt flag is set by an edge generated by the
receiver. The condition for setting the receive interrupt
flag depends on the settings specified by the
URXISEL<1:0> (UxSTA<7:6>) control bits.
a) If URXISEL<1:0> = 00 or 01, an interrupt is
generated every time a data word is transferred
from the Receive Shift register (UxRSR) to the
Receive Buffer. There may be one or more
characters in the receive buffer.
b) If URXISEL<1:0> = 10, an interrupt is generated
when a word is transferred from the Receive
Shift register (UxRSR) to the Receive Buffer,
which, as a result of the transfer, contains
3 characters.
c) If URXISEL<1:0> = 11, an interrupt is set when
a word is transferred from the Receive Shift reg-
ister (UxRSR) to the Receive Buffer, which, as a
result of the transfer, contains 4 characters (i.e.,
becomes full).
Switching between the Interrupt modes during opera-
tion is possible, though generally not advisable during
normal operation.
18.5 Reception Error Handling
18.5.1 RECEIVE BUFFER OVERRUN
ERROR (OERR BIT)
The OERR bit (UxSTA<1>) is set if all of the following
conditions occur:
a) The receive buffer is full.
b) The Receive Shift register is full, but unable to
transfer the character to the receive buffer.
c) The Stop bit of the character in the UxRSR is
detected, indicating that the UxRSR needs to
transfer the character to the buffer.
Once OERR is set, no further data is shifted in UxRSR
(until the OERR bit is cleared in software or a Reset
occurs). The data held in UxRSR and UxRXREG
remains valid.
© 2008 Microchip Technology Inc. DS70149D-page 121
dsPIC30F5015/5016
18.5.2 FRAMING ERROR (FERR BIT)
The FERR bit (UxSTA<2>) is set if a ‘0’ is detected
instead of a Stop bit. If two Stop bits are selected, both
Stop bits must be ‘1’, otherwise FERR will be set. The
read-only FERR bit is buffered along with the received
data. It is cleared on any Reset.
18.5.3 PARITY ERROR (PERR BIT)
The PERR bit (UxSTA<3>) is set if the parity of the
received word is incorrect. This error bit is applicable
only if a Parity mode (odd or even) is selected. The
read-only PERR bit is buffered along with the received
data bytes. It is cleared on any Reset.
18.5.4 IDLE STATUS
When the receiver is active (i.e., between the initial
detection of the Start bit and the completion of the Stop
bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the
completion of the Stop bit and detection of the next
Start bit, the RIDLE bit is ‘1’, indicating that the UART
is Idle.
18.5.5 RECEIVE BREAK
The receiver will count and expect a certain number of
bit times based on the values programmed in the
PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)
bits.
If the break is longer than 13 bit times, the reception is
considered complete after the number of bit times
specified by PDSEL and STSEL. The URXDA bit is
set, FERR is set, zeros are loaded into the receive
FIFO, interrupts are generated, if appropriate, and the
RIDLE bit is set.
When the module receives a long break signal and the
receiver has detected the Start bit, the data bits and
the invalid Stop bit (which sets the FERR), the receiver
must wait for a valid Stop bit before looking for the next
Start bit. It cannot assume that the break condition on
the line is the next Start bit.
Break is regarded as a character containing all 0’s,
with the FERR bit set. The break character is loaded
into the buffer. No further reception can occur until a
Stop bit is received. Note that RIDLE goes high when
the Stop bit has not been received yet.
18.6 Address Detect Mode
Setting the ADDEN bit (UxSTA<5>) enables this
special mode, in which a 9th bit (URX8) value of ‘1
identifies the received word as an address rather than
data. This mode is only applicable for 9-bit data
communication. The URXISEL control bit does not
have any impact on interrupt generation in this mode,
since an interrupt (if enabled) will be generated every
time the received word has the 9th bit set.
18.7 Loopback Mode
Setting the LPBACK bit enables this special mode in
which the UxTX pin is internally connected to the UxRX
pin. When configured for the Loopback mode, the
UxRX pin is disconnected from the internal UART
receive logic. However, the UxTX pin still functions as
in a normal operation.
To select this mode:
a) Configure UART for desired mode of operation.
b) Set LPBACK = 1 to enable Loopback mode.
c) Enable transmission as defined in Section 18.3
“Transmitting Data”.
18.8 Baud Rate Generator
The UART has a 16-bit Baud Rate Generator to allow
maximum flexibility in baud rate generation. The Baud
Rate Generator register (UxBRG) is readable and
writable. The baud rate is computed as follows:
BRG = 16-bit value held in UxBRG register
(0 through 65535)
FCY = Instruction Clock Rate (1/TCY)
The Baud Rate is given by Equation 18-1.
EQUATION 18-1: BAUD RATE
Therefore, maximum baud rate possible is
FCY/16 (if BRG = 0),
and the minimum baud rate possible is
FCY/(16 * 65536).
With a full 16-bit Baud Rate Generator, at 30 MIPS
operation, the minimum baud rate achievable is
28.5 bps.
Baud Rate = FCY/(16 * (BRG + 1))
dsPIC30F5015/5016
DS70149D-page 122 © 2008 Microchip Technology Inc.
18.9 Auto-Baud Support
To allow the system to determine baud rates of
received characters, the input can be optionally linked
to a selected capture input. To enable this mode, the
user must program the input capture module to detect
the falling and rising edges of the Start bit.
18.10 UART Operation During CPU
Sleep and Idle Modes
18.10.1 UART OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’. If
entry into Sleep mode occurs while a transmission is
in progress, then the transmission is aborted. The
UxTX pin is driven to logic ‘1’. Similarly, if entry into
Sleep mode occurs while a reception is in progress,
then the reception is aborted. The UxSTA, UxMODE,
transmit and receive registers and buffers, and the
UxBRG register are not affected by Sleep mode.
If the Wake bit (UxMODE<7>) is set before the device
enters Sleep mode, then a falling edge on the UxRX
pin will generate a receive interrupt. The Receive
Interrupt Select Mode bit (URXISEL) has no effect for
this function. If the receive interrupt is enabled, then
this will wake-up the device from Sleep. The UARTEN
bit must be set in order to generate a wake-up
interrupt.
18.10.2 UART OPERATION DURING CPU
IDLE MODE
For the UART, the USIDL bit selects if the module will
stop operation when the device enters Idle mode, or
whether the module will continue on Idle. If USIDL = 0,
the module will continue operation during Idle mode. If
USIDL = 1, the module will stop on Idle.
© 2008 Microchip Technology Inc. DS70149D-page 123
dsPIC30F5015/5016
TABLE 18-1: UART1 REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
U1MODE 020C UARTEN —USIDL WAKE LPBACK ABAUD PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000
U1STA 020E UTXISEL UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000
U1TXREG 0210 UTX8 Transmit Register 0000 000u uuuu uuuu
U1RXREG 0212 URX8 Receive Register 0000 0000 0000 0000
U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 124 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 125
dsPIC30F5015/5016
19.0 CAN MODULE
19.1 Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules or microcontroller devices. This
interface/protocol was designed to allow
communications within noisy environments. Only one
CAN module is available.
The CAN module is a communication controller
implementing the CAN 2.0 A/B protocol, as defined in
the BOSCH specification. The module will support
CAN 1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B
Active versions of the protocol. The module
implementation is a full CAN system. The CAN
specification is not covered within this data sheet. The
reader may refer to the BOSCH CAN specification for
further details.
The module features are as follows:
Implementation of the CAN protocol CAN 1.2,
CAN 2.0A and CAN 2.0B
Standard and extended data frames
0-8 bytes data length
Programmable bit rate up to 1 Mbit/sec
Support for remote frames
Double-buffered receiver with two prioritized
received message storage buffers (each buffer
may contain up to 8 bytes of data)
6 full (standard/extended identifier) acceptance
filters, 2 associated with the high priority receive
buffer, and 4 associated with the low priority
receive buffer
2 full acceptance filter masks, one each associ-
ated with the high and low priority receive buffers
Three transmit buffers with application specified
prioritization and abort capability (each buffer may
contain up to 8 bytes of data)
Programmable wake-up functionality with
integrated low pass filter
Programmable Loopback mode supports self-test
operation
Signaling via interrupt capabilities for all CAN
receiver and transmitter error states
Programmable clock source
Programmable link to timer module for
time-stamping and network synchronization
Low-power Sleep and Idle mode
The CAN bus module consists of a protocol engine,
and message buffering/control. The CAN protocol
engine handles all functions for receiving and
transmitting messages on the CAN bus. Messages are
transmitted by first loading the appropriate data
registers. Status and errors can be checked by reading
the appropriate registers. Any message detected on
the CAN bus is checked for errors and then matched
against filters to see if it should be received and stored
in one of the receive registers.
19.2 Frame Types
The CAN module transmits various types of frames,
which include data messages or remote transmission
requests initiated by the user as other frames that are
automatically generated for control purposes. The
following frame types are supported:
Standard Data Frame
A Standard Data Frame is generated by a node when
the node wishes to transmit data. It includes an 11-bit
Standard Identifier (SID) but not an 18-bit Extended
Identifier (EID).
Extended Data Frame
An Extended Data Frame is similar to a Standard Data
Frame, but includes an Extended Identifier as well.
Remote Frame
It is possible for a destination node to request the data
from the source. For this purpose, the destination node
sends a Remote Frame with an identifier that matches
the identifier of the required Data Frame. The appropri-
ate data source node will then send a Data Frame as a
response to this remote request.
Error Frame
An Error Frame is generated by any node that detects
a bus error. An error frame consists of 2 fields: an Error
Flag field and an Error Delimiter field.
Overload Frame
An Overload Frame can be generated by a node as a
result of 2 conditions. First, the node detects a
dominant bit during lnterframe Space, which is an
illegal condition. Second, due to internal conditions, the
node is not yet able to start reception of the next
message. A node may generate a maximum of 2
sequential Overload Frames to delay the start of the
next message.
Interframe Space
Interframe Space separates a proceeding frame (of
whatever type) from a following Data or Remote
Frame.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 126 © 2008 Microchip Technology Inc.
FIGURE 19-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM
Acceptance Filter
RXF2
R
X
B
1
A
c
c
e
p
t
A
c
c
e
p
t
Identifier
Data Field Data Field
Identifier
Acceptance Mask
RXM1
Acceptance Filter
RXF3
Acceptance Filter
RXF4
Acceptance Filter
RXF5
M
A
B
Acceptance Mask
RXM0
Acceptance Filter
RXF0
Acceptance Filter
RXF1
R
X
B
0
MSGREQ
TXB2
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
Message
Queue
Control Transmit Byte Sequencer
MSGREQ
TXB1
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
MSGREQ
TXB0
TXABT
TXLARB
TXERR
MTXBUFF
MESSAGE
Receive ShiftTransmit Shift
Receive
Error
Transmit
Error
Protocol
RERRCNT
TERRCNT
ErrPas
BusOff
Finite
State
Machine
Counter
Counter
Transmit
Logic
Bit
Timing
Logic
CiTX(1) CiRX(1)
Bit Timing
Generator
PROTOCOL
ENGINE
BUFFERS
CRC Check
CRC Generator
Note 1: i = 1 refers to CAN1 module
© 2008 Microchip Technology Inc. DS70149D-page 127
dsPIC30F5015/5016
19.3 Modes of Operation
The CAN module can operate in one of several operation
modes selected by the user. These modes include:
Initialization Mode
Disable Mode
Normal Operation Mode
Listen-Only Mode
Loopback Mode
Error Recognition Mode
Modes are requested by setting the REQOP<2:0>
bits (CiCTRL<10:8>). Entry into a mode is
acknowledged by monitoring the OPMODE<2:0> bits
(CiCTRL<7:5>). The module will not change the mode
and the OPMODE bits until a change in mode is
acceptable, generally during bus idle time which is
defined as at least 11 consecutive recessive bits.
19.3.1 INITIALIZATION MODE
In the Initialization mode, the module will not transmit or
receive. The error counters are cleared and the inter-
rupt flags remain unchanged. The programmer will
have access to Configuration registers that are access
restricted in other modes. The module will protect the
user from accidentally violating the CAN protocol
through programming errors. All registers which control
the configuration of the module can not be modified
while the module is on-line. The CAN module will not
be allowed to enter the Configuration mode while a
transmission is taking place. The Configuration mode
serves as a lock to protect the following registers:
All Module Control Registers
Baud Rate and Interrupt Configuration Registers
Bus Timing Registers
Identifier Acceptance Filter Registers
Identifier Acceptance Mask Registers
19.3.2 DISABLE MODE
In Disable mode, the module will not transmit or
receive. The module has the ability to set the WAKIF bit
due to bus activity, however any pending interrupts will
remain and the error counters will retain their value.
If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the
module will enter the Module Disable mode. If the mod-
ule is active, the module will wait for 11 recessive bits
on the CAN bus, detect that condition as an idle bus,
then accept the module disable command. When the
OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indi-
cates whether the module successfully went into Mod-
ule Disable mode. The I/O pins will revert to normal I/O
function when the module is in the Module Disable
mode.
The module can be programmed to apply a low-pass
filter function to the CiRX input line while the module or
the CPU is in Sleep mode. The WAKFIL bit
(CiCFG2<14>) enables or disables the filter.
19.3.3 NORMAL OPERATION MODE
Normal Operating mode is selected when
REQOP<2:0> = 000. In this mode, the module is
activated, the I/O pins will assume the CAN bus
functions. The module will transmit and receive CAN
bus messages via the CxTX and CxRX pins.
19.3.4 LISTEN-ONLY MODE
If the Listen-Only mode is activated, the module on the
CAN bus is passive. The transmitter buffers revert to
the Port I/O function. The receive pins remain inputs.
For the receiver, no error flags or Acknowledge signals
are sent. The error counters are deactivated in this
state. The Listen-Only mode can be used for detecting
the baud rate on the CAN bus. To use this, it is neces-
sary that there are at least two further nodes that
communicate with each other.
19.3.5 ERROR RECOGNITION MODE
The module can be set to ignore all errors and receive
any message. The Error Recognition mode is activated
by setting the RXM<1:0> bits (CiRXnCON<6:5>) regis-
ters to ‘11’. In this mode, the data which is in the
message assembly buffer until the time an error
occurred, is copied in the receive buffer and can be
read via the CPU interface.
19.3.6 LOOPBACK MODE
If the Loopback mode is activated, the module will con-
nect the internal transmit signal to the internal receive
signal at the module boundary. The transmit and
receive pins revert to their port I/O function.
Note: Typically, if the CAN module is allowed to
transmit in a particular mode of operation
and a transmission is requested immedi-
ately after the CAN module has been
placed in that mode of operation, the mod-
ule waits for 11 consecutive recessive bits
on the bus before starting transmission. If
the user switches to Disable mode within
this 11-bit period, then this transmission is
aborted and the corresponding TXABT bit
is set and TXREQ bit is cleared.
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DS70149D-page 128 © 2008 Microchip Technology Inc.
19.4 Message Reception
19.4.1 RECEIVE BUFFERS
The CAN bus module has 3 receive buffers. However,
one of the receive buffers is always committed to mon-
itoring the bus for incoming messages. This buffer is
called the Message Assembly Buffer (MAB). So there
are 2 receive buffers visible, RXB0 and RXB1, that can
essentially instantaneously receive a complete
message from the protocol engine.
All messages are assembled by the MAB, and are
transferred to the RXBn buffers only if the acceptance
filter criterion are met. When a message is received,
the RXnIF flag (CiINTF<0> or CiINRF<1>) will be set.
This bit can only be set by the module when a message
is received. The bit is cleared by the CPU when it has
completed processing the message in the buffer. If the
RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an
interrupt will be generated when a message is
received.
RXF0 and RXF1 filters with RXM0 mask are associated
with RXB0. The filters RXF2, RXF3, RXF4, and RXF5
and the mask RXM1 are associated with RXB1.
19.4.2 MESSAGE ACCEPTANCE FILTERS
The message acceptance filters and masks are used to
determine if a message in the message assembly buf-
fer should be loaded into either of the receive buffers.
Once a valid message has been received into the mes-
sage assembly buffer, the identifier fields of the mes-
sage are compared to the filter values. If there is a
match, that message will be loaded into the appropriate
receive buffer.
The acceptance filter looks at incoming messages for
the RXIDE bit (CiRXnSID<0>) to determine how to
compare the identifiers. If the RXIDE bit is clear, the
message is a standard frame, and only filters with the
EXIDE bit (CiRXFnSID<0>) clear are compared. If the
RXIDE bit is set, the message is an extended frame,
and only filters with the EXIDE bit set are compared.
Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can
override the EXIDE bit.
19.4.3 MESSAGE ACCEPTANCE FILTER
MASKS
The mask bits essentially determine which bits to apply
the filter to. If any mask bit is set to a zero, then that bit
will automatically be accepted regardless of the filter
bit. There are 2 programmable acceptance filter masks
associated with the receive buffers, one for each buffer.
19.4.4 RECEIVE OVERRUN
An overrun condition occurs when the message
assembly buffer has assembled a valid received mes-
sage, the message is accepted through the acceptance
filters, and when the receive buffer associated with the
filter has not been designated as clear of the previous
message.
The overrun error flag, RXnOVR (CiINTF<15> or
CiINTF<14>) and the ERRIF bit (CiINTF<5>) will be set
and the message in the MAB will be discarded.
If the DBEN bit is clear, RXB1 and RXB0 operate inde-
pendently. When this is the case, a message intended
for RXB0 will not be diverted into RXB1 if RXB0
contains an unread message and the RX0OVR bit will
be set.
If the DBEN bit is set, the overrun for RXB0 is handled
differently. If a valid message is received for RXB0 and
RXFUL = 1 indicates that RXB0 is full and RXFUL = 0
indicates that RXB1 is empty, the message for RXB0
will be loaded into RXB1. An overrun error will not be
generated for RXB0. If a valid message is received for
RXB0 and RXFUL = 1 and RXFUL = 1 indicates that
both RXB0 and RXB1 are full, the message will be lost
and an overrun will be indicated for RXB1.
19.4.5 RECEIVE ERRORS
The CAN module will detect the following receive
errors:
Cyclic Redundancy Check (CRC) Error
Bit Stuffing Error
Invalid Message Receive Error
The receive error counter is incremented by one in
case one of these errors occur. The RXWAR bit
(CiINTF<9>) indicates that the Receive Error Counter
has reached the CPU warning limit of 96 and an
interrupt is generated.
19.4.6 RECEIVE INTERRUPTS
Receive interrupts can be divided into 3 major groups,
each including various conditions that generate
interrupts:
Receive Interrupt
A message has been successfully received and loaded
into one of the receive buffers. This interrupt is acti-
vated immediately after receiving the End-of-Frame
(EOF) field. Reading the RXnIF flag will indicate which
receive buffer caused the interrupt.
Wake-up interrupt
The CAN module has woken up from Disable mode or
the device has woken up from Sleep mode.
© 2008 Microchip Technology Inc. DS70149D-page 129
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Receive Error Interrupts
A receive error interrupt will be indicated by the ERRIF
bit. This bit shows that an error condition occurred. The
source of the error can be determined by checking the
bits in the CAN Interrupt Status register, CiINTF.
Invalid message received
If any type of error occurred during reception of the last
message, an error will be indicated by the IVRIF bit.
Receiver overrun
The RXnOVR bit indicates that an overrun condition
occurred.
Receiver warning
The RXWAR bit indicates that the Receive Error Coun-
ter (RERRCNT<7:0>) has reached the warning limit of
96.
Receiver error passive
The RXEP bit indicates that the Receive Error Counter
has exceeded the error passive limit of 127 and the
module has gone into Error Passive state.
19.5 Message Transmission
19.5.1 TRANSMIT BUFFERS
The CAN module has three transmit buffers. Each of
the three buffers occupies 14 bytes of data. Eight of the
bytes are the maximum 8 bytes of the transmitted mes-
sage. Five bytes hold the standard and extended
identifiers and other message arbitration information.
19.5.2 TRANSMIT MESSAGE PRIORITY
Transmit priority is a prioritization within each node of the
pending transmittable messages. There are 4 levels of
transmit priority. If TXPRI<1:0> (CiTXnCON<1:0>, where
n = 0, 1 or 2 represents a particular transmit buffer) for a
particular message buffer is set to ‘11’, that buffer has the
highest priority. If TXPRI<1:0> for a particular message
buffer is set to ‘10’ or ‘01’, that buffer has an intermediate
priority. If TXPRI<1:0> for a particular message buffer is
00’, that buffer has the lowest priority.
19.5.3 TRANSMISSION SEQUENCE
To initiate transmission of the message, the TXREQ bit
(CiTXnCON<3>) must be set. The CAN bus module
resolves any timing conflicts between setting of the
TXREQ bit and the Start-of-Frame (SOF), ensuring
that if the priority was changed, it is resolved correctly
before the SOF occurs. When TXREQ is set, the
TXABT (CiTXnCON<6>), TXLARB (CiTXnCON<5>)
and TXERR (CiTXnCON<4>) flag bits are
automatically cleared.
Setting the TXREQ bit simply flags a message buffer as
enqueued for transmission. When the module detects
an available bus, it begins transmitting the message
which has been determined to have the highest priority.
If the transmission completes successfully on the first
attempt, the TXREQ bit is cleared automatically and an
interrupt is generated if TXIE was set.
If the message transmission fails, one of the error
condition flags will be set and the TXREQ bit will
remain set indicating that the message is still pending
for transmission. If the message encountered an error
condition during the transmission attempt, the TXERR
bit will be set and the error condition may cause an
interrupt. If the message loses arbitration during the
transmission attempt, the TXLARB bit is set. No
interrupt is generated to signal the loss of arbitration.
19.5.4 ABORTING MESSAGE
TRANSMISSION
The system can also abort a message by clearing the
TXREQ bit associated with each message buffer. Set-
ting the ABAT bit (CiCTRL<12>) will request an abort of
all pending messages. If the message has not yet
started transmission, or if the message started but is
interrupted by loss of arbitration or an error, the abort
will be processed. The abort is indicated when the
module sets the TXABT bit and the TXnIF flag is not
automatically set.
19.5.5 TRANSMISSION ERRORS
The CAN module will detect the following transmission
errors:
Acknowledge Error
Form Error
Bit Error
These transmission errors will not necessarily generate
an interrupt, but are indicated by the transmission error
counter. However, each of these errors will cause the
transmission error counter to be incremented by one.
Once the value of the error counter exceeds the value
of 96, the ERRIF (CiINTF<5>) and the TXWAR bit
(CiINTF<10>) are set. Once the value of the error
counter exceeds the value of 96, an interrupt is
generated and the TXWAR bit in the Error Flag register
is set.
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DS70149D-page 130 © 2008 Microchip Technology Inc.
19.5.6 TRANSMIT INTERRUPTS
Transmit interrupts can be divided into 2 major groups,
each including various conditions that generate
interrupts:
Transmit Interrupt
At least one of the three transmit buffers is empty (not
scheduled) and can be loaded to schedule a message
for transmission. Reading the TXnIF flags will indicate
which transmit buffer is available and caused the
interrupt.
Transmit Error Interrupts
A transmission error interrupt will be indicated by the
ERRIF flag. This flag shows that an error condition
occurred. The source of the error can be determined by
checking the error flags in the CAN Interrupt Status
register, CiINTF. The flags in this register are related to
receive and transmit errors.
Transmitter Warning Interrupt
The TXWAR bit indicates that the Transmit Error
Counter has reached the CPU warning limit of 96
Transmitter Error Passive
The TXEP bit (CiINTF<12>) indicates that the
Transmit Error Counter has exceeded the error
passive limit of 127 and the module has gone to
Error Passive state
Bus Off
The TXBO bit (CiINTF<13>) indicates that the
Transmit Error Counter has exceeded 255 and
the module has gone to Bus Off state
19.6 Baud Rate Setting
All nodes on any particular CAN bus must have the
same nominal bit rate. In order to set the baud rate, the
following parameters have to be initialized:
Synchronization Jump Width
Baud rate prescaler
Phase segments
Length determination of Phase2 Seg
Sample Point
Propagation segment bits
19.6.1 BIT TIMING
All controllers on the CAN bus must have the same
baud rate and bit length. However, different controllers
are not required to have the same master oscillator
clock. At different clock frequencies of the individual
controllers, the baud rate has to be adjusted by
adjusting the number of time quanta in each segment.
The Nominal Bit Time can be thought of as being
divided into separate non-overlapping time segments.
These segments are shown in Figure 19-2.
Synchronization segment (Sync Seg)
Propagation time segment (Prop Seg)
Phase segment 1 (Phase1 Seg)
Phase segment 2 (Phase2 Seg)
The time segments and also the nominal bit time are
made up of integer units of time called time quanta or
TQ. By definition, the Nominal Bit Time has a minimum
of 8 TQ and a maximum of 25 TQ. Also, by definition,
the minimum nominal bit time is 1 μsec, corresponding
to a maximum bit rate of 1 MHz.
FIGURE 19-2: CAN BIT TIMING
Input Signal
Sync Prop
Segment
Phase
Segment 1
Phase
Segment 2 Sync
Sample Point
TQ
© 2008 Microchip Technology Inc. DS70149D-page 131
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19.6.2 PRESCALER SETTING
There is a programmable prescaler, with integral
values ranging from 1 to 64, in addition to a fixed
divide-by-2 for clock generation. The Time Quantum
(TQ) is a fixed unit of time derived from the oscillator
period, and is given by Equation 19-1, where FCAN is
FCY (if the CANCKS bit is set or 4 FCY if CANCKS is
cleared).
EQUATION 19-1: TIME QUANTUM FOR
CLOCK GENERATION
19.6.3 PROPAGATION SEGMENT
This part of the bit time is used to compensate physical
delay times within the network. These delay times con-
sist of the signal propagation time on the bus line and
the internal delay time of the nodes. The Propagation
Segment can be programmed from 1 TQ to 8 TQ by
setting the PRSEG<2:0> bits (CiCFG2<2:0>).
19.6.4 PHASE SEGMENTS
The phase segments are used to optimally locate the
sampling of the received bit within the transmitted bit
time. The sampling point is between Phase1 Seg and
Phase2 Seg. These segments are lengthened or short-
ened by resynchronization. The end of the Phase1 Seg
determines the sampling point within a bit period. The
segment is programmable from 1 TQ to 8 TQ. Phase2
Seg provides delay to the next transmitted data transi-
tion. The segment is programmable from 1 TQ to 8 TQ,
or it may be defined to be equal to the greater of
Phase1 Seg or the Information Processing Time
(2 TQ). The Phase1 Seg is initialized by setting bits
SEG1PH<2:0> (CiCFG2<5:3>) and Phase2 Seg is
initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).
The following requirement must be fulfilled while setting
the lengths of the Phase Segments:
Propagation Segment + Phase1 Seg > = Phase2
Seg
19.6.5 SAMPLE POINT
The sample point is the point of time at which the bus
level is read and interpreted as the value of that respec-
tive bit. The location is at the end of Phase1 Seg. If the
bit timing is slow and contains many TQ, it is possible to
specify multiple sampling of the bus line at the sample
point. The level determined by the CAN bus then corre-
sponds to the result from the majority decision of three
values. The majority samples are taken at the sample
point and twice before with a distance of TQ/2. The
CAN module allows the user to choose between sam-
pling three times at the same point or once at the same
point, by setting or clearing the SAM bit (CiCFG2<6>).
Typically, the sampling of the bit should take place at
about 60-70% through the bit time, depending on the
system parameters.
19.6.6 SYNCHRONIZATION
To compensate for phase shifts between the oscillator
frequencies of the different bus stations, each CAN
controller must be able to synchronize to the relevant
signal edge of the incoming signal. When an edge in
the transmitted data is detected, the logic will compare
the location of the edge to the expected time (Synchro-
nous Segment). The circuit will then adjust the values
of Phase1 Seg and Phase2 Seg. There are 2
mechanisms used to synchronize.
19.6.6.1 Hard Synchronization
Hard Synchronization is only done whenever there is a
‘recessive’ to ‘dominant’ edge during Bus Idle, indicat-
ing the start of a message. After hard synchronization,
the bit time counters are restarted with the Synchro-
nous Segment. Hard synchronization forces the edge
which has caused the hard synchronization to lie within
the synchronization segment of the restarted bit time. If
a hard synchronization is done, there will not be a
resynchronization within that bit time.
19.6.6.2 Resynchronization
As a result of resynchronization, Phase1 Seg may be
lengthened or Phase2 Seg may be shortened. The
amount of lengthening or shortening of the phase
buffer segment has an upper bound known as the
synchronization jump width, and is specified by the
SJW<1:0> bits (CiCFG1<7:6>). The value of the
synchronization jump width will be added to Phase1
Seg or subtracted from Phase2 Seg. The
resynchronization jump width is programmable
between 1 TQ and 4 TQ.
The following requirement must be fulfilled while setting
the SJW<1:0> bits:
Phase2 Seg > Synchronization Jump Width
Note: FCAN must not exceed 30 MHz. If
CANCKS = 0, then FCY must not exceed
7.5 MHz.
TQ = 2 (BRP<5:0> + 1)/FCAN
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DS70149D-page 132 © 2008 Microchip Technology Inc.
TABLE 19-1: CAN1 REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
C1RXF0SID 0300 Receive Acceptance Filter 0 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF0EIDH 0302 Receive Acceptance Filter 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF1SID 0308 Receive Acceptance Filter 1 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF1EIDH 030A Receive Acceptance Filter 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF2SID 0310 Receive Acceptance Filter 2 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF2EIDH 0312 Receive Acceptance Filter 2 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF3SID 0318 Receive Acceptance Filter 3 Standard Identifier <10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF3EIDH 031A Receive Acceptance Filter 3 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF4SID 0320 Receive Acceptance Filter 4 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF4EIDH 0322 Receive Acceptance Filter 4 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXF5SID 0328 Receive Acceptance Filter 5 Standard Identifier<10:0> EXIDE 000u uuuu uuuu uu0u
C1RXF5EIDH 032A Receive Acceptance Filter 5 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXM0SID 0330 Receive Acceptance Mask 0 Standard Identifier<10:0> MIDE 000u uuuu uuuu uu0u
C1RXM0EIDH 0332 Receive Acceptance Mask 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier<5:0> uuuu uu00 0000 0000
C1RXM1SID 0338 Receive Acceptance Mask 1 Standard Identifier<10:0> MIDE 000u uuuu uuuu uu0u
C1RXM1EIDH 033A Receive Acceptance Mask 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier<5:0> uuuu uu00 0000 0000
C1TX2SID 0340 Transmit Buffer 2 Standard Identifier <10:6> Transmit Buffer 2 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX2EID 0342 Transmit Buffer 2 Extended Identifier<17:14> Transmit Buffer 2 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu
C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu
C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu
C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu
C1TX2CON 034E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1TX1SID 0350 Transmit Buffer 1 Standard Identifier<10:6> Transmit Buffer 1 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX1EID 0352 Transmit Buffer 1 Extended Identifier<17:14> Transmit Buffer 1 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
© 2008 Microchip Technology Inc. DS70149D-page 133
dsPIC30F5015/5016
C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1TX1CON 035E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1TX0SID 0360 Transmit Buffer 0 Standard Identifier<10:6> Transmit Buffer 0 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu
C1TX0EID 0362 Transmit Buffer 0 Extended Identifier<17:14> Transmit Buffer 0 Extended Identifier<13:6> uuuu 0000 uuuu uuuu
C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier<5:0> TXRTR TXRB1 TXRB0 DLC<3:0> uuuu uuuu uuuu u000
C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1TX0CON 036E TXABT TXLARB TXERR TXREQ TXPRI<1:0> 0000 0000 0000 0000
C1RX1SID 0370 Receive Buffer 1 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX1EID 0372 Receive Buffer 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RX1DLC 0374 Receive Buffer 1 Extended Identifier<5:0> RXRTR RXRB1 RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu
C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu
C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu
C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu
C1RX1CON 037E —RXFUL RXRTRRO FILHIT<2:0> 0000 0000 0000 0000
C1RX0SID 0380 Receive Buffer 0 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu
C1RX0EID 0382 Receive Buffer 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu
C1RX0DLC 0384 Receive Buffer 0 Extended Identifier<5:0> RXRTR RXRB1 RXRB0 DLC<3:0> uuuu uuuu 000u uuuu
C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu
C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu
C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu
C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu
C1RX0CON 038E —RXFUL RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000
C1CTRL 0390 CANCAP CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> ICODE<2:0> 0000 0100 1000 0000
C1CFG1 0392 SJW<1:0> BRP<5:0> 0000 0000 0000 0000
C1CFG2 0394 WAKFIL SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu
C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000
C1INTE 0398 IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000
C1EC 039A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000
TABLE 19-1: CAN1 REGISTER MAP(1) (CONTINUED)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 134 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 135
dsPIC30F5015/5016
20.0 SYSTEM INTEGRATION
There are several features intended to maximize
system reliability, minimize cost through elimination of
external components, provide power-saving operating
modes and offer code protection:
Oscillator Selection
Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Programmable Brown-out Reset (BOR)
Watchdog Timer (WDT)
Power-Saving modes (Sleep and Idle)
Code Protection
Unit ID Locations
In-Circuit Serial Programming (ICSP)
dsPIC30F devices have a Watchdog Timer, which is
permanently enabled via the Configuration bits or can
be software controlled. It runs off its own RC oscillator
for added reliability. There are two timers that offer
necessary delays on power-up. One is the Oscillator
Start-up Timer (OST), intended to keep the chip in
Reset until the crystal oscillator is stable. The other is
the Power-up Timer (PWRT), which provides a delay
on power-up only, designed to keep the part in Reset
while the power supply stabilizes. With these two
timers on-chip, most applications need no external
Reset circuitry.
Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer Wake-up or
through an interrupt. Several oscillator options are also
made available to allow the part to fit a wide variety of
applications. In the Idle mode, the clock sources are
still active, but the CPU is shut-off. The RC oscillator
option saves system cost, while the LP crystal option
saves power.
20.1 Oscillator System Overview
The dsPIC30F oscillator system has the following
modules and features:
Various external and internal oscillator options as
clock sources
An on-chip PLL to boost internal operating
frequency
A clock switching mechanism between various
clock sources
Programmable clock postscaler for system power
savings
A Fail-Safe Clock Monitor (FSCM) that detects
clock failure and takes fail-safe measures
Clock Control register OSCCON
Configuration bits for main oscillator selection
Configuration bits determine the clock source upon
Power-on Reset (POR) and Brown-out Reset (BOR).
Thereafter, the clock source can be changed between
permissible clock sources. The OSCCON register
controls the clock switching and reflects system clock
related Status bits.
Table 20-1 provides a summary of the dsPIC30F
oscillator operating modes. A simplified diagram of the
oscillator system is shown in Figure 20-1.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 136 © 2008 Microchip Technology Inc.
TABLE 20-1: OSCILLATOR OPERATING MODES
Oscillator Mode Description
XTL 200 kHz-4 MHz crystal on OSC1:OSC2
XT 4 MHz-10 MHz crystal on OSC1:OSC2
XT w/PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled
XT w/PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled
XT w/PLL 16x 4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)
LP 32 kHz crystal on SOSCO:SOSCI(2)
HS 10 MHz-25 MHz crystal
HS/2 w/PLL 4x 10 MHz-20 MHz crystal, divide by 2, 4x PLL enabled(3)
HS/2 w/PLL 8x 10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled(3)
HS/2 w/PLL 16x 10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1)
HS/3 w/PLL 4x 12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled(4)
HS/3 w/PLL 8x 12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled(4)
HS/3 w/PLL 16x 12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1)(4)
EC External clock input (0-40 MHz)
ECIO External clock input (0-40 MHz), OSC2 pin is I/O
EC w/PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled
EC w/PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled
EC w/PLL 16x External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1)
ERC External RC oscillator, OSC2 pin is FOSC/4 output(5)
ERCIO External RC oscillator, OSC2 pin is I/O(5)
FRC 7.37 MHz internal RC oscillator
FRC w/PLL 4x 7.37 MHz internal RC oscillator, 4x PLL enabled
FRC w/PLL 8x 7.37 MHz internal RC oscillator, 8x PLL enabled
FRC w/PLL 16x 7.37 MHz internal RC oscillator, 16x PLL enabled
LPRC 512 kHz internal RC oscillator
Note 1: Any higher will violate device operating frequency range.
2: LP oscillator can be conveniently shared as system clock, as well as Real-Time Clock for Timer1.
3: Any higher will violate PLL input range.
4: Any lower will violate PLL input range.
5: Requires external R and C. Frequency operation up to 4 MHz.
© 2008 Microchip Technology Inc. DS70149D-page 137
dsPIC30F5015/5016
FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM
Primary
OSC1
OSC2
SOSCO
SOSCI
Oscillator
32 kHz LP
Clock
and Control
Block
Switching
Oscillator
x4, x8, x16
PLL
Primary
Oscillator
Stability Detector
Stability Detector
Secondary
Oscillator
Programmable
Clock Divider
Oscillator
Start-up
Timer
Fail-Safe Clock
Monitor (FSCM)
Internal Fast RC
Oscillator (FRC)
Internal
Low-Power RC
Oscillator (LPRC)
PWRSAV Instruction
Wake-up Request
Oscillator Configuration Bits
System
Clock
Oscillator Trap
to Timer1
LPRC
Secondary Osc
POR Done
Primary Osc
FPLL
POST<1:0>
2
FCKSM<1:0>
2
PLL
Lock COSC<1:0>
NOSC<1:0>
OSWEN
CF
TUN<4:0>
5
dsPIC30F5015/5016
DS70149D-page 138 © 2008 Microchip Technology Inc.
20.2 Oscillator Configurations
20.2.1 INITIAL CLOCK SOURCE
SELECTION
While coming out of Power-on Reset or Brown-out
Reset, the device selects its clock source based on:
a) FOS<2:0> Configuration bits that select one of
four oscillator groups.
b) AND FPR<4:0> Configuration bits that select
one of 16 oscillator choices within the primary
group.
The selection is as shown in Table 20-2.
TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mode Oscillator
Source FOS<2:0> FPR<4:0> OSC2 Function
ECIO w/PLL 4x PLL 11101101 I/O
ECIO w/PLL 8x PLL 11101110 I/O
ECIO w/PLL 16x PLL 11101111 I/O
FRC w/PLL 4x PLL 11100001 I/O
FRC w/PLL 8x PLL 11101010 I/O
FRC w/PLL 16x PLL 11100011 I/O
XT w/PLL 4x PLL 11100101 OSC2
XT w/PLL 8x PLL 11100110 OSC2
XT w/PLL 16x PLL 11100111 OSC2
HS/2 w/PLL 4x PLL 11110001 OSC2
HS/2 w/PLL 8x PLL 11110010 OSC2
HS/2 w/PLL 16x PLL 11110011 OSC2
HS/3 w/PLL 4x PLL 11110101 OSC2
HS/3 w/PLL 8x PLL 11110110 OSC2
HS/3 w/PLL 16x PLL 11110111 OSC2
ECIO External 01101100 I/O
XT External 01100100 OSC2
HS External 01100010 OSC2
EC External 01101011 CLKO
ERC External 01101001 CLKO
ERCIO External 01101000 I/O
XTL External 01100000 OSC2
LP Secondary 000xxxxx (Note 1, 2)
FRC Internal FRC 001xxxxx (Note 1, 2)
LPRC Internal LPRC 010xxxxx (Note 1, 2)
Note 1: The OSC2 pin is usable as general-purpose I/O pin functionality only, depending on the Primary Oscillator
mode selection (FPR<4:0>).
2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is
selected at all times.
© 2008 Microchip Technology Inc. DS70149D-page 139
dsPIC30F5015/5016
20.2.2 OSCILLATOR START-UP TIMER
(OST)
In order to ensure that a crystal oscillator (or ceramic
resonator) has started and stabilized, an Oscillator
Start-up Timer is included. It is a simple 10-bit counter
that counts 1024 TOSC cycles before releasing the
oscillator clock to the rest of the system. The time-out
period is designated as TOST. The TOST time is involved
every time the oscillator has to restart (i.e., on POR,
BOR and wake-up from Sleep). The Oscillator Start-up
Timer is applied to the LP, XT, XTL, and HS Oscillator
modes (upon wake-up from Sleep, POR and BOR) for
the primary oscillator.
20.2.3 LP OSCILLATOR CONTROL
Enabling the LP oscillator is controlled with two
elements:
1. The current oscillator group bits COSC<2:0>
2. The LPOSCEN bit (OSCCON register)
The LP oscillator is ON (even during Sleep mode) if
LPOSCEN = 1. The LP oscillator is the device clock if:
COSC<2:0> =
000
(LP selected as main oscillator)
and
LPOSCEN = 1
Keeping the LP oscillator ON at all times allows for a
fast switch to the 32 kHz system clock for lower power
operation. Returning to the faster main oscillator will
still require a start-up time.
20.2.4 PHASE LOCKED LOOP (PLL)
The PLL multiplies the clock which is generated by the
primary oscillator. The PLL is selectable to have either
gains of x4, x8 and x16. Input and output frequency
ranges are summarized in Table 20-3.
TABLE 20-3: PLL FREQUENCY RANGE
The PLL features a lock output, which is asserted when
the PLL enters a phase locked state. Should the loop
fall out of lock (e.g., due to noise), the lock signal will be
rescinded. The state of this signal is reflected in the
read-only LOCK bit in the OSCCON register.
20.2.5 FAST RC OSCILLATOR (FRC)
The FRC oscillator is a fast (7.37 MHz ±2% nominal)
internal RC oscillator. This oscillator is intended to
provide reasonable device operating speeds without
the use of an external crystal, ceramic resonator or RC
network. The FRC oscillator can be used with the PLL
to obtain higher clock frequencies.
The dsPIC30F operates from the FRC oscillator
whenever the current oscillator selection control bits in
the OSCCON register (OSCCON<14:12>) are set to
001’.
The 6-bit field specified by TUN<4:0> (OSCTUN<4:0>)
allows the user to tune the internal fast RC oscillator
(nominal 7.37 MHz). The user can tune the FRC
oscillator within a range of +12.6% (930 kHz) and -13%
(960 kHz) in steps of 0.4% around the
factory-calibrated setting, see Table 20-4.
If OSCCON<14:12> are set to ‘111’ and FPR<4:0> are
set to ‘00101’, ‘00110’ or ‘00111’, then a PLL
multiplier of 4, 8 or 16 (respectively) is applied.
TABLE 20-4: FRC TUNING
Fin PLL
Multiplier Fout
4 MHz-10 MHz x4 16 MHz-40 MHz
4 MHz-10 MHz x8 32 MHz-80 MHz
4 MHz-7.5 MHz x16 64 MHz-120 MHz
Note: When a 16x PLL is used, the FRC
oscillator must not be tuned to a frequency
greater than 7.5 MHz.
TUN<5:0>
Bits FRC Frequency
01 1111 +12.6%
01 1110 +12.2%
01 1101 +11.8%
... ...
00 0100 +1.6%
00 0011 +1.2%
00 0010 +0.8%
00 0001 +0.4%
00 0000 Center Frequency (oscillator is
running at calibrated frequency)
11 1111 -0.4%
11 1110 -0.8%
11 1101 -1.2%
11 1100 -1.6%
... ...
10 0011 -11.8%
10 0010 -12.2%
10 0001 -12.6%
10 0000 -13.0%
dsPIC30F5015/5016
DS70149D-page 140 © 2008 Microchip Technology Inc.
20.2.6 LOW-POWER RC OSCILLATOR
(LPRC)
The LPRC oscillator is a component of the Watchdog
Timer (WDT) and oscillates at a nominal frequency of
512 kHz. The LPRC oscillator is the clock source for
the Power-up Timer (PWRT) circuit, WDT and clock
monitor circuits. It may also be used to provide a low
frequency clock source option for applications where
power consumption is critical, and timing accuracy is
not required.
The LPRC oscillator is always enabled at a Power-on
Reset, because it is the clock source for the PWRT.
After the PWRT expires, the LPRC oscillator will remain
ON if one of the following is TRUE:
The Fail-Safe Clock Monitor is enabled
The WDT is enabled
The LPRC oscillator is selected as the system
clock via the COSC<2:0> control bits in the
OSCCON register
If one of the above conditions is not true, the LPRC will
shut-off after the PWRT expires.
20.2.7 FAIL-SAFE CLOCK MONITOR
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue to operate even in the event of an oscillator
failure. The FSCM function is enabled by appropriately
programming the FCKSM Configuration bits (Clock
Switch and Monitor Selection bits) in the FOSC
Configuration register. If the FSCM function is
enabled, the LPRC Internal oscillator will run at all
times (except during Sleep mode) and will not be
subject to control by the SWDTEN bit.
In the event of an oscillator failure, the FSCM will
generate a clock failure trap event and will switch the
system clock over to the FRC oscillator. The user will
then have the option to either attempt to restart the
oscillator or execute a controlled shutdown. The user
may decide to treat the trap as a warm Reset by simply
loading the Reset address into the oscillator fail trap
vector. In this event, the CF (Clock Fail) Status bit
(OSCCON<3>) is also set whenever a clock failure is
recognized.
In the event of a clock failure, the WDT is unaffected
and continues to run on the LPRC clock.
If the oscillator has a very slow start-up time coming
out of POR, BOR or Sleep, it is possible that the
PWRT timer will expire before the oscillator has
started. In such cases, the FSCM will be activated and
the FSCM will initiate a clock failure trap, and the
COSC<2:0> bits are loaded with FRC oscillator selec-
tion. This will effectively shut-off the original oscillator
that was trying to start.
The user may detect this situation and restart the
oscillator in the clock fail trap, ISR.
Upon a clock failure detection, the FSCM module will
initiate a clock switch to the FRC oscillator as follows:
1. The COSC bits (OSCCON<14:12>) are loaded
with the FRC oscillator selection value.
2. CF bit is set (OSCCON<3>).
3. OSWEN control bit (OSCCON<0>) is cleared.
For the purpose of clock switching, the clock sources
are sectioned into four groups:
1. Primary
2. Secondary
3. Internal FRC
4. Internal LPRC
The user can switch between these functional groups,
but cannot switch between options within a group. If the
primary group is selected, then the choice within the
group is always determined by the FPR<4:0>
Configuration bits.
The OSCCON register holds the control and Status bits
related to clock switching.
COSC<2:0>: Read-only Status bits always reflect
the current oscillator group in effect.
NOSC<2:0>: Control bits which are written to
indicate the new oscillator group of choice.
- On POR and BOR, COSC<2:0> and
NOSC<2:0> are both loaded with the
Configuration bit values FOS<2:0>.
LOCK: The LOCK Status bit indicates a PLL lock.
CF: Read-only Status bit indicating if a clock fail
detect has occurred.
OSWEN: Control bit changes from a ‘0’ to a ‘1
when a clock transition sequence is initiated.
Clearing the OSWEN control bit will abort a clock
transition in progress (used for hang-up
situations).
If Configuration bits FCKSM<1:0> = 1x, then the clock
switching and Fail-Safe Clock Monitor functions are
disabled. This is the default Configuration bit setting.
If clock switching is disabled, then the FOS<2:0> and
FPR<4:0> bits directly control the oscillator selection
and the COSC<2:0> bits do not control the clock
selection. However, these bits will reflect the clock
source selection.
Note 1: OSC2 pin function is determined by the
Primary Oscillator mode selection
(FPR<4:0>).
2: Note that OSC1 pin cannot be used as an
I/O pin, even if the secondary oscillator or
an internal clock source is selected at all
times.
Note: The application should not attempt to
switch to a clock of frequency lower than
100 KHz when the Fail-Safe Clock Monitor
is enabled. If clock switching is performed,
the device may generate an oscillator fail
trap and switch to the Fast RC oscillator.
© 2008 Microchip Technology Inc. DS70149D-page 141
dsPIC30F5015/5016
20.2.8 PROTECTION AGAINST
ACCIDENTAL WRITES TO OSCCON
A write to the OSCCON register is intentionally made
difficult because it controls clock switching and clock
scaling.
To write to the OSCCON low byte, the following code
sequence must be executed without any other
instructions in between:
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
To write to the OSCCON high byte, the following
instructions must be executed without any other
instructions in between:
Byte write is allowed for one instruction cycle. Write the
desired value or use bit manipulation instruction.
20.3 Reset
The PIC18F1220/1320 differentiates between various
kinds of Reset:
a) Power-on Reset (POR)
b) MCLR Reset during normal operation
c) MCLR Reset during Sleep
d) Watchdog Timer (WDT) Reset (during normal
operation)
e) Programmable Brown-out Reset (BOR)
f) RESET Instruction
g) Reset cause by trap lockup (TRAPR)
h) Reset caused by illegal opcode, or by using an
uninitialized W register as an Address Pointer
(IOPUWR)
Different registers are affected in different ways by
various Reset conditions. Most registers are not
affected by a WDT wake-up, since this is viewed as the
resumption of normal operation. Status bits from the
RCON register are set or cleared differently in different
Reset situations, as indicated in Table 20-5. These bits
are used in software to determine the nature of the
Reset.
A block diagram of the on-chip Reset circuit is shown in
Figure 20-2.
A MCLR noise filter is provided in the MCLR Reset
path. The filter detects and ignores small pulses.
Internally generated Resets do not drive MCLR pin low.
FIGURE 20-2: RESET SYSTEM BLOCK DIAGRAM
Byte Write 0x46 to OSCCON low
Byte Write 0x57 to OSCCON low
Byte Write0x78to OSCCON high
Byte Write0x9Ato OSCCON high
S
RQ
MCLR
VDD
VDD Rise
Detect
POR
SYSRST
Sleep or Idle
Brown-out
Reset BOREN
RESET
Instruction
WDT
Module
Digital
Glitch Filter
BOR
Trap Conflict
Illegal Opcode/
Uninitialized W Register
dsPIC30F5015/5016
DS70149D-page 142 © 2008 Microchip Technology Inc.
20.3.1 POR: POWER-ON RESET
A power-on event will generate an internal POR pulse
when a VDD rise is detected. The Reset pulse will occur
at the POR circuit threshold voltage (VPOR), which is
nominally 1.85V. The device supply voltage
characteristics must meet specified starting voltage
and rise rate requirements. The POR pulse will reset a
POR timer and place the device in the Reset state. The
POR also selects the device clock source identified by
the oscillator configuration fuses.
The POR circuit inserts a small delay, TPOR, which is
nominally 10 μs and ensures that the device bias
circuits are stable. Furthermore, a user selected
power-up time-out (TPWRT) is applied. The TPWRT
parameter is based on Configuration bits and can be 0
ms (no delay), 4 ms, 16 ms or 64 ms. The total delay is
at device power-up TPOR + TPWRT. When these delays
have expired, SYSRST will be negated on the next
leading edge of the Q1 clock, and the PC will jump to
the Reset vector.
The timing for the SYSRST signal is shown in
Figure 20-3 through Figure 20-5.
FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)
FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1
TPWRT
TOST
VDD
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
MCLR
TPWRT
TOST
VDD
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
MCLR
© 2008 Microchip Technology Inc. DS70149D-page 143
dsPIC30F5015/5016
FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2
20.3.1.1 POR with Long Crystal Start-up Time
(with FSCM Enabled)
The oscillator start-up circuitry is not linked to the POR
circuitry. Some crystal circuits (especially low
frequency crystals) will have a relatively long start-up
time. Therefore, one or more of the following conditions
is possible after the POR timer and the PWRT have
expired:
The oscillator circuit has not begun to oscillate.
The Oscillator Start-up Timer has NOT expired (if
a crystal oscillator is used).
The PLL has not achieved a LOCK (if PLL is
used).
If the FSCM is enabled and one of the above conditions
is true, then a clock failure trap will occur. The device
will automatically switch to the FRC oscillator and the
user can switch to the desired crystal oscillator in the
trap, ISR.
20.3.1.2 Operating without FSCM and PWRT
If the FSCM is disabled and the Power-up Timer
(PWRT) is also disabled, then the device will exit
rapidly from Reset on power-up. If the clock source is
FRC, LPRC, EXTRC or EC, it will be active
immediately.
If the FSCM is disabled and the system clock has not
started, the device will be in a frozen state at the Reset
vector until the system clock starts. From the user’s
perspective, the device will appear to be in Reset until
a system clock is available.
20.3.2 BOR: PROGRAMMABLE
BROWN-OUT RESET
The BOR (Brown-out Reset) module is based on an
internal voltage reference circuit. The main purpose of
the BOR module is to generate a device Reset when
a brown-out condition occurs. Brown-out conditions
are generally caused by glitches on the AC mains
(i.e., missing portions of the AC cycle waveform due
to bad power transmission lines or voltage sags due
to excessive current draw when a large inductive load
is turned on).
The BOR module allows selection of one of the
following voltage trip points:
2.6V-2.71V
4.1V-4,4V
4.58V-4.73V
A BOR will generate a Reset pulse which will reset the
device. The BOR will select the clock source, based on
the Configuration bit values (FOS<2:0> and
FPR<4:0>). Furthermore, if an oscillator mode is
selected, the BOR will activate the Oscillator Start-up
Timer (OST). The system clock is held until OST
expires. If the PLL is used, then the clock will be held
until the LOCK bit (OSCCON<5>) is ‘1’.
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
Note: The BOR voltage trip points indicated here
are nominal values provided for design
guidance only.
dsPIC30F5015/5016
DS70149D-page 144 © 2008 Microchip Technology Inc.
Concurrently, the POR time-out (TPOR) and the PWRT
time-out (TPWRT) will be applied before the internal
Reset is released. If TPWRT = 0 and a crystal oscillator
is being used, then a nominal delay of TFSCM = 100 μs
is applied. The total delay in this case is
(TPOR +TFSCM).
The BOR Status bit (RCON<1>) will be set to indicate
that a BOR has occurred. The BOR circuit, if enabled,
will continue to operate while in Sleep or Idle modes
and will reset the device should VDD fall below the BOR
threshold voltage.
FIGURE 20-6: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
Note: Dedicated supervisory devices, such as
the MCP1XX and MCP8XX, may also be
used as an external Power-on Reset
circuit.
Note 1: External Power-on Reset circuit is
required only if the VDD power-up slope
is too slow. The diode D helps discharge
the capacitor quickly when VDD powers
down.
2: R should be suitably chosen so as to
make sure that the voltage drop across
R does not violate the device’s electrical
specification.
3: R1 should be suitably chosen so as to
limit any current flowing into MCLR from
external capacitor C, in the event of
MCLR/VPP pin breakdown due to Elec-
trostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
dsPIC30F
MCLR
© 2008 Microchip Technology Inc. DS70149D-page 145
dsPIC30F5015/5016
Table 20-5 shows the Reset conditions for the RCON
register. Since the control bits within the RCON register
are R/W, the information in the table implies that all the
bits are negated prior to the action specified in the
condition column.
TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1
Table 20-6 shows a second example of the bit
conditions for the RCON register. In this case, it is not
assumed the user has set/cleared specific bits prior to
action specified in the condition column.
TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset 0x000000 000000011
Brown-out Reset 0x000000 000000001
MCLR Reset during normal
operation
0x000000 001000000
Software Reset during
normal operation
0x000000 000100000
MCLR Reset during Sleep 0x000000 001000100
MCLR Reset during Idle 0x000000 001001000
WDT Time-out Reset 0x000000 000010000
WDT Wake-up PC + 2 000010100
Interrupt Wake-up from
Sleep
PC + 2(1) 000000100
Clock Failure Trap 0x000004 000000000
Trap Reset 0x000000 100000000
Illegal Operation Trap 0x000000 010000000
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
Condition Program
Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR
Power-on Reset 0x000000 000000011
Brown-out Reset 0x000000 uuuuuuu01
MCLR Reset during normal
operation
0x000000 uu10000uu
Software Reset during
normal operation
0x000000 uu01000uu
MCLR Reset during Sleep 0x000000 uu1u001uu
MCLR Reset during Idle 0x000000 uu1u010uu
WDT Time-out Reset 0x000000 uu00100uu
WDT Wake-up PC + 2 uuuu1u1uu
Interrupt Wake-up from
Sleep
PC + 2(1) uuuuuu1uu
Clock Failure Trap 0x000004 uuuuuuuuu
Trap Reset 0x000000 1uuuuuuuu
Illegal Operation Reset 0x000000 u1uuuuuuu
Legend: u = unchanged
Note 1: When the wake-up is due to an enabled interrupt, the PC is loaded with the corresponding interrupt vector.
dsPIC30F5015/5016
DS70149D-page 146 © 2008 Microchip Technology Inc.
20.4 Watchdog Timer (WDT)
20.4.1 WATCHDOG TIMER OPERATION
The primary function of the Watchdog Timer (WDT) is
to reset the processor in the event of a software
malfunction. The WDT is a free-running timer, which
runs off an on-chip RC oscillator, requiring no external
component. Therefore, the WDT timer will continue to
operate even if the main processor clock (e.g., the
crystal oscillator) fails.
20.4.2 ENABLING AND DISABLING THE
WDT
The Watchdog Timer can be ‘enabled’ or ‘disabled’ only
through a Configuration bit (FWDTEN) in the
Configuration register FWDT.
Setting FWDTEN = 1 enables the Watchdog Timer.
The enabling is done when programming the device.
By default, after chip-erase, FWDTEN bit = 1. Any
device programmer capable of programming
dsPIC30F devices allows programming of this and
other Configuration bits.
If enabled, the WDT will increment until it overflows or
“times out”. A WDT time-out will force a device Reset
(except during Sleep). To prevent a WDT time-out, the
user must clear the Watchdog Timer using a CLRWDT
instruction.
If a WDT times out during Sleep, the device will
wake-up. The WDTO bit in the RCON register will be
cleared to indicate a wake-up resulting from a WDT
time-out.
Setting FWDTEN = 0 allows user software to
enable/disable the Watchdog Timer via the SWDTEN
(RCON<5>) control bit.
20.5 Power-Saving Modes
There are two power-saving states that can be entered
through the execution of a special instruction, PWRSAV.
These are: Sleep and Idle.
The format of the PWRSAV instruction is as follows:
PWRSAV <parameter>, where ‘parameter’ defines
Idle or Sleep mode.
20.5.1 SLEEP MODE
In Sleep mode, the clock to the CPU and peripherals is
shutdown. If an on-chip oscillator is being used, it is
shutdown.
The Fail-Safe Clock Monitor is not functional during
Sleep, since there is no clock to monitor. However,
LPRC clock remains active if WDT is operational during
Sleep.
The Brown-out protection circuit, if enabled, will remain
functional during Sleep.
The processor wakes up from Sleep if at least one of
the following conditions has occurred:
any interrupt that is individually enabled and
meets the required priority level
any Reset (POR, BOR and MCLR)
WDT time-out
On waking up from Sleep mode, the processor will
restart the same clock that was active prior to entry
into Sleep mode. When clock switching is enabled,
bits COSC<2:0> will determine the oscillator source
that will be used on wake-up. If clock switch is
disabled, then there is only one system clock.
If the clock source is an oscillator, the clock to the
device is held off until OST times out (indicating a sta-
ble oscillator). If PLL is used, the system clock is held
off until LOCK = 1 (indicating that the PLL is stable).
Either way, T
POR
, T
LOCK
and T
PWRT
delays are applied
.
If EC, FRC, LPRC or EXTRC oscillators are used, then
a delay of TPOR (~10 μs) is applied. This is the smallest
delay possible on wake-up from Sleep.
Moreover, if LP oscillator was active during Sleep, and
LP is the oscillator used on wake-up, then the start-up
delay will be equal to TPOR. PWRT delay and OST
timer delay are not applied. In order to have the small-
est possible start-up delay when waking up from Sleep,
one of these faster wake-up options should be selected
before entering Sleep.
Any interrupt that is individually enabled (using the
corresponding IE bit) and meets the prevailing priority
level will be able to wake-up the processor. The proces-
sor will process the interrupt and branch to the ISR. The
Sleep Status bit in RCON register is set upon wake-up
.
All Resets will wake-up the processor from Sleep
mode. Any Reset, other than POR, will set the Sleep
Status bit. In a POR, the Sleep bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Sleep mode upon WDT time-out. The
Sleep and WDTO Status bits are both set.
Note: If a POR or BOR occurred, the selection of
the oscillator is based on the FOS<2:0>
and FPR<4:0> Configuration bits.
Note:
In spite of various delays applied (T
POR
,
T
LOCK
and T
PWRT
), the crystal oscillator
(and PLL) may not be active at the end of
the time-out (e.g., for low frequency crys-
tals. In such cases), if FSCM is enabled,
then the device will detect this as a clock
failure and process the clock failure trap,
the FRC oscillator will be enabled, and the
user will have to re-enable the crystal oscil-
lator. If FSCM is not enabled, then the
device will simply suspend execution of
code until the clock is stable, and will
remain in Sleep until the oscillator clock has
started.
© 2008 Microchip Technology Inc. DS70149D-page 147
dsPIC30F5015/5016
20.5.2 IDLE MODE
In Idle mode, the clock to the CPU is shutdown while
peripherals keep running. Unlike Sleep mode, the clock
source remains active.
Several peripherals have a control bit in each module
that allows them to operate during Idle.
LPRC fail-safe clock remains active if clock failure
detect is enabled.
The processor wakes up from Idle if at least one of the
following conditions is true:
on any interrupt that is individually enabled (IE bit
is ‘1’) and meets the required priority level
on any Reset (POR, BOR, MCLR)
on WDT time-out
Upon wake-up from Idle mode, the clock is re-applied
to the CPU and instruction execution begins
immediately, starting with the instruction following the
PWRSAV instruction.
Any interrupt that is individually enabled (using IE bit)
and meets the prevailing priority level will be able to
wake-up the processor. The processor will process the
interrupt and branch to the ISR. The Idle Status bit in
the RCON register is set upon wake-up.
Any Reset, other than POR, will set the Idle Status bit.
On a POR, the Idle bit is cleared.
If Watchdog Timer is enabled, then the processor will
wake-up from Idle mode upon WDT time-out. The Idle
and WDTO Status bits are both set.
Unlike wake-up from Sleep, there are no time delays
involved in wake-up from Idle.
20.6 Device Configuration Registers
The Configuration bits in each device Configuration
register specify some of the device modes and are
programmed by a device programmer, or by using the
In-Circuit Serial Programming (ICSP) feature of the
device. Each device Configuration register is a 24-bit
register, but only the lower 16 bits of each register are
used to hold configuration data. There are four
Configuration registers available to the user:
1. FOSC (0xF80000): Oscillator Configuration
Register
2. FWDT (0xF80002): Watchdog Timer
Configuration Register
3. FBORPOR (0xF80004): BOR and POR
Configuration Register
4. FGS (0xF8000A): General Code Segment
Configuration Register
5. FICD (0xF8000C): FUSE Configuration
Register
The placement of the Configuration bits is
automatically handled when you select the device in
your device programmer. The desired state of the
Configuration bits may be specified in the source code
(dependent on the language tool used), or through the
programming interface. After the device has been
programmed, the application software may read the
Configuration bit values through the table read
instructions. For additional information, please refer to
the programming specifications of the device.
Note: If the code protection configuration fuse
bits (FGS<GCP> and FGS<GWRP>)
have been programmed, an erase of the
entire code-protected device is only
possible at voltages VDD 4.5V.
dsPIC30F5015/5016
DS70149D-page 148 © 2008 Microchip Technology Inc.
20.7 Peripheral Module Disable (PMD)
Registers
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled via the appropriate PMD
control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral will also be disabled so
writes to those registers will have no effect and read
values will be invalid.
A peripheral module will only be enabled if both the
associated bit in the PMD register is cleared and the
peripheral is supported by the specific dsPIC DSC
variant. If the peripheral is present in the device, it is
enabled in the PMD register by default.
20.8 In-Circuit Debugger
When MPLAB® ICD 2 is selected as a debugger, the
In-Circuit Debugging functionality is enabled. This
function allows simple debugging functions when used
with MPLAB IDE. When the device has this feature
enabled, some of the resources are not available for
general use. These resources include the first 80 bytes
of data RAM and two I/O pins.
One of four pairs of Debug I/O pins may be selected by
the user using configuration options in MPLAB IDE.
These pin pairs are named EMUD/EMUC,
EMUD1/EMUC1, EMUD2/EMUC2 and
EMUD3/EMUC3.
In each case, the selected EMUD pin is the Emula-
tion/Debug Data line, and the EMUC pin is the Emula-
tion/Debug Clock line. These pins will interface to the
MPLAB ICD 2 module available from Microchip. The
selected pair of Debug I/O pins is used by MPLAB
ICD 2 to send commands and receive responses, as
well as to send and receive data. To use the In-Circuit
Debugger function of the device, the design must
implement ICSP connections to MCLR, VDD, VSS,
PGC, PGD and the selected EMUDx/EMUCx pin pair.
This gives rise to two possibilities:
1. If EMUD/EMUC is selected as the debug I/O pin
pair, then only a 5-pin interface is required, as
the EMUD and EMUC pin functions are
multiplexed with the PGD and PGC pin functions
in all dsPIC30F devices.
2. If EMUD1/EMUC1, EMUD2/EMUC2 or
EMUD3/EMUC3 is selected as the debug I/O
pin pair, then a 7-pin interface is required, as the
EMUDx/EMUCx pin functions (x = 1, 2 or 3) are
not multiplexed with the PGD and PGC pin
functions.
Note: If a PMD bit is set, the corresponding
module is disabled after a delay of 1
instruction cycle. Similarly, if a PMD bit is
cleared, the corresponding module is
enabled after a delay of 1 instruction cycle
(assuming the module control registers
are already configured to enable module
operation).
© 2008 Microchip Technology Inc. DS70149D-page 149
dsPIC30F5015/5016
TABLE 20-7: SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F5015/5016(1)
TABLE 20-8: DEVICE CONFIGURATION REGISTER MAP(1)
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
RCON 0740 TRAPR IOPUWR BGST EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Depends on type of Reset.
OSCCON 0742 COSC<2:0> NOSC<2:0> POST<1:0> LOCK —CF LPOSCEN OSWEN Depends on Configuration bits.
OSCTUN 0744 TUN<4:0> 0000 0000 0000 0000
PMD1 0770 T5MD T4MD T3MD T2MD T1MD QEIMD PWMMD I2CMD U2MD U1MD SPI2MD SPI1MD C1MD ADCMD 0000 0000 0000 0000
PMD2 0772 IC4MD IC3MD IC2MD IC1MD OC4MD OC3MD OC2MD OC1MD 0000 0000 0000 0000
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
FOSC F80000 FCKSM<1:0> FOS<2:0> —FPR<4:0>
FWDT F80002 —FWDTEN FWPSA<1:0> FWPSB<3:0>
FBORPOR F80004 —MCLREN PWMPIN HPOL LPOL BOREN BORV<1:0> —FPWRT<1:0>
FGS F8000A Reserved(2) GCP GWRP
FICD F8000C BKBUG COE —ICS<1:0>
Legend: — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
2: The FGS<2> bit is a read-only copy of the GCP bit (FGS<1>).
dsPIC30F5015/5016
DS70149D-page 150 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 151
dsPIC30F5015/5016
21.0 10-BIT HIGH-SPEED
ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The10-bit high-speed Analog-to-Digital Converter
(ADC) allows conversion of an analog input signal to a
10-bit digital number. This module is based on a
Successive Approximation Register (SAR)
architecture, and provides a maximum sampling rate of
1 Msps. The ADC module has 16 analog inputs which
are multiplexed into four sample and hold amplifiers.
The output of the sample and hold is the input into the
converter, which generates the result. The analog
reference voltages are software selectable to either the
device supply voltage (AVDD/AVSS) or the voltage level
on the (VREF+/VREF-) pin. The ADC has a unique
feature of being able to operate while the device is in
Sleep mode.
The ADC module has six 16-bit registers:
A/D Control Register1 (ADCON1)
A/D Control Register2 (ADCON2)
A/D Control Register3 (ADCON3)
A/D Input Select Register (ADCHS)
A/D Port Configuration Register (ADPCFG)
A/D Input Scan Selection Register (ADCSSL)
The ADCON1, ADCON2 and ADCON3 registers
control the operation of the ADC module. The ADCHS
register selects the input channels to be converted. The
ADPCFG register configures the port pins as analog
inputs or as digital I/O. The ADCSSL register selects
inputs for scanning.
The block diagram of the A/D module is shown in
Figure 21-1.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157). Note: The SSRC<2:0>, ASAM, SIMSAM,
SMPI<3:0>, BUFM and ALTS bits, as well
as the ADCON3 and ADCSSL registers,
must not be written to while ADON = 1.
This would lead to indeterminate results.
dsPIC30F5015/5016
DS70149D-page 152 © 2008 Microchip Technology Inc.
FIGURE 21-1: 10-BIT HIGH-SPEED A/D FUNCTIONAL BLOCK DIAGRAM
S/H
+
-
10-bit Result Conversion Logic
VREF+(1)
AVSS
AVDD
ADC
Data
16-word, 10-bit
Dual Port
Buffer
Bus Interface
AN12
AN0
AN5
AN7
AN9
AN13
AN14
AN15
AN12
AN1
AN2
AN3
AN4
AN6
AN8
AN10
AN11
AN13
AN14
AN15
AN8
AN9
AN10
AN11
AN4
AN5
AN6
AN7
AN0
AN1
AN2
AN3
CH1
CH2
CH3
CH0
AN5
AN2
AN11
AN8
AN4
AN1
AN10
AN7
AN3
AN0
AN9
AN6
AN1
VREF-(2)
Sample/Sequence
Control
Sample
CH1,CH2,
CH3,CH0
Input MUX
Control
Input
Switches
S/H
+
-
S/H
+
-
S/H
+
-
Format
Note 1: VREF+ is multiplexed with AN0 in the dsPIC30F5015 variant.
2: VREF- is multiplexed with AN1 in the dsPIC30F5015 variant.
© 2008 Microchip Technology Inc. DS70149D-page 153
dsPIC30F5015/5016
21.1 ADC Result Buffer
The module contains a 16-word dual port, read-only
buffer, called ADCBUF0...ADCBUFF, to buffer the A/D
results. The RAM is 10 bits wide, but is read into different
format 16-bit words. The contents of the sixteen ADC
Result Buffer registers, ADCBUF0 through ADCBUFF,
cannot be written by user software.
21.2 Conversion Operation
After the ADC module has been configured, the sample
acquisition is started by setting the SAMP bit. Various
sources, such as a programmable bit, timer time-outs and
external events, will terminate acquisition and start a
conversion. When the A/D conversion is complete, the
result is loaded into ADCBUF0...ADCBUFF, and the A/D
interrupt Flag ADIF and the DONE bit are set after the
number of samples specified by the SMPI bit.
The following steps should be followed for doing an
A/D conversion:
1. Configure the ADC module:
- Configure analog pins, voltage reference
and digital I/O
- Select A/D input channels
- Select A/D conversion clock
- Select A/D conversion trigger
- Turn on A/D module
2. Configure A/D interrupt (if required):
- Clear ADIF bit
- Select A/D interrupt priority
3. Start sampling.
4. Wait the required acquisition time.
5. Trigger acquisition end, start conversion
6. Wait for A/D conversion to complete, by either:
- Waiting for the A/D interrupt
- Waiting for the DONE bit to get set
7. Read A/D result buffer, clear ADIF if required.
21.3 Selecting the Conversion
Sequence
Several groups of control bits select the sequence in
which the A/D connects inputs to the sample/hold
channels, converts channels, writes the buffer memory,
and generates interrupts. The sequence is
controlled by the sampling clocks.
The SIMSAM bit controls the acquire/convert
sequence for multiple channels. If the SIMSAM bit is
0’, the two or four selected channels are acquired and
converted sequentially, with two or four sample clocks.
If the SIMSAM bit is ‘1’, two or four selected channels
are acquired simultaneously, with one sample clock.
The channels are then converted sequentially.
Obviously, if there is only 1 channel selected, the
SIMSAM bit is not applicable.
The CHPS bits selects how many channels are
sampled. This can vary from 1, 2 or 4 channels. If
CHPS selects 1 channel, the CH0 channel will be
sampled at the sample clock and converted. The result
is stored in the buffer. If CHPS selects 2 channels, the
CH0 and CH1 channels will be sampled and converted.
If CHPS selects 4 channels, the CH0, CH1, CH2 and
CH3 channels will be sampled and converted.
The SMPI bits select the number of
acquisition/conversion sequences that would be
performed before an interrupt occurs. This can vary
from 1 sample per interrupt to 16 samples per interrupt.
The user cannot program a combination of CHPS and
SMPI bits that specifies more than 16 conversions per
interrupt, or 8 conversions per interrupt, depending on
the BUFM bit. The BUFM bit, when set, will split the
16-word results buffer (ADCBUF0...ADCBUFF) into
two 8-word groups. Writing to the 8-word buffers will be
alternated on each interrupt event. Use of the BUFM bit
will depend on how much time is available for moving
data out of the buffers after the interrupt, as determined
by the application.
If the processor can quickly unload a full buffer within
the time it takes to acquire and convert one channel,
the BUFM bit can be ‘0’ and up to 16 conversions may
be done per interrupt. The processor will have one
sample and conversion time to move the sixteen
conversions.
If the processor cannot unload the buffer within the
acquisition and conversion time, the BUFM bit should be
1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,
then eight conversions will be loaded into 1/2 of the
buffer, following which an interrupt occurs. The next eight
conversions will be loaded into the other 1/2 of the buffer.
The processor will have the entire time between
interrupts to move the eight conversions.
The ALTS bit can be used to alternate the inputs
selected during the sampling sequence. The input
multiplexer has two sets of sample inputs: MUX A and
MUX B. If the ALTS bit is ‘0’, only the MUX A inputs are
selected for sampling. If the ALTS bit is ‘1’ and
SMPI<3:0> = 0000, on the first sample/convert
sequence, the MUX A inputs are selected, and on the
next acquire/convert sequence, the MUX B inputs are
selected.
The CSCNA bit (ADCON2<10>) will allow the CH0
channel inputs to be alternately scanned across a
selected number of analog inputs for the MUX A group.
The inputs are selected by the ADCSSL register. If a
particular bit in the ADCSSL register is ‘1’, the
corresponding input is selected. The inputs are always
scanned from lower to higher numbered inputs, starting
after each interrupt. If the number of inputs selected is
greater than the number of samples taken per interrupt,
the higher numbered inputs are unused.
dsPIC30F5015/5016
DS70149D-page 154 © 2008 Microchip Technology Inc.
21.4 Programming the Start of
Conversion Trigger
The conversion trigger will terminate acquisition and
start the requested conversions.
The SSRC<2:0> bits select the source of the
conversion trigger.
The SSRC bits provide for up to five alternate sources
of conversion trigger.
When SSRC<2:0> = 000, the conversion trigger is
under software control. Clearing the SAMP bit will
cause the conversion trigger.
When SSRC<2:0> = 111 (Auto-Start mode), the
conversion trigger is under A/D clock control. The
SAMC bits select the number of A/D clocks between
the start of acquisition and the start of conversion. This
provides the fastest conversion rates on multiple
channels. SAMC must always be at least one clock
cycle.
Other trigger sources can come from timer modules,
Motor Control PWM module, or external interrupts.
21.5 Aborting a Conversion
Clearing the ADON bit during a conversion will abort
the current conversion and stop the sampling
sequencing. The ADCBUF will not be updated with the
partially completed A/D conversion sample. That is, the
ADCBUF will continue to contain the value of the last
completed conversion (or the last value written to the
ADCBUF register).
If the clearing of the ADON bit coincides with an
auto-start, the clearing has a higher priority.
After the A/D conversion is aborted, a 2 TAD wait is
required before the next sampling may be started by
setting the SAMP bit.
If sequential sampling is specified, the A/D will continue
at the next sample pulse which corresponds with the next
channel converted. If simultaneous sampling is specified,
the A/D will continue with the next multichannel group
conversion sequence.
21.6 Selecting the A/D Conversion
Clock
The A/D conversion requires 12 TAD. The source of the
A/D conversion clock is software selected using a 6-bit
counter. There are 64 possible options for TAD.
EQUATION 21-1: A/D CONVERSION CLOCK
The internal RC oscillator is selected by setting the
ADRC bit.
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
of 83.33 nsec (for VDD = 5V). Refer to Section 24.0
“Electrical Characteristics” for minimum TAD under
other operating conditions.
Example 21-1 shows a sample calculation for the
ADCS<5:0> bits, assuming a device operating speed
of 30 MIPS.
EXAMPLE 21-1: A/D CONVERSION CLOCK
CALCULATION
21.7 ADC Speeds
The dsPIC30F 10-bit ADC specifications permit a
maximum 1 Msps sampling rate. Table 21-1
summarizes the conversion speeds for the dsPIC30F
10-bit ADC and the required operating conditions.
Note: To operate the ADC at the maximum
specified conversion speed, the
Auto-Convert Trigger option should be
selected (SSRC = 111) and the
Auto-Sample Time bits should be set to 1
TAD (SAMC = 00001). This configuration
will give a total conversion period (sample
+ convert) of 13 TAD.
The use of any other conversion trigger will
result in additional TAD cycles to
synchronize the external event to the ADC.
TAD = TCY * (0.5*(ADCS<5:0> +1))
ADCS<5:0> = 2 - 1
TAD
TCY
TAD = 84 nsec
ADCS<5:0> = 2 - 1
TAD
TCY
TCY = 33 nsec (30 MIPS)
= 2 • - 1
84 nsec
33 nsec
= 4.09
Therefore,
Set ADCS<5:0> = 5
Actual TAD = (ADCS<5:0> + 1)
TCY
2
= (9 + 1)
33 nsec
2
= 99 nsec
© 2008 Microchip Technology Inc. DS70149D-page 155
dsPIC30F5015/5016
TABLE 21-1: 10-BIT CONVERSION RATE PARAMETERS
dsPIC30F 10-bit A/D Converter Conversion Rates
A/D Speed TAD
Minimum
Sampling
Time Min RS Max VDD Temperature A/D Channels Configuration
Up to
1 Msps(1)
83.33 ns 12 TAD 500Ω4.5V to 5.5V -40°C to +85°C
Up to
750 ksps(1)
95.24 ns 2 TAD 500Ω4.5V to 5.5V -40°C to +85°C
Up to
600 ksps(1)
138.89 ns 12 TAD 500Ω3.0V to 5.5V -40°C to +125°C
Up to
500 ksps
153.85 ns 1 TAD 5.0 kΩ4.5V to 5.5V -40°C to +125°C
Up to
300 ksps
256.41 ns 1 TAD 5.0 kΩ3.0V to 5.5V -40°C to +125°C
Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 21-2 for recommended
circuit.
V
REF
-V
REF
+
ADC
ANx
S/H
S/H
CH1, CH2 or CH3
CH0
V
REF
-V
REF
+
ADC
ANx
S/H
CH
X
V
REF
-V
REF
+
ADC
ANx
S/H
S/H
CH1, CH2 or CH3
CH0
V
REF
-V
REF
+
ADC
ANx
S/H
CH
X
ANx or V
REF
-
or
AV
SS
or
AV
DD
V
REF
-V
REF
+
ADC
ANx
S/H
CH
X
ANx or V
REF
-
or
AV
SS
or
AV
DD
dsPIC30F5015/5016
DS70149D-page 156 © 2008 Microchip Technology Inc.
The configuration guidelines give the required setup
values for the conversion speeds above 500 ksps,
since they require external VREF pins usage and there
are some differences in the configuration procedure.
Configuration details that are not critical to the
conversion speed have been omitted.
The following figure depicts the recommended circuit
for the conversion rates above 500 ksps.
FIGURE 21-2: ADC VOLTAGE REFERENCE SCHEMATIC
21.7.1 1 Msps CONFIGURATION
GUIDELINE
The configuration for 1 Msps operation is dependent on
whether a single input pin is to be sampled or whether
multiple pins will be sampled.
21.7.1.1 Single Analog Input
For conversions at 1 Msps for a single analog input, at
least two sample and hold channels must be enabled.
The analog input multiplexer must be configured so
that the same input pin is connected to both sample
and hold channels. The ADC converts the value held
on one S/H channel, while the second S/H channel
acquires a new input sample.
21.7.1.2 Multiple Analog Inputs
The ADC can also be used to sample multiple analog
inputs using multiple sample and hold channels. In this
case, the total 1 Msps conversion rate is divided among
the different input signals. For example, four inputs can
be sampled at a rate of 250 ksps for each signal or two
inputs could be sampled at a rate of 500 ksps for each
signal. Sequential sampling must be used in this
configuration to allow adequate sampling time on each
input.
V
DD
V
DD
V
DD
R2
10
C2
0.1
μ
F
C1
0.01
μ
F
R1
10
C8
1 mF
V
DD
C7
0.1 mF
V
DD
C6
0.01 mF
V
DD
C5
1 mF
V
DD
C4
0.1 mF
V
DD
C3
0.01 mF
dsPIC30F5015
1
2
3
4
5
6
MCLR
8
VSS
VDD
11
12
13 36
35
34
33
32
31
30
29
28
27
VDD
64
63
62
61
60
59
58
VDD
VSS
14
VREF-
VREF+
17
18
AVDD
AVSS
21
22
23
24
VSS
AVDD VDD
43
42
VSS
40
39
VDD
37
44
48
47
46
50
49
51
54
53
52
55
45
VDD
VDD
© 2008 Microchip Technology Inc. DS70149D-page 157
dsPIC30F5015/5016
21.7.1.3 1 Msps Configuration Items
The following configuration items are required to
achieve a 1 Msps conversion rate.
Comply with conditions provided in Table 21-2
Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set SMPI<3:0>
= 0001 since at least two sample and hold
channels should be enabled
Configure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
Select at least two channels per analog input pin
by writing to the ADCHS register
21.7.2 750 ksps CONFIGURATION
GUIDELINE
The following configuration items are required to
achieve a 750 ksps conversion rate. This configuration
assumes that a single analog input is to be sampled.
Comply with conditions provided in Table 21-2
Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
Enable one sample and hold channel by setting
CHPS<1:0> = 00 in the ADCON2 register
Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts
Configure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 TAD by
writing: SAMC<4:0> = 00010
21.7.3 600 ksps CONFIGURATION
GUIDELINE
The configuration for 600 ksps operation is dependent
on whether a single input pin is to be sampled or
whether multiple pins will be sampled.
21.7.3.1 Single Analog Input
When performing conversions at 600 ksps for a single
analog input, at least two sample and hold channels
must be enabled. The analog input multiplexer must be
configured so that the same input pin is connected to
both sample and hold channels. The ADC the value
held on one S/H channel, while the second S/H
channel acquires a new input sample.
21.7.3.2 Multiple Analog Input
The ADC can also be used to sample multiple analog
inputs using multiple sample and hold channels. In this
case, the total 600 ksps conversion rate is divided
among the different input signals. For example, four
inputs can be sampled at a rate of 150 ksps for each
signal or two inputs can be sampled at a rate of 300
ksps for each signal. Sequential sampling must be
used in this configuration to allow adequate sampling
time on each input.
21.7.3.3 600 ksps Configuration Items
The following configuration items are required to
achieve a 600 ksps conversion rate.
Comply with conditions provided in Table 21-2
Connect external VREF+ and VREF- pins following
the recommended circuit shown in Figure 21-2
Set SSRC<2:0> = 111 in the ADCON1 register to
enable the auto-convert option
Enable automatic sampling by setting the ASAM
control bit in the ADCON1 register
Enable sequential sampling by clearing the
SIMSAM bit in the ADCON1 register
Enable at least two sample and hold channels by
writing the CHPS<1:0> control bits in the
ADCON2 register
Write the SMPI<3:0> control bits in the ADCON2
register for the desired number of conversions
between interrupts. At a minimum, set
SMPI<3:0> = 0001 since at least two sample and
hold channels should be enabled
Configure the A/D clock period to be:
by writing to the ADCS<5:0> control bits in the
ADCON3 register
Configure the sampling time to be 2 Tad by
writing: SAMC<4:0> = 00010
Select at least two channels per analog input pin
by writing to the ADCHS register
1
12 x 1,000,000
= 83.33 ns
1
(12 + 2) X 750,000
= 95.24 ns
1
12 x 600,000
= 138.89 ns
dsPIC30F5015/5016
DS70149D-page 158 © 2008 Microchip Technology Inc.
21.8 ADC Acquisition Requirements
The analog input model of the 10-bit ADC is shown in
Figure 21-3. The total sampling time for the ADC is a
function of the internal amplifier settling time, device
VDD and the holding capacitor charge time.
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the voltage level on the analog input pin. The
analog output source impedance (RS), the interconnect
impedance (RIC), and the internal sampling switch
(RSS) impedance combine to directly affect the time
required to charge the capacitor CHOLD. The combined
impedance must therefore be small enough to fully
charge the holding capacitor within the chosen sample
time. To minimize the effects of pin leakage currents on
the accuracy of the ADC, the maximum recommended
source impedance, RS, is 5 kΩ for conversion rates up
to 500 ksps and a maximum of 500Ω for conversion
rates up to 1 Msps. After the analog input channel is
selected (changed), this sampling function must be
completed prior to starting the conversion. The internal
holding capacitor will be in a discharged state prior to
each sample operation.
The user must allow at least 1 TAD period of sampling
time, TSAMP, between conversions to allow each sam-
ple to be acquired. This sample time may be controlled
manually in software by setting/clearing the SAMP bit,
or it may be automatically controlled by the ADC. In an
automatic configuration, the user must allow enough
time between conversion triggers so that the minimum
sample time can be satisfied. Refer to Table 24-40 for
TAD and sample time requirements.
FIGURE 21-3: ADC CONVERTER ANALOG INPUT MODEL
CPIN
VA
Rs ANx VT = 0.6V
VT = 0.6V I leakage
RIC 250ΩSampling
Switch
RSS
CHOLD
= DAC capacitance
VSS
VDD
= 4.4 pF
± 500 nA
Legend: CPIN
VT
I leakage
RIC
RSS
CHOLD
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch resistance
= sample/hold capacitance (from DAC)
various junctions
Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs 5 kΩ.
RSS 3 kΩ
© 2008 Microchip Technology Inc. DS70149D-page 159
dsPIC30F5015/5016
21.9 Module Power-Down Modes
The module has 3 internal power modes. When the
ADON bit is ‘1’, the module is in Active mode; it is fully
powered and functional. When ADON is ‘0’, the module
is in Off mode. The digital and analog portions of the
circuit are disabled for maximum current savings. In
order to return to the Active mode from Off mode, the
user must wait for the ADC circuitry to stabilize.
21.10 ADC Operation During CPU Sleep
and Idle Modes
21.10.1 ADC OPERATION DURING CPU
SLEEP MODE
When the device enters Sleep mode, all clock sources
to the module are shutdown and stay at logic ‘0’.
If Sleep occurs in the middle of a conversion, the
conversion is aborted. The converter will not continue
with a partially completed conversion on exit from
Sleep mode.
Register contents are not affected by the device
entering or leaving Sleep mode.
The ADC module can operate during Sleep mode if the
ADC clock source is set to RC (ADRC = 1). When the
RC clock source is selected, the ADC module waits
one instruction cycle before starting the conversion.
This allows the SLEEP instruction to be executed,
which eliminates all digital switching noise from the
conversion. When the conversion is complete, the
DONE bit will be set and the result loaded into the
ADCBUF register.
If the A/D interrupt is enabled, the device will wake-up
from Sleep. If the A/D interrupt is not enabled, the A/D
module will then be turned off, although the ADON bit
will remain set.
21.10.2 ADC OPERATION DURING CPU
IDLE MODE
The ADSIDL bit selects if the module will stop on Idle or
continue on Idle. If ADSIDL = 0, the module will continue
operation on assertion of Idle mode. If ADSIDL = 1, the
module will stop on Idle.
21.11 Effects of a Reset
A device Reset forces all registers to their Reset state.
This forces the ADC module to be turned off, and any
conversion and acquisition sequence is aborted. The
values that are in the ADCBUF registers are not
modified. The ADC result register will contain unknown
data after a Power-on Reset.
21.12 Output Formats
The ADC result is 10 bits wide. The data buffer RAM is
also 10 bits wide. The 10-bit data can be read in one of
four different formats. The FORM<1:0> bits select the
format. Each of the output formats translates to a 16-bit
result on the data bus.
Write data will always be in right justified (integer)
format.
FIGURE 21-4: ADC OUTPUT DATA FORMATS
RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Read to Bus:
Signed Fractional (1.15) d09 d08d07d06d05d04d03d02d01d00000000
Fractional (1.15)d09d08d07d06d05d04d03d02d01d00000000
Signed Integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00
dsPIC30F5015/5016
DS70149D-page 160 © 2008 Microchip Technology Inc.
21.13 Configuring Analog Port Pins
The use of the ADPCFG and TRIS registers control the
operation of the ADC port pins. The port pins that are
desired as analog inputs must have their
corresponding TRIS bit set (input). If the TRIS bit is
cleared (output), the digital output level (VOH or VOL)
will be converted.
The A/D operation is independent of the state of the
CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.
When reading the PORT register, all pins configured as
analog input channels will read as cleared.
Pins configured as digital inputs will not convert an
analog input. Analog levels on any pin that is defined as
a digital input (including the ANx pins) may cause the
input buffer to consume current that exceeds the
device specifications.
21.14 Connection Considerations
The analog inputs have diodes to VDD and VSS as ESD
protection. This requires that the analog input be
between VDD and VSS. If the input voltage exceeds this
range by greater than 0.3V (either direction), one of the
diodes becomes forward biased and it may damage the
device if the input current specification is exceeded.
An external RC filter is sometimes added for
anti-aliasing of the input signal. The R component
should be selected to ensure that the sampling time
requirements are satisfied. Any external components
connected (via high-impedance) to an analog input pin
(capacitor, zener diode, etc.) should have very little
leakage current at the pin.
© 2008 Microchip Technology Inc. DS70149D-page 161
dsPIC30F5015/5016
TABLE 21-2: ADC REGISTER MAP(1)
SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State
ADCBUF0 0280 ADC Data Buffer 0 0000 00uu uuuu uuuu
ADCBUF1 0282 ADC Data Buffer 1 0000 00uu uuuu uuuu
ADCBUF2 0284 ADC Data Buffer 2 0000 00uu uuuu uuuu
ADCBUF3 0286 ADC Data Buffer 3 0000 00uu uuuu uuuu
ADCBUF4 0288 ADC Data Buffer 4 0000 00uu uuuu uuuu
ADCBUF5 028A ADC Data Buffer 5 0000 00uu uuuu uuuu
ADCBUF6 028C ADC Data Buffer 6 0000 00uu uuuu uuuu
ADCBUF7 028E ADC Data Buffer 7 0000 00uu uuuu uuuu
ADCBUF8 0290 ADC Data Buffer 8 0000 00uu uuuu uuuu
ADCBUF9 0292 ADC Data Buffer 9 0000 00uu uuuu uuuu
ADCBUFA 0294 ADC Data Buffer 10 0000 00uu uuuu uuuu
ADCBUFB 0296 ADC Data Buffer 11 0000 00uu uuuu uuuu
ADCBUFC 0298 ADC Data Buffer 12 0000 00uu uuuu uuuu
ADCBUFD 029A ADC Data Buffer 13 0000 00uu uuuu uuuu
ADCBUFE 029C ADC Data Buffer 14 0000 00uu uuuu uuuu
ADCBUFF 029E ADC Data Buffer 15 0000 00uu uuuu uuuu
ADCON1 02A0 ADON —ADSIDL—— FORM<1:0> SSRC<2:0> SIMSAM ASAM SAMP DONE 0000 0000 0000 0000
ADCON2 02A2 VCFG<2:0> CSCNA CHPS<1:0> BUFS SMPI<3:0> BUFM ALTS 0000 0000 0000 0000
ADCON3 02A4 SAMC<4:0> ADRC ADCS<5:0> 0000 0000 0000 0000
ADCHS 02A6 CH123NB<1:0> CH123SB CH0NB CH0SB<3:0> CH123NA<1:0> CH123SA CH0NA CH0SA<3:0> 0000 0000 0000 0000
ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000
ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000
Legend: u = uninitialized bit; — = unimplemented bit, read as ‘0
Note 1: Refer to “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.
dsPIC30F5015/5016
DS70149D-page 162 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 163
dsPIC30F5015/5016
22.0 INSTRUCTION SET SUMMARY
The dsPIC30F instruction set adds many
enhancements to the previous PIC® Microcontroller
(MCU) instruction sets, while maintaining an easy
migration from PIC MCU instruction sets.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word divided
into an 8-bit opcode which specifies the instruction
type, and one or more operands which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into five basic categories:
Word or byte-oriented operations
Bit-oriented operations
Literal operations
DSP operations
Control operations
Table 22-1 shows the general symbols used in
describing the instructions.
The dsPIC30F instruction set summary in Table 22-2
lists all the instructions along with the status flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have three
operands:
The first source operand, which is typically a
register ‘Wb’ without any address modifier
The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register
instructions have two operands:
The file register specified by the value ‘f’
The destination, which could either be the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
Most bit oriented instructions (including simple
rotate/shift instructions) have two operands:
The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
The bit in the W register or file register
(specified by a literal value, or indirectly by the
contents of register ‘Wb’)
The literal instructions that involve data movement may
use some of the following operands:
A literal value to be loaded into a W register or file
register (specified by the value of ‘k’)
The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
The first source operand, which is a register ‘Wb’
without any address modifier
The second source operand, which is a literal
value
The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions may use some of the
following operands:
The accumulator (A or B) to be used (required
operand)
The W registers to be used as the two operands
The X and Y address space prefetch operations
The X and Y address space prefetch destinations
The accumulator write-back destination
The other DSP instructions do not involve any
multiplication, and may include:
The accumulator to be used (required)
The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
The amount of shift, specified by a W register ‘Wn’
or a literal value
The control instructions may use some of the following
operands:
A program memory address
The mode of the table read and table write
instructions
All instructions are a single word, except for certain
double-word instructions, which were made
double-word instructions so that all the required
information is available in these 48 bits. In the second
word, the 8 MSbs are ‘0’s. If this second word is
executed as an instruction (by itself), it will execute as
a NOP
.
Note: This data sheet summarizes features of
this group of dsPIC30F devices and is not
intended to be a complete reference
source. For more information on the CPU,
peripherals, register descriptions and
general device functionality, refer to the
dsPIC30F Family Reference Manual
(DS70046). For more information on the
device instruction set and programming,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
dsPIC30F5015/5016
DS70149D-page 164 © 2008 Microchip Technology Inc.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true or the
program counter is changed as a result of the
instruction. In these cases, the execution takes two
instruction cycles with the additional instruction
cycle(s) executed as a NOP. Notable exceptions are the
BRA (unconditional/computed branch), indirect
CALL/GOTO, all table reads and writes and
RETURN/RETFIE instructions, which are single-word
instructions, but take two or three cycles. Certain
instructions that involve skipping over the subsequent
instruction, require either two or three cycles if the skip
is performed, depending on whether the instruction
being skipped is a single-word or two-word instruction.
Moreover, double-word moves require two cycles. The
double-word instructions execute in two instruction
cycles.
Note: For more details on the instruction set,
refer to the “dsPIC30F/33F Programmer’s
Reference Manual” (DS70157).
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Means literal defined by “text
(text) Means “content of “text
[text] Means “the location addressed by text
{ } Optional field or operation
<n:m> Register bit field
.b Byte mode selection
.d Double-word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumulator write-back destination address register {W13, [W13] + = 2}
bit4 4-bit bit selection field (used in word addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero
Expr Absolute address, label or expression (resolved by the linker)
fFile register address {0x0000...0x1FFF}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16384}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388608}; LSB must be ‘0
None Field does not require an entry, may be blank
OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
© 2008 Microchip Technology Inc. DS70149D-page 165
dsPIC30F5015/5016
Wb Base W register {W0..W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor working register pair (direct addressing)
Wm*Wm Multiplicand and Multiplier working register pair for Square instructions
{W4*W4,W5*W5,W6*W6,W7*W7}
Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions
{W4*W5,W4*W6,W4*W7,W5*W6,W5*W7,W6*W7}
Wn One of 16 working registers {W0..W15}
Wnd One of 16 destination working registers {W0..W15}
Wns One of 16 source working registers {W0..W15}
WREG W0 (working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X data space prefetch address register for DSP instructions
{[W8]+ = 6, [W8]+ = 4, [W8]+ = 2, [W8], [W8]- = 6, [W8]- = 4, [W8]- = 2,
[W9]+ = 6, [W9]+ = 4, [W9]+ = 2, [W9], [W9]- = 6, [W9]- = 4, [W9]- = 2,
[W9+W12], none}
Wxd X data space prefetch destination register for DSP instructions {W4..W7}
Wy Y data space prefetch address register for DSP instructions
{[W10]+ = 6, [W10]+ = 4, [W10]+ = 2, [W10], [W10]- = 6, [W10]- = 4, [W10]- = 2,
[W11]+ = 6, [W11]+ = 4, [W11]+ = 2, [W11], [W11]- = 6, [W11]- = 4, [W11]- = 2,
[W11+W12], none}
Wyd Y data space prefetch destination register for DSP instructions {W4..W7}
TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
dsPIC30F5015/5016
DS70149D-page 166 © 2008 Microchip Technology Inc.
TABLE 22-2: INSTRUCTION SET OVERVIEW
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words
# of
cycles
Status Flags
Affected
1ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB
ADD ff = f + WREG 1 1 C,DC,N,OV,Z
ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA,OB,SA,SB
2ADDC ADDC ff = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3AND AND ff = f .AND. WREG 1 1 N,Z
AND f,WREG WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z
4ASR ASR ff = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5BCLR BCLR f,#bit4 Bit Clear f 1 1 None
BCLR Ws,#bit4 Bit Clear Ws 1 1 None
6BRA BRA C,Expr Branch if Carry 1 1 (2) None
BRA GE,Expr Branch if greater than or equal 1 1 (2) None
BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None
BRA GT,Expr Branch if greater than 1 1 (2) None
BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None
BRA LE,Expr Branch if less than or equal 1 1 (2) None
BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None
BRA LT,Expr Branch if less than 1 1 (2) None
BRA LTU,Expr Branch if unsigned less than 1 1 (2) None
BRA N,Expr Branch if Negative 1 1 (2) None
BRA NC,Expr Branch if Not Carry 1 1 (2) None
BRA NN,Expr Branch if Not Negative 1 1 (2) None
BRA NOV,Expr Branch if Not Overflow 1 1 (2) None
BRA NZ,Expr Branch if Not Zero 1 1 (2) None
BRA OA,Expr Branch if accumulator A overflow 1 1 (2) None
BRA OB,Expr Branch if accumulator B overflow 1 1 (2) None
BRA OV,Expr Branch if Overflow 1 1 (2) None
BRA SA,Expr Branch if accumulator A saturated 1 1 (2) None
BRA SB,Expr Branch if accumulator B saturated 1 1 (2) None
BRA Expr Branch Unconditionally 1 2 None
BRA Z,Expr Branch if Zero 1 1 (2) None
BRA Wn Computed Branch 1 2 None
7BSET BSET f,#bit4 Bit Set f 1 1 None
BSET Ws,#bit4 Bit Set Ws 1 1 None
8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None
9BTG BTG f,#bit4 Bit Toggle f 1 1 None
BTG Ws,#bit4 Bit Toggle Ws 1 1 None
10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1
(2 or 3)
None
BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1
(2 or 3)
None
© 2008 Microchip Technology Inc. DS70149D-page 167
dsPIC30F5015/5016
11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1
(2 or 3)
None
BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1
(2 or 3)
None
12 BTST BTST f,#bit4 Bit Test f 1 1 Z
BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z
13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z
14 CALL CALL lit23 Call subroutine 2 2 None
CALL Wn Call indirect subroutine 1 2 None
15 CLR CLR ff = 0x0000 1 1 None
CLR WREG WREG = 0x0000 1 1 None
CLR Ws Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB
16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep
17 COM COM ff = f 11N,Z
COM f,WREG WREG = f 11N,Z
COM Ws,Wd Wd = Ws 11N,Z
18 CP CP fCompare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z
CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z
19 CP0 CP0 fCompare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20 CPB CPB fCompare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws Compare Wb with Ws, with Borrow
(Wb – Ws – C)
1 1 C,DC,N,OV,Z
21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1
(2 or 3)
None
22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1
(2 or 3)
None
23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1
(2 or 3)
None
24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if 11
(2 or 3)
None
25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C
26 DEC DEC ff = f –1 1 1 C,DC,N,OV,Z
DEC f,WREG WREG = f –1 1 1 C,DC,N,OV,Z
DEC Ws,Wd Wd = Ws – 1 1 1 C,DC,N,OV,Z
27 DEC2 DEC2 ff = f – 2 1 1 C,DC,N,OV,Z
DEC2 f,WREG WREG = f – 2 1 1 C,DC,N,OV,Z
DEC2 Ws,Wd Wd = Ws – 2 1 1 C,DC,N,OV,Z
28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None
29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C, OV
DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C, OV
30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C, OV
31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None
DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None
32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,
SA,SB,SAB
33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words
# of
cycles
Status Flags
Affected
dsPIC30F5015/5016
DS70149D-page 168 © 2008 Microchip Technology Inc.
35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C
36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C
37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C
38 GOTO GOTO Expr Go to address 2 2 None
GOTO Wn Go to indirect 1 2 None
39 INC INC ff = f + 1 1 1 C,DC,N,OV,Z
INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
40 INC2 INC2 ff = f + 2 1 1 C,DC,N,OV,Z
INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z
INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z
41 IOR IOR ff = f .IOR. WREG 1 1 N,Z
IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z
42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
43 LNK LNK #lit14 Link frame pointer 1 1 None
44 LSR LSR ff = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z
LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
46 MOV MOV f,Wn Move f to Wn 1 1 None
MOV fMove f to f 1 1 N,Z
MOV f,WREG Move f to WREG 1 1 N,Z
MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None
MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None
MOV Wn,f Move Wn to f 1 1 None
MOV Wso,Wdo Move Ws to Wd 1 1 None
MOV WREG,f Move WREG to f 1 1 N,Z
MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None
MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None
47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Prefetch and store Accumulator 1 1 None
48 MPY MPY
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY
Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
49 MPY.N MPY.N
Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator 1 1 None
50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,
AWB
Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
51 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None
MUL.US Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None
MUL.UU Wb,Ws,Wnd {Wnd+1, Wnd} = unsigned(Wb) *
unsigned(Ws)
1 1 None
MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = unsigned(Wb) *
unsigned(lit5)
1 1 None
MUL fW3:W2 = f * WREG 1 1 None
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words
# of
cycles
Status Flags
Affected
© 2008 Microchip Technology Inc. DS70149D-page 169
dsPIC30F5015/5016
52 NEG NEG Acc Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG ff = f + 1 1 1 C,DC,N,OV,Z
NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z
NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z
53 NOP NOP No Operation 1 1 None
NOPR No Operation 1 1 None
54 POP POP fPop f from Top-of-Stack (TOS) 1 1 None
POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd Pop from Top-of-Stack (TOS) to
W(nd):W(nd+1)
1 2 None
POP.S Pop Shadow Registers 1 1 All
55 PUSH PUSH fPush f to Top-of-Stack (TOS) 1 1 None
PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns Push W(ns):W(ns+1) to Top-of-Stack (TOS) 1 2 None
PUSH.S Push Shadow Registers 1 1 None
56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep
57 RCALL RCALL Expr Relative Call 1 2 None
RCALL Wn Computed Call 1 2 None
589 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None
REPEAT Wn Repeat Next Instruction (Wn) + 1 times 1 1 None
59 RESET RESET Software device Reset 1 1 None
60 RETFIE RETFIE Return from interrupt 1 3 (2) None
61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None
62 RETURN RETURN Return from Subroutine 1 3 (2) None
63 RLC RLC ff = Rotate Left through Carry f 1 1 C,N,Z
RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z
RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z
64 RLNC RLNC ff = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z
65 RRC RRC ff = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z
66 RRNC RRNC ff = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z
67 SAC SAC Acc,#Slit4,Wdo Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None
68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z
69 SETM SETM ff = 0xFFFF 1 1 None
SETM WREG WREG = 0xFFFF 1 1 None
SETM Ws Ws = 0xFFFF 1 1 None
70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
71 SL SL ff = Left Shift f 1 1 C,N,OV,Z
SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words
# of
cycles
Status Flags
Affected
dsPIC30F5015/5016
DS70149D-page 170 © 2008 Microchip Technology Inc.
72 SUB SUB Acc Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB ff = f – WREG 1 1 C,DC,N,OV,Z
SUB f,WREG WREG = f – WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn Wn = Wn – lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C,DC,N,OV,Z
73 SUBB SUBB ff = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z
74 SUBR SUBR ff = WREG – f 1 1 C,DC,N,OV,Z
SUBR f,WREG WREG = WREG – f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C,DC,N,OV,Z
75 SUBBR SUBBR ff = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z
76 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None
SWAP Wn Wn = byte swap Wn 1 1 None
77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None
78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None
79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None
80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None
81 ULNK ULNK Unlink Frame Pointer 1 1 None
82 XOR XOR ff = f .XOR. WREG 1 1 N,Z
XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z
83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C,Z,N
TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
words
# of
cycles
Status Flags
Affected
© 2008 Microchip Technology Inc. DS70149D-page 171
dsPIC30F5015/5016
23.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers are supported with a full
range of hardware and software development tools:
Integrated Development Environment
- MPLAB® IDE Software
Assemblers/Compilers/Linkers
- MPASMTM Assembler
- MPLAB C18 and MPLAB C30 C Compilers
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB ASM30 Assembler/Linker/Library
Simulators
- MPLAB SIM Software Simulator
Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- MPLAB REAL ICE™ In-Circuit Emulator
In-Circuit Debugger
- MPLAB ICD 2
Device Programmers
-PICSTART
® Plus Development Programmer
- MPLAB PM3 Device Programmer
- PICkit™ 2 Development Programmer
Low-Cost Demonstration and Development
Boards and Evaluation Kits
23.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- Emulator (sold separately)
- In-Circuit Debugger (sold separately)
A full-featured editor with color-coded context
A multiple project manager
Customizable data windows with direct edit of
contents
High-level source code debugging
Visual device initializer for easy register
initialization
Mouse over variable inspection
Drag and drop variables from source to watch
windows
Extensive on-line help
Integration of select third party tools, such as
HI-TECH Software C Compilers and IAR
C Compilers
The MPLAB IDE allows you to:
Edit your source files (either assembly or C)
One touch assemble (or compile) and download
to PIC MCU emulator and simulator tools
(automatically updates all project information)
Debug using:
- Source files (assembly or C)
- Mixed assembly and C
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
dsPIC30F5015/5016
DS70149D-page 172 © 2008 Microchip Technology Inc.
23.2 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for all PIC MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
Integration into MPLAB IDE projects
User-defined macros to streamline
assembly code
Conditional assembly for multi-purpose
source files
Directives that allow complete control over the
assembly process
23.3 MPLAB C18 and MPLAB C30
C Compilers
The MPLAB C18 and MPLAB C30 Code Development
Systems are complete ANSI C compilers for
Microchip’s PIC18 and PIC24 families of
microcontrollers and the dsPIC30 and dsPIC33 family
of digital signal controllers. These compilers provide
powerful integration capabilities, superior code
optimization and ease of use not found with other
compilers.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
23.4 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
Efficient linking of single libraries instead of many
smaller files
Enhanced code maintainability by grouping
related modules together
Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
23.5 MPLAB ASM30 Assembler, Linker
and Librarian
MPLAB ASM30 Assembler produces relocatable
machine code from symbolic assembly language for
dsPIC30F devices. MPLAB C30 C Compiler uses the
assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
Support for the entire dsPIC30F instruction set
Support for fixed-point and floating-point data
Command line interface
Rich directive set
Flexible macro language
MPLAB IDE compatibility
23.6 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by
simulating the PIC MCUs and dsPIC® DSCs on an
instruction level. On any given instruction, the data
areas can be examined or modified and stimuli can be
applied from a comprehensive stimulus controller.
Registers can be logged to files for further run-time
analysis. The trace buffer and logic analyzer display
extend the power of the simulator to record and track
program execution, actions on I/O, most peripherals
and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C18 and
MPLAB C30 C Compilers, and the MPASM and
MPLAB ASM30 Assemblers. The software simulator
offers the flexibility to develop and debug code outside
of the hardware laboratory environment, making it an
excellent, economical software development tool.
© 2008 Microchip Technology Inc. DS70149D-page 173
dsPIC30F5015/5016
23.7 MPLAB ICE 2000
High-Performance
In-Circuit Emulator
The MPLAB ICE 2000 In-Circuit Emulator is intended
to provide the product development engineer with a
complete microcontroller design tool set for PIC
microcontrollers. Software control of the MPLAB ICE
2000 In-Circuit Emulator is advanced by the MPLAB
Integrated Development Environment, which allows
editing, building, downloading and source debugging
from a single environment.
The MPLAB ICE 2000 is a full-featured emulator
system with enhanced trace, trigger and data
monitoring features. Interchangeable processor
modules allow the system to be easily reconfigured for
emulation of different processors. The architecture of
the MPLAB ICE 2000 In-Circuit Emulator allows
expansion to support new PIC microcontrollers.
The MPLAB ICE 2000 In-Circuit Emulator system has
been designed as a real-time emulation system with
advanced features that are typically found on more
expensive development tools. The PC platform and
Microsoft® Windows® 32-bit operating system were
chosen to best make these features available in a
simple, unified application.
23.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The MPLAB REAL ICE probe is connected to the design
engineer’s PC using a high-speed USB 2.0 interface and
is connected to the target with either a connector
compatible with the popular MPLAB ICD 2 system
(RJ11) or with the new high-speed, noise tolerant,
Low-Voltage Differential Signal (LVDS) interconnection
(CAT5).
MPLAB REAL ICE is field upgradeable through future
firmware downloads in MPLAB IDE. In upcoming
releases of MPLAB IDE, new devices will be
supported, and new features will be added, such as
software breakpoints and assembly code trace.
MPLAB REAL ICE offers significant advantages over
competitive emulators including low-cost, full-speed
emulation, real-time variable watches, trace analysis,
complex breakpoints, a ruggedized probe interface and
long (up to three meters) interconnection cables.
23.9 MPLAB ICD 2 In-Circuit Debugger
Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a
powerful, low-cost, run-time development tool,
connecting to the host PC via an RS-232 or high-speed
USB interface. This tool is based on the Flash PIC
MCUs and can be used to develop for these and other
PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes
the in-circuit debugging capability built into the Flash
devices. This feature, along with Microchip’s In-Circuit
Serial ProgrammingTM (ICSPTM) protocol, offers
cost-effective, in-circuit Flash debugging from the graph-
ical user interface of the MPLAB Integrated Develop-
ment Environment. This enables a designer to develop
and debug source code by setting breakpoints, single
stepping and watching variables, and CPU status and
peripheral registers. Running at full speed enables
testing hardware and applications in real time. MPLAB
ICD 2 also serves as a development programmer for
selected PIC devices.
23.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a
modular, detachable socket assembly to support
various package types. The ICSP™ cable assembly is
included as a standard item. In Stand-Alone mode, the
MPLAB PM3 Device Programmer can read, verify and
program PIC devices without a PC connection. It can
also set code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an SD/MMC card for
file storage and secure data applications.
dsPIC30F5015/5016
DS70149D-page 174 © 2008 Microchip Technology Inc.
23.11 PICSTART Plus Development
Programmer
The PICSTART Plus Development Programmer is an
easy-to-use, low-cost, prototype programmer. It
connects to the PC via a COM (RS-232) port. MPLAB
Integrated Development Environment software makes
using the programmer simple and efficient. The
PICSTART Plus Development Programmer supports
most PIC devices in DIP packages up to 40 pins.
Larger pin count devices, such as the PIC16C92X and
PIC17C76X, may be supported with an adapter socket.
The PICSTART Plus Development Programmer is CE
compliant.
23.12 PICkit 2 Development Programmer
The PICkit™ 2 Development Programmer is a low-cost
programmer and selected Flash device debugger with
an easy-to-use interface for programming many of
Microchip’s baseline, mid-range and PIC18F families of
Flash memory microcontrollers. The PICkit 2 Starter Kit
includes a prototyping development board, twelve
sequential lessons, software and HI-TECH’s PICC™
Lite C compiler, and is designed to help get up to speed
quickly using PIC® microcontrollers. The kit provides
everything needed to program, evaluate and develop
applications using Microchip’s powerful, mid-range
Flash memory family of microcontrollers.
23.13 Demonstration, Development and
Evaluation Boards
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide application
firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and
demonstration software for analog filter design,
KEELOQ® security ICs, CAN, IrDA®, PowerSmart
battery management, SEEVAL® evaluation system,
Sigma-Delta ADC, flow rate sensing, plus many more.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
© 2008 Microchip Technology Inc. DS70149D-page 175
dsPIC30F5015/5016
24.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings(†)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) (1) ............................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V
Voltage on MCLR with respect to VSS........................................................................................................ 0V to +13.25V
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin(2)...........................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD) ..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports(2)...............................................................................................................200 mA
Note 1: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather
than pulling this pin directly to VSS.
2: Maximum allowable current is a function of device maximum power dissipation. See Table 24-6.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
dsPIC30F5015/5016
DS70149D-page 176 © 2008 Microchip Technology Inc.
24.1 DC Characteristics
TABLE 24-1: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5015
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F5015-30I dsPIC30F5015-20E
4.5-5.5 -40 to +85 30
4.5-5.5 -40 to +125 20
3.0-3.6 -40 to +85 20
3.0-3.6 -40 to +125 15
2.5-3.0 -40 to +85 10
TABLE 24-2: OPERATING MIPS VS. VOLTAGE FOR dsPIC30F5016
VDD Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC30F5016-30I dsPIC30F5016-20E
4.5-5.5 -40 to +85 30
4.5-5.5 -40 to +125 20
3.0-3.6 -40 to +85 20
3.0-3.6 -40 to +125 15
2.5-3.0 -40 to +85 10
TABLE 24-3: THERMAL OPERATING CONDITIONS FOR PIC18FXXXX
Rating Symbol Min Typ Max Unit
dsPIC30F5015-30I/dsPIC30F5016-30I
Operating Junction Temperature Range TJ-40 +125 °C
Operating Ambient Temperature Range TA-40 +85 °C
dsPIC30F5015-20E/dsPIC30F5016-20E
Operating Junction Temperature Range TJ-40 +150 °C
Operating Ambient Temperature Range TA-40 +125 °C
Power Dissipation:
Internal chip power dissipation:
PDPINT + PI/OW
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W
TABLE 24-4: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 80-pin TQFP (12x12x1mm) θJA 39 °C/W 1
Package Thermal Resistance, 64-pin TQFP (10x10x1mm) θJA 39 °C/W 1
Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.
PINT VDD IDD IOH
()×=
PI/OVDD VOH
{}
IOH
×()
VOL IOL
×
()
+=
© 2008 Microchip Technology Inc. DS70149D-page 177
dsPIC30F5015/5016
TABLE 24-5: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Operating Voltage(2)
DC10 VDD Supply Voltage 2.5 5.5 V Industrial temperature
DC11 VDD Supply Voltage 3.0 5.5 V Extended temperature
DC12 VDR RAM Data Retention Voltage(3) 1.75 V
DC16 VPOR VDD Start Voltage
to ensure internal
Power-on Reset signal
——VSS V
DC17 SVDD VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05 V/ms 0-5V in 0.1 sec
0-3V in 60 ms
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: This is the limit to which VDD can be lowered without losing RAM data.
dsPIC30F5015/5016
DS70149D-page 178 © 2008 Microchip Technology Inc.
TABLE 24-6: DC CHARACTERISTICS: OPERATING CURRENT (IDD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC31a 5.6 10 mA 25°C
3.3V
0.128 MIPS
LPRC (512 kHz)
DC31b 5.7 10 mA 85°C
DC31c 5.5 10 mA 125°C
DC31e 14 23 mA 25°C
5VDC31f 15 23 mA 85°C
DC31g 15 23 mA 125°C
DC30a 10 21 mA 25°C
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
DC30b 12 21 mA 85°C
DC30c 14 21 mA 125°C
DC30e 23 38 mA 25°C
5VDC30f 24 38 mA 85°C
DC30g 25 38 mA 125°C
DC23a 30 50 mA 25°C
3.3V
4 MIPS
DC23b 32 50 mA 85°C
DC23c 35 50 mA 125°C
DC23e 32 53 mA 25°C
5VDC23f 34 53 mA 85°C
DC23g 35 53 mA 125°C
DC24a 35 60 mA 25°C
3.3V
10 MIPS
DC24b 37 60 mA 85°C
DC24c 40 60 mA 125°C
DC24e 62 95 mA 25°C
5VDC24f 63 95 mA 85°C
DC24g 65 95 mA 125°C
DC27a 63 95 mA 25°C 3.3V
20 MIPS
DC27b 65 95 mA 85°C
DC27d 108 145 mA 25°C
5VDC27e 127 145 mA 85°C
DC27f 130 145 mA 125°C
DC29a 151 200 mA 25°C 5V 30 MIPS
DC29b 170 200 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption. The test conditions for all IDD measurements are as follows: OSC1
driven with external square wave from rail to rail. All I/O pins are configured as Inputs and pulled to VDD.
MCLR = VDD, WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data
Memory are operational. No peripheral modules are operating.
© 2008 Microchip Technology Inc. DS70149D-page 179
dsPIC30F5015/5016
TABLE 24-7: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Operating Current (IDD)(2)
DC51a 5.2 9 mA 25°C
3.3V
0.128 MIPS
LPRC (512 kHz)
DC51b 5.3 9 mA 85°C
DC51c 5.4 9 mA 125°C
DC51e 13 22 mA 25°C
5VDC51f 14 22 mA 85°C
DC51g 15 22 mA 125°C
DC50a 8.1 13 mA 25°C
3.3V
(1.8 MIPS)
FRC (7.37 MHz)
DC50b 8.2 13 mA 85°C
DC50c 8.3 13 mA 125°C
DC50e 19 32 mA 25°C
5VDC50f 20 32 mA 85°C
DC50g 21 32 mA 125°C
DC43a 12 26 mA 25°C
3.3V
4 MIPS
DC43b 14 26 mA 85°C
DC43c 17 26 mA 125°C
DC43e 25 42 mA 25°C
5VDC43f 26 42 mA 85°C
DC43g 28 42 mA 125°C
DC44a 23 40 mA 25°C
3.3V
10 MIPS
DC44b 25 40 mA 85°C
DC44c 26 40 mA 125°C
DC44e 42 68 mA 25°C
5VDC44f 43 68 mA 85°C
DC44g 45 68 mA 125°C
DC47a 40 55 mA 25°C 3.3V
20 MIPS
DC47b 40 55 mA 85°C
DC47d 70 85 mA 25°C
5VDC47e 72 85 mA 85°C
DC47f 74 85 mA 125°C
DC49a 98 120 mA 25°C 5V 30 MIPS
DC49b 103 120 mA 85°C
Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2: Base IIDLE current is measured with Core off, Clock on and all modules turned off.
dsPIC30F5015/5016
DS70149D-page 180 © 2008 Microchip Technology Inc.
TABLE 24-8: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Parameter
No. Typical(1) Max Units Conditions
Power Down Current (IPD)(2)
DC60a 0.2 μA 25°C
3.3V
Base Power Down Current
DC60b 0.7 40 μA 85°C
DC60c 12 65 μA125°C
DC60e 0.4 μA 25°C
5VDC60f 1.7 55 μA 85°C
DC60g 16 90 μA125°C
DC61a 10 30 μA 25°C
3.3V
Watchdog Timer Current: ΔIWDT(3)
DC61b 12 30 μA 85°C
DC61c 12 30 μA125°C
DC61e 20 40 μA 25°C
5VDC61f 22 40 μA 85°C
DC61g 23 40 μA125°C
DC62a 4 10 μA 25°C
3.3V
Timer 1 w/32 kHz Crystal: ΔITI32(3)
DC62b 5 10 μA 85°C
DC62c 4 10 μA125°C
DC62e 4 15 μA 25°C
5VDC62f 6 15 μA 85°C
DC62g 5 15 μA125°C
DC63a 33 65 μA 25°C
3.3V
BOR On: ΔIBOR(3)
DC63b 38 65 μA 85°C
DC63c 39 65 μA125°C
DC63e 38 70 μA 25°C
5VDC63f 41 70 μA 85°C
DC63g 42 70 μA125°C
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
© 2008 Microchip Technology Inc. DS70149D-page 181
dsPIC30F5015/5016
TABLE 24-9: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VIL Input Low Voltage(2)
DI10 I/O pins:
with Schmitt Trigger buffer VSS —0.2VDD V
DI15 MCLR VSS —0.2VDD V
DI16 OSC1 (in XT, HS and LP modes) VSS —0.2VDD V
DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V
DI18 SDA, SCL VSS —0.3VDD V SMbus disabled
DI19 SDA, SCL VSS —0.2VDD V SMbus enabled
VIH Input High Voltage(2)
DI20 I/O pins:
with Schmitt Trigger buffer 0.8 VDD —VDD V
DI25 MCLR 0.8 VDD —VDD V
DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V
DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V
DI28 SDA, SCL 0.7 VDD —VDD V SMbus disabled
DI29 SDA, SCL 0.8 VDD —VDD V SMbus enabled
ICNPU CNXX Pull-up Current(2)
DI30 50 250 400 μAVDD = 5V, VPIN = VSS
IIL Input Leakage Current(2)(4)(5)
DI50 I/O ports 0.01 ±1 μAVSS VPIN VDD,
Pin at high-impedance
DI51 Analog Input Pins 0.50 μAVSS VPIN VDD,
Pin at high-impedance
DI55 MCLR —0.05±5 μAVSS VPIN VDD
DI56 OSC1 0.05 ±5 μAVSS VPIN VDD, XT, HS
and LP Osc mode
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that
the dsPIC30F device be driven with an external clock while in RC mode.
4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
5: Negative current is defined as current sourced by the pin.
dsPIC30F5015/5016
DS70149D-page 182 © 2008 Microchip Technology Inc.
FIGURE 24-1: BROWN-OUT RESET CHARACTERISTICS
TABLE 24-10: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
VOL Output Low Voltage(2)
DO10 I/O ports 0.6 V IOL = 8.5 mA, VDD = 5V
0.15 V IOL = 2.0 mA, VDD = 3V
DO16 OSC2/CLKO 0.6 V IOL = 1.6 mA, VDD = 5V
(RC or EC Osc mode) 0.72 V IOL = 2.0 mA, VDD = 3V
VOH Output High Voltage(2)
DO20 I/O ports VDD – 0.7 V IOH = -3.0 mA, VDD = 5V
VDD – 0.2 V IOH = -2.0 mA, VDD = 3V
DO26 OSC2/CLKO VDD – 0.7 V IOH = -1.3 mA, VDD = 5V
(RC or EC Osc mode) VDD – 0.1 V IOH = -2.0 mA, VDD = 3V
Capacitive Loading Specs
on Output Pins(2)
DO50 COSC2 OSC2/SOSC2 pin 15 pF In XTL, XT, HS and LP modes
when external clock is used to
drive OSC1.
DO56 CIO All I/O pins and OSC2 50 pF RC or EC Osc mode
DO58 CBSCL, SDA 400 pF In I2C™ mode
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
BO10
Reset (due to BOR)
VDD
(Device in Brown-out Reset)
(Device not in Brown-out Reset)
Power-up Time-out
BO15
© 2008 Microchip Technology Inc. DS70149D-page 183
dsPIC30F5015/5016
TABLE 24-11: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
BO10 VBOR BOR Voltage(2) on
VDD transition
low-to-high
BORV = 11(3) V Not in operating
range
BORV = 10 2.6 2.71 V
BORV = 01 4.1 4.4 V
BORV = 00 4.58 4.73 V
BO15 VBHYS —5 mV
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: 11’ values not in usable operating range.
TABLE 24-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
DC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ(1) Max Units Conditions
Data EEPROM Memory(2)
D120 EDByte Endurance 100K 1M E/W -40°C TA +85°C
D121 VDRW VDD for Read/Write VMIN 5.5 V Using EECON to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time 2 ms
D123 TRETD Characteristic Retention 40 100 Year Provided no other specifications
are violated
D124 IDEW IDD During Programming 10 30 mA Row Erase
Program FLASH
Memory(2)
D130 EPCell Endurance 10K 100K E/W -40°C TA +85°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VEB VDD for Bulk Erase 4.5 5.5 V
D133 VPEW VDD for Erase/Write 3.0 5.5 V
D134 TPEW Erase/Write Cycle Time 1 2 ms
D135 TRETD Characteristic Retention 40 100 Year Provided no other specifications
are violated
D136 TEB ICSP™ Block Erase Time 4 ms
D137 IPEW IDD During Programming 10 30 mA Row Erase
D138 IEB IDD During Programming 10 30 mA Bulk Erase
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
2: These parameters are characterized but not tested in manufacturing.
dsPIC30F5015/5016
DS70149D-page 184 © 2008 Microchip Technology Inc.
24.2 AC Characteristics and Timing Parameters
The information contained in this section defines dsPIC30F AC characteristics and timing parameters.
FIGURE 24-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
FIGURE 24-3: EXTERNAL CLOCK TIMING
TABLE 24-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Operating voltage VDD range as described in DC Spec Section 24.1 “DC
Characteristics”.
VDD/2
CL
RL
Pin
Pin
VSS
VSS
CL
RL=464Ω
CL= 50 pF for all pins except OSC2
5 pF for OSC2 output
Load Condition 1 – for all pins except OSC2 Load Condition 2 – for OSC2
OSC1
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
OS20
OS25
OS30 OS30
OS40 OS41
OS31 OS31
© 2008 Microchip Technology Inc. DS70149D-page 185
dsPIC30F5015/5016
TABLE 24-14: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No.
Symb
ol Characteristic Min Typ(1) Max Units Conditions
OS10 FOSC External CLKI Frequency(2)
(External clocks allowed only
in EC mode)
DC
4
4
4
40
10
10
7.5(3)
MHz
MHz
MHz
MHz
EC
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
Oscillator Frequency(2) DC
0.4
4
4
4
4
10
10
10
10
12(4)
12(4)
12(4)
32.768
4
4
10
10
10
7.5(3)
25
20(4)
20(4)
15(3)
25
25
22.5(3)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
kHz
RC
XTL
XT
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
LP
OS20 TOSC TOSC = 1/FOSC See parameter OS10
for FOSC value
OS25 TCY Instruction Cycle Time(2)(5) 33 DC ns See Table 24-16
OS30 TosL,
Tos H
External Clock(2) in (OSC1)
High or Low Time
.45 x TOSC ——nsEC
OS31 TosR,
Tos F
External Clock(2) in (OSC1)
Rise or Fall Time
——20nsEC
OS40 TckR CLKO Rise Time(2)(6) ns See parameter DO31
OS41 TckF CLKO Fall Time(2)(6) ns See parameter DO32
Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
2: These parameters are characterized but not tested in manufacturing.
3: Limited by the PLL output frequency range.
4: Limited by the PLL input frequency range.
5: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “Min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“Max.” cycle time limit is “DC” (no clock) for all devices.
6: Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is
low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).
dsPIC30F5015/5016
DS70149D-page 186 © 2008 Microchip Technology Inc.
TABLE 24-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OS50 FPLLI PLL Input Frequency Range(2) 4
4
4
4
4
4
5(3)
5(3)
5(3)
4
4
4
10
10
7.5(4)
10
10
7.5(4)
10
10
7.5(4)
8.33(3)
8.33(3)
7.5(4)
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
EC with 4x PLL
EC with 8x PLL
EC with 16x PLL
XT with 4x PLL
XT with 8x PLL
XT with 16x PLL
HS/2 with 4x PLL
HS/2 with 8x PLL
HS/2 with 16x PLL
HS/3 with 4x PLL
HS/3 with 8x PLL
HS/3 with 16x PLL
OS51 FSYS On-Chip PLL Output(2) 16 120 MHz EC, XT, HS/2, HS/3 modes
with PLL
OS52 TLOC PLL Start-up Time (Lock Time) 20 50 μs
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: Limited by oscillator frequency range.
4: Limited by device operating frequency range.
TABLE 24-16: PLL JITTER
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ(1) Max Units Conditions
OS61 x4 PLL 0.251 0.413 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.251 0.413 % -40°C TA +125°C VDD = 3.0 to 3.6V
0.256 0.47 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.256 0.47 % -40°C TA +125°C VDD = 4.5 to 5.5V
x8 PLL 0.355 0.584 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.355 0.584 % -40°C TA +125°C VDD = 3.0 to 3.6V
0.362 0.664 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.362 0.664 % -40°C TA +125°C VDD = 4.5 to 5.5V
x16 PLL 0.67 0.92 % -40°C TA +85°C VDD = 3.0 to 3.6V
0.632 0.956 % -40°C TA +85°C VDD = 4.5 to 5.5V
0.632 0.956 % -40°C TA +125°C VDD = 4.5 to 5.5V
Note 1: These parameters are characterized but not tested in manufacturing.
© 2008 Microchip Technology Inc. DS70149D-page 187
dsPIC30F5015/5016
TABLE 24-17: INTERNAL CLOCK TIMING EXAMPLES
Clock
Oscillator
Mode
FOSC
(MHz)(1) TCY (μsec)(2) MIPS(3)
w/o PLL
MIPS(3)
w PLL x4
MIPS(3)
w PLL x8
MIPS(3)
w PLL x16
EC 0.200 20.0 0.05
4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0
25 0.16 6.25
XT 4 1.0 1.0 4.0 8.0 16.0
10 0.4 2.5 10.0 20.0
Note 1: Assumption: Oscillator Postscaler is divide by 1.
2: Instruction Execution Cycle Time: TCY = 1/MIPS.
3: Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4 (since there are 4 Q clocks per instruction
cycle).
dsPIC30F5015/5016
DS70149D-page 188 © 2008 Microchip Technology Inc.
TABLE 24-18: AC CHARACTERISTICS: INTERNAL FRC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1)
OS63 FRC ±2.00 % -40°C TA +85°C VDD = 3.0-5.5V
±5.00 % -40°C TA +125°C VDD = 3.0-5.5V
Note 1: Frequency calibrated at 25°C and 5V. TUN bits can be used to compensate for temperature drift.
TABLE 24-19: AC CHARACTERISTICS: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Characteristic Min Typ Max Units Conditions
LPRC @ Freq. = 512 kHz(1)
OS65A -50 +50 % VDD = 5.0V, ±10%
OS65B -60 +60 % VDD = 3.3V, ±10%
OS65C -70 +70 % VDD = 2.5V
Note 1: Change of LPRC frequency as VDD changes.
© 2008 Microchip Technology Inc. DS70149D-page 189
dsPIC30F5015/5016
FIGURE 24-4: CLKO AND I/O TIMING CHARACTERISTICS
TABLE 24-20: CLKO AND I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions
DO31 TIOR Port output rise time 7 20 ns
DO32 TIOF Port output fall time 7 20 ns
DI35 TINP INTx pin high or low time (output) 20 ns
DI40 TRBP CNx high or low time (input) 2 TCY ——ns
Note 1: These parameters are asynchronous events not related to any internal clock edges.
2: Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.
3: These parameters are characterized but not tested in manufacturing.
4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Note: Refer to Figure 24-2 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
dsPIC30F5015/5016
DS70149D-page 190 © 2008 Microchip Technology Inc.
FIGURE 24-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
SY11
SY10
SY20
SY13
I/O Pins
SY13
Note: Refer to Figure 24-2 for load conditions.
FSCM
Delay
SY35
SY30
SY12
© 2008 Microchip Technology Inc. DS70149D-page 191
dsPIC30F5015/5016
FIGURE 24-6: BAND GAP START-UP TIME CHARACTERISTICS
TABLE 24-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SY10 TmcL MCLR Pulse Width (low) 2 μs -40°C to +85°C
SY11 TPWRT Power-up Timer Period 2
10
43
4
16
64
8
32
128
ms -40°C to +85°C, VDD =
5V
User programmable
SY12 TPOR Power-on Reset Delay(4) 31030μs -40°C to +85°C
SY13 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset
—0.81.0μs
SY20 TWDT1
TWDT2
TWDT3
Watchdog Timer Time-out Period
(No Prescaler)
1.1
1.2
1.3
2.0
2.0
2.0
6.6
5.0
4.0
ms
ms
ms
VDD = 2.5V
VDD = 3.3V, ±10%
VDD = 5V, ±10%
SY25 TBOR Brown-out Reset Pulse Width(3) 100 μsVDD VBOR (D034)
SY30 TOST Oscillator Start-up Timer Period
1024 T
OSC
——TOSC = OSC1 period
SY35 TFSCM Fail-Safe Clock Monitor Delay 500 900 μs -40°C to +85°C
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.
3: Refer to Figure 24-1 and Table 24-11 for BOR.
4: Characterized by design but not tested.
TABLE 24-22: BAND GAP START-UP TIME REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
SY40 TBGAP Band Gap Start-up Time 40 65 µs Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable
(RCON<13> Status bit).
Note 1: These parameters are characterized but not tested in manufacturing.
VBGAP
Enable Band Gap
Band Gap
0V
(see Note)
Stable
Note: Set FBORPOR<7>.
SY40
dsPIC30F5015/5016
DS70149D-page 192 © 2008 Microchip Technology Inc.
FIGURE 24-7: TIMER1, 2, 3, 4 AND 5 EXTERNAL CLOCK TIMING CHARACTERISTICS
TABLE 24-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TA10 TTXH TxCK High Time Synchronous,
no prescaler
0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler
10 ns
Asynchronous 10 ns
TA11 TTXL TxCK Low Time Synchronous,
no prescaler
0.5 TCY + 20 ns Must also meet
parameter TA15
Synchronous,
with prescaler
10 ns
Asynchronous 10 ns
TA15 TTXP TxCK Input Period Synchronous,
no prescaler
TCY + 10 ns
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
N = prescale
value
(1, 8, 64, 256)
Asynchronous 20 ns
OS60 Ft1 SOSC1/T1CK oscillator input
frequency range (oscillator enabled
by setting bit TCS (T1CON, bit 1))
DC 50 kHz
TA20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
0.5 TCY 1.5 TCY
Note 1: Timer1 is a Type A.
Note: Refer to Figure 24-2 for load conditions.
Tx11
Tx15
Tx10
Tx20
TMRX
OS60
TxCK
© 2008 Microchip Technology Inc. DS70149D-page 193
dsPIC30F5015/5016
TABLE 24-24: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TB10 TtxH TxCK High Time Synchronous,
no prescaler
0.5 TCY + 20 ns Must also meet
parameter TB15
Synchronous,
with prescaler
10 — ns
TB11 TtxL TxCK Low Time Synchronous,
no prescaler
0.5 TCY + 20 ns Must also meet
parameter TB15
Synchronous,
with prescaler
10 ns
TB15 TtxP TxCK Input Period Synchronous,
no prescaler
T
CY + 10 ns N = prescale
value
(1, 8, 64, 256)
Synchronous,
with prescaler
Greater of:
20 ns or
(TCY + 40)/N
TB20 TCKEXT-
MRL
Delay from External TxCK Clock
Edge to Timer Increment
0.5 TCY 1.5 TCY
TABLE 24-25: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 ns Must also meet
parameter TC15
TC15 TtxP TxCK Input Period Synchronous,
no prescaler
TCY + 10 ns N = prescale
value
(1, 8, 64, 256)
Synchronous,
with prescaler
Greater of:
20 ns or
(T
CY + 40)/N
TC20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
0.5 TCY —1.5
TCY
dsPIC30F5015/5016
DS70149D-page 194 © 2008 Microchip Technology Inc.
FIGURE 24-8: TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
TABLE 24-26: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ Max Units Conditions
TQ10 TtQH TQCK High Time Synchronous,
with prescaler
TCY + 20 ns Must also meet
parameter TQ15
TQ11 TtQL TQCK Low Time Synchronous,
with prescaler
TCY + 20 ns Must also meet
parameter TQ15
TQ15 TtQP TQCP Input
Period
Synchronous,
with prescaler
2 * TCY + 40 ns
TQ20 TCKEXTMRL Delay from External TxCK Clock
Edge to Timer Increment
0.5 TCY 1.5 TCY ns
Note 1: These parameters are characterized but not tested in manufacturing.
TQ11
TQ15
TQ10
TQ20
QEB
POSCNT
© 2008 Microchip Technology Inc. DS70149D-page 195
dsPIC30F5015/5016
FIGURE 24-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS
FIGURE 24-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS
TABLE 24-27: INPUT CAPTURE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC11 TccH ICx Input High Time No Prescaler 0.5 TCY + 20 ns
With Prescaler 10 ns
IC15 TccP ICx Input Period (2 TCY + 40)/N ns N = prescale
value (1, 4, 16)
Note 1: These parameters are characterized but not tested in manufacturing.
TABLE 24-28: OUTPUT COMPARE MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC10 TccF OCx Output Fall Time ns See parameter DO32
OC11 TccR OCx Output Rise Time ns See parameter DO31
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
ICX
IC10 IC11
IC15
Note: Refer to Figure 24-2 for load conditions.
OCx
OC11 OC10
(Output Compare
Note: Refer to Figure 24-2 for load conditions.
or PWM Mode)
dsPIC30F5015/5016
DS70149D-page 196 © 2008 Microchip Technology Inc.
FIGURE 24-11: OC/PWM MODULE TIMING CHARACTERISTICS
TABLE 24-29: SIMPLE OC/PWM MODE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
OC15 TFD Fault Input to PWM I/O
Change
50 ns
OC20 TFLT Fault Input Pulse Width 50 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
OCFA/OCFB
OCx
OC20
OC15
© 2008 Microchip Technology Inc. DS70149D-page 197
dsPIC30F5015/5016
FIGURE 24-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS
FIGURE 24-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS
TABLE 24-30: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
MP10 TFPWM PWM Output Fall Time ns See parameter DO32
MP11 TRPWM PWM Output Rise Time ns See parameter DO31
MP20 TFD Fault Input to PWM
I/O Change
——50ns
MP30 TFH Minimum Pulse Width 50 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
FLTA/B
PWMx
MP30
MP20
PWMx
MP11 MP10
Note: Refer to Figure 24-2 for load conditions.
dsPIC30F5015/5016
DS70149D-page 198 © 2008 Microchip Technology Inc.
FIGURE 24-14: QEA/QEB INPUT CHARACTERISTICS
TABLE 24-31: QUADRATURE DECODER TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Typ(2) Max Units Conditions
TQ30 TQUL Quadrature Input Low Time 6 TCY —ns
TQ31 TQUH Quadrature Input High Time 6 TCY —ns
TQ35 TQUIN Quadrature Input Period 12 TCY —ns
TQ36 TQUP Quadrature Phase Period 3 TCY —ns
TQ40 TQUFL Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ41 TQUFH Filter Time to Recognize High,
with Digital Filter
3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
Note 1: These parameters are characterized but not tested in manufacturing.
2: N = Index Channel Digital Filter Clock Divide Select Bits. Refer to Section 16. “Quadrature Encoder
Interface (QEI)” in the “dsPIC30F Family Reference Manual” (DS70046).
TQ30
TQ35
TQ31
QEA
(input)
TQ30
TQ35
TQ31
QEB
(input)
TQ36
QEB
Internal
TQ40TQ41
© 2008 Microchip Technology Inc. DS70149D-page 199
dsPIC30F5015/5016
FIGURE 24-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS
TABLE 24-32: QEI INDEX PULSE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Max Units Conditions
TQ50 TqIL Filter Time to Recognize Low,
with Digital Filter
3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ51 TqiH Filter Time to Recognize High,
with Digital Filter
3 * N * TCY ns N = 1, 2, 4, 16, 32, 64,
128 and 256 (Note 2)
TQ55 Tqidxr Index Pulse Recognized to Position
Counter Reset (Ungated Index)
3 TCY —ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Alignment of index pulses to QEA and QEB is shown for position counter reset timing only. Shown for
forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but
index pulse recognition occurs on falling edge.
QEA
(input)
Ungated
Index
QEB
(input)
TQ55
Index Internal
Position Coun-
TQ50
TQ51
dsPIC30F5015/5016
DS70149D-page 200 © 2008 Microchip Technology Inc.
FIGURE 24-16: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
TABLE 24-33: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX Output Low Time(3) TCY/2 ns
SP11 TscH SCKX Output High Time(3) TCY/2 ns
SP20 TscF SCKX Output Fall Time(4) ns See parameter DO32
SP21 TscR SCKX Output Rise Time(4) ns See parameter DO31
SP30 TdoF SDOX Data Output Fall Time(4) ns See parameter DO32
SP31 TdoR SDOX Data Output Rise Time(4) ns See parameter DO31
SP35 TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
——30ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20 ns
SP41 TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP11 SP10
SP40 SP41
SP21
SP20
SP35
SP20
SP21
MSb LSb
BIT14 - - - - - -1
MSb IN LSb IN
BIT14 - - - -1
SP30
SP31
Note: Refer to Figure 24-2 for load conditions.
© 2008 Microchip Technology Inc. DS70149D-page 201
dsPIC30F5015/5016
FIGURE 24-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS
TABLE 24-34: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP10 TscL SCKX output low time(3) TCY/2 ns
SP11 TscH SCKX output high time(3) TCY/2 ns
SP20 TscF SCKX output fall time(4) ns See parameter DO32
SP21 TscR SCKX output rise time(4) ns See parameter DO31
SP30 TdoF SDOX data output fall time(4) ns See parameter DO32
SP31 TdoR SDOX data output rise time(4) ns See parameter DO31
SP35 TscH2doV,
TscL2doV
SDOX data output valid after
SCKX edge
——ns
SP36 TdoV2sc,
TdoV2scL
SDOX data output setup to
first SCKX edge
30 ns
SP40 TdiV2scH,
TdiV2scL
Setup time of SDIX data input
to SCKX edge
20 ns
SP41 TscH2diL,
TscL2diL
Hold time of SDIX data input
to SCKX edge
20 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDIX
SP36
SP30,SP31
SP35
MSb
MSb IN
BIT14 - - - - - -1
LSb IN
BIT14 - - - -1
LSb
Note: Refer to Figure 24-2 for load conditions.
SP11 SP10 SP20
SP21
SP21
SP20
SP40
SP41
dsPIC30F5015/5016
DS70149D-page 202 © 2008 Microchip Technology Inc.
FIGURE 24-18: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Time 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) —1025ns
SP73 TscR SCKX Input Rise Time(3) —1025ns
SP30 TdoF SDOX Data Output Fall Time(3) ns See parameter DO32
SP31 TdoR SDOX Data Output Rise Time(3) ns See parameter DO31
SP35 TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
——30ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20 ns
SP41 TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20 ns
SP50 TssL2scH,
TssL2scL
SSX to SCKX or SCKX Input 120 ns
SP51 TssH2doZ SSX to SDOX Output
High-Impedance(3)
10 50 ns
SP52 TscH2ssH
TscL2ssH
SSX after SCK Edge 1.5 TCY +40 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: Assumes 50 pF load on all SPI pins.
SS
X
SCK
X
(CKP =
0
)
SCK
X
(CKP =
1
)
SDO
X
SDI
SP50
SP40
SP41
SP30,SP31 SP51
SP35
SDI
X
MSb LSb
BIT14 - - - - - -1
MSb IN BIT14 - - - -1 LSb IN
SP52
SP73
SP72
SP72
SP73
SP71 SP70
Note: Refer to Figure 24-2 for load conditions.
© 2008 Microchip Technology Inc. DS70149D-page 203
dsPIC30F5015/5016
FIGURE 24-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SSX
SCKX
(CKP = 0)
SCKX
(CKP = 1)
SDOX
SDI
SP50
SP60
SDIX
SP30,SP31
MSb BIT14 - - - - - -1 LSb
SP51
MSb IN BIT14 - - - -1 LSb IN
SP35
SP52
SP52
SP73
SP72
SP72
SP73
SP71 SP70
SP40
SP41
Note: Refer to Figure 24-2 for load conditions.
dsPIC30F5015/5016
DS70149D-page 204 © 2008 Microchip Technology Inc.
TABLE 24-36: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
SP70 TscL SCKX Input Low Time 30 ns
SP71 TscH SCKX Input High Time 30 ns
SP72 TscF SCKX Input Fall Time(3) —1025ns
SP73 TscR SCKX Input Rise Time(3) —1025ns
SP30 TdoF SDOX Data Output Fall Time(3) ns See parameter
DO32
SP31 TdoR SDOX Data Output Rise Time(3) ns See parameter
DO31
SP35 TscH2doV,
TscL2doV
SDOX Data Output Valid after
SCKX Edge
30 ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDIX Data Input
to SCKX Edge
20 ns
SP41 TscH2diL,
TscL2diL
Hold Time of SDIX Data Input
to SCKX Edge
20 ns
SP50 TssL2scH,
TssL2scL
SSX to SCKX or SCKX input 120 ns
SP51 TssH2doZ SS to SDOX Output
High-Impedance(4)
10 50 ns
SP52 TscH2ssH
TscL2ssH
SSX after SCKX Edge 1.5 TCY + 40 ns
SP60 TssL2doV SDOX Data Output Valid after
SSX Edge
50 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4: Assumes 50 pF load on all SPI pins.
© 2008 Microchip Technology Inc. DS70149D-page 205
dsPIC30F5015/5016
FIGURE 24-20: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
FIGURE 24-21: I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
IM31 IM34
SCL
SDA
Start
Condition
Stop
Condition
IM30 IM33
Note: Refer to Figure 24-2 for load conditions.
IM11 IM10 IM33
IM11
IM10
IM20
IM26 IM25
IM40 IM40 IM45
IM21
SCL
SDA
In
SDA
Out
Note: Refer to Figure 24-2 for load conditions.
dsPIC30F5015/5016
DS70149D-page 206 © 2008 Microchip Technology Inc.
TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min(1) Max Units Conditions
IM10 TLO:SCL Clock Low Time 100 kHz mode TCY/2 (BRG + 1) μs
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM11 THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) μs
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM20 TF:SCL SDA and SCL
Fall Time
100 kHz mode 300 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 100 ns
IM21 TR:SCL SDA and SCL
Rise Time
100 kHz mode 1000 ns CB is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(2) 300 ns
IM25 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(2) — — ns
IM26 THD:DAT Data Input
Hold Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
1 MHz mode(2) — — ns
IM30 TSU:STA Start Condition
Setup Time
100 kHz mode TCY/2 (BRG + 1) μs Only relevant for
repeated Start
condition
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM31 THD:STA Start Condition
Hold Time
100 kHz mode TCY/2 (BRG + 1) μs After this period the
first clock pulse is
generated
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM33 TSU:STO Stop Condition
Setup Time
100 kHz mode TCY/2 (BRG + 1) μs
400 kHz mode TCY/2 (BRG + 1) μs
1 MHz mode(2) TCY/2 (BRG + 1) μs
IM34 THD:STO Stop Condition 100 kHz mode TCY/2 (BRG + 1) ns
Hold Time 400 kHz mode T
CY/2 (BRG + 1) ns
1 MHz mode(2) TCY/2 (BRG + 1) ns
IM40 TAA:SCL Output Valid
From Clock
100 kHz mode 3500 ns
400 kHz mode 1000 ns
1 MHz mode(2) ——ns
IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be
free before a new
transmission can start
400 kHz mode 1.3 μs
1 MHz mode(2) ——μs
IM50 CBBus Capacitive Loading 400 pF
Note 1: BRG is the value of the I2C Baud Rate Generator. Refer to Section 21. “Inter-Integrated Circuit (I2C™)”
in the dsPIC30F Family Reference Manual.
2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
© 2008 Microchip Technology Inc. DS70149D-page 207
dsPIC30F5015/5016
FIGURE 24-22: I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 24-23: I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS31 IS34
SCL
SDA
Start
Condition
Stop
Condition
IS30 IS33
IS30 IS31 IS33
IS11
IS10
IS20
IS26 IS25
IS40 IS40 IS45
IS21
SCL
SDA
In
SDA
Out
dsPIC30F5015/5016
DS70149D-page 208 © 2008 Microchip Technology Inc.
TABLE 24-38: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min Max Units Conditions
IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 μs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs
IS11 THI:SCL Clock High Time 100 kHz mode 4.0 μs Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 μs Device must operate at a
minimum of 10 MHz
1 MHz mode(1) 0.5 μs
IS20 TF:SCL SDA and SCL
Fall Time
100 kHz mode 300 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) —100ns
IS21 TR:SCL SDA and SCL
Rise Time
100 kHz mode 1000 ns CB is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 CB300 ns
1 MHz mode(1) —300ns
IS25 TSU:DAT Data Input
Setup Time
100 kHz mode 250 ns
400 kHz mode 100 ns
1 MHz mode(1) 100 ns
IS26 THD:DAT Data Input
Hold Time
100 kHz mode 0 ns
400 kHz mode 0 0.9 μs
1 MHz mode(1) 00.3μs
IS30 TSU:STA Start Condition
Setup Time
100 kHz mode 4.7 μs Only relevant for repeated
Start condition
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS31 THD:STA Start Condition
Hold Time
100 kHz mode 4.0 μs After this period, the first
clock pulse is generated
400 kHz mode 0.6 μs
1 MHz mode(1) 0.25 μs
IS33 TSU:STO Stop Condition
Setup Time
100 kHz mode 4.7 μs
400 kHz mode 0.6 μs
1 MHz mode(1) 0.6 μs
IS34 THD:STO Stop Condition 100 kHz mode 4000 ns
Hold Time 400 kHz mode 600 ns
1 MHz mode(1) 250 ns
IS40 TAA:SCL Output Valid
From Clock
100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode(1) 0350ns
IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 μs Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 μs
1 MHz mode(1) 0.5 μs
IS50 CBBus Capacitive Loading 400 pF
Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).
© 2008 Microchip Technology Inc. DS70149D-page 209
dsPIC30F5015/5016
FIGURE 24-24: CAN MODULE I/O TIMING CHARACTERISTICS
TABLE 24-39: CAN MODULE I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions
CA10 TioF Port Output Fall Time ns See parameter DO32
CA11 TioR Port Output Rise Time ns See parameter DO31
CA20 Tcwf Pulse Width to Trigger
CAN Wake-up Filter
500 ns
Note 1: These parameters are characterized but not tested in manufacturing.
2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
CXTX Pin
(output)
CA10 CA11
Old Value New Value
CA20
CXRX Pin
(input)
dsPIC30F5015/5016
DS70149D-page 210 © 2008 Microchip Technology Inc.
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1)
AC CHARACTERISTICS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Device Supply
AD01 AVDD Module VDD Supply Greater of
VDD – 0.3
or 2.7
Lesser of
VDD + 0.3
or 5.5
V
AD02 AVSS Module VSS Supply Vss – 0.3 VSS + 0.3 V
Reference Inputs
AD05 VREFH Reference Voltage High AVss + 2.7 AVDD V
AD06 VREFL Reference Voltage Low AVss AVDD – 2.7 V
AD07 VREF Absolute Reference Voltage AVss – 0.3 AVDD + 0.3 V
AD08 IREF Current Drain 200
.001
300
3
μA
μA
A/D operating
A/D off
Analog Input
AD10 VINH-VINL Full-Scale Input Span VREFL —VREFH V
AD12 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
Source Impedance = 5 kΩ
AD13 Leakage Current ±0.001 ±0.244 μAV
INL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Source Impedance = 5 kΩ
AD17 RIN Recommended Impedance
of Analog Voltage Source
——ΩSee Table 21-2
DC Accuracy
AD20 Nr Resolution 10 data bits bits
AD21 INL Integral Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD21A INL Integral Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD22 DNL Differential Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD22A DNL Differential Nonlinearity(2) —±1±1LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD23 GERR Gain Error(2) —±5±6LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD23A GERR Gain Error(2) —±5±6LSbVINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
Note 1: These parameters are characterized but not tested in manufacturing.
2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
3: The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
© 2008 Microchip Technology Inc. DS70149D-page 211
dsPIC30F5015/5016
AD24 EOFF Offset Error(2) ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 5V
AD24A EOFF Offset Error(2) ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V,
AVDD = VREFH = 3V
AD25 Monotonicity(3) Guaranteed
Dynamic Performance
AD30 THD Total Harmonic Distortion -64 -67 dB
AD31 SINAD Signal to Noise and
Distortion
—5758dB
AD32 SFDR Spurious Free Dynamic
Range
—6771dB
AD33 FNYQ Input Signal Bandwidth 500 kHz
AD34 ENOB Effective Number of Bits 9.29 9.41 bits
TABLE 24-40: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS(1) (CONTINUED)
AC CHARACTERISTICS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ Max. Units Conditions
Note 1: These parameters are characterized but not tested in manufacturing.
2: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.
3: The A/D conversion result never decreases with an increase in the input voltage, and has no missing
codes.
dsPIC30F5015/5016
DS70149D-page 212 © 2008 Microchip Technology Inc.
FIGURE 24-25: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000)
AD55
TSAMP
CLEAR SAMPSET SAMP
AD61
ADCLK
Instruction
SAMP
ch0_dischrg
ch1_samp
AD60
DONE
ADIF
ADRES(0)
ADRES(1)
1 2 3 4 5 6 8 5 6 7
1– Software sets ADCON. SAMP to start sampling.
2– Sampling starts after discharge period.
3– Software clears ADCON. SAMP to start conversion.
4– Sampling ends, conversion sequence starts.
5– Convert bit 9.
8– One TAD for end of conversion.
AD50
ch0_samp
ch1_dischrg
eoc
7
AD55
8
6– Convert bit 8.
7– Convert bit 0.
Execution
TSAMP is described in Section 17. “10-bit A/D Converter” of the “dsPIC30F Family Reference Manual” (DS70046).
© 2008 Microchip Technology Inc. DS70149D-page 213
dsPIC30F5015/5016
FIGURE 24-26: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS
(CHPS = 01, SIMSAM = 0, ASAM = 1, SSRC = 111, SAMC = 00001)
AD55
TSAMP
SET ADON
ADCLK
Instruction
SAMP
ch0_dischrg
ch1_samp
DONE
ADIF
ADRES(0)
ADRES(1)
1 2 3 4 5 6 4 5 6 8
1– Software sets ADCON. ADON to start AD operation.
2– Sampling starts after discharge period.
3– Convert bit 9.
4– Convert bit 8.
5– Convert bit 0.
AD50
ch0_samp
ch1_dischrg
eoc
7 3
AD55
6– One TAD for end of conversion.
7– Begin conversion of next channel.
8– Sample for time specified by SAMC.
TSAMP
TCONV
3 4
Execution
TSAMP is described in Section 17. “10-bit A/D Converter”
of the dsPIC30f Family Reference Manual” (DS70046).
TSAMP is described in Section 17. “10-bit Converter”
of the dsPIC30f Family Reference Manual” (DS70046).
dsPIC30F5015/5016
DS70149D-page 214 © 2008 Microchip Technology Inc.
TABLE 24-41: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 2.7V to 5.5V
(unless otherwise stated)
Operating temperature -40°C TA +85°C for Industrial
-40°C TA +125°C for Extended
Param
No. Symbol Characteristic Min. Typ(1) Max. Units Conditions
Clock Parameters
AD50 TAD A/D Clock Period 84(2) ns See Table 21-1(3)
AD51 tRC A/D Internal RC Oscillator Period 700 900 1100 ns
Conversion Rate
AD55 tCONV Conversion Time 12 TAD ——
AD56 FCNV Throughput Rate 1.0 Msps See Table 21-1(3)
AD57 TSAMP Sample Time 1 TAD See Table 21-1(3)
Timing Parameters
AD60 tPCS Conversion Start from Sample
Trigger(3)
—1.0 TAD Auto-Convert Trigger
(SSRC = 111) not
selected
AD61 tPSS Sample Start from Setting
Sample (SAMP) Bit
0.5 TAD 1.5 TAD
AD62 tCSS Conversion Completion to
Sample Start (ASAM = 1)(4)
—0.5 TAD —ns
AD63 tDPU(4) Time to Stabilize Analog Stage
from A/D Off to A/D On(4)
——20μs
Note 1: These parameters are characterized but not tested in manufacturing.
2: Operating Temperature: -40°C to +85°C
3: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures.
4: tDPU is the time required for the ADC module to stabilize when it is turned on (ADCON1<ADON> = 1). Dur-
ing this time the ADC result is indeterminate.
© 2008 Microchip Technology Inc. DS70149D-page 215
dsPIC30F5015/5016
25.0 PACKAGING INFORMATION
25.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
64-Lead TQFP
dsPIC30F5015
-30I/PT
0712XXX
Example
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
80-Lead TQFP
dsPIC30F5016
30I/PT
0712XXX
Example
3
e
3
e
dsPIC30F5015/5016
DS70149D-page 216 © 2008 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 64
Lead Pitch e 0.50 BSC
Overall Height A 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 3.5°
Overall Width E 12.00 BSC
Overall Length D 12.00 BSC
Molded Package Width E1 10.00 BSC
Molded Package Length D1 10.00 BSC
Lead Thickness c 0.09 0.20
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top α1 12° 13°
Mold Draft Angle Bottom β1 12° 13°
D
D1
E
E1
e
b
N
NOTE 1 123NOTE 2
c
L
A1
L1
A2
A
φ
β
α
Microchip Technology Drawing C04-085B
© 2008 Microchip Technology Inc. DS70149D-page 217
dsPIC30F5015/5016
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 80
Lead Pitch e 0.50 BSC
Overall Height A 1.20
Molded Package Thickness A2 0.95 1.00 1.05
Standoff A1 0.05 0.15
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle φ 3.5°
Overall Width E 14.00 BSC
Overall Length D 14.00 BSC
Molded Package Width E1 12.00 BSC
Molded Package Length D1 12.00 BSC
Lead Thickness c 0.09 0.20
Lead Width b 0.17 0.22 0.27
Mold Draft Angle Top α1 12° 13°
Mold Draft Angle Bottom β1 12° 13°
D
D1
E
E1
e
bN
NOTE 1123 NOTE 2
A
A2
L1
A1
L
c
α
βφ
Microchip Technology Drawing C04-092B
dsPIC30F5015/5016
DS70149D-page 218 © 2008 Microchip Technology Inc.
NOTES:
© 2007 Microchip Technology Inc. DS70149D-page 219
dsPIC30F5015/5016
APPENDIX A: REVISION HISTORY
Revision A (July 2005)
Original data sheet for dsPIC30F5015/5016 devices.
Revision B (September 2006)
Revision B of this data sheet reflects these changes:
Base instruction CP1 removed (see Table 22-2)
Supported I2C Slave Addresses (see Table 17-1)
ADC Conversion Clock selection (see
Section 21.0 “10-bit High-Speed Analog-to-
Digital Converter (ADC) Module”)
Revised Electrical Characteristics
- Operating current (IDD) specifications
(see Table 24-6)
- Idle current (IIDLE) specifications
(see Table 24-7)
- Power-down current (IPD) specifications
(see Table 24-8)
- I/O Pin input specifications
(see Table 24-9)
- BOR voltage limits
(see Table 24-11)
- Watchdog Timer limits
(see Table 24-21)
Revision C (January 2007)
This revision includes updates to the packaging
diagram.
Revision D (June 2008)
This revision reflects these updates:
Changed the location of the input reference in the
10-bit High-Speed ADC Functional Block Diagram
(see Figure 21-1)
Added FUSE Configuration Register (FICD)
details (see Section 20.6 “Device Configuration
Registers” and Table 20-8)
Added Note 2 in Device Configuration Registers
table (Table 20-8)
Removed erroneous statement regarding
generation of CAN receive errors (see
Section 19.4.5 “Receive Errors”)
Electrical Specifications:
- Resolved TBD values for parameters DO10,
DO16, DO20, and DO26 (see Table 24-10)
- 10-bit High-Speed ADC tPDU timing
parameter (time to stabilize) has been
updated from 20 µs typical to 20 µs maximum
(see Table 24-41)
- Parameter OS65 (Internal RC Accuracy) has
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table 24-19)
- Parameter DC12 (RAM Data Retention
Voltage) Min and Max values have been
updated (see Table 24-5)
- Parameter D134 (Erase/Write Cycle Time)
has been updated to include Min and Max
values and the Typ value has been removed
(see Table 24-12)
- Removed parameters OS62 (Internal FRC
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table 24-18)
- Parameter OS63 (Internal FRC Accuracy)
has been expanded to reflect multiple Min
and Max values for different temperatures
(see Table 24-18)
- Updated Min and Max values and Conditions
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see Table 24-21)
Removed dsPIC30F6010 device reference from
the third paragraph of Section 7.0 “Data
EEPROM Memory”
Removed IC5 and IC6 pin references from the
64-pin TQFP pin diagram (see “Pin Diagram”)
and Figure 1-1
Changed Interrupt Vectors 40-43 to Reserved
(see Table 5-1)
Updated PMD2 SFR – bits 15-12 and 7-4 are
unimplemented (see Table 20-7)
Additional minor corrections throughout the
document
dsPIC30F5015/5016
DS70149D-page 220 © 2007 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 221
dsPIC30F5015/5016
INDEX
A
A/D
Aborting a Conversion ............................................. 154
Acquisition Requirements ........................................ 158
ADCHS .................................................................... 151
ADCON1 .................................................................. 151
ADCON2 .................................................................. 151
ADCON3 .................................................................. 151
ADCSSL ................................................................... 151
ADPCFG .................................................................. 151
Configuring Analog Port Pins ................................... 160
Connection Considerations ...................................... 160
Conversion Operation .............................................. 153
Effects of a Reset ..................................................... 159
Operation During CPU Idle Mode ............................ 159
Operation During CPU Sleep Mode ......................... 159
Output Formats ........................................................ 159
Power-Down Modes ................................................. 159
Programming the Start of Conversion Trigger ......... 154
Register Map ............................................................ 161
Result Buffer ............................................................ 153
Selecting the Conversion Clock ............................... 154
Selecting the Conversion Sequence ........................ 153
AC
Temperature and Voltage Specifications ................. 184
AC Characteristics ........................................................... 184
Internal FRC Jitter, Accuracy and Drift .................... 188
Internal LPRC Accuracy ........................................... 188
Load Conditions ....................................................... 184
PLL Jitter .................................................................. 186
Address Generator Units ................................................... 37
Alternate Vector Table (AIVT) ............................................ 47
Alternate 16-bit Timer/Counter ........................................... 91
Assembler
MPASM Assembler .................................................. 172
Automatic Clock Stretch ................................................... 112
During 10-bit Addressing (STREN = 1) .................... 112
During 7-bit Addressing (STREN = 1) ...................... 112
Receive Mode .......................................................... 112
Transmit Mode ......................................................... 112
B
Barrel Shifter ...................................................................... 24
Bit-Reversed Addressing ................................................... 40
Example ..................................................................... 40
Implementation .......................................................... 40
Modifier Values for XBREV Register ......................... 41
Sequence Table (16-Entry) ........................................ 41
Block Diagrams
CAN Buffers and Protocol Engine ............................ 126
Dedicated Port Structure ............................................ 61
DSP Engine ............................................................... 21
dsPIC30F5015 ........................................................... 10
dsPIC30F5016 ........................................................... 13
External Power-on Reset Circuit .............................. 144
Input Capture Mode ................................................... 81
I2C ............................................................................ 110
Oscillator System ..................................................... 137
Output Compare Mode .............................................. 85
Programmer’s Model .................................................. 19
PWM Module ............................................................. 96
Quadrature Encoder Interface ................................... 89
Reset System ........................................................... 141
Shared Port Structure ................................................ 62
SPI ........................................................................... 106
SPI Master/Slave Connection .................................. 106
UART Receiver ........................................................ 118
UART Transmitter .................................................... 117
10-bit High-Speed A/D Functional ........................... 152
16-bit Timer1 Module (Type A Timer) ........................ 68
16-bit Timer2 (Type B Timer) .................................... 73
16-bit Timer3 (Type C Timer) .................................... 73
16-bit Timer4 (Type B Timer) .................................... 78
16-bit Timer5 (Type C Timer) .................................... 78
32-bit Timer2/3 .......................................................... 72
32-bit Timer4/5 .......................................................... 77
BOR. See Brown-out Reset.
Brown-out Reset (BOR) ................................................... 135
C
C Compilers
MPLAB C18 ............................................................. 172
MPLAB C30 ............................................................. 172
CAN
Baud Rate Setting ................................................... 130
Bit Timing ................................................................. 130
Message Reception ................................................. 128
Acceptance Filter Masks ................................. 128
Acceptance Filters ........................................... 128
Receive Buffers ............................................... 128
Receive Errors ................................................. 128
Receive Interrupts ........................................... 128
Receive Overrun .............................................. 128
Message Transmission ............................................ 129
Aborting ........................................................... 129
Errors ............................................................... 129
Interrupts ......................................................... 130
Sequence ........................................................ 129
Transmit Buffers .............................................. 129
Transmit Priority .............................................. 129
Modes of Operation ................................................. 127
Disable ............................................................ 127
Error Recognition ............................................. 127
Initialization ...................................................... 127
Listen-Only ...................................................... 127
Loopback ......................................................... 127
Normal ............................................................. 127
Phase Segments ..................................................... 131
Prescaler Setting ..................................................... 131
Propagation Segment .............................................. 131
Sample Point ........................................................... 131
Synchronization ....................................................... 131
CAN Module .................................................................... 125
CAN1 Register Map ................................................. 132
Frame Types ........................................................... 125
Overview .................................................................. 125
Code Examples
Data EEPROM Block Erase ...................................... 58
Data EEPROM Block Write ....................................... 60
Data EEPROM Read ................................................. 57
Data EEPROM Word Erase ...................................... 58
Data EEPROM Word Write ....................................... 59
Erasing a Row of Program Memory .......................... 53
Initiating a Programming Sequence .......................... 54
Loading Write Latches ............................................... 54
Code Protection ............................................................... 135
Configuring Analog Port Pins ............................................. 62
dsPIC30F5015/5016
DS70149D-page 222 © 2008 Microchip Technology Inc.
Core
Register Map .............................................................. 34
Core Overview ................................................................... 17
CPU Architecture Overview ............................................... 17
Customer Change Notification Service ............................ 226
Customer Notification Service .......................................... 226
Customer Support ............................................................ 226
D
Data Address Space .......................................................... 29
Alignment ................................................................... 32
Alignment (Figure) ..................................................... 32
Effect of Invalid Memory Accesses ............................ 32
MCU and DSP (MAC Class) Instructions Example .... 31
Memory Map ........................................................ 29, 30
Near Data Space ....................................................... 33
Software Stack ........................................................... 33
Spaces ....................................................................... 32
Width .......................................................................... 32
Data EEPROM Memory ..................................................... 57
Erasing ....................................................................... 58
Erasing, Block ............................................................ 58
Erasing, Word ............................................................ 58
Protection Against Spurious Write ............................. 60
Reading ...................................................................... 57
Write Verify ................................................................ 60
Writing ........................................................................ 59
Writing, Block ............................................................. 60
Writing, Word ............................................................. 59
DC Characteristics ........................................................... 176
I/O Pin Input Specifications ...................................... 181
I/O Pin Output Specifications ................................... 182
Idle Current (IIDLE) ................................................... 179
Operating Current (IDD) ............................................ 178
Operating MIPS vs Voltage
dsPIC30F5015 ................................................. 176
dsPIC30F5016 ................................................. 176
Power-Down Current (IPD) ....................................... 180
Program and EEPROM ............................................ 183
Temperature and Voltage Specifications ................. 177
Thermal Operating Conditions ................................. 176
Development Support ...................................................... 171
Device Configuration
Register Map ............................................................ 149
Device Configuration Registers ........................................ 147
FBORPOR ............................................................... 147
FGS .......................................................................... 147
FOSC ....................................................................... 147
FWDT ....................................................................... 147
Device Overview .................................................................. 9
Divide Support .................................................................... 20
DSP Engine ........................................................................ 20
Data Accumulators and Adder/Subtracter ................. 22
Accumulator Write Back ..................................... 23
Data Space Write Saturation ............................. 24
Overflow and Saturation .................................... 22
Round Logic ....................................................... 23
Multiplier ..................................................................... 22
dsPIC30F5015 PORT
Register Map .............................................................. 63
dsPIC30F5016 PORT
Register Map .............................................................. 64
Dual Output Compare Match Mode ................................... 86
Continuous Pulse Mode ............................................. 86
Single Pulse Mode ..................................................... 86
E
Electrical Characteristics ................................................. 175
Equations
A/D Conversion Clock .............................................. 154
Baud Rate ................................................................ 121
PWM Period ............................................................... 98
PWM Period (Up/Down Mode) .................................. 98
PWM Resolution ........................................................ 98
Serial Clock Rate ..................................................... 114
Time Quantum for Clock Generation ....................... 131
Errata ................................................................................... 7
F
Fast Context Saving .......................................................... 47
Flash Program Memory ..................................................... 51
Erasing a Row ........................................................... 53
Initiating Programming Sequence .............................. 54
Loading Write Latches ............................................... 54
Operations ................................................................. 53
Programming Algorithm ............................................. 53
Table Instruction Operation Summary ....................... 51
I
I/O Ports ............................................................................. 61
Parallel I/O (PIO) ....................................................... 61
Idle Current (IIDLE) ........................................................... 179
In-Circuit Debugger .......................................................... 148
In-Circuit Serial Programming (ICSP) ........................ 51, 135
Initialization Condition for RCON Register Case 1 .......... 145
Initialization Condition for RCON Register Case 2 .......... 145
Input Capture Module ........................................................ 81
Interrupts ................................................................... 82
Operation During Sleep and Idle Modes .................... 82
Register Map ............................................................. 83
Simple Capture Event Mode ...................................... 81
Input Change Notification Module ...................................... 65
Register Map (Bits 15-8 for dsPIC30F5015) .............. 65
Register Map (Bits 15-8 for dsPIC30F5016) .............. 65
Register Map (Bits 7-0 for dsPIC30F5015) ................ 65
Register Map (Bits 7-0 for dsPIC30F5016) ................ 65
Instruction Addressing Modes ........................................... 37
File Register Instructions ........................................... 37
Fundamental Modes Supported ................................ 37
MAC Instructions ....................................................... 38
MCU Instructions ....................................................... 37
Move and Accumulator Instructions ........................... 38
Other Instructions ...................................................... 38
Instruction Set
Overview .................................................................. 166
Summary ................................................................. 163
Internet Address .............................................................. 226
Interrupt Vector Table (IVT) ............................................... 47
Interrupts ............................................................................ 43
Controller
Register Map for dsPIC30F5015 ....................... 48
Register Map for dsPIC30F5016 ....................... 49
External Requests ..................................................... 47
Interrupt Stack Frame ................................................ 47
Priority ....................................................................... 44
Sequence .................................................................. 47
I2C Master Mode
Baud Rate Generator .............................................. 113
Clock Arbitration ...................................................... 114
Multi-Master Communication, Bus Collision and
Bus Arbitration ................................................. 114
Reception ................................................................ 113
© 2008 Microchip Technology Inc. DS70149D-page 223
dsPIC30F5015/5016
Transmission ............................................................ 113
I2C Module ....................................................................... 109
Addresses ................................................................ 111
General Call Address Support ................................. 113
Interrupts .................................................................. 113
IPMI Support ............................................................ 113
Master Operation ..................................................... 113
Master Support ........................................................ 113
Operating Function Description ............................... 109
Operation During CPU Sleep and Idle Modes ......... 114
Pin Configuration ..................................................... 109
Programmer’s Model ................................................ 109
Register Map ............................................................ 115
Registers .................................................................. 109
Slope Control ........................................................... 113
Software Controlled Clock Stretching (STREN = 1) . 112
Various Modes ......................................................... 109
I2C 10-bit Slave Mode Operation ..................................... 111
Reception ................................................................. 112
Transmission ............................................................ 112
I2C 7-bit Slave Mode Operation ....................................... 111
Reception ................................................................. 111
Transmission ............................................................ 111
M
Memory Organization ......................................................... 25
Microchip Internet Web Site ............................................. 226
Modulo Addressing ............................................................ 38
Applicability ................................................................ 40
Operation Example .................................................... 39
Start and End Address ............................................... 39
W Address Register Selection ................................... 39
Motor Control PWM Module ............................................... 95
MPLAB ASM30 Assembler, Linker, Librarian .................. 172
MPLAB ICD 2 In-Circuit Debugger .................................. 173
MPLAB ICE 2000 High-Performance Universal
In-Circuit Emulator ................................................... 173
MPLAB Integrated Development Environment Software . 171
MPLAB PM3 Device Programmer ................................... 173
MPLAB REAL ICE In-Circuit Emulator System ................ 173
MPLINK Object Linker/MPLIB Object Librarian ............... 172
N
NVM
Register Map .............................................................. 55
O
Operating Current (IDD) .................................................... 178
Oscillator
Operating Modes (Table) ......................................... 136
System Overview ..................................................... 135
Oscillator Configurations .................................................. 138
Fail-Safe Clock Monitor ............................................ 140
Fast RC (FRC) ......................................................... 139
Initial Clock Source Selection .................................. 138
Low-Power RC (LPRC) ............................................ 140
LP Oscillator Control ................................................ 139
Phase Locked Loop (PLL) ....................................... 139
Start-up Timer (OST) ............................................... 139
Oscillator Selection .......................................................... 135
Output Compare Module .................................................... 85
Interrupts .................................................................... 87
Operation During CPU Idle Mode .............................. 87
Operation During CPU Sleep Mode ........................... 87
Register Map .............................................................. 88
Timer2, Timer3 Selection Mode ................................. 86
P
Packaging
Information ............................................................... 215
Marking .................................................................... 215
Peripheral Module Disable (PMD) Registers ................... 148
PICSTART Plus Development Programmer .................... 174
Pinout Descriptions
dsPIC30F5015 ........................................................... 11
dsPIC30F5016 ........................................................... 14
POR. See Power-on Reset.
Port Write/Read Example .................................................. 62
Position Measurement Mode ............................................. 90
Power-Down Current (IPD) ............................................... 180
Power-on Reset (POR) .................................................... 135
Oscillator Start-up Timer (OST) ............................... 135
Power-up Timer (PWRT) ......................................... 135
Power-Saving Modes ....................................................... 146
Idle ........................................................................... 147
Sleep ....................................................................... 146
Power-Saving Modes (Sleep and Idle) ............................ 135
Program Address Space .................................................... 25
Construction .............................................................. 26
Data Access from Program Memory
Using Program Space Visibility ......................... 28
Data Access from Program Memory
Using Table Instructions .................................... 27
Data Access from, Address Generation .................... 26
Memory Map .............................................................. 25
Table Instructions
TBLRDH ............................................................ 27
TBLRDL ............................................................. 27
TBLWTH ............................................................ 27
TBLWTL ............................................................ 27
Program Counter ............................................................... 18
Program Data Table Access (MSB) ................................... 28
Program Space Visibility
Window into Program Space Operation .................... 29
Programmable ................................................................. 135
Programmable Digital Noise Filters ................................... 91
Programmer’s Model ......................................................... 18
Protection Against Accidental Writes to OSCCON .......... 141
PWM
Center-Aligned ........................................................... 99
Complementary Operation ...................................... 100
Dead-Time Generators ............................................ 100
Assignment ...................................................... 100
Ranges ............................................................ 100
Selection Bits ................................................... 100
Duty Cycle Comparison Units .................................... 99
Immediate Updates ........................................... 99
Register Buffers ................................................. 99
Edge-Aligned ............................................................. 98
Fault Pins ................................................................. 102
Enable Bits ...................................................... 102
Fault States ..................................................... 102
Input Modes ..................................................... 102
Priority ............................................................. 102
Independent Output ................................................. 101
Operation During CPU Idle Mode ............................ 103
Operation During CPU Sleep Mode ........................ 103
Output and Polarity Control ..................................... 102
Output Pin Control ........................................... 102
Output Override ....................................................... 101
Complementary Output Mode ......................... 101
Synchronization ............................................... 101
Period ........................................................................ 98
dsPIC30F5015/5016
DS70149D-page 224 © 2008 Microchip Technology Inc.
Single-Pulse Operation ............................................ 101
Special Event Trigger ............................................... 103
Postscaler ........................................................ 103
Time Base .................................................................. 97
Continuous Up/Down Counting Modes .............. 97
Double Update Mode ......................................... 98
Free-Running Mode ........................................... 97
Postscaler .......................................................... 98
Prescaler ............................................................ 98
Single-Shot Mode .............................................. 97
Update Lockout ........................................................ 103
Q
Quadrature Encoder Interface (QEI) .................................. 89
Interrupts .................................................................... 92
Logic .......................................................................... 90
Operation During CPU Idle Mode .............................. 91
Operation During CPU Sleep Mode ........................... 91
Register Map .............................................................. 93
Timer Operation During CPU Idle Mode .................... 92
Timer Operation During CPU Sleep Mode ................. 91
R
Reader Response ............................................................ 227
Reset ........................................................................ 135, 141
Reset Sequence ................................................................. 45
Reset Sources ........................................................... 45
Resets
BOR, Programmable ................................................ 143
POR ......................................................................... 142
POR with Long Crystal Start-up Time ...................... 143
POR, Operating without FSCM and PWRT ............. 143
Revision History ............................................................... 219
Run-Time Self-Programming (RTSP) ................................ 51
Control Registers ....................................................... 52
NVMADR ........................................................... 52
NVMADRU ......................................................... 52
NVMCON ........................................................... 52
NVMKEY ............................................................ 52
Operation ................................................................... 52
S
Simple Capture Event Mode
Capture Buffer Operation ........................................... 82
Capture Prescaler ...................................................... 81
Hall Sensor Mode ...................................................... 82
Timer2 and Timer3 Selection Mode ........................... 82
Simple Output Compare Match Mode ................................ 86
Simple PWM Mode ............................................................ 86
Input Pin Fault Protection ........................................... 86
Period ......................................................................... 87
Software Simulator (MPLAB SIM) .................................... 172
Software Stack Pointer, Frame Pointer .............................. 18
CALL Stack Frame ..................................................... 33
SPI Module ....................................................................... 105
Framed SPI Support ................................................ 107
Operating Function Description ............................... 105
Operation During CPU Idle Mode ............................ 107
Operation During CPU Sleep Mode ......................... 107
SDOx Disable .......................................................... 105
Slave Select Synchronization .................................. 107
SPI1 Register Map ................................................... 108
SPI2 Register Map ................................................... 108
Word and Byte Communication ............................... 105
STATUS Register ............................................................... 18
Symbols Used in Opcode Descriptions ............................ 164
System Integration ........................................................... 135
Register Map ........................................................... 149
T
Timer1 Module ................................................................... 67
Gate Operation .......................................................... 68
Interrupt ..................................................................... 69
Operation During Sleep Mode ................................... 68
Prescaler ................................................................... 68
Real-Time Clock ........................................................ 69
Interrupts ........................................................... 69
Oscillator Operation ........................................... 69
Register Map ............................................................. 70
16-bit Asynchronous Counter Mode .......................... 67
16-bit Synchronous Counter Mode ............................ 67
16-bit Timer Mode ...................................................... 67
Timer2/3 Module ................................................................ 71
ADC Event Trigger ..................................................... 74
Gate Operation .......................................................... 74
Interrupt ..................................................................... 74
Operation During Sleep Mode ................................... 74
Register Map ............................................................. 75
Timer Prescaler ......................................................... 74
16-bit Mode ................................................................ 71
32-bit Synchronous Counter Mode ............................ 71
32-bit Timer Mode ...................................................... 71
Timer4/5 Module ................................................................ 77
Register Map ............................................................. 79
Timing Diagrams
Band Gap Start-up Time .......................................... 191
Brown-out Reset ...................................................... 182
CAN Bit .................................................................... 130
CAN Module I/O ....................................................... 209
Center-Aligned PWM ................................................. 99
CLKOUT and I/O ..................................................... 189
Dead-Time ............................................................... 101
Edge-Aligned PWM ................................................... 98
External Clock .......................................................... 184
Input Capture (CAPx) .............................................. 195
I2C Bus Data (Master Mode) ................................... 205
I2C Bus Data (Slave Mode) ..................................... 207
I2C Bus Start/Stop Bits (Master Mode) .................... 205
I2C Bus Start/Stop Bits (Slave Mode) ...................... 207
Motor Control PWM Module .................................... 197
Motor Control PWM Module Fault ........................... 197
OC/PWM Module ..................................................... 196
Output Compare (OCx) ............................................ 195
PWM Output .............................................................. 87
QEA/QEB Input Characteristics ............................... 198
QEI Module Index Pulse .......................................... 199
Reset, Watchdog Timer, Oscillator Start-up Timer
and Power-up Timer ........................................ 190
SPI Master Mode (CKE = 0) .................................... 200
SPI Master Mode (CKE = 1) .................................... 201
SPI Slave Mode (CKE = 0) ...................................... 202
SPI Slave Mode (CKE = 1) ...................................... 203
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 1 .................... 142
Time-out Sequence on Power-up
(MCLR Not Tied to VDD), Case 2 .................... 143
Time-out Sequence on Power-up
(MCLR Tied to VDD) ........................................ 142
TimerQ (QEI Module) External Clock ...................... 194
Timer1, 2, 3, 4, 5 External Clock ............................. 192
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 0, SSRC = 000) ........... 212
© 2008 Microchip Technology Inc. DS70149D-page 225
dsPIC30F5015/5016
10-bit High-Speed A/D Conversion (CHPS = 01,
SIMSAM = 0, ASAM = 1, SSRC = 111,
SAMC = 00001) ............................................... 213
Timing Requirements
A/D Conversion ........................................................ 214
Band Gap Start-up Time .......................................... 191
CAN Module I/O ....................................................... 209
CLKOUT and I/O ...................................................... 189
External Clock .......................................................... 185
Input Capture ........................................................... 195
I2C Bus Data (Master Mode) .................................... 206
I2C Bus Data (Slave Mode) ...................................... 208
Motor Control PWM Module ..................................... 197
Output Compare ...................................................... 195
QEI Module External Clock ...................................... 194
QEI Module Index Pulse .......................................... 199
Quadrature Decoder ................................................ 198
Reset, Watchdog Timer, Oscillator Start-up Timer,
Power-up Timer and Brown-out Reset ............ 191
Simple OC/PWM Mode ............................................ 196
SPI Master Mode (CKE = 0) .................................... 200
SPI Master Mode (CKE = 1) .................................... 201
SPI Slave Mode (CKE = 0) ...................................... 202
SPI Slave Mode (CKE = 1) ...................................... 204
Timer1 External Clock .............................................. 192
Timer2 and Timer4 External Clock .......................... 193
Timer3 and Timer5 External Clock .......................... 193
Timing Specifications
PLL Clock ................................................................. 186
Traps .................................................................................. 45
Hard and Soft ............................................................. 46
Sources ...................................................................... 45
Vectors ....................................................................... 46
U
UART
Address Detect Mode .............................................. 121
Auto-Baud Support .................................................. 122
Baud Rate Generator ............................................... 121
Disabling .................................................................. 119
Enabling ................................................................... 119
Loopback Mode ....................................................... 121
Module Overview ..................................................... 117
Operation During CPU Sleep and Idle Modes ......... 122
Receiving Data ......................................................... 120
In 8-bit or 9-bit Data Mode ............................... 120
Interrupt ........................................................... 120
Receive Buffer (UxRXB) .................................. 120
Reception Error Handling ......................................... 120
Framing Error (FERR Bit) ................................ 121
Idle Status ........................................................ 121
Parity Error (PERR Bit) .................................... 121
Receive Break ................................................. 121
Receive Buffer Overrun Error (OERR Bit) ....... 120
Setting Up Data, Parity and Stop Bit Selections ...... 119
Transmitting Data ..................................................... 119
In 8-bit Data Mode ........................................... 119
In 9-bit Data Mode ........................................... 119
Interrupt ........................................................... 120
Transmit Buffer (UxTXB) ................................. 119
UART1 Register Map ............................................... 123
Unit ID Locations .............................................................. 135
Universal Asynchronous Receiver Transmitter
Module (UART) ........................................................ 117
W
Wake-up from Sleep ........................................................ 135
Wake-up from Sleep and Idle ............................................ 47
Watchdog Timer (WDT) ........................................... 135, 146
Enabling and Disabling ............................................ 146
Operation ................................................................. 146
WWW Address ................................................................ 226
WWW, On-Line Support ...................................................... 7
Z
10-Bit High-Speed Analog-to-Digital (A/D) Converter Module
151
16-bit Up/Down Position Counter Mode ............................ 90
Count Direction Status ............................................... 90
Error Checking ........................................................... 90
8-Output PWM
Register Map ........................................................... 104
dsPIC30F5015/5016
DS70149D-page 226 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS70149D-page 227
dsPIC30F5015/5016
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dsPIC30F5015/5016
DS70149D-page 228 © 2008 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
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DS70149DdsPIC30F5015/5016
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
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6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2008 Microchip Technology Inc. DS70149D-page 229
dsPIC30F5015/5016
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
dsPIC30F5016AT-30I/PT-000
Example:
dsPIC30F5015AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Trademark
Architecture
Flash
E = Extended High Temp -40°C to +125°C
I = Industrial -40°C to +85°C
Temperature
Device ID
Package
PT = TQFP 10x10
PT = TQFP 12x12
S = Die (Waffle Pack)
W = Die (Wafers)
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Custom ID (3 digits) or
T = Tape and Reel
A,B,C… = Revision Level
Engineering Sample (ES)
Speed
30 = 30 MIPS
DS70149D-page 230 © 2008 Microchip Technology Inc.
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China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Worldwide Sales and Service
01/02/08