LM2621
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SNVS033C –MAY 2004–REVISED MARCH 2005
LM2621 Low Input Voltage, Step-Up DC-DC Converter
Check for Samples: LM2621
1FEATURES DESCRIPTION
The LM2621 is a high efficiency, step-up DC-DC
2• Small VSSOP8 Package (Half the Footprint of switching regulator for battery-powered and low input
Standard 8-Pin SOIC Package) voltage systems. It accepts an input voltage between
• 1.09 mm Package Height 1.2V and 14V and converts it into a regulated output
• Up to 2 MHz Switching Frequency voltage. The output voltage can be adjusted between
1.24V and 14V. It has an internal 0.17ΩN-Channel
• 1.2V to 14V Input Voltage MOSFET power switch. Efficiencies up to 90% are
• 1.24V - 14V Adjustable Output Voltage achievable using the LM2621.
• Up to 1A Load Current The high switching frequency (adjustable up to 2MHz)
• 0.17 ΩInternal MOSFET of the LM2621 allows for tiny surface mount inductors
• Up to 90% Regulator Efficiency and capacitors. Because of the unique constant-duty-
cycle gated oscillator topology very high efficiencies
• 80 µA Typical Operating Current are realized over a wide load range. The supply
• <2.5µA Ensured Supply Current In Shutdown current is reduced to 80µA because of the BiCMOS
process technology. In the shutdown mode, the
APPLICATIONS supply current is less than 2.5µA.
• PDAs, Cellular Phones The LM2621 is available in a VSSOP-8 package.
• 2-Cell and 3-Cell Battery-Operated Equipment This package uses half the board area of a standard
8-pin SOIC and has a height of just 1.09 mm.
• PCMCIA Cards, Memory Cards
• Flash Memory Programming
• TFT/LCD Applications
• 3.3V to 5.0V Conversion
• GPS Devices
• Two-Way Pagers
• Palmtop Computers
• Hand-Held Instruments
Typical Application Circuit
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM2621
SNVS033C –MAY 2004–REVISED MARCH 2005
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Connection Diagram
Figure 1. VSSOP-8 (DGK) Package - Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
SW Pin Voltage −0.5 V to 14.5V
BOOT, VDD, EN and FB Pins −0.5V to 10V
FREQ Pin 100µA
θJA(3) 240°C/W
TJmax(3) 150°C
Storage Temperature Range −65°C to +150°C
Lead Temp. (Soldering, 5 sec) 260°C
Power Dissipation (TA=25°C)(3) 500mW
ESD Rating(4) 2kV
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is Pdmax = (Tjmax - TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. For Pin 8 (SW) the ESD rating is 1.5
kV.
OPERATING CONDITIONS(1)
VDD Pin 2.5V to 5V
FB, EN Pins 0 to VDD
BOOT Pin 0 to 10V
Ambient Temperature (TA)−40°C to +85°C
(1) Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated operating conditions.
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ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TJ= 25°C, and limits in boldface type apply over the full operating temperature range of
−40°C to +85°C. Unless otherwise specified: VDD= VOUT= 3.3V.
Symbol Parameter Condition Typ Min Max Units
VIN_ST Minimum Start-Up Supply Voltage(1) ILOAD = 0mA 1.1 1.2 V
VIN_OP Minimum Operating Supply Voltage ILOAD = 0mA 0.65 V
(once started)
VFB FB Pin Voltage 1.24 1.2028 1.2772 V
VOUT_M Maximum Output Voltage 14 V
AX
VHYST Hysteresis Voltage(2) 30 45 mV
ηEfficiency VIN = 3.6V; VOUT = 5V; ILOAD = 500mA 87 %
VIN = 2.5V; VOUT = 3.3V; ILOAD = 200mA 87
D Switch Duty Cycle 70 60 80 %
IDD Operating Quiescent Current(3) FB Pin > 1.3V; EN Pin at VDD 80 110 µA
ISD Shutdown Quiescent Current(2) VDD, BOOT and SW Pins at 5.0V; 0.01 2.5 µA
EN Pin <200mV
ICL Switch Peak Current Limit 2.85 A
RDS_ON MOSFET Switch On Resistance 0.17 Ω
Enable Section
VEN_LO EN Pin Voltage Low(4) 0.15VDD V
VEN_HI EN Pin Voltage High(4) 0.7VDD V
(1) Output in regulation, VOUT = VOUT (NOMINAL) ± 5%
(2) This is the total current into pins VDD, BOOT, SW and FREQ.
(3) This is the current into the VDD pin.
(4) When the EN pin is below VEN_LO, the regulator is shut down; when it is above VEN_HI, the regulator is operating.
PIN DESCRIPTION
Pin Name Function
1 PGND Power Ground
2 EN Active-Low Shutdown Input
3 FREQ Frequency Adjust. An external resistor connected between this pin and Pin 6 (VDD) sets the switching
frequency of the LM2621.
4 FB Output Voltage Feedback
5 SGND Signal Ground
6 VDD Power Supply for Internal Circuitry
7 BOOT Bootstrap Supply for the Gate Drive of Internal MOSFET Power Switch
8 SW Drain of the Internal MOSFET Power Switch
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TYPICAL PERFORMANCE CHARACTERISTICS
Efficiency vs Load Current Efficiency vs Load Current
VOUT = 5.0V VOUT = 3.3V
Figure 2. Figure 3.
VFB vs Temperature IOP vs Temperature
Figure 4. Figure 5.
ISD vs Temperature ISD vs VDD
Figure 6. Figure 7.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
VIN_ST vs Load Current
IOP vs VDD VOUT = 3.3V
Figure 8. Figure 9.
Peak Inductor Current vs
Switching Frequency vs RFQ Load Current
Figure 10. Figure 11.
Maximum Load Current vs
Input Voltage
Figure 12.
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DETAILED DESCRIPTION
OPERATING PRINCIPLE
The LM2621 is designed to provide step-up DC-DC voltage regulation in battery-powered and low-input voltage
systems. It combines a step-up switching regulator, N-channel power MOSFET, built-in current limit, thermal
limit, and voltage reference in a single 8-pin VSSOP package Figure 13. The switching DC-DC regulator boosts
an input voltage between 1.2V and 14V to a regulated output voltage between 1.24V and 14V. The LM2621
starts from a low 1.1V input and remains operational down to 0.65V.
This device is optimized for use in cellular phones and other applications requiring a small size, low profile, as
well as low quiescent current for maximum battery life during stand-by and shutdown. A high-efficiency gated-
oscillator topology offers an output of up to 1A.
Additional features include a built-in peak switch current limit, and thermal protection circuitry.
Figure 13. Functional Diagram
GATED OSCILLATOR CONTROL SCHEME
A unique gated oscillator control scheme enables the LM2621 to have an ultra-low quiescent current and
provides a high efficiency over a wide load range. The switching frequency of the internal oscillator is
programmable using an external resistor and can be set between 300 kHz and 2 MHz.
This control scheme uses a hysteresis window to regulate the output voltage. When the output voltage is below
the upper threshold of the window, the LM2621 switches continuously with a fixed duty cycle of 70% at the
switching frequency selected by the user. During the first part of each switching cycle, the internal N-channel
MOSFET switch is turned on. This causes the current to ramp up in the inductor and store energy. During the
second part of each switching cycle, the MOSFET is turned off. The voltage across the inductor reverses and
forces current through the diode to the output filter capacitor and the load. Thus when the LM2621 switches
continuously, the output voltage starts to ramp up. When the output voltage hits the upper threshold of the
window, the LM2621 stops switching completely. This causes the output voltage to droop because the energy
stored in the output capacitor is depleted by the load. When the output voltage hits the lower threshold of the
hysteresis window, the LM2621 starts switching continuously again causing the output voltage to ramp up
towards the upper threshold. Figure 14 shows the switch voltage and output voltage waveforms.
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Because of this type of control scheme, the quiescent current is inherently very low. At light loads the gated
oscillator control scheme offers a much higher efficiency compared to the conventional PWM control scheme.
Figure 14. Typical Step-Up Regulator Waveforms
LOW VOLTAGE START-UP
The LM2621 can start-up from input voltages as low as 1.1V. On start-up, the control circuitry switches the N-
channel MOSFET continuously at 70% duty cycle until the output voltage reaches 2.5V. After this output voltage
is reached, the normal step-up regulator feedback and gated oscillator control scheme take over. Once the
device is in regulation it can operate down to a 0.65V input, since the internal power for the IC can be boot-
strapped from the output using the VDD pin.
SHUTDOWN
The LM2621 features a shutdown mode that reduces the quiescent current to less than a ensured 2.5µA over
temperature. This extends the life of the battery in battery powered applications. During shutdown, all feedback
and control circuitry is turned off. The regulator's output voltage drops to one diode drop below the input voltage.
Entry into the shutdown mode is controlled by the active-low logic input pin EN (Pin 2). When the logic input to
this pin pulled below 0.15VDD, the device goes into shutdown mode. The logic input to this pin should be above
0.7VDD for the device to work in normal step-up mode.
OUTPUT VOLTAGE RIPPLE FREQUENCY
A major component of the output voltage ripple is due to the hysteresis used in the gated oscillator control
scheme. The frequency of this voltage ripple is proportional to the load current. The frequency of this ripple does
not necessitate the use of larger inductors and capacitors however, since the size of these components is
determined by the switching frequency of the oscillator which can be set upto 2MHz using an external resistor.
INTERNAL CURRENT LIMIT AND THERMAL PROTECTION
An internal cycle-by-cycle current limit serves as a protection feature. This is set high enough (2.85A typical,
approximately 4A maximum) so as not to come into effect during normal operating conditions. An internal thermal
protection circuitry disables the MOSFET power switch when the junction temperature (TJ) exceeds about 160°C.
The switch is re-enabled when TJdrops below approximately 135°C.
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Design Procedure
SETTING THE OUTPUT VOLTAGE
The output voltage of the step-up regulator can be set between 1.24V and 14V by connecting a feedback
resistive divider made of RF1 and RF2. The resistor values are selected as follows:
RF2 = RF1 /[(VOUT/ 1.24) −1] (1)
A value of 150kΩis suggested for RF1. Then, RF2 can be selected using the above equation. A 39pF capacitor
(CF1) connected across RF1 helps in feeding back most of the AC ripple at VOUT to the FB pin. This helps reduce
the peak-to-peak output voltage ripple as well as improve the efficiency of the step-up regulator, because a set
hysteresis of 30mV at the FB pin is used for the gated oscillator control scheme.
BOOTSTRAPPING
When the output voltage (VOUT) is between 2.5V and 5.0V a bootstrapped operation is suggested. This is
achieved by connecting the VDD pin (Pin 6) to VOUT. However if the VOUT is outside this range, the VDD pin should
be connected to a voltage source whose range is between 2.5V and 5V. This can be the input voltage (VIN), VOUT
stepped down using a linear regulator, or a different voltage source available in the system. This is referred to as
non-bootstrapped operation. The maximum acceptable voltage at the BOOT pin (Pin 7) is 10V.
SETTING THE SWITCHING FREQUENCY
The switching frequency of the oscillator is selected by choosing an external resistor (RFQ) connected between
FREQ and VDD pins. See the graph titled " Switching Frequency vs RFQ” in the TYPICAL PERFORMANCE
CHARACTERISTICS section of the datasheet for choosing the RFQ value to achieve the desired switching
frequency. A high switching frequency allows the use of very small surface mount inductors and capacitors and
results in a very small solution size. A switching frequency between 300kHz and 2MHz is recommended.
INDUCTOR SELECTION
The LM2621's high switching frequency enables the use of a small surface mount inductor. A 6.8µH shielded
inductor is suggested. The inductor should have a saturation current rating higher than the peak current it will
experience during circuit operation (see graph titled " Peak Inductor Current vs. Load Current” in the TYPICAL
PERFORMANCE CHARACTERISTICS section). Less than 100mΩESR is suggested for high efficiency.
Open-core inductors cause flux linkage with circuit components and interfere with the normal operation of the
circuit. They should be avoided. For high efficiency, choose an inductor with a high frequency core material, such
as ferrite, to reduce the core losses. To minimize radiated noise, use a toroid, pot core or shielded core inductor.
The inductor should be connected to the SW pin as close to the IC as possible. See Table 1 for a list of the
inductor manufacturers.
OUTPUT DIODE SELECTION
A Schottky diode should be used for the output diode. The forward current rating of the diode should be higher
than the load current, and the reverse voltage rating must be higher than the output voltage. Do not use ordinary
rectifier diodes, since slow switching speeds and long recovery times cause the efficiency and the load regulation
to suffer. Table 1 shows a list of the diode manufacturers.
INPUT AND OUTPUT FILTER CAPACITORS SELECTION
Tantalum chip capacitors are recommended for the input and output filter capacitors. A 22µF capacitor is
suggested for the input filter capacitor. It should have a DC working voltage rating higher than the maximum
input voltage. A 68µF tantalum capacitor is suggested for the output capacitor. The DC working voltage rating
should be greater than the output voltage. Very high ESR values (>3Ω) should be avoided. Table 1 shows a list
of the capacitor manufacturers.
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Table 1. Suggested Manufacturers List
Inductors Capacitors Diodes
Coilcraft Sprague/ Vishay Motorola
Tel: (800) 322-2645 Tel: (207) 324-4140 Tel: (800) 521-6274
Fax: (708) 639-1469 Fax: (207) 324-7223 Fax: (602) 244-6609
Coiltronics Kemet International Rectifier (IR)
Tel: (407) 241-7876 Tel: (864) 963-6300 Tel: (310) 322-3331
Fax: (407) 241-9339 Fax: (864) 963-6521 Fax: (310) 322-3332
Pulse Engineering Nichicon General Semiconductor
Tel: (619) 674-8100 Tel: (847) 843-7500 Tel: (516) 847-3222
Fax: (619) 674-8262 Fax: (847) 843-2798 Fax: (516) 847-3150
PC BOARD LAYOUT
High switching frequencies and high peak currents make a proper layout of the PC board an important part of
design. Poor design can cause excessive EMI and ground-bounce, both of which can cause malfunction and loss
of regulation by corrupting voltage feedback signal and injecting noise into the control section.
Power components - such as the inductor, input and output filter capacitors, and output diode - should be placed
as close to the regulator IC as possible, and their traces should be kept short, direct and wide. The ground pins
of the input and output filter capacitors and the PGND and SGND pins of LM2621 should be connected using
short, direct and wide traces. The voltage feedback network (RF1, RF2, and CF1) should be kept very close to the
FB pin. Noisy traces, such as from the SW pin, should be kept away from the FB and VDD pins. The traces that
run between Vout and the FB pin of the IC should be kept away from the inductor flux. Always provide sufficient
copper area to dissipate the heat due to power loss in the circuitry and prevent the thermal protection circuitry in
the IC from shutting the IC down.
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Application examples
Figure 15. EXAMPLE 1 – 5V/0.5A Step-Up Regulator
U1 Texas Instruments LM2621MM
C1 Vishay/Sprague 595D226X06R3B2T, Tantalum
C2 Vishay/Sprague 595D686X0010C2T, Tantalum
D1 Motorola MBRS140T3
L Coilcraft DT1608C-682
Figure 16. EXAMPLE 2 – 2mm Tall 5V/0.2A Step-Up Regulator for Low Profile Applications
U1 Texas Instruments LM2621MM
C1 Vishay/Sprague 592D156X06R3B2T, Tantalum
C2 Vishay/Sprague 592D336X06R3C2T, Tantalum
D1 Motorola MBRS140T3
L Vishay/Dale ILS-3825-03
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Figure 17. EXAMPLE 3 – 3.3V/0.5A SEPIC Regulator
U1 Texas Instruments LM2621MM
C1 Vishay/Sprague 595D226X06R3B2T, Tantalum
C2 Vishay/Sprague 595D686X0010C2T, Tantalum
D1 Motorola MBRS140T3
L1, L2 Coilcraft DT1608C-682
CSVishay/Vitramon VJ1210Y105M , Ceramic
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PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2621MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S06A
LM2621MMX NRND VSSOP DGK 8 TBD Call TI Call TI -40 to 85 S06A
LM2621MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 S06A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2621MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2621MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2621MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM2621MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 2
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