1. Product profile
1.1 General description
The BLM8G0710S-30PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state
of the art GEN8 LDMOS technology. This multiband device is perfectly suited as general
purpose driver or small cell final in the frequency range from 700 MHz to 1000 MHz.
Available in gull wing or straight lead outline.
1.2 Features and benefits
Designed for broadband operation (frequency 700 MHz to 1000 MHz)
High section-to-section isolation enabling multiple combinations
Integrated temperature compensated bias
Biasing of individual stages is externally accessible
Integrated ESD protection
Excellent thermal stability
High power gain
On-chip matching for ease of use
Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances
(RoHS)
1.3 Applications
RF power MMIC for W-CDMA base stations in the 700 MHz to 1000 MHz frequency
range. Possible circuit topologies are the following as also depicted in Section 8.1:
Dual section or single ended
Doherty
Quadrature combined
Push-pull
BLM8G0710S-30PB;
BLM8G0710S-30PBG
LDMOS 2-stage power MMIC
Rev. 3 — 1 September 2015 Product data sheet
Table 1. Performance
Typical RF performance at Tcase = 25
C; IDq1 = 30 mA ; IDq2 = 120 mA.
Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section
unless otherwise specified in a class-AB productio n circuit.
Test signal f VDS PL(AV) GpDACPR5M
(MHz) (V) (W) (dB) (%) (dBc)
single carrier W-CDMA 957.5 28 3 35 27 41.5
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 2 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
2. Pinning information
2.1 Pinning
2.2 Pin description
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1. Pin configuration
aaa-009322
V
DS(A1)
V
DS(B1)
V
GS(A2)
V
GS(B2)
V
GS(A1)
RF_OUT_A / V
DS(A2)
RF_OUT_B / V
DS(B2)
V
GS(B1)
RF_IN_A
RF_IN_B
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
pin 1 index
9
8
7
6
5
4
3
2
1
14
13
12
11
10
15
16
Table 2. Pin description
Symbol Pin Description
VDS(A1) 1 drain-source voltage of driver stage A1
VGS(A2) 2 gate-source voltage of final stage A2
VGS(A1) 3 gate-source voltage of driver stage A1
RF_IN_A 4 RF input section A
n.c. 5 not connected
n.c. 6 not connected
n.c. 7 not connected
n.c. 8 not connected
n.c. 9 not connected
n.c. 10 not connected
RF_IN_B 11 RF input section B
VGS(B1) 12 gate-source voltage of driver stage B1
VGS(B2) 13 gate-source voltage of final stage B2
VDS(B1) 14 drain-source voltage of driver stage B1
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 3 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
3. Ordering information
4. Block diagram
5. Limiting values
[1] Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
RF_OUT_B/VDS(B2) 15 RF output section B / drain-source voltage of final stage B2
RF_OUT_A/VDS(A2) 16 RF output section A / drain-source voltage of final stage A2
GND flange RF ground
Table 2. Pin description …continued
Symbol Pin Description
Table 3. Ordering information
Type number Package
Name Description Version
BLM8G0710S-30PB HSOP16F plastic, heatsink small outline package; 16 leads (flat) SOT1211-2
BLM8G0710S-30PBG HSOP16 plastic, heatsink small outline package; 16 leads SOT1212-2
Fig 2. Block diagram
aaa-009323
V
DS(A1)
V
DS(B1)
V
GS(A2)
RF_OUT_A / V
DS(A2)
RF_OUT_B / V
DS(B2)
V
GS(B1)
RF_IN_A
RF_IN_B
TEMPERATURE
COMPENSATED BIAS
V
GS(B2)
V
GS(A1)
TEMPERATURE
COMPENSATED BIAS
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 65 V
VGS gate-source voltage 0.5 +13 V
Tstg storage temperature 65 +150 C
Tjjunction temperature [1] -225C
Tcase case temperature - 150 C
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 4 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
6. Thermal characteristics
[1] When operated with a CW signal.
7. Characteristics
[1] In production circuit with 1.3 k gate feed resistor.
[2] In production circuit with 1.2 k gate feed resistor.
Table 5. Thermal characteristics
Measured for total device.
Symbol Parameter Conditions Value Unit
Rth(j-c) thermal resistance from
junction to case
final stage; Tcase =90C; PL=2.52W [1] 1.5 K/W
driver stage; Tcase =90C; PL=2.52W [1] 5.3 K/W
Table 6. DC characteristics
Tcase = 25
C; per section unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Final stage
V(BR)DSS drain-source breakdown voltage VGS =0V; I
D= 0.241 mA 65 - - V
VGSq gate-source quiescent voltage VDS = 28 V; ID= 120 mA 1.5 2 2.7 V
VDS = 28 V; ID=120mA [1] 1.9 2.6 3.5 V
IDSS drain leakage current VGS =0V; V
DS =28V - - 1.4 A
IDSX drain cut-off current VGS = 5.65 V; VDS =10V - 4.4 - A
IGSS gate leakage current VGS =1.0V; V
DS =0V - - 140 nA
Driver stage
V(BR)DSS drain-source breakdown voltage VGS =0V; I
D= 0.06 mA 65 - - V
VGSq gate-source quiescent voltage VDS = 28 V; ID= 30 mA 1.5 2.1 2.7 V
VDS = 28 V; ID=30mA [2] 1.9 2.6 3.5 V
IDSS drain leakage current VGS =0V; V
DS =28V - - 1.4 A
IDSX drain cut-off current VGS = 5.65 V; VDS =10V - 1.1 - A
IGSS gate leakage current VGS =1.0V; V
DS =0V - - 140 nA
Table 7. RF Characteristics
Typical RF p erformanc e at Tcase = 25
C; VDS = 28 V ; IDq1 = 30 mA; IDq2 = 120 mA; PL(AV) = 3 W. Per section unless otherwise
specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz production circuit.
Symbol Parameter Conditions Min Typ Max Unit
Test signal: single carrier W-CDMA [1]
Gppower gain f = 730.5 MHz - 35.7 - dB
f = 957.5 MHz 33.5 35 36.5 dB
Ddrain efficiency f = 730.5 MHz - 24 - %
f = 957.5 MHz 23.5 27 - %
RLin input return loss f = 730.5 MHz - 20 - dB
f = 957.5 MHz - 16 10 dB
ACPR5M adjacent channel power ratio
(5 MHz)
f = 730.5 MHz - 39 - dBc
f = 957.5 MHz - 41.5 38.5 dBc
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 5 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
[1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF.
[2] f = 957.5 MHz.
8. Application information
PAROoutput peak-to-average ratio f = 730.5 MHz - 8 - dB
f = 957.5 MHz 7.3 8 - dB
IDq/T quiescent drain current variation with
temperature
T = 40 C to +85 C
final stage IDq; gate feed resistor = 1.3 k-0.5- %
driver stage IDq; gate feed resistor = 1.2 k-0.5- %
Test signal: CW [2]
s21 phase response difference between sections 10 - +10 deg
s212insertion power gain difference between sections 0.5 - +0.5 dB
Table 7. RF Characteristics …continued
Typical RF p erformanc e at Tcase = 25
C; VDS = 28 V ; IDq1 = 30 mA; IDq2 = 120 mA; PL(AV) = 3 W. Per section unless otherwise
specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz production circuit.
Symbol Parameter Conditions Min Typ Max Unit
Table 8. Typical performance
Test signal: 1-tone CW; RF performance at Tcase = 25
C; VDS = 28 V; IDq1 = 60 mA (both sections); IDq2 = 240 mA (both
sections) unless otherwise specified, measured in an Ampleon wideband f = 700 MHz to 1000 MHz class AB application
circuit.
Symbol Parameter Conditions Min Typ Max Unit
PL(1dB) output power at 1 dB gain compression f = 800 MHz - 29.7 - W
Ddrain efficiency at PL(1dB); f = 800 MHz - 51.7 - %
Gppower gain PL(AV) = 8 W; f = 800 MHz - 35.8 - dB
Bvideo video bandwidth 2-tone CW; PL(AV) = 16 W; f = 881 MHz - 168 - MHz
Gflat gain flatness PL(AV) =8W - 0.5 - dB
G/T gain variation with temperature f = 800 MHz - 0.03 - dB/C
s122isolation between sections A and B;
PL(AV) = 8 W; f = 800 MHz
-26- dB
K Rollett stability factor T = 40 C; f = 0.1 GHz to 3 GHz - >1 -
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 6 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
Fig 3. Component layout for class-AB application circuit
aaa-016380
40 mm
40 m
m
1.2 kΩ
10 µF
10 µF
100 pF
10 µF
100 pF
5.1 pF
5.1 pF
10 pF
2.7 pF
10 µF
1.3 kΩ
10 µF
100 Ω
10 µF
10 µF
10 µF
1.3 kΩ
1.2 kΩ
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BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 7 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Fig 4. Electrical schematic
RF in
1
16
15
VDS(A1)
VDS
28 V
100 Ω
1.2 kΩ
1.3 kΩ
aaa-016381
VGS
VDS
28 V
BLM8G0710S-30PB
PathA
BLM8G0710S-30PB
Single ended class AB compact board
schematics 700-1000 MHz v1r0
BLM8G0710S-30PB
PathB
2
VGS(A2)
3
VGS(A1)
4RF_IN_A
5
n.c.
6
n.c.
7
n.c.
8
n.c.
9
n.c.
10
n.c.
11
RF_IN_B
12
VDS(B2)
13
VGS(B2)
14
VDS(B1)
Driver
clamped
RF FET
Driver
RF power FET
Final
clamped
RF FET
Driver
clamped
RF FET
Final
clamped
RF FET
Final
RF power FET
Driver
RF power FET
Final
RF power FET
RF out
10 pF
ATC600F
2.7 pF
ATC600F
100 pF
ATC600F
10 µF
50 V
10 µF
50 V
10 µF
6.3 V
10 µF
6.3 V
10 µF
6.3 V
10 µF
6.3 V
10 µF
50 V
ferrite
5.1 pF
ATC600F
5.1 pF
ATC600F
10 µF
50 V
100 pF
ATC600F
ferrite
1.2 kΩ
1.3 kΩ
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 8 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.1 Possible circuit topologies
Fig 5. Dual section or single ended
Fig 6. Doherty
Fig 7. Quadrature combined
aaa-009324
In
A
In
-3 dB / Φ-0°
-3 dB / Φ-0°
In B
Out A
Out
Out B
-3 dB / Φ-0°
-3 dB / Φ-90°
λ/4
Combiner
λ/4
Splitter
aaa-009326
-3 dB / Φ-0°
-3 dB / Φ-90°
Out
3 dB Coupler 3 dB Coupler
In
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 9 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.2 Ruggedness in class-AB operation
The BLM8G0710S-30PB and BLM8G0710S-30PBG are capable of withstanding a load
mismatch corresponding to VSWR = 10 : 1 through all phases under the following
conditions: VDS =32V; I
Dq1 = 40 mA; IDq2 = 120 mA; Pi=13dBm, P
i is measured at CW
and corresponding to PL(3dB) under ZS=50; f = 840 MHz.
Fig 8. Push-pull
aaa-009327
-3 dB / Φ-0°
-3 dB / Φ-180°
λ/2
Combiner
Out
λ/2
Splitter
In
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 10 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.3 Impedance information
Table 9. Typical impedance tuned for maximum output power
Measured load-pull data per section; test signa l: pulsed CW; Tcase = 25
C; VDS = 28 V; IDq1 = 30 mA; IDq2 =120mA;
tp=100
s;
=10%; Z
S=50
. Typical values unless otherwise specified.
at 1dB gain compression point at 3dB gain compression point
f ZLGp(max) PLadd AM-PM
conversion
ZLGp(max) PLadd AM-PM
conversion
(MHz) ()(dB) (W) (%) (deg) ()(dB) (W) (%) (deg)
BLM8G0710S-30PB
680 6.1 + j5.1 34.2 44 56.2 7.3 6.4 + j4.3 34 44.9 59.4 9.2
700 5.6 + j4.6 34 43.9 53.3 6.8 6.2 + j3.6 33.9 44.8 56.4 8.5
720 6.1 + j5.2 34.5 43.8 56.7 6.4 6.2 + j3.7 34 44.8 56.8 8
740 5.7 + j4.6 34.1 43.8 53.7 5.3 6.3 + j3.6 33.9 44.8 57.2 7.2
760 5.7 + j4.5 34 43.8 54.6 4.4 6.3 + j3.5 33.8 44.8 57.4 6.1
780 6.2 + j3.5 33.6 43.8 53.4 3.6 6.2 + j3.5 33.6 44.8 57.7 6.2
800 7.0 + j3.3 33.7 43.9 55.6 2.6 6.2 + j2.8 33.4 44.9 56.3 5
820 6.3 + j2.9 33.3 43.9 52.7 3 6.3 + j2.9 33.3 44.8 56.8 5.7
840 6.3 + j2.8 33.2 43.9 53.3 2.1 6.8 + j2.2 33.1 44.9 56.5 4.1
860 7.0 + j3.2 33.5 43.8 56 2.2 7.4 + j1.7 33.1 44.8 56.2 4
880 6.7 + j2.1 33.1 43.8 52 1.3 7.4 + j1.7 33.1 44.8 56.2 3.3
900 7.4 + j1.8 33.2 43.9 53.4 1.2 7.2 + j0.9 32.9 44.8 54.3 3.4
920 6.8 + j2.2 33.3 43.8 53.1 1 7.3 + j0.9 32.9 44.7 54.2 2.7
940 7.5 + j1.7 33.4 43.8 53.1 0.5 8.1 + j0.7 33.2 44.7 55.2 2
960 7.2 + j0.9 33.2 43.6 49.7 0.2 7.2 + j0.9 33.2 44.6 53.4 2.4
980 6.5 + j1.3 33.2 43.7 49.7 0.3 8.0 + j0.8 33.4 44.7 55.1 2
1000 8.1 + j0.9 33.4 43.6 51.4 0.3 8.1 + j0.9 33.4 44.6 55.1 2.2
BLM8G0710S-30PBG
700 5.7 + j4.6 34.7 43.5 53.5 7.3 6.4 + j3.1 34.4 44.4 55.3 8.8
720 5.8 + j3.8 34.6 43.5 52.1 6 6.3 + j3.4 34.6 44.4 56.6 8.3
740 5.6 + j3.8 34.5 43.5 51.7 6.2 6.5 + j2.6 34.4 44.5 55.5 7.6
760 6.1 + j3.2 34.3 43.5 52.5 5 7.4 + j1.8 34.2 44.5 55.9 6
780 5.7 + j2.7 33.8 43.5 50.1 4.1 6.5 + j1.6 33.6 44.5 53.1 5.5
800 6.4 + j2.2 33.7 43.7 52.7 3.1 7.1 + j1.3 33.6 44.7 55.7 4.8
820 6.8 + j2.4 33.8 43.7 54.3 2.6 6.4 + j1.2 33.3 44.7 54.2 4.8
840 7.0 + j0.8 33.3 43.7 51.2 2.3 7.0 + j0.8 33.3 44.7 55 4.7
860 6.8 + j1.9 33.6 43.6 53.2 2.5 7.5 + j0.5 33.3 44.6 54.7 4.4
880 6.6 + j1.3 33.5 43.5 50.8 2 7.4 + j0.7 33.4 44.5 54.6 4.3
900 7.1 + j1.3 33.7 43.4 51.6 1.2 8.2 + j0.3 33.6 44.4 54.8 2.9
920 7.4 + j0.0 33.4 43.4 49.4 0.7 7.4 + j0.1 33.4 44.5 53.8 2.8
940 8.0 j0.2 33.4 43.3 49.3 0.2 8.0 + j0.1 33.5 44.4 53.9 2.4
960 7.8 + j0.7 34 43.3 51.1 0.1 7.9 j0.6 33.5 44.3 52.4 2
980 7.7 j0.5 33.7 43.3 48.6 0.5 7.7 j0.5 33.7 44.4 53 1.6
1000 7.2 j0.4 33.5 43.3 48.4 0.1 7.2 j0.4 33.5 44.3 52.7 2.3
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 11 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Table 10. Typical impedance tuned for maximum power added efficiency
Measured load-pull data per section; test signa l: pulsed CW; Tcase = 25
C; VDS = 28 V; IDq1 = 30 mA; IDq2 =120mA;
tp=100
s;
=10%; Z
S=50
. Typical values unless otherwise specified.
at 1dB gain compression point at 3dB gain compression point
f ZLGp(max) PLadd AM-PM
conversion
ZLGp(max) PLadd AM-PM
conversion
(MHz) ()(dB) (W) (%) (deg) ()(dB) (W) (%) (deg)
BLM8G0710S-30PB
680 9.6 + j9.3 35.5 42.6 65.9 8.9 9.3 + j8.4 35.3 43.6 68.1 11.1
700 8.7 + j9.5 35.6 42.5 65.4 9 9.2 + j8.5 35.5 43.5 67.3 10.7
720 8.8 + j9.6 35.7 42.3 64.5 8 8.8 + j9.6 35.7 43 67 11
740 8.0 + j9.5 35.6 42.3 64.2 7.3 8.5 + j8.7 35.4 43.3 66.7 9.7
760 8.9 + j9.4 35.5 42.3 64.5 5.5 9.4 + j8.4 35.3 43.3 66.7 7.3
780 8.4 + j8.5 35.1 42.5 63.8 5 8.4 + j8.5 35.1 43.2 66.1 8.2
800 8.4 + j8.6 35.1 42.4 63.5 4.2 9.2 + j8.5 35.1 43.2 65.4 6.1
820 8.4 + j8.7 34.9 42.3 62.7 4.1 8.7 + j6.8 34.6 43.7 65.1 6.3
840 8.5 + j8.6 34.9 42.3 63 3.1 7.9 + j6.9 34.6 43.7 65.1 6.2
860 8.5 + j8.5 34.8 42.2 62.1 2.9 7.9 + j6.8 34.5 43.7 64.5 6.2
880 7.6 + j8.5 34.8 42.1 61.8 3 7.8 + j6.8 34.5 43.6 64 5.3
900 8.0 + j7.7 34.7 42.4 61.9 2.3 7.8 + j6.8 34.6 43.5 63.8 5.2
920 8.7 + j6.8 34.6 42.7 61.2 1 8.1 + j7.8 34.8 43.1 63.1 3.9
940 8.2 + j7.7 34.9 42.2 60.6 1.3 8.3 + j5.9 34.6 43.7 62.4 2.8
960 7.9 + j6.8 34.9 42.4 59.3 1.1 8.7 + j6.7 34.8 43.3 61.8 1.9
980 7.5 + j8.5 35.2 41.7 59.8 1 8.6 + j6.8 34.8 43.3 62.1 1.5
1000 8.0 + j7.8 35 41.9 59.1 0.2 7.1 + j6.8 34.9 43.1 61.6 3.2
BLM8G0710S-30PBG
700 8.4 + j8.2 36 42.3 63.4 9 8.5 + j8.5 36.1 42.9 65.8 12.7
720 8.6 + j9.1 36.2 41.9 63.9 8.1 8.9 + j8.8 36.1 42.8 66.8 11
740 8.3 + j8.2 36 42.2 62.6 7.6 8.3 + j8.2 36 42.9 65.4 10.9
760 9.6 + j7.7 35.7 42.2 62.2 5.4 8.8 + j8.7 35.9 42.6 65.1 9.2
780 8.5 + j7.1 35.4 42.4 61.5 5.1 7.3 + j8.1 35.5 42.7 64.2 10.2
800 8.0 + j8.3 35.5 41.8 62.1 4.8 7.1 + j8.0 35.5 42.8 64.9 9.7
820 8.0 + j7.1 35.1 42.3 61.6 4 8.3 + j8.2 35.3 42.6 64 6.9
840 8.8 + j7.2 35.1 42.1 61.4 3.4 8.1 + j8.1 35.3 42.5 63.5 7
860 8.4 + j7.1 35.1 42.1 60.9 3.3 8.4 + j7.1 35.1 42.9 63.4 6
880 8.1 + j6.4 35.1 42.2 60.1 2.9 8.2 + j7.4 35.3 42.7 62.3 6
900 7.3 + j6.2 35.2 42.1 59.5 2.8 8.0 + j7.2 35.4 42.6 62.1 4.9
920 8.0 + j7.4 35.4 41.6 59.5 2.1 7.3 + j6.3 35.3 42.9 61.8 5.4
940 8.1 + j6.6 35.3 41.8 58.7 1.5 6.8 + j6.5 35.4 42.6 60.9 5.7
960 9.5 + j5.4 35.2 42.2 57.8 0 7.0 + j6.9 35.8 42.4 60.5 4.2
980 8.1 + j6.5 35.4 41.7 58.1 0.3 7.1 + j6.3 35.5 42.6 61.3 3
1000 6.9 + j4.9 35 42.2 58.2 1.1 7.0 + j6.0 35.2 42.7 61.1 3.2
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 12 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
8.4 Graphs
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
PL= 0.25 W. Per section.
(1) magnitude of Gp
(2) magnitude of RLin
Tcase =25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
PL= 0.25 W. Per section.
(1) magnitude of Gp
(2) magnitude of RLin
Fig 9. Wideband power gain and input return loss as
function of frequency; typical values
Fig 10. In-band power gain and input return loss as
function of frequency; typical values
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA.
Per section.
(1) f = 700 MHz
(2) f = 800 MHz
(3) f = 900 MHz
(4) f = 1000 MHz
Normalized at PL= 26 dBm; Tcase = 25 C; VDS =28V;
IDq1 = 30 mA; IDq2 = 120 mA. Per section.
(1) f = 700 MHz
(2) f = 800 MHz
(3) f = 900 MHz
(4) f = 1000 MHz
Fig 11. Power gain and drain efficiency as function of
output power; typical values
Fig 12. Normalized phase response as a function of
output power; typical values
aaa-015424
200 400 600 800 1000 1200
0 -40
10 -30
20 -20
30 -10
40 0
f (MHz)
Gp
Gp
(dB)(dB)(dB)
RL
RLinin
RLin
(dB)(dB)(dB)
(1)(1)(1)
(2)
(2)(2)
aaa-015425
700 750 800 850 900 950 1000
30 -40
32 -30
34 -20
36 -10
38 0
f (MHz)
Gp
Gp
(dB)(dB)(dB)
RL
RLinin
RLin
(dB)(dB)(dB)
(1)(1)(1)
(2)
(2)(2)
aaa-015426
25 30 35 40 45 50
32 0
34 20
36 40
38 60
40 80
PL (dBm)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(4)(4)(4)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(4)(4)(4)
Gp
Gp
ηD
ηD
aaa-015427
25 30 35 40 45 50
-10
-7.5
-5
-2.5
0
2.5
5
PL (dBm)
φ
____ φs21s21s21(norm)s21(norm)
φs21s21(norm)
(deg)(deg)(deg)
(1)(1)(1)
(2)
(2)(2)
(3)
(3)(3)
(4)(4)(4)
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 13 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA; f = 881 MHz; 2-tone CW; PL= 8 W. Per section.
(1) IMD low
(2) IMD high
Fig 13. Intermodulation distortion as a function of tone spacing; typical values
Tcase = 25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
f = 900 MHz; 1-carrier W-CDMA; test model 1;
PAR = 9.9 dB at 0.01 % probability on CCDF. Per
section.
Tcase =25 C; VDS = 28 V; IDq1 = 30 mA; IDq2 = 120 mA;
measured on evaluation board.
Fig 14. Adjacent channel power ratio and drain
efficiency as function of output power;
typical values
Fig 15. Isolation as a function of frequency;
typical values
aaa-015428
1 10 102103
-90
-70
-50
-30
-10
tone spacing (MHz)
IMD
IMDIMD
(dBc)
(dBc)(dBc)
(1)(1)(1)
(2)(2)(2)
(1)(1)(1)
(2)(2)(2)
(1)(1)(1)
(2)(2)(2)
IMD3IMD3IMD3
IMD5
IMD5IMD5
IMD7
IMD7IMD7
aaa-015429
25 30 35 40 45
-70 0
-60 10
-50 20
-40 30
-30 40
PL (dBm)
ACPR
ACPRACPR
(dB)
(dB)(dB)
ηD
ηD
(%)(%)(%)
ACPR
ACPR5M5M
ACPR5M
ACPRACPR10M10M
ACPR10M
ηD
ηD
aaa-015430
500 600 700 800 900 1000 1100 1200
0
12
24
36
48
60
f (MHz)
|s
|s1212|2
|s12|2
(dB)(dB)(dB)
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 14 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
9. Package outline
Fig 16. Package outline SOT1211-2 (HSOP16F)
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1211-2
sot1211-2_po
15-01-12
15-06-09
Unit
mm
max
nom
min
3.9 0.2
0.1
0
5.55
5.50
5.45
0.27
0.22
0.17
20.62
20.57
20.52
19.00
18.95
18.90
1.0 9.55
A
HSOP16F: plastic, heatsink small outline package; 16 leads(flat) SOT1211-2
A1
3.65
3.60
3.55
A2b
0.40
0.35
0.30
b1cD
(1) D1
16.05
16.00
15.95
0.24.072.97
FD2
20.44
20.39
20.34
D3
10.01
9.96
9.91
E(1)
8.18
8.13
8.08
E1
5.89
5.84
5.79
E2
9.83
9.78
9.73
E3
8.45
e3
ee
1
7.45
e2
1.5
e4e5e6
1.62
1.57
1.52
0.250.25
y
16.16
15.96
15.76
0.1
HEQ1vw
scale
detail X
e2
D1
D2
e1
010 mm
D
B
y
Bw
E1
E2
pin 1
index
16
114
15
b1(2x)
Bw
b(14x)
A A2
Q1
A1
A
E
c
HE
D3E3
vA
X
Dimensions (mm are the original dimensions)
e
(2x)
e5
(2x)
e6
(2x)
(12x)
e3
(2x)
e4
(8x) METAL
PROTRUSIONS (SOURCE)
F(16x)
Note
1. Package body dimensions “D and “E do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side.
2. Lead width dimensions “b and “ b1 do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead.
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 15 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Fig 17. Package outline SOT1212-2 (HSOP16)
D3
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1212-2
sot1212-2_po
15-01-14
15-06-09
HSOP16: plastic, heatsink small outline package; 16 leads SOT1212-2
detail X
e1
D E
c
HE
E1
114
16 15
E2
(8x) METAL
PROTRUSIONS (SOURCE)
D1
D2
y
B
H
A
vA
X
wB
b
(14x)
wBb1(2x)
(A3)
Q
A2
A1
A
A4
pin 1 index
θ
e2
e4
(12x)
e3(2x)
(2x)
Lp
e
E3
e6
(2x)
e5
(2x)
3°
Unit
mm
max
nom
min
3.9 0.2 0.40 0.27 20.62 19.00
20.39 9.96
A
Dimensions (mm are the original dimensions)
Note
1. Package body dimensions “D'' and `'E'' do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side.
2. Lead width dimensions `'b'' and `'b1'' do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead.
3. Dimension A4 is measured with respect to bottom of the heatsink DATUM H. Positive value means that the bottom of the heatsink is
higher than the bottom of the lead.
A1A2A3A4b
3.65
b1cD
(1) D1D2
16.00 8.13
20.44 10.0116.05 8.18
0.1 0.35 0.22 20.57 18.95 9.553.60 0.35 7.45 1.5
20.34 9.9115.95 8.08
5.84
5.89
5.79
9.78
9.83
9.73
1.0
0 0.30
5.55
5.50
5.45 0.17 20.52 18.903.55
0.06
0
-0.02
8.45
w
0.25
y
0 10 mm
scale
7°
0°
θ
E(1)
D3E1E2E3ee
1
13.2 2.020.95 0.25
2.07
1.97
1.10
0.80
13.5 0.1
12.9
HELpQv
e2e3e4
2.97
e5
4.07
e6
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 16 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
10. Handling information
11. Abbreviations
12. Revision history
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 11. Abbreviations
Acronym Description
AM Amplitude Modulation
3GPP 3rd Generation Partnership Project
CCDF Complementary Cumulative Distribution Function
CW Continuous Wave
DPCH Dedicated Physical CHannel
ESD ElectroStatic Discharge
GEN8 Eighth Generation
LDMOS Laterally Diffused Metal Oxide Semiconductor
MMIC Monolithic Microwave Integrated Circuit
MTF Median Time to Failure
PAR Peak-to-Average Ratio
PM Phase Modulation
VSWR Voltage Standing-Wave Ratio
W-CDMA Wideband Code Division Multiple Access
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BLM8G0710S-30PB_S-30PBG#3 20150901 Product data sheet BLM8G0710S-30PB_S
-30PBG v.2
Modifications: The format of this document has been redesigned to comply with the new
identity guidelines of Ampleon.
Legal texts have been adapted to the new company name where appropriate.
BLM8G0710S-30PB_S-30PBG v.2 20150701 Product data sheet - BLM8G0710S-30PB_
S-30PBG v.1
BLM8G0710S-30PB_S-30PBG v.1 20150123 Product data sheet - -
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 17 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’ aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BLM8G0710S-30PB_S-30PBG#3 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 3 — 1 September 2015 18 of 19
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’ warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’ specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’ standard warranty and Ampleon’ product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own Any
reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
14. Contact information
For more information, please visit:
http://www.ampleon.com
For sales office addresses, please visit:
http://www.ampleon.com/sales
BLM8G0710S-30PB(G)
LDMOS 2-stage power MMIC
© Ampleon The Netherlands B.V. 2015. All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 1 September 2015
Document identifier: BLM8G0710S-30PB_S-30PBG#3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Application information. . . . . . . . . . . . . . . . . . . 5
8.1 Possible circuit topologies . . . . . . . . . . . . . . . . 8
8.2 Ruggedness in class-AB operation . . . . . . . . . 9
8.3 Impedance information . . . . . . . . . . . . . . . . . . 10
8.4 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
10 Handling information. . . . . . . . . . . . . . . . . . . . 16
11 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
14 Contact information. . . . . . . . . . . . . . . . . . . . . 18
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19