EC3SMF-12.000M EC3SM F -12.000M Series 4.0mm Epoxy Base SMD Crystal Nominal Frequency 12.000MHz Frequency Tolerance/Stability 15ppm at 25C, 30ppm over 0C to +70C Load Capacitance 18pF Parallel Resonant Mode of Operation AT-Cut Fundamental ELECTRICAL SPECIFICATIONS Nominal Frequency 12.000MHz Frequency Tolerance/Stability 15ppm at 25C, 30ppm over 0C to +70C Aging at 25C 5ppm/year Maximum Load Capacitance 18pF Parallel Resonant Shunt Capacitance (C0) 7pF Maximum Equivalent Series Resistance 70 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 1mWatts Maximum Storage Temperature Range -40C to +85C Insulation Resistance 500 Megaohms Minimum at 100Vdc ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 4 4.95 MAX 12.5 MAX 3 2.0 REF MARKING ORIENTATION 1 PIN CONNECTION 1 Crystal 2 Connected to Pin 3 3 Connected to Pin 2 4 Crystal LINE MARKING 2 1 E12.000 E=Ecliptek Designator 4.0 MAX 1.3 0.1 (x4) 1.2 0.1 9.0 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 1 of 3 EC3SMF-12.000M Suggested Solder Pad Layout All Dimensions in Millimeters 2.2 (X4) 2.3 (X4) Solder Land (X4) 6.7 1.3 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 2 of 3 EC3SMF-12.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 225C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 225C Maximum 225C Maximum 2 Times 80 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev R 2/17/2010 | Page 3 of 3