©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
43
Revised: November 10, 2009
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SL1003A Series
SL1003A Series
Reflow Condition Pb-free assembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (Min to Max) (ts)60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp
(TL) to peak) 3°C/second max.
TS(max) to TL - Ramp-up Rate 5°C/second max.
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of Actual Peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (TP)8 minutes max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
TL to TP
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100° C
Temperature Maximum: 150° C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.