AO4800B
30V Dual N-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=10V) 6.9A
R
DS(ON)
(at V
GS
=10V) < 27mΩ
R
DS(ON)
(at V
GS
= 4.5V) < 32mΩ
R
DS(ON)
(at V
GS
= 2.5V) < 50mΩ
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
The AO4800B uses advanced trench technology to
provide excellent R
DS(ON)
and low gate charge. The two
MOSFETs make a compact and efficient switch and
synchronous rectifier combination for use in buck
converters.
V
Maximum UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
30V
Drain-Source Voltage
30
G2
D1
S2
G1
D1
S1
G1
S1
G2
S2
D1
D1
D2
D2
2
4 5
1
3
8
6
7
Top View
SOIC-8
Top View Bottom View
Pin1
V
DS
V
GS
I
DM
I
AS
, I
AR
E
AS
, E
AR
T
J
, T
STG
Symbol
t ≤ 10s
Steady-State
Steady-State
R
θJL
Maximum Junction-to-Ambient
Maximum Junction-to-Lead °C/W
°C/W
Maximum Junction-to-Ambient
A D
32 90
40
°C/W
R
θJA
Power Dissipation
B
P
D
Pulsed Drain Current
C
Continuous Drain
Current
T
A
=25°C
Avalanche Current
C
Avalanche energy L=0.1mH
C
A14
T
A
=25°C
T
A
=70°C A
I
D
6.9
5.8
30
V
Drain-Source Voltage
30
48
74 62.5
V±12Gate-Source Voltage
Junction and Storage Temperature Range -55 to 150 °C
Thermal Characteristics UnitsParameter Typ Max
10 mJ
1.3
T
A
=70°C W
2
G2
D1
S2
G1
D1
S1
G1
S1
G2
S2
D1
D1
D2
D2
2
4 5
1
3
8
6
7
Top View
SOIC-8
Top View Bottom View
Pin1
Rev 4: Dec 2011
www.aosmd.com Page 1 of 6
AO4800B
Symbol Min Typ Max Units
BV
DSS
30 V
V
DS
=30V, V
GS
=0V 1
T
J
=55°C 5
I
GSS
100 nA
V
GS(th)
Gate Threshold Voltage 0.7 1.1 1.5 V
I
D(ON)
30 A
17.8 27
T
J
=125°C 28 40
19 32 mΩ
24 50 mΩ
g
FS
33 S
V
SD
0.7 1 V
I
S
2.5 A
C
iss
630 pF
C
oss
75 pF
C
rss
50 pF
R
g
1.5 3 4.5 Ω
Q
g
6 7 nC
Q
gs
1.3 nC
Q
gd
1.8 nC
t
D(on)
3 ns
t
2.5
ns
On state drain current
I
D
=250µA, V
GS
=0V
V
GS
=4.5V, V
DS
=5V
V
GS
=10V, I
D
=6.9A
Reverse Transfer Capacitance V
GS
=0V, V
DS
=15V, f=1MHz
SWITCHING PARAMETERS
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS Parameter Conditions
I
DSS
µA
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=5A
V
GS
=2.5V, I
D
=5A
V
GS
=4.5V, I
D
=6A
Forward Transconductance
Diode Forward Voltage
V
DS
=V
GS
I
D
=250µA
V
DS
=0V, V
GS
= ±12V
mΩ
Gate resistance V
GS
=0V, V
DS
=0V, f=1MHz
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
DYNAMIC PARAMETERS
Turn-On DelayTime
Turn-On Rise Time
R
DS(ON)
Static Drain-Source On-Resistance
V
=10V, V
=15V, R
=2.2
Ω
,
Total Gate Charge V
GS
=4.5V, V
DS
=15V, I
D
=6.9A
Gate Source Charge
Gate Drain Charge
t
r
2.5
ns
t
D(off)
25 ns
t
f
4 ns
t
rr
8.5 ns
Q
rr
2.6 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
I
F
=6.9A, dI/dt=100A/µs
Body Diode Reverse Recovery Charge I
F
=6.9A, dI/dt=100A/µs
Turn-On Rise Time
Turn-Off DelayTime
Body Diode Reverse Recovery Time
V
GS
=10V, V
DS
=15V, R
L
=2.2
Ω
,
R
GEN
=3Ω
Turn-Off Fall Time
A. The value of RθJA is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PDis based on TJ(MAX)=150°C, using ≤10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
Rev 4: Dec 2011 www.aosmd.com Page 2 of 6
AO4800B
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
17
5
2
10
0
18
0
3
6
9
12
15
0 0.5 1 1.5 2 2.5 3
ID(A)
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
10
15
20
25
30
0 5 10 15 20
RDS(ON) (mΩ
Ω
Ω
Ω)
ID(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
0.8
1
1.2
1.4
1.6
1.8
0 25 50 75 100 125 150 175
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
VGS=10V
ID=6.9A
VGS=4.5V
ID=6A
25°C
125°C
V
DS
=5V
VGS=4.5V
VGS=10V
0
5
10
15
20
25
30
35
40
012345
ID(A)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
VGS=2V
4.5V
10V
2.5V
3V
0
3
6
9
12
15
0 0.5 1 1.5 2 2.5 3
ID(A)
VGS(Volts)
Figure 2: Transfer Characteristics (Note E)
10
15
20
25
30
0 5 10 15 20
RDS(ON) (mΩ
Ω
Ω
Ω)
ID(A)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
0.0 0.2 0.4 0.6 0.8 1.0
IS(A)
VSD (Volts)
Figure 6: Body-Diode Characteristics (Note E)
25°C
125°C
0.8
1
1.2
1.4
1.6
1.8
0 25 50 75 100 125 150 175
Normalized On-Resistance
Temperature (°C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
VGS=10V
ID=6.9A
VGS=4.5V
ID=6A
10
20
30
40
50
0 2 4 6 8 10
RDS(ON) (mΩ
Ω
Ω
Ω)
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
25°C
125°C
V
DS
=5V
VGS=4.5V
VGS=10V
ID=6.9A
25
°
C
125°C
0
5
10
15
20
25
30
35
40
012345
ID(A)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
VGS=2V
4.5V
10V
2.5V
3V
Rev 4: Dec 2011 www.aosmd.com Page 3 of 6
AO4800B
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0
1
2
3
4
5
02468
VGS (Volts)
Qg(nC)
Figure 7: Gate-Charge Characteristics
0
200
400
600
800
1000
0 5 10 15 20 25 30
Capacitance (pF)
VDS (Volts)
Figure 8: Capacitance Characteristics
Ciss
Coss
C
rss
VDS=15V
ID=6.9A
0.0
0.1
1.0
10.0
100.0
0.01 0.1 1 10 100
ID(Amps)
VDS (Volts)
Figure 10: Maximum Forward Biased Safe
Operating Area (Note F)
10
µ
10s
1ms
DC
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
100
µ
10ms
1.0
10.0
100.0
1 10 100 1000
IAR (A) Peak Avalanche Current
Time in avalanche, tA(µ
µµ
µs)
Figure 9: Single Pulse Avalanche capability (Note C)
TA=25°C
TA=150°C
T
A
=100°C
TA=125°C
0
1
2
3
4
5
02468
VGS (Volts)
Qg(nC)
Figure 7: Gate-Charge Characteristics
0
200
400
600
800
1000
0 5 10 15 20 25 30
Capacitance (pF)
VDS (Volts)
Figure 8: Capacitance Characteristics
Ciss
Coss
C
rss
VDS=15V
ID=6.9A
1
10
100
1000
10000
0.00001 0.001 0.1 10 1000
Power (W)
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)
TA=25°C
0.0
0.1
1.0
10.0
100.0
0.01 0.1 1 10 100
ID(Amps)
VDS (Volts)
Figure 10: Maximum Forward Biased Safe
Operating Area (Note F)
10
µ
10s
1ms
DC
RDS(ON)
limited
TJ(Max)=150°C
TA=25°C
100
µ
10ms
1.0
10.0
100.0
1 10 100 1000
IAR (A) Peak Avalanche Current
Time in avalanche, tA(µ
µµ
µs)
Figure 9: Single Pulse Avalanche capability (Note C)
TA=25°C
TA=150°C
T
A
=100°C
TA=125°C
Rev 4: Dec 2011 www.aosmd.com Page 4 of 6
AO4800B
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
0.001
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Zθ
θ
θ
θJA Normalized Transient
Thermal Resistance
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
Single Pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
T
on
T
P
D
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=90°C/W
0.001
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Zθ
θ
θ
θJA Normalized Transient
Thermal Resistance
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
Single Pulse
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
T
on
T
P
D
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=90°C/W
Rev 4: Dec 2011 www.aosmd.com Page 5 of 6
AO4800B
-
+
VDC
Ig
Vds
DUT
-
+
VDC
Vgs
Vgs
10V
Qg
Qgs Qgd
Charge
Gate Charge Test Circuit & Waveform
-
+
VDC
DUT Vdd
Vgs
Vds
Vgs
RL
Rg
Vgs
Vds
10%
90%
Resistive Switching Test Circuit & Waveforms
t t
r
d(on)
t
on
t
d(off)
t
f
t
off
Vdd
Vgs
Id
+
L
Vgs
Vds
BV
I
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
Vds
AR
DSS
2
E = 1/2 LI
AR
AR
-
+
VDC
Ig
Vds
DUT
-
+
VDC
Vgs
Vgs
10V
Qg
Qgs Qgd
Charge
Gate Charge Test Circuit & Waveform
-
+
VDC
DUT Vdd
Vgs
Vds
Vgs
RL
Rg
Vgs
Vds
10%
90%
Resistive Switching Test Circuit & Waveforms
t t
r
d(on)
t
on
t
d(off)
t
f
t
off
Vdd
Vgs
Id
Vgs
Rg
DUT
-
+
VDC
L
Vgs
Vds
Id
Vgs
BV
I
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
Ig
Vgs
-
+
VDC
DUT
L
Vds
Vgs
Vds
Isd
Isd
Diode Recovery Test Circuit & Waveforms
Vds -
Vds +
I
F
AR
DSS
2
E = 1/2 LI
dI/dt
I
RM
rr
Vdd
Vdd
Q = - Idt
AR
AR
t
rr
Rev 4: Dec 2011 www.aosmd.com Page 6 of 6