TLP5751(TP,E - TOSHIBA

TLP5751

1

Photocouplers Infrared LED & Photo IC

TLP5751

Start of commercial production

2014-06

1.

1. Applications

Applications

• Induction Cooktop and Home Appliances

• Industrial Inverters

• Air Conditioner Inverters

• MOSFET Gate Drivers

• IGBT Gate Drivers

2.

2. General

General

The TLP5751 consists of an infrared LED and integrated high-gain, high-speed photodetector and is house in

the 6-pin SO6L package.

The TLP5751 is 50 % smaller than the 8-pin DIP package and meets the reinforced insulation class requirements

of international safety standards.

Therefore the mounting area can be reduced in equipment requiring the safety standard certification.

The TLP5751 has an internal faraday shield that provides a guaranteed common-mode transient immunity of

±35 kV/µs.

In particular, the TLP5751 has rail to rail output, and this enables stable operation and better switching

performance in system.

3.

3. Features

Features

(1) Buffer logic type (totem pole output)

(2) Output peak current: ± 1.0 A (max)

(3) Operating temperature: -40 to 110 

(4) Supply current: 3.0 mA (max)

(5) Supply voltage: 15 to 30 V

(6) Threshold input current: 4 mA (max)

(7) Propagation delay time: 150 ns (max)

(8) Common-mode transient immunity: ±35 kV/µs (min)

(9) Isolation voltage: 5000 Vrms (min)

(10) Safety standards

UL-recognized: UL 1577, File No.E67349

cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)

(Note 1)

CQC-approved: GB4943.1, GB8898 Japan and Thailand Factory

Note 1: When a VDE approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

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4.

4. Packaging (Note)

Packaging (Note)

TLP5751

11-4N1A

TLP5751(LF4)

11-4N101A

Note: Lead forming option: (LF4)

5.

5. Pin Assignment

Pin Assignment

1: Anode

2: N.C.

3: Cathode

4: GND

5: VO (Output)

6: VCC

6.

6. Internal Circuit (Note)

Internal Circuit (Note)

Note: A 1-µF bypass capacitor must be connected between pin 6 and pin 4.

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7.

7. Principle of Operation

Principle of Operation

7.1.

7.1. Truth Table

Truth Table

Input

H

L

LED

ON

OFF

M1

ON

OFF

M2

OFF

ON

Output

H

L

7.2.

7.2. Mechanical Parameters

Mechanical Parameters

Characteristics

Height

Creepage distances

Clearance distances

Internal isolation thickness

Size

2.3 (max)

8.0 (min)

0.4 (min)

Unit

mm

8.

8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Peak transient input forward

current

Peak transient input forward

current derating

Input reverse voltage

Input power dissipation

derating

Junction temperature

Peak high-level output current

Peak low-level output current

Output voltage

Supply voltage

Output power dissipation

derating

Junction temperature

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 105 )

(Ta ≥ 85 )

(Ta = -40 to 110 )

(Ta ≥ 85 )

(10 s)

AC, 60 s, R.H. ≤ 60 %

Symbol

IF

∆IF/∆Ta

IFPT

∆IFPT/∆Ta

VR

PD

∆PD/∆Ta

Tj

IOPH

IOPL

VO

VCC

PO

∆PO/∆Ta

Tj

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

(Note 3)

(Note 4)

Rating

20

-1

1

-25

5

40

-1.0

125

-1.0

+1.0

35

450

-4.5

125

-40 to 110

-55 to 125

260

5000

Unit

mA

mA/

A

mA/

V

mW

mW/



A

V

mW

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability

Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e.

reliability test report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 1 µs, 300 pps

Note 2: Exponential waveform. Pulse width ≤ 2 µs, f ≤ 15 kHz

Note 3: ≥ 2 mm below seating plane.

Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

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9.

9. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

Input on-state current

Input off-state voltage

Supply voltage

Peak high-level output current

Peak low-level output current

Operating frequency

Symbol

IF(ON)

VF(OFF)

VCC

IOPH

IOPL

f

Note

(Note 1)

(Note 2)

(Note 3)

Min

6

0

15



Typ.



Max

15

0.8

30

-1.0

+1.0

50

Unit

mA

V

A

kHz

Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this datasheet should also be considered.

Note: A ceramic capacitor (1 µF) should be connected between pin 6 (VCC) and pin 4 (GND) to stabilize the operation

of a high-gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor

should be placed within 1 cm of each pin.

Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.

Note 2: Denotes the operating range, not the recommended operating condition.

Note 3: Exponential waveform. IOPH ≥ -1.0 A (≤ 90 ns), IOPL ≤ 1.0 A (≤ 90 ns), Ta = 110 

10.

10. Electrical Characteristics (Note) (Unless otherwise specified, T

Electrical Characteristics (Note) (Unless otherwise specified, T

Electrical Characteristics (Note) (Unless otherwise specified, Ta

a

a = -40 to 110

= -40 to 110

= -40 to 110 



)

)

Characteristics

Input forward voltage

temperature coefficient

Input reverse current

Input capacitance

Peak high-level output current

Peak low-level output current

High-level output voltage

Low-level output voltage

High-level supply current

Low-level supply current

Threshold input current (L/H)

Threshold input voltage (H/L)

Supply voltage

UVLO threshold voltage

UVLO hysteresis

Symbol

VF

∆VF/∆Ta

IR

Ct

IOPH

IOPL

VOH

VOL

ICCH

ICCL

IFLH

VFHL

VCC

VUVLO+

VUVLO-

UVLOHYS

Note

(Note 1)

Test

Circuit

Fig.

13.1.1

Fig.

13.1.2

Fig.

13.1.3

Fig.

13.1.4

Fig.

13.1.5

Fig.

13.1.6

Test Condition

IF = 10 mA, Ta = 25 

IF = 10 mA

VR = 5 V, Ta = 25 

V = 0 V, f = 1 MHz, Ta = 25 

IF = 5 mA, VCC = 30 V,

V6-5 = -3.5 V

IF = 5 mA, VCC = 15 V,

V6-5 = -7 V

IF = 0 mA, VCC = 30 V,

V5-4 = 2.5 V

IF = 0 mA, VCC = 15 V,

V5-4 = 7 V

IF = 4 mA, VCC = 15 V,

IO = -100 mA

VF = 0.8 V, VCC = 15 V,

IO = 100 mA

IF = 10 mA, VCC = 30 V,

VO = Open

IF = 0 mA, VCC = 30 V,

VO = Open

VCC = 15 V, VO > 1 V

VCC = 15 V, VO < 1 V



IF = 5 mA, VO > 2.5 V

IF = 5 mA, VO < 2.5 V



Min

1.45



0.5

1.0

14.7



0.8

15

12.1

11.1



Typ.

1.55

-1.8



60



14.9

0.07

1.8

1.7

1.4



12.7

11.7

1.0

Max

1.70



10



-0.5

-1.0



0.2

3.0

4



30

13.5

12.4



Unit

V

mV/

µA

pF

A

V

mA

V

Note: All typical values are at Ta = 25 .

Note: This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.

Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.

Note 1: IO application time ≤ 50 µs; single pulse.

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11.

11. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Total capacitance (input to

output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note

(Note 1)

Test Conditions

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60 %

AC, 60 s

Min



1012

5000

Typ.

1.0

1014



Max



Unit

pF

Ω

Vrms

Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

12.

12. Switching Characteristics (Note) (Unless otherwise specified, T

Switching Characteristics (Note) (Unless otherwise specified, T

Switching Characteristics (Note) (Unless otherwise specified, Ta

a

a = -40 to 110

= -40 to 110

= -40 to 110 



)

)

Characteristics

Propagation delay time

(L/H)

Propagation delay time

(H/L)

Rise time

Fall time

Pulse width distortion

Propagation delay skew

(device to device)

High-level common-mode

transient immunity

Low-level common-mode

transient immunity

Symbol

tpLH

tpHL

tr

tf

|tpHL-tpLH|

tpsk

CMH

CML

Note

(Note 1)

(Note 1),

(Note 2)

(Note 3)

(Note 4)

Test

Circuit

Fig.

13.1.7

Fig.

13.1.8

Test Condition

IF = 0 → 10 mA, VCC = 30 V,

Rg = 10 Ω, Cg = 25 nF

IF = 10 → 0 mA, VCC = 30 V,

Rg = 10 Ω, Cg = 25 nF

IF = 0 → 10 mA, VCC = 30 V,

Rg = 10 Ω, Cg = 25 nF

IF = 10 → 0 mA, VCC = 30 V,

Rg = 10 Ω, Cg = 25 nF

IF = 0 ←→ 10 mA, VCC = 30 V,

Rg = 10 Ω, Cg = 25 nF

VCM = 1000 Vp-p, IF = 5 mA,

VCC = 30 V, Ta = 25 ,

VO(min) = 26 V

VCM = 1000 Vp-p, IF = 0 mA,

VCC = 30 V, Ta = 25 ,

VO(max) = 1 V

Min

50



-80

±35

Typ.



15

8



±40

Max

150



50

80



Unit

ns

kV/µs

Note: All typical values are at Ta = 25 .

Note 1: Input signal (f = 25 kHz, duty = 50 %, tr = tf = 5 ns or less).

CL is less than 15 pF which includes probe and stray wiring capacitance.

Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH

that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).

Note 3: CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in

the logic high state (VO > 26 V).

Note 4: CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage

in the logic low state (VO < 1 V).

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13.

13. Test Circuits and Characteristics Curves

Test Circuits and Characteristics Curves

13.1.

13.1. Test Circuits

Test Circuits

Fig.

Fig. 13.1.1

13.1.1

13.1.1 I

I

IOPH

OPH

OPH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 13.1.2

13.1.2

13.1.2 I

I

IOPL

OPL

OPL Test Circuit

Test Circuit

Fig.

Fig. 13.1.3

13.1.3

13.1.3 V

V

VOH

OH

OH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 13.1.4

13.1.4

13.1.4 V

V

VOL

OL

OL Test Circuit

Test Circuit

Fig.

Fig. 13.1.5

13.1.5

13.1.5 I

I

ICCH

CCH

CCH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 13.1.6

13.1.6

13.1.6 I

I

ICCL

CCL

CCL Test Circuit

Test Circuit

Fig.

Fig. 13.1.7

13.1.7

13.1.7 Switching Time Test Circuit and Waveform

Switching Time Test Circuit and Waveform

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Fig.

Fig. 13.1.8

13.1.8

13.1.8 Common-Mode Transient Immunity Test Circuit and Waveform

Common-Mode Transient Immunity Test Circuit and Waveform

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13.2.

13.2. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 13.2.1

13.2.1

13.2.1 I

I

IF

F

F - V

- V

- VF

F

FFig.

Fig.

Fig. 13.2.2

13.2.2

13.2.2 I

I

IF

F

F - T

- T

- Ta

a

Fig.

Fig. 13.2.3

13.2.3

13.2.3 P

P

PO

O

O - T

- T

- Ta

a

aFig.

Fig.

Fig. 13.2.4

13.2.4

13.2.4 I

I

IFLH

FLH

FLH - T

- T

- Ta

a

Fig.

Fig. 13.2.5

13.2.5

13.2.5 I

I

ICCL

CCL

CCL - T

- T

- Ta

a

aFig.

Fig.

Fig. 13.2.6

13.2.6

13.2.6 I

I

ICCH

CCH

CCH - T

- T

- Ta

a

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Fig.

Fig. 13.2.7

13.2.7

13.2.7 V

V

VOL

OL

OL - T

- T

- Ta

a

aFig.

Fig.

Fig. 13.2.8

13.2.8

13.2.8 V

V

VOH

OH

OH - T

- T

- Ta

a

Fig.

Fig. 13.2.9

13.2.9

13.2.9 V

V

VOL

OL

OL - I

- I

- IOPL

OPL

OPL Fig.

Fig.

Fig. 13.2.10

13.2.10

13.2.10 (V

(V

(VOH

OH

OH-V

-V

-VCC

CC

CC) - I

) - I

) - IOPH

OPH

Fig.

Fig. 13.2.11

13.2.11

13.2.11 t

t

tpLH

pLH

pLH,t

,t

,tpHL

pHL

pHL,|t

,|t

,|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - T

| - T

| - Ta

a

aFig.

Fig.

Fig. 13.2.12

13.2.12

13.2.12 t

t

tpLH

pLH

pLH,t

,t

,tpHL

pHL

pHL,|t

,|t

,|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - I

| - I

| - IF

F

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Fig.

Fig. 13.2.13

13.2.13

13.2.13 t

t

tpLH

pLH

pLH,t

,t

,tpHL

pHL

pHL,|t

,|t

,|tpHL

pHL

pHL-t

-t

-tpLH

pLH

pLH| - V

| - V

| - VCC

CC

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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14.

14. Soldering and Storage

Soldering and Storage

14.1.

14.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 14.1.1

14.1.1

14.1.1 An example of a temperature profile when lead(Pb)-free solder is used

An example of a temperature profile when lead(Pb)-free solder is used

• When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

14.2.

14.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

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15.

15. Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Unit: mm

TLP5751

Fig.

Fig. 15.1

15.1

15.1 Lead Forming Option (standard)

Lead Forming Option (standard)

TLP5751(LF4)

Fig.

Fig. 15.2

15.2

15.2 Lead Forming Option (LF4)

Lead Forming Option (LF4)

16.

16. Marking

Marking

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17.

17. EN 60747-5-5 Option (D4) Specification

EN 60747-5-5 Option (D4) Specification

• Part number: TLP5751 (Note 1)

(Note 1)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN 60747.

Example: TLP5751(D4-TP,E

D4: EN 60747 option

TP: Tape type

E: [[G]]/RoHS COMPATIBLE (Note 2)

(Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP5751(D4-TP,E → TLP5751

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

Fig.

Fig. 17.1

17.1

17.1 EN 60747 Insulation Characteristics

EN 60747 Insulation Characteristics

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Fig.

Fig. 17.2

17.2

17.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 17.3

17.3

17.3 Marking on Packing

Marking on Packing

Fig.

Fig. 17.4

17.4

17.4 Marking Example (Note)

Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN 60747.

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Fig.

Fig. 17.5

17.5

17.5 Measurement Procedure

Measurement Procedure

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18.

18. Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Item Name

TLP5751(E

TLP5751(TP,E

TLP5751(D4,E

TLP5751(D4-TP,E

TLP5751(LF4,E

TLP5751(TP4,E

TLP5751(D4-LF4,E

TLP5751(D4-TP4,E

Packaging

LF4, Wide forming

VDE Option

EN 60747-5-5

Packing (MOQ)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Package Dimensions

Unit: mm

TLP5751

Weight: 0.126 g (typ.)

Package Name(s)

TOSHIBA: 11-4N1A

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Package Dimensions

Unit: mm

TLP5751(LF4)

Weight: 0.126 g (typ.)

Package Name(s)

TOSHIBA: 11-4N101A

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TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE").

Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in

nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, and devices related to power plant.

IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.

For details, please contact your TOSHIBA sales representative or contact us via our website.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2019-12-10

Rev.10.0

Toshiba Electronic Devices & Storage Corporation