Logic Controlled, High-Side Power Switches ADP190/ADP191 FEATURES APPLICATIONS Mobile phones Digital cameras and audio devices Portable and battery-powered equipment TYPICAL APPLICATIONS CIRCUIT VIN ADP190 VOUT + GND - LEVEL SHIFT AND SLEW RATE CONTROL ON LOAD 07874-001 EN OFF Figure 1. VIN ADP191 VOUT + - GND ON EN OFF LEVEL SHIFT AND SLEW RATE CONTROL AND LOAD DISCHARGE LOAD 07874-102 Low RDSON of 105 m at 1.8 V Internal output discharge resistor (ADP191) Turn-on slew rate limiting (ADP191) Low input voltage range: 1.2 V to 3.6 V 500 mA continuous operating current Built-in level shift for control logic that can be operated by 1.2 V logic Low 2 A (maximum) ground current Ultralow shutdown current: <1 A Ultrasmall 0.8 mm x 0.8 mm, 4-ball, 0.4 mm pitch WLCSP Figure 2. GENERAL DESCRIPTION The ADP190/ADP191 are high-side load switches designed for operation from 1.2 V to 3.6 V. These load switchs provide power domain isolation for extended power battery life. The devices contain a low on-resistance P-channel MOSFET that supports more than 500 mA of continuous current and minimizes power loss. The low 2 A (maximum) of ground current and ultralow shutdown current make the ADP190/ADP191 ideal for batteryoperated portable equipment. The built-in level shifter for enable logic makes the ADP190/ADP191 compatible with modern processors and GPIO controllers. The ADP191 controls the turn-on slew rate of the switch to reduce the input inrush current. The ADP191 also incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled. Beyond operating performance, the ADP190/ADP191 occupy minimal printed circuit board (PCB) space with an area less than 0.64 mm2 and a height of 0.60 mm. It is available in an ultrasmall 0.8 mm x 0.8 mm, 4-ball, 0.4 mm pitch WLCSP. Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2009-2010 Analog Devices, Inc. All rights reserved. ADP190/ADP191 TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................6 Applications ....................................................................................... 1 Typical Performance Characteristics ..............................................7 Typical Applications Circuit............................................................ 1 Theory of Operation .........................................................................9 General Description ......................................................................... 1 Applications Information .............................................................. 10 Revision History ............................................................................... 2 Ground Current .......................................................................... 10 Specifications..................................................................................... 3 Enable Feature ............................................................................ 10 Timing Diagram ........................................................................... 4 Timing ......................................................................................... 10 Absolute Maximum Ratings............................................................ 5 Thermal Considerations............................................................ 12 Thermal Data ................................................................................ 5 PCB Layout Considerations ...................................................... 14 Thermal Resistance ...................................................................... 5 Outline Dimensions ....................................................................... 15 ESD Caution .................................................................................. 5 Ordering Guide .......................................................................... 15 REVISION HISTORY 2/10--Rev. A to Rev. B Added ADP191 .............................................................. Throughout Changes to Table 1 ............................................................................ 3 Changes to Table 3 ............................................................................ 5 Changes to Ordering Guide .......................................................... 15 9/09--Rev. 0 to Rev. A Changes to Ordering Guide .......................................................... 13 1/09--Revision 0: Initial Version Rev. B | Page 2 of 16 ADP190/ADP191 SPECIFICATIONS VIN = 1.8 V, VEN = VIN, ILOAD = 200 mA, TA = 25C, unless otherwise noted. Table 1. ADP190 Parameter INPUT VOLTAGE RANGE EN INPUT EN Input Threshold Symbol VIN Test Conditions TJ = -40C to +85C Min 1.2 VEN_TH Logic High Voltage Logic Low Voltage EN Input Pull-Down Resistance CURRENT Ground Current1 Shutdown Current VIH VIL REN 1.1 V VIN 1.3 V, TJ = -40C to +85C 1.3 V < VIN < 1.8 V, TJ = -40C to +85C 1.8 V VIN 3.6 V, TJ = -40C to +85C 1.1 V VIN 3.6 V 1.1 V VIN 3.6 V 0.3 0.4 0.45 1.2 VIN to VOUT RESISTANCE RDSON VOUT TIME Turn-On Delay Time Turn-On Delay Time 1 IGND IOFF tON_DLY tON_DLY Typ Max 3.6 Unit V 1.0 1.2 1.2 V V V V V M 0.3 4 VIN = 3.6 V, VOUT open, TJ = -40C to +85C EN = GND EN = GND, TJ = -40C to +85C 0.1 2 VIN = 3.6 V, ILOAD = 200 mA, EN = 1.5 V VIN = 2.5 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.8 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.5 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.2 V, ILOAD = 200 mA, EN = 1 V 80 90 105 125 160 ILOAD = 200 mA, EN = 1.5 V, CLOAD = 1 F VIN = 3.6 V, ILOAD = 200 mA, EN = 1.5 V, CLOAD = 1 F 5 1.5 2 130 A A A m m m m m s s Ground current includes EN pull-down current. Table 2. ADP191 Parameter INPUT VOLTAGE RANGE EN INPUT EN Input Threshold Symbol VIN Test Conditions TJ = -40C to +85C Min 1.2 VEN_TH Logic High Voltage Logic Low Voltage EN Input Pull-Down Resistance CURRENT Ground Current1 Shutdown Current VIH VIL REN 1.1 V VIN 1.3 V, TJ = -40C to +85C 1.3 V < VIN < 1.8 V, TJ = -40C to +85C 1.8 V VIN 3.6 V, TJ = -40C to +85C 1.1 V VIN 3.6 V 1.1 V VIN 3.6 V 0.3 0.4 0.45 1.2 VIN to VOUT RESISTANCE RDSON VOUT DISCHARGE RESISTANCE VOUT TIME Turn-On Delay Time Turn-On Delay Time 1 IGND IOFF Max 3.6 Unit V 1.0 1.2 1.2 V V V V V M 0.3 4 VIN = 3.6 V, VOUT open, TJ = -40C to +85C EN = GND EN = GND, TJ = -40C to +85C 2 0.1 2 VIN = 3.6 V, ILOAD = 200 mA, EN = 1.5 V VIN = 2.5 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.8 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.5 V, ILOAD = 200 mA, EN = 1.5 V VIN = 1.2 V, ILOAD = 200 mA, EN = 1 V 80 90 105 125 160 215 ILOAD = 200 mA, EN = 1.5 V, CLOAD = 1 F VIN = 3.6 V, ILOAD = 200 mA, EN = 1.5 V, CLOAD = 1 F 80 50 RDIS tON_DLY tON_DLY Typ Ground current includes EN pull-down current. Rev. B | Page 3 of 16 130 A A A m m m m m s s ADP190/ADP191 TIMING DIAGRAM VEN TURN-OFF DELAY TURN-ON DELAY 90% VOUT TURN-ON RISE TURN-OFF FALL Figure 3. Timing Diagram Rev. B | Page 4 of 16 07874-003 10% ADP190/ADP191 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter VIN to GND Pins VOUT to GND Pins EN to GND Pins Continuous Drain Current TA = 25C TA = 85C Continuous Diode Current Storage Temperature Range Operating Junction Temperature Range Soldering Conditions Rating -0.3 V to +4.0 V -0.3 V to VIN -0.3 V to +4.0 V 1 A 500 mA -50 mA -65C to +150C -40C to +125C JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP190/ADP191can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (JA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula Junction-to-ambient thermal resistance (JA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of JA may vary, depending on PCB material, layout, and environmental conditions. The specified values of JA are based on a 4-layer, 4 inch x 3 inch PCB. See JESD51-7 and JESD51-9 for detailed information regarding board construction. For additional information, see the AN-617 application note, MicroCSPTM Wafer Level Chip Scale Package. JB is the junction-to-board thermal characterization parameter with units of C/W. JB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12 document, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. JB measures the component power flowing through multiple thermal paths rather than through a single path, as in thermal resistance (JB). Therefore, JB thermal paths include convection from the top of the package as well as radiation from the package, factors that make JB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and the power dissipation (PD) using the formula TJ = TB + (PD x JB) See JESD51-8, JESD51-9, and JESD51-12 for more detailed information about JB. THERMAL RESISTANCE JA and JB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type 4-Ball, 0.4 mm Pitch WLCSP ESD CAUTION TJ = TA + (PD x JA) Rev. B | Page 5 of 16 JA 260 JB 58.4 Unit C/W ADP190/ADP191 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS A 1 2 VIN VOUT B EN GND 07874-002 TOP VIEW (Not to Scale) Figure 4. Pin Configuration Table 5. Pin Function Descriptions Pin No. A1 B1 A2 B2 Mnemonic VIN EN VOUT GND Description Input Voltage. Enable Input. Drive EN high to turn on the switch; drive EN low to turn off the switch. Output Voltage. Ground. Rev. B | Page 6 of 16 ADP190/ADP191 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 1.8 V, VEN = VIN > VIH, ILOAD = 100 mA, TA = 25C, unless otherwise noted. 200 VOUT = 3.6V ILOAD = 200mA CLOAD = 1F VEN = 1.5V T VIN = 1.2V 180 VEN RDSON (m) 160 140 VIN = 1.8V 120 1 VOUT 100 2 -40 -5 25 85 JUNCTION TEMPERATURE, TJ (C) 07874-004 60 125 CH1 500mV CH2 2V ILOAD ILOAD ILOAD ILOAD ILOAD 180 A CH1 990mV Figure 7. ADP190 Turn-On Delay, Input Voltage = 3.6 V Figure 4. RDSON vs. Temperature (Includes ~15 m Trace Resistance) 200 M1.00s T 3.0s 07874-007 VIN = 3.6V 80 VOUT = 1.8V ILOAD = 200mA CLOAD = 1F VEN = 1.5V T = 10mA = 100mA = 250mA = 350mA = 500mA VEN RDSON (m) 160 140 VOUT 1 120 2 1.6 2.0 2.4 VIN (V) 2.8 3.2 3.6 CH1 500mV CH2 1V 1 IIN 60 40 2 20 VOUT 0 -20 0 50 100 150 200 LOAD (mA) 250 300 350 07874-006 3 CH1 2.00V CH3 2.00V Figure 6. Voltage Drop vs. Load Current (Includes ~15 m Trace Resistance) Rev. B | Page 7 of 16 CH2 100mA M20.0s T 10.20% A CH1 1.24V Figure 9. ADP191 Turn-On Delay and Inrush Current vs. Input Voltage = 3.6 V 07874-110 DIFFERENCE (mV) 80 990mV VEN T VIN = 1.2V VIN = 1.8V VIN = 2.5V VIN = 3.6V A CH1 Figure 8. ADP190 Turn-On Delay, Input Voltage = 1.8 V Figure 5. RDSON vs. Input Voltage, VIN (Includes ~15 m Trace Resistance) 100 M4s T 12s 07874-008 80 1.2 07874-005 100 ADP190/ADP191 1.3 VEN T 1 1.2 GROUND CURRENT (A) IIN 2 VOUT ILOAD ILOAD ILOAD ILOAD ILOAD = 10mA = 100mA = 250mA = 350mA = 500mA 1.1 1.0 0.9 0.8 CH2 50.0mA M40.0s T 10.20% A CH1 1.24V 0.7 -40 Figure 10. ADP191 Turn-On Delay and Inrush Current vs. Input Voltage = 1.8 V -5 25 85 JUNCTION TEMPERATURE, TJ (C) 07874-009 CH1 2.00V CH3 1.00V 07874-111 3 125 Figure 13. Ground Current vs. Temperature 2.0 T VEN 1 GROUND CURRENT (A) 1.8 1.6 ILOAD ILOAD ILOAD ILOAD ILOAD = 10mA = 100mA = 250mA = 350mA = 500mA 1.4 1.2 1.0 VOUT 3 CH2 50.0mA M200s T 10.20% A CH1 600mV 0.6 1.2 2.2 2.7 3.2 3.6 VIN (V) Figure 11. ADP191 Turn-Off Delay, Input Voltage = 3.6 V Figure 14. Ground Current vs. Input Voltage, VIN 0.7 T VEN 1 1.7 07874-010 CH1 2.00V CH3 1.00V 07874-112 0.8 SHUTDOWN CURRENT (A) 0.6 VIN = 1.2V VIN = 1.8V VIN = 2.5V VIN = 3.6V 0.5 0.4 0.3 0.2 VOUT M200s T 10.20% A CH1 600mV 07874-113 CH1 2.00V CH2 50.0mA CH3 500mV 0 -50 Figure 12. ADP191 Turn-Off Delay, Input Voltage = 1.8 V -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ (C) Figure 15. Shutdown Current vs. Temperature Rev. B | Page 8 of 16 125 07874-011 0.1 3 ADP190/ADP191 THEORY OF OPERATION The ADP191 incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled. The ADP191 also contains circuitry to limit the switch turn-on slew rate to limit the inrush current. ADP190 VIN GND VOUT LEVEL SHIFT AND SLEW RATE CONTROL 07874-030 EN Figure 16. ADP190 Functional Block Diagram ADP191 VIN GND EN VOUT LEVEL SHIFT AND SLEW RATE CONTROL AND LOAD DISCHARGE Figure 17. ADP191 Functional Block Diagram Rev. B | Page 9 of 16 07874-118 The ADP190/ADP191are high-side PMOS load switches. They are designed for supply operation from 1.2 V to 3.6 V. The PMOS load switch is designed for low on resistance, 105 m at VIN = 1.8 V, and supports 500 mA of continuous current. It is a low ground current device with a nominal 4 m pull-down resistor on its enable pin. The package is a space-saving 0.8 mm x 0.8 mm, 4-ball WLCSP. ADP190/ADP191 APPLICATIONS INFORMATION 2.0 GROUND CURRENT 1.8 The major source for ground current in the ADP190/ADP191 is the 4 M pull-down on the enable (EN) pin. Figure 19 shows typical ground current when VEN = VIN and VIN varies from 1.2 V to 3.6 V. 1.6 VOUT (V) 1.4 2.0 VIN = 3.6V 1.8 1.2 1.0 0.8 0.4 0.2 1.4 VIN = 2.5V 0 0 1.2 0.2 0.3 0.4 0.5 0.6 0.7 VEN (V) 0.8 0.9 1.0 1.1 1.2 Figure 20. Typical EN Operation 1.0 VIN = 1.8V 0.8 0.6 0 50 100 150 200 LOAD (mA) 250 300 350 07874-013 VIN = 1.2V Figure 18. Ground Current vs. Load Current As shown in Figure 21, the EN pin has built-in hysteresis. This prevents on/off oscillations that can occur due to noise on the EN pin as it passes through the threshold points. The EN pin active/inactive thresholds derive from the VIN voltage; therefore, these thresholds vary with changing input voltage. Figure 22 shows typical EN active/inactive thresholds when the input voltage varies from 1.2 V to 3.6 V. 1.15 TYPICAL EN THRESHOLDS (V) As shown in Figure 20, an increase in ground current can occur when VEN VIN. This is caused by the CMOS logic nature of the level shift circuitry as it translates an EN signal 1.2 V to a logic high. This increase is a function of the VIN - VEN delta. 14 12 10 VOUT = 3.6V IGND (A) 0.1 07874-015 GROUND CURRENT (A) 0.6 1.6 8 6 1.05 0.95 EN ACTIVE 0.85 0.75 0.65 EN INACTIVE 0.55 0.45 3.60 07874-016 3.45 3.30 3.15 3.00 2.85 2.70 2.55 2.25 2.40 2.10 1.95 1.80 1.65 1.50 VIN (V) VOUT = 1.8V Figure 21. Typical EN Pin Thresholds vs. Input Voltage, VIN 07874-014 0 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 VEN (V) 1.35 0.35 2 1.20 4 TIMING Figure 19. Typical Ground Current when VEN VIN ENABLE FEATURE The ADP190/ADP191use the EN pin to enable and disable the VOUT pin under normal operating conditions. As shown in Figure 21, when a rising voltage on EN crosses the active threshold, VOUT turns on. When a falling voltage on EN crosses the inactive threshold, VOUT turns off. Turn-on delay is defined as the delta between the time that EN reaches >1.2 V until VOUT rises to ~10% of its final value. The ADP190/ADP191 include circuitry to set the typical 1.5 s turnon delay at 3.6 V VIN to limit the VIN inrush current. As shown in Figure 23, the turn-on delay is dependent on the input voltage. Rev. B | Page 10 of 16 ADP190/ADP191 ILOAD = 100mA CLOAD = 1F VEN = 3.6V T T VEN VEN VOUT 1 VOUT = 2.5V VOUT = 1.8V 2 VOUT = 1.2V IIN 1 2 CH2 1V M4s T 15.96s A CH1 2.34V 07874-017 CH1 1V CH1 2V CH2 2V CH3 2.00mA Figure 22. ADP190 Typical Turn-On Delay Time with Varying Input Voltage M10s T 40.16s A CH1 2.32V 07874-029 VOUT = 1.8V ILOAD = 200mA CLOAD = 1F VEN = 3.6V 3 Figure 24. ADP190 Typical Rise Time and Inrush Current with CLOAD = 1 F 4.0 VEN T VOUT = 3.6V 1 3.5 IIN 2.5 2.0 VOUT = 1.8V 1.5 VEN = 1.8V 1.0 VOUT = 1.2V 2 VOUT 0 100 300 200 TIME (s) 400 500 07874-124 0 Figure 23. ADP191 Typical Turn-On Delay Time with Varying Input Voltage CH1 2.00V CH3 2.00V CH2 100mA M20.0s T 10.20% A CH1 1.24V 07874-126 3 0.5 Figure 25. ADP191 Typical Rise Time and Inrush Current with CLOAD = 1 F The rise time is defined as the delta between the time from 10% to 90% of VOUT reaching its final value. It is dependent on the RC time constant where C = load capacitance (CLOAD) and R = RDSON||RLOAD. Because RDSON is usually smaller than RLOAD, an adequate approximation for RC is RDSON x CLOAD. The ADP190/ ADP191 do not need any input or load capacitor, but capacitors can be used to suppress noise on the board. If significant load capacitance is connected, inrush current is a concern. 2 The ADP191 contains circuitry to limit the slew rate of the switch turn to reduce the turn on inrush current. See Figure 25 and Figure 26 for a comparison of rise time and inrush current. 3 T VEN 1 VOUT IIN VOUT = 1.8V ILOAD = 200mA CLOAD = 4.7F VEN= 3.6V CH2 2V CH1 2V CH3 2.00mA M10s T 39.8s A CH1 1.00V 07874-019 INPUT VOLTAGE (V) 3.0 Figure 26. ADP190 Typical Rise Time and Inrush Current with CLOAD = 4.7 F Rev. B | Page 11 of 16 ADP190/ADP191 The turn-off time is defined as the delta between the time from 90% to 10% of VOUT reaching its final value. It is also dependent on the RC time constant. The ADP191 incorporates an internal output discharge resistor to discharge the output capacitance when the ADP191 output is disabled. See Figure 28 and Figure 29 for a comparison of turnoff times. VOUT = 1.8V VEN = 3.6V T ILOAD = 200mA, CLOAD = 1F ILOAD = 100mA, CLOAD = 4.7F Table 5. Typical JA Values for WLCSP Copper Size (mm2) 01 50 100 300 500 ILOAD = 100mA, CLOAD = 1F 1 2 CH2 500mV M10s T 30.36s A CH1 1V 07874-020 VEN CH1 1V 1 Device soldered to minimum size pin traces. Package 4-Ball WLCSP VEN 1 JA (C/W) 260 159 157 153 151 Table 6. Typical JB Values Figure 27. ADP190 Typical Turn-Off Time, Various Load Currents T To guarantee reliable operation, the junction temperature of the ADP190/ADP191must not exceed 125C. To ensure that the junction temperature stays below this maximum value, the user must be aware of the parameters that contribute to junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (JA). The JA value is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pin to the PCB. Table 6 shows typical JA values of the 4-ball WLCSP for various PCB copper sizes. Table 7 shows the typical JB value of the 4-ball WLCSP. JB 58.4 Unit C/W The junction temperature of the ADP190/ADP191can be calculated from the following equation: TJ = TA + (PD x JA) (1) where: TA is the ambient temperature. PD is the power dissipation in the die, given by VOUT PD = [(VIN - VOUT) x ILOAD] + (VIN x IGND) 3 M200s T 10.20% A CH1 600mV where: ILOAD is the load current. IGND is the ground current. VIN and VOUT are the input and output voltages, respectively. 07874-129 CH1 2.00V CH3 500mV (2) Figure 28. ADP191 Typical Turn-Off Time, Load Current = 0 mA THERMAL CONSIDERATIONS In most applications, the ADP190/ADP191 do not dissipate much heat due to their low on-channel resistance. However, in applications with high ambient temperature and load current, the heat dissipated in the package can be large enough to cause the junction temperature of the die to exceed the maximum junction temperature of 125C. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 1. Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to the following: TJ = TA + {[(VIN - VOUT) x ILOAD] x JA} (3) As shown in Equation 3, for a given ambient temperature, inputto-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure that the junction temperature does not rise above 125C. Figure 30 to Figure 35 show junction temperature calculations for different ambient temperatures, load currents, VIN to VOUT differentials, and areas of PCB copper. Rev. B | Page 12 of 16 ADP190/ADP191 140 140 80 60 40 20 100 80 60 40 20 LOAD CURRENT = 100mA LOAD CURRENT = 150mA 1.0 1.5 2.0 2.5 3.0 VIN - VOUT (V) 3.5 4.0 4.5 0 0.5 07874-021 0 0.5 Figure 29. 500 mm2 of PCB Copper, TA = 25C JUNCTION TEMPERATURE, TJ (C) JUNCTION TEMPERATURE, TJ (C) LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT = 1mA = 10mA = 25mA = 50mA = 75mA 60 40 20 1.5 2.0 2.5 3.0 VIN - VOUT (V) 3.5 4.0 4.5 60 40 20 JUNCTION TEMPERATURE, TJ (C) 60 40 LOAD CURRENT = 25mA LOAD CURRENT = 50mA LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA 2.0 2.5 3.0 VIN - VOUT (V) 3.5 4.0 4.5 07874-023 JUNCTION TEMPERATURE, TJ (C) 1.5 LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA 2.0 2.5 3.0 VIN - VOUT (V) 3.5 4.0 4.5 MAX JUNCTION TEMPERATURE LOAD CURRENT = 1mA LOAD CURRENT = 10mA 1.5 1.0 = 1mA = 10mA = 25mA = 50mA 140 MAX JUNCTION TEMPERATURE 1.0 LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT Figure 33. 100 mm2 of PCB Copper, TA = 50C 80 0 0.5 4.5 80 0 0.5 07874-022 1.0 100 20 4.0 100 Figure 30. 100 mm2 of PCB Copper, TA = 25C 120 3.5 120 LOAD CURRENT = 100mA LOAD CURRENT = 150mA 140 2.0 2.5 3.0 VIN - VOUT (V) MAX JUNCTION TEMPERATURE 80 0 0.5 1.5 LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA 140 MAX JUNCTION TEMPERATURE 100 1.0 = 1mA = 10mA = 25mA = 50mA Figure 32. 500 mm2 of PCB Copper, TA = 50C 140 120 LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT 07874-024 = 1mA = 10mA = 25mA = 50mA = 75mA 07874-025 100 LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT MAX JUNCTION TEMPERATURE 120 Figure 31. 0 mm2 of PCB Copper, TA = 25C 120 100 80 60 40 20 0 0.5 LOAD CURRENT LOAD CURRENT LOAD CURRENT LOAD CURRENT 1.0 1.5 = 1mA = 10mA = 25mA = 50mA LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA 2.0 2.5 3.0 VIN - VOUT (V) 3.5 Figure 34. 0 mm2 of PCB Copper, TA = 50C Rev. B | Page 13 of 16 4.0 4.5 07874-026 120 JUNCTION TEMPERATURE, TJ (C) JUNCTION TEMPERATURE, TJ (C) MAX JUNCTION TEMPERATURE ADP190/ADP191 In cases where the board temperature is known, use the thermal characterization parameter, JB, to estimate the junction temperature rise. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD x JB) (4) 120 100 60 40 20 0 0.5 07874-028 80 LOAD CURRENT = 1mA LOAD CURRENT = 10mA LOAD CURRENT = 25mA LOAD CURRENT = 50mA LOAD CURRENT = 75mA LOAD CURRENT = 100mA LOAD CURRENT = 150mA MAX JUNCTION TEMPERATURE 1.0 1.5 2.0 2.5 3.0 VIN - VOUT (V) Figure 36. ADP190 PCB Layout 3.5 4.0 4.5 07874-027 JUNCTION TEMPERATURE, TJ (C) 140 Figure 35. TB = 85C PCB LAYOUT CONSIDERATIONS It is critical to keep the input and output traces as wide and as short as possible to minimize the circuit board trace resistance. Rev. B | Page 14 of 16 07874-200 Improve heat dissipation from the package by increasing the amount of copper attached to the pins of the ADP190/ADP191. However, as listed in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Figure 37. ADP191 PCB Layout ADP190/ADP191 OUTLINE DIMENSIONS 0.660 0.600 0.540 0.430 0.400 0.370 0.800 0.760 SQ 0.720 SEATING PLANE 2 1 A 0.280 0.260 0.240 BALL A1 IDENTIFIER B 0.40 BALL PITCH 0.230 0.200 0.170 BOTTOM VIEW (BALL SIDE UP) 0.050 NOM COPLANARITY 011509-A TOP VIEW (BALL SIDE DOWN) Figure 38. 4-Ball Wafer Level Chip Scale Package [WLCSP] (CB-4-3) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP190ACBZ-R7 ADP191ACBZ-R7 ADP190CB-EVALZ ADP191CB-EVALZ 1 Temperature Range -40C to +85C -40C to +85C Package Description 4-Ball Wafer Level Chip Scale Package [WLCSP] 4-Ball Wafer Level Chip Scale Package [WLCSP] Evaluation Board Evaluation Board Z = RoHS Compliant Part. Rev. B | Page 15 of 16 Package Option CB-4-3 CB-4-3 Branding 4D 4G ADP190/ADP191 NOTES (c)2009-2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07874-0-2/10(B) Rev. B | Page 16 of 16