TO -92 Z0109MA0 4Q Triac Rev. 5 -- 22 July 2011 Product data sheet 1. Product profile 1.1 General description Planar passivated sensitive gate four quadrant triac in a SOT54 (TO-92) plastic package intended for use in applications requiring enhanced noise immunity and direct interfacing to logic ICs and low power gate drivers. 1.2 Features and benefits Direct interfacing to logic level ICs Enhanced current surge capability Planar passivated for voltage ruggedness and reliability Enhanced noise immunity Sensitive gate in four quadrants High blocking voltage of 600V Triggering in all four quadrants 1.3 Applications General purpose low power motor control Industrial process control Low power AC Fan controllers Home appliances 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak off-state voltage ITSM non-repetitive peak on-state current IT(RMS) RMS on-state current Conditions Min Typ Max Unit - - 600 V full sine wave; Tj(init) = 25 C; tp = 20 ms; see Figure 4; see Figure 5 - - 12.5 A full sine wave; Tlead 45 C; see Figure 1; see Figure 3; see Figure 2 - - 1 A Z0109MA0 NXP Semiconductors 4Q Triac Table 1. Quick reference data ...continued Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 C; see Figure 7 0.4 - 10 mA Static characteristics IGT gate trigger current 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 T2 main terminal 2 2 G gate T2 3 T1 main terminal 1 sym051 T1 G 321 SOT54 (TO-92) 3. Ordering information Table 3. Ordering information Type number Z0109MA0 Z0109MA0 Product data sheet Package Name Description Version TO-92 plastic single-ended leaded (through hole) package; 3 leads SOT54 All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 2 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current ITSM non-repetitive peak on-state current Min Max Unit - 600 V full sine wave; Tlead 45 C; see Figure 1; see Figure 3; see Figure 2 - 1 A full sine wave; Tj(init) = 25 C; tp = 20 ms; see Figure 4; see Figure 5 - 12.5 A full sine wave; Tj(init) = 25 C; tp = 16.7 ms - 13.8 A I2t I2t for fusing tp = 10 ms; sine-wave pulse - 0.78 A2s dIT/dt rate of rise of on-state current IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2+ G+ - 50 A/s IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2+ G- - 50 A/s IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2- G- - 50 A/s IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/s; T2- G+ - 20 A/s IGM peak gate current - 1 A PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 C Tj junction temperature - 125 C over any 20 ms period 003aac264 1.2 003a a f977 16 I T(RMS) I T(RMS ) (A) (A) 12 0.8 8 0.4 4 0 -50 Fig 1. 0 50 RMS on-state current as a function of lead temperature; maximum values Z0109MA0 Product data sheet 0 10-2 100 150 T lead (C) Fig 2. 10-1 1 10 surge duration (s) RMS on-state current as a function of surge duration; maximum values All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 3 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 003aac259 2.0 Ptot (W) 1.6 1.2 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 alpha = 180 alpha 120 90 60 0.8 30 0.4 0.0 0 Fig 3. 0.2 0.4 0.6 0.8 1 1.2 I T(RMS ) (A) Total power dissipation as a function of RMS on-state current; maximum values 003aaf449 16 ITSM (A) 12 8 ITSM IT 4 t 1/f Tj(init) = 25 C max 0 1 102 10 103 number of cycles Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values Z0109MA0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 4 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 003aaf490 103 ITSM IT ITSM (A) t tp Tj(init) = 25 C max 102 (1) (2) 10 1 10-5 Fig 5. 10-4 10-3 10-2 10-1 tp (s) Non-repetitive peak on-state current as a function of pulse width; maximum values 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-lead) thermal resistance from junction to lead full cycle; see Figure 6 - - 60 K/W Rth(j-a) thermal resistance from junction to ambient full cycle; printed circuit board mounted; lead length 4 mm - 150 - K/W 003aac206 102 Zth(j-lead) (K/W) 10 1 P 10-1 tp 10-2 10-5 Fig 6. 10-4 10-3 10-2 10-1 1 tp (s) t 10 Transient thermal impedance from junction to lead as a function of pulse width Z0109MA0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 5 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IT = 0.1 A; T2- G+; Tj = 25 C; see Figure 7 0.4 - 10 mA VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 C; see Figure 8 - - 15 mA VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 C; see Figure 8 - - 30 mA VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 C; see Figure 8 - - 15 mA VD = 12 V; IG = 0.1 A; T2- G+; Tj = 25 C; see Figure 8 - - 15 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 C; see Figure 9 - - 10 mA VT on-state voltage IT = 1 A; Tj = 25 C; see Figure 10 - 1.3 1.6 V VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 C; see Figure 11 - - 1.3 V VD = 600 V; IT = 0.1 A; Tj = 125 C; see Figure 11 0.2 - - V VD = 600 V; Tj = 125 C - - 0.5 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 110 C; gate open circuit; exponential waveform; see Figure 12 120 - - V/s dVcom/dt rate of change of commutating voltage VD = 400 V; Tj = 110 C; dIcom/dt = 0.44 A/ms; gate open circuit 2 - - V/s Z0109MA0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 6 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 003aaa205 4 003aaa203 3 IGT IL IGT(25C) IL(25C) 3 (1) (2) 2 (3) (4) 2 1 1 0 -50 0 50 100 0 -50 150 0 50 100 150 Tj (C) Tj (C) (1) T2- G+ (2) T2- G(3) T2+ G(4) T2+ G+ Fig 7. Normalized gate trigger current as a function of junction temperature Fig 8. Normalized latching current as a function of junction temperature 003aaa204 3 003aac258 2 IT (A) IH IH(25C) 1.6 2 1.2 0.8 (1) 1 (2) (3) 0.4 0 -50 0 0 50 100 0 150 0.4 0.8 1.2 1.6 Tj (C) VT (V) 2 Vo = 1.13 V Rs = 0.31 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values Fig 9. Normalized holding current as a function of junction temperature Z0109MA0 Product data sheet Fig 10. On-state current as a function of on-state voltage All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 7 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 003aaa209 1.6 003aaa208 1.6 VGT A VGT(25C) 1.2 1.2 0.8 0.8 0.4 0.4 0 -50 0 0 50 100 0 150 Fig 11. Normalized gate trigger voltage as a function of junction temperature Z0109MA0 Product data sheet 50 100 150 Tj (C) Tj (C) Fig 12. Normalized critical rate of rise of off-state voltage as a function of junction temperature;typical values All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 8 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E mm 5.2 5.0 0.48 0.40 0.66 0.55 0.45 0.38 4.8 4.4 1.7 1.4 4.2 3.6 e 2.54 e1 L L1(1) 1.27 14.5 12.7 2.5 max. Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION REFERENCES IEC SOT54 JEDEC JEITA TO-92 SC-43A EUROPEAN PROJECTION ISSUE DATE 04-06-28 04-11-16 Fig 13. Package outline SOT54 (TO-92) Z0109MA0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 9 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes Z0109MA0 v.5 20110722 Product data sheet - Z0109MA0 v.4 - Z0109MA0 v.3 Modifications: Z0109MA0 v.4 Z0109MA0 Product data sheet * Various changes to content. 20110512 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 10 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 9. Legal information 9.1 Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Preview -- The document is a preview version only. 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Z0109MA0 Product data sheet Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 11 of 13 Z0109MA0 NXP Semiconductors 4Q Triac Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. 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In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE -- are trademarks of NXP B.V. HD Radio and HD Radio logo -- are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Z0109MA0 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 22 July 2011 (c) NXP B.V. 2011. All rights reserved. 12 of 13 Z0109MA0 NXP Semiconductors 4Q Triac 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 22 July 2011 Document identifier: Z0109MA0