NC7SZ125 TinyLogic UHS Buffer with Three-State Output Description The NC7SZ125 is a single buffer with three-state output from ON Semiconductor's Ultra-High Speed (UHS) of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra high speed with high output drive while maintaining low static power dissipation over a very broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V range. The inputs and output are high impedance above ground when VCC is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage. The output tolerates voltages above VCC when in the 3-STATE condition. www.onsemi.com MARKING DIAGRAMS DDKK XYZ SIP6 CASE 127EB Pin 1 Features * * * * * * * * * * Ultra-High Speed: tPD 2.6 ns (Typical) into 50 pF at 5 V VCC High Output Drive: 24 mA at 3 V VCC Broad VCC Operating Range: 1.65 V to 5.5 V Matches Performance of LCX when Operated at 3.3 V VCC Power Down High-Impedance Inputs / Outputs Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation Proprietary Noise / EMI Reduction Circuitry Ultra-Small MicroPakTM Packages Space-Saving SC-74A and SC-88A Packages These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant DDKK XYZ UDFN6 CASE 517DP Pin 1 SC-74A CASE 318BQ SC-88A CASE 419AC-01 7Z25T Z25T IEEE / IEC A OE 1 EN Y DD, 7Z25, Z25 = Specific Device Code KK = 2-Digit Lot Run Traceability Code XY = 2-Digit Date Code Format Z = Assembly Plant Code T = Die Run Code = Year Coding Scheme = Plant Code Identifier = Eight-Week Datacoding Scheme Figure 1. Logic Symbol ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. (c) Semiconductor Components Industries, LLC, 1996 July, 2019 - Rev. 3 1 Publication Order Number: NC7SZ125/D NC7SZ125 Pin Configurations OE 1 5 OE 1 VCC 6 VCC A 2 A 2 GND 3 4 Y 5 NC GND 3 Figure 2. SC-88A and SC-74A (Top View) 4 Y Figure 3. MicroPak (Top Through View) PIN DEFINITIONS FUNCTION TABLE Pin # SC-88A / SC74A Pin # MicroPak Name Inputs 1 1 OE Input 2 2 A Input 3 3 GND Ground 4 4 Y Output 5 6 VCC Supply Voltage 5 NC No Connect Description Output /OE In A Out Y L L L L H H H X Z H = HIGH Logic Level L = LOW Logic Level X = HIGH or LOW Logic Level Z = HIGH Impedance State www.onsemi.com 2 NC7SZ125 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit VCC Supply Voltage -0.5 6.0 V VIN DC Input Voltage -0.5 6.0 V DC Output Voltage -0.5 6.0 V VIN < -0.5 V - -50 mA VIN > 6.0 V - +20 VOUT < -0.5 V - -50 VOUT > 6 V, VCC = GND - +20 DC Output Current - 50 mA DC VCC or Ground Current - 50 mA -65 +150 C - +150 C VOUT IIK IOK IOUT ICC or IGND TSTG Parameter DC Input Diode Current DC Output Diode Current Storage Temperature Range mA TJ Junction Temperature Under Bias TL Junction Lead Temperature (Soldering, 10 Seconds) - +260 C PD Power Dissipation in Still Air SC-74A - 225 mW SC-88A-5 - 190 MicroPak-6 - 327 MicroPak2TM-6 - 327 Human Body Model, JEDEC: JESD22-A114 - 4000 Charge Device Model, JEDEC: JESD22-C101 - 2000 ESD V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT Parameter Min Max Unit Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.50 5.50 0 5.5 V Active State 0 VCC V Three-State 0 5.5 -40 +85 C VCC at 1.8 V, 2.5 V 0.2 V 0 20 ns/V VCC at 3.3 V 0.3 V 0 10 VCC at 5.0 V 0.5 V 0 5 SC-74A - 555 SC-88A-5 - 659 MicroPak-6 - 382 MicroPak2-6 - 382 Input Voltage Output Voltage TA Operating Temperature tr, tf Input Rise and Fall Times JA Conditions Thermal Resistance C/W Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float. www.onsemi.com 3 NC7SZ125 DC ELECTICAL CHARACTERISTICS TA = +25C Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage Typ Max Min Max Unit 1.65 to 1.95 0.65 VCC - - 0.65 VCC - V 2.30 to 5.50 0.70 VCC - - 0.70 VCC - 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC 2.30 to 5.50 - - 0.30 VCC - 0.30 VCC 1.55 1.65 - 1.55 - 1.70 1.80 - 1.70 - 2.30 2.20 2.30 - 2.20 - 3.00 2.90 3.00 - 2.90 - 4.50 4.40 4.50 - 4.40 - VCC (V) 1.65 1.80 VOL LOW Level Output Voltage TA = -40 to +85C Min Conditions VIN = VIH, IOH = -100 A 1.65 IOH = -4 mA 1.29 1.52 - 1.29 - 2.30 IOH = -8 mA 1.90 2.15 - 1.90 - 3.00 IOH = -16 mA 2.40 2.80 - 2.40 - 3.00 IOH = -24 mA 2.30 2.68 - 2.30 - 4.50 IOH = -32 mA 3.80 4.20 - 3.80 - 1.65 VIN = VIL, IOL = 100 A - 0.00 0.10 - 0.00 - 0.00 0.10 - 0.10 2.30 - 0.00 0.10 - 0.10 3.00 - 0.00 0.10 - 0.10 4.50 - 0.00 0.10 - 0.10 1.80 1.65 IOL = 4 mA - 0.80 0.24 - 0.24 2.30 IOL = 8 mA - 0.10 0.30 - 0.30 3.00 IOL = 16 mA - 0.15 0.40 - 0.40 3.00 IOL = 24 mA - 0.22 0.55 - 0.55 4.50 V V V IOL = 32 mA - 0.22 0.55 - 0.55 1.65 to 5.5 0 VIN 5.5 V - - 1 - 10 A 3-STATE Output Leakage 0 to 5.5 VIN = VIH or VIL 0 VO 5.5 V - - 1 - 10 A IOFF Power Off Leakage Current 0 VIN or VOUT = 5.5 V - - 1 - 10 A ICC Quiescent Supply Current VIN = 5.5 V, GND - - 2 - 20 A IIN Input Leakage Current IOZ 1.65 to 5.50 www.onsemi.com 4 NC7SZ125 AC ELECTRICAL CHARACTERISTICS TA = +25C TA = -40 to +85C Min Typ Max Min Max Unit - 6.4 13.2 - 13.8 ns - 5.3 11.0 - 11.5 2.50 0.20 - 3.4 7.5 - 8.0 3.30 0.30 - 2.5 5.2 - 5.5 5.00 0.50 - 2.1 4.5 - 4.8 CL = 50 pF, RD = 500 5.00 0.50 S1 = OPEN - 3.2 5.7 - 6.0 - 2.6 5.0 - 5.3 CL = 50 pF, RD = 500 1.80 RU = 500 2.50 0.20 S1 = GND for tPZH S1 = VIN for tPZL 3.30 0.30 VIN = 2 * VCC - 8.4 15.0 - 15.6 - 7.0 12.5 - 13.0 - 4.6 8.5 - 9.0 - 3.5 6.2 - 6.5 5.00 0.50 - 2.8 5.5 - 5.8 CL = 50 pF, 1.65 RD = 500 1.80 RU = 500 2.50 0.20 S1 = GND for tPHZ S1 = VIN for tPLZ 3.30 0.30 VIN = 2 * VCC - 6.5 13.2 - 14.5 - 5.4 11.0 - 12.0 - 3.5 8.0 - 8.5 - 2.8 5.7 - 6.0 5.00 0.50 - 2.1 4.7 - 5.0 Input Capacitance 0.00 - 4 - - - COUT Output Capacitance 0.00 - 8 - - - CPD Power Dissipation Capacitance (Note 2) (Figure 5) 3.30 - 17 - - - Symbol Parameter VCC (V) tPLH, tPHL Propagation Delay (Figure 4, 6) 1.65 1.80 Conditions CL = 15 pF, RD = 1 M S1=OPEN 3.30 0.30 tPZL, tPZH tPLZ, tPHZ CIN Output Enable Time (Figure 4, 6) Output Disable Time (Figure 4, 6) 1.65 ns pF pF 2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic). www.onsemi.com 5 NC7SZ125 VI OPEN GND VCC OE INPUT RU OUTPUT INPUT CL RD NOTE: 3. CL includes load and stray capacitance; Input PRR = 1.0 MHz; tW = 500 ns Figure 4. AC Test Circuit VCC A OE INPUT OUTPUT NOTE: 4. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz; Duty Cycle = 50%. Figure 5. ICCD Test Circuit Figure 6. AC Waveforms ORDERING INFORMATION Part Number Top Mark Operating Temperature Packages Shipping NC7SZ125M5X 7Z25 -40 to +85C SC-74A 3000 / Tape & Reel NC7SZ125P5X Z25 -40 to +85C SC-88A 3000 / Tape & Reel NC7SZ125L6X DD -40 to +85C MicroPak 5000 / Tape & Reel NC7SZ125FHX DD -40 to +85C MicroPak2 5000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 6 NC7SZ125 PACKAGE DIMENSIONS SIP6 1.45X1.0 CASE 127EB ISSUE O www.onsemi.com 7 NC7SZ125 PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5X b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 e D A L DETAIL A TOP VIEW A SIDE VIEW DETAIL A C c SEATING PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT* 0.95 PITCH 2.40 5X 1.00 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM A A1 b c D E E1 e L M MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ NC7SZ125 PACKAGE DIMENSIONS SC-88A (SC-70 5 Lead), 1.25x2 CASE 419AC-01 ISSUE A SYMBOL MIN A 0.80 D e e E1 E MAX 1.10 A1 0.00 0.10 A2 0.80 1.00 b 0.15 0.30 c 0.10 0.18 D 1.80 2.00 2.20 E 1.80 2.10 2.40 E1 1.15 1.25 1.35 0.65 BSC e 0.26 L L1 0.36 0.46 0.42 REF 0.15 BSC L2 TOP VIEW NOM 0 8 1 4 10 1 A2 A 1 b L L1 A1 SIDE VIEW c END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-203. www.onsemi.com 9 L2 NC7SZ125 PACKAGE DIMENSIONS UDFN6 1.0X1.0, 0.35P CASE 517DP ISSUE O www.onsemi.com 10 NC7SZ125 MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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