LM6142, LM6144
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SNOS726D –JUNE 2000–REVISED MARCH 2013
LM6142/LM6144 17 MHz Rail-to-Rail Input-Output Operational Amplifiers
Check for Samples: LM6142,LM6144
1FEATURES DESCRIPTION
Using patent pending new circuit topologies, the
2At VS= 5V. Typ Unless Noted. LM6142/LM6144 provides new levels of performance
• Rail-to-rail Input CMVR −0.25V to 5.25V in applications where low voltage supplies or power
• Rail-to-Rail Output Swing 0.005V to 4.995V limitations previously made compromise necessary.
Operating on supplies of 1.8V to over 24V, the
• Wide Gain-Bandwidth: 17MHz at 50kHz (typ) LM6142/LM6144 is an excellent choice for battery
• Slew Rate: operated systems, portable instrumentation and
– Small Signal, 5V/μsothers.
– Large Signal, 30V/μsThe greater than rail-to-rail input voltage range
• Low Supply Current 650μA/Amplifier eliminates concern over exceeding the common-
mode voltage range. The rail-to-rail output swing
• Wide Supply Range 1.8V to 24V provides the maximum possible dynamic range at the
• CMRR 107dB output. This is particularly important when operating
• Gain 108dB with RL= 10k on low supply voltages.
• PSRR 87dB High gain-bandwidth with 650μA/Amplifier supply
current opens new battery powered applications
APPLICATIONS where previous higher power consumption reduced
battery life to unacceptable levels. The ability to drive
• Battery Operated Instrumentation large capacitive loads without oscillating functionally
• Depth Sounders/Fish Finders removes this common problem.
• Barcode Scanners
• Wireless Communications
• Rail-to-Rail in-out Instrumentation Amps
Connection Diagrams
Figure 1. 8-Pin CDIP Figure 2. 8-Pin PDIP/SOIC
Top View Top View
Figure 3. 14-Pin PDIP/SOIC
Top View
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM6142, LM6144
SNOS726D –JUNE 2000–REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
ESD Tolerance(3) 2500V
Differential Input Voltage 15V
Voltage at Input/Output Pin (V+) + 0.3V, (V−)−0.3V
Supply Voltage (V+−V−) 35V
Current at Input Pin ±10mA
Current at Output Pin(4) ±25mA
Current at Power Supply Pin 50mA
Lead Temperature (soldering, 10 sec) 260°C
Storage Temp. Range −65°C to +150°C
Junction Temperature(5) 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 1.5kΩin series with 100pF.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of TJ(MAX),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) −TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings(1)
Supply Voltage 1.8V ≤V+≤24V
Temperature Range LM6142, LM6144 −40°C ≤TA≤+85°C
Thermal Resistance (θJA) P Package, 8-Pin PDIP 115°C/W
D Package, 8-Pin SOIC 193°C/W
NFF Package, 14-Pin PDIP 81°C/W
D Package, 14-Pin SOIC 126°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
5.0V DC Electrical Characteristics(1)
Unless otherwise specified, all limits guaranteed for TA= 25°C, V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
VOS Input Offset Voltage 0.3 1.0 2.5 mV
2.2 3.3 max
TCVOS Input Offset Voltage 3μV/°C
Average Drift
IBInput Bias Current 170 250 300 nA
max
0V ≤VCM ≤5V 180 280
526 526
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No guarantee of parametric performance is indicated in the electrical tables under
conditions of the internal self heating where TJ> TA.
(2) Typical values represent the most likely parametric norm.
(3) All limits are guaranteed by testing or statistical analysis.
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SNOS726D –JUNE 2000–REVISED MARCH 2013
5.0V DC Electrical Characteristics(1) (continued)
Unless otherwise specified, all limits guaranteed for TA= 25°C, V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
IOS Input Offset Current 3 30 30 nA
80 80 max
RIN Input Resistance, CM126 MΩ
CMRR Common Mode 0V ≤VCM ≤4V 107 84 84
Rejection Ratio 78 78
0V ≤VCM ≤5V 82 66 66 dB
min
79 64 64
PSRR Power Supply 5V ≤V+≤24V 87 80 80
Rejection Ratio 78 78
VCM Input Common-Mode −0.25 0 0 V
Voltage Range 5.25 5.0 5.0
AVLarge Signal RL= 10k 270 100 80 V/mV
Voltage Gain 70 33 25 min
VOOutput Swing RL= 100k 0.005 0.01 0.01 V
0.013 0.013 max
4.995 4.98 4.98 V
4.93 4.93 min
RL= 10k 0.02 V max
4.97 V min
RL= 2k 0.06 0.1 0.1 V
0.133 0.133 max
4.90 4.86 4.86 V
4.80 4.80 min
ISC Output Short Sourcing 13 10 8 mA
Circuit Current 4.9 4 min
LM6142 35 35 mA
max
Sinking 24 10 10 mA
5.3 5.3 min
35 35 mA
max
ISC Output Short Sourcing 8 6 6 mA
Circuit Current 3 3 min
LM6144 35 35 mA
max
Sinking 22 8 8 mA
4 4 min
35 35 mA
max
ISSupply Current Per Amplifier 650 800 800 μA
880 880 max
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5.0V AC Electrical Characteristics(1)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 5.0V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
SR Slew Rate 8 VPP @ V+12V 25 15 13 V/μs
RS> 1 kΩ13 11 min
GBW Gain-Bandwidth Product f = 50 kHz 17 10 10 MHz
6 6 min
φmPhase Margin 38 Deg
Amp-to-Amp Isolation 130 dB
enInput-Referred f = 1 kHz nV
16
Voltage Noise √Hz
inInput-Referred f = 1 kHz pA
0.22
Current Noise √Hz
T.H.D. Total Harmonic Distortion f = 10 kHz, RL= 10 kΩ, 0.003 %
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No guarantee of parametric performance is indicated in the electrical tables under
conditions of the internal self heating where TJ> TA.
(2) Typical values represent the most likely parametric norm.
(3) All limits are guaranteed by testing or statistical analysis.
2.7V DC Electrical Characteristics(1)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extreme
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
VOS Input Offset Voltage 0.4 1.8 2.5 mV
4.3 5 max
IBInput Bias Current 150 250 300 nA
526 526 max
IOS Input Offset Current 4 30 30 nA
80 80 max
RIN Input Resistance 128 MΩ
CMRR Common Mode 0V ≤VCM ≤1.8V 90 dB
Rejection Ratio min
0V ≤VCM ≤2.7V 76
PSRR Power Supply 3V ≤V+ ≤5V 79
Rejection Ratio
VCM Input Common-Mode −0.25 0 0 V min
Voltage Range 2.95 2.7 2.7 V max
AVLarge Signal RL= 10k 55 V/mV
Voltage Gain min
VOOutput Swing RL= 100kΩ0.019 0.08 0.08 V
0.112 0.112 max
2.67 2.66 2.66 V
2.25 2.25 min
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No guarantee of parametric performance is indicated in the electrical tables under
conditions of the internal self heating where TJ> TA.
(2) Typical values represent the most likely parametric norm.
(3) All limits are guaranteed by testing or statistical analysis.
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SNOS726D –JUNE 2000–REVISED MARCH 2013
2.7V DC Electrical Characteristics(1) (continued)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extreme
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
ISSupply Current Per Amplifier 510 800 800 μA
880 880 max
2.7V AC Electrical Characteristics(1)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 2.7V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extreme
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
GBW Gain-Bandwidth Product f = 50 kHz 9 MHz
φmPhase Margin 36 Deg
GmGain Margin 6 dB
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No guarantee of parametric performance is indicated in the electrical tables under
conditions of the internal self heating where TJ> TA.
(2) Typical values represent the most likely parametric norm.
(3) All limits are guaranteed by testing or statistical analysis.
24V Electrical Characteristics(1)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extreme
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
VOS Input Offset Voltage 1.3 2 3.8 mV
4.8 4.8 max
IBInput Bias Current 174 nA
max
IOS Input Offset Current 5 nA
max
RIN Input Resistance 288 MΩ
CMRR Common Mode 0V ≤VCM ≤23V 114 dB
Rejection Ratio min
0V ≤VCM ≤24V 100
PSRR Power Supply 0V ≤VCM ≤24V 87
Rejection Ratio
VCM Input Common-Mode −0.25 0 0 V min
Voltage Range 24.25 24 24 V max
AVLarge Signal RL= 10k 500 V/mV
Voltage Gain min
VOOutput Swing RL= 10 kΩ0.07 0.15 0.15 V
0.185 0.185 max
23.85 23.81 23.81 V
23.62 23.62 min
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ= TA. No guarantee of parametric performance is indicated in the electrical tables under
conditions of the internal self heating where TJ> TA.
(2) Typical values represent the most likely parametric norm.
(3) All limits are guaranteed by testing or statistical analysis.
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24V Electrical Characteristics(1) (continued)
Unless Otherwise Specified, All Limits Guaranteed for TA= 25°C, V+= 24V, V−= 0V, VCM = VO= V+/2 and RL> 1 MΩto V+/2.
Boldface limits apply at the temperature extreme
Symbol Parameter Conditions Typ(2) LM6144AI LM6144BI Units
LM6142AI LM6142BI
Limit(3) Limit(3)
ISSupply Current Per Amplifier 750 1100 1100 μA
1150 1150 max
GBW Gain-Bandwidth Product f = 50 kHz 18 MHz
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SNOS726D –JUNE 2000–REVISED MARCH 2013
Typical Performance Characteristics
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Supply Current vs. Supply Voltage Offset Voltage vs. Supply Voltage
Figure 4. Figure 5.
Bias Current vs. Supply Voltage Offset Voltage vs. VCM
Figure 6. Figure 7.
Offset Voltage vs. VCM Offset Voltage vs. VCM
Figure 8. Figure 9.
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Typical Performance Characteristics (continued)
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Bias Current vs. VCM Bias Current vs. VCM
Figure 10. Figure 11.
Bias Current vs. VCM Open-Loop Transfer Function
Figure 12. Figure 13.
Open-Loop Transfer Function Open-Loop Transfer Function
Figure 14. Figure 15.
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Typical Performance Characteristics (continued)
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Output Voltage vs. Source Current Output Voltage vs. Source Current
Figure 16. Figure 17.
Output Voltage vs. Source Current Output Voltage vs. Sink Current
Figure 18. Figure 19.
Output Voltage vs. Sink Current Output Voltage vs. Sink Current
Figure 20. Figure 21.
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Typical Performance Characteristics (continued)
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Gain and Phase vs. Load Gain and Phase vs. Load
Figure 22. Figure 23.
Distortion + Noise vs. Frequency GBW vs. Supply
Figure 24. Figure 25.
Open Loop Gain vs. Load, 3V Supply Open Loop Gain vs. Load, 5V Supply
Figure 26. Figure 27.
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Typical Performance Characteristics (continued)
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Open Loop Gain vs. Load, 24V Supply Unity Gain Frequency vs. VS
Figure 28. Figure 29.
CMRR vs. Frequency Crosstalk vs. Frequency
Figure 30. Figure 31.
PSRR vs. Frequency Noise Voltage vs. Frequency
Figure 32. Figure 33.
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Typical Performance Characteristics (continued)
TA= 25°C, RL= 10 kΩUnless Otherwise Specified
Noise Current vs. Frequency NF vs. RSource
Figure 34. Figure 35.
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SNOS726D –JUNE 2000–REVISED MARCH 2013
LM6142/LM6144 APPLICATION IDEAS
The LM6142 brings a new level of ease of use to op amp system design.
With greater than rail-to-rail input voltage range concern over exceeding the common-mode voltage range is
eliminated.
Rail-to-rail output swing provides the maximum possible dynamic range at the output. This is particularly
important when operating on low supply voltages.
The high gain-bandwidth with low supply current opens new battery powered applications, where high power
consumption, previously reduced battery life to unacceptable levels.
To take advantage of these features, some ideas should be kept in mind.
ENHANCED SLEW RATE
Unlike most bipolar op amps, the unique phase reversal prevention/speed-up circuit in the input stage causes the
slew rate to be very much a function of the input signal amplitude.
Figure 36 shows how excess input signal, is routed around the input collector-base junctions, directly to the
current mirrors.
The LM6142/LM6144 input stage converts the input voltage change to a current change. This current change
drives the current mirrors through the collectors of Q1–Q2, Q3–Q4 when the input levels are normal.
Figure 36.
If the input signal exceeds the slew rate of the input stage, the differential input voltage rises above two diode
drops. This excess signal bypasses the normal input transistors, (Q1–Q4), and is routed in correct phase through
the two additional transistors, (Q5, Q6), directly into the current mirrors.
This rerouting of excess signal allows the slew-rate to increase by a factor of 10 to 1 or more. (See Figure 37.)
As the overdrive increases, the op amp reacts better than a conventional op amp. Large fast pulses will raise the
slew- rate to around 30V to 60V/μs.
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Figure 37. Slew Rate vs. ΔVIN
VS= ±5V
This effect is most noticeable at higher supply voltages and lower gains where incoming signals are likely to be
large.
This new input circuit also eliminates the phase reversal seen in many op amps when they are overdriven.
This speed-up action adds stability to the system when driving large capacitive loads.
DRIVING CAPACITIVE LOADS
Capacitive loads decrease the phase margin of all op amps. This is caused by the output resistance of the
amplifier and the load capacitance forming an R-C phase lag network. This can lead to overshoot, ringing and
oscillation. Slew rate limiting can also cause additional lag. Most op amps with a fixed maximum slew-rate will lag
further and further behind when driving capacitive loads even though the differential input voltage raises. With the
LM6142, the lag causes the slew rate to raise. The increased slew-rate keeps the output following the input
much better. This effectively reduces phase lag. After the output has caught up with the input, the differential
input voltage drops down and the amplifier settles rapidly.
These features allow the LM6142 to drive capacitive loads as large as 1000pF at unity gain and not oscillate.
The scope photos (Figure 38 and Figure 39) above show the LM6142 driving a l000pF load. In Figure 38, the
upper trace is with no capacitive load and the lower trace is with a 1000pF load. Here we are operating on ±12V
supplies with a 20 VPP pulse. Excellent response is obtained with a Cfof l0pF. In Figure 39, the supplies have
been reduced to ±2.5V, the pulse is 4 VPP and Cfis 39pF. The best value for the compensation capacitor is best
established after the board layout is finished because the value is dependent on board stray capacity, the value
of the feedback resistor, the closed loop gain and, to some extent, the supply voltage.
Another effect that is common to all op amps is the phase shift caused by the feedback resistor and the input
capacitance. This phase shift also reduces phase margin. This effect is taken care of at the same time as the
effect of the capacitive load when the capacitor is placed across the feedback resistor.
The circuit shown in Figure 40 was used for these scope photos.
Figure 38.
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SNOS726D –JUNE 2000–REVISED MARCH 2013
Figure 39.
Figure 40.
Typical Applications
FISH FINDER/ DEPTH SOUNDER.
The LM6142/LM6144 is an excellent choice for battery operated fish finders. The low supply current, high gain-
bandwidth and full rail to rail output swing of the LM6142 provides an ideal combination for use in this and similar
applications.
ANALOG TO DIGITAL CONVERTER BUFFER
The high capacitive load driving ability, rail-to-rail input and output range with the excellent CMR of 82 dB, make
the LM6142/LM6144 a good choice for buffering the inputs of A to D converters.
3 OP AMP INSTRUMENTATION AMP WITH RAIL-TO-RAIL INPUT AND OUTPUT
Using the LM6144, a 3 op amp instrumentation amplifier with rail-to-rail inputs and rail to rail output can be made.
These features make these instrumentation amplifiers ideal for single supply systems.
Some manufacturers use a precision voltage divider array of 5 resistors to divide the common-mode voltage to
get an input range of rail-to-rail or greater. The problem with this method is that it also divides the signal, so to
even get unity gain, the amplifier must be run at high closed loop gains. This raises the noise and drift by the
internal gain factor and lowers the input impedance. Any mismatch in these precision resistors reduces the CMR
as well. Using the LM6144, all of these problems are eliminated.
In this example, amplifiers A and B act as buffers to the differential stage (Figure 41). These buffers assure that
the input impedance is over 100MΩand they eliminate the requirement for precision matched resistors in the
input stage. They also assure that the difference amp is driven from a voltage source. This is necessary to
maintain the CMR set by the matching of R1–R2 with R3–R4.
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Figure 41.
The gain is set by the ratio of R2/R1 and R3 should equal R1 and R4 equal R2. Making R4 slightly smaller than
R2 and adding a trim pot equal to twice the difference between R2 and R4 will allow the CMR to be adjusted for
optimum.
With both rail to rail input and output ranges, the inputs and outputs are only limited by the supply voltages.
Remember that even with rail-to-rail output, the output can not swing past the supplies so the combined common
mode voltage plus the signal should not be greater than the supplies or limiting will occur.
SPICE MACROMODEL
A SPICE macromodel of this and many other Texas Instruments op amps is available
http://www.ti.com/ww/en/analog/webench/index.shtml?DCMP=hpa_sva_webench&HQS=webench-bb.
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 16
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PACKAGE OPTION ADDENDUM
www.ti.com 6-Mar-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM6142AIM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 85 LM614
2AIM
LM6142AIM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM614
2AIM
LM6142AIMX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LM614
2AIM
LM6142AIMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM614
2AIM
LM6142BIM NRND SOIC D 8 95 Non-RoHS
& Green Call TI Call TI -40 to 85 LM614
2BIM
LM6142BIM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM614
2BIM
LM6142BIMX NRND SOIC D 8 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LM614
2BIM
LM6142BIMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM614
2BIM
LM6142BIN/NOPB ACTIVE PDIP P 8 40 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 85 LM6142
BIN
LM6144AIM NRND SOIC D 14 55 Non-RoHS
& Green Call TI Call TI -40 to 85 LM6144
AIM
LM6144AIM/NOPB ACTIVE SOIC D 14 55 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM6144
AIM
LM6144AIMX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM6144
AIM
LM6144BIM NRND SOIC D 14 55 Non-RoHS
& Green Call TI Call TI -40 to 85 LM6144
BIM
LM6144BIM/NOPB ACTIVE SOIC D 14 55 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM6144
BIM
LM6144BIMX NRND SOIC D 14 2500 Non-RoHS
& Green Call TI Call TI -40 to 85 LM6144
BIM
LM6144BIMX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM6144
BIM
LM6144BIN/NOPB ACTIVE PDIP NFF 14 25 RoHS & Green Call TI | SN Level-1-NA-UNLIM -40 to 85 LM6144BIN
PACKAGE OPTION ADDENDUM
www.ti.com 6-Mar-2021
Addendum-Page 2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM6142AIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6142AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6142BIMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6142BIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM6144AIMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LM6144BIMX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LM6144BIMX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM6142AIMX SOIC D 8 2500 367.0 367.0 35.0
LM6142AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM6142BIMX SOIC D 8 2500 367.0 367.0 35.0
LM6142BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM6144AIMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LM6144BIMX SOIC D 14 2500 367.0 367.0 35.0
LM6144BIMX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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