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LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
LM4050-N/-Q1 Precision Micropower Shunt Voltage Reference
1 Features 3 Description
Ideal for space-critical applications, the LM4050-N
1• Small Package: SOT-23 precision voltage reference is available in the sub-
• No Output Capacitor Required miniature (3 mm × 1.3 mm) SOT-23 surface-mount
• Tolerates Capacitive Loads package. The LM4050-N design eliminates the need
for an external stabilizing capacitor while ensuring
• Fixed Reverse Breakdown Voltages of 2.048 V, stability with any capacitive load, thus making the
2.5 V, 4.096 V, 5 V, 8.192 V, and 10 V LM4050-N easy to use. Further reducing design effort
• Key Specifications (LM4050-N) is the availability of several fixed reverse breakdown
– Output Voltage Tolerance (A Grade, 25°C) voltages: 2.048 V, 2.5 V, 4.096 V, 5 V, 8.192 V, and
±0.1% (Maximum) 10 V. The minimum operating current increases from
60 μA for the LM4050-N-2.0 to 100 μA for the
– Low Output Noise (10 Hz to 10 kHz) 41 μVrms LM4050-N-10.0. All versions have a maximum
(Typical) operating current of 15 mA.
– Wide Operating Current Range 60 μA to 15 The LM4050-N utilizes fuse and Zener-zap reverse
mA breakdown voltage trim during wafer sort to ensure
– Industrial Temperature Range −40°C to 85°C that the prime parts have an accuracy of better than
– Extended Temperature Range −40°C to 125°C ±0.1% (A grade) at 25°C. Bandgap reference
temperature drift curvature correction and low
– Low Temperature Coefficient 50 ppm/°C (max) dynamic impedance ensure stable reverse
– LM4050-N-Q1 is AEC-Q100 Grade 1 Qualified breakdown voltage accuracy over a wide range of
and are Manufactured on an Automotive operating temperatures and currents.
Grade Flow All grades and voltage options of the LM4050-N are
available in both an industrial temperature range
2 Applications (−40°C and 85°C) and an extended temperature
• Portable, Battery-Powered Equipment range (−40°C and 125°C).
• Data Acquisition Systems Device Information(1)
• Instrumentation PART NUMBER PACKAGE BODY SIZE (NOM)
• Process Control LM4050-N
• Energy Management SOT-23 (3) 2.92 mm × 1.30 mm
LM4050-N-Q1
• Product Testing (1) For all available packages, see the orderable addendum at
• Automotive the end of the data sheet.
• Precision Audio Components
Shunt Regulator Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
8.1 Overview................................................................. 13
1 Features.................................................................. 18.2 Functional Block Diagram....................................... 13
2 Applications ........................................................... 18.3 Feature Description................................................. 13
3 Description............................................................. 18.4 Device Functional Modes........................................ 13
4 Revision History..................................................... 29 Application and Implementation ........................ 14
5 Pin Configuration and Functions......................... 39.1 Application Information............................................ 14
6 Specifications......................................................... 39.2 Typical Applications ................................................ 15
6.1 Absolute Maximum Ratings ...................................... 310 Power Supply Recommendations ..................... 21
6.2 ESD Ratings.............................................................. 311 Layout................................................................... 21
6.3 Recommended Operating Conditions ...................... 411.1 Layout Guidelines ................................................. 21
6.4 Thermal Information.................................................. 411.2 Layout Example .................................................... 21
6.5 Electrical Characteristics: 2-V Option ....................... 512 Device and Documentation Support ................. 22
6.6 Electrical Characteristics: 2.5-V Option .................... 612.1 Related Links ........................................................ 22
6.7 Electrical Characteristics: 4.1-V Option .................... 712.2 Community Resources.......................................... 22
6.8 Electrical Characteristics: 5-V Option ...................... 812.3 Trademarks........................................................... 22
6.9 Electrical Characteristics: 8.2-V Option ................... 912.4 Electrostatic Discharge Caution............................ 22
6.10 Electrical Characteristics: 10-V Option ................ 10 12.5 Glossary................................................................ 22
6.11 Typical Characteristics.......................................... 11 13 Mechanical, Packaging, and Orderable
7 Parameter Measurement Information ................ 12 Information ........................................................... 22
8 Detailed Description............................................ 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (June 2015) to Revision G Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
• Removed Vapor Phase and Infrared Lead Temperatures from Abs Max Ratings table. ...................................................... 3
Changes from Revision E (April 2013) to Revision F Page
• Deleted "-25" from (LM4050-N) in Key Specifications title and "A/-Q1B/-Q1C" from Key Specification re: auto grade........ 1
• Added Maximum Junction Temperature to Abs Max Ratings table ...................................................................................... 3
• Added table notes to Operating Ratings table to clarify operating and high junction temperature ranges............................ 4
• Deleted "-N" from part numbers in EC table "Limits" column headers .................................................................................. 5
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 20
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5 Pin Configuration and Functions
DBZ Package
3-Pin SOT-23
Top View
*This pin must be left floating or connected to pin 2.
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
Cathode 1 I/O Shunt current and input voltage
Anode 2 O Common pin, normally connected to ground
NC 3 — No internal connection
6 Specifications
6.1 Absolute Maximum Ratings
See (1),(2)
MIN MAX UNIT
Reverse Current 20 mA
Forward Current 10 mA
Power Dissipation (TA= 25°C)(3) 280 mW
Maximum Junction Temperature (4) 150 °C
Storage Temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax −TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 150°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package.
(4) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
Electrostatic
V(ESD) Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 V
discharge Machine model (MM) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
Ambient Temperature Range –40 85 °C
Industrial Temperature Range Junction Temperature Range –40 85 °C
Ambient Temperature Range –40 125 °C
Extended Temperature Range Junction Temperature –40 125 °C
(1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
RθJA (junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax −TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4050-N,
TJmax = 150°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package.
(2) Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and conditions, see
Electrical Characteristics section.
6.4 Thermal Information LM4050-N/-Q1
THERMAL METRIC(1) DBZ (SOT-23) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 287 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 106.6 °C/W
RθJB Junction-to-board thermal resistance 57.7 °C/W
ψJT Junction-to-top characterization parameter 5.5 °C/W
ψJB Junction-to-board characterization parameter 56.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics: 2-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Reverse Breakdown Voltage IR= 100 μA 2.048 V
LM4050AIM3, LM4050AEM3 ±2.048
IR= 100 μA LM4050BIM3, LM4050BEM3 ±4.096
LM4050CIM3, LM4050CEM3 ±1024
LM4050AIM3, LM4050AEM3 ±9.0112
VRReverse breakdown voltage Industrial temperature range LM4050BIM3, LM4050BEM3 ±11.4688 mV
tolerance(3) TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±14.7456
LM4050AIM3, LM4050AEM3 ±12.288
Extended temperature range LM4050BIM3, LM4050BEM3 ±14.7456
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±17.2032
TA= TJ= 25°C 41 60
IRMIN Minimum operating current μA
TA= TJ= TMIN to TMAX 65
IR= 10 mA ±20
IR= 1 mA ±15
Average reverse breakdown
ΔVR/ΔT voltage temperature ppm/°C
IR= 100 μA, TA= TJ= 25°C ±15
coefficient(3) IR= 100 μA, ±50
TA= TJ= TMIN to TMAX
IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.3 0.8
IRMIN ≤IR≤1 mA, 1.2
Reverse breakdown voltage TA= TJ= TMIN to TMAX
ΔVR/ΔIRchange with operating current mV
1 mA ≤IR≤15 mA, TA= TJ= 25°C 2.3 6
change(4)
1 mA ≤IR≤15 mA, 8
TA= TJ= TMIN to TMAX
ZRReverse dynamic impedance IR= 1 mA, f = 120 Hz, IAC = 0.1 IR0.3 Ω
eNWideband noise IR= 100 μA, 10 Hz ≤f≤10 kHz 34 μVrms
Reverse breakdown voltage
ΔVRt = 1000 hrs, T = 25°C ±0.1°C, IR= 100 μA 120 ppm
long term stability
VHYST Thermal hysteresis (5) ΔT = −40°C to 125°C 0.7 mV
(1) Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
(2) Typicals are at TJ= 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
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6.6 Electrical Characteristics: 2.5-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
IR= 100 μA 2.500 V
LM4050AIM3, LM4050AEM3 ±2.5
Reverse breakdown voltage IR= 100 μA LM4050BIM3, LM4050BEM3 ±5 mV
LM4050CIM3, LM4050CEM3 ±13
LM4050AIM3, LM4050AEM3 ±11
VRIndustrial temperature range, LM4050BIM3, LM4050BEM3 ±24
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±21
Reverse breakdown voltage mV
tolerance(3) LM4050AIM3, LM4050AEM3 ±15
Extended temperature range, LM4050BIM3, LM4050BEM3 ±18
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±25
TA= TJ= 25°C 41 60
IRMIN Minimum operating current μA
TA= TJ= TMIN to TMAX 65
IR= 10 mA ±20
IR= 1 mA ±15
Average reverse breakdown
ΔVR/ΔT ppm/°C
voltage temperature coefficient(3) IR= 100 μA, TA= TJ= 25°C ±15
IR= 100 μA, TA= TJ= TMIN to TMAX ±50
IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.3 0.8
Reverse breakdown voltage
ΔVR/ΔIRchange with operating current mV
IRMIN ≤IR≤1 mA 1.2
change(4) TA= TJ= TMIN to TMAX
1 mA ≤IR≤15 mA, TA= TJ= 25°C 2.3 6
Reverse breakdown voltage
ΔVR/ΔIRchange with operating current mV
1 mA ≤IR≤15 mA, 8
change(4) TA= TJ= TMIN to TMAX
ZRReverse dynamic impedance IR= 1 mA, f = 120 Hz, IAC = 0.1 IR0.3 Ω
eNWideband noise IR= 100 μA, 10 Hz ≤f≤10 kHz 41 μVrms
Reverse breakdown voltage long
ΔVRt = 1000 hrs, T = 25°C ±0.1°C, IR= 100 μA 120 ppm
term stability
VHYST Thermal hysteresis (5) ΔT = −40°C to 125°C 07 mV
(1) Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
(2) Typicals are at TJ= 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
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6.7 Electrical Characteristics: 4.1-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2%, and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Reverse Breakdown Voltage IR= 100 μA 4.096 V
LM4050AIM3, LM4050AEM3 ±4.1
IR= 100 μA LM4050BIM3,LM4050BEM3 ±8.2
LM4050CIM3, LM4050CEM3 ±21
LM4050AIM3, LM4050AEM3 ±18
VRIndustrial temperature range,
Reverse Breakdown Voltage LM4050BIM3,LM4050BEM3 ±22 mV
Tolerance(2) TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±34
LM4050AIM3, LM4050AEM3 ±25
Extended temperature range, LM4050BIM3,LM4050BEM3 ±29
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±41
TA= TJ= 25°C 52 68
Industrial temperature range,
IRMIN Minimum Operating Current 73 μA
TA= TJ= TMIN to TMAX
Extended temperature range, TA= TJ= TMIN to TMAX 78
IR= 10 mA ±30
IR= 1 mA ±20
Average reverse breakdown voltage
ΔVR/ΔT ppm/°C
temperature coefficient(2) IR= 100 μA, TA= TJ= 25°C ±20
IR= 100 μA, TA= TJ= TMIN to TMAX ±50
IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.2 0.9
IRMIN ≤IR≤1 mA, TA= TJ= TMIN to TMAX 1.2
Reverse breakdown voltage change
ΔVR/ΔIRmV
with operating current change(3) 1 mA ≤IR≤15 mA, TA= TJ= 25°C 2 7
1 mA ≤IR≤15 mA, TA= TJ= TMIN to TMAX 10
ZRReverse dynamic impedance IR= 1 mA, f = 120 Hz, IAC = 0.1 IR0.5 Ω
eNWideband noise IR= 100 μA, 10 Hz ≤f≤10 kHz 93 μVrms
Reverse breakdown voltage long
ΔVRt = 1000 hrs, T = 25°C ±0.1°C, IR= 100 μA 120 ppm
term stability
VHYST Thermal hysteresis(4) ΔT = −40°C to 125°C 1.148 mV
(1) Typicals are at TJ= 25°C and represent most likely parametric norm.
(2) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(3) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(4) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
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6.8 Electrical Characteristics: 5-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1%,
±0.2% and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Reverse Breakdown Voltage IR= 100 μA 5 V
LM4050AIM3, LM4050AEM3 ±5
IR= 100 μA LM4050BIM3. LM4050BEM3 ±10
LM4050CIM3, LM4050CEM3 ±25
LM4050AIM3, LM4050AEM3 ±22
VRReverse Breakdown Voltage Industrial Temp. Range LM4050BIM3, LM4050BEM3 ±27 mV
Tolerance(3) TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±42
LM4050AIM3, LM4050AEM3 ±30
Extended Temp. Range LM4050BIM3, LM4050BEM3 ±35
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±50
Minimum Operating Current TA= TJ= 25°C 56 74
Industrial Temp. Range 80
IRMIN TA= TJ= TMIN to TMAX μA
Extended Temp. Range 90
TA= TJ= TMIN to TMAX
Average Reverse Breakdown IR= 10 mA ±30
Voltage Temperature Coefficient(3) IR= 1 mA ±20
ΔVR/ΔT ppm/°C
IR= 100 μA, TA= TJ= 25°C ±20
IR= 100 μA±50
TA= TJ= TMIN to TMAX
Reverse Breakdown Voltage IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.2 1
Change with Operating Current IRMIN ≤IR≤1 mA
Change(4) 1.4
TA= TJ= TMIN to TMAX
ΔVR/ΔIRmV
1 mA ≤IR≤15 mA, TA= TJ= 25°C 2 8
1 mA ≤IR≤15 mA 12
TA= TJ= TMIN to TMAX
Reverse Dynamic Impedance IR= 1 mA, f = 120 Hz 0.5
ZRΩ
IAC = 0.1 IR
Wideband Noise IR= 100 μA
eN93 μVrms
10 Hz ≤f≤10 kHz
Reverse Breakdown Voltage Long t = 1000 hrs
ΔVRTerm Stability T = 25°C ±0.1°C 120 ppm
IR= 100 μA
VHYST Thermal Hysteresis(5) ΔT = –40°C to 125°C 1.4 mV
(1) Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
(2) Typicals are at TJ= 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
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6.9 Electrical Characteristics: 8.2-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1% and
±0.2% and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Reverse Breakdown Voltage IR= 150 μA 8.192 V
LM4050AIM3, LM4050AEM3 ±8.2
IR= 150 μA LM4050BIM3, LM4050BEM3 ±16
LM4050CIM3, LM4050CEM3 ±41
LM4050AIM3, LM4050AEM3 ±35
VRReverse Breakdown Voltage Industrial Temp. Range LM4050BIM3, LM4050BEM3 ±43 mV
Tolerance (3) TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±68
LM4050AIM3, LM4050AEM3 ±49
Extended Temp. Range LM4050BIM3, LM4050BEM3 ±57
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±82
TA= TJ= 25°C 74 91
Industrial Temp. Range 95
IRMIN Minimum Operating Current TA= TJ= TMIN to TMAX μA
Extended Temp. Range 100
TA= TJ= TMIN to TMAX
IR= 10 mA ±40
IR= 1 mA ±20
Average Reverse Breakdown
ΔVR/ΔT ppm/°C
IR= 150 μA, TA= TJ= 25°C ±20
Voltage Temperature Coefficient (3)
IR= 150 μA±50
TA= TJ= TMIN to TMAX
Reverse Breakdown Voltage IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.6 1.3
Change with Operating Current IRMIN ≤IR≤1 mA
Change (4) 2.5
TA= TJ= TMIN to TMAX
ΔVR/ΔIRmV
1 mA ≤IR≤15 mA, TA= TJ= 25°C 7 10
1 mA ≤IR≤15 mA 18
TA= TJ= TMIN to TMAX
Reverse Dynamic Impedance IR= 1 mA, f = 120 Hz,
ZR0.6 Ω
IAC = 0.1 IR
Wideband Noise IR= 150 μA
eN150 μVrms
10 Hz ≤f≤10 kHz
Reverse Breakdown Voltage Long t = 1000 hrs
ΔVRTerm Stability T = 25°C ±0.1°C 120 ppm
IR= 150 μA
Thermal Hysteresis ΔT = −40°C to 125°C
VHYST 2.3 mV
(5)
(1) Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
(2) Typicals are at TJ= 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
6.10 Electrical Characteristics: 10-V Option
All other limits TA= TJ= 25°C. The grades A, B and C designate initial Reverse Breakdown Voltage tolerances of ±0.1% and
±0.2% and 0.5% respectively.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Reverse Breakdown Voltage IR= 150 μA 10 V
LM4050AIM3, LM4050AEM3 ±10
IR= 150 μA LM4050BIM3, LM4050BEM3 ±20
LM4050CIM3, LM4050CEM3 ±50
LM4050AIM3, LM4050AEM3 ±43
VRReverse Breakdown Voltage Industrial Temp. Range LM4050BIM3, LM4050BEM3 ±53 mV (max)
Tolerance (3) TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±83
LM4050AIM3, LM4050AEM3 ±60
Extended Temp. Range LM4050BIM3, LM4050BEM3 ±70
TA= TJ= TMIN to TMAX LM4050CIM3, LM4050CEM3 ±100
TA= TJ= 25°C 80 100
Industrial Temp. Range 103
IRMIN Minimum Operating Current TA= TJ= TMIN to TMAX μA
Extended Temp. Range 110
TA= TJ= TMIN to TMAX
IR= 10 mA ±40
IR= 1 mA ±20
Average Reverse Breakdown
ΔVR/ΔT ppm/°C
IR= 150 μA, TA= TJ= 25°C ±20
Voltage Temperature Coefficient (3)
IR= 150 μA ±50
TA= TJ= TMIN to TMAX
IRMIN ≤IR≤1 mA, TA= TJ= 25°C 0.8 1.5
IRMIN ≤IR≤1 mA 3.5
Reverse Breakdown Voltage TA= TJ= TMIN to TMAX
ΔVR/ΔIRChange with Operating Current mV
1 mA ≤IR≤15 mA, TA= TJ= 25°C 8 12
Change (4)
1 mA ≤IR≤15 mA 23
TA= TJ= TMIN to TMAX
IR= 1 mA, f = 120 Hz, 0.7
ZRReverse Dynamic Impedance Ω
IAC = 0.1 IR
IR= 150 μA 150
eNWideband Noise μVrms
10 Hz ≤f≤10 kHz
t = 1000 hrs 120
Reverse Breakdown Voltage Long
ΔVRT = 25°C ±0.1°C ppm
Term Stability IR= 150 μA
VHYST Thermal Hysteresis(5) ΔT = −40°C to 125°C 2.8 mV
(1) Limits are 100% production tested at 25°C. Limits over temperature are guaranteed through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate National's AOQL.
(2) Typicals are at TJ= 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR/ΔT)(maxΔT)(VR)]. Where, ΔVR/ΔT is the VRtemperature coefficient, maxΔT is the maximum difference in temperature
from the reference point of 25°C to T MIN or TMAX, and VRis the reverse breakdown voltage. The total overtemperature tolerance for the
different grades in the industrial temperature range where maxΔT = 65°C is shown below: A-grade: ±0.425% = ±0.1% ±50 ppm/°C ×
65°C B-grade: ±0.525% = ±0.2% ±50 ppm/°C × 65°C C-grade: ±0.825% = ±0.5% ±50 ppm/°C × 65°C. Therefore, as an
example, the A-grade LM4050-N-2.5 has an overtemperature Reverse Breakdown Voltage tolerance of ±2.5V × 0.425% = ±11 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at 25°C after cycling to temperature –40°C and the 25°C
measurement after cycling to temperature 125°C.
10 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N
,
LM4050-N-Q1
www.ti.com
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
6.11 Typical Characteristics
Figure 1. Output Impedance vs Frequency Figure 2. Output Impedance vs Frequency
Figure 3. Reverse Characteristics and Minimum Operating Figure 4. Noise Voltage vs Frequency
Current
Figure 5. Thermal Hysteresis
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
6.11.1 Start-Up Characteristics
Figure 6. Input Voltage Step Response LM4050-N-2.5 Figure 7. Input Voltage Step Response LM4050-N-5
Figure 8. Input Voltage Step Response LM4050-N-10
7 Parameter Measurement Information
Figure 9. Test Circuit
12 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N
,
LM4050-N-Q1
www.ti.com
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
8 Detailed Description
8.1 Overview
The LM4050-N device is a precision micropower shunt voltage reference. The part comes in 6 different fixed-
output voltage options for space-constrained applications, removing the need for feedback resistors. The voltage
tolerance accuracies are ±0.1%, ±0.2%, and ±0.5% for Versions A, B, and C, respectively. The LM4050-N comes
in two application versions, Industrial and Extended temperature range, which are operational from –40°C to
85°C and –40°C to 125°C, respectively.
8.2 Functional Block Diagram
8.3 Feature Description
The LM4050-N behaves as a high-precision Zener diode. The voltage is regulated between its cathode and
anode which is dependent on the current being supplied to the cathode. This current is needed for the LM4050-N
to regulate within the specified limits. Refer to the minimum and maximum operating requirements for the specific
voltage option used. The LM4050-N is internally compensated to be stable without the use of an output
capacitor. However, if desired, a bypass capacitor may be used.
8.4 Device Functional Modes
The LM4050-N can only operate in closed loop due to the fact that the feedback resistors are internal to the
device. Additionally, the output voltage cannot be adjusted for the same reason. The output voltage is regulated
in a closed loop, provided the Rs (see Functional Block Diagram) resistor is sized to deliver the current to the
cathode within the limits specified for the fixed-voltage version being used.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LM4050-N LM4050-N-Q1
S R
S
L Q
V V
R
I I
-
=
+
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM4050-N is a precision micropower curvature-corrected bandgap shunt voltage reference. For space
critical applications, the LM4050-N is available in the sub-miniature SOT-23 surface-mount package. The
LM4050-N has been designed for stable operation without the need of an external capacitor connected between
the + pin and the −pin. If, however, a bypass capacitor is used, the LM4050-N remains stable. Reducing design
effort is the availability of several fixed reverse breakdown voltages: 2.048 V, 2.5 V, 4.096 V, 5 V, 8.192 V, and
10 V. The minimum operating current increases from 60 μA for the LM4050-N-2.0 to 100 μA for the LM4050-N-
10.0. All versions have a maximum operating current of 15 mA.
LM4050-Ns in the SOT-23 packages have a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach
interface contact). Therefore, pin 3 of the SOT-23 package must be left floating or connected to pin 2.
The 4.096-V version allows single 5-V 12-bit ADCs or DACs to operate with an LSB equal to 1 mV. For 12-bit
ADCs or DACs that operate on supplies of 10 V or greater, the 8.192-V version gives 2 mV per LSB.
The typical thermal hysteresis specification is defined as the change in 25°C voltage measured after thermal
cycling. The device is thermal cycled to temperature –40°C and then measured at 25°C. Next the device is
thermal cycled to temperature 125°C and again measured at 25°C. The resulting VOUT delta shift between the
25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced
by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature
and board mounting temperature are all factors that can contribute to thermal hysteresis.
In a conventional shunt regulator application (Figure 10) , an external series resistor (RS) is connected between
the supply voltage and the LM4050-N. RSdetermines the current that flows through the load (IL) and the
LM4050-N (IQ). Since load current and supply voltage may vary, RSshould be small enough to supply at least
the maximum guaranteed IRMIN (spec. table) to the LM4050-N even when the supply voltage is at its minimum
and the load current is at its maximum value. When the supply voltage is at its maximum and ILis at its
minimum, RSshould be large enough so that the current flowing through the LM4050-N is less than 15 mA.
RSis determined by the supply voltage, (VS), the load and operating current, (ILand IQ), and the LM4050-N's
reverse breakdown voltage, VR.
(1)
14 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
s out
RMIN
s
V V
I 0.015A
R
-
< <
Cathode
Anode
Rs
Cout
Vout
IQ+ILIL
IQ
Vs
LM4050-N
,
LM4050-N-Q1
www.ti.com
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
9.2 Typical Applications
9.2.1 Shunt Regulator
Figure 10. Shunt Regulator Schematic
9.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
DESIGN PARAMETER VALUE
Output Voltage 2 V, 2.5 V, 4.1 V, 5 V, 8.2 V, 10 V
Minimum Cathode Current 41 µA, 41 µA, 52 µA, 56 µA, 74 µA, 80 µA (Typical) (Respective to Above field)
9.2.1.2 Detailed Design Procedure
RSsets the cathode current of the shunt reference. Ensure that this current is greater than the minimum cathode
current to ensure regulation and less that the maximum reverse current to prevent overheating of the shunt
reference. A suggested good starting value for most designs is from approximately 0.5 mA to 1 mA.
(2)
9.2.1.3 Application Curve
Figure 11. Reverse Characteristics and Minimum Operating Current
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LM4050-N LM4050-N-Q1
s out
s
Q
V V
R
I
-
=
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
9.2.2 Precision Reference for an Analog-to-Digital Converter
**Ceramic monolithic
*Tantalum
Figure 12. LM4050-N-4.1'S Nominal 4.096 Breakdown Voltage Gives ADC12451 1 MV/LSB
9.2.2.1 Design Requirements
For this design example, use the parameters listed in Table 2 as the input parameters.
Table 2. Design Parameters
DESIGN PARAMETER VALUE
Output Voltage 4.1 V
9.2.2.2 Detailed Design Procedure
Set IQto approximately 1 mA.
where
• Rs = 900 Ω, nearest preferred Value = 909 Ω(3)
16 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
s
30 V 10 V
R
0.0006A
-
=
s s out
s
Q
V V V
R
I
+ - -
=
bound
V (2 0.7 V) 10 V= ´ +
f wd
V 0.7 V=
bound wd out
V 2 V V= ´ +
LM4050-N
,
LM4050-N-Q1
www.ti.com
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
9.2.3 VOUT Bounded Amplifier
Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping
voltage is ±11.5 V (LM4050-N's reverse breakdown voltage +2 diode VF).
Figure 13. Bounded Amplifier
9.2.3.1 Design Requirements
The only design requirement is VOUT bounded to ±11.5 V.
9.2.3.2 Detailed Design Procedure
(4)
(5)
(6)
Set IQto approximately 0.6 mA.
(7)
where
• RS(total) = 33 kΩ(select 2 × 15 kΩ) (8)
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LM4050-N LM4050-N-Q1
s s out
s
Q
V V V
R
I
+ - -
=
bound
V (3 0.7 V) 2.5 V= ´ +
f wd
V 0.7 V=
bound wd out
V 3 V V= ´ +
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
9.2.4 VIN Bounded Amplifier
The bounding voltage is ±4 V with the LM4050-N-2.5 (LM4050-N's reverse breakdown voltage + 3 diode VF).
Figure 14. Protecting Op Amp Input
9.2.4.1 Design Requirements
The only design requirement is VIN bounded to ±4.6 V.
9.2.4.2 Detailed Design Procedure
(9)
(10)
(11)
Set IQto approximately 0.6 mA.
(12)
where
• RS(total) = 12.5 kΩ(select 2 × 5 kΩ) (13)
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,
LM4050-N-Q1
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SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
9.2.5 ±4.096 Precision Reference
Figure 15. Precision ±4.096v Reference
9.2.5.1 Design Requirements
The only design requirement is a positive and negative reference generated from a positive reference, ±4.096 V.
9.2.5.2 Detailed Design Procedure
Follow the design procedure set in Precision Reference for an Analog-to-Digital Converter.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LM4050-N LM4050-N-Q1
out
out
V
I
R2
=
4
R1 1.583 10= ´ W
12 V 2.5 V
R1
0.0006A
-
=
Opampmax
Q
Vout Vout
R1 I
-
=
opamp max
out
V 12 V=
out
out
V
I
R2
=
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
9.2.6 ±1-mA Precision Current Sources
Figure 16. Precision 1-µA to 1-mA Current Source (±)
9.2.6.1 Design Requirements
The only design requirement is a dual ±1-mA current source.
9.2.6.2 Detailed Design Procedure
Set worse-case cathode current to 0.6 mA.
(14)
(15)
(16)
(17)
(18)
20 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
Cathode
Anode
Rs
Vs
Cout
Vout
Cin
Set Cin Close to Ref Set Cout Close to Ref
Set Rs Close to Ref
LM4050-N
,
LM4050-N-Q1
www.ti.com
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
10 Power Supply Recommendations
Noise on the power supply input to RScan affect output noise performance. Noise performance can be reduced
by using an optional bypass capacitor at the input side of RSand Ground. TI recommends a 0.1-µF ceramic
capacitor or higher.
11 Layout
11.1 Layout Guidelines
Place RSas close to the cathode as possible. If an input and output capacitor is used, place this as close to the
reference as possible.
11.2 Layout Example
Figure 17. Layout Recommendation
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: LM4050-N LM4050-N-Q1
LM4050-N
,
LM4050-N-Q1
SNOS455G –MAY 2000–REVISED SEPTEMBER 2015
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
LM4050-N Click here Click here Click here Click here Click here
LM4050-N-Q1 Click here Click here Click here Click here Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM4050-N LM4050-N-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050AEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RGA
LM4050AEM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RNA
LM4050AEM3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 RCA
LM4050AEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCA
LM4050AEM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 REA
LM4050AEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 REA
LM4050AEM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RFA
LM4050AEM3X-10/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RGA
LM4050AEM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCA
LM4050AEM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 REA
LM4050AIM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RGA
LM4050AIM3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 RCA
LM4050AIM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCA
LM4050AIM3-4.1 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 RDA
LM4050AIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDA
LM4050AIM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 REA
LM4050AIM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REA
LM4050AIM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCA
LM4050AIM3X-4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDA
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050AIM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REA
LM4050BEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RGB
LM4050BEM3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 RCB
LM4050BEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCB
LM4050BEM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RDB
LM4050BEM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 REB
LM4050BEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 REB
LM4050BEM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RFB
LM4050BEM3X-10/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RGB
LM4050BEM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCB
LM4050BEM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 REB
LM4050BIM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RGB
LM4050BIM3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 RCB
LM4050BIM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCB
LM4050BIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDB
LM4050BIM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 REB
LM4050BIM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REB
LM4050BIM3X-2.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RNB
LM4050BIM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCB
LM4050BIM3X-4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDB
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050BIM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REB
LM4050CEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM RGC
LM4050CEM3-2.5 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 125 RCC
LM4050CEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCC
LM4050CEM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI REC
LM4050CEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM REC
LM4050CEM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RCC
LM4050CEM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM REC
LM4050CIM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RGC
LM4050CIM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCC
LM4050CIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDC
LM4050CIM3-5.0 NRND SOT-23 DBZ 3 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 REC
LM4050CIM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REC
LM4050CIM3X-2.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RNC
LM4050CIM3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RCC
LM4050CIM3X-4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RDC
LM4050CIM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 REC
LM4050QAEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYA
LM4050QAEM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSA
LM4050QAEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTA
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050QAEM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUA
LM4050QAEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVA
LM4050QAEM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXA
LM4050QAEM3X10/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYA
LM4050QAEM3X2.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSA
LM4050QAEM3X2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTA
LM4050QAEM3X4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUA
LM4050QAEM3X5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVA
LM4050QAEM3X8.2/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXA
LM4050QAIM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RYA
LM4050QAIM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RSA
LM4050QAIM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RTA
LM4050QAIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RUA
LM4050QAIM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RXA
LM4050QAIM3X4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RUA
LM4050QBEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYB
LM4050QBEM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSB
LM4050QBEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTB
LM4050QBEM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUB
LM4050QBEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVB
LM4050QBEM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXB
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050QBEM3X10/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYB
LM4050QBEM3X2.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSB
LM4050QBEM3X2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTB
LM4050QBEM3X4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUB
LM4050QBEM3X5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVB
LM4050QBEM3X8.2/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXB
LM4050QBIM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RYB
LM4050QBIM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RSB
LM4050QBIM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RTB
LM4050QBIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RUB
LM4050QBIM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RVB
LM4050QBIM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RXB
LM4050QCEM3-10/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYC
LM4050QCEM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSC
LM4050QCEM3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTC
LM4050QCEM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUC
LM4050QCEM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVC
LM4050QCEM3-8.2/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXC
LM4050QCEM3X10/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RYC
LM4050QCEM3X2.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RSC
LM4050QCEM3X2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RTC
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 6
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4050QCEM3X4.1/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RUC
LM4050QCEM3X5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RVC
LM4050QCEM3X8.2/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 RXC
LM4050QCIM3-2.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RSC
LM4050QCIM3-4.1/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RUC
LM4050QCIM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 RVC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 7
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM4050-N, LM4050-N-Q1 :
•Catalog: LM4050-N
•Automotive: LM4050-N-Q1
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4050AEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-2.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3-8.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3X-10/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AEM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-4.1 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4050AIM3X-4.1/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050AIM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3-8.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3X-10/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BEM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3X-2.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3X-4.1/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050BIM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CEM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3X-2.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3X-4.1/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050CIM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3-2.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3-2.5/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4050QAEM3-4.1/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3-5.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3-8.2/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X10/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X2.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X2.5/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X4.1/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X5.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAEM3X8.2/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3-2.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3-8.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QAIM3X4.1/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-2.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-2.5/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-4.1/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-5.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3-8.2/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X10/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X2.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X2.5/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X4.1/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X5.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBEM3X8.2/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBIM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBIM3-2.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 3
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4050QBIM3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBIM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QBIM3-8.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-10/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-2.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-2.5/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-4.1/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-5.0/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3-8.2/NOP
BSOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X10/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X2.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X2.5/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X4.1/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X5.0/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCEM3X8.2/NOP
BSOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCIM3-2.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCIM3-4.1/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM4050QCIM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 4
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4050AEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AEM3X-10/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050AEM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050AEM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050AIM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-4.1 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050AIM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050AIM3X-4.1/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050AIM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 5
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4050BEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BEM3X-10/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BEM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BEM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BIM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050BIM3X-2.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BIM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BIM3X-4.1/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050BIM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CEM3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CEM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CEM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CEM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CIM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CIM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CIM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CIM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050CIM3X-2.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CIM3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CIM3X-4.1/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050CIM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAEM3X10/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAEM3X2.0/NOP SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 6
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
B
LM4050QAEM3X2.5/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAEM3X4.1/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAEM3X5.0/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAEM3X8.2/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QAIM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAIM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAIM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAIM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QAIM3X4.1/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBEM3X10/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3X2.0/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3X2.5/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3X4.1/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3X5.0/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBEM3X8.2/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QBIM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBIM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBIM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBIM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QBIM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-10/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3-8.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCEM3X10/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QCEM3X2.0/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 7
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4050QCEM3X2.5/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QCEM3X4.1/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QCEM3X5.0/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QCEM3X8.2/NOP
BSOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4050QCIM3-2.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCIM3-4.1/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4050QCIM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 8
4203227/C
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
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