Distinctive Characteristics
HyperBusTM Low Signal Count Interface
Copyright © 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice.
ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this
device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be
expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated
Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Overview
6(37(0%(5 2018
16M x 8 HyperRAM™
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
3.0V I/O, 11 bus signals
– Single ended clock (CK)
1.8V I/O, 12 bus signals
– Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
– Bidirectional Data Strobe / Mask
– Output at the start of all transactions to indicate refresh
latency
– Output during read transactions as Read Data Strobe
– Input during write transactions as Write Data Mask
RWDS DCARS Timing
– During read transactions RWDS is offset by a second
clock, phase shifted from CK
– The Phase Shifted Clock is used to move the RWDS
transition edge within the read data eye
High Performance
Up to 333MB/s
Double-Data Rate (DDR) - two data transfers per clock
166-MHz clock rate (333 MB/s) at 1.8V VCC
100-MHz clock rate (200 MB/s) at 3.0V VCC
Sequential burst transactions
Configurable Burst Characteristics
– Wrapped burst lengths:
– 16 bytes (8 clocks)
– 32 bytes (16 clocks)
– 64 bytes (32 clocks)
– 128 bytes (64 clocks)
– Linear burst
– Hybrid option - one wrapped burst followed by linear burst
– Wrapped or linear burst type selected in each transaction
– Configurable output drive strength
Package
– 24-ball FBGA
Performance Summary
Read Transaction Timings
Maximum Clock Rate at 1.8V VCC/VCCQ 166 MHz
Maximum Clock Rate at 3.0V VCC/VCCQ 100 MHz
Maximum Access Time, (tACC at 166 MHz) 36 ns
Maximum CS# Access Time to first word at
166 MHz (excluding refresh latency) 56 ns
Maximum Current Consumption
Burst Read or Write (linear burst at 166 MHz, 3V) 45 mA
Standby (CS# = High, 3V, 105 °C) 600 µA
Standby (CS# = High, 1.8V, 105 °C) 600 µA
The IS66/67WVH16M8ALL/BLL are integrated memory device of 128Mbit Pseudo Static Random Access
Memory using a self-refresh DRAM array organized as 16M words by 8 bits. The device is a dual die stack of
two 64Mb die. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and
data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed
specially for Mobile and Automotive applications.
Burst Read or Write (linear burst at 166 MHz, 1.8V) 60 mA
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
1
Block Diagram
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
64Mb
HyperRAM
(Top Die)
CS#
CK/CK#
DQ0~DQ7 VssQ
Vss
Vcc
VccQ
RWDS
Vss
Vcc
VssQDQ0~DQ7
RWDS
CS#
CK/CK#
RESET#
RESET#
(PSC/PSC#)
(PSC/PSC#)
64Mb
HyperRAM
(Bottom Die)
CS#
CK/CK#
DQ0~DQ7 VssQ
Vss
Vcc
VccQ
RWDS
RESET#
(PSC/PSC#)
Key Diefference between Stacked 128Mb and Monolithic 64Mb
Stacked 128Mb device is different from monolithic based 64Mb in below 6 items.
1. Configuration Register 0, 1 must be set per each die individually by CA35 (0 or 1).
CA35 (A22) = 0 for bottom die, CA35 (A22) = 1 for top die.
2. Deep Power Down mode by CR write supports for only 1 die only ( either bottom or top die)
It is selected by CA35 staus when Deep Power Down operation is executed.
3. Fixed Latency mode only supported (No Variable latency mode)
4. Table 5.1 ID Register Bit Assignments
5. When Linear Burst is selected by CA[45], the device cannot advance across to next die.
6. Input Output Capacitance value will be doubled in stacked 128Mb device, which will impact on
clock to data (strobe) access time of tCKD, tCKDI, tCKDS, tDSV and tID/tIH.
Symbol Parameter 1.8V Device 3.0V Device
tCKD CK transition to DQ Valid 5.5ns 6.5ns 7.0ns 8.0ns
tCKDI CK transition to RWDS Valid
tCKDS CK transition to RWDS Valid 5.5ns 6.5ns 7.0ns 8.0ns
tDSV Data Strobe Valid 12.0ns 13.0ns 12.0ns 13.0ns
tIS/tIH Input Setup/Hold 0.6/0.8/1.0ns
0.9/0.9/1.0ns No change (1.0ns)
VccQ
4.6/4.5/4.3ns
5.6/5.5/5.3ns 5.2ns 6.2ns
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
2
Contents
1. General Description..................................................... 4
2. HyperRAM Product Overview ..................................... 7
3. HyperRAM Signal Descriptions .................................. 8
3.1 Input/Output Summary................................................... 8
3.2 Command/Address Bit Assignments ............................. 9
3.3 Read Transactions....................................................... 13
3.4 Write Transactions with Initial Latency
(Memory Core Write) ................................................... 14
3.5 Write Transactions without Initial Latency
(Register Write)............................................................ 16
4. Memory Space............................................................ 16
5. Register Space ........................................................... 17
5.1 Device Identification Registers..................................... 17
5.2 Register Space Access................................................ 18
HyperRAM Device Hardware Interface
6. Interface States .......................................................... 25
6.1 Power Conservation Modes......................................... 25
7. HyperRAM Connection Descriptions ....................... 27
7.1 Other Connectors Summary ........................................ 27
7.2 HyperRAM Block Diagram ........................................... 28
8. Interface States .......................................................... 29
9. Electrical Specifications............................................ 30
9.1 Absolute Maximum Ratings ......................................... 30
9.2 Latchup Characteristics ............................................... 31
9.3 Operating Ranges........................................................ 31
9.4 DC Characteristics ....................................................... 32
9.5 Power-Up Initialization ................................................. 33
9.6 Power Down................................................................. 35
9.7 Hardware Reset............................................................ 36
10. Timing Specifications................................................. 37
10.1 Key to Switching Waveforms ........................................ 37
10.2 AC Test Conditions....................................................... 37
10.3 AC Characteristics ........................................................ 38
11. Physical Interface ....................................................... 41
11.1 FBGA 24-Ball 5 x 5 Array Footprint .............................. 41
12. DDR Center Aligned
Read Strobe Functionality ......................................... 42
12.1 HyperRAM Products with DCARS
Signal Descriptions ....................................................... 42
12.2 HyperRAM Products with DCARS
— FBGA 24-ball, 5x5 Array Footprint ........................... 43
12.3 HyperRAM Memory with DCARS Timing...................... 43
13. Ordering Rule Information............ ............................ 44
13.1 Ordering Part Number................................................... 45
14. PACKAGE INFORMATION.............................. ............ 47
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
3
1. General Description
The ISSI 128-Mbit HyperRAMTM device is a high-speed CMOS, self-refresh Dynamic RAM (DRAM), with a HyperBus interface.
The Random Access Memory (RAM) array uses dynamic cells that require periodic refresh. Refresh control logic within the device
manages the refresh operations on the RAM array when the memory is not being actively read or written by the HyperBus interface
master (host). Since the host is not required to manage any refresh operations, the DRAM array appears to the host as though the
memory uses static cells that retain data without refresh. Hence, the memory can also be described as Pseudo Static RAM
(PSRAM).
Because the DRAM cells cannot be refreshed during a read or write transaction, there is a requirement that the host not perform
read or write burst transfers that are long enough to block the necessary internal logic refresh operations when they are needed. The
host is required to limit the duration of transactions and allow additional initial access latency, at the beginning of a new transaction,
if the memory indicates a refresh operation is needed.
HyperBus is a low signal count, Double Data Rate (DDR) interface, that achieves high speed read and write throughput. The DDR
protocol transfers two data bytes per clock cycle on the DQ input/output signals. A read or write transaction on HyperBus consists of
a series of 16-bit wide, one clock cycle data transfers at the internal HyperRAM core with two corresponding 8-bit wide, one-half-
clock-cycle data transfers on the DQ signals. All inputs and outputs are LV-CMOS compatible. Ordering Part Number (OPN) device
versions are available for core (VCC) and IO buffer (VCCQ) supplies of either 1.8V or 3.0V (nominal).
Command, address, and data information is transferred over the eight HyperBus DQ[7:0] signals. The clock is used for information
capture by a HyperBus slave device when receiving command, address, or data on the DQ signals. Command or Address values
are center aligned with clock transitions.
Every transaction begins with the assertion of CS# and Command-Address (CA) signals, followed by the start of clock transitions to
transfer six CA bytes, followed by initial access latency and either read or write data transfers, until CS# is deasserted.
Figure 1.1 Read Transaction, Fixed Latency Mode
The Read/Write Data Strobe (RWDS) is a bidirectional signal that indicates:
– when data will start to transfer from a HyperRAM device to the master device in read transactions (initial read latency)
– when data is being transferred from a HyperRAM device to the master device during read transactions (as a source
synchronous read data strobe)
– when data may start to transfer from the master device to a HyperRAM device in write transactions (initial write latency)
– data masking during write data transfers
During read data transfers, RWDS is a read data strobe with data values edge aligned with the transitions of RWDS.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
CS#
CK, CK#
RWDS
DQ[7:0]
tRWR =Read Write Recovery tACC = AccessAdditional Latency
4 cycle latency 1 4 cycle latency 2
tCKDS
tDSV
47:40 39:32 31:24 23:16 15:8 7:0
High = 2x Latency Count
Dn
A
Dn
B
Dn+1
A
Dn+1
B
Command-Address
Host drives DQ[7:0] and Memory drives RWDS
Memory drives DQ[7:0]
and RWDS
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
4
Figure 1.2 Write Transaction, Fixed Latency Mode
During write data transfers, RWDS indicates whether each data byte transfer is masked with RWDS High (invalid and prevented
from changing the byte location in a memory) or not masked with RWDS Low (valid and written to a memory). Data masking may be
used by the host to byte align write data within a memory or to enable merging of multiple non-word aligned writes in a single burst
write. During write transactions, data is center aligned with clock transitions.
Read and write transactions are burst oriented, transferring the next sequential word during each clock cycle. Each individual read
or write transaction can use either a wrapped or linear burst sequence.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
CS#
CK,CK#
RWDS
DQ[7:0]
tRWR=Read Write Recovery tACC = AccessAdditional Latency
4 cycle latency 1 4 cycle latency 2
47:40 39:32 31:24 23:16 15:8 7:0
High = 2x Latency Count
Dn
A
Dn
B
Dn+1
A
Dn+1
B
Command-Address
Host drives DQ[7:0] and Memory drives RWDS
Host drives DQ[7:0]
and RWDS
CK and Data
are center aligned
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
5
During wrapped transactions, accesses start at a selected location and continue to the end of a configured word group aligned
boundary, then wrap to the beginning location in the group, then continue back to the starting location. Wrapped bursts are generally
used for critical word first cache line fill read transactions. During linear transactions, accesses start at a selected location and
continue in a sequential manner until the transaction is terminated when CS# returns High. Linear transactions are generally used
for large contiguous data transfers such as graphic images. Since each transaction command selects the type of burst sequence for
that transaction, wrapped and linear bursts transactions can be dynamically intermixed as needed.
4h 5h 6h 7h 8h 9h Ah Bh Ch Dh Eh Fh
10h 11h 12h 13h
4h 5h 6h 7h 8h 9h Ah Bh Ch Dh Eh Fh
0h 1h 2h 3h
Figure 1.3 Linear Versus Wrapped Burst Sequence
16 word group alignment boundaries
Initial address = 4h
Linear Burst
Wrapped Burst
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
6
2. HyperRAM Product Overview
The 64-Mbit HyperRAM device is a 1.8V or 3.0V core and I/O, synchronous self-refresh Dynamic RAM (DRAM). The HyperRAM
device provides a HyperBus slave interface to the host system. HyperBus has an 8-bit (1 byte) wide DDR data bus and uses only
word-wide (16-bit data) address boundaries. Read transactions provide 16 bits of data during each clock cycle (8 bits on both clock
edges). Write transactions take 16 bits of data from each clock cycle (8 bits on each clock edge).
Figure 2.1 HyperRAM Interface
Read and write transactions require two clock cycles to define the target row address and burst type, then an initial access latency of
tACC. During the Command-Address (CA) part of a transaction, the memory will indicate whether an additional latency for a required
refresh time (tRFH) is added to the initial latency; by driving the RWDS signal to the High state. During the CA period the third clock
cycle will specify the target word address within the target row. During a read (or write) transaction, after the initial data value has
been output (or input), additional data can be read from (or written to) the row on subsequent clock cycles in either a wrapped or
linear sequence. When configured in linear burst mode, the device will automatically fetch the next sequential row from the memory
array to support a continuous linear burst. Simultaneously accessing the next row in the array while the read or write data transfer is
in progress, allows for a linear sequential burst operation that can provide a sustained data rate of 333 MB/s (1 byte (8 bit data bus)
* 2 (data clock edges) * 166 MHz = 333 MB/s).
CS#
CK#
CK
DQ[7:0]
RWDS
VSS
VSSQ
VCC
VCCQ
RESET#
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
7
3. HyperRAM Signal Descriptions
3.1 Input/Output Summary
HyperRAM signals are shown in Table 3.1. Active Low signal names have a hash symbol (#) suffix.
Table 3.1 I/O Summary
Symbol Type Description
CS# Master Output, Slave Input
Chip Select. Bus transactions are initiated with a High to Low transition. Bus
transactions are terminated with a Low to High transition. The master device has a
separate CS# for each slave.
CK, CK# Master Output, Slave Input
Differential Clock. Command, address, and data information is output with respect
to the crossing of the CK and CK# signals. Differential clock is used on 1.8V I/O
devices.
Single Ended Clock. CK# is not used on 3.0V devices, only a single ended CK is
used.
The clock is not required to be free-running.
DQ[7:0] Input/Output Data Input/Output. Command, Address, and Data information is transferred on
these signals during Read and Write transactions.
RWDS Input/Output
Read Write Data Strobe. During the Command/Address portion of all bus
transactions RWDS is a slave output and indicates whether additional initial latency
is required. Slave output during read data transfer, data is edge aligned with RWDS.
Slave input during data transfer in write transactions to function as a data mask.
(High = additional latency, Low = no additional latency).
RESET# Master Output, Slave Input,
Internal Pull-up
Hardware RESET. When Low the slave device will self initialize and return to the
Standby state. RWDS and DQ[7:0] are placed into the High-Z state when RESET# is
Low. The slave RESET# input includes a weak pull-up, if RESET# is left
unconnected it will be pulled up to the High state.
VCC Power Supply Core Power.
VCCQ Power Supply Input/Output Power.
VSS Power Supply Core Ground.
VSSQ Power Supply Input/Output Ground.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
8
3.2 Command/Address Bit Assignments
All HyperRAM bus transactions can be classified as either read or write. A bus transaction is started with CS# going Low with clock
in idle state (CK=Low and CK#=High). The first three clock cycles transfer three words of Command/Address (CA0, CA1, CA2)
information to define the transaction characteristics. The Command/Address words are presented with DDR timing, using the first six
clock edges. The following characteristics are defined by the Command/Address information:
Read or Write transaction
Address Space: memory array space or register space
– Register space is used to access Device Identification (ID) registers and Configuration Registers (CR) that identify the
device characteristics and determine the slave specific behavior of read and write transfers on the HyperBus interface.
Whether a transaction will use a linear or wrapped burst sequence.
The target row (and half-page) address (upper order address)
The target column (word within half-page) address (lower order address)
Figure 3.1 Command-Address Sequence
Notes:
1. Figure shows the initial three clock cycles of all transactions on the HyperBus.
2. CK# of differential clock is shown as dashed line waveform.
3. Command-Address information is “center aligned” with the clock during both Read and Write transactions.
Table 3.2 Command-Address Bit Assignment to DQ Signals
Signal CA0[47:40] CA0[39:32] CA1[31:24] CA1[23:16] CA2[15:8] CA2[7:0]
DQ[7] CA[47] CA[39] CA[31] CA[23] CA[15] CA[7]
DQ[6] CA[46] CA[38] CA[30] CA[22] CA[14] CA[6]
DQ[5] CA[45] CA[37] CA[29] CA[21] CA[13] CA[5]
DQ[4] CA[44] CA[36] CA[28] CA[20] CA[12] CA[4]
DQ[3] CA[43] CA[35] CA[27] CA[19] CA[11] CA[3]
DQ[2] CA[42] CA[34] CA[26] CA[18] CA[10] CA[2]
DQ[1] CA[41] CA[33] CA[25] CA[17] CA[9] CA[1]
DQ[0] CA[40] CA[32] CA[24] CA[16] CA[8] CA[0]
CS#
CK , CK#
DQ[7:0] CA0[47:40] CA0[39:32] CA1[31:24] CA1[23:16] CA2[15:8] CA2[7:0]
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
9
05/01/2015
05/01/2015
Notes:
1. A Row is a group of words relevant to the internal memory array structure and additional latency may be inserted by RWDS when crossing Row boundaries - this is
device dependent behavior, refer to each HyperBus device data sheet for additional information. Also, the number of Rows may be used in the calculation of a
distributed refresh interval for HyperRAM memory.
2. A Page is a 16-word (32-byte) length and aligned unit of device internal read or write access and additional latency may be inserted by RWDS when crossing Page
boundaries - this is device dependent behavior, refer to each HyperBus device data sheet for additional information.
3. The Column address selects the burst transaction starting word location within a Row. The Column address is split into an upper and lower portion. The upper portion
selects an 8-word (16-byte) Half-page and the lower portion selects the word within a Half-page where a read or write transaction burst starts.
4. The initial read access time starts when the Row and Upper Column (Half-page) address bits are captured by a slave interface. Continuous linear read burst is enabled
by memory devices internally interleaving access to 16 byte half-pages.
5. HyperBus protocol address space limit, assuming:
29 Row &Upper Column address bits
3 Lower Column address bits
Each address selects a word wide (16 bit = 2 byte) data value
29 + 3 = 32 address bits = 4G addresses supporting 8Gbyte (64Gbit) maximum address space
Future expansion of the column address can allow for 29 Row &Upper Column + 16 Lower Column address bits = 35 Tera-word = 70 Tera-byte address space.
Figure 3.2 Data Placement During a Read Transaction
Notes:
1. Figure shows a portion of a Read transaction on the HyperBus. CK# of differential clock is shown as dashed line waveform.
2. Data is “edge aligned” with the RWDS serving as a read data strobe during read transactions.
3. Data is always transferred in full word increments (word granularity transfers).
4. Word address increments in each clock cycle. Byte A is between RWDS rising and falling edges and is followed by byte B between RWDS falling and rising edges, of
each word.
5. Data bits in each byte are always in high to low order with bit 7 on DQ7 and bit 0 on DQ0.
Table 3.3 Command/Address Bit Assignments
CS#
CK , CK#
DQ[7:0] CA0[47:40] CA0[39:32] CA1[31:24] CA1[23:16] CA2[15:8] CA2[7:0]
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
CA Bit# Bit Name Bit Function
47 R/W#
Identifies the transaction as a read or write.
R/W#=1 indicates a Read transaction
R/W#=0 indicates a Write transaction
46 Address Space
(AS)
Indicates whether the read or write transaction accesses the memory or register spaces.
AS=0 indicates memory space
AS=1 indicates the register space
The register space is used to access device ID and Configuration registers.
45 Burst Type
Indicates whether the burst will be linear or wrapped.
Burst Type=0 indicates wrapped burst
Burst Type=1 indicates linear burst
44-36 (128Mb) Reserved Reserved for future row address expansion.
Reserved bits should be set to 0 by the HyperBus master.
35-22 (128Mb) Row Address Row component of the target address: System word address bits A22-A9
21-16 Upper Column
Address Upper Column component of the target address: System word address bits A8-A3
15-3 Reserved Reserved for future column address expansion.
Reserved bits should be set to 0 by the HyperBus master.
2-0 Lower Column
(word) Address
Lower Column component of the target address: System word address bits A2-0 selecting the
starting word within a row.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
10
Table 3.4 Data Bit Placement During Read or Write Transaction
Address
Space
Byte
Order
Byte
Position
Word
Data
Bit
DQ Bit Order
Memory
Big-
endian
A
15 7
When data is being accessed in memory space:
The first byte of each word read or written is the “A” byte and the second is the “B” byte.
The bits of the word within the A and B bytes depend on how the data was written. If the word
lower address bits 7-0 are written in the A byte position and bits 15-8 are written into the B byte
position, or vice versa, they will be read back in the same order.
So, memory space can be stored and read in either little-endian or big-endian order.
14 6
13 5
12 4
11 3
10 2
9 1
8 0
B
77
66
55
44
33
22
11
00
Little-
endian
A
7 7
6 6
5 5
4 4
3 3
2 2
1 1
0 0
B
15 7
14 6
13 5
12 4
11 3
10 2
19
08
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
11
Figure 3.3 Data Placement During a Write Transaction
Notes:
1. Figure shows a portion of a Write transaction on the HyperBus.
2. Data is “center aligned” with the clock during a Write transaction.
3. RWDS functions as a data mask during write data transfers with initial latency. Masking of the first and last byte is shown to illustrate an unaligned 3 byte write of data.
4. RWDS is not driven by the master during write data transfers with zero initial latency. Full data words are always written in this case. RWDS may be driven low or left
High-Z by the slave in this case.
Register Big-
endian
A
15 7
When data is being accessed in register space:
During a Read transaction on the HyperBus two bytes are transferred on each clock cycle. The
upper order byte A (Word[15:8]) is transferred between the rising and falling edges of RWDS
(edge aligned). The lower order byte B (Word[7:0]) is transferred between the falling and rising
edges of RWDS.
During a write, the upper order byte A (Word[15:8]) is transferred on the CK rising edge and the
lower order byte B (Word[7:0]) is transferred on the CK falling edge.
So, register space is always read and written in Big-endian order because registers have device
dependent fixed bit location and meaning definitions.
14 6
13 5
12 4
11 3
10 2
9 1
8 0
B
77
66
55
44
33
22
11
00
Table 3.4 Data Bit Placement During Read or Write Transaction (Continued)
Address
Space
Byte
Order
Byte
Position
Word
Data
Bit
DQ Bit Order
CS#
CK , CK#
RWDS
DQ[7:0] Dn A Dn B Dn+1 A Dn+1 B Dn+2 A
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
12
3.3 Read Transactions
The HyperBus master begins a transaction by driving CS# Low while clock is idle. Then the clock begins toggling while Command-
Address CA words are transfered.
In CA0, CA[47] = 1 indicates that a Read transaction is to be performed. CA[46] = 0 indicates the memory space is being read or
CA[46] = 1 indicates the register space is being read. CA[45] indicates the burst type (wrapped or linear). Read transactions can
begin the internal array access as soon as the row and upper column address has been presented in CA0 and CA1 (CA[47:16]).
CA2 (CA(15:0]) identifies the target Word address within the chosen row. However, some HyperBus devices may require a minimum
time between the end of a prior transaction and the start of a new access. This time is referred to as Read-Write-Recovery time
(tRWR). The master interface must start driving CS# Low only at a time when the CA1 transfer will complete after tRWR is satisfied.
The HyperBus master then continues clocking for a number of cycles defined by the latency count setting in configuration register 0.
The initial latency count required for a particular clock frequency is based on RWDS. 128Mb supports Fixled latency mode only, so
RWDS is High during the CA cycles and an additional latency count is inserted. Once these latency clocks have been completed
the memory starts to simultaneously transition the Read-Write Data Strobe (RWDS) and output the target data.
New data is output edge aligned with every transition of RWDS. Data will continue to be output as long as the host continues to
transition the clock while CS# is Low. However, the HyperRAM device may stop RWDS transitions with RWDS Low, between the
delivery of words, in order to insert latency between words when crossing memory array boundaries.
Wrapped bursts will continue to wrap within the burst length and linear burst will output data in a sequential manner across row
boundaries. When a linear burst read reaches the last address in the array, continuing the burst beyond the last address will provide
undefined data. Read transfers can be ended at any time by bringing CS# High when the clock is idle.
The clock is not required to be free-running. The clock may remain idle while CS# is high.
Figure 3.4 Read Transaction, Fixed Latency Mode
Notes:
1. Transactions are initiated with CS# falling while CK=Low and CK#=High.
2. CS# must return High before a new transaction is initiated.
3. CK# is the complement of the CK signal. 3V devices use a single ended clock (CK only), CK# is used with CK on1.8V devices to provide a differential clock. CK# of a
differential clock is shown as a dashed line waveform.
4. Read access array starts once CA[23:16] is captured.
5. The read latency is defined by the initial latency value in a configuration register.
6. In this read transaction example the initial latency count was set to four clocks.
7. In this read transaction a RWDS High indication during CA delays output of target data by an additional four clocks.
8. The memory device drives RWDS during read transactions.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
CS#
CK, CK#
RWDS
DQ[7:0]
tRWR =Read Write Recovery tACC = AccessAdditional Latency
4 cycle latency 1 4 cycle latency 2
tCKDS
tDSV
47:40 39:32 31:24 23:16 15:8 7:0
High = 2x Latency Count
Dn
A
Dn
B
Dn+1
A
Dn+1
B
Command-Address
Host drives DQ[7:0] and Memory drives RWDS
Memory drives DQ[7:0]
and RWDS
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
13
05/01/2015
05/01/2015
3.4 Write Transactions with Initial Latency (Memory Core Write)
The HyperBus master begins a transaction by driving CS# Low while clock is idle. Then the clock begins toggling while Command-
Address CA words are transfered.
In CA0, CA[47] = 0 indicates that a Write transaction is to be performed. CA[46] = 0 indicates the memory space is being written.
CA[45] indicates the burst type (wrapped or linear). Write transactions can begin the internal array access as soon as the row and
upper column address has been presented in CA0 and CA1 (CA[47:16]). CA2 (CA(15:0]) identifies the target word address within
the chosen row. However, some HyperBus devices may require a minimum time between the end of a prior transaction and the start
of a new access. This time is referred to as Read-Write-Recovery time (tRWR). The master interface must start driving CS# Low only
at a time when the CA1 transfer will complete after tRWR is satisfied.
The HyperBus master then continues clocking for a number of cycles defined by the latency count setting in configuration register 0.
The initial latency count required for a particular clock frequency is based on RWDS. 128Mb supports Fixled latency mode only, so
RWDS is High during the CA cycles and an additional latency count is inserted.
Once these latency clocks have been completed the HyperBus master starts to output the target data. Write data is center aligned
with the clock edges. The first byte of data in each word is captured by the memory on the rising edge of CK and the second byte is
captured on the falling edge of CK.
During the CA clock cycles, RWDS is driven by the memory.
During the write data transfers, RWDS is driven by the host master interface as a data mask. When data is being written and RWDS
is High the byte will be masked and the array will not be altered. When data is being written and RWDS is Low the data will be
placed into the array. Because the master is driving RWDS during write data transfers, neither the master nor the HyperRAM device
are able to indicate a need for latency within the data transfer portion of a write transaction. The acceptable write data burst length
setting is also shown in configuration register 0.
Data will continue to be transferred as long as the HyperBus master continues to transition the clock while CS# is Low. Legacy
format wrapped bursts will continue to wrap within the burst length. Hybrid wrap will wrap once then switch to linear burst starting at
the next wrap boundary. Linear burst accepts data in a sequential manner across page boundaries. Write transfers can be ended at
any time by bringing CS# High when the clock is idle.
When a linear burst write reaches the last address in the memory array space, continuing the burst will write to the beginning of the
address range.
The clock is not required to be free-running. The clock may remain idle while CS# is high.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
14
Figure 3.5 Write Transaction, Fixed Latency Mode
Notes:
1. Transactions must be initiated with CK=Low and CK#=High.
2. CS# must return High before a new transaction is initiated.
3. During Command-Address, RWDS is driven by the memory and indicates whether additional latency cycles are required.
4. In this example, RWDS indicates that additional initial latency cycles are required.
5. At the end of Command-Address cycles the memory stops driving RWDS to allow the host HyperBus master to begin driving RWDS. The master must drive RWDS to
a valid Low before the end of the initial latency to provide a data mask preamble period to the slave.
6. During data transfer, RWDS is driven by the host to indicate which bytes of data should be either masked or loaded into the array.
7. The figure shows RWDS masking byte A0 and byte B1 to perform an unaligned word write to bytes B0 and A1.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
CS#
CK,CK#
RWDS
DQ[7:0]
tRWR=Read Write Recovery tACC = AccessAdditional Latency
4 cycle latency 1 4 cycle latency 2
47:40 39:32 31:24 23:16 15:8 7:0
High = 2x Latency Count
Dn
A
Dn
B
Dn+1
A
Dn+1
B
Command-Address
Host drives DQ[7:0] and Memory drives RWDS
Host drives DQ[7:0]
and RWDS
CK and Data
are center aligned
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
15
3.5 Write Transactions without Initial Latency (Register Write)
A Write transaction starts with the first three clock cycles providing the Command/Address information indicating the transaction
characteristics. CA0 may indicate that a Write transaction is to be performed and also indicates the address space and burst type
(wrapped or linear).
Writes without initial latency are used for register space writes. HyperRAM device write transactions with zero latency mean that the
CA cycles are followed by write data transfers. Writes with zero initial latency, do not have a turn around period for RWDS. The
HyperRAM device will always drive RWDS during the Command-Address period to indicate whether extended latency is required for
a transaction that has initial latency. However, the RWDS is driven before the HyperRAM device has received the first byte of CA i.e.
before the HyperRAM device knows whether the transaction is a read or write to register space. In the case of a write with zero
latency, the RWDS state during the CA period does not affect the initial latency of zero. Since master write data immediately follows
the Command-Address period in this case, the HyperRAM device may continue to drive RWDS Low or may take RWDS to High-Z
during write data transfer. The master must not drive RWDS during Writes with zero latency. Writes with zero latency do not use
RWDS as a data mask function. All bytes of write data are written (full word writes).
The first byte of data in each word is presented on the rising edge of CK and the second byte is presented on the falling edge of CK.
Write data is center aligned with the clock inputs. Write transfers can be ended at any time by bringing CS# High when clock is idle.
The clock is not required to be free-running.
Figure 3.8 Write Operation without Initial Latency
CS#
CK, CK#
RWDS
DQ[7:0]
Data
47:40 39:32 31:24 23:16 15:8 7:0 15:8 7:0
Command-Address
Host drives DQ[7:0] with Command-Address and Write Data
Memory drives RWDS but master ignores it
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
4. Memory Space
When CA[46] is 0 a read or write transaction accesses the DRAM memory array.
Table 4.1 Memory Space Address Map
Unit Type Count System Word
Address Bits CA Bits Notes
Rows within 64Mb device 8192 (Rows) A21 - A9 34 - 22
Rows within 32Mb device 4096 (Rows) A20 - A9 33 - 22
Row 1 (row) A8 - A3 21 - 16
512 (word
addresses)
1kbytes
Half-Page 8 (word
addresses) A2 - A0 2 - 0 16 bytes
Rows within 128Mb device 16384 (Rows) A22 - A9 35 - 22
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
16
5. Register Space
Note:
1. CA45 may be either 0 or 1 for either wrapped or linear read. CA45 must be 1 as only linear single word register writes are supported.
5.1 Device Identification Registers
There are two read only, non-volatile, word registers, that provide information on the device selected when CS# is low. The device
information fields identify:
Manufacturer
Type
Density
– Row address bit count
– Column address bit count
When CA[46] is 1 a read or write transaction accesses the Register Space.
Table 5.1 Register Space Address Map
Register
System
Address — — — 31-27 26-19 18-11 10-3 — 2-0
CA Bits 47 46 45 44-40 39-32 31-24 23-16 15-8 7-0
Identification Register 0
(read only) C0h or E0h 00h 00h 00h 00h 00h
Identification Register 1
(read only) C0h or E0h 00h 00h 00h 00h 01h
Configuration Register 0 Read C0h or E0h 00h 01h 00h 00h 00h
Configuration Register 0 Write 60h 00h 01h 00h 00h 00h
Configuration Register 1 Read C0h or E0h 00h 01h 00h 00h 01h
Configuration Register 1 Write 60h 00h 01h 00h 00h 01h
Table 5.2 ID Register 0 Bit Assignments
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Bits Function Settings (Binary)
15-14 Die Address
13 Reserved 0 - default
12-8 Row Address Bit Count
7-4 Column Address Bit Count
0000 - One column address bit
...
1111 - Sixteen column address bits
3-0 Manufacturer
0000 to 0010- Reserved
0011 - ISSI
0100 to 1111 - Reserved
A pair of 64Mb HyperRAM are stacked for 128Mb HyperRAM. There will be a bottom die, and Top die,
which are different from normal 64Mb die like beow 2 items
00 – Die 0 (Lowest address Die, Bottpm Die)
01 – Die 1 ( Highest address Die, Top Die)
01101
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
17
5.1.1 Density and Row Boundaries
5.2 Register Space Access
Register default values are loaded upon power-up or hardware reset. The registers can be altered at any time while the device is in
the standby state.
Loading a register is accomplished with a single 16-bit word write transaction as shown in Figure 5.1. CA[47] is zero to indicate a
write transaction, CA[46] is a one to indicate a register space write, CA[45] is a one to indicate a linear write, lower order bits in the
CA field indicate the register address.
Figure 5.1 Loading a Register
Notes:
1. The host must not drive RWDS during a write to register space.
2. The RWDS signal is driven by the memory during the Command-Address period based on whether the memory array is being refreshed. This refresh indication does
not affect the writing of register data. RWDS is driven immediately after CS# goes low, before CA[47:46] are received to indicate that the transaction is a write to
register space, for which the RWDS refresh indication is not relevant.
3. The register value is always provided immediately after the CA value and is not delayed by a refresh latency.
4. The the RWDS signal returns to high impedance after the Command-Address period. Register data is never masked. Both data bytes of the register data are loaded
into the selected register.
Table 5.3 ID Register 1 Bit Assignments
Bits Function Settings (Binary)
15-4 Reserved Reserved
3-0 Device Type 0000 - HyperRAM
0001 to 1111 - Reserved
CS#
CK , CK#
RWDS
DQ[7:0] 47:40 39:32 31:24 23:16 15:8 7:0 15:8 7:0
Command-Address RD
Host drives DQ[7:0] with Command-Address and Register Data
Memory drives RWDS with Refresh Indication
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
The DRAM array size (density) of the device can be determined from the total number of system address bits
used for the row and column addresses as indicated by the Row Address Bit Count and Column Address Bit
Count fields in the ID0 register. For example: a 64 Mbit HyperRAM has 9 column address bits and 13 row
address bits for a total of 22 word address bits = 2^22 = 4 Mwords = 8 MBytes. The 9 column address bits
indicate that each row holds 2^9 = 512 words = 1 kbytes. The row address bit count indicates there are 8196
rows to be refreshed within each array refresh interval. The row count is used in calculating the refresh
interval.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
18
Each register is written with a separate single word write transaction. Register write transactions have zero latency, the single word
of data immediately follows the Command-Address. RWDS is not driven by the host during the write because RWDS is always
driven by the memory during the CA cycles to indicate whether a memory array refresh is in progress. Because a register space
write goes directly to a register, rather than the memory array, there is no initial write latency, related to an array refresh that may be
in progress. In a register write, RWDS is also not used as a data mask because both bytes of a register are always written and never
masked.
Reserved register fields must be written with their default value. Writing reserved fields with other than default values may produce
undefined results.
Reading of a register is accomplished with a single 16 bit read transaction with CA[46]=1 to select register space. If more than one
word is read, the same register value is repeated in each word read. The CA[45] burst type is “don’t care” because only a single
register value is read. The contents of the register is returned in the same manner as reading array data, with one or two latency
counts, based on the state of RWDS during the Command-Address period. The latency count is defined in the Configuration
Register 0 Read Latency field (CR0[7:4]).
5.2.1 Configuration Register 0
Configuration Register 0 (CR0) is used to define the power mode and access protocol operating conditions for the HyperRAM
device. Configurable characteristics include:
Wrapped Burst Length (16, 32, 64, or 128-byte aligned and length data group)
Wrapped Burst Type
– Legacy wrap (sequential access with wrap around within a selected length and aligned group)
– Hybrid wrap (Legacy wrap once then linear burst at start of the next sequential group)
Initial Latency
Output Drive Strength
Table 5.4 Configuration Register 0 Bit Assignments
CR0 Bit Function Settings (Binary)
15
14-12 Drive Strength
000 - 34 ohms (default)
001 - 115 ohms
010 - 67 ohms
011 - 46 ohms
100 - 34 ohms
101 - 27 ohms
110 - 22 ohms
111 - 19 ohms
11-8
Reserved
1 - Reserved (default)
Reserved for Future Use. When writing this register, these bits should be set
to 1 for future compatibility.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
In an MCP device, Configuration Register 0 and Configuration Register 1 must be set per each
individual die base ( die 0, die 1) in case not using it as a default mode, and die 0 and die 1 are
selected by A35 address.
Fixed Latency
–128Mb deice is an MCP, and will support fixed latency only. In fixed latency mode, the memory
will always indicate a refresh latency and delay the read data transfer accordingly.
Reserved
1 - Reserved (default)
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
19
05/01/2015
05/01/2015
5.2.1.1 Wrapped Burst
A wrapped burst transaction accesses memory within a group of words aligned on a word boundary matching the length of the
configured group. Wrapped access groups can be configured as 16, 32, 64, or 128 bytes alignment and length. During wrapped
transactions, access starts at the Command-Address selected location within the group, continues to the end of the configured word
group aligned boundary, then wraps around to the beginning location in the group, then continues back to the starting location.
Wrapped bursts are generally used for critical word first instruction or data cache line fill read accesses.
5.2.1.2 Hybrid Burst
The beginning of a hybrid burst will wrap within the target address wrapped burst group length before continuing to the next half-
page of data beyond the end of the wrap group. Continued access is in linear burst order until the transfer is ended by returning CS#
high. This hybrid of a wrapped burst followed by a linear burst starting at the beginning of the next burst group, allows multiple
sequential address cache lines to be filled in a single access. The first cache line is filled starting at the critical word. Then the next
sequential line in memory can be read in to the cache while the first line is being processed.
7-4 Initial Latency
0000 - 5 Clock Latency
0001 - 6 Clock Latency (default)
0010 - Reserved
0011 - Reserved
0100 - Reserved
...
1101 - Reserved
1110 - 3 Clock Latency
1111 - 4 Clock Latency
3 Fixed Latency Enable
0 - Variable Latency - Not Supported.
1 - Fixed 2 times Initial Latency (default)
2 Hybrid Burst Enable 0: Wrapped burst sequences to follow hybrid burst sequencing
1: Wrapped burst sequences in legacy wrapped burst manner (default)
1-0 Burst Length
00 - 128 bytes
01 - 64 bytes
10- 16 bytes
11 - 32 bytes (default)
Table 5.5 CR0[2] Control of Wrapped Burst Sequence
Bit Default Value Name
12
Hybrid Burst Enable
CR[2]= 0: Wrapped burst sequences to follow hybrid burst sequencing
CR[2]= 1: Wrapped burst sequences in legacy wrapped burst manner
Table 5.4 Configuration Register 0 Bit Assignments (Continued)
CR0 Bit Function Settings (Binary)
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
20
.
Table 5.6 Example Wrapped Burst Sequences
Burst Selection Burst
Type
Wrap
Boundary
(bytes)
Start
Address
(Hex)
Address Sequence (Hex)
(Words)
CA[45] CR0[2:0]
0000
Hybrid
128
128 Wrap
once then
Linear
XXXXXX03
03, 04, 05, 06, 07, 08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, 13, 14, 15,
16, 17, 18, 19, 1A, 1B, 1C, 1D, 1E, 1F, 20, 21, 22, 23, 24, 25, 26, 27, 28,
29, 2A, 2B, 2C, 2D, 2E, 2F, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 3A, 3B,
3C, 3D, 3E, 3F, 00, 01, 02
(wrap complete, now linear beyond the end of the initial 128 byte wrap
group)
40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 4A, 4B, 4C, 4D, 4E, 4F, 50, 51, ...
0 001 Hybrid 64
64 Wrap
once then
Linear
XXXXXX03
03, 04, 05, 06, 07, 08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, 13, 14, 15,
16, 17, 18, 19, 1A, 1B, 1C, 1D, 1E, 1F, 00, 01, 02,
(wrap complete, now linear beyond the end of the initial 64 byte wrap
group)
20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 2A, 2B, 2C, 2D, 2E, 2F, 30, 31, ...
0 001 Hybrid 64
64 Wrap
once then
Linear
XXXXXX2E
2E, 2F, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 3A, 3B, 3C, 3D, 3E, 3F, 20,
21, 22, 23, 24, 25, 26, 27, 28, 29, 2A, 2B, 2C, 2D,
(wrap complete, now linear beyond the end of the initial 64 byte wrap
group)
40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 4A, 4B, 4C, 4D, 4E, 4F, 50, 51, ...
0 010 Hybrid 16
16 Wrap
once then
Linear
XXXXXX02
02, 03, 04, 05, 06, 07, 00, 01,
(wrap complete, now linear beyond the end of the initial 16 byte wrap
group)
08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, ...
0 010 Hybrid 16
16 Wrap
once then
Linear
XXXXXX0C
0C, 0D, 0E, 0F, 08, 09, 0A, 0B,
(wrap complete, now linear beyond the end of the initial 16 byte wrap
group)
10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 1A, ...
0 011 Hybrid 32
32 Wrap
once then
Linear
XXXXXX0A 0A, 0B, 0C, 0D, 0E, 0F, 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, ...
0 011 Hybrid 32
32 Wrap
once then
Linear
XXXXXX1E 1E, 1F, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 1A, 1B, 1C, 1D, ...
0 100 Wrap 128 128 XXXXXX03
03, 04, 05, 06, 07, 08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, 13, 14, 15,
16, 17, 18, 19, 1A, 1B, 1C, 1D, 1E, 1F, 20, 21, 22, 23, 24, 25, 26, 27, 28,
29, 2A, 2B, 2C, 2D, 2E, 2F, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 3A, 3B,
3C, 3D, 3E, 3F, 00, 01, 02, ...
0 101 Wrap 64 64 XXXXXX03 03, 04, 05, 06, 07, 08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, 13, 14, 15,
16, 17, 18, 19, 1A, 1B, 1C, 1D, 1E, 1F, 00, 01, 02, ...
0 101 Wrap 64 64 XXXXXX2E 2E, 2F, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 3A, 3B, 3C, 3D, 3E, 3F, 20,
21, 22, 23, 24, 25, 26, 27, 28, 29, 2A, 2B, 2C, 2D, ...
0 110 Wrap 16 16 XXXXXX02 02, 03, 04, 05, 06, 07, 00, 01, ...
0 110 Wrap 16 16 XXXXXX0C 0C, 0D, 0E, 0F, 08, 09, 0A, 0B, ...
0 111 Wrap 32 32 XXXXXX0A 0A, 0B, 0C, 0D, 0E, 0F, 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, ...
0 111 Wrap 32 32 XXXXXX1E 1E, 1F, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 1A, 1B, 1C, 1D, ...
1 XXX Linear Linear
Burst XXXXXX03 03, 04, 05, 06, 07, 08, 09, 0A, 0B, 0C, 0D, 0E, 0F, 10, 11, 12, 13, 14, 15,
16, 17, 18, ...
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
21
5.2.1.3 Initial Latency
Memory Space read and write transactions or Register Space read transactions require some initial latency to open the row selected
by the Command-Address. This initial latency is tACC. The number of latency clocks needed to satisfy tACC depends on the
HyperBus frequency and can vary from 3 to 6 clocks. The value in CR0[7:4] selects the number of clocks for initial latency. The
default value is 6 clocks, allowing for operation up to a maximum frequency of 166MHz prior to the host system setting a lower initial
latency value that may be more optimal for the system.
In the event a distributed refresh is required at the time a Memory Space read or write transaction or Register Space read
transaction begins, the RWDS signal goes high during the Command-Address to indicate that an additional initial latency is being
inserted to allow a refresh operation to complete before opening the selected row.
Register Space write transactions always have zero initial latency. RWDS may be High or Low during the Command-Address
period. The level of RWDS during the Command-Address period does not affect the placement of register data immediately after the
Command-Address, as there is no initial latency needed to capture the register data. A refresh operation may be performed in the
memory array in parallel with the capture of register data.
5.2.1.4 Fixed Latency
A configuration register option bit CR0[3] is provided to make all Memory Space read and write transactions or Register Space read
transactions require the same initial latency by always driving RWDS high during the Command-Address to indicate that two initial
latency periods are required. This fixed initial latency is independent of any need for a distributed refresh, it simply provides a fixed
(deterministic) initial latency for all of these transaction types. The fixed latency option may simplify the design of some HyperBus
memory controllers or ensure deterministic transaction performance. Fixed latency is the default POR or reset configuration.
5.2.1.5 Drive Strength
DQ signal line loading, length, and impedance vary depending on each system design. Configuration register bits CR0[14:12]
provide a means to adjust the DQ[7:0] signal output impedance to customize the DQ signal impedance to the system conditions to
minimize high speed signal behaviors such as overshoot, undershoot, and ringing. The default POR or reset configuration value is
000b to select the mid point of the available output impedance options.
The impedance values shown are typical for both pull-up and pull-down drivers at typical silicon process conditions, nominal
operating voltage (1.8Vor 3V) and 50°C. The impedance values may vary by up to ±80% from the typical values depending on the
Process, Voltage, and Temperature (PVT) conditions. Impedance will increase with slower process, lower voltage, or higher
temperature. Impedance will decrease with faster process, higher voltage, or lower temperature.
Each system design should evaluate the data signal integrity across the operating voltage and temperature ranges to select the best
drive strength settings for the operating conditions.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
128Mb device supports Fixed latency only, so actual latency is initial latency selected by CR0[7:4] x 2 cycles.
5.2.1.6 Deep Power Down
Deep Power Down Mode is not supported in an 128Mb MCP device.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
22
5.2.2 Configuration Register 1
Configuration Register 1 (CR1) is used to define the distributed refresh interval for this HyperRAM device. The core DRAM array
requires periodic refresh of all bits in the array. This can be done by the host system by reading or writing a location in each row
within a specified time limit. The read or write access copies a row of bits to an internal buffer. At the end of the access the bits in the
buffer are written back to the row in memory, thereby recharging (refreshing) the bits in the row of DRAM memory cells.
However, the host system generally has better things to do than to periodically read every row in memory and keep track that each
row is visited within the required refresh interval for the entire memory array. HyperRAM devices include self-refresh logic that will
refresh rows automatically so that the host system is relieved of the need to refresh the memory. The automatic refresh of a row can
only be done when the memory is not being actively read or written by the host system. The refresh logic waits for the end of any
active read or write before doing a refresh, if a refresh is needed at that time. If a new read or write begins before the refresh is
completed, the memory will drive RWDS high during the Command-Address period to indicate that an additional initial latency time
is required at the start of the new access in order to allow the refresh operation to complete before starting the new access.
The required refresh interval for the entire memory array varies with temperature as shown in Table 5.7, Array Refresh Interval per
Temperature on page 23. This is the time within which all rows must be refreshed. Refresh of all rows could be done as a single
batch of accesses at the beginning of each interval, in groups (burst refresh) of several rows at a time, spread throughout each
interval, or as single row refreshes evenly distributed throughout the interval. The self-refresh logic distributes single row refresh
operations throughout the interval so that the memory is not busy doing a burst of refresh operations for a long period, such that the
burst refresh would delay host access for a long period.
Table 5.7 Array Refresh Interval per Temperature
Device Temperature (°C) Array Refresh Interval (ms) Array Rows Recommended tCMS (µs)
85 64 8192 4
105 16 8192 1
Table 5.8 Configuration Register 1 Bit Assignments
CR1 Bit Function Settings (Binary)
15-2 Reserved
000000h — Reserved (default)
Reserved for Future Use. When writing this register, these bits should be
cleared to 0 for future compatibility.
1-0 Distributed Refresh Interval
10b — default
4 µs for Industrial temperature range devices
1 µs for Industrial Plus temperature range devices
11b — 1.5 times default
00b — 2 times default
01b — 4 times default
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
23
The distributed refresh method requires that the host does not do burst transactions that are so long as to prevent the memory from
doing the distributed refreshes when they are needed. This sets an upper limit on the length of read and write transactions so that
the refresh logic can insert a refresh between transactions. This limit is called the CS# low maximum time (tCMS). The tCMS value is
determined by the array refresh interval divided by the number of rows in the array, then reducing this calculation by half to ensure
that a distributed refresh interval cannot be entirely missed by a maximum length host access starting immediately before a
distributed refresh is needed. Because tCMS is set to half the required distributed refresh interval, any series of maximum length host
accesses that delay refresh operations will be catching up on refresh operations at twice the rate required by the refresh interval
divided by the number of rows.
The host system is required to respect the tCMS value by ending each transaction before violating tCMS. This can be done by host
memory controller logic splitting long transactions when reaching the tCMS limit, or by host system hardware or software not
performing a single read or write transaction that would be longer than tCMS.
As noted in Table 5.7, Array Refresh Interval per Temperature on page 23 the array refresh interval is longer at lower temperatures
such that tCMS could be increased to allow longer transactions. The host system can either use the tCMS value from the table for the
maximum operating temperature or, may determine the current operating temperature from a temperature sensor in the system in
order to set a longer distributed refresh interval.
The host system may also effectively increase the tCMS value by explicitly taking responsibility for performing all refresh and doing
burst refresh reading of multiple sequential rows in order to catch up on distributed refreshes missed by longer transactions.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
24
HyperRAM Hardware Interface
For the general description of the HyperBus hardware interface of HyperFlash memories refer to the
HyperBus Specification. The following section describes HyperRAM device dependent aspects of hardware
interface.
6. Interface States
6.1 Power Conservation Modes
6.1.1 Interface Standby
Standby is the default, low power, state for the interface while the device is not selected by the host for data
transfer (CS#= High). All inputs, and outputs other than CS# and RESET# are ignored in this state.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
25
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
6.1.2 Active Clock Stop
The Active Clock Stop mode reduces device interface energy consumption to the ICC6 level during the data
transfer portion of a read or write operation. The device automatically enables this mode when clock remains
stable for tACC + 30 ns. While in Active Clock Stop mode, read data is latched and always driven onto the
data bus. ICC6 shown in Section 9.4, DC Characteristics on page 32.
Active Clock Stop mode helps reduce current consumption when the host system clock has stopped to pause
the data transfer. Even though CS# may be Low throughout these extended data transfer cycles, the memory
device host interface will go into the Active Clock Stop current level at tACC + 30 ns. This allows the device to
transition into a lower current mode if the data transfer is stalled. Active read or write current will resume once
the data transfer is restarted with a toggling clock. The Active Clock Stop mode must not be used in violation
of the tCSM limit. CS# must go high before tCSM is violated.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
26
7. HyperRAM Connection Descriptions
Following is the description for other package connectors.
7.1 Other Connectors Summary
Table 7.1 Other Connectors Summary
Symbol Type Description
VCC Power Supply Core Power.
VCCQ Power Supply Input/Output Power.
VSS Power Supply Core Ground.
VSSQ Power Supply Input/Output Ground.
NC No Connect Not Connected internally. The signal/ball location may be used in Printed Circuit Board (PCB) as part
of a routing channel.
RFU No Connect
Reserved for Future Use. May or may not be connected internally, the signal/ball location should be
left unconnected and unused by PCB routing channel for future compatibility. The signal/ball may be
used by a signal in the future.
DNU Reserved Do Not Use. Reserved for use by ISSI. The signal/ball is connected internally. The signal/ball must be
left open on the PCB.
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
27
7.2 HyperRAM Block Diagram
Figure 7.1 HyperRAM Connections, Including Optional Signals
CS0#
CK#
CK
DQ[7:0]
RWDS
VSS
VSSQ
VCC
VCCQ
RESET#
CS#
CK#
CK
DQ[7:0]
RWDS
VSS
VSSQ
VCC
VCCQ
RESET#
CK#
CK
DQ[7:0]
RWDS
VSS
VSSQ
VCC
VCCQ
RESET#
Master Slave 0
Slave 1
CS1#
CS#
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
28
8. Interface States
Legend
L = VIL
H = VIH
X = either VIL or VIH
L/H = rising edge
H/L = falling edge
T = Toggling during information transfer
Idle = CK is low and CK# is high.
Valid = all bus signals have stable L or H level
Notes:
1.
2.
Writes without initial latency (with zero initial latency), do not have a turn around period for RWDS. The HyperRAM device will always drive RWDS during the
Command-Address period to indicate whether extended latency is required. Since master write data immediately follows the Command-Address period the HyperRAM
device may continue to drive RWDS Low or may take RWDS to High-Z. The master must not drive RWDS during Writes with zero latency. Writes with zero latency do
not use RWDS as a data mask function. All bytes of write data are written (full word writes).
Active Clock Stop is described in Section 6.1.2, Active Clock Stop on page 25. .
The Interface States table describes the required value of each signal for each interface state.
Table 8.1 Interface States
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Interface State VCC / VCCQ CS# CK, CK# D7-D0 RWDS RESET#
Power-On (Cold) Reset VCC / VCCQ min X X High-Z High-Z X
Hardware (Warm) Reset VCC / VCCQ min X X High-Z High-Z L
Interface Standby VCC / VCCQ min H X High-Z High-Z H
Command-Address VCC / VCCQ min L T Master Output
Valid HX
Read Initial Access Latency (data
bus turn around period) VCC / VCCQ min L T High-Z L H
Write Initial Access Latency (RWDS
turn around period) VCC / VCCQ min L T High-Z High-Z H
Read data transfer VCC / VCCQ min L T Slave Output Valid
Slave
Output
Valid
X or T
H
Write data transfer with Initial
Latency VCC / VCCQ min L T Master Output
Valid
Master
Output
Valid
X or T
H
Write data transfer without Initial
Latency (1) VCC / VCCQ min L T Master Output
Valid
Slave
Output
L or
High-Z
H
Active Clock Stop 2) VCC / VCCQ min L Idle
Master or Slave
Output Valid or
High-Z
XH
Deep Power Down(2) VCC / VCCQ min H X or T Slave Output
High-Z High-Z H
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
29
9. Electrical Specifications
9.1 Absolute Maximum Ratings
65 °C to +150 °CStorage Temperature Plastic Packages
Ambient Temperature with Power Applied 65°C to +115 °C
Voltage with Respect to Ground
All signals (1)
Output Short Circuit Current (2)
VCC
0.5V to +(VCC + 0.5V)
100 mA
0.5V to +4.0V
Notes:
1. Minimum DC voltage on input or I/O signal is 1.0V. During voltage transitions, input or I/O signals may undershoot VSS
to -1.0V for periods of up to 20 ns. See Figure 9.1. Maximum DC voltage on input or I/O signals is VCC +1.0V. During
voltage transitions, input or I/O signals may overshoot to VCC +1.0V for periods up to 20 ns. See Figure 9.2.
2. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one
second.
3. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or any other conditions above those indicated in the
operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for
extended periods may affect device reliability.
9.1.1 Input Signal Overshoot
During DC conditions, input or I/O signals should remain equal to or between VSS and VDD. During voltage transitions, inputs or I/Os
may overshoot VSS to 1.0V or overshoot to VDD +1.0V, for periods up to 20 ns.
Figure 9.1 Maximum Negative Overshoot Waveform
Figure 9.2 Maximum Positive Overshoot Waveform
VSSQ to VCCQ
- 1.0V
≤20 ns
VCCQ + 1.0V
≤20 ns
VSSQ to VCCQ
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
30
Note:
1. Excludes power supplies VCC/VCCQ. Test conditions: VCC = VCCQ = 1.8 V, one connection at a time tested, connections not being tested are at VSS.
9.3 Operating Ranges
Operating ranges define those limits between which the functionality of the device is guaranteed.
9.3.1 Temperature Ranges
9.3.2 Power Supply Voltages
9.2 Latchup Characteristics
Table 9.1 Latchup Specification
Description Min Max Unit
Input voltage with respect to VSSQ on all input only connections 1.0 VCCQ + 1.0 V
Input voltage with respect to VSSQ on all I/O connections 1.0 VCCQ + 1.0 V
VCCQ Current 100 +100 mA
VCC and VCCQ 1.7v to 1.95V
VCC and VCCQ 2.7V to 3.6V
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Parameter Symbol Device Spec Unit
Min Max
Ambient Temperature TA
Industrial (I) –40 85
°C
Extended (E)–40 105
Automotive, A1 Grade –40 85
Automotive, A2 Grade –40 105
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
31
Notes:
1. Not 100% tested.
2. RESET# low initiates the draw of ICC5 reset current, making ILI during Reset# Low insignificant.
9.4 DC Characteristics
Table 9.2 DC Characteristics (CMOS Compatible)
Parameter Description Test Conditions Min Typ (1) Max Unit
ILI
Input Leakage Current
3V Device Reset Signal High Only
VIN = VSS to VCC,
VCC = VCC max µA
ILI
Input Leakage Current
1.8V Device Reset Signal High Only
VIN = VSS to VCC,
VCC = VCC max µA
ILI
Input Leakage Current
3V Device Reset Signal Low Only (2)
VIN = VSS to VCC,
VCC = VCC max +40.0 µA
ILI
Input Leakage Current
1.8V Device Reset Signal Low Only (2)
VIN = VSS to VCC,
VCC = VCC max
+40.0 µA
ICC1 VCC Active Read Current CS# = VIL, @166 MHz, VCC = 1.9V
20 60 mA
CS# = VIL, @100 MHz, VCC = 3.6V 20 45 mA
ICC2 VCC Active Write Current CS# = VIL, @166 MHz, VCC = 1.9V
15 mA
CS# = VIL, @100 MHz, VCC = 3.6V 15 mA
ICC4I
VCC Standby Current for Industrial
(40 °C to +85 °C) CS#, VCC = VCC max, 270 450µA
ICC4IP
VCC Standby Current for Industrial Plus
(40 °C to +105 °C) CS#, VCC = VCC max 270 600 µA
ICC5 Reset Current CS# = VIH, RESET# = VIL,
VCC = VCC max mA
ICC6I
Active Clock Stop Current for Industrial
(40 °C to +85 °C)
CS# = VIL, RESET# = VIH,
VCC = VCC max 12 16 mA
ICC6IP
Active Clock Stop Current for Industrial
Plus(40 °C to +105 °C)
CS# = VIL, RESET# = VIH,
VCC = VCC max 15 20 mA
VIL Input Low Voltage -0.5 - VCC
V
VIH Input High Voltage VCC
-VCC +
0.3
V
VOL Output Low Voltage IOL = 100 µA for DQ[7:0] - - 0.15 x
VCC
V
VOH Output High Voltage IOH = 100 µA for DQ[7:0] 0.85 x
VCC
V-
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
-0.2
-0.2
0.25 x
0.75 x
-
20
60
45
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
32
9.4.1 Capacitance Characteristics
Notes:
1. These values are guaranteed by design and are tested on a sample basis only.
2. Contact capacitance is measured according to JEP147 procedure for measuring capacitance using a vector network analyzer. VCC, VCCQ are
applied and all other signals (except the signal under test) floating. DQ’s should be in the high impedance state.
3. Note that the capacitance values for the CK, CK#, RWDS and DQx signals must have similar capacitance values to allow for signal propagation
time matching in the system. The capacitance value for CS# is not as critical because there are no critical timings between CS# going active
(Low) and data being presented on the DQs bus.
Notes:
1. These values are guaranteed by design and are tested on a sample basis only.
2. Contact capacitance is measured according to JEP147 procedure for measuring capacitance using a vector network analyzer. VCC, VCCQ are
applied and all other signals (except the signal under test) floating. DQ’s should be in the high impedance state.
3. The capacitance values for the CK, RWDS and DQx signals must have similar capacitance values to allow for signal propagation time matching
in the system. The capacitance value for CS# is not as critical because there are no critical timings between CS# going active (Low) and data
being presented on the DQs bus.
9.5 Power-Up Initialization
HyperRAM products include an on-chip voltage sensor used to launch the power-up initialization process. VCC and VCCQ must be
applied simultaneously. When the power supply reaches a stable level at or above VCC(min), the device will require tVCS time to
complete its self-initialization process.
The device must not be selected during power-up. CS# must follow the voltage applied on VCCQ until VCC (min) is reached during
power-up, and then CS# must remain high for a further delay of tVCS. A simple pull-up resistor from VCCQ to Chip Select (CS#) can
be used to insure safe and proper power-up.
If RESET# is Low during power up, the device delays start of the tVCS period until RESET# is High. The tVCS period is used primarily
to perform refresh operations on the DRAM array to initialize it.
When initialization is complete, the device is ready for normal operation.
Table 9.3 1.8V Capacitive Characteristics
Table 9.4 3.0V Capacitive Characteristics
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Description Parameter Min Max Unit
Input Capacitance (CK, CK#, CS#) CI 6 9 pF
Delta Input Capacitance (CK, CK#) CID - 0.5pF
Output Capacitance (RWDS) CO 6 8 pF
IO Capacitance (DQx) CIO 6 8 pF
IO Capacitance Delta (DQx) CIOD - 1pF
Description Parameter Min Max Unit
Input Capacitance (CK, CS#) CI 6 9 pF
Output Capacitance (RWDS) CO 6 8 pF
IO Capacitance (DQx) CIO 6 8 pF
IO Capacitance Delta (DQx) CIOD - 1pF
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
33
Figure 9.3 Power-up with RESET# High
Figure 9.4 Power-up with RESET# Low
Notes:
1. Bus transactions (read and write) are not allowed during the power-up reset time (tVCS).
2. VCCQ must be the same voltage as VCC.
3. VCC ramp rate may be non-linear.
Table 9.5 Power Up and Reset Parameters
Parameter Description Min Max Unit
VCC 1.8V VCC Power Supply 1.7 1.95 V
VCC 3V VCC Power Supply 2.7 3.6 V
tVCS
VCC and VCCQ minimum and RESET# High to first
access 150 µs
Vcc_VccQ
CS#
RESET#
tVCS
Device
Access Allowed
Vcc_VccQ
CS#
RESET#
tVCS
Device
Access Allowed
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
34
9.6 Power Down
HyperRAM devices are considered to be powered-off when the core power supply (VCC) drops below the VCC Lock-Out voltage
(VLKO). During a power supply transition down to the VSS level, VCCQ should remain less than or equal to VCC.
At the VLKO level, the HyperRAM device will have lost configuration or array data.
VCC must always be greater than or equal to VCCQ (VCC VCCQ).
During Power-Down or voltage drops below VLKO, the core power supply voltages must also drop below VCC Reset (VRST) for a
Power Down period (tPD) for the part to initialize correctly when the power supply again rises to VCC minimum. See Figure 9.5.
If during a voltage drop the VCC stays above VLKO the part will stay initialized and will work correctly when VCC is again above VCC
minimum. If VCC does not go below and remain below VRST for greater than tPD, then there is no assurance that the POR process
will be performed. In this case, a hardware reset will be required ensure the HyperBus device is properly initialized.
Figure 9.5 Power Down or Voltage Drop
Note:
1. VCC ramp rate can be non-linear.
Note:
1. VCC ramp rate can be non-linear.
The following section describes HyperRAM device dependent aspects of power down specifications.
Table 9.6 1.8V Power-Down Voltage and Timing
Symbol Parameter Min Max Unit
VCC VCC Power Supply 1.7 1.95 V
VLKO VCC Lock-out below which re-initialization is required 1.7 V
VRST VCC Low Voltage needed to ensure initialization will occur 0.8 V
tPD Duration of VCC VRST 30 µs
Table 9.7 3.0V Power-Down Voltage and Timing
Symbol Parameter Min Max Unit
VCC VCC Power Supply 2.7 3.6 V
VLKO VCC Lock-out below which re-initialization is required 2.7 V
VRST VCC Low Voltage needed to ensure initialization will occur 0.8 V
tPD Duration of VCC VRST 50 µs
V
CC
(Max)
V
CC
(Min)
V
LKO
V
RST
t
VCS
Device Access
Allowed
No Device Access Allowed
t
Time
V
CC
PD
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
35
9.7 Hardware Reset
The RESET# input provides a hardware method of returning the device to the standby state.
During tRPH the device will draw ICC5 current. If RESET# continues to be held Low beyond tRPH, the device draws CMOS standby
current (ICC4). While RESET# is Low (during tRP), and during tRPH, bus transactions are not allowed.
A hardware reset will:
cause the configuration registers to return to their default values,
halt self-refresh operation while RESET# is low,
After RESET# returns High, the self-refresh operation will resume. Because self-refresh operation is stopped during RESET# Low,
and the self-refresh row counter is reset to its default value, some rows may not be refreshed within the required array refresh
interval per Table 5.7, Array Refresh Interval per Temperature on page 23. This may result in the loss of DRAM array data during or
immediately following a hardware reset. The host system should assume DRAM array data is lost after a hardware reset and reload
any required data.
Figure 9.6 Hardware Reset Timing Diagram
Table 9.8 Power Up and Reset Parameters
Parameter Description Min Max Unit
tRP RESET# Pulse Width 200 ns
tRH Time between RESET# (high) and CS# (low) 200 ns
tRPH RESET# Low to CS# Low 400 ns
RESET#
CS#
tRP
tVCS - if RESET# Low > t
RP max
tRH
tRPH
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
36
10. Timing Specifications
The following section describes HyperRAM device dependent aspects of timing specifications.
10.1 Key to Switching Waveforms
10.2 AC Test Conditions
Figure 10.1 Test Setup
Notes:
1. All AC timings assume an input slew rate of 2V/ns. CK/CK# differential slew rate of at least 4V/ns.
2. Input and output timing is referenced to VCCQ/2 or to the crossing of CK/CK#.
Figure 10.2 Input Waveforms and Measurement Levels
Note:
1. Input timings for the differential CK/CK# pair are measured from clock crossings.
Table 10.1 Test Specification
Parameter All Speeds Units
Output Load Capacitance, CL20 pF
Minimum Input Rise and Fall Slew Rates (Note 1) 2.0 V/ns
Input Pulse Levels 0.0-VCCQ V
Input timing measurement reference levels VCCQ/2 V
Output timing measurement reference levels VCCQ/2 V
Valid_High_or_Low
High_to_Low_Transition
Low_to_High_Transition
Invalid
High_Impedance
Device
Under
Test
CL
VccQ
Vss
Input VccQ / 2 Measurement Level VccQ / 2 Output
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
37
10.3 AC Characteristics
10.3.1 Read Transactions
Table 10.2 HyperRAM Specific 1.8V Read Timing Parameters
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Parameter Symbol 166 MHz 133 MHz 100 MHz Unit
Min Max MinMinMin Max
Chip Select High Between Transactions tCSHI 6 – 7.5 – 10.0 – ns
HyperRAM Read-Write Recovery Time tRWR 36 37.5 40 ns
Chip Select Setup to next CK Rising
Edge tCSS 33– 3– – ns
Data Strobe Valid tDSV – – – ns
Input Setup tIS – – 1.0 – ns
Input Hold tIH – – 1.0 – ns
tACC
HyperRAM Read Initial Access Time 36 37.5 40 ns
Clock to DQs Low Z tDQLZ 00– –0– ns
CK transition to DQ Valid tCKD 1 1 1 ns
CK transition to DQ Invalid tCKDI 0 0 0 ns
Data Valid (tDV min = the lessor of:
tCKHP min - tCKD max + tCKDI max) or
tCKHP min - tCKD min + tCKDI min)
tDV 1.7 – 2.375 – 3.3 – ns
CK transition to RWDS valid tCKDS 1 1 1 ns
RWDS transition to DQ Valid tDSS -0.45 +0.45 -0.6 +0.6 -0.8 +0.8 ns
RWDS transition to DQ Invalid tDSH -0.45 +0.45 -0.6 +0.6 -0.8 +0.8 ns
Chip Select Hold After CK Falling Edge tCSH 00– –0– ns
Chip Select Inactive to RWDS High-Z tDSZ 6–– –6 6 ns
Chip Select Inactive to DQ High-Z tOZ 6–– –6 6 ns
HyperRAM Chip Select Maximum Low
Time - Industrial Temperature tCSM
-4.0-4.0-4.0us
HyperRAM Chip Select Maximum Low
Time - Extended Temperature -1.0-1.0-1.0us
Refresh Time tRFH 36 37.5 40 ns
6.5
6.5 6.5
6.5
6.5 6.5
13 13 13
0.9
0.9
0.9
0.9
33
00
00
––
––
Max MinMinMin
5.3
5.5
5.6
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
38
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Table 10.3 HyperRAM Specific 3.0V Read Timing Parameters
Parameter Symbol 100 MHz Unit
Min Max
Chip Select High Between Transactions tCSHI 10.0 – ns
HyperRAM Read-Write Recovery Time tRWR 40 - ns
Chip Select Setup to next CK Rising Edge tCSS –3 ns
Data Strobe Valid tDSV – ns
Input Setup tIS 1.0 – ns
Input Hold tIH 1.0 – ns
tACC
HyperRAM Read Initial Access Time 40 – ns
Clock to DQs Low Z tDQLZ –0 ns
tCKD
HyperRAM CK transition to DQ Valid 18ns
tCKDI
HyperRAM CK transition to DQ Invalid 0.5 6.2 ns
Data Valid (tDV min = the lessor of:
tCKHP min - tCKD max + tCKDI max) or
tCKHP min - tCKD min + tCKDI min)
tDV 2.7 ns
CK transition to RWDS valid tCKDS 1 ns
RWDS transition to DQ Valid tDSS -0.8 +0.8 ns
RWDS transition to DQ Invalid tDSH -0.8 +0.8 ns
Chip Select Hold After CK Falling Edge tCSH 0– ns
Chip Select Inactive to RWDS High-Z tDSZ –7 ns
Chip Select Inactive to DQ High-Z tOZ –7 ns
HyperRAM Chip Select Maximum Low Time - Industrial Temperature tCSM
-4.0us
HyperRAM Chip Select Maximum Low Time - Extended Temperature - 1.0 us
Refresh Time tRFH 40 ns
8
13
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
39
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
10.3.2 Write Transactions
Table 10.4 1.8V Write Timing Parameters
Parameter Symbol 166 MHz 133 MHz 100 MHz Unit
Min Max MMMininin Max
Read-Write Recovery Time tRWR 36 37.5 40 ns
Access Time tACC 36 37.5 40 ns
Refresh Time tRFH 36 37.5 40 ns
Chip Select Maximum Low Time
Industrial Temperature tCSM
4.0 4.0 4.0 µs
Chip Select Maximum Low Time
Industrial Plus Temperature 1.0 1.0 1.0 µs
Table 10.5 3.0V Write Timing Parameters
Parameter Symbol 100 MHz Unit
Min Max
Read-Write Recovery Time tRWR 40 ns
Access Time tACC 40 ns
Refresh Time tRFH 40 ns
Chip Select Maximum Low Time Industrial Temperature tCSM
4.0 µs
Chip Select Maximum Low Time Industrial Plus Temperature 1.0 µs
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
40
11. Physical Interface
11.1 FBGA 24-Ball 5 x 5 Array Footprint
HyperRAM devices are provided in Fortified Ball Grid Array (FBGA), 1 mm pitch, 24-ball, 5 x 5 ball array footprint, with 6mm x 8mm
body.
Figure 11.1 24-Ball FBGA, 6 x 8 mm, 5x5 Ball Footprint, Top View
Notes:
1. B1 is assigned to CK# on the 1.8V device.
2. B1 is a RFU on the 3.0V device.
3241
RFU CS# RESET#
B
D
E
A
C
VssCK VccCK#
RWDSRFU DQ2VssQ
DQ0DQ1 DQ3VccQ
DQ5DQ6 VccQDQ7
RFU
RFU
RFU
DQ4
VssQ
5
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
41
12. DDR Center Aligned Read Strobe Functionality
The HyperRAM device offers an optional feature that enables independent skewing (phase shifting) of the RWDS signal with respect
to the read data outputs. This feature is provided in certain devices, based on the Ordering Part Number (OPN).
When the DDR Center Aligned Read Strobe (DCARS) feature is provided, a second differential Phase Shifted Clock input PSC/
PSC# is used as the reference for RWDS edges instead of CK/CK#. The second clock is generally a copy of CK/CK# that is phase
shifted 90 degrees to place the RWDS edges centered within the DQ signals valid data window. However, other degrees of phase
shift between CK/CK# and PSC/PSC# may be used to optimize the position of RWDS edges within the DQ signals valid data
window so that RWDS provides the desired amount of data setup and hold time in relation to RWDS edges.
PSC/PSC# is not used during a write transaction. PSC and PSC# may be driven Low and High respectively or, both may be driven
Low during write transactions.
The PSC/PSC# differential clock is used only in HyperBus devices with 1.8 V nominal core and I/O voltage. HyperBus devices with
3 V nominal core and I/O voltage use only PSC as a single-ended clock.
12.1 HyperRAM Products with DCARS Signal Descriptions
Figure 12.1 HyperBus Product with DCARS Signal Diagram
Signal Descriptions
Symbol Type Description
CS# Input Chip Select. HyperBus transactions are initiated with a High to Low transition. HyperBus transactions
are terminated with a Low to High transition.
CK, CK# Input Differential Clock. Command-Address/Data information is input or output with respect to the crossing
of the CK and CK# signals. CK# is not used on the 3.0 V device, only a single ended CK is used.
PSC,
PSC# Input
Phase Shifted Clock. PSC/PSC# allows independent skewing of the RWDS signal with respect to
the CK/CK# inputs. PSC# is only used on the 1.8 V device. PSC (and PSC#) may be driven High and
Low respectively or both may be driven Low during write transactions.
RWDS Output
Read-Write Data Strobe. Data bytes output during read transactions are aligned with RWDS based
on the phase shift from CK, CK# to PSC, PSC#. PSC, PSC# cause the transitions of RWDS, thus the
phase shift from CK, CK# to PSC, PSC# is used to place RWDS edges within the data valid window.
RWDS is an input during write transactions to function as a data mask. At the beginning of all bus
transactions RWDS is an output and indicates whether additional initial latency count is required
(1 = additional latency count, 0 = no additional latency count).
DQ[7:0] Input/Output Data Input/Output. Command-Address/Data information is transferred on these DQs during Read
and Write transactions.
RESET# Input
Hardware RESET. When Low the device will self initialize and return to the idle state. RWDS and
DQ[7:0] are placed into the High-Z state when RESET# is Low. RESET# includes a weak pull-up, if
RESET# is left unconnected it will be pulled up to the High state.
VCC Power Supply Core Power.
VCCQ Power Supply Input/Output Power.
VSS Power Supply Core Ground.
VSSQ Power Supply Input/Output Ground.
CS#
CK#
CK
PSC
DQ[7:0]
RWDS
PSC#
V
SS
V
SS
Q
V
CC
V
CC
Q
RESET#
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
42
12.2 HyperRAM Products with DCARS — FBGA 24-ball, 5x5 Array Footprint
Figure 12.2 24-ball FBGA, 5x5 Ball Footprint, Top View
Notes:
1. B1 is an RFU on the 3.0 V device and is assigned to CK# on the 1.8 V device.
2. C5 is an RFU on the 3.0 V device and is assigned to PSC# on the 1.8 V device.
12.3 HyperRAM Memory with DCARS Timing
The HyperRAM device read transaction timing parameters vary by device, voltage range, and temperature range. Some timing
parameters are not shown in this supplement documentation. Refer to the individual device data sheets for all current timing
parameter information. The illustrations and parameters in this document are only those needed to define the DCARS feature and
show the relationship between the Phase Shifted Clock, RWDS, and data.
Figure 12.3 HyperRAM Memory DCARS Timing Diagram
Notes:
1. Transactions must be initiated with CK = Low and CK# = High. CS# must return High before a new transaction is initiated.
2. CK# and PSC# are only used on the 1.8 V device. The 3 V device uses a single ended CK and PSC input.
3. The memory drives RWDS during read transactions.
4. This example demonstrates a latency code setting of four clocks and no additional initial latency required.
3241
RFU CS# RESET#
B
D
E
A
C
VssCK VccCK#
RWDSRFU DQ2VssQ
DQ0DQ1 DQ3VccQ
DQ5DQ6 VccQDQ7
RFU
PSC
PSC#
DQ4
VssQ
5
CS#
CK , CK#
PSC , PSC#
RWDS
DQ[7:0]
tACC = Access time
4 cycle latency
Command-Address
tCKD
tCSHI
tCSS tCSS
tDSV
tIS tIH
tPSCRWDS
tDQLZ
tCSH
tDSZ
tOZ
47:40 39:32 31:24 23:16 15:8 7:0
High = 2x Latency Count
Low = 1x Latency Count
Dn
A
Dn
B
Dn+1
A
Dn+1
B
Host drives DQ[7:0] and Memory drives RWDS
Memory drives DQ[7:0]
and RWDS
RWDS aligned
by PSC
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
43
Figure 12.4 DCARS Data Valid Timing
Notes:
1. This figure shows a closer view of the data transfer portion of Figure 12.1, HyperBus Product with DCARS Signal Diagram on page 43 in order to more clearly show
the Data Valid period as affected by clock jitter and clock to output delay uncertainty.
2. CK# and PSC# are only used on the 1.8 V device. The 3 V device uses a single ended CK and PSC input.
3. The delay (phase shift) from CK to PSC is controlled by the HyperBus master interface (Host) and is generally between 40 and 140 degrees in order to place the
RWDS edge within the data valid window with sufficient set-up and hold time of data to RWDS. The requirements for data set-up and hold time to RWDS are
determined by the HyperBus master interface design and are not addressed by the HyperBus slave timing parameters.
4. The HyperBus timing parameters of tCKD, and tCKDI define the beginning and end position of the data valid period. The tCKD and tCKDI values track together (vary by the
same ratio) because RWDS and Data are outputs from the same device under the same voltage and temperature conditions.
DCARS Read Timings (@ 3.0 V)
Note:
1. Sampled, not 100% tested.
DCARS Read Timings (@ 1.8 V)
Note:
1. Sampled, not 100% tested.
Parameter Symbol 100 MHz Unit
Min Max
HyperRAM PSC transition to RWDS transition tPSCRWDS 17 ns
Time delta between CK to DQ valid and PSC to RWDS tPSCRWDS - tCKD -1.0 +0.5 ns
Parameter Symbol 133 MHz 100 MHz Unit
MinMax Min Max
HyperRAM PSC transition to RWDS transition tPSCRWDS 15.515.5 ns
Time delta between CK to DQ valid and PSC to
RWDS tPSCRWDS - tCKD -1.0 +0.5 -1.0 +0.5 ns
CS#
CK ,CK#
PSC ,PSC#
RWDS
DQ[7:0]
t
CKD
t
CKD
t
CSS
t
PSCRWDS
t
DQLZ
t
CSH
t
DSZ
t
OZ
t
DV
t
CKDI
t
CKHP
Dn
A
Dn
B
Dn+1
A
Dn+1
B
RWDS and Data are driven by the memory
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
44
PSRAM Product Type
H – Hyper RAM
Den/Org
8M8 = 64Mb/8M x8
4M8 = 32Mb/4M x8
16M8 = 128Mb/16M x8
32M8 = 256Mb/32M x8
VDD
ALL = 1.8V
BLL = 3.0V
Temperature Range
I = Industrial (-40 °C to 85 °C)
A1 = Automove (-40 °C to 85 °C)
A2= Automove (-40 °C to 105 °C)
IS66/67 WVH 16M8 x BLL –166 B1 L I
66: for PSRAM
67: for Automove PSRAM
166: 166 MHZ (1.8V)
100: 100 MHZ (3.0V)
PACKAGED
KGD
–
31=31mil
Die Rev
Blank – current die rev
Solder Type
L = Pb Free
13.ORDERING RULE & INFORMATION
13.1 ORDERING RULE
Package Code
B1 = 24 TFBGA(1.2mm Height)
B2 = 24 TFBGA with PSC/PSC# (1.2mm Height)
B3 = 24 VFBGA (1.0mm Height)
Note:
Call Factory for VFBGA (B3 Package)
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
45
13.2 ORDERING INFORMATION
Note:
Call Factory for VFBGA (Height=1.0mm, B3 Package)
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Industrial Temperature Range: (-40oC to +85oC)
Frequency
(MHz)
Config. Order Part No. Package
16Mx8
166
IS66WVH16M8ALL-166B1LI 24-ball TFBGA , Pb Free, 5x5 Array
IS66WVH16M8ALL-166B2LI 24-ball TFBGA , Pb Free, 5x5 Array, PSC/PSC#
133
IS66WVH16M8ALL-133B1LI 24-ball TFBGA, Pb Free, 5x5 Array
IS66WVH16M8ALL-133B2LI 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
Automotive A1 Temperature Range: (-40oC to +85oC)
Automotive A2 Temperature Range: (-40oC to +105oC)
Frequency
(MHz)
Config. Order Part No. Package
16Mx8
166
IS67WVH16M8ALL-166B1LA1 24-ball TFBGA , Pb Free, 5x5 Array
IS67WVH16M8ALL-166B2LA1 24-ball TFBGA , Pb Free, 5x5 Array, PSC/PSC#
133
IS67WVH16M8ALL-133B1LA1 24-ball TFBGA, Pb Free, 5x5 Array
IS67WVH16M8ALL-133B2LA1 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
Frequency
(MHz)
Config. Order Part No. Package
16Mx8
166
IS67WVH16M8ALL-166B1LA2 24-ball TFBGA , Pb Free, 5x5 Array
IS67WVH16M8ALL-166B2LA2 24-ball TFBGA , Pb Free, 5x5 Array, PSC/PSC#
133
IS67WVH16M8ALL-133B1LA2 24-ball TFBGA, Pb Free, 5x5 Array
IS67WVH16M8ALL-133B2LA2 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
46
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
46
Ordering Information :
BLL : VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Note:
Call Factory for VFBGA (Height=1.0mm, B3 Package)
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Industrial Temperature Range: (-40oC to +85oC)
Frequency
(MHz)
Config. Order Part No. Package
16Mx8 100
IS66WVH16M8BLL-100B1LI 24-ball TFBGA, Pb Free, 5x5 Array
IS66WVH16M8BLL-100B2LI 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
Automotive A1 Temperature Range: (-40oC to +85oC)
Automotive A2 Temperature Range: (-40oC to +105oC)
Frequency
(MHz)
Config. Order Part No. Package
16Mx8 100
IS67WVH16M8BLL-100B1LA1 24-ball TFBGA, Pb Free, 5x5 Array
IS67WVH16M8BLL-100B2LA1 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
Frequency
(MHz)
Config. Order Part No. Package
16Mx8 100
IS67WVH16M8BLL-100B1LA2 24-ball TFBGA, Pb Free, 5x5 Array
IS67WVH16M8BLL-100B2LA2 24-ball TFBGA, Pb Free, 5x5 Array, PSC/PSC#
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
47
14. PACKAGE INFORMATION
IS66WVH16M8ALL/BLL
IS67WVH16M8ALL/BLL
Integrated Silicon Solution, Inc.- www.issi.com
Rev.B4
09/21/2018
48
