High Power
Chip Resistors
SC3 Series
High Power
Chip Resistors
SC3 Series
© Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Issue A · 03.02
Welwyn Components
Performance Data
Temperature Rise vs Pad Area
Construction
Resistive thick film material, overglaze and organic protection
are screen printed on a 96% alumina substrate. The
components are laser trimmed to achieve the required
resistance tolerance.
Terminations
The wrap-around copper terminations have an electroplated
nickel barrier and tin-lead solder coating, this ensures
excellent ‘leach’ resistance properties and solderability.
Chips can withstand immersion in solder at 250˚C for 90
seconds and are suitable for reflow or wave soldering
mounting applications.
Marking
The body protection and marking are resistant to all normal
industrial cleaning solvents suitable for printed circuits.
Chips are packed and mounted with marking side up.
The SC3 Chips are mounted with the actual resistor element
mounted face down on its termination pads.
1000
100
10
100mm2300mm21000mm2
Termination Pad Area (each end)
Temperature Rise (˚C)
1 watt 2 watt 3 watt
Pulse Power Rating
100
10
1
0.010.11.0
Time (sec)
Power (watts)
The wrap-around terminations have an electroplated nickel
barrier and matte tin finish. This ensures
excellent ‘leach’ resistance properties and solderability.
AEC-Q200 Table 7 Method Max.+0.01Ω Typ.
ref Test
3High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2
4Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1
6Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2
7Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.1
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1.0 0.5
14 Vibration MIL-STD-202 Method 204 R% 0.25 0.05
15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05
16 Thermal Shock MIL-STD-202 Method 107 R% 0.5 0.2
18 Solderability J-STD-002 >95% coverage
21 Board Flex AEC-Q200-005 R% 0.25 0.05
22 Terminal Strength AEC-Q200-006 R% 0.25 0.05
Short Term Overload 6.25 x Pr for 2s R% 0.5
Low Temperature Storage
Low Temperature Operation
-65°C for 100 hours R%
R%
R%
0.5
Shelf Life Test Room temp for 12 months
-65°C for 1 hour then Pr for 45 minutes 0.5
0.1
Leach Resistance Solder dip at 250°C 90s minimum
04.16
General Note
TT Electronics reserves the right to make changes in product specication without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
© TT Electronics plc
www.ttelectronicsresistors.com
BI Technologies IRC Welwyn