2007-08-17
2
CFY67...
Maximum Ratings
Parameter Symbol Value Unit
Drain-source voltage VDS 3.5 V
Drain-gate voltage VDG 4.5
Gate-source voltage (reverse/ forward) VGS -3...0.5
Drain current ID60 mA
Gate forward current IG2
RF input power, C- and X-band1) PRF,in 10 dBm
Junction temperature T
150 °C
Storage temperature Tst
-65...150
Total power dissipation2) Ptot 200 mW
Soldering temperature3) Tsol 230 °C
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point RthJS ≤ 515 (tbc) K/W
Electrical Characteristics (at TA = 25 °C; unless otherwise specified)
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Drain- source saturation current
VDS = 2 V, VGS = 0 V IDSS 15 30 60 mA
Gate threshold voltage
VDS = 2 V, ID = 1 mA -VGth 0.2 0.7 2 V
Drain current pinch-off
VDS = 1.5 V, VGS = -3 V IDp - <50 - µA
Gate leakage current at pinch-off
VDS = 1.5 V, VGS = -3 V -IGp - <50 200
Transconductance
VDS = 2 V, ID = 15 mA gm15 50 65 - mS
Gate leakage current at operation
VDS = 2 V, ID = 15 mA -IG15 - <0,5 2 µA
1For VDS 2V. For VDS 2 V, derating is required.
2At TS= 47°C. For TS > 47°C derating is required.
3During 15 sec. maximum. The same terminal shall not be resoldered until 3 minuntes have elapsed.