4
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mlcc01_e-01
FEATURES
PART NUMBER
STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
APPLICATIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
◦Improved higher density mounting.042 to 105 type
◦Monolithic structure provides higher reliability.
◦A wide range of capacitance values available in standard case sizes.
◦The use of nickel as electrode material and plating processing im-
prove the solderability and heat resistance characteristics. It also
prevents migration and raises the level of reliability.
◦Low equivalent series resistance(ESR) provides superior noise ab-
sorption characteristics.
◦Compared to tantalum or aluminum electrolytic capacitors, multilayer
ceramic capacitors offer a number of superior features, including:
Higher permissible ripple current values
Smaller case sizes with high rated voltage
Improved reliability due to higher insulation resistance and breakdown voltage.
◦Communication equipment
cellular phone, wireless applications, etc.
◦General digital circuit
◦Power supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LSI, IC, converters(both for input and output)
◦Smoothing capacitors
DC-DC converters (for both input and output)
Switching power supplies (secondary side)
HIGH VALUE MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE)
REFLOWWAVE
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
MK042
01005 inch0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03 40000
MK063
0201 inch0.6±0.03 0.3±0.03 0.3±0.03 P 0.15±0.05 15000
MK105
0402 inch1.0±0.05 0.5±0.05 0.2±0.02 C 0.25±0.10 20000
0.3±0.03 P 15000
0.5±0.05 V 10000
MK107
0603 inch1.6±0.10 0.8±0.10 0.45±0.05 K 0.35±0.25 4000
0.8±0.10 A
MK212
0805 inch2.0±0.10 1.25±0.10 0.45±0.05 K 0.5±0.25 4000
0.85±0.10 D
1.25±0.10 G 3000
MK316
1206 inch3.2±0.15 1.6±0.15 0.85±0.10 D 0.50.35/0.25 4000
1.25±0.10 G 3000
1.6±0.20 L 2000
MK325
1210 inch3.2±0.30 2.5±0.20
0.85±0.10 D
0.6±0.3 20001.9±0.20 N
1.90.1/0.2 Y
2.5±0.20 M 500T, 1000P
Series name
M
End
termination
K Plated
Rated
voltage
VDC
A 4
J 6.3
L 10
E 16
T 25
G 35
U 50
Packaging
Fφ178mm Taping
2mm pitch
Wφ178mm Taping
1mm pitch, 042
Type
T
φ178mm Taping
4mm pitch
All types
P
φ178mm Taping
4mm pitch,
1000pcs/reel
1210Type 
ThicknessM
Internal code
Standard
Blank space
Special
code
Standard
Thickness
mm
C 0.2
P 0.3
V 0.5
K 0.45
A 0.8
D 0.85
G
1.25
L 1.6
N 1.9
Y
2.0max
M 2.5
Nominal
capacitance
pF
example
473 47,000
105 1,000,000
Capacitance
tolerance
K±10
M±20
Z80
20
Temperature
characteristics code
BJ B
X5R
B7 X7R
FF
Y5V
Blank space
Dimension
Type inchL×Wmm
042 010050.4×0.2
063 02010.6×0.3
105 04021.0×0.5
107 06031.6×0.8
212 08052.0×1.25
316 12063.2×1.6
325 12103.2×2.5
J M K 3 1 6 B J 1 0 6 M L T
Dimension tolerance
mm
Code
Type L W T
ALL Standard Standard Standard
A
063
0.6±0.05 0.3±0.05 0.3±0.05
105
1.0±0.1 0.5±0.1 0.5±0.1
107
1.60.15/0.05 0.80.15/0.05 0.80.15/0.05
212
2.00.15/0.05 1.250.15/0.05 0.45±0.05
0.85±0.1
1.250.15/0.05
316
3.2±0.2 1.6±0.2 0.85±0.1
1.6±0.2
325
3.2±0.3 2.5±0.3 2.5±0.3
B
105
1.00.15/0.05 0.50.15/0.05 0.50.15/0.05
107
1.60.2/0 0.80.2/00.45±0.05
0.80.2/0
212
2.00.2/0 1.250.2/00.85±0.1
1.250.2/0
Blank space
CAPACITORS
5
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mlcc01_e-01
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
AVAILABLE CAPACITANCE RANGE
Temp.char.Code Temperature characteristics Capacitance tolerance
〔%
Applicable standard Temperature range〔℃〕 Ref. Temp.℃〕 Capacitance change%〕
BJ JIS B 2585 20 ±10 ±10K
±20M
EIA X5R 5585 25 ±15
B7 EIA X7R 55125 25 ±15
FJIS F 2585 20 30/80 80  
20
Z
EIA Y5V 3085 25 22/82
Low Profile Multilayer Ceramic Capacitors
Cap
〔μF
Type
107 212 316 325
B/X5R X7R B/X5R F/Y5V X7R B/X5R F/Y5V B/X5R
VDC
25 16 10
6.3
50 25 16 10 50 25 16 10
6.3
50 10
6.3
50 25 10 50 25 16 10
6.3
35 25 16 10
6.3
25 16 10
3-digit
0.1 104 D
0.22 224 D D
0.33 334
0.47 474 D D D
0.68 684
1 105 K K K K D D D D D D D D D
2.2 225 K K D D D D D D D D D D D
3.3 335 G D
4.7 475 K K D D D
D. K D.K
D D D D D D D
6.8 685 G D
10 106 D D
D.K
D D D D D D D D D
22 226 D D D D D D D
47 476 D D
NoteLetters in the table indicate product thickness.  X5R only
NoteLetters in the table indicate product thickness.  X5R only
Cap
〔μF
Type
107 212 316 325
X7R B/X5R F/Y5V X7R B/X5R F/Y5V X7R B/X5R F/Y5V X7R B/X5R F/Y5V
VDC
50 25 16 10
6.3
50 35 25 16 10
6.3
4 50 25 16 10 50 35 25 16 10
6.3
50 25 16 10
6.3
50 16 10
6.3
50 25 16 10
6.3
50 25 16 10
6.3
4 35 25 16 10 50 25 16 10
6.3
50 35 25 16 10
6.3
16 10
6.3
3-digit
0.1 104 A G G
0.15 154
0.22 224 A A A A A A A A G G L
0.33 334
0.47 474 A A A A A A A A A A A G G G L
0.68 684
1 105 A A A A A A A A A A A A G G G G G G G L L L
2.2 225 A A A A A A A G G G G G G G G L L L L L L N
3.3 335 N N
4.7 475 A A A G G G G G G G G L L L L L L
M.N
N N
M.N
NNN
6.8 685
10 106 A A A G G G G G G G G G L L L L L L L L L L L M
M.N
N N M N
M.N
N N
22 226 A G G L L L L L M M M
M.Y
Y N N
47 476 G L L M M
M.Y
M
M.N
N
100 107 L L M
M.Y
Cap
pF
Type 042 063 105
X7R
B/X5R X7R B/X5R X7R B/X5R F/Y5V
VDC 10 10 6.3 4 25 16 25 16 10 6.3 4 50 25 16 10 6.3 50 35 25 16 10 6.3 4 50 25 16 10 6.3
3-digit
100 101 C C P P
150 151 C C P P
220 221 C C P P V V
330 331 C C P P V V
470 471 C C P P V V
680 681 C C P P V V
1000 102 C C P P V V
1500 152 C C P P P V V V
2200 222 C C P P P V V V
3300 332 C C P P P V V V
4700 472 C C P P P V V V
6800 682 C C P P P V V V
10000 103 C C P P P V V V V
15000 153 V V
22000 223 C P P V V V V V
33000 333 P P V V
47000 473 C P P V V V V V
68000 683 P P V
100000 104 C P P P V V V V V V V
220000 224 P P P V V V V V V V V
330000 334 P
470000 474 P V V V V
1000000 105 P V V V V V
2200000 225 V V
3300000 335 V
4700000 475 V V
NoteLetters in the table indicate product thickness.  X5R only
Cap
pF
Type 105
B/X5R
VDC 25 16 10 6.3
3-digit
100 101
150 151
220 221
330 331
470 471
680 681
1000 102
1500 152
2200 222
3300 332
4700 472
6800 682
10000 103 P
15000 153
22000 223
33000 333
47000 473
68000 683
100000 104 P C
220000 224 P C
330000 334
470000 474 P P C
1000000 105 P
2200000 225
3300000 335
4700000 475
Multilayer Ceramic Capacitors 
6
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mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
042TYPE01005 case size
063TYPE0201 case size
Temperature Characteristic BJ:B/X5R 0.2mm thicknessC
Temperature Characteristic BJ:B/X5R 0.3mm thicknessP
Temperature Characteristic B7X7R 0.2mm thicknessC
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
10V LMK042 BJ101C B/X5R*1100 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ151C B/X5R*1150 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ221C B/X5R*1220 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ331C B/X5R*1330 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ471C B/X5R*1470 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ681C B/X5R*1680 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ102C B/X5R*11000 ±10, ±20 5 0.2±0.02 R 200%
LMK042 BJ152C X5R 1500 ±10, ±20 10 0.2±0.02 R 150%
LMK042 BJ222C X5R 2200 ±10, ±20 10 0.2±0.02 R 150%
LMK042 BJ332C X5R 3300 ±10, ±20 10 0.2±0.02 R 150%
LMK042 BJ472C X5R 4700 ±10, ±20 10 0.2±0.02 R 150%
LMK042 BJ682C X5R 6800 ±10, ±20 10 0.2±0.02 R 150%
LMK042 BJ103C X5R 10000 ±10, ±20 10 0.2±0.02 R 150%
6.3V JMK042 BJ152C B/X5R*11500 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ222C B/X5R*12200 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ332C B/X5R*13300 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ472C B/X5R*14700 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ682C B/X5R*16800 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ103C B/X5R*110000 ±10, ±20 10 0.2±0.02 R 150%
JMK042 BJ223C X5R 22000 ±10, ±20 10 0.2±0.02 R 150%
4V AMK042 BJ473MC X5R 47000 ±20 10 0.2±0.02 R 150%
AMK042 BJ104MC X5R 100000 ±20 10 0.2±0.02 R 150%
Capacitance tolerance code is applied to of part number. *1 We may provide X7S/X7R for some items according to the individual specification.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
10V LMK042 B7101C X7R 100 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7151C X7R 150 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7221C X7R 220 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7331C X7R 330 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7471C X7R 470 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7681C X7R 680 ±10, ±20 5 0.2±0.02 R 200%
LMK042 B7102C X7R 1000 ±10, ±20 5 0.2±0.02 R 200%
Capacitance tolerance code is applied to of part number.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
25V TMK063 BJ101P B/X5R*1100 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ151P B/X5R*1150 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ221P B/X5R*1220 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ331P B/X5R*1330 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ471P B/X5R*1470 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ681P B/X5R*1680 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ102P B/X5R*11000 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 BJ152P B/X5R 1500 ±10, ±20 5 0.3±0.03 R 200%
TMK063 BJ222P B/X5R 2200 ±10, ±20 5 0.3±0.03 R 200%
TMK063 BJ332P B/X5R 3300 ±10, ±20 5 0.3±0.03 R 200%
TMK063 BJ472P B/X5R 4700 ±10, ±20 5 0.3±0.03 R 200%
TMK063 BJ682P B/X5R 6800 ±10, ±20 5 0.3±0.03 R 200%
TMK063 BJ103P B/X5R 10000 ±10, ±20 5 0.3±0.03 R 200%
16V EMK063 BJ152P B/X5R*11500 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ222P B/X5R*12200 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ332P B/X5R*13300 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ472P B/X5R*14700 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ682P B/X5R*16800 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ103P B/X5R*110000 ±10, ±20 5 0.3±0.03 R 200%
EMK063 BJ104P X5R 100000 ±10, ±20 10 0.3±0.03 R 150%
10V LMK063 BJ223P B/X5R 22000 ±10, ±20 7.5 0.3±0.03 R 150%
LMK063 BJ333P X5R 33000 ±10, ±20 7.5 0.3±0.03 R 150%
LMK063 BJ473P X5R 47000 ±10, ±20 7.5 0.3±0.03 R 150%
LMK063 BJ683P X5R 68000 ±10, ±20 10 0.3±0.03 R 150%
LMK063 BJ104P X5R 100000 ±10, ±20 10 0.3±0.03 R 150%
LMK063 BJ224P X5R 220000 ±10, ±20 10 0.3±0.03 R 150%
6.3V JMK063 BJ223P B/X5R 22000 ±10, ±20 7.5 0.3±0.03 R 200%
JMK063 BJ333P X5R 33000 ±10, ±20 7.5 0.3±0.03 R 150%
JMK063 BJ473P X5R 47000 ±10, ±20 7.5 0.3±0.03 R 150%
JMK063 BJ683P X5R 68000 ±10, ±20 10 0.3±0.03 R 150%
JMK063 BJ104P X5R 100000 ±10, ±20 10 0.3±0.03 R 150%
JMK063 BJ224P X5R 220000 ±10, ±20 10 0.3±0.03 R 150%
4V AMK063 BJ224P X5R 220000 ±10, ±20 10 0.3±0.03 R 150%
AMK063 BJ334MP X5R 330000 ±20 10 0.3±0.03 R 150% *2
AMK063 BJ474MP X5R 470000 ±20 10 0.3±0.03 R 150%
AMK063ABJ105MP X5R 1000000 ±20 10 0.3±0.05 R 150%
Capacitance tolerance code is applied to of part number. *1 We may provide X7R for some items according to the individual specification. *2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels.
CAPACITORS
7
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
105TYPE0402 case size
Temperature Characteristic BJ:B/X5R
0.5mm thicknessV
Temperature Characteristic B7X7R
0.3mm thicknessP
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
25V TMK063 B7101P X7R 100 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7151P X7R 150 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7221P X7R 220 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7331P X7R 330 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7471P X7R 470 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7681P X7R 680 ±10, ±20 3.5 0.3±0.03 R 200%
TMK063 B7102P X7R 1000 ±10, ±20 3.5 0.3±0.03 R 200%
16V EMK063 B7152P X7R 1500 ±10, ±20 5 0.3±0.03 R 200%
EMK063 B7222P X7R 2200 ±10, ±20 5 0.3±0.03 R 200%
EMK063 B7332P X7R 3300 ±10, ±20 5 0.3±0.03 R 200%
EMK063 B7472P X7R 4700 ±10, ±20 5 0.3±0.03 R 200%
EMK063 B7682P X7R 6800 ±10, ±20 5 0.3±0.03 R 200%
EMK063 B7103P X7R 10000 ±10, ±20 5 0.3±0.03 R 200%
Capacitance tolerance code is applied to of part number.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK105 BJ221V B/X5R*1220 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ331V B/X5R*1330 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ471V B/X5R*1470 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ681V B/X5R*1680 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ102V B/X5R*11000 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ152V B/X5R*11500 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ222V B/X5R*12200 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ332V B/X5R*13300 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ472V B/X5R*14700 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 BJ682V B/X5R*16800 ±10, ±20 2.5 0.5±0.05 R 150%
UMK105 BJ103V B/X5R*110000 ±10, ±20 3.5 0.5±0.05 R 200%
35V GMK105 BJ104V B/X5R 100000 ±10, ±20 5 0.5±0.05 R 150%
25V TMK105 BJ153V B/X5R*115000 ±10, ±20 3.5 0.5±0.05 R 200%
TMK105 BJ223V B/X5R*122000 ±10, ±20 3.5 0.5±0.05 R 200%
TMK105 BJ333V B/X5R*133000 ±10, ±20 3.5 0.5±0.05 R 150%
TMK105 BJ473V B/X5R*147000 ±10, ±20 3.5 0.5±0.05 R 150%
TMK105 BJ104V B/X5R 100000 ±10, ±20 5 0.5±0.05 R 150%
TMK105 BJ105V X5R 1000000 ±10, ±20 10 0.5±0.05 R 150%
16V EMK105 BJ153V B/X5R*115000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 BJ223V B/X5R*122000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 BJ333V B/X5R*133000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 BJ473V B/X5R*147000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 BJ683V B/X5R 68000 ±10, ±20 5 0.5±0.05 R 200%
EMK105 BJ104V B/X5R*1100000 ±10, ±20 5 0.5±0.05 R 150%
EMK105 BJ224V B/X5R 220000 ±10, ±20 5 0.5±0.05 R 150%
EMK105 BJ105V X5R 1000000 ±10, ±20 10 0.5±0.05 R 150%
10V LMK105 BJ104V B/X5R 100000 ±10, ±20 5 0.5±0.05 R 200%
LMK105 BJ224V B/X5R 220000 ±10, ±20 5 0.5±0.05 R 150%
LMK105 BJ474V X5R 470000 ±10, ±20 10 0.5±0.05 R 150%
LMK105 BJ105V X5R 1000000 ±10, ±20 10 0.5±0.05 R 150%
LMK105 BJ225MV X5R 2200000 ±20 10 0.5±0.05 R 150%
6.3V JMK105 BJ224V B/X5R 220000 ±10, ±20 5 0.5±0.05 R 150%
JMK105 BJ474V X5R 470000 ±10, ±20 10 0.5±0.05 R 150%
JMK105 BJ105V X5R 1000000 ±10, ±20 10 0.5±0.05 R 150%
JMK105 BJ225MV X5R 2200000 ±20 10 0.5±0.05 R 150%
JMK105 BJ475MV JMK105BBJ475MV X5R 4700000 ±20 10 0.50.15/0.05 R 150% D
4V AMK105 BJ335MV X5R 3300000 ±20 10 0.5±0.05 R 150% *2
AMK105 BJ475MV AMK105ABJ475MV X5R 4700000 ±20 10 0.5±0.1 R 150%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some items according to the individual specification.
*2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels.
8
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temperature Characteristic B7:X7R
0.5mm thicknessV
Temperature Characteristic F:Y5V
0.5mm thicknessV
0.3mm thicknessP
0.2mm thicknessC
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
25V TMK105 BJ103P B/X5R 10000 ±10, ±20 5 0.3±0.03 R 150%
TMK105 BJ104P X5R 100000 ±10, ±20 10 0.3±0.03 R 150%
TMK105 BJ224P X5R 220000 ±10, ±20 10 0.3±0.03 R 150%
TMK105 BJ474P X5R 470000 ±10, ±20 10 0.3±0.03 R 150%
16V EMK105 BJ474P X5R 470000 ±10, ±20 10 0.3±0.03 R 150%
6.3V JMK105 BJ105P X5R 1000000 ±10, ±20 10 0.3±0.03 R 150%
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
10V LMK105 BJ104C X5R 100000 ±10, ±20 10 0.2±0.02 R 150%
6.3V JMK105 BJ224C X5R 220000 ±10, ±20 10 0.2±0.02 R 150%
JMK105 BJ474C X5R 470000 ±10, ±20 10 0.2±0.02 R 150%
Capacitance tolerance code is applied to of part number.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK105 B7221V X7R 220 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7331V X7R 330 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7471V X7R 470 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7681V X7R 680 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7102V X7R 1000 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7152V X7R 1500 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7222V X7R 2200 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7332V X7R 3300 ±10, ±20 2.5 0.5±0.05 R 200%
UMK105 B7472V X7R 4700 ±10, ±20 2.5 0.5±0.05 R 150%
UMK105 B7682V X7R 6800 ±10, ±20 2.5 0.5±0.05 R 150%
UMK105 B7103V X7R 10000 ±10, ±20 3.5 0.5±0.05 R 150%
25V TMK105 B7152V X7R 1500 ±10, ±20 2.5 0.5±0.05 R 200%
TMK105 B7222V X7R 2200 ±10, ±20 2.5 0.5±0.05 R 200%
TMK105 B7332V X7R 3300 ±10, ±20 2.5 0.5±0.05 R 200%
TMK105 B7472V X7R 4700 ±10, ±20 2.5 0.5±0.05 R 200%
TMK105 B7682V X7R 6800 ±10, ±20 2.5 0.5±0.05 R 200%
TMK105 B7103V X7R 10000 ±10, ±20 3.5 0.5±0.05 R 200%
TMK105 B7224V X7R 220000 ±10, ±20 10 0.5±0.05 R 150% R
16V EMK105 B7223V X7R 22000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 B7473V X7R 47000 ±10, ±20 3.5 0.5±0.05 R 200%
EMK105 B7104V X7R 100000 ±10, ±20 5 0.5±0.05 R 150%
EMK105 B7224V X7R 220000 ±10, ±20 10 0.5±0.05 R 150% R
10V LMK105 B7223V X7R 22000 ±10, ±20 3.5 0.5±0.05 R 200%
LMK105 B7473V X7R 47000 ±10, ±20 3.5 0.5±0.05 R 200%
LMK105 B7104V X7R 100000 ±10, ±20 5 0.5±0.05 R 150%
LMK105 B7224V X7R 220000 ±10, ±20 10 0.5±0.05 R 150% R
LMK105 B7474V X7R 470000 ±10, ±20 10 0.5±0.05 R 150%
6.3V JMK105 B7224V X7R 220000 ±10, ±20 5 0.5±0.05 R 150%
Capacitance tolerance code is applied to of part number.
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pFCapacitance
tolerance
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK105 F103ZV F/Y5V 10000 80/20 5 0.5±0.05 R 200%
25V TMK105 F223ZV F/Y5V 22000 80/20 5 0.5±0.05 R 200%
16V EMK105 F473ZV F/Y5V 47000 80/20 7 0.5±0.05 R 200%
EMK105 F104ZV F/Y5V 100000 80/20 9 0.5±0.05 R 200%
10V LMK105 F224ZV F/Y5V 220000 80/20 11 0.5±0.05 R 200%
6.3V JMK105 F474ZV F/Y5V 470000 80/20 12.5 0.5±0.05 R 200%
JMK105 F105ZV F/Y5V 1000000 80/20 20 0.5±0.05 R 150%
CAPACITORS
9
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
107TYPE
Temperature Characteristic BJ:B/X5R
0.8mm thicknessA
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK107 BJ474A UMK107ABJ474A X5R 0.47 ±10, ±20 10 0.80.15/0.05 R 150% D
UMK107 BJ105A X5R 1 ±10, ±20 10 0.8±0.1 R 150%
35V GMK107 BJ105A B/X5R 1 ±10, ±20 5 0.8±0.1 R 150%
25V TMK107 BJ224A B/X5R 0.22 ±10, ±20 3.5 0.8±0.1 R/W 200%
TMK107 BJ474A B/X5R 0.47 ±10, ±20 3.5 0.8±0.1 R 150%
TMK107 BJ105A B/X5R 1 ±10, ±20 5 0.8±0.1 R 150%
TMK107 BJ225A TMK107ABJ225A X5R 2.2 ±10, ±20 10 0.80.15/0.05 R 150% D
16V EMK107 BJ224A B/X5R*10.22 ±10, ±20 3.5 0.8±0.1 R/W 200%
EMK107 BJ474A B/X5R*10.47 ±10, ±20 3.5 0.8±0.1 R 200%
EMK107 BJ105A B/X5R*11±10, ±20 5 0.8±0.1 R 150%
EMK107 BJ225A B/X5R 2.2 ±10, ±20 10 0.8±0.1 R 150%
EMK107 BJ475A EMK107ABJ475A X5R 4.7 ±10, ±20 10 0.80.15/0.05 R 150% D
10V LMK107 BJ224A B/X5R*10.22 ±10, ±20 3.5 0.8±0.1 R/W 200%
LMK107 BJ474A B/X5R*10.47 ±10, ±20 3.5 0.8±0.1 R 200%
LMK107 BJ105A B/X5R*11±10, ±20 5 0.8±0.1 R 200%
LMK107 BJ225A B/X5R 2.2 ±10, ±20 10 0.8±0.1 R 150%
LMK107 BJ475A X5R 4.7 ±10, ±20 10 0.8±0.1 R 150%
LMK107 BJ106MA LMK107BBJ106MA X5R 10 ±20 10 0.80.2/0 R 150% D
Special codeL
6.3V JMK107 BJ225A B/X5R 2.2 ±10, ±20 10 0.8±0.1 R 150%
JMK107 BJ475A X5R 4.7 ±10, ±20 10 0.8±0.1 R 150%
JMK107 BJ106MA JMK107ABJ106MA X5R 10 ±20 10 0.80.15/0.05 R 150%
4V AMK107 BJ106MA X5R 10±20 10 0.8±0.1 R 150%
AMK107 BJ226MA AMK107BBJ226MA X5R 22 ±20 10 0.80.2/0 R 150%
0.45mm thicknessK
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
25V TMK107 BJ105K X5R 1 ±10, ±20 10 0.45±0.05 R 150%
16V EMK107 BJ105K X5R 1 ±10, ±20 10 0.45±0.05 R 150%
10V LMK107 BJ105K B/X5R 1 ±10, ±20 10 0.45±0.05 R 150%
LMK107 BJ225K X5R 2.2 ±10, ±20 10 0.45±0.05 R 150%
LMK107 BJ475MK LMK107BBJ475MK X5R 4.7 ±20 10 0.45±0.05 R 150% D
Special codeL
6.3V JMK107 BJ105K B/X5R 1 ±10, ±20 10 0.45±0.05 R 150%
JMK107 BJ225K X5R 2.2 ±10, ±20 10 0.45±0.05 R 150%
JMK107 BJ475MK X5R 4.7 ±20 10 0.45±0.05 R 150%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
Temperature Characteristic B7X7R
0.8mm thicknessA
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK107 B7224A X7R 0.22 ±10, ±20 10 0.8±0.1 R 150% R
UMK107 B7474A X7R 0.47 ±10, ±20 10 0.8±0.1 R 150% R
UMK107AB7105A X7R 1 ±10, ±20 10 0.80.15/0.05 R 150%
25V TMK107 B7474A X7R 0.47 ±10, ±20 10 0.8±0.1 R 150% R
TMK107 B7105A X7R 1 ±10, ±20 10 0.8±0.1 R 150%
16V EMK107 B7224A X7R 0.22 ±10, ±20 3.5 0.8±0.1 R/W 150%
EMK107 B7474A X7R 0.47 ±10, ±20 3.5 0.8±0.1 R 150%
EMK107 B7105A X7R 1 ±10, ±20 5 0.8±0.1 R 150%
10V LMK107 B7224A X7R 0.22 ±10, ±20 3.5 0.8±0.1 R/W 200%
LMK107 B7474A X7R 0.47 ±10, ±20 3.5 0.8±0.1 R 200%
LMK107 B7105A X7R 1 ±10, ±20 5 0.8±0.1 R 150%
LMK107 B7225A X7R 2.2 ±10, ±20 10 0.8±0.1 R 150%
6.3V JMK107 B7224A X7R 0.22 ±10, ±20 3.5 0.8±0.1 R/W 200%
JMK107 B7474A X7R 0.47 ±10, ±20 3.5 0.8±0.1 R 200%
JMK107 B7105A X7R 1 ±10, ±20 5 0.8±0.1 R 150%
Capacitance tolerance code is applied to of part number.
10
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temperature Characteristic FY5V
0.8mm thicknessA
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK107 F104ZA F/Y5V 0.1 80/20 7 0.8±0.1 R/W 200%
25V TMK107 F474ZA F/Y5V 0.47 80/20 7 0.8±0.1 R/W 200%
16V EMK107 F224ZA F/Y5V 0.22 80/20 7 0.8±0.1 R/W 200%
EMK107 F474ZA F/Y5V 0.47 80/20 7 0.8±0.1 R/W 200%
EMK107 F105ZA F/Y5V 1 80/20 16 0.8±0.1 R 200%
EMK107 F225ZA F/Y5V 2.2 80/20 16 0.8±0.1 R 200%
10V LMK107 F105ZA F/Y5V 1 80/20 16 0.8±0.1 R 200%
LMK107 F225ZA F/Y5V 2.2 80/20 16 0.8±0.1 R 200%
212TYPE
Temperature Characteristic BJB/X5R
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212 BJ104G B/X5R*10.1 ±10, ±20 3.5 1.25±0.1 R/W 200%
UMK212 BJ224G B/X5R*10.22 ±10, ±20 3.5 1.25±0.1 R/W 150%
UMK212 BJ474G B/X5R*10.47 ±10, ±20 3.5 1.25±0.1 R/W 150%
UMK212 BJ105G B/X5R 1 ±10, ±20 5 1.25±0.1 R/W 150%
25V TMK212 BJ225G B/X5R 2.2 ±10, ±20 5 1.25±0.1 R 150%
TMK212 BJ475G TMK212ABJ475G X5R 4.7 ±10, ±20 10 1.250.15/0.05 R 150%
TMK212BBJ106MG X5R 10 ±20 10 1.250.2/0 R 150%
16V EMK212 BJ225G B/X5R*12.2 ±10, ±20 5 1.25±0.1 R 200%
EMK212 BJ475G EMK212ABJ475G B/X5R*14.7 ±10, ±20 5 1.250.15/0.05 R 150%
EMK212 BJ106G EMK212ABJ106G X5R 10 ±10, ±20 10 1.250.15/0.05 R 150%
10V LMK212 BJ225G B/X5R*12.2 ±10, ±20 5 1.25±0.1 R 200%
LMK212 BJ475GLMK212ABJ475G B/X5R*14.7 ±10, ±20 5 1.250.15/0.05 R 200%
LMK212 BJ106G LMK212ABJ106G X5R 10 ±10, ±20 10 1.250.15/0.05 R 200%
LMK212 BJ226MG LMK212BBJ226MG X5R 22 ±20 10 1.250.2/0 R 150%
6.3V JMK212 BJ475G JMK212ABJ475G B/X5R 4.7 ±10, ±20 5 1.250.15/0.05 R 200%
JMK212 BJ106G JMK212ABJ106G X5R*110 ±10, ±20 10 1.250.15/0.05 R 200%
JMK212 BJ226MG JMK212ABJ226MG X5R 22 ±20 10 1.250.15/0.05 R 150%
JMK212 BJ476MG JMK212BBJ476MG X5R 47 ±20 10 1.250.2/0 R 150%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212 BJ105D UMK212ABJ105D X5R 1 ±10, ±20 10 0.85±0.1 R 150% D
25V TMK212 BJ474D B/X5R 0.47 ±10, ±20 3.5 0.85±0.1 R 200%
TMK212 BJ105D B/X5R 1 ±10, ±20 5 0.85±0.1 R 200%
TMK212 BJ225D TMK212ABJ225D B/X5R 2.2 ±10, ±20 5 0.85±0.1 R 150%
TMK212 BJ475D TMK212BBJ475D X5R 4.7 ±10, ±20 10 0.85±0.1 R 150% D
16V EMK212 BJ105D B/X5R*11±10, ±20 5 0.85±0.1 R 200%
EMK212 BJ225D EMK212ABJ225D B/X5R*12.2 ±10, ±20 5 0.85±0.1 R 200%
EMK212 BJ475D B/X5R 4.7 ±10, ±20 10 0.85±0.1 R 150%
EMK212 BJ106D EMK212ABJ106D X5R 10 ±10, ±20 10 0.85±0.1 R 150% D
10V LMK212 BJ105D B/X5R*11±10, ±20 3.5 0.85±0.1 R 200%
LMK212 BJ225D B/X5R*12.2 ±10, ±20 5 0.85±0.1 R 200%
LMK212 BJ475D B/X5R 4.7 ±10, ±20 10 0.85±0.1 R 200%
LMK212 BJ106D LMK212ABJ106D X5R 10 ±10, ±20 10 0.85±0.1 R 150%
6.3V JMK212 BJ475D X5R 4.7 ±10, ±20 10 0.85±0.1 R 200%
JMK212 BJ106D JMK212ABJ106D X5R 10 ±10, ±20 10 0.85±0.1 R 200%
JMK212 BJ226MD JMK212ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150%
0.45mm thicknessK
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
10V LMK212 BJ475K LMK212ABJ475K X5R 4.7 ±10, ±20 10 0.45±0.05 R 150%
6.3V JMK212 BJ475K JMK212ABJ475K X5R 4.7 ±10, ±20 10 0.45±0.05 R 150%
JMK212 BJ106MK JMK212ABJ106MK X5R 10 ±20 10 0.45±0.05 R 150%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
CAPACITORS
11
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temperature Characteristic B7X7R
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212 B7104G X7R 0.1 ±10, ±20 3.5 1.25±0.1 R/W 200%
UMK212 B7224G X7R 0.22 ±10, ±20 3.5 1.25±0.1 R/W 150%
UMK212 B7474G X7R 0.47 ±10, ±20 3.5 1.25±0.1 R/W 150%
UMK212 B7105G X7R 1 ±10, ±20 10 1.25±0.1 R/W 150%
UMK212BB7225G X7R 2.2 ±10, ±20 10 1.250.2/0 R 150%
35V GMK212 B7105G X7R 1 ±10, ±20 3.5 1.25±0.1 R/W 150%
25V TMK212 B7105G X7R 1 ±10, ±20 3.5 1.25±0.1 R/W 150%
TMK212 B7225G X7R 2.2 ±10, ±20 10 1.25±0.1 R 150% R
TMK212 B7475G TMK212AB7475G X7R 4.7 ±10, ±20 10 1.250.15/0.05 R 150% D
16V EMK212 B7105G X7R 1 ±10, ±20 3.5 1.25±0.1 R/W 200%
EMK212 B7225G X7R 2.2 ±10, ±20 10 1.25±0.1 R 150%
EMK212 B7475G X7R 4.7 ±10, ±20 10 1.25±0.1 R 150%
EMK212BB7106MG X7R 10 ±20 10 1.250.2/0 R 150%
10V LMK212 B7105G X7R 1 ±10, ±20 3.5 1.25±0.1 R/W 200%
LMK212 B7225G X7R 2.2 ±10, ±20 5 1.25±0.1 R 200%
LMK212 B7475G X7R 4.7 ±10, ±20 10 1.25±0.1 R 150%
LMK212 B7106MG LMK212AB7106MG X7R 10 ±20 10 1.250.15/0.05 R 150% D
6.3V JMK212 B7106G JMK212AB7106G X7R 10 ±10, ±20 10 1.250.15/0.05 R 150%
316Type
Temperature Characteristic BJB/X5R
1.6mm thicknessL
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK316 BJ105L B/X5R*11±10, ±20 3.5 1.6±0.2 R 200%
UMK316 BJ475L X5R 4.7 ±10, ±20 10 1.6±0.2 R 150%
25V TMK316 BJ225L B/X5R*12.2 ±10, ±20 3.5 1.6±0.2 R 200%
TMK316 BJ475L B/X5R 4.7 ±10, ±20 5 1.6±0.2 R 150%
TMK316 BJ106L X5R*110 ±10, ±20 5 1.6±0.2 R 150%
16V EMK316 BJ225L B/X5R*12.2 ±10, ±20 3.5 1.6±0.2 R/W 200%
EMK316 BJ475L B/X5R 4.7 ±10, ±20 5 1.6±0.2 R 200%
EMK316 BJ106L B/X5R*110 ±10, ±20 5 1.6±0.2 R 150%
EMK316 BJ226ML EMK316ABJ226ML B/X5R 22 ±20 10 1.6±0.2 R 150%
10V LMK316 BJ106L B/X5R*110 ±10, ±20 5 1.6±0.2 R 200%
LMK316 BJ226ML LMK316ABJ226ML B/X5R 22 ±20 10 1.6±0.2 R 150%
LMK316 BJ476ML LMK316ABJ476ML X5R 47 ±20 10 1.6±0.2 R 150%
6.3V JMK316 BJ106L B/X5R*110 ±10, ±20 5 1.6±0.2 R 200%
JMK316 BJ226L JMK316ABJ226L B/X5R 22 ±10, ±20 10 1.6±0.2 R 200%
JMK316 BJ476ML JMK316ABJ476ML X5R 47 ±20 10 1.6±0.2 R 200%
JMK316 BJ107ML JMK316ABJ107ML X5R 100 ±20 10 1.6±0.2 R 150%
4V AMK316 BJ107ML AMK316ABJ107ML X5R 100 ±20 10 1.6±0.2 R 150%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212AB7104D X7R 0.1 ±10, ±20 10 0.85±0.1 R 150%
UMK212AB7224D X7R 0.22 ±10, ±20 10 0.85±0.1 R 150%
UMK212AB7474D X7R 0.47 ±10, ±20 10 0.85±0.1 R 150%
UMK212AB7105D X7R 1 ±10, ±20 10 0.85±0.1 R 150%
25V TMK212AB7225D X7R 2.2 ±10, ±20 10 0.85±0.1 R 150% R
16V EMK212 B7474D X7R 0.47 ±10, ±20 3.5 0.85±0.1 R/W 200%
EMK212 B7105D X7R 1 ±10, ±20 5 0.85±0.1 R 200%
EMK212 B7225D EMK212AB7225D X7R 2.2 ±10, ±20 5 0.85±0.1 R 150%
10V LMK212 B7105D X7R 1 ±10, ±20 3.5 0.85±0.1 R 200%
LMK212 B7225D LMK212AB7225D X7R 2.2 ±10, ±20 5 0.85±0.1 R 200%
LMK212 B7475D LMK212AB7475D X7R 4.7 ±10, ±20 10 0.85±0.1 R 150% R
Capacitance tolerance code is applied to of part number.
Temperature Characteristic FY5V
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212 F474ZG F/Y5V 0.47 80/20 7 1.25±0.1 R/W 200%
UMK212 F105ZG F/Y5V 1 80/20 7 1.25±0.1 R/W 200%
16V EMK212 F225ZG F/Y5V 2.2 80/20 7 1.25±0.1 R/W 200%
10V LMK212 F475ZG F/Y5V 4.7 80/20 9 1.25±0.1 R 200%
LMK212 F106ZG F/Y5V 10 80/20 16 1.25±0.1 R 200%
6.3V JMK212 F106ZG F/Y5V 10 80/20 16 1.25±0.1 R 200%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK212 F224ZD F/Y5V 0.22 80/20 7 0.85±0.1 R/W 200%
10V LMK212 F225ZD F/Y5V 2.2 80/20 9 0.85±0.1 R 200%
6.3V JMK212 F475ZD F/Y5V 4.7 80/20 16 0.85±0.1 R 200%
12
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK316 BJ105D B/X5R 1 ±10, ±20 3.5 0.85±0.1 R 150%
UMK316 BJ225D B/X5R 2.2 ±10, ±20 3.5 0.85±0.1 R 150%
UMK316 BJ475D UMK316ABJ475D X5R 4.7 ±10, ±20 10 0.85±0.1 R 150% D
25V TMK316 BJ105D B/X5R 1 ±10, ±20 3.5 0.85±0.1 R 200%
TMK316 BJ225D B/X5R 2.2 ±10, ±20 3.5 0.85±0.1 R 150%
TMK316 BJ475D X5R 4.7 ±10, ±20 5 0.85±0.1 R 150%
TMK316 BJ106D TMK316ABJ106D X5R 10 ±10, ±20 10 0.85±0.1 R 150% D
16V EMK316 BJ225D B/X5R 2.2 ±10, ±20 3.5 0.85±0.1 R 200%
EMK316 BJ475D B/X5R 4.7 ±10, ±20 5 0.85±0.1 R 200%
EMK316 BJ106D X5R 10±10, ±20 10 0.85±0.1 R 150%
EMK316 BJ226MD EMK316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150% D
10V LMK316 BJ475D B/X5R 4.7 ±10, ±20 5 0.85±0.1 R 200%
LMK316 BJ106DB/X5R 10 ±10, ±20 10 0.85±0.1 R 200%
LMK316 BJ226MD LMK316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150%
6.3V JMK316 BJ106D B/X5R 10 ±10, ±20 10 0.85±0.1 R 200%
JMK316 BJ226MD JMK316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150%
JMK316 BJ476MD JMK316ABJ476MD X5R 47 ±20 10 0.85±0.1 R 150%
Capacitance tolerance code is applied to of part number.
Temperature Characteristic B7X7R
1.6mm thicknessL
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK316 B7224L X7R 0.22 ±10, ±20 2.5 1.6±0.2 R/W 200%
UMK316 B7474L X7R 0.47 ±10, ±20 3.5 1.6±0.2 R/W 200%
UMK316 B7105L X7R 1 ±10, ±20 3.5 1.6±0.2 R 200%
UMK316 B7225L X7R 2.2 ±10, ±20 10 1.6±0.2 R 150%
UMK316 B7475L UMK316AB7475L X7R 4.7 ±10, ±20 10 1.6±0.2 R 150% D
25V TMK316 B7105L X7R 1 ±10, ±20 3.5 1.6±0.2 R/W 200%
TMK316 B7225L X7R 2.2 ±10, ±20 3.5 1.6±0.2 R 200%
TMK316 B7475L TMK316AB7475L X7R 4.7 ±10, ±20 10 1.6±0.2 R 200% D
TMK316 B7106L TMK316AB7106L X7R 10 ±10, ±20 10 1.6±0.2 R 150% D
16V EMK316 B7225L X7R 2.2 ±10, ±20 3.5 1.6±0.2 R/W 200%
EMK316 B7106L EMK316AB7106L X7R 10 ±10, ±20 10 1.6±0.2 R 200% D
10V LMK316 B7225L X7R 2.2 ±10, ±20 3.5 1.6±0.2 R/W 200%
LMK316 B7475L X7R 4.7 ±10, ±20 5 1.6±0.2 R 200%
LMK316 B7106L LMK316AB7106L X7R 10 ±10, ±20 10 1.6±0.2 R 200% D
LMK316 B7226ML LMK316AB7226ML X7R 22 ±20 10 1.6±0.2 R 150% R
6.3V JMK316 B7106L X7R 10±10, ±20 5 1.6±0.2 R 200%
Capacitance tolerance code is applied to of part number.
Temperature Characteristic FF/Y5V
1.6mm thicknessL
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
35V GMK316 F106ZL F/Y5V 10 80/20 9 1.6±0.2 R 200%
25V TMK316 F106ZL F/Y5V 10 80/20 9 1.6±0.2 R 200%
16V EMK316 F106ZL F/Y5V 10 80/20 9 1.6±0.2 R 200%
10V LMK316 F226ZL F/Y5V 22 80/20 16 1.6±0.2 R 200%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK316 B7225D X7R 2.2 ±10, ±20 10 0.85±0.1 R 150%
25V TMK316AB7475D X7R 4.7 ±10, ±20 10 0.85±0.1 R 150%
10V LMK316AB7106MD X7R 10 ±20 10 0.85±0.1 R 150%
Capacitance tolerance code is applied to of part number.
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK316 F225ZG F/Y5V 2.2 80/20 7 1.25±0.1 R/W 200%
35V GMK316 F475ZG F/Y5V 4.7 80/20 7 1.25±0.1 R 200%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
10V LMK316 F475ZD F/Y5V 4.7 80/20 9 0.85±0.1 R 200%
6.3V JMK316 F106ZD F/Y5V 10 80/20 16 0.85±0.1 R 200%
CAPACITORS
13
1
2
mlcc01_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
325Type
Temperature Characteristic BJB/X5R
2.5mm thicknessM
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK325 BJ475MM X5R 4.7 ±20 5 2.5±0.2 R 150%
UMK325 BJ106MM X5R 10±20 5 2.5±0.2 R 150%
25V TMK325 BJ106MM B/X5R*110 ±20 3.5 2.5±0.2 R 150%
16V EMK325 BJ226MM B/X5R 22 ±20 5 2.5±0.2 R 150%
EMK325 BJ476MM X5R 47±20 10 2.5±0.2 R 150%
10V LMK325 BJ226MM B/X5R 22 ±20 5 2.5±0.2 R 200%
LMK325 BJ476MM X5R 47±20 10 2.5±0.2 R 150%
LMK325 BJ107MM LMK325ABJ107MM X5R 100 ±20 10 2.5±0.3 R 150%
6.3V JMK325 BJ476MM X5R 47±20 10 2.5±0.2 R 150%
JMK325 BJ107MM JMK325ABJ107MM X5R 100 ±20 10 2.5±0.3 R 150%
1.9mm thicknessY, N
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK325 BJ475MN X5R 4.7 ±20 10 1.9±0.2 R 150%
35V GMK325 BJ225MN B/X5R 2.2 ±20 3.5 1.9±0.2 R 200%
GMK325 BJ475MN X5R 4.7 ±20 10 1.9±0.2 R 150%
GMK325 BJ106MN B/X5R 10 ±20 5 1.9±0.2 R 150%
25V TMK325 BJ335MN B/X5R*13.3 ±20 3.5 1.9±0.2 R 200%
TMK325 BJ475MN B/X5R*14.7 ±20 3.5 1.9±0.2 R 200%
TMK325 BJ106MN B/X5R 10 ±20 5 1.9±0.2 R 200%
16V EMK325 BJ475MN B/X5R*14.7 ±20 3.5 1.9±0.2 R 200%
EMK325 BJ106MN B/X5R 10 ±20 3.5 1.9±0.2 R 200%
EMK325 BJ476MY X5R 47±20 10 1.90.1/0.2 R 150%
10V LMK325 BJ226MY B/X5R 22 ±20 5 1.90.1/0.2 R 150%
LMK325 BJ106MN B/X5R*110 ±20 3.5 1.9±0.2 R 200%
6.3V JMK325 BJ226MY B/X5R 22 ±20 5 1.90.1/0.2 R 200%
JMK325 BJ107MY X5R 100 ±20 10 1.90.1/0.2 R 150%
JMK325 BJ476MN X5R 47±20 10 1.9±0.2 R 150%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
25V TMK325 BJ106MD B/X5R 10 ±20 5 0.85±0.1 R 150%
16V EMK325 BJ106MD B/X5R 10 ±20 5 0.85±0.1 R 150%
EMK325 BJ226MD B/X5R 22 ±20 10 0.85±0.1 R 150%
10V LMK325 BJ335MD B/X5R 3.3 ±20 3.5 0.85±0.1 R 200%
LMK325 BJ475MD B/X5R 4.7 ±20 5 0.85±0.1 R 200%
LMK325 BJ106MD B/X5R 10 ±20 5 0.85±0.1 R 150%
*1 We may provide X7R for some itemes according to the individual specification.
Temperature Characteristic B7X7R
2.5mm thicknessM
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK325 B7475MM X7R 4.7 ±20 5 2.5±0.2 R 150%
UMK325AB7106MM X7R 10 ±20 10 2.5±0.3 R 150%
25V TMK325 B7226MM X7R 22±20 10 2.5±0.2 R 150% R
TMK325AB7106MM X7R 10 ±20% 10 2.5±0.3 R 150%
16V EMK325 B7226MM X7R 22±20 10 2.5±0.2 R 150% R
10V LMK325 B7476MM X7R 47±20 10 2.5±0.2 R 150% R
6.3V JMK325 B7476MM X7R 47±20 10 2.5±0.2 R 200% R
1.9mm thicknessN
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
50V UMK325 B7475MN X7R 4.7 ±20 10 1.9±0.2 R 150% R
25V TMK325 B7335MN X7R 3.3 ±20 3.5 1.9±0.2 R 200%
TMK325 B7475MN X7R 4.7 ±20 3.5 1.9±0.2 R 150%
TMK325 B7106MN X7R 10±20 10 1.9±0.2 R 150% R
16V EMK325 B7475MN X7R 4.7 ±20 3.5 1.9±0.2 R 200%
EMK325 B7106MN X7R 10±20 3.5 1.9±0.2 R 150%
10V LMK325 B7106MN X7R 10±20 3.5 1.9±0.2 R 200%
Temperature Characteristic FF/Y5V
1.9mm thicknessN
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
〔μF
Capacitance
tolerance
%
tanδ
%Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1Note
% Rated
voltage
16V EMK325 F226ZN F/Y5V 22 80/20 16 1.9±0.2 R 200%
10V LMK325 F226ZN F/Y5V 22 80/20 16 1.9±0.2 R 200%
6.3V JMK325 F476ZN F/Y5V 47 80/20 16 1.9±0.2 R 200%
14
1
2
mlcc01_e-01
ELECTRICAL CHARACTERISTICS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Example of Impedance ESR vs. Frequency characteristics
Taiyo Yuden multilayer ceramic capacitor
TMK107 BJ105KA
AMK107BBJ226MA
AMK107 BJ226MA
JMK107ABJ106MA
JMK107 BJ106MA
TMK212BBJ106MG
JMK316ABJ476ML
JMK316 BJ476ML
TMK316 BJ106KL
JMK212ABJ226MG
JMK212 BJ226MG
JMK316ABJ107ML
JMK316 BJ107ML
EMK325 BJ476MY
GMK325 BJ106MN
JMK325 BJ107MY
UMK212 F224ZD
UMK212 F105ZG
LMK212 F106ZG
UMK316 F225ZG
GMK316 F106ZL
LMK107 F105ZA
LMK107 F225ZA
UMK107 F104ZA
LMK316 F226ZL
JMK325 F476ZN
CAPACITORS
15
1
2
mlcc01_e-01
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
2
mlcc_pack-P1 mlcc_pack_e-01
PACKAGING
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Taped package
Minimum Quantity
Taping material
No bottom tape for pressed carrier tape
Representative taping dimensions
 ◦Paper Tape8mm wide
 Pressed carrier tape 2mm pitch
T1
0.1/−0
Paper tape
Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
MK107
WK107 1.0 1.8
4.0±0.1
1.1max.
2K110 1.15 1.55 1.0max.
MK212
WK212 1.65 2.4 1.1max.4K212
2K212
MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
2K096 0.72 1.02 52.0±0.05 0.6max.
MK105
VK105 0.65 1.15 0.8max.
0.1/−0
0.1/−0
Punched carrier tape 4mm pitch
NoteTaping size might be different depending on the size of the product.
Punched carrier tape 2mm pitch
Chip filled
Type Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
MK042
0.2 C,D 40000
MK063 0.3 P,T 15000
2K096 0.3 P 100000.45 K
WK105 0.3 P
MK105 0.2 C 20000
0.3 P 15000
0.5 V, W 10000
VK105 0.5 W
MK107
WK107
0.45 K 4000
0.5 V 4000
0.8 A
4000
2K110 0.5 V
0.6 B
0.8 A
MK212
WK212
0.45 K
0.85 D
1.25 G 3000
4K212 0.85 D 4000 2K212 0.85 D
MK316
0.85 D
1.15 F 3000
1.25 G
1.6 L
2000
MK325
0.85 D
1.15 F
1.9 N
2.0max Y
2.5 M
500T, 1000P
MK432 2.5 M 500
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
T1
MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.2K096 0.65 1.02
WK105 0.65 1.15MK105*1C0.4max. 0.3max.
MK105*1P0.45max. 0.42max.
*1 Thickness, C0.2mmP0.3mm
1
2
mlcc_pack-P2
mlcc_pack_e-01
PACKAGING
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Embossed tape8mm wide
Embossed tape12mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
MK212 1.65 2.4 3.4max. 0.6max.MK316 2.0 3.6
MK325 2.8 3.6
Trailer and Leader
Reel size
Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
0.1/−0
0.1/−0
2.0±0.1 F
360/0.2
110±0.7
12±0.1
0.2/0
0/0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.00/0.1 2.00/0.1 1.50.1/0
Unitmm
Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
2.0±0.04
Embossed tape4mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unitmm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
1
2
mlcc_reli-R1 mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
7. Q or Dissipation Factor
Specified
Value
Temperature Compensating
Class 1Standard C30 pFQ40020CC30 pFQ1000 CNominal capacitance
High Frequency Type Refer to detailed specification
High PermittivityClass 2 Note 1 BJ, B7, C6,C72.5 max., F7 max.
Test Methods and Remarks
High Frequency Type
Measuring equipment: HP4291A
Measuring jig: HP16192A
Class 1 Class 2
Standard High Frequency Type C10μF C10μF
Preconditioning None Thermal treatment at 150 for 1hr Note 2
Measuring frequency 1Hz±101GHz 1Hz±10120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
6. Capacitance Tolerance
Specified
Value
Temperature Compensating
Class 1
StandardC
U
0.5pFC5pF±0.25pF
0.5pF<C10pF±0.5pF
C10pF±5%  
RH
S
T
0.5pFC2pF±0.1pF
C2pF±5%
High Frequency Type CH
RH 0.5pFC2pF±0.1pF
C2pF±5%
High Permittivity Class 2BJ, B7, C6,C7±10 or ±20, F2080
Test Methods and RemarksClass 1 Class 2
Standard High Frequency Type C10μF C10μF
Preconditioning None Thermal treatment at 150 for 1hr Note 2
Measuring frequency 1Hz±101Hz±10120±10Hz
Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms
Bias application None
5. Insulation Resistance
Specified
Value
Temperature Compensating
Class 1Standard10000 MΩ min.
High Frequency Type
High Permittivity Class 2 Note 1 C0.047μF : 10000 MΩ min.
C0.047μF : 500MΩμF
Test Methods and Remarks
Applied voltage: Rated voltage
Duration: 60±5 sec.
Charge/discharge current: 50mA max.
4. Withstanding VoltageBetween terminals
Specified
Value
Temperature Compensating
Class 1StandardNo breakdown or damage
High Frequency Type
High PermittivityClass 2
Test Methods and Remarks
Class 1 Class 2
Applied voltage Rated voltage×3 Rated voltage×2.5
Duration 1 to 5 sec.
Charge/discharge current 50mA max.
3. Rated Voltage
Specified
Value
Temperature Compensating
Class 1Standard 50VDC, 25VDC, 16VDC
High Frequency Type 50VDC, 16VDC
High Permittivity Class 250VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC
2. Storage Conditions
Specified
Value
Temperature Compensating
Class 1Standard55 to 125
High Frequency Type
High Permittivity Class 2
Specification Temperature Range
BJ B25 to 85
X5R 55 to 85
B7 X7R 55 to 125
C6 X6S 55 to 105
C7 X7S 55 to 125
FF25 to 85
Y5V 30 to 85
1.Operating Temperature Range
Specified
Value
Temperature Compensating
Class 1Standard55 to 125
High Frequency Type
High Permittivity Class 2
Specification Temperature Range
BJ B25 to 85
X5R 55 to 85
B7 X7R 55 to 125
C6 X6S 55 to 105
C7 X7S 55 to 125
FF25 to 85
Y5V 30 to 85
Multilayer Ceramic Capacitors Super Low Distortion Multilayer Ceramic Capacitors and Medium-High
Voltage Multilayer Ceramic Capacitors are noted separately.
1
2
mlcc_reli-R2
mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
8. Temperature CharacteristicWithout voltage application
Specified
Value
Temperature Compensating
Class 1
StandardTemperature Characteristic ppm/ Tolerance
C 0 CH, CJ, CK
H±60
J±120
K±250
R 220 RH
S 330 SH, SJ, SK
T 470 TJ, TK
U 750 UJ, UK
SL 350 to 1000
High Frequency Type
High Permittivity Class 2
Specification Capacitance change Reference temperature Temperature Range
BJ B±1020 25 to 85
X5R ±1525 55 to 85
B7 X7R ±1525 55 to 125
C6 X6S ±2225 55 to 105
C7 X7S ±2225 55 to 125
FF30/8020 25 to 85
Y5V 22/8225 30 to 85
Test Methods and Remarks
Class 1
Capacitance at 20 and 85 shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
C85C20 × 106
ppm/
C20×T           △T65
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
CC2 ×100(%
C2
C Capacitance in Step 1 or Step 3
C2 Capacitance in Step 2
Step BF X5RX7RX6SX7SY5V
1 Minimum operating temperature
2 2025
3 Maximum operating temperature
9. Deflection
Specified
Value
Temperature Compensating
Class 1
Standard Appearance : No abnormality
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
High Frequency Type Appearance : No abnormality
Capacitance change : Within±0.5 pF
High Permittivity Class 2Appearance : No abnormality
Capacitance change : Within ±12.5%BJ, B7, C6, C7, Within ±30%F
Test Methods and Remarks
Multilayer Ceramic Capacitors Board Thickness Warp Duration
042063 Type glass epoxy-resin substrate 0.8mm 1mm 10 sec.
The other types 1.6mm
Array Type
Board Thickness Warp Duration
096110212 Type glass epoxy-resin substrate 1.6mm 1mm 10 sec.
Board Warp
Capacitance measurement shall
be conducted with the board bent
10. Body Strength
Specified
Value
Temperature Compensating
Class 1Standard
High Frequency Type No mechanical damage.
High Permittivity Class 2
Test Methods and Remarks
High Frequency Type
Applied force: 5N
Duration: 10 sec.
A
A
A
11. Adhesive Strength of Terminal Electrodes
Specified
Value
Temperature Compensating
Class 1StandardNo terminal separation or its indication.High Frequency Type
High Permittivity Class 2
Test Methods and Remarks
Multilayer Ceramic Capacitors Array Type
Applied force Duration
042063 Type 2N 30±5 sec.
105 Type or more 5N
Applied force Duration
096 Type 2N 30±5 sec.
110212 Type 5N
12. Solderability
Specified
Value
Temperature Compensating
Class 1StandardAt least 95% of terminal electrode is covered by new solder.High Frequency Type
High Permittivity Class 2
Test Methods and Remarks
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±54±1 sec.
Lead-free solder Sn-3.0Ag0.5Cu 245±3
1
2
mlcc_reli-R3 mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
13. Resistance to Soldering
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±2.5%
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% BJ, B7, C6, C7
Within ±20% F
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
Test Methods and Remarks
Class 1
042, 063 Type 105 Type
Array096, 110 Type
Preconditioning None
Preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min.
150 to 200, 2 to 5 min.
Solder temp. 270±5
Duration 3±0.5 sec.
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2
042063 Type 105, 107, 212 Type
Array096, 110,212 Type 316, 325 Type
Preconditioning Thermal treatment at 150 for 1 hr Note 2
Preheating 150, 1 to 2 min. 80 to 100, 2 to 5 min.
150 to 200, 2 to 5 min. 80 to 100, 5 to 10 min.
150 to 200, 5 to 10 min.
Solder temp. 270±5
Duration 3±0.5 sec.
Recovery 24±2 hrs Standard condition Note 5
14. Temperature Cycle (Thermal Shock
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±2.5% or ±0.25pF, whichever is larger.
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Frequency Type
Appearance: No abnormality
Capacitance change: Within ±0.25pF
Q: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±7.5% BJ, B7, C6, C7
Within ±20% F
Dissipation factor: Initial value
Insulation resistance: Initial value
Withstanding voltage between terminals: No abnormality
Test Methods and Remarks
Class 1 Class 2
Preconditioning None Thermal treatment at 150 for 1 hr Note 2
1 cycle
Step Temperature(℃) Timemin.
1 Lowest operating temperature 0/3 30±3
2 Normal temperature 2 to 3
3 Highest operating temperature 0/3 30±3
4 Normal temperature 2 to 3
Number of cycles 5 times
Recovery 6 to 24 hrs Standard condition Note 5 24±2 hrs Standard condition Note 5
15. Humidity Steady State
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±5% or ±0.5pF, whichever is larger.
Q C10pF Q20010C 
10C30pF Q2752.5C
C30pF Q350 CNominal capacitance
Insulation resistance: 1000 MΩ min.
High Frequency Type Appearance: No abnormality
Capacitance change: Within ±0.5pF,
Insulation resistance: 1000 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max. BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 50 MΩ
μF or 1000 MΩ whichever is smaller.
Test Methods and Remarks
Class 1 Standard High Frequency Type
Preconditioning None
Temperature 40±260±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2 All items
Preconditioning Thermal treatment at 150 for 1 hr Note 2
Temperature 40±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Recovery 24±2 hrs Standard condition Note 5
1
2
mlcc_reli-R4
mlcc_reli_e-01
RELIABILITY DATA
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
16. Humidity Loading
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±7.5% or ±0.75pF, whichever is larger.
Q C30pFQ10010C/3
C30pFQ200 CNominal capacitance
Insulation resistance: 500 MΩ min.
High Frequency Type
Appearance: No abnormality
Capacitance change: C2pFWithin ±0.4 pF
C2pFWithin ±0.75 pF CNominal capacitance
Insulation resistance: 500 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5% BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max. BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 25 MΩμF or 500 MΩ, whichever is smaller.
Test Methods and Remarks
Class 1 Standard High Frequency Type
Preconditioning None
Temperature 40±260±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 6 to 24 hrs Standard condition Note 5  
Class 2 All items
Preconditioning Voltage treatment
Rated voltage are applied for 1 hour at 40 Note 3
Temperature 40±2
Humidity 90 to 95RH
Duration 50024/0 hrs
Applied voltage Rated voltage
Charge/discharge current 50mA max.
Recovery 24±2 hrs Standard condition Note 5
17. High Temperature Loading
Specified
Value
Temperature Compensating
Class 1
Standard
Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Q C10pF Q20010C
10C30pF Q2752.5C
C30pF Q350 CNominal capacitance
Insulation resistance: 1000 MΩ min.
High Frequency Type Appearance: No abnormality
Capacitance change: Within ±3% or ±0.3pF, whichever is larger.
Insulation resistance: 1000 MΩ min.
High Permittivity Class 2 Note 1
Appearance: No abnormality
Capacitance change: Within ±12.5%BJ, B7, C6, C7
Within ±30%F
Dissipation factor 5.0% max.BJ, B7, C6, C7
11.0% max.F
Insulation resistance: 50 MΩμF or 1000 MΩ, whichever is smaller.
Test Methods and Remarks
Class 1 Standard High Frequency Type
Preconditioning None
Temperature 125±3
Duration 100048/0 hrs
Applied voltage Rated voltage×2
Charge/discharge current 50mA max.
Recovery 6 to 24hr Standard condition Note 5  
Class 2 BJ, F C6 B7, C7
Preconditioning Voltage treatment Twice the rated voltage shall be
applied for 1 hour at 85, 105 or 125 Note 3, 4
Temperature 85±2105±3125±3
Duration 100048/0 hrs
Applied voltage Rated voltage×2 Note 4
Charge/discharge current 50mA max.
Recovery 24±2 hrs Standard condition Note 5
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 1500/10 for an hour and kept at room temperature for 24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
Operating Voltage Verification of Rated voltage
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
Pattern configurations Design of Land-patterns
1. When capacitors are mounted on PCBs, the amount of solder used size of fillet can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
Pattern configurationsCapacitor layout on PCBs
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
Pattern configurations Design of Land-patterns
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
1Recommended land dimensions for typical chip capacitors
Multilayer Ceramic Capacitors : Recommended land dimensions unit: mm
 Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
NoteRecommended land size might be different according to the allowance of the size of the product.
LWDC: Recommended land dimensions for reflow-solderingunit: mm
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
Array type: Recommended land dimensions for reflow-soldering unit: mm
2 circuits 4 circuits
Type 0962 circuits1102 circuits2122 circuits2124 circuits
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
2Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
1
2
mlcc_prec-P2
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
Pattern configurationsCapacitor layout on PCBs
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
1 The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
2 The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
3 To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
1Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
2The recommended amount of adhesives is as follows;
Recommended condition
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land   
1
2
mlcc_prec-P3 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
1Flux used shall be less than or equal to 0.1 wt% in CI equivalent of halogenated content. Flux having a strong acidity content shall not be applied.
2When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
3When water-soluble flux is used, special care shall be taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
Selection of Flux
1-1. When too much halogenated substance Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate fl ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
Soldering
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130.
Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100.
Reflow soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature(℃
0
100
200
300 230
Within 10 sec.
60sec.
Min.
60sec.
Min. Slow cooling
Preheating
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
The ideal condition is to have solder mass fillet controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Wave soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
Wave soldering must not be applied to capacitors designated as for reflow soldering only.
Hand soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec. Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
T
316type or less
T150
T
325type or more
T130
Caution
Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
The soldering iron shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g. to
remove soldering flux or other materials from the production process.
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties especially insulation resistance.
2. Inappropriate cleaning conditions insufficient or excessive cleaning may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
1If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
2Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature : Below 30
Humidity : Below 70% RH
The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
RCR-2335BSafety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEITA.
 Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.