CLC020
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CLC020 SMPTE 259M Digital Video Serializer with Integrated Cable Driver
Check for Samples: CLC020
1FEATURES DESCRIPTION
The CLC020 SMPTE 259M Digital Video Serializer
2• SMPTE 259M Serial Digital Video Standard with Integrated Cable Driver is a monolithic integrated
Compliant circuit that encodes, serializes and transmits bit-
• No External Serial Data Rate Setting or VCO parallel digital data conforming to SMPTE 125M and
Filtering Components Required(1) SMPTE 267M component video and SMPTE 244M
composite video standards. The CLC020 can also
• Built-In Self-Test (BIST) and Video Test Pattern serialize other 8 or 10-bit parallel data. The CLC020
Generator (TPG) with 16 Internal Patterns(1) operates at data rates from below 100 Mbps to over
• Supports All NTSC and PAL Standard 400 Mbps. The serial data clock frequency is
Component and Composite Serial Video Data internally generated and requires no external
Rates frequency setting components, trimming or filtering*.
• HCMOS/TTL-Compatible Data and Control Functions performed by the CLC020 include: parallel-
to-serial data conversion, data encoding using the
Inputs and Outputs polynomial (X9+X4+1), data format conversion from
• 75ΩECL-Compatible, Differential, Serial Cable- NRZ to NRZI, parallel data clock frequency
Driver Outputs multiplication and encoding with the serial data, and
• Fast VCO Lock Time: <75 µs coaxial cable driving. Input for sync (TRS) detection
disabling and a PLL lock detect output are provided.
• Single +5V TTL or −5V ECL Supply Operation The CLC020 has an exclusive built-in self-test (BIST)
• Low Power: 235 mW Typical and video test pattern generator (TPG) with 4
• 28-Lead PLCC Package component video test patterns, reference black, PLL
• Commercial Temperature Range 0°C to +70°C and EQ pathologicals and modified colour bars, in 4:3
and 16:9 raster and both NTSC and PAL formats*.
Separate power pins for the output driver, VCO and
APPLICATIONS the digital logic improve power supply rejection,
• SMPTE 259M Parallel-to-Serial Digital Video output jitter and noise performance.
Interfaces for: The CLC020 is the ideal complement to the
– Video Cameras CLC011B SMPTE 259M Serial Digital Video
– VTRs Decoder, CLC014 Active Cable Equalizer, CLC016
Data Retiming PLL (clock-data separator), CLC018
– Telecines 8X8 Digital Crosspoint Switch and CLC006 or
– Video Test Pattern Generators and Digital CLC007 Cable Drivers, for a complete parallel-serial-
Video Test Equipment parallel, high-speed data processing and
• Non-SMPTE Video Applications transmission system.
• Other High Data Rate Parallel/Serial Video and The CLC020 is powered from a single 5V supply.
Data Systems Power dissipation is typically 235 mW including two
75Ωback-matched output loads. The device is
packaged in a JEDEC 28-lead PLCC.
(1) Patents Applications Made or Pending.
TYPICAL APPLICATION
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CLC020
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)(2)
Supply Voltage (VDD−VSS) 6.0V
CMOS/TTL Input Voltage (VI)−0.5V to (VDD + 0.5V)
CMOS/TTL Output Voltage (VO)−0.5V to (VDD + 0.5V)
CMOS/TTL Input Current (single input) VI= VSS −0.5V −5 mA
VI= VDD +0.5V +5 mA
Input Current, Other Inputs ±1 mA
CMOS/TTL Output Source/Sink Current ±10 mA
SDO Output Source Current 20 mA
Package Thermal Resistance θJA 28-lead PLCC 85°C/W
θJC 28-lead PLCC 35°C/W
Storage Temp. Range −65°C to +150°C
Junction Temperature +150°C
Lead Temperature (Soldering 4 Sec) +260°C
ESD Rating (HBM) >2.5 kV
ESD Rating (MM) >200 V
Transistor Count 33,400
(1) Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage (VDD−VSS) 5.0V ±10%
CMOS/TTL Input Voltage VSS to VDD
PCLK Frequency Range 10 to 40MHz
PCLK Duty Cycle 45 to 55%
DNand PCLK Rise/Fall Time 1.0 to 3.0 ns
Maximum DC Bias on SDO pins 3.0V ±10%
Operating Free Air Temperature (TA) 0°C to +70°C
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DC ELECTRICAL CHARACTERISTICS
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
Symbol Parameter Conditions Reference Min Typ Max Units
VIH Input Voltage High Level D0 through D9, 2.0 VDD V
PCLK, TPG_EN
VIL Input Voltage Low Level VSS 0.8 V
and Sync.
IIH Input Current High Level VIH = VDD +40 +60 µA
Detect Enable
IIL Input Current Low Level VIL = VSS -1 -20 µA
VOH CMOS Output Voltage IOH =−10 mA Lock Detect, 2.4 4.7 VDD V
High Level Test Out
VOL CMOS Output Voltage Low IOL = +10 mA 0.0 0.3 VSS + 0.5V V
Level
VSDO Serial Driver Output RL= 75Ω1%, SDO, SDO 700 800 900 mVP-P
Voltage RREF = 1.69 kΩ1%,
See Figure 3
IDD Power Supply Current, RL= 75Ω1%, 47 60 mA
Total RREF = 1.69 kΩ1%,
PCLK = 27 MHz, See Figure 3,
NTSC Colour Bar Pattern
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VSS = 0V.
(2) Typical values are stated for VDD = +5.0V and TA= +25°C.
AC ELECTRICAL CHARACTERISTICS
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)
Symbol Parameter Conditions Reference Min Typ Max Units
BRSDO Serial data rate RL= 75Ω, AC coupled(2) SDO, SDO 100 400 Mbps
FPCLK Reference Clock PCLK 10 40 MHz
Input Frequency
Reference Clock Duty PCLK 45 50 55 %
Cycle
tr, tfRise time, Fall time 10%–90% DN, PCLK 1.0 1.5 3.0 ns
tjSerial output jitter 270 Mbps(3), See Figure 3 220 psP-P
tjit Serial output jitter See(4)(2) 100 200 psP-P
SDO, SDO
tr, tfRise time, Fall time 20%–80%(2)(4) 500 800 1500 ps
Output overshoot 1 %
tLOCK Lock time 270 Mbps(2)(5) 75 µs
tSU Setup time See Figure 4 DNto PCLK 3 2 ns
tHLD Hold time See Figure 4 DNfrom PCLK 1.5 1 ns
LGEN Output inductance See(4) 6 nH
SDO, SDO
RGEN Output resistance See(4) 25k Ω
(1) Typical values are stated for VDD = +5.0V and TA= +25°C.
(2) RL= 75Ω, AC-coupled @ 270 Mbps, RREF = 1.69 kΩ1%, See TEST LOADS and Figure 3.
(3) CLC020 mounted in the SD020EVK board, configured in BIST mode (NTSC color bars) with PCLK = 27MHz derived from Tektronix
TG2000 black-burst reference. Timing jitter measured with Tektronix VM700T using jitter measurement FFT mode, frame rate, 1kHz
filter bandwidth, Hanning window.
(4) Specification is ensured by design.
(5) Measured from rising-edge of first PCLK cycle until Lock Detect output goes high (true).
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TIMING DIAGRAM
Figure 4. Setup and Hold Timing
DEVICE OPERATION
The CLC020 SMPTE 259M Digital Video Serializer is used in digital video signal origination and processing
equipment: cameras, video tape recorders, telecines, video test equipment and others. It converts parallel
component or composite digital video signals into serial format. Logic levels within this equipment are normally
TTL-compatible as produced by CMOS or bipolar logic devices. The encoder outputs ECL-compatible serial
digital video (SDV) signals conforming to SMPTE 259M-1997. The CLC020 operates at all standard SMPTE and
ITU-R parallel data rates.
VIDEO DATA PROCESSING CIRCUITS
The input data register accepts 8 or 10-bit parallel data and clock signals having CMOS/TTL-compatible signal
levels. Parallel data may conform to any of several standards: SMPTE 125M, SMPTE 267M, SMPTE 244M or
ITU-R BT.601. If data is 8-bit, it is converted to a 10-bit representation according to the type of data being input:
component 4:2:2 per SMPTE 259M paragraph 7.1.1, composite NTSC per paragraph 8.1.1 or composite PAL
per paragraph 9.1.1. Output from this register feeds the SMPTE polynomial generator/serializer and sync
detector. All CMOS inputs including the PCLK input have internal pull-down devices.
The sync detector or TRS character detector accepts data from the input register. The detection function is
controlled by Sync Detect Enable, a low-true, TTL-compatible, external signal. Synchronization words, the timing
reference signals (TRS), start-of-active-video (SAV) and end-of-active-video (EAV) are defined in SMPTE 125M-
1995 and 244M. The sync detector supplies control signals to the SMPTE polynomial generator that identify the
presence of valid video data. The sync detector performs input TRS character LSB-clipping as prescribed in ITU-
R-BT.601. LSB-clipping causes all TRS characters with a value between 000h and 003h to be forced to 000h
and all TRS characters with a value between 3FCh and 3FFh to be forced to 3FFh. Clipping is done prior to
encoding.
The SMPTE polynomial generator accepts the parallel video data and encodes it using the polynomial X9+X4+1
as specified in SMPTE 259M–1997, paragraph 5 and Annex C. The scrambled data is then serialized for output.
The NRZ-to-NRZI converter accepts serial NRZ data from the SMPTE polynomial genertor and converts it to
NRZI using the polynomial X + 1 per SMPTE 259M–1997, paragraph 5.2 and Annex C. The transmission bit
order is LSB first, per paragraph 6. The converter's output feeds the output driver amplifier.
PHASE-LOCKED LOOP AND VCO
The phase-locked loop (PLL) system generates the output serial data clock at 10× the parallel data clock
frequency. This system consists of a VCO, divider chain, phase-frequency detector and internal loop filter. The
VCO free-running frequency is internally set. The PLL automatically generates the appropriate frequency for the
serial clock rate using the parallel data clock (PCLK) frequency as its reference. Loop filtering is internal to the
CLC020. The VCO has separate VSSO and VDDO power supply feeds, pins 15 and 16, which may be supplied
power independently via an external low-pass filter, if desired. The PLL acquisition (lock) time is less than 75 µs
@ 270 Mbps.
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VDDmin
VSS
VSS 10%
PCLK
VDD
30Ps min
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LOCK DETECT
The Lock Detect output of the phase-frequency detector indicates the PLL lock condition. It is a logic HIGH
when the loop is locked. The output is CMOS/TTL-compatible and is suitable for driving other CMOS devices or
a LED indicator.
SERIAL DATA OUTPUT BUFFER
The current-mode serial data outputs provide low-skew complimentary or differential signals. The output buffer
design can drive 75Ωcoaxial cables (AC-coupled) or 10k/100k ECL/PECL-compatible devices (DC-coupled).
Output levels are 800 mVP-P ±10% into 75ΩAC-coupled, back-matched loads. The output level is 400 mVP-P
±10% when DC-coupled into 75Ω(See APPLICATION INFORMATION for details). The 75Ωresistors connected
to the SDO outputs are back-matching resistors. No series back-matching resistors should be used. SDO output
levels are controlled by the value of RREF connected to pin 19. The value of RREF is normally 1.69 kΩ, ±1%. The
output buffer is static when the device is in an out-of-lock condition. Separate VSSSD and VDDSD power feeds, pins
21 and 24, are provided for the serial output driver.
POWER-ON RESET
The CLC020 has an internally controlled, automatic, power-on reset circuit. This circuit clears TRS detection
circuitry, all latches, registers, counters and polynomial generators and disables the serial output. The SDO
outputs are tri-stated during power-on reset. The part will remain in the reset condition until the parallel input
clock is applied.
It is recommended that PCLK not be asserted until at least 30 µs after power has reached VDDmin. See Figure 5.
Figure 5. Power-On Reset Sequence
BUILT-IN SELF-TEST (BIST)
The CLC020 has a built-in self-test (BIST) function. The BIST performs a comprehensive go-no-go test of the
device. The test uses either a full-field color bar for NTSC or a PLL pathological for PAL as the test data pattern.
Data is input internally to the input data register, processed through the device and tested for errors. Table 1
gives device pin functions and Table 2 gives the test pattern codes used for this function. The signal level at
Test_Output, pin 26, indicates a pass or fail condition.
The BIST is initiated by applying the code for the desired BIST to D0 throught D3 (D9 through D4 are 00h) and a
27 MHz clock at the PCLK input. Since all parallel data inputs are equipped with an internal pull-down device, only
those inputs D0 through D3 which require a logic-1 need be pulled high. After the Lock_Detect output goes high
(true) indicating the VCO is locked on frequency, TPG_Enable, pin 17, is then taken to a logic high. TPG_Enable
may be temporarily connected to the Lock_Detect output to automate BIST operation. Test_Output, pin 26, is
monitored for a pass/fail indication. If no errors have been detected, this output will go to a logic high level
approximately 2 field intervals after TPG_Enable is taken high. If errors have been detected in the internal
circuitry of the CLC020, Test_Output will remain low until the test is terminated. The BIST is terminated by taking
TPG_Enable to a logic low. Continuous serial data output is available during the test.
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TEST PATTERN GENERATOR
The CLC020 features an on-board test pattern generator (TPG). Four full-field component video test patterns
for both NTSC and PAL standards, and 4x3 and 16x9 raster sizes are produced. The test patterns are: flat-field
black, PLL pathological, equalizer (EQ) pathological and a modified 75%, 8-color vertical bar pattern. The
pathologicals follow recommendations contained in SMPTE RP 178–1996 regarding the test data used. The
color bar pattern does not incorporate bandwidth limiting coding in the chroma and luma data when transitioning
between the bars. For this reason, it may not be suitable for use as a visual test pattern or for input to video D-to-
A conversion devices unless measures are taken to restrict the production of out-of-band frequency components.
The TPG is operated by applying the code for the desired test pattern to D0 through D3 (D4 through D9 are
00h). Since all parallel data inputs are equipped with an internal pull-down device, only those inputs D0 through
D3 which require a logic-1 need be pulled high. Next, apply a 27 or 36 MHz signal, appropriate to the raster size
desired, at the PCLK input and wait until the Lock_Detect output goes true indicating the VCO is locked on-
frequency. Then, take TPG_Enable, pin 17, to a logic high. The serial test pattern data appears on the SDO
outputs. TPG_Enable may be temporarily connected to the Lock_Detect output to automate TPG operation. The
TPG mode is exited by taking TPG_Enable to a logic low. Table 1 gives device pin functions for this mode.
Table 2 gives the available test patterns and selection codes.
Figure 6. Built-In Self-Test Control Sequence
Figure 7. Test Pattern Generator Control Sequence
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Table 1. BIST and Test Pattern Generator Control
Functions
Pin Name Function
3 D0 TPG code input LSB
4 D1 TPG code input
5 D2 TPG code input
6 D3 TPG code input MSB
17 TPG_EN TPG Enable, active high true
26 Test_Out BIST Pass/Fail output. Pass=High (See text
for timing requirements)
Table 2. Component Video Test Pattern Selection(1)
Standard Frame Test Pattern D3 D2 D1 D0
NTSC 4x3 Flat-field black 0 0 0 0
NTSC 4x3 PLL pathological 0 0 0 1
NTSC 4x3 EQ pathological 0 0 1 0
NTSC 4x3 Color bars, 75%, 8-bars (modified, see text), BIST 0 0 1 1
PAL 4x3 Flat-field black 0 1 0 0
PAL 4x3 PLL pathological, BIST 0 1 0 1
PAL 4x3 EQ pathological 0 1 1 0
PAL 4x3 Color bars, 75%, 8-bars (modified, see text) 0 1 1 1
NTSC 16x9 Flat-field black 1 0 0 0
NTSC 16x9 PLL pathological 1 0 0 1
NTSC 16x9 EQ pathological 1 0 1 0
NTSC 16x9 Color bars, 75%, 8-bars (modified, see text) 1 0 1 1
PAL 16x9 Flat-field black 1 1 0 0
PAL 16x9 PLL pathological 1 1 0 1
PAL 16x9 EQ pathological 1 1 1 0
PAL 16x9 Color bars, 75%, 8-bars (modified, see text) 1 1 1 1
(1) D9 through D4 = 0 (binary)
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PIN DESCRIPTIONS(1)
Pin # Name Description
1 VDD Positive power supply input (digital logic)
2 VDD Positive power supply input (digital logic)
3 D0 Parallel data input/Test pattern select (LSB)
4 D1 Parallel data input/Test pattern select
5 D2 Parallel data input/Test pattern select
6 D3 Parallel data input/Test pattern select (MSB)
7 D4 Parallel data input
8 D5 Parallel data input
9 D6 Parallel data input
10 D7 Parallel data input
11 D8 Parallel data input
12 D9 Parallel data input
13 PCLK Parallel clock input
14 Lock Detect VCO Lock Detect output (high-true)
15 VSSO Negative power supply input (PLL supply)
16 VDDO Positive power supply input (PLL supply)
17 TPG_EN Test Pattern Generator (TPG) Enable input (high-true)
18 VSSOD Negative power supply input (PLL digital supply)
19 RREF Output driver level control
20 VDDOD Positive power supply input (PLL digital supply)
21 VSSSD Negative power supply input (Output driver)
22 SDO Serial data true output
23 SDO Serial data complement output
24 VDDSD Positive power supply input (Output driver)
25 Sync Detect Enable Parallel data sync detection enable input (low true)
26 Test_Out BIST Pass/Fail output
27 VSS Negative power supply input (digital logic)
28 VSS Negative power supply input (digital logic)
(1) All CMOS/TTL inputs have internal pull-down devices.
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APPLICATION INFORMATION
A typical application circuit for the CLC020 is shown in Figure 8. This circuit demonstrates the capabilities of the
CLC020 and allows its evaluation in a variety of configurations. An assembled demonstration board with more
comprehensive evaluation options is available, part number SD020EVK. The board may be ordered through any
of Texas Instruments's sales offices. Complete circuit board layouts and schematics, for the SD020EVK are
available on Texas Instruments' WEB site in the application information for this device.
APPLICATION CIRCUIT
Figure 8. Typical Application Circuit
Several different input and output drive and loading options can be constructed on the SD020EVK application
circuit board, Figure 9. Pin headers are provided for input cabling and control signal access. The appropriate
value resistor packs, 220 and 330Ωfor TTL or 50Ωfor signal sources requiring such loading, should be installed
at RP1-4 before applying input signals.
The board's outputs may be DC interfaced to PECL inputs by first installing 124Ωresistors at R1B and R2B,
changing R1A and R2A to 187Ωand replacing C1 and C2 with short circuits. The PECL inputs should be directly
connected to J1 and J2 without cabling. If 75Ωcabling is used to connect the CLC020 to the PECL inputs, the
voltage dividers used on the CLC020 outputs must be removed and re-installed on the circuit board where the
PECL device is mounted. This will provide correct termination for the cable and biasing for both the CLC020's
outputs and the PECL inputs. It is most important to note that a 75Ωor equivalent DC loading (measured with
respect to the negative supply rail) must always be installed at both of the CLC020's SDO outputs to obtain
proper signal levels from device. When using 75ΩThevenin-equivalent load circuits, the DC bias applied to the
SDO outputs should not exceed +3V with respect to the negative supply rail. Serial output levels should be
reduced to 400 mVp-p by changing RREF to 3.4 kΩ.
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The Test Out output is intended for monitoring by equipment presenting high impedance loading (>500Ω). When
monitoring the Lock Detect output, the attached monitoring circuit should present a DC resistance greater than 5
kΩso that Lock Detect indicator operation is not affected.
Connect LOCK DETECT to TPG ENABLE for test pattern generator function.
Remove RP1 & RP3 and replace RP2 & RP4 with 50Ωresistor packs for coax interfacing.
Install RP1-4 when using ribbon cable for input interfacing.
This board is designed for use with TTL power supplies only.
For optional ECL compatible load: R1A = R2A = 187; R1B = R2B = 124.
All resistances & impedances in Ohms. Values with 3 significant digits are 1%; with 2 digits 5%.
Figure 9. SD020EVK Schematic Diagram
MEASURING JITTER
The test method used to obtain the timing jitter value given in the AC Electrical Specification table is based on
procedures and equipment described in SMPTE RP 192-1996. The recommended practice discusses several
methods and indicator devices. An FFT method performed by standard video test equipment was used to obtain
the data given in this data sheet. As such, the jitter characteristics (or jitter floor) of the measurement equipment,
particularly the measurement analyzer, become integral to the resulting jitter value. The method and equipment
were chosen so that the test can be easily duplicated by the design engineer using most standard digital video
test equipment. In so doing, similar results should be achieved. The intrinsic jitter floor of the CLC020's PLL is
approximately 25% of the typical jitter given in the electrical specifications. In production, device jitter is
measured on automatic IC test equipment (ATE) using a different method compatible with that equipment. Jitter
measured using this ATE yields values approximately 50% of those obtained using the video test equipment.
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The jitter test setup used to obtain values quoted in the data sheet consists of:
• Texas Instruments SD020EVK, CLC020 evaluation kit
• Tektronix TG2000 signal generation platform with DVG1 option
• Tektronix VM700T Option 1S Video Measurement Set
• Tektronix TDS 794D, Option C2 oscilloscope
• Tektronix P6339A passive probe
• 75 Ohm coaxial cable, 3ft., Belden 8281 or RG59 (2 required)
• ECL-to-TTL/CMOS level converter/amplifier, Figure 11
Apply the black-burst reference clock from the TG2000 signal generator's BG1 module 27MHz clock output to the
level converter input. The clock amplitude converter schematic is shown in Figure 10. Adjust the input bias
control to give a 50% duty cycle output as measured on the oscilloscope/probe system. Connect the level
translator to the SD020EVK board, connector P1, PCLK pins (the outer-most row of pins is ground). Configure the
SD020EVK to operate in the NTSC colour bars, BIST mode. Configure the VM700T to make the jitter
measurement in the jitter FFT mode at the frame rate with 1kHz filter bandwidth and Hanning window. Configure
the setup as shown in Figure 10. Switch the test equipment on (from standby mode) and allow all equipment
temperatures stabilize per manufacturer's recommendation. Measure the jitter value after allowing the
instrument's reading to stabilize (about 1 minute). Consult the VM700T Video Measurement Set Option 1S Serial
Digital Measurements User Manual (document number 071-0074-00) for details of equipment operation.
The VM700T measurement system's jitter floor specification at 270Mbps is given as 200ps ±20% (100ps ±5%
typical) of actual components from 50Hz to 1MHz and 200ps +60%, -30% of actual components from 1MHz to
10MHz. To obtain the actual residual jitter of the CLC020, a root-sum-square adjustment of the jitter reading
must be made to compensate for the measurement system's jitter floor specification. For example, if the jitter
reading is 250ps, the CLC020 residual jitter is the square root of (2502−2002) = 150ps. The accuracy limits of
the reading as given above apply.
Figure 10. Jitter Test Circuit
Figure 11. ECL-to-TTL/CMOS level converter/amplifer
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Figure 12. Jitter Plots
PCB LAYOUT AND POWER SYSTEM BYPASS RECOMMENDATIONS
Circuit board layout and stack-up for the CLC020 should be designed to provide noise-free power to the device.
Good layout practice also will separate high frequency or high level inputs and outputs to minimize unwanted
stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin
dielectrics (4 to 10 mils) for power/ground sandwiches. This increases the intrinsic capacitance of the PCB power
system which improves power supply filtering, especially at high frequencies, and makes the value and
placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic
and tantalum electrolytic types. RF capacitors may use values in the range 0.01 µF to 0.1 µF. Tantalum
capacitors may be in the range 2.2 µF to 10 µF. Voltage rating for tantalum capacitors should be at least 5× the
power supply voltage being used. It is recommended practice to use two vias at each power pin of the CLC020
as well as all RF bypass capacitor terminals. Dual vias reduce the interconnect inductance by up to half, thereby
reducing interconnect inductance and extending the effective frequency range of the bypass components.
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The outer layers of the PCB may be flooded with additional VSS (ground) plane. These planes will improve
shielding and isolation as well as increase the intrinsic capacitance of the power supply plane system. Naturally,
to be effective, these planes must be tied to the VSS power supply plane at frequent intervals with vias. Frequent
via placement also improves signal integrity on signal transmission lines by providing short paths for image
currents which reduces signal distortion. The planes should be pulled back from all transmission lines and
component mounting pads a distance equal to the width of the widest transmission line or the thickness of the
dielectric separating the transmission line from the internal power or ground plane(s) whichever is greater. Doing
so minimizes effects on transmission line impedances and reduces unwanted parasitic capacitances at
component mounting pads.
In especially noisy power supply environments, such as is often the case when using switching power supplies,
separate filtering may be used at the CLC020's VCO and output driver power pins. The CLC020 was designed
for this situation. The digital section, VCO and output driver power supply feeds are independent (see PIN
DESCRIPTIONS table and Pinout Drawing for details). Supply filtering may take the form of L-section or pi-
section, L-C filters in series with these VDD inputs. Such filters are available in a single package from several
manufacturers. Despite being independent feeds, all device power supplies should be applied simultaneously as
from a common source. The CLC020 is free from power supply latch-up caused by circuit-induced delays
between the device's three separate power feed systems.
REPLACING THE GENNUM GS9022
The CLC020 is form-fit-function compatible with the Gennum GS9022. The CLC020 can improve the
performance of GS9022 applications using the existing PCB layout with the removal of certain components or
changes to component values. New layouts using the CLC020 will benefit from the greatly reduced ancilliary
component count and more compact layout.
The CLC020 does not require external VCO filtering components. The external VCO filtering components at pin
17 of the GS9022 may remain connected to the CLC020 without complications. It is suggested that these be
removed from the circuit board. The CLC020 uses pin 17 for its test pattern generator enable function. You will
find the TPG function very useful when you make this change.
Remove the COSC capacitor used by the GS9022 at pin 26. The CLC020 uses pin 26 as the BIST pass/fail
indicator output. You may attach a LED as an indicator to this pin, if desired. LED current should be limited to 10
mA maximum. The same LED type and current limiting resistor shown in Figure 9 at the Lock Detect output may
be used for this indicator function.
Remove any capacitor attached to pin 19. A capacitor attached to pin 19 will cause distortion of the output VOH
level. The former data rate setting resistor, RVCO, at pin 19 now functions as the output level setting resistor,
RREF. It must be changed to a 1.69 kΩ, 1% value for correct output level setting.
The input series resistors and the PCLK risetime filter capacitor used with the GS9022 are not needed for the
CLC020. These components should be removed from the circuit board and the resistors replaced by short
circuits (0Ωresistors). These series resistors will increase input signal rise and fall times if left on the board.
The CLC020 has current-mode serial cable driver outputs. These outputs have very high internal generator
resistance as one would expect of a current source. Though these current-mode outputs can produce the
equivalent drive voltages into the load, it is necessary to change and simplify the typical GS9022 output circuit
normally recommended for that device. The output load resistors at pins 22 and 23 must be changed to 75Ω, 1%
values. These resistors become the back-matching loads across which the CLC020's outputs develop drive
voltage. The series back-matching resistors used on the GS9022 should be removed and replaced with short
circuits. The risetime compensating capacitors across these resistors should be removed.
Pin 28 on the CLC020 is VSS and must be connected to the negative supply or ground. On layouts designed to
mount the GS9022, the series R-C network connected to this pin should be replaced by short circuits (0Ω
resistors). The pull-up resistor connected to the Lock Detect output, pin 14, should be removed. It may be
replaced by a LED and current limiting resistor connected to VSS if a visual lock indicator is desired.
The CLC020 has an internal pull-down at the Sync Detect Enable input and may be left unconnected in SMPTE
video-only applications.
The CLC020 has independent power supply pins for the VCO, VSSO, pin 15 and VDDO, pin 16. The CLC020 has
an output driver negative supply, VSSSD, at pin 21. The output driver positive supply, VDDSD, is pin 24 (as on the
GS9022). On new layouts, additional power supply filtering may be added at these pins, if desired.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: CLC020
CLC020
SNLS046E –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 15
16 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: CLC020
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jul-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CLC020BCQ/NOPB ACTIVE PLCC FN 28 35 Green (RoHS
& no Sb/Br) CU SN Level-2A-245C-4
WEEK 0 to 70 CLC020BCQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jul-2014
Addendum-Page 2
www.ti.com
PACKAGE OUTLINE
C
28X -.021.013 -0.530.33[ ]
28X -.032.026 -0.810.66[ ]
TYP
-.495.485 -12.5712.32[ ]
24X .050
[1.27]
-.438.382 -11.129.71[ ]
(.008)
[0.2]
TYP-.120.090 -3.042.29[ ]
.180 MAX
[4.57] .020 MIN
[0.51]
B
NOTE 3
-.456.450 -11.5811.43[ ]
A
NOTE 3
-.456.450 -11.5811.43[ ]
4215153/B 05/2017
4215153/B 05/2017
PLCC - 4.57 mm max heightFN0028A
PLASTIC CHIP CARRIER
NOTES:
1. All linear dimensions are in inches. Any dimensions in brackets are in millimeters. Any dimensions in parenthesis are for reference only.
Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension does not include mold protrusion. Maximum allowable mold protrusion .01 in [0.25 mm] per side.
4. Reference JEDEC registration MS-018.
PIN 1 ID
(OPTIONAL)
128
4
12 18
19
25
5
11
.004 [0.1] C
.007 [0.18] C A B
SEATING PLANE
SCALE 1.000
www.ti.com
EXAMPLE BOARD LAYOUT
.002 MAX
[0.05]
ALL AROUND
.002 MIN
[0.05]
ALL AROUND
28X (.094)
[2.4]
28X (.026 )
[0.65]
24X (.050 )
[1.27]
(.429 )
[10.9]
(.429 )
[10.9]
(R.002 ) TYP
[0.05]
4215153/B 05/2017
4215153/B 05/2017
PLCC - 4.57 mm max heightFN0028A
PLASTIC CHIP CARRIER
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
SYMM
SYMM
128
4
12 18
19
25
5
11
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
28X (.026 )
[0.65]
28X (.094)
[2.4]
(.429 )
[10.9]
(.429 )
[10.9]
24X (.050 )
[1.27]
(R.002 ) TYP
[0.05]
PLCC - 4.57 mm max heightFN0028A
PLASTIC CHIP CARRIER
4215153/B 05/2017
PLCC - 4.57 mm max heightFN0028A
PLASTIC CHIP CARRIER
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
SYMM
SYMM
128
4
12 18
19
25
5
11
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