2006-2012 Microchip Technology Inc. DS41291G-page 1
PIC16F882/883/884/886/887
High-Performance RISC CPU:
• Only 35 Instructions to Learn:
- All single-cycle instructions except branches
• Operating Speed:
- DC – 20 MHz oscillator/clock input
- DC – 200 ns instruction cycle
• Interrupt Capability
• 8-Level Deep Hardware Stack
• Direct, Indirect and Relative Addressing modes
Special Microcontroller Features:
• Precision Internal Oscillator:
- Factory calibrated to ±1%
- Software selectable frequency range of
8 MHz to 31 kHz
- Software tunable
- Two-Speed Start-up mode
- Crystal fail detect for critical applications
- Clock mode switching during operation for
power savings
• Power-Saving Sleep mode
• Wide Operating Voltage Range (2.0V-5.5V)
• Industrial and Extended Temperature Range
• Power-on Reset (POR)
• Power-up Timer (PWRT) and Oscillator Start-up
Timer (OST)
• Brown-out Reset (BOR) with Software Control
Option
• Enhanced Low-Current Watchdog Timer (WDT)
with On-Chip Oscillator (software selectable
nominal 268 seconds with full prescaler) with
software enable
• Multiplexed Master Clear with Pull-up/Input Pin
• Programmable Code Protection
• High Endurance Flash/EEPROM Cell:
- 100,000 write Flash endurance
- 1,000,000 write EEPROM endurance
- Flash/Data EEPROM retention: > 40 years
• Program Memory Read/Write during run time
• In-Circuit Debugger (on board)
Low-Power Features:
• Standby Current:
- 50 nA @ 2.0V, typical
• Operating Current:
-11A @ 32 kHz, 2.0V, typical
-220A @ 4 MHz, 2.0V, typical
• Watchdog Timer Current:
-1A @ 2.0V, typical
Peripheral Features:
• 24/35 I/O Pins with Individual Direction Control:
- High current source/sink for direct LED drive
- Interrupt-on-Change pin
- Individually programmable weak pull-ups
- Ultra Low-Power Wake-up (ULPWU)
• Analog Comparator Module with:
- Two analog comparators
- Programmable on-chip voltage reference
(CVREF) module (% of VDD)
- Fixed voltage reference (0.6V)
- Comparator inputs and outputs externally
accessible
- SR Latch mode
- External Timer1 Gate (count enable)
• A/D Converter:
- 10-bit resolution and 11/14 channels
• Timer0: 8-bit Timer/Counter with 8-bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Dedicated low-power 32 kHz oscillator
• Timer2: 8-bit Timer/Counter with 8-bit Period
Register, Prescaler and Postscaler
• Enhanced Capture, Compare, PWM+ Module:
- 16-bit Capture, max. resolution 12.5 ns
- Compare, max. resolution 200 ns
- 10-bit PWM with 1, 2 or 4 output channels,
programmable “dead time”, max. frequency
20 kHz
- PWM output steering control
• Capture, Compare, PWM Module:
- 16-bit Capture, max. resolution 12.5 ns
- 16-bit Compare, max. resolution 200 ns
- 10-bit PWM, max. frequency 20 kHz
• Enhanced USART Module:
- Supports RS-485, RS-232, and LIN 2.0
- Auto-Baud Detect
- Auto-Wake-Up on Start bit
• In-Circuit Serial ProgrammingTM (ICSPTM) via Two
Pins
• Master Synchronous Serial Port (MSSP) Module
supporting 3-wire SPI (all 4 modes) and I2C™
Master and Slave Modes with I2C Address Mask
28/40/44-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC16F882/883/884/886/887
DS41291G-page 2 2006-2012 Microchip Technology Inc.
PIC16F882/883/884/886/887 Family Types
Device
Program
Memory Data Memory
I/O 10-bit A/D
(ch)
ECCP/
CCP EUSART MSSP Comparators Timers
8/16-bit
Flash
(words)
SRAM
(bytes)
EEPROM
(bytes)
PIC16F882 2048 128 128 24 11 1/1 1 1 2 2/1
PIC16F883 4096 256 256 24 11 1/1 1 1 2 2/1
PIC16F884 4096 256 256 35 14 1/1 1 1 2 2/1
PIC16F886 8192 368 256 24 11 1/1 1 1 2 2/1
PIC16F887 8192 368 256 35 14 1/1 1 1 2 2/1
2006-2012 Microchip Technology Inc. DS41291G-page 3
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F882/883/886, 28-Pin PDIP, SOIC, SSOP
10
11
2
3
4
5
6
1
8
7
9
12
13
14 15
16
17
18
19
20
23
24
25
26
27
28
22
21
PIC16F882/883/886
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11/P1D
RB3/AN9/PGM/C12IN2-
RB2/AN8/P1B
RB1/AN10/P1C/C12IN3-
RB0/AN12/INT
VDD
VSS
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
28-Pin PDIP, SOIC, SSOP
PIC16F882/883/884/886/887
DS41291G-page 4 2006-2012 Microchip Technology Inc.
TABLE 1: 28-PIN PDIP, SOIC, SSOP ALLOCATION TABLE (PIC16F882/883/886)
I/O
28-Pin PDIP/SOIC/SSOP
Analog
Comparators
Timers
ECCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 2AN0/ULPWU C12IN0- — — — — — — —
RA1 3 AN1 C12IN1- — — — — — — —
RA2 4AN2 C2IN+ — — — — — — VREF-/CVREF
RA3 5 AN3 C1IN+ — — — — — — VREF+
RA4 6 — C1OUT T0CKI — — — — — —
RA5 7 AN4 C2OUT — — — SS —— —
RA6 10 — — — — — — — — OSC2/CLKOUT
RA7 9 — — — — — — — — OSC1/CLKIN
RB0 21 AN12 — — — — — IOC/INT Y —
RB1 22 AN10 C12IN3- — P1C — — IOC Y —
RB2 23 AN8 — — P1B — — IOC Y —
RB3 24 AN9 C12IN2- — — — — IOC Y PGM
RB4 25 AN11 — — P1D — — IOC Y —
RB5 26 AN13 — T1G — — — IOC Y —
RB6 27 — — — — — — IOC YICSPCLK
RB7 28 — — — — — — IOC Y ICSPDAT
RC0 11 — — T1OSO/T1CKI — — — — — —
RC1 12 — — T1OSI CCP2 — — — — —
RC2 13 — — — CCP1/P1A — — — — —
RC3 14 — — — — — SCK/SCL — — —
RC4 15 — — — — — SDI/SDA — — —
RC5 16 — — — — — SDO — — —
RC6 17 — — — — TX/CK — — — —
RC7 18 — — — — RX/DT — — — —
RE3 1 — — — — — — — Y(1) MCLR/VPP
—20 — — — — — — — — VDD
— 8 — — — — — — — — VSS
—19 — — — — — — — — VSS
Note 1: Pull-up activated only with external MCLR configuration.
2006-2012 Microchip Technology Inc. DS41291G-page 5
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F882/883/886, 28-Pin QFN
16
2
7
1
3
6
5
4
15
21
19
20
17
18
22
28
26
27
23
24
25
14
8
10
9
13
12
11
PIC16F882/883/886
RA1/AN1/C12IN1-
RA0/AN0/ULPWU/C12IN0-
RE3/MCLR/VPP
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11/P1D
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RB3/AN9/PGM/C12IN2-
RB2/AN8/P1B
RB1/AN10/P1C/C12IN3-
RB0/AN12/INT
VDD
VSS
RC7/RX/DT
28-Pin QFN
PIC16F882/883/884/886/887
DS41291G-page 6 2006-2012 Microchip Technology Inc.
TABLE 2: 28-PIN QFN ALLOCATION TABLE (PIC16F882/883/886)
I/O
28-Pin QFN
Analog
Comparators
Timers
ECCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 27 AN0/ULPWU C12IN0- — — — — — — —
RA1 28 AN1 C12IN1- — — — — — — —
RA2 1AN2 C2IN+ — — — — — — VREF-/CVREF
RA3 2 AN3 C1IN+ — — — — — — VREF+
RA4 3 — C1OUT T0CKI — — — — — —
RA5 4 AN4 C2OUT — — — SS —— —
RA6 7 — — — — — — — — OSC2/CLKOUT
RA7 6 — — — — — — — — OSC1/CLKIN
RB0 18 AN12 — — — — — IOC/INT Y —
RB1 19 AN10 C12IN3- — P1C — — IOC Y —
RB2 20 AN8 — — P1B — — IOC Y —
RB3 21 AN9 C12IN2- — — — — IOC Y PGM
RB4 22 AN11 — — P1D — — IOC Y —
RB5 23 AN13 — T1G — — — IOC Y —
RB6 24 — — — — — — IOC YICSPCLK
RB7 25 — — — — — — IOC Y ICSPDAT
RC0 8 — — T1OSO/T1CKI — — — — — —
RC1 9 — — T1OSI CCP2 — — — — —
RC2 10 — — — CCP1/P1A — — — — —
RC3 11 — — — — — SCK/SCL — — —
RC4 12 — — — — — SDI/SDA — — —
RC5 13 — — — — — SDO — — —
RC6 14 — — — — TX/CK — — — —
RC7 15 — — — — RX/DT — — — —
RE3 26 — — — — — — — Y(1) MCLR/VPP
—17 — — — — — — — — VDD
— 5 — — — — — — — — VSS
—16 — — — — — — — — VSS
Note 1: Pull-up activated only with external MCLR configuration.
2006-2012 Microchip Technology Inc. DS41291G-page 7
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F884/887, 40-Pin PDIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
PIC16F884/887
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3/VREF+/C1IN+
RA4/T0CKI/C1OUT
RA5/AN4/SS/C2OUT
RE0/AN5
RE1/AN6
RE2/AN7
VDD
VSS
RA7/OSC1/CLKIN
RA6/OSC2/CLKOUT
RC0/T1OSO/T1CKI
RC1/T1OSI/CCP2
RC2/P1A/CCP1
RC3/SCK/SCL
RD0
RD1
RB7/ICSPDAT
RB6/ICSPCLK
RB5/AN13/T1G
RB4/AN11
RB3/AN9/PGM/C12IN2-
RB2/AN8
RB1/AN10/C12IN3-
RB0/AN12/INT
VDD
VSS
RD7/P1D
RD6/P1C
RD5/P1B
RD4
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
40-Pin PDIP
PIC16F882/883/884/886/887
DS41291G-page 8 2006-2012 Microchip Technology Inc.
TABLE 3: 40-PIN PDIP ALLOCATION TABLE (PIC16F884/887)
I/O
40-Pin PDIP
Analog
Comparators
Timers
ECCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 2AN0/ULPWU C12IN0- — — — — — — —
RA1 3 AN1 C12IN1- — — — — — — —
RA2 4AN2 C2IN+ — — — — — — VREF-/CVREF
RA3 5 AN3 C1IN+ — — — — — — VREF+
RA4 6 — C1OUT T0CKI — — — — — —
RA5 7 AN4 C2OUT — — — SS —— —
RA6 14 — — — — — — — — OSC2/CLKOUT
RA7 13 — — — — — — — — OSC1/CLKIN
RB0 33 AN12 — — — — — IOC/INT Y —
RB1 34 AN10 C12IN3- — — — — IOC Y —
RB2 35 AN8 — — — — — IOC Y —
RB3 36 AN9 C12IN2- — — — — IOC Y PGM
RB4 37 AN11 — — — — — IOC Y —
RB5 38 AN13 — T1G — — — IOC Y —
RB6 39 — — — — — — IOC YICSPCLK
RB7 40 — — — — — — IOC Y ICSPDAT
RC0 15 — — T1OSO/T1CKI — — — — — —
RC1 16 — — T1OSI CCP2 — — — — —
RC2 17 — — — CCP1/P1A — — — — —
RC3 18 — — — — — SCK/SCL — — —
RC4 23 — — — — — SDI/SDA — — —
RC5 24 — — — — — SDO — — —
RC6 25 — — — — TX/CK — — — —
RC7 26 — — — — RX/DT — — — —
RD0 19 — — — — — — — — —
RD1 20 — — — — — — — — —
RD2 21 — — — — — — — — —
RD3 22 — — — — — — — — —
RD4 27 — — — — — — — — —
RD5 28 — — — P1B — — — — —
RD6 29 — — — P1C — — — — —
RD7 30 — — — P1D — — — — —
RE0 8AN5 — — — — — — — —
RE1 9 AN6 — — — — — — — —
RE2 10 AN7 — — — — — — — —
RE3 1 — — — — — — — Y(1) MCLR/VPP
—11 — — — — — — — — VDD
—32 — — — — — — — — VDD
—12 — — — — — — — — VSS
—31 — — — — — — — — VSS
Note 1: Pull-up activated only with external MCLR configuration.
2006-2012 Microchip Technology Inc. DS41291G-page 9
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F884/887, 44-Pin QFN
44-Pin QFN
10
11
2
3
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
5
4
PIC16F884/887
RA6/OSC2/CLKOUT
RA7/OSC1/CLKIN
VSS
VSS
NC
VDD
RE2/AN7
RE1/AN6
RE0/AN5
RA5/AN4/SS/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4
RD5/P1B
RD6/P1C
RD7/P1D
VSS
VDD
VDD
RB0/AN12/INT
RB1/AN10/C12IN3-
RB2/AN8
RB3/AN9/PGM/C12IN2-
NC
RB4/AN11
RB5/AN13/T1G
RB6/ICSPCLK
RB7/ICSPDAT
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3//VREF+/C1IN+
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
RD1
RD0
RC3/SCK/SCL
RC2/P1A/CCP1
RC1/T1OSCI/CCP2
RC0/T1OSO/T1CKI
PIC16F882/883/884/886/887
DS41291G-page 10 2006-2012 Microchip Technology Inc.
TABLE 4: 44-PIN QFN ALLOCATION TABLE (PIC16F884/887)
I/O
44-Pin QFN
Analog
Comparators
Timers
ECCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 19 AN0/ULPWU C12IN0- — — — — — — —
RA1 20 AN1 C12IN1- — — — — — — —
RA2 21 AN2 C2IN+ — — — — — — VREF-/CVREF
RA3 22 AN3 C1IN+ — — — — — — VREF+
RA4 23 —C1OUT T0CKI — — — — — —
RA5 24 AN4 C2OUT — — — SS —— —
RA6 33 — — — — — — — — OSC2/CLKOUT
RA7 32 — — — — — — — — OSC1/CLKIN
RB0 9AN12 — — — — — IOC/INT Y —
RB1 10 AN10 C12IN3- — — — — IOC Y —
RB2 11 AN8 — — — — — IOC Y —
RB3 12 AN9 C12IN2- — — — — IOC Y PGM
RB4 14 AN11 — — — — — IOC Y —
RB5 15 AN13 — T1G — — — IOC Y —
RB6 16 — — — — — — IOC YICSPCLK
RB7 17 — — — — — — IOC Y ICSPDAT
RC0 34 — — T1OSO/T1CKI — — — — — —
RC1 35 — — T1OSI CCP2 — — — — —
RC2 36 — — — CCP1/P1A — — — — —
RC3 37 — — — — — SCK/SCL — — —
RC4 42 — — — — — SDI/SDA — — —
RC5 43 — — — — — SDO — — —
RC6 44 — — — — TX/CK — — — —
RC7 1 — — — — RX/DT — — — —
RD0 38 — — — — — — — — —
RD1 39 — — — — — — — — —
RD2 40 — — — — — — — — —
RD3 41 — — — — — — — — —
RD4 2 — — — — — — — — —
RD5 3 — — — P1B — — — — —
RD6 4 — — — P1C — — — — —
RD7 5 — — — P1D — — — — —
RE0 25 AN5 — — — — — — — —
RE1 26 AN6 — — — — — — — —
RE2 27 AN7 — — — — — — — —
RE3 18 — — — — — — — Y(1) MCLR/VPP
— 7 — — — — — — — — VDD
—8 — — — — — — — — VDD
—28 — — — — — — — — VDD
—6 — — — — — — — — VSS
—30 — — — — — — — — VSS
—31 — — — — — — — — VSS
—13 — — — — — — — — NC (no connect)
— 29 — — — — — — — — NC (no connect)
Note 1: Pull-up activated only with external MCLR configuration.
2006-2012 Microchip Technology Inc. DS41291G-page 11
PIC16F882/883/884/886/887
Pin Diagrams – PIC16F884/887, 44-Pin TQFP
44-Pin TQFP
10
11
2
3
6
1
18
19
20
21
22
12
13
14
15
38
8
7
44
43
42
41
40
39
16
17
29
30
31
32
33
23
24
25
26
27
28
36
34
35
9
37
5
4
PIC16F884/887
NC
RC0/T1OSO/T1CKI
RA6/OSC2/CLKOUT
RA7/OSC1/CLKIN
VSS
VDD
RE2/AN7
RE1/AN6
RE0/AN5
RA5/AN4/SS/C2OUT
RA4/T0CKI/C1OUT
RC7/RX/DT
RD4
RD5/P1B
RD6/P1C
RD7/P1D
VSS
VDD
RB0/AN12/INT
RB1/AN10/C12IN3-
RB2/AN8
RB3/AN9/PGM/C12IN2-
NC
NC
RB4/AN11
RB5/AN13/T1G
RB6/ICSPCLK
RB7/ICSPDAT
RE3/MCLR/VPP
RA0/AN0/ULPWU/C12IN0-
RA1/AN1/C12IN1-
RA2/AN2/VREF-/CVREF/C2IN+
RA3/AN3//VREF+/C1IN+
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3
RD2
RD1
RD0
RC3/SCK/SCL
RC2/P1A/CCP1
RC1/T1OSCI/CCP2
NC
PIC16F882/883/884/886/887
DS41291G-page 12 2006-2012 Microchip Technology Inc.
TABLE 5: 44-PIN TQFP ALLOCATION TABLE (PIC16F884/887)
I/O
44-Pin TQFP
Analog
Comparators
Timers
ECCP
EUSART
MSSP
Interrupt
Pull-up
Basic
RA0 19 AN0/ULPWU C12IN0- — — — — — — —
RA1 20 AN1 C12IN1- — — — — — — —
RA2 21 AN2 C2IN+ — — — — — — VREF-/CVREF
RA3 22 AN3 C1IN+ — — — — — — VREF+
RA4 23 —C1OUT T0CKI — — — — — —
RA5 24 AN4 C2OUT — — — SS —— —
RA6 31 — — — — — — — — OSC2/CLKOUT
RA7 30 — — — — — — — — OSC1/CLKIN
RB0 8AN12 — — — — — IOC/INT Y —
RB1 9 AN10 C12IN3- — — — — IOC Y —
RB2 10 AN8 — — — — — IOC Y —
RB3 11 AN9 C12IN2- — — — — IOC Y PGM
RB4 14 AN11 — — — — — IOC Y —
RB5 15 AN13 — T1G — — — IOC Y —
RB6 16 — — — — — — IOC YICSPCLK
RB7 17 — — — — — — IOC Y ICSPDAT
RC0 32 — — T1OSO/T1CKI — — — — — —
RC1 35 — — T1OSI CCP2 — — — — —
RC2 36 — — — CCP1/P1A — — — — —
RC3 37 — — — — — SCK/SCL — — —
RC4 42 — — — — — SDI/SDA — — —
RC5 43 — — — — — SDO — — —
RC6 44 — — — — TX/CK — — — —
RC7 1 — — — — RX/DT — — — —
RD0 38 — — — — — — — — —
RD1 39 — — — — — — — — —
RD2 40 — — — — — — — — —
RD3 41 — — — — — — — — —
RD4 2 — — — — — — — — —
RD5 3 — — — P1B — — — — —
RD6 4 — — — P1C — — — — —
RD7 5 — — — P1D — — — — —
RE0 25 AN5 — — — — — — — —
RE1 26 AN6 — — — — — — — —
RE2 27 AN7 — — — — — — — —
RE3 18 — — — — — — — Y(1) MCLR/VPP
— 7 — — — — — — — — VDD
—28 — — — — — — — — VDD
— 6 — — — — — — — — VSS
— 13 — — — — — — — — NC (no connect)
—29 — — — — — — — — VSS
— 34 — — — — — — — — NC (no connect)
—33 — — — — — — — — NC (no connect)
— 12 — — — — — — — — NC (no connect)
Note 1: Pull-up activated only with external MCLR configuration.
2006-2012 Microchip Technology Inc. DS41291G-page 13
PIC16F882/883/884/886/887
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 15
2.0 Memory Organization ................................................................................................................................................................. 23
3.0 I/O Ports ..................................................................................................................................................................................... 41
4.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 65
5.0 Timer0 Module ........................................................................................................................................................................... 77
6.0 Timer1 Module with Gate Control............................................................................................................................................... 81
7.0 Timer2 Module ........................................................................................................................................................................... 87
8.0 Comparator Module.................................................................................................................................................................... 89
9.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 103
10.0 Data EEPROM and Flash Program Memory Control............................................................................................................... 115
11.0 Enhanced Capture/Compare/PWM Module ............................................................................................................................. 127
12.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 155
13.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 183
14.0 Special Features of the CPU.................................................................................................................................................... 213
15.0 Instruction Set Summary.......................................................................................................................................................... 235
16.0 Development Support............................................................................................................................................................... 245
17.0 Electrical Specifications............................................................................................................................................................ 249
18.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 277
19.0 Packaging Information.............................................................................................................................................................. 305
Appendix A: Data Sheet Revision History.......................................................................................................................................... 323
Appendix B: Migrating from other PIC® Devices ............................................................................................................................... 324
Index .................................................................................................................................................................................................. 325
The Microchip Web Site..................................................................................................................................................................... 333
Customer Change Notification Service .............................................................................................................................................. 333
Customer Support .............................................................................................................................................................................. 333
Reader Response .............................................................................................................................................................................. 334
Product Identification System ............................................................................................................................................................ 335
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PIC16F882/883/884/886/887
DS41291G-page 14 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 15
PIC16F882/883/884/886/887
1.0 DEVICE OVERVIEW
The PIC16F882/883/884/886/887 devices are covered
by this data sheet. The PIC16F882/883/886 devices are
available in 28-pin PDIP, SOIC, SSOP and QFN
packages. The PIC16F884/887 are available in a 40-pin
PDIP and 44-pin QFN and TQFP packages. Figure 1-1
shows the block diagram of the PIC16F882/883/886
devices and Figure 1-2 shows a block diagram of the
PIC16F884/887 devices. Ta b le 1 -1 and Ta b l e 1 - 2 show
the corresponding pinout descriptions.
PIC16F882/883/884/886/887
DS41291G-page 16 2006-2012 Microchip Technology Inc.
FIGURE 1-1: PIC16F882/883/886 BLOCK DIAGRAM
Flash
Program
Memory
13 Data Bus 8
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode and
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
8
8
8
3
8-Level Stack 128(2)/256(1)/
2K(2)/4K(1)/
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
Data
EEPROM
128(2)/
EEDATA
EEADDR
T0CKI T1CKI
Configuration
Internal
Oscillator
T1G
VDD
8
Timer2 ECCP
Block
2 Analog ComparatorsVREF+
and Reference
Analog-To-Digital Converter
(ADC)
AN0
AN1
AN2
AN3
AN4
AN8
AN9
AN10
AN11
AN12
AN13
C1IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1OUT
C2IN+
C2OUT
CCP1/P1A
P1B
P1C
P1D
PORTA
PORTC
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RC7
PORTB
EUSART
TX/CK
RX/DT
PORTE
RE3
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
Timer1
32 kHz
Oscillator
Master Synchronous
Serial Port (MSSP)
CCP2
CCP2
SDO
SDI/SDA
SCK/SCL
SS
VREF-
14
Note 1: PIC16F883 only.
2: PIC16F882 only.
VREF+
VREF-
CVREF
In-Circuit
Debugger
(ICD)
T1OSI
T1OSO
8K X 14
368 Bytes
256 Bytes
2006-2012 Microchip Technology Inc. DS41291G-page 17
PIC16F882/883/884/886/887
FIGURE 1-2: PIC16F884/PIC16F887 BLOCK DIAGRAM
PORTD
RD0
RD1
RD2
RD3
RD4
RD5
RD6
RD7
Flash
Program
Memory
13 Data Bus 8
Program
Bus
Instruction Reg
Program Counter
RAM
File
Registers
Direct Addr 7
RAM Addr 9
Addr MUX
Indirect
Addr
FSR Reg
STATUS Reg
MUX
ALU
W Reg
Instruction
Decode and
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
8
8
8
3
8-Level Stack 256(1)/368 Bytes
4K(1)/8K X 14
(13-Bit)
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
MCLR VSS
Brown-out
Reset
Timer0 Timer1
Data
EEPROM
256 Bytes
EEDATA
EEADDR
T0CKI T1CKI
Configuration
Internal
Oscillator
T1G
VDD
8
Timer2 ECCP
Block
2 Analog Comparators
and Reference
Analog-To-Digital Converter
(ADC)
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
PORTA
PORTC
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RC7
PORTB
EUSART
PORTE
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RA7
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RB7
Timer1
32 kHz
Oscillator
Master Synchronous
Serial Port (MSSP)
CCP2
CCP2
14
Note 1: PIC16F884 only.
RE0
RE1
RE2
RE3
SDO
SDI/SDA
SCK/SCL
SS
CCP1/P1A
P1B
P1C
P1D
TX/CK
RX/DT
VREF+
VREF-
VREF+
VREF-
CVREF
C1IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1OUT
C2IN+
C2OUT
In-Circuit
Debugger
(ICD)
T1OSI
T1OSO
PIC16F882/883/884/886/887
DS41291G-page 18 2006-2012 Microchip Technology Inc.
TABLE 1-1: PIC16F882/883/886 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
RA0/AN0/ULPWU/C12IN0- RA0 TTL CMOS General purpose I/O.
AN0 AN — A/D Channel 0 input.
ULPWU AN — Ultra Low-Power Wake-up input.
C12IN0- AN — Comparator C1 or C2 negative input.
RA1/AN1/C12IN1- RA1 TTL CMOS General purpose I/O.
AN1 AN — A/D Channel 1 input.
C12IN1- AN — Comparator C1 or C2 negative input.
RA2/AN2/VREF-/CVREF/C2IN+ RA2 TTL CMOS General purpose I/O.
AN2 AN — A/D Channel 2.
VREF- AN — A/D Negative Voltage Reference input.
CVREF — AN Comparator Voltage Reference output.
C2IN+ AN — Comparator C2 positive input.
RA3/AN3/VREF+/C1IN+ RA3 TTL — General purpose I/O.
AN3 AN — A/D Channel 3.
VREF+ AN — Programming voltage.
C1IN+ AN — Comparator C1 positive input.
RA4/T0CKI/C1OUT RA4 TTL CMOS General purpose I/O.
T0CKI ST — Timer0 clock input.
C1OUT — CMOS Comparator C1 output.
RA5/AN4/SS/C2OUT RA5 TTL CMOS General purpose I/O.
AN4 AN — A/D Channel 4.
SS ST — Slave Select input.
C2OUT — CMOS Comparator C2 output.
RA6/OSC2/CLKOUT RA6 TTL CMOS General purpose I/O.
OSC2 — XTAL Master Clear with internal pull-up.
CLKOUT — CMOS FOSC/4 output.
RA7/OSC1/CLKIN RA7 TTL CMOS General purpose I/O.
OSC1 XTAL — Crystal/Resonator.
CLKIN ST — External clock input/RC oscillator connection.
RB0/AN12/INT RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN12 AN — A/D Channel 12.
INT ST — External interrupt.
RB1/AN10/P1C/C12IN3- RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN10 AN — A/D Channel 10.
P1C — CMOS PWM output.
C12IN3- AN — Comparator C1 or C2 negative input.
RB2/AN8/P1B RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN8 AN — A/D Channel 8.
P1B — CMOS PWM output.
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
2006-2012 Microchip Technology Inc. DS41291G-page 19
PIC16F882/883/884/886/887
RB3/AN9/PGM/C12IN2- RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN9 AN — A/D Channel 9.
PGM ST — Low-voltage ICSP™ Programming enable pin.
C12IN2- AN — Comparator C1 or C2 negative input.
RB4/AN11/P1D RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN11 AN — A/D Channel 11.
P1D — CMOS PWM output.
RB5/AN13/T1G RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN13 AN — A/D Channel 13.
T1G ST — Timer1 Gate input.
RB6/ICSPCLK RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPCLK ST — Serial Programming Clock.
RB7/ICSPDAT RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPDAT ST CMOS ICSP™ Data I/O.
RC0/T1OSO/T1CKI RC0 ST CMOS General purpose I/O.
T1OSO — CMOS Timer1 oscillator output.
T1CKI ST — Timer1 clock input.
RC1/T1OSI/CCP2 RC1 ST CMOS General purpose I/O.
T1OSI ST — Timer1 oscillator input.
CCP2 ST CMOS Capture/Compare/PWM2.
RC2/P1A/CCP1 RC2 ST CMOS General purpose I/O.
P1A — CMOS PWM output.
CCP1 ST CMOS Capture/Compare/PWM1.
RC3/SCK/SCL RC3 ST CMOS General purpose I/O.
SCK ST CMOS SPI clock.
SCL ST OD I2C™ clock.
RC4/SDI/SDA RC4 ST CMOS General purpose I/O.
SDI ST — SPI data input.
SDA ST OD I2C data input/output.
RC5/SDO RC5 ST CMOS General purpose I/O.
SDO — CMOS SPI data output.
RC6/TX/CK RC6 ST CMOS General purpose I/O.
TX — CMOS EUSART asynchronous transmit.
CK ST CMOS EUSART synchronous clock.
RC7/RX/DT RC7 ST CMOS General purpose I/O.
RX ST — EUSART asynchronous input.
DT ST CMOS EUSART synchronous data.
RE3/MCLR/VPP RE3 TTL — General purpose input.
MCLR ST — Master Clear with internal pull-up.
VPP HV — Programming voltage.
VSS VSS Power — Ground reference.
VDD VDD Power — Positive supply.
TABLE 1-1: PIC16F882/883/886 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
PIC16F882/883/884/886/887
DS41291G-page 20 2006-2012 Microchip Technology Inc.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
RA0/AN0/ULPWU/C12IN0- RA0 TTL CMOS General purpose I/O.
AN0 AN — A/D Channel 0 input.
ULPWU AN — Ultra Low-Power Wake-up input.
C12IN0- AN — Comparator C1 or C2 negative input.
RA1/AN1/C12IN1- RA1 TTL CMOS General purpose I/O.
AN1 AN — A/D Channel 1 input.
C12IN1- AN — Comparator C1 or C2 negative input.
RA2/AN2/VREF-/CVREF/C2IN+ RA2 TTL CMOS General purpose I/O.
AN2 AN — A/D Channel 2.
VREF- AN — A/D Negative Voltage Reference input.
CVREF — AN Comparator Voltage Reference output.
C2IN+ AN — Comparator C2 positive input.
RA3/AN3/VREF+/C1IN+ RA3 TTL CMOS General purpose I/O.
AN3 AN — A/D Channel 3.
VREF+ AN — A/D Positive Voltage Reference input.
C1IN+ AN — Comparator C1 positive input.
RA4/T0CKI/C1OUT RA4 TTL CMOS General purpose I/O.
T0CKI ST — Timer0 clock input.
C1OUT — CMOS Comparator C1 output.
RA5/AN4/SS/C2OUT RA5 TTL CMOS General purpose I/O.
AN4 AN — A/D Channel 4.
SS ST — Slave Select input.
C2OUT — CMOS Comparator C2 output.
RA6/OSC2/CLKOUT RA6 TTL CMOS General purpose I/O.
OSC2 — XTAL Crystal/Resonator.
CLKOUT — CMOS FOSC/4 output.
RA7/OSC1/CLKIN RA7 TTL CMOS General purpose I/O.
OSC1 XTAL — Crystal/Resonator.
CLKIN ST — External clock input/RC oscillator connection.
RB0/AN12/INT RB0 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN12 AN — A/D Channel 12.
INT ST — External interrupt.
RB1/AN10/C12IN3- RB1 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN10 AN — A/D Channel 10.
C12IN3- AN — Comparator C1 or C2 negative input.
RB2/AN8 RB2 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN8 AN — A/D Channel 8.
RB3/AN9/PGM/C12IN2- RB3 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN9 AN — A/D Channel 9.
PGM ST — Low-voltage ICSP™ Programming enable pin.
C12IN2- AN — Comparator C1 or C2 negative input.
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
2006-2012 Microchip Technology Inc. DS41291G-page 21
PIC16F882/883/884/886/887
RB4/AN11 RB4 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN11 AN — A/D Channel 11.
RB5/AN13/T1G RB5 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
AN13 AN — A/D Channel 13.
T1G ST — Timer1 Gate input.
RB6/ICSPCLK RB6 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPCLK ST — Serial Programming Clock.
RB7/ICSPDAT RB7 TTL CMOS General purpose I/O. Individually controlled interrupt-on-change.
Individually enabled pull-up.
ICSPDAT ST TTL ICSP™ Data I/O.
RC0/T1OSO/T1CKI RC0 ST CMOS General purpose I/O.
T1OSO — XTAL Timer1 oscillator output.
T1CKI ST — Timer1 clock input.
RC1/T1OSI/CCP2 RC1 ST CMOS General purpose I/O.
T1OSI XTAL — Timer1 oscillator input.
CCP2 ST CMOS Capture/Compare/PWM2.
RC2/P1A/CCP1 RC2 ST CMOS General purpose I/O.
P1A ST CMOS PWM output.
CCP1 — CMOS Capture/Compare/PWM1.
RC3/SCK/SCL RC3 ST CMOS General purpose I/O.
SCK ST CMOS SPI clock.
SCL ST OD I2C™ clock.
RC4/SDI/SDA RC4 ST CMOS General purpose I/O.
SDI ST — SPI data input.
SDA ST OD I2C data input/output.
RC5/SDO RC5 ST CMOS General purpose I/O.
SDO — CMOS SPI data output.
RC6/TX/CK RC6 ST CMOS General purpose I/O.
TX — CMOS EUSART asynchronous transmit.
CK ST CMOS EUSART synchronous clock.
RC7/RX/DT RC7 ST CMOS General purpose I/O.
RX ST — EUSART asynchronous input.
DT ST CMOS EUSART synchronous data.
RD0 RD0 TTL CMOS General purpose I/O.
RD1 RD1 TTL CMOS General purpose I/O.
RD2 RD2 TTL CMOS General purpose I/O.
RD3 RD3 TTL CMOS General purpose I/O.
RD4 RD4 TTL CMOS General purpose I/O.
RD5/P1B RD5 TTL CMOS General purpose I/O.
P1B — CMOS PWM output.
RD6/P1C RD6 TTL CMOS General purpose I/O.
P1C — CMOS PWM output.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
PIC16F882/883/884/886/887
DS41291G-page 22 2006-2012 Microchip Technology Inc.
RD7/P1D RD7 TTL CMOS General purpose I/O.
P1D AN — PWM output.
RE0/AN5 RE0 TTL CMOS General purpose I/O.
AN5 AN — A/D Channel 5.
RE1/AN6 RE1 TTL CMOS General purpose I/O.
AN6 AN — A/D Channel 6.
RE2/AN7 RE2 TTL CMOS General purpose I/O.
AN7 AN — A/D Channel 7.
RE3/MCLR/VPP RE3 TTL — General purpose input.
MCLR ST — Master Clear with internal pull-up.
VPP HV — Programming voltage.
VSS VSS Power — Ground reference.
VDD VDD Power — Positive supply.
TABLE 1-2: PIC16F884/887 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS = CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels
HV = High Voltage XTAL = Crystal
2006-2012 Microchip Technology Inc. DS41291G-page 23
PIC16F882/883/884/886/887
2.0 MEMORY ORGANIZATION
2.1 Program Memory Organization
The PIC16F882/883/884/886/887 devices have a 13-bit
program counter capable of addressing a 2K x 14
(0000h-07FFh) for the PIC16F882, 4K x 14 (0000h-
0FFFh) for the PIC16F883/PIC16F884, and 8K x 14
(0000h-1FFFh) for the PIC16F886/PIC16F887 program
memory space. Accessing a location above these
boundaries will cause a wrap-around within the first 8K x
14 space. The Reset vector is at 0000h and the interrupt
vector is at 0004h (see Figures 2-2 and 2-3).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F882
FIGURE 2-2: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F883/PIC16F884
FIGURE 2-3: PROGRAM MEMORY MAP
AND STACK FOR THE
PIC16F886/PIC16F887
PC<12:0>
13
0000h
0004h
0005h
07FFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
On-Chip
Program
Memory
PC<12:0>
13
0000h
0004h
0005h
07FFh
0800h
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
Page 1
0FFFh
On-Chip
Program
Memory
PC<12:0>
13
0000h
0004h
0005h
07FFh
0800h
17FFh
Stack Level 1
Stack Level 8
Reset Vector
Interrupt Vector
CALL, RETURN
RETFIE, RETLW
Stack Level 2
Page 0
Page 1
Page 2
Page 3
0FFFh
1000h
1FFFh
1800h
On-Chip
Program
Memory
PIC16F882/883/884/886/887
DS41291G-page 24 2006-2012 Microchip Technology Inc.
2.2 Data Memory Organization
The data memory (see Figures 2-2 and 2-3) is
partitioned into four banks which contain the General
Purpose Registers (GPR) and the Special Function
Registers (SFR). The Special Function Registers are
located in the first 32 locations of each bank. The
General Purpose Registers, implemented as static RAM,
are located in the last 96 locations of each Bank.
Register locations F0h-FFh in Bank 1, 170h-17Fh in
Bank 2 and 1F0h-1FFh in Bank 3, point to addresses
70h-7Fh in Bank 0. The actual number of General
Purpose Resisters (GPR) implemented in each Bank
depends on the device. Details are shown in Figures 2-5
and 2-6. All other RAM is unimplemented and returns ‘0’
when read. RP<1:0> of the STATUS register are the
bank select bits:
RP1 RP0
00Bank 0 is selected
01Bank 1 is selected
10Bank 2 is selected
11Bank 3 is selected
2.2.1 GENERAL PURPOSE REGISTER
FILE
The register file is organized as 128 x 8 in the
PIC16F882, 256 x 8 in the PIC16F883/PIC16F884, and
368 x 8 in the PIC16F886/PIC16F887. Each register is
accessed, either directly or indirectly, through the File
Select Register (FSR) (see Section 2.4 “Indirect
Addressing, INDF and FSR Registers”).
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 2-1 ). These
registers are static RAM.
The special registers can be classified into two sets:
core and peripheral. The Special Function Registers
associated with the “core” are described in this section.
Those related to the operation of the peripheral
features are described in the section of that peripheral
feature.
2006-2012 Microchip Technology Inc. DS41291G-page 25
PIC16F882/883/884/886/887
FIGURE 2-4: PIC16F882 SPECIAL FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h Indirect addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
08h 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h 110h 190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h General
Purpose
Registers
32 Bytes
A0h
BFh
120h 1A0h
C0h
EFh 16Fh 1EFh
accesses
70h-7Fh
F0h accesses
70h-7Fh
170h accesses
70h-7Fh
1F0h
7Fh FFh 17Fh 1FFh
Bank 0 Bank 1 Bank 2 Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
PIC16F882/883/884/886/887
DS41291G-page 26 2006-2012 Microchip Technology Inc.
FIGURE 2-5: PIC16F883/PIC16F884 SPECIAL FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h Indirect addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
PORTD(2) 08h TRISD(2) 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h 110h 190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h General
Purpose
Registers
80 Bytes
A0h General
Purpose
Registers
80 Bytes
120h 1A0h
EFh 16Fh 1EFh
accesses
70h-7Fh
F0h accesses
70h-7Fh
170h accesses
70h-7Fh
1F0h
7Fh FFh 17Fh 1FFh
Bank 0Bank 1Bank 2Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
2: PIC16F884 only.
2006-2012 Microchip Technology Inc. DS41291G-page 27
PIC16F882/883/884/886/887
FIGURE 2-6: PIC16F886/PIC16F887 SPECIAL FUNCTION REGISTERS
File File File File
Address Address Address Address
Indirect addr. (1) 00h Indirect addr. (1) 80h Indirect addr. (1) 100h Indirect addr. (1) 180h
TMR0 01h OPTION_REG 81h TMR0 101h OPTION_REG 181h
PCL 02h PCL 82h PCL 102h PCL 182h
STATUS 03h STATUS 83h STATUS 103h STATUS 183h
FSR 04h FSR 84h FSR 104h FSR 184h
PORTA 05h TRISA 85h WDTCON 105h SRCON 185h
PORTB 06h TRISB 86h PORTB 106h TRISB 186h
PORTC 07h TRISC 87h CM1CON0 107h BAUDCTL 187h
PORTD(2) 08h TRISD(2) 88h CM2CON0 108h ANSEL 188h
PORTE 09h TRISE 89h CM2CON1 109h ANSELH 189h
PCLATH 0Ah PCLATH 8Ah PCLATH 10Ah PCLATH 18Ah
INTCON 0Bh INTCON 8Bh INTCON 10Bh INTCON 18Bh
PIR1 0Ch PIE1 8Ch EEDAT 10Ch EECON1 18Ch
PIR2 0Dh PIE2 8Dh EEADR 10Dh EECON2(1) 18Dh
TMR1L 0Eh PCON 8Eh EEDATH 10Eh Reserved 18Eh
TMR1H 0Fh OSCCON 8Fh EEADRH 10Fh Reserved 18Fh
T1CON 10h OSCTUNE 90h
General
Purpose
Registers
16 Bytes
110h
General
Purpose
Registers
16 Bytes
190h
TMR2 11h SSPCON2 91h 111h 191h
T2CON 12h PR2 92h 112h 192h
SSPBUF 13h SSPADD 93h 113h 193h
SSPCON 14h SSPSTAT 94h 114h 194h
CCPR1L 15h WPUB 95h 115h 195h
CCPR1H 16h IOCB 96h 116h 196h
CCP1CON 17h VRCON 97h 117h 197h
RCSTA 18h TXSTA 98h 118h 198h
TXREG 19h SPBRG 99h 119h 199h
RCREG 1Ah SPBRGH 9Ah 11Ah 19Ah
CCPR2L 1Bh PWM1CON 9Bh 11Bh 19Bh
CCPR2H 1Ch ECCPAS 9Ch 11Ch 19Ch
CCP2CON 1Dh PSTRCON 9Dh 11Dh 19Dh
ADRESH 1Eh ADRESL 9Eh 11Eh 19Eh
ADCON0 1Fh ADCON1 9Fh 11Fh 19Fh
General
Purpose
Registers
96 Bytes
20h
3Fh
General
Purpose
Registers
80 Bytes
A0h
General
Purpose
Registers
80 Bytes
120h
General
Purpose
Registers
80 Bytes
1A0h
40h
6Fh EFh 16Fh 1EFh
70h accesses
70h-7Fh
F0h accesses
70h-7Fh
170h accesses
70h-7Fh
1F0h
7Fh FFh 17Fh 1FFh
Bank 0Bank 1Bank 2Bank 3
Unimplemented data memory locations, read as ‘0’.
Note 1: Not a physical register.
2: PIC16F887 only.
PIC16F882/883/884/886/887
DS41291G-page 28 2006-2012 Microchip Technology Inc.
TABLE 2-1: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 0
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 0
00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx
01h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 0000 0000
03h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu(5)
04h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
05h PORTA(3) RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxxx xxxx 0000 0000
06h PORTB(3) RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 0000 0000
07h PORTC(3) RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx 0000 0000
08h PORTD(3,4) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 0000 0000
09h PORTE(3) — — — —RE3RE2
(4) RE1(4) RE0(4) ---- xxxx ---- 0000
0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 ---0 0000
0Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 0000 000u
0Ch PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF -000 0000 0000 0000
0Dh PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF — CCP2IF 0000 00-0 0000 0000
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu
11h TMR2 Timer2 Module Register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON(2) WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
15h CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 0000 0000
18h RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 0000
19h TXREG EUSART Transmit Data Register 0000 0000 0000 0000
1Ah RCREG EUSART Receive Data Register 0000 0000 0000 0000
1Bh CCPR2L Capture/Compare/PWM Register 2 Low Byte (LSB) xxxx xxxx uuuu uuuu
1Ch CCPR2H Capture/Compare/PWM Register 2 High Byte (MSB) xxxx xxxx uuuu uuuu
1Dh CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 --00 000
1Eh ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu
1Fh ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/
DONE
ADON 0000 0000 00-0 0000
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset do not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: When SSPCON register bits SSPM<3:0> = 1001, any reads or writes to the SSPADD SFR address are accessed through the SSPMSK
register. See Registers 13-2 and 13-4 for more details.
3: Port pins with analog functions controlled by the ANSEL and ANSELH registers will read ‘0’ immediately after a Reset even though the data
latches are either undefined (POR) or unchanged (other Resets).
4: PIC16F884/PIC16F887 only.
5: See Table 14-5 for Reset value for specific condition.
2006-2012 Microchip Technology Inc. DS41291G-page 29
PIC16F882/883/884/886/887
TABLE 2-2: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 1
80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx
81h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 0000 0000
83h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu(5)
84h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
85h TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 1111 1111 1111 1111
86h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
87h TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 1111 1111 1111 1111
88h TRISD(3) TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111
89h TRISE — — — — TRISE3 TRISE2(3) TRISE1(3) TRISE0(3) ---- 1111 ---- 1111
8Ah PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 0000 000u
8Ch PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE -000 0000 0000 0000
8Dh PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE — CCP2IE 0000 00-0 0000 0000
8Eh PCON —— ULPWUE SBOREN ——PORBOR --01 --qq --0u --uu(4,6)
8Fh OSCCON — IRCF2 IRCF1 IRCF0 OSTS HTS LTS SCS -110 q000 -110 q000
90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu
91h SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000
92h PR2 Timer2 Period Register 1111 1111 1111 1111
93h SSPADD(2) Synchronous Serial Port (I2C mode) Address Register 0000 0000 0000 0000
93h SSPMSK(2) MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0 1111 1111 1111 1111
94h SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 0000 0000
95h WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 1111 1111 1111 1111
96h IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 0000 0000 0000 0000
97h VRCON VREN VROE VRR VRSS VR3 VR2 VR1 VR0 0000 0000 0000 0000
98h TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 -010
99h SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 0000 0000 0000 0000
9Ah SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 0000 0000 0000 0000
9Bh PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 0000 0000 0000 0000
9Ch ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 0000 0000 0000 0000
9Dh PSTRCON — — — STRSYNC STRD STRC STRB STRA ---0 0001 ---0 0001
9Eh ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu
9Fh ADCON1 ADFM —VCFG1VCFG0— — — — 0-00 ---- 0-00 ----
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset do not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the mismatch
exists.
2: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
3: PIC16F884/PIC16F887 only.
4: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
5: See Table 14-5 for Reset value for specific condition.
6: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
PIC16F882/883/884/886/887
DS41291G-page 30 2006-2012 Microchip Technology Inc.
TABLE 2-3: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 2
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 2
100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx
101h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
102h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 0000 0000
103h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu(3)
104h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
105h WDTCON — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN ---0 1000 ---0 1000
106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 0000 0000
107h CM1CON0 C1ON C1OUT C1OE C1POL — C1R C1CH1 C1CH0 0000 -000 0000 0-00
108h CM2CON0 C2ON C2OUT C2OE C2POL — C2R C2CH1 C2CH0 0000 -000 0000 0-00
109h CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —— T1GSS C2SYNC 0000 --10 0000 0--0
10Ah PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
10Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 0000 000u
10Ch EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 0000 0000 0000 0000
10Dh EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 0000 0000 0000 0000
10Eh EEDATH — — EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0 --00 0000 --00 0000
10Fh EEADRH — — — EEADRH4(2) EEADRH3 EEADRH2 EEADRH1 EEADRH0 ---- 0000 ---0 0000
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset does not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: PIC16F886/PIC16F887 only.
3: See Table 14-5 for Reset value for specific condition.
TABLE 2-4: PIC16F882/883/884/886/887 SPECIAL FUNCTION REGISTERS SUMMARY BANK 3
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 3
180h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx
181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
182h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 0000 0000
183h STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 000q quuu(3)
184h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
185h SRCON SR1 SR0 C1SEN C2REN PULSS PULSR — FVREN 0000 00-0 0000 00-0
186h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111
187h BAUDCTL ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 01-0 0-00
188h ANSEL ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0 1111 1111 1111 1111
189h ANSELH —— ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 --11 1111 1111 1111
18Ah PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 ---0 0000
18Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF(1) 0000 000x 0000 000u
18Ch EECON1 EEPGD — — — WRERR WREN WR RD x--- x000 ---- q000
18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- ---- ----
Legend: – = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Note 1: MCLR and WDT Reset does not affect the previous value data latch. The RBIF bit will be cleared upon Reset but will set again if the
mismatch exists.
2: PIC16F884/PIC16F887 only.
3: See Table 14-5 for Reset value for specific condition.
2006-2012 Microchip Technology Inc. DS41291G-page 31
PIC16F882/883/884/886/887
2.2.2.1 STATUS Register
The STATUS register, shown in Register 2-1, contains:
• the arithmetic status of the ALU
• the Reset status
• the bank select bits for data memory (GPR and
SFR)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS, will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not affect-
ing any Status bits, see Section 15.0 “Instruction Set
Summary”
REGISTER DEFINITIONS: STATUS
Note 1: The C and DC bits operate as a Borrow
and Digit Borrow out bit, respectively, in
subtraction.
REGISTER 2-1: STATUS: STATUS REGISTER
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD ZDC
(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h-1FFh)
0 = Bank 0, 1 (00h-FFh)
bit 6-5 RP<1:0>: Register Bank Select bits (used for direct addressing)
00 = Bank 0 (00h-7Fh)
01 = Bank 1 (80h-FFh)
10 = Bank 2 (100h-17Fh)
11 = Bank 3 (180h-1FFh)
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second
operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the
source register.
PIC16F882/883/884/886/887
DS41291G-page 32 2006-2012 Microchip Technology Inc.
2.2.2.2 OPTION Register
The OPTION register, shown in Register 2-2, is a
readable and writable register, which contains various
control bits to configure:
• Timer0/WDT prescaler
• External INT interrupt
•Timer0
• Weak pull-ups on PORTB
REGISTER DEFINITIONS: OPTION REGISTER
Note: To achieve a 1:1 prescaler assignment for
Timer0, assign the prescaler to the WDT
by setting PSA bit of the OPTION register
to ‘1’. See Section 6.3 “Timer1 Pres-
caler”.
REGISTER 2-2: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 T0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value Timer0 Rate WDT Rate
2006-2012 Microchip Technology Inc. DS41291G-page 33
PIC16F882/883/884/886/887
2.2.2.3 INTCON Register
The INTCON register, shown in Register 2-3, is a
readable and writable register, which contains the various
enable and flag bits for TMR0 register overflow, PORTB
change and external INT pin interrupts.
REGISTER DEFINITIONS: INTERRUPT CONTROL
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE PEIE T0IE INTE RBIE(1) T0IF(2) INTF RBIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 T0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3 RBIE: PORTB Change Interrupt Enable bit(1)
1 = Enables the PORTB change interrupt
0 = Disables the PORTB change interrupt
bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2)
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred (must be cleared in software)
0 = The INT external interrupt did not occur
bit 0 RBIF: PORTB Change Interrupt Flag bit
1 = When at least one of the PORTB general purpose I/O pins changed state (must be cleared in software)
0 = None of the PORTB general purpose I/O pins have changed state
Note 1: IOCB register must also be enabled.
2: T0IF bit is set when Timer0 rolls over. Timer0 is unchanged on Reset and should be initialized before clearing
T0IF bit.
PIC16F882/883/884/886/887
DS41291G-page 34 2006-2012 Microchip Technology Inc.
2.2.2.4 PIE1 Register
The PIE1 register contains the interrupt enable bits, as
shown in Register 2-4.
REGISTER DEFINITIONS: PIE1
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 RCIE: EUSART Receive Interrupt Enable bit
1 = Enables the EUSART receive interrupt
0 = Disables the EUSART receive interrupt
bit 4 TXIE: EUSART Transmit Interrupt Enable bit
1 = Enables the EUSART transmit interrupt
0 = Disables the EUSART transmit interrupt
bit 3 SSPIE: Master Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
2006-2012 Microchip Technology Inc. DS41291G-page 35
PIC16F882/883/884/886/887
2.2.2.5 PIE2 Register
The PIE2 register contains the interrupt enable bits, as
shown in Register 2-5.
REGISTER DEFINITIONS: PIE2
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 2-5: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
OSFIE C2IE C1IE EEIE BCLIE ULPWUIE — CCP2IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables oscillator fail interrupt
0 = Disables oscillator fail interrupt
bit 6 C2IE: Comparator C2 Interrupt Enable bit
1 = Enables Comparator C2 interrupt
0 = Disables Comparator C2 interrupt
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables Comparator C1 interrupt
0 = Disables Comparator C1 interrupt
bit 4 EEIE: EEPROM Write Operation Interrupt Enable bit
1 = Enables EEPROM write operation interrupt
0 = Disables EEPROM write operation interrupt
bit 3 BCLIE: Bus Collision Interrupt Enable bit
1 = Enables Bus Collision interrupt
0 = Disables Bus Collision interrupt
bit 2 ULPWUIE: Ultra Low-Power Wake-up Interrupt Enable bit
1 = Enables Ultra Low-Power Wake-up interrupt
0 = Disables Ultra Low-Power Wake-up interrupt
bit 1 Unimplemented: Read as ‘0’
bit 0 CCP2IE: CCP2 Interrupt Enable bit
1 = Enables CCP2 interrupt
0 = Disables CCP2 interrupt
PIC16F882/883/884/886/887
DS41291G-page 36 2006-2012 Microchip Technology Inc.
2.2.2.6 PIR1 Register
The PIR1 register contains the interrupt flag bits, as
shown in Register 2-6.
REGISTER DEFINITIONS: PIR1
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
REGISTER 2-6: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
U-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
—ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = A/D conversion complete (must be cleared in software)
0 = A/D conversion has not completed or has not been started
bit 5 RCIF: EUSART Receive Interrupt Flag bit
1 = The EUSART receive buffer is full (cleared by reading RCREG)
0 = The EUSART receive buffer is not full
bit 4 TXIF: EUSART Transmit Interrupt Flag bit
1 = The EUSART transmit buffer is empty (cleared by writing to TXREG)
0 = The EUSART transmit buffer is full
bit 3 SSPIF: Master Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = The MSSP interrupt condition has occurred, and must be cleared in software before returning from the Interrupt Service Rou-
tine. The conditions that will set this bit are:
SPI
A transmission/reception has taken place
I2 C Slave/Master
A transmission/reception has taken place
I2 C Master
The initiated Start condition was completed by the MSSP module
The initiated Stop condition was completed by the MSSP module
The initiated restart condition was completed by the MSSP module
The initiated Acknowledge condition was completed by the MSSP module
A Start condition occurred while the MSSP module was idle (Multi-master system)
A Stop condition occurred while the MSSP module was idle (Multi-master system)
0 = No MSSP interrupt condition has occurred
bit 2 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = A Timer2 to PR2 match occurred (must be cleared in software)
0 = No Timer2 to PR2 match occurred
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = The TMR1 register overflowed (must be cleared in software)
0 = The TMR1 register did not overflow
2006-2012 Microchip Technology Inc. DS41291G-page 37
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2.2.2.7 PIR2 Register
The PIR2 register contains the interrupt flag bits, as
shown in Register 2-7.
REGISTER DEFINITIONS: PIR2
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
REGISTER 2-7: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
OSFIF C2IF C1IF EEIF BCLIF ULPWUIF — CCP2IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 OSFIF: Oscillator Fail Interrupt Flag bit
1 = System oscillator failed, clock input has changed to INTOSC (must be cleared in software)
0 = System clock operating
bit 6 C2IF: Comparator C2 Interrupt Flag bit
1 = Comparator output (C2OUT bit) has changed (must be cleared in software)
0 = Comparator output (C2OUT bit) has not changed
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Comparator output (C1OUT bit) has changed (must be cleared in software)
0 = Comparator output (C1OUT bit) has not changed
bit 4 EEIF: EE Write Operation Interrupt Flag bit
1 = Write operation completed (must be cleared in software)
0 = Write operation has not completed or has not started
bit 3 BCLIF: Bus Collision Interrupt Flag bit
1 = A bus collision has occurred in the MSSP when configured for I2C Master mode
0 = No bus collision has occurred
bit 2 ULPWUIF: Ultra Low-Power Wake-up Interrupt Flag bit
1 = Wake-up condition has occurred (must be cleared in software)
0 = No Wake-up condition has occurred
bit 1 Unimplemented: Read as ‘0’
bit 0 CCP2IF: CCP2 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TMR1 register capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode
PIC16F882/883/884/886/887
DS41291G-page 38 2006-2012 Microchip Technology Inc.
2.2.2.8 PCON Register
The Power Control (PCON) register (see Register 2-8)
contains flag bits to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Watchdog Timer Reset (WDT)
• External MCLR Reset
The PCON register also controls the Ultra Low-Power
Wake-up and software enable of the BOR.
REGISTER DEFINITIONS: PCON
REGISTER 2-8: PCON: POWER CONTROL REGISTER
U-0 U-0 R/W-0 R/W-1 U-0 U-0 R/W-0 R/W-x
—— ULPWUE SBOREN(1) ——PORBOR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5 ULPWUE: Ultra Low-Power Wake-up Enable bit
1 = Ultra Low-Power Wake-up enabled
0 = Ultra Low-Power Wake-up disabled
bit 4 SBOREN: Software BOR Enable bit(1)
1 = BOR enabled
0 = BOR disabled
bit 3-2 Unimplemented: Read as ‘0’
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Note 1: BOREN<1:0> = 01 in the Configuration Word Register 1 for this bit to control the BOR.
2006-2012 Microchip Technology Inc. DS41291G-page 39
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2.3 PCL and PCLATH
The Program Counter (PC) is 13 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<12:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 2-7 shows the two
situations for the loading of the PC. The upper example
in Figure 2-7 shows how the PC is loaded on a write to
PCL (PCLATH<4:0> PCH). The lower example in
Figure 2-7 shows how the PC is loaded during a CALL or
GOTO instruction (PCLATH<4:3> PCH).
FIGURE 2-7: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<12:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper 5 bits to the PCLATH register.
When the lower 8 bits are written to the PCL register, all
13 bits of the program counter will change to the values
contained in the PCLATH register and those being
written to the PCL register.
A computed GOTO is accomplished by adding an offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFF to 0x00 in the middle of
the table, then PCLATH must be incremented for each
address rollover that occurs between the table
beginning and the target location within the table.
For more information refer to Application Note AN556,
“Implementing a Table Read” (DS00556).
2.3.2 STACK
The PIC16F882/883/884/886/887 devices have an
8-level x 13-bit wide hardware stack (see Figures 2-2
and 2-3). The stack space is not part of either program
or data space and the Stack Pointer is not readable or
writable. The PC is PUSHed onto the stack when a
CALL instruction is executed or an interrupt causes a
branch. The stack is POPed in the event of a RETURN,
RETLW or a RETFIE instruction execution. PCLATH is
not affected by a PUSH or POP operation.
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
2.4 Indirect Addressing, INDF and
FSR Registers
The INDF register is not a physical register. Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register actually
accesses data pointed to by the File Select Register
(FSR). Reading INDF itself indirectly will produce 00h.
Writing to the INDF register indirectly results in a no
operation (although Status bits may be affected). An
effective 9-bit address is obtained by concatenating the
8-bit FSR and the IRP bit of the STATUS register, as
shown in Figure 2-8.
A simple program to clear RAM location 20h-2Fh using
indirect addressing is shown in Example 2-1.
EXAMPLE 2-1: INDIRECT ADDRESSING
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
ALU Result
GOTO, CALL
OPCODE<10:0>
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
PCL as
Destination
Note 1: There are no Status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interrupt address.
MOVLW 0x20 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR,4 ;all done?
GOTO NEXT ;no clear next
CONTINUE ;yes continue
PIC16F882/883/884/886/887
DS41291G-page 40 2006-2012 Microchip Technology Inc.
FIGURE 2-8: DIRECT/INDIRECT ADDRESSING PIC16F882/883/884/886/887
Note: For memory map detail, see Figures 2-2 and 2-3.
Data
Memory
Indirect AddressingDirect Addressing
Bank Select Location Select
RP1 RP0 6 0
From Opcode IRP File Select Register
70
Bank Select Location Select
00 01 10 11
180h
1FFh
00h
7Fh
Bank 0 Bank 1 Bank 2 Bank 3
2006-2012 Microchip Technology Inc. DS41291G-page 41
PIC16F882/883/884/886/887
3.0 I/O PORTS
There are as many as thirty-five general purpose I/O
pins available. Depending on which peripherals are
enabled, some or all of the pins may not be available as
general purpose I/O. In general, when a peripheral is
enabled, the associated pin may not be used as a
general purpose I/O pin.
3.1 PORTA and the TRISA Registers
PORTA is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 3-2). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a TRISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). Example 3-1 shows how to
initialize PORTA.
Reading the PORTA register (Register 3-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch.
The TRISA register (Register 3-2) controls the PORTA
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISA register are maintained set when using them as
analog inputs. I/O pins configured as analog input
always read ‘0’.
EXAMPLE 3-1: INITIALIZING PORTA
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’.
BANKSEL PORTA ;
CLRF PORTA ;Init PORTA
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O
BANKSEL TRISA ;
MOVLW 0Ch ;Set RA<3:2> as inputs
MOVWF TRISA ;and set RA<5:4,1:0>
;as outputs
REGISTER 3-1: PORTA: PORTA REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RA<7:0>: PORTA I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-2: TRISA: PORTA TRI-STATE REGISTER
R/W-1(1) R/W-1(1) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISA<7:0>: PORTA Tri-State Control bit
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
Note 1: TRISA<7:6> always reads ‘1’ in XT, HS and LP Oscillator modes.
PIC16F882/883/884/886/887
DS41291G-page 42 2006-2012 Microchip Technology Inc.
3.2 Additional Pin Functions
RA0 also has an Ultra Low-Power Wake-up option. The
next three sections describe these functions.
3.2.1 ANSEL REGISTER
The ANSEL register (Register 3-3) is used to configure
the Input mode of an I/O pin to analog. Setting the
appropriate ANSEL bit high will cause all digital reads
on the pin to be read as ‘0’ and allow analog functions
on the pin to operate correctly.
The state of the ANSEL bits has no affect on digital out-
put functions. A pin with TRIS clear and ANSEL set will
still operate as a digital output, but the Input mode will
be analog. This can cause unexpected behavior when
executing read-modify-write instructions on the
affected port.
REGISTER 3-3: ANSEL: ANALOG SELECT REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
ANS7(2) ANS6(2) ANS5(2) ANS4 ANS3 ANS2 ANS1 ANS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ANS<7:0>: Analog Select bits
Analog select between analog or digital function on pins AN<7:0>, respectively.
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
2: Not implemented on PIC16F883/886.
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PIC16F882/883/884/886/887
3.2.2 ULTRA LOW-POWER WAKE-UP
The Ultra Low-Power Wake-up (ULPWU) on RA0 allows
a slow falling voltage to generate an interrupt-on-change
on RA0 without excess current consumption. The mode
is selected by setting the ULPWUE bit of the PCON
register. This enables a small current sink, which can be
used to discharge a capacitor on RA0.
Follow these steps to use this feature:
a) Charge the capacitor on RA0 by configuring the
RA0 pin to output (= 1).
b) Configure RA0 as an input.
c) Set the ULPWUIE bit of the PIE2 register to
enable interrupt.
d) Set the ULPWUE bit of the PCON register to
begin the capacitor discharge.
e) Execute a SLEEP instruction.
When the voltage on RA0 drops below VIL, an interrupt
will be generated which will cause the device to
wake-up and execute the next instruction. If the GIE bit
of the INTCON register is set, the device will then call
the interrupt vector (0004h).
This feature provides a low-power technique for
periodically waking up the device from Sleep. The
time-out is dependent on the discharge time of the RC
circuit on RA0. See Example 3-2 for initializing the
Ultra Low-Power Wake-up module.
A series resistor between RA0 and the external
capacitor provides overcurrent protection for the
RA0/AN0/ULPWU/C12IN0- pin and can allow for
software calibration of the time-out (see Figure 3-1). A
timer can be used to measure the charge time and
discharge time of the capacitor. The charge time can
then be adjusted to provide the desired interrupt delay.
This technique will compensate for the affects of
temperature, voltage and component accuracy. The
Ultra Low-Power Wake-up peripheral can also be
configured as a simple Programmable Low Voltage
Detect or temperature sensor.
EXAMPLE 3-2: ULTRA LOW-POWER
WAKE-UP INITIALIZATION
Note: For more information, refer to AN879,
“Using the Microchip Ultra Low-Power
Wake-up Module” Application Note
(DS00879).
BANKSEL PORTA ;
BSF PORTA,0 ;Set RA0 data latch
BANKSEL ANSEL ;
BCF ANSEL,0 ;RA0 to digital I/O
BANKSEL TRISA ;
BCF TRISA,0 ;Output high to
CALL CapDelay ;charge capacitor
BANKSEL PIR2 ;
BCF PIR2,ULPWUIF ;Clear flag
BANKSEL PCON
BSF PCON,ULPWUE ;Enable ULP Wake-up
BSF TRISA,0 ;RA0 to input
BSF PIE2, ULPWUIE ;Enable interrupt
MOVLW B’11000000’ ;Enable peripheral
MOVWF INTCON ;interrupt
SLEEP ;Wait for IOC
NOP ;
PIC16F882/883/884/886/887
DS41291G-page 44 2006-2012 Microchip Technology Inc.
3.2.3 PIN DESCRIPTIONS AND
DIAGRAMS
Each PORTA pin is multiplexed with other functions. The
pins and their combined functions are briefly described
here. For specific information about individual functions
such as the comparator or the A/D Converter (ADC),
refer to the appropriate section in this data sheet.
3.2.3.1 RA0/AN0/ULPWU/C12IN0-
Figure 3-1 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a negative analog input to Comparator C1 or C2
• an analog input for the Ultra Low-Power Wake-up
FIGURE 3-1: BLOCK DIAGRAM OF RA0
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
RD
WR
WR
RD
To Comparator
Analog(1)
Input Mode
01
IULP
Data Bus
PORTA
TRISA
TRISA
PORTA
Note 1: ANSEL determines Analog Input mode.
-
+V
TRG
ULPWUE
To A/D Converter
VSS
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PIC16F882/883/884/886/887
3.2.3.2 RA1/AN1/C12IN1-
Figure 3-2 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a negative analog input to Comparator C1 or C2
FIGURE 3-2: BLOCK DIAGRAM OF RA1
3.2.3.3 RA2/AN2/VREF-/CVREF/C2IN+
Figure 3-3 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a negative voltage reference input for the ADC
and CVREF
• a comparator voltage reference output
• a positive analog input to Comparator C2
FIGURE 3-3: BLOCK DIAGRAM OF RA2
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
To Comparator
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
To Comparator (VREF-)
Note 1: ANSEL determines Analog Input mode.
To Comparator (positive input)
CVREF
VROE
To A/D Converter (VREF-)
To A/D Converter (analog channel)
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DS41291G-page 46 2006-2012 Microchip Technology Inc.
3.2.3.4 RA3/AN3/VREF+/C1IN+
Figure 3-4 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose input
• an analog input for the ADC
• a positive voltage reference input for the ADC and
CVREF
• a positive analog input to Comparator C1
FIGURE 3-4: BLOCK DIAGRAM OF RA3
3.2.3.5 RA4/T0CKI/C1OUT
Figure 3-5 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a clock input for Timer0
• a digital output from Comparator C1
FIGURE 3-5: BLOCK DIAGRAM OF RA4
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
Note 1: ANSEL determines Analog Input mode.
To Comparator (VREF+)
To Comparator (positive input)
To A/D Converter (VREF+)
To A/D Converter (analog channel)
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
0
1
C1OUT
C1OUT
Enable
To Tim er 0
2006-2012 Microchip Technology Inc. DS41291G-page 47
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3.2.3.6 RA5/AN4/SS/C2OUT
Figure 3-6 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a slave select input
• a digital output from Comparator C2
FIGURE 3-6: BLOCK DIAGRAM OF RA5
3.2.3.7 RA6/OSC2/CLKOUT
Figure 3-7 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a crystal/resonator connection
• a clock output
FIGURE 3-7: BLOCK DIAGRAM OF RA6
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
0
1
C2OUT
C2OUT
Enable
To S S Input
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
FOSC/4
OSC2
CLKOUT
0
1
CLKOUT
Enable
Enable
INTOSCIO/
EXTRCIO/EC(1)
CLKOUT
Enable
Note 1: With I/O option.
Circuit
Oscillator
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3.2.3.8 RA7/OSC1/CLKIN
Figure 3-8 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a crystal/resonator connection
• a clock input
FIGURE 3-8: BLOCK DIAGRAM OF RA7
TABLE 3-1: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTA
WR
PORTA
WR
TRISA
RD
TRISA
INTOSC
Mode
OSC1
CLKIN
Circuit
Oscillator
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 108
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 42
CM1CON0 C1ON C1OUT C1OE C1POL — C1R C1CH1 C1CH0 93
CM2CON0 C2ON C2OUT C2OE C2POL — C2R C2CH1 C2CH0 94
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —— T1GSS C2SYNC 96
PCON ——ULPWUESBOREN——PORBOR 38
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 32
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 41
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 185
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 41
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
2006-2012 Microchip Technology Inc. DS41291G-page 49
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3.3 PORTB and TRISB Registers
PORTB is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISB
(Register 3-6). Setting a TRISB bit (= 1) will make the
corresponding PORTB pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISB bit (= 0) will make the corresponding
PORTB pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 3-3 shows how to initialize PORTB.
Reading the PORTB register (Register 3-5) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch.
The TRISB register (Register 3-6) controls the PORTB
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISB register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’. Example 3-3 shows how to initialize PORTB.
EXAMPLE 3-3: INITIALIZING PORTB
3.4 Additional PORTB Pin Functions
PORTB pins RB<7:0> on the device family device have
an interrupt-on-change option and a weak pull-up
option. The following three sections describe these
PORTB pin functions.
Every PORTB pin on this device family has an
interrupt-on-change option and a weak pull-up option.
3.4.1 ANSELH REGISTER
The ANSELH register (Register 3-4) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELH bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELH bits has no affect on digital
output functions. A pin with TRIS clear and ANSELH
set will still operate as a digital output, but the Input
mode will be analog. This can cause unexpected
behavior when executing read-modify-write
instructions on the affected port.
3.4.2 WEAK PULL-UPS
Each of the PORTB pins has an individually configurable
internal weak pull-up. Control bits WPUB<7:0> enable or
disable each pull-up (see Register 3-7). Each weak
pull-up is automatically turned off when the port pin is
configured as an output. All pull-ups are disabled on a
Power-on Reset by the RBPU bit of the OPTION register.
3.4.3 INTERRUPT-ON-CHANGE
All of the PORTB pins are individually configurable as an
interrupt-on-change pin. Control bits IOCB<7:0> enable
or disable the interrupt function for each pin. Refer to
Register 3-8. The interrupt-on-change feature is
disabled on a Power-on Reset.
For enabled interrupt-on-change pins, the present value
is compared with the old value latched on the last read
of PORTB to determine which bits have changed or
mismatched the old value. The ‘mismatch’ outputs of
the last read are OR’d together to set the PORTB
Change Interrupt flag bit (RBIF) in the INTCON register.
This interrupt can wake the device from Sleep. The user,
in the Interrupt Service Routine, clears the interrupt by:
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear the flag bit RBIF.
A mismatch condition will continue to set flag bit RBIF.
Reading or writing PORTB will end the mismatch
condition and allow flag bit RBIF to be cleared. The latch
holding the last read value is not affected by a MCLR nor
Brown-out Reset. After these Resets, the RBIF flag will
continue to be set if a mismatch is present.
Note: The ANSELH register must be initialized
to configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’.
BANKSEL PORTB ;
CLRF PORTB ;Init PORTB
BANKSEL TRISB ;
MOVLW B‘11110000’ ;Set RB<7:4> as inputs
;and RB<3:0> as outputs
MOVWF TRISB ;
Note: If a change on the I/O pin should occur
when the read operation is being executed
(start of the Q2 cycle), then the RBIF
interrupt flag may not get set. Furthermore,
since a read or write on a port affects all bits
of that port, care must be taken when using
multiple pins in Interrupt-on-Change mode.
Changes on one pin may not be seen while
servicing changes on another pin.
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REGISTER 3-4: ANSELH: ANALOG SELECT HIGH REGISTER
U-0 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
—— ANS13 ANS12 ANS11 ANS10 ANS9 ANS8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 ANS<13:8>: Analog Select bits
Analog select between analog or digital function on pins AN<13:8>, respectively.
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
REGISTER 3-5: PORTB: PORTB REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RB<7:0>: PORTB I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-6: TRISB: PORTB TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISB<7:0>: PORTB Tri-State Control bit
1 = PORTB pin configured as an input (tri-stated)
0 = PORTB pin configured as an output
2006-2012 Microchip Technology Inc. DS41291G-page 51
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REGISTER 3-7: WPUB: WEAK PULL-UP PORTB REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 WPUB<7:0>: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global RBPU bit of the OPTION register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
REGISTER 3-8: IOCB: INTERRUPT-ON-CHANGE PORTB REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 IOCB<7:0>: Interrupt-on-Change PORTB Control bit
1 = Interrupt-on-change enabled
0 = Interrupt-on-change disabled
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3.4.4 PIN DESCRIPTIONS AND
DIAGRAMS
Each PORTB pin is multiplexed with other functions. The
pins and their combined functions are briefly described
here. For specific information about individual functions
such as the SSP, I2C or interrupts, refer to the appropriate
section in this data sheet.
3.4.4.1 RB0/AN12/INT
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• an external edge triggered interrupt
3.4.4.2 RB1/AN10/P1C(1)/C12IN3-
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a PWM output(1)
• an analog input to Comparator C1 or C2
3.4.4.3 RB2/AN8/P1B(1)
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a PWM output(1)
3.4.4.4 RB3/AN9/PGM/C12IN2-
Figure 3-9 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• Low-voltage In-Circuit Serial Programming enable
pin
• an analog input to Comparator C1 or C2
FIGURE 3-9: BLOCK DIAGRAM OF
RB<3:0>
Note 1: P1C is available on PIC16F882/883/886
only.
Note 1: P1B is available on PIC16F882/883/886
only.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
Weak
Analog(1)
Input Mode
Data Bus
WR
WPUB
RD
WPUB
WR
PORTB
WR
TRISB
RD
TRISB
To A/D Converter
RB0/INT
Analog(1)
Input Mode
RBPU
Note 1: ANSELH determines Analog Input mode.
RB3/PGM
To Comparator (RB1, RB3)
D
Q
CK
Q
D
EN
Q
D
EN
Q
RD PORTB
RD
PORTB
WR
IOCB
RD
IOCB
Interrupt-on-
Change
Q3
1
0
CCP1OUT Enable
CCP1OUT
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3.4.4.5 RB4/AN11/P1D(1)
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a PWM output(1)
3.4.4.6 RB5/AN13/T1G
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an analog input for the ADC
• a Timer1 gate input
3.4.4.7 RB6/ICSPCLK
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• In-Circuit Serial Programming clock
3.4.4.8 RB7/ICSPDAT
Figure 3-10 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• In-Circuit Serial Programming data
Note 1: P1D is available on PIC16F882/883/886
only.
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DS41291G-page 54 2006-2012 Microchip Technology Inc.
FIGURE 3-10: BLOCK DIAGRAM OF RB<7:4>
TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELH —— ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 50
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 128
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL ——T1GSSC2SYNC 96
IOCB IOCB7 IOCB6 IOCB5 IOCB4 IOCB3 IOCB2 IOCB1 IOCB0 51
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 32
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 50
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 50
WPUB WPUB7 WPUB6 WPUB5 WPUB4 WPUB3 WPUB2 WPUB1 WPUB0 51
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used by PORTB.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
D
Q
CK
Q
VDD
D
EN
Q
D
EN
Q
Weak
Data Bus
WR
WPUB
RD
WPUB
RD PORTB
RD
PORTB
WR
PORTB
WR
TRISB
RD
TRISB
WR
IOCB
RD
IOCB
Interrupt-on-
Analog(1) Input Mode
RBPU
Change
Q3
Available on PIC16F882/PIC16F883/PIC16F886 only.
Note 1: ANSELH determines Analog Input mode.
2: Applies to RB<7:6> pins only).
3: Applies to RB5 pin only.
To A/D Converter
1
0
CCP1OUT Enable
CCP1OUT 0
1
1
0
Analog(1)
Input Mode
To Timer1 T1G(3)
ICSP™(2)
To ICSPCLK (RB6) and ICSPDAT (RB7)
2006-2012 Microchip Technology Inc. DS41291G-page 55
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3.5 PORTC and TRISC Registers
PORTC is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISC
(Register 3-10). Setting a TRISC bit (= 1) will make the
corresponding PORTC pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISC bit (= 0) will make the corresponding
PORTC pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 3-4 shows how to initialize PORTC.
Reading the PORTC register (Register 3-9) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch.
The TRISC register (Register 3-10) controls the PORTC
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISC register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-4: INITIALIZING PORTC
BANKSEL PORTC ;
CLRF PORTC ;Init PORTC
BANKSEL TRISC ;
MOVLW B‘00001100’ ;Set RC<3:2> as inputs
MOVWF TRISC ;and set RC<7:4,1:0>
;as outputs
REGISTER 3-9: PORTC: PORTC REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RC<7:0>: PORTC General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-10: TRISC: PORTC TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1(1) R/W-1(1)
TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISC<7:0>: PORTC Tri-State Control bit
1 = PORTC pin configured as an input (tri-stated)
0 = PORTC pin configured as an output
Note 1: TRISC<1:0> always reads ‘1’ in LP Oscillator mode.
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3.5.1 RC0/T1OSO/T1CKI
Figure 3-11 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a Timer1 oscillator output
• a Timer1 clock input
FIGURE 3-11: BLOCK DIAGRAM OF RC0
3.5.2 RC1/T1OSI/CCP2
Figure 3-12 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a Timer1 oscillator input
• a Capture input and Compare/PWM output for
Comparator C2
FIGURE 3-12: BLOCK DIAGRAM OF RC1
3.5.3 RC2/P1A/CCP1
Figure 3-13 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a PWM output
• a Capture input and Compare output for
Comparator C1
FIGURE 3-13: BLOCK DIAGRAM OF RC2
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To Timer1 clock input
T1OSCEN Circuit
Timer1 Oscillator
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To CCP2
CCP2
CCP2CON
0
1
1
0
T1OSCEN
T1OSCEN
Circuit
Timer1 Oscillator
T1OSI
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data bus
WR
PORTC
WR
TRISC
RD
TRISC
To Enhanced CCP1
RD
PORTC
CCP1/P1A
CCP1CON
0
1
1
0I/O Pin
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3.5.4 RC3/SCK/SCL
Figure 3-14 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a SPI clock
•an I
2C™ clock
FIGURE 3-14: BLOCK DIAGRAM OF RC3
3.5.5 RC4/SDI/SDA
Figure 3-15 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a SPI data I/O
•an I
2C data I/O
FIGURE 3-15: BLOCK DIAGRAM OF RC4
3.5.6 RC5/SDO
Figure 3-16 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a serial data output
FIGURE 3-16: BLOCK DIAGRAM OF RC5
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To SSPSR
SSPEN
0
1
1
0
SCK
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
To SSPSR
SSPEN
0
1
1
0
SDI/SDA
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
Port/SDO
0
1
1
0
SDO
Select
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3.5.7 RC6/TX/CK
Figure 3-17 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an asynchronous serial output
• a synchronous clock I/O
FIGURE 3-17: BLOCK DIAGRAM OF RC6
3.5.8 RC7/RX/DT
Figure 3-18 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• an asynchronous serial input
• a synchronous serial data I/O
FIGURE 3-18: BLOCK DIAGRAM OF RC7
TABLE 3-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
SPEN
TXEN
CK
TX
SYNC
EUSART
EUSART
0
1
1
0
0
1
1
0
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
RD
PORTC
WR
PORTC
WR
TRISC
RD
TRISC
SPEN
SYNC
EUSART
0
1
1
0
DT
EUSART RX/DT
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 128
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 129
PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 55
PSTRCON — — — STRSYNC STRD STRC STRB STRA 150
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 185
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 84
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTC.
2006-2012 Microchip Technology Inc. DS41291G-page 59
PIC16F882/883/884/886/887
3.6 PORTD and TRISD Registers
PORTD(1) is a 8-bit wide, bidirectional port. The
corresponding data direction register is TRISD
(Register 3-12). Setting a TRISD bit (= 1) will make the
corresponding PORTD pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISD bit (= 0) will make the corresponding
PORTD pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 3-5 shows how to initialize PORTD.
Reading the PORTD register (Register 3-11) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch.
The TRISD register (Register 3-12) controls the PORTD
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISD register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-5: INITIALIZING PORTD
Note 1: PORTD is available on PIC16F884/887
only.
BANKSEL PORTD ;
CLRF PORTD ;Init PORTD
BANKSEL TRISD ;
MOVLW B‘00001100’ ;Set RD<3:2> as inputs
MOVWF TRISD ;and set RD<7:4,1:0>
;as outputs
REGISTER 3-11: PORTD: PORTD REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 RD<7:0>: PORTD General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-12: TRISD: PORTD TRI-STATE REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 TRISD<7:0>: PORTD Tri-State Control bit
1 = PORTD pin configured as an input (tri-stated)
0 = PORTD pin configured as an output
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DS41291G-page 60 2006-2012 Microchip Technology Inc.
3.6.1 RD<4:0>
Figure 3-19 shows the diagram for these pins. These
pins are configured to function as general purpose
I/O’s.
FIGURE 3-19: BLOCK DIAGRAM OF
RD<4:0>
3.6.2 RD5/P1B(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a PWM output
3.6.3 RD6/P1C(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a PWM output
3.6.4 RD7/P1D(1)
Figure 3-20 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose I/O
• a PWM output
FIGURE 3-20: BLOCK DIAGRAM OF
RD<7:5>
TABLE 3-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD
Note: RD<4:0> is available on PIC16F884/887
only.
Note 1: RD5/P1B is available on PIC16F884/887
only. See RB2/AN8/P1B for this function
on PIC16F882/883/886.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
WR
PORTD
WR
TRISD
RD
TRISD
RD
PORTD
I/O Pin
Note 1: RD6/P1C is available on PIC16F884/887
only. See RB1/AN10/P1C/C12IN3- for
this function on PIC16F882/883/886.
Note 1: RD7/P1D is available on PIC16F884/887
only. See RB4/AN11/P1D for this function
on PIC16F882/883/886.
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Data Bus
WR
PORTD
WR
TRISD
RD
TRISD
RD
PORTD
CCP1
PSTRCON
0
1
1
0I/O Pin
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 59
PSTRCON — — — STRSYNC STRD STRC STRB STRA 150
TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 59
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTD.
2006-2012 Microchip Technology Inc. DS41291G-page 61
PIC16F882/883/884/886/887
3.7 PORTE and TRISE Registers
PORTE(1) is a 4-bit wide, bidirectional port. The
corresponding data direction register is TRISE. Setting a
TRISE bit (= 1) will make the corresponding PORTE pin
an input (i.e., put the corresponding output driver in a
High-Impedance mode). Clearing a TRISE bit (= 0) will
make the corresponding PORTE pin an output (i.e.,
enable the output driver and put the contents of the
output latch on the selected pin). The exception is RE3,
which is input only and its TRIS bit will always read as
‘1’. Example 3-6 shows how to initialize PORTE.
Reading the PORTE register (Register 3-13) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch. RE3 reads ‘0’ when
MCLRE = 1.
The TRISE register (Register 3-14) controls the PORTE
pin output drivers, even when they are being used as
analog inputs. The user should ensure the bits in the
TRISE register are maintained set when using them as
analog inputs. I/O pins configured as analog input always
read ‘0’.
EXAMPLE 3-6: INITIALIZING PORTE
Note 1: RE<2:0> pins are available on
PIC16F884/887 only.
Note: The ANSEL register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’.
BANKSEL PORTE ;
CLRF PORTE ;Init PORTE
BANKSEL ANSEL ;
CLRF ANSEL ;digital I/O
BCF STATUS,RP1 ;Bank 1
BANKSEL TRISE ;
MOVLW B‘00001100’ ;Set RE<3:2> as inputs
MOVWF TRISE ;and set RE<1:0>
;as outputs
REGISTER 3-13: PORTE: PORTE REGISTER
U-0 U-0 U-0 U-0 R-x R/W-x R/W-x R/W-x
— — — — RE3 RE2 RE1 RE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 RD<3:0>: PORTE General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 3-14: TRISE: PORTE TRI-STATE REGISTER
U-0 U-0 U-0 U-0 R-1(1) R/W-1 R/W-1 R/W-1
— — — — TRISE3 TRISE2 TRISE1 TRISE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 TRISE<3:0>: PORTE Tri-State Control bit
1 = PORTE pin configured as an input (tri-stated)
0 = PORTE pin configured as an output
Note 1: TRISE<3> always reads ‘1’.
PIC16F882/883/884/886/887
DS41291G-page 62 2006-2012 Microchip Technology Inc.
3.7.1 RE0/AN5(1)
This pin is configurable to function as one of the
following:
• a general purpose I/O
• an analog input for the ADC
3.7.2 RE1/AN6(1)
This pin is configurable to function as one of the
following:
• a general purpose I/O
• an analog input for the ADC
3.7.3 RE2/AN7(1)
This pin is configurable to function as one of the
following:
• a general purpose I/O
• an analog input for the ADC
FIGURE 3-21: BLOCK DIAGRAM OF
RE<2:0>
3.7.4 RE3/MCLR/VPP
Figure 3-22 shows the diagram for this pin. This pin is
configurable to function as one of the following:
• a general purpose input
• as Master Clear Reset with weak pull-up
FIGURE 3-22: BLOCK DIAGRAM OF RE3
Note 1: RE0/AN5 is available on PIC16F884/887
only.
Note 1: RE1/AN6 is available on PIC16F884/887
only.
Note 1: RE2/AN7 is available on PIC16F884/887
only.
I/O Pin
VDD
VSS
D
Q
CK
Q
D
Q
CK
Q
Analog(1)
Input Mode
Data Bus
RD
PORTE
WR
PORTE
WR
TRISE
RD
TRISE
To A/D Converter
Note 1: ANSEL determines Analog Input mode.
Input
VSS
Data Bus
RD
PORTE
Reset MCLRE
RD
TRISE VSS
MCLRE
VDD
Weak
MCLRE
Pin
2006-2012 Microchip Technology Inc. DS41291G-page 63
PIC16F882/883/884/886/887
TABLE 3-5: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 42
PORTE ———— RE3 RE2 RE1 RE0 61
TRISE ———— TRISE3 TRISE2 TRISE1 TRISE0 61
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTE
PIC16F882/883/884/886/887
DS41291G-page 64 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 65
PIC16F882/883/884/886/887
4.0 OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
4.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 4-1
illustrates a block diagram of the oscillator module.
Clock sources can be configured from external
oscillators, quartz crystal resonators, ceramic resonators
and Resistor-Capacitor (RC) circuits. In addition, the
system clock source can be configured from one of two
internal oscillators, with a choice of speeds selectable via
software. Additional clock features include:
• Selectable system clock source between external
or internal via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
The oscillator module can be configured in one of eight
clock modes.
1. EC – External clock with I/O on OSC2/CLKOUT.
2. LP – 32 kHz Low-Power Crystal mode.
3. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode.
4. HS – High Gain Crystal or Ceramic Resonator
mode.
5. RC – External Resistor-Capacitor (RC) with
FOSC/4 output on OSC2/CLKOUT.
6. RCIO – External Resistor-Capacitor (RC) with I/
O on OSC2/CLKOUT.
7. INTOSC – Internal oscillator with FOSC/4 output
on OSC2 and I/O on OSC1/CLKIN.
8. INTOSCIO – Internal oscillator with I/O on
OSC1/CLKIN and OSC2/CLKOUT.
Clock Source modes are configured by the FOSC<2:0>
bits in the Configuration Word Register 1 (CONFIG1).
The internal clock can be generated from two internal
oscillators. The HFINTOSC is a calibrated high-
frequency oscillator. The LFINTOSC is an uncalibrated
low-frequency oscillator.
FIGURE 4-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
(CPU and Peripherals)
OSC1
OSC2
Sleep
External Oscillator
LP, XT, HS, RC, RCIO, EC
System Clock
Postscaler
MUX
MUX
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
250 kHz
IRCF<2:0>
111
110
101
100
011
010
001
000
31 kHz
Power-up Timer (PWRT)
FOSC<2:0>
(Configuration Word Register 1)
SCS<0>
(OSCCON Register)
Internal Oscillator
(OSCCON Register)
Watchdog Timer (WDT)
Fail-Safe Clock Monitor (FSCM)
HFINTOSC
8 MHz
LFINTOSC
31 kHz
INTOSC
PIC16F882/883/884/886/887
DS41291G-page 66 2006-2012 Microchip Technology Inc.
4.2 Oscillator Control
The Oscillator Control (OSCCON) register (Figure 4-1)
controls the system clock and frequency selection
options. The OSCCON register contains the following
bits:
• Frequency selection bits (IRCF)
• Frequency Status bits (HTS, LTS)
• System clock control bits (OSTS, SCS)
REGISTER DEFINITIONS: OSCILLATOR CONTROL
REGISTER 4-1: OSCCON: OSCILLATOR CONTROL REGISTER
U-0 R/W-1 R/W-1 R/W-0 R-1 R-0 R-0 R/W-0
— IRCF2 IRCF1 IRCF0 OSTS(1) HTS LTS SCS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits
111 = 8 MHz
110 = 4 MHz (default)
101 = 2 MHz
100 = 1 MHz
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31 kHz (LFINTOSC)
bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)
1 = Device is running from the clock defined by FOSC<2:0> of the CONFIG1 register
0 = Device is running from the internal oscillator (HFINTOSC or LFINTOSC)
bit 2 HTS: HFINTOSC Status bit (High Frequency – 8 MHz to 125 kHz)
1 = HFINTOSC is stable
0 = HFINTOSC is not stable
bit 1 LTS: LFINTOSC Stable bit (Low Frequency – 31 kHz)
1 = LFINTOSC is stable
0 = LFINTOSC is not stable
bit 0 SCS: System Clock Select bit
1 = Internal oscillator is used for system clock
0 = Clock source defined by FOSC<2:0> of the CONFIG1 register
Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe
mode is enabled.
2006-2012 Microchip Technology Inc. DS41291G-page 67
PIC16F882/883/884/886/887
4.3 Clock Source Modes
Clock Source modes can be classified as external or
internal.
• External Clock modes rely on external circuitry for
the clock source. Examples are: oscillator mod-
ules (EC mode), quartz crystal resonators or
ceramic resonators (LP, XT and HS modes) and
Resistor-Capacitor (RC) mode circuits.
• Internal clock sources are contained internally
within the oscillator module. The oscillator module
has two internal oscillators: the 8 MHz High-
Frequency Internal Oscillator (HFINTOSC) and
the 31 kHz Low-Frequency Internal Oscillator
(LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bit of the OSCCON register. See Section 4.6
“Clock Switching” for additional information.
4.4 External Clock Modes
4.4.1 OSCILLATOR START-UP TIMER
(OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module. When switching between clock sources, a
delay is required to allow the new clock to stabilize.
These oscillator delays are shown in Table 4-1.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 4.7 “Two-
Speed Clock Start-up Mode”).
TABLE 4-1: OSCILLATOR DELAY EXAMPLES
4.4.2 EC MODE
The External Clock (EC) mode allows an externally
generated logic level as the system clock source. When
operating in this mode, an external clock source is
connected to the OSC1 input and the OSC2 is available
for general purpose I/O. Figure 4-2 shows the pin
connections for EC mode.
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 4-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Switch From Switch To Frequency Oscillator Delay
Sleep/POR LFINTOSC
HFINTOSC
31 kHz
125 kHz to 8 MHz Oscillator Warm-up Delay (TWARM)
Sleep/POR EC, RC DC – 20 MHz 2 cycles
LFINTOSC (31 kHz) EC, RC DC – 20 MHz 1 cycle of each
Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST)
LFINTOSC (31 kHz) HFINTOSC 125 kHz to 8 MHz 1 s (approx.)
OSC1/CLKIN
OSC2/CLKOUT(1)
I/O
Clock from
Ext. System
PIC® MCU
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview”.
PIC16F882/883/884/886/887
DS41291G-page 68 2006-2012 Microchip Technology Inc.
4.4.3 LP, XT, HS MODES
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 4-3). The mode selects a low,
medium or high gain setting of the internal inverter-
amplifier to support various resonator types and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifier. HS mode current consumption
is the highest of the three modes. This mode is best
suited for resonators that require a high drive setting.
Figure 4-3 and Figure 4-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
FIGURE 4-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 4-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator
OSC2/CLKOUT
2006-2012 Microchip Technology Inc. DS41291G-page 69
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4.4.4 EXTERNAL RC MODES
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required. There are two modes: RC and RCIO.
In RC mode, the RC circuit connects to OSC1. OSC2/
CLKOUT outputs the RC oscillator frequency divided
by 4. This signal may be used to provide a clock for
external circuitry, synchronization, calibration, test or
other application requirements. Figure 4-5 shows the
external RC mode connections.
FIGURE 4-5: EXTERNAL RC MODES
In RCIO mode, the RC circuit is connected to OSC1.
OSC2 becomes an additional general purpose I/O pin.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
4.5 Internal Clock Modes
The oscillator module has two independent, internal
oscillators that can be configured or selected as the
system clock source.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
8 MHz. The frequency of the HFINTOSC can be
user-adjusted via software using the OSCTUNE
register (Register 4-2).
2. The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<2:0> of the OSCCON register.
The system clock can be selected between external or
internal clock sources via the System Clock Selection
(SCS) bit of the OSCCON register. See Section 4.6
“Clock Switching” for more information.
4.5.1 INTOSC AND INTOSCIO MODES
The INTOSC and INTOSCIO modes configure the
internal oscillators as the system clock source when
the device is programmed using the oscillator selection
or the FOSC<2:0> bits in the Configuration Word
Register 1 (CONFIG1).
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT outputs the selected
internal oscillator frequency divided by 4. The CLKOUT
signal may be used to provide a clock for external
circuitry, synchronization, calibration, test or other
application requirements.
In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT
are available for general purpose I/O.
4.5.2 HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 8 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 4-2).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 4-1). One of seven
frequencies can be selected via software using the
IRCF<2:0> bits of the OSCCON register. See
Section 4.5.4 “Frequency Select Bits (IRCF)” for
more information.
The HFINTOSC is enabled by selecting any frequency
between 8 MHz and 125 kHz by setting the IRCF<2:0>
bits of the OSCCON register 000. Then, set the
System Clock Source (SCS) bit of the OSCCON
register to ‘1’ or enable Two-Speed Start-up by setting
the IESO bit in the Configuration Word Register 1
(CONFIG1) to ‘1’.
The HF Internal Oscillator (HTS) bit of the OSCCON
register indicates whether the HFINTOSC is stable or not.
OSC2/CLKOUT(1)
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Alternate pin functions are listed in the
Section 1.0 “Device Overview”.
2: Output depends upon RC or RCIO Clock
mode.
I/O(2)
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DS41291G-page 70 2006-2012 Microchip Technology Inc.
4.5.2.1 OSCTUNE Register
The HFINTOSC is factory calibrated but can be
adjusted in software by writing to the OSCTUNE
register (Register 4-2).
The default value of the OSCTUNE register is ‘0’. The
value is a 5-bit two’s complement number.
When the OSCTUNE register is modified, the
HFINTOSC frequency will begin shifting to the new
frequency. Code execution continues during this shift.
There is no indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
REGISTER 4-2: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 TUN<4:0>: Frequency Tuning bits
01111 = Maximum frequency
01110 =
•
•
•
00001 =
00000 = Oscillator module is running at the factory-calibrated frequency.
11111 =
•
•
•
10000 = Minimum frequency
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4.5.3 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a postscaler
and multiplexer (see Figure 4-1). Select 31 kHz, via
software, using the IRCF<2:0> bits of the OSCCON
register. See Section 4.5.4 “Frequency Select Bits
(IRCF)” for more information. The LFINTOSC is also the
frequency for the Power-up Timer (PWRT), Watchdog
Timer (WDT) and Fail-Safe Clock Monitor (FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<2:0> bits of the OSCCON register = 000) as the
system clock source (SCS bit of the OSCCON
register = 1), or when any of the following are enabled:
• Two-Speed Start-up IESO bit of the Configuration
Word Register 1 = 1 and IRCF<2:0> bits of the
OSCCON register = 000
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The LF Internal Oscillator (LTS) bit of the OSCCON
register indicates whether the LFINTOSC is stable or
not.
4.5.4 FREQUENCY SELECT BITS (IRCF)
The output of the 8 MHz HFINTOSC and 31 kHz
LFINTOSC connects to a postscaler and multiplexer
(see Figure 4-1). The Internal Oscillator Frequency
Select bits IRCF<2:0> of the OSCCON register select
the frequency output of the internal oscillators. One of
eight frequencies can be selected via software:
•8 MHz
• 4 MHz (Default after Reset)
•2 MHz
•1 MHz
• 500 kHz
• 250 kHz
• 125 kHz
• 31 kHz (LFINTOSC)
4.5.5 HFINTOSC AND LFINTOSC CLOCK
SWITCH TIMING
When switching between the LFINTOSC and the
HFINTOSC, the new oscillator may already be shut
down to save power (see Figure 4-6). If this is the case,
there is a delay after the IRCF<2:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The LTS and HTS bits of the
OSCCON register will reflect the current active status
of the LFINTOSC and HFINTOSC oscillators. The
timing of a frequency selection is as follows:
1. IRCF<2:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. CLKOUT is held low and the clock switch
circuitry waits for a rising edge in the new clock.
5. CLKOUT is now connected with the new clock.
LTS and HTS bits of the OSCCON register are
updated as required.
6. Clock switch is complete.
See Figure 4-1 for more details.
If the internal oscillator speed selected is between
8 MHz and 125 kHz, there is no start-up delay before
the new frequency is selected. This is because the old
and new frequencies are derived from the HFINTOSC
via the postscaler and multiplexer.
Start-up delay specifications are located in the
oscillator tables of Section 17.0 “Electrical
Specifications”.
Note: Following any Reset, the IRCF<2:0> bits
of the OSCCON register are set to ‘110’
and the frequency selection is set to
4 MHz. The user can modify the IRCF bits
to select a different frequency.
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FIGURE 4-6: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC
LFINTOSC
IRCF <2:0>
System Clock
HFINTOSC
LFINTOSC
IRCF <2:0>
System Clock
00
00
Start-up Time 2-cycle Sync Running
2-cycle Sync Running
HFINTOSC LFINTOSC (FSCM and WDT disabled)
HFINTOSC LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC
IRCF <2:0>
System Clock
= 0¼ 0
Start-up Time 2-cycle Sync Running
LFINTOSC HFINTOSC
LFINTOSC turns off unless WDT or FSCM is enabled
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4.6 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bit of the OSCCON
register.
4.6.1 SYSTEM CLOCK SELECT (SCS) BIT
The System Clock Select (SCS) bit of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
• When the SCS bit of the OSCCON register = 0,
the system clock source is determined by
configuration of the FOSC<2:0> bits in the
Configuration Word Register 1 (CONFIG1).
• When the SCS bit of the OSCCON register = 1,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<2:0>
bits of the OSCCON register. After a Reset, the
SCS bit of the OSCCON register is always
cleared.
4.6.2 OSCILLATOR START-UP TIME-OUT
STATUS (OSTS) BIT
The Oscillator Start-up Time-out Status (OSTS) bit of
the OSCCON register indicates whether the system
clock is running from the external clock source, as
defined by the FOSC<2:0> bits in the Configuration
Word Register 1 (CONFIG1), or from the internal clock
source. In particular, OSTS indicates that the Oscillator
Start-up Timer (OST) has timed out for LP, XT or HS
modes.
4.7 Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device.
This mode allows the application to wake-up from
Sleep, perform a few instructions using the INTOSC
as the clock source and go back to Sleep without
waiting for the primary oscillator to become stable.
When the oscillator module is configured for LP, XT or
HS modes, the Oscillator Start-up Timer (OST) is
enabled (see Section 4.4.1 “Oscillator Start-up Timer
(OST)”). The OST will suspend program execution until
1024 oscillations are counted. Two-Speed Start-up
mode minimizes the delay in code execution by
operating from the internal oscillator as the OST is
counting. When the OST count reaches 1024 and the
OSTS bit of the OSCCON register is set, program
execution switches to the external oscillator.
4.7.1 TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
• IESO (of the Configuration Word Register 1) = 1;
Internal/External Switchover bit (Two-Speed
Start-up mode enabled).
• SCS (of the OSCCON register) = 0.
• FOSC<2:0> bits in the Configuration Word
Register 1 (CONFIG1) configured for LP, XT or
HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
If the external clock oscillator is configured to be
anything other than LP, XT or HS mode, then Two-
speed Start-up is disabled. This is because the external
clock oscillator does not require any stabilization time
after POR or an exit from Sleep.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or Fail-
Safe Clock Monitor, does not update the
SCS bit of the OSCCON register. The user
can monitor the OSTS bit of the OSCCON
register to determine the current system
clock source.
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCCON register to
remain clear.
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4.7.2 TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<2:0>
bits of the OSCCON register.
3. OST enabled to count 1024 clock cycles.
4. OST timed out, wait for falling edge of the
internal oscillator.
5. OSTS is set.
6. System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
4.7.3 CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCCON
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Word Register 1
(CONFIG1), or the internal oscillator.
FIGURE 4-7: TWO-SPEED START-UP
0 1 1022 1023
PC + 1
TOSTT
HFINTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N PC
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4.8 Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Configuration Word Register 1 (CONFIG1). The FSCM
is applicable to all external Oscillator modes (LP, XT,
HS, EC, RC and RCIO).
FIGURE 4-8: FSCM BLOCK DIAGRAM
4.8.1 FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 4-8. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire half-
cycle of the sample clock elapses before the primary
clock goes low.
4.8.2 FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<2:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
4.8.3 FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or toggling the SCS bit
of the OSCCON register. When the SCS bit is toggled,
the OST is restarted. While the OST is running, the
device continues to operate from the INTOSC selected
in OSCCON. When the OST times out, the Fail-Safe
condition is cleared and the device will be operating
from the external clock source. The Fail-Safe condition
must be cleared before the OSFIF flag can be cleared.
4.8.4 RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled. Therefore, the device will always be executing
code while the OST is operating.
External
LFINTOSC ÷ 64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
OSTS bit of the OSCCON register to verify
the oscillator start-up and that the system
clock switchover has successfully
completed.
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FIGURE 4-9: FSCM TIMING DIAGRAM
TABLE 4-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
TABLE 4-3: SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH CLOCK SOURCES
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Te s t Test Test
Clock Monitor Output
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON — IRCF2 IRCF1 IRCF0 OSTS HTS LTS SCS 66
OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 70
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE —CCP2IE 35
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF —CCP2IF 37
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
oscillators.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1(1) 13:8 — — DEBUG LVP FCMEN IESO BOREN 1 BOREN0 214
7:0 CPD CP MCLRE PWRTE WDTE FOSC 2 FOSC 1 FOSC 0
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
oscillators.
Note 1: See Configuration Word Register 1 (Register 14-1) for operation of all register bits.
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5.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 8-bit prescaler (shared with Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on overflow
Figure 5-1 is a block diagram of the Timer0 module.
5.1 Timer0 Operation
When used as a timer, the Timer0 module can be used
as either an 8-bit timer or an 8-bit counter.
5.1.1 8-BIT TIMER MODE
When used as a timer, the Timer0 module will
increment every instruction cycle (without prescaler).
Timer mode is selected by clearing the T0CS bit of the
OPTION register to ‘0’.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
5.1.2 8-BIT COUNTER MODE
When used as a counter, the Timer0 module will
increment on every rising or falling edge of the T0CKI
pin. The incrementing edge is determined by the T0SE
bit of the OPTION register. Counter mode is selected by
setting the T0CS bit of the OPTION register to ‘1’.
FIGURE 5-1: TIMER0/WDT PRESCALER BLOCK DIAGRAM
Note: The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
T0CKI
T0SE
pin
TMR0
Watchdog
Timer
WDT
Time-out
PS<2:0>
WDTE
Data Bus
Set Flag bit T0IF
on Overflow
T0CS
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register.
2: SWDTEN and WDTPS<3:0> are bits in the WDTCON register.
3: WDTE bit is in the Configuration Word Register1.
0
1
0
1
0
1
8
8
8-bit
Prescaler
0
1
FOSC/4
PSA
PSA
PSA
16-bit
Prescaler 16
WDTPS<3:0>
31 kHz
INTOSC
SWDTEN
Sync
2 Tcy
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5.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available
for use with either Timer0 or the Watchdog Timer
(WDT), but not both simultaneously. The prescaler
assignment is controlled by the PSA bit of the OPTION
register. To assign the prescaler to Timer0, the PSA bit
must be cleared to a ‘0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
selectable via the PS<2:0> bits of the OPTION register.
In order to have a 1:1 prescaler value for the Timer0
module, the prescaler must be assigned to the WDT
module.
The prescaler is not readable or writable. When
assigned to the Timer0 module, all instructions writing to
the TMR0 register will clear the prescaler.
When the prescaler is assigned to WDT, a CLRWDT
instruction will clear the prescaler along with the WDT.
5.1.3.1 Switching Prescaler Between
Timer0 and WDT Modules
As a result of having the prescaler assigned to either
Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values. When changing the prescaler assignment from
Timer0 to the WDT module, the instruction sequence
shown in Example 5-1, must be executed.
EXAMPLE 5-1: CHANGING PRESCALER
(TIMER0 WDT)
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be executed (see Example 5-2).
EXAMPLE 5-2: CHANGING PRESCALER
(WDT TIMER0)
5.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit must be
cleared in software. The Timer0 interrupt enable is the
T0IE bit of the INTCON register.
5.1.5 USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Counter mode, the synchronization
of the T0CKI input and the Timer0 register is accom-
plished by sampling the prescaler output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, the
high and low periods of the external clock source must
meet the timing requirements as shown in the
Section 17.0 “Electrical Specifications”.
BANKSEL TMR0 ;
CLRWDT ;Clear WDT
CLRF TMR0 ;Clear TMR0 and
;prescaler
BANKSEL OPTION_REG ;
BSF OPTION_REG,PSA ;Select WDT
CLRWDT ;
;
MOVLW b’11111000’ ;Mask prescaler
ANDWF OPTION_REG,W ;bits
IORLW b’00000101’ ;Set WDT prescaler
MOVWF OPTION_REG ;to 1:32
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
CLRWDT ;Clear WDT and
;prescaler
BANKSEL OPTION_REG ;
MOVLW b’11110000’ ;Mask TMR0 select and
ANDWF OPTION_REG,W ;prescaler bits
IORLW b’00000011’ ;Set prescale to 1:16
MOVWF OPTION_REG ;
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REGISTER DEFINITIONS: OPTION REGISTER
REGISTER 5-1: OPTION_REG: OPTION REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual PORT latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
Note 1: A dedicated 16-bit WDT postscaler is available. See Section 14.5 “Watchdog Timer (WDT)” for more
information.
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
BIT VALUE TMR0 RATE WDT RATE
TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
TMR0 Timer0 Module Register 77
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 79
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 41
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the
Timer0 module.
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NOTES:
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6.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/counter register pair (TMR1H:TMR1L)
• Programmable internal or external clock source
• 3-bit prescaler
• Optional LP oscillator
• Synchronous or asynchronous operation
• Timer1 gate (count enable) via comparator or
T1G pin
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Special Event Trigger (with ECCP)
• Comparator output synchronization to Timer1
clock
Figure 6-1 is a block diagram of the Timer1 module.
6.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer. When used with an external clock source, the
module can be used as either a timer or counter.
6.2 Clock Source Selection
The TMR1CS bit of the T1CON register is used to select
the clock source. When TMR1CS = 0, the clock source
is FOSC/4. When TMR1CS = 1, the clock source is
supplied externally.
FIGURE 6-1: TIMER1 BLOCK DIAGRAM
Clock Source TMR1CS
FOSC/4 0
T1CKI pin 1
Note 1: ST Buffer is low power type when using LP osc, or high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
4: SYNCC2OUT is synchronized when the C2SYNC bit of the CM2CON1 register is set.
TMR1H TMR1L
Oscillator T1SYNC
T1CKPS<1:0>
FOSC/4
Internal
Clock
Prescaler
1, 2, 4, 8
1
0
0
1
Synchronized
clock input
2
Set flag bit
TMR1IF on
Overflow TMR1(2)
TMR1GE
TMR1ON
T1OSCEN
1
0
SYNCC2OUT(4)
T1GSS
T1GINV
To C2 Comparator Module
Timer1 Clock
TMR1CS
T1OSI
T1OSO/T1CKI
(1)
EN
INTOSC
Without CLKOUT
Synchronize(3)
det
T1G
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6.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
6.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
When counting, Timer1 is incremented on the rising
edge of the external clock input T1CKI. In addition, the
Counter mode clock can be synchronized to the
microcontroller system clock or run asynchronously.
If an external clock oscillator is needed (and the
microcontroller is using the INTOSC without CLKOUT),
Timer1 can use the LP oscillator as a clock source.
In Counter mode, a falling edge must be registered by
the counter prior to the first incrementing rising edge
after one or more of the following conditions (see
Figure 6-2):
• Timer1 is enabled after POR or BOR Reset
• A write to TMR1H or TMR1L
• T1CKI is high when Timer1 is disabled and when
Timer1 is re-enabled T1CKI is low.
6.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
6.4 Timer1 Oscillator
A low-power 32.768 kHz oscillator is built-in between
pins T1OSI (input) and T1OSO (amplifier output). The
oscillator is enabled by setting the T1OSCEN control
bit of the T1CON register. The oscillator will continue to
run during Sleep.
The Timer1 oscillator is identical to the LP oscillator.
The user must provide a software time delay to ensure
proper oscillator start-up.
TRISC0 and TRISC1 bits are set when the Timer1
oscillator is enabled. RC0 and RC1 bits read as ‘0’ and
TRISC0 and TRISC1 bits read as ‘1’.
6.5 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
continues to increment asynchronous to the internal
phase clocks. The timer will continue to run during
Sleep and can generate an interrupt on overflow,
which will wake-up the processor. However, special
precautions in software are needed to read/write the
timer (see Section 6.5.1 “Reading and Writing
Timer1 in Asynchronous Counter Mode”).
6.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TTMR1L register
pair.
6.6 Timer1 Gate
Timer1 gate source is software configurable to be the
T1G pin or the output of Comparator C2. This allows the
device to directly time external events using T1G or
analog events using Comparator C2. See the
CM2CON1 register (Register 8-3) for selecting the
Timer1 gate source. This feature can simplify the
software for a Delta-Sigma A/D converter and many
other applications. For more information on Delta-Sigma
A/D converters, see the Microchip web site
(www.microchip.com).
Timer1 gate can be inverted using the T1GINV bit of
the T1CON register, whether it originates from the T1G
pin or Comparator C2 output. This configures Timer1 to
measure either the active-high or active-low time
between events.
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to enabling Timer1.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce a single spurious
increment.
Note: TMR1GE bit of the T1CON register must
be set to use the Timer1 gate.
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6.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
• Timer1 interrupt enable bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
6.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
The device will wake-up on an overflow and execute
the next instruction. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine (0004h).
6.9 ECCP Capture/Compare Time
Base
The ECCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPRxH:CCPRxL
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPRxH:CCPRxL register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
See Section 11.0 “Capture/Compare/PWM Modules
(CCP1 and CCP2)” for more information.
6.10 ECCP Special Event Trigger
If an ECCP is configured to trigger a special event, the
trigger will clear the TMR1H:TMR1L register pair. This
special event does not cause a Timer1 interrupt. The
ECCP module may still be configured to generate a
ECCP interrupt.
In this mode of operation, the CCPRxH:CCPRxL
register pair effectively becomes the period register for
Timer1.
Timer1 should be synchronized to the FOSC to utilize
the Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the event that a write to TMR1H or TMR1L coincides
with a Special Event Trigger from the ECCP, the write
will take precedence.
For more information, see Section 11.0 “Capture/
Compare/PWM Modules (CCP1 and CCP2)”.
6.11 Comparator Synchronization
The same clock used to increment Timer1 can also be
used to synchronize the comparator output. This
feature is enabled in the Comparator module.
When using the comparator for Timer1 gate, the
comparator output should be synchronized to Timer1.
This ensures Timer1 does not miss an increment if the
comparator changes.
For more information, see Section 8.0 “Comparator
Module”.
FIGURE 6-2: TIMER1 INCREMENTING EDGE
Note: The TMR1H:TTMR1L register pair and
the TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of
the clock.
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6.12 Timer1 Control Register
The Timer1 Control register (T1CON), shown in
Register 6-1, is used to control Timer1 and select the
various features of the Timer1 module.
REGISTER DEFINITIONS: TIMER1 CONTROL
REGISTER 6-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 T1GINV: Timer1 Gate Invert bit(1)
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 6 TMR1GE: Timer1 Gate Enable bit(2)
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 Gate function
0 = Timer1 is always counting
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale Value
10 = 1:4 Prescale Value
01 = 1:2 Prescale Value
00 = 1:1 Prescale Value
bit 3 T1OSCEN: LP Oscillator Enable Control bit
1 = LP oscillator is enabled for Timer1 clock
0 = LP oscillator is off
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit
TMR1CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock
bit 1 TMR1CS: Timer1 Clock Source Select bit
1 = External clock from T1CKI pin (on the rising edge)
0 = Internal clock (FOSC/4)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source.
2: TMR1GE bit must be set to use either T1G pin or C2OUT, as selected by the T1GSS bit of the CM2CON1
register, as a Timer1 gate source.
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TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —— T1GSS C2SYNC 96
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 81
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 81
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 84
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1
module.
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NOTES:
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7.0 TIMER2 MODULE
The Timer2 module is an 8-bit timer with the following
features:
• 8-bit timer register (TMR2)
• 8-bit period register (PR2)
• Interrupt on TMR2 match with PR2
• Software programmable prescaler (1:1, 1:4, 1:16)
• Software programmable postscaler (1:1 to 1:16)
See Figure 7-1 for a block diagram of Timer2.
7.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4). The clock is fed into the
Timer2 prescaler, which has prescale options of 1:1,
1:4 or 1:16. The output of the prescaler is then used to
increment the TMR2 register.
The values of TMR2 and PR2 are constantly compared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, two things happen:
• TMR2 is reset to 00h on the next increment cycle
• The Timer2 postscaler is incremented
The match output of the Timer2/PR2 comparator is
then fed into the Timer2 postscaler. The postscaler has
postscale options of 1:1 to 1:16 inclusive. The output of
the Timer2 postscaler is used to set the TMR2IF
interrupt flag bit in the PIR1 register.
The TMR2 and PR2 registers are both fully readable
and writable. On any Reset, the TMR2 register is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Timer2 is turned off by clearing
the TMR2ON bit to a ‘0’.
The Timer2 prescaler is controlled by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
controlled by the TOUTPS bits in the T2CON register.
The prescaler and postscaler counters are cleared
when:
• A write to TMR2 occurs.
• A write to T2CON occurs.
• Any device Reset occurs (Power-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
FIGURE 7-1: TIMER2 BLOCK DIAGRAM
Note: TMR2 is not cleared when T2CON is
written.
Comparator
TMR2 Sets Flag
TMR2
Output
Reset
Postscaler
Prescaler
PR2
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16
EQ
4
bit TMR2IF
TOUTPS<3:0>
T2CKPS<1:0>
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REGISTER DEFINITIONS: TIMER2 CONTROL
TABLE 7-1: SUMMARY OF ASSOCIATED TIMER2 REGISTERS
REGISTER 7-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Unimplemented: Read as ‘0’
bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 = 1:1 Postscaler
0001 = 1:2 Postscaler
0010 = 1:3 Postscaler
0011 = 1:4 Postscaler
0100 = 1:5 Postscaler
0101 = 1:6 Postscaler
0110 = 1:7 Postscaler
0111 = 1:8 Postscaler
1000 = 1:9 Postscaler
1001 = 1:10 Postscaler
1010 = 1:11 Postscaler
1011 = 1:12 Postscaler
1100 = 1:13 Postscaler
1101 = 1:14 Postscaler
1110 = 1:15 Postscaler
1111 = 1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 =Prescaler is 1
01 =Prescaler is 4
1x = Prescaler is 16
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
PR2 Timer2 Module Period Register 87
TMR2 Holding Register for the 8-bit TMR2 Register 87
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 88
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for Timer2
module.
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8.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
The comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of the program execution. The analog
comparator module includes the following features:
• Independent comparator control
• Programmable input selection
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
•PWM shutdown
• Timer1 gate (count enable)
• Output synchronization to Timer1 clock input
•SR Latch
• Programmable and fixed voltage reference
8.1 Comparator Overview
A single comparator is shown in Figure 8-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
FIGURE 8-1: SINGLE COMPARATOR
Note: Only Comparator C2 can be linked to
Timer1.
–
+
VIN+
VIN-
Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
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FIGURE 8-2: COMPARATOR C1 SIMPLIFIED BLOCK DIAGRAM
FIGURE 8-3: COMPARATOR C2 SIMPLIFIED BLOCK DIAGRAM
Note 1: When C1ON = 0, the C1 comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
C1POL
C1OUT
To PWM Logic
RD_CM1CON0
Set C1IF
To
DQ
EN
Q1
Data Bus
C1POL
DQ
EN
CL
Q3*RD_CM1CON0
Reset
C1OUT (to SR Latch)
MUX
C1
0
1
2
3
C1ON(1)
C1CH<1:0>
2
0
1
C1R
MUX
C1VIN-
C1VIN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
C1IN+
+
-
0
1
MUX
CVREF
C1RSEL
FixedRef
C1VREF
MUX
C2
C2POL
C2OUT
0
1
2
3
C2ON(1)
C2CH<1:0>
2
0
1
C2R
From Timer1
Clock
Note 1: When C2ON = 0, the C2 comparator will produce a ‘0’ output to the XOR Gate.
2: Q1 and Q3 are phases of the four-phase system clock (FOSC).
3: Q1 is held high during Sleep mode.
MUX
DQ
EN
DQ
EN
CL
DQ
RD_CM2CON0
Q3*RD_CM2CON0
Q1
Set C2IF
To
Reset
C2VIN-
C2VIN+
SYNCC2OUT
C2IN+
C12IN0-
C12IN1-
C12IN2-
C12IN3-
0
1
C2SYNC
C2POL
Data Bus
MUX
To Timer1 Gate, SR Latch,
0
1
MUX
CVREF
C2RSEL
FixedRef
C2VREF
PWM Logic, and other
peripherals
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8.2 Comparator Control
Each comparator has a separate control and
Configuration register: CM1CON0 for Comparator C1
and CM2CON0 for Comparator C2. In addition,
Comparator C2 has a second control register,
CM2CON1, for controlling the interaction with Timer1 and
simultaneous reading of both comparator outputs.
The CM1CON0 and CM2CON0 registers (see Registers
8-1 and 8-2, respectively) contain the control and Status
bits for the following:
• Enable
• Input selection
• Reference selection
•Output selection
• Output polarity
8.2.1 COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
8.2.2 COMPARATOR INPUT SELECTION
The CxCH<1:0> bits of the CMxCON0 register direct
one of four analog input pins to the comparator
inverting input.
8.2.3 COMPARATOR REFERENCE
SELECTION
Setting the CxR bit of the CMxCON0 register directs an
internal voltage reference or an analog input pin to the
non-inverting input of the comparator. See
Section 8.10 “Comparator Voltage Reference” for
more information on the internal voltage reference
module.
8.2.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CM2CON1 register. In order
to make the output available for an external connection,
the following conditions must be true:
• CxOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CxON bit of the CMxCON0 register must be set
8.2.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
Table 8-1 shows the output state versus input
conditions, including polarity control.
8.3 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the
comparator differs from the settling time of the voltage
reference. Therefore, both of these times must be
considered when determining the total response time
to a comparator input change. See the Comparator and
Voltage Reference specifications in Section 17.0
“Electrical Specifications” for more details.
Note: To use CxIN+ and CxIN- pins as analog
inputs, the appropriate bits must be set in
the ANSEL and ANSELH registers and
the corresponding TRIS bits must also be
set to disable the output drivers.
Note 1: The CxOE bit overrides the PORT data
latch. Setting the CxON has no impact on
the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
TABLE 8-1: COMPARATOR OUTPUT
STATE VS. INPUT
CONDITIONS
Input Condition CxPOL CxOUT
CxVIN- > CxVIN+00
CxVIN- < CxVIN+01
CxVIN- > CxVIN+11
CxVIN- < CxVIN+10
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8.4 Comparator Interrupt Operation
The comparator interrupt flag can be set whenever
there is a change in the output value of the comparator.
Changes are recognized by means of a mismatch
circuit which consists of two latches and an exclusive-
or gate (see Figures 8-2 and 8-3). One latch is updated
with the comparator output level when the CMxCON0
register is read. This latch retains the value until the
next read of the CMxCON0 register or the occurrence
of a Reset. The other latch of the mismatch circuit is
updated on every Q1 system clock. A mismatch
condition will occur when a comparator output change
is clocked through the second latch on the Q1 clock
cycle. At this point the two mismatch latches have
opposite output levels which is detected by the
exclusive-or gate and fed to the interrupt circuitry. The
mismatch condition persists until either the CMxCON0
register is read or the comparator output returns to the
previous state.
The comparator interrupt is set by the mismatch edge
and not the mismatch level. This means that the inter-
rupt flag can be reset without the additional step of
reading or writing the CMxCON0 register to clear the
mismatch registers. When the mismatch registers are
cleared, an interrupt will occur upon the comparator’s
return to the previous state, otherwise no interrupt will
be generated.
Software will need to maintain information about the
status of the comparator output, as read from the
CMxCON0 register, or CM2CON1 register, to determine
the actual change that has occurred.
The CxIF bit of the PIR2 register is the comparator
interrupt flag. This bit must be reset in software by
clearing it to ‘0’. Since it is also possible to write a ‘1’ to
this register, an interrupt can be generated.
The CxIE bit of the PIE2 register and the PEIE and GIE
bits of the INTCON register must all be set to enable
comparator interrupts. If any of these bits are cleared,
the interrupt is not enabled, although the CxIF bit of the
PIR2 register will still be set if an interrupt condition
occurs.
FIGURE 8-4: COMPARATOR
INTERRUPT TIMING W/O
CMxCON0 READ
FIGURE 8-5: COMPARATOR
INTERRUPT TIMING WITH
CMxCON0 READ
Note 1: A write operation to the CMxCON0
register will also clear the mismatch
condition because all writes include a read
operation at the beginning of the write
cycle.
2: Comparator interrupts will operate
correctly regardless of the state of CxOE.
Note 1: If a change in the CMxCON0 register
(CxOUT) should occur when a read oper-
ation is being executed (start of the Q2
cycle), then the CxIF of the PIR2 register
interrupt flag may not get set.
2: When either comparator is first enabled,
bias circuitry in the comparator module
may cause an invalid output from the
comparator until the bias circuitry is
stable. Allow about 1 s for bias settling
then clear the mismatch condition and
interrupt flags before enabling comparator
interrupts.
Q1
Q3
CIN+
CxOUT
Set CxIF (level)
CxIF
TRT
reset by software
Q1
Q3
CxIN+
CxOUT
Set CxIF (level)
CxIF
TRT
reset by software
cleared by CMxCON0 read
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8.5 Operation During Sleep
The comparator, if enabled before entering Sleep mode,
remains active during Sleep. The additional current
consumed by the comparator is shown separately in the
Section 17.0 “Electrical Specifications”. If the
comparator is not used to wake the device, power
consumption can be minimized while in Sleep mode by
turning off the comparator. Each comparator is turned off
by clearing the CxON bit of the CMxCON0 register.
A change to the comparator output can wake-up the
device from Sleep. To enable the comparator to wake
the device from Sleep, the CxIE bit of the PIE2 register
and the PEIE bit of the INTCON register must be set.
The instruction following the Sleep instruction always
executes following a wake from Sleep. If the GIE bit of
the INTCON register is also set, the device will then
execute the Interrupt Service Routine.
8.6 Effects of a Reset
A device Reset forces the CMxCON0 and CM2CON1
registers to their Reset states. This forces both
comparators and the voltage references to their Off
states.
REGISTER DEFINITIONS: COMPARATOR C1
REGISTER 8-1: CM1CON0: COMPARATOR C1 CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
C1ON C1OUT C1OE C1POL —C1R C1CH1 C1CH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 C1ON: Comparator C1 Enable bit
1 = Comparator C1 is enabled
0 = Comparator C1 is disabled
bit 6 C1OUT: Comparator C1 Output bit
If C1POL = 1 (inverted polarity):
C1OUT = 0 when C1VIN+ > C1VIN-
C1OUT = 1 when C1VIN+ < C1VIN-
If C1POL = 0 (non-inverted polarity):
C1OUT = 1 when C1VIN+ > C1VIN-
C1OUT = 0 when C1VIN+ < C1VIN-
bit 5 C1OE: Comparator C1 Output Enable bit
1 = C1OUT is present on the C1OUT pin(1)
0 = C1OUT is internal only
bit 4 C1POL: Comparator C1 Output Polarity Select bit
1 = C1OUT logic is inverted
0 = C1OUT logic is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 C1R: Comparator C1 Reference Select bit (non-inverting input)
1 = C1VIN+ connects to C1VREF output
0 = C1VIN+ connects to C1IN+ pin
bit 1-0 C1CH<1:0>: Comparator C1 Channel Select bit
00 = C12IN0- pin of C1 connects to C1VIN-
01 = C12IN1- pin of C1 connects to C1VIN-
10 = C12IN2- pin of C1 connects to C1VIN-
11 = C12IN3- pin of C1 connects to C1VIN-
Note 1: Comparator output requires the following three conditions: C1OE = 1, C1ON = 1 and corresponding port
TRIS bit = 0.
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REGISTER DEFINITIONS: COMPARATOR C2
REGISTER 8-2: CM2CON0: COMPARATOR C2 CONTROL REGISTER 0
R/W-0 R-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
C2ON C2OUT C2OE C2POL —C2R C2CH1 C2CH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 C2ON: Comparator C2 Enable bit
1 = Comparator C2 is enabled
0 = Comparator C2 is disabled
bit 6 C2OUT: Comparator C2 Output bit
If C2POL = 1 (inverted polarity):
C2OUT = 0 when C2VIN+ > C2VIN-
C2OUT = 1 when C2VIN+ < C2VIN-
If C2POL = 0 (non-inverted polarity):
C2OUT = 1 when C2VIN+ > C2VIN-
C2OUT = 0 when C2VIN+ < C2VIN-
bit 5 C2OE: Comparator C2 Output Enable bit
1 = C2OUT is present on C2OUT pin(1)
0 = C2OUT is internal only
bit 4 C2POL: Comparator C2 Output Polarity Select bit
1 = C2OUT logic is inverted
0 = C2OUT logic is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 C2R: Comparator C2 Reference Select bits (non-inverting input)
1 = C2VIN+ connects to C2VREF
0 = C2VIN+ connects to C2IN+ pin
bit 1-0 C2CH<1:0>: Comparator C2 Channel Select bits
00 = C12IN0- pin of C2 connects to C2VIN-
01 = C12IN1- pin of C2 connects to C2VIN-
10 = C12IN2- pin of C2 connects to C2VIN-
11 = C12IN3- pin of C2 connects to C2VIN-
Note 1: Comparator output requires the following three conditions: C2OE = 1, C2ON = 1 and corresponding port
TRIS bit = 0.
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8.7 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 8-6. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
FIGURE 8-6: ANALOG INPUT MODEL
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
VA
Rs < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE(1)
±500 nA
Vss
AIN
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA= Analog Voltage
VT= Threshold Voltage
To ADC Input
Note 1: See Section 17.0 “Electrical Specifications”.
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8.8 Additional Comparator Features
There are three additional comparator features:
• Timer1 count enable (gate)
• Synchronizing output with Timer1
• Simultaneous read of comparator outputs
8.8.1 COMPARATOR C2 GATING TIMER1
This feature can be used to time the duration or interval
of analog events. Clearing the T1GSS bit of the
CM2CON1 register will enable Timer1 to increment
based on the output of Comparator C2. This requires
that Timer1 is on and gating is enabled. See
Section 6.0 “Timer1 Module with Gate Control” for
details.
It is recommended to synchronize the comparator with
Timer1 by setting the C2SYNC bit when the comparator
is used as the Timer1 gate source. This ensures Timer1
does not miss an increment if the comparator changes
during an increment.
8.8.2 SYNCHRONIZING COMPARATOR
C2 OUTPUT TO TIMER1
The Comparator C2 output can be synchronized with
Timer1 by setting the C2SYNC bit of the CM2CON1
register. When enabled, the C2 output is latched on the
falling edge of the Timer1 clock source. If a prescaler is
used with Timer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator output is latched on the falling edge of the
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figures 8-2 and 8-3) and the Timer1
Block Diagram (Figure 6-1) for more information.
8.8.3 SIMULTANEOUS COMPARATOR
OUTPUT READ
The MC1OUT and MC2OUT bits of the CM2CON1
register are mirror copies of both comparator outputs.
The ability to read both outputs simultaneously from a
single register eliminates the timing skew of reading
separate registers.
Note 1: Obtaining the status of C1OUT or
C2OUT by reading CM2CON1 does not
affect the comparator interrupt mismatch
registers.
REGISTER 8-3: CM2CON1: COMPARATOR C2 CONTROL REGISTER 1
R-0 R-0 R/W-0 R/W-0 U-0 U-0 R/W-1 R/W-0
MC1OUT MC2OUT C1RSEL C2RSEL — — T1GSS C2SYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 MC1OUT: Mirror Copy of C1OUT bit
bit 6 MC2OUT: Mirror Copy of C2OUT bit
bit 5 C1RSEL: Comparator C1 Reference Select bit
1 = CVREF routed to C1VREF input of Comparator C1
0 = Absolute voltage reference (0.6) routed to C1VREF input of Comparator C1 (or 1.2V precision
reference on parts so equipped)
bit 4 C2RSEL: Comparator C2 Reference Select bit
1 = CVREF routed to C2VREF input of Comparator C2
0 = Absolute voltage reference (0.6) routed to C2VREF input of Comparator C2 (or 1.2V precision
reference on parts so equipped)
bit 3-2 Unimplemented: Read as ‘0’
bit 1 T1GSS: Timer1 Gate Source Select bit
1 = Timer1 gate source is T1G
0 = Timer1 gate source is SYNCC2OUT.
bit 0 C2SYNC: Comparator C2 Output Synchronization bit
1 = Output is synchronous to falling edge of Timer1 clock
0 = Output is asynchronous
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8.9 Comparator SR Latch
The SR latch module provides additional control of the
comparator outputs. The module consists of a single
SR latch and output multiplexers. The SR latch can be
set, reset or toggled by the comparator outputs. The SR
latch may also be set or reset, independent of
comparator output, by control bits in the SRCON control
register. The SR latch output multiplexers select
whether the latch outputs or the comparator outputs are
directed to the I/O port logic for eventual output to a pin.
8.9.1 LATCH OPERATION
The latch is a Set-Reset latch that does not depend on a
clock source. Each of the Set and Reset inputs are
active-high. Each latch input is connected to a
comparator output and a software controlled pulse
generator. The latch can be set by C1OUT or the PULSS
bit of the SRCON register. The latch can be reset by
C2OUT or the PULSR bit of the SRCON register. The
latch is reset-dominant, therefore, if both Set and Reset
inputs are high the latch will go to the Reset state. Both
the PULSS and PULSR bits are self resetting which
means that a single write to either of the bits is all that is
necessary to complete a latch set or Reset operation.
8.9.2 LATCH OUTPUT
The SR<1:0> bits of the SRCON register control the
latch output multiplexers and determine four possible
output configurations. In these four configurations, the
CxOUT I/O port logic is connected to:
• C1OUT and C2OUT
• C1OUT and SR latch Q
• C2OUT and SR latch Q
• SR latch Q and Q
After any Reset, the default output configuration is the
unlatched C1OUT and C2OUT mode. This maintains
compatibility with devices that do not have the SR latch
feature.
The applicable TRIS bits of the corresponding ports
must be cleared to enable the port pin output drivers.
Additionally, the CxOE comparator output enable bits of
the CMxCON0 registers must be set in order to make the
comparator or latch outputs available on the output pins.
The latch configuration enable states are completely
independent of the enable states for the comparators.
FIGURE 8-7: SR LATCH SIMPLIFIED BLOCK DIAGRAM
C1SEN
SR0
PULSS
S
R
Q
Q
C2REN
PULSR SR1
Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q =1
2: Pulse generator causes a 1/2 Q-state (1 Tosc) pulse width.
3: Output shown for reference only. See I/O port pin block diagram for more detail.
Pulse
Gen(2)
Pulse
Gen(2)
SYNCC2OUT (from comparator)
C1OUT (from comparator)
C2OE
C2OUT pin(3)
C1OE
C1OUT pin(3)
0
1
MUX
1
0
MUX
SR
Latch(1)
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REGISTER DEFINITIONS: SR LATCH
REGISTER 8-4: SRCON: SR LATCH CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/S-0 R/S-0 U-0 R/W-0
SR1(2) SR0(2) C1SEN C2REN PULSS PULSR — FVREN
bit 7 bit 0
Legend: S = Bit is set only -
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SR1: SR Latch Configuration bit(2)
1 = C2OUT pin is the latch Q output
0 = C2OUT pin is the C2 comparator output
bit 6 SR0: SR Latch Configuration bits(2)
1 = C1OUT pin is the latch Q output
0 = C1OUT pin is the C1 Comparator output
bit 5 C1SEN: C1 Set Enable bit
1 = C1 comparator output sets SR latch
0 = C1 comparator output has no effect on SR latch
bit 4 C2REN: C2 Reset Enable bit
1 = C2 comparator output resets SR latch
0 = C2 comparator output has no effect on SR latch
bit 3 PULSS: Pulse the SET Input of the SR Latch bit
1 = Triggers pulse generator to set SR latch. Bit is immediately reset by hardware.
0 = Does not trigger pulse generator
bit 2 PULSR: Pulse the Reset Input of the SR Latch bit
1 = Triggers pulse generator to reset SR latch. Bit is immediately reset by hardware.
0 = Does not trigger pulse generator
bit 1 Unimplemented: Read as ‘0’
bit 0 FVREN: Fixed Voltage Reference Enable bit
1 = 0.6V Reference FROM INTOSC LDO is enabled
0 = 0.6V Reference FROM INTOSC LDO is disabled
Note 1: The CxOUT bit in the CMxCON0 register will always reflect the actual comparator output (not the level on
the pin), regardless of the SR latch operation.
2: To enable an SR Latch output to the pin, the appropriate CxOE and TRIS bits must be properly
configured.
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8.10 Comparator Voltage Reference
The comparator voltage reference module provides an
internally generated voltage reference for the
comparators. The following features are available:
• Independent from Comparator operation
• Two 16-level voltage ranges
• Output clamped to VSS
• Ratiometric with VDD
• Fixed Reference (0.6V)
The VRCON register (Register 8-5) controls the
voltage reference module shown in Figure 8-8.
The voltage source is selectable through both ends of
the 16 connection resistor ladder network. Bit VRSS of
the VRCON register selects either the internal or
external voltage source.
The PIC16F882/883/884/886/887 allows the CVREF
signal to be output to the RA2 pin of PORTA under
certain configurations only. For more details, see
Figure 8-9.
8.10.1 INDEPENDENT OPERATION
The comparator voltage reference is independent of
the comparator configuration. Setting the VREN bit of
the VRCON register will enable the voltage reference.
8.10.2 OUTPUT VOLTAGE SELECTION
The CVREF voltage reference has 2 ranges with 16
voltage levels in each range. Range selection is
controlled by the VRR bit of the VRCON register. The
16 levels are set with the VR<3:0> bits of the VRCON
register.
The CVREF output voltage is determined by the following
equations:
EQUATION 8-1: CVREF OUTPUT VOLTAGE
The full range of VSS to VDD cannot be realized due to
the construction of the module. See Figure 8-8.
8.10.3 OUTPUT CLAMPED TO VSS
The CVREF output voltage can be set to Vss with no
power consumption by clearing the FVREN bit of the
VRCON register.
This allows the comparator to detect a zero-crossing
while not consuming additional CVREF module current.
8.10.4 OUTPUT RATIOMETRIC TO VDD
The comparator voltage reference is VDD derived and
therefore, the CVREF output changes with fluctuations in
VDD. The tested absolute accuracy of the Comparator
Voltage Reference can be found in Section 17.0
“Electrical Specifications”.
8.10.5 FIXED VOLTAGE REFERENCE
The fixed voltage reference is independent of VDD, with
a nominal output voltage of 0.6V. This reference can be
enabled by setting the FVREN bit of the SRCON
register to ‘1’. This reference is always enabled when
the HFINTOSC oscillator is active.
8.10.6 FIXED VOLTAGE REFERENCE
STABILIZATION PERIOD
When the fixed voltage reference module is enabled, it
will require some time for the reference and its amplifier
circuits to stabilize. The user program must include a
small delay routine to allow the module to settle. See
Section 17.0 “Electrical Specifications” for the
minimum delay requirement.
8.10.7 VOLTAGE REFERENCE
SELECTION
Multiplexers on the output of the voltage reference
module enable selection of either the CVREF or fixed
voltage reference for use by the comparators.
Setting the C1RSEL bit of the CM2CON1 register
enables current to flow in the CVREF voltage divider
and selects the CVREF voltage for use by C1. Clearing
the C1RSEL bit selects the fixed voltage for use by C1.
Setting the C2RSEL bit of the CM2CON1 register
enables current to flow in the CVREF voltage divider
and selects the CVREF voltage for use by C2. Clearing
the C2RSEL bit selects the fixed voltage for use by C2.
When both the C1RSEL and C2RSEL bits are cleared,
current flow in the CVREF voltage divider is disabled
minimizing the power drain of the voltage reference
peripheral.
VRR 1 (low range):=
VRR 0 (high range):=
CVREF (VLADDER/4) + =
CVREF (VR<3:0>/24) VLADDER=
(VR<3:0> VLADDER/32)
VLADDER VDD=or ([VREF+] - [VREF-]) or VREF+
Note: Depending on the application, additional
components may be required for a zero
cross circuit. Reference TB3013, “Using
the ESD Parasitic Diodes on Mixed Signal
Microcontrollers” (DS93013), for more
information.
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FIGURE 8-8: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
FIGURE 8-9: COMPARATOR AND ADC VOLTAGE REFERENCE BLOCK DIAGRAM
VRR
8R
VR<3:0>
Analog
8RRR RR
16 Stages
MUX
Fixed Voltage
VREN
CVREF
Reference
EN
FVREN
Sleep
HFINTOSC enable
0.6V
FixedRef
To Comparators
and ADC Module
To Comparators
and ADC Module
15
0
4
VREF+
VDD
VRSS = 0
VRSS = 1
VREF-
VRSS = 0
VRSS = 1
CVREF
VROE
C1RSEL
C2RSEL
VREF+
VCFG0
AVDD
VREF-
VCFG1
AVSS
VROE
VCFG1
CVREF
Comparator ADC
AVDD
AVSS
Voltage
Reference
Voltage
Reference
VRSS
VRSS
0
1
0
1
0
1
0
1
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TABLE 8-2: COMPARATOR AND ADC VOLTAGE REFERENCE PRIORITY
RA3 RA2 Comp.
Reference (+)
Comp.
Reference (-)
ADC
Reference (+)
ADC
Reference (-) CFG1 CFG0 VRSS VROE
I/O I/O AVDD AVSS AVDD AVSS 0000
I/O CVREF AVDD AVSS AVDD AVSS 0001
VREF+VREF-VREF+VREF-AVDD AVSS 0010
VREF+CVREF VREF+AVSS AVDD AVSS 0011
VREF+I/O AVDD AVSS VREF+AVSS 0100
VREF+CVREF AVDD AVSS VREF+AVSS 0101
VREF+VREF-VREF+VREF-VREF+AVSS 0110
VREF+CVREF VREF+AVSS VREF+AVSS 0111
I/O VREF-AVDD AVSS AVDD VREF-1000
I/O VREF-AVDD AVSS AVDD VREF-1001
VREF+VREF-VREF+VREF-AVDD VREF-1010
VREF+VREF-VREF+VREF-AVDDVREF-1011
VREF+VREF-AVDD AVSS VREF+VREF-1100
VREF+VREF-AVDD AVSS VREF+VREF-1101
VREF+VREF-VREF+VREF-VREF+VREF-1110
VREF+VREF-VREF+VREF-VREF+VREF-1111
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REGISTER DEFINITIONS: VOLTAGE REFERENCE CONTROL
TABLE 8-3: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND VOLTAGE
REFERENCE MODULES
REGISTER 8-5: VRCON: VOLTAGE REFERENCE CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
VREN VROE VRR VRSS VR3 VR2 VR1 VR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 VREN: Comparator C1 Voltage Reference Enable bit
1 =CV
REF circuit powered on
0 =CV
REF circuit powered down
bit 6 VROE: Comparator C2 Voltage Reference Enable bit
1 = CVREF voltage level is also output on the RA2/AN2/VREF-/CVREF/C2IN+ pin
0 = CVREF voltage is disconnected from the RA2/AN2/VREF-/CVREF/C2IN+ pin
bit 5 VRR: CVREF Range Selection bit
1 = Low range
0 = High range
bit 4 VRSS: Comparator VREF Range Selection bit
1 = Comparator Reference Source, CVRSRC = (VREF+) - (VREF-)
0 = Comparator Reference Source, CVRSRC = VDD - VSS
bit 3-0 VR<3:0>: CVREF Value Selection 0 VR<3:0> 15
When VRR = 1: CVREF = (VR<3:0>/24) * VDD
When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 42
ANSELH — — ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 50
CM1CON0 C1ON C1OUT C1OE C1POL — C1R C1CH1 C1CH0 93
CM2CON0 C2ON C2OUT C2OE C2POL — C2R C2CH1 C2CH0 94
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL —— T1GSS C2SYNC 96
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE —CCP2IE 35
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF —CCP2IF 37
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 41
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 50
SRCON SR1 SR0 C1SEN C2SEN PULSS PULSR —FVREN 98
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 41
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 50
VRCON VREN VROE VRR VRSS VR3 VR2 VR1 VR0 102
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used for comparator.
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9.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESL and ADRESH).
The ADC voltage reference is software selectable to be
either internally generated or externally supplied.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
Figure 9-1 shows the block diagram of the ADC.
FIGURE 9-1: ADC BLOCK DIAGRAM
AN0
AN1
AN2
AN4
AVDD
VREF+
ADON
GO/DONE
VCFG0 = 1
VCFG0 = 0
CHS<3:0>
VSS
AN5
AN6
AN7
AN3
AN8
AN9
AN10
AN11
AN12
AN13
AVSS
VREF-VCFG1 = 1
VCFG1 = 0
CVREF
FixedRef
0000
0001
0010
0011
0100
0101
0111
0110
1000
1001
1010
1011
1100
1101
1110
1111
ADRESH ADRESL
10
10
ADFM 0 = Left Justify
1 = Right Justify
ADC
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9.1 ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
• Results formatting
9.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and digital
signals. When converting analog signals, the I/O pin
should be configured for analog by setting the associated
TRIS and ANSEL bits. See the corresponding Port
section for more information.
9.1.2 CHANNEL SELECTION
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 9.2
“ADC Operation” for more information.
9.1.3 ADC VOLTAGE REFERENCE
The VCFG bits of the ADCON1 register provide
independent control of the positive and negative
voltage references. The positive voltage reference can
be either VDD or an external voltage source. Likewise,
the negative voltage reference can be either VSS or an
external voltage source.
9.1.4 CONVERSION CLOCK
The source of the conversion clock is software select-
able via the ADCS bits of the ADCON0 register. There
are four possible clock options:
•F
OSC/2
•FOSC/8
•F
OSC/32
•FRC (dedicated internal oscillator)
The time to complete one bit conversion is defined as
T
AD. One full 10-bit conversion requires 11 TAD periods
as shown in Figure 9-2.
For correct conversion, the appropriate TAD specification
must be met. See A/D conversion requirements in
Section 17.0 “Electrical Specifications” for more
information. Table 9-1 gives examples of appropriate
ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input buf-
fer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
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TABLE 9-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
FIGURE 9-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
9.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is the ADIF bit in the
PIR1 register. The ADC interrupt enable is the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interrupt Service Routine.
Please see Section 14.3 “Interrupts” for more
information.
ADC Clock Period (TAD) Device Frequency (FOSC)
ADC Clock Source ADCS<1:0> 20 MHz 8 MHz 4 MHz 1 MHz
FOSC/2 00 100 ns(2) 250 ns(2) 500 ns(2) 2.0 s
FOSC/8 01 400 ns(2) 1.0 s(2) 2.0 s8.0 s(3)
FOSC/32 10 1.6 s4.0 s8.0 s(3) 32.0 s(3)
FRC 11 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 4 s for VDD > 3.0V.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the
conversion will be performed during Sleep.
TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion Starts
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
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9.1.6 RESULT FORMATTING
The 10-bit A/D conversion result can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 9-3 shows the two output formats.
FIGURE 9-3: 10-BIT A/D CONVERSION RESULT FORMAT
9.2 ADC Operation
9.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
9.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF flag bit
• Update the ADRESH:ADRESL registers with new
conversion result
9.2.3 TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion. Addi-
tionally, a 2 TAD delay is required before another acqui-
sition can be initiated. Following this delay, an input
acquisition is automatically started on the selected
channel.
9.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC clock source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conver-
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
9.2.5 SPECIAL EVENT TRIGGER
The ECCP Special Event Trigger allows periodic ADC
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 counter resets to zero.
Using the Special Event Trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
See Section 11.0 “Capture/Compare/PWM Modules
(CCP1 and CCP2)” for more information.
ADRESH ADRESL
(ADFM = 0)MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit A/D Result Unimplemented: Read as ‘0’
(ADFM = 1)MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0’ 10-bit A/D Result
Note: The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 9.2.6 “A/D Conversion
Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
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9.2.6 A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (See TRIS register)
• Configure pin as analog
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Select result format
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 9-1: A/D CONVERSION
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: See Section 9.3 “A/D Acquisition
Requirements”.
;This code block configures the ADC
;for polling, Vdd and Vss as reference, Frc
clock and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL ADCON1 ;
MOVLW B’10000000’ ;right justify
MOVWF ADCON1 ;Vdd and Vss as Vref
BANKSEL TRISA ;
BSF TRISA,0 ;Set RA0 to input
BANKSEL ANSEL ;
BSF ANSEL,0 ;Set RA0 to analog
BANKSEL ADCON0 ;
MOVLW B’11000001’ ;ADC Frc clock,
MOVWF ADCON0 ;AN0, On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,GO ;Start conversion
BTFSC ADCON0,GO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
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9.2.7 ADC REGISTER DEFINITIONS
The following registers are used to control the opera-
tion of the ADC.
REGISTER DEFINITIONS: ADC CONTROL
Note: For ANSEL and ANSELH registers, see
Register 3-3 and Register 3-4,
respectively.
REGISTER 9-1: ADCON0: A/D CONTROL REGISTER 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADCS<1:0>: A/D Conversion Clock Select bits
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max)
bit 5-2 CHS<3:0>: Analog Channel Select bits
0000 = AN0
0001 = AN1
0010 = AN2
0011 = AN3
0100 = AN4
0101 = AN5
0110 = AN6
0111 = AN7
1000 = AN8
1001 = AN9
1010 = AN10
1011 = AN11
1100 = AN12
1101 = AN13
1110 = CVREF
1111 = Fixed Ref (0.6V fixed voltage reference)
bit 1 GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
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REGISTER 9-2: ADCON1: A/D CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
ADFM —VCFG1VCFG0— — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ADFM: A/D Conversion Result Format Select bit
1 = Right justified
0 = Left justified
bit 6 Unimplemented: Read as ‘0’
bit 5 VCFG1: Voltage Reference bit
1 = VREF- pin
0 = VSS
bit 4 VCFG0: Voltage Reference bit
1 = VREF+ pin
0 = VDD
bit 3-0 Unimplemented: Read as ‘0’
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REGISTER 9-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper 8 bits of 10-bit conversion result
REGISTER 9-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES1 ADRES0 — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower 2 bits of 10-bit conversion result
bit 5-0 Reserved: Do not use.
REGISTER 9-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — — — — — ADRES9 ADRES8
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-2 Reserved: Do not use.
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper 2 bits of 10-bit conversion result
REGISTER 9-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower 8 bits of 10-bit conversion result
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9.3 A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 9-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge the
capacitor CHOLD. The sampling switch (RSS) impedance
varies over the device voltage (VDD), see Figure 9-4.
The maximum recommended impedance for analog
sources is 10 k. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 9-1 may be used. This equation
assumes that 1/2 LSb error is used (1024 steps for the
ADC). The 1/2 LSb error is the maximum error allowed
for the ADC to meet its specified resolution.
EQUATION 9-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C0.05µs/°C++=
TCCHOLD RIC RSS RS++ ln(1/2047)–=
10pF 1k
7k
10k
++– ln(0.0004885)=
1.37
=µs
TACQ 2ΜS1.37ΜS50°C- 25°C0.05ΜS/°C++=
4.67ΜS=
VAPPLIED 1e
Tc–
RC
---------
–
VAPPLIED 11
2n1+
1–
--------------------------
–
=
VAPPLIED 11
2n1+
1–
--------------------------
–
VCHOLD=
VAPPLIED 1e
TC–
RC
----------
–
VCHOLD=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
5.0V VDD=
Assumptions:
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
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FIGURE 9-4: ANALOG INPUT MODEL
FIGURE 9-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs ANx
5 pF
VDD
VT = 0.6V
VT = 0.6V I LEAKAGE(1)
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 10 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(k)
VDD
± 500 nA
Legend: CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
Note 1: See Section 17.0 “Electrical Specifications”.
3FFh
3FEh
ADC Output Code
3FDh
3FCh
004h
003h
002h
001h
000h
Full-Scale
3FBh
1 LSB ideal
VSS/VREF-Zero-Scale
Transition
VDD/VREF+
Transition
1 LSB ideal
Full-Scale Range
Analog Input Voltage
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TABLE 9-2: SUMMARY OF ASSOCIATED ADC REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON0 ADCS1 ADCS0 CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 108
ADCON1 ADFM —VCFG1VCFG0— — — — 109
ANSEL ANS7 ANS6 ANS5 ANS4 ANS3 ANS2 ANS1 ANS0 42
ANSELH —— ANS13 ANS12 ANS11 ANS10 ANS9 ANS8 50
ADRESH A/D Result Register High Byte 110
ADRESL A/D Result Register Low Byte 110
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIERCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIFRCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 41
PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 50
PORTE — — — — RE3 RE2 RE1 RE0 61
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 41
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 50
TRISE — — — — TRISE3 TRISE2 TRISE1 TRISE0 61
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
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NOTES:
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10.0 DATA EEPROM AND FLASH
PROGRAM MEMORY
CONTROL
The Data EEPROM and Flash program memory are
readable and writable during normal operation (full VDD
range). These memories are not directly mapped in the
register file space. Instead, they are indirectly
addressed through the Special Function Registers
(SFRs). There are six SFRs used to access these
memories:
• EECON1
• EECON2
• EEDAT
•EEDATH
• EEADR
• EEADRH (bit 4 on PIC16F886/PIC16F887 only)
When interfacing the data memory block, EEDAT holds
the 8-bit data for read/write, and EEADR holds the
address of the EEDAT location being accessed. These
devices have 256 bytes of data EEPROM with an
address range from 0h to 0FFh.
When accessing the program memory block of the
PIC16F886/PIC16F887 devices, the EEDAT and EED-
ATH registers form a 2-byte word that holds the 14-bit
data for read/write, and the EEADR and EEADRH reg-
isters form a 2-byte word that holds the 12-bit address
of the EEPROM location being read. The PIC16F882
devices have 2K words of program EEPROM with an
address range from 0h to 07FFh. The PIC16F883/
PIC16F884 devices have 4K words of program
EEPROM with an address range from 0h to 0FFFh.
The program memory allows one-word reads.
The EEPROM data memory allows byte read and write.
A byte write automatically erases the location and
writes the new data (erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range of
the device for byte or word operations.
Depending on the setting of the Flash Program
Memory Self Write Enable bits WRT<1:0> of the
Configuration Word Register 2, the device may or may
not be able to write certain blocks of the program
memory. However, reads from the program memory
are allowed.
When the device is code-protected, the CPU may
continue to read and write the data EEPROM memory
and Flash program memory. When code-protected, the
device programmer can no longer access data or
program memory.
10.1 EEADR and EEADRH Registers
The EEADR and EEADRH registers can address up to
a maximum of 256 bytes of data EEPROM or up to a
maximum of 8K words of program EEPROM.
When selecting a program address value, the MSB of
the address is written to the EEADRH register and the
LSB is written to the EEADR register. When selecting a
data address value, only the LSB of the address is
written to the EEADR register.
10.1.1 EECON1 AND EECON2 REGISTERS
EECON1 is the control register for EE memory
accesses.
Control bit EEPGD determines if the access will be a pro-
gram or data memory access. When clear, as it is when
reset, any subsequent operations will operate on the data
memory. When set, any subsequent operations will oper-
ate on the program memory. Program memory can only
be read.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation to
data EEPROM. On power-up, the WREN bit is clear.
The WRERR bit is set when a write operation is
interrupted by a MCLR or a WDT Time-out Reset
during normal operation. In these situations, following
Reset, the user can check the WRERR bit and rewrite
the location.
Interrupt flag bit EEIF of the PIR2 register is set when
write is complete. It must be cleared in the software.
EECON2 is not a physical register. Reading EECON2
will read all ‘0’s. The EECON2 register is used
exclusively in the data EEPROM write sequence.
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REGISTER DEFINITIONS: DATA EEPROM CONTROL
REGISTER 10-1: EEDAT: EEPROM DATA REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 EEDAT<7:0>: 8 Least Significant Address bits to Write to or Read from data EEPROM or Read from program memory
REGISTER 10-2: EEADR: EEPROM ADDRESS REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 EEADR<7:0>: 8 Least Significant Address bits for EEPROM Read/Write Operation(1) or Read from program memory
REGISTER 10-3: EEDATH: EEPROM DATA HIGH BYTE REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 EEDATH<5:0>: 6 Most Significant Data bits from program memory
REGISTER 10-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — EEADRH4(1) EEADRH3 EEADRH2 EEADRH1 EEADRH0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 EEADRH<4:0>: Specifies the 4 Most Significant Address bits or high bits for program memory reads
Note 1: PIC16F886/PIC16F887 only.
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REGISTER 10-5: EECON1: EEPROM CONTROL REGISTER
R/W-x U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0
EEPGD — — — WRERR WREN WR RD
bit 7 bit 0
Legend:
S = Bit can only be set
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 EEPGD: Program/Data EEPROM Select bit
1 = Accesses program memory
0 = Accesses data memory
bit 6-4 Unimplemented: Read as ‘0’
bit 3 WRERR: EEPROM Error Flag bit
1 = A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during
normal operation or BOR Reset)
0 = The write operation completed
bit 2 WREN: EEPROM Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a write cycle (The bit is cleared by hardware once write is complete. The WR bit can only
be set, not cleared, in software.)
0 = Write cycle to the data EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates a memory read (the RD is cleared in hardware and can only be set, not cleared, in
software.)
0 = Does not initiate a memory read
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10.1.2 READING THE DATA EEPROM
MEMORY
To read a data memory location, the user must write
the address to the EEADR register, clear the EEPGD
control bit of the EECON1 register, and then set control
bit RD. The data is available at the very next cycle, in
the EEDAT register; therefore, it can be read in the next
instruction. EEDAT will hold this value until another
read or until it is written to by the user (during a write
operation).
EXAMPLE 10-1: DATA EEPROM READ
10.1.3 WRITING TO THE DATA EEPROM
MEMORY
To write an EEPROM data location, the user must first
write the address to the EEADR register and the data
to the EEDAT register. Then the user must follow a
specific sequence to initiate the write for each byte.
The write will not initiate if the above sequence is not
followed exactly (write 55h to EECON2, write AAh to
EECON2, then set WR bit) for each byte. Interrupts
should be disabled during this code segment.
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times, except when
updating EEPROM. The WREN bit is not cleared
by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect this write cycle. The WR bit will
be inhibited from being set unless the WREN bit is set.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. EEIF must be
cleared by software.
EXAMPLE 10-2: DATA EEPROM WRITE
BANKSEL EEADR ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ;Data Memory
;Address to read
BANKSEL EECON1 ;
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, RD ;EE Read
BANKSEL EEDAT ;
MOVF EEDAT, W ;W = EEDAT
BCF STATUS, RP1 ;Bank 0
BANKSEL EEADR ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADR ;Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDAT ;Data Memory Value to write
BANKSEL EECON1 ;
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, WREN ;Enable writes
BCF INTCON, GIE ;Disable INTs.
BTFSC INTCON, GIE ;SEE AN576
GOTO $-2
MOVLW 55h ;
MOVWF EECON2 ;Write 55h
MOVLW AAh ;
MOVWF EECON2 ;Write AAh
BSF EECON1, WR ;Set WR bit to begin write
BSF INTCON, GIE ;Enable INTs.
SLEEP ;Wait for interrupt to signal write complete
BCF EECON1, WREN ;Disable writes
BCF STATUS, RP0 ;Bank 0
BCF STATUS, RP1
Required
Sequence
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10.1.4 READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must
write the Least and Most Significant address bits to the
EEADR and EEADRH registers, set the EEPGD con-
trol bit of the EECON1 register, and then set control bit
RD. Once the read control bit is set, the program mem-
ory Flash controller will use the second instruction
cycle to read the data. This causes the second instruc-
tion immediately following the “BSF EECON1,RD”
instruction to be ignored. The data is available in the
very next cycle, in the EEDAT and EEDATH registers;
therefore, it can be read as two bytes in the following
instructions.
EEDAT and EEDATH registers will hold this value until
another read or until it is written to by the user.
EXAMPLE 10-3: FLASH PROGRAM READ
Note 1: The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
two-cycle instruction on the next
instruction after the RD bit is set.
2: If the WR bit is set when EEPGD = 1, it
will be immediately reset to ‘0’ and no
operation will take place.
BANKSEL EEADR ;
MOVLW MS_PROG_EE_ADDR ;
MOVWF EEADRH ;MS Byte of Program Address to read
MOVLW LS_PROG_EE_ADDR ;
MOVWF EEADR ;LS Byte of Program Address to read
BANKSEL EECON1 ;
BSF EECON1, EEPGD ;Point to PROGRAM memory
BSF EECON1, RD ;EE Read
;
;First instruction after BSF EECON1,RD executes normally
NOP
NOP ;Any instructions here are ignored as program
;memory is read in second cycle after BSF EECON1,RD
;
BANKSEL EEDAT ;
MOVF EEDAT, W ;W = LS Byte of Program Memory
MOVWF LOWPMBYTE ;
MOVF EEDATH, W ;W = MS Byte of Program EEDAT
MOVWF HIGHPMBYTE ;
BCF STATUS, RP1 ;Bank 0
Required
Sequence
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FIGURE 10-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF EECON1,RD
executed here INSTR(PC + 1)
executed here Forced NOP
executed here
PC
PC + 1 EEADRH,EEADR PC+3 PC + 5
Flash ADDR
RD bit
EEDATH,EEDAT
PC + 3 PC + 4
INSTR (PC + 1)
INSTR(PC - 1)
executed here INSTR(PC + 3)
executed here INSTR(PC + 4)
executed here
Flash Data
EEDATH
EEDAT
Register
EERHLT
INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
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10.2 Writing to Flash Program Memory
Flash program memory may only be written to if the
destination address is in a segment of memory that is
not write-protected, as defined in bits WRT<1:0> of the
Configuration Word Register 2. Flash program memory
must be written in eight-word blocks (four-word blocks
for 4K memory devices). See Figures 10-2 and 10-3 for
more details. A block consists of eight words with
sequential addresses, with a lower boundary defined
by an address, where EEADR<2:0> = 000. All block
writes to program memory are done as 16-word erase
by eight-word write operations. The write operation is
edge-aligned and cannot occur across boundaries.
To write program data, it must first be loaded into the
buffer registers (see Figure 10-2). This is accomplished
by first writing the destination address to EEADR and
EEADRH and then writing the data to EEDATA and
EEDATH. After the address and data have been set up,
then the following sequence of events must be
executed:
1. Set the EEPGD control bit of the EECON1
register.
2. Write 55h, then AAh, to EECON2 (Flash
programming sequence).
3. Set the WR control bit of the EECON1 register.
All eight buffer register locations should be written to
with correct data. If less than eight words are being
written to in the block of eight words, then a read from
the program memory location(s) not being written to
must be performed. This takes the data from the pro-
gram location(s) not being written and loads it into the
EEDATA and EEDATH registers. Then the sequence of
events to transfer data to the buffer registers must be
executed.
To transfer data from the buffer registers to the program
memory, the EEADR and EEADRH must point to the last
location in the eight-word block (EEADR<2:0> = 111).
Then the following sequence of events must be
executed:
1. Set the EEPGD control bit of the EECON1
register.
2. Write 55h, then AAh, to EECON2 (Flash
programming sequence).
3. Set control bit WR of the EECON1 register to
begin the write operation.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011, 100, 101, 110, 111). When the write is
performed on the last word (EEADR<2:0> = 111), a
block of sixteen words is automatically erased and the
content of the eight word buffer registers are written
into the program memory.
After the “BSF EECON1,WR” instruction, the processor
requires two cycles to set up the erase/write operation.
The user must place two NOP instructions after the WR
bit is set. Since data is being written to buffer registers,
the writing of the first seven words of the block appears
to occur immediately. The processor will halt internal
operations for the typical 4 ms, only during the cycle in
which the erase takes place (i.e., the last word of the
sixteen-word block erase). This is not Sleep mode as
the clocks and peripherals will continue to run. After the
eight-word write cycle, the processor will resume oper-
ation with the third instruction after the EECON1 write
instruction. The above sequence must be repeated for
the higher eight words.
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FIGURE 10-2: BLOCK WRITES TO 2K AND 4K FLASH PROGRAM MEMORY
FIGURE 10-3: BLOCK WRITES TO 8K FLASH PROGRAM MEMORY
14 14 14 14
Program Memory
Buffer Register
EEADR<1:0> = 00
Buffer Register
EEADR<1:0> = 01
Buffer Register
EEADR<1:0> = 10
Buffer Register
EEADR<1:0> = 11
EEDATAEEDATH
75 07 0
68
First word of block
to be written
Sixteen words of
to Flash
automatically
after this word
is written
are transferred
Flash are erased,
then four buffers
14 14 14 14
Program Memory
Buffer Register
EEADR<2:0> = 000
Buffer Register
EEADR<2:0> = 001
Buffer Register
EEADR<2:0> = 010
Buffer Register
EEADR<2:0> = 111
EEDATAEEDATH
75 07 0
68
First word of block
to be written
Sixteen words of
to Flash
automatically
after this word
is written
are transferred
Flash are erased,
then eight buffers
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An example of the complete eight-word write sequence
is shown in Example 10-4. The initial address is loaded
into the EEADRH and EEADR register pair; the eight
words of data are loaded using indirect addressing.
EXAMPLE 10-4: WRITING TO FLASH PROGRAM MEMORY
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; This write routine assumes the following:
; A valid starting address (the least significant bits = '000')
; is loaded in ADDRH:ADDRL
; ADDRH, ADDRL and DATADDR are all located in data memory
;
BANKSEL EEADRH
MOVF ADDRH,W ; Load initial address
MOVWF EEADRH ;
MOVF ADDRL,W ;
MOVWF EEADR ;
MOVF DATAADDR,W ; Load initial data address
MOVWF FSR ;
LOOP MOVF INDF,W ; Load first data byte into lower
MOVWF EEDATA ;
INCF FSR,F ; Next byte
MOVF INDF,W ; Load second data byte into upper
MOVWF EEDATH ;
INCF FSR,F ;
BANKSEL EECON1
BSF EECON1,EEPGD ; Point to program memory
BSF EECON1,WREN ; Enable writes
BCF INTCON,GIE ; Disable interrupts (if using)
BTFSC INTCON,GIE ; See AN576
GOTO $-2
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
; Required Sequence
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write 0AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Required to transfer data to the buffer
NOP ; registers
;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;;
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts (comment out if not using interrupts)
BANKSEL EEADR
MOVF EEADR, W
INCF EEADR,F ; Increment address
ANDLW 0x0F ; Indicates when sixteen words have been programmed
SUBLW 0x0F ; 0x0F = 16 words
; 0x0B = 12 words (PIC16F884/883/882 only)
; 0x07 = 8 words
; 0x03 = 4 words(PIC16F884/883/882 only)
BTFSS STATUS,Z ; Exit on a match,
GOTO LOOP ; Continue if more data needs to be written
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10.3 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the data
EEPROM should be verified (see Example 10-5) to the
desired value to be written.
EXAMPLE 10-5: WRITE VERIFY
10.3.1 USING THE DATA EEPROM
The data EEPROM is a high-endurance, byte
addressable array that has been optimized for the
storage of frequently changing information (e.g.,
program variables or other data that are updated often).
When variables in one section change frequently, while
variables in another section do not change, it is possible
to exceed the total number of write cycles to the
EEPROM (specification D124) without exceeding the
total number of write cycles to a single byte
(specifications D120 and D120A). If this is the case,
then a refresh of the array must be performed. For this
reason, variables that change infrequently (such as
constants, IDs, calibration, etc.) should be stored in
Flash program memory.
10.4 Protection Against Spurious Write
There are conditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built in. On power-up, WREN is cleared. Also, the
Power-up Timer (64 ms duration) prevents
EEPROM write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during:
• Brown-out
•Power Glitch
• Software Malfunction
10.5 Data EEPROM Operation During
Code-Protect
Data memory can be code-protected by programming
the CPD bit in the Configuration Word Register 1
(Register 14-1) to ‘0’.
When the data memory is code-protected, only the
CPU is able to read and write data to the data
EEPROM. It is recommended to code-protect the pro-
gram memory when code-protecting data memory.
This prevents anyone from programming zeroes over
the existing code (which will execute as NOPs) to reach
an added routine, programmed in unused program
memory, which outputs the contents of data memory.
Programming unused locations in program memory to
‘0’ will also help prevent data memory code protection
from becoming breached.
BANKSEL EEDAT ;
MOVF EEDAT, W ;EEDAT not changed
;from previous write
BANKSEL EECON1 ;
BSF EECON1, RD ;YES, Read the
;value written
BANKSEL EEDAT ;
XORWF EEDAT, W ;
BTFSS STATUS, Z ;Is data the same
GOTO WRITE_ERR ;No, handle error
: ;Yes, continue
BCF STATUS, RP1 ;Bank 0
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TABLE 10-1: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
EECON1 EEPGD — — — WRERR WREN WR RD 117
EECON2 EEPROM Control Register 2 (not a physical register) —
EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 116
EEADRH — — — EEADRH4(1) EEADRH3 EEADRH2 EEADRH1 EEADRH0 116
EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 116
EEDATH —— EEDATH5 EEDATH4 EEDATH3 EEDATH2 EEDATH1 EEDATH0 116
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE — CCP2IE 35
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF — CCP2IF 37
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by data EEPROM module.
Note 1: PIC16F886/PIC16F887 only.
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NOTES:
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11.0 CAPTURE/COMPARE/PWM
MODULES (CCP1 AND CCP2)
This device contains one Enhanced Capture/Compare/
PWM (CCP1) and Capture/Compare/PWM module
(CCP2). The CCP1 and CCP2 modules are identical in
operation, with the exception of the Enhanced PWM
features available on CCP1 only. See Section 11.6
“PWM (Enhanced Mode)” for more information.
11.1 Enhanced Capture/Compare/PWM
(CCP1)
The Enhanced Capture/Compare/PWM module is a
peripheral which allows the user to time and control
different events. In Capture mode, the peripheral
allows the timing of the duration of an event. The
Compare mode allows the user to trigger an external
event when a predetermined amount of time has
expired. The PWM mode can generate a Pulse-Width
Modulated signal of varying frequency and duty cycle.
Table 11-1 shows the timer resources required by the
ECCP module.
TABLE 11-1: ECCP MODE – TIMER
RESOURCES REQUIRED
Note: CCPRx and CCPx throughout this
document refer to CCPR1 or CCPR2 and
CCP1 or CCP2, respectively.
ECCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
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REGISTER DEFINITIONS: CCP CONTROL
REGISTER 11-1: CCP1CON: ENHANCED CCP1 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 P1M<1:0>: PWM Output Configuration bits
If CCP1M<3:2> = 00, 01, 10:
xx = P1A assigned as Capture/Compare input; P1B, P1C, P1D assigned as port pins
If CCP1M<3:2> = 11:
00 = Single output; P1A modulated; P1B, P1C, P1D assigned as port pins
01 = Full-Bridge output forward; P1D modulated; P1A active; P1B, P1C inactive
10 = Half-Bridge output; P1A, P1B modulated with dead-band control; P1C, P1D assigned as port pins
11 = Full-Bridge output reverse; P1B modulated; P1C active; P1A, P1D inactive
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: ECCP Mode Select bits
0000 = Capture/Compare/PWM off (resets ECCP module)
0001 = Unused (reserved)
0010 = Compare mode, toggle output on match (CCP1IF bit is set)
0011 = Unused (reserved)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP1IF bit is set)
1001 = Compare mode, clear output on match (CCP1IF bit is set)
1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is
unaffected)
1011 = Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 or TMR2
1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high
1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low
1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high
1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low
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11.2 Capture/Compare/PWM (CCP2)
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events. In Capture mode, the peripheral allows the
timing of the duration of an event. The Compare mode
allows the user to trigger an external event when a
predetermined amount of time has expired. The PWM
mode can generate a Pulse-Width Modulated signal of
varying frequency and duty cycle.
The timer resources used by the module are shown in
Table 11-2.
Additional information on CCP modules is available in
the Application Note AN594, “Using the CCP Modules”
(DS00594).
TABLE 11-2: CCP MODE – TIMER
RESOURCES REQUIRED
CCP Mode Timer Resource
Capture Timer1
Compare Timer1
PWM Timer2
REGISTER 11-2: CCP2CON: CCP2 CONTROL REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 DC2B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR2L.
bit 3-0 CCP2M<3:0>: CCP2 Mode Select bits
0000 = Capture/Compare/PWM off (resets CCP2 module)
0001 = Unused (reserved)
0010 = Unused (reserved)
0011 = Unused (reserved)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP2IF bit is set)
1001 = Compare mode, clear output on match (CCP2IF bit is set)
1010 = Compare mode, generate software interrupt on match (CCP2IF bit is set, CCP2 pin
is unaffected)
1011 = Compare mode, trigger special event (CCP2IF bit is set, TMR1 is reset and A/D
conversion is started if the ADC module is enabled. CCP2 pin is unaffected.)
11xx = PWM mode.
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11.3 Capture Mode
In Capture mode, the CCPRxH, CCPRxL register pair
captures the 16-bit value of the TMR1 register when an
event occurs on pin CCPx. An event is defined as one
of the following and is configured by the CCP1M<3:0>
bits of the CCP1CON register:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCPxIF of the PIRx register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPRxH, CCPRxL register pair
is read, the old captured value is overwritten by the new
captured value (see Figure 11-1).
11.3.1 CCP PIN CONFIGURATION
In Capture mode, the CCPx pin should be configured
as an input by setting the associated TRIS control bit.
FIGURE 11-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
11.3.2 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchronized
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
11.3.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCPxIE interrupt enable bit of the PIEx register clear to
avoid false interrupts. Additionally, the user should
clear the CCPxIF interrupt flag bit of the PIRx register
following any change in Operating mode.
11.3.4 CCP PRESCALER
There are four prescaler settings specified by the
CCPxM<3:0> bits of the CCPxCON register. Whenever
the CCP module is turned off, or the CCP module is not
in Capture mode, the prescaler counter is cleared. Any
Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCPxCON register before changing the
prescaler (see Example 11-1).
EXAMPLE 11-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the CCPx pin is configured as an output,
a write to the port can cause a capture
condition.
CCPRxH CCPRxL
TMR1H TMR1L
Set Flag bit CCPxIF
(PIRx register)
Capture
Enable
CCPxCON<3:0>
Prescaler
1, 4, 16
and
Edge Detect
pin
CCPx
System Clock (FOSC)
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
; the new prescaler
; move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
; value
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11.4 Compare Mode
In Compare mode, the 16-bit CCPRx register value is
constantly compared against the TMR1 register pair
value. When a match occurs, the CCPx module may:
• Toggle the CCPx output
• Set the CCPx output
• Clear the CCPx output
• Generate a Special Event Trigger
• Generate a Software Interrupt
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPx1CON register.
All Compare modes can generate an interrupt.
FIGURE 11-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
11.4.1 CCP PIN CONFIGURATION
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
11.4.2 TIMER1 MODE SELECTION
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
11.4.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCP1CON
register).
11.4.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCPxM<3:0> = 1011), the CCPx module does the
following:
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCPx module does not assert control of the CCPx
pin in this mode (see the CCPxCON register).
The Special Event Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPRxH, CCPRxL
register pair. The TMR1H, TMR1L register pair is not
reset until the next rising edge of the Timer1 clock. This
allows the CCPRxH, CCPRxL register pair to
effectively provide a 16-bit programmable period
register for Timer1.
Note: Clearing the CCP1CON register will force
the CCPx compare output latch to the
default low level. This is not the PORT I/O
data latch.
CCPRxH CCPRxL
TMR1H TMR1L
Comparator
QS
R
Output
Logic
Special Event Trigger
Set CCPxIF Interrupt Flag
(PIRx)
Match
TRIS
CCPxCON<3:0>
Mode Select
Output Enable
Pin
Special Event Trigger will:
• Clear TMR1H and TMR1L registers.
• NOT set interrupt flag bit TMR1IF of the PIR1 register.
• Set the GO/DONE bit to start the ADC conversion.
CCPx 4
Note 1: The Special Event Trigger from the CCP
module does not set interrupt flag bit
TMRxIF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPRxH
and CCPRxL register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generates the Timer1 Reset, will
preclude the Reset from occurring.
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11.5 PWM Mode
The PWM mode generates a Pulse-Width Modulated
signal on the CCPx pin. The duty cycle, period and
resolution are determined by the following registers:
•PR2
•T2CON
• CCPRxL
• CCPxCON
In Pulse-Width Modulation (PWM) mode, the CCP
module produces up to a 10-bit resolution PWM output
on the CCPx pin. Since the CCPx pin is multiplexed
with the PORT data latch, the TRIS for that pin must be
cleared to enable the CCPx pin output driver.
Figure 11-3 shows a simplified block diagram of PWM
operation.
Figure 11-4 shows a typical waveform of the PWM
signal.
For a step-by-step procedure on how to set up the CCP
module for PWM operation, see Section 11.5.7
“Setup for PWM Operation”.
FIGURE 11-3: SIMPLIFIED PWM BLOCK
DIAGRAM
The PWM output (Figure 11-4) has a time base
(period) and a time that the output stays high (duty
cycle).
FIGURE 11-4: CCP PWM OUTPUT
11.5.1 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 11-1.
EQUATION 11-1: PWM PERIOD
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
•TMR2 is cleared
• The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPRxL into
CCPRxH.
Note: Clearing the CCPxCON register will
relinquish CCPx control of the CCPx pin.
CCPRxL
CCPRxH(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCPxCON<5:4>
Clear Timer2,
toggle CCPx pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler, to create the 10-bit time
base.
2: In PWM mode, CCPRxH is a read-only register.
TRIS
CCPx
Comparator
Note: The Timer2 postscaler (see Section 7.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
Period
Pulse Width
TMR2 = 0
TMR2 = CCPRxL:CCPxCON<5:4>
TMR2 = PR2
PWM Period PR21+4TOSC =
(TMR2 Prescale Value)
Note: TOSC = 1/FOSC
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11.5.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPRxH
register is read-only.
Equation 11-2 is used to calculate the PWM pulse
width.
Equation 11-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 11-2: PULSE WIDTH
EQUATION 11-3: DUTY CYCLE RATIO
The CCPRxH register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler, to create the 10-bit time base. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 11-3).
Pulse Width CCPRxL:CCPxCON<5:4>
=
TOSC
(TMR2 Prescale Value)
Duty Cycle Ratio CCPRxL:CCPxCON<5:4>
4PR2 1+
-----------------------------------------------------------------------=
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11.5.3 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 11-4.
EQUATION 11-4: PWM RESOLUTION
TABLE 11-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 11-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution 4PR2 1+log
2log
------------------------------------------ bits=
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
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11.5.4 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the CCPx
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMR2 will continue from its
previous state.
11.5.5 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 4.0 “Oscillator Module (With Fail-Safe
Clock Monitor)” for additional details.
11.5.6 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
11.5.7 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Disable the PWM pin (CCPx) output drivers as
an input by setting the associated TRIS bit.
2. Set the PWM period by loading the PR2 register.
3. Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
4. Set the PWM duty cycle by loading the CCPRxL
register and DCxB<1:0> bits of the CCPxCON
register.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the
PIR1 register.
• Set the Timer2 prescale value by loading the
T2CKPS bits of the T2CON register.
• Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PWM output after a new PWM cycle has
started:
• Wait until Timer2 overflows (TMR2IF bit of
the PIR1 register is set).
• Enable the CCPx pin output driver by clearing
the associated TRIS bit.
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11.6 PWM (Enhanced Mode)
The Enhanced PWM Mode can generate a PWM signal
on up to four different output pins with up to 10-bits of
resolution. It can do this through four different PWM
output modes:
• Single PWM
• Half-Bridge PWM
• Full-Bridge PWM, Forward mode
• Full-Bridge PWM, Reverse mode
To select an Enhanced PWM mode, the P1M bits of the
CCP1CON register must be set appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A, P1B, P1C and P1D. The polarity of the
PWM pins is configurable and is selected by setting the
CCP1M bits in the CCP1CON register appropriately.
Ta bl e 11 - 5 shows the pin assignments for each
Enhanced PWM mode.
Figure 11-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
FIGURE 11-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE
TABLE 11-5: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
Note: The PWM Enhanced mode is available on
the Enhanced Capture/Compare/PWM
module (CCP1) only.
Note: To prevent the generation of an
incomplete waveform when the PWM is
first enabled, the ECCP module waits until
the start of a new PWM period before
generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
RQ
S
Duty Cycle Registers DC1B<1:0>
Clear Timer2,
toggle PWM pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit
time base.
TRISn
CCP1/P1A
TRISn
P1B
TRISn
P1C
TRISn
P1D
Output
Controller
P1M<1:0>
2
CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
P1C
P1D
Note 1: The TRIS register value for each PWM output must be configured appropriately.
2: Clearing the CCPxCON register will relinquish ECCP control of all PWM output pins.
3: Any pin not used by an Enhanced PWM mode is available for alternate pin functions.
ECCP Mode P1M<1:0> CCP1/P1A P1B P1C P1D
Single 00 Yes(1) Yes(1) Yes(1) Yes(1)
Half-Bridge 10 Yes Yes No No
Full-Bridge, Forward 01 Yes Yes Yes Yes
Full-Bridge, Reverse 11 Ye s Yes Yes Yes
Note 1: Pulse Steering enables outputs in Single mode.
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FIGURE 11-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
0
Period
00
10
01
11
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
P1A Inactive
P1B Modulated
P1C Active
P1D Inactive
Pulse
Width
(Single Output)
(Half-Bridge)
(Full-Bridge,
Forward)
(Full-Bridge,
Reverse)
Delay(1) Delay(1)
Relationships:
• Period = 4 * T
OSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.6.6 “Programmable Dead-Band Delay
Mode”).
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FIGURE 11-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
0
Period
00
10
01
11
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
P1A Active
P1B Inactive
P1C Inactive
P1D Modulated
P1A Inactive
P1B Modulated
P1C Active
P1D Inactive
Pulse
Width
(Single Output)
(Half-Bridge)
(Full-Bridge,
Forward)
(Full-Bridge,
Reverse)
Delay(1) Delay(1)
Relationships:
• Period = 4 * T
OSC * (PR2 + 1) * (TMR2 Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
Note 1: Dead-band delay is programmed using the PWM1CON register (Section 11.6.6 “Programmable Dead-Band Delay
Mode”).
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11.6.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-pull loads. The PWM output signal is output
on the CCPx/P1A pin, while the complementary PWM
output signal is output on the P1B pin (see Figure 11-9).
This mode can be used for Half-Bridge applications, as
shown in Figure 11-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the PDC<6:0> bits of
the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 11.6.6 “Programmable Dead-Band Delay
Mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 11-8: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-Pull”)
Half-Bridge Output Driving a Full-Bridge Circuit
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11.6.2 FULL-BRIDGE MODE
In Full-Bridge mode, all four pins are used as outputs.
An example of Full-Bridge application is shown in
Figure 11-10.
In the Forward mode, pin CCP1/P1A is driven to its active
state, pin P1D is modulated, while P1B and P1C will be
driven to their inactive state as shown in Figure 11-11.
In the Reverse mode, P1C is driven to its active state,
pin P1B is modulated, while P1A and P1D will be driven
to their inactive state as shown Figure 11-11.
P1A, P1B, P1C and P1D outputs are multiplexed with
the PORT data latches. The associated TRIS bits must
be cleared to configure the P1A, P1B, P1C and P1D
pins as outputs.
FIGURE 11-10: EXAMPLE OF FULL-BRIDGE APPLICATION
P1A
P1C
FET
Driver
FET
Driver
V+
V-
Load
FET
Driver
FET
Driver
P1B
P1D
QA
QB QD
QC
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FIGURE 11-11: EXAMPLE OF FULL-BRIDGE PWM OUTPUT
Period
Pulse Width
P1A(2)
P1B(2)
P1C(2)
P1D(2)
Forward Mode
(1)
Period
Pulse Width
P1A(2)
P1C(2)
P1D(2)
P1B(2)
Reverse Mode
(1)
(1)
(1)
Note 1: At this time, the TMR2 register is equal to the PR2 register.
2: Output signal is shown as active-high.
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11.6.2.1 Direction Change in Full-Bridge
Mode
In the Full-Bridge mode, the P1M1 bit in the CCP1CON
register allows users to control the forward/reverse
direction. When the application firmware changes this
direction control bit, the module will change to the new
direction on the next PWM cycle.
A direction change is initiated in software by changing
the P1M1 bit of the CCP1CON register. The following
sequence occurs prior to the end of the current PWM
period:
• The modulated outputs (P1B and P1D) are placed
in their inactive state.
• The associated unmodulated outputs (P1A and
P1C) are switched to drive in the opposite
direction.
• PWM modulation resumes at the beginning of the
next period.
See Figure 11-12 for an illustration of this sequence.
The Full-Bridge mode does not provide dead-band
delay. As one output is modulated at a time, dead-band
delay is generally not required. There is a situation
where dead-band delay is required. This situation
occurs when both of the following conditions are true:
1. The direction of the PWM output changes when
the duty cycle of the output is at or near 100%.
2. The turn off time of the power switch, including
the power device and driver circuit, is greater
than the turn on time.
Figure 11-13 shows an example of the PWM direction
changing from forward to reverse, at a near 100% duty
cycle. In this example, at time t1, the output P1A and
P1D become inactive, while output P1C becomes
active. Since the turn off time of the power devices is
longer than the turn on time, a shoot-through current
will flow through power devices QC and QD (see
Figure 11-10) for the duration of ‘t’. The same
phenomenon will occur to power devices QA and QB
for PWM direction change from reverse to forward.
If changing PWM direction at high duty cycle is required
for an application, two possible solutions for eliminating
the shoot-through current are:
1. Reduce PWM duty cycle for one PWM period
before changing directions.
2. Use switch drivers that can drive the switches off
faster than they can drive them on.
Other options to prevent shoot-through current may
exist.
FIGURE 11-12: EXAMPLE OF PWM DIRECTION CHANGE
Pulse Width
Period(1)
Signal
Note 1: The direction bit P1M1 of the CCP1CON register is written any time during the PWM cycle.
2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle. The
modulated P1B and P1D signals are inactive at this time. The length of this time is (1/Fosc) TMR2 prescale
value.
Period
(2)
P1A (Active-High)
P1B (Active-High)
P1C (Active-High)
P1D (Active-High)
Pulse Width
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FIGURE 11-13: EXAMPLE OF PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE
Forward Period Reverse Period
P1A
TON
TOFF
T = TOFF – TON
P1B
P1C
P1D
External Switch D
Potential
Shoot-Through Current
Note 1: All signals are shown as active-high.
2: TON is the turn on delay of power switch QC and its driver.
3: TOFF is the turn off delay of power switch QD and its driver.
External Switch C
t1
PW
PW
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11.6.3 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the user to choose whether the PWM output signals are
active-high or active-low for each pair of PWM output pins
(P1A/P1C and P1B/P1D). The PWM output polarities
must be selected before the PWM pin output drivers are
enabled. Changing the polarity configuration while the
PWM pin output drivers are enable is not recommended
since it may result in damage to the application circuits.
The P1A, P1B, P1C and P1D output latches may not be
in the proper states when the PWM module is
initialized. Enabling the PWM pin output drivers at the
same time as the Enhanced PWM modes may cause
damage to the application circuit. The Enhanced PWM
modes must be enabled in the proper Output mode and
complete a full PWM cycle before enabling the PWM
pin output drivers. The completion of a full PWM cycle
is indicated by the TMR2IF bit of the PIR1 register
being set as the second PWM period begins.
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the high-
impedance state. The external circuits
must keep the power switch devices in the
Off state until the microcontroller drives
the I/O pins with the proper signal levels or
activates the PWM output(s).
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11.6.4 ENHANCED PWM AUTO-
SHUTDOWN MODE
The PWM mode supports an Auto-Shutdown mode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
ECCPAS<2:0> bits of the ECCPAS register. A shutdown
event may be generated by:
•A logic ‘0’ on the INT pin
• Comparator C1
• Comparator C2
• Setting the ECCPASE bit in firmware
A shutdown condition is indicated by the ECCPASE
(Auto-Shutdown Event Status) bit of the ECCPAS
register. If the bit is a ‘0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state.
When a shutdown event occurs, two things happen:
The ECCPASE bit is set to ‘1’. The ECCPASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 11.6.5 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [P1A/P1C] and [P1B/P1D]. The state
of each pin pair is determined by the PSSAC and
PSSBD bits of the ECCPAS register. Each pin pair may
be placed into one of three states:
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
FIGURE 11-14: AUTO-SHUTDOWN BLOCK DIAGRAM
PSSAC<1>
TRISx P1A
0
1
P1A_DRV
PSSAC<0>
PSSBD<1>
TRISx P1B
0
1
PSSBD<0>
P1B_DRV
PSSAC<1>
TRISx P1C
0
1
PSSAC<0>
P1C_DRV
PSSBD<1>
TRISx P1D
0
1
PSSBD<0>
P1D_DRV
000
001
010
011
100
101
110
111
From Comparator C2
From Comparator C1
ECCPAS<2:0>
R
DQ
S
ECCPASE
From Data Bus
Write to ECCPASE
PRSEN
INT
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REGISTER 11-3: ECCPAS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN
CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; ECCP outputs are in shutdown state
0 = ECCP outputs are operating
bit 6-4 ECCPAS<2:0>: ECCP Auto-shutdown Source Select bits
000 = Auto-Shutdown is disabled
001 = Comparator C1 output high
010 = Comparator C2 output high(1)
011 = Either Comparators output is high
100 =V
IL on INT pin
101 =V
IL on INT pin or Comparator C1 output high
110 =V
IL on INT pin or Comparator C2 output high
111 =VIL on INT pin or either Comparators output is high
bit 3-2 PSSACn: Pins P1A and P1C Shutdown State Control bits
00 = Drive pins P1A and P1C to ‘0’
01 = Drive pins P1A and P1C to ‘1’
1x = Pins P1A and P1C tri-state
bit 1-0 PSSBDn: Pins P1B and P1D Shutdown State Control bits
00 = Drive pins P1B and P1D to ‘0’
01 = Drive pins P1B and P1D to ‘1’
1x = Pins P1B and P1D tri-state
Note 1: If C2SYNC is enabled, the shutdown will be delayed by Timer1.
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
2: Writing to the ECCPASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
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FIGURE 11-15: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (PRSEN = 0)
11.6.5 AUTO-RESTART MODE
The Enhanced PWM can be configured to automati-
cally restart the PWM signal once the auto-shutdown
condition has been removed. Auto-restart is enabled by
setting the PRSEN bit in the PWM1CON register.
If auto-restart is enabled, the ECCPASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
ECCPASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 11-16: PWM AUTO-SHUTDOWN WITH AUTO-RESTART ENABLED (PRSEN = 1)
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM
Resumes
Start of
PWM Period
ECCPASE
Cleared by
Firmware
PWM Period
Shutdown
PWM
ECCPASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM
Resumes
PWM Period
Start of
PWM Period
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11.6.6 PROGRAMMABLE DEAD-BAND
DELAY MODE
In Half-Bridge applications where all power switches
are modulated at the PWM frequency, the power
switches normally require more time to turn off than to
turn on. If both the upper and lower power switches are
switched at the same time (one turned on, and the
other turned off), both switches may be on for a short
period of time until one switch completely turns off.
During this brief interval, a very high current (shoot-
through current) will flow through both power switches,
shorting the bridge supply. To avoid this potentially
destructive shoot-through current from flowing during
switching, turning on either of the power switches is
normally delayed to allow the other switch to
completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signal transition from the non-active state
to the active state. See Figure 11-17 for illustration. The
lower seven bits of the associated PWM1CON register
(Register 11-4) sets the delay period in terms of
microcontroller instruction cycles (TCY or 4 TOSC).
FIGURE 11-17: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 11-18: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
V-
Load
+
V
-
+
V
-
Standard Half-Bridge Circuit (“Push-Pull”)
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REGISTER DEFINITIONS: PWM CONTROL
REGISTER 11-4: PWM1CON: ENHANCED PWM CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 PRSEN: PWM Restart Enable bit
1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM
bit 6-0 PDC<6:0>: PWM Delay Count bits
PDCn = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal
should transition active and the actual time it transitions active.
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11.6.7 PULSE STEERING MODE
In Single Output mode, pulse steering allows any of the
PWM pins to be the modulated signal. Additionally, the
same PWM signal can be simultaneously available on
multiple pins.
Once the Single Output mode is selected
(CCP1M<3:2> = 11 and P1M<1:0> = 00 of the
CCP1CON register), the user firmware can bring out
the same PWM signal to one, two, three or four output
pins by setting the appropriate STR<D:A> bits of the
PSTRCON register, as shown in Table 11-5.
While the PWM Steering mode is active, CCP1M<1:0>
bits of the CCP1CON register select the PWM output
polarity for the P1<D:A> pins.
The PWM auto-shutdown operation also applies to
PWM Steering mode as described in Section 11.6.4
“Enhanced PWM Auto-Shutdown Mode”. An auto-
shutdown event will only affect pins that have PWM
outputs enabled.
REGISTER DEFINITIONS: PULSE STEERING CONTROL
Note: The associated TRIS bits must be set to
output (‘0’) to enable the pin output driver
in order to see the PWM signal on the pin.
REGISTER 11-5: PSTRCON: PULSE STEERING CONTROL REGISTER(1)
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
— — — STRSYNC STRD STRC STRB STRA
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4 STRSYNC: Steering Sync bit
1 = Output steering update occurs on next PWM period
0 = Output steering update occurs at the beginning of the instruction cycle boundary
bit 3 STRD: Steering Enable bit D
1 = P1D pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1D pin is assigned to port pin
bit 2 STRC: Steering Enable bit C
1 = P1C pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1C pin is assigned to port pin
bit 1 STRB: Steering Enable bit B
1 = P1B pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1B pin is assigned to port pin
bit 0 STRA: Steering Enable bit A
1 = P1A pin has the PWM waveform with polarity control from CCPxM<1:0>
0 = P1A pin is assigned to port pin
Note 1: The PWM Steering mode is available only when the CCP1CON register bits CCP1M<3:2> = 11 and
P1M<1:0> = 00.
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FIGURE 11-19: SIMPLIFIED STEERING
BLOCK DIAGRAM
1
0TRIS
P1A pin
PORT Data
P1A Signal
STRA
1
0
TRIS
P1B pin
PORT Data
STRB
1
0
TRIS
P1C pin
PORT Data
STRC
1
0
TRIS
P1D pin
PORT Data
STRD
Note 1: Port outputs are configured as shown when
the CCP1CON register bits P1M<1:0> = 00
and CCP1M<3:2> = 11.
2: Single PWM output requires setting at least
one of the STRx bits.
CCP1M1
CCP1M0
CCP1M1
CCP1M0
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11.6.7.1 Steering Synchronization
The STRSYNC bit of the PSTRCON register gives the
user two selections of when the steering event will
happen. When the STRSYNC bit is ‘0’, the steering
event will happen at the end of the instruction that
writes to the PSTRCON register. In this case, the
output signal at the P1<D:A> pins may be an
incomplete PWM waveform. This operation is useful
when the user firmware needs to immediately remove
a PWM signal from the pin.
When the STRSYNC bit is ‘1’, the effective steering
update will happen at the beginning of the next PWM
period. In this case, steering on/off the PWM output will
always produce a complete PWM waveform.
Figures 11-20 and 11-21 illustrate the timing diagrams
of the PWM steering depending on the STRSYNC
setting.
FIGURE 11-20: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STRSYNC = 0)
FIGURE 11-21: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION
(STRSYNC = 1)
PWM
P1n = PWM
STRn
P1<D:A> PORT Data
PWM Period
PORT Data
PWM
PORT Data
P1n = PWM
STRn
P1<D:A> PORT Data
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TABLE 11-6: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1
TABLE 11-7: REGISTERS ASSOCIATED WITH PWM AND TIMER2
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 128
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 129
CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) 130
CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) 130
CCPR2L Capture/Compare/PWM Register 2 Low Byte (LSB) 130
CCPR2H Capture/Compare/PWM Register 2 High Byte (MSB) 130
CM2CON1 MC1OUT MC2OUT C1RSEL C2RSEL ——T1GSSC2SYNC 96
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE — CCP2IE 35
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF — CCP2IF 37
T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 84
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 81
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 81
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the
Capture and Compare.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 128
CCP2CON —— DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 129
ECCPAS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0 146
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PR2 Timer2 Period Register 87
PSTRCON — — — STRSYNC STRD STRC STRB STRA 150
PWM1CON PRSEN PDC6 PDC5 PDC4 PDC3 PDC2 PDC1 PDC0 149
T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 88
TMR2 Timer2 Module Register 87
TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 50
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TRISD TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 59
Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the
PWM.
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NOTES:
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12.0 ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
system. Full-Duplex mode is useful for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These devices typically do not have internal clocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
The EUSART module includes the following capabilities:
• Full-duplex asynchronous transmit and receive
• Two-character input buffer
• One-character output buffer
• Programmable 8-bit or 9-bit character length
• Address detection in 9-bit mode
• Input buffer overrun error detection
• Received character framing error detection
• Half-duplex synchronous master
• Half-duplex synchronous slave
• Programmable clock polarity in synchronous
modes
• Sleep operation
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
• Automatic detection and calibration of the baud rate
• Wake-up on Break reception
• 13-bit Break character transmit
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 12-1 and Figure 12-2.
FIGURE 12-1: EUSART TRANSMIT BLOCK DIAGRAM
TXIF
TXIE
Interrupt
TXEN
TX9D
MSb LSb
Data Bus
TXREG Register
Transmit Shift Register (TSR)
(8) 0
TX9
TRMT SPEN
TX/CK pin
Pin Buffer
and Control
8
SPBRG
SPBRGH
BRG16
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
•••
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FIGURE 12-2: EUSART RECEIVE BLOCK DIAGRAM
The operation of the EUSART module is controlled
through three registers:
• Transmit Status and Control (TXSTA)
• Receive Status and Control (RCSTA)
• Baud Rate Control (BAUDCTL)
These registers are detailed in Register 12-1,
Register 12-2 and Register 12-3, respectively.
RX/DT pin
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR
FERR
RSR Register
MSb LSb
RX9D RCREG Register FIFO
Interrupt
RCIF
RCIE
Data Bus
8
Stop START
(8) 7 10
RX9
• • •
SPBRGSPBRGH
BRG16
RCIDL
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
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12.1 EUSART Asynchronous Mode
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH mark state which
represents a ‘1’ data bit, and a VOL space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output level of that bit without returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the mark state. Each character
transmission consists of one Start bit followed by eight
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is 8 bits. Each transmitted bit persists for a period
of 1/(Baud Rate). An on-chip dedicated 8-bit/16-bit Baud
Rate Generator is used to derive standard baud rate
frequencies from the system oscillator. See Table 12-5
for examples of baud rate configurations.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but share the same data format and baud
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data bit.
12.1.1 EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 12-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREG register.
12.1.1.1 Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
•TXEN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the TXEN bit of the TXSTA register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART and
automatically configures the TX/CK I/O pin as an output.
If the TX/CK pin is shared with an analog peripheral the
analog I/O function must be disabled by clearing the
corresponding ANSEL bit.
12.1.1.2 Transmitting Data
A transmission is initiated by writing a character to the
TXREG register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR register. If the TSR still contains
all or part of a previous character, the new character
data is held in the TXREG until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREG is then transferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bits
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREG.
12.1.1.3 Transmit Interrupt Flag
The TXIF interrupt flag bit of the PIR1 register is set
whenever the EUSART transmitter is enabled and no
character is being held for transmission in the TXREG.
In other words, the TXIF bit is only clear when the TSR
is busy with a character and a new character has been
queued for transmission in the TXREG. The TXIF flag
bit is not cleared immediately upon writing TXREG.
TXIF becomes valid in the second instruction cycle
following the write execution. Polling TXIF immediately
following the TXREG write will return invalid results. The
TXIF bit is read-only, it cannot be set or cleared by
software.
The TXIF interrupt can be enabled by setting the TXIE
interrupt enable bit of the PIE1 register. However, the
TXIF flag bit will be set whenever the TXREG is empty,
regardless of the state of TXIE enable bit.
To use interrupts when transmitting data, set the TXIE
bit only when there is more data to send. Clear the
TXIE interrupt enable bit upon writing the last character
of the transmission to the TXREG.
Note 1: When the SPEN bit is set the RX/DT I/O
pin is automatically configured as an input,
regardless of the state of the correspond-
ing TRIS bit and whether or not the
EUSART receiver is enabled. The RX/DT
pin data can be read via a normal PORT
read but PORT latch data output is pre-
cluded.
2: The TXIF transmitter interrupt flag is set
when the TXEN enable bit is set.
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12.1.1.4 TSR Status
The TRMT bit of the TXSTA register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREG. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user has to
poll this bit to determine the TSR status.
12.1.1.5 Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTA register is set the
EUSART will shift 9 bits out for each character transmit-
ted. The TX9D bit of the TXSTA register is the ninth,
and Most Significant, data bit. When transmitting 9-bit
data, the TX9D data bit must be written before writing
the 8 Least Significant bits into the TXREG. All nine bits
of data will be transferred to the TSR shift register
immediately after the TXREG is written.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 12.1.2.7 “Address
Detection” for more information on the Address mode.
12.1.1.6 Asynchronous Transmission Setup:
1. Initialize the SPBRGH, SPBRG register pair and
the BRGH and BRG16 bits to achieve the desired
baud rate (see Section 12.3 “EUSART Baud
Rate Generator (BRG)”).
2. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
3. If 9-bit transmission is desired, set the TX9 con-
trol bit. A set ninth data bit will indicate that the 8
Least Significant data bits are an address when
the receiver is set for address detection.
4. Enable the transmission by setting the TXEN
control bit. This will cause the TXIF interrupt bit
to be set.
5. If interrupts are desired, set the TXIE interrupt
enable bit of the PIE1 register. An interrupt will
occur immediately provided that the GIE and
PEIE bits of the INTCON register are also set.
6. If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
7. Load 8-bit data into the TXREG register. This
will start the transmission.
FIGURE 12-3: ASYNCHRONOUS TRANSMISSION
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
Word 1
Stop bit
Word 1
Transmit Shift Reg
Start bit bit 0 bit 1 bit 7/8
Write to TXREG
Word 1
BRG Output
(Shift Clock)
TX/CK
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
pin
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FIGURE 12-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK)
TABLE 12-1: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Asynchronous Transmission.
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
TX/CK
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Start bit Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
pin
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
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12.1.2 EUSART ASYNCHRONOUS
RECEIVER
The Asynchronous mode is typically used in RS-232
systems. The receiver block diagram is shown in
Figure 12-2. The data is received on the RX/DT pin and
drives the data recovery block. The data recovery block
is actually a high-speed shifter operating at 16 times
the baud rate, whereas the serial Receive Shift
Register (RSR) operates at the bit rate. When all 8 or 9
bits of the character have been shifted in, they are
immediately transferred to a two character First-In-
First-Out (FIFO) memory. The FIFO buffering allows
reception of two complete characters and the start of a
third character before software must start servicing the
EUSART receiver. The FIFO and RSR registers are not
directly accessible by software. Access to the received
data is via the RCREG register.
12.1.2.1 Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operation by configuring the following three control bits:
• CREN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the CREN bit of the RCSTA register enables the
receiver circuitry of the EUSART. Clearing the SYNC bit
of the TXSTA register configures the EUSART for asyn-
chronous operation. Setting the SPEN bit of the RCSTA
register enables the EUSART and automatically config-
ures the RX/DT I/O pin as an input. If the RX/DT pin is
shared with an analog peripheral the analog I/O function
must be disabled by clearing the corresponding ANSEL
bit.
12.1.2.2 Receiving Data
The receiver data recovery circuit initiates character
reception on the falling edge of the first bit. The first bit,
also known as the Start bit, is always a zero. The data
recovery circuit counts one-half bit time to the center of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit counts a full bit time to the center of the
next bit. The bit is then sampled by a majority detect
circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR.
This repeats until all data bits have been sampled and
shifted into the RSR. One final bit time is measured and
the level sampled. This is the Stop bit, which is always
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
character, otherwise the framing error is cleared for this
character. See Section 12.1.2.4 “Receive Framing
Error” for more information on framing errors.
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCIF interrupt
flag bit of the PIR1 register is set. The top character in
the FIFO is transferred out of the FIFO by reading the
RCREG register.
12.1.2.3 Receive Interrupts
The RCIF interrupt flag bit of the PIR1 register is set
whenever the EUSART receiver is enabled and there is
an unread character in the receive FIFO. The RCIF
interrupt flag bit is read-only, it cannot be set or cleared
by software.
RCIF interrupts are enabled by setting all of the
following bits:
• RCIE interrupt enable bit of the PIE1 register
• PEIE peripheral interrupt enable bit of the
INTCON register
• GIE global interrupt enable bit of the INTCON
register
The RCIF interrupt flag bit will be set when there is an
unread character in the FIFO, regardless of the state of
interrupt enable bits.
Note: When the SPEN bit is set the TX/CK I/O
pin is automatically configured as an
output, regardless of the state of the
corresponding TRIS bit and whether or
not the EUSART transmitter is enabled.
The PORT latch is disconnected from the
output driver so it is not possible to use the
TX/CK pin as a general purpose output.
Note: If the receive FIFO is overrun, no additional
characters will be received until the overrun
condition is cleared. See Section 12.1.2.5
“Receive Overrun Error” for more
information on overrun errors.
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12.1.2.4 Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indicates that a Stop bit was not seen at the expected
time. The framing error status is accessed via the
FERR bit of the RCSTA register. The FERR bit
represents the status of the top unread character in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.
The FERR bit is read-only and only applies to the top
unread character in the receive FIFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTA register which resets the EUSART.
Clearing the CREN bit of the RCSTA register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
12.1.2.5 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated If a third character, in its
entirety, is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTA register is
set. The characters already in the FIFO buffer can be
read but no additional characters will be received until
the error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTA register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTA register.
12.1.2.6 Receiving 9-Bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9 bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth and Most Significant data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREG.
12.1.2.7 Address Detection
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTA
register.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
receive FIFO buffer, thereby setting the RCIF interrupt
bit. All other characters will be ignored.
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop bit occurs. When user software detects the end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
Note: If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREG will not clear the FERR bit.
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12.1.2.8 Asynchronous Reception Setup:
1. Initialize the SPBRGH, SPBRG register pair and
the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit reception is desired, set the RX9 bit.
5. Enable reception by setting the CREN bit.
6. The RCIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCIE interrupt enable bit was also set.
7. Read the RCSTA register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data bit.
8. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register.
9. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
12.1.2.9 9-bit Address Detection Mode Setup
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGH, SPBRG register pair and
the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. Enable 9-bit reception by setting the RX9 bit.
5. Enable address detection by setting the ADDEN
bit.
6. Enable reception by setting the CREN bit.
7. The RCIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will be generated if the RCIE interrupt enable bit
was also set.
8. Read the RCSTA register to get the error flags.
The ninth data bit will always be set.
9. Get the received 8 Least Significant data bits
from the receive buffer by reading the RCREG
register. Software determines if this is the
device’s address.
10. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
11. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
FIGURE 12-5: ASYNCHRONOUS RECEPTION
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX/DT pin
Reg
Rcv Buffer Reg
Rcv Shift
Read Rcv
Buffer Reg
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG
Word 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing the OERR (overrun) bit to be set.
RCIDL
2006-2012 Microchip Technology Inc. DS41291G-page 163
PIC16F882/883/884/886/887
TABLE 12-2: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Asynchronous Reception.
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DS41291G-page 164 2006-2012 Microchip Technology Inc.
12.2 Clock Accuracy with
Asynchronous Operation
The factory calibrates the Internal Oscillator block out-
put (INTOSC). However, the INTOSC frequency may
drift as VDD or temperature changes, and this directly
affects the asynchronous baud rate. Two methods may
be used to adjust the baud rate clock, but both require
a reference clock source of some kind.
The first (preferred) method uses the OSCTUNE
register to adjust the INTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See Section 4.5
“Internal Clock Modes” for more information.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 12.3.1 “Auto-
Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
REGISTER DEFINITIONS: EUSART CONTROL
REGISTER 12-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0
CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode
bit 1 TRMT: Transmit Shift Register Status bit
1 =TSR empty
0 = TSR full
bit 0 TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
2006-2012 Microchip Technology Inc. DS41291G-page 165
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REGISTER 12-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave
Don’t care
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2 FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receive next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: Ninth bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
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REGISTER 12-3: BAUDCTL: BAUD RATE CONTROL REGISTER
R-0 R-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1 = Auto-baud timer overflowed
0 = Auto-baud timer did not overflow
Synchronous mode:
Don’t care
bit 6 RCIDL: Receive Idle Flag bit
Asynchronous mode:
1 = Receiver is Idle
0 = Start bit has been received and the receiver is receiving
Synchronous mode:
Don’t care
bit 5 Unimplemented: Read as ‘0’
bit 4 SCKP: Synchronous Clock Polarity Select bit
Asynchronous mode:
1 = Transmit inverted data to the RB7/TX/CK pin
0 = Transmit non-inverted data to the RB7/TX/CK pin
Synchronous mode:
1 = Data is clocked on rising edge of the clock
0 = Data is clocked on falling edge of the clock
bit 3 BRG16: 16-bit Baud Rate Generator bit
1 = 16-bit Baud Rate Generator is used
0 = 8-bit Baud Rate Generator is used
bit 2 Unimplemented: Read as ‘0’
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = Receiver is waiting for a falling edge. No character will be received byte RCIF will be set. WUE will
automatically clear after RCIF is set.
0 = Receiver is operating normally
Synchronous mode:
Don’t care
bit 0 ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0 = Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
2006-2012 Microchip Technology Inc. DS41291G-page 167
PIC16F882/883/884/886/887
12.3 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCTL register selects 16-bit
mode.
The SPBRGH, SPBRG register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXSTA
register and the BRG16 bit of the BAUDCTL register. In
Synchronous mode, the BRGH bit is ignored.
Table 12-3 contains the formulas for determining the
baud rate. Example 12-1 provides a sample calculation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 12-3. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
Writing a new value to the SPBRGH, SPBRG register
pair causes the BRG timer to be reset (or cleared). This
ensures that the BRG does not wait for a timer overflow
before outputting the new baud rate.
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is Idle before
changing the system clock.
EXAMPLE 12-1: CALCULATING BAUD
RATE ERROR
TABLE 12-3: BAUD RATE FORMULAS
TABLE 12-4: REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
Solving for SPBRGH:SPBRG:
X
FOSC
Desired Baud Rate
---------------------------------------------
64
--------------------------------------------- 1–=
Desired Baud Rate FOSC
64 [SPBRGH:SPBRG] 1+
---------------------------------------------------------------------=
16000000
9600
------------------------
64
------------------------1–=
25.04225==
Calculated Baud Rate 16000000
64 25 1+
---------------------------=
9615=
Error Calc. Baud Rate Desired Baud Rate –
Desired Baud Rate
--------------------------------------------------------------------------------------------=
9615 9600–
9600
---------------------------------- 0 . 1 6 %==
Configuration Bits
BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/[64 (n+1)]
001 8-bit/Asynchronous FOSC/[16 (n+1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n+1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH, SPBRG register pair
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL —SCKP BRG16 —WUE ABDEN 166
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, - = unimplemented read as ‘0’. Shaded cells are not used for the Baud Rate Generator.
PIC16F882/883/884/886/887
DS41291G-page 168 2006-2012 Microchip Technology Inc.
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300—— — —— — —— — —— —
1200 1221 1.73 255 1200 0.00 239 1200 0.00 143 1202 0.16 103
2400 2404 0.16 129 2400 0.00 119 2400 0.00 71 2404 0.16 51
9600 9470 -1.36 32 9600 0.00 29 9600 0.00 17 9615 0.16 12
10417 10417 0.00 29 10286 -1.26 27 10165 -2.42 16 10417 0.00 11
19.2k 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8 — — —
57.6k — — — 57.60k 0.00 7 57.60k 0.00 2 — — —
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300 0.16 207 300 0.00 191 300 0.16 103 300 0.16 51
1200 1202 0.16 51 1200 0.00 47 1202 0.16 25 1202 0.16 12
2400 2404 0.16 25 2400 0.00 23 2404 0.16 12 — — —
9600 — — — 9600 0.00 5 — — — — — —
10417 10417 0.00 5 — — — 10417 0.00 2 — — —
19.2k — — — 19.20k 0.00 2 — — — — — —
57.6k — — — 57.60k 0.00 0 — — — — — —
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 —— — —— — —— — —— —
1200 — — — — — — — — — — — —
2400 — — — — — — —— —
2404 0.16 207
9600 9615 0.16 129 9600 0.00 119 9600 0.00 71 9615 0.16 51
10417 10417 0.00 119 10378 -0.37 110 10473 0.53 65 10417 0.00 47
19.2k 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 19231 0.16 25
57.6k 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11 55556 -3.55 8
115.2k 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5 — — —
2006-2012 Microchip Technology Inc. DS41291G-page 169
PIC16F882/883/884/886/887
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 — — — — — — — — — 300 0.16 207
1200 1202 0.16 207 1200 0.00 191 1202 0.16 103 1202 0.16 51
2400 2404 0.16 103 2400 0.00 95 2404 0.16 51 2404 0.16 25
9600 9615 0.16 25 9600 0.00 23 9615 0.16 12 — — —
10417 10417 0.00 23 10473 0.53 21 10417 0.00 11 10417 0.00 5
19.2k 19.23k 0.16 12 19.2k 0.00 11 — — — — — —
57.6k — — — 57.60k 0.00 3 — — — — — —
115.2k — — — 115.2k 0.00 1 — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303 299.9 -0.02 1666
1200 1200 -0.03 1041 1200 0.00 959 1200 0.00 575 1199 -0.08 416
2400 2399 -0.03 520 2400 0.00 479 2400 0.00 287 2404 0.16 207
9600 9615 0.16 129 9600 0.00 119 9600 0.00 71 9615 0.16 51
10417 10417 0.00 119 10378 -0.37 110 10473 0.53 65 10417 0.00 47
19.2k 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35 19.23k 0.16 25
57.6k 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11 55556 -3.55 8
115.2k 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5 — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.1 0.04 832 300.0 0.00 767 299.8 -0.108 416 300.5 0.16 207
1200 1202 0.16 207 1200 0.00 191 1202 0.16 103 1202 0.16 51
2400 2404 0.16 103 2400 0.00 95 2404 0.16 51 2404 0.16 25
9600 9615 0.16 25 9600 0.00 23 9615 0.16 12 — — —
10417 10417 0.00 23 10473 0.53 21 10417 0.00 11 10417 0.00 5
19.2k 19.23k 0.16 12 19.20k 0.00 11 — — — — — —
57.6k — — — 57.60k 0.00 3 — — — — — —
115.2k — — — 115.2k 0.00 1 — — — — — —
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
PIC16F882/883/884/886/887
DS41291G-page 170 2006-2012 Microchip Technology Inc.
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 9215 300.0 0.00 6666
1200 1200 -0.01 4166 1200 0.00 3839 1200 0.00 2303 1200 -0.02 1666
2400 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151 2401 0.04 832
9600 9597 -0.03 520 9600 0.00 479 9600 0.00 287 9615 0.16 207
10417 10417 0.00 479 10425 0.08 441 10433 0.16 264 10417 0 191
19.2k 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143 19.23k 0.16 103
57.6k 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47 57.14k -0.79 34
115.2k 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23 117.6k 2.12 16
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.01 3332 300.0 0.00 3071 299.9 -0.02 1666 300.1 0.04 832
1200 1200 0.04 832 1200 0.00 767 1199 -0.08 416 1202 0.16 207
2400 2398 0.08 416 2400 0.00 383 2404 0.16 207 2404 0.16 103
9600 9615 0.16 103 9600 0.00 95 9615 0.16 51 9615 0.16 25
10417 10417 0.00 95 10473 0.53 87 10417 0.00 47 10417 0.00 23
19.2k 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 25 19.23k 0.16 12
57.6k 58.82k 2.12 16 57.60k 0.00 15 55.56k -3.55 8 — — —
115.2k 111.1k -3.55 8 115.2k 0.00 7 — — — — — —
TABLE 12-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
2006-2012 Microchip Technology Inc. DS41291G-page 171
PIC16F882/883/884/886/887
12.3.1 AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a received 55h (ASCII “U”) which is the Sync character
for the LIN bus. The unique feature of this character is
that it has five rising edges including the Stop bit edge.
Setting the ABDEN bit of the BAUDCTL register starts
the auto-baud calibration sequence (Figure 12-6).
While the ABD sequence takes place, the EUSART
state machine is held in Idle. On the first rising edge of
the receive line, after the Start bit, the SPBRG begins
counting up using the BRG counter clock as shown in
Table 12-6. The fifth rising edge will occur on the RX pin
at the end of the eighth bit period. At that time, an
accumulated value totaling the proper BRG period is
left in the SPBRGH, SPBRG register pair, the ABDEN
bit is automatically cleared and the RCIF interrupt flag
is set. The value in the RCREG needs to be read to
clear the RCIF interrupt. RCREG content should be
discarded. When calibrating for modes that do not use
the SPBRGH register the user can verify that the
SPBRG register did not overflow by checking for 00h in
the SPBRGH register.
The BRG auto-baud clock is determined by the BRG16
and BRGH bits as shown in Tab l e 1 2-6. During ABD,
both the SPBRGH and SPBRG registers are used as a
16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGH
and SPBRG registers are clocked at 1/8th the BRG
base clock rate. The resulting byte measurement is the
average bit time when clocked at full speed.
TABLE 12-6: BRG COUNTER CLOCK RATES
FIGURE 12-6: AUTOMATIC BAUD RATE CALIBRATION
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection will occur on the byte
following the Break character (see
Section 12.3.2 “Auto-Wake-up on
Break”).
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible.
3: During the auto-baud process, the auto-
baud counter starts counting at 1. Upon
completion of the auto-baud sequence, to
achieve maximum accuracy, subtract 1
from the SPBRGH:SPBRG register pair.
BRG16 BRGH BRG Base
Clock
BRG ABD
Clock
00FOSC/64 FOSC/512
01FOSC/16 FOSC/128
10FOSC/16 FOSC/128
11 FOSC/4 FOSC/32
Note: During the ABD sequence, SPBRG and
SPBRGH registers are both used as a 16-bit
counter, independent of BRG16 setting.
BRG Value
RX pin
ABDEN bit
RCIF bit
bit 0 bit 1
(Interrupt)
Read
RCREG
BRG Clock
Start
Auto Cleared
Set by User
XXXXh 0000h
Edge #1
bit 2 bit 3
Edge #2
bit 4 bit 5
Edge #3
bit 6 bit 7
Edge #4
Stop bit
Edge #5
001Ch
Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode
SPBRG XXh 1Ch
SPBRGH XXh 00h
RCIDL
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12.3.2 AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controller to wake-up due to activity on the RX/DT line.
This feature is available only in Asynchronous mode.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCTL register. Once set, the normal
receive sequence on RX/DT is disabled, and the
EUSART remains in an Idle state, monitoring for a wake-
up event independent of the CPU mode. A wake-up
event consists of a high-to-low transition on the RX/DT
line. (This coincides with the start of a Sync Break or a
wake-up signal character for the LIN protocol.)
The EUSART module generates an RCIF interrupt
coincident with the wake-up event. The interrupt is
generated synchronously to the Q clocks in normal CPU
operating modes (Figure 12-7), and asynchronously if
the device is in Sleep mode (Figure 12-8). The interrupt
condition is cleared by reading the RCREG register.
The WUE bit is automatically cleared by the low-to-high
transition on the RX line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
12.3.2.1 Special Considerations
Break Character
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
received, the low time from the Start bit to the first rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the initial character in the transmission must
be all ‘0’s. This must be 10 or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
Oscillator Startup Time
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval, to allow enough time for the selected oscillator
to start and provide proper initialization of the EUSART.
WUE Bit
The wake-up event causes a receive interrupt by
setting the RCIF bit. The WUE bit is cleared in
hardware by a rising edge on RX/DT. The interrupt
condition is then cleared in software by reading the
RCREG register and discarding its contents.
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before setting the WUE bit. If a receive operation is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
FIGURE 12-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit set by user Auto Cleared
Cleared due to User Read of RCREG
Note 1: The EUSART remains in Idle while the WUE bit is set.
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FIGURE 12-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
12.3.3 BREAK CHARACTER SEQUENCE
The EUSART module has the capability of sending the
special Break character sequences that are required by
the LIN bus standard. A Break character consists of a
Start bit, followed by 12 ‘0’ bits and a Stop bit.
To send a Break character, set the SENDB and TXEN
bits of the TXSTA register. The Break character trans-
mission is then initiated by a write to the TXREG. The
value of data written to TXREG will be ignored and all
‘0’s will be transmitted.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN specification).
The TRMT bit of the TXSTA register indicates when the
transmit operation is active or Idle, just as it does during
normal transmission. See Figure 12-9 for the timing of
the Break character sequence.
12.3.3.1 Break and Sync Transmit Sequence
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
1. Configure the EUSART for the desired mode.
2. Set the TXEN and SENDB bits to enable the
Break sequence.
3. Load the TXREG with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREG to load the Sync character
into the transmit FIFO buffer.
5. After the Break has been sent, the SENDB bit is
reset by hardware and the Sync character is
then transmitted.
When the TXREG becomes empty, as indicated by the
TXIF, the next data byte can be written to TXREG.
12.3.4 RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
The first method to detect a Break character uses the
FERR bit of the RCSTA register and the Received data
as indicated by RCREG. The Baud Rate Generator is
assumed to have been initialized to the expected baud
rate.
A Break character has been received when;
• RCIF bit is set
• FERR bit is set
• RCREG = 00h
The second method uses the Auto-Wake-up feature
described in Section 12.3.2 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RX/DT, cause an
RCIF interrupt, and receive the next data byte followed
by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCTL register before placing the EUSART in
Sleep mode.
Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit Set by User Auto Cleared
Cleared due to User Read of RCREG
Sleep Command Executed
Note 1
Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is
still active. This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
Sleep Ends
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FIGURE 12-9: SEND BREAK CHARACTER SEQUENCE
Write to TXREG Dummy Write
BRG Output
(Shift Clock)
Start bit bit 0 bit 1 bit 11 Stop bit
Break
TXIF bit
(Transmit
Interrupt Flag)
TX (pin)
TRMT bit
(Transmit Shift
Empty Flag)
SENDB
(send Break
control bit)
SENDB Sampled Here Auto Cleared
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12.4 EUSART Synchronous Mode
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary
circuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the
internal clock generation circuitry.
There are two signal lines in Synchronous mode: a bidi-
rectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and trans-
mit shift registers. Since the data line is bidirectional,
synchronous operation is half-duplex only. Half-duplex
refers to the fact that master and slave devices can
receive and transmit data but not both simultaneously.
The EUSART can operate as either a master or slave
device.
Start and Stop bits are not used in synchronous
transmissions.
12.4.1 SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for Synchronous Master operation:
• SYNC = 1
• CSRC = 1
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures
the device for synchronous operation. Setting the CSRC
bit of the TXSTA register configures the device as a
master. Clearing the SREN and CREN bits of the RCSTA
register ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART. If the RX/DT or TX/CK pins are shared with an
analog peripheral the analog I/O functions must be
disabled by clearing the corresponding ANSEL bits.
12.4.1.1 Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device config-
ured as a master transmits the clock on the TX/CK line.
The TX/CK pin output driver is automatically enabled
when the EUSART is configured for synchronous
transmit or receive operation. Serial data bits change
on the leading edge to ensure they are valid at the trail-
ing edge of each clock. One clock cycle is generated
for each data bit. Only as many clock cycles are
generated as there are data bits.
12.4.1.2 Clock Polarity
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the SCKP
bit of the BAUDCTL register. Setting the SCKP bit sets
the clock Idle state as high. When the SCKP bit is set,
the data changes on the falling edge of each clock.
Clearing the SCKP bit sets the Idle state as low. When
the SCKP bit is cleared, the data changes on the rising
edge of each clock.
12.4.1.3 Synchronous Master Transmission
Data is transferred out of the device on the RX/DT pin.
The RX/DT and TX/CK pin output drivers are automat-
ically enabled when the EUSART is configured for
synchronous master transmit operation.
A transmission is initiated by writing a character to the
TXREG register. If the TSR still contains all or part of a
previous character the new character data is held in the
TXREG until the last bit of the previous character has
been transmitted. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately trans-
ferred to the TSR. The transmission of the character
commences immediately following the transfer of the
data to the TSR from the TXREG.
Each data bit changes on the leading edge of the
master clock and remains valid until the subsequent
leading clock edge.
12.4.1.4 Synchronous Master Transmission
Setup:
1. Initialize the SPBRGH, SPBRG register pair and
the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 12.3 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN, and CSRC.
3. Disable Receive mode by clearing bits SREN
and CREN.
4. Enable Transmit mode by setting the TXEN bit.
5. If 9-bit transmission is desired, set the TX9 bit.
6. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
7. If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
8. Start transmission by loading data to the TXREG
register.
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
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FIGURE 12-10: SYNCHRONOUS TRANSMISSION
FIGURE 12-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
TABLE 12-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL —SCKPBRG16—WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Master Transmission.
bit 0 bit 1 bit 7
Word 1
bit 2 bit 0 bit 1 bit 7
RX/DT
Write to
TXREG Reg
TXIF bit
(Interrupt Flag)
TXEN bit ‘1’ ‘1’
Word 2
TRMT bit
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words.
pin
TX/CK pin
TX/CK pin
(SCKP = 0)
(SCKP = 1)
RX/DT pin
TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
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12.4.1.5 Synchronous Master Reception
Data is received at the RX/DT pin. The RX/DT pin
output driver is automatically disabled when the
EUSART is configured for synchronous master receive
operation.
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTA register) or the Continuous Receive Enable bit
(CREN of the RCSTA register).
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the completion of one character. When CREN is set,
clocks are continuously generated until CREN is
cleared. If CREN is cleared in the middle of a character
the CK clock stops immediately and the partial charac-
ter is discarded. If SREN and CREN are both set, then
SREN is cleared at the completion of the first character
and CREN takes precedence.
To initiate reception, set either SREN or CREN. Data is
sampled at the RX/DT pin on the trailing edge of the
TX/CK clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
received into the RSR, the RCIF bit is set and the char-
acter is automatically transferred to the two character
receive FIFO. The Least Significant eight bits of the top
character in the receive FIFO are available in RCREG.
The RCIF bit remains set as long as there are un-read
characters in the receive FIFO.
12.4.1.6 Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a slave receives the clock on the TX/CK line. The TX/
CK pin output driver is automatically disabled when the
device is configured for synchronous slave transmit or
receive operation. Serial data bits change on the leading
edge to ensure they are valid at the trailing edge of each
clock. One data bit is transferred for each clock cycle.
Only as many clock cycles should be received as there
are data bits.
12.4.1.7 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before RCREG is read to access
the FIFO. When this happens the OERR bit of the
RCSTA register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be received until the error is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREG. If the overrun occurred when the CREN bit is
set then the error condition is cleared by either clearing
the CREN bit of the RCSTA register or by clearing the
SPEN bit which resets the EUSART.
12.4.1.8 Receiving 9-Bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9-bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth, and Most Significant, data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the 8 Least Significant bits from
the RCREG.
12.4.1.9 Synchronous Master Reception
Setup:
1. Initialize the SPBRGH, SPBRG register pair for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Ensure bits CREN and SREN are clear.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit reception is desired, set bit RX9.
6. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
7. Interrupt flag bit RCIF will be set when reception
of a character is complete. An interrupt will be
generated if the enable bit RCIE was set.
8. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
9. Read the 8-bit received data by reading the
RCREG register.
10. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
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FIGURE 12-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 12-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Master
Reception.
CREN bit
RX/DT
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RXREG
‘0’
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
‘0’
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
TX/CK pin
TX/CK pin
pin
(SCKP = 0)
(SCKP = 1)
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12.4.2 SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for Synchronous slave operation:
• SYNC = 1
• CSRC = 0
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures the
device for synchronous operation. Clearing the CSRC bit
of the TXSTA register configures the device as a slave.
Clearing the SREN and CREN bits of the RCSTA register
ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART. If the RX/DT or TX/CK pins are shared with an
analog peripheral the analog I/O functions must be
disabled by clearing the corresponding ANSEL bits.
12.4.2.1 EUSART Synchronous Slave
Transmit
The operation of the Synchronous Master and Slave
modes are identical (see Section 12.4.1.3
“Synchronous Master Transmission”), except in the
case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
1. The first character will immediately transfer to
the TSR register and transmit.
2. The second word will remain in TXREG register.
3. The TXIF bit will not be set.
4. After the first character has been shifted out of
TSR, the TXREG register will transfer the second
character to the TSR and the TXIF bit will now be
set.
5. If the PEIE and TXIE bits are set, the interrupt
will wake the device from Sleep and execute the
next instruction. If the GIE bit is also set, the
program will call the Interrupt Service Routine.
12.4.2.2 Synchronous Slave Transmission
Setup:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the CREN and SREN bits.
3. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit transmission is desired, set the TX9 bit.
5. Enable transmission by setting the TXEN bit.
6. If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
7. Start transmission by writing the Least
Significant 8 bits to the TXREG register.
TABLE 12-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
BAUDCTL ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Slave Transmis-
sion.
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12.4.2.3 EUSART Synchronous Slave
Reception
The operation of the Synchronous Master and Slave
modes is identical (Section 12.4.1.5 “Synchronous
Master Reception”), with the following exceptions:
• Sleep
• CREN bit is always set, therefore the receiver is
never Idle
• SREN bit, which is a “don't care” in Slave mode
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is received, the RSR register will transfer the data
to the RCREG register. If the RCIE enable bit is set, the
interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE bit is also
set, the program will branch to the interrupt vector.
12.4.2.4 Synchronous Slave Reception
Setup:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
3. If 9-bit reception is desired, set the RX9 bit.
4. Set the CREN bit to enable reception.
5. The RCIF bit will be set when reception is
complete. An interrupt will be generated if the
RCIE bit was set.
6. If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTA
register.
7. Retrieve the 8 Least Significant bits from the
receive FIFO by reading the RCREG register.
8. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
TABLE 12-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCTL ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 166
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
RCREG EUSART Receive Data Register 162
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 165
SPBRG BRG7 BRG6 BRG5 BRG4 BRG3 BRG2 BRG1 BRG0 167
SPBRGH BRG15 BRG14 BRG13 BRG12 BRG11 BRG10 BRG9 BRG8 167
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
TXREG EUSART Transmit Data Register 157
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 164
Legend: x = unknown, – = unimplemented read as ‘0’. Shaded cells are not used for Synchronous Slave
Reception.
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12.5 EUSART Operation During Sleep
The EUSART WILL remain active during Sleep only in
the Synchronous Slave mode. All other modes require
the system clock and therefore cannot generate the
necessary signals to run the Transmit or Receive Shift
registers during Sleep.
Synchronous Slave mode uses an externally generated
clock to run the Transmit and Receive Shift registers.
12.5.1 SYNCHRONOUS RECEIVE DURING
SLEEP
To receive during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Reception (see
Section 12.4.2.4 “Synchronous Slave
Reception Setup:”).
• If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
• The RCIF interrupt flag must be cleared by read-
ing RCREG to unload any pending characters in
the receive buffer.
Upon entering Sleep mode, the device will be ready to
accept data and clocks on the RX/DT and TX/CK pins,
respectively. When the data word has been completely
clocked in by the external device, the RCIF interrupt
flag bit of the PIR1 register will be set. Thereby, waking
the processor from Sleep.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the GIE global
interrupt enable bit of the INTCON register is also set,
then the Interrupt Service Routine at address 004h will
be called.
12.5.2 SYNCHRONOUS TRANSMIT
DURING SLEEP
To transmit during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Transmission
(see Section 12.4.2.2 “Synchronous Slave
Transmission Setup:”).
• The TXIF interrupt flag must be cleared by writing
the output data to the TXREG, thereby filling the
TSR and transmit buffer.
9. If interrupts are desired, set the TXIE bit of the
PIE1 register and the PEIE bit of the INTCON
register.
• Interrupt enable bits TXIE of the PIE1 register and
PEIE of the INTCON register must set.
Upon entering Sleep mode, the device will be ready to
accept clocks on TX/CK pin and transmit data on the
RX/DT pin. When the data word in the TSR has been
completely clocked out by the external device, the
pending byte in the TXREG will transfer to the TSR and
the TXIF flag will be set. Thereby, waking the processor
from Sleep. At this point, the TXREG is available to
accept another character for transmission, which will
clear the TXIF flag.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the GIE global
interrupt enable bit is also set then the Interrupt Service
Routine at address 0004h will be called.
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NOTES:
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13.0 MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
13.1 Master SSP (MSSP) Module
Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be Serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSP module
can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated CircuitTM (I2CTM)
- Full Master mode
- Slave mode (with general address call).
The I2C interface supports the following modes in
hardware:
•Master mode
• Multi-Master mode
• Slave mode.
13.2 Control Registers
The MSSP module has three associated registers.
These include a STATUS register and two control
registers.
Register 13-1 shows the MSSP STATUS register
(SSPSTAT), Register 13-2 shows the MSSP Control
Register 1 (SSPCON), and Register 13-3 shows the
MSSP Control Register 2 (SSPCON2).
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REGISTER 13-1: SSPSTAT: SSP STATUS REGISTER
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A PSR/WUA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 SMP: Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
In I2 C Master or Slave mode:
1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high speed mode (400 kHz)
bit 6 CKE: SPI Clock Edge Select bit
CKP = 0:
1 = Data transmitted on falling edge of SCK
0 = Data transmitted on rising edge of SCK
CKP = 1:
1 = Data transmitted on rising edge of SCK
0 = Data transmitted on falling edge of SCK
bit 5 D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4 P: Stop bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3 S: Start bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2 R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to
the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN, or ACKEN will indicate if the MSSP is in Idle mode.
bit 1 UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2 C mode only):
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
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REGISTER 13-2: SSPCON: SSP CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software)
0 = No collision
bit 6 SSPOV: Receive Overflow Indicator bit
In SPI mode:
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR
is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting
data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is
initiated by writing to the SSPBUF register (must be cleared in software).
0 = No overflow
In I2 C mode:
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit
mode (must be cleared in software).
0 = No overflow
bit 5 SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
In SPI mode:
1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins
0 = Disables serial port and configures these pins as I/O port pins
In I2 C mode:
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: Clock Polarity Select bit
In SPI mode:
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2 C Slave mode:
SCK release control
1 = Release clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2 C Master mode:
Unused in this mode
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
0000 = SPI Master mode, clock = FOSC/4
0001 = SPI Master mode, clock = FOSC/16
0010 = SPI Master mode, clock = FOSC/64
0011 = SPI Master mode, clock = TMR2 output/2
0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled
0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin
0110 = I2C Slave mode, 7-bit address
0111 = I2C Slave mode, 10-bit address
1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))
1001 = Load Mask function
1010 = Reserved
1011 = I2C firmware controlled Master mode (Slave idle)
1100 = Reserved
1101 = Reserved
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
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REGISTER 13-3: SSPCON2: SSP CONTROL REGISTER 2
R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0000h) is received in the SSPSR
0 = General call address disabled
bit 6 ACKSTAT: Acknowledge Status bit (in I2C Master mode only)
In Master Transmit mode:
1 = Acknowledge was not received from slave
0 = Acknowledge was received from slave
bit 5 ACKDT: Acknowledge Data bit (in I2C Master mode only)
In Master Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0 = Acknowledge sequence idle
bit 3 RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only)
SCK Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1 RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0 SEN: Start Condition Enabled bit (in I2C Master mode only)
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
In Slave mode:
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
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13.3 SPI Mode
The SPI mode allows 8 bits of data to be synchronously
transmitted and received, simultaneously. All four modes
of SPI are supported. To accomplish communication,
typically three pins are used:
• Serial Data Out (SDO) – RC5/SDO
• Serial Data In (SDI) – RC4/SDI/SDA
• Serial Clock (SCK) – RC3/SCK/SCL
Additionally, a fourth pin may be used when in any
Slave mode of operation:
• Slave Select (SS) – RA5/SS/AN4
13.3.1 OPERATION
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits SSPCON<5:0> and SSPSTAT<7:6>.
These control bits allow the following to be specified:
• Master mode (SCK is the clock output)
• Slave mode (SCK is the clock input)
• Clock polarity (Idle state of SCK)
• Data input sample phase (middle or end of data
output time)
• Clock edge (output data on rising/falling edge of
SCK)
• Clock rate (Master mode only)
• Slave Select mode (Slave mode only)
Figure 13-1 shows the block diagram of the MSSP
module, when in SPI mode.
FIGURE 13-1: MSSP BLOCK DIAGRAM
(SPI MODE)
The MSSP consists of a transmit/receive shift register
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR,
until the received data is ready. Once the 8 bits of data
have been received, that byte is moved to the SSPBUF
register. Then, the buffer full-detect bit BF of the SSP-
STAT register and the interrupt flag bit SSPIF of the
PIR1 register are set. This double buffering of the
received data (SSPBUF) allows the next byte to start
reception before reading the data that was just
received. Any write to the SSPBUF register during
transmission/reception of data will be ignored, and the
write collision detect bit WCOL of the SSPCON register
will be set. User software must clear the WCOL bit so
that it can be determined if the following write(s) to the
SSPBUF register completed successfully.
( )
Read Write
Internal
Data Bus
SSPSR Reg
SSPM<3:0>
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
TOSC
Prescaler
4, 16, 64
2
Edge
Select
2
4
Data to TX/RX in SSPSR
TRIS bit
2
SMP:CKE
SDI
SDO
SS
SCK
Note: I/O pins have diode protection to VDD and VSS.
SSPBUF Reg
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When the application software is expecting to receive
valid data, the SSPBUF should be read before the next
byte of data to transfer is written to the SSPBUF. The
buffer full bit BF of the SSPSTAT register indicates
when SSPBUF has been loaded with the received data
(transmission is complete). When the SSPBUF is read,
the BF bit is cleared. This data may be irrelevant if the
SPI is only a transmitter. Generally, the MSSP Interrupt
is used to determine when the transmission/reception
has completed. The SSPBUF must be read and/or
written. If the interrupt method is not going to be used,
then software polling can be done to ensure that a write
collision does not occur. Example 13-1 shows the
loading of the SSPBUF (SSPSR) for data transmission.
The SSPSR is not directly readable or writable, and
can only be accessed by addressing the SSPBUF
register. Additionally, the MSSP STATUS register
(SSPSTAT register) indicates the various status
conditions.
13.3.2 ENABLING SPI I/O
To enable the serial port, SSP Enable bit SSPEN of the
SSPCON register must be set. To reset or reconfigure
SPI mode, clear the SSPEN bit, re-initialize the
SSPCON registers, and then set the SSPEN bit. This
configures the SDI, SDO, SCK and SS pins as serial
port pins. For the pins to behave as the serial port
function, some must have their data direction bits (in
the TRIS register) appropriately programmed. That is:
• SDI is automatically controlled by the SPI module
• SDO must have TRISC<5> bit cleared
• SCK (Master mode) must have TRISC<3> bit
cleared
• SCK (Slave mode) must have TRISC<3> bit set
•SS
must have TRISA<5> bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
EXAMPLE 13-1: LOADING THE SSPBUF (SSPSR) REGISTER
LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)?
GOTO LOOP ;No
MOVF SSPBUF, W ;WREG reg = contents of SSPBUF
MOVWF RXDATA ;Save in user RAM, if data is meaningful
MOVF TXDATA, W ;W reg = contents of TXDATA
MOVWF SSPBUF ;New data to xmit
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13.3.3 MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK. The master determines
when the slave is to broadcast data by the software
protocol.
In Master mode, the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SDO output could be dis-
abled (programmed as an input). The SSPSR register
will continue to shift in the signal present on the SDI pin
at the programmed clock rate. As each byte is
received, it will be loaded into the SSPBUF register as
a normal received byte (interrupts and Status bits
appropriately set). This could be useful in receiver
applications as a “Line Activity Monitor” mode.
The clock polarity is selected by appropriately program-
ming the CKP bit of the SSPCON register. This, then,
would give waveforms for SPI communication as
shown in Figure 13-2, Figure 13-4 and Figure 13-5,
where the MSb is transmitted first. In Master mode, the
SPI clock rate (bit rate) is user programmable to be one
of the following:
•F
OSC/4 (or TCY)
•FOSC/16 (or 4 • TCY)
•F
OSC/64 (or 16 • TCY)
• Timer2 output/2
This allows a maximum data rate (at 40 MHz) of
10.00 Mbps.
Figure 13-2 shows the waveforms for Master mode.
When the CKE bit of the SSPSTAT register is set, the
SDO data is valid before there is a clock edge on SCK.
The change of the input sample is shown based on the
state of the SMP bit of the SSPSTAT register. The time
when the SSPBUF is loaded with the received data is
shown.
FIGURE 13-2: SPI MODE WAVEFORM (MASTER MODE)
SCK
(CKP = 0
SCK
(CKP = 1
SCK
(CKP = 0
SCK
(CKP = 1
4 Clock
Modes
Input
Sample
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
bit7 bit 0
SDI
SSPIF
(SMP = 1)
(SMP = 0)
(SMP = 1)
CKE = 1)
CKE = 0)
CKE = 1)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
(CKE = 0)
(CKE = 1)
Next Q4 Cycle
after Q2
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13.3.4 SLAVE MODE
In Slave mode, the data is transmitted and received as
the external clock pulses appear on SCK. When the
last bit is latched, the SSPIF interrupt flag bit of the
PIR1 register is set.
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times, as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. When a byte is received, the device will wake-up
from Sleep.
13.3.5 SLAVE SELECT
SYNCHRONIZATION
The SS pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SS pin control
enabled (SSPCON<3:0> = 04h). The pin must not
be driven low for the SS pin to function as an input.
The Data Latch must be high. When the SS pin is
low, transmission and reception are enabled and
the SDO pin is driven. When the SS pin goes high,
the SDO pin is no longer driven, even if in the mid-
dle of a transmitted byte, and becomes a floating
output. External pull-up/pull-down resistors may be
desirable, depending on the application.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SS pin to
a high level, or clearing the SSPEN bit.
To emulate two-wire communication, the SDO pin can
be connected to the SDI pin. When the SPI needs to
operate as a receiver, the SDO pin can be configured
as an input. This disables transmissions from the SDO.
The SDI can always be left as an input (SDI function),
since it cannot create a bus conflict.
FIGURE 13-3: SLAVE SYNCHRONIZATION WAVEFORM
Note 1: When the SPI is in Slave mode with SS
pin control enabled (SSPCON<3:0> =
0100), the SPI module will reset if the SS
pin is set to VDD.
2: If the SPI is used in Slave mode with CKE
set (SSPSTAT register), then the SS pin
control must be enabled.
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 7
SSPIF
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
bit 0
bit 7
bit 0
Next Q4 Cycle
after Q2
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FIGURE 13-4: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
FIGURE 13-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
(SMP = 0)
CKE = 0)
CKE = 0)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Optional
Next Q4 Cycle
after Q2
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSPIF
(SMP = 0)
CKE = 1)
CKE = 1)
(SMP = 0)
Write to
SSPBUF
SSPSR to
SSPBUF
SS
Required
Next Q4 Cycle
after Q2
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13.3.6 SLEEP OPERATION
In Master mode, all module clocks are halted, and the
transmission/reception will remain in that state until the
device wakes from Sleep. After the device returns to
normal mode, the module will continue to transmit/
receive data.
In Slave mode, the SPI transmit/receive shift register
operates asynchronously to the device. This allows the
device to be placed in Sleep mode and data to be
shifted into the SPI transmit/receive shift register.
When all eight bits have been received, the MSSP
interrupt flag bit will be set and, if enabled, will wake the
device from Sleep.
13.3.7 EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
13.3.8 BUS MODE COMPATIBILITY
Table 13-1 shows the compatibility between the
standard SPI modes and the states of the CKP and
CKE control bits.
TABLE 13-1: SPI BUS MODES
There is also a SMP bit that controls when the data will
be sampled.
TABLE 13-2: REGISTERS ASSOCIATED WITH SPI OPERATION
Standard SPI Mode
Terminology
Control Bits State
CKP CKE
0, 001
0, 100
1, 011
1, 110
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
INTCON GIE/GIEH PEIE/GIEL T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 —ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIR1 —ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register 187
SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 185
SSPSTAT SMP CKE D/A P S R/W UA BF 184
TRISA TRISA7 TRISA6 TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 41
TRISC TRISC7 TRISC6 TRISC5 TRISC4 TRISC3 TRISC2 TRISC1 TRISC0 55
Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP in
SPI mode.
Note 1: Bit 6 of PORTA, LATA and TRISA are enabled in ECIO and RCIO Oscillator modes only. In all other
oscillator modes, they are disabled and read ‘0’.
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13.4 MSSP I2C Operation
The MSSP module in I2C mode, fully implements all
master and slave functions (including general call
support) and provides interrupts on Start and Stop bits in
hardware, to determine a free bus (Multi-Master mode).
The MSSP module implements the standard mode
specifications, as well as 7-bit and 10-bit addressing.
Two pins are used for data transfer. These are the
RC3/SCK/SCL pin, which is the clock (SCL), and the
RC4/SDI/SDA pin, which is the data (SDA). The user
must configure these pins as inputs or outputs through
the TRISC<4:3> bits.
The MSSP module functions are enabled by setting
MSSP Enable bit SSPEN of the SSPCON register.
FIGURE 13-6: MSSP BLOCK DIAGRAM
(I2C MODE)
The MSSP module has these six registers for I2C
operation:
• MSSP Control Register 1 (SSPCON)
• MSSP Control Register 2 (SSPCON2)
• MSSP STATUS register (SSPSTAT)
• Serial Receive/Transmit Buffer (SSPBUF)
• MSSP Shift Register (SSPSR) – Not directly
accessible
• MSSP Address register (SSPADD)
• MSSP Mask register (SSPMSK)
The SSPCON register allows control of the I2C
operation. The SSPM<3:0> mode selection bits
(SSPCON register) allow one of the following I2C modes
to be selected:
•I
2C Master mode, clock = OSC/4 (SSPADD +1)
•I
2C Slave mode (7-bit address)
•I
2C Slave mode (10-bit address)
•I
2C Slave mode (7-bit address), with Start and
Stop bit interrupts enabled
•I
2C Slave mode (10-bit address), with Start and
Stop bit interrupts enabled
•I
2C firmware controlled master operation, slave is
idle
Selection of any I2C mode with the SSPEN bit set,
forces the SCL and SDA pins to be open drain,
provided these pins are programmed to be inputs by
setting the appropriate TRISC bits.
13.4.1 SLAVE MODE
In Slave mode, the SCL and SDA pins must be
configured as inputs (TRISC<4:3> set). The MSSP
module will override the input state with the output data
when required (slave-transmitter).
When an address is matched, or the data transfer after
an address match is received, the hardware
automatically will generate the Acknowledge (ACK)
pulse and load the SSPBUF register with the received
value currently in the SSPSR register.
If either or both of the following conditions are true, the
MSSP module will not give this ACK pulse:
a) The buffer full bit BF (SSPCON register) was set
before the transfer was received.
b) The overflow bit SSPOV (SSPCON register)
was set before the transfer was received.
In this event, the SSPSR register value is not loaded
into the SSPBUF, but bit SSPIF of the PIR1 register is
set. The BF bit is cleared by reading the SSPBUF
register, while bit SSPOV is cleared through software.
The SCL clock input must have a minimum high and
low for proper operation. The high and low times of the
I2C specification, as well as the requirement of the
MSSP module, are shown in timing parameter #100
and parameter #101.
Read Write
SSPSR Reg
Match Detect
SSPADD Reg
Start and
Stop bit Detect
SSPBUF Reg
Internal
Data Bus
Addr Match
Set, Reset
S, P bits
(SSPSTAT Reg)
RC3/SCK/SCL
RC4/
Shift
Clock
MSb
SDI/
LSb
SDA
Note: I/O pins have diode protection to VDD and VSS.
SSPMSK Reg
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13.4.1.1 Addressing
Once the MSSP module has been enabled, it waits for
a Start condition to occur. Following the Start condition,
the eight bits are shifted into the SSPSR register. All
incoming bits are sampled with the rising edge of the
clock (SCL) line. The value of register SSPSR<7:1> is
compared to the value of the SSPADD register. The
address is compared on the falling edge of the eighth
clock (SCL) pulse. If the addresses match, and the BF
and SSPOV bits are clear, the following events occur:
a) The SSPSR register value is loaded into the
SSPBUF register.
b) The buffer full bit BF is set.
c) An ACK pulse is generated.
d) MSSP interrupt flag bit, SSPIF of the PIR1
register, is set on the falling edge of the ninth
SCL pulse (interrupt is generated, if enabled).
In 10-bit address mode, two address bytes need to be
received by the slave. The five Most Significant bits
(MSb) of the first address byte specify if this is a 10-bit
address. The R/W bit (SSPSTAT register) must specify
a write so the slave device will receive the second
address byte. For a 10-bit address, the first byte would
equal ‘1111 0 A9 A8 0’, where A9 and A8 are the
two MSb’s of the address.
The sequence of events for 10-bit addressing is as
follows, with steps 7-9 for slave-transmitter:
1. Receive first (high) byte of address (bit SSPIF of
the PIR1 register and bits BF and UA of the
SSPSTAT register are set).
2. Update the SSPADD register with second (low)
byte of address (clears bit UA and releases the
SCL line).
3. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
4. Receive second (low) byte of address (bits
SSPIF, BF, and UA are set).
5. Update the SSPADD register with the first (high)
byte of address. If match releases SCL line, this
will clear bit UA.
6. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
7. Receive Repeated Start condition.
8. Receive first (high) byte of address (bits SSPIF
and BF are set).
9. Read the SSPBUF register (clears bit BF) and
clear flag bit SSPIF.
13.4.1.2 Reception
When the R/W bit of the address byte is clear and an
address match occurs, the R/W bit of the SSPSTAT
register is cleared. The received address is loaded into
the SSPBUF register.
When the address byte overflow condition exists, then
no Acknowledge (ACK) pulse is given. An overflow
condition is defined as either bit BF (SSPSTAT register)
is set, or bit SSPOV (SSPCON register) is set.
An MSSP interrupt is generated for each data transfer
byte. Flag bit SSPIF of the PIR1 register must be
cleared in software. The SSPSTAT register is used to
determine the status of the byte.
13.4.1.3 Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register. The ACK pulse will
be sent on the ninth bit and pin RC3/SCK/SCL is held
low. The transmit data must be loaded into the
SSPBUF register, which also loads the SSPSR regis-
ter. Then pin RC3/SCK/SCL should be enabled by set-
ting bit CKP (SSPCON register). The master must
monitor the SCL pin prior to asserting another clock
pulse. The slave devices may be holding off the master
by stretching the clock. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time
(Figure 13-8).
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared in software and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the ninth clock pulse.
As a slave-transmitter, the ACK pulse from the master-
receiver is latched on the rising edge of the ninth SCL
input pulse. If the SDA line is high (not ACK), then the
data transfer is complete. When the ACK is latched by
the slave, the slave logic is reset and the slave moni-
tors for another occurrence of the Start bit. If the SDA
line was low (ACK), the transmit data must be loaded
into the SSPBUF register, which also loads the SSPSR
register. Pin RC3/SCK/SCL should be enabled by
setting bit CKP.
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FIGURE 13-7: I2C™ SLAVE MODE WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)
FIGURE 13-8: I2C™ SLAVE MODE WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)
P
9
8
765
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1SDA
SCL 123456 7891234567891234
Bus Master
Termina tes
Transfer
Bit SSPOV is set because the SSPBUF register is still full
Cleared in software
SSPBUF register is read
ACK Receiving Data
Receiving Data
D0
D1
D2
D3D4
D5
D6D7
ACK
R/W = 0
Receiving Address
SSPIF
BF
SSPOV
Not ACK
ACK is not sent
SDA
SCL
SSPIF
BF
CKP
A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0
Not ACKTransmitting DataR/W = 1Receiving Address
123456789 123456789 P
Cleared in software
SSPBUF is written in software
From SSP Interrupt
Service Routine
Set bit after writing to SSPBUF
SData in
Sampled
(the SSPBUF must be written to
before the CKP bit can be set)
R/W = 0
responds to SSPIF
SCL held low
while CPU
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13.4.2 GENERAL CALL ADDRESS
SUPPORT
The addressing procedure for the I2C bus is such that,
the first byte after the Start condition usually deter-
mines which device will be the slave addressed by the
master. The exception is the general call address,
which can address all devices. When this address is
used, all devices should, in theory, respond with an
Acknowledge.
The general call address is one of eight addresses
reserved for specific purposes by the I2C protocol. It
consists of all 0’s with R/W = 0.
The general call address is recognized (enabled) when
the General Call Enable (GCEN) bit is set (SSPCON2
register). Following a Start bit detect, eight bits are
shifted into the SSPSR and the address is compared
against the SSPADD. It is also compared to the general
call address and fixed in hardware.
If the general call address matches, the SSPSR is
transferred to the SSPBUF, the BF bit is set (eighth bit),
and on the falling edge of the ninth bit (ACK bit), the
SSPIF interrupt flag bit is set.
When the interrupt is serviced, the source for the inter-
rupt can be checked by reading the contents of the
SSPBUF. The value can be used to determine if the
address was device specific or a general call address.
In 10-bit mode, the SSPADD is required to be updated
for the second half of the address to match, and the UA
bit is set (SSPSTAT register). If the general call address
is sampled when the GCEN bit is set, and while the
slave is configured in 10-bit address mode, then the
second half of the address is not necessary. The UA bit
will not be set, and the slave will begin receiving data
after the Acknowledge (Figure 13-9).
FIGURE 13-9: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESS)
SDA
SCL
S
SSPIF
BF
SSPOV
Cleared in software
SSPBUF is read
R/W = 0
ACK
General Call Address
Address is compared to General Call Address
GCEN
Receiving Data ACK
123456789123456789
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
‘0’
‘1’
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13.4.3 MASTER MODE
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset, or when the MSSP module is disabled.
Control of the I2C bus may be taken when the P bit is
set, or the bus is idle, with both the S and P bits clear.
In Master mode, the SCL and SDA lines are manipu-
lated by the MSSP hardware.
The following events will cause SSP Interrupt Flag bit,
SSPIF, to be set (SSP Interrupt if enabled):
• Start condition
• Stop condition
• Data transfer byte transmitted/received
• Acknowledge transmit
• Repeated Start condition
13.4.4 I2C™ MASTER MODE SUPPORT
Master mode is enabled by setting and clearing the
appropriate SSPM bits in SSPCON and by setting the
SSPEN bit. Once Master mode is enabled, the user
has the following six options:
1. Assert a Start condition on SDA and SCL.
2. Assert a Repeated Start condition on SDA and
SCL.
3. Write to the SSPBUF register initiating
transmission of data/address.
4. Generate a Stop condition on SDA and SCL.
5. Configure the I2C port to receive data.
6. Generate an Acknowledge condition at the end
of a received byte of data.
FIGURE 13-10: MSSP BLOCK DIAGRAM (I2C™ MASTER MODE)
Note: The MSSP module, when configured in I2C
Master mode, does not allow queueing of
events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
imitate transmission, before the Start
condition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a write
to the SSPBUF did not occur.
Read Write
SSPSR
Start bit, Stop bit,
SSPBUF
Internal
Data Bus
Set/Reset, S, P, WCOL (SSPSTAT)
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate
SCL
SCL In
Bus Collision
SDA In
Receive Enable
Clock Cntl
Clock Arbitrate/WCOL Detect
(hold off clock source)
SSPADD<6:0>
Baud
Set SSPIF, BCLIF
Reset ACKSTAT, PEN (SSPCON2)
Rate
Generator
SSPM<3:0>
Note: I/O pins have diode protection to VDD and VSS.
Start bit Detect
Stop bit Detect
Write Collision Detect
Clock Arbitration
State Counter for
End of XMIT/RCV
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13.4.4.1 I2C™ Master Mode Operation
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted eight bits at a time. After each byte is trans-
mitted, an Acknowledge bit is received. Start and Stop
conditions are output to indicate the beginning and the
end of a serial transfer.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate receive bit. Serial
data is received via SDA, while SCL outputs the serial
clock. Serial data is received eight bits at a time. After
each byte is received, an Acknowledge bit is transmit-
ted. Start and Stop conditions indicate the beginning
and end of transmission.
The Baud Rate Generator used for the SPI mode oper-
ation is now used to set the SCL clock frequency for
either 100 kHz, 400 kHz, or 1 MHz I2C operation. The
Baud Rate Generator reload value is contained in the
lower 7 bits of the SSPADD register. The Baud Rate
Generator will automatically begin counting on a write
to the SSPBUF. Once the given operation is complete
(i.e., transmission of the last data bit is followed by
ACK), the internal clock will automatically stop counting
and the SCL pin will remain in its last state.
A typical transmit sequence would go as follows:
a) The user generates a Start condition by setting
the Start Enable (SEN) bit (SSPCON2 register).
b) SSPIF is set. The MSSP module will wait the
required start time before any other operation
takes place.
c) The user loads the SSPBUF with the address to
transmit.
d) Address is shifted out the SDA pin until all eight
bits are transmitted.
e) The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit (SSPCON2 register).
f) The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
g) The user loads the SSPBUF with eight bits of
data.
h) Data is shifted out the SDA pin until all eight bits
are transmitted.
i) The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit (SSPCON2 register).
j) The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
k) The user generates a Stop condition by setting
the Stop Enable bit PEN (SSPCON2 register).
l) Interrupt is generated once the Stop condition is
complete.
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13.4.5 BAUD RATE GENERATOR
In I2C Master mode, the reload value for the BRG is
located in the lower 7 bits of the SSPADD register
(Figure 13-11). When the BRG is loaded with this
value, the BRG counts down to 0 and stops until
another reload has taken place. The BRG count is
decremented twice per instruction cycle (T
CY) on the
Q2 and Q4 clocks. In I2C Master mode, the BRG is
reloaded automatically. If clock arbitration is taking
place, for instance, the BRG will be reloaded when the
SCL pin is sampled high (Figure 13-12).
FIGURE 13-11: BAUD RATE GENERATOR BLOCK DIAGRAM
FIGURE 13-12: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SSPM<3:0>
BRG Down Counter
CLKOUT FOSC/4
SSPADD<6:0>
SSPM<3:0>
SCL
Reload
Control
Reload
SDA
SCL
SCL de-asserted but slave holds
DX-1DX
BRG
SCL is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration)
SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
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13.4.6 I2C™ MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start Con-
dition Enable bit SEN of the SSPCON2 register. If the
SDA and SCL pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPADD<6:0> and starts its count. If SCL and SDA are
both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
of the SDA being driven low, while SCL is high, is the
Start condition, and causes the S bit of the SSPSTAT
register to be set. Following this, the Baud Rate Gener-
ator is reloaded with the contents of SSPADD<6:0>
and resumes its count. When the Baud Rate Generator
times out (TBRG), the SEN bit of the SSPCON2 register
will be automatically cleared by hardware, the Baud
Rate Generator is suspended leaving the SDA line held
low and the Start condition is complete.
13.4.6.1 WCOL Status Flag
If the user writes the SSPBUF when a Start sequence
is in progress, the WCOL is set and the contents of the
buffer are unchanged (the write doesn’t occur).
FIGURE 13-13: FIRST START BIT TIMING
Note: If, at the beginning of the Start condition,
the SDA and SCL pins are already sam-
pled low, or if during the Start condition the
SCL line is sampled low before the SDA
line is driven low, a bus collision occurs,
the Bus Collision Interrupt Flag, BCLIF, is
set, the Start condition is aborted, and the
I2C module is reset into its Idle state.
Note: Because queueing of events is not
allowed, writing to the lower 5 bits of
SSPCON2 is disabled until the Start
condition is complete.
SDA
SCL
S
TBRG
1st Bit 2nd Bit
TBRG
SDA = 1, At completion of Start bit,
SCL = 1
Write to SSPBUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSPSTAT)
and sets SSPIF bit
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13.4.7 I2C™ MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition occurs when the RSEN bit
(SSPCON2 register) is programmed high and the I2C
logic module is in the Idle state. When the RSEN bit is
set, the SCL pin is asserted low. When the SCL pin is
sampled low, the Baud Rate Generator is loaded with
the contents of SSPADD<5:0> and begins counting.
The SDA pin is released (brought high) for one Baud
Rate Generator count (TBRG). When the Baud Rate
Generator times out, if SDA is sampled high, the SCL
pin will be de-asserted (brought high). When SCL is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD<6:0> and begins count-
ing. SDA and SCL must be sampled high for one TBRG.
This action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG, while SCL is high. Following
this, the RSEN bit (SSPCON2 register) will be automat-
ically cleared and the Baud Rate Generator will not be
reloaded, leaving the SDA pin held low. As soon as a
Start condition is detected on the SDA and SCL pins,
the S bit (SSPSTAT register) will be set. The SSPIF bit
will not be set until the Baud Rate Generator has timed
out.
Immediately following the SSPIF bit getting set, the
user may write the SSPBUF with the 7-bit address in
7-bit mode, or the default first address in 10-bit mode.
After the first eight bits are transmitted and an ACK is
received, the user may then transmit an additional eight
bits of address (10-bit mode), or eight bits of data (7-bit
mode).
13.4.7.1 WCOL Status Flag
If the user writes the SSPBUF when a Repeated Start
sequence is in progress, the WCOL is set and the con-
tents of the buffer are unchanged (the write doesn’t
occur).
FIGURE 13-14: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
• SDA is sampled low when SCL goes
from low-to-high.
• SCL goes low before SDA is
asserted low. This may indicate that
another master is attempting to
transmit a data “1”.
Note: Because queueing of events is not
allowed, writing of the lower 5 bits of
SSPCON2 is disabled until the Repeated
Start condition is complete.
SDA
SCL
Sr = Repeated Start
Write to SSPCON2
Write to SSPBUF occurs here
Falling edge of ninth clock
End of Xmit
At completion of Start bit,
hardware clear RSEN bit
1st bit
Set S (SSPSTAT<3>)
TBRG
TBRG
SDA = 1,
SDA = 1,
SCL (no change)
SCL = 1
occurs here,
TBRG TBRG TBRG
and set SSPIF
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13.4.8 I2C™ MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address, or the
other half of a 10-bit address, is accomplished by sim-
ply writing a value to the SSPBUF register. This action
will set the Buffer Full bit, BF, and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDA pin after the falling edge of SCL is
asserted (see data hold time specification, parameter
106). SCL is held low for one Baud Rate Generator roll-
over count (TBRG). Data should be valid before SCL is
released high (see data setup time specification,
parameter 107). When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF bit is cleared and the master releases SDA,
allowing the slave device being addressed to respond
with an ACK bit during the ninth bit time, if an address
match occurs, or if data was received properly. The
status of ACK is written into the ACKDT bit on the fall-
ing edge of the ninth clock. If the master receives an
Acknowledge, the Acknowledge Status bit, ACKSTAT,
is cleared. If not, the bit is set. After the ninth clock, the
SSPIF bit is set and the master clock (Baud Rate Gen-
erator) is suspended until the next data byte is loaded
into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 13-15).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL, until all
seven address bits and the R/W bit, are completed. On
the falling edge of the eighth clock, the master will de-
assert the SDA pin, allowing the slave to respond with
an Acknowledge. On the falling edge of the ninth clock,
the master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT Status bit (SSPCON2 regis-
ter). Following the falling edge of the ninth clock trans-
mission of the address, the SSPIF is set, the BF bit is
cleared and the Baud Rate Generator is turned off, until
another write to the SSPBUF takes place, holding SCL
low and allowing SDA to float.
13.4.8.1 BF Status Flag
In Transmit mode, the BF bit (SSPSTAT register) is set
when the CPU writes to SSPBUF, and is cleared when
all eight bits are shifted out.
13.4.8.2 WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the buf-
fer are unchanged (the write doesn’t occur). WCOL
must be cleared in software.
13.4.8.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2
register) is cleared when the slave has sent an
Acknowledge (ACK = 0), and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call), or when the slave has
properly received its data.
13.4.9 I2C™ MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (SSPCON2 register).
The Baud Rate Generator begins counting, and on
each rollover, the state of the SCL pin changes (high-
to-low/low-to-high) and data is shifted into the SSPSR.
After the falling edge of the eighth clock, the RCEN bit
is automatically cleared, the contents of the SSPSR are
loaded into the SSPBUF, the BF bit is set, the SSPIF
flag bit is set and the Baud Rate Generator is sus-
pended from counting, holding SCL low. The MSSP is
now in Idle state, awaiting the next command. When
the buffer is read by the CPU, the BF bit is automati-
cally cleared. The user can then send an Acknowledge
bit at the end of reception, by setting the Acknowledge
Sequence Enable bit ACKEN (SSPCON2 register).
13.4.9.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
13.4.9.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when eight
bits are received into the SSPSR and the BF bit is
already set from a previous reception.
13.4.9.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write doesn’t occur).
Note: The MSSP module must be in an Idle state
before the RCEN bit is set, or the RCEN bit
will be disregarded.
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FIGURE 13-15: I2C™ MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
SDA
SCL
SSPIF
BF
SEN
A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting Data or Second Half
R/W = 0Transmit Address to Slave
123456789 123456789 P
Cleared in software service routine
SSPBUF is written in software
From SSP interrupt
After Start condition, SEN cleared by hardware.
S
SSPBUF written with 7-bit address and R/W
start transmit
SCL held low
while CPU
responds to SSPIF
SEN = 0
of 10-bit Address
Write SSPCON2<0> SEN = 1
Start condition begins From slave, clear ACKSTAT bit SSPCON2<6>
ACKSTAT in
SSPCON2 = 1
Cleared in software
SSPBUF written
PEN
Cleared in software
R/W
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FIGURE 13-16: I2C™ MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
87
6
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1
SDA
SCL 12345678912345678 9 1234
Bus Master
terminates
transfer
ACK
Receiving Data from Slave
Receiving Data from Slave
D0
D1
D2
D3D4
D5
D6D7
ACK
R/W = 1
Transmit Address to Slave
SSPIF
BF
ACK is not sent
Write to SSPCON2<0> (SEN = 1)
Write to SSPBUF occurs here
ACK from Slave
Master configured as a receiver
by programming SSPCON2<3>, (RCEN = 1)PEN bit = 1
written here
Data shifted in on falling edge of CLK
Cleared in software
Start XMIT
SEN = 0
SSPOV
SDA = 0, SCL = 1
while CPU
ACK
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
Cleared in software
Cleared in software
Set SSPIF interrupt
at end of receive
Set P bit
(SSPSTAT<4>)
and SSPIF
Cleared in
software
ACK from Master
Set SSPIF at end
Set SSPIF interrupt
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of Acknow-
ledge sequence
of receive
Set ACKEN start Acknowledge sequence
SSPOV is set because
SSPBUF is still full
SDA = ACKDT = 1
RCEN cleared
automatically
RCEN = 1 start
next receive
Write to SSPCON2<4>
to start Acknowledge sequence
SDA = ACKDT (SSPCON2<5>) = 0
RCEN cleared
automatically
responds to SSPIF
ACKEN
Begin Start Condition
Cleared in software
SDA = ACKDT = 0
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PIC16F882/883/884/886/887
13.4.10 ACKNOWLEDGE SEQUENCE TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN (SSPCON2
register). When this bit is set, the SCL pin is pulled low
and the contents of the Acknowledge Data bit (ACKDT)
is presented on the SDA pin. If the user wishes to gener-
ate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generator then counts for one rollover period (TBRG) and
the SCL pin is de-asserted (pulled high). When the SCL
pin is sampled high (clock arbitration), the Baud Rate
Generator counts for TBRG. The SCL pin is then pulled
low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP module then goes into Idle mode (Figure 13-17).
13.4.10.1 WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
13.4.11 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN (SSPCON2 register). At the end of a receive/
transmit, the SCL line is held low after the falling edge
of the ninth clock. When the PEN bit is set, the master
will assert the SDA line low. When the SDA line is sam-
pled low, the Baud Rate Generator is reloaded and
counts down to 0. When the Baud Rate Generator
times out, the SCL pin will be brought high, and one
TBRG (Baud Rate Generator rollover count) later, the
SDA pin will be de-asserted. When the SDA pin is sam-
pled high while SCL is high, the P bit (SSPSTAT regis-
ter) is set. A TBRG later, the PEN bit is cleared and the
SSPIF bit is set (Figure 13-18).
13.4.11.1 WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write doesn’t
occur).
FIGURE 13-17: ACKNOWLEDGE SEQUENCE WAVEFORM
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
Set SSPIF at the end
Acknowledge sequence starts here,
Write to SSPCON2 ACKEN automatically cleared
Cleared in
TBRG TBRG
of receive
ACK
8
ACKEN = 1, ACKDT = 0
D0
9
SSPIF
software
Set SSPIF at the end
of Acknowledge sequence
Cleared in
software
PIC16F882/883/884/886/887
DS41291G-page 206 2006-2012 Microchip Technology Inc.
FIGURE 13-18: STOP CONDITION RECEIVE OR TRANSMIT MODE
13.4.12 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition, de-
asserts the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate Gen-
erator (BRG) is suspended from counting until the SCL
pin is actually sampled high. When the SCL pin is sam-
pled high, the Baud Rate Generator is reloaded with
the contents of SSPADD<6:0> and begins counting.
This ensures that the SCL high time will always be at
least one BRG rollover count, in the event that the clock
is held low by an external device (Figure 13-19).
13.4.13 SLEEP OPERATION
While in Sleep mode, the I2C module can receive
addresses or data, and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
13.4.14 EFFECT OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
FIGURE 13-19: CLOCK ARBITRATION TIMING IN MASTER TRANSMIT MODE
SCL
SDA
SDA asserted low before rising edge of clock
Write to SSPCON2
Set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high, P bit (SSPSTAT) is set
TBRG
to set up Stop condition
ACK
P
TBRG
PEN bit (SSPCON2) is cleared by
hardware and the SSPIF bit is set
SCL
SDA
BRG overflow,
Release SCL,
If SCL = 1, load BRG with
SSPADD<6:0>, and start count BRG overflow occurs,
Release SCL, Slave device holds SCL low SCL = 1, BRG starts counting
clock high interval
SCL line sampled once every machine cycle (TOSC*4),
Hold off BRG until SCL is sampled high
TBRG TBRG TBRG
to measure high time interval
2006-2012 Microchip Technology Inc. DS41291G-page 207
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13.4.15 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset, or when the
MSSP module is disabled. Control of the I2C bus may
be taken when the P bit (SSPSTAT register) is set, or
the bus is idle with both the S and P bits clear. When
the bus is busy, enabling the SSP Interrupt will gener-
ate the interrupt when the Stop condition occurs.
In Multi-Master operation, the SDA line must be moni-
tored for arbitration, to see if the signal level is the
expected output level. This check is performed in hard-
ware, with the result placed in the BCLIF bit.
Arbitration can be lost in the following states:
• Address transfer
• Data transfer
• A Start condition
• A Repeated Start condition
• An Acknowledge condition
13.4.16 MULTI -MASTER
COMMUNICATION, BUS
COLLISION, AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitra-
tion. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a ‘1’ on SDA, by letting SDA float high and
another master asserts a ‘0’. When the SCL pin floats
high, data should be stable. If the expected data on
SDA is a ‘1’ and the data sampled on the SDA pin = 0,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag (BCLIF) and reset the
I2C port to its Idle state (Figure 13-20).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF bit is
cleared, the SDA and SCL lines are de-asserted, and
the SSPBUF can be written to. When the user services
the bus collision interrupt service routine, and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop, or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDA and SCL
lines are de-asserted, and the respective control bits in
the SSPCON2 register are cleared. When the user
services the bus collision interrupt service routine, and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be
set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the trans-
mitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the SSPSTAT
register, or the bus is idle and the S and P bits are
cleared.
FIGURE 13-20: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCLIF
SDA released
SDA line pulled low
by another source
Sample SDA,
While SCL is high, data doesn’t
Bus collision has occurred
Set bus collision
interrupt (BCLIF)
match what is driven by the master,
by master
Data changes
while SCL = 0
PIC16F882/883/884/886/887
DS41291G-page 208 2006-2012 Microchip Technology Inc.
13.4.16.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the beginning of
the Start condition (Figure 13-21).
b) SCL is sampled low before SDA is asserted low
(Figure 13-22).
During a Start condition, both the SDA and the SCL
pins are monitored, if:
the SDA pin is already low,
or the SCL pin is already low,
then:
the Start condition is aborted,
and the BCLIF flag is set,
and the MSSP module is reset to its Idle state
(Figure 13-21).
The Start condition begins with the SDA and SCL pins
de-asserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded from SSPADD<6:0>
and counts down to 0. If the SCL pin is sampled low
while SDA is high, a bus collision occurs, because it is
assumed that another master is attempting to drive a
data ‘1’ during the Start condition.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 13-23). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to 0, and during this time, if the SCL pin is
sampled as ‘0’, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
FIGURE 13-21: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The reason that bus collision is not a factor
during a Start condition, is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDA before the other.
This condition does not cause a bus colli-
sion, because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSPIF set because
SSP module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSPIF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1.
SDA = 0, SCL = 1.
BCLIF
S
SSPIF
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared in software.
SSPIF and BCLIF are
cleared in software.
Set BCLIF,
Start condition. Set BCLIF.
2006-2012 Microchip Technology Inc. DS41291G-page 209
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FIGURE 13-22: BUS COLLISION DURING START CONDITION (SCL = 0)
FIGURE 13-23: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN Bus collision occurs, set BCLIF
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
Interrupt cleared
in software
Bus collision occurs, set BCLIF
SCL =0 before BRG time-out,
‘0’‘0’
‘0’‘0’
SDA
SCL
SEN
Set S
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
Less than TBRG TBRG
SDA = 0, SCL = 1
BCLIF
S
SSPIF
S
Interrupts cleared
in software
Set SSPIF
SDA = 0, SCL = 1
SDA pulled low by other master
Reset BRG and assert SDA
SCL pulled low after BRG
time-out
Set SSPIF
‘0’
PIC16F882/883/884/886/887
DS41291G-page 210 2006-2012 Microchip Technology Inc.
13.4.16.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level.
b) SCL goes low before SDA is asserted low, indi-
cating that another master is attempting to trans-
mit a data ’1’.
When the user de-asserts SDA and the pin is allowed
to float high, the BRG is loaded with SSPADD<6:0>
and counts down to 0. The SCL pin is then de-asserted,
and when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e, another
master is attempting to transmit a data ‘0’, see
Figure 13-24). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from high-
to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDA at
exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(Figure 13-25).
If at the end of the BRG time-out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
FIGURE 13-24: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 13-25: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDA
SCL
RSEN
BCLIF
S
SSPIF
Sample SDA when SCL goes high,
If SDA = 0, set BCLIF and release SDA and SCL
Cleared in software
‘0’
‘0’
SDA
SCL
BCLIF
RSEN
S
SSPIF
Interrupt cleared
in software
SCL goes low before SDA,
Set BCLIF, release SDA and SCL
TBRG TBRG
‘0’
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13.4.16.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been de-asserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
b) After the SCL pin is de-asserted, SCL is
sampled low before SDA goes high.
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD<6:0>
and counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 13-26). If the SCL pin is sam-
pled low before SDA is allowed to float high, a bus col-
lision occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 13-27).
FIGURE 13-26: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 13-27: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCLIF
‘0’
‘0’
SDA
SCL
BCLIF
PEN
P
SSPIF
TBRG TBRG TBRG
Assert SDA SCL goes low before SDA goes high,
set BCLIF
‘0’
‘0’
PIC16F882/883/884/886/887
DS41291G-page 212 2006-2012 Microchip Technology Inc.
13.4.17 SSP MASK REGISTER
An SSP Mask (SSPMSK) register is available in I2C
Slave mode as a mask for the value held in the
SSPSR register during an address comparison
operation. A zero (‘0’) bit in the SSPMSK register has
the effect of making the corresponding bit in the
SSPSR register a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
This register must be initiated prior to setting
SSPM<3:0> bits to select the I2C Slave mode (7-bit or
10-bit address).
This register can only be accessed when the appropriate
mode is selected by bits (SSPM<3:0> of SSPCON).
The SSP Mask register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
REGISTER 13-4: SSPMSK: SSP MASK REGISTER(1)
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
MSK7 MSK6 MSK5 MSK4 MSK3 MSK2 MSK1 MSK0(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-1 MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address(2)
I2C Slave mode, 10-bit Address (SSPM<3:0> = 0111):
1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match
Note 1: When SSPCON bits SSPM<3:0> = 1001, any reads or writes to the SSPADD SFR address are accessed
through the SSPMSK register.
2: In all other SSP modes, this bit has no effect.
2006-2012 Microchip Technology Inc. DS41291G-page 213
PIC16F882/883/884/886/887
14.0 SPECIAL FEATURES OF THE
CPU
The PIC16F882/883/884/886/887 devices have a host
of features intended to maximize system reliability,
minimize cost through elimination of external
components, provide power-saving features and offer
code protection.
These features are:
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Timer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• Oscillator selection
• Sleep
• Code protection
• ID Locations
• In-Circuit Serial Programming™
• Low-voltage In-Circuit Serial Programming™
The PIC16F882/883/884/886/887 devices have two
timers that offer necessary delays on power-up. One is
the Oscillator Start-up Timer (OST), intended to keep
the chip in Reset until the crystal oscillator is stable.
The other is the Power-up Timer (PWRT), which
provides a fixed delay of 64 ms (nominal) on power-up
only, designed to keep the part in Reset while the
power supply stabilizes. There is also circuitry to reset
the device if a brown-out occurs, which can use the
Power-up Timer to provide at least a 64 ms Reset. With
these three functions-on-chip, most applications need
no external Reset circuitry.
The Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through:
• External Reset
• Watchdog Timer Wake-up
• An interrupt
Several oscillator options are also made available to
allow the part to fit the application. The INTOSC option
saves system cost while the LP crystal option saves
power. A set of Configuration bits are used to select
various options (see Register 14-3).
PIC16F882/883/884/886/887
DS41291G-page 214 2006-2012 Microchip Technology Inc.
14.1 Configuration Bits
The Configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’) to select various
device configurations as shown in Register 14-1.
These bits are mapped in program memory location
2007h and 2008h, respectively.
REGISTER DEFINITIONS: CONFIGURATION WORDS
Note: Address 2007h and 2008h are beyond the
user program memory space. It belongs to
the special configuration memory space
(2000h-3FFFh), which can be accessed
only during programming. See “PIC16F88X
Memory Programming Specification”
(DS41287) for more information.
REGISTER 14-1: CONFIG1: CONFIGURATION WORD REGISTER 1
DEBUG LVP FCMEN IESO BOREN<1:0>
bit 13 bit 8
CPD CP MCLRE PWRTE WDTE FOSC<2:0>
bit 7 bit 0
bit 13 DEBUG: In-Circuit Debugger Mode bit
1 = In-Circuit Debugger disabled, RB6/ICSPCLK and RB7/ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, RB6/ICSPCLK and RB7/ICSPDAT are dedicated to the debugger
bit 12 LVP: Low Voltage Programming Enable bit
1 = RB3/PGM pin has PGM function, low voltage programming enabled
0 = RB3 pin is digital I/O, HV on MCLR must be used for programming
bit 11 FCMEN: Fail-Safe Clock Monitor Enabled bit
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
bit 10 IESO: Internal External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the PCON register
00 = BOR disabled
bit 7 CPD: Data Code Protection bit(2)
1 = Data memory code protection is disabled
0 = Data memory code protection is enabled
bit 6 CP: Code Protection bit(3)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 5 MCLRE: RE3/MCLR pin function select bit(4)
1 = RE3/MCLR pin function is MCLR
0 = RE3/MCLR pin function is digital input, MCLR internally tied to VDD
bit 4 PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 3 WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled and can be enabled by SWDTEN bit of the WDTCON register
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = RC oscillator: CLKOUT function on RA6/OSC2/CLKOUT pin, RC on RA7/OSC1/CLKIN
110 = RCIO oscillator: I/O function on RA6/OSC2/CLKOUT pin, RC on RA7/OSC1/CLKIN
101 = INTOSC oscillator: CLKOUT function on RA6/OSC2/CLKOUT pin, I/O function on RA7/OSC1/CLKIN
100 = INTOSCIO oscillator: I/O function on RA6/OSC2/CLKOUT pin, I/O function on RA7/OSC1/CLKIN
011 = EC: I/O function on RA6/OSC2/CLKOUT pin, CLKIN on RA7/OSC1/CLKIN
010 = HS oscillator: High-speed crystal/resonator on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
001 = XT oscillator: Crystal/resonator on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
000 = LP oscillator: Low-power crystal on RA6/OSC2/CLKOUT and RA7/OSC1/CLKIN
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire data EEPROM will be erased when the code protection is turned off.
3: The entire program memory will be erased when the code protection is turned off.
4: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled.
2006-2012 Microchip Technology Inc. DS41291G-page 215
PIC16F882/883/884/886/887
REGISTER 14-2: CONFIG2: CONFIGURATION WORD REGISTER 2
— — —WRT<1:0>BOR4V
bit 13 bit 8
— — — — — — — —
bit 7 bit 0
bit 13-11 Unimplemented: Read as ‘1’
bit 10-9 WRT<1:0>: Flash Program Memory Self Write Enable bits
PIC16F883/PIC16F884
00 = 0000h to 07FFh write protected, 0800h to 0FFFh may be modified by EECON control
01 = 0000h to 03FFh write protected, 0400h to 0FFFh may be modified by EECON control
10 = 0000h to 00FFh write protected, 0100h to 0FFFh may be modified by EECON control
11 = Write protection off
PIC16F886/PIC16F887
00 = 0000h to 0FFFh write protected, 1000h to 1FFFh may be modified by EECON control
01 = 0000h to 07FFh write protected, 0800h to 1FFFh may be modified by EECON control
10 = 0000h to 00FFh write protected, 0100h to 1FFFh may be modified by EECON control
11 = Write protection off
PIC16F882
00 = 0000h to 03FFh write protected, 0400h to 07FFh may be modified by EECON control
01 = 0000h to 00FFh write protected, 0100h to 07FFh may be modified by EECON control
11 = Write protection off
bit 8 BOR4V: Brown-out Reset Selection bit
0 = Brown-out Reset set to 2.1V
1 = Brown-out Reset set to 4.0V
bit 7-0 Unimplemented: Read as ‘1’
PIC16F882/883/884/886/887
DS41291G-page 216 2006-2012 Microchip Technology Inc.
14.2 Reset
The PIC16F882/883/884/886/887 devices differentiate
between various kinds of Reset:
a) Power-on Reset (POR)
b) WDT Reset during normal operation
c) WDT Reset during Sleep
d) MCLR Reset during normal operation
e) MCLR Reset during Sleep
f) Brown-out Reset (BOR)
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on:
• Power-on Reset
•MCLR
Reset
•MCLR Reset during Sleep
•WDT Reset
• Brown-out Reset (BOR)
They are not affected by a WDT Wake-up since this is
viewed as the resumption of normal operation. TO and
PD bits are set or cleared differently in different Reset
situations, as indicated in Table 14-2. These bits are
used in software to determine the nature of the Reset.
See Table 14-5 for a full description of Reset states of
all registers.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 14-1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 17.0 “Electrical
Specifications” for pulse-width specifications.
FIGURE 14-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR/VPP pin
VDD
OSC1/
WDT
Module
VDD Rise
Detect
OST/PWRT
LFINTOSC
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
11-bit Ripple Counter
Reset
Enable OST
Enable PWRT
Sleep
Brown-out(1)
Reset
SBOREN
BOREN
CLKI pin
Note 1: Refer to the Configuration Word Register 1 (Register 14-1).
2006-2012 Microchip Technology Inc. DS41291G-page 217
PIC16F882/883/884/886/887
14.2.1 POWER-ON RESET (POR)
The on-chip POR circuit holds the chip in Reset until VDD
has reached a high enough level for proper operation. A
maximum rise time for VDD is required. See
Section 17.0 “Electrical Specifications” for details. If
the BOR is enabled, the maximum rise time specification
does not apply. The BOR circuitry will keep the device in
Reset until VDD reaches VBOR (see Section 14.2.4
“Brown-out Reset (BOR)”).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
14.2.2 MCLR
PIC16F882/883/884/886/887 have a noise filter in the
MCLR Reset path. The filter will detect and ignore
small pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
The behavior of the ESD protection on the MCLR pin
has been altered from early devices of this family.
Voltages applied to the pin that exceed its specification
can result in both MCLR Resets and excessive current
beyond the device specification during the ESD event.
For this reason, Microchip recommends that the MCLR
pin no longer be tied directly to VDD. The use of an RC
network, as shown in Figure 14-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word Register 1. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the RA3/MCLR pin
becomes an external Reset input. In this mode, the
RA3/MCLR pin has a weak pull-up to VDD.
FIGURE 14-2: RECOMMENDED MCLR
CIRCUIT
14.2.3 POWER-UP TIMER (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR or Brown-out
Reset. The Power-up Timer operates from the 31 kHz
LFINTOSC oscillator. For more information, see
Section 4.5 “Internal Clock Modes”. The chip is kept
in Reset as long as PWRT is active. The PWRT delay
allows the VDD to rise to an acceptable level. A
Configuration bit, PWRTE, can disable (if set) or enable
(if cleared or programmed) the Power-up Timer. The
Power-up Timer should be enabled when Brown-out
Reset is enabled, although it is not required.
The Power-up Timer delay will vary from chip-to-chip
and vary due to:
•V
DD variation
• Temperature variation
• Process variation
See DC parameters for details (Section 17.0 “Electrical
Specifications”).
Note: The POR circuit does not produce an
internal Reset when VDD declines. To
re-enable the POR, VDD must reach Vss
for a minimum of 100 s.
VDD
PIC16F886
MCLR
R1
1kor greater)
C1
0.1 F
(optional, not critical)
PIC16F882/883/884/886/887
DS41291G-page 218 2006-2012 Microchip Technology Inc.
14.2.4 BROWN-OUT RESET (BOR)
The BOREN0 and BOREN1 bits in the Configuration
Word Register 1 select one of four BOR modes. Two
modes have been added to allow software or hardware
control of the BOR enable. When BOREN<1:0> = 01,
the SBOREN bit (PCON<4>) enables/disables the
BOR allowing it to be controlled in software. By
selecting BOREN<1:0>, the BOR is automatically
disabled in Sleep to conserve power and enabled on
wake-up. In this mode, the SBOREN bit is disabled.
See Register 14-3 for the Configuration Word
definition.
The BOR4V bit in the Configuration Word Register 2
selects one of two Brown-out Reset voltages. When
BOR4B = 1, VBOR is set to 4V. When BOR4V = 0, VBOR
is set to 2.1V.
If VDD falls below VBOR for greater than parameter
(TBOR) (see Section 17.0 “Electrical Specifications”),
the Brown-out situation will reset the device. This will
occur regardless of VDD slew rate. A Reset is not insured
to occur if VDD falls below VBOR for less than parameter
(TBOR).
On any Reset (Power-on, Brown-out Reset, Watchdog
Timer, etc.), the chip will remain in Reset until VDD rises
above VBOR (see Figure 14-3). The Power-up Timer
will now be invoked, if enabled and will keep the chip in
Reset an additional 64 ms.
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-up Timer will be re-initialized. Once VDD
rises above VBOR, the Power-up Timer will execute a
64 ms Reset.
FIGURE 14-3: BROWN-OUT SITUATIONS
Note: The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
Register 1.
64 ms(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset 64 ms(1)
< 64 ms
64 ms(1)
VBOR
VDD
Internal
Reset
Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’.
2006-2012 Microchip Technology Inc. DS41291G-page 219
PIC16F882/883/884/886/887
14.2.5 TIME-OUT SEQUENCE
On power-up, the time-out sequence is as follows: first,
PWRT time-out is invoked after POR has expired, then
OST is activated after the PWRT time-out has expired.
The total time-out will vary based on oscillator
configuration and PWRTE bit status. For example, in
EC mode with PWRTE bit erased (PWRT disabled),
there will be no time-out at all. Figures 14-4,14-5
and 14-6 depict time-out sequences. The device can
execute code from the INTOSC while OST is active by
enabling Two-Speed Start-up or Fail-Safe Monitor (see
Section 4.7.2 “Two-Speed Start-up Sequence” and
Section 4.8 “Fail-Safe Clock Monitor”).
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 14-5). This is useful for testing purposes or
to synchronize more than one
PIC16F882/883/884/886/887 device operating in par-
allel.
Table 14-5 shows the Reset conditions for some
special registers, while Table 14-4 shows the Reset
conditions for all the registers.
14.2.6 POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset that last
occurred.
Bit 0 is BOR (Brown-out Reset). BOR is unknown on
Power-on Reset. It must then be set by the user and
checked on subsequent Resets to see if BOR = 0,
indicating that a Brown-out has occurred. The BOR
Status bit is a “don’t care” and is not necessarily
predictable if the brown-out circuit is disabled
(BOREN<1:0> = 00 in the Configuration Word
Register 1).
Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on
Reset and unaffected otherwise. The user must write a
‘1’ to this bit following a Power-on Reset. On a
subsequent Reset, if POR is ‘0’, it will indicate that a
Power-on Reset has occurred (i.e., VDD may have
gone too low).
For more information, see Section 3.2.2 “Ultra
Low-Power Wake-up” and Section 14.2.4
“Brown-out Reset (BOR)”.
TABLE 14-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 14-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE
TABLE 14-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT
Oscillator Configuration
Power-up Brown-out Reset Wake-up from
Sleep
PWRTE = 0PWRTE = 1PWRTE = 0PWRTE = 1
XT, HS, LP TPWRT +
1024 • TOSC
1024 • TOSC TPWRT +
1024 • T
OSC
1024 • TOSC 1024 • TOSC
LP, T1OSCIN = 1TPWRT —TPWRT ——
RC, EC, INTOSC TPWRT —TPWRT ——
POR BOR TO PD Condition
0x11Power-on Reset
u011Brown-out Reset
uu0uWDT Reset
uu00WDT Wake-up
uuuuMCLR Reset during normal operation
uu10MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
PCON — — ULPWUE SBOREN ——PORBOR 38
STATUS IRP RP1 RPO TO PD ZDC C31
Legend: u = unchanged, x = unknown, — = unimplemented bit, reads as ‘0’, q = value depends on condition.
Shaded cells are not used by BOR.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
PIC16F882/883/884/886/887
DS41291G-page 220 2006-2012 Microchip Technology Inc.
FIGURE 14-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
FIGURE 14-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
FIGURE 14-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
2006-2012 Microchip Technology Inc. DS41291G-page 221
PIC16F882/883/884/886/887
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER
Register Address Power-on
Reset
MCLR Reset
WDT Reset
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out
W—xxxx xxxx uuuu uuuu uuuu uuuu
INDF 00h/80h/10
0h/180h
xxxx xxxx xxxx xxxx uuuu uuuu
TMR0 01h/101h xxxx xxxx uuuu uuuu uuuu uuuu
PCL 02h/82h/10
2h/182h
0000 0000 0000 0000 PC + 1(3)
STATUS 03h/83h/10
3h/183h
0001 1xxx 000q quuu(4) uuuq quuu(4)
FSR 04h/84h/10
4h/184h
xxxx xxxx uuuu uuuu uuuu uuuu
PORTA 05h xxxx xxxx 0000 0000 uuuu uuuu
PORTB 06h/106h xxxx xxxx 0000 0000 uuuu uuuu
PORTC 07h xxxx xxxx 0000 0000 uuuu uuuu
PORTD 08h xxxx xxxx 0000 0000 uuuu uuuu
PORTE 09h ---- xxxx ---- 0000 ---- uuuu
PCLATH 0Ah/8Ah/10
Ah/18Ah
---0 0000 ---0 0000 ---u uuuu
INTCON 0Bh/8Bh/10
Bh/18Bh
0000 000x 0000 000u uuuu uuuu(2)
PIR1 0Ch 0000 0000 0000 0000 uuuu uuuu(2)
PIR2 0Dh 0000 0000 0000 0000 uuuu uuuu(2)
TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu
T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu
TMR2 11h 0000 0000 0000 0000 uuuu uuuu
T2CON 12h -000 0000 -000 0000 -uuu uuuu
SSPBUF 13h xxxx xxxx uuuu uuuu uuuu uuuu
SSPCON 14h 0000 0000 0000 0000 uuuu uuuu
CCPR1L 15h xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H 16h xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON 17h 0000 0000 0000 0000 uuuu uuuu
RCSTA 18h 0000 000x 0000 0000 uuuu uuuu
TXREG 19h 0000 0000 0000 0000 uuuu uuuu
RCREG 1Ah 0000 0000 0000 0000 uuuu uuuu
CCPR2L 1Bh xxxx xxxx uuuu uuuu uuuu uuuu
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
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DS41291G-page 222 2006-2012 Microchip Technology Inc.
CCPR2H 1Ch xxxx xxxx uuuu uuuu uuuu uuuu
CCP2CON 1Dh --00 0000 --00 0000 --uu uuuu
ADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 1Fh 00-0 0000 00-0 0000 uu-u uuuu
OPTION_REG 81h/181h 1111 1111 1111 1111 uuuu uuuu
TRISA 85h 1111 1111 1111 1111 uuuu uuuu
TRISB 86h/186h 1111 1111 1111 1111 uuuu uuuu
TRISC 87h 1111 1111 1111 1111 uuuu uuuu
TRISD 88h 1111 1111 1111 1111 uuuu uuuu
TRISE 89h ---- 1111 ---- 1111 ---- uuuu
PIE1 8Ch 0000 0000 0000 0000 uuuu uuuu
PIE2 8Dh 0000 0000 0000 0000 uuuu uuuu
PCON 8Eh --01 --0x --0u --uu(1, 5) --uu --uu
OSCCON 8Fh -110 q000 -110 q000 -uuu uuuu
OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu
SSPCON2 91h 0000 0000 0000 0000 uuuu uuuu
PR2 92h 1111 1111 1111 1111 1111 1111
SSPADD(6) 93h 0000 0000 0000 0000 uuuu uuuu
SSPMSK(6) 93h 1111 1111 1111 1111 1111 1111
SSPSTAT 94h 0000 0000 0000 0000 uuuu uuuu
WPUB 95h 1111 1111 1111 1111 uuuu uuuu
IOCB 96h 0000 0000 0000 0000 uuuu uuuu
VRCON 97h 0000 0000 0000 0000 uuuu uuuu
TXSTA 98h 0000 -010 0000 -010 uuuu -uuu
SPBRG 99h 0000 0000 0000 0000 uuuu uuuu
SPBRGH 9Ah 0000 0000 0000 0000 uuuu uuuu
PWM1CON 9Bh 0000 0000 0000 0000 uuuu uuuu
ECCPAS 9Ch 0000 0000 0000 0000 uuuu uuuu
PSTRCON 9Dh ---0 0001 ---0 0001 ---u uuuu
ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu
ADCON1 9Fh 0-00 ---- 0-00 ---- u-uu ----
WDTCON 105h ---0 1000 ---0 1000 ---u uuuu
CM1CON0 107h 0000 0-00 0000 0-00 uuuu u-uu
CM2CON0 108h 0000 0-00 0000 0-00 uuuu u-uu
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER (CONTINUED)
Register Address Power-on
Reset
MCLR Reset
WDT Reset (Continued)
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out (Continued)
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
2006-2012 Microchip Technology Inc. DS41291G-page 223
PIC16F882/883/884/886/887
TABLE 14-5: INITIALIZATION CONDITION FOR SPECIAL REGISTERS
CM2CON1 109h 0000 0--0 0000 0--0 uuuu u--u
EEDAT 10Ch 0000 0000 0000 0000 uuuu uuuu
EEADR 10Dh 0000 0000 0000 0000 uuuu uuuu
EEDATH 10Eh --00 0000 --00 0000 --uu uuuu
EEADRH 10Fh ---0 0000 ---0 0000 ---u uuuu
SRCON 185h 0000 00-0 0000 00-0 uuuu uu-u
BAUDCTL 187h 01-0 0-00 01-0 0-00 uu-u u-uu
ANSEL 188h 1111 1111 1111 1111 uuuu uuuu
ANSELH 189h 1111 1111 1111 1111 uuuu uuuu
EECON1 18Ch ---- x000 ---- q000 ---- uuuu
EECON2 18Dh ---- ---- ---- ---- ---- ----
Condition Program
Counter
Status
Register
PCON
Register
Power-on Reset 000h 0001 1xxx --01 --0x
MCLR Reset during normal operation 000h 000u uuuu --0u --uu
MCLR Reset during Sleep 000h 0001 0uuu --0u --uu
WDT Reset 000h 0000 uuuu --0u --uu
WDT Wake-up PC + 1 uuu0 0uuu --uu --uu
Brown-out Reset 000h 0001 1uuu --01 --u0
Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu --uu --uu
Legend: u = unchanged, x = unknown, — = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Interrupt Enable bit, GIE, is set, the PC is loaded with
the interrupt vector (0004h) after execution of PC + 1.
TABLE 14-4: INITIALIZATION CONDITION FOR REGISTER (CONTINUED)
Register Address Power-on
Reset
MCLR Reset
WDT Reset (Continued)
Brown-out Reset(1)
Wake-up from Sleep through
Interrupt
Wake-up from Sleep through
WDT Time-out (Continued)
Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition.
Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently.
2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up).
3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt
vector (0004h).
4: See Table 14-5 for Reset value for specific condition.
5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u.
6: Accessible only when SSPCON register bits SSPM<3:0> = 1001.
PIC16F882/883/884/886/887
DS41291G-page 224 2006-2012 Microchip Technology Inc.
14.3 Interrupts
The PIC16F882/883/884/886/887 devices have multi-
ple interrupt sources:
• External Interrupt RB0/INT
• Timer0 Overflow Interrupt
• PORTB Change Interrupts
• 2 Comparator Interrupts
• A/D Interrupt
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt
• EEPROM Data Write Interrupt
• Fail-Safe Clock Monitor Interrupt
• Enhanced CCP Interrupt
• EUSART Receive and Transmit Interrupts
• Ultra Low-Power Wake-up Interrupt
• MSSP Interrupt
The Interrupt Control register (INTCON) and Peripheral
Interrupt Request Register 1 (PIR1) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
A Global Interrupt Enable bit, GIE (INTCON<7>),
enables (if set) all unmasked interrupts, or disables (if
cleared) all interrupts. Individual interrupts can be
disabled through their corresponding enable bits in the
INTCON, PIE1 and PIE2 registers, respectively. GIE is
cleared on Reset.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enables unmasked interrupts.
The following interrupt flags are contained in the
INTCON register:
• INT Pin Interrupt
• PORTB Change Interrupts
• Timer0 Overflow Interrupt
The peripheral interrupt flags are contained in the PIR1
and PIR2 registers. The corresponding interrupt enable
bits are contained in PIE1 and PIE2 registers.
The following interrupt flags are contained in the PIR1
register:
• A/D Interrupt
• EUSART Receive and Transmit Interrupts
• Timer1 Overflow Interrupt
• Synchronous Serial Port (SSP) Interrupt
• Enhanced CCP1 Interrupt
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt
The following interrupt flags are contained in the PIR2
register:
• Fail-Safe Clock Monitor Interrupt
• 2 Comparator Interrupts
• EEPROM Data Write Interrupt
• Ultra Low-Power Wake-up Interrupt
• CCP2 Interrupt
When an interrupt is serviced:
• The GIE is cleared to disable any further interrupt.
• The return address is pushed onto the stack.
• The PC is loaded with 0004h.
For external interrupt events, such as the INT pin,
PORTB change interrupts, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 14-8). The latency is the same for one or
two-cycle instructions. Once in the Interrupt Service
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
For additional information on Timer1, Timer2,
comparators, A/D, data EEPROM, EUSART, MSSP or
Enhanced CCP modules, refer to the respective
peripheral section.
14.3.1 RB0/INT INTERRUPT
External interrupt on RB0/INT pin is edge-triggered;
either rising if the INTEDG bit (OPTION_REG<6>) is
set, or falling, if the INTEDG bit is clear. When a valid
edge appears on the RB0/INT pin, the INTF bit
(INTCON<1>) is set. This interrupt can be disabled by
clearing the INTE control bit (INTCON<4>). The INTF
bit must be cleared in software in the Interrupt Service
Routine before re-enabling this interrupt. The RB0/INT
interrupt can wake-up the processor from Sleep, if the
INTE bit was set prior to going into Sleep. The status of
the GIE bit decides whether or not the processor
branches to the interrupt vector following wake-up
(0004h). See Section 14.6 “Power-Down Mode
(Sleep)” for details on Sleep and Figure 14-10 for
timing of wake-up from Sleep through RB0/INT
interrupt.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
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PIC16F882/883/884/886/887
14.3.2 TIMER0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
the T0IF (INTCON<2>) bit. The interrupt can be
enabled/disabled by setting/clearing T0IE (INTCON<5>)
bit. See Section 5.0 “Timer0 Module” for operation of
the Timer0 module.
14.3.3 PORTB INTERRUPT
An input change on PORTB change sets the RBIF
(INTCON<0>) bit. The interrupt can be
enabled/disabled by setting/clearing the RBIE
(INTCON<3>) bit. Plus, individual pins can be
configured through the IOCB register.
FIGURE 14-7: INTERRUPT LOGIC
Note: If a change on the I/O pin should occur
when the read operation is being
executed (start of the Q2 cycle), then the
RBIF interrupt flag may not get set. See
Section 3.4.3 “Interrupt-on-Change” for
more information.
C1IF
C1IE
T0IF
T0IE
INTF
INTE
RBIF
RBIE
GIE
PEIE
Wake-up (If in Sleep mode)(1)
Interrupt to CPU
EEIE
EEIF
ADIF
ADIE
IOC-RB0
IOCB0
IOC-RB1
IOCB1
IOC-RB2
IOCB2
IOC-RB3
IOCB3
CCP1IF
CCP1IE
OSFIF
OSFIE
C2IF
C2IE
IOC-RB4
IOCB4
IOC-RB5
IOCB5
IOC-RB6
IOCB6
IOC-RB7
IOCB7
RCIF
RCIE
TMR2IE
TMR2IF
SSPIE
SSPIF
TXIE
TXIF
TMR1IE
TMR1IF
Note 1: Some peripherals depend upon the
system clock for operation. Since the
system clock is suspended during
Sleep, these peripherals will not wake
the part from Sleep. See Section 14.6.1
“Wake-up from Sleep”.
BCLIE
BCLIF
ULPWUIF
ULPWUIE
CCP2IF
CCP2IE
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FIGURE 14-8: INT PIN INTERRUPT TIMING
TABLE 14-6: SUMMARY OF INTERRUPT REGISTERS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 33
PIE1 — ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 34
PIE2 OSFIE C2IE C1IE EEIE BCLIE ULPWUIE — CCP2IE 35
PIR1 — ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 36
PIR2 OSFIF C2IF C1IF EEIF BCLIF ULPWUIF — CCP2IF 37
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends upon condition.
Shaded cells are not used by the interrupt module.
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Dummy Cycle
Inst (PC)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 17.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(5)
(1)
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14.4 Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Since the upper 16 bytes of all GPR banks are
common in the PIC16F882/883/884/886/887 (see
Figures 2-2 and 2-3), temporary holding registers,
W_TEMP and STATUS_TEMP, should be placed in
here. These 16 locations do not require banking and
therefore, make it easier to context save and restore.
The same code shown in Example 14-1 can be used
to:
• Store the W register
• Store the STATUS register
• Execute the ISR code
• Restore the Status (and Bank Select Bit register)
• Restore the W register
EXAMPLE 14-1: SAVING STATUS AND W REGISTERS IN RAM
Note: The PIC16F882/883/884/886/887 devices
normally do not require saving the
PCLATH. However, if computed GOTOs
are used in the ISR and the main code,
the PCLATH must be saved and restored
in the ISR.
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS,W ;Swap status to be saved into W
;Swaps are used because they do not affect the status bits
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP,F ;Swap W_TEMP
SWAPF W_TEMP,W ;Swap W_TEMP into W
PIC16F882/883/884/886/887
DS41291G-page 228 2006-2012 Microchip Technology Inc.
14.5 Watchdog Timer (WDT)
The WDT has the following features:
• Operates from the LFINTOSC (31 kHz)
• Contains a 16-bit prescaler
• Shares an 8-bit prescaler with Timer0
• Time-out period is from 1 ms to 268 seconds
• Configuration bit and software controlled
WDT is cleared under certain conditions described in
Table 14-7.
14.5.1 WDT OSCILLATOR
The WDT derives its time base from the 31 kHz
LFINTOSC. The LTS bit of the OSCCON register does
not reflect that the LFINTOSC is enabled.
The value of WDTCON is ‘---0 1000’ on all Resets.
This gives a nominal time base of 17 ms.
14.5.2 WDT CONTROL
The WDTE bit is located in the Configuration Word
Register 1. When set, the WDT runs continuously.
When the WDTE bit in the Configuration Word
Register 1 is set, the SWDTEN bit of the WDTCON
register has no effect. If WDTE is clear, then the
SWDTEN bit can be used to enable and disable the
WDT. Setting the bit will enable it and clearing the bit
will disable it.
The PSA and PS<2:0> bits of the OPTION register
have the same function as in previous versions of the
PIC16F882/883/884/886/887 family of microcon-
trollers. See Section 5.0 “Timer0 Module” for more
information.
FIGURE 14-9: WATCHDOG TIMER BLOCK DIAGRAM
Note: When the Oscillator Start-up Timer (OST)
is invoked, the WDT is held in Reset,
because the WDT Ripple Counter is used
by the OST to perform the oscillator delay
count. When the OST count has expired,
the WDT will begin counting (if enabled).
TABLE 14-7: WDT STATUS
Conditions WDT
WDTE = 0Cleared
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
31 kHz
PSA
16-bit WDT Prescaler
From TMR0 Clock Source
Prescaler(1)
8
PS<2:0>
PSA
WDT Time-out
WDTPS<3:0>
WDTE from the Configuration Word Register 1
1
1
0
0
SWDTEN from WDTCON
LFINTOSC Clock
Note 1: This is the shared Timer0/WDT prescaler. See Section 5.1.3 “Software Programmable Prescaler” for more information.
2006-2012 Microchip Technology Inc. DS41291G-page 229
PIC16F882/883/884/886/887
TABLE 14-8: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 14-9: SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER
REGISTER 14-3: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 U-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0
— — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 Unimplemented: Read as ‘0’
bit 4-1 WDTPS<3:0>: Watchdog Timer Period Select bits
Bit Value = Prescale Rate
0000 = 1:32
0001 = 1:64
0010 = 1:128
0011 = 1:256
0100 = 1:512 (Reset value)
0101 = 1:1024
0110 = 1:2048
0111 = 1:4096
1000 = 1:8192
1001 = 1:16384
1010 = 1:32768
1011 = 1:65536
1100 = reserved
1101 = reserved
1110 = reserved
1111 = reserved
bit 0 SWDTEN: Software Enable or Disable the Watchdog Timer(1)
1 = WDT is turned on
0 = WDT is turned off (Reset value)
Note 1: If WDTE Configuration bit = 1, then WDT is always enabled, irrespective of this control bit. If WDTE
Configuration bit = 0, then it is possible to turn WDT on/off with this control bit.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 32
WDTCON — — — WDTPS3 WDTPS2 WSTPS1 WDTPS0 SWDTEN 229
Legend: Shaded cells are not used by the Watchdog Timer.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1(1) 13:8 — — DEBUG LVP FCMEN IESO BOREN 1 BOREN0 214
7:0 CPD CP MCLRE PWRTE WDTE FOSC 2 FOSC 1 FOSC 0
Legend: – = unimplemented locations read as ‘0’. Shaded cells are not used by the Watchdog Timer.
Note 1: See Configuration Word Register 1 (Register 14-1) for operation of all register bits.
PIC16F882/883/884/886/887
DS41291G-page 230 2006-2012 Microchip Technology Inc.
14.6 Power-Down Mode (Sleep)
The Power-down mode is entered by executing a
SLEEP instruction.
If the Watchdog Timer is enabled:
• WDT will be cleared but keeps running.
•PD
bit in the STATUS register is cleared.
•TO
bit is set.
• Oscillator driver is turned off.
• I/O ports maintain the status they had before
SLEEP was executed (driving high, low or
high-impedance).
For lowest current consumption in this mode, all I/O pins
should be either at VDD or VSS, with no external circuitry
drawing current from the I/O pin and the comparators
and CVREF should be disabled. I/O pins that are
high-impedance inputs should be pulled high or low
externally to avoid switching currents caused by floating
inputs. The T0CKI input should also be at VDD or VSS for
lowest current consumption. The contribution from
on-chip pull-ups on PORTA should be considered.
The MCLR pin must be at a logic high level.
14.6.1 WAKE-UP FROM SLEEP
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR pin.
2. Watchdog Timer Wake-up (if WDT was enabled).
3. Interrupt from RB0/INT pin, PORTB change or a
peripheral interrupt.
The first event will cause a device Reset. The two latter
events are considered a continuation of program exe-
cution. The TO and PD bits in the STATUS register can
be used to determine the cause of device Reset. The
PD bit, which is set on power-up, is cleared when Sleep
is invoked. TO bit is cleared if WDT Wake-up occurred.
The following peripheral interrupts can wake the device
from Sleep:
1. TMR1 interrupt. Timer1 must be operating as an
asynchronous counter.
2. ECCP Capture mode interrupt.
3. A/D conversion (when A/D clock source is FRC).
4. EEPROM write operation completion.
5. Comparator output changes state.
6. Interrupt-on-change.
7. External Interrupt from INT pin.
8. EUSART Break detect, I2C slave.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be set (enabled). Wake-up
occurs regardless of the state of the GIE bit. If the GIE
bit is clear (disabled), the device continues execution at
the instruction after the SLEEP instruction. If the GIE bit
is set (enabled), the device executes the instruction
after the SLEEP instruction, then branches to the inter-
rupt address (0004h). In cases where the execution of
the instruction following SLEEP is not desirable, the
user should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
14.6.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
complete as a NOP. Therefore, the WDT and WDT
prescaler and postscaler (if enabled) will not be
cleared, the TO bit will not be set and the PD bit
will not be cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction, the device will imme-
diately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT prescaler
and postscaler (if enabled) will be cleared, the TO
bit will be set and the PD bit will be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
Note: It should be noted that a Reset generated
by a WDT time-out does not drive MCLR
pin low.
Note: If the global interrupts are disabled (GIE is
cleared), but any interrupt source has both
its interrupt enable bit and the
corresponding interrupt flag bits set, the
device will immediately wake-up from
Sleep. The SLEEP instruction is completely
executed.
2006-2012 Microchip Technology Inc. DS41291G-page 231
PIC16F882/883/884/886/887
FIGURE 14-10: WAKE-UP FROM SLEEP THROUGH INTERRUPT
14.7 Code Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out using ICSP™ for verification purposes.
14.8 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are readable
and writable during Program/Verify mode. Only the
Least Significant 7 bits of the ID locations are used.
14.9 In-Circuit Serial Programming™
The PIC16F882/883/884/886/887 microcontrollers can
be serially programmed while in the end application cir-
cuit. This is simply done with two lines for clock and
data and three other lines for:
•power
• ground
• programming voltage
This allows customers to manufacture boards with
unprogrammed devices and then program the micro-
controller just before shipping the product. This also
allows the most recent firmware or a custom firmware
to be programmed.
The device is placed into a Program/Verify mode by
holding the RB6/ICSPCLK and RB7/ICSPDAT pins low,
while raising the MCLR (VPP) pin from VIL to VIHH. See
the “PIC16F88X Memory Programming Specification”
(DS41287) for more information. RB7 becomes the
programming data and RB6 becomes the programming
clock. Both RB7 and RB6 are Schmitt Trigger inputs in
this mode.
After Reset, to place the device into Program/Verify
mode, the Program Counter (PC) is at location 00h. A
6-bit command is then supplied to the device.
Depending on the command, 14 bits of program data
are then supplied to or from the device, depending on
whether the command was a Load or a Read. For
complete details of serial programming, please refer to
the “PIC16F88X Memory Programming Specification”
(DS41287).
A typical In-Circuit Serial Programming connection is
shown in Figure 14-11.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT(4)
INT pin
INTF flag
(INTCON<1>)
GIE bit
(INTCON<7>)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(3)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 0005h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Oscillator mode assumed.
2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC and RC Oscillator modes.
3: GIE = 1 assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = 0, execution will continue in-line.
4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference.
Note: The entire data EEPROM and Flash
program memory will be erased when the
code protection is switched from on to off.
See the “PIC16F88X Memory
Programming Specification” (DS41287) for
more information.
PIC16F882/883/884/886/887
DS41291G-page 232 2006-2012 Microchip Technology Inc.
FIGURE 14-11: TYPICAL IN-CIRCUIT
SERIAL
PROGRAMMING™
CONNECTION
14.10 Low-Voltage (Single-Supply) ICSP
Programming
The LVP bit of the Configuration Word enables
low-voltage ICSP programming. This mode allows the
microcontroller to be programmed via ICSP using a
VDD source in the operating voltage range. This only
means that VPP does not have to be brought to VIHH but
can instead be left at the normal operating voltage. In
this mode, the RB3/PGM pin is dedicated to the
programming function and ceases to be a general
purpose I/O pin. During programming, VDD is applied to
the MCLR pin. To enter Programming mode, VDD must
be applied to the RB3/PGM provided the LVP bit is set.
The LVP bit defaults to on (‘1’) from the factory.
If Low-Voltage Programming mode is not used, the LVP
bit can be programmed to a ‘0’ and RB3/PGM becomes
a digital I/O pin. However, the LVP bit may only be
programmed when programming is entered with VIHH
on MCLR. The LVP bit can only be charged when using
high voltage on MCLR.
It should be noted, that once the LVP bit is programmed
to ‘0’, only the High-Voltage Programming mode is
available and only High-Voltage Programming mode
can be used to program the device.
When using low-voltage ICSP, the part must be
supplied at 4.5V to 5.5V if a bulk erase will be executed.
This includes reprogramming of the code-protect bits
from an on state to an off state. For all other cases of
low-voltage ICSP, the part may be programmed at the
normal operating voltage. This means calibration
values, unique user IDs or user code can be
reprogrammed or added.
External
Connector
Signals
To N or ma l
Connections
To N or ma l
Connections
PIC16F882/883/
VDD
VSS
RE3/MCLR/VPP
RB6
RB7
+5V
0V
VPP
CLK
Data I/O
* * *
*
* Isolation devices (as required)
884/886/887
Note 1: The High-Voltage Programming mode is
always available, regardless of the state
of the LVP bit, by applying VIHH to the
MCLR pin.
2: While in Low-Voltage ICSP mode, the
RB3 pin can no longer be used as a
general purpose I/O pin.
3: When using Low-Voltage ICSP Program-
ming (LVP) and the pull-ups on PORTB
are enabled, bit 3 in the TRISB register
must be cleared to disable the pull-up on
RB3 and ensure the proper operation of
the device.
4: RB3 should not be allowed to float if LVP
is enabled. An external pull-down device
should be used to default the device to
normal operating mode. If RB3 floats
high, the PIC16F882/883/884/886/887
devices will enter Programming mode.
5: LVP mode is enabled by default on all
devices shipped from Microchip. It can be
disabled by clearing the LVP bit in the
CONFIG register.
2006-2012 Microchip Technology Inc. DS41291G-page 233
PIC16F882/883/884/886/887
14.11 In-Circuit Debugger
The PIC16F882/883/884/886/887-ICD can be used in
any of the package types. The devices will be mounted
on the target application board, which in turn has a 3 or
4-wire connection to the ICD tool.
When the debug bit in the Configuration Word
(CONFIG<13>) is programmed to a ‘0’, the In-Circuit
Debugger functionality is enabled. This function allows
simple debugging functions when used with MPLAB®
ICD 2. When the microcontroller has this feature
enabled, some of the resources are not available for
general use. See Table 14-10 for more detail.
For more information, see “Using MPLAB® ICD 2”
(DS51265), available on Microchip’s web site
(www.microchip.com).
14.11.1 ICD PINOUT
The devices in the PIC16F88X family carry the
circuitry for the In-Circuit Debugger on-chip and on
existing device pins. This eliminates the need for a
separate die or package for the ICD device. The pinout
for the ICD device is the same as the devices (see
Section 1.0 “Device Overview” for complete pinout
and pin descriptions). Table 14-10 shows the location
and function of the ICD related pins on the 28 and 40
pin devices.
TABLE 14-10: PIC16F883/884/886/887-ICD PIN DESCRIPTIONS
Note: The user’s application must have the
circuitry required to support ICD
functionality. Once the ICD circuitry is
enabled, normal device pin functions on
RB6/ICSPCLK and RB7/ICSPDAT will not
be usable. The ICD circuitry uses these pins
for communication with the ICD2 external
debugger.
Pin (PDIP)
Name Type Pull-up Description
PIC16F884/887 PIC16F882/883/886
40 28 ICDDATA TTL — In-Circuit Debugger Bidirectional data
39 27 ICDCLK ST — In-Circuit Debugger Bidirectional clock
11MCLR/VPP HV — Programming voltage
11,32 20 VDD P—
12,31 8,19 VSS P—
Legend: TTL = TTL input buffer, ST = Schmitt Trigger input buffer, P = Power, HV = High Voltage
PIC16F882/883/884/886/887
DS41291G-page 234 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 235
PIC16F882/883/884/886/887
15.0 INSTRUCTION SET SUMMARY
The PIC16F882/883/884/886/887 instruction set is
highly orthogonal and is comprised of three basic
categories:
•Byte-oriented operations
•Bit-oriented operations
•Literal and control operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instruction type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
is presented in Figure 15-1, while the various opcode
fields are summarized in Table 15-1 .
Table 15-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W register. If ‘d’ is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instruction cycle consists of four oscillator periods;
for an oscillator frequency of 4 MHz, this gives a normal
instruction execution time of 1 s. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
15.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
For example, a CLRF PORTA instruction will read
PORTA, clear all the data bits, then write the result
back to PORTA. This example would have the unin-
tended consequence of clearing the condition that set
the RAIF flag.
TABLE 15-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 15-1: GENERAL FORMAT FOR
INSTRUCTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16F882/883/884/886/887
DS41291G-page 236 2006-2012 Microchip Technology Inc.
TABLE 15-2: PIC16F882/883/884/886/887 INSTRUCTION SET
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
–
k
k
k
–
k
–
–
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present
on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external
device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
2006-2012 Microchip Technology Inc. DS41291G-page 237
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15.2 Instruction Descriptions
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bit literal ‘k’
and the result is placed in the
W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If
‘d’ is ‘1’, the result is stored back
in register ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the eight-bit literal
‘k’. The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is discarded, and a NOP
is executed instead, making this a
two-cycle instruction.
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BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP
is executed instead, making this a
two-cycle instruction.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call Subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits <10:0>. The upper bits of
the PC are loaded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z)
is set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the
Watchdog Timer. It also resets
the prescaler of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’,
the result is stored back in
register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’,
the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
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DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, then a NOP is
executed instead, making it a
two-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Affected: None
Description: GOTO is an unconditional branch.
The eleven-bit immediate value is
loaded into PC bits <10:0>. The
upper bits of PC are loaded from
PCLATH<4:3>. GOTO is a
two-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
incremented. If ‘d’ is ‘0’, the result
is placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, a NOP is executed
instead, making it a two-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the eight-bit literal ‘k’.
The result is placed in the
W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ is ‘0’, the result is
placed in the W register. If ‘d’ is
‘1’, the result is placed back in
register ‘f’.
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MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register ‘f’ is
moved to a destination dependent
upon the status of ‘d’. If d = 0,
destination is W register. If d = 1,
the destination is file register ‘f’
itself. d = 1 is useful to test a file
register since status flag Z is
affected.
Words: 1
Cycles: 1
Example:MOVF FSR, 0
After Instruction
W= value in FSR
register
Z= 1
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The eight-bit literal ‘k’ is loaded into
W register. The “don’t cares” will
assemble as ‘0’s.
Words: 1
Cycles: 1
Example:MOVLW 0x5A
After Instruction
W= 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to
register ‘f’.
Words: 1
Cycles: 1
Example:MOVW
F
OPTION
Before Instruction
OPTION = 0xFF
W = 0x4F
After Instruction
OPTION = 0x4F
W = 0x4F
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example:NOP
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RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is
POPed and Top-of-Stack (TOS)
is loaded in the PC. Interrupts are
enabled by setting Global
Interrupt Enable bit, GIE
(INTCON<7>). This is a two-cycle
instruction.
Words: 1
Cycles: 2
Example:RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains
table
;offset value
• ;W now has
• ;table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ;End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack
is POPed and the top of the stack
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
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RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
Words: 1
Cycles: 1
Example:RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are
rotated one bit to the right through
the Carry flag. If ‘d’ is ‘0’, the
result is placed in the W register.
If ‘d’ is ‘1’, the result is placed
back in register ‘f’.
Register fC
Register fC
SLEEP Enter Sleep mode
Syntax: [ label ] SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD
is cleared. Time-out Status bit,
TO is set. Watchdog Timer and
its prescaler are cleared.
The processor is put into Sleep
mode with the oscillator stopped.
SUBLW Subtract W from literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C = 0W k
C = 1W k
DC = 0W<3:0> k<3:0>
DC = 1W<3:0> k<3:0>
C = 0W f
C = 1W f
DC = 0W<3:0> f<3:0>
DC = 1W<3:0> f<3:0>
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SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is
‘0’, the result is placed in the W
register. If ‘d’ is ‘1’, the result is
placed in register ‘f’.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register
are XOR’ed with the eight-bit
literal ‘k’. The result is placed in
the W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If ‘d’ is
‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
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NOTES:
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16.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Programmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits, and Starter Kits
16.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-Circuit Debugger (sold separately)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Extensive on-line help
• Integration of select third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assembly)
• One-touch compile or assemble, and download to
emulator and simulator tools (automatically
updates all project information)
• Debug using:
- Source files (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
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16.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
16.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of digital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol information that is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
processor, and one-step driver, and can run on multiple
platforms.
16.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
source files
• Directives that allow complete control over the
assembly process
16.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLAB C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
16.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the assembler to produce its object file. The assembler
generates relocatable object files that can then be
archived or linked with other relocatable object files and
archives to create an executable file. Notable features
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich directive set
• Flexible macro language
• MPLAB IDE compatibility
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16.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
16.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated Development Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
16.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
devices. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nected to the design engineer's PC using a high-speed
USB 2.0 interface and is connected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 supports all
MPLAB ICD 2 headers.
16.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most affordable price point using the powerful graphical
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
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16.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The PICkit™ 2 Development Programmer/Debugger is
a low-cost development tool with an easy to use inter-
face for programming and debugging Microchip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 families of 8-bit, 16-bit, and 32-bit
microcontrollers, and many Microchip Serial EEPROM
products. With Microchip’s powerful MPLAB Integrated
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file registers can be examined and modified.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
16.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages and a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices and incorporates an MMC card for file
storage and data applications.
16.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
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17.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V
Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V
Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)
Total power dissipation(1) ............................................................................................................................... 800 mW
Maximum current out of VSS pin ...................................................................................................................... 95 mA
Maximum current into VDD pin ......................................................................................................................... 95 mA
Input clamp current, IIK (VI < 0 or VI > VDD)20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD)20 mA
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum output current sunk by any I/O PIN................................................................................................... 25 mA
Maximum output current sourced by any I/O pin ............................................................................................. 25 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC16F882/883/884/886/887
DS41291G-page 250 2006-2012 Microchip Technology Inc.
FIGURE 17-1: PIC16F882/883/884/886/887 VOLTAGE-FREQUENCY GRAPH,
-40°C
TA
+125°C
FIGURE 17-2: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
5.5
2.0
3.5
2.5
0
3.0
4.0
4.5
5.0
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
82010
125
25
2.0
0
60
85
VDD (V)
4.0 5.04.5
Temperature (°C)
2.5 3.0 3.5 5.5
± 1%
± 2%
± 5%
2006-2012 Microchip Technology Inc. DS41291G-page 251
PIC16F882/883/884/886/887
17.1 DC Characteristics: PIC16F882/883/884/886/887-I (Industrial)
PIC16F882/883/884/886/887-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
D001
D001C
D001D
VDD Supply Voltage 2.0
2.0
3.0
4.5
—
—
—
—
5.5
5.5
5.5
5.5
V
V
V
V
FOSC < = 8 MHz: HFINTOSC, EC
FOSC < = 4 MHz
FOSC < = 10 MHz
FOSC < = 20 MHz
D002* VDR RAM Data Retention
Voltage(1)
1.5 — — V Device in Sleep mode
D003 VPOR VDD Start Voltage to
ensure internal Power-on
Reset signal
—VSS —VSee Section 14.2.1 “Power-on Reset
(POR)” for details.
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 — — V/ms See Section 14.2.1 “Power-on Reset
(POR)” for details.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
PIC16F882/883/884/886/887
DS41291G-page 252 2006-2012 Microchip Technology Inc.
17.2 DC Characteristics: PIC16F882/883/884/886/887-I (Industrial)
PIC16F882/883/884/886/887-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max. Units
Conditions
VDD Note
D010 Supply Current (IDD)(1, 2) —13 19A2.0FOSC = 32 kHz
LP Oscillator mode
—2230A3.0
—3360A5.0
D011* — 180 250 A2.0F
OSC = 1 MHz
XT Oscillator mode
— 290 400 A3.0
— 490 650 A5.0
D012 — 280 380 A2.0F
OSC = 4 MHz
XT Oscillator mode
— 480 670 A3.0
—0.91.4mA5.0
D013* — 170 295 A2.0F
OSC = 1 MHz
EC Oscillator mode
— 280 480 A3.0
— 470 690 A5.0
D014 — 290 450 A2.0F
OSC = 4 MHz
EC Oscillator mode
— 490 720 A3.0
—0.851.3 mA 5.0
D015 — 8 20 A2.0F
OSC = 31 kHz
LFINTOSC mode
—1640A3.0
—3165A5.0
D016* — 416 520 A2.0F
OSC = 4 MHz
HFINTOSC mode
— 640 840 A3.0
—1.131.6 mA 5.0
D017 — 0.65 0.9 mA 2.0 FOSC = 8 MHz
HFINTOSC mode
— 1.01 1.3 mA 3.0
— 1.86 2.3 mA 5.0
D018 — 340 580 A2.0F
OSC = 4 MHz
EXTRC mode(3)
— 550 900 A3.0
—0.921.4 mA 5.0
D019 — 3.8 4.7 mA 4.5 FOSC = 20 MHz
HS Oscillator mode
—4.04.8mA5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can
be extended by the formula IR = VDD/2REXT (mA) with REXT in k
2006-2012 Microchip Technology Inc. DS41291G-page 253
PIC16F882/883/884/886/887
17.3 DC Characteristics: PIC16F882/883/884/886/887-I (Industrial)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
Param
No. Device Characteristics Min. Typ† Max. Units
Conditions
VDD Note
D020 Power-down Base
Current(IPD)(2)
— 0.05 1.2 A 2.0 WDT, BOR, Comparators, VREF and
T1OSC disabled
— 0.15 1.5 A3.0
— 0.35 1.8 A5.0
— 150 500 nA 3.0 -40°C TA +25°C
D021 — 1.0 2.2 A 2.0 WDT Current(1)
—2.04.0A3.0
—3.07.0A5.0
D022 — 42 60 A 3.0 BOR Current(1)
— 85 122 A5.0
D023 — 32 45 A 2.0 Comparator Current(1), both
comparators enabled
—6078A3.0
— 120 160 A5.0
D024 — 30 36 A2.0CV
REF Current(1) (high range)
—4555A3.0
—7595A5.0
D025* — 39 47 A2.0CV
REF Current(1) (low range)
—5972A3.0
— 98 124 A5.0
D026 — 2.0 5.0 A 2.0 T1OSC Current(1), 32.768 kHz
—2.55.5A3.0
—3.07.0A5.0
D027 — 0.30 1.6 A 3.0 A/D Current(1), no conversion in
progress
— 0.36 1.9 A5.0
D028 — 90 125 A 3.0 VP6 Reference Current
— 125 162 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
PIC16F882/883/884/886/887
DS41291G-page 254 2006-2012 Microchip Technology Inc.
17.4 DC Characteristics: PIC16F882/883/884/886/887-E (Extended)
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C for extended
Param
No. Device Characteristics Min. Typ† Max. Units
Conditions
VDD Note
D020E Power-down Base
Current (IPD)(2)
—0.05 9A 2.0 WDT, BOR, Comparators, VREF and
T1OSC disabled
—0.15 11 A3.0
—0.35 15 A5.0
D021E — 1 28 A 2.0 WDT Current(1)
—230A3.0
—335A5.0
D022E — 42 65 A 3.0 BOR Current(1)
—85127A5.0
D023E — 32 45 A 2.0 Comparator Current(1), both
comparators enabled
—6078A3.0
—120160A5.0
D024E — 30 70 A2.0CV
REF Current(1) (high range)
—4590A3.0
—75120A5.0
D025E* — 39 91 A2.0CV
REF Current(1) (low range)
—59117A3.0
—98156A5.0
D026E — 3.5 18 A 2.0 T1OSC Current(1), 32.768 kHz
—4.0 21 A3.0
—5.0 24 A5.0
D027E — 0.30 12 A 3.0 A/D Current(1), no conversion in
progress
—0.36 16 A5.0
D028E — 90 130 A 3.0 VP6 Reference Current
—125170A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this
peripheral is enabled. The peripheral current can be determined by subtracting the base IDD or IPD
current from this limit. Max values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD.
2006-2012 Microchip Technology Inc. DS41291G-page 255
PIC16F882/883/884/886/887
17.5 DC Characteristics: PIC16F882/883/884/886/887-I (Industrial)
PIC16F882/883/884/886/887-E (Extended)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O Port:
D030 with TTL buffer Vss — 0.8 V 4.5V VDD 5.5V
D030A Vss — 0.15 VDD V2.0V VDD 4.5V
D031 with Schmitt Trigger buf-
fer
Vss — 0.2 VDD V2.0V VDD 5.5V
D032 MCLR, OSC1 (RC mode)(1) VSS —0.2 VDD V
D033 OSC1 (XT and LP modes) VSS —0.3V
D033A OSC1 (HS mode) VSS —0.3 VDD V
VIH Input High Voltage
I/O ports: —
D040 with TTL buffer 2.0 — VDD V4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 — VDD V2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD —VDD V2.0V VDD 5.5V
D042 MCLR 0.8 VDD —VDD V
D043 OSC1 (XT and LP modes) 1.6 — VDD V
D043A OSC1 (HS mode) 0.7 VDD —VDD V
D043B OSC1 (RC mode) 0.9 VDD —VDD V(Note 1)
IIL Input Leakage Current(2)
D060 I/O ports — 0.1 1AVSS VPIN VDD,
Pin at high-impedance
D061 MCLR(3) —0.1 5AVSS VPIN VDD
D063 OSC1 — 0.1 5AVSS VPIN VDD, XT, HS and
LP oscillator configuration
D070* IPUR PORTB Weak Pull-up Cur-
rent
50 250 400 AVDD = 5.0V, VPIN = VSS
VOL Output Low Voltage(5)
D080 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V
(Ind.)
VOH Output High Voltage(5)
D090 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V
(Ind.)
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an
external clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
4: See Section 10.3.1 “Using the Data EEPROM” for additional information.
5: Including OSC2 in CLKOUT mode.
PIC16F882/883/884/886/887
DS41291G-page 256 2006-2012 Microchip Technology Inc.
D100 IULP Ultra Low-Power Wake-Up
Current
— 200 — nA See Application Note AN879,
“Using the Microchip Ultra
Low-Power Wake-up Module”
(DS00879)
Capacitive Loading Specs
on Output Pins
D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A
*
CIO All I/O pins — — 50 pF
Data EEPROM Memory
D120 EDByte Endurance 100K 1M — E/W -40°C TA +85°C
D120A EDByte Endurance 10K 100K — E/W +85°C TA +125°C
D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON1 to read/write
VMIN = Minimum operating
voltage
D122 TDEW Erase/Write Cycle Time — 5 6 ms
D123 TRETD Characteristic Retention 40 — — Year Provided no other
specifications are violated
D124 TREF Number of Total Erase/Write
Cycles before Refresh(4)
1M 10M — E/W -40°C TA +85°C
Program Flash Memory
D130 EPCell Endurance 10K 100K — E/W -40°C TA +85°C
D130A EDCell Endurance 1K 10K — E/W +85°C TA +125°C
D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating
voltage
D132 VPEW VDD for Row Erase/Write VMIN —5.5V
VDD for Bulk Erase Opera-
tions
4.5 — 5.5 V
D133 TPEW Erase/Write cycle time — 2 2.5 ms
D134 TRETD Characteristic Retention 40 — — Year Provided no other
specifications are violated
17.5 DC Characteristics: PIC16F882/883/884/886/887-I (Industrial)
PIC16F882/883/884/886/887-E (Extended) (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an
external clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels
represent normal operating conditions. Higher leakage current may be measured at different input voltages.
4: See Section 10.3.1 “Using the Data EEPROM” for additional information.
5: Including OSC2 in CLKOUT mode.
2006-2012 Microchip Technology Inc. DS41291G-page 257
PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No. Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance
Junction to Ambient
47.2 C/W 40-pin PDIP package
24.4 C/W 44-pin QFN package
45.8 C/W 44-pin TQFP package
60.2 C/W 28-pin PDIP package
80.2 C/W 28-pin SOIC package
89.4 C/W 28-pin SSOP package
29 C/W 28-pin QFN package
TH02 JC Thermal Resistance
Junction to Case
24.7 C/W 40-pin PDIP package
20.0 C/W 44-pin QFN package
14.5 C/W 44-pin TQFP package
29 C/W 28-pin PDIP package
23.8 C/W 28-pin SOIC package
23.9 C/W 28-pin SSOP package
20.0 C/W 28-pin QFN package
TH03 TJJunction Temperature 150 C For derated power calculations
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/OI/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD -
VOH))
TH07 PDER Derated Power — W PDER = (TJ - TA)/JA
(NOTE 2, 3)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
PIC16F882/883/884/886/887
DS41291G-page 258 2006-2012 Microchip Technology Inc.
17.7 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 17-3: LOAD CONDITIONS
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O PORT t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
FFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
V
SS
C
L
Legend: CL= 50 pF for all pins
15 pF for OSC2 output
Load Condition
Pin
2006-2012 Microchip Technology Inc. DS41291G-page 259
PIC16F882/883/884/886/887
17.8 AC Characteristics: PIC16F882/883/884/886/887 (Industrial, Extended)
FIGURE 17-4: CLOCK TIMING
TABLE 17-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 37 kHz LP Oscillator mode
DC — 4 MHz XT Oscillator mode
DC — 20 MHz HS Oscillator mode
DC — 20 MHz EC Oscillator mode
Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode
0.1 — 4 MHz XT Oscillator mode
1 — 20 MHz HS Oscillator mode
DC — 4 MHz RC Oscillator mode
OS02 T
OSC External CLKIN Period(1) 27 — • s LP Oscillator mode
250 — • ns XT Oscillator mode
50 — • ns HS Oscillator mode
50 — • ns EC Oscillator mode
Oscillator Period(1) —30.5 — s LP Oscillator mode
250 — 10,000 ns XT Oscillator mode
50 — 1,000 ns HS Oscillator mode
250 — — ns RC Oscillator mode
OS03 T
CY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TosH,
Tos L
External CLKIN High,
External CLKIN Low
2——s LP oscillator
100 — — ns XT oscillator
20 — — ns HS oscillator
OS05* TosR,
Tos F
External CLKIN Rise,
External CLKIN Fall
0 — • ns LP oscillator
0 — • ns XT oscillator
0 — • ns HS oscillator
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and
are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for
all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03
OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
PIC16F882/883/884/886/887
DS41291G-page 260 2006-2012 Microchip Technology Inc.
TABLE 17-2: OSCILLATOR PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Freq.
Tolerance Min. Typ† Max. Units Conditions
OS06 TWARM Internal Oscillator Switch
when running(3)
———2TOSC Slowest clock
OS07 TSC Fail-Safe Sample Clock
Period(1) ——21—msLFINTOSC/64
OS08 HFOSC Internal Calibrated
HFINTOSC Frequency(2)
1% 7.92 8.0 8.08 MHz VDD = 3.5V, 25°C
2% 7.84 8.0 8.16 MHz 2.5V VDD 5.5V,
0°C T
A +85°C
5% 7.60 8.0 8.40 MHz 2.0V VDD 5.5V,
-40°C T
A +85°C (Ind.),
-40°C T
A +125°C (Ext.)
OS09* LFOSC Internal Uncalibrated
LFINTOSC Frequency
— 153145kHz
OS10* TIOSC
ST
HFINTOSC Oscillator
Wake-up from Sleep
Start-up Time
— 5.5 12 24 sVDD = 2.0V, -40°C to +85°C
—3.5714sVDD = 3.0V, -40°C to +85°C
—3611sV
DD = 5.0V, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are
based on characterization data for that particular oscillator type under standard operating conditions with the
device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or
higher than expected current consumption. All devices are tested to operate at “min” values with an external
clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock)
for all devices.
2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the
device as possible. 0.1 F and 0.01 F values in parallel are recommended.
3: By design.
2006-2012 Microchip Technology Inc. DS41291G-page 261
PIC16F882/883/884/886/887
FIGURE 17-5: CLKOUT AND I/O TIMING
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
TABLE 17-3: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS11 TOSH2CKLFOSC to CLKOUT (1) — — 70 ns VDD = 5.0V
OS12 T
OSH2CKHFOSC to CLKOUT (1) — — 72 ns VDD = 5.0V
OS13 T
CKL2IOVCLKOUT to Port out valid(1) — — 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15* T
OSH2IOVFOSC (Q1 cycle) to Port out valid — 50 70 ns VDD = 5.0V
OS16 T
OSH2IOIFOSC (Q2 cycle) to Port input invalid
(I/O in hold time)
50 — — ns VDD = 5.0V
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle)
(I/O in setup time)
20 — — ns
OS18 TIOR Port output rise time(2) —
—
15
40
72
32
ns VDD = 2.0V
VDD = 5.0V
OS19 TIOF Port output fall time(2) —
—
28
15
55
30
ns VDD = 2.0V
VDD = 5.0V
OS20* TINP INT pin input high or low time 25 — — ns
OS21* TRAP PORTA interrupt-on-change new
input level time
TCY ——ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x T
OSC.
2: Includes OSC2 in CLKOUT mode.
PIC16F882/883/884/886/887
DS41291G-page 262 2006-2012 Microchip Technology Inc.
FIGURE 17-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 17-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Watchdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33*
37
* 64 ms delay only if PWRTE bit in the Configuration Word Register 1 is programmed to ‘0’.
Reset
(due to BOR)
VBOR + VHYST
2006-2012 Microchip Technology Inc. DS41291G-page 263
PIC16F882/883/884/886/887
TABLE 17-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
30 TMCLMCLR Pulse Width (low) 2
5
—
—
—
—
s
s
VDD = 5V, -40°C to +85°C
VDD = 5V
31 TWDT Watchdog Timer Time-out
Period (No Prescaler)
10
10
16
16
29
31
ms
ms
VDD = 5V, -40°C to +85°C
VDD = 5V
32 T
OST Oscillation Start-up Timer
Period(1, 2)
—1024—TOSC (NOTE 3)
33* TPWRT Power-up Timer Period 40 65 140 ms
34* TIOZ I/O High-impedance from
MCLR Low or Watchdog
Timer Reset
——2.0s
35 VBOR Brown-out Reset Voltage 2.0 — 2.2 V BOR4V bit = 0 (NOTE 4)
3.6 4.0 4.4 V BOR4V bit = 1, -40°C to +85°C
(NOTE 4)
3.6 4.0 4.5 V BOR4V bit = 1, -40°C to +125°C
(NOTE 4)
36* VHYST Brown-out Reset Hysteresis — 50 — mV
37* TBOR Brown-out Reset Minimum
Detection Period
100 — — sVDD VBOR
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-
ation and/or higher than expected current consumption. All devices are tested to operate at “min” values
with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time
limit is “DC” (no clock) for all devices.
2: By design.
3: Period of the slower clock.
4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device
as possible. 0.1 F and 0.01 F values in parallel are recommended.
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FIGURE 17-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 17-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler
15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous,
with Prescaler
15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period
Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
(1, 2, 4, 8)
Asynchronous 60 — — ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
— 32.768 — kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
2 TOSC —7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
2006-2012 Microchip Technology Inc. DS41291G-page 265
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FIGURE 17-9: CAPTURE/COMPARE/PWM TIMINGS (ECCP)
TABLE 17-6: CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP)
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
CC01* TccL CCP1 Input Low Time No Prescaler 0.5T
CY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCP1 Input High Time No Prescaler 0.5T
CY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCP1 Input Period 3TCY + 40
N
— — ns N = prescale
value (1, 4 or
16)
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 17-3 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP1
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TABLE 17-7: COMPARATOR SPECIFICATIONS
TABLE 17-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS
TABLE 17-9: VOLTAGE (VR) REFERENCE SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristics Min. Typ† Max. Units Comments
CM01 VOS Input Offset Voltage — 5.0 10 mV (VDD - 1.5)/2
CM02 VCM Input Common Mode Voltage 0 — VDD - 1.5 V
CM03* CMRR Common Mode Rejection Ratio +55 — — dB
CM04* TRT Response Time Falling — 150 600 ns (NOTE 1)
Rising — 200 1000 ns
CM05* TMC2COV Comparator Mode Change to
Output Valid
—— 10 s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Response time is measured with one comparator input at (VDD - 1.5)/2 - 100 mV to (VDD -1.5)/2+20mV.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristics Min. Typ† Max. Units Comments
CV01* CLSB Step Size(2) —
—
VDD/24
VDD/32
—
—
V
V
Low Range (VRR = 1)
High Range (VRR = 0)
CV02* CACC Absolute Accuracy —
—
—
—
1/2
1/2
LSb
LSb
Low Range (VRR = 1)
High Range (VRR = 0)
CV03* CRUnit Resistor Value (R) — 2k —
CV04* CST Settling Time(1) ——10s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guid-
ance only and are not tested.
Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’.
2: See Section 8.10 “Comparator Voltage Reference” for more information.
VR Voltage Reference Specifications Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Symbol Characteristics Min. Typ. Max. Units Comments
VR01 VROUT VR voltage output 0.5 0.6 0.7 V
VR02* T
STABLE Settling Time — 10 100* s
* These parameters are characterized but not tested.
2006-2012 Microchip Technology Inc. DS41291G-page 267
PIC16F882/883/884/886/887
TABLE 17-10: PIC16F882/883/884/886/887 A/D CONVERTER (ADC) CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD01 NRResolution — — 10 bits bit
AD02 EIL Integral Error — — ±1 LSb VREF = 5.12V
AD03 EDL Differential Error — — ±1 LSb No missing codes to 10 bits
VREF = 5.12V
AD04 EOFF Offset Error 0 +1.5 +3.0 LSb VREF = 5.12V
AD07 EGN Gain Error — — ±1 LSb VREF = 5.12V
AD06
AD06A
VREF Reference Voltage(3) 2.2
2.7
——
VDD
V
Absolute minimum to ensure 1 LSb
accuracy
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended
Impedance of Analog
Voltage Source
—— 10k
AD09* IREF VREF Input Current(3) 10 — 1000 ADuring VAIN acquisition.
Based on differential of VHOLD to VAIN.
—— 50A During A/D conversion cycle.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input.
4: When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module.
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TABLE 17-11: PIC16F882/883/884/886/887 A/D CONVERSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD130* T
AD A/D Clock Period 1.6 — 9.0 sTOSC-based, VREF 3.0V
3.0 — 9.0 sTOSC-based, VREF full range
A/D Internal RC
Oscillator Period 3.0 6.0 9.0 s
ADCS<1:0> = 11 (ADRC mode)
At VDD = 2.5V
1.6 4.0 6.0 sAt VDD = 5.0V
AD131 TCNV Conversion Time
(not including
Acquisition Time)(1)
—11—TAD Set GO/DONE bit to new data in A/D
Result register
AD132* TACQ Acquisition Time 11.5 — s
AD133* T
AMP Amplifier Settling Time — — 5 s
AD134 TGO Q4 to A/D Clock Start —
—
TOSC/2
TOSC/2 + TCY
—
—
—
— If the A/D clock source is selected as
RC, a time of TCY is added before the
A/D clock starts. This allows the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
2: See Section 9.3 “A/D Acquisition Requirements” for minimum conditions.
2006-2012 Microchip Technology Inc. DS41291G-page 269
PIC16F882/883/884/886/887
FIGURE 17-10: PIC16F882/883/884/886/887 A/D CONVERSION TIMING (NORMAL MODE)
FIGURE 17-11: PIC16F882/883/884/886/887 A/D CONVERSION TIMING (SLEEP MODE)
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
987 3210
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
6
AD134 (TOSC/2(1))
1 TCY
AD132
AD132
AD131
AD130
BSF ADCON0, GO
Q4
A/D CLK
A/D Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3210
Note 1: If the A/D clock source is selected as RC, a time of T
CY is added before the A/D clock starts. This allows the
SLEEP instruction to be executed.
AD134
6
8
1 TCY
(TOSC/2 + TCY(1))
1 TCY
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FIGURE 17-12: EUSART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 17-12: EUSART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 17-13: EUSART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 17-13: EUSART SYNCHRONOUS RECEIVE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C T
A +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
120 TCKH2DT
V
SYNC XMIT (Master & Slave)
Clock high to data-out valid
—40ns
121 TCKRF Clock out rise time and fall time (Master mode) — 20 ns
122 TDTRF Data-out rise time and fall time — 20 ns
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C T
A +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
125 TDTV2CKL SYNC RCV (Master & Slave)
Data-hold before CK (DT hold time) 10 — ns
126 TCKL2DTL Data-hold after CK (DT hold time) 15 — ns
Note: Refer to Figure 17-3 for load conditions.
121 121
120 122
RC6/TX/CK
RC7/RX/DT
pin
pin
Note: Refer to Figure 17-3 for load conditions.
125
126
RC6/TX/CK
RC7/RX/DT
pin
pin
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FIGURE 17-14: SPI MASTER MODE TIMING (CKE = 0, SMP = 0)
FIGURE 17-15: SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76
78
79
80
79
78
MSb LSb
bit 6 - - - - - -1
MSb In LSb In
bit 6 - - - -1
Note: Refer to Figure 17-3 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
75, 76
78
80
MSb
79
73
bit 6 - - - - - -1 LSb
Note: Refer to Figure 17-3 for load conditions.
73
74
MSb In LSb In
bit 6 - - - -1
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FIGURE 17-16: SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 17-17: SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73
74
75, 76 77
78
79
80
79
78
MSb LSb
bit 6 - - - - - -1
MSb In bit 6 - - - -1 LSb In
83
Note: Refer to Figure 17-3 for load conditions.
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
74
75, 76
MSb bit 6 - - - - - -1 LSb
77
MSb In bit 6 - - - -1 LSb In
80
83
Note: Refer to Figure 17-3 for load conditions.
2006-2012 Microchip Technology Inc. DS41291G-page 273
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TABLE 17-14: SPI MODE REQUIREMENTS
FIGURE 17-18: I2C™ BUS START/STOP BITS TIMING
Param
No. Symbol Characteristic Min. Typ† Max. Units Conditions
70* T
SSL2SCH,
T
SSL2SCL
SS to SCK or SCK input TCY ——ns
71* T
SCH SCK input high time (Slave mode) TCY + 20 — — ns
72* T
SCL SCK input low time (Slave mode) TCY + 20 — — ns
73* TDIV2SCH,
TDIV2SCL
Setup time of SDI data input to SCK edge 100 — — ns
74* T
SCH2DIL,
T
SCL2DIL
Hold time of SDI data input to SCK edge 100 — — ns
75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns
2.0-5.5V — 25 50 ns
76* TDOF SDO data output fall time — 10 25 ns
77* T
SSH2DOZSS to SDO output high-impedance 10 — 50 ns
78* TSCR SCK output rise time
(Master mode)
3.0-5.5V — 10 25 ns
2.0-5.5V — 25 50 ns
79* T
SCF SCK output fall time (Master mode) — 10 25 ns
80* TSCH2DOV,
T
SCL2DOV
SDO data output valid after
SCK edge
3.0-5.5V — — 50 ns
2.0-5.5V — — 145 ns
81* TDOV2SCH,
TDOV2SCL
SDO data output setup to SCK edge Tcy — — ns
82* T
SSL2DOV SDO data output valid after SS edge — — 50 ns
83* T
SCH2SSH,
T
SCL2SSH
SS after SCK edge 1.5TCY + 40 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note: Refer to Figure 17-3 for load conditions.
91
92
93
SCL
SDA
Start
Condition
Stop
Condition
90
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TABLE 17-15: I2C™ BUS START/STOP BITS REQUIREMENTS
FIGURE 17-19: I2C™ BUS DATA TIMING
Param
No. Symbol Characteristic Min. Typ. Max. Unit
sConditions
90* T
SU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for Repeated
Start condition
Setup time 400 kHz mode 600 — —
91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first
clock pulse is generated
Hold time 400 kHz mode 600 — —
92* T
SU:STO Stop condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
93 THD:STO Stop condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 17-3 for load conditions.
90
91 92
100
101
103
106 107
109 109
110
102
SCL
SDA
In
SDA
Out
2006-2012 Microchip Technology Inc. DS41291G-page 275
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TABLE 17-16: I2C™ BUS DATA REQUIREMENTS
Param.
No. Symbol Characteristic Min. Max. Units Conditions
100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a
minimum of 10 MHz
SSP Module 1.5T
CY —
101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a
minimum of 10 MHz
SSP Module 1.5TCY —
102* TRSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
103* TFSDA and SCL fall
time
100 kHz mode — 300 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
90* TSU:STA Start condition
setup time
100 kHz mode 4.7 — s Only relevant for
Repeated Start condition
400 kHz mode 0.6 — s
91* THD:STA Start condition hold
time
100 kHz mode 4.0 — s After this period the first
clock pulse is generated
400 kHz mode 0.6 — s
106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data input setup
time
100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
92* TSU:STO Stop condition
setup time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* TAA Output valid from
clock
100 kHz mode — 3500 ns (Note 1)
400 kHz mode — — ns
110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 — s
CBBus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system, but the
requirement T
SU:DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it
must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the
Standard mode I2C bus specification), before the SCL line is released.
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NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 277
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18.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
“Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.”
represents (mean + 3) or (mean - 3) respectively, where is a standard deviation, over each temper-
ature range.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
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DS41291G-page 278 2006-2012 Microchip Technology Inc.
FIGURE 18-1: TYPICAL IDD vs. FOSC OVER VDD (EC MODE)
FIGURE 18-2: MAXIMUM IDD vs. FOSC OVER VDD (EC MODE)
Typical 2V3V4V5V5.5V
1Mhz 0.086 0.153 0.220 0.277 0.310
2Mhz 0.150 0.2596 0.3718 0.4681 0.5236
4Mhz 0.279 0.472 0.675 0.850 0.951
6Mhz 0.382 0.635 0.903 1.135 1.269
8Mhz 0.486 0.798 1.132 1.420 1.587
10Mhz 0.589 0.961 1.360 1.706 1.905
12Mhz 0.696 1.126 1.596 2.005 2.241
14Mhz 0.802 1.291 1.832 2.304 2.577
16Mhz 0.908 1.457 2.068 2.603 2.913
18Mhz 1.017 1.602 2.268 2.848 3.185
20Mhz 1.126 1.748 2.469 3.093 3.458
Max 2V3V4V5V5.5V
1Mhz 0.168 0.236 0.315 0.412 0.452
2Mhz 0.261 0.394 0.537 0.704 0.780
4Mhz 0.449 0.710 0.981 1.287 1.435
6Mhz 0.577 0.972 1.331 1.739 1.950
8Mhz 0.705 1.233 1.682 2.191 2.465
10Mhz 0.833 1.495 2.032 2.642 2.979
12Mhz 0.956 1.711 2.372 3.101 3.506
14Mhz 1.078 1.926 2.713 3.560 4.032
16Mhz 1.201 2.142 3.054 4.018 4.558
18Mhz 1.305 2.326 3.295 4.324 4.887
20Mhz 1.409 2.510 3.536 4.630
EC Mode
3V
4V
5V
5.5V
2V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz
VDD (V)
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
3V
4V
5V
5.5V
2V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz
VDD (V)
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2006-2012 Microchip Technology Inc. DS41291G-page 279
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FIGURE 18-3: TYPICAL IDD vs. FOSC OVER VDD (HS MODE)
FIGURE 18-4: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE)
3V 3.5V 4V 4.5V 5V 5.5V
0.567660978 0.6909750.8211857610.9883470541.0462473761.119615457
1.1610564131.4069334781.6664380432.0030751092.1193190652.268818804
2.883088587 3.03554863 3.23775
3.74139 3.967407543
HS Mode
3V
3.5V
4V
4.5V
5V
5.5V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
4 MHz 10 MHz 16 MHz 20 Mhz
FOSC
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
3V 3.5V 4V 4.5V 5V 5.5V
0.8868608641.0693043161.2645617521.4868166111.5076394231.520959608
1.6176371031.9623642592.3355493582.7630868222.8139211682.849632041
3.8375797553.9157601913.967889512
4.685048474 4.78069621
HS Mode
3V
3.5V
4V
4.5V
5V
5.5V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
4 MHz 10 MHz 16 MHz 20 MHz
FOSC
IDD (mA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291G-page 280 2006-2012 Microchip Technology Inc.
FIGURE 18-5: TYPICAL IDD vs. VDD OVER FOSC (XT MODE)
FIGURE 18-6: MAXIMUM IDD vs. VDD OVER FOSC (XT MODE)
2 2.5 3 3.5 4 4.5 5 5.5
180.1774 235.0683 289.9592 337.753 385.547 436.866 488.184 554.8964
283.7333 382.484 481.2347 577.923 674.6106 783.831 893.052 1033.15
Vdd
2 2.5 3 3.5 4 4.5 5 5.5
244.8837 320.7132 396.5426 461.707 526.8719 587.642 648.412 724.0755
375.529 522.3721 669.2152 822.619 976.0232 1163.67 1351.32
XT Mode
1 MHz
4 MHz
0
200
400
600
800
1,000
1,200
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
DD
(V)
I
DD
(uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Temp) + 3
(-40×C to 125×C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
XT Mode
4 MHz
1 MHz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2006-2012 Microchip Technology Inc. DS41291G-page 281
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FIGURE 18-7: TYPICAL IDD vs. VDD OVER FOSC (EXTRC MODE)
FIGURE 18-8: MAXIMUM IDD vs. VDD (EXTRC MODE)
(EXTRC Mode)
1 MHz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
4 MHz
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
1 MHz
4 MHz
0
200
400
600
800
1,000
1,200
1,400
1,600
1,800
2,000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Temp) + 3
(-40×C to 125×C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
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FIGURE 18-9: IDD vs. VDD OVER FOSC (LFINTOSC MODE, 31 kHz)
FIGURE 18-10: IDD vs. VDD (LP MODE)
LFINTOSC Mode, 31KHZ
Typical
Maximum
0
10
20
30
40
50
60
70
80
VDD (V)
IDD (A)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0
10
20
30
40
50
60
70
80
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
32 kHz Maximum
32 kHz Typical
2006-2012 Microchip Technology Inc. DS41291G-page 283
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FIGURE 18-11: TYPICAL IDD vs. FOSC OVER VDD (HFINTOSC MODE)
FIGURE 18-12: MAXIMUM IDD vs. FOSC OVER VDD (HFINTOSC MODE)
4V 5V 5.5V
197.9192604299.82617 395.019 496.999 574.901
210.9124688 324.4079 431.721 544.182 620.66
239.9707708369.77809 491.538 623.314 717.723
298.6634479460.30461 619.714 793.635 901.409
414.3997292639.99889 878.13 1127.53 1275.6
649.86985881014.4002 1421.21 1858.97 2097.71
2V 3V 4V 5V 5.5V
HFINTOSC
2V
3V
4V
5V
5.5V
0
500
1,000
1,500
2,000
2,500
125 kHz 25 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz
VDD (V)
IDD (uA)
Typical: Statistical Mean @25×C
Maximum: Mean (Worst Case Temp) + 3
(-40×C to 125×C)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
HFINTOSC
2V
3V
4V
5V
5.5V
0
500
1,000
1,500
2,000
2,500
3,000
125 kHz 250 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz
VDD (V)
IDD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
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FIGURE 18-13: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED)
FIGURE 18-14: MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED)
Typical
(Sleep Mode all Peripherals Disabled)
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V
DD
(V)
I
PD
(uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
0.00
Maximum
(Sleep Mode all Peripherals Disabled)
Max. 125°C
Max. 85°C
0
2
4
6
8
10
12
14
16
18
2.02.5 3.03.5 4.04.5 5.05.5
VDD (V)
IPD (A)
Maximum: Mean + 3
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2006-2012 Microchip Technology Inc. DS41291G-page 285
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FIGURE 18-15: COMPARATOR IPD vs. VDD (BOTH COMPARATORS ENABLED)
FIGURE 18-16: BOR IPD vs. VDD OVER TEMPERATURE
Typical Max
31.9 43.9
45.6 60.8
59.3 77.7
73.0 95.8
86.7 113.8
100.4 131.8
114.1 149.9
127.7
Typical
Maximum
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
0
20
40
60
80
100
120
140
160
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (A)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
Maximum
Typical
PIC16F882/883/884/886/887
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FIGURE 18-17: TYPICAL WDT IPD vs. VDD (25°C)
FIGURE 18-18: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE
Typical Max 85×C Max 125×C
21.007 2.140 27.702
2.5 1.146 2.711 29.079
31.285 3.282 30.08
3.5 1.449 3.899 31.347
41.612 4.515 32.238
4.5 1.924 5.401 33.129
52.237 6.288 34.02
5.5 2.764 7.776
0.0
0.5
1.0
1.5
2.0
2.5
3.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Max. 125°C
Max. 85°C
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Maximum: Mean + 3
Maximum: Mean + 3
2006-2012 Microchip Technology Inc. DS41291G-page 287
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FIGURE 18-19: WDT PERIOD vs. VDD OVER TEMPERATURE
FIGURE 18-20: WDT PERIOD vs. TEMPERATURE (VDD = 5.0V)
WDT Time-out Period
Typical
10
12
14
16
18
20
22
24
26
28
30
32
2.02.53.03.54.04.55.05.5
VDD (V)
Time (ms)
Maximum: Mean + 3(-40°C to 125°C)
Max. (125°C)
Max. (85°C)
Minimum
Vdd = 5V
Maximum
Typical
Minimum
10
12
14
16
18
20
22
24
26
28
30
-40°C 25°C 85°C 125°C
Temperature (°C)
Time (ms)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
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FIGURE 18-21: CVREF IPD vs. VDD OVER TEMPERATURE (HIGH RANGE)
FIGURE 18-22: CVREF IPD vs. VDD OVER TEMPERATURE (LOW RANGE)
Max 85×C Max 125×C
35.8 68.0
44.8 77.3
53.8 86.5
62.8 94.3
71.8 102.1
81.0 109.8
90.1 117.6
99.2 125.1
Max 85×C Max 125×C
46.5 86.4
58.3 98.1
70.0 109.9
High Range
Typical
Max. 85°C
0
20
40
60
80
100
120
140
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
Max. 125°C
low Range
Typical
Max. 85°C
Max. 125°C
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2006-2012 Microchip Technology Inc. DS41291G-page 289
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FIGURE 18-23: TYPICAL VP6 REFERENCE IPD vs. VDD (25°C)
FIGURE 18-24: MAXIMUM VP6 REFERENCE IPD vs. VDD OVER TEMPERATURE
VP6 Reference IPD vs. VDD (25×C)
0
20
40
60
80
100
120
140
160
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical
Max VP6 Reference IPD vs. VDD Over Temperature
0
20
40
60
80
100
120
140
160
180
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Max 125C
Max 85C
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FIGURE 18-25: T1OSC IPD vs. VDD OVER TEMPERATURE (32 kHz)
FIGURE 18-26: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V)
Typ 25×C Max 85×C Max 125×C
2 2.022 4.98 17.54
2.5 2.247 5.23 19.02
3 2.472 5.49 20.29
3.5 2.453 5.79 21.50
4 2.433 6.08 22.45
4.5 2.711 6.54 23.30
5 2.989 7.00 24.00
5.5 3.112 7.34 Typ. 25°C
Max. 85°C
Max. 125°C
0
5
10
15
20
25
30
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
(VDD = 3V, -40×C TO 125×C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Max. 85°C
Max. 125°C
Typical 25°C
Min. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean + 3
2006-2012 Microchip Technology Inc. DS41291G-page 291
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FIGURE 18-27: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V)
FIGURE 18-28: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
IOL (mA)
VOL (V)
Typical: Statistical Mean
Maximum: Means + 3
Typical: Statistical Mean @25°C
Maximum: Mean + 3
Max. 85°C
Typ. 25°C
Min. -40°C
Max. 125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0
IOH (mA)
VOH (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
PIC16F882/883/884/886/887
DS41291G-page 292 2006-2012 Microchip Technology Inc.
FIGURE 18-29: VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V)
FIGURE 18-30: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
(, )
3.0
3.5
4.0
4.5
5.0
5.5
-5.0-4.5-4.0-3.5-3.0-2.5-2.0-1.5-1.0-0.50.0
IOH (mA)
VOH (V)
Max. -40°C
Typ. 25°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
(TTL Input, -40×C TO 125×C)
0.5
0.7
0.9
1.1
1.3
1.5
1.7
2.02.5 3.03.5 4.04.5 5.05.5
VDD (V)
VIN (V)
Typ. 25°C
Max. -40°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
2006-2012 Microchip Technology Inc. DS41291G-page 293
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FIGURE 18-31: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE
FIGURE 18-32: COMPARATOR RESPONSE TIME (RISING EDGE)
(ST Input, -40×C TO 125×C)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max. 125°C
VIH Min. -40°C
VIL Min. 125°C
VIL Max. -40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
V- input = Transition from VCM + 100MV to VCM - 20MV
V+ input = VCM
4 200 278 639 846
5.5 140 202 531
0
100
200
300
400
500
600
700
800
900
1,000
2.0 2.5 4.0 5.5
VDD (Volts)
Response Time (nS)
Max. (85°C)
Typ. (25°C)
Min. (-40°C)
Max. (125°C)
Note:
V- input = Transition from VCM + 100MV to VCM - 20MV
V+ input = VCM
VCM = VDD - 1.5V)/2
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FIGURE 18-33: COMPARATOR RESPONSE TIME (FALLING EDGE)
FIGURE 18-34: LFINTOSC FREQUENCY vs. VDD OVER TEMPERATURE (31 kHz)
Vdd -40×C 25×C 85×C 125×C
2 279 327 547 557
2.5 226 267 425 440
4 172 204 304 319
5.5 119 142 182
0
100
200
300
400
500
600
2.0 2.5 4.0 5.5
VDD (Volts)
Response Time (nS)
Max. (85°C)
Typ. (25°C)
Min. (-40°C)
Note:
V- input = Transition from VCM - 100MV to VCM + 20MV
V+ input = VCM
VCM = VDD - 1.5V)/2
Max. (125°C)
LFINTOSC 31Khz
0
5,000
10,000
15,000
20,000
25,000
30,000
35,000
40,000
45,000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Frequency (Hz)
Max. -40°C
Typ. 25°C
Min. 85°C
Min. 125°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3
2006-2012 Microchip Technology Inc. DS41291G-page 295
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FIGURE 18-35: ADC CLOCK PERIOD vs. VDD OVER TEMPERATURE
FIGURE 18-36: TYPICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
0
2
4
6
8
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
25°C
85°C
125°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
(-40°C to 125°C)
0
2
4
6
8
10
12
14
16
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
85°C
25°C
-40°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3
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DS41291G-page 296 2006-2012 Microchip Technology Inc.
FIGURE 18-37: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
FIGURE 18-38: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE
-40C to +85C
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
-40°C
85°C
25°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case) + 3
-40C to +85C
0
1
2
3
4
5
6
7
8
9
10
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Time (s)
-40°C
25°C
85°C
Typical: Statistical Mean @25°C
Maximum: Mean (Worst-case Temp) + 3
2006-2012 Microchip Technology Inc. DS41291G-page 297
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FIGURE 18-39: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (25°C)
FIGURE 18-40: TYPICAL HFINTOSC FREQUENCY CHANGE OVER DEVICE VDD (85°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
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DS41291G-page 298 2006-2012 Microchip Technology Inc.
FIGURE 18-41: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (125°C)
FIGURE 18-42: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (-40°C)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
-5
-4
-3
-2
-1
0
1
2
3
4
5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Change from Calibration (%)
2006-2012 Microchip Technology Inc. DS41291G-page 299
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FIGURE 18-43: TYPICAL VP6 REFERENCE VOLTAGE vs. VDD (25°C)
FIGURE 18-44: VP6 DRIFT OVER TEMPERATURE NORMALIZED AT 25°C (VDD 5V)
VP6 Reference Voltage vs. VDD (25×C)
0.55
0.56
0.57
0.58
0.59
0.60
0.61
0.62
0.63
0.64
0.65
23455.5
VDD (V)
VP6 (V)
Typical
-1
0
1
2
3
4
-40 025 85 125
Temperature in Degrees C
Change from Nominal in %
-2
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DS41291G-page 300 2006-2012 Microchip Technology Inc.
FIGURE 18-45: VP6 DRIFT OVER TEMPERATURE NORMALIZED AT 25°C (VDD 3V)
FIGURE 18-46: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 25°C)
-1
0
1
2
3
4
-40 025 85 125
Temperature in Degrees C
Change from Nominal in %
-2
Typical VP6 Reference Voltage Distribution (VDD=3V, 25×C)
0
5
10
15
20
25
30
35
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
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FIGURE 18-47: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 85°C)
FIGURE 18-48: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, 125°C)
Typical VP6 Reference Voltage Distribution (VDD=3V, 85×C)
0
5
10
15
20
25
30
35
40
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=3V, 125×C)
0
5
10
15
20
25
30
35
40
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
PIC16F882/883/884/886/887
DS41291G-page 302 2006-2012 Microchip Technology Inc.
FIGURE 18-49: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (3V, -40°C)
FIGURE 18-50: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 25°C)
Typical VP6 Reference Voltage Distribution (VDD=3V, -40×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=5V, 25×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
2006-2012 Microchip Technology Inc. DS41291G-page 303
PIC16F882/883/884/886/887
FIGURE 18-51: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 85°C)
FIGURE 18-52: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, 125°C)
Typical VP6 Reference Voltage Distribution (VDD=5V, 85×C)
0
5
10
15
20
25
30
35
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
Typical VP6 Reference Voltage Distribution (VDD=5V, 25×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
PIC16F882/883/884/886/887
DS41291G-page 304 2006-2012 Microchip Technology Inc.
FIGURE 18-53: TYPICAL VP6 REFERENCE VOLTAGE DISTRIBUTION (5V, -40°C)
Typical VP6 Reference Voltage Distribution (VDD=5V, -40×C)
0
5
10
15
20
25
30
0.500
0.510
0.520
0.530
0.540
0.550
0.560
0.570
0.580
0.590
0.600
0.610
0.620
0.630
0.640
0.650
0.660
0.670
0.680
0.690
0.700
Voltage (V)
Number of Parts
Parts=118
2006-2012 Microchip Technology Inc. DS41291G-page 305
PIC16F882/883/884/886/887
19.0 PACKAGING INFORMATION
19.1 Package Marking Information
28-Lead SOIC (7.50 mm) Example
YYWWNNN
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
28-Lead SSOP (5.30 mm) Example
28-Lead SPDIP (.300”) Example
3
e
PIC16F883
1231220
-I/P
PIC16F886/SO
1231220
3
e
PIC16F883
-I/SS
1231220
3
e
*Standard PICmicro® device marking consists of Microchip part number, year code, week code and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
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PIC16F882/883/884/886/887
DS41291G-page 306 2006-2012 Microchip Technology Inc.
19.1 Package Marking Information (Continued)
28-Lead QFN (6x6 mm) Example
XXXXXXXX
XXXXXXXX
YYWWNNN
PIN 1 PIN 1
40-Lead PDIP (600 mil) Example
XXXXXXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
44-Lead QFN (8x8x0.9 mm) Example
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
XXXXXXXXXXX
PIN 1 PIN 1
16F886
/ML
1231220
3
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1231220
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1231220
3
e
*Standard PICmicro® device marking consists of Microchip part number, year code, week code and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
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2006-2012 Microchip Technology Inc. DS41291G-page 307
PIC16F882/883/884/886/887
19.1 Package Marking Information (Continued)
44-Lead TQFP (10x10x1 mm) Example
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
PIC16F887
-I/PT
1231220
3
e
*Standard PICmicro® device marking consists of Microchip part number, year code, week code and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
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PIC16F882/883/884/886/887
DS41291G-page 308 2006-2012 Microchip Technology Inc.
19.2 Package Details
The following sections give the technical details of the packages.
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PIC16F882/883/884/886/887
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PIC16F882/883/884/886/887
DS41291G-page 310 2006-2012 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2012 Microchip Technology Inc. DS41291G-page 311
PIC16F882/883/884/886/887
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F882/883/884/886/887
DS41291G-page 312 2006-2012 Microchip Technology Inc.
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2006-2012 Microchip Technology Inc. DS41291G-page 313
PIC16F882/883/884/886/887
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F882/883/884/886/887
DS41291G-page 314 2006-2012 Microchip Technology Inc.
2006-2012 Microchip Technology Inc. DS41291G-page 315
PIC16F882/883/884/886/887
PIC16F882/883/884/886/887
DS41291G-page 316 2006-2012 Microchip Technology Inc.
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2006-2012 Microchip Technology Inc. DS41291G-page 319
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2006-2012 Microchip Technology Inc. DS41291G-page 321
PIC16F882/883/884/886/887
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F882/883/884/886/887
DS41291G-page 322 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 323
PIC16F882/883/884/886/887
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (5/2006)
Initial release of this data sheet.
Revision B (7/2006)
Pin Diagrams (44-Pin QFN drawing); Revised Table
2-1, Addr. 1DH (CCP2CON); Section 3.0, 3.1; Section
3.4.4.6; Table 3; Table 3-1 (ANSEL); Table 3-3
(CCP2CON); Register 3-1; Register 3.2; Register 3-3;
Register 3-4; Register 3-9; Register 3-10; Register
3-11; Register 3-12; Register 3-14; Table 3-5 (ANSEL);
Figure 3-5; Figure 3-11; Figure 8-2; Figure 8-3; Figure
9-1; Register 9-1; Section 9.1.4; Example 10-4; Figure
11-5; Table 11-5 (P1M); Section 11.5.2; Section 11.5.7,
Number 4; Table 11-7 (CCP2CON); Section 12.3.1
(Para. 3); Figure 12-6 (Title); Sections 14.2, 14.3 and
14.4 DC Characteristics (Max); Table 14-4 (OSCCON);
Section 14.3 (TMR0); Section 14.3.2 (TMR0).
Revision C
Section 19.0 Packaging Information: Replaced
package drawings and added note.
Added PIC16F882 part number.
Replaced PICmicro with PIC.
Revision D
Replaced Package Drawings (Rev. AM); Replaced
Development Support Section; Revised Product ID
Section.
Revision E (01/2008)
Added Char Data; Removed Preliminary status;
Revised Device Table (PIC16F882, I/O); Revised the
following: Pin Diagram 44 TQFP, pin 30; Table 5, I/O
RA7; Table 1-1, RA1 and RA4; Section 2.2.1; Register
2-3, INTCON; Example 3-1; Section 3.2.2; Example
3-2; Figure 6-1; Section 6.2.2; Section 6.6; Section
8.10.3; Table 9-1; Equation 11-1; Added Figure 11-14
and renumbered remaining Figures; Register 11-3;
Register 13-3; Section 14.0; Section 14.1; Section
14.9; Section 14.10; Section 17.0; Updated Package
Drawings.
Revision F (04/2009)
Revised Product ID: Removed ‘F’ (std. voltage range)
from part numbers; Revised Figure 6-1: Timer1 Block
Diagram; Revised Figure 8-3, Comparator C2 Block
Diagram; Added note to Section 8.10.3; Revised
Section 8.10.7.
Revision G (10/2012)
Updated data sheet to new format; Updated Register
13-1 and Register 13-2; Updated the Packaging
Information section; Updated the Product Identification
System section; Other minor corrections.
PIC16F882/883/884/886/887
DS41291G-page 324 2006-2012 Microchip Technology Inc.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This discusses some of the issues in migrating from
other PIC devices to the PIC16F88X Family of devices.
B.1 PIC16F87X to PIC16F88X
TABLE B-1: FEATURE COMPARISON
Feature PIC16F87X PIC16F88X
Max Operating Speed 20 MHz 20 MHz
Max Program
Memory (Words)
8192 8192
SRAM (bytes) 368 368
A/D Resolution 10-bit 10-bit
Data EEPROM (Bytes) 256 256
Timers (8/16-bit) 2/1 2/1
Oscillator Modes 4 8
Brown-out Reset Y Y (2.1V/4V)
Software Control Option
of WDT/BOR
NY
Internal Pull-ups RB<7:4> RB<7:0>,
MCLR
Interrupt-on-change RB<7:4> RB<7:0>
Comparator 2 2
References CVREF CVREF and
VP6
ECCP/CCP 0/2 1/1
Ultra Low-Power
Wake-Up
NY
Extended WDT N Y
INTOSC Frequencies N 32 kHz-8 MHz
Clock Switching N Y
MSSP Standard w/Slave
Address Mask
USART AUSART EUSART
ADC Channels 8 14
Note: This device has been designed to perform
to the parameters of its data sheet. It has
been tested to an electrical specification
designed to determine its conformance
with these parameters. Due to process
differences in the manufacture of this
device, this device may have different
performance characteristics than its earlier
version. These differences may cause this
device to perform differently in your
application than the earlier version of this
device.
2006-2012 Microchip Technology Inc. DS41291G-page 325
PIC16F882/883/884/886/887
INDEX
A
A/D
Specifications.................................................... 267, 268
Absolute Maximum Ratings .............................................. 249
AC Characteristics
Industrial and Extended ............................................ 259
Load Conditions ........................................................ 258
ACKSTAT ......................................................................... 202
ACKSTAT Status Flag ...................................................... 202
ADC .................................................................................. 103
Acquisition Requirements ......................................... 111
Associated Registers ................................................ 113
Block Diagram........................................................... 103
Calculating Acquisition Time..................................... 111
Channel Selection..................................................... 104
Configuration............................................................. 104
Configuring Interrupt ................................................. 107
Conversion Clock...................................................... 104
Conversion Procedure .............................................. 107
Internal Sampling Switch (RSS) Impedance.............. 111
Interrupts................................................................... 105
Operation .................................................................. 106
Operation During Sleep ............................................ 106
Port Configuration ..................................................... 104
Reference Voltage (VREF)......................................... 104
Result Formatting...................................................... 106
Source Impedance.................................................... 111
Special Event Trigger................................................ 106
Starting an A/D Conversion ...................................... 106
ADCON0 Register............................................................. 108
ADCON1 Register............................................................. 109
ADRESH Register (ADFM = 0)......................................... 110
ADRESH Register (ADFM = 1)......................................... 110
ADRESL Register (ADFM = 0).......................................... 110
ADRESL Register (ADFM = 1).......................................... 110
Analog Input Connection Considerations............................ 95
Analog-to-Digital Converter. See ADC
ANSEL Register.................................................................. 42
ANSELH Register ............................................................... 50
Assembler
MPASM Assembler................................................... 246
B
Baud Rate Generator........................................................ 199
BAUDCTL Register........................................................... 166
BF ..................................................................................... 202
BF Status Flag .................................................................. 202
Block Diagrams
(CCP) Capture Mode Operation ............................... 130
ADC .......................................................................... 103
ADC Transfer Function ............................................. 112
Analog Input Model ............................................. 95, 112
Auto-Shutdown ......................................................... 145
Baud Rate Generator................................................ 199
CCP PWM................................................................. 132
Clock Source............................................................... 65
Comparator C1 ........................................................... 90
Comparator C1 and ADC Voltage Reference ........... 100
Comparator C2 ........................................................... 90
Compare ................................................................... 131
Crystal Operation ........................................................ 68
EUSART Receive ..................................................... 156
EUSART Transmit .................................................... 155
External RC Mode ...................................................... 69
Fail-Safe Clock Monitor (FSCM)................................. 75
In-Circuit Serial Programming Connections ............. 232
Interrupt Logic........................................................... 225
MSSP (I2C Master Mode)......................................... 197
MSSP (I2C Mode)..................................................... 193
MSSP (SPI Mode) .................................................... 187
On-Chip Reset Circuit............................................... 216
PIC16F883/886 .......................................................... 16
PIC16F884/887 .......................................................... 17
PWM (Enhanced) ..................................................... 136
RA0 Pins..................................................................... 44
RA1 Pin ...................................................................... 45
RA2 Pin ...................................................................... 45
RA3 Pin ...................................................................... 46
RA4 Pin ...................................................................... 46
RA5 Pin ...................................................................... 47
RA6 Pin ...................................................................... 47
RA7 Pin ...................................................................... 48
RB0, RB1, RB2, RB3 Pins.......................................... 52
RB4, RB5, RB6, RB7 Pins.......................................... 54
RC0 Pin ...................................................................... 56
RC1 Pin ...................................................................... 56
RC2 Pin ...................................................................... 56
RC3 Pin ...................................................................... 57
RC4 Pin ...................................................................... 57
RC5 Pin ...................................................................... 57
RC6 Pin ...................................................................... 58
RC7 Pin ...................................................................... 58
RD0, RD1, RD2, RD3, RD4 Pins................................ 60
RD5, RD6, RD7 Pins.................................................. 60
RE3 Pin ...................................................................... 62
Resonator Operation .................................................. 68
Timer1 ........................................................................ 81
Timer2 ........................................................................ 87
TMR0/WDT Prescaler ................................................ 77
Watchdog Timer (WDT)............................................ 228
Break Character (12-bit) Transmit and Receive ............... 173
BRG .................................................................................. 199
Brown-out Reset (BOR).................................................... 218
Associated ................................................................ 219
Specifications ........................................................... 263
Timing and Characteristics ....................................... 262
Bus Collision During a Repeated Start Condition ............. 210
Bus Collision During a Start Condition.............................. 208
Bus Collision During a Stop Condition.............................. 211
C
C Compilers
MPLAB C18.............................................................. 246
Capture Module. See Enhanced Capture/Compare/PWM
(ECCP)
Capture/Compare/PWM (CCP)
Associated Registers w/ Capture, Compare and
Timer1 .............................................................. 153
Associated Registers w/ PWM and Timer2 .............. 153
Capture Mode........................................................... 130
CCP Pin Configuration ............................................. 130
Compare Mode......................................................... 131
CCP Pin Configuration ..................................... 131
Software Interrupt Mode........................... 130, 131
Special Event Trigger ....................................... 131
Timer1 Mode Selection............................. 130, 131
Prescaler .................................................................. 130
PIC16F882/883/884/886/887
DS41291G-page 326 2006-2012 Microchip Technology Inc.
PWM Mode ............................................................... 132
Duty Cycle.........................................................133
Effects of Reset.................................................135
Example PWM Frequencies and
Resolutions, 20 MHZ ................................ 134
Example PWM Frequencies and
Resolutions, 8 MHz................................... 134
Operation in Sleep Mode .................................. 135
Setup for Operation...........................................135
System Clock Frequency Changes................... 135
PWM Period..............................................................132
Setup for PWM Operation......................................... 135
Timer Resources....................................................... 129
CCP1CON (Enhanced) Register....................................... 128
CCP2CON Register .......................................................... 129
Clock Accuracy with Asynchronous Operation ................. 164
Clock Sources
External Modes ........................................................... 67
EC ....................................................................... 67
HS ....................................................................... 68
LP........................................................................ 68
OST..................................................................... 67
RC....................................................................... 69
XT ....................................................................... 68
Internal Modes ............................................................ 69
Frequency Selection ........................................... 71
HFINTOSC.......................................................... 69
HFINTOSC/LFINTOSC Switch Timing ...............71
INTOSC .............................................................. 69
INTOSCIO........................................................... 69
LFINTOSC .......................................................... 71
Clock Switching...................................................................73
CM1CON0 Register ............................................................ 93
CM2CON0 Register ............................................................ 94
CM2CON1 Register ............................................................ 96
Code Examples
A/D Conversion......................................................... 107
Assigning Prescaler to Timer0 .................................... 78
Assigning Prescaler to WDT ....................................... 78
Changing Between Capture Prescalers .................... 130
Indirect Addressing .....................................................39
Initializing PORTA....................................................... 41
Initializing PORTB....................................................... 49
Initializing PORTC....................................................... 55
Initializing PORTD....................................................... 59
Initializing PORTE....................................................... 61
Loading the SSPBUF Register ................................. 188
Saving STATUS and W Registers in RAM ............... 227
Ultra Low-Power Wake-up Initialization ...................... 43
Write Verify ............................................................... 124
Writing to Flash Program Memory ............................123
Code Protection ................................................................ 231
Comparator
C2OUT as T1 Gate ...............................................82, 96
Effects of a Reset........................................................ 93
Operation .................................................................... 89
Operation During Sleep .............................................. 93
Response Time ........................................................... 91
Specifications ............................................................ 266
Synchronizing COUT w/Timer1 .................................. 96
Comparator Module ............................................................ 89
Associated Registers ................................................102
C1 Output State Versus Input Conditions ................... 91
Comparator Voltage Reference (CVREF) ............................ 99
Effects of a Reset........................................................ 93
Comparator Voltage Reference (CVREF)
Response Time........................................................... 91
Comparator Voltage Reference (CVREF)
Specifications ........................................................... 266
Compare Module. See Enhanced Capture/Compare/PWM
(ECCP)
CONFIG1 Register ........................................................... 214
CONFIG2 Register ........................................................... 215
Configuration Bits ............................................................. 214
CPU Features................................................................... 213
Customer Change Notification Service............................. 333
Customer Notification Service .......................................... 333
Customer Support............................................................. 333
D
Data EEPROM Memory.................................................... 115
Associated Registers ................................................ 125
Code Protection ........................................................ 124
Reading .................................................................... 118
Writing ...................................................................... 118
Data Memory ...................................................................... 24
DC Characteristics
Extended .................................................................. 254
Industrial ................................................................... 253
Industrial and Extended ............................ 251, 252, 255
Development Support ....................................................... 245
Device Overview................................................................. 15
E
ECCP. See Enhanced Capture/Compare/PWM
ECCPAS Register............................................................. 146
EEADR Register ............................................................... 116
EEADR Registers ............................................................. 115
EEADRH Registers........................................................... 115
EECON1 Register..................................................... 115, 117
EECON2 Register............................................................. 115
EEDAT Register ............................................................... 116
EEDATH Register............................................................. 116
EEPROM Data Memory
Avoiding Spurious Write ........................................... 124
Write Verify ............................................................... 124
Effects of Reset
PWM mode............................................................... 135
Electrical Specifications .................................................... 249
Enhanced Capture/Compare/PWM .................................. 127
Enhanced Capture/Compare/PWM (ECCP)
Enhanced PWM Mode.............................................. 136
Auto-Restart ..................................................... 147
Auto-shutdown.................................................. 145
Direction Change in Full-Bridge Output Mode.. 142
Full-Bridge Application...................................... 140
Full-Bridge Mode .............................................. 140
Half-Bridge Application ..................................... 139
Half-Bridge Application Examples .................... 148
Half-Bridge Mode.............................................. 139
Output Relationships (Active-High and
Active-Low)............................................... 137
Output Relationships Diagram.......................... 138
Programmable Dead Band Delay..................... 148
Shoot-through Current...................................... 148
Start-up Considerations.................................... 144
Specifications ........................................................... 265
Timer Resources ...................................................... 127
Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) .............................. 155
Errata .................................................................................. 13
2006-2012 Microchip Technology Inc. DS41291G-page 327
PIC16F882/883/884/886/887
EUSART ........................................................................... 155
Associated Registers
Baud Rate Generator........................................ 167
Asynchronous Mode ................................................. 157
12-bit Break Transmit and Receive .................. 173
Associated Registers
Receive..................................................... 163
Transmit.................................................... 159
Auto-Wake-up on Break ................................... 172
Baud Rate Generator (BRG) ............................ 167
Clock Accuracy ................................................. 164
Receiver............................................................ 160
Setting up 9-bit Mode with Address Detect....... 162
Transmitter........................................................ 157
Baud Rate Generator (BRG)
Auto Baud Rate Detect ..................................... 171
Baud Rate Error, Calculating ............................ 167
Baud Rates, Asynchronous Modes .................. 168
Formulas........................................................... 167
High Baud Rate Select (BRGH Bit) .................. 167
Synchronous Master Mode ............................... 175, 179
Associated Registers
Receive..................................................... 178
Transmit.................................................... 176
Reception.......................................................... 177
Requirements, Synchronous Receive .............. 270
Requirements, Synchronous Transmission ...... 270
Timing Diagram, Synchronous Receive ........... 270
Timing Diagram, Synchronous Transmission ... 270
Transmission .................................................... 175
Synchronous Slave Mode
Associated Registers
Receive..................................................... 180
Transmit.................................................... 179
Reception.......................................................... 180
Transmission .................................................... 179
F
Fail-Safe Clock Monitor....................................................... 75
Fail-Safe Condition Clearing ....................................... 75
Fail-Safe Detection ..................................................... 75
Fail-Safe Operation..................................................... 75
Reset or Wake-up from Sleep..................................... 75
Firmware Instructions........................................................ 235
Flash Program Memory .................................................... 115
Writing....................................................................... 121
Fuses. See Configuration Bits
G
General Call Address Support .......................................... 196
General Purpose Register File............................................ 24
I
I2C (MSSP Module)
ACK Pulse......................................................... 193, 194
Addressing ................................................................ 194
Read/Write Bit Information (R/W Bit) ........................ 194
Reception.................................................................. 194
Serial Clock (RC3/SCK/SCL).................................... 194
Slave Mode............................................................... 193
Transmission............................................................. 194
I2C Master Mode Reception.............................................. 202
I2C Master Mode Repeated Start Condition Timing.......... 201
I2C Module
Acknowledge Sequence Timing................................ 205
Baud Rate Generator................................................ 199
BRG Block Diagram ................................................. 199
BRG Reset Due to SDA Arbitration During Start
Condition .......................................................... 209
BRG Timing .............................................................. 199
Bus Collision
Acknowledge .................................................... 207
Repeated Start Condition ................................. 210
Repeated Start Condition Timing (Case1)........ 210
Repeated Start Condition Timing (Case2)........ 210
Start Condition.................................................. 208
Start Condition Timing .............................. 208, 209
Stop Condition .................................................. 211
Stop Condition Timing (Case 1) ....................... 211
Stop Condition Timing (Case 2) ....................... 211
Bus Collision timing .................................................. 207
Clock Arbitration ....................................................... 206
Clock Arbitration Timing (Master Transmit) .............. 206
Effect of a Reset ....................................................... 206
General Call Address Support.................................. 196
Master Mode............................................................. 197
Master Mode 7-bit Reception Timing........................ 204
Master Mode Operation............................................ 198
Master Mode Start Condition Timing ........................ 200
Master Mode Support ............................................... 197
Master Mode Transmission ...................................... 202
Master Mode Transmit Sequence ............................ 198
Multi-Master Mode.................................................... 207
Repeat Start Condition Timing Waveform ................ 201
Sleep Operation........................................................ 206
Stop Condition Receive or Transmit Timing ............. 206
Stop Condition Timing .............................................. 205
Waveforms for 7-bit Reception ................................. 195
Waveforms for 7-bit Transmission ............................ 195
ID Locations...................................................................... 231
In-Circuit Debugger........................................................... 233
In-Circuit Serial Programming (ICSP)............................... 231
Indirect Addressing, INDF and FSR registers..................... 39
Instruction Format............................................................. 235
Instruction Set................................................................... 235
ADDLW..................................................................... 237
ADDWF .................................................................... 237
ANDLW..................................................................... 237
ANDWF .................................................................... 237
MOVF ....................................................................... 240
BCF .......................................................................... 237
BSF........................................................................... 237
BTFSC...................................................................... 237
BTFSS ...................................................................... 238
CALL......................................................................... 238
CLRF ........................................................................ 238
CLRW ....................................................................... 238
CLRWDT .................................................................. 238
COMF ....................................................................... 238
DECF........................................................................ 238
DECFSZ ................................................................... 239
GOTO ....................................................................... 239
INCF ......................................................................... 239
INCFSZ..................................................................... 239
IORLW...................................................................... 239
IORWF...................................................................... 239
MOVLW .................................................................... 240
MOVWF.................................................................... 240
NOP.......................................................................... 240
RETFIE..................................................................... 241
RETLW ..................................................................... 241
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DS41291G-page 328 2006-2012 Microchip Technology Inc.
RETURN ................................................................... 241
RLF ........................................................................... 242
RRF........................................................................... 242
SLEEP ...................................................................... 242
SUBLW ..................................................................... 242
SUBWF ..................................................................... 242
SWAPF ..................................................................... 243
XORLW..................................................................... 243
XORWF..................................................................... 243
Summary Table......................................................... 236
INTCON Register ................................................................ 33
Inter-Integrated Circuit. See I2C
Internal Oscillator Block ....................................................260
INTOSC
Specifications.................................................... 261
Internal Sampling Switch (RSS) Impedance ...................... 111
Internet Address................................................................333
Interrupts ........................................................................... 224
ADC .......................................................................... 107
Associated Registers ................................................226
Context Saving..........................................................227
Interrupt-on-Change.................................................... 49
PORTB Interrupt-on-Change .................................... 225
RB0/INT .................................................................... 224
Timer0....................................................................... 225
TMR1 .......................................................................... 83
INTOSC
Specifications ............................................................ 260
INTOSC Specifications ............................................. 260, 261
IOCB Register ..................................................................... 51
L
Load Conditions ................................................................ 258
M
Master Mode ..................................................................... 197
Master Mode Support........................................................ 197
Master Synchronous Serial Port. See MSSP
MCLR ................................................................................ 217
Internal ...................................................................... 217
Memory Organization.......................................................... 23
Data ............................................................................ 24
Program ...................................................................... 23
Microchip Internet Web Site.............................................. 333
Migrating from other PICmicro Devices ............................ 324
MPLAB ASM30 Assembler, Linker, Librarian ................... 246
MPLAB Integrated Development Environment Software .. 245
MPLAB PM3 Device Programmer.....................................248
MPLAB REAL ICE In-Circuit Emulator System.................247
MPLINK Object Linker/MPLIB Object Librarian ................ 246
MSSP ................................................................................ 183
Block Diagram (SPI Mode) ....................................... 187
I2C Mode. See I2C
SPI Mode ..................................................................187
SPI Mode. See SPI
MSSP Module
Control Registers ......................................................183
I2C Operation ............................................................193
SPI Master Mode ...................................................... 189
SPI Slave Mode ........................................................190
Multi-Master Communication, Bus Collision and Bus
Arbitration.................................................................. 207
Multi-Master Mode ............................................................207
O
OPCODE Field Descriptions ............................................. 235
OPTION Register................................................................ 32
OPTION_REG Register...................................................... 79
OSCCON Register.............................................................. 66
Oscillator
Associated Registers.................................... 76, 85, 229
Oscillator Module ................................................................ 65
EC............................................................................... 65
HFINTOSC ................................................................. 65
HS............................................................................... 65
INTOSC ...................................................................... 65
INTOSCIO .................................................................. 65
LFINTOSC .................................................................. 65
LP ............................................................................... 65
RC .............................................................................. 65
RCIO........................................................................... 65
XT ............................................................................... 65
Oscillator Parameters ....................................................... 260
Oscillator Specifications.................................................... 259
Oscillator Start-up Timer (OST)
Specifications ........................................................... 263
Oscillator Switching
Fail-Safe Clock Monitor .............................................. 75
Two-Speed Clock Start-up.......................................... 73
OSCTUNE Register............................................................ 70
P
P1A/P1B/P1C/P1D.See Enhanced Capture/Compare/PWM
(ECCP) ..................................................................... 136
Packaging ......................................................................... 305
Marking ..................................................... 305, 306, 307
PDIP Details ............................................................. 308
PCL and PCLATH............................................................... 39
Stack........................................................................... 39
PCON Register ........................................................... 38, 219
PIE1 Register...................................................................... 34
PIE2 Register...................................................................... 35
Pin Diagram
PIC16F883/886, 28-pin (PDIP, SOIC, SSOP) .............. 3
PIC16F883/886, 28-pin (QFN)...................................... 5
PIC16F884/887, 40-Pin (PDIP) .................................... 7
PIC16F884/887, 44-pin (QFN)...................................... 9
PIC16F884/887, 44-pin (TQFP).................................. 11
Pinout Descriptions
PIC16F883/886 .......................................................... 18
PIC16F884/887 .......................................................... 20
PIR1 Register ..................................................................... 36
PIR2 Register ..................................................................... 37
PORTA ............................................................................... 41
Additional Pin Functions ............................................. 42
ANSEL Register ................................................. 42
Ultra Low-Power Wake-up............................ 42, 43
Associated Registers .................................................. 48
Pin Descriptions and Diagrams .................................. 44
RA0............................................................................. 44
RA1............................................................................. 45
RA2............................................................................. 45
RA3............................................................................. 46
RA4............................................................................. 46
RA5............................................................................. 47
RA6............................................................................. 47
RA7............................................................................. 48
Specifications ........................................................... 261
PORTA Register................................................................. 41
PORTB ............................................................................... 49
Additional Pin Functions ............................................. 49
ANSELH Register............................................... 49
2006-2012 Microchip Technology Inc. DS41291G-page 329
PIC16F882/883/884/886/887
Weak Pull-up ...................................................... 49
Associated Registers .................................................. 54
Interrupt-on-Change.................................................... 49
P1B/P1C/P1D.See Enhanced Capture/Compare/PWM+
(ECCP+) ............................................................. 49
Pin Descriptions and Diagrams................................... 52
RB0 ............................................................................. 52
RB1 ............................................................................. 52
RB2 ............................................................................. 52
RB3 ............................................................................. 52
RB4 ............................................................................. 53
RB5 ............................................................................. 53
RB6 ............................................................................. 53
RB7 ............................................................................. 53
PORTB Register ................................................................. 50
PORTC ............................................................................... 55
Associated Registers .................................................. 58
P1A.See Enhanced Capture/Compare/PWM+
(ECCP+) ............................................................. 55
RC0............................................................................. 56
RC1............................................................................. 56
RC2............................................................................. 56
RC3............................................................................. 57
RC3 Pin..................................................................... 194
RC4............................................................................. 57
RC5............................................................................. 57
RC6............................................................................. 58
RC7............................................................................. 58
Specifications............................................................ 261
PORTC Register ................................................................. 55
PORTD ............................................................................... 59
Associated Registers .................................................. 60
P1B/P1C/P1D.See Enhanced Capture/Compare/
PWM+ (ECCP+) ................................................. 59
RD0, RD1, RD2, RD3, RD4 ........................................ 60
RD5............................................................................. 60
RD6............................................................................. 60
RD7............................................................................. 60
PORTD Register ................................................................. 59
PORTE................................................................................ 61
Associated Registers .................................................. 63
RE0 ............................................................................. 62
RE1 ............................................................................. 62
RE2 ............................................................................. 62
RE3 ............................................................................. 62
PORTE Register ................................................................. 61
Power-Down Mode (Sleep) ............................................... 230
Power-on Reset (POR) ..................................................... 217
Power-up Timer (PWRT) .................................................. 217
Specifications............................................................ 263
Precision Internal Oscillator Parameters........................... 261
Prescaler
Shared WDT/Timer0 ................................................... 78
Switching Prescaler Assignment................................. 78
Program Memory ................................................................ 23
Map and Stack ............................................................ 23
Map and Stack (PIC16F883/884) ............................... 23
Map and Stack (PIC16F886/887) ............................... 23
Programming, Device Instructions .................................... 235
PSTRCON Register .......................................................... 150
Pulse Steering................................................................... 150
PWM (ECCP Module)
Pulse Steering........................................................... 150
Steering Synchronization .......................................... 152
PWM Mode. See Enhanced Capture/Compare/PWM ...... 136
PWM1CON Register......................................................... 149
R
RCREG............................................................................. 162
RCSTA Register ............................................................... 165
Reader Response............................................................. 334
Read-Modify-Write Operations ......................................... 235
Register
RCREG Register ...................................................... 171
Registers
ADCON0 (ADC Control 0) ........................................ 108
ADCON1 (ADC Control 1) ........................................ 109
ADRESH (ADC Result High) with ADFM = 0) .......... 110
ADRESH (ADC Result High) with ADFM = 1) .......... 110
ADRESL (ADC Result Low) with ADFM = 0)............ 110
ADRESL (ADC Result Low) with ADFM = 1)............ 110
ANSEL (Analog Select) .............................................. 42
ANSELH (Analog Select High) ................................... 50
BAUDCTL (Baud Rate Control)................................ 166
CCP1CON (Enhanced CCP1 Control) ..................... 128
CCP2CON (CCP2 Control) ...................................... 129
CM1CON0 (C1 Control) ............................................. 93
CM2CON0 (C2 Control) ............................................. 94
CM2CON1 (C2 Control) ............................................. 96
CONFIG1 (Configuration Word Register 1).............. 214
CONFIG2 (Configuration Word Register 2).............. 215
ECCPAS (Enhanced CCP Auto-shutdown Control) . 146
EEADR (EEPROM Address) .................................... 116
EECON1 (EEPROM Control 1) ................................ 117
EEDAT (EEPROM Data).......................................... 116
EEDATH (EEPROM Data) ....................................... 116
INTCON (Interrupt Control) ........................................ 33
IOCB (Interrupt-on-Change PORTB).......................... 51
OPTION_REG (OPTION)..................................... 32, 79
OSCCON (Oscillator Control)..................................... 66
OSCTUNE (Oscillator Tuning).................................... 70
PCON (Power Control Register)................................. 38
PCON (Power Control) ............................................. 219
PIE1 (Peripheral Interrupt Enable 1) .......................... 34
PIE2 (Peripheral Interrupt Enable 2) .......................... 35
PIR1 (Peripheral Interrupt Register 1) ........................ 36
PIR2 (Peripheral Interrupt Request 2) ........................ 37
PORTA ....................................................................... 41
PORTB ....................................................................... 50
PORTC ....................................................................... 55
PORTD ....................................................................... 59
PORTE ....................................................................... 61
PSTRCON (Pulse Steering Control)......................... 150
PWM1CON (Enhanced PWM Control)..................... 149
RCSTA (Receive Status and Control) ...................... 165
Reset Values ............................................................ 221
Reset Values (special registers) ............................... 223
Special Function Register Map
PIC16F883/884 ............................................ 25, 26
PIC16F886/887 .................................................. 27
Special Function Registers......................................... 24
Special Register Summary
Bank 0 ................................................................ 28
Bank 1 ................................................................ 29
Bank 2 ................................................................ 30
Bank 3 ................................................................ 30
SRCON (SR Latch Control) ........................................ 98
SSPCON (MSSP Control 1) ..................................... 185
SSPCON2 (SSP Control 2) ...................................... 186
SSPMSK (SSP Mask) .............................................. 212
SSPSTAT (SSP Status) ........................................... 184
PIC16F882/883/884/886/887
DS41291G-page 330 2006-2012 Microchip Technology Inc.
STATUS ...................................................................... 31
T1CON ........................................................................ 84
T2CON ........................................................................ 88
TRISA (Tri-State PORTA) ...........................................41
TRISB (Tri-State PORTB) ...........................................50
TRISC (Tri-State PORTC) .......................................... 55
TRISD (Tri-State PORTD) .......................................... 59
TRISE (Tri-State PORTE) ...........................................61
TXSTA (Transmit Status and Control) ...................... 164
VRCON (Voltage Reference Control) ....................... 102
WDTCON (Watchdog Timer Control)........................ 229
WPUB (Weak Pull-up PORTB) ...................................51
Reset................................................................................. 216
Revision History ................................................................ 323
S
SCK................................................................................... 187
SDI .................................................................................... 187
SDO .................................................................................. 187
Serial Clock, SCK.............................................................. 187
Serial Data In, SDI ............................................................ 187
Serial Data Out, SDO........................................................ 187
Serial Peripheral Interface. See SPI
Shoot-through Current ...................................................... 148
Slave Mode General Call Address Sequence................... 196
Slave Select Synchronization............................................ 190
Slave Select, SS ............................................................... 187
Sleep ................................................................................. 230
Wake-up.................................................................... 230
Wake-up Using Interrupts ......................................... 230
Software Simulator (MPLAB SIM)..................................... 247
SPBRG.............................................................................. 167
SPBRGH ........................................................................... 167
Special Event Trigger........................................................ 106
Special Function Registers ................................................. 24
SPI
Master Mode ............................................................. 189
Serial Clock............................................................... 187
Serial Data In ............................................................ 187
Serial Data Out ......................................................... 187
Slave Select .............................................................. 187
SPI clock ................................................................... 189
SPI Mode ..................................................................187
SPI Bus Modes ................................................................. 192
SPI Mode
Associated Registers with SPI Operation ................. 192
Bus Mode Compatibility ............................................ 192
Effects of a Reset......................................................192
Enabling SPI I/O ....................................................... 188
Operation .................................................................. 187
Sleep Operation ........................................................ 192
SPI Module
Slave Mode ............................................................... 190
Slave Select Synchronization ...................................190
Slave Synchronization Timing................................... 190
Slave Timing with CKE = 0 ....................................... 191
Slave Timing with CKE = 1 ....................................... 191
SRCON Register................................................................. 98
SS ..................................................................................... 187
SSP
SSPBUF.................................................................... 189
SSPSR ...................................................................... 189
SSPCON Register.............................................................185
SSPCON2 Register........................................................... 186
SSPMSK Register............................................................. 212
SSPOV.............................................................................. 202
SSPOV Status Flag .......................................................... 202
SSPSTAT Register ........................................................... 184
R/W Bit ..................................................................... 194
STATUS Register ............................................................... 31
T
T1CON Register ................................................................. 84
T2CON Register ................................................................. 88
Thermal Considerations.................................................... 257
Time-out Sequence .......................................................... 219
Timer0................................................................................. 77
Associated Registers .................................................. 79
External Clock............................................................. 78
Interrupt ...................................................................... 79
Operation .............................................................. 77, 81
Specifications ........................................................... 264
T0CKI ......................................................................... 78
Timer1................................................................................. 81
Associated Registers .................................................. 85
Asynchronous Counter Mode ..................................... 82
Reading and Writing ........................................... 82
Interrupt ...................................................................... 83
Modes of Operation .................................................... 81
Operation During Sleep .............................................. 83
Oscillator..................................................................... 82
Prescaler .................................................................... 82
Specifications ........................................................... 264
Timer1 Gate
Inverting Gate ..................................................... 82
Selecting Source .......................................... 82, 96
SR Latch............................................................. 97
Synchronizing COUT w/Timer1 .......................... 96
TMR1H Register......................................................... 81
TMR1L Register.......................................................... 81
Timer2
Associated Registers .................................................. 88
Timers
Timer1
T1CON ............................................................... 84
Timer2
T2CON ............................................................... 88
Timing Diagrams
A/D Conversion......................................................... 269
A/D Conversion (Sleep Mode) .................................. 269
Acknowledge Sequence Timing ............................... 205
Asynchronous Reception.......................................... 162
Asynchronous Transmission..................................... 158
Asynchronous Transmission (Back to Back) ............ 159
Auto Wake-up Bit (WUE) During Normal Operation. 172
Auto Wake-up Bit (WUE) During Sleep .................... 173
Automatic Baud Rate Calibration.............................. 171
Baud Rate Generator with Clock Arbitration............. 199
BRG Reset Due to SDA Arbitration .......................... 209
Brown-out Reset (BOR)............................................ 262
Brown-out Reset Situations ...................................... 218
Bus Collision
Start Condition Timing ...................................... 208
Bus Collision During a Repeated Start
Condition (Case 1)............................................ 210
Bus Collision During a Repeated Start
Condition (Case2)............................................. 210
Bus Collision During a Start Condition (SCL = 0) ..... 209
Bus Collision During a Stop Condition...................... 211
Bus Collision for Transmit and Acknowledge ........... 207
CLKOUT and I/O ...................................................... 261
Clock Timing............................................................. 259
2006-2012 Microchip Technology Inc. DS41291G-page 331
PIC16F882/883/884/886/887
Comparator Output ..................................................... 89
Enhanced Capture/Compare/PWM (ECCP) ............. 265
EUSART Synchronous Receive (Master/Slave) ....... 270
EUSART Synchronous Transmission
(Master/Slave) .................................................. 270
Fail-Safe Clock Monitor (FSCM)................................. 76
Full-Bridge PWM Output ........................................... 141
Half-Bridge PWM Output .................................. 139, 148
I2C Bus Data ............................................................. 274
I2C Bus Start/Stop Bits.............................................. 273
I2C Master Mode First Start Bit Timing ..................... 200
I2C Master Mode Reception Timing.......................... 204
I2C Master Mode Transmission Timing..................... 203
I2C Module
Bus Collision
Transmit Timing........................................ 207
INT Pin Interrupt........................................................ 226
Internal Oscillator Switch Timing................................. 72
Master Mode Transmit Clock Arbitration................... 206
PWM Auto-shutdown
Auto-restart Enabled ......................................... 147
Firmware Restart .............................................. 147
PWM Direction Change ............................................ 142
PWM Direction Change at Near 100% Duty Cycle ... 143
PWM Output (Active-High)........................................ 137
PWM Output (Active-Low) ........................................ 138
Repeat Start Condition.............................................. 201
Reset, WDT, OST and Power-up Timer ................... 262
Send Break Character Sequence ............................. 174
Slave Synchronization .............................................. 190
SPI Master Mode (CKE = 1, SMP = 1) ..................... 271
SPI Mode Timing (Master Mode) SPI Mode
Master Mode Timing Diagram .......................... 189
SPI Mode Timing (Slave Mode with CKE = 0) .......... 191
SPI Mode Timing (Slave Mode with CKE = 1) .......... 191
SPI Slave Mode (CKE = 0) ....................................... 272
SPI Slave Mode (CKE = 1) ....................................... 272
Stop Condition Receive or Transmit ......................... 206
Synchronous Reception (Master Mode, SREN) ....... 178
Synchronous Transmission....................................... 176
Synchronous Transmission (Through TXEN) ........... 176
Time-out Sequence
Case 1 .............................................................. 220
Case 2 .............................................................. 220
Case 3 .............................................................. 220
Timer0 and Timer1 External Clock ........................... 264
Timer1 Incrementing Edge.......................................... 83
Two Speed Start-up .................................................... 74
Wake-up from Interrupt ............................................. 231
Timing Parameter Symbology........................................... 258
Timing Requirements
I2C Bus Data ............................................................. 275
I2C Bus Start/Stop Bits ............................................. 274
SPI Mode .................................................................. 273
TRISA ................................................................................. 41
TRISA Register ................................................................... 41
TRISB ................................................................................. 49
TRISB Register ................................................................... 50
TRISC ................................................................................. 55
TRISC Register................................................................... 55
TRISD ................................................................................. 59
TRISD Register................................................................... 59
TRISE ................................................................................. 61
TRISE Register ................................................................... 61
Two-Speed Clock Start-up Mode ........................................ 73
TXREG ............................................................................. 157
TXSTA Register................................................................ 164
BRGH Bit.................................................................. 167
U
Ultra Low-Power Wake-up................................ 18, 20, 42, 43
V
Voltage Reference (VR)
Specifications ........................................................... 266
Voltage Reference. See Comparator Voltage
Reference (CVREF)
Voltage References
Associated Registers................................................ 102
VP6 Stabilization ........................................................ 99
VREF. SEE ADC Reference Voltage
W
Wake-up on Break............................................................ 172
Wake-up Using Interrupts ................................................. 230
Watchdog Timer (WDT).................................................... 228
Associated Registers................................................ 229
Clock Source ............................................................ 228
Modes....................................................................... 228
Period ....................................................................... 228
Specifications ........................................................... 263
Waveform for Slave Mode General Call Address
Sequence ................................................................. 196
WCOL............................................................... 200, 202, 205
WCOL Status Flag............................................ 200, 202, 205
WDTCON Register ........................................................... 229
WPUB Register................................................................... 51
WWW Address ................................................................. 333
WWW, On-Line Support ..................................................... 13
PIC16F882/883/884/886/887
DS41291G-page 332 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 333
PIC16F882/883/884/886/887
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
PIC16F882/883/884/886/887
DS41291G-page 334 2006-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS41291GPIC16F882/883/884/886/887
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2006-2012 Microchip Technology Inc. DS41291G-page 335
PIC16F882/883/884/886/887
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC16F883, PIC16F883T(1), PIC16F884, PIC16F884T(1),
PIC16F886, PIC16F886T(1), PIC16F887, PIC16F887T(1),
VDD range 2.0V to 5.5V
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range:
I= -40C to +85C (Industrial)
E= -40C to +125C (Extended)
Package:(2) ML = Quad Flat No Leads (QFN)
P = Plastic DIP
PT = Plastic Thin-Quad Flatpack (TQFP)
SO = Plastic Small Outline (SOIC) (7.50 mm)
SP = Skinny Plastic DIP
SS = Plastic Shrink Small Outline
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC16F883-E/P 301 = Extended Temp., PDIP
package, 20 MHz, QTP pattern #301
b) PIC16F883-I/SO = Industrial Temp., SOIC
package, 20 MHz
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2: For other small form-factor package
availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
[X](1)
Tape and Reel
Option
-
PIC16F882/883/884/886/887
DS41291G-page 336 2006-2012 Microchip Technology Inc.
NOTES:
2006-2012 Microchip Technology Inc. DS41291G-page 337
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620766743
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS41291G-page 338 2006-2012 Microchip Technology Inc.
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10/26/12
