HI-8190, HI-8191, HI-8192 12W, Quad, SPST, 3.3V / 5.0V compatible Analog Switch October 2017 GENERAL DESCRIPTION FEATURES The HI-8190 is a quad analog CMOS switch fabricated with Silicon-on-Insulator (SOI) technology for latch-up free operation and maximum switch isolation. The switch voltages can range from bipolar 3.3V to 15V or single ended from 3.3V to 15V. The logic supply can range from 3.3V to 5.0V. The HI-8190 provides four each normally open switches when the switch control inputs are Low. The HI-8191 provides four each normally closed switches when the switch control inputs are Low. The HI8192 provides a combination of two normally On and two normally Off switches. The limits of the operating range are defined by the V+/V- bias voltage. * 3.3V to 15V CMOS analog switches On-resistance of each switch depends upon only the VLOGIC selection. At 5V, RON ranges from 10W to 17W while at 3.3V supply RON ranges from 10W to 22W. Each switch is designed using back to back high voltage transistors. Switch transistors are symmetrical and conduct equally well in either direction. Signal range can run the full rails. Off leakages are very low (1 nA typical) and charge injection is less than 3 pC. Switch ESD tolerance is greater than 4 KV. * Low RON: 12 W to 15 W typical * Robust CMOS Silicon-on-Insulator (SOI) technology * SOI switch isolation with 1nA typical Off leakage * Superior ESD protection > 4KV HBM * Fast switching time with break-before-make * Low power * Extended Temperature Range (-55C to +125C) PIN CONFIGURATIONS (Top Views) IN1 1 16 IN2 S1A 2 15 S2A S1B 3 14 S2B V- 4 13 V+ GND 5 12 VLOGIC S4B 6 11 S3B S4A 7 10 S3A IN4 8 9 IN3 Industry-standard plastic package options include 16-pin TSSOP, SO, DIP and 16-pin QFN. Ceramic packaging is available on request. All three products are offered in both Industrial (-40C to +85C) and extended (-55C to +125C) temperature range options. 14 IN2 13 S2A 16 S1A HI-8190PSx, HI-8190PDx 16-Pin SO or DIP package 15 IN1 The Off state is achieved first before any On condition is applied. Switching times with a 3.3V VLOGIC supply are typically 35 ns to the On state and 20 ns to the Off state. S1B 1 12 S2B V- 2 11 V+ GND 3 10 VLOGIC S4B 4 * Data bus isolation * Sample-and-Hold circuits IN3 7 S3B S3A 8 IN4 6 S4A 5 APPLICATIONS 9 HI-8190PCx 16-pin 5mm x 5mm Chip-scale package * Test Equipment * Communications Systems * Battery operated Systems * PBX, PABX * Audio Signal Routing * Data Acquisition Systems * xDSL Modems * Avionics (DS8190 Rev. D) PRODUCT OPTIONS PART TYPE IN1 HI-8190 0 1 HI-8191 0 1 HI-8192 0 1 HOLT INTEGRATED CIRCUITS www.holtic.com Switch 1 Open Closed Closed Open Open Closed IN2 0 1 0 1 0 1 Switch 2 Open Closed Closed Open Closed Open IN3 0 1 0 1 0 1 Switch 3 Open Closed Closed Open Closed Open IN4 0 1 0 1 0 1 Switch 4 Open Closed Closed Open Open Closed 10/17 HI-8190, HI-8191, HI-8192 PIN DESCRIPTIONS SIGNAL FUNCTION IN1 S1A S1B VGND S4B S4A IN4 IN3 S3A S3B VLOGIC V+ S2B S1B IN2 Logic Input Switch Node Switch Node Supply Supply Switch Node Switch Node Logic Input Logic Input Switch Node Switch Node Supply Supply Switch Node Switch Node Logic input DESCRIPTION HI-8190 and HI-8192 are normally Open when input Low Switch 1 Node Switch 1 Node Negative supply for Bipolar configuration. GND for Unipolar use Reference Ground Switch 4 Node Switch 4 Node HI-8190 and HI-8192 are normally Open when input Low HI-8191 and HI-8192 are normally Closed when input Low Switch 3 Node Switch 3 Node 3.3V or 5.0V Logic supply Positive supply for Bipolar and Unipolar configurations Switch 2 Node Switch 2 Node HI-8191 and HI-8192 are normally Closed when input Low 24W 24W 22W 18W 16W VLOGIC = 5.0V 18W T = +25C 16W T = -55C 14W 14W 12W 12W 10W 10W 8W -15V -10V -5V T = +125C 20W RON RON 20W 22W VLOGIC = 3.3V 0V 5V 10V 15V 8W -15V -10V VSWITCH Typical RON as a function of VLOGIC and VSWITCH (10mA switch current, 25C) -5V 0V VSWITCH 5V 10V Typical RON as a function of VSWITCH and Temperature (10mA switch current) VLOGIC = 5V HOLT INTEGRATED CIRCUITS 2 15V HI-8190, HI-8191, HI-8192 VDD = 3.3V 1.00E-06 Leakage (A) 1.00E-07 125C 1.00E-08 85C 25C -55C -40C 1.00E-09 10 11 12 13 14 15 Vswitch (V) Switch leakage vs switch voltage as a function of temperature at Vdd = 3.0V VDD = 5.0V Leakage (A) 1.00E-07 125C 1.00E-08 85C 25C -40C 1.00E-09 10 11 12 13 14 Vswitch (V) Switch leakage vs switch voltage as a function of temperature at Vdd = 5.0V HOLT INTEGRATED CIRCUITS 3 15 HI-8190, HI-8191, HI-8192 ABSOLUTE MAXIMUM RATINGS (Voltages referenced to GND = 0V) Supply Voltage, V+: ............................................................................16.5V Continuous Power Dissipation (TA=70C): Supply Voltage, V-:.............................................................................-16.5V SO Package (derate 6.7mW/C above 70C)...................696mW Supply Volgate, VLOGIC .........................................................................5.5V Plastic DIP (derate 10.53 mw/C above 70C) .................842mW Switch Current (either direction, DC): .................................................20mA Thin QFN (derate 21.3mW/C above 70C) ...................1702mW Peak Switch Current (1 ms pulse, 10% duty cycle max.)..................100mA Digital Input Voltage (IN1-4):.....................................-0.3V to VLOGIC + 0.3V Storage Temperature Range: ......................................-65C to +150C Operating Temperature Range: (Industrial)..........................-40C to +85C (Hi-Temp) ........................-55C to +125C Soldering Temperature: (Ceramic)......................60 sec. at +300C (Plastic - leads).............10 sec. at +280C (Plastic - body) .....................+260C Max. Maximum Junction Temperature ........................................................175C NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS V+ = 15V, V- = -15V, GND = 0V. Operating temperature range (unless otherwise noted). VLOGIC = 3.3V PARAMETER SYMBOL CONDITIONS FIGURE MIN TYP MAX VLOGIC = 5.0V MIN TYP MAX UNIT SWITCH PARAMETERS Switch Signal Range Switch Resistance Leakage VRANGE -15 +15 V 10 8 17 20 W W 5 5 nA 2 20 20 nA 2 150 150 nA RON 25C, 10mA -55C to +125C, 10mA 1 1 |ISWLEAK| Switch voltage 15V, 25C 2 |ISWLEAK| Switch voltage 15V, 125 |ISWLEAK| Switch voltage 15V, -55C 10 8 22 26 LOGIC INPUTS Input High Voltage VIH 70 70 %VLOGIC Input Low Voltage VIL Input Current IIN VIN = 0V or VIN=VLOGIC VLOGIC Current IDD1 Any state 0.5 0.5 A V+ Current IDD2 Any state 0.5 0.5 A V- Current IEE Any state TON V+/V- = 10V, 25C VS = 10V, -55C to +125C 3 3 55 V+/V- = 10V, 25C VS = 10V, -55C to +125C 3 3 35 10V signal, 25C 10V signal, -55C to +125C 4 4 30 -0.5 0.5 30 -0.5 0.5 %VLOGIC A SUPPLY -0.5 A -0.5 DYNAMIC PARAMETERS Turn On Time Turn Off time Break-Before-Make Time TOFF TD 35 75 ns ns 25 ns ns 20 40 8 4 55 8 ns ns 4 Charge Injection Q VS=0V, RS=0W, 25C 5 4 4 pC Off Isolation RR f = 1 MHz, 25C 6 65 65 dB Crosstalk CR f = 1 MHz, 25C 7 90 90 dB COFF CON Switch Off, 25C Switch On, 25C 8 9 5 20 5 20 pF pF Capacitance HOLT INTEGRATED CIRCUITS 4 HI-8190, HI-8191, HI-8192 TEST CIRCUITS IDS V1 SA VS + - RON = V1/IDS + - VS Figure 1 - On Resistance +5V 0.1F 0.1F VIN (HI-8191) V+ SA VD + - Figure 2 - Off Leakage +15V VLOGIC ID(OFF) SB A IS(OFF) SA A SB 50% 50% 50% 50% VIN (HI-8190) SB VOUT IN VS GND + - 90% 300W 35pF V- 50% VOUT 0.1F -15V t ON t OFF Figure 3. Switching Times 0.1F +5V +15V VLOGIC V+ 0.1F 5V VIN 50% 50% 0V VS1 VS2 S1A S1B S2A S2B IN VOUT1 VOUT2 35pF GND V- 35pF 0.1F 90% 50% VOUT1 300W 300W 90% VOUT2 50% -15V tD Figure 4. Break-Before-Make Time Delay (HI-8192) HOLT INTEGRATED CIRCUITS 5 tD HI-8190, HI-8191, HI-8192 RS +5V +15V VLOGIC V+ SA SB VOUT VIN IN VS GND + - CL 10nF V- DVOUT VOUT -15V QINJ = CL x DVOUT Figure 5. Charge Injection 0.1F 0.1F +5V +15V VLOGIC 0.1F +15V VLOGIC V+ SA1 V+ SA +5V SB VOUT 0.1F SB1 50W IN1 VS IN IN2 GND 50W V- VS 0.1F SB2 VOUT 50W -15V SA2 GND NC V0.1F -15V Figure 7 - Channel-to-Channel Crosstalk Figure 6 - Off Isolation 0.1F +5V +15V VLOGIC V+ SA Capacitance Meter f=1MHz 0.1F 0.1F SB +15V VLOGIC V+ SA Capacitance Meter f=1MHz IN GND +5V V- SB VS IN GND V- 0.1F 0.1F -15V -15V Figure 8 - Off Capacitance Figure 9 - On Capacitance HOLT INTEGRATED CIRCUITS 6 0.1F HI-8190, HI-8191, HI-8192 FREQUENCY RESPONSE Figure 10 shows a typical frequency response. Figure 10. Frequency Response. HOLT INTEGRATED CIRCUITS 7 HI-8190, HI-8191, HI-8192 ORDERING INFORMATION HI - 819x xx x x PART NUMBER Blank F PART NUMBER LEAD FINISH Tin / Lead (Sn / Pb) Solder 100% Matte Tin (Pb-free, RoHS compliant) TEMPERATURE RANGE FLOW BURN IN I -40C TO +85C I NO T -55C TO +125C T NO M -55C TO +125C M YES PART NUMBER PACKAGE DESCRIPTION PC 16 PIN PLASTIC 5x5 mm CHIP SCALE (16PCS1) (No M-flow, Pb-free only) PS 16 PIN PLASTIC NARROW BODY SOIC (16HN) PD 16 PIN PLASTIC DIP (16P) PART NUMBER FUNCTION 8190 QUAD SWITCH, NORMALLY OPEN 8191 QUAD SWITCH, NORMALLY CLOSED 8192 QUAD SWITCH, TWO NORMALLY OPEN, TWO NORMALLY CLOSED HOLT INTEGRATED CIRCUITS 8 HI-8190, HI-8191, HI-8192 REVISION HISTORY P/N Rev DS8190 New A Date 10/26/11 12/12/11 B C 09/26/12 12/05/13 D 10/26/17 Description of Change Initial release Update DC and Peak switch current values in maximum ratings. Clarify QFN available only in Pb-free. Add frequency response curve. Add leakage vs switch voltage as a function of temperature curves. Update package drawings. Update frequency response curve. HOLT INTEGRATED CIRCUITS 9 HI-8190 PACKAGE DIMENSIONS millimeters (inches) 16-PIN PLASTIC SMALL OUTLINE (SOIC) - NB (Narrow Body) 0.175 0.075 (0.007 0.003) 9.90 (0.390) BSC 6.00 (0.236) BSC Top View Package Type: 16HN 3.90 (0.154) BSC See Detail A 0.410 0.100 (0.016 0.004) 1.25 (0.049) min 1.27 BSC (0.050) 0 to 8 0.175 0.075 (0.007 0.003) 0.835 0.435 (0.033 0.017) BSC = "Basic Spacing between Centers" is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) Detail A millimeters (inches) 16-PIN PLASTIC CHIP-SCALE PACKAGE Package Type: 16PCS1 5.00 BSC (0.197) 5.00 BSC (0.197) Electrically isolated heat sink pad on bottom of package. Connect to any ground or power plane for optimum thermal dissipation. 3.355 0.075 (0.132 0.003) 3.355 0.075 (0.132 0.003) Top View Bottom View 0.50 0.050 (0.0197 0.002) 1.00 (0.039)max. .203 (0.008)typ. BSC = "Basic Spacing between Centers" is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 10 0.80 BSC (0.031) 0.30 0.050 (0.012 0.002) HI-8190 PACKAGE DIMENSIONS 16-PIN PLASTIC DUAL IN-LINE PACKAGE (PDIP) (300mil Body) inches (millimeters) Package Type: 16P .255 BSC (6.48) .300 BSC (7.62) .100 BSC (2.54) 0.755 BSC (19.18) .150 .020 (3.81 .508) .011 .002 (.279 .051) .130 .010 (3.302 .254) .028 .013 (.711 .330) .058 .013 (1.473 .330) .018 .002 (.457 .051) BSC = "Basic Spacing between Centers" is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) HOLT INTEGRATED CIRCUITS 11 .345 .035 (8.763 .889)