Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Anti-Surge Thick Film Chip Resistors
E
1
R
2
J
3
P
4
0
5
6
6
D
7
1
8
0
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code Size, Power Rating
Type: inches
P03 : 0603
P06 : 0805
P08 : 1206
P14 : 1210
Power R.
0.2 W
0.25 W
0.33 W
0.5 W
Resistance Tolerance
Code
D
F
J
Tolerance
±0.5 %
±1%
±5%
The first two or three digits are significant figures of resistance
and the third one denotes number of zeros following.
Example: 222촞2.2 k
1002촞10 k
Resistance Value
Packaging Methods
Code
V
U
Type
ERJP03
ERJP06
ERJP08
ERJP14
Packaging
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
a
b
t
W
L
Anti-Surge Thick Film Chip Re sis tors
0603, 0805, 1206, 1210
Type: ERJ P03, P06, P08, P14
■Features
● Anti-Surge characteristics superior to standard metal fi lm resistors
● High reliability
Metal glaze thick fi lm resistive element and three layers of electrodes
● Suitable for both refl ow and fl ow soldering
● High power…0.2 W : 1608(0603) size
0.25 W : 2012(0805) size
0.33 W : 3216(1206) size
0.5 W : 3225(1210) size
● Reference Standards…IEC 60115-8, JIS C 5201-8
■Explanation of Part Numbers
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
ERJP03
(0603) 1.60±0.15 0.80+0.15 0.15+0.15 0.30±0.15 0.45±0.10 2
ERJP06
(0805) 2.00±0.20 1.25±0.10 0.25±0.20 0.40±0.20 0.60±0.10 4
ERJP08
(1206) 3.20+0.05 1.60+0.05 0.40±0.20 0.50±0.20 0.60±0.10 10
ERJP14
(1210) 3.20±0.20 2.50±0.20 0.35±0.20 0.50±0.20 0.60±0.10 16
–0.15
Thick fi lm
resistive element
Electrode (Inner)
Electrode (Outer)
Electrode
(Between)
Alumina substrate
Protective coating
■Construction ■Dimensions in mm (not to scale)
–0.20
–0.10
–0.05
Mar. 2008
Anti-Surge Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
–40
–20 0 20 40 60 80 100 120 140 160
0180
–60
70 °C
–55 °C
20
40
60
80
100
Rated Load (%)
Ambient Temperature (°C)
155 °C
125 °C
10
-30%
-25%
-15%
-10%
ChangeRatioof
ResistanceValue
ChangeRatioof
ResistanceValue
ChangeRatioof
ResistanceValue
ChangeRatioof
ResistanceValue
-5%
0%
5%
-20%
1001k10k100k1M10
-30%
-25%
-15%
-10%
-5%
0%
5%
-20%
1001k10k100k1M
10
-30%
-25%
-15%
-10%
-5%
0%
5%
-20%
100
ERJP03(1608 (0603) size)
ERJP08(3216 (1206) size)
ERJP06(2012 (0805) size)
ERJP14(3225 (1210) size)
1k10k100k1M10
-30%
-25%
-15%
-10%
-5%
0%
5%
-20%
1001k10k100k1M
ERJP
ERJ
ERJP
ERJ
ERJP
ERJ
ERJP
ERJ
■Ratings
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 Power Rating or max. Over load Volt age list ed above
which ev er less.
(3) Please contact us when resistors with guaranteed high voltage are need.
Type
(inches)
Power Rating
at 70 °C
(W)
Limiting Element
Voltage
(Maximum RCWV)(1)
(V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C (ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJP03
(0603) 0.2 150 200
±0.5 10 to 1 M
(E24, E96) ±150
–55 to +155±1 10 to 1 M
(E24, E96) ±200
±5 1 to 1 M
(E24)
±200
Less than 10 : –150 to +400
ERJP06
(0805) 0.25 150
(400)(3)
200
(600)(3)
±0.5, ±1 10 to 3.3 M
(E24, E96)
Less than 33 : ±300
More than 33 : ±100
–55 to +155
±5 1 to 3.3 M
(E24)
Less than 33 : ±300
More than 33 : ±200
ERJP08
(1206) 0.33 200
(500)(3)
400
(1000)(3)
±0.5, ±1 10 to 1 M
(E24, E96) ±100
–55 to +155
±5 1 to 10 M
(E24)
Less than 10 : –100 to +600
More than 10 : ±200
ERJP14
(1210) 0.5 200 400
±0.5, ±1 10 to 1 M
(E24, E96) ±100
–55 to +155
±5 1 to 1 M
(E24)
Less than 10 : –100 to +600
More than 10 : ±200
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
✽ When the temperature of ERJP06/08/14 is 155 °C or
less, the derating start temperature can be changed to
125 °C. (See the dotted line)
■ESD Characteristic
Anti-Surge Thick Film Chip Resistors(ERJP Type)
Thick Film Chip Resistors(ERJ Type)
R=0
/
150
C=150pF Sample
±3.0kV
Jun. 2009
Anti-Pulse Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
T
4
0
5
6
6
J
7
1
8
0
9
0
10 11
V
Thick Film
Chip Resistors
Product Code Size, Power Rating
Type: inches
T06 : 0805
T08 : 1206
T14 : 1210
Power R.
0.25 W
0.33 W
0.5 W
Resistance Tolerance
Code
J
Tolerance
±5%
The first two digits are significant figures of resistance
and the third one denotes number of zeros following.
Example: 222촞2.2 k
Resistance Value
Packaging Methods
Code
V
U
Type
ERJT06
ERJT08
ERJT14
Packaging
Punched Carrier Taping
4mmpitch
Embossed Carrier Taping
4mmpitch
a
b
t
W
L
Anti-Pulse Thick Film Chip Re sis tors
0805, 1206, 1210
Type: ERJ T06, T08, T14
■Features
● Anti-Pulse characteristics
High pulse characteristics achieved by the optimized trimming specifi cations
● High reliability
Metal glaze thick fi lm resistive element and three layers of electrodes
● Suitable for both refl ow and fl ow soldering
● High power…0.25 W : 2012(0805) size
0.33 W : 3216(1206) size
0.5 W : 3225(1210) size
● Reference Standards…IEC 60115-8, JIS C 5201-8
■Explanation of Part Numbers
Type
(inches)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
LWa b t
ERJT06
(0805) 2.00±0.20 1.25±0.10 0.25±0.20 0.40±0.20 0.60±0.10 4
ERJT08
(1206) 3.20+0.05 1.60+0.05 0.40±0.20 0.50±0.20 0.60±0.10 10
ERJT14
(1210) 3.20±0.20 2.50±0.20 0.35±0.20 0.50±0.20 0.60±0.10 16
–0.15
Thick fi lm
resistive element
Electrode (Inner)
Electrode (Outer)
Electrode
(Between)
Alumina substrate
Protective coating
■Construction ■Dimensions in mm (not to scale)
–0.20
Jun. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Anti-Pulse Thick Film Chip Resistors
–40
–20 0 20 40 60 80 100 120 140 160
0180
–60
70 °C
–55 °C
20
40
60
80
100
Rated Load (%)
Ambient Temperature (
°
C)
155 °C
Pulse duration τ(msec)
Limiting Power : Pp (W)
Pulse duration τ(msec) Pulse duration τ(msec)
Limiting Power : Pp (W)
Limiting Power : Pp (W)
1
10
100
110100 1000 1
10
100
110100 1000 1
10
100
1000
110100 1000
Period time : 10 s
Pulse duration : τ
0
Pp
Limiting
Power
: Anti-Pulse Thick Film Chip Resistors (ERJT Type)
: Thick Film Chip Resistors (ERJ Type)
■Ratings
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=2.5 Power Rating or max. Over load Volt age list ed above
which ev er less.
Type
(inches)
Power Rating
at 70 °C
(W)
Limiting Element
Voltage
(Maximum RCWV)(1)
(V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C (ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJT06
(0805) 0.25 150 200 ±5 1 to 1 M
(E24)
Le
ss than 10 : –100 to +600
Less than 33 : ±300
More than 33 : ±200
–55 to +155
ERJT08
(1206) 0.33 200 400 ±5 1 to 1 M
(E24)
Less than 10 : –100 to +600
More than 10 : ±200
–55 to +155
ERJT14
(1210) 0.5 200 400 ±5 1 to 1 M
(E24)
Less than 10 : –100 to +600
More than 10 : ±200
–55 to +155
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure on the right.
■Limiting Power Curve
● In rush pulse Characteristic
● ERJT06 (2012 (0805) size) ● ERJT08 (3216 (1206) size) ● ERJT14 (3225 (1210) size)
Test cycle : 1000 cycles
Spec : Resistance value = within ±5%
Jun. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Anti-Surge Thick Film Chip Resistors
TTA
P0
P2
P1
φD0
B
F
W
E
φD1(Only Emboss)
φB
W
T
φA
φC
Chip Resistor
c
a
b
■Packaging Methods (Taping)
● Standard Quantity
Type Kind of Taping Pitch (P1)Quantity
ERJP03
Punched Carrier Taping 4 mm 5000 pcs./reel
ERJP06
ERJP08
ERJP14 Embossed Carrier Taping
(Unit : mm)
(Unit : mm)
Type A B W F E P1P2P0φD0TφD1
ERJP03 1.10±0.10 1.90±0.10
8.00±0.20
3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10
0.70±0.05 –
ERJP06 1.65±0.15 2.50±0.20
0.84±0.05 –
ERJP08 2.00±0.15 3.60±0.20
8.00±0.30 –
ERJP14 2.80±0.20 3.50±0.20 1.00±0.10 1.0+0.10
−0
−0
● Taping Reel
● Carrier Tape
Type φAφBφCWT
ERJP03
180.0+0 60 min. 13.0±1.0 9.0±1.0 11.4 ±1.0
ERJP06
ERJP08
ERJP14
−3.0
Type
(inches)
Dimensions (mm)
abc
ERJP03
(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJP06
(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJP08
(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJP14
(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
■Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Punched Carrier Embossed Carrier
Mar. 2008
Anti-Pulse Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
TTA
P0
P2
P1
φD0
B
F
W
E
φD1(Only Emboss)
φB
W
T
φA
φC
■Packaging Methods (Taping)
● Standard Quantity
Type Kind of Taping Pitch (P1)Quantity
ERJT06 Punched Carrier Taping 4 mm 5000 pcs./reel
ERJT08
ERJT14 Embossed Carrier Taping
(Unit : mm)
(Unit : mm)
Type A B W F E P1P2P0φD0TφD1
ERJT06 1.65±0.15 2.50±0.20 8.00±0.20
3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.84±0.05 –
ERJT08 2.00±0.15 3.60±0.20
8.00±0.30 –
ERJT14 2.80±0.20 3.50±0.20 1.00±0.10 1.0+0.10
−0
−0
● Taping Reel
● Carrier Tape
Type φAφBφCWT
ERJT06
180.0+0 60 min. 13.0±1.0 9.0±1.0 11.4 ±1.0
ERJT08
ERJT14
−3.0
Punched Carrier Embossed Carrier
Jun. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Anti-Pulse Thick Film Chip Resistors
Chip Resistor
c
a
b
Preheating
Peak
Heating
Temperature
Time
Type
(inches)
Dimensions (mm)
abc
ERJT06
(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJT08
(1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJT14
(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
■Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature TimeTemperatureTime
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Anti-Pulse Thick Film Chip Resistors (here af ter
called the resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avo i d exc ess i ve b e nding of printed circuit boards in order to protect the resistors from abnormal stress.
Jun. 2008
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S e aling o r c oating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007