tm
February 2012
FDA24N50F N-Channel MOSFET
©2012 Fairchild Semiconductor Corporation
FDA24N50F Rev.C0
www.fairchildsemi.com1
UniFET
TM
FDA24N50F
N-Channel MOSFET
500V, 24A, 0.2Ω
Features
•R
DS(on) = 0.166Ω ( Typ.)@ VGS = 10V, ID = 12A
Low Gate Charge ( Typ. 65nC)
Low Crss ( Typ. 32pF)
Fast Switching
100% Avalanche Tested
Improved dv/dt Capability
RoHS Compliant
Description
These N-Channel enhancement mode power field effect transis-
tors are produced using Fairchild’s proprietary, planar stripe,
DMOS technology.
This advance technology has been especially tailored to mini-
mize on-state resistance, provide superior switching perfor-
mance, and withstand high energy pulse in the avalanche and
commutation mode. These devices are well suited for high effi-
cient switching mode power supplies and active power factor
correction.
D
G
S
TO-3PN
GSD
MOSFET Maximum Ratings TC = 25oC unless otherwise noted
Thermal Characteristics
Symbol Parameter Ratings Units
VDSS Drain to Source Voltage 500 V
VGSS Gate to Source Voltage ±30 V
IDDrain Current -Continuous (TC = 25oC) 24 A
-Continuous (TC = 100oC) 14
IDM Drain Current - Pulsed (Note 1) 96 A
EAS Single Pulsed Avalanche Energy (Note 2) 1872 mJ
IAR Avalanche Current (Note 1) 24 A
EAR Repetitive Avalanche Energy (Note 1) 27 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
PDPower Dissipation (TC = 25oC) 270 W
- Derate above 25oC2.2W/
oC
TJ, TSTG Operating and Storage Temperature Range -55 to +150 oC
TL
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds 300 oC
Symbol Parameter Ratings Units
RθJC Thermal Resistance, Junction to Case 0.46
oC/WRθCS Thermal Resistance, Case to Sink Typ. 0.24
RθJA Thermal Resistance, Junction to Ambient 40
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
2
Package Marking and Ordering Information
Electrical Characteristics TC = 25oC unless otherwise noted
Off Characteristics
On Characteristics
Dynamic Characteristics
Switching Characteristics
Drain-Source Diode Characteristics
Device Marking Device Package Reel Size Tape Width Quantity
FDA24N50F FDA24N50F TO-3PN - - 30
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V, TJ = 25oC 500 - - V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient ID = 250μA, Referenced to 25oC-0.6-V/
oC
IDSS Zero Gate Voltage Drain Current VDS = 500V, VGS = 0V - - 1 μA
VDS = 400V, TC = 125oC--10
IGSS Gate to Body Leakage Current VGS = ±30V, VDS = 0V - - ±100 nA
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250μA3.0-5.0V
RDS(on) Static Drain to Source On Resistance VGS = 10V, ID = 12A - 0.166 0.2 Ω
gFS Forward Transconductance VDS = 20V, ID = 12A (Note 4) -30-S
Ciss Input Capacitance VDS = 25V, VGS = 0V
f = 1MHz
- 3240 4310 pF
Coss Output Capacitance - 450 600 pF
Crss Reverse Transfer Capacitance - 32 48 pF
Qg(tot) Total Gate Charge at 10V
VDS = 400V, ID = 24A
VGS = 10V
(Note 4, 5)
-6585nC
Qgs Gate to Source Gate Charge - 18 - nC
Qgd Gate to Drain “Miller” Charge - 26 - nC
td(on) Turn-On Delay Time
VDD = 250V, ID = 24A
RG = 25Ω
(Note 4, 5)
- 49 108 ns
trTurn-On Rise Time - 105 220 ns
td(off) Turn-Off Delay Time - 165 340 ns
tfTurn-Off Fall Time - 87 185 ns
ISMaximum Continuous Drain to Source Diode Forward Current - - 24 A
ISM Maximum Pulsed Drain to Source Diode Forward Current - - 96 A
VSD Drain to Source Diode Forward Voltage VGS = 0V, ISD = 24A - - 1.4 V
trr Reverse Recovery Time VGS = 0V, ISD = 24A
dIF/dt = 100A/μs (Note 4)
- 264 - ns
Qrr Reverse Recovery Charge - 1.4 - μC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 6.5mH, IAS = 24A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C
3. ISD 24A, di/dt 200A/μs, VDD BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width 300μs, Duty Cycle 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
3
Typical Performance Characteristics
Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics
Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage
Drain Current and Gate Voltage Variation vs. Source Current
and Temperature
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
0.1 1 10
1
10
60
*Notes:
1. 250μs Pulse Test
2. TC = 25oC
VGS = 15.0V
10.0V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
ID,Drain Current[A]
VDS,Drain-Source Voltage[V]
0.5
45678
1
10
100
-55oC
150oC
*Notes:
1. VDS = 20V
2. 250μs Pulse Test
25oC
ID,Drain Current[A]
VGS,Gate-Source Voltage[V]
0 20406080
0.15
0.20
0.25
0.30
0.35
*Note: TJ = 25oC
VGS = 20V
VGS = 10V
RDS(ON) [Ω],
Drain-Source On-Resistance
ID, Drain Current [A]
0.2 0.6 1.0 1.4
1
10
100
*Notes:
1. VGS = 0V
2. 250μs Pulse Test
150oC
IS, Reverse Drain Current [A]
VSD, Body Diode Forward Voltage [V]
25oC
150
0.1 1 10
0
1500
3000
4500
6000
7500
Coss
Ciss
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
*Note:
1. VGS = 0V
2. f = 1MHz
Crss
Capacitances [pF]
VDS, Drain-Source Voltage [V]
30
0204060
0
2
4
6
8
10
*Note: ID = 24A
VDS = 100V
VDS = 250V
VDS = 400V
VGS, Gate-Source Voltage [V]
Qg, Total Gate Charge [nC]
70
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
4
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation
vs. Temperature vs. Temperature
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
Figure 11. Transient Thermal Response Curve
-75 -25 25 75 125 175
0.0
0.5
1.0
1.5
2.0
2.5
3.0
*Notes:
1. VGS = 10V
2. ID = 12A
RDS(on), [Normalized]
Drain-Source On-Resistance
TJ, Junction Temperature [oC]
1 10 100 1000
0.01
0.1
1
10
100
200
60μs
100μs
1ms
10ms
ID, Drain Current [A]
VDS, Drain-Source Voltage [V]
Operation in This Area
is Limited by R DS(on)
*Notes:
1. TC = 25oC
2. TJ = 150oC
3. Single Pulse
DC
25 50 75 100 125 150
0
6
12
18
24
ID, Drain Current [A]
TC, Case Temperature [oC]
10-5 10-4 10-3 10-2 10-1 100101
0.001
0.01
0.1
1
0.01
0.1
0.2
0.05
0.02 *Notes:
1. ZθJC(t) = 0.46oC/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.5
Single pulse
Thermal Response [ZθJC]
Rectangular Pulse Duration [sec]
t
1
P
DM
t
2
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
5
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
6
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
VDS
+
_
Driver
RGSame Type
as DUT
VGS dv/dt controlled by RG
•I
SD controlled by pulse period
VDD
L
ISD
10V
VGS
( Driver )
ISD
( DUT )
VDS
( DUT )
VDD
Body Diode
Forward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D = Gate Pulse Width
Gate Pulse Period
--------------------------
DUT
VDS
+
_
Driver
RGSame Type
as DUT
VGS dv/dt controlled by RG
•I
SD controlled by pulse period
VDD
LL
ISD
10V
VGS
( Driver )
ISD
( DUT )
VDS
( DUT )
VDD
Body Diode
Forward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D = Gate Pulse Width
Gate Pulse Period
--------------------------
D = Gate Pulse Width
Gate Pulse Period
--------------------------
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0
www.fairchildsemi.com
7
Mechanical Dimensions
TO-3PN
Dimensions in Millimeters
FDA24N50F N-Channel MOSFET
FDA24N50F Rev.C0 www.fairchildsemi.com
8
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