DATA SH EET
Product specification 2000 Feb 01
DISCRETE SEMICONDUCTORS
BLS3135-20
Microwave power transistor
halfpage
M3D259
2000 Feb 01 2
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
FEATURES
Suitable for short and medium pulse applications
Internal input and output matching networks for an easy
circuit design
Emitter ballasting resistors improve ruggedness
Gold metallization ensures excellent reliability
Interdigitated emitter-base structure provides high
emitter efficiency
Multicellgeometryimprovespowersharingandreduces
thermal resistance.
APPLICATIONS
Commonbaseclass-Cpulsedpoweramplifiersforradar
applications in the 3.1 to 3.5 GHz range.
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in
a 2-lead rectangular flange package with a ceramic cap
(SOT422A) with the common base connected to the
flange.
PINNING - SOT422A
PIN DESCRIPTION
1 collector
2 emitter
3 base; connected to flange
handbook, halfpage
1
2
33
MBK051
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Th=25°C in a common base class-C test circuit.
MODE OF OPERATION f
(GHz) VCB
(V) PL
(W) Gp
(dB) ηC
(%)
Pulsed, class-C 3.1 to 3.5 40 20 typ. 8 typ. 40
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
2000 Feb 01 3
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
Note
1. Equivalent thermal impedance under pulsed microwave operating conditions.
CHARACTERISTICS
Tj=25°C unless otherwise specified.
APPLICATION INFORMATION
RF performance at Th=25°C in a common-base test circuit.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter 75 V
VCES collector-emitter voltage RBE =0 75 V
VEBO emitter-base voltage open collector 2V
I
CM peak collector current tp100 µs; δ≤10% 2A
P
tot total power dissipation tp= 100 µs; δ= 10%; Tmb =25°C80 W
Tstg storage temperature 65 +200 °C
Tjoperating junction temperature 200 °C
Tsld soldering temperature up to 0.2 mm from ceramic cap;
t10 s 235 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Zth j-h thermal impedance from junction to heatsink tp= 100 µs; δ= 10%; note 1 2 K/W
tp= 200 µs; δ= 10%; note 1 2.45 K/W
tp= 300 µs; δ= 10%; note 1 2.75 K/W
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V(BR)CBO collector-base breakdown voltage IC= 15 mA; open emitter 75 V
V(BR)CES collector-emitter breakdown voltage IC= 15 mA; VBE =0 75 V
I
CBO collector leakage current VCB = 40 V; IE=0 0.5 mA
ICES collector leakage current VCE = 40 V; VBE =0 1mA
I
EBO emitter leakage current VEB = 1.5 V; IC=0 0.1 mA
hFE DC current gain VCB =5V; I
C= 1.5 A 40
MODE OF OPERATION f
(GHz) VCE
(V) PL
(W) Gp
(dB) ηC
(%)
Class-C; tp= 100 µs; δ= 10% 3.1 to 3.5 40 20
typ. 22 7
typ. 8 35
typ. 40
2000 Feb 01 4
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
handbook, halfpage
01
(1) (2)
(3)
24
25
0
20
3PD (W)
PL
(W)
15
10
5
MCD863
Fig.2 Load power as a function of drive power;
typical values.
VCB = 40 V; class-C; tp= 100 µs; δ= 10%.
(1) f = 3.1 GHz.
(2) f = 3.3 GHz.
(3) f = 3.5 GHz.
handbook, halfpage
025
10
0
2
4
6
8
5101520
P
L
(W)
Gp
(dB)
MCD864
(3)
(1)
(2)
Fig.3 Power gain as a function of load power;
typical values.
VCB = 40 V; class-C; tp= 100 µs; δ= 10%.
(1) f = 3.1 GHz.
(2) f = 3.3 GHz.
(3) f = 3.5 GHz.
handbook, halfpage
025
50
0
10
20
30
40
5101520
P
L
(W)
ηC
(dB)
MCD865
(3)
(1)
(2)
Fig.4 Collector efficiency as a function of load
power; typical values.
VCB = 40 V; class-C; tp= 100 µs; δ= 10%.
(1) f = 3.1 GHz.
(2) f = 3.3 GHz.
(3) f = 3.5 GHz.
handbook, halfpage
3
Gp
(dB)
3.2 3.4
Gp
ηC
3.6
f (GHz)
10
0
8
6
4
2
ηC
(%)
50
0
40
30
20
10
MCD866
Fig.5 Power gain and efficiency as functions of
frequency; typical values.
VCB = 40 V; class-C; PL= 20 W; tp= 100 µs; δ= 10%.
2000 Feb 01 5
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
handbook, halfpage
3 3.2 3.4
ri
xi
3.6
f (GHz)
zi
()
15
10
10
5
0
5
MCD867
Fig.6 Input impedance as a function of frequency
(series components); typical values.
VCB = 40 V; class-C; PL=20W.
handbook, halfpage
3 3.2 3.4
RL
XL
3.6
f (GHz)
ZL
()
15
10
10
5
0
5
MCD868
Fig.7 Load impedance as a function of frequency
(series components); typical values.
VCB = 40 V; class-C; PL=20W.
2000 Feb 01 6
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
handbook, full pagewidth
MCD869
30 30
40
C2
C1
Dimensions in mm.
The components are situated on one side of the copper-clad printed-circuit board with Duroid dielectric (εr= 2.2), thickness 0.38 mm.
The other side is unetched and serves as a ground plane.
C1 = C2 = 4.7 pF (ATC 100A).
Fig.8 Component layout for 3.1 to 3.5 GHz class-C test circuit.
2000 Feb 01 7
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT422A 99-03-29
0 5 10 mm
scale
Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT422A
UNIT Q
cD E
1
EFH p q
mm 0.13
0.08
b
5.21
4.95 10.29
10.03
9.93
9.68 8.76
8.51
D1
10.29
10.03 1.58
1.47 19.18
17.65
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
3.43
3.18 16.51 22.99
22.73
U2
U1
9.91
9.65 0.25
w2
w1
0.76
A
5.72
4.83 3.35
2.92
inches 0.005
0.003
0.205
0.195 0.405
0.395
0.391
0.381 0.345
0.335
0.405
0.395 0.062
0.058 0.755
0.695
L
4.52
3.74
0.178
0.147 0.135
0.125 0.65 0.905
0.895 0.390
0.380 0.01 0.03
0.225
0.190 0.132
0.115
D
D1
q
U1
A
U2E1E
p
b
1
3
2
Q
F
c
M M
C
C
A
w2
B
w1AB
M M M
L
L
H
2000 Feb 01 8
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data Sheet Status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
2000 Feb 01 9
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
NOTES
2000 Feb 01 10
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
NOTES
2000 Feb 01 11
Philips Semiconductors Product specification
Microwave power transistor BLS3135-20
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000 69
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Printed in The Netherlands 603516/01/pp12 Date of release: 2000 Feb 01 Document order number: 9397 750 06722