© 2010 Microchip Technology Inc. DS22183C-page 1
MCP73113/4
Features
Complete Linear Charge Management Controller:
- Integrated Input Overvoltage Protection
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
Constant Current / Constant Voltage Operation
with Thermal Regulation
4.15V Undervoltage Lockout (UVLO)
18V Absolute Maximum Input with OVP:
- 6.5V (MCP73113)
- 5.8V (MCP73114)
High Accuracy Preset V oltage Regulation Through
Full Temperature Range (-5°C to +55°C): +0.5%
Battery Charge Voltage Options:
- 4.10V, 4.20V, 4.35V or 4.4V
Resistor Programmable Fast Charge Current:
- 130 mA - 1100 mA
Preconditioning of Deeply Depleted Cells
- Available Options: 10% or Disable
Integrated Precondition Timer:
- 32 Minutes or Disable
Automatic End-of-Charge Control:
- Selectable Minimum Current Ratio:
5%, 7.5%, 10% or 20%
- Elapse Safety Timer: 4 HR, 6 HR, 8 HR or
Disable
Automatic Recharge:
- Available Options: 95% or Disable
Charge Status Output - Two Style Options
Soft start
Temperature Range: -40°C to +85°C
Packaging: DFN-10 (3 mm x 3 mm)
Applications
Low-Cost Li-Ion/Li-Poly Battery Chargers
MP3 Players
Digital Still Camera
Portable Media Players
Handheld Devices
Bluetooth Headsets
USB Chargers
Description
The MCP73113/4 are highly integrated Li-Ion battery
charge management controllers for use in
space-limited and cost-sensitive applications. The
MCP73113/4 devices provide specific charge
algorithms for Li-Ion/Li-Polymer batteries to achieve
optimal capacity and safety in the shortest charging
time possible. Along with th eir small physical size, the
low number of external components make the
MCP73113/4 ideally suitable for portable applications.
The absolute maximum vol tag e, up to 18V, allows the
use of MCP73113/4 in harsh environments, such as
low cost wall wart or voltage spikes from plug/unplug.
The MCP73113/4 devices employ a constant
current/constant voltage charge algorithm. The various
charging voltage regulations provide design e ngineers
flexibility to use in different applications. The fast
charge, constant current value is set with on e external
resistor from 130 mA to 1100 mA. The MCP73113/4
devices limit the charge current based on die
temperature during high power or high ambient
conditions. This thermal regulation optimizes the
charge cycle time while maintaining device reliability.
The PROG pin of the MCP73113/4 also serves as
enable pin. When high impedance is applied, the
MCP73113/4 will be in standby mode.
The MCP73113/4 devices are fully specified over the
ambient temperature range of -40°C to +85°C. They
are available in a 10 lead, DFN package.
Package Types (Top View)
MCP73113/4
3x3 DFN *
VBAT
VDD
VBAT
VSS
VSS
1
2
3
4
10
9
8
7STAT
PROGVDD
* Includes Exposed Thermal Pad (EP); see Table 3-1.
EP
11
NC 56NC
Single-Cell Li-Ion / Li-Polymer Battery Charge Management
Controller with Input Overvoltage Protection
MCP73113/4
DS22183C-page 2 © 2010 Microchip Technology Inc.
Typical Application
TABLE 1: AVAILABLE FACTORY PRESET OPTIONS
TABLE 2: STANDARD SAMPLE OPTIONS
Charge
Voltage OVP
Pre-
conditioning
Charge Current
Pre-
conditioning
Threshold
Precondition
Timer
Elapse
Timer
End-of-
Charge
Control
Automatic
Recharge
Output
Status
4.10V 5.8V / 6.5V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR
/ 6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes T ype 1 /
Type 2
4.20V 5.8V / 6.5V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR
/ 6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes T ype 1 /
Type 2
4.35V 5.8V / 6.5V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR
/ 6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes T ype 1 /
Type 2
4.40V 5.8V / 6.5V Disable / 10% 66.5% / 71.5% Disable /
32 Minimum Disable / 4 HR
/ 6 HR / 8 HR 5% / 7.5% /
10% / 20% No /
Yes T ype 1 /
Type 2
Note 1: IREG: Regulated fast charge current.
2: VREG: Regulated charge voltage.
3: IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current.
4: ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current.
5: MCP73113: VOVP = 6.5V, MCP73114: VOVP = 5.8V.
6: VRTH/VREG: Recharge threshold; ratio of regulated battery voltage.
7: VPTH/VREG: Preconditioning threshold voltage.
+
STAT
VDD
NC
PROG
VBAT
1-Cell
5
6
7
1
2
Ac-dc Adapter
NC
VDD
VSS
VSS 8
9
10
4
3
RLED
CIN COUT
VBAT
RPROG
Li-Ion
Battery
MCP73113/4 Typical Application
Part
Number
VREG OVP IPREG/IREG Pre-charge
Timer
Elapse
Timer
ITERM/IREG VRTH/VREG VPTH/VREG Output
Status
MCP73113-16S/MF 4.10V 6.5V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1
MCP73113-06S/MF 4.20V 6.5V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1
MCP73114-0NS/MF 4.20V 5.8V 10% 32 Min. 6 HR 10% 95% 71.5% Type 1
Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of
this document. Technical support is available through the web site at: http//support.microchip.com.
© 2010 Microchip Technology Inc. DS22183C-page 3
MCP73113/4
Functional Block Diagram
Reference,
Bias, UVLO,
AND SHDN
VREF (1.21V)
STAT
PROG
VBAT
VSS
Direction
Control
Precondition
+
-
Term
+
-
+
-
CA
Charge
+
-
+
-
VA
+
-
Current
Limit
Charge
Control,
Timer,
and
Status
Logic
VREF
VOREG
VOREG UVLO
VDD
Input OverVPVDD
+
-
5.8 / 6.5V
Thermal Regulation
TSD
+
-
110°C
*Recharge VBAT
+
-
95% VREG
*Only available on selected options
MCP73113/4
DS22183C-page 4 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 5
MCP73113/4
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDD................................................................................18.0V
VPROG ..............................................................................6.0V
All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ............Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 kΩ in Series with 100 pF).......4kV
Machine Model (200 pF, No Series Resistance).............300V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended per iods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Supply Input
Input Voltage Range VDD 4—16V
Operating Supply Voltage VDD 4.2 6.5 V
Supply Current ISS 4 5.5 µA Shutdown (VDD < VBAT - 150 mV)
700 1500 µA Charging
30 100 µA Standby (PROG Floating)
50 150 µA Charge Complete; No Battery;
VDD < VSTOP
Battery Discharge Current
Output Reverse Leakage
Current IDISCHARGE 0.5 2 µA Standby (PROG Floating)
0.5 2 µA Shutdown (VDD < VBAT,
or VDD < VSTOP)
6 17 µA Charge Complete; VDD is present
Undervoltage Lockout
UVLO Start Threshold VSTART 4.10 4.15 4.25 V
UVLO Stop Threshold VSTOP 4.00 4.05 4.15 V
UVLO Hysteresis VHYS 100 mV
Overvoltage Protection
OVP Start Thre shold VOVP 6.4 6.5 6.6 V MCP73113
5.8 5.9 6.0 V MCP73114
OVP Hysteresis VOVPHYS 150 mV
Voltage Regulation (Constant Voltage Mode)
Regulated Output Voltage
Options VREG 4.079 4.10 4.121 V TA = -5°C to 55°C
4.179 4.20 4.221 V VDD = [VREG(Typical)+1V]
4.328 4.35 4.372 V IOUT = 50 mA
4.378 4.40 4.422 V
Output Voltage Tolerance VRTOL -0.5 0.5 %
Line Regulation |(ΔVBAT/VBAT)
/ΔVDD| 0.05 0.20 %/V VDD = [VREG(Typical)+1V] to 6V
IOUT = 50 mA
Load Regulation VBAT/VBAT| 0.05 0.20 % IOUT = 50 mA - 150 mA
VDD = [VREG(Typical)+1V]
Supply Ripple Attenuation PSRR -46 dB IOUT = 20 mA, 10 Hz to 1 kHz
—-30dBI
OUT = 20 mA, 10 Hz to 10 kHz
Note 1: Not production tested. Ensured by design.
MCP73113/4
DS22183C-page 6 © 2010 Microchip Technology Inc.
Battery Short Protection
BSP Start Threshold VSHORT —1.7V
BSP Hysteresis VBSPHYS 150 mV
BSP Regulation Current ISHORT —25mA
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation IREG 130 1100 mA TA = -5°C to +55°C
117 130 143 mA PROG = 10 kΩ
900 1000 1100 mA PROG = 1.1 kΩ
Charge Current Tolerance IRTOL —10%
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current Ratio I PREG / IREG 81015%PROG = 1kΩ to 10 kΩ
TA = -5°C to +55°C
100 % No Preconditioning
Precondition Voltage
Threshold Ratio VPTH / VREG 64 66.5 69 % VBAT Low-to-High
69 71.5 74 %
Precondition Hysteresis VPHYS 100 mV VBAT High-to-Low (Note 1)
Charge Termination
Charge Termination
Current Ratio ITERM / IREG 3.75 5 6.25 % PROG = 1 kΩ to 10 kΩ
TA = -5°C to +55°C
5.6 7.5 9.4 %
7.5 10 12.5 %
15 20 25 %
Automatic Recharge
Recharge Voltage
Threshold Ratio VRTH / VREG 93 95.0 97 % VBAT High-to-Low
No Automatic Recharge
—0%
Pass Transistor ON-Resistance
ON-Resistance RDSON 350 mΩVDD = 4.5V, TJ = 105°C (Note 1)
Status Indicator - STAT
Sink Current ISINK —2035mA
Low Output Voltage VOL —0.20.5VI
SINK = 4 mA
Input Leakage Current ILK 0.001 1 μA High Impedance, VDD on pin
PROG Input
Charge Impedance Range RPROG 1—21kΩ
Shutdown Impedance RPROG 70 200 kΩImpedance for Shutdown
PROG Voltage Range VPROG 0—5V
Automatic Power Down
Automatic Power Down
Entry Threshold VPDENTRY VBAT +
10 mV VBAT +
50 mV V 2.3V < VBAT < VREG
VDD Falling
Automatic Power Down
Exit Threshold VPDEXIT —V
BAT +
150 mV VBAT +
250 mV V2.3V < VBAT < VREG
VDD Rising
Thermal Shutdown
Die Temperature TSD 150 °C
Die Temperature
Hysteresis TSDHYS —10°C
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Note 1: Not production tested. Ensured by design.
© 2010 Microchip Technology Inc. DS22183C-page 7
MCP73113/4
AC CHARACTERISTICS
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V, TA=-40°C to +85°C.
Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]
Parameters Sym Min Typ Max Units Conditions
Elapsed Timer
Elapsed Timer Period tELAPSED 0 Hours Timer Disabled
3.6 4.0 4.4 Hours
5.4 6.0 6.6 Hours
7.2 8.0 8.8 Hours
Preconditioning Timer
Preconditioning Timer Period tPRECHG 0 Hour s Disabled Timer
0.4 0.5 0.6 Hours
Status Indicator
Status Output turn-off tOFF ——500µsI
SINK = 1 mA to 0 mA
(Note 1)
Status Output turn-on, tON ——500 I
SINK = 0 mA to 1 mA
(Note 1)
Note 1: Not production tested. Ensured by design.
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (Typi cal ) + 1.0V]
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 +85 °C
Operating Temperature Range TJ-40 +125 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance, DFN-10 (3x3) θJA 43 °C/W 4-Layer JC51-7 Standard Board,
Natural Convection
MCP73113/4
DS22183C-page 8 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 9
MCP73113/4
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25°C, Constant-voltage mode.
FIGURE 2-1: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-2: Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-3: Battery Regulation Voltage
(VBAT) vs. Ambient Tempe r at ur e (TA).
FIGURE 2-4: Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-5: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-6: Charge Current (IOUT) vs.
Supply Voltage (VDD).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provide d for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified pow er supply range) and therefore outside the warranted range.
4.180
4.185
4.190
4.195
4.200
4.205
4.210
4.215
4.220
4.5 4.8 5.0 5.3 5.5 5.8 6.0
Supply Voltage(V)
Battery Regulation Voltage (V)
ILOAD = 50 mA
VBAT
= 4.2
V
TA = +25°C
4.180
4.185
4.190
4.195
4.200
4.205
4.210
4.215
4.220
4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
Battery Regulation Voltage (V)
ILOAD
= 150 mA
VBAT
= 4.2
V
TA = +25°C
4.170
4.175
4.180
4.185
4.190
4.195
4.200
4.205
4.210
4.215
4.220
-5 5 1525354555
Ambient Temperature (°C)
Battery Regulation Voltage (V)
ILOAD = 50 mA
VDD = 5.2V
4.170
4.175
4.180
4.185
4.190
4.195
4.200
4.205
4.210
4.215
4.220
-5 5 1525354555
Ambient Temperature (°C)
Battery Regulation Voltage (V)
ILOAD = 150 mA
VDD = 5.2V
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1 2 3 4 5 6 7 8 9 1011121314151617181920
Programming Resistor (k)
Charge Current (mA)
VDD
= 5.2
V
TA = +25°C
750
770
790
810
830
850
870
890
910
930
950
4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 1.33 k
TA = +25°C
MCP73113/4
DS22183C-page 10 © 2010 Microchip Technology Inc.
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Con stant-voltage mode.
FIGURE 2-7: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-8: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-9: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-10: Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-11: Charge Current (IOUT) vs.
Ambient Temperature (TA).
FIGURE 2-12: Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
475
495
515
535
555
575
595
615
635
655
675
4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 2 k
TA = +25°C
150
170
190
210
230
250
270
290
310
330
350
4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
Charge Current (mA)
RPROG = 5 k
TA = +25°C
90
96
102
108
114
120
126
132
138
144
150
4.5 4.8 5.1 5.4 5.7 6.0
Supply Voltage (V)
Fast Charge (mA)
RPROG = 10 k
TA = +25°C
50
53
56
59
62
65
68
71
74
77
80
4.54.85.15.45.76.0
Supply Voltage (V)
Charge Curent (mA)
RPROG = 20 k
TA = +25°C
750
770
790
810
830
850
870
890
910
930
950
-5 5 1525354555
Ambient Temperature (°C)
Charge Current (mA)
RPROG
= 1.33 k
VDD = 5.2V
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
-5.0 5.0 15.0 25.0 35.0 45.0 55.0
Ambient Temperature (°C)
Discharge Current (uA)
VDD < VBAT
VDD < VSTOP
End of Charge
© 2010 Microchip Technology Inc. DS22183C-page 11
MCP73113/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
FIGURE 2-13: Overvoltage Protection Start
(50 ms/Div).
FIGURE 2-14: Overvoltage Protection S top
(50 ms/Div).
FIGURE 2-15: Load Transient Response
(ILOAD = 50 mA, Output: 100 mV/Div,
Time: 100 µs/Div).
FIGURE 2-16: Complete Charge Cycle
(875 mAh Li-Ion Battery.
FIGURE 2-17: Line Transient Response
(ILOAD = 10 mA, Output: 1.0V/Div,
Source: 2.0V/Div).
FIGURE 2-18: Line Transient Response
(ILOAD = 100 mA, Output: 1.0V/Div,
Source: 2.0V/Div).
Charge Current
Input Voltage
Battery Voltage
Charge Current
Input Voltage
Battery Voltage
Output Current (mA)
Output Ripple (mV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 153045607590105120
Time (Minutes)
Battery Voltage (V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Supply Current (A)
RPROG = 2 k
875 mAh Battery
Source Voltage (V)
Output Ripple (V)
Source Voltage (V)
Output Ripple (V)
MCP73113/4
DS22183C-page 12 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 13
MCP73113/4
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLES
3.1 Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 6.0V is
recommended. Bypass to VSS with a minimum of 1 µF.
The VDD pin is rated 18V absolute maximum to prevent
suddenly rise of input voltage from spikes or low cost
ac-dc wall adapter.
3.2 Battery Charge Control Output
(VBAT)
Connect to the positive termin al of the battery. Bypass
to VSS with a minimum o f 1 µF to ensure loop stability
when the battery is disconnected.
3.3 No Connect (NC)
No connect.
3.4 Battery Management 0V Reference
(VSS)
Connect to the negative terminal of the battery and
input suppl y.
3.5 Status Output (STAT)
STA T is an open-drain logic output for connection to an
LED for charge status indication in standalone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1 for a summary of the status output during a
charge cycle.
3.6 Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during constant current (CC) mode.
PROG pin is rated up to 5V with 6V absolute maximum
value.
PROG pin also serves as charge control enable.
When a typical 200 kΩ impedance is applied to PROG
pin, the MCP73113/4 device is disabled until the high
impedance is removed. Refer to Section 5.5
“Constant Current MODE - Fast Charge” for details.
3.7 Exposed Pad (EP)
The Exposed Thermal Pad (EP) shall be connected to
the exposed copper area o n the Printed Circuit Board
(PCB) for the thermal enhancement. Additional vias on
the copper area under the MCP73113/4 device can
improve the performance of heat dissipation and
simplify the assembly process.
MCP73113/4
Symbol I/O Function
DFN-10
1, 2 VDD I Battery Management In put Supply
3, 4 VBAT I/O Battery Charge Control Output
5, 6 NC - No Connection
7 STAT O Battery Charge Status Output
8, 9 VSS - Battery Managemen t 0V Reference
10 PROG I/O Battery Charge Current Regulation Program and Charge Control Enable
11 EP Exposed Pad
MCP73113/4
DS22183C-page 14 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 15
MCP73113/4
4.0 DEVICE OVERVIEW
The MCP73113/4 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the
operational flow algorithm.
FIGURE 4-1: The MCP73113/4 Flow Chart.
VBAT < VPTH
Timer Expired
SHUTDOWN MODE
VDD < VUVLO
VDD < VPD
or
PROG > 200 kΩ
STAT = HI-Z
TEMPERATURE FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
TIMER FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
PRECONDITIONING MODE
Charge Current = IPREG
STAT = LOW
T imer Reset
Timer Enable
FAST CHARGE MODE
Charge Current = IREG
STAT = LOW
T imer Reset
T i mer Enabled
CONSTANT VOLTAGE MODE
Charge Voltage = VREG
STAT = LOW
CHARGE COMPLETE MODE
No Charge Current
STAT = HI-Z
T imer Reset
VBAT > VPTH
VBAT = VREG
VBAT < ITERM
VBAT > VPTH
VBAT < VRTH
VDD < VOVP
VDD > VOVP
OVERVOLTAGE PROTECTION
No Charge Current
STAT = Hi-Z
Timer Suspended
VDD > VOVP
VDD < VOVP
VDD > VOVP
VDD < VOVP
Timer Expired
TIMER FAULT
No Charge Current
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
Die Temperature > TSD
Die Temperature < TSDHYS
Charge Mode Resume
BATTERY SHORT PROTECTION
Charge Current = ISHORT
STAT = Flashing (Op.1)
STAT = Hi-Z (Op.2)
Timer Suspended
VBAT > VSHORT
VBAT < VSHORT
Charge Mode Resume
MCP73113/4
DS22183C-page 16 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 17
MCP73113/4
5.0 DETAILED DESCRIPTION
5.1 Undervoltage Lockout (UVLO)
An internal undervoltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73113/4 device becomes operational.
The UVLO circuit places the device in shutdown mode
if the input supply falls to approximately 150 mV above
the battery voltage.The UVLO circuit is always active.
At any time, the input supply is below the UVLO
threshold or approximately 150 mV of the voltage at the
VBAT pin, the MCP73113/4 device is placed in a
shutdown mode.
5.2 Overvoltage Protection (OVP)
An internal overvoltage protection (OVP) circuit
monitors the input voltage and keeps the charger in
shutdown mode when the input supply rises above the
OVP threshold. The hysteresis of OVP is
approximately 150 mV for the MCP73113/4 device .
The MCP73113/4 device is operational between UVLO
and OVP threshold. The OVP circuit is also recognized
as overvoltage lock out (OVLO).
5.3 Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP7311 3/4 becomes operational.
The automati c power down circuit places the d evice i n
a shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. At any time the
input supply is within +50 mV of the voltage at the
VBAT pin, the MCP73113/4 is placed in a shutdown
mode.
For a charge cycle to begin, the automatic power
down conditions must be met and the charge enable
input must be above the input high threshold.
5.3.1 BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supp ly to the MCP73113/4.
The MCP73113/4 automatically enters a Power-down
mode if the voltage on the VDD input falls to within
+50 mV of the battery voltage. This feature prevents
draining the battery pack when the VDD supply is not
present.
5.3.2 BATTERY CHARGE CONTROL
OUTPUT (VBAT)
The battery charge control output is th e drain terminal
of an internal P-channel MOSFET. The MCP73113/4
devices provide constant current and voltage
regulation to the battery pack by controlling this
MOSFET in the linear region. The battery charge
control output should be connected to the positive
terminal of the battery pack.
5.3.3 BATTERY DETECTION
The MCP73113/4 detects the battery presence with
charging of the output capacitor. The charge flow will
initiate when the voltage on VBAT is pulled below the
VRECHARGE threshold. Refer to Section 1.0 “Electrical
Characteristics” for VRECHARGE values. The value will
be the same for non-rechargeable device.
When VBAT > VREG + Hysteresis, the charge will be
suspended or not started, depends on the conditio n to
prevent over charge that may occur.
5.4 Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73113/4 device
enters a preconditioning mode. The preconditioning
threshold is factory set. Refer to Section 1.0
“Electrical Characteristics” for preconditioning
threshold options.
In this mode, the MCP73113/4 devi ce supplie s 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the
pre-conditioning threshold, the MCP73113/4 device
enters the constant current (fast charge) mode.
5.4.1 TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for fast charge mode, a timer fault is
indicated and the charge cycle terminates. The
MCP73113/4 device remains in this condition until the
battery is removed or input power is cycled. If the
battery is removed, the MCP73113/4 device enters the
standby mode where it remains until a battery is
reinserted.
Note: The MCP73113/4 also offer options with
no preconditioning.
Note: The typical preconditioning timer for
MCP73113/4 is 32 minutes. The
MCP73113/4 also offer options with no
preconditioning timer.
MCP73113/4
DS22183C-page 18 © 2010 Microchip Technology Inc.
5.5 Constant Current MODE - Fast
Charge
During the constant current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single
resistor from PROG to VSS. The program resistor and
the charge current are calculated using the following
equations:
EQUATION 5-1:
EQUATION 5-2:
Table 5-1 provides commonly seen E9 6 (1%) and E2 4
(5%) resistors for various charge current to reduce
design time.
TABLE 5-1: RESISTOR LOOKUP TABLE
Constant current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When constant current mode is invoked, the internal
timer is reset.
5.5.1 TIMER EXPIRED DURING
CONSTANT CURRENT - FAST
CHARGE MODE
If the internal timer expires before the recharge voltage
threshold is reached, a timer faul t is indicated and the
charge cycle terminates. The MCP73113/4 device
remains in this condition until the battery is removed. If
the battery is removed or input power is cycled, the
MCP73113/4 device enters the Stand-by mode where
it remains until a battery is reinserted.
5.6 Constant Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 4.10V,
4.20V, 4.35V or 4.40V with a tolerance of ±0.5%.
5.7 Charge Termination
The charge cycle is terminated when, during constant
voltage mode, the average charge current diminishes
below a threshold established with the value of 5%,
7.5%, 10% or 20% of fast charge current or internal
timer has expired. A 1 ms fil ter time o n the terminati on
comparator ensures that transient load conditions do
not result in premature charge cycle termination. The
timer period is factory set and can be disabled. Refer to
Section 1.0 “Electrical Characteristics” for timer
period options.
5.8 Automatic Recharge
The MCP73113/4 device continuously monitors the
voltage at the VBAT pin in the charge complete mode. If
the voltage drops below the recharge threshold,
another charge cycle begins and cu rrent is once again
supplied to the battery or load. The recharge threshold
is factory set. Refer to Section 1.0 “Electrical
Characteristics” for recharge threshold option s .
For the MCP73113/4 devices with no rech arge option,
the MCP73113/4 will go into standby mode when
termination condition is met. The charge will not restart
until the following conditions have been met:
Battery is removed from the system and inserted
again
•V
DD is removed and plugged in again
RPROG is disconnected (or high impedance) and
reconnected
Charge
Current (mA)
Recommended
E96 Resistor (Ω)
Recommended
E24 Resistor (Ω)
130 10k 10k
150 8.45k 8.20k
200 6.20k 6.20k
250 4.99k 5.10k
300 4.02k 3.90k
350 3.40k 3.30k
400 3.00k 3.00k
450 2.61k 2.70k
500 2.32k 2.37k
550 2.10k 2.20k
600 1.91k 2.00k
650 1.78k 1.80k
700 1.62k 1.60k
750 1.50k 1.50k
800 1.40k 1.50k
850 1.33k 1.30k
900 1.24k 1.20k
950 1.18k 1.20k
1000 1.10k 1.10k
1100 1.00k 1.00k
IREG 1104 R 0.93
×
=
Where:
RPROG = kilo-ohms (kΩ)
IREG = milliampere (mA)
RPROG 10
IREG
1104
------------
⎝⎠
⎛⎞
log
⎝⎠
⎛⎞
0.93()
=
Where:
RPROG = kilo-ohms (kΩ)
IREG = milliampere (mA)
Note: The MCP73113/4 also offer options with
no automatic recharge.
© 2010 Microchip Technology Inc. DS22183C-page 19
MCP73113/4
5.9 THERMAL REGULATION
The MCP73113/4 shall limit the charge current based
on the die temperature. The thermal regulation
optimizes the charge cycle time while maintaining
device reliability. Figure 5-1 depicts the thermal
regulation for the MCP73113/4 device. Refer to
Section 1.0 “Electrical Characteristics” for thermal
package resistances and Section 6.1.1.2 “Thermal
Considerations” for calculating power dissipation.
.
FIGURE 5-1: Charge Current (IOUT) vs.
Junction Temperature (TJ).
5.10 THERMAL SHUTDOWN
The MCP73113/4 suspends charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by
approximately 10°C. The thermal shutdown is a
secondary safety feature in the event that there is a
failure within the thermal regulation circuitry.
5.11 Status Indicator
The charge status outputs are open-drain outputs with
two different states: Low (L), and High Impedance
(Hi-Z). The charge status outputs can be used to
illuminate LEDs. Optionally, the charge status outputs
can be used as an interface to a host microcontroller.
Table 5-2 summarizes the state of the status outputs
during a charge cycle.
5.12 BATTERY SHORT PROTECTION
Once a single-cell Li-Ion battery is detected, an internal
battery short protection (BSP) circuit starts monitoring
the battery voltage. When VBAT falls below a typical
1.7V battery short protection threshold voltage, the
charging behavior is postponed. 25 mA (typical)
detection current is supplied for recovering from battery
short condition.
Preconditioning mode resumes when VBAT raises
above battery short protection threshold. The battery
voltage must rise approximately 150 mV above the
battery short protection voltage before the
MCP73113/4 device becomes operational.
0
100
200
300
400
500
600
25 35 45 55 65 75 85 95 105 115 125 135 145
Junction Temperature (°C)
Charge Current (mA)
VDD = 5.2V
RPROG = 2 k
TABLE 5-2: STATUS OUTPUTS
CHARGE CYCLE STATE STAT
Shutdown Hi-Z
Standby Hi-Z
Preconditioning L
Constant Current Fast
Charge L
Constant Voltage L
Charge Complete - Standby Hi-Z
Temperature Fault 1.6 second 50% D.C.
Flashing (Type2)
Hi-Z (Type 1)
Timer Fault 1.6 second 50% D.C.
Flashing (Type 2)
Hi-Z (Type 1)
Preconditioning Timer Fault 1.6 second 50% D.C.
Flashing (Type 2)
Hi-Z (Type 1)
MCP73113/4
DS22183C-page 20 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 21
MCP73113/4
6.0 APPLICATIONS
The MCP73113/4 devices are designed to operate in
conjunction with a host microcontroller or in
standalone applications. The MCP73113/4 provides
the preferred charge algorithm for Lithium-Ion and
Lithium-Polymer cells Constant-current followed by
Constant-voltage. Figure 6-1 depicts a typical
standalone application circuit, while Figure 6-2
depicts the accompanying charge profile.
FIGURE 6-1: Typical Application Circuit.
FIGURE 6-2: Typical Charge Profile
(875 mAh Battery).
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air . The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
6.1.1 COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
6.1.1.1 Charge Current
The preferred fast charge current for Li-Ion / Li-Poly
cells is below the 1C rate, with an absolute maximum
current at the 2C rate. The recommended fast charge
current should be obtained from battery
manufacturer. For example, a 500 mAh battery pack
with 0.7C preferred fast charge current has a charge
current of 350 mA. Charging at this rate provides the
shortest charge cycle times without degradation to the
battery pack performance or life.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 153045607590105120
Time (Minutes)
Battery Voltage (V)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Supply Current (A)
R
PROG = 2 k
8
75 mAh Battery
Note: Please consult with your battery supplier
or refer to battery data sheet for preferred
charge rate.
MCP73113/4
DS22183C-page 22 © 2010 Microchip Technology Inc.
6.1.1.2 Thermal Considerations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
Power dissipation with a 5V, ±10% input voltage
source, 500 mA ±10% and preconditioning threshold
voltage at 2.7V is:
EQUATION 6-1:
This power dissipation with the battery charger in the
DFN-10 package will resu lt approxi mate ly 63 °C above
room temperature.
6.1.1.3 External Capacitors
The MCP73113/4 are stable with or without a battery
load. In order to maintain good AC stability in the
Constant-voltage mode, a minimum capacitance of
1 µF is recommended to bypass the VBAT pin to VSS.
This capacitance provides compensation when there is
no battery load. In addition, the battery and
interconnections appear in ductive at high frequencies.
These elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
A minimum of 16V rated 1 µF, is recommended to apply
for output capacitor and a minimum of 25V rated 1 µF,
is recommended to apply for in put ca pacitor for typical
applications.
TABLE 6-1: MLCC CAPACITOR EXAMPLE
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 1 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability.
6.1.1.4 Reverse-Blocking Protection
The MCP73113/4 provide protection from a faulted or
shorted input. Without the protection, a faulted or
shorted inpu t would discharge th e battery pack th rough
the body diode of the internal pass transistor.
PowerDissipation VDDMAX VPTHMIN
()IREGMAX
×=
Where:
VDDMAX = the maximum input voltage
IREGMAX = the maximum fast charge current
VPTHMIN = the minimum transition threshold
voltage
PowerDissipation 5.5V 2.7V()550mA
×
1.54W==
MLCC
Capacitors
Temperature
Range Tolerance
X7R -55°C to +125°C ±15%
X5R -55°C to +85°C ±15%
© 2010 Microchip Technology Inc. DS22183C-page 23
MCP73113/4
6.2 PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
recommended to minimize voltage drops along the
high current-carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figure 6-4 and Figure 6-5 depict
a typical layout with PCB heatsinking.
FIGURE 6-3: Typical Layout (Top).
FIGURE 6-4: Typical Layout (Top Metal).
FIGURE 6-5: Ty pic al La yo ut (Bott om ) .
MCP73113/4
DS22183C-page 24 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 25
MCP73113/4
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
3
e
3
e
MCP73113/4
DS22183C-page 26 © 2010 Microchip Technology Inc.
© 2010 Microchip Technology Inc. DS22183C-page 27
MCP73113/4
MCP73113/4
DS22183C-page 28 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 29
MCP73113/4
APPENDIX A: REVISION HISTORY
Revision C (January 2010)
The following is the list of modificatio ns:
1. DC Characteristics table: Removed the
minimum and maximum values for the BSP S tart
Threshold parameter.
Revision B (July 2009)
The following is the list of modificatio ns:
1. Added MCP73114 device throughout the
document.
2. Updated specifications for the MCP73113/4
device family throughout the document.
3. Updated package marking information.
4. Updated Product Identification System page.
Revision A (May 2009)
Original Release of this Document.
MCP73113/4
DS22183C-page 30 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 31
MCP73113/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP73113: Single Cell Li-Ion/L i-Polymer Battery Device
MCP73113T: Single Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
MCP73114: Single Cell Li-Ion/Li-Polymer Battery Device
MCP73114T: Single Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
Temperature
Range: I= -40°C to +85°C (Industrial)
Package: MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN),
10-Lead
PART NO. XXX
PackageTemperature
Range
Device
Examples:
a) MCP73113-06SI/MF: Single Cell Li-Ion/Li-
Polymer Battery Devic e
b) MCP73113-16SI/MF: Single Cell Li-Ion/Li-
Polymer Battery Device
c) MCP73113T-06SI-MF: Tape and Reel,
Single Cell Li-Ion/Li-
Polymer Battery Device
d) MCP73113T-16SI/MF: Tape and Reel,
Single Cell Li-Ion/Li-
Polymer Battery Device
a) MCP73114-0NSI/MF: Single Cell Li-Ion/Li-
Polymer Battery Devic e
b) MCP73114T-0NSI/MF: Tape and Reel,
Single Cell Li-Ion/Li-
Polymer Battery Device
MCP73113/4
DS22183C-page 32 © 2010 Microchip Technology Inc.
NOTES:
© 2010 Microchip Technology Inc. DS22183C-page 33
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
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INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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intellectual property rights.
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All other trademarks mentioned herein are property of their
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© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:200 2 certif ication for its worldwide
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
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and manufacture of development systems is ISO 9001:2000 certified.
DS22183C-page 34 © 2010 Microchip Technology Inc.
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