MANUFACTURER CATEGORY
SERIES
PACKAGE
VOLTAGE
CLASS REV.DATE
ECLIPTEK CORP. OSCILLATOR EC25 CERAMIC 5.0V OS29 11/10
EC25 00 ET T TS Y - 40.000M TR
FREQUENCY TOLERANCE / STABILITY
00 = ±100ppm Maximum
45 = ±50ppm Maximum
25 = ±25ppm Maximum
20 = ±20ppm Maximum
OPERATING TEMPERATURE RANGE
Blank = -10°C to +70°C
ET = -40°C to +85°C
DUTY CYCLE
Blank = 50 ±10(%)
T = 50 ±5(%)
PACKAGING OPTIONS
Blank = Bulk
TR = Tape & Reel
FREQUENCY
LOAD DRIVE CAPABILITY
Blank = 10LSTTL/30pF HCMOS Load Maximum (<70MHz)
Blank = 10LSTTL/15pF HCMOS Load Maximum (>70MHz)
Y = 10TTL or 50pF HCMOS Load Maximum (<70MHz)
OUTPUT CONTROL FUNCTION
TS = Tri-State
PART NUMBERING GUIDE
A B C D E F
16+.3-.1 7.5±.1 6.75±.1 4 ±.1 2±.1
F G H J K L
8±.1 B0* 1.5 +.1-0 A0* .3 ±.05 K0*
TAPE
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13±.2 40 MIN
R S T U V
QTY/REEL
2.5 MIN 10 MIN 22.4 MAX 360 MAX 16.4+2-0 1,000
REEL
*Compliant to EIA 481A
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
Line 1: ECLIPTEK
Line 2: XX.XXX M
Frequency in MHz (5 Digits Maximum + Decimal)
Line 3: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
Tolerances = ±0.1
Pin 1: Tri-State
Pin 2: Case Ground
Pin 3: Output
Pin 4: Supply Voltage
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
1.6 +0.2/-0.5
5.00
±0.15
7.00
±0.15
MARKING
ORIENTATION
3.68
±0.15
1.4 ±01 1.2 ±0.2
2.60
±0.15
5.08
±0.15
12
34
Characteristic Specification
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A