2014-2015 Microchip Technology Inc. DS00001578C-page 1
General Description
The USB2642 is a USB 2.0 compliant, hi-speed hub
and card reader combo solution. This fully-integrated,
single chip solution provides USB expansion and flash
media reader/writer integration. The Microchip
USB2642 provides an ultra fast interface between a
USB host and today’s popular flash media formats. The
controller allows read/write capability to flash media
including the following:
• Secure DigitalTM (SD)
• SD High CapacityTM (SDHC)
• SD Extended CapacityTM (SDXC)
• MultiMediaCardTM(MMC)
• Embedded MultiMediaCardTM (eMMC)
The USB2642 offers a versatile, cost-effective and
energy-efficient hub controller with 2 downstream USB
2.0 ports and a flash media interface. The flash media
interface can support sustained transfer rates exceed-
ing 35 MB/s.
Additionally, the USB2642 provides an I2CTM over USB
bridge and an SD over USB bridge. The I2C bridge
allows for control of any I2C slave device operating at
50KHz serial clock.
Highlights
•PortMap
- Flexible port mapping and port disable
sequencing supports multiple platform
designs
•PortSwap
- Programmable USB differential-pair pin loca-
tions eases PCB design by aligning USB sig-
nal traces directly to connectors
•PHYBoost
- Programmable USB transceiver drive
strength recovers signal integrity
Features
• Single-chip USB 2.0 hub controller with 2
exposed hi-speed downstream ports
• The dedicated flash media reader is internally
attached to a 3rd downstream port of the hub as a
USB compound device
• Hub and flash media reader/writer configuration
from a single source:
- Configures internal code using an external
SPI ROM
- Supports execution of external code from SPI
Flash EEPROM
- Supports custom vendor, product, and lan-
guage ID when using an external EEPROM
• Supports full power management with individual
or ganged power control of each downstream port
• Transaction Translator (TT) in the hub supports
operation of FS and LS peripherals
• Single 24 MHz crystal support
• Control of peripheral I2C devices by USB host.
• Supports internally or externally regulated 1.8 V
core voltage operation
• Supports storage addressability of up to 2TB
• RoHS compliant package
- USB2642: 48-pin (7x7 mm²) QFN
• Temperature ranges:
- Commercial Range (0 ºC to +70 ºC)
- Industrial Range (-40 ºC to +85 ºC)
Target Applications
• Desktop and mobile PCs
• Monitors and televisions
• Mobile PC docking
• Consumer A/V
• Media players/viewers
• Printers
• Flash media card readers/writers
USB2642
USB 2.0 Hub and Flash Media Card Contro ller Combo
USB2642
DS00001578C-page 2 2014-2015 Microchip Technology Inc.
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2014-2015 Microchip Technology Inc. DS00001578C-page 3
USB2642
Table of Contents
1.0 Overview ......................................................................................................................................................................................... 4
2.0 Block Diagram ................................................................................................................................................................................. 6
3.0 USB2642 Pin Configuration ............................................................................................................................................................ 7
4.0 Pin Table ......................................................................................................................................................................................... 8
5.0 Pin Descriptions .............................................................................................................................................................................. 9
6.0 Pin Reset States ........................................................................................................................................................................... 17
7.0 Configuration Options ................................................................................................................................................................... 19
8.0 DC Parameters ............................................................................................................................................................................. 43
9.0 AC Specifications .......................................................................................................................................................................... 47
10.0 Package Outlines ........................................................................................................................................................................ 49
11.0 Revision History .......................................................................................................................................................................... 51
Appendix A: Acronyms ........................................................................................................................................................................ 52
Appendix B: References ..................................................................................................................................................................... 53
The Microchip Web Site ...................................................................................................................................................................... 54
Customer Change Notification Service ............................................................................................................................................... 54
Customer Support ............................................................................................................................................................................... 54
Product Identification System ............................................................................................................................................................. 55
2014-2015 Microchip Technology Inc. DS00001578C-page 4
USB2642
1.0 OVERVIEW
1.1 Introduction
The USB2642 offers a USB 2.0 compliant, versatile, cost-effective and energy-efficient hi-speed hub controller with 2
downstream USB ports and an SD/MMC flash media card interface. The dedicated flash media reader is internally
attached to a 3rd downstream port of the hub as a USB compound device. This combo solution supports today’s popular
multi-format flash media card formats. The flash media interface can support sustained transfer rates exceeding 35 MB/
s if the media and host support those rates.
The USB2642 also provides I2C over USB. The I2C bridge allows for control of any I2C device operating at 50kHz clock.
The USB2642 will attach to an upstream port as either a full-speed or full-/hi-speed hub. The hub supports low-speed,
full-speed, and hi-speed (if operating as a full-/hi-speed hub) downstream devices on all of the enabled downstream
ports.
All required resistors on the USB ports are integrated into the hub. This includes all series termination resistors on D+
and D- pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream facing
ports have internal pull-up resistors.
The USB2642 includes programmable features such as:
PortMap which provides flexible port mapping and disable sequences. The downstream ports of a USB2642 hub can
be reordered or disabled in any sequence to support multiple platform designs with minimum effort. For any port that is
disabled, the USB2642 automatically reorders the remaining ports to
match the USB host controller’s port numbering scheme.
PortSwap which adds per-port programmability to USB differential-pair
pin locations. PortSwap allows direct alignment of USB signals (D+/D-)
to connectors avoiding uneven trace length or crossing of the USB differ-
ential signals on the PCB.
PHYBoost which enables four programmable levels of USB signal drive
strength in downstream port transceivers. PHYBoost attempts to restore
USB signal integrity. The diagram on the right shows an example of Hi-
Speed USB eye diagrams before (PHYBoost at 0%) and after (PHYBoost
at 12%) signal integrity restoration in a compromised system environ-
ment.
USB2642
DS00001578C-page 5 2014-2015 Microchip Technology Inc.
1.2 Device Features
1.2.1 HARDWARE FEATURES
• Single-chip hub, flash media controller, and I2C device control over USB
• Supports commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges
• Transaction Translator (TT) in the hub supports operation of FS and LS peripherals
• Full power management with individual or ganged power control of each downstream port
• Optional support for external firmware access via SPI
• Code execution via SPI ROM which must meet the following qualifications:
- 60 MHz operation support
- Single bit or dual bit mode support
- Mode 0 or mode 3 SPI support
Compliant with the following flash media card specifications:
• Secure Digital 2.0
- SDSC, SDHC, and SDXC
- microSD and reduced form factor media
- Supports storage addressability of up to 2TB
• MultiMediaCard 4.2
- 1/4/8 bit
- Includes support for eMMC devices
• Control of I2C device using the I2C over USB bridge
• Supports internal regulator for 1.8 V core operation
• Supports external regulator for 1.8 V core operation
1.2.2 CONFIGURABLE FEATURES
Default configuration is loaded by USB2642 following a reset. The USB2642 may also be configured by an external I2C
EEPROM or external SPI ROM flash, where the following features are supported:
• Customizable vendor ID, product ID, and device ID
• 12-hex digits maximum for the serial number string
• 29-character manufacturer ID and product strings for flash media reader/writer
• Compound device support on a port-by-port basis a port is permanently hardwired to a downstream USB periph-
eral device
• Select over-current sensing and port power control on an individual or ganged (all ports together) basis to match
the circuit board component selection
• Port power control and over-current detection/delay features
• Configure the delay time for filtering the over-current sense inputs
• Configure the delay time for turning on downstream port power
• Bus- or self-powered selection
• Hub port disable of non-removable configurations
• Flexible port mapping and disable sequencing supports multiple platform designs
• Programmable USB differential-pair pin location selection eases PCB layout by aligning USB signal lines directly
to connectors
• Programmable USB signal drive strength improves USB signal integrity using 4 levels of signal drive strength
• Indicate the maximum current that the 2-port hub consumes from the USB upstream port
• Manage the maximum current required for the hub controller
2014-2015 Microchip Technology Inc. DS00001578C-page 6
USB2642
2.0 BLOCK DIAGRAM
FIGURE 2-1: USB2642 BLOCK DIAGRAM
To Upstream
VBUS 3.3 V
Upstream
PHY
Upstream U SB
Data
Repeater Controller
Serial
Interface
Engine
Serial
Interface
PLL
24 MHz
Crystal
Routing & Port Re-Ordering Logic
Port Controller
PHY
Port #3
OC
Sense
Switch
Driver
Bus-Power
Detect/VBUS
Pulse
1.8 V
Transaction
Translator
1.8 V Reg
PHY
Port #2
OC
Sense
Switch
Driver
USB Data
Downstream OC Sense/
Pwr Switch
8051
PROCESSOR
SFR
RAM
XDATA BRIDGE
+ BUS ARBITER
ROM
64K
RAM
6K ADDR
MAP
PWR_FET0
Program
Memory
I/O Bus
GPO1
(CRD_PWR)
GPIOs
3 K
total RAM
EP2 TX
EP2 RX
BUS
INTFC
EP0 RX
EP0 TX
EP2 RX
SIE
CTL
BRIDGE BUS
INTFC
FMDU
CTL
AUTO_CBW
PROC
FMI
BUS
INTFC
USB Data
Downstream
SD/
MMC
OC Sense/
Pwr Switch
SPI SPI (4 pins )
SD/MMC Socket
eMMM IC
I2C I2C (2 pins)
2014-2015 Microchip Technology Inc. DS00001578C-page 7
USB2642
3.0 USB2642 PIN CONFIGURATION
FIGURE 3-1: USB2642 48-PIN QFN - TOP VIEW
USB2642
RESET_N 38
VBUS_DET 39
GPO1 37
TEST0 40
VDDA33 41
USBUP_DM 43
XTAL2 44
XTAL1 (CLKIN) 45
RBIAS
48
VDDA33
47
VDD18PLL 46
USBUP_DP 42
VDDA33
1
USBDN_DM2
2
USBDN_DP2
3
USBDN_DM3
4
USBDN_DP3
5
PRTCTL2 6
PRTCTL3 7
SPI_CE_N 8
SPI_CLK/SCL_EP 9
VDD33
10
SPI_DI 11
SPI_DO/SDA_EP/SPI_SPD_SEL
12
21 SD_CLK
20 SD_D6
19 SD_D7
18 SD_D0
17
VDD18
16
SD_D1
15
VDD33
14 SD_nCD
13 SD_WP
23 SD_D5
22 REG_EN
24 SD_CMD
35
SCL
34
CRD_PWR
33
VDD33
32 SD_D3
31 NC
30 SD_D4
29 SDA
28 TEST2
36
SD_D2
27 TEST1
26 VDD33 (OTP)
25 VDD33
Indicates pins on the bottom of the device.
3
e
Ground Pad
(must be connected
to VSS)
2014-2015 Microchip Technology Inc. DS00001578C-page 8
USB2642
4.0 PIN TABLE
TABLE 4-1: USB2642 48-PIN TABLE (GROUPED BY FUNCTION)
Secure Digital (12 pins)
SD_D7 SD_D6 SD_D5 SD_D4
SD_D3 SD_D2 SD_D1 SD_D0
SD_CLK SD_CMD SD_nCD SD_WP
USB 2.0 Interface (10 pins)
USBUP_DP USBUP_DM XTAL1 (CLKIN) XTAL2
RBIAS (3) VDDA33 VDD18PLL REG_EN
2-PORT USB Interface (7 pins)
USBDN_DP2 USBDN_DM2 PRTCTL2 PRTCTL3
USBDN_DP3 USBDN_DM3 VBUS_DET -
SPI Interface (4 pins)
SPI_CE_N SPI_CLK/
SCL_EP
SPI_DO/
SDA_EP/
SPI_SPD_SEL
SPI_DI
I2C Interface (2 pins)
SCL SDA
MISC (7 pins)
RESET_N TEST0 TEST1 TEST2
GPO1 CRD_PWR (1) NC
POWER (6 pins)
(4) VDD33 VDD33 VDD18
Total 48
2014-2015 Microchip Technology Inc. DS00001578C-page 9
USB2642
5.0 PIN DESCRIPTIONS
This section provides a detailed description of each signal. The signals are arranged in functional groups according to
their associated interface. The pin descriptions below are applied when using the internal default firmware and can be
referenced in Section 7.0, Configuration Options. The acronyms used in this chapter can be referenced in Appendix A:
"Acronyms".
An N at the end of a signal name indicates that the active (asserted) state occurs when the signal is at a low voltage
level. When the N is not present, the signal is asserted when it is at a high voltage level. The terms assertion and nega-
tion are used exclusively in order to avoid confusion when working with a mixture of active low and active high signals.
The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high
or low voltage. The term negate, or negation, indicates that a signal is inactive.
5.1 USB2642 Pin Description
TABLE 5-1: USB2642 PIN DESCRIPTIONS
Symbol 48-Pin
QFN Buffer
Type Description
Secure Digital Interface
SD_D[7:0] 19
20
23
30
32
33
17
18
I/O12PU Secure Digital Data 7-0
These are the bi-directional data signals SD_D0 - SD_D7
Note: The pull up resistance is a current source that is limited to VDD.
SD_CLK 21 O12 Secure Digital Clock
This is an output clock signal to SD/MMC device.
SD_CMD 24 I/O12PU Secure Digital Command
This is a bi-directional signal that connects to the CMD signal of the SD/
MMC device.
SD_nCD 14 I/O12PU Secure Digital Card Detect
SD_WP 13 I/O12 Secure Digital Write Protect
I2C Interface
SDA 29 I/O12 Serial Data Signal
SCL 36 I/O12 Serial Clock
USB Interface
USBUP_DM
USBUP_DP 43
42
I/O-U USB Bus Data
These pins connect to the upstream USB bus data signals (host port or
upstream hub). USBUP_DM and USBUP_DP can be swapped using the
PortSwap feature.
USBDN_DM
[3:2]
USBDN_DP
[3:2]
3
1
4
2
I/O-U USB Bus Data
These pins connect to the downstream USB bus data signals and can be
swapped using the PortSwap feature.
USB2642
DS00001578C-page 10 2014-2015 Microchip Technology Inc.
PRTCTL[3:2] 7
6
I/OD12PU USB Power Enable
As an output, these pins enables power downstream USB peripheral
devices. See Section 5.3, "Port Power Control" for diagram and usage
instructions.
As an input, when the power is enabled, these pins monitor the over-
current condition. When an over-current condition is detected, these pins
turn the power off.
VBUS_DET 39 I Detect Upstream VBUS Power
The Microchip hub monitors VBUS_DET to determine when to assert the
internal D+ pull-up resistor (signaling a connect event).
When designing a detachable hub, connect this pin to the VBUS power
pin of the USB port that is upstream of the hub.
For self-powered applications with a permanently attached host, this pin
should be pulled up, typically to VDD33.
VBUS is a 3.3 volt input. A resistor divider must be used when connecting
to 5 volts of USB power.
RBIAS 47 I-R USB Transceiver Bias
A 12.0 kΩ, ±1.0% resistor is attached from VSS to this pin in order to set
the transceiver's internal bias currents.
XTAL1 (CLKIN) 45 ICLKx 24 MHz Crystal Input/External Clock Input
This pin can be connected to one terminal of the crystal or it can be
connected to an external 24 MHz clock when a crystal is not used.
XTAL2 44 OCLKx 24 MHz Crystal Output
This is the other terminal of the crystal, or a no connect pin, when an
external clock source is used to drive XTAL1 (CLKIN).
VDD18PLL 46 - 1.8 V PLL Power Bypass
This pin is the 1.8 V power bypass for the PLL. This pin requires an
external bypass capacitor of 1.0 µF.
If REG_EN is low, this pin serves as a power supply (1.8 V) for the device.
VDDA33 5
41
48
- 3.3 V Analog Power
• 48QFN - Pin 48 requires an external bypass capacitor of 4.7 µF.
SPI Interface
SPI_CE_N 8 O12 SPI Chip Enable
This is the active low chip enable output. If the SPI interface is enabled,
drive this pin high in power down states.
SPI_CLK/ 9 I/O12 SPI Clock
This is the SPI clock out to the serial ROM. See Section 5.4, "ROM Boot
Sequence" for diagram and usage instructions.
During reset, this pin is driven low.
SCL_EP When configured, this is the I²C EEPROM clock pin.
TABLE 5-1: USB2642 PIN DESCRIPTIONS
Symbol 48-Pin
QFN Buffer
Type Description
2014-2015 Microchip Technology Inc. DS00001578C-page 11
USB2642
SPI_DO/ 10 I/O12 SPI Data Out
This is the data out for the SPI port. See Section 5.4, "ROM Boot
Sequence" for diagram and usage instructions.
SDA_EP This pin is the data pin when the device is connected to the optional I²C
EEPROM.
SPI_SPD_SEL This pin is used to pick the speed of the SPI interface. During RESET_N
assertion, this pin will be tri-stated with the weak pull-down resistor
enabled. When RESET_N is negated, the value on the pin will be
internally latched, and the pin will revert to SPI_DO functionality.
Additionally, the internal pull-down will be disabled.
0 : 30 MHz
1 : 60 MHz
If the latched value is 1, then the pin is tri-stated when the chip is in the
suspend state.
If the latched value is 0, then the pin is driven low during a suspend state.
SPI_DI 11 I/O12PD SPI Data In
This is the data in to the controller from the SPI ROM.
Misc
GPO1 37 I/O12 This general purpose pin is set to be used as an output.
CRD_PWR 35 I/O200 Card power drive: 3.3 V (200 mA)
This pin powers the multiplexed flash media interface (slot) for the SD/
MMC interface.
Bits 0, 1, 2, and 3 control FET 2 of Register A5h. See Section 7.4.2.11,
"A4h-A5h: LUN 0 Power Configuration," on page 26 for more information.
NC 31 IPU
REG_EN 22 IPU Regulator Enable
This pin is internally pulled up to enable the internal 1.8 V regulators. In
order to disable the regulators, this pin will need to be externally
connected to ground.
When the internal regulator is enabled, the 1.8 V power pins must be left
unconnected, except for the required bypass capacitors.
RESET_N 38 I RESET input
This active low signal is used by the system to reset the chip. The active
low pulse should be at least 1 µs wide.
TEST[2:0] 28
27
40
IPD TEST Input
Tie these test pins to ground for normal operation.
Digital/Power/Ground
VDD18 15 - 1.8 V Digital Core Power Bypass
This pin requires an external bypass capacitor of 1.0 µF.
If REG_EN is low, this pin serves as a power supply (1.8 V) for the device.
VDD33 12
16
25
34
- 3.3 V Power and Regulator Input
• 48QFN - Pin 16 requires an external bypass capacitor of 4.7 µF mini-
mum.
VDD33 (OTP) 26 - 3.3 V Power
TABLE 5-1: USB2642 PIN DESCRIPTIONS
Symbol 48-Pin
QFN Buffer
Type Description
USB2642
DS00001578C-page 12 2014-2015 Microchip Technology Inc.
5.2 Buffer Type Descriptions
5.3 Port Power Control
5.3.1 PORT POWER CONTROL USING USB POWER SWITCH
The USB2642 has a single port power control and over-current sense signal for each downstream port. When disabling
port power, the driver will actively drive a 0. To avoid unnecessary power dissipation, the internal pull-up resistor will be
disabled at that time. When port power is enabled, the output driver is disabled, and the pull-up resistor is enabled cre-
ating an open drain output.
If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The Schmitt trigger
input will detect this event as a low. The open drain output does not interfere. The over-current sense filter handles the
transient conditions, such as low voltage, while the device is powering up.
VSS ePad - Ground Pad
The ground pad is the only VSS for the device and must be tied to ground
with multiple vias.
TABLE 5-2: USB2642 BUFFER TYPE DESCRIPTIONS
Buffer Description
I Input
IPU Input with weak internal pull-up
IS Input with Schmitt trigger
I/O12 Input/output buffer with 12 mA sink and 12 mA source
I/O200 Input/output buffer 12 mA with FET disabled, 100/200 mA source only when the FET is
enabled
I/O12PD Input/output buffer with 12 mA sink and 12 mA source, with an internal weak pull-down
resistor
I/O12PU Open drain, 12 mA sink with pull-up. Input with Schmitt trigger
I/OD12PU Input/open drain output buffer with a 12 mA sink
O12 Output buffer with a 12 mA sink and a 12 mA source
ICLKx XTAL clock input
OCLKx XTAL clock output
I/O-U Analog input/output defined in USB Specification (Appendix B)
I-R RBIAS
TABLE 5-1: USB2642 PIN DESCRIPTIONS
Symbol 48-Pin
QFN Buffer
Type Description
2014-2015 Microchip Technology Inc. DS00001578C-page 13
USB2642
5.3.2 PORT POWER CONTROL USING A POLY FUSE
When using the USB2642 with a poly fuse, an external diode must be used (see Figure 5-2). When disabling port power,
the USB2642 driver will drive a 0. This procedure will have no effect since the external diode will isolate the pin from the
load. When port power is enabled, the USB2642 output driver is disabled, and the pull-up resistor is enabled which cre-
ates an open drain output. This means that the pull-up resistor is providing 3.3 volts to the anode of the diode. If there
is an over-current situation, the poly fuse will open. This will cause the cathode of the diode to go to zero volts. The
anode of the diode will be at 0.7 volts, and the Schmitt trigger input will register this as a low resulting in an over-current
detection. The open drain output does not interfere.
FIGURE 5-1: PORT POWER CONTROL WITH USB POWER SWITCH
USB2642
USB Power
Switch
5 V
USB
Device
PRTCTL3
EN
OCS
USB Power
Switch
5 V
USB
Device
PRTCTL2
EN
OCS
USB2642
DS00001578C-page 14 2014-2015 Microchip Technology Inc.
When using a single poly fuse to power all devices, note that for the ganged situation, all power control pins must be
tied together.
FIGURE 5-2: PORT POWER CONTROL WITH SINGLE POLY F USE AND MULTIPLE LOADS
USB
Device
5 V
PRTCTL3
USB
Device
5 V
PRTCTL2
USB2642
2014-2015 Microchip Technology Inc. DS00001578C-page 15
USB2642
5.4 ROM Boot Sequence
After power-on reset, the internal firmware checks for an external SPI flash device that contains a valid signature of
2DFU (device firmware upgrade) beginning at address 0xFFFA. If a valid signature is found, then the external ROM is
enabled and code execution begins at address 0x0000 in the external SPI device. Otherwise, code execution continues
from the internal ROM.
The SPI ROM required for the USB2642 is a recommended minimum of 1 Mbit and support 60 MHz. The frequency
used is set using the SPI_SPD_SEL. For 60 MHz operation, this pin must pulled up through a 100 kΩ resistor. SPI_SP-
D_SEL is used to choose the speed of the SPI interface. During RESET_N assertion, this pin will be tri-stated with the
weak pull-down resistor enabled. When RESET_N is negated, the value on the pin will be internally latched, and the pin
will revert to SPI_DO functionality, and the internal pull-down is disabled.
The firmware can determine the speed of operation on the SPI port by checking the SPI_SPEED in the SPI_CTL Register
(0x2400 - RESET = 0x02). Both 1- and 2-bit SPI operation is supported. For optimum throughput, a 2-bit SPI ROM is
recommended. Both mode 0 and mode 3 SPI ROMS are also supported.
FIGURE 5-3: PORT POWER WITH GANGED CONTROL WITH POLY FUSE
USB
Device
Poly Fuse
5 V
USB
Device
PRTCTL2
PRTCTL3
USB2642
USB2642
DS00001578C-page 16 2014-2015 Microchip Technology Inc.
FIGURE 5-4: SPI ROM CONNECTION
SPI ROM
SPI_CE_N
SPI_CLK / SCL_EP
SPI_DI
SPI_DO / SDA_EP / SPI_SP D_SEL
USB2642
CE#
CLK
SI
SO
2014-2015 Microchip Technology Inc. DS00001578C-page 17
USB2642
6.0 PIN RESET STATES
6.1 Pin Reset States
TABLE 6-1: LEGEND FOR PIN RESET STATES
Symbol Description
0 Output driven low
1 Output driven high
IP Input enabled
PU Hardware enables pull-up
PD Hardware enables pull-down
none Hardware disables pad
- Hardware disables function
Z Hardware disables pad. Both output driver and input buffers are disabled.
TABLE 6-2: USB2642 RESET STATES
Pin Pin Name
Reset State
Function Input/
Output PU/
PD
1 USBDN_DM2 USBDN_DM2 IP PD
2 USBDN_DP2 USBDN_DP2 IP PD
3 USBDN_DM3 USBDN_DM3 IP PD
4 USBDN_DP3 USBDN_DP3 IP PD
6 PRTCTL2 PRTCTL 0 -
7 PRTCTL3 PRTCTL 0 -
8 SPI_CE_N SPI_CE_N 1 -
9 SPI_CLK/SCL_EP IO 0 -
10 SPI_DO/SDA_EP/SPI_SPD_SEL IO 0 -
11 SPI_DI SPI_DI IP PD
13 SD_WP IO 0 -
14 SD_nCD IO IP PU
17 SD_D1 none Z -
USB2642
DS00001578C-page 18 2014-2015 Microchip Technology Inc.
18 SD_D0 none Z -
19 SD_D7 none Z -
20 SD_D6 none Z -
21 SD_CLK none Z -
22 REG_EN none IP PU
23 SD_D5 none Z -
24 SD_CMD none Z -
27 TEST1 none Z -
28 TEST2 none Z -
29 SDA IO IP PU
30 SD_D4 none Z -
31 NC GPIO IP PU
32 SD_D3 none Z -
33 SD_D2 none Z -
35 CRD_PWR IO Z -
36 SCL IO 0 -
37 GPO1 GPO 0 -
38 RESET_N RESET_N IP -
39 VBUS_DET VBUS_DET IP -
40 TEST0 TEST IP PD
42 USBUP_DP USBUP_DP Z -
43 USBUP_DM USBUP_DM Z -
TABLE 6-2: USB2642 RESET STATES (CONTINUED)
Pin Pin Name
Reset State
Function Input/
Output PU/
PD
2014-2015 Microchip Technology Inc. DS00001578C-page 19
USB2642
7.0 CONFIGURATION OPTIONS
7.1 Hub
Microchip’s USB2642 hub is fully compliant with the Universal Serial Bus 2.0 Specification (References). See
Chapter 11 (Hub Specification) for general details regarding hub operation and functionality.
The hub provides a single Transaction Translator (TT) shared by both downstream ports. The TT contains 4 non-peri-
odic buffers.
7.1.1 HUB CONFIGURATION OPTIONS
The Microchip hub supports a large number of configurable features (some are mutually exclusive). There are two prin-
cipal ways to configure the hub:
• default settings
• settings loaded from an external EEPROM or SPI Flash device
7.1.1.1 Power Switching Polarity
The hub will only support active high power controllers.
7.1.2 VBUS DETECT
According to Section 7.2.1 of the USB 2.0 Specification, a downstream port can never provide power to its D+ or D- pull-
up resistors unless the upstream port’s VBUS is in the asserted (powered) state. The VBUS_DET pin on the hub mon-
itors the state of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from
an active to an inactive state (not powered), the hub will remove power from the D+ pull-up resistor within 10 seconds.
7.2 Card Reader
The Microchip USB2642 is fully compliant with the following flash media card reader specifications:
• Secure Digital 2.0
- SDSC, SDHC, and SDXC
- mircoSD and reduced form factor media
- Supports storage addressability of up to 2TB
• MultiMediaCard 4.2
- 1/4/8 bit
- includes support for eMMC devices
7.3 I2C over USB Bridge
USB2642 offers a I2C over USB bridge functionality. Host initiated SCSI pass-through commands are sent to USB2642
using Mass Storage Class driver to control I2C master interface. Additional support for detecting clock stretching during
reads is also provided.
The following features are exposed through host side I2C API:
• Write_I2C_Stream
Send any length of data over the I2C interface.
The sequence follows the I2C protocol for writing data.
• WriteRead_I2C_Stream
Read any length of data over the I2C interface.
The sequence follows the I2C protocol for reading data.
• GPIO_1_SET_OUTPUT
This method allows an application to assert GPO1 pin. This can be driving RST of the I2C slave device.
For additional configuration information and protocol details, see “USB2642 I2C Over USB Bridge User’s Guide”.
USB2642
DS00001578C-page 20 2014-2015 Microchip Technology Inc.
7.4 System Configurations
7.4.1 EEPROM/SPI INTERFACE
The USB2642 can be configured via a 2-wire (I2C) EEPROM (512x8) or an external SPI flash device containing the
firmware for the USB2642. If an external configuration device does not exist the internal default values will be used. If
one of the external devices is used for configuration, the OEM can update the values through the USB interface. The
hub will then attach to the upstream USB host.
The USBDM tool set is available in the Hub Card reader combo software release package.
7.4.2 EEPROM DATA DESCRIPTOR
TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS
Address Register Name Description Internal Default Value
00h-19h USB_SER_NUM USB Serial Number 000008264001
(Unicode)
1Ah-1Bh USB_VID USB Card Reader
Vendor ID 0424
1Ch-1Dh USB_PID USB Card Reader
Product ID 4041
1Eh-21h USB_LANG_ID USB Language Identifier 0409
(see Note 1)
22h-5Dh USB_MFR_STR USB Manufacturer String Generic
(Unicode)
5Eh-99h USB_PRD_STR USB Product String Ultra Fast Media Reader
(Unicode)
9Ah USB_BM_ATT USB BmAttribute 80h
9Bh USB_MAX_PWR USB Max Power 30h (96 mA)
9Ch ATT_LB Attribute Lo byte 40h (Reverse SD_WP only)
9Dh ATT_HLB Attribute Hi Lo byte 80h (Reverse SD2_WP only)
9Eh ATT_LHB Attribute Lo Hi byte 00h
9Fh ATT_HB Attribute Hi byte 00h
A0h-A3h rsvd
A4h LUN_PWR_LB LUN Power Lo byte 00h
A5h LUN_PWR_HB LUN Power Hi byte 0Ah
A6h-BEh rsvd
BFh-C5h DEV3_ID_STR Device 3 Identifier String SD/MMC
C6h-CDh INQ_VEN_STR Inquiry Vendor String Generic
CEh-D2h INQ_PRD_STR 48QFN Inquiry Product
String 2642
D3h DYN_NUM_LUN Dynamic Number of LUNs 01h
D4h-D7h LUN_DEV_MAP LUN to Device Mapping FFh, 00h, 00h, 00h
D8h-DAh rsvd
2014-2015 Microchip Technology Inc. DS00001578C-page 21
USB2642
Note that the following applies to the system values and descriptions:
• rsvd = reserved for internal use; do not write to these registers
Note 1: Refer to the USB 2.0 Specification (References) for other language codes.
2: This register value must not be changed from the default value.
DBh-DDh SD_MMC_BUS_TIMING SD/MMC Bus Timing
Control 59h, 56h, 97h
(Note 2)
Refer to Table 7-2, “Hub Controller Configurations,” on page 22
for a continuation of the register values DEh-17Fh.
Internal Flash Media Controller Extended Configurations:
The registers below are enabled by setting bit 7 of bmAttribute.
100h-106h CLUN0_ID_STR LUN 0 Identifier String COMBO
107h-10Dh CLUN1_ID_STR LUN 1 Identifier String COMBO
10Eh-114h CLUN2_ID_STR LUN 2 Identifier String COMBO
115h-11Bh CLUN3_ID_STR LUN 3 Identifier String COMBO
11Ch-122h CLUN4_ID_STR LUN 4 Identifier String COMBO
123h-129h rsvd
12Ah-145h rsvd
146h DYN_NUM_ EXT_LUN Dynamic Number of
Extended LUNs 00h
147h-14Bh LUN_DEV_MAP LUN to Device Mapping FFh, FFh, FFh, FFh, FFh
14Ch-17Bh rsvd
17Ch-17Fh NVSTORE_SIG2 Non-Volatile Storage
Signature ecf1
TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Address Register Name Description Internal Default Value
USB2642
DS00001578C-page 22 2014-2015 Microchip Technology Inc.
TABLE 7-2: HUB CONTROLLER CONFIGURATIONS
Address Register Name Description Internal Default Value
DEh VID_LSB Vendor ID Least Significant Byte 24h
DFh VID_MSB Vendor ID Most Significant Byte 04h
E0h PID_LSB 48QFN Product ID Least
Significant Byte 40h
E1h PID_MSB Product ID Most Significant Byte 26h
E2h DID_LSB Device ID Least Significant Byte A2h
E3h DID_MSB Device ID Most Significant Byte 08h
E4h CFG_DAT_BYT1 Configuration Data Byte 1 8Bh
E5h CFG_DAT_BYT2 Configuration Data Byte 2 28h
E6h CFG_DAT_BYT3 Configuration Data Byte 3 00h
E7h NR_DEVICE Non-Removable Devices 02h
E8h PORT_DIS_SP Port Disable (Self) 00h
E9h PORT_DIS_BP Port Disable (Bus) 00h
EAh MAX_PWR_SP Max Power (Self) 01h
EBh MAX_PWR_BP Max Power (Bus) 32h
ECh HC_MAX_C_SP Hub Controller Max Current (Self) 01h
EDh HC_MAX_C_BP Hub Controller Max Current (Bus) 32h
EEh PWR_ON_TIME Power-on Time 32h
EFh BOOST_UP Boost_Up 00h
F0h BOOST_3:2 Boost_3:2 00h
F1h PRT_SWP PortSwap 00h
F2h PRTM12 PortMap 12 00h
F3h PRTM3 PortMap 3 00h
TABLE 7-3: OTHER INTERNAL CONFIGURATIONS
Address Register Name Description Internal Default Value
F4h SD_CLK_LIM SD Clock Limit for the Flash
Media Controller 00h
F5h rsvd
F6h MEDIA_SETTINGS SD1 Timeout Configuration 00h
F7h-FBh rsvd
FCh-FFh NVSTORE_SIG Non-Volatile Storage Signature ATA2
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USB2642
7.4.2.1 00h-19h: USB Serial Number Option
7.4.2.2 1Ah-1Bh: USB Vendor Identifier Option
7.4.2.3 1Ch-1Dh: USB Product Identifier Option
7.4.2.4 1Eh-21h: USB Language Identifier Option
7.4.2.5 22h-5Dh: USB Manufacturer String Length
7.4.2.6 5Eh-99h: USB Product String Length
Byte Name Description
25:0 USB_SER_NUM Maximum string length is 12 hex digits. Must be unique to each device.
Byte Name Description
1:0 USB_VID This ID is unique for every vendor, where the vendor ID is assigned by the
USB Implementer’s Forum.
Byte Name Description
1:0 USB_PID This ID is unique for every product, where the product ID is assigned by the
vendor.
Byte Name Description
3:0 USB_LANG_ID English language code = 0409
Byte Name Description
59:0 USB_MFR_STR Maximum string length is 29 characters.
Byte Name Description
59:0 USB_PRD_STR This string is used during the USB enumeration process by Windows®. The
maximum string length is 29 characters.
USB2642
DS00001578C-page 24 2014-2015 Microchip Technology Inc.
7.4.2.7 9Ah: USB BmAttribute (1 byte)
7.4.2.8 9Bh: USB MaxPower (1 byte)
Bit Name Description
7:0 USB_BM_ATT Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus power)
or bus-powered (limited to a 100 mA maximum of upstream power prior to
being configured by the host controller).
When configured as a bus-powered device, the Microchip hub consumes less
than 100 mA of current prior to being configured. After configuration, the bus-
powered Microchip hub (along with all associated hub circuitry, any embed-
ded devices if part of a compound device, and 100 mA per externally avail-
able downstream port) must consume no more than 500 mA of upstream
VBUS current. The current consumption is system dependent, and the OEM
must ensure that the USB 2.0 specifications are not violated.
When configured as a self-powered device, <1 mA of upstream VBUS current
is consumed and all ports are available, with each port being capable of
sourcing 500 mA of current.
80 = Bus-powered operation
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
Bit Name Description
7:0 USB_MAX_PWR USB Max Power per USB Specification (References). Do NOT set this value
greater than 100 mA.
2014-2015 Microchip Technology Inc. DS00001578C-page 25
USB2642
7.4.2.9 9Ch-9Fh: Attribute Byte Descriptions
Byte Name Bit
Number Description
0 ATT_LB 3:0 Always read as 0
4 Inquire Manufacturer and Product ID Strings
1 : use the Inquiry Manufacturer and Product ID Strings.
0 : (default) - use the USB Descriptor Manufacturer and Product ID Strings.
5 Always read as 0
6 Reverse SD Card Write Protect Sense
1 : (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
0 : SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7 Always read as 0
1 ATT_HLB 3:0 Always read as 0
4 Activity LED True Polarity
1 : Activity LED to Low True
0 : (default) Activity LED polarity to High True
5 Common Media Insert/Media Activity LED
1 : the activity LED will function as a common media inserted/media access
LED.
0 : (default) the activity LED will remain in its idle state until media is
accessed.
6 Always read as 0
7 Reverse SD2 Card Write Protect Sense
1 : (default) SD cards in LUN 1 will be write protected when SW_nWP is
high, and writable when SW_nWP is low.
0 : SD cards in LUN 1 will be write protected when SW_nWP is low, and
writable when SW_nWP is high.
2 ATT_LHB 0 Attach on Card Insert/Detach on Card Removal
1 : attach on Insert is enabled
0 : (default) - attach on Insert is disabled
1 Always read as 0
2 Use LUN Power Configuration
1 : custom LUN Power Configuration stored in the NVSTORE is used
0 : (default) - default LUN Power Configuration is used.
7:3 Always read as 0
3 ATT_HB 7:0 Always read as 0
USB2642
DS00001578C-page 26 2014-2015 Microchip Technology Inc.
7.4.2.10 A0h-A3h: Reserved
7.4.2.11 A4h-A5h: LUN 0 Power Configuration
The USB2642 has one internal FET which can be utilized for card power. The settings are stored in NVSTORE and
provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power limit is set to 200 mA default for the internal FET, but can be set to 100 mA.
Each media uses two bytes to store its LUN power configuration. Bit 3 selects between internal or external. For internal
FETs bits 0 through 2 are used for the power limit. Only 2 of the possible 8 values are currently specified.
7.4.2.12 A6h-BEh: Reserved
7.4.3 DEVICE ID STRINGS
7.4.3.1 BFh-C5h: Device 3 Identifier String
7.4.3.2 C6h-CDh: Inquiry Vendor String
Byte Name Description
3:0 rsvd
TABLE 7-4: FET CONFIGURATION
FET Type Bits Bit Type Description
0FET Lo
Byte
3:0 Low Nibble rsvd
1 7:4 High Nibble
2FET Hi
Byte 3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble rsvd
Byte Name Description
25:0 rsvd
Byte Name Description
6:0 DEV3_ID_STR These bytes are used to specify the LUN descriptor returned by the device.
These bytes are used in combination with the LUN to device mapping bytes
in applications where the OEM wishes to reorder and rename the LUNs. If
this device is configured to be part of a COMBO LUN then this string is
ignored for the appropriate CLUNx_ID_STR.
Byte Name Description
7:0 INQ_VEN_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
2014-2015 Microchip Technology Inc. DS00001578C-page 27
USB2642
7.4.3.3 CEh-D2h: Inquiry Product String
7.4.3.4 D3h: Dynamic Number of LUNs
7.4.3.5 D4h-D7h: LUN to Device Mapping
7.4.3.6 D8h-DAh: Reserved
7.4.3.7 DBh-DDh: SD/MMC Bus Timing Control
7.4.3.8 DEh: Vendor ID (LSB)
Byte Name Description
4:0 INQ_PRD_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
Bit Name Description
7:0 DYN_NUM_LUN This byte is used to specify the number of LUNs the device exposes to the
host. These bytes are also used for icon sharing by assigning more than one
LUN to a single icon. This is used in applications where the device utilizes
a combo socket and the OEM wishes to have only a single icon displayed
for one or more interfaces.
If this field is set to FF, the program assumes that you are using the default
value and icons will be configured per the default configuration.
Byte Name Description
3:0 LUN_DEV_MAP These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to FF, the program assumes that you are using the default
values and LUNs will be configured per the default configuration.
Bit Name Description
2:0 rsvd
Byte Name Description
2:0 SD_MMC_BUS_
TIMING
The values for these bytes are set internally and must not be altered.
Bit Name Description
7:0 VID_LSB Least Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
USB2642
DS00001578C-page 28 2014-2015 Microchip Technology Inc.
7.4.3.9 DFh: Vendor ID (MSB)
7.4.3.10 E0h: Product ID (LSB)
7.4.3.11 E1h: Product ID (MSB)
7.4.3.12 E2h: Device ID (LSB)
7.4.3.13 E3h: Device ID (MSB)
Bit Name Description
7:0 VID_MSB Most Significant Byte of the Vendor ID. This is a 16-bit value that uniquely
identifies the vendor of the user device (assigned by USB Implementer’s
Forum).
Bit Name Description
7:0 PID_LSB Least Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
Bit Name Description
7:0 PID_MSB Most Significant Byte of the Product ID. This is a 16-bit value that the vendor
can assign that uniquely identifies this particular product.
Bit Name Description
7:0 DID_LSB Least Significant Byte of the Device ID. This is a 16-bit device release
number in BCD (binary coded decimal) format.
Bit Name Description
7:0 DID_MSB Most Significant Byte of the Device ID. This is a 16-bit device release
number in BCD format.
2014-2015 Microchip Technology Inc. DS00001578C-page 29
USB2642
7.4.3.14 E4h: Configuration Data Byte 1 (CFG_DAT_BYT1)
Bit Name Description
7 SELF_BUS_PWR Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA of upstream bus
power) or bus-powered (limited to a 100 mA maximum of upstream power
prior to being configured by the host controller).
When configured as a bus-powered device, the Microchip hub consumes
less than 100 mA of current prior to being configured. After configuration, the
bus-powered Microchip hub (along with all associated hub circuitry, any
embedded devices if part of a compound device, and 100 mA per externally
available downstream port) must consume no more than 500 mA of
upstream VBUS current. The current consumption is system dependent, and
the OEM must ensure that the USB 2.0 specifications are not violated.
When configured as a self-powered device, <1 mA of upstream VBUS
current is consumed and all ports are available, with each port being capable
of sourcing 500 mA of current.
0 : bus-powered operation
1 : self-powered operation
6 rsvd
5 HS_DISABLE Hi-Speed Disable: Disables the capability to attach as either a Hi-/Full-Speed
device, and forces attachment as Full-Speed only (i.e., no Hi-Speed support).
0 : Hi-/Full-Speed
1 : Full-Speed-Only (Hi-Speed disabled!)
4 rsvd
3 EOP_DISABLE EOP Disable: Disables EOP generation of EOF1 when in Full-Speed mode.
During FS operation only, this permits the hub to send EOP if no
downstream traffic is detected at EOF1. See Section 11.3.1 of the USB 2.0
Specification (References) for additional details.
0 : An EOP is generated at the EOF1 point if no traffic is detected.
1 : EOP generation at EOF1 is disabled (normal USB operation).
Generation of an EOP at the EOF1 point may prevent a host controller
(operating in FS mode) from placing the USB bus in suspend.
2:1 CURRENT_SNS Over-Current Sense: Selects current sensing on a port-by-port basis, all
ports ganged, or none (only for bus-powered hubs). The ability to support
current sensing on a per port or ganged basis is dependent upon the
hardware implementation.
00 : ganged sensing (all ports together)
01 : individual (port-by-port)
1x : over-current sensing is not supported (must only be used with bus-
powered configurations)
0 PORT_PWR Port Power Switching: Enables power switching on all ports simultaneously
(ganged), or port power is individually switched on and off on a port-by-port
basis (individual). The ability to support power enabling on a port or ganged
basis is dependent upon the hardware implementation.
0 : ganged switching (all ports together)
1 : individual port-by-port switching
USB2642
DS00001578C-page 30 2014-2015 Microchip Technology Inc.
7.4.3.15 E5h: Configuration Data Byte 2 (CFG_DAT_BYT2)
7.4.3.16 E6h: Configuration Data Byte 3 (CFG_DAT_BYT3)
Bit Name Description
7:6 rsvd
5:4 OC_TIMER OverCurrent Timer: Over-current timer delay.
00 : 50 ns
01 : 100 ns
10 : 200 ns
11 : 400 ns
3 COMPOUND Compound Device: Allows OEM to indicate that the hub is part of a
compound device per the USB 2.0 Specification. The applicable port(s) must
also be defined as having a “non-removable device”.
When configured via strapping options, declaring a port as non-removable
automatically causes the hub controller to report that it is part of a compound
device.
0 : no
1 : yes, the hub is part of a compound device
2:0 rsvd
Bit Name Description
7:4 rsvd
3 PRTMAP_EN Port Mapping Enable: Selects the method used by the hub to assign port
numbers and disable ports.
0 : Standard Mode. Strap options or the following registers are used to define
which ports are enabled, and the ports are mapped as port ‘n’ on the hub is
reported as port ‘n’ to the host, unless one of the ports is disabled, then the
higher numbered ports are remapped in order to report contiguous port
numbers to the host.
Register 300Ah: Port disable for self-powered operation (reset = 0x00).
Register 300Bh: Port disable for bus-powered operation (reset = 0x00).
1 : PortMap mode. The mode enables remapping via the registers defined
below.
Register 30FBh: PortMap 12 (reset = 0x00)
Register 30FCh: PortMap 3 (reset = 0x00)
2:0 rsvd
2014-2015 Microchip Technology Inc. DS00001578C-page 31
USB2642
7.4.3.17 E7h: Non-Removable Device
7.4.3.18 E8h: Port Disable For Self-Powered Operation
Bit Name Description
7:0 NR_DEVICE Indicates which port(s) include non-removable devices.
0 : port is removable
1 : port is non-removable
Informs the host if one of the active ports has a permanent device that is
undetachable from the hub. The device must provide its own descriptor data.
When using the internal default option, the NON_REM[1:0] pins will
designate the appropriate ports as being non-removable.
Bit 7 = rsvd
Bit 6 = rsvd
Bit 5 = rsvd
Bit 4 = rsvd
Bit 3 = controls physical port 3
Bit 2 = controls physical port 2
Bit 1 = controls physical port 1
Bit 0 = rsvd
Note: Bit 1 must be set to a 1 by the firmware for proper identification of
the card reader as a non-removable device.
Bit Name Description
7:0 PORT_DIS_SP Disables 1 or more ports.
0 : port is available
1 : port is disabled
During self-powered operation this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or
enumerated by a host controller. The ports can be disabled in any order
since the internal logic will automatically report the correct number of
enabled ports to the USB host and will reorder the active ports in order to
ensure proper function.
Bit 7 = rsvd
Bit 6 = rsvd
Bit 5 = rsvd
Bit 4 = rsvd
Bit 3 = controls physical port 3
Bit 2 = controls physical port 2
Bit 1 = controls physical port 1
Bit 0 = rsvd
Note: Bit 1 must be set to ‘0’ in order for the card reader to enumerate.
USB2642
DS00001578C-page 32 2014-2015 Microchip Technology Inc.
7.4.3.19 E9h: Port Disable For Bus-Powered Operation
7.4.3.20 EAh: Max Power For Self-Powered Operation
7.4.3.21 EBh: Max Power For Bus-Powered Operation
Bit Name Description
7:0 PORT_DIS_BP Disables 1 or more ports.
0 : port is available
1 : port is disabled
During self-powered operation, this register selects the ports which will be
permanently disabled. The ports are unavailable to be enabled or
enumerated by a host controller. The ports can be disabled in any order, the
internal logic will automatically report the correct number of enabled ports to
the USB host and will reorder the active ports in order to ensure proper
function.
When using the internal default option, the PRT_DIS[1:0] pins will disable the
appropriate ports.
Bit 7 = rsvd
Bit 6 = rsvd
Bit 5 = rsvd
Bit 4 = rsvd
Bit 3 = controls physical port 3
Bit 2 = controls physical port 2
Bit 1 = controls physical port 1
Bit 0 = rsvd
Note: Bit 1 must be set to 0 in order for the card reader to enumerate.
Bit Name Description
7:0 MAX_PWR_SP Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
Note: The USB 2.0 Specification (References) does not permit this value
to exceed 100 mA.
Bit Name Description
7:0 MAX_PWR_BP Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value also includes the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device, and the embedded peripheral reports 0 mA in its
descriptors.
Note: The USB 2.0 Specification does not permit this value to exceed
100 mA.
2014-2015 Microchip Technology Inc. DS00001578C-page 33
USB2642
7.4.3.22 ECh: Hub Controller Max Current For Self-Powered Operation
7.4.3.23 EDh: Hub Controller Max Current For Bus-Powered Operation
7.4.3.24 EEh: Power-On Time
7.4.3.25 EFh: Boost_Up
Bit Name Description
7:0 HC_MAX_C_SP Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a self-powered hub. This value includes the hub
silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value does NOT include the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device.
Note: The USB 2.0 Specification (References) does not permit this value
to exceed 100 mA.
A value of 50 (decimal) indicates 100 mA, which is the default value.
Bit Name Description
7:0 HC_MAX_C_BP Value in 2 mA increments that the hub consumes from an upstream port
(VBUS) when operating as a bus-powered hub. This value will include the
hub silicon along with the combined power consumption (from VBUS) of all
associated circuitry on the board. This value will NOT include the power
consumption of a permanently attached peripheral if the hub is configured
as a compound device.
A value of 50 (decimal) would indicate 100 mA, which is the default value.
Bit Name Description
7:0 POWER_ON_TIME The length of time that it takes (in 2 ms intervals) from the time the host
initiated power-on sequence begins on a port until power is adequate on that
port. If the host requests the power-on time, the system software uses this
value to determine how long to wait before accessing a powered-on port.
Bit Name Description
7:2 rsvd
1:0 BOOST_IOUT USB electrical signaling drive strength boost bit for the upstream port ‘A’.
00 : normal electrical drive strength = no boost
01 : elevated electrical drive strength = low (approximately 4% boost)
10 : elevated electrical drive strength = medium (approximately 8% boost)
11 : elevated electrical drive strength = high (approximately 12% boost)
Note: “Boost” could result in non-USB Compliant parameters. OEM
should use a 00 value unless specific implementation issues
require additional signal boosting to correct for degraded USB
signaling levels.
USB2642
DS00001578C-page 34 2014-2015 Microchip Technology Inc.
7.4.3.26 F0h: Boost_3:2
7.4.3.27 F1h: PortSwap
Bit Name Description
7:6 rsvd
5:4 BOOST_IOUT_3 Upstream USB electrical signaling drive strength boost bit for downstream
port 3.
00 : normal electrical drive strength = no boost
01 : elevated electrical drive strength = low (approximately 4% boost)
10 : elevated electrical drive strength = medium (approximately 8% boost)
11 : elevated electrical drive strength = high (approximately 12% boost)
3:2 BOOST_IOUT_2 Upstream USB electrical signaling drive strength boost bit for downstream
port 2.
00 : normal electrical drive strength = no boost
01 : elevated electrical drive strength = low (approximately 4% boost)
10 : elevated electrical drive strength = medium (approximately 8% boost)
11 : elevated electrical drive strength = high (approximately 12% boost)
“Boost” could result in non-USB Compliant parameters. OEM should use a
00 value unless specific implementation issues require additional signal
boosting to correct for degraded USB signaling levels.
1:0 rsvd
Bit Byte Name Description
7:0 PRT_SWP Swaps the upstream and downstream USB DP and DM pins for ease of
board routing to devices and connectors.
0 : USB D+ functionality is associated with the DP pin and D- functionality
is associated with the DM pin.
1 : USB D+ functionality is associated with the DM pin and D- functionality
is associated with the DP pin.
Bit 7 = rsvd
Bit 6 = rsvd
Bit 5 = rsvd
Bit 4 = rsvd
Bit 3 = controls physical port 3
Bit 2 = controls physical port 2
Bit 1 = rsvd
Bit 0 = controls physical port 0
2014-2015 Microchip Technology Inc. DS00001578C-page 35
USB2642
7.4.3.28 F2h: PortMap 12
Bit Byte Name Description
7:0 PRTM12 PortMap Register for Ports 1 and 2
When a hub is enumerated by a USB host controller, the hub is only
permitted to report how many ports it has; the hub is not permitted to select
a numerical range or assignment. The host controller will number the
downstream ports of the hub starting with the number 1, up to the number
of ports that the hub reported having.
The host's port number is referred to as logical port number and the physical
port on the hub is the physical port number. When remapping mode is
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the
hub's downstream port numbers can be remapped to different logical port
numbers (assigned by the host).
Note: The OEM must ensure that contiguous logical port numbers are
used, starting from number 1 up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
TABLE 7-5: PORTMAP REGISTER FOR PORTS 1 & 2
Bit [7:4] 0000 Physical port 2 is disabled
0001 Physical port 2 is mapped to Logical port 1
0010 Physical port 2 is mapped to Logical port 2
0011 Physical port 2 is mapped to Logical port 3
0100
to
1111
Illegal; Do not use
Bit [3:0] 0000 Physical port 1 is disabled
0001 Physical port 1 is mapped to Logical port 1
0010 Physical port 1 is mapped to Logical port 2
0011 Physical port 1 is mapped to Logical port 3
0100
to
1111
Illegal; Do not use
USB2642
DS00001578C-page 36 2014-2015 Microchip Technology Inc.
7.4.3.29 F3h: PortMap 3
7.4.3.30 F4h: SD Clock Limit for the Flash Media Controller
Bit Byte Name Description
7:0 PRTM3 PortMap Register for Port 3.
When a hub is enumerated by a USB host controller, the hub is only
permitted to report how many ports it has; the hub is not permitted to select
a numerical range or assignment. The host controller will number the
downstream ports of the hub starting with the number 1, up to the number
of ports that the hub reported having.
The host's port number is referred to as logical port number and the physical
port on the hub is the physical port number. When remapping mode is
enabled (see PRTMAP_EN in Register 08h: Configuration Data Byte 3) the
hub's downstream port numbers can be remapped to different logical port
numbers (assigned by the host).
Note: The OEM must ensure that contiguous logical port numbers are
used, starting from number 1 up to the maximum number of
enabled ports; this ensures that the hub's ports are numbered in
accordance with the way a host will communicate with the ports.
Byte Name Type Bit s Description
SD_CLK_LIM
Upper
Nibble Bits
7:4 0 : SD/MMC - 48 MHz
1 : SD/MMC - 24 MHz
2 : SD/MMC - 20 MHz
3 : SD/MMC - 15 MHz
Lower
Nibble Bits
3:0 rsvd
TABLE 7-6: PORTMAP REGISTER FOR PORT 3
Bit [7:4] 0000 rsvd
0001 rsvd
0010 rsvd
0011 rsvd
0100
to
1111
Illegal; Do not use
Bit [3:0] 0000 Physical port 3 is disabled
0001 Physical port 3 is mapped to Logical port 1
0010 Physical port 3 is mapped to Logical port 2
0011 Physical port 3 is mapped to Logical port 3
0100
to
1111
Illegal; Do not use
2014-2015 Microchip Technology Inc. DS00001578C-page 37
USB2642
7.4.3.31 F5h: Reserved
7.4.3.32 F6h: SD1/2 Timeout Options
7.4.3.33 F7h-FBh: Reserved
7.4.3.34 FCh-FFh: Non-Volatile Storage Signature
7.4.4 INTERNAL FLASH MEDIA CONTROLLER EXTENDED CONFIGURATIONS
Enable Registers 100h - 17Fh by setting bit 7 of bmAttribute.
7.4.4.1 100h-106h: Combo LUN 0 Identifier String
7.4.4.2 107h-10Dh: Combo LUN 1 Identifier String
Bit Name Description
7:0 rsvd
Bit Name Description
7:0 MEDIA_SETTINGS The SD1 and SD2 Timeout Options:
Bit 0 : rsvd
Bit 1 : rsvd
Bits 2-4 : SD1 timeout
Bits 5-7 : rsvd
A value of 001b equates to a timeout of 0.81 seconds, where 010b indicates
an additional 0.81 seconds for a total of 1.62, and so on. The maximum
value is 000b (default), which indicates a total timeout of 6.5 seconds.
Bit Byte Name Description
7:0 rsvd
Byte Name Description
4:0 NVSTORE_SIG This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ATA2.
Byte Name Description
6:0 CLUN0_ID_STR If the LUN to device mapping bytes have configured this LUN to be a combo
LUNs, then these strings will be used to identify the LUN rather than the
device identifier strings.
Byte Name Description
6:0 CLUN1_ID_STR If the LUN to device mapping bytes have configured this LUN to be a combo
LUNs, then these strings will be used to identify the LUN rather than the
device identifier strings.
USB2642
DS00001578C-page 38 2014-2015 Microchip Technology Inc.
7.4.4.3 10Eh-114h: Combo LUN 2 Identifier String
7.4.4.4 115h-11Bh: Combo LUN 3 Identifier String
7.4.4.5 11Ch-122h: Combo LUN 4 Identifier String
7.4.4.6 123h-145h: Reserved
7.4.4.7 146h: Dynamic Number of Extended LUNs
7.4.4.8 147h-14Bh: LUN to Device Mapping
Byte Name Description
6:0 CLUN2_ID_STR If the LUN to device mapping bytes have configured this LUN to be a combo
LUNs, then these strings will be used to identify the LUN rather than the
device identifier strings.
Byte Name Description
6:0 CLUN3_ID_STR If the LUN to device mapping bytes have configured this LUN to be a combo
LUNs, then these strings will be used to identify the LUN rather than the
device identifier strings.
Byte Name Description
6:0 CLUN4_ID_STR If the LUN to device mapping bytes have configured this LUN to be a combo
LUNs, then these strings will be used to identify the LUN rather than the
device identifier strings.
Byte Name Description
27:0 rsvd
Bit Name Description
7:0 DYN_NUM_
EXT_LUN
These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to FF, the program assumes that you are using the default
value and icons will be configured per the default configuration.
Byte Name Description
4:0 LUN_DEV_MAP These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing by assigning more than
one LUN to a single icon. This is used in applications where the device
utilizes a combo socket and the OEM wishes to have only a single icon
displayed for one or more interfaces.
If this field is set to FF, the program assumes that you are using the default
value and icons will be configured per the default configuration.
2014-2015 Microchip Technology Inc. DS00001578C-page 39
USB2642
7.4.4.9 14Eh-17Bh: Reserved
7.4.4.10 17Ch -17Fh: Non-Volatile Storage Signature for Extended Configuration
7.4.5 I2C EEPROM
The I2C EEPROM interface implements a subset of the I2C Master Specification (refer to the Philips Semiconductor
Standard I2C-Bus Specification (References) for details on I2C bus protocols). The device’s I2C EEPROM interface is
designed to attach to a single dedicated I2C EEPROM, and it conforms to the Standard-mode I2C Specification (100
kbit/s transfer rate and 7-bit addressing) for protocol and electrical compatibility.
7.4.5.1 Implementation Characteristics
The device will only access an EEPROM using the sequential read protocol.
7.4.5.2 Pull-Up Resistor
The circuit board designer is required to place external pull-up resistors (10 kΩ recommended) on the SPI_DO/SDA_EP/
SPI_SPD_SEL and SPI_CLK/SCL_EP lines (per SMBus 1.0 Specification (References) and EEPROM manufacturer
guidelines) to VDD33 in order to assure proper operation.
7.4.5.3 I2C EEPROM Slave Address
Slave address is 1010000b. 10-bit addressing is NOT supported.
7.4.6 IN-CIRCUIT EEPROM PROGRAMMING
The EEPROM can be programmed via automatic test equipment (ATE) by pulling RESET_N low which tri-states the
device’s EEPROM interface and allows an external source to program the EEPROM.
7.5 Default Configuration Option
The Microchip device can be configured via its internal default configuration. Please see Section 7.4.2, "EEPROM Data
Descriptor" for specific details on how to enable default configuration. Please refer to Table 7-1 for the internal default
values that are loaded when this option is selected.
7.6 Reset
There are two different resets that the device experiences. One is a hardware reset (either from the internal POR
(power-on reset) circuit or via the RESET_N pin) and the second is a USB bus reset.
7.6.1 EXTERNAL HARDWARE RESET_N
A valid hardware reset is defined as assertion of RESET_N for a minimum of 1 µs after all power supplies are within
operating range. While reset is asserted, the device (and its associated external circuitry) consumes less than IRST µA
of current from the upstream USB power source.
Byte Name Description
45:0 rsvd
Byte Name Description
3:0 NVSTORE_SIG2 This signature is used to verify the validity of the data in the upper 256 bytes
if a 512-byte EEPROM is used, otherwise this bank is a read-only configuration
area. The signature must be set to ecf1.
Note: Extensions to the I2C Specification are not supported. The device acts as the master and generates the
serial clock SCL, controls the bus access (determines which device acts as the transmitter and which
device acts as the receiver), and generates the START and STOP conditions.
USB2642
DS00001578C-page 40 2014-2015 Microchip Technology Inc.
Assertion of RESET_N (external pin) causes the following:
1. All downstream ports are disabled, and PRTCTL power to downstream devices is removed.
2. The PHYs are disabled, and the differential pairs will be in a high-impedance state.
3. All transactions immediately terminate; no states are saved.
4. All internal registers return to the default state (in most cases, 00h).
5. The external crystal oscillator is halted.
6. The PLL is halted.
7.6.1.1 RESET_N for EEPROM Configuration
Note 7-1 All power supplies must have reached the operating levels mandated in Section 8.0, "DC
Parameters", prior to (or coincident with) the assertion of RESET_N.
7.6.2 USB BUS RESET
In response to the upstream port signaling a reset, the hub does the following:
FIGURE 7-1: RESET_N TIMING FOR EEPROM MODE
TABLE 7-7: RESET_N TIMING FOR EEPROM MODE
Name Description Min Typ Max Units
t1 RESET_N asserted 1 - - µsec
t2 Device recovery/stabilization - - 500 µsec
t3 8051 programs device configuration - 20 50 msec
t4 USB attach (see Note 7-1) - - 100 msec
t5 Host acknowledges attach and signals USB reset 100 - - msec
t6 USB idle - Undefined - msec
t7 Completion time for requests (with or without data
stage) - - 5 msec
Note: The hub does not propagate the upstream USB reset to downstream devices.
t1 t2
t4
t5 t6 t7
RESET_N
VSS
Hardware
reset
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery Idle
Start
completion
request
response
t3
2014-2015 Microchip Technology Inc. DS00001578C-page 41
USB2642
1. Sets default address to 0
2. Sets configuration to: unconfigured
3. Negates PRTCTL[3:2] to all downstream ports
4. Clears all TT buffers
5. Moves device from suspended to active (if suspended)
6. Complies with Section 11.10 of the USB 2.0 Specification (References) for behavior after completion of the reset
sequence.
The host then configures the hub and the device’s downstream port devices in accordance with the USB Specification.
2014-2015 Microchip Technology Inc. DS00001578C-page 43
USB2642
8.0 DC PARAMETERS
8.1 Maximum Guaranteed Ratings
Stresses above the specified parameters may cause permanent damage to the device. This is a stress rating only. Func-
tional operation of the device at any condition above those indicated in the operation sections of this specification is not
implied. When powering this device from laboratory or system power supplies the absolute maximum ratings must not
be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC
power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. When
this possibility exists, a clamp circuit should be used.
8.2 Operating Conditions
Note 1: 0°C for commercial version, -40°C for industrial version.
Parameter Symbol Min Max Units Comments
Storage
Temperature TSTOR -55 150 °C
3.3 V supply
voltage VDD33,
VDDA33
-0.5 4.0 V
Voltage on
CRD_PWD --0.5 V
DD33 + 0.3 V When internal power FET
operation of these pins are
enabled, these pins may be
simultaneously shorted to
ground or any voltage up to
3.63 V indefinitely, without
damage to the device as
long as VDD33 and VDDA33
are less than 3.63 V and TA
is less than 70oC.
Voltage on
any signal pin --0.5 V
DD33 + 0.3 V
Voltage on
XTAL1 --0.5 3.6 V
Parameter Symbol Min Max Units Comments
Operating Temperature TANote 1 Note 2 °C Ambient temperature in still air.
(See Note 3)
3.3 V supply voltage VDD33,
VDDA33
3.0 3.6 V A 3.3 V regulator with an output
tolerance of ±1% must be used if
the output of the internal power
FET’s must support a 5%
tolerance.
3.3 V supply rise time tRT 0400µs(Figure 8-1)
1.8 V supply rise time tRT 0400µs(Figure 8-1)
Voltage on any signal
pin --0.3V
DD33 V
Voltage on XTAL1 - -0.3 2.0 V
USB2642
DS00001578C-page 44 2014-2015 Microchip Technology Inc.
2: +70°C for commercial version, +85°C for industrial version.
3: The TJ (junction temperature) must not exceed 125°C.
4: The 3.3 V supply should be at least at 75% of its operating condition before the 1.8 V supply is allowed to
ramp up.
8.3 Package Thermal Specifications
8.4 DC Electrical Characteristics
FIGURE 8-1: SUPPLY RISE TIME MODELS
TABLE 8-1: 48-PIN QFN PACKAGE THERMAL PARAMETERS
Parameter Symbol Value Unit Comments
Thermal Resistance ΘJA 28 °C/W Measured from the die to the ambient air
Junction-to-Top-of-Package ΨJT 0.2 °C/W -
Parameter Symbol Min Typ Max Units Comments
I, IPU, IPD Type Input Buffer See Note 11 for I
buffer
Low Input Level VILI 0.8 V TTL Levels
High Input Level VIHI 2.0 V
Pull Down PD 72 µA
Pull Up PU 58 µA
IS Type Input Buffer
Low Input Level VILI 0.8 V TTL Levels
High Input Level VIHI 2.0 V
t10%
10%
90%
Voltage tRT
t90% Time
100%
1.8 V
VSS
VDD18
2014-2015 Microchip Technology Inc. DS00001578C-page 45
USB2642
ICLK Input Buffer
Low Input Level VILCK 0.5 V
High Input Level VIHCK 1.4 V
Input Leakage IIL -10 +10 µA VIN = 0 to VDD33
Input Leakage
(All I and IS buffers)
Low Input Leakage IIL -10 +10 µA VIN = 0 V
High Input Leakage IIH -10 +10 µA VIN = VDD33
O12 Type Buffer
Low Output Level VOL 0.4 V IOL = 6 mA @
VDD33 = 3.3 V
High Output Level VOH VDD33
- 0.4
VI
OH = -6 mA @
VDD33 = 3.3 V
Output Leakage IOL -10 +10 µA VIN = 0 to VDD33
(Note 5)
I/O12, I/O12PU & I/O12PD Type
Buffer
Low Output Level VOL 0.4 V IOL = 6 mA @
VDD33 = 3.3 V
High Output Level VOH VDD33
- 0.4
VI
OH = -6 mA @
VDD33 = 3.3 V
Output Leakage IOL -10 +10 µA VIN = 0 to VDD33
(Note 5)
Pull Down PD 72 µA
Pull Up PU 58 µA
IO-U (Note 6)
I-R (Note 7)
Integrated Power FET set to
200 mA
Output Current (8:)I
OUT 200 mA VdropFET ≈ 0.46 V
Short Circuit Current Limit ISC 181 mA VoutFET = 0 V
On Resistance (8:)R
DSON 2.1 ΩIFET = 70 mA
Output Voltage Rise Time tDSON 800 µs CLOAD = 10 µF
Parameter Symbol Min Typ Max Units Comments
USB2642
DS00001578C-page 46 2014-2015 Microchip Technology Inc.
5: Output leakage is measured with the current pins in high impedance.
6: See the USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
7: RBIAS is a 3.3 V tolerant analog pin.
8: Output current range is controlled by program software. The software disables the FET during short circuit
condition.
9: Supply currents do not include power FET currents.
10: HS Host, 2 ports active.
11: Noise on the RESET_N signal can affect the startup, a clean 100us rise time is recommended for consistent
startup.
8.5 Capacitance
TA = 25°C; fc = 1 MHz; VDD33 = 3.3 V, VDD18 = 1.8 V
Supply Current Unconfigured Note 9
Hi-Speed Host ICCINTHS --75mA
Full Speed Host ICCINITFS --70mA
Supply Current Active HS Host
(Note 10)ICC - - 330 mA
Supply Current Suspend ICSBY - - 2500 µA
Supply Current Reset IRST - - 2500 µA
TABLE 8-2: PIN CAPACITANCE
Parameter Symbol Limits Unit Test Conditions
Min Typ Max
XTAL Pin Input Capacitance CXTAL - - 4 pF All pins (except USB pins
and pins under test) are tied
to AC ground.
Input Capacitance CIN - - 10 pF
Parameter Symbol Min Typ Max Units Comments
2014-2015 Microchip Technology Inc. DS00001578C-page 47
USB2642
9.0 AC SPECIFICATIONS
9.1 Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz ± 350 ppm.
Note 9-1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 9-2. However, the OEM
PCB itself may present a parasitic capacitance between XTAL1 and XTAL2. For an accurate
calculation of C1 and C2, take the parasitic capacitance between traces XTAL1 and XTAL2 into
account.
Note 9-2 Each of these capacitance values is typically approximately 18 pF.
FIGURE 9-1: TYPICAL CRYSTAL CIRCUIT
TABLE 9-1: CRYSTAL CIRCUIT LEGEND
Symbol Description In Accordance with
C0Crystal shunt capacitance Crystal manufacturer’s specification (see
Note 9-1)
CLCrystal load capacitance
CBTotal board or trace capacitance OEM board design
CSStray capacitance Microchip IC and OEM board design
CXTAL XTAL pin input capacitance Microchip IC
C1Load capacitors installed on OEM board Calculated values based on Figure 9-2 (see
Note 9-2)
C2
FIGURE 9-2: CAPACITANCE FORMULAS
C1 = 2 x (CL – C0) – CS1
C2 = 2 x (CL – C0) – C S2
USB2642
DS00001578C-page 48 2014-2015 Microchip Technology Inc.
9.2 Ceramic Resonator
24 MHz ± 350 ppm
9.3 External Clock
50% Duty cycle ± 10%, 24 MHz ± 350 ppm, Jitter < 100 ps rms
The external clock is recommended to conform to the signaling level designated in the JESD76-2 Specification (Refer-
ences) on 1.8 V CMOS Logic. XTAL2 should be treated as a no connect.
9.3.1 I2C EEPROM
Frequency is fixed at 58.6 kHz ± 20%.
9.3.2 USB 2.0
The Microchip device conforms to all voltage, power, and timing characteristics and specifications as set forth in the
USB 2.0 Specification (References).
FIGURE 9-3: CERAMIC RESONATOR USAGE WITH MICROCHIP IC
2014-2015 Microchip Technology Inc. DS00001578C-page 49
USB2642
10.0 PACKAGE OUTLINES
FIGURE 10-1: USB2642 48-PIN QFN
Note: For the most current package drawings,
see the Microchip Packaging Specification at
http://www.microchip.com/packaging
USB2642
DS00001578C-page 50 2014-2015 Microchip Technology Inc.
FIGURE 10-2: USB2642 LANDING PATTERN
Note: For the most current package drawings,
see the Microchip Packaging Specification at
http://www.microchip.com/packaging
2014-2015 Microchip Technology Inc. DS00001578C-page 51
USB2642
11.0 REVISION HISTORY
TABLE 11-1: REVISION HISTORY
Revision Section/Figure/Entry Correction
DS00001578C
(03-19-15)
All Removed misleading reference to SDIO support
Section 8.4, DC Electrical Characteris-
tics
Added Note 11 regarding I Buffer
DS00001578C
(03-13-15)
Table 5-1, "USB2642 Pin Descriptions" Changed Buffer type from “IS” to “I” for RESET_N
Product Identification System Changed ordering code example “d”
from:
USB2642T-I/ML, Tape & reel, Industrial temp., 48-pin
QFN
to:
USB2642T-I/ML-SEU, Tape & reel, Industrial temp.,
48-pin QFN, Low Alpha Emissions package
Worldwide Sales and Service Updated Worldwide Sales Listing page
DS00001578B Conversion to MCHP template
DS00001578A DS00001578A replaces the previous SMSC version, Revision 1.1
2014-2015 Microchip Technology Inc. DS00001578C-page 52
USB2642
APPENDIX A: ACRONYMS
Acronym Description
EOF End of (micro) Frame
EOP End of Packet
FMC Flash Media Controller
FS USB Full-Speed
HS USB Hi-Speed
I2C™ Inter-Integrated Circuit
I2C is a trademark of Philips Corporation.
LS USB Low-Speed
LUN Logical Unit Number
MMC MultiMediaCard
OCS Over-current Sense
PHY Physical Layer
PLL Phase-Locked Loop
SDC Secure Digital Controller
USB2642
DS00001578C-page 53 2014-2015 Microchip Technology Inc.
APPENDIX B: REFERENCES
[1] Universal Serial Bus Specification, Version 2.0, April 27, 2000 (12/7/2000 and 5/28/2002 Errata)
USB Implementers Forum, Inc. http://www.usb.org
[2] USB Mass Storage Class Specification Overview Rev 1.2
http://www.usb.org
[3] USB Mass Storage Class Bulk-Only Transport Rev 1.0
http://www.usb.org
[4] SCSI Architecture Model - 2 (SAM-2) and (SPC-2)
http://www.t10.org
[5] SD Specifications Part 1 Physical Layer Specification Version 2.00
http://www.sdcard.org
[6] SD Specifications Part A2 SD Host Controller Standard Specification Version 2.00
http://www.sdcard.org
[7] I2C-Bus Specification Version 1.1
NXP (formerly a division of Philips). http://www.nxp.com
[8] System Management Bus Specification, version 1.0
SMBus. http://smbus.org/specs/
[9] MicroChip 24AA02/24LC02B (Revision C)
Microchip Technology Inc. http://www.microchip.com/
[10]JEDEC Specifications: JESD76-2 (June 2001) and J-STD-020D.1 (March 2008)
JEDEC Global Standards for the Microelectronics Industry.http://www.jedec.org/standards-documents
2014-2015 Microchip Technology Inc. DS00001578C-page 54
USB2642
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
•Business of Mic r oc hi p – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
2014 Microchip Technology Inc. DS00001578C-page 55
USB2642
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: USB2642
Tape and Reel
Option: Blank = Standard packaging (tray)
T = Tape and Reel(1)
Temperature
Range: Blank = 0°C to +70°C (Commercial)
I= -40°C to +85°C (Industrial)
Package: ML = 48-pin QFN
Special: SEU = Single Event Upset
(Low Alpha Emissions Package)
Examples:
a) USB2642/ML
Tray, Commercial temp., 48-pin QFN
b) USB2642-I/ML
Tray, Industrial temp., 48-pin QFN
c) USB2642T/ML
Tape & reel, Commercial temp., 48-pin QFN
d) USB2642T-I/ML-SEU
Tape & reel, Industrial temp., 48-pin QFN, Low
Alpha Emissions Package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
PART NO. [X](1) XX
TemperatureTape and Reel
Device
[XX) - XXX
Package
-
/
Option Range
Special
(Optional)
2014-2015 Microchip Technology Inc. DS00001578C-page 56
USB2642
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such
acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of
Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implic-
itly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK,
MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial
Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2014-2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632771735
Microchip received ISO/TS-16949:200 9 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip ’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2014-2015 Microchip Technology Inc. DS00001578C-page 57
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