www.stec-inc.com
1GB to 16GB
USB Flash Module
USB Solid-State Flash Disk
Capacity: 1GB - 16GB
USB 2.0 Compliant
Form Factors:
Horizontal Mount
Standard Connector or 9-Pin D-
Connector
1-High TSOP Flash Placement or
Stacked TSOP Flash Placement
High Reliability:
Guaranteed 2M Program/Erase
Cycles
Advanced Wear-Leveling
BCH ECC Engine corrects up to
6 bits/512 Bytes errors
Automatic Bad Block Management
Single Level Cell (SLC) NAND
Flash Memory
10 Year Data Retention
Unique Serial Number
Commercial and Extended Operating
Temperature
RoHS-6 Compliant
SLUFMxGU2U(I)-y
General Description
USB Flash Module (UFM) provides non-volatile, solid-state storage in a compact
design, making it perfectly suited for embedded applications. The standard USB 2.0
interface provides designers with a true plug-n-play storage device, allowing for short
design cycles and fast time to market.
STEC’s U2, state-of-the-art, USB 2.0 flash memory controller is incorporated in the
UFM, providing high data reliability and endurance. The flash management software
that is embedded in the controller emulates a hard disk, enabling read/write operations
that are identical to a standard, sector-based hard disk. Sophisticated wear leveling
algorithms ensures greater flash endurance, while automatic bad block management
and a built-in ECC Engine guarantee the highest data reliability. Based on a BCH error
correct algorithm, the ECC engine can correct up to 6-bit errors and per 512 bytes.
USB Flash Module is available with a standard 2.54mm connector or a 9-pin Hirose
connector.
High performance, high reliability and low cost per MByte make the USB Flash Module
the product of choice in embedded applications, such as Gaming, POS Workstations,
Networking Equipment and Industrial PCs.
STEC offers value-added services to OEM customers, such as customized form factors
and test solutions, custom firmware, controlled Bill Of Materials, customer-specific
labeling and serialization.
Ordering Information: USB Flash Module
Part Number
Flash Placement
Capacity
SLUFM1GU2U(I)-y
1-High TSOP Flash
1 GBytes
SLUFM2GU2U(I)-y
1-High TSOP Flash
2 GBytes
SLUFM4GU2U(I)-y
1-High TSOP Flash
4 GBytes
SLUFM8GU2U(I)-y
1-High TSOP Flash
8 GBytes
SLUFM16GU2U-A
Stacked TSOP Flash
16 GBytes
Legend:
SLUFM = STEC standard USB Flash Module part number prefix.
G = proceeding capacity (x) is in Gigabytes (G).
U2 = STEC U2 controller
U = RoHS-6 compliant
Part numbers without (I) = Commercial Temperature Range (0ºC to 70ºC).
(I) = Extended Temperature Range (-15ºC to +85 ºC).
(y) = A for standard 7.4mm ( y) = C for 9-Pin
height connector Hirose connector
Note: 16GB is available with Commercial Temperature Range and standard height
connector only.
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Datasheet
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Table of Contents
General Description ................................................................................................................. 1
Ordering Information: USB Flash Module .............................................................................. 1
1.0 Introduction ....................................................................................................................... 3
2.0 Product Specifications ..................................................................................................... 4
2.1 Mechanical Dimensions................................................................................................................ 4
2.1.1 2x5 Standard ―A‖ Connector Form Factor ................................................................................. 4
2.1.2 9-Pin Hirose ―C‖ Connector Form Factor .................................................................................. 5
2.2 Pin Assignment ............................................................................................................................. 6
2.2.1 ―A‖ Connector, 2x5 Standard .................................................................................................... 6
2.2.2 ―C‖ Connector, 9-Pin Hirose ...................................................................................................... 6
2.3 Signal Description ......................................................................................................................... 6
2.4 Performance ................................................................................................................................. 7
2.5 Power Consumption ..................................................................................................................... 7
3.0 Theory of Operation ......................................................................................................... 8
3.1 Block Diagram .............................................................................................................................. 8
3.1.1 Controller Internal Components ................................................................................................ 8
3.1.2 Controller external components ................................................................................................ 9
3.2 Flash Management ....................................................................................................................... 9
3.2.1 Bad Block Management ............................................................................................................ 9
3.2.2 Wear Leveling ......................................................................................................................... 10
3.2.3 Error Correction ....................................................................................................................... 10
3.3 OS and Boot Support ................................................................................................................. 11
3.3.1 Using USB Flash Module with XP Embedded ........................................................................ 11
3.4 Unique Serial Number ................................................................................................................ 12
4.0 Environmental Specifications .........................................................................................13
4.1 Recommended Operating Conditions ........................................................................................ 13
4.2 Reliability .................................................................................................................................... 13
4.3 Shock, Vibration, and Humidity .................................................................................................. 13
4.4 Electrostatic Discharge (ESD) .................................................................................................... 14
4.5 Mean Time Between Failure (MTBF) ......................................................................................... 14
4.6 Standards Compliance ............................................................................................................... 14
5.0 Electrical Specifications .................................................................................................15
5.1 Absolute Maximum Ratings ........................................................................................................ 15
5.2 DC Characteristics...................................................................................................................... 15
5.3 AC Characteristics ...................................................................................................................... 16
6.0 SCSI Command List ........................................................................................................17
7.0 Evaluating USB Flash Module ........................................................................................18
8.0 Product Marking ..............................................................................................................19
9.0 Programmed Vendor and Product Names .....................................................................20
10.0 Contact Information .........................................................................................................21
10.1 STEC Worldwide Headquarters ................................................................................................. 21
10.2 STEC Worldwide Locations ........................................................................................................ 21
11.0 Revision History ..............................................................................................................22
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61000-05386-116, October 2010 3
1.0 Introduction
This datasheet includes the following sections:
Product Specifications covers the most referenced specifications, such as mechanical dimensions,
ball assignment, signal description, and performance.
Theory of Operation explains the USB Flash Module block diagram, and flash management features.
Environmental Specifications characterizes the recommended operating conditions, reliability
parameters and shock, vibration and humidity parameters.
Electrical Specifications describes the absolute maximum ratings and AC/DC characteristics.
Evaluating USB Flash Module describes how designers can evaluate the USB Flash Module if there is
no 2x5-pin or Hirose connector yet available on the hardware design.
Product Marking describes the marking on the USB Flash Module.
Figure 1: USB Flash Module
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2.0 Product Specifications
2.1 Mechanical Dimensions
2.1.1 2x5 Standard “A” Connector Form Factor
Table 1 and Figure 2 show the mechanical dimensions of the USB Flash Module with 2x5 standard
connector.
Table 1: Mechanical dimensions, 2x5 standard connector
Parameter
Length
38.00 ± 0.15 mm (1.496 ±. 0.006 in)
Width
23.00 ± 0.15 mm (0.906 ± 0.006 in)
Height
1-High TSOP Flash Placement
10.27 mm (0.404 in) max
Stacked TSOP Flash Placement
11.16 mm (0.439 in) max
Figure 2: Mechanical dimensions, 2x5 standard connector
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2.1.2 9-Pin Hirose “C” Connector Form Factor
Table 2 and Figure 3 show the mechanical dimensions of the USB Flash Module with 9-pin Hirose
connector.
Table 2: Mechanical dimensions, 9-pin Hirose connector
Parameter
Value
Length
38.00 ± 0.15 mm (1.496 ±. 0.006 in)
Width
23.00 ± 0.15 mm (0.906 ± 0.006 in)
Height
5.97 mm (0.235 in) max
Figure 3: Mechanical dimensions, 9-pin Hirose connector
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2.2 Pin Assignment
2.2.1 “A” Connector, 2x5 Standard
Table 3: 2x5 Standard Pin Assignment
Pin
Number
Signal Name
Pin Type
Pin
Number
Signal Name
Pin Type
1
VBUS
Power
6
NC
I/O
2
NC
—
7
GND
Ground
3
D-
I/O
8
NC
—
4
NC
—
9
Key
Blocked Pin
5
D+
I/O
10
LED
I/O
2.2.2 “C” Connector, 9-Pin Hirose
Table 4: Hirose Pin Assignment
Pin
Number
Signal Name
Pin Type
Pin
Number
Signal Name
Pin Type
1
NC
—
6
GND
Ground
2
NC
—
7
D+
I/O
3
LED
I/O
8
D-
I/O
4
NC
—
9
GND
Ground
5
VBUS
Power
—
2.3 Signal Description
Table 5: Signal Description
Signal Name
Type
Pin Number
(A Connectors)
Pin Number
(C Connector)
Description
VBUS
Power
1
5
Bus voltage supply from source
D-
I/O
3
8
Data line –
D+
I/O
5
7
Data line +
GND
Ground
7
6, 9
Ground
NC
Open
2, 4, 6,
8, 10
1, 2, 4
No Connect
Key
Open
9
—
Alignment pin
LED
I/O
—
3
Activity indicator
Can be connected to LED on host board
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2.4 Performance
Table 6: Read/Write Performance
Parameter
Value
Sustained Read
up to 30 MB/sec
Sustained Write
up to 20 MB/sec
2.5 Power Consumption
The power consumption currents listed in Table 7 are for reference only. Power consumption may change
according to flash memory used.
Table 7: Power Consumption
Power State
Symbol
Typ Power Consumption
(2 Flash Components)
Typ Power Consumption
(4 Flash Components)
Unit
Normal
INORMAL
67.03
77.03
mA
Suspend
ISUSPEND
0.39
2.39
mA
Sleep
ISLEEP
0.38
1.38
mA
Read
IREAD
104.12
134.12
mA
Write
IWRITE
118.74
148.74
mA
Table 8: Number of Flash Components
Capacity
Number of Flash Components
1GB
2
2GB
2
4GB
2
8GB
2
16GB
4
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3.0 Theory of Operation
3.1 Block Diagram
The USB Flash Module uses STEC’s U2, state-of-the art, USB 2.0 controller, and is combined with SLC
NAND Flash for optimal device reliability. The controller’s firmware supports the latest NAND flash
technology from multiple vendors, and is optimized for the highest performance and reliability.
The USB Flash Module controller consists of the functional blocks shown in Figure 4 and described below.
Figure 4: Controller block diagram
3.1.1 Controller Internal Components
Microcontroller which serves as the hardware backbone for the flash controller algorithm.
USB 2.0 Interface Controller with high speed (480 Mbps) device function. This block interfaces with the
host system via the USB interface.
Flash Interface Controller that serves as the interface to the NAND flash components. It supports all
the major NAND flash memory manufacturers.
Flash Storage Management Algorithm Block is responsible for the flash management, including wear
leveling, bad block management, and Error Detection and Correction.
ECC block is responsible for on-the-fly error correction.
Sector Buffer for optimized performance.
SRAM for running controller firmware fast and efficient.
ROM for storing controllers boot code.
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3.1.2 Controller external components
In addition to the functional blocks shown in Figure 4, the USB Flash Module has the following external
components:
SLC NAND Flash for the most reliable data storage.
Crystal Oscillator 12Mhz, as the main clock source.
3.2 Flash Management
Since the USB Flash Module provides a standard USB interface to the host, no software integration is
required, providing the shortest time-to-market for design engineers.
The firmware of the embedded USB 2.0 controller contains STEC’s advanced flash memory management
algorithms to ensure the most optimum device performance, reliability and endurance. It was designed to
maximize the benefits of flash memory, while at the same time overcoming inherent NAND flash
limitations. Implemented in firmware are the below features:
Flash file system management
Bad-block management
Wear-leveling
Performance optimization
3.2.1 Bad Block Management
Inherent to NAND flash technology are areas (blocks) on the media that cannot be used for storage
because of their high error rate. These so-called ―bad blocks‖ are already identified by the flash vendor
during manufacturing, but can also be accumulated over time during device operation.
The USB 2.0 controller contains a table that lists all the bad blocks on the device (Bad Block Table), and
automatically maps out these blocks upon system initialization. During device operation it ensures that
newly accumulated bad blocks are also mapped out and added to the Bad Block Table.
Bad block management is 100% transparent to the host application, which will not be aware of the location
or existence of bad blocks on the media.
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3.2.2 Wear Leveling
The SLC NAND flash devices that are being used in the USB Flash Module are guaranteed for 100,000
Write/Erase cycles per block. This means that after approximately 100,000 erase cycles, the erase block
has a higher probability for errors than the error rate that is typical to the flash. While 100,000 write/erase
cycles may be good for consumer data storage, such as digital cameras, MP3 players, etc., it is not
sufficient for industrial and embedded applications where data is constantly written to the device and long
product life is required.
For example, operating systems that use a file system, will update the File Allocation Table (FAT) every
time a write is done to the device. Without any wear leveling in place, the area on the flash where the FAT
table is located would wear out faster than other areas, reducing the lifetime of the entire flash device.
To overcome this limitation, the flash management algorithm needs to make sure that each block in the
device ages, i.e. is ―worn out‖, at the same rate. The built-in wear leveling scheme makes sure that with
every write to the flash, the youngest block is used. This ensures that the full flash media is used
uniformly, so that one area of the flash will not reach the endurance limits prematurely before other areas.
3.2.3 Error Correction
The USB 2.0 controller implements an advanced Error Correction scheme, based on the BCH error
correct algorithm. The ECC engine can correct up to 6 bits per 512 bytes (symbol based). To ensure the
fastest performance, correction is done on-the-fly, in hardware only.
Each time the host application writes a sector of 512 bytes to the USB Flash Module, a unique ECC
signature is created by the ECC engine and written together with the data to the flash. When the data is
read back by the host, the ECC engine creates again the unique ECC signature. It will then compare the
original written signature with the newly created signature, and sets an error flag if the two signatures are
not the same. Correction of the data is done on-the-fly when the error flag is set, and the data presented
to the host will be the same as the original written data. This powerful Error Correction scheme results in
an overall error rate of less than 1 in 1014 bits, read.
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3.3 OS and Boot Support
USB Flash Module can be used as the OS boot and main storage device for most Microsoft Operating
Systems, as well as most embedded Operating Systems, as listed in Table 9 In both modes the USB
Flash Module is recognized as fixed hard drive in the system.
Table 9: Supported Operating Systems
Operating System
Secondary Storage
Boot
Version
Windows XP Pro/Vista
√
√
Windows XP Embedded
√
√
Service Pack 2007
Windows CE
√
√
4.2 and 5.0
Windows for POS (WEPOS)
√
-
VxWorks
√
√
6.1 and up
Linux
√
√
Kernel 2.4 and up
Note: When using the USB Flash Module as the OS boot device, it should be verified that the system
BIOS supports booting from a USB device. Please contact your BIOS vendor to verify this.
3.3.1 Using USB Flash Module with XP Embedded
When using USB Flash Module with Windows XP Embedded, it is recommended that the Enhanced Write
Filter (EWF) feature is implemented. The EWF intercepts calls at the sector level, and thereby eliminates
many file system updates/writes to the flash. Windows XP Embedded Service Pack 2 Feature Pack 2007
introduced an additional write protect feature, called File Based Write Filter (FBWF). The new FBWF
function write-protects embedded devices at the file level, in contrast to the EWF, which has been
protecting devices at the sector level.
FBWF and EWF, combined with the built-in wear leveling algorithm, ensure that the maximum life span of
the flash device is achieved.
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3.4 Unique Serial Number
During manufacturing stage, a unique serial number is written to the USB Flash Module that includes a
date code related to the time of manufacturing.
The serial number uses the following format: AA[B][C][DD][EE][FFFF][GGGG]. Table 10 below describes
the parameters of the serial number.
Table 10: Unique Serial Number format
Symbol
Parameter
AA
STEC Reserved
B
Year (hex)
C
Month (hex)
DD
Day (hex)
EE
Computer Number (hex)
FFFF
Last 2 Bytes of MAC Address
GGGG
Serial Number, Incremental (hex)
The Serial Number can be obtained through Windows Device Manager or Linux lsusb utility.
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61000-05386-116, October 2010 13
4.0 Environmental Specifications
4.1 Recommended Operating Conditions
Table 11: Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Commercial Operating Temperature
TA1
0
25
70
C
Extended Operating Temperature
TA2
-15
-
85
C
Bus Voltage (5V)
VBUS(5V)
4.75
5.0
5.25
V
4.2 Reliability
Table 12: Reliability
Parameter
Value
Endurance
Guaranteed 2M program/erase cycles
Data reliability
1 in 1014 bits, read
Data retention
10 years
4.3 Shock, Vibration, and Humidity
Table 13: Shock, Vibration & Humidity
Parameter
Value
Shock
1500G Peak, 0.5m pulse duration, 5 pulses, 6 axes
(per JESD22-B110)
Vibration
20G Peak, 20-2000 Hz, 4 cycles per direction (X, Y and Z)
(per JESD22-B103)
Humidity
85°C, 85% RH, Vmax for 500 hrs
(per JESD22-A101)
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4.4 Electrostatic Discharge (ESD)
USB Flash Module has been tested and approved for immunity from ESD under the conditions described
in Table 14 below.
Table 14: ESD Rating for USB Flash Module
ESD Type
Value (KV)
Air
2, 4, 8
Contact
2, 4
4.5 Mean Time Between Failure (MTBF)
STEC estimates Mean Time Between Failure (MTBF), using a prediction methodology based on reliability
data for the individual components in the USB Flash Module. Table 15 below summarizes the prediction
results for the USB Flash Module, based on the following two methodologies:
Telcordia Special Report SR-332, Reliability Prediction Procedure for Electronic Equipment.
MIL-HNBK-217
The analysis was performed using Relex Software.
Table 15: USB Flash Module MTBF
Product
Condition
MTBF (hours)
SLUFM4GU2U-A
Telcordia SR-332, GB, 25°C,
MIL-HNBK-217
>8,000,000
SLUFM8GU2U-A
Telcordia SR-332, GB, 25°C,
MIL-HNBK-217
>7,000,000
4.6 Standards Compliance
USB Flash Module complies with the following standards:
CE - EN 55022/55024
FCC - Class B for Information Technology
UL 60950
RoHS-6
USB 2.0 – Mass Storage Class
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Datasheet
61000-05386-116, October 2010 15
5.0 Electrical Specifications
5.1 Absolute Maximum Ratings
Operation not guaranteed at extreme corner cases.
Table 16: Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Power Supply Voltage Relative to Ground
VBUS-VSS
-0.3 to 5.5
V
Voltage on D+ and D- Relative to Ground
VDATA
-0.3 to 3.6
V
Ambient Operating Temperature (Commercial)
TA1
0 to +70
C
Ambient Operating Temperature (Extended)
TA2
-15 to +85
C
Storage Temperature
Tstg
-40 to +85
C
5.2 DC Characteristics
Measurements at Recommended Operating Conditions, unless otherwise specified.
Table 17: DC Characteristics for Full-Speed Operation (TA=25ºC, Vdd=5V, Vss=0V)
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Supply Voltage
VBUS
3.0
5
5.5
V
Input LOW Voltage
VIL
-
-
0.8
V
Input HIGH Voltage
VIH
2.0
-
-
V
Output LOW Voltage
VOL
RL of 1.5kΩ to
3.6V
-
-
0.3
V
Output HIGH Voltage
VOH
RL of 15kΩ to GND
2.8
-
3.6
V
Output Signal Crossover
Voltage
VCRS
1.3
-
2.0
V
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Table 18: DC Characteristics for High-Speed Operation (TA=25ºC, Vdd=5V, Vss=0V)
Parameter
Symbol
Test conditions
Min
Typ
Max
Unit
Supply Voltage
VBUS
3.0
5
5. 5
V
High Speed Idle Level
VHSOI
-10
-
10
mV
High Speed Data
Signaling High
VHSOH
360
-
440
mV
High Speed Data
Signaling Low
VHSOL
-10
-
10
mV
Chirp J Level
(differential Voltage)
VCHIRPJ
0.7
-
1.1
V
Chirp K Level
(differential Voltage)
VCHIRPK
-0.9
-
-0.5
mV
5.3 AC Characteristics
Measurements at Recommended Operating Conditions, unless otherwise specified.
Table 19: AC Characteristics Full Speed
Parameter
Symbol
Min
Typ
Max
Unit
Rise Time
TFR
4
-
20
ns
Fall Time
TFF
4
-
20
ns
Differential Rise and Fall
Time Matching
TFRFM
90
111.11
%
Driver Output Resistance
ZDRV
28
-
44
Ω
Table 20: AC Characteristics High Speed
Parameter
Symbol
Min
Typ
Max
Unit
Rise Time (10%~90%)
THSR
500
-
-
ps
Fall Time (10%~90%)
THSF
500
-
-
ps
Driver Output Resistance
ZHSDRV
40.5
-
49.5
Ω
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6.0 SCSI Command List
Table 21: SCSI Command List
Command List
OpCode
RBC
SPC-2
SPC-3
INQUIRY
12h
√
√
√
MODESENSE(6)
1Ah
√
√
√
MODESENSE(10)
5Ah
-
√
√
PREVENT/ALLOW MEDIUM REMOVAL
1Eh
√
√
√
READ(10)
28h
√
-
-
READ CAPACITY
25h
√
-
-
REQUEST SENSE
03h
-
√
√
START STOP UNIT
1Bh
√
-
-
TEST UNIT READY
00h
√
√
√
WRITE(10)
2Ah
√
-
-
VERIFY(10)
2Fh
√
-
-
SYNC CACHE
35h
√
-
-
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7.0 Evaluating USB Flash Module
Adapters are available for customers that do not have the hardware layout ready for the USB Flash
Module. The adapter shown in Figure 5 uses a standard ―series A‖ (2.54mm) connector and enable
inserting the USB Flash Module into a standard USB port on a desktop or laptop PC. Inquire for adapters
that use the ―series C‖ (9-pin Hirose) connector.
Figure 5: USB Flash Module Adapter
The adapters can be ordered with the following ordering information:
SLUFDM-2x5-ADPT-A
SLUFDM-ADPT-C (Preliminary, inquire for availability)
With:
A = Adapter for USB Flash Module with standard 2.54mm connector
C = Adapter for USB Flash Module with 9-pin Hirose connector
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8.0 Product Marking
The flash module will be shipped with 2 labels, the Manufacturing Label and the Standards Label. The
Manufacturing Label lists the Customer Part Number, Serial Number, BOM Assembly Number, Ordering
Part Number, Kanban ID (with date code). Refer to Table 22 to decode the Kanban ID and Table 23 to
decode the BOM Assembly Number.
Table 22: Kanban ID info
Kanban ID
yymmdd-XXX-xxx
Description
yymmdd
Date code of manufacturing
XXX
SMT Line at which the part
was manufactured
xxx
lot code
Table 23: BOM Assembly Number info
BOM Assembly Number
(Format: ppp00-0xxxx-yyzCU)
Description
ppp00
STEC designation for OEM Flash products
(ppp is 940 for standard, or customer prefix for custom)
0xxxx
PCB Number
yy
Product Revision
z
Capacity Designator (Randomly assigned per PCB
number based on designator availability)
C
Commercial Operating Temperature
U
RoHS Compliant
The Standards Label (Figure 6) shows the standards for which the USB Flash Module is certified.
Figure 6: Standards Label
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61000-05386-116, October 2010 20
9.0 Programmed Vendor and Product Names
The USB Flash Module can be manufactured with standard or customer-specific Vendor and Product
Names. Table 24 lists the STEC standard names for USB Flash Module.
The names can be displayed by the OS, for example, Windows XP displays the names in the notifications
area in the right corner of the screen the first time the module is installed. Windows Device Manager and
the properties of the USB Flash Module also can display the names
Table 24: STEC Standard USB Vendor and Product Names
Parameter
Value
Vendor Name
―STEC‖
Product Name
―STEC USB 2.0‖
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10.0 Contact Information
10.1 STEC Worldwide Headquarters
STEC INC
3001 Daimler Street
General Support:
1-949-476-1180
Santa Ana, California 92705
Fax Number:
1-949-476-1209
United States of America (USA)
E-mail:
oemsupport@stec-inc.com
10.2 STEC Worldwide Locations
STEC ITALY S. R. L.
STEC TAIWAN
STEC JAPAN G.K.
Via del Caravaggio, 3
RM1101, 11F, No. 495
Shinyurigaoka-City Building 4-402
20111 Milano
Guang-Fu S. Road
1-1-1, Manpukuji, Aso-ku, Kawaski-shi
Italy
Taipei
Kanagawa-ken 215-0004
Taiwan
Japan
Phone:
+39 02 497 56 213
Phone:
+886 2 8780 8000 Ext. 1101
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SLUFMxGU2U(I)-y USB Flash Module
Datasheet
61000-05386-116, October 2010 22
11.0 Revision History
Revision Date Description
-101 10/24/2008 Preliminary initial release.
-102 11/17/2008. Dimension line from center of connector to center of mounting hole corrected.
-103 11/27/2008 Form Factor with low profile connector (y=B) is not offered.
-104 12/03/2008 ECC engine corrects 12 bits/512 bytes.
-105 12/12/2008 Endurance added to Features and Reliability table.
-106 12/22/2008 Serial Number definition updated. Bus Voltage corrected. Absolute Maximum
Ratings at extreme corners or not guaranteed. Product Name programmed into
device updated. Preliminary notice removed.
-107 01/09/2009 VBUS(3V3) removed from Recommended Operating Conditions.
-108 02/06/2009 VBUS(5V) tolerance updated to ±5%
-109 92/18/2009 Mounting hole dimension of standard height uFM corrected from 3.2mm to
4.0mm.
-110 92/23/2909 Linux utility to obtain Serial Number is corrected to lsusb.
-111 10/27/2009 16GB capacity added.
-112 12/01/2009 Stacked Flash Package Dimensions added for 16GB.
-113 12/07/2009 Industrial Temperature option updated to Extended Temperature option.
-114 06/07/2010 ECC corrects 6-bit with 2K/4K flash, and 12-bit with 8K flash.
-115 08/18/2010 Serial Number definition updated. BOM Assembly Number table clarified.
-116 10/21/2010 BOM Number decoder table corrected.
SLUFMxGU2U(I)-y USB Flash Module
Datasheet
61000-05386-116, October 2010 23
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