VN750 High-side driver Datasheet - production data Features Type VN750 VN750S VN750PT VN750-B5 RDS(on) IOUT VCC SO-8 60 m 6A PENTAWATT 36 V CMOS compatible input On-state open-load detection Off-state open-load detection Shorted load protection Undervoltage and overvoltage shutdown Protection against loss of ground Very low standby current Reverse battery protection P2PAK PPAK Description The VN750 is a monolithic device designed using STMicroelectronic(R) VIPower(R) M0-3 technology. The VN750 is intended for driving any type of load with one side connected to ground. The active VCC pin voltage clamp protects the device against low energy spikes. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device detects the openload condition in both the on-state and off-state. In the off-state the device detects if the output is shorted to VCC. The device automatically turns off where the ground pin becomes disconnected. Table 1. Device summary Order codes Package Tube Tape and reel PENTAWATT VN750 -- SO-8 VN750S VN750S13TR P2PAK VN750-B5 VN750-B513TR PPAK VN750PT VN750PT13TR May 2012 This is information on a product in full production. Doc ID 6942 Rev. 4 1/46 www.st.com 1 Contents VN750 Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 4 2/46 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 19 2.5.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 19 2.5.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 20 2.6 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.7 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.8 Open-load detection in Off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 2.9 SO-8 maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . 22 2.10 PPAK/P2PAK maximum demagnetization energy (VCC = 13.5V) . . . . . . 23 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.1 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.2 P2PAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 3.3 PPAK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.2 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4.3 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 4.4 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 4.5 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 4.6 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4.7 PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.8 P2PAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.9 PPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Doc ID 6942 Rev. 4 VN750 5 Contents Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Doc ID 6942 Rev. 4 3/46 List of tables VN750 List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. 4/46 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 VCC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 P2PAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 PPAK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Doc ID 6942 Rev. 4 VN750 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43. Figure 44. Figure 45. Figure 46. Figure 47. Figure 48. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Status timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Open-load On-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Open-load Off-state voltage detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Ilim vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO-8 maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PPAK /P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . 23 SO-8 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 24 SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 27 P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 27 Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 PPAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . . 29 PPAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Thermal fitting model of a single channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 P2PAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 PPAK package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 SO-8 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 PENTAWATT tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 P2PAK tape and reel (suffix "13TR"). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Doc ID 6942 Rev. 4 5/46 List of figures Figure 49. Figure 50. Figure 51. 6/46 VN750 PPAK suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 PPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 PPAK tape and reel (suffix "13TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Doc ID 6942 Rev. 4 VN750 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC OVERVOLTAGE DETECTION VCC CLAMP UNDERVOLTAGE DETECTION GND Power CLAMP DRIVER INPUT OUTPUT LOGIC CURRENT LIMITER ON STATE OPENLOAD DETECTION STATUS OVERTEMPERATURE DETECTION Figure 2. VCC OUTPUT OUTPUT VCC OFF STATE OPENLOAD AND OUTPUT SHORTED TO VCC DETECTION Configuration diagram (top view) 5 4 8 1 5 N.C. STATUS INPUT GND 4 3 2 1 OUTPUT STATUS VCC INPUT GND OUTPUT STATUS VCC INPUT GND 5 4 3 2 1 PC10000 PPAK / P2PAK SO-8 Table 2. PENTAWATT Suggested connections for unused and not connected pins Connection / pin Status N.C. Output Input Floating X X X X To ground X Doc ID 6942 Rev. 4 Through 10K resistor 7/46 Electrical specifications 2 VN750 Electrical specifications Figure 3. Current and voltage conventions IS VF IIN VCC INPUT ISTAT IOUT STATUS VCC OUTPUT GND VIN VSTAT 2.1 VOUT IGND Absolute maximum ratings Stressing the device above the rating listed in the Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Table 3. Absolute maximum ratings Value Symbol Parameter SO-8 VCC DC supply voltage -VCC P2PAK Unit PPAK 41 V Reverse DC supply voltage -0.3 V -Ignd DC reverse ground pin current -200 mA IOUT DC output current Internally limited A -IOUT Reverse DC output current -6 A DC input current +/- 10 mA ISTAT DC Status current +/- 10 mA VESD Electrostatic discharge (human body model: R = 1.5 K; C = 100 pF) - INPUT - STATUS - OUTPUT - VCC 4000 4000 5000 5000 V V V V IIN 8/46 PENTAWATT Doc ID 6942 Rev. 4 VN750 Electrical specifications Table 3. Absolute maximum ratings (continued) Value Symbol Parameter SO-8 EMAX Maximum switching energy (L = 1.8 mH; RL = 0 ; Vbat = 13.5 V; Tjstart = 150C; IL = 9 A) EMAX Maximum switching energy (L = 2.46 mH; RL = 0 ; Vbat = 13.5 V; Tjstart = 150C; IL = 9 A) Ptot Power dissipation TC = 25C Tj Junction operating temperature Tc Tstg 2.2 PENTAWATT P2PAK Unit PPAK 100 mJ 4.2 138 138 mJ 60 60 W 60 Internally limited C Case operating temperature -40 to 150 C Storage temperature -55 to 150 C Thermal data Table 4. Thermal data Max. value Symbol Parameter S0-8 Rthj-case Thermal resistance junction-case Rthj-lead Thermal resistance junction-lead Thermal resistance junction-ambient Unit - 2.1 2.1 2.1 C/W 30 - - - C/W 62.1 52.1(2) 77.1(2) C/W 62.1 37(4) 44(4) C/W 93(1) Rthj-amb PENTAWATT P2PAK PPAK 82(3) 1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 m thick). Horizontal mounting and no artificial air flow. 3. When mounted on a standard single-sided FR-4 board with 2 cm2 of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 4. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 m thick). Horizontal mounting and no artificial air flow. Doc ID 6942 Rev. 4 9/46 Electrical specifications 2.3 VN750 Electrical characteristics Values specified in this section are for 8 V < VCC < 36 V; -40C < Tj < 150C, unless otherwise stated. Table 5. Symbol Parameter Min. Typ. VCC Operating supply voltage 5.5 13 36 V VUSD Undervoltage shutdown 3 4 5.5 V VUSDhyst Undervoltage shutdown hysteresis VOV Overvoltage shutdown RON On state resistance IS Test conditions Max. Unit 0.5 V 36 Supply current V IOUT = 2 A; Tj = 25C; VCC > 8 V 60 m IOUT = 2 A; VCC > 8 V 120 m Off-state; VCC = 13 V; VIN = VOUT = 0 V 10 25 A Off-state; VCC = 13 V; VIN = VOUT = 0 V; Tj = 25C 10 20 A On-state; VCC = 13 V; VIN = 5 V; IOUT = 0 A 2 3.5 mA 0 50 A -75 0 A IL(off1) Off-state output current VIN = VOUT = 0 V IL(off2) Off-state output current VIN = 0 V; VOUT = 3.5 V IL(off3) Off-state output current VIN = VOUT = 0 V; VCC = 13 V; Tj = 125C 5 A IL(off4) Off-state output current VIN = VOUT = 0 V; VCC = 13 V; Tj = 25C 3 A Table 6. Symbol Switching (VCC = 13 V) Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time RL = 6.5 from VIN rising edge to VOUT = 1.3V 40 s td(off) Turn-off delay time RL = 6.5 from VIN falling edge to VOUT = 11.7 V 30 s dVOUT/dt(on) Turn-on voltage slope RL = 6.5 from VOUT = 1.3 V to VOUT=10.4 V See Figure 21 V/s dVOUT/dt(off) Turn-off voltage slope RL = 6.5 from VOUT = 11.7 V to VOUT=1.3 V See Figure 22 V/s Table 7. Symbol 10/46 Power Input pin Parameter Test conditions VIL Input low level IIL Low level input current VIH Input high level VIN = 1.25 V Doc ID 6942 Rev. 4 Min. Typ. Max. Unit 1.25 V 1 A 3.25 V VN750 Electrical specifications Table 7. Symbol Input pin (continued) Parameter Test conditions IIH High level input current Vhyst Input hysteresis voltage VICL Input clamp voltage Table 8. Symbol VF Table 9. Symbol Min. Typ. VIN = 3.25 V Max. Unit 10 A 0.5 IIN = 1 mA V 6 6.8 IIN = -1 mA 8 -0.7 V V VCC output diode Parameter Test conditions Forward on voltage -IOUT = 1.3 A; Tj = 150C Min. Typ. Max. Unit -- -- 0.6 V Min. Typ. Max. Unit Status pin Parameter Test conditions VSTAT Status low output voltage ISTAT = 1.6 mA 0.5 V ILSTAT Status leakage current Normal operation; VSTAT = 5 V 10 A CSTAT Status pin input capacitance Normal operation; VSTAT = 5 V 100 pF 8 V VSCL Status clamp voltage Table 10. Protections(1) Symbol Parameter ISTAT = 1 mA 6 6.8 ISTAT = -1 mA V Min. Typ. Max. Unit Shutdown temperature 150 175 200 C TR Reset temperature 135 Thyst Thermal hysteresis 7 tSDL Status delay in overload Tj > Tjsh condition Ilim Current limitation TTSD Vdemag Test conditions -0.7 9 V < VCC < 36 V 6 C 15 9 5 V< VCC < 36 V Turn-off output clamp voltage IOUT = 2 A; VIN = 0 V; L = 6 mH C 20 ms 15 A 15 A VCC - 41 VCC - 48 VCC - 55 V 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles. Table 11. Symbol Open-load detection Parameter Test conditions IOL Open-load ON-state detection threshold VIN = 5 V tDOL(on) Open-load ON-state detection delay IOUT = 0 A Doc ID 6942 Rev. 4 Min. 50 Typ. Max. Unit 200 mA 200 s 11/46 Electrical specifications Table 11. VN750 Open-load detection (continued) Symbol Parameter VOL Open-load OFF-state voltage detection threshold tDOL(off) Open-load detection delay at turn-off Figure 4. Test conditions VIN = 0 V Typ. Max. Unit 3.5 V 1000 s 1.5 Status timings OPEN LOAD STATUS TIMING (with external pull-up) IOUT< IOL VOUT > VOL OVERTEMP STATUS TIMING Tj > Tjsh VIN VIN VSTAT VSTAT tDOL(off) Figure 5. Min. tDOL(on) tSDL tSDL Switching time waveforms VOUT 90% 80% dVOUT/dt(off) dVOUT/dt(on) 10% t VIN td(on) td(off) t 12/46 Doc ID 6942 Rev. 4 VN750 Electrical specifications Table 12. Truth table Conditions Input Output Status Normal operation L H L H H H Current limitation L H H L X X H (Tj < TTSD) H (Tj > TTSD) L Overtemperature L H L L H L Undervoltage L H L L X X Overvoltage L H L L H H Output voltage > VOL L H H H L H Output current < IOL L H L H H L Doc ID 6942 Rev. 4 13/46 Electrical specifications Table 13. VN750 Electrical transient requirements on VCC pin (part 1) Test levels ISO T/R 7637/1 Test pulse I II III IV Delays and impedance 1 - 25 V - 50 V - 75 V - 100 V 2 ms 10 2 + 25 V + 50 V + 75 V + 100 V 0.2 ms 10 3a - 25 V - 50 V - 100 V - 150 V 0.1 s 50 3b + 25 V + 50 V + 75 V + 100 V 0.1 s 50 4 -4V -5V -6V -7V 100 ms, 0.01 5 + 26.5 V + 46.5 V + 66.5 V + 86.5 V 400 ms, 2 Table 14. Electrical transient requirements on VCC pin (part 2) Test levels results ISO T/R 7637/1 test pulse I II III IV 1 C C C C 2 C C C C 3a C C C C 3b C C C C 4 C C C C 5 C E E E Table 15. Class 14/46 Electrical transient requirements on VCC pin (part 3) Contents C All functions of the device are performed as designed after exposure to disturbance. E One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device. Doc ID 6942 Rev. 4 VN750 Electrical specifications Figure 6. Waveforms NORMAL OPERATION INPUT LOAD VOLTAGE STATUS UNDERVOLTAGE VUSDhyst VCC VUSD INPUT LOAD VOLTAGE STATUS undefined OVERVOLTAGE VCC<VOV VCC > VOV VCC INPUT LOAD VOLTAGE STATUS OPEN LOAD with external pull-up INPUT VOUT > VOL LOAD VOLTAGE VOL STATUS OPEN LOAD without external pull-up INPUT LOAD VOLTAGE STATUS Tj TTSD TR OVERTEMPERATURE INPUT LOAD CURRENT STATUS Doc ID 6942 Rev. 4 15/46 Electrical specifications 2.4 VN750 Electrical characteristics curves Figure 7. Off-state output current Figure 8. High level input current Iih (uA) IL(off1) (uA) 7 3 2.5 6 Off state Vcc=36V Vin=Vout=0V 2 Vin=3.25V 5 1.5 4 1 3 0.5 2 0 1 -0.5 -1 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) Figure 9. 50 75 100 125 150 175 Tc (C) Input clamp voltage Figure 10. Status leakage current Ilstat (uA) Vicl (V) 8 0.05 7.8 Iin=1mA 0.04 7.6 Vstat=5V 7.4 0.03 7.2 7 0.02 6.8 6.6 0.01 6.4 6.2 0 6 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 11. 50 75 100 125 150 175 Tc (C) Tc (C) Status low output voltage Figure 12. Status clamp voltage Vstat (V) Vscl (V) 0.6 8 7.8 Istat=1mA 0.5 7.6 Istat=1.6mA 7.4 0.4 7.2 7 0.3 6.8 0.2 6.6 6.4 0.1 6.2 0 6 -50 -25 0 25 50 75 100 125 150 175 16/46 -50 -25 0 25 50 75 Tc (C) Tc (C) Doc ID 6942 Rev. 4 100 125 150 175 VN750 Electrical specifications Figure 13. On-state resistance vs Tcase Figure 14. On-state resistance vs VCC Ron (mOhm) Ron (mOhm) 140 120 110 120 Iout=2A Iout=2A Vcc=8V; 13V; 36V 100 100 Tc= 150C 90 80 80 Tc= 125C 70 60 60 50 40 Tc= 25C 40 Tc= - 40C 20 30 0 20 -50 -25 0 25 50 75 100 125 150 175 5 10 15 20 Tc (C) 25 30 35 40 Vcc (V) Figure 15. Open-load On-state detection Figure 16. Input high level threshold Iol (mA) Vih (V) 220 3.6 200 3.4 Vcc=13V Vin=5V 180 3.2 160 140 3 120 2.8 100 2.6 80 60 2.4 40 2.2 20 0 2 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 Tc (C) Figure 17. Input low level Figure 18. Input hysteresis voltage Vil (V) Vhyst (V) 2.8 1.5 2.6 1.4 1.3 2.4 1.2 2.2 1.1 2 1 1.8 0.9 1.6 0.8 1.4 0.7 1.2 0.6 1 0.5 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 100 125 150 175 Tc (C) Doc ID 6942 Rev. 4 17/46 Electrical specifications VN750 Figure 19. Overvoltage shutdown Figure 20. Open-load Off-state voltage detection threshold Vol (V) Vov (V) 5 50 48 4.5 Vin=0V 46 4 44 3.5 42 40 3 38 2.5 36 2 34 1.5 32 30 1 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 75 100 125 150 175 Tc (C) Figure 21. Turn-on voltage slope Figure 22. Turn-off voltage slope dVout/dt/(on) (V/ms) dVout/dt(off) (V/ms) 1000 500 900 450 Vcc=13V Rl=6.5Ohm 800 Vcc=13V Rl=6.5Ohm 400 700 350 600 300 500 250 400 200 300 150 200 100 100 50 0 0 -50 -25 0 25 50 75 100 125 150 175 Tc (C) Ilim (A) 20 18 Vcc=13V 16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 -50 -25 0 25 50 75 Tc (C) Figure 23. Ilim vs Tcase 100 125 150 175 Tc (C) 18/46 50 Doc ID 6942 Rev. 4 100 125 150 175 VN750 Electrical specifications Figure 24. Application schematic +5V +5V VCC Rprot STATUS Dld C Rprot INPUT OUTPUT GND VGND RGND DGND 2.5 GND protection network against reverse battery 2.5.1 Solution 1: resistor in the ground line (RGND only) This can be used with any type of load. The following is an indication on how to size the RGND resistor. 1. RGND 600 mV / (IS(on)max). 2. RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power dissipation in RGND (when VCC < 0: during reverse battery situations) is: PD = (-VCC)2/ RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not shared by the device ground then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in case of several high side drivers sharing the same RGND. If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below). Doc ID 6942 Rev. 4 19/46 Electrical specifications 2.5.2 VN750 Solution 2: diode (DGND) in the ground line A resistor (RGND = 1 k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (600 mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift does not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. The safest configuration for unused INPUT and STATUS pin is to leave them unconnected. 2.6 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table. 2.7 MCU I/Os protection If a ground protection network is used and negative transient are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins from latching-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended values: Rprot =10k . 2.8 Open-load detection in Off-state Off-state open-load detection requires an external pull-up resistor (RPU) connected between OUTPUT pin and a positive supply voltage (VPU) like the +5V line used to supply the microprocessor. The external resistor has to be selected according to the following requirements: 20/46 1. No false open-load indication when load is connected: in this case we have to avoid VOUT to be higher than VOlmin; this results in the following condition VOUT= (VPU / (RL+RPU)) RL < VOlmin. 2. No misdetection when load is disconnected: in this case the VOUT has to be higher than VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2). Doc ID 6942 Rev. 4 VN750 Electrical specifications Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pullup resistor RPU should be connected to a supply that is switched OFF when the module is in standby. The values of VOLmin, VOLmax and IL(off2) are available in the electrical characteristics section. Figure 25. Open-load detection in off-state 6 BATT 60 5 6## 20 5 ).0 54 $2)6%2 ),OFF ,/')# /54 2 3 4!453 6/, 2, '2/5.$ ("1($'5 Doc ID 6942 Rev. 4 21/46 Electrical specifications 2.9 VN750 SO-8 maximum demagnetization energy (VCC = 13.5V) Figure 26. SO-8 maximum turn-off current versus inductance ),-!8 ! " # $ ,M( '!0'#&4 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL = 0 .In case of repetitive pulses, Tjstart (at the beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. 22/46 Doc ID 6942 Rev. 4 VN750 2.10 Electrical specifications PPAK/P2PAK maximum demagnetization energy (VCC = 13.5V) Figure 27. PPAK /P2PAK maximum turn-off current versus inductance ),-!8 ! ! " # ,M( '!0'#&4 A: Tjstart = 150C single pulse B: Tjstart = 100C repetitive pulse C: Tjstart = 125C repetitive pulse VIN, IL Demagnetization Demagnetization Demagnetization t 1. Values are generated with RL = 0 .In case of repetitive pulses, Tjstart (at the beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves A and B. Doc ID 6942 Rev. 4 23/46 Package and PCB thermal data VN750 3 Package and PCB thermal data 3.1 SO-8 thermal data Figure 28. SO-8 PC board 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm, Cu thickness = 35 m , Copper areas: 0.14 cm2, 0.8 cm2, 2 cm2). Figure 29. Rthj-amb vs PCB copper area in open box free air condition 3/ AT PINS CONNECTED TO 4!" 24(J?AMB #7 0#" #U HEATSINK AREA CM> '!0'#&4 24/46 Doc ID 6942 Rev. 4 VN750 Package and PCB thermal data Figure 30. SO-8 thermal impedance junction ambient single pulse :4( #7 CM CM 4IME S '!0'#&4 Equation 1: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Figure 31. Thermal fitting model of a single channel Doc ID 6942 Rev. 4 25/46 Package and PCB thermal data Table 16. 3.2 VN750 Thermal parameter Area/island (cm2) 0.5 R1 (C/W) 0.05 R2 (C/W) 0.8 R3 (C/W) 3.5 R4 (C/W) 21 R5 (C/W) 16 R6 (C/W) 58 C1 (W*s/C) 0.006 C2 (W*s/C) 0.0026 C3 (W*s/C) 0.0075 C4 (W*s/C) 0.045 C5 (W*s/C) 0.35 C6 (W*s/C) 1.05 2 28 2 P2PAK thermal data Figure 32. P2PAK PC board ("1($'5 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness = 2 mm, Cu thickness = 35 m , Copper areas: 0.97 cm2, 8 cm2). 26/46 Doc ID 6942 Rev. 4 VN750 Package and PCB thermal data Figure 33. Rthj-amb vs PCB copper area in open box free air condition 24(J?AMB # 7 4J 4AMB # 0#" #U HEATSINK AREA CM> ("1($'5 Figure 34. P2PAK thermal impedance junction ambient single pulse :4( # 7 CM CM 4IME S ("1($'5 Equation 2: pulse calculation formula Z TH = R TH +Z THtp (1 - ) where = tP/T Doc ID 6942 Rev. 4 27/46 Package and PCB thermal data VN750 Figure 35. Thermal fitting model of a single channel Table 17. 28/46 Thermal parameter Area/island (cm2) 0.5 R1 (C/W) 0.15 R2 (C/W) 0.7 R3 (C/W) 0.7 R4 (C/W) 4 R5 (C/W) 9 R6 (C/W) 37 C1 (W*s/C) 0.0006 C2 (W*s/C) 0.0025 C3 (W*s/C) 0.055 C4 (W*s/C) 0.4 C5 (W*s/C) 2 C6 (W*s/C) 3 Doc ID 6942 Rev. 4 6 22 5 VN750 3.3 Package and PCB thermal data PPAK thermal data Figure 36. PPAK PC board ("1($'5 1. Layout condition of Rth and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness = 2 mm, Cu thickness = 35 m , Copper areas: 0.44 cm2, 8 cm2). Figure 37. Rthj-amb vs PCB copper area in open box free air condition 24(J?AMB #7 0#" #U HEATSINK AREA CM> Doc ID 6942 Rev. 4 ("1($'5 29/46 Package and PCB thermal data VN750 Figure 38. PPAK thermal impedance junction ambient single pulse :4( #7 CM CM 4IME S TH = R TH +Z THtp (1 - ) where = tP/T Figure 39. Thermal fitting model of a single channel 30/46 Doc ID 6942 Rev. 4 ("1($'5 Equation 3: pulse calculation formula Z VN750 Package and PCB thermal data Table 18. Thermal parameter Area/island (cm2) 0.5 R1 (C/W) 0.15 R2 (C/W) 0.7 R3 (C/W) 1.6 R4 (C/W) 2 R5 (C/W) 15 R6 (C/W) 61 C1 (W*s/C) 0.0006 C2 (W*s/C) 0.0025 C3 (W*s/C) 0.08 C4 (W*s/C) 0.3 C5 (W*s/C) 0.45 C6 (W*s/C) 0.8 Doc ID 6942 Rev. 4 6 24 5 31/46 Package and packing information VN750 4 Package and packing information 4.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 4.2 SO-8 package information Figure 40. SO-8 package dimensions 6 H E H D E $ D & F D / ( ' 0 ) ("1($'5 32/46 Doc ID 6942 Rev. 4 VN750 Package and packing information Table 19. SO-8 mechanical data mm Dim. Min. Typ. A a1 Max. 1.75 0.1 0.25 a2 1.65 a3 0.65 0.85 b 0.35 0.48 b1 0.19 0.25 C 0.25 0.5 c1 45 (typ.) D 4.8 5 E 5.8 6.2 e 1.27 e3 3.81 F 3.8 4 L 0.4 1.27 M 0.6 S L1 8 (max.) 0.8 Doc ID 6942 Rev. 4 1.2 33/46 Package and packing information 4.3 VN750 PENTAWATT mechanical data Figure 41. PENTAWATT package dimensions Table 20. PENTAWATT mechanical data mm Dim. Min. 34/46 Typ. Max. A 4.8 C 1.37 D 2.4 2.8 D1 1.2 1.35 E 0.35 0.55 F 0.8 1.05 F1 1 1.4 G 3.2 Doc ID 6942 Rev. 4 3.4 3.6 VN750 Package and packing information Table 20. PENTAWATT mechanical data (continued) mm Dim. G1 Min. Typ. Max. 6.6 6.8 7 H2 H3 10.4 10.05 10.4 L 17.85 L1 15.75 L2 21.4 L3 22.5 L5 2.6 3 L6 15.1 15.8 L7 6 6.6 M 4.5 M1 4 Diam. 3.65 Doc ID 6942 Rev. 4 3.85 35/46 Package and packing information 4.4 VN750 P2PAK mechanical data Figure 42. P2PAK package dimensions ("1($'5 36/46 Doc ID 6942 Rev. 4 VN750 Package and packing information P2PAK mechanical data Table 21. mm Dim. Min. Typ. Max. A 4.30 4.80 A1 2.40 2.80 A2 0.03 0.23 b 0.80 1.05 c 0.45 0.60 c2 1.17 1.37 D 8.95 9.35 D2 E 8.00 10.00 E1 10.40 8.50 e 3.20 3.60 e1 6.60 7.00 L 13.70 14.50 L2 1.25 1.40 L3 0.90 1.70 L5 1.55 2.40 R V2 0.40 0 Package weight 8 1.40 Gr (typ) Doc ID 6942 Rev. 4 37/46 Package and packing information 4.5 VN750 PPAK mechanical data Figure 43. PPAK package dimensions ("1($'5 38/46 Doc ID 6942 Rev. 4 VN750 Package and packing information Table 22. PPAK mechanical data mm Dim. Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 B 0.40 0.60 B2 5.20 5.40 C 0.45 0.60 C2 0.48 0.60 D 6.00 6.20 D1 E 5.1 6.40 6.60 E1 4.7 e 1.27 G 4.90 5.25 G1 2.38 2.70 H 9.35 10.10 L2 0.8 1.00 L4 0.60 1.00 L5 1 -- L6 2.80 R 0.2 V2 0 Package weight 8 Gr. 0.3 Doc ID 6942 Rev. 4 39/46 Package and packing information 4.6 VN750 SO-8 packing information The devices can be packed in tube or tape and reel shipments (see the Table 1: Device summary ). Figure 44. SO-8 tube shipment (no suffix) B Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) C A 100 2000 532 3.2 6 0.6 All dimensions are in mm. Figure 45. SO-8 tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4 All dimensions are in mm. Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D (+0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 12 4 8 1.5 1.5 5.5 4.5 2 All dimensions are in mm. End Start Top cover tape No components Components Empty components pockets saled with cover tape. User direction of feed 40/46 Doc ID 6942 Rev. 4 No components 500mm min 500mm min VN750 4.7 Package and packing information PENTAWATT packing information The devices can be packed in tube or tape and reel shipments (see the Table 1: Device summary ). Figure 46. PENTAWATT tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) " # 50 1000 532 18 33.1 1 All dimensions are in mm. ! ("1($'5 4.8 P2PAK packing information The devices can be packed in tube or tape and reel shipments (see the Table 1: Device summary ). Figure 47. P2PAK tube shipment (no suffix) Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) " # 50 1000 532 18 33.1 1 All dimensions are in mm. ! ("1($'5 Doc ID 6942 Rev. 4 41/46 Package and packing information VN750 Figure 48. P2PAK tape and reel (suffix "13TR") REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 24.4 60 30.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 24 4 12 1.5 1.5 11.5 6.5 2 End Start Top cover tape No components Components 500mm min Empty components pockets saled with cover tape. User direction of feed 42/46 No components Doc ID 6942 Rev. 4 500mm min VN750 4.9 Package and packing information PPAK packing information The devices can be packed in tube or tape and reel shipments (see the Table 1: Device summary ). Figure 49. PPAK suggested pad layout 3 1.8 6.7 Figure 50. PPAK tube shipment (no suffix) A C B Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) 75 3000 532 6 21.3 0.6 All dimensions are in mm. Doc ID 6942 Rev. 4 43/46 Package and packing information VN750 Figure 51. PPAK tape and reel (suffix "13TR") REEL DIMENSIONS All dimensions are in mm. Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 16.4 60 22.4 TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 16 4 8 1.5 1.5 7.5 2.75 2 End Start Top cover tape No components Components Empty components pockets saled with cover tape. User direction of feed 44/46 Doc ID 6942 Rev. 4 No components 500mm min 500mm min VN750 5 Revision history Revision history Table 23. Document revision history Date Revision 21-Jun-2004 1 Initial release. 2 Current and voltage convention update (page 2). Configuration diagram (top view) & suggested connections for unused and n.c. pins: insertion (page 2). 6cm2 Cu condition insertion in thermal data table (page 3). VCC - output diode section update (page 4). Revision history table insertion (page 30). Disclaimers update (page 31). 24-Nov-2008 3 Document reformatted and restructured. Added content, list of figures and tables. Added ECOPACK(R) packages information. Updated Figure 48.: P2PAK tape and reel (suffix "13TR"): - changed component spacing (P) in tape dimensions table from 16 mm to 12 mm. 18-May-2012 4 Updated Section 4.5: PPAK mechanical data 03-May-2006 Changes Doc ID 6942 Rev. 4 45/46 VN750 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 46/46 Doc ID 6942 Rev. 4