© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 10
1Publication Order Number:
MC10EP05/D
MC10EP05, MC100EP05
3.3V / 5V ECL 2‐Input
Differential AND/NAND
Description
The MC10/100EP05 is a 2-input differential AND/NAND gate. The
device is functionally equivalent to the EL05 and LVEL05 devices.
With AC performance much faster than the LVEL05 device, the EP05
is ideal for applications requiring the fastest AC performance
available.
The 100 Series contains temperature compensation.
Features
•220 ps Typical Propagation Delay
•Maximum Frequency > 3 GHz Typical
•PECL Mode Operating Range:
♦VCC = 3.0 V to 5.5 V with VEE = 0 V
•NECL Mode Operating Range:
♦VCC = 0 V with VEE = −3.0 V to −5.5 V
•Open Input Default State
•Safety Clamp on Inputs
•Q Output Will Default LOW with Inputs Open or at VEE
•These Devices are Pb-Free, Halogen Free and are RoHS Compliant
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= Pb-Free Package
H = MC10
K = MC100
5I = MC10
2X = MC100
D = Date Code
MARKING DIAGRAMS*
ALYWG
G
HP05
ALYWG
G
KP05
1
8
1
8
www.onsemi.com
HEP05
ALYWG
G
1
8
KEP05
ALYWG
G
1
8
5I DG
G
14
2X DG
G
14
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information on page 8 of
this data sheet.
ORDERING INFORMATION
SOIC−8NB
D SUFFIX
CASE
751−07
TSSOP−8
DT SUFFIX
CASE
948R−02
1
8
1
8
DFN−8
MN SUFFIX
CASE 506AA
MC10EP05, MC100EP05
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2
Figure 1. 8-Lead Pinout (Top View) and Logic
Diagram
1
2
3
45
6
7
8
Q
VEE
VCC
D0
QD1
D1
D0
Table 1. PIN DESCRIPTION
Pin Function
D0*, D1*, D0**, D1** ECL Data Inputs
Q, Q ECL Data Outputs
VCC Positive Supply
VEE Negative Supply
EP (DFN−8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect
to the most negative supply (GND) or
leave unconnected, floating open.
* Pins will default LOW when left open.
** Pins will default to VCC/2when left open.
Table 2. TRUTH TABLE
D0 D1 D0 D1 Q Q
L
L
H
H
L
H
L
H
H
H
L
L
H
L
H
L
L
L
L
H
H
H
H
L
Table 3. ATTRIBUTES
Characteristics Value
Internal Input Pulldown Resistor 75 kW
Internal Input Pullup Resistor 37.5 kW
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg
SOIC−8NB
TSSOP−8
DFN−8
Level 1
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count 137 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
MC10EP05, MC100EP05
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3
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 6 V
VEE NECL Mode Power Supply VCC = 0 V −6 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6
−6
V
Iout Output Current Continuous
Surge
50
100
mA
TAOperating Temperature Range −40 to +85 °C
Tstg Storage Temperature Range −65 to +150 °C
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
SOIC−8NB 190
130
°C/W
qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8NB 41 to 44 °C/W
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
TSSOP−8 185
140
°C/W
qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−841 to 44 °C/W
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
DFN−8 129
84
°C/W
Tsol Wave Solder (Pb-Free) <2 to 3 sec @ 260°C 265 °C
qJC Thermal Resistance (Junction-to-Case) (Note 1) DFN−835 to 40 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 5. 10EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 29 20 24 29 20 24 29 mA
VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV
VOL Output LOW Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV
VIH Input HIGH Voltage (Single-Ended) 2090 2415 2155 2480 2215 2540 mV
VIL Input LOW Voltage (Single-Ended) 1365 1690 1460 1755 1490 1815 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP05, MC100EP05
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4
Table 6. 10EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 29 20 24 29 20 24 29 mA
VOH Output HIGH Voltage (Note 2) 3865 3990 4115 3930 4055 4180 3990 4115 4240 mV
VOL Output LOW Voltage (Note 2) 3065 3190 3315 3130 3255 3380 3190 3315 3440 mV
VIH Input HIGH Voltage (Single-Ended) 3790 4115 3855 4180 3915 4240 mV
VIL Input LOW Voltage (Single-Ended) 3065 3390 3130 3455 3190 3515 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 7. 10EP DC CHARACTERISTICS, NECL (VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 20 24 29 20 24 29 20 24 29 mA
VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV
VOL Output LOW Voltage (Note 2) −1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV
VIH Input HIGH Voltage (Single-Ended) −1210 −885 −1145 −820 −1085 −760 mV
VIL Input LOW Voltage (Single-Ended) −1935 −1610 −1870 −1545 −1810 −1485 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VEE+2.0 0.0 VEE+2.0 0.0 VEE+2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP05, MC100EP05
www.onsemi.com
5
Table 8. 100EP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 15 25 32 17 27 36 19 28 38 mA
VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV
VOL Output LOW Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV
VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV
VIL Input LOW Voltage (Single-Ended) 1355 1675 1355 1675 1355 1675 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 3.3 2.0 3.3 2.0 3.3 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 9. 100EP DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 15 25 32 17 27 36 19 28 38 mA
VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV
VOL Output LOW Voltage (Note 2) 3055 3180 3305 3055 3180 3305 3055 3180 3305 mV
VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV
VIL Input LOW Voltage (Single-Ended) 3055 3375 3055 3375 3055 3375 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
2.0 5.0 2.0 5.0 2.0 5.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
MC10EP05, MC100EP05
www.onsemi.com
6
Table 10. 100EP DC CHARACTERISTICS, NECL (VCC = 0 V, VEE = −5.5 V to −3.0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
IEE Power Supply Current 15 25 32 17 27 36 19 28 38 mA
VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV
VOL Output LOW Voltage (Note 2) −1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV
VIH Input HIGH Voltage (Single-Ended) −1225 −880 −1225 −880 −1225 −880 mV
VIL Input LOW Voltage (Single-Ended) −1945 −1625 −1945 −1625 −1945 −1625 mV
VIHCMR Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 3)
VEE+2.0 0.0 VEE+2.0 0.0 VEE+2.0 0.0 V
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current
D
D
0.5
−150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC.
2. All loading with 50 W to VCC − 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
Table 11. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1))
−40°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit
fmax Maximum Frequency
(Figure 2)
> 3 > 3 > 3 GHz
tPLH,
tPHL
Propagation Delay to
Output Differential
160 210 260 170 220 270 210 260 320 ps
tJITTER Random Clock Jitter
(Figure 2)
0.2 < 1 0.2 < 1 0.2 1.5 ps
VPP Input Voltage Swing
(Differential Configuration)
150 800 1200 150 800 1200 150 800 1200 mV
tr
tf
Output Rise/Fall Times
Q (20% − 80%)
70 120 170 80 130 180 100 150 200 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
MC10EP05, MC100EP05
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7
Figure 2. Fmax/Jitter @ 255C
FREQUENCY (GHz)
1
2
3
4
5
6
7
8
(JITTER)
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
9
3.3 V
VOUTamplitude (mVpp)
JITTEROUT ps (RMS)
ÉÉ
ÉÉ
10
850
750
650
550
450
350
250
1.0 1.5 2.0 2.5 3.0
0
5V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC − 2.0 V
MC10EP05, MC100EP05
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8
ORDERING INFORMATION
Device Package Shipping†
MC10EP05DG SOIC−8NB
(Pb-Free)
98 Units / Rail
MC10EP05DR2G SOIC−8NB
(Pb-Free)
2500 / Tape & Reel
MC10EP05DTG TSSOP−8
(Pb-Free)
100 Units / Rail
MC10EP05DTR2G TSSOP−8
(Pb-Free)
2500 / Tape & Reel
MC100EP05DG SOIC−8NB
(Pb-Free)
98 Units / Rail
MC100EP05DR2G SOIC−8NB
(Pb-Free)
2500 / Tape & Reel
MC100EP05DTG TSSOP−8
(Pb-Free)
100 Units / Rail
MC100EP05DTR2G TSSOP−8
(Pb-Free)
2500 / Tape & Reel
MC100EP05MNR4G DFN−8
(Pb-Free)
1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D −ECL Clock Distribution Techniques
AN1406/D −Designing with PECL (ECL at +5.0 V)
AN1503/D −ECLinPSt I/O SPiCE Modeling Kit
AN1504/D −Metastability and the ECLinPS Family
AN1568/D −Interfacing Between LVDS and ECL
AN1672/D −The ECL Translator Guide
AND8001/D −Odd Number Counters Design
AND8002/D −Marking and Date Codes
AND8020/D −Termination of ECL Logic Devices
AND8066/D −Interfacing with ECLinPS
AND8090/D −AC Characteristics of ECL Devices
MC10EP05, MC100EP05
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9
PACKAGE DIMENSIONS
SOIC−8NB
CASE 751−07
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC10EP05, MC100EP05
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10
PACKAGE DIMENSIONS
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A2.90 3.10 0.114 0.122
B2.90 3.10 0.114 0.122
C0.80 1.10 0.031 0.043
D0.05 0.15 0.002 0.006
F0.40 0.70 0.016 0.028
G0.65 BSC 0.026 BSC
L4.90 BSC 0.193 BSC
M0 6 0 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
____
SEATING
PLANE
PIN 1
14
85
DETAIL E
B
C
D
A
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
8x REFK
IDENT
K0.25 0.40 0.010 0.016
TSSOP−8
CASE 948R−02
ISSUE A
MC10EP05, MC100EP05
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11
PACKAGE DIMENSIONS
ÇÇ
ÇÇ
ÇÇ
DFN−8 2x2, 0.5P
CASE 506AA
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
A
L
(A3)
D2
E2
C
C0.10
C0.10
C0.08
NOTE 4 A1 SEATING
PLANE
e/2
e
8X
K
NOTE 3
b
8X
0.10 C
0.05 C
ABB
DIM MIN MAX
MILLIMETERS
A0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b0.20 0.30
D2.00 BSC
D2 1.10 1.30
E2.00 BSC
E2 0.70 0.90
e0.50 BSC
K
L0.25 0.35
14
85
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.30
0.50
0.50
8X
DIMENSIONS: MILLIMETERS
0.30 PITCH
8X
1
PACKAGE
OUTLINE
RECOMMENDED
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
DETAIL A
L1 −−− 0.10
0.30 REF
0.90
1.30
ÉÉ
ÉÉ
ÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
ÉÉ
ÉÉ
ÇÇ
A1
A3
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