AQS225R2SX - Panasonic

RF PhotoMOS (AQS225R2S)

TYPES

* Indicate the peak AC and DC values.

Notes: (1) Tape package is the standard packing style. Also available in tube. (Part No. sufﬁx “X” or “Z” is not needed when ordering; Tube: 50 pcs.; Case: 1,000 pcs.)

(2) For space reasons, the package type indicator “X” and “Z” are omitted from the seal.

RATING

1. Absolute maximum ratings (Ambient temperature: 25

C 77

High capacity

and low on resistance.

RF in SOP 4 Form A type

RF PhotoMOS

(AQS225R2S)

Type Output rating* Part No. Packing quantity

in tape and reel

Load voltage Load current Picked from the

1/2/3/4/5/6/7/8-pin side Picked from the

9/10/11/12/13/14/15/16-pin side

AC/DC type 80 V 70 mA AQS225R2SX AQS225R2SZ 1,000 pcs.

Item Symbol AQS225R2S Remarks

Input

LED forward current I

50 mA

LED reverse voltage V

5 V

Peak forward current I

1 A f = 100 Hz, Duty factor = 0.1%

Power dissipation P

75 mW

Output

Load voltage (peak AC) V

80 V

Continuous load current (peak AC) I

0.07 A

Peak load current I

peak

0.2 A 100 ms (1 shot), V

= DC

Power dissipation P

out

600 mW

Total power dissipation P

650 mW

I/O isolatiom voltage V

iso

1,500 V AC

Temperature

limits Operating T

opr

–40

C to +85

C –40

F to +185

FNon-condensing at low temperatures

Storage T

stg

–40

C to +100

C –40

F to +212

mm inch

FEATURES

1. High-level functions (high capacity

and low on resistance)

Features: Compared to predecessor (AQS225S)

14.5pF × 21Ω

*24.5pF × 10.5Ω

Type AQS225S AQS225R2S

C×R*1 94.5pF·Ω

(typ.) *2 47.25pF·Ω

(typ.)

Load current

value 50mA 70mA

4.4

.173

2.1

.083

10.37

.408

2. 4-channel (4 Form A) of RF

PhotoMOS Relays

3. SO package 16-pin type in super

miniature design

The device comes in a super-miniature

SO package measuring (W)10.37 ×

(L)4.4 ×

(H)2.1mm (W) .408×(L).173×

(H).083inch— approx. 50% of the

footprint size of 8-pin(2-channel) type.

4. Applicable for 4 Form A use, as well

as 4 independent 1 Form A

5. Low capacitance between output

terminals ensure high response

speed:

The capacitance between output

terminals is small, typically 4.5pF.

This enables f or a f ast operation speed of

0.04ms(typ.).

6. Low-level off state leakage current

7. Controls low-level analog signals

PhotoMOS relays feature extremely low

closed-circuit offset voltage to enable

control of low-le vel analog signals without

distortion

TYPICAL APPLICATIONS

For multi-circuit switching

1. Measuring instruments

(probe cards, etc.)

2. Test equipment

IC tester, Liquid crystal driver tester,

semiconductor performance tester

3. Board tester

Bear board tester, In-circuit tester,

function tester

4. Medical equipment

Ultrasonic wave diagnostic machine

5. Multi-point recorder

Warping, thermo couple

SOP 2-channel type AQS225R2S

Footprint

Approx. 50%

RF PhotoMOS (AQS225R2S)

2. Electrical characteristics (Ambient temperature: 25

C 77

Note: Recommendable LED forward current I

= 5 mA.

For type of connection, see page 4. *Turn on/Turn off time

REFERENCE DATA

Item Symbol AQS225R2S Condition

Input

LED operate current Typical I

Fon

0.9 mA I

= Max.

Maximum 3 mA

LED turn off current Minimum I

Foff

0.3 mA I

= Max.

Typical 0.85 mA

LED dropout voltage Typical V

1.25 V (1.14 V at I

= 5 mA) I

= 50 mA

Maximum 1.5 V

Output

On resistance Typical R

10.5

Ω

= 5 mA

= Max.

Within 1 s on time

Maximum 15

Ω

Output capacitance Typical C

out

4.5 pF I

= 0

= 0 V

f = 1 MHz

Maximum 6 pF

Off state leakage current Typical I

Leak

0.01 nA I

= 0

= Max.

Maximum 10 nA

Transfer

characteristics

Turn on time* Typical T

0.04 ms I

= 5 mA

= Max.

Maximum 0.3 ms

Turn off time* Typical T

off

0.07 ms I

= 5 mA

= Max.

Maximum 0.2 ms

I/O capacitance Typical C

iso

0.8 pF f = 1 MHz

= 0

Maximum 1.5 pF

Initial I/O isolation resistance Minimum R

iso

1,000 M

Ω

500 V DC

Ton

Input

Output 10%

90%

Toff

1. Load current vs. ambient temperature

characteristics

Allowable ambient temperature: –40°C to +85°C

–40°F to +185°F

2. On resistance vs. ambient temperature

characteristics

LED current: 5 mA;

Continuous load current: 70 mA (DC)

3. Turn on time vs. ambient temperature

characteristics

LED current: 5 mA; Load voltage: 80 V (DC);

Continuous load current: 70 mA (DC)

100

–40 –20 0 20 40 60

100

Ambient temperature, °C

Load current, mA

–40 –20 0 20 40 60

100

Ambient temperature, °C

On resistance, Ω

0.05

0.1

0.15

0.2

0.25

–40 –20 0 20 40 60

100

Ambient temperature, °C

Turn on time, ms

4. Turn off time vs. ambient temperature

characteristics

LED current: 5 mA; Load voltage: 80 V (DC);

Continuous load current: 70 mA (DC)

5. LED operate current vs. ambient

temperature characteristics

Continuous load current: 70 mA (DC)

6. LED turn off current vs. ambient temperature

characteristics

Continuous load current: 70 mA (DC)

0.05

0.1

0.15

0.2

0.25

–40 –20 0 20 40 60

100

Ambient temperature, °C

Turn off time, ms

0.5

1.5

2.5

–40 –20 0 20 40 60

100

Ambient temperature, °C

LED operate current, mA

0.5

1.5

2.5

–40 –20 0 20 40 60

100

Ambient temperature, °C

LED turn off current, mA

DIMENSIONS

mm inch

7. LED dropout voltage vs. ambient

temperature characteristics

LED current: 5 to 50 mA

8. Current vs. voltage characteristics of output

at MOS portion

Ambient temperature: 25°C 77°F

9. Off state leakage current vs. load voltage

characteristics

Ambient temperature: 25°C 77°F

1.5

1.4

1.3

1.2

1.1

-40 -20 0 20 40 60

8085

100

50mA

30mA

20mA

10mA

5mA

Ambient temperature, °C

LED dropout voltage, V

–2 –20

–40

–60

–80

–1.5 –1 –0.5 0 0.5 1 1.5 2

Voltage, V

Current, mA

200406080100

10–3

10–6

10–9

10–12

Load voltage, V

Off state leakage current, A

10. Turn on time vs. LED forward current

characteristics

Load voltage: 80 V (DC); Continuous load current:

70 mA (DC); Ambient temperature: 25°C 77°F

11. Turn off time vs. LED forward current

characteristics

Load voltage: 80 V (DC); Continuous load current:

70 mA (DC); Ambient temperature: 25°C 77°F

12. Output capacitance vs. applied voltage

characteristics

Frequency: 1 MHz, 30 m Vrms;

Ambient temperature: 25°C 77°F

0.25

0.2

0.15

0.1

0.05

00102030405060

LED forward current, mA

Turn on time, ms

0.25

0.2

0.15

0.1

0.05

00102030405060

LED forward current, mA

Turn off time, ms

020406080100

Applied voltage, V

Output capacitance, pF

13. Isolation vs. frequency characteristics

(50Ω impedance)

Ambient temperature: 25°

C 77°F

14. Insertion loss vs. frequency char acteristics

(50Ω impedance)

Ambient temperature: 25°C 77°F

100

104105106107

Frequency, Hz

Isolation, dB

0.5

1.5

104105106107

Frequency, Hz

Insertion loss, dB

Recommended mounting pad (Top view)

General tolerance: ±0.1 ±.004

Terminal thickness = 0.15 .006

Tolerance:±0.1 ±.004

4.4±0.2

.173±.008

2.0±0.2

.079±.008

1.27

.050

0.1

.004

6.8±0.4

.268±.016

0.5

.020

0.5

.020

0.4

.016

10.37±0.2

.408±.008

1.2

.047

0.8

.031

.236

1.27

.050

1.27

.050

1.27

.050

1.27

.050

1.27

.050 1.27

.050

RF PhotoMOS (AQS225R2S)

SCHEMATIC AND WIRING DIAGRAM

: Power source at input side; I

: LED forward current; I

: Input current; V

: Load voltage; I

: Load current.

CAUTIONS FOR USE

Type Schematic Output

conﬁgu-

ration Load Connec-

tion Wiring diagram

AQS225R2S 4a AC/DC —

IL1

15 Load

VL1 (AC,DC)

Load

VL1 (AC,DC)

IF1

E1IL1

Load

VL2 (AC,DC)

IL2

Load

VL3 (AC,DC)

IL3

Load

VL4 (AC,DC)

IL4

IL2

Load

VL2 (AC,DC)

IL3

Load

VL3 (AC,DC)

IL4

Load

VL4 (AC,DC)

IF2

IF3

IF4

1. Applying stress that exceeds the

absolute maximum rating

If the voltage or current value for any of

the terminals exceeds the absolute

maximum rating, internal elements will

deteriorate because of the excessive

voltage or current. In extreme cases,

wiring may melt, or silicon P/N junctions

may be destroyed.

As a result, the design should ensure that

the absolute maximum ratings will never

be exceeded, even momentarily.

2. Deterioration and destruction

caused by discharge of static

electricity

This phenomenon is generally called

static electricity destruction, and occurs

when static electricity generated by

various factors is discharged while the

relay terminals are in contact, producing

internal destruction of the element.

To prevent problems from static

electricity, the following precautions and

measures should be taken when using

your device.

1) Employees handling relays should

wear anti-static clothing and should be

grounded through protective resistance

of 500 kΩ

to 1 MΩ.

2) A conductive metal sheet should be

placed over the work table. Measuring

instruments and jigs should be grounded.

3) When using soldering irons, either use

irons with low leakage current, or ground

the tip of the soldering iron. (Use of low-

voltage soldering irons is also

recommended.)

4) Devices and equipment used in

assembly should also be grounded.

5) When packing printed circuit boards

and equipment, av oid using high-polymer

materials such as foam styrene, plastic,

and other materials which carry an

electrostatic charge.

6) When storing or transporting relays,

the environment should not be conduciv e

to generating static electricity (for

instance, the humidity should be between

45 and 60%), and relays should be

protected using conductive packing

materials.

4. Short across terminals

Do not short circuit between terminals

when relay is energized, since there is

possibility of breaking of the internal IC.

5. Output spike voltages

1) If an inductive load generates spike

voltages which exceed the absolute

maximum rating, the spike voltage must

be limited. Typical circuits are shown

below.

2) Even if spik e v oltages generated at the

load are limited with a clamp diode if the

circuit wires are long, spike voltages will

occur by inductance . Keep wires as short

as possible to minimize inductance.

6. Ripple in the input power supply

If ripple is present in the input power

supply, observe the following:

1) For LED operate current at Emin,

maintain min. 5 mA.

2) Keep the LED operate current at 50

mA or less at Emax.

7. Cleaning solvents compatibility

The PhotoMOS relay forms an optical

path by coupling a light-emitting diode

(LED) and photodiode via transparent

silicon resin. F or this reason, unlike other

directory element molded resin products

(e.g., MOS transistors and bipolar

transistors), avoid ultrasonic cleansing if

at all possible. We recommend cleaning

with an organic solvent. If you cannot

avoid using ultrasonic cleansing, please

ensure that the following conditions are

met, and check beforehand for defects.

•Frequency: 27 to 29 kHz

•Ultrasonic output:

No greater than 0.25W/cm2

•Cleaning time:

No longer than 30 s

• Cleanser used: Asahiklin AK-225

• Other:

Submerge in solvent in order to prevent

the PCB and elements from being

contacted directly by the ultrasonic

vibrations.

Note: Applies to unit area ultrasonic output f or

ultrasonic baths.

Load

Add a clamp

diode to

the load

Add a CR

snubber

circuit to

the load

Emin. Emax.

9. The following shows the packaging format

1) Tape and reel

mm inch

Type Tape dimensions Dimensions of paper tape reel

SO package

16-pin type

8. Soldering

When soldering this terminals, the

following conditions are recommended.

(1) IR (Infrared reﬂow) soldering method

(2) Soldering iron method

Tip temperature: 280 to 300°C 536 to

572°F

Wattage: 30 to 60 W

Soldering time: within 5 s

(3) Others

Check mounting conditions before using

other soldering methods (hot-air, hot

plate, pulse heater, etc.)

• The temperature proﬁle indicates the

temperature of the soldered terminal on

the surf ace of the PC board. The ambient

temperature may increase excessively.

Check the temperature under mounting

conditions.

• The conditions for the infrared reﬂow

soldering apply when preheating using

the VPS method.

T1 = 155 to 165°C 311 to 329°F

T2 = 180°C 200°C 356 to 392°F

T3 = 245°C 473°F or less

t1 = 120 s or less

t2 = 30 s or less

t1t2

(1) When picked from 1/2/3/4/5/6/7/8-pin side: Part No. AQS225R2SX (Shown above)

(2) When picked from 9/10/11/12/13/14/15/16-pin side: Part No. AQS225R2SZ

Device mounted

on tape

Direction of picking

Tractor feed holes

1.55±0.05 dia.

.061±.002 dia.

1.55±0.1 dia.

.061±.004 dia.

7.5±0.1

.295±.004

4±0.1

.157±.004

2±0.1

.079±.004

12±0.1

.472±.004

0.3±0.05

.012±.002

2.8±0.3

.110±.012

16±0.3

.630±.012

7.5±0.1

.295±.004

1.75±0.1

.069±.004

11.15±0.1

.439±.004

80±1 dia.

3.150±.039 dia.

13±0.5 dia.

.512±.020 dia.

21±0.8

.827±.031

17.5±1.5

.689±.059 2±1.0

.079±.039

2±0.5

.079±.020

250±2 dia.

9.843±.079 dia.

80±1 dia.

3.150±.039 dia.

10. Storage

PhotoMOS relays implemented in SO

packages are sensitive to moisture and

come in sealed moisture-proof packages .

Observe the following cautions on

storage.

• After the moisture-proof package is

unsealed, take the de vices out of stor age

as soon as possible (within 1 month at

the most).

• If the de vices are to be left in storage f or

a considerable period after the moisture-

proof package has been unsealed, it is

recommended to keep them in another

moisture-proof bag containing silica gel

(within 3 months at the most).

11. Transportation and storage

1) Extreme vibration during transport will

warp the lead or damage the relay.

Handle the outer and inner boxes with

care.

2) Storage under extreme conditions will

cause soldering degradation, external

appearance defects, and deterioration of

the characteristics. The following storage

conditions are recommended:

• Temperature: 0 to 45°

C 32 to 113°F

• Humidity: Less than 70% R.H.

• Atomosphere: No harmful gasses such

as sulfurous acid gas, minimal dust.

12. Notes for mounting

1) If many different packages are

combined on a single substrate, then

lead temperature rise is highly dependent

on package size. For this reason, please

make sure that the temperature of the

terminal solder area of the PhotoMOS

relay falls within the temperature

conditions of item 8 before mounting.

2) If the mounting conditions exceed the

recommended solder conditions in item

8, resin strength will fall and the

nonconformity of the heat expansion

coefﬁcient of each constituent material

will increase markedly, possibly causing

cracks in the package, severed bonding

wires, and the like. For this reason,

please inquire with us about whether this

use is possible.

RF PhotoMOS (AQS225R2S)