AUIRFR8403
AUIRFU8403
VDSS 40V
RDS(on) typ. 2.4m
ID (Silicon Limited) 127A
max. 3.1m
ID (Package Limited) 100A
Features
Advanced Process Technology
New Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET
utilizes the latest processing techniques to achieve extremely low on-resistance per
silicon area. Additional features of this design are a 175°C junction operating
temperature, fast switching speed and improved repetitive avalanche rating. These
features combine to make this design an extremely efficient and reliable device for
use in Automotive applications and wide variety of other applications.
1 2017-10-03
HEXFET® is a registered trademark of Infineon.
*Qualification standards can be found at www.infineon.com
AUTOMOTIVE GRADE
Symbol Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 127
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 90
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Package Limited) 100
IDM Pulsed Drain Current 520
PD @TC = 25°C Maximum Power Dissipation 99 W
Linear Derating Factor 0.66 W/°C
VGS Gate-to-Source Voltage ± 20 V
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds (1.6mm from case) 300
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and
power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless
otherwise specified.
Thermal Resistance
Symbol Parameter Typ. Max. Units
RJC Junction-to-Case ––– 1.52
°C/W
RJA Junction-to-Ambient ( PCB Mount) ––– 50
RJA Junction-to-Ambient ––– 110
D-Pak
AUIRFR8403
I-Pak
AUIRFU8403
Base part number Package Type Standard Pack
Form Quantity
AUIRFU8403 I-Pak Tube 75 AUIRFU8403
AUIRFR8403 D-Pak Tube 75 AUIRFR8403
Tape and Reel Left 3000 AUIRFR8403TRL
Orderable Part Number
G D S
Gate Drain Source
G
S
D
D
S
G
D
Avalanche Characteristics
EAS Single Pulse Avalanche Energy (Thermally Limited) 114
EAS (tested) Single Pulse Avalanche Energy (Tested Limited) 148
IAR Avalanche Current See Fig. 14, 15, 24a, 24b A
EAR Repetitive Avalanche Energy mJ
mJ
Applications
Electric Power Steering (EPS)
Battery Switch
Start/Stop Micro Hybrid
Heavy Loads
DC-DC Converter
HEXFET® Power MOSFET