OPA355
OPA2355
OPA3355
SBOS195D – MARCH 2001 – REVISED JANUARY 2004
www.ti.com
DESCRIPTION
The OPA355 series high-speed, voltage-feedback CMOS
operational amplifiers are designed for video and other
applications requiring wide bandwidth. The OPA355 is unity-
gain stable and can drive large output currents. In addition,
the OPA355 has a digital shutdown (Enable) function. This
feature provides power savings during idle periods and
places the output in a high-impedance state to support output
multiplexing. Differential gain is 0.02% and differential phase
is 0.05°. Quiescent current is only 8.3mA per channel.
The OPA355 is optimized for operation on single or dual
supplies as low as 2.5V (±1.25V) and up to 5.5V (±2.75V).
Common-mode input range for the OPA355 extends 100mV
below ground and up to 1.5V from V+. The output swing is
within 100mV of the rails, supporting wide dynamic range.
The OPA355 series is available in single (SOT23-6 and
SO-8), dual (MSOP-10), and triple (TSSOP-14 and SO-14)
versions. Multichannel versions feature completely indepen-
dent circuitry for lowest crosstalk and freedom from interac-
tion. All are specified over the extended –40°C to +125°C
range.
FEATURES
●UNITY-GAIN BANDWIDTH: 450MHz
●WIDE BANDWIDTH: 200MHz GBW
●HIGH SLEW RATE: 360V/µs
●LOW NOISE: 5.8nV/
√Hz
●EXCELLENT VIDEO PERFORMANCE:
DIFF GAIN: 0.02%, DIFF PHASE: 0.05°
0.1dB GAIN FLATNESS: 75MHz
●INPUT RANGE INCLUDES GROUND
●RAIL-TO-RAIL OUTPUT (within 100mV)
●LOW INPUT BIAS CURRENT: 3pA
●LOW SHUTDOWN CURRENT: 3.4µA
●ENABLE/DISABLE TIME: 100ns/30ns
●THERMAL SHUTDOWN
●SINGLE-SUPPLY OPERATING RANGE: 2.5V to 5.5V
●
Micro
SIZE PACKAGES
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2001-2004, Texas Instruments Incorporated
200MHz, CMOS
OPERATIONAL AMPLIFIER WITH SHUTDOWN
APPLICATIONS
●VIDEO PROCESSING
●ULTRASOUND
●OPTICAL NETWORKING, TUNABLE LASERS
●PHOTODIODE TRANSIMPEDANCE AMPS
●ACTIVE FILTERS
●HIGH-SPEED INTEGRATORS
●ANALOG-TO-DIGITAL (A/D) CONVERTER
INPUT BUFFERS
●DIGITAL-TO-ANALOG (D/A) CONVERTER
OUTPUT AMPLIFIERS
●BARCODE SCANNERS
●COMMUNICATIONS
®
OPA3355
OPA3355
OPA355
OPA2355
OPA355 RELATED PRODUCTS
FEATURES PRODUCT
200MHz, Rail-to-Rail Output, CMOS, No Shutdown OPA356
38MHz, Rail-to-Rail Input/Output, CMOS OPAx350
75MHz, Rail-to-Rail Output OPAx631
150MHz, Rail-to-Rail Output OPAx634
Differential Input/Output, 3.3V Supply THS412x
OPA355 Out
V+
V–Enable
–V
IN
+V
IN
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
OPA355, 2355, 3355
SBOS195D
2www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V–................................................................... 7.5V
Signal Input Terminals, Voltage(2) .................... (V–) – 0.5V to (V+) + 0.5V
Current(2) ..................................................... 10mA
Enable Input......................................................(V–) – 0.5V to (V+) + 0.5V
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +150°C
Storage Temperature...................................................... –65°C to +150°C
Junction Temperature .................................................................... +160°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals
that can swing more than 0.5V beyond the supply rails should be current limited
to 10mA or less. (3) Short-circuit to ground, one amplifier per package.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PIN CONFIGURATIONS
Top View
1
2
3
6
5
4
V+
Enable
–In
Out
V–
+In
OPA355
SOT23-6
(1)
C55
1
2
3
4
8
7
6
5
Enable
V+
Out
NC(2)
NC(2)
–In
+In
V–
OPA355
SO-8
1
2
3
4
5
10
9
8
7
6
V+
Out B
–In B
+In B
Enable B
Out A
–In A
+In A
V–
Enable A
OPA2355
MSOP-10
A
B
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Out C
–In C
+In C
V–
+In B
–In B
Out B
Enable A
Enable B
Enable C
V+
+In A
–In A
Out A
OPA3355
SO-14
TSSOP-14
AB
C
PACKAGE
PRODUCT PACKAGE-LEAD MARKING
OPA355 SOT23-6 C55
"" "
OPA355 SO-8 OPA355UA
"" "
OPA2355 MSOP-10 D55
"" "
OPA3355 TSSOP-14 OPA3355EA
"" "
OPA3355 SO-14 OPA3355UA
"" "
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this data sheet.
PACKAGE/ORDERING INFORMATION(1)
NOTES: (1) Pin 1 of the SOT23-6 is
determined by orienting the package marking
as indicated in the diagram. (2) NC indicates
no internal connection.
OPA355, 2355, 3355
SBOS195D 3
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ELECTRICAL CHARACTERISTICS: VS = +2.7V to +5.5V Single-Supply
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, and connected to VS/2, unless otherwise noted.
OPA355
OPA2355
OPA3355
PARAMETER CONDITION MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VOS VS = +5V ±2±9mV
Specified Temperature Range ±15 mV
vs Temperature dVOS/dT Specified Temperature Range ±7µV/°C
vs Power Supply PSRR VS = +2.7V to +5.5V, VCM = VS/2 – 0.15V ±80 ±350 µV/V
INPUT BIAS CURRENT
Input Bias Current IB3±50 pA
Input Offset Current IOS ±1±50 pA
NOISE
Input Noise Voltage Density enf = 1MHz 5.8 nV/
√Hz
Current Noise Density inf = 1MHz 50 fA/
√Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM (V–) – 0.1 (V+) – 1.5 V
Common-Mode Rejection Ratio CMRR VS = +5.5V, –0.1V < VCM < +4.0V 66 80 dB
Specified Temperature Range 66 dB
INPUT IMPEDANCE
Differential 1013 || 1.5 Ω || pF
Common-Mode 1013 || 1.5 Ω || pF
OPEN-LOOP GAIN VS = +5V, 0.3V < VO < 4.7V 84 92 dB
OPA355 VS = +5V, 0.3V < VO < 4.7V 80 dB
OPA2355, OPA3355 VS = +5V, 0.4V < VO < 4.6V 80 dB
FREQUENCY RESPONSE
Small-Signal Bandwidth f–3dB G = +1, VO = 100mVp-p, RF = 0Ω450 MHz
f–3dB G = +2, VO = 100mVp-p, RL = 50Ω100 MHz
f–3dB G = +2, VO = 100mVp-p, RL = 150Ω170 MHz
f–3dB G = +2, VO = 100mVp-p, RL = 1kΩ200 MHz
Gain-Bandwidth Product GBW G = +10, RL = 1kΩ200 MHz
Bandwidth for 0.1dB Gain Flatness f0.1dB G = +2, VO = 100mVp-p, RF = 560Ω75 MHz
Slew Rate SR VS = +5V, G = +2, 4V Output Step 300/–360 V/µs
Rise-and-Fall Time G = +2, VO = 200mVp-p, 10% to 90% 2.4 ns
G = +2, VO = 2Vp-p, 10% to 90% 8 ns
Settling Time, 0.1% VS = +5V, G = +2, 2V Output Step 30 ns
0.01% VS = +5V, G = +2, 2V Output Step 120 ns
Overload Recovery Time VIN • Gain = VS8ns
Harmonic Distortion
2nd-Harmonic G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω–81 dBc
3rd-Harmonic G = +2, f = 1MHz, VO = 2Vp-p, RL = 200Ω–93 dBc
Differential Gain Error NTSC, RL = 150Ω0.02 %
Differential Phase Error NTSC, RL = 150Ω0.05 degrees
Channel-to-Channel Crosstalk OPA2355 f = 5MHz –90 dB
OPA3355 f = 5MHz –70 dB
OUTPUT
Voltage Output Swing from Rail VS = +5V, RL = 150Ω, AOL > 84dB 0.2 0.3 V
Voltage Output Swing from Rail VS = +5V, RL = 1kΩ0.1 V
Output Current, Continuous(1) IO±60 mA
Output Current, Peak(1) IOVS = +5V ±100 mA
Output Current, Peak(1) IOVS = +3V ±80 mA
Closed-Loop Output Impedance f < 100kHz 0.02 Ω
POWER SUPPLY
Specified Voltage Range VS2.7 5.5 V
Operating Voltage Range 2.5 to 5.5 V
Quiescent Current (per amplifier) IQVS = +5V, Enabled, IO = 0 8.3 11 mA
Specified Temperature Range 14 mA
NOTES: (1) See typical characteristic
Output Voltage Swing vs Output Current
. (2) Logic LOW and HIGH levels are CMOS logic compatible. They are referenced to V–.
OPA355, 2355, 3355
SBOS195D
4www.ti.com
SHUTDOWN
Disabled (Logic-LOW Threshold)(2) 0.8 V
Enabled (Logic-HIGH Threshold)(2) 2V
Enable Time 100 ns
Disable Time 30 ns
Shutdown Current (per amplifier) VS = +5V, Disabled 3.4 6 µA
THERMAL SHUTDOWN
Junction Temperature
Shutdown 160 °C
Reset from Shutdown 140 °C
TEMPERATURE RANGE
Specified Range –40 125 °C
Operating Range –55 150 °C
Storage Range –65 150 °C
Thermal Resistance
θ
JA °C/W
SOT-23-6, MSOP-10 150 °C/W
SO-8 125 °C/W
SO-14, TSSOP-14 100 °C/W
NOTES: (1) See typical characteristic
Output Voltage Swing vs Output Current
. (2) Logic LOW and HIGH levels are CMOS logic compatible. They are referenced to V–.
ELECTRICAL CHARACTERISTICS:
V
S
= +2.7V to +5.5V Single-Supply (Cont.)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RF = 604Ω, RL = 150Ω, and connected to VS/2, unless otherwise noted.
OPA355
OPA2355
OPA3355
PARAMETER CONDITION MIN TYP MAX UNITS
OPA355, 2355, 3355
SBOS195D 5
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
NONINVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
Frequency (Hz)
Normalized Gain (dB)
10M1M 100M 1G100k
6
3
0
–3
–6
–9
–12
–15
V
O
= 0.1Vp-p
G = +2
G = +5
G = +10
G = +1
R
F
= 0
INVERTING SMALL-SIGNAL
FREQUENCY RESPONSE
Frequency (Hz)
Normalized Gain (dB)
10M1M 100M 1G100k
3
0
–3
–6
–9
–12
–15
V
O
= 0.1Vp-p
G = –1
G = –5
G = –10
G = –2
NON-INVERTING SMALL-SIGNAL
STEP RESPONSE
Time (20ns/div)
Output Voltage (50mV/div)
G = +2
NONINVERTING LARGE-SIGNAL
STEP RESPONSE
Time (20ns/div)
Output Voltage (500mV/div)
G = +2
LARGE-SIGNAL DISABLE/ENABLE
RESPONSE
Time (200ns/div)
Output Voltage (500mV/div)
4.5
3.5
2.5
1.5
0.5
Disable Voltage (V)
Enabled
Disabled VOUT
fIN = 5MHz
0.1dB GAIN FLATNESS FOR VARIOUS RF
Frequency (MHz)
Normalized Gain (dB)
10 1001
0.5
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
–0.5
VO = 0.1Vp-p
CL = 0pF RF = 604Ω
RF = 560Ω
RF = 500Ω
OPA355, 2355, 3355
SBOS195D
6www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
HARMONIC DISTORTION vs OUTPUT VOLTAGE
Output Voltage (Vp-p)
Harmonic Distortion (dBc)
23 401
–50
–60
–70
–80
–90
–100
RL = 200Ω
f = 1MHz
2nd Harmonic
3rd Harmonic
HARMONIC DISTORTION vs NONINVERTING GAIN
Gain (V/V)
Harmonic Distortion (dBc)
101
–50
–60
–70
–80
–90
–100
2nd-Harmonic
3rd-Harmonic
V
O
= 2Vp-p
f = 1MHz
R
L
= 200Ω
HARMONIC DISTORTION vs INVERTING GAIN
Gain (V/V)
Harmonic Distortion (dBc)
101
–50
–60
–70
–80
–90
–100
2nd-Harmonic
3rd-Harmonic
V
O
= 2Vp-p
f = 1MHz
R
L
= 200Ω
HARMONIC DISTORTION vs FREQUENCY
Frequency (Hz)
Harmonic Distortion (dBc)
10M100k 1M
–50
–60
–70
–80
–90
–100
2nd-Harmonic
3rd-Harmonic
V
O
= 2Vp-p
R
L
= 200Ω
HARMONIC DISTORTION vs LOAD RESISTANCE
RL (Ω)
Harmonic Distortion (dBc)
1k100
–50
–60
–70
–80
–90
–100
2nd-Harmonic
3rd-Harmonic
VO = 2Vp-p
f = 1MHz
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
Frequency (Hz)
Voltage Noise (nV/√Hz), Current Noise (fA/√Hz)
100M10 100 1k 10k 100k 1M 10M
10k
1k
100
10
1
Current Noise
Voltage Noise
OPA355, 2355, 3355
SBOS195D 7
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TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
FREQUENCY RESPONSE FOR VARIOUS RL
Frequency (Hz)
Normalized Gain (dB)
10M1M 100M 1G100k
3
0
–3
–6
–9
–12
–15
RL = 50Ω
RL = 150Ω
RL = 1kΩ
RL = 10kΩ
CL = 0pF
VO = 0.1Vp-p
FREQUENCY RESPONSE FOR VARIOUS CL
Frequency (Hz)
Normalized Gain (dB)
10M1M 100M 1G100k
9
6
3
0
–3
–6
–9
–12
–15
RS = 0Ω
VO = 0.1Vp-p
CL = 100pF
CL = 47pF
CL = 5.6pF
RECOMMENDED RS vs CAPACITIVE LOAD
Capacitive Load (pF)
RS (Ω)
10 1001
120
100
80
60
40
20
0
OPA355
C
L
R
S
V
IN
V
O
1kΩ
604Ω
604Ω(1kΩ is
Optional)
FREQUENCY RESPONSE vs CAPACITIVE LOAD
Frequency (Hz)
Normalized Gain (dB)
10M 100M 1G1M
3
0
–3
–6
–9
–12
–15
CL = 100pF
RS = 24Ω
CL = 47pF
RS = 36Ω
CL = 5.6pF
RS = 80Ω
OPA355
C
L
R
S
V
IN
V
O
1kΩ
604Ω
604Ω(1kΩ is
Optional)
G = +2
VO = 0.1Vp-p
Frequency (Hz)
10M 100M100k 1M 1G10k
100
90
80
70
60
50
40
30
20
10
0
–PSRR
+PSRR
CMRR
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
CMRR, PSRR (dB)
OPEN-LOOP GAIN AND PHASE
Frequency (Hz)
Open-Loop Gain (dB)
Open-Loop Phase (degrees)
10M 100M100k 1M 1G1k 10k
180
160
140
120
100
80
60
40
20
0
–20
Gain
Phase
RL = 1kΩ
RL = 150kΩ
OPA355, 2355, 3355
SBOS195D
8www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
SHUTDOWN CURRENT vs TEMPERATURE
Temperature (°C)
Shutdown Current (µA)
65 85 1055 25 45 135125–55 –35 –15
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VS = 5V
VS = 3V
VS = 5.5V
VS = 2.5V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR V
S
= 5V
Output Current (mA)
Output Voltage (V)
10050 150 200 2500
5
4
3
2
1
0
125°C
125°C
25°C
25°C
–55°C
–55°C
Continuous currents above
60mA are not recommended.
SUPPLY CURRENT vs TEMPERATURE
Temperature (°C)
Supply Current (mA)
65 85 10552545 135125–55 –35 –15
14
12
10
8
6
4
2
0
VS = 5V
VS = 3V
VS = 5.5V
VS = 2.5V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
FOR VS = 3V
Output Current (mA)
Output Voltage (V)
6030 90 120 1500
3
2
1
0
125°C
125°C
25°C
25°C
–55°C
–55°C
Continuous currents above
60mA are not recommended.
INPUT BIAS CURRENT vs TEMPERATURE
Temperature (°C)
Input Bias Current (pA)
65 85 1055 25 45 135125–55 –35 –15
10n
1n
100
10
1
COMPOSITE VIDEO
DIFFERENTIAL GAIN AND PHASE
Number of 150Ω Loads
dG/dP (%/degrees)
3241
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
dP
dG
OPA355, 2355, 3355
SBOS195D 9
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
COMMON-MODE REJECTION RATIO AND
POWER-SUPPLY REJECTION RATIO vs TEMPERATURE
Temperature (°C)
CMRR, PSRR (dB)
65 85 1055 25 45 135125–55 –35 –15
100
90
80
70
60
50
Power-Supply Rejection Ratio
Common-Mode Rejection Ratio
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (mV)
Percent of Amplifiers (%)
–6–7–8–9–5–4–3–2–10123456789
20
18
16
14
12
10
8
6
4
2
0
OPEN-LOOP GAIN vs TEMPERATURE
Temperature (°C)
Open-Loop Gain (dB)
65 85 1055 25 45 135125–55 –35 –15
110
100
90
80
70
60
RL = 1kΩ
RL = 150Ω
OUTPUT SETTLING TIME TO 0.1%
Time (ns)
Output Error (%)
25 30 40 45351051520 500
0.2
0.1
0
–0.1
–0.2
–0.3
–0.4
VO = 2Vp-p
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
Frequency (MHz)
Output Voltage (Vp-p)
10 1001
6
5
4
3
2
1
0
V
S
= 5.5V
V
S
= 2.7V
Maximum Output
Voltage without
Slew-Rate
Induced Distortion
CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY
Frequency (Hz)
Output Impedance (Ω)
10M 100M1M 1G10k 100k
100
10
1
0.1
0.01
0.001
OPA355
604Ω
604Ω
ZO
OPA355, 2355, 3355
SBOS195D
10 www.ti.com
APPLICATIONS INFORMATION
The OPA355 series is a CMOS, high-speed, voltage-feed-
back, operational amplifier designed for video and other
general-purpose applications. It is available as a single, dual,
or triple op amp.
The amplifier features a 200MHz gain bandwidth and
360V/µs slew rate, but it is unity-gain stable and can be
operated as a +1V/V voltage follower.
Its input common-mode voltage range includes ground, al-
lowing the OPA355 to be used in virtually any single-supply
application up to a supply voltage of +5.5V.
PCB LAYOUT
Good high-frequency PC board layout techniques should be
employed for the OPA355. Generous use of ground planes,
short direct signal traces, and a suitable bypass capacitor
located at the V+ pin will assure clean, stable operation.
Large areas of copper also provide a means of dissipating
heat that is generated within the amplifier in normal opera-
tion.
Sockets are definitely not recommended for use with any
high-speed amplifier.
A 10nF ceramic bypass capacitor is the minimum recom-
mended value; adding a 1µF or larger tantalum capacitor in
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = 5V, G = +2, RF = 604Ω, and RL = 150Ω connected to VS/2, unless otherwise noted.
CHANNEL-TO-CHANNEL CROSSTALK
Frequency (Hz)
Crosstalk, Input-Referred (dB)
10M1M 100M100k
0
–20
–40
–60
–80
–100
–120
OPA3355
(triple)
OPA2355
(dual)
parallel can be beneficial when driving a low-resistance load.
Providing adequate bypass capacitance is essential to achiev-
ing very low harmonic and intermodulation distortion.
OPERATING VOLTAGE
The OPA355 is specified over a power-supply range of +2.7V
to +5.5V (±1.35V to ±2.75V). However, the supply voltage
may range from +2.5V to +5.5V (±1.25V to ±2.75V). Supply
voltages higher than 7.5V (absolute maximum) can perma-
nently damage the amplifier.
Parameters that vary significantly over supply voltage or
temperature are shown in the Typical Characteristics section
of this data sheet.
ENABLE FUNCTION
The OPA355 can be enabled by applying a TTL HIGH
voltage level to the Enable pin. Conversely, a TTL LOW
voltage level will disable the amplifier, reducing its supply
current from 8.3mA to only 3.4µA per amplifier. This pin
voltage is referenced to single-supply ground. When using a
split-supply, such as ±2.5V, the enable/disable voltage levels
will be referenced to V–. Independent Enable pins are
available for each channel, providing maximum design flex-
ibility. For portable battery-operated applications, this feature
can be used to greatly reduce the average current and
thereby extend battery life.
OPA355, 2355, 3355
SBOS195D 11
www.ti.com
The Enable input can be modeled as a CMOS input gate with
a 100kΩ pull-up resistor to V+. Left open, the Enable pin will
assume a logic HIGH, and the amplifier will be on.
The Enable time is 100ns and the disable time is only 30ns.
This allows the OPA355 to be operated as a “gated” amplifier,
or to have its output multiplexed onto a common output bus.
When disabled, the output assumes a high-impedance state.
OUTPUT DRIVE
The output stage can supply high short-circuit current (typi-
cally over 200mA). Therefore, an on-chip thermal shutdown
circuit is provided to protect the OPA355 from dangerously
high junction temperatures. At 160°C, the protection circuit
will shut down the amplifier. Normal operation will resume
when the junction temperature cools to below 140°C.
NOTE: it is not recommended to run a continuous DC current
in excess of ±60mA. Refer to the Typical Characteristics,
Output Voltage Swing vs Output Current
.
VIDEO
The OPA355 output stage is capable of driving a standard
back-terminated 75Ω video cable. By back-terminating a
transmission line, it does not exhibit a capacitive load to its
driver. A properly back-terminated 75Ω cable does not ap-
pear as capacitance; it presents only a 150Ω resistive load to
the OPA355 output.
The OPA355 can be used as an amplifier for RGB graphic
signals, which have a voltage of zero at the video black
level, by offsetting and AC-coupling the signal, as shown in
Figure 1.
WIDEBAND VIDEO MULTIPLEXING
One common application for video speed amplifiers which
include an enable pin is to wire multiple amplifier outputs
together, then select which one of several possible video
inputs to source onto a single line. This simple
Wired-OR
Video Multiplexer
can be easily implemented using the
OPA357; see Figure 2.
INPUT AND ESD PROTECTION
All OPA355 pins are static protected with internal ESD
protection diodes tied to the supplies; see Figure 3.
These diodes will provide overdrive protection if the current
is externally limited to 10mA by the source or by a resistor.
FIGURE 1. RGB Cable Driver.
1/3
OPA355
604Ω
1µF10nF
+3V
75Ω
Red
Green
Blue
604Ω
R
2
R
1
Red
(1)
V+
R
2
R
1
Green
(1)
V+
R
2
R
1
Blue
(1)
V+
75Ω
220µF
604Ω
75Ω
75Ω
1/3
OPA355
1/3
OPA355
604Ω
75Ω
604Ω
604Ω
75Ω
+
NOTE: (1) Source video signal offset 300mV above ground
to accommodate op amp swing-to-ground capability.
220µF
220µF
OPA355, 2355, 3355
SBOS195D
12 www.ti.com
FIGURE 3. Internal ESD Protection.
External
Pin
+V
CC
–V
CC
Internal
Circuitry
FIGURE 2. Multiplexed Output.
1kΩ
A
OPA355
+2.5V
1µF 10nF
–2.5V
49.9ΩVOUT
49.9Ω
Signal #1
49.9Ω
1kΩ
+
1µF 10nF
+
1kΩ
HCO4
B
OPA355
+2.5V
1µF 10nF
–2.5V
49.9Ω
Signal #2
Select
1kΩ
+
1µF 10nF
+
BON
AON
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jul-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2355DGSA/250 ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2355DGSA/250G4 ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA3355EA/250 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA3355EA/250G4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA3355EA/2K5 ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA3355EA/2K5G4 ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA3355UA ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA3355UAG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA355UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 30-Jul-2011
Addendum-Page 2
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2355DGSA/250 MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA3355EA/250 TSSOP PW 14 250 180.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA3355EA/2K5 TSSOP PW 14 2500 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
OPA355UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2355DGSA/250 MSOP DGS 10 250 210.0 185.0 35.0
OPA3355EA/250 TSSOP PW 14 250 210.0 185.0 35.0
OPA3355EA/2K5 TSSOP PW 14 2500 367.0 367.0 35.0
OPA355UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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