© Semiconductor Components Industries, LLC, 2004
July, 2019 − Rev. 1
1Publication Order Number:
NC7S02/D
NC7S02
TinyLogic HS 2-Input NOR
Gate
Description
The NC7S02 is a single 2−Input high performance CMOS NOR
Gate. Advanced Silicon Gate CMOS fabrication assures high speed
and low power circuit operation over a broad VCC range. ESD
protection diodes inherently guard both inputs and output with respect
to the VCC and GND rails. Three stages of gain between inputs and
outputs assures high noise immunity and reduced sensitivity to input
edge rate.
Features
•Space Saving SC−74A and SC88A 5−Lead Packages
•Ultra Small MicroPak™ Leadless Package
•High Speed: tPD = 3.5 ns Typ
•Low Quiescent Power: ICC < 1 mA
•Balanced Output Drive: 2 mA IOL, −2 mA IOH
•Broad VCC Operating Range: 2 V – 6 V
•Balanced Propagation Delays
•Specified for 3 V Operation
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
Y
A≥1
IEEE / IEC
BE4, 7S02, S02 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
T = Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= Eight−Week Datacoding Scheme
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
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SC−88A
CASE 419A−02
SIP6
CASE 127EB
E4KK
XYZ
S02T
Pin 1
SC−74A
CASE 318BQ 7S02T
NC7S02
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2
Pin Configurations
A
B
VCC
GND Y
1
2
3
5
4
Figure 2. SC−88A and SC−74A (Top View)
A 1 6 VCC
B 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DESCRIPTIONS
Pin Name Description
A, B Inputs
Y Output
NC No Connect
FUNCTION TABLE (Y = A + B)
Inputs Output
A B Y
L L H
L H L
H L L
H H L
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V
IIK DC Input Diode Current VIN ≤ −0.5 V − −20 mA
VIN ≥ VCC + 0.5 V −+20
VIN DC Input Voltage −0.5 VCC + 0.5 V
IOK DC Output Diode Current VOUT < −0.5 V − −20 mA
VOUT > VCC + 0.5 V −+20
VOUT DC Output Voltage −0.5 VCC + 0.5 V
IOUT DC Output Source or Sink Current −±12.5 mA
ICC or IGND DC VCC or Ground Current per Output Pin −±25 mA
TSTG Storage Temperature −65 +150 °C
TJJunction Temperature −+150 °C
TLLead Temperature (Soldering, 10 Seconds) −+260 °C
PDPower Dissipation in Still Air SC−74A −225 mW
SC−88A −190
MicroPak −327
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
NC7S02
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage 2.0 6.0 V
VIN Input Voltage 0 VCC V
VOUT Output Voltage 0 VCC V
TAOperating Temperature −40 +85 °C
tr, tfInput Rise and Fall Times VCC at 2.0 V 0 20 ns
VCC at 3.0 V 0 20
VCC at 4.5 V 0 10
VCC at 6.0 V 0 5
qJA Thermal Resistance SC−74A −555 °C/W
SC−88A −659
MicroPak −382
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Input Voltage 2.0
3.0 − 6.0
1.50
0.7 VCC
−
−
−
−
1.50
0.7 VCC
−
−
V
VIL LOW Level Input Voltage 2.0
3.0 − 6.0
−
−
−
−
0.50
0.3 VCC
−
−
0.50
0.3 VCC
V
VOH HIGH Level Output Voltage 2.0
3.0
4.5
6.0
IOH = −20 mA
VIN = VIL
1.90
2.90
4.40
5.90
2.0
3.0
4.5
6.0
−
−
−
−
1.90
2.90
4.40
5.90
−
−
−
−
V
3.0
4.5
6.0
VIN = VIL
IOH = −1.3 mA
IOH = −2.0 mA
IOH = −2.6 mA
2.68
4.18
5.68
2.85
4.35
5.85
−
−
−
2.63
4.13
5.63
−
−
−
V
VOL LOW Level Output Voltage 2.0
3.0
4.5
6.0
IOL = 20 mA
VIN = VIH
−
−
−
−
0.0
0.0
0.0
0.0
0.10
0.10
0.10
0.10
−
−
−
−
0.10
0.10
0.10
0.10
V
3.0
4.5
6.0
VIN = VIH
IOL = 1.3 mA
IOL = 2.0 mA
IOL = 2.6 mA
−
−
−
0.1
0.1
0.1
0.26
0.26
0.26
−
−
−
0.33
0.33
0.33
V
IIN Input Leakage Current 6.0 VIN = VCC, GND − − ±0.1 −±1.0 mA
ICC Quiescent Supply Current 6.0 VIN = VCC, GND − − 1.0 −10.0 mA
NC7S02
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AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
tPLH,
tPHL
Propagation Delay (Figure 4, 6) 5.0 CL = 15 pF −3.5 15 − − ns
2.0
3.0
4.5
6.0
CL = 50 pF −
−
−
−
19
10.5
7.5
6.5
100
27
20
17
−
−
−
−
125
35
25
21
ns
tTLH,
tTHL
Output Transition Time
(Figure 4, 6)
5.0 CL = 15 pF −3 10 − − ns
2.0
3.0
4.5
6.0
CL = 50 pF −
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
155
45
31
26
ns
CIN Input Capacitance Open −2 10 −10 pF
CPD Power Dissipation Capacitance
(Figure 5)
5.0 (Note 2) −6− − − pF
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
Figure 4. AC Test Circuit
Figure 5. ICCD Test Circuit
Figure 6. AC Waveforms
Input = AC Waveform;
PRR = Variable; Duty Cycle = 50%.
A
INPUT
VCC
VCC
CL
INPUT
OUTPUT
CL includes load and stray capacitance
Input PRR = 1.0 MHz; tW = 500 ns
NC7S02
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5
ORDERING INFORMATION
Order Number Top Mark Package Description Shipping†
NC7S02M5X 7S02 SC−74A 3000 / Tape & Reel
NC7S02P5X S02 SC−88A 3000 / Tape & Reel
NC7S02L6X E4 SIP6, MicroPak 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NC7S02
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7
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
NC7S02
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8
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
NC7S02
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9
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NC7S02/D
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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