© 2018 Kingbright. All Rights Reserved. Spec No: DSAN3493 / 1102015107 Rev No: V.6B Date: 06/27/2018 Page 5 / 5
PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes
AA3528AVU/AQBS/D
4. Storage of Unused and Remaining Parts
If the full reel was not consumed during production, the production environment was within limits (<30°C/60%RH), and the exposure
time did not exceed the limits in Table 1, then the remaining parts may be stored as below:
zRe-sealed with desiccant.
zStored within a dry box (5% RH). The dry box storage time would not count against the total exposure time. When the
stored parts are taken out, the exposure time is accu-mulated from the previous production run.
5. Humidity Control of PCB-Mounted Parts
If the moisture-sensitive SMD parts will not undergo further reflow or other high-temperature processes, then no special treatment is
required. However, if the PCB assembly requires further reflow or other high-temperature process, including rework, then the mounted
SMD’s exposure time should continue to accumulate against the MSL limit, unless the board is kept in a dry environ ment (<5% RH).
If the exposure time exceeds the MSL limit, the board and part must be baked dry to reset the exposure time before undergoing further
reflow.
Installation and Usage
If the part’s silicone lens extends beyond the board’s edge after installation, proper protection Should be made (such as covers) to
prevent accidental impact or stress on the exposed lens that would cause damage or detachment. The silicone lens may withstand
up to 1.5-newton in shear force when properly mounted. If external protection is not available, strongly suggest following these handling
procedures to prevent damage:
1. When the PCB assembly is handled or transported after reflow soldering, care must be taken to
prevent accidental contact or impact on the exposed silicone lens.
2. When the PCB assembly is installed into the casing or panel, care must be taken to maintain
sufficient clearance for the lens.
3. Do not subject the silicone lens to outside impact or friction.
Cleaning
1. Do not use unknown chemicals or acidic solvents to clean the part. Please check to insure the cleaning solvent will notcorode
epoxy resin, silicone resin, silver plating, and other component materials before using.
2. Kingbright suggests ethanol as a safe solvent for use with the surface mount devices. Softly wipe away any surface parcles,
avoiding excessive force scratching the surface or damaging the structures. Then place down and allow to naturally dry under
room temperature conditions before further use. Do not soak the component in the solvent.
MSL
Allowed Exposure After Opening
Time Conditions
LEVEL 1 No Limit ≤ 30°C/85%RH
LEVEL 2 1 Year ≤30°C/60%RH
LEVEL 2a 4 Weeks ≤30°C/60%RH
LEVEL 3 168 Hours ≤30°C/60%RH
LEVEL 4 72 Hours ≤30°C/60%RH
LEVEL 5 48 Hours ≤30°C/60%RH
LEVEL 5a 24 Hours ≤30°C/60%RH
LEVEL 6 Immediately upon open ≤30°C/60%RH