1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection, encapsulated in ultra small Surface-Mounted
Device (SMD) plastic packages.
1.2 Features
nForward current: IF≤0.5 A
nReverse voltage: VR≤30 V
nVery low forward voltage
nUltra small SMD plastic packages
1.3 Applications
nLow voltage rectification
nHigh efficiency DC-to-DC conversion
nSwitch mode power supply
nReverse polarity protection
nLow power consumption applications
1.4 Quick reference data
[1] Pulse test: tp≤300 µs; δ≤0.02.
PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 01 — 29 November 2006 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
PMEG3005EB SOD523 SC-79 single
PMEG3005EL SOD882 - single
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
IFforward current Tsp ≤55 °C - - 0.5 A
VRreverse voltage - - 30 V
VFforward voltage IF= 500 mA [1] - 430 500 mV
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 2 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
[1] The marking bar indicates the cathode.
3. Ordering information
4. Marking
Table 3. Pinning
Pin Description Simplified outline Symbol
SOD523
1 cathode [1]
2 anode
SOD882
1 cathode [1]
2 anode
21
sym001
12
21
Transparent
top view
sym001
12
Table 4. Ordering information
Type number Package
Name Description Version
PMEG3005EB SC-79 plastic surface-mounted package; 2 leads SOD523
PMEG3005EL - leadless ultra small plastic package; 2 terminals;
body 1.0 ×0.6 ×0.5 mm SOD882
Table 5. Marking codes
Type number Marking code
PMEG3005EB KB
PMEG3005EL AM
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 3 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Soldering point of cathode tab.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 30 V
IFforward current Tsp ≤55 °C - 0.5 A
IFRM repetitive peak forward current tp≤1 ms;
δ≤0.25 -1A
IFSM non-repetitive peak forward
current square wave;
tp=8ms -3A
Ptot total power dissipation Tamb ≤25 °C[1]
PMEG3005EB - 310 mW
PMEG3005EL - 250 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1][2]
PMEG3005EB - - 400 K/W
PMEG3005EL - - 500 K/W
Rth(j-sp) thermal resistance from
junction to solder point [3]
PMEG3005EB - - 75 K/W
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 4 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF= 0.1 mA - 90 180 mV
IF= 1 mA - 150 200 mV
IF= 10 mA - 210 270 mV
IF= 100 mA - 295 360 mV
IF= 500 mA - 430 500 mV
IRreverse current VR=10V - 15 200 µA
VR=30V - 70 500 µA
Cddiode capacitance VR=1V; f=1MHz - 24 30 pF
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 5 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb =85°C
(4) Tamb =25°C
(5) Tamb =−40 °C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
f = 1 MHz; Tamb =25°C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
006aaa855
10
1
103
102
104
IF
(mA)
10−1
VF (V)
0 1.41.20.4 0.8 1.00.2 0.6
(1)
(2)
(3)
(4)
(5)
006aaa856
IR
(µA)
1
10−2
10−1
104
103
102
10
105
10−3
VR (V)
0302551510 20
(1)
(2)
(3)
(4)
(5)
006aaa857
VR (V)
0302010
20
10
30
40
Cd
(pF)
0
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 6 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
8. Test information
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 4. Duty cycle definition
t1
t2
P
t
006aaa812
duty cycle δ =
t1
t2
Fig 5. Package outline SOD523 (SC-79) Fig 6. Package outline SOD882
02-12-13Dimensions in mm
1.65
1.55 1.25
1.15
0.17
0.11
0.34
0.26
0.65
0.58
0.85
0.75
1
2
03-04-17Dimensions in mm
0.55
0.47
0.65
0.62
0.55 0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 8000 10000
PMEG3005EB SOD523 2 mm pitch, 8 mm tape and reel - -315 -
4 mm pitch, 8 mm tape and reel -115 - -135
PMEG3005EL SOD882 2 mm pitch, 8 mm tape and reel - - -315
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 7 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
11. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD523 (SC-79)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD882
mgs343
1.80
1.90
0.30
0.40
0.50
1.20 0.60
2.15
solder lands
solder resist
occupied area
solder paste
mbl872
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)0.70
(2×)0.80
(2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 8 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMEG3005EB_PMEG3005EL_1 20061129 Product data sheet - -
PMEG3005EB_PMEG3005EL_1 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 29 November 2006 9 of 10
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors PMEG3005EB; PMEG3005EL
0.5 A very low VF MEGA Schottky barrier rectifiers
© NXP B.V. 2006. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 November 2006
Document identifier: PMEG3005EB_PMEG3005EL_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
